Sensor module and electronic device

Abstract

This invention provides a sensor module and an electronic device. The sensor module includes: a sensor substrate on which a sensor is mounted; a base having a first surface facing a fixed surface and a second surface opposite to the first surface, on which the sensor substrate is mounted; and a flexible substrate having a first end connected to the sensor substrate and a second end disposed on the first surface side.

Description

Technical Field

[0001] This invention relates to sensor modules and electronic devices. Background Technology

[0002] Patent document 1 describes a sensor module equipped with a three-axis accelerometer and a three-axis angular velocity sensor, and featuring a plug-type connector. The plug-type connector connects to a socket-type connector to transmit and receive electrical signals, such as power supply to the sensor module and output of detection data detected by the sensor module.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2019-163955

[0004] When such a sensor module is fixed to a surface such as a car, vibrations can propagate through the socket-type connector and the plug-type connector, potentially affecting the output signal. Summary of the Invention

[0005] One aspect of the sensor module of this application includes: a sensor substrate on which a sensor is mounted; a base having a first surface facing a fixed surface and a second surface opposite to the first surface, wherein the sensor substrate is mounted on the second surface; and a flexible substrate having a first end connected to the sensor substrate and a second end disposed on the first surface side.

[0006] One embodiment of the electronic device of this application includes the aforementioned sensor module. Attached Figure Description

[0007] Figure 1 This is a perspective view showing the sensor module of Embodiment 1 fixed to the fixed surface.

[0008] Figure 2 This shows the view from the fixed side. Figure 1 A 3D view of the status of the sensor module.

[0009] Figure 3 This is a perspective view of the sensor module with its housing removed.

[0010] Figure 4 It is shown along Figure 3 The position of the AA line is cut Figure 1 A cross-sectional view of the sensor module.

[0011] Figure 5 This is an exploded 3D view of the sensor module.

[0012] Figure 6 This is a perspective view showing an example of the electronic device according to Embodiment 2.

[0013] Figure 7 This is a perspective view showing another example of the electronic device according to Embodiment 2.

[0014] Label Explanation

[0015] 1: Rigid-flexible substrate; 1a: Rigid part; 1b: Flexible part; 7: Sensor; 7x: Angular velocity sensor; 7y: Angular velocity sensor; 7z: Angular velocity sensor; 8: Circuit; 10: Sensor substrate; 20: Flexible substrate; 2a: First end; 2b: Second end; 30: Base; 3a: Upper surface; 3b: Lower surface; 31: Protrusion; 31a: Upper surface; 32: Through hole; 33: Recess; 40: Elastic component; 41: Opening; 42: Through hole; 50: Housing; 51: Storage part; 52: Through hole; 60: Screw; 90: Mounted device; 9a: Fixed surface; 91: Connector; 100: Sensor module; 110: Smartphone; 111: Control unit; 130: Automobile; 131: Vehicle body; 132: Vehicle body posture control device; 133: Wheel. Detailed Implementation

[0016] To facilitate observation of the constituent elements, the scales of the dimensions in the accompanying drawings are sometimes different depending on the constituent elements.

[0017] In the attached figures, the X-axis, Y-axis, and Z-axis are orthogonal to each other.

[0018] In the following explanation, "X-axis direction" refers to the direction parallel to the X-axis, "Y-axis direction" refers to the direction parallel to the Y-axis, and "Z-axis direction" refers to the direction parallel to the Z-axis.

[0019] In the following explanation, "positive side" refers to the front side of the arrow direction of each XYZ axis, and "negative side" refers to the end side of the arrow direction.

[0020] In the following description, "top view" refers to viewing the surface containing the X and Y axes from the Z-axis direction.

[0021] In the following description, the description of the upper surface of a structure indicates the positive side of the structure in the Z-axis direction, and the description of the lower surface of a structure indicates the negative side of the structure in the Z-axis direction.

[0022] 1. Implementation Method 1

[0023] Figures 1 to 5 The sensor module 100 of this embodiment is shown.

[0024] Figure 1 This shows the sensor module 100 installed in the vehicle 130 (see reference). Figure 7 A perspective view of the state of the fixed surface 9a of the installed device 90. Figure 2 This shows the view from the fixed surface 9a side. Figure 1 A three-dimensional view of the state of the sensor module 100. Figure 3 This is a perspective view of the sensor module 100 with the housing 50 removed. Figure 4 It is shown along Figure 3 The position of the AA line is cut Figure 1 A cross-sectional view of the sensor module 100. Figure 5 This is an exploded perspective view of sensor module 100.

