Filtering and purifying equipment for recovering copper from waste etching solution

CN122789484APending Publication Date: 2026-09-22HUBEI LINTAI ENVIRONMENTAL TECH CO LTD
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202611252788.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-08-18
Publication Date
2026-09-22

AI Technical Summary

Technical Problem

[0008]针对现有离子交换树脂处理废蚀刻液设备树脂易结块、分布不均、固液分离滞后、树脂利用率低的技术缺陷,提供一种废蚀刻液回收铜用过滤与净化设备,实现树脂在线研磨破块、全域均匀散料、自动循环提升、一体化在线过滤,提升铜离子回收效率,实现废蚀刻液连续化净化处理

Benefits of technology

(1)本发明通过同步旋转的磨料盘与集料槽配合球形磨料咬合研磨,树脂循环提升过程中强制破除团聚结块,保证单颗树脂完全暴露于蚀刻液,大幅提升铜离子交换吸附容量,铜回收效率提升30%以上。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122789484A_ABST
    Figure CN122789484A_ABST
Patent Text Reader

Abstract

The application discloses a kind of filtering and purification equipment for recovering copper from waste etching liquid, belong to etching waste liquid resource processing technical field, solve the technical problems that existing ion exchange resin is easy to be caked, resin stratification distribution is uneven, exchange reaction is not sufficient, and the technical problems that solid-liquid separation effect is poor.This equipment contains jar body, and support frame separates upper chamber and lower chamber in the inner cavity of jar body, resin precipitation area and bulk material area are arranged in lower chamber, and water inlet, feeding, water outlet and discharge pipeline are matched;Support frame bottom is sequentially arranged with material collecting groove and guide material cylinder, and built-in screw lifting mechanism is driven by driving device, abrasive disc is coaxially linked with lifting mechanism, and abrasive disc is formed with resin abrasive anti-caking channel in cooperation with material collecting groove;Material collecting groove discharge port is connected with bulk material pipe group, and float ball linkage floating bulk material mechanism is arranged in pipe.The application breaks resin caking by mechanical grinding, and realizes resin global uniform distribution by screw lifting circulating resin and float intermittent bulk material, and greatly improves copper ion exchange adsorption efficiency.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention relates to the field of resource recovery and treatment technology of waste etching solution for PCB printed circuit boards, and in particular to a filtration and purification device for recovering copper from waste etching solution by relying on ion exchange resin to adsorb copper ions. Background Technology

[0002] The etching process in printed circuit board (PCB) manufacturing generates a large amount of waste etching solution containing high concentrations of copper ions. This waste solution is classified as hazardous waste, and direct discharge will cause heavy metal pollution and significant copper resource loss. The industry commonly uses ion exchange resin adsorption to recover copper ions from the waste solution. This method relies on the ion exchange resin and etching solution to achieve copper ion exchange and adsorption, followed by separation of the purified solution from the saturated resin to recover copper. Existing related technologies are mainly divided into two categories: 1. Comparative document 1 (CN218590553U ion exchange device): The resin is turned over by a cylinder-driven telescopic screen, and the resin layer is stirred by lifting up and down.

[0003] The solution has obvious drawbacks: relying solely on mechanical agitation through a screen without a resin extrusion structure, the resin is prone to agglomeration and clumping under pressure in the sedimentation zone. The clumped resin cannot come into contact with the etching solution, significantly reducing the copper adsorption capacity. The resin cannot be circulated and evenly distributed throughout the reaction chamber, resulting in a large difference in resin concentration between the upper and lower layers and an uneven exchange reaction. Furthermore, the lack of an automatic resin circulation and lifting system and a uniform material distribution structure makes manual cleaning of clumped resin a labor-intensive task.

[0004] 2. Comparison document 2 (CN223951114U Waste etching solution copper recovery equipment): adopts bottom inclined filter plate combined with central propeller to stir resin.

[0005] The defects are as follows: the stirring blades can only agitate the shallow liquid, and the resin at the bottom cannot be stirred up, resulting in long-term accumulation and hardening of the resin; the resin feeding relies on fixed feeding columns on both sides, and the resin can only settle locally, resulting in severe uneven distribution of resin inside the cavity; there is no resin grinding and extrusion mechanism, so the agglomerated resin cannot be dissolved online; there is no resin self-circulation and lifting structure, so saturated resin deposited at the bottom cannot continuously participate in the upper exchange reaction, resulting in low resin utilization.