[0025] In this embodiment, the sensor module 100 is an inertial measurement unit (IMU) that detects the posture and behavior of the mounted device 90, such as the car 130 or robot. Here, the mounted device 90 can also be referred to as a moving body. The behavior can also be referred to as inertial motion. The inertial measurement unit can also be referred to as a physical quantity measuring device.

[0026] like Figure 1 As shown, the sensor module 100 has a housing 50 and an elastic component 40.

[0027] The housing 50 is a cuboid with a roughly square upper and lower surface and roughly rectangular sides. The storage section 51 inside the housing 50 (see reference) Figure 4 The sensor substrate 10 houses and mounts the multiple sensors 7, which will be described later. The sensor substrate 10 will be described later.

[0028] An elastic member 40 is disposed between the housing 50 and the fixed surface 9a, and functions as a vibration damping member. The elastic member 40 can be, for example, a soft, gel-like material primarily made of silicone. In this embodiment, because the elastic member 40 is disposed between the housing 50 and the fixed surface 9a, the propagation of vibrations from the fixed surface 9a to the sensor substrate 10 can be suppressed.

[0029] A through hole 52 is provided in the housing 50, and a through hole 42 is provided in the elastic member 40 (see reference). Figure 2 By passing screw 60 through the through holes 52 and 42, the sensor module 100 is fixed to the fixing surface 9a of the mounting device 90, such as the automobile 130. In this embodiment, screw 60 is an example of a fixing component.

[0030] like Figure 2 or Figure 5 As shown, a connector 91 is provided on the fixing surface 9a of the mounted device 90. The connector 91 is an FPC (Flexible Printed Circuits) connector. In this embodiment, the connector 91 is an example of a connecting component. A hole 92 for fixing the sensor module 100 may also be provided on the fixing surface 9a.

[0031] An opening 41 is provided in the elastic member 40. The lower surface 3b of the base 30 and the through hole 32 of the base 30 are exposed at the opening 41. Figure 3 As shown, the through hole 32 passes between the lower surface 3b and the upper surface 3a of the base 30.

[0032] In the through hole 32, the flexible substrate 20 is led out from the upper surface 3a side of the base 30 into the opening 41. Inside the opening 41, the second end 2b of the flexible substrate 20 is inserted into the connector 91. The flexible substrate 20 is an FPC. In this embodiment, the lower surface 3b of the base 30 is an example of a first surface, and the upper surface 3a is an example of a second surface.

[0033] like Figures 3 to 5 As shown, a sensor 7 and a circuit 8 are mounted on the sensor substrate 10. In this embodiment, the sensor 7 includes angular velocity sensors 7x, 7y, and 7z. Angular velocity sensor 7x is an angular velocity sensor that detects the angular velocity about the X-axis. Angular velocity sensor 7y is an angular velocity sensor that detects the angular velocity about the Y-axis. Angular velocity sensor 7z is an angular velocity sensor that detects the angular velocity about the Z-axis.

[0034] Angular velocity sensors 7x, 7y, and 7z are angular velocity sensors with piezoelectric oscillators such as quartz oscillators. As angular velocity sensors 7x, 7y, and 7z, electrostatic capacitive angular velocity sensors can also be used, for example, which have silicon MEMS oscillators using silicon MEMS (Silicon Micro Electro Mechanical Systems) technology.

[0035] Sensor 7 is not limited to a 3-axis angular velocity sensor. For example, sensor 7 can also be a 2-axis or 1-axis angular velocity sensor. In addition, sensor 7 can also be an accelerometer or a 6DoF (Degree of Freedom) sensor.

[0036] Circuit 8 includes, for example, an arithmetic circuit and a digital interface circuit. The arithmetic circuit acts as the master controller relative to the angular velocity sensors 7x, 7y, and 7z, receiving the detection data output from these sensors and performing various processing steps. The arithmetic circuit is an integrated circuit device, such as an MPU (Micro Processor Unit) or CPU (Central Processing Unit). The interface circuit performs digital interface processing based on communication standards such as SPI or I2C. After the detection data output from the angular velocity sensors 7x, 7y, and 7z is processed in the arithmetic circuit, it is transmitted to the mounted device 90 via the flexible substrate 20 and connector 91 through the digital interface circuit.

[0037] The first end 2a of the flexible substrate 20 is connected to the sensor substrate 10, and the second end 2b is connected to the connector 91 of the mounted device 90. A plurality of electrodes 21 for electrical connection with the connector 91 are provided on the second end 2b.

[0038] In a preferred embodiment, the sensor substrate 10 and the flexible substrate 20 are composed of a rigid-flexible substrate 1. The rigid-flexible substrate 1 has a rigid portion 1a and a flexible portion 1b, the rigid portion 1a including the sensor substrate 10 and the flexible portion 1b including the flexible substrate 20.

[0039] By using the rigid-flexible substrate 1, a connector is not needed to connect the sensor substrate 10 and the flexible substrate 20, thus enabling the sensor module 100 to be lightweight and miniaturized. Moreover, since noise can be reduced, the accuracy of the sensor module 100 can be improved.

[0040] The sensor substrate 10 is mounted on the upper surface 3a.

[0041] The base 30 has a protrusion 31 between the through hole 32 and the sensor substrate 10. The base 30 also has a recess 33. The recess 33 is a clearance portion used to prevent the sensor 7 and circuit 8 mounted on the sensor substrate 10 from contacting the base 30. The base 30 has a through hole 32. The through hole 32 passes between the lower surface 3b and the upper surface 3a of the base 30. In addition, although the base 30 has a through hole 32, a cutout can be used instead of a through hole, as long as the flexible substrate 20 is led out from the upper surface 3a of the base 30 into the opening 41.

[0042] The upper surface 31a of the protrusion 31 abuts against the flexible substrate 20. The base 30 is made of metal and has a larger mass than the flexible substrate 20, which is made of polyimide film or the like.

[0043] Therefore, by abutting the upper surface 31a of the protrusion 31 against the flexible substrate 20, the propagation of vibrations of the mounted device 90, which propagates to the flexible substrate 20 via the connector 91, to the sensor substrate 10 can be suppressed. In a preferred embodiment, the flexible substrate 20 is fixed to the upper surface 31a of the protrusion 31 via a bonding member such as an adhesive. By fixing the flexible substrate 20 to the upper surface 31a of the protrusion 31, the propagation of vibrations of the mounted device 90, which propagates to the flexible substrate 20, to the sensor substrate 10 can be further suppressed compared to the case where it is not fixed. In this embodiment, the protrusion 31 is an example of an abutting portion. The protrusion 31 abuts between the first end 2a and the second end 2b of the flexible substrate 20. In this embodiment, the protrusion 31 is provided on the side of the flexible substrate 20 at the first end 2a connected to the sensor substrate 10. That is, in this embodiment, the protrusion 31 is provided close to the sensor substrate 10.

[0044] The length of the elastic member 40 along the Z-axis, in other words, the height of the elastic member 40, is greater than the height of the connector 91. The elastic member 40 deforms due to vibrations of the mounted device 90, and therefore has a predetermined height such that the lower surface 3b of the base 30 does not collide with the connector 91 when the elastic member 40 deforms. The predetermined height refers to the height at which a predetermined gap is maintained between the elastic member 40 and the connector 91 when the elastic member 40 deforms and approaches the connector 91. For example, if the elastic member 40 uses αGEL (registered trademark) from Taica Co., Ltd., the predetermined height is preferably at least 1.5 times the height of the connector 91. Alternatively, to avoid collision with the elastic member 40, the height of the connector 91 is preferably less than two-thirds of the height of the elastic member 40.

[0045] As described above, the sensor module 100 of this embodiment has the following effects.

[0046] The sensor module 100 of this embodiment includes: a sensor substrate 10 on which a sensor 7 is mounted; a base 30 having a lower surface 3b, which is a first surface opposite to the fixed surface 9a, and an upper surface 3a, which is a second surface opposite to the lower surface 3b, on which the sensor substrate 10 is mounted; and a flexible substrate 20, the first end 2a of which is connected to the sensor substrate 10, and the second end 2b of which is disposed on the lower surface 3b side.