[0006] In summary, existing traditional ion exchange treatment equipment generally suffers from four major pain points: ① Ion exchange resin is prone to clumping, and the resin inside the clumping cannot participate in copper ion exchange, resulting in a significant decrease in recovery efficiency; ② After the resin settles, it solidifies in layers, resulting in uneven resin distribution throughout the cavity and insufficient contact between the etching solution and the resin; ③ The resin cannot circulate automatically, and saturated resin accumulates at the bottom, resulting in a low overall resin utilization rate.

[0007] To address the aforementioned deficiencies in the existing technology, this invention provides a filtration and purification device for recovering copper from waste etching solution. It integrates resin mechanical grinding to prevent agglomeration, spiral self-circulation lifting, intermittent uniform material distribution via float linkage, and integrated online filtration with a filter membrane, solving industry problems such as resin agglomeration, uneven distribution, and dispersed processing steps. Summary of the Invention

[0008] To address the technical shortcomings of existing ion exchange resin treatment equipment for waste etching solutions, such as resin agglomeration, uneven distribution, slow solid-liquid separation, and low resin utilization, this paper provides a filtration and purification device for copper recovery from waste etching solutions. This device achieves online resin grinding and breaking up, uniform material distribution throughout the entire process, automatic circulation and lifting, and integrated online filtration, thereby improving copper ion recovery efficiency and enabling continuous purification treatment of waste etching solutions.

[0009] To achieve the above objectives, this invention proposes a filtration and purification device for recovering copper from waste etching solution. The core component is a sealed tank with a horizontally mounted support frame inside. This support frame vertically divides the tank's internal cavity into a lower reaction chamber and an upper buffer chamber. The lower half of the lower chamber is a resin sedimentation and accumulation zone, while the upper half is a resin dispersion reaction zone. The tank is equipped with multiple fluid and material interfaces: a water inlet at the top for introducing the waste etching solution; a feeding port on the side wall for adding ion exchange resin to the chamber; a water outlet on the side wall above the support frame for discharging the purified waste liquid after membrane separation; and a discharge port at the bottom of the tank, equipped with a controllable discharge valve for periodically discharging saturated resin. A filter membrane is laid flat on the support frame, blocking resin particles and allowing only purified liquid to pass through, achieving immediate solid-liquid separation. A downward-extending collection trough is fixed at the center of the lower surface of the support frame, and a vertically fixed guide cylinder is fixed at the center of the collection trough. A drive device is installed on the top surface of the tank, and the output shaft of the drive device extends vertically downward into the guide cylinder. A lifting mechanism is installed inside the guide cylinder. The lifting mechanism can continuously transport the resin accumulated at the bottom of the sedimentation zone upward to the collection trough, completing the internal circulation of the resin. A synchronously rotating abrasive disc is coaxially mounted on the lifting mechanism. The abrasive disc is positioned opposite the top of the collection trough, and the two work together to form an annular abrasive channel. When the resin passes through the channel, it is crushed and ground by the spherical surface to break up the agglomerates and prevent resin agglomeration. Multiple annular and evenly distributed discharge ports are opened at the bottom of the collection trough. A vertically downward dispersing pipe assembly is fixed below each discharge port. Multiple sets of equidistant dispersing holes are opened on the pipe wall of the dispersing pipe assembly. A floating dispersing mechanism is set inside the pipe body. The floating mechanism relies on the buoyancy of the liquid in the cavity and is linked with the abrasive disc. It moves up and down periodically with the rotation of the abrasive disc, controlling the intermittent diffusion of resin from the dispersing holes to ensure that the resin is evenly dispersed throughout the entire lower chamber and avoids local resin accumulation.

[0010] Further optimize the structure of the lifting mechanism: The lifting mechanism includes a vertical shaft and a spiral guide plate. The upper end of the shaft is rigidly connected to the drive device. The shaft extends downward through the guide cylinder to the bottom of the sedimentation zone. The spiral guide plate is fixed around the outer wall of the shaft. When the shaft rotates, the spiral guide plate cooperates with the inner wall of the guide cylinder and lifts and transports the bottom resin upward by relying on the spiral conveying principle.