[0047] Thus, the sensor substrate 10, on which the sensor 7 is mounted, is mounted on the upper surface 3a of the base 30, and the second end 2b of the flexible substrate 20 connected to the sensor substrate 10 is disposed on the lower surface 3b side of the base 30.

[0048] Therefore, even when the sensor module 100 is fixed to the fixed surface 9a, the vibration of the fixed surface 9a can be suppressed from propagating to the sensor substrate 10. Thus, the sensor module 100 of this embodiment can suppress the impact of vibration of the fixed surface 9a on the output signal of the sensor 7, achieving a high-precision sensor module 100.

[0049] The sensor module 100 of this embodiment includes an elastic member 40, which is disposed between the lower surface 3b of the base 30 and the fixed surface 9a, and has an opening 41 that overlaps with the second end 2b of the flexible substrate 20 when viewed from above.

[0050] Therefore, the sensor module 100 of this embodiment can suppress the propagation of vibration from the fixed surface 9a to the sensor substrate 10 by means of the elastic member 40. Thus, the sensor module 100 of this embodiment can suppress the influence of vibration from the fixed surface 9a on the output signal of the sensor 7, and can achieve a high-precision sensor module 100.

[0051] The sensor module 100 of this embodiment includes: a housing 50 having a housing portion 51 for housing the sensor substrate 10, the base 30 and the flexible substrate 20 and a through hole 52; and a screw 60 as a fixing component, which is disposed in the through hole 52 to fix the housing 50 to the fixing surface 9a.

[0052] Thus, in the sensor module 100 of this embodiment, the sensor substrate 10, the base 30, and the flexible substrate 20 are housed in the housing 50. Therefore, the sensor module 100 of this embodiment can suppress external influences, thereby achieving a high-precision sensor module 100.

[0053] The sensor module 100 of this embodiment includes an elastic member 40 disposed between the housing 50 and the fixed surface 9a, and has an opening 41 that overlaps with the second end 2b of the flexible substrate 20 when viewed from above.

[0054] Therefore, the sensor module 100 of this embodiment can suppress the propagation of vibration from the fixed surface 9a to the sensor substrate 10 by means of the elastic member 40. Thus, the sensor module 100 of this embodiment can suppress the influence of vibration from the fixed surface 9a on the output signal of the sensor 7, and can achieve a high-precision sensor module 100.

[0055] In the sensor module 100 of this embodiment, the fixed surface 9a has a connector 91 that overlaps with the opening 41 as a connecting member when viewed from above, and the second end 2b of the flexible substrate 20 is connected to the connector 91.

[0056] In this way, connector 91 is connected to flexible substrate 20. Therefore, the sensor module 100 of this embodiment can suppress the vibration of the fixed surface 9a propagating to the sensor substrate 10 via the flexible substrate 20.

[0057] The sensor module 100 of this embodiment includes a rigid-flexible substrate 1, which has a rigid portion 1a including a sensor substrate 10 and a flexible portion 1b including a flexible substrate 20.

[0058] Therefore, the sensor module 100 of this embodiment does not require a connector to connect the sensor substrate 10 and the flexible substrate 20, thus enabling the sensor module 100 to be lightweight and miniaturized. Moreover, since noise can be reduced, accuracy can be improved.

[0059] In the sensor module 100 of this embodiment, the base 30 has a protrusion 31 that abuts against the first end 2a and the second end 2b of the flexible substrate 20, and the flexible substrate 20 is fixed to the protrusion 31.

[0060] Therefore, the sensor module 100 of this embodiment can suppress the vibration of the fixed surface 9a propagating to the sensor substrate 10 by means of the protrusion 31.

[0061] 2. Implementation Method 2

[0062] In Embodiment 2, an electronic device equipped with a sensor module 100 will be described.

[0063] The following example, using smartphone 110 (see reference), is an illustration of an electronic device. Figure 6 Examples include portable devices such as cars and mobile bodies such as automobiles.

[0064] 2.1. Overview of Portable Devices

[0065] Figure 6 This is a perspective view of a portable device as an electronic device according to Embodiment 2, and a diagram showing the structure of a smartphone 110 as an example of a portable device.

[0066] The smartphone 110 is equipped with a sensor module 100.