[0011] Further optimization of the abrasive grinding structure: The abrasive disc is fixedly mounted on the outside of the shaft and rotates synchronously with the shaft; the upper part of the abrasive disc is a conical surface that is narrower at the top and wider at the bottom, with multiple sets of raised spherical abrasive particles arranged on the conical surface; two coaxial annular limiting rings are set at the bottom edge of the abrasive disc, and a wavy annular pressure surface is machined between the two limiting rings. The top of the collecting trough is machined with a lower conical surface that perfectly matches the taper of the abrasive disc's conical surface, and corresponding spherical abrasive particles are arranged on the lower conical surface; the upper and lower sets of spherical abrasive particles interlock with each other, and the resin is squeezed and ground as it flows through the gap, completely breaking down the agglomerated resin.

[0012] Further optimize the structure of the bulk material pipe assembly: The bulk material pipe assembly consists of two coaxial conduits, inner and outer. The upper end of the inner conduit is connected to the discharge port of the collecting trough, and the lower end is closed. A vertical discharge trough is opened on the side wall of the inner conduit. After the resin enters the inner conduit from the collecting trough, it enters the interlayer between the inner and outer conduits through the discharge trough. Multiple sets of bulk material holes are opened along the axial direction on the outer conduit wall. The diameter of the bulk material holes is controlled at 1 to 2 times the diameter of the resin particles, which can not only discharge the resin smoothly, but also avoid local accumulation caused by a large amount of resin rushing out quickly.

[0013] Further optimization of the floating material distribution mechanism: Multiple feeders are vertically arranged inside the interlayer, all connected as a whole by a thin rope. The rope passes upward through the collection trough and connects to a float. The float is confined between two limiting rings of the abrasive disc. The buoyancy of the liquid inside the cavity continuously pushes the float upward, pressing it tightly against the corrugated pressure surface. As the abrasive disc rotates continuously, the corrugated pressure surface periodically squeezes and releases the float, causing the rope and all feeders to move up and down synchronously. The upper part of the feeder has a conical expansion structure. When moving upward, it blocks the discharge trough and stops resin discharge; when moving downward, it opens the discharge trough channel, allowing resin to diffuse from the distribution hole, thus achieving intermittent and uniform resin distribution. The lower cylinder of the feeder fits with the inner wall of the outer guide tube with a micro-gap, smaller than the diameter of the resin particles, preventing resin leakage from the bottom of the interlayer.

[0014] Compared with related technologies, the filtration and purification equipment for copper recovery from waste etching solution provided by the present invention has the following beneficial effects: (1) The present invention uses a synchronously rotating abrasive disc and a collection tank to grind with spherical abrasives. During the resin circulation process, the agglomerates are forcibly broken, ensuring that each resin particle is fully exposed to the etching solution, which greatly improves the copper ion exchange adsorption capacity and increases the copper recovery efficiency by more than 30%.

[0015] (2) This equipment relies on a spiral structure to continuously transport the bottom saturated resin upwards. After grinding and dispersing, it is redistributed to the entire reaction chamber, realizing the resin circulation without dead corners. The etching solution and resin are in full contact, avoiding the incomplete adsorption of copper ions due to insufficient local resin.

[0016] (3) The present invention relies on the linkage of the abrasive disc wave surface with the float ball to automatically and intermittently release resin as the equipment runs. The resin diffuses evenly along the entire height of the distribution pipe, and the resin distribution in the cavity is highly uniform, without local blockage or local material shortage.

[0017] (4) The support frame of this equipment integrates a filter membrane. After purification, the liquid is discharged immediately through the outlet. Saturated resin only needs to be discharged in a concentrated manner by opening the bottom discharge valve periodically. The feeding, adsorption, filtration and slag discharge processes are integrated and operated continuously without the need to stop the machine for transfer, and the production efficiency is increased by more than 100%.

[0018] (5) This equipment only requires a single motor to drive all motion mechanisms, without the need for multiple cylinders and multiple motors to control separately, simplifying the equipment structure and reducing energy consumption; resin clumps are automatically dissolved online, eliminating the need for manual shutdown to clean the clumps, greatly reducing the workload of manual operation and maintenance; all pipelines and cavities are integrated and sealed, eliminating the risk of waste liquid leakage and improving environmental safety. Attached Figure Description

[0019] Figure 1 This is a three-dimensional schematic diagram of a filtration and purification device for recovering copper from waste etching solution proposed in this invention. Figure 2 This is a schematic diagram of the overall plan of a filtration and purification device for recovering copper from waste etching solution proposed in this invention; Figure 3 for Figure 2 A three-dimensional schematic diagram of a partial section at point AA; Figure 4 for Figure 2 Schematic diagram of half-section plane at point AA; Figure 5 for Figure 4 Enlarged view of point B in the middle; Figure 6 This is a three-dimensional schematic diagram of the abrasive disk proposed in this invention; Figure 7 This is a three-dimensional schematic diagram of the material collection trough proposed in this invention; Figure 8 This is a half-section perspective view of the bulk material pipe assembly and floating bulk material mechanism proposed in this invention.

[0020] In the diagram: 1. Tank body; 11. Lower chamber; 12. Upper chamber; 13. Inlet; 14. Discharge port; 15. Discharge valve; 16. Feeding port; 17. Outlet; 2. Support frame; 21. Filter membrane; 3. Collection trough; 31. Lower conical surface; 32. Lower abrasive ball; 33. Discharge port; 4. Guide cylinder; 5. Drive device; 6. Lifting mechanism; 61. Shaft; 62. Spiral guide plate; 7. Abrasive disc; 71. Upper conical surface; 72. Upper abrasive ball; 73. Limiting ring; 74. Corrugated pressure surface; 8. Distributor assembly; 81. Outer guide tube; 82. Inner guide tube; 83. Discharge trough; 84. Distributor hole; 9. Floating distribution mechanism; 91. Distributor; 92. Thin rope; 93. Float. Detailed Implementation

[0021] The present invention will be further described in detail below with reference to specific embodiments, so that those skilled in the art can understand it.

[0022] Please see Figures 1-8 This embodiment proposes a filtration and purification device for recovering copper from waste etching solution, including a tank 1. The tank 1 is a vertical cylindrical sealed pressure tank. A ring support frame 2 is horizontally welded and fixed inside the tank 1. The support frame 2 vertically divides the internal space of the tank 1 into a lower chamber 11 and an upper chamber 12. The lower half of the lower chamber 11 is the ion exchange resin precipitation zone, the upper half of the lower chamber 11 is the ion exchange resin bulk reaction zone, and the upper chamber 12 is only used as a liquid buffer space and is not filled with resin.

[0023] A water inlet 13 is opened at the center of the top of the tank 1. The water inlet 13 is connected to a waste liquid transfer pump to continuously send the waste etching solution generated in PCB production into the lower chamber 11. A feeding port 16 is opened on the upper side wall of the lower chamber 11. The feeding port 16 is equipped with a sealing flange for initial filling of resin and subsequent replenishment of lost resin. A water outlet 17 is opened on the side wall of the tank 1 at the installation height of the support frame 2. The water outlet 17 is connected to a clean water storage tank. A discharge port 14 is opened at the lowest point of the conical head at the bottom of the tank 1. An electrically controlled discharge valve 15 is connected in series on the pipe of the discharge port 14. The discharge valve 15 is used to periodically discharge the resin that has adsorbed saturated copper ions.

[0024] The filter membrane 21 is laid flat and fixed on the ring frame of the support frame 2. The filter membrane 21 is a special filter membrane for acid and alkali resistant ion exchange. The pore size of the filter membrane is smaller than the diameter of the ion exchange resin particles. The liquid can penetrate upward through the filter membrane 21 and flow into the upper chamber 12. The resin particles are completely blocked in the lower chamber 11, realizing synchronous filtration of reaction.

[0025] The bottom center of the support frame 2 is welded downward to fix the inverted conical collection trough 3. The bottom center of the collection trough 3 is vertically fixed to the cylindrical guide cylinder 4, which extends vertically to the bottom of the sedimentation zone of the lower chamber 11. The top surface of the tank body 1 is fixed with a drive device 5, which is a horizontal geared motor. The output shaft of the drive device 5 extends vertically downward into the inside of the guide cylinder 4.

[0026] The material guide cylinder 4 is equipped with a lifting mechanism 6, which includes a shaft 61 and a spiral guide plate 62. The top end of the shaft 61 is rigidly connected to the output shaft of the drive device 5 via a coupling. The shaft 61 passes through the material guide cylinder 4 vertically and extends to the bottom sedimentation area of ​​the tank 1. The spiral guide plate 62 is continuously welded around the outer wall of the shaft 61. The outer edge of the spiral guide plate 62 is clearance-fitted with the inner wall of the material guide cylinder 4. When the shaft 61 rotates, the spiral guide plate 62 spirally lifts the resin at the bottom of the sedimentation area and transports it to the inside of the collection tank 3.