[0067] The detection data from the sensor module 100 is received by the control unit 111. The control unit 111 can recognize the posture and movement of the smartphone 110 based on the received detection signals, and change the display image on the display unit, or emit warning sounds or effect sounds, or drive the vibration motor to vibrate the main body.

[0068] The sensor module 100 can also be mounted on other portable devices besides the smartphone 110. For example, the sensor module 100 can be mounted on portable devices such as smartwatches, portable activity meters, HMDs (Head-Mounted Displays), mobile PCs (Personal Computers), tablet PCs, cameras, and PDAs (Personal Digital Assistants). Thus, the portable device can recognize the posture and movements of the portable device based on the detection data from the sensor module 100, causing changes in the displayed image, issuing warning sounds or effects, or driving a vibration motor to vibrate the main body.

[0069] Thus, in this embodiment, a portable device such as a smartphone 110 is equipped with a sensor module 100. Therefore, according to this embodiment, the reliability of a portable device equipped with a sensor module 100 can be improved.

[0070] 2.2. Overview of Moving Bodies

[0071] Figure 7This is a perspective view of a mobile body of an electronic device as described in Embodiment 2, and a diagram showing the structure of a car 130 as an example of a mobile body.

[0072] The car 130 is equipped with sensor module 100.

[0073] The sensor module 100 detects the posture of the vehicle body 131 and sends the detection data to the vehicle posture control device 132. The detection data includes angular velocity signals and acceleration signals.

[0074] When the vehicle body posture control device 132 receives the detection data from the sensor module 100, it detects the posture of the vehicle body 131 based on the signal and controls the stiffness of the suspension or the brakes of each wheel 133 according to the detection results.

[0075] In addition, the detection data of sensor module 100 can also be effectively used in keyless entry systems, anti-theft systems, car navigation systems, car air conditioning, anti-lock braking systems (ABS), airbags, TPMS (Tire Pressure Monitoring System), engine controllers, control equipment for inertial navigation in autonomous driving, and ECUs (Electronic Control Units) such as battery monitors for hybrid or electric vehicles.

[0076] The sensor module 100 can also be mounted on other mobile bodies besides the vehicle 130. Other mobile bodies include bipedal walking robots, trams, radio-controlled aircraft, radio-controlled helicopters, drones, agricultural machinery, and construction machinery. Mobile bodies equipped with the sensor module 100 can effectively utilize the detection data from the sensor module 100 for posture control or position measurement, etc.

[0077] Thus, in this embodiment, the sensor module 100 is mounted on a moving body such as a car 130. Therefore, according to this embodiment, the reliability of the moving body equipped with the sensor module 100 can be improved.

[0078] The preferred embodiments have been described above, but the present invention is not limited to the embodiments described above. The structure of each part of the present invention can be replaced with any structure that performs the same function as the embodiments described above, and any structure can be added.

Claims

1. A sensor module comprising: A sensor substrate on which a sensor is mounted; A base having a first surface facing the fixed surface and a second surface opposite to the first surface, wherein the sensor substrate is mounted on the second surface; and A flexible substrate, the first end of which is connected to the sensor substrate, and the second end which is disposed on the first surface side.

2. The sensor module according to claim 1, wherein, The sensor module includes an elastic member disposed between the first surface of the base and the fixed surface, having an opening that overlaps with the second end of the flexible substrate when viewed from above.

3. The sensor module according to claim 1, wherein, The sensor module includes: A housing having a through hole and a receiving portion for accommodating the sensor substrate, the base, and the flexible substrate; and A fixing component, disposed in the through hole, fixes the housing to the fixing surface.

4. The sensor module according to claim 3, wherein, The sensor module includes an elastic member disposed between the housing and the fixed surface, having an opening that overlaps with the second end of the flexible substrate when viewed from above.

5. The sensor module according to claim 4, wherein, The fixed surface has a connecting member that overlaps with the opening when viewed from above. The second end of the flexible substrate is connected to the connecting component.

6. The sensor module according to claim 1, wherein, The sensor module has a rigid-flexible substrate, which has a rigid portion including the sensor substrate and a flexible portion including the flexible substrate.

7. The sensor module according to claim 1, wherein, The base has an abutting portion that abuts against the first end and the second end of the flexible substrate. The flexible substrate is fixed to the abutment portion.

8. An electronic device comprising a sensor module as described in any one of claims 1 to 7.

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