[0027] The abrasive disc 7 is coaxially mounted and fixed at the middle position of the shaft 61, and the abrasive disc 7 rotates synchronously with the shaft 61; the upper part of the abrasive disc 7 is an upper conical surface 71 that is narrow at the top and wide at the bottom, and multiple sets of upper abrasive balls 72 are uniformly fixed in a ring on the surface of the upper conical surface 71; two circular limiting rings 73 are coaxially machined at the bottom edge of the abrasive disc 7, and an annular wave-shaped pressure surface 74 is integrally formed between the two limiting rings 73.

[0028] The top opening of the collecting trough 3 forms a lower conical surface 31, the taper of which is perfectly matched with the upper conical surface 71. Multiple sets of lower abrasive balls 32 are uniformly fixed in an annular shape on the surface of the lower conical surface 31. The lower abrasive balls 32 and the upper abrasive balls 72 are staggered and correspond one to one. The annular gap between the upper conical surface 71 and the lower conical surface 31 forms an abrasive channel. After the resin flows out from the top of the guide cylinder 4, it all flows through the abrasive channel.

[0029] The bottom of the collecting trough 3 has several uniformly spaced discharge ports 33, and a set of material distribution pipes 8 is vertically fixed at the lower end of each discharge port 33. The material distribution pipes 8 include an outer guide tube 81 and an inner guide tube 82 arranged coaxially. The upper end of the inner guide tube 82 is sealed and connected to the discharge port 33, and the lower end of the inner guide tube 82 is closed. Multiple long discharge grooves 83 are opened along the vertical axis of the inner guide tube 82. The outer guide tube 81 is sleeved on the outside of the inner guide tube 82, and the lower end of the outer guide tube 81 is open to avoid material blockage. Multiple sets of material distribution holes 84 are equidistantly opened along the length of the outer guide tube 81, and the diameter of the material distribution holes 84 is set to 1.5 times the diameter of a single particle of ion exchange resin.

[0030] A floating material distribution mechanism 9 is assembled inside the annular interlayer formed by the outer guide tube 81 and the inner guide tube 82. The floating material distribution mechanism 9 includes a distributor 91, a thin rope 92, and a float 93. Nine distributors 91 are arranged vertically and equidistantly inside the interlayer. All distributors 91 are connected in series by the same thin rope 92 through their center. The thin rope 92 passes upward through the inner cavity of the material collection trough 3 and is connected to the spherical float 93 at the top. The float 93 is movably placed between the two limiting rings 73 of the abrasive disk 7. It can only move up and down slightly in the vertical direction and will not deviate horizontally from the wavy pressure surface 74.

[0031] The upper part of the distributor 91 has a conical expansion structure with the conical surface facing downwards, which can guide the resin particles flowing out of the discharge channel 83 of the inner guide tube 82 to the outside. The lower part of the distributor 91 is a cylindrical section, with the outer wall of the cylinder fitting with the inner wall of the outer guide tube 81 with a gap width of 0.5 times the diameter of the resin particles, preventing resin from leaking downwards through this gap. The lower chamber 11 is filled with waste etching solution, and the buoyancy of the liquid continuously lifts the float 93 upwards, so that the outer wall of the float 93 always fits tightly against the corrugated pressure surface 74.

[0032] The workflow of this invention is as follows: 1. Initial filling stage of the equipment: Close the discharge valve 15, open the feed port 16 flange, and add a quantitative amount of ion exchange resin into the lower chamber 11 of the tank body 1. After filling is completed, seal the feed port 16; start the drive device 5, and the drive device 5 drives the shaft 61, the spiral guide plate 62, and the grinding disc 7 to rotate synchronously and uniformly.

[0033] 2. Waste liquid feeding and copper ion exchange stage: The waste liquid conveying pump is started, and the waste etching solution is sent into the lower chamber 11 through the inlet 13. The liquid gradually fills the entire lower chamber 11 and submerges all the resin. The liquid generates buoyancy and pushes the float 93 upward. The float 93 is in close contact with the wavy pressure surface 74 of the abrasive disk 7. The bottom sedimented resin is lifted upward along the guide cylinder 4 under the conveying action of the spiral guide plate 62. After the resin flows out from the top of the guide cylinder 4, it enters the abrasive channel at the top of the collection tank 3. The rotating upper abrasive ball 72 and the fixed lower abrasive ball 32 squeeze and knead the resin agglomerates. The agglomerated resin is ground and broken into single particles, eliminating the defect that the agglomerates cannot adsorb copper ions.

[0034] 3. Floating intermittent uniform material distribution process: The resin after grinding and crushing falls to the bottom of the collection tank 3, flows into the inner guide tube 82 through the discharge port 33, and enters the interlayer of the inner and outer guide tubes through the discharge trough 83; the grinding disc 7 rotates continuously, and the wavy pressure surface 74 periodically squeezes and releases the float ball 93. - The raised section of the wave-shaped pressure surface 74 contacts the float 93: the float 93 is forced to descend, and all the distributors 91 move down synchronously under the action of gravity. After the resin flows out of the discharge trough 83, it is evenly diffused to each height area of ​​the lower chamber 11 through the dispersing hole 84. - The concave section of the wave-shaped pressure surface 74 contacts the float 93: the buoyancy of the liquid pushes the float 93 upward, the thin rope 92 drives the distributor 91 to move upward as a whole, the conical section of the distributor 91 blocks the discharge chute 83, and the resin temporarily stops spreading outward; relying on the continuous undulation of the wave surface, the resin achieves intermittent, uniform distribution throughout the entire height, the resin is evenly distributed in the entire area of ​​the lower chamber 11, and fully contacts the waste etching solution, and the copper ions are fully adsorbed by the ion exchange resin.

[0035] 4. Integrated online filtration and drainage: After the waste etching solution reacts fully with the resin, the purified liquid that removes copper ions flows upward through the filter membrane 21 on the support frame 2. The resin particles are completely intercepted by the filter membrane 21, and the purified liquid flows into the upper chamber 12. Finally, it is continuously discharged to the clean water storage tank through the outlet 17. No separate solid-liquid separation process is required, realizing continuous feeding and continuous output of clean water.

[0036] 5. Automatic discharge of saturated resin: After the equipment has been running for a period of time, all the resin in the lower chamber 11 has adsorbed saturated copper ions. The water pump and drive device 5 are stopped, the bottom discharge valve 15 is opened, and the liquid in the tank 1 carrying the saturated resin is discharged from the discharge port 14 and sent to the resin regeneration section. After the discharge is completed, the discharge valve 15 is closed, waste liquid is added again, a small amount of new resin is added, and a new round of purification and recycling cycle is started.

[0037] Operational optimization notes: This equipment can simultaneously complete all actions of resin lifting, agglomeration grinding, and intermittent material distribution using only a single drive motor, eliminating the need for separate control of multiple power sources and resulting in lower energy consumption; the grinding, circulation, and material distribution structures work in tandem, enabling fully automated operation without manual intervention in resin dispersing or material distribution; the filter membrane is integrated in the middle of the reaction chamber, allowing for simultaneous reaction and filtration, and its continuous production capacity is far superior to traditional split-type exchange equipment, making it suitable for large-scale continuous processing of waste etching solution in PCB factories.

[0038] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of the present invention according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of the present invention. These technical solutions also fall within the scope of protection of the present invention.

Claims

1. A filtration and purification device for recovering copper from waste etching solution, characterized in that, The tank (1) includes a fixed support frame (2) inside the tank (1), which divides the inner cavity of the tank (1) into a lower chamber (11) and an upper chamber (12). The ion exchange resin in the lower chamber (11) forms a sedimentation zone and a bulking zone due to gravity settling. The tank (1) is provided with an inlet (13), a feed port (16), and an outlet (17) that connect to the lower chamber (11). A discharge port (14) with a discharge valve (15) is opened at the bottom of the tank (1). A filter membrane (21) is assembled on the support frame (2). A collection trough (3) is fixed on the bottom surface of the support frame (2), and a guide is fixed in the center of the collection trough (3). The top surface of the cylinder (4) and tank (1) is equipped with a drive device (5). Inside the guide cylinder (4) is a lifting mechanism (6) driven by the drive device (5) to lift the bottom resin. The lifting mechanism (6) is coaxially fixed with an abrasive disc (7). An abrasive channel is formed between the abrasive disc (7) and the collection trough (3) to grind the resin and prevent resin from clumping. The collection trough (3) has a ring-shaped discharge port (33). The bottom of the discharge port (33) is fixed with a distribution pipe group (8) with a distribution hole (84). Inside the distribution pipe group (8) is a floating distribution mechanism (9) that is linked with the abrasive disc (7) to realize intermittent resin distribution.

2. The filtration and purification equipment for recovering copper from waste etching solution according to claim 1, characterized in that, The lifting mechanism (6) includes a shaft (61) and a spiral guide plate (62); the upper end of the shaft (61) is connected to the output end of the drive device (5), the shaft (61) extends downward through the guide cylinder (4) and into the bottom of the sedimentation zone of the lower chamber (11), the spiral guide plate (62) is fixed to the outer wall of the shaft (61), and the spiral guide plate (62) and the inner wall of the guide cylinder (4) cooperate to form a resin lifting channel.

3. The filtration and purification equipment for recovering copper from waste etching solution according to claim 2, characterized in that, The abrasive disc (7) is coaxially mounted and fixed on the outside of the shaft (61). The abrasive disc (7) has an upper conical surface (71) and multiple sets of upper abrasive balls (72) are arranged on the upper conical surface (71). Two limiting rings (73) are coaxially arranged on the bottom edge of the abrasive disc (7), and a wave-shaped pressing surface (74) is formed between the two limiting rings (73).

4. The filtration and purification equipment for recovering copper from waste etching solution according to claim 3, characterized in that, The top of the collecting trough (3) is formed with a lower conical surface (31) that matches the taper of the upper conical surface (71). Multiple sets of lower abrasive balls (32) are evenly arranged on the lower conical surface (31). The lower conical surface (31) and the lower abrasive balls (32) are arranged alternately in the axial direction. The bottom end of the lower conical surface (31) is connected to the discharge port (33). The upper abrasive balls (72) and the lower abrasive balls (32) interlock to form an abrasive channel.

5. The filtration and purification equipment for recovering copper from waste etching solution according to claim 1, characterized in that, The material distribution pipe assembly (8) includes an outer conduit (81) and an inner conduit (82) arranged coaxially. The outer conduit (81) and the inner conduit (82) are fixedly connected to the bottom of the discharge port (33) of the material collection trough (3). The inner conduit (82) is open at the upper end and closed at the lower end. Multiple discharge grooves (83) are opened along the axial direction on the periphery of the inner conduit (82). Several sets of material distribution holes (84) are opened at equal intervals along the length direction on the wall of the outer conduit (81).

6. The filtration and purification equipment for recovering copper from waste etching solution according to claim 5, characterized in that, The aperture size of the material dispensing hole (84) is between the diameter of a single particle of ion exchange resin and twice the particle diameter.

7. The filtration and purification equipment for recovering copper from waste etching solution according to claim 5, characterized in that, The floating material distribution mechanism (9) includes a multi-component feeder (91), a thin rope (92), and a float (93). The multi-component feeders (91) are arranged vertically at equal intervals inside the annular cavity formed by the outer guide tube (81) and the inner guide tube (82). All feeders (91) are connected in series by the thin rope (92). The upper end of the thin rope (92) extends into the material collection trough (3) and is connected to the float (93). The float (93) is limited to the movement between the two limiting rings (73) of the abrasive disc (7).

8. The filtration and purification equipment for recovering copper from waste etching solution according to claim 7, characterized in that, The float (93) is held upward by the buoyancy of the liquid in the lower chamber (11). The outer wall of the float (93) continuously adheres to the wave-shaped pressure surface (74). When the abrasive disc (7) rotates, the wave-shaped pressure surface (74) periodically pushes / releases the float (93). The feeder (91) is driven to move up and down repeatedly by the thin rope (92) to achieve intermittent material discharge.

9. The filtration and purification equipment for recovering copper from waste etching solution according to claim 7, characterized in that, The upper part of the distributor (91) is a tapered expansion structure that is narrow at the top and wide at the bottom, which is used to diffuse the resin particles discharged from the discharge trough (83) of the inner conduit (82) to the outside; the lower part of the distributor (91) is a cylindrical structure, with the outer wall of the cylinder and the inner wall of the outer conduit (81) in a gap fit, and the gap width between the two is smaller than the diameter of a single particle of ion exchange resin.

Citation Information

Patent Citations

  • Ion exchange device

    CN218590553U

  • Filtering and purifying equipment for recovering copper from waste etching liquid

    CN223951114U