An oxygen sensor chip testing device

Abstract

The application discloses an oxygen sensor chip testing device and relates to the field of oxygen sensor detection.The device comprises a high-temperature testing furnace, a first through hole and a second through hole arranged in the high-temperature testing furnace, and a first sealing block embedded in the second through hole and a temperature-resistant rod embedded in the first through hole, wherein one end of the temperature-resistant rod extending into the heating chamber of the high-temperature testing furnace is provided with a limiting part for loading the oxygen sensor chip.In the application, when the oxygen sensor ceramic chip in the limiting part is heated, the oxygen sensor ceramic chip can be heated in a rotating state, so that the uniformity of the heating of the upper and lower end faces of the oxygen sensor ceramic chip is ensured, and the effectiveness of the high-temperature detection is ensured.Meanwhile, under the action of a moving unit, the oxygen sensor ceramic chip heated for a certain period of time can be quickly moved out of the high-temperature testing furnace, and the oxygen sensor ceramic chip can be cooled and observed.

Description

Technical Field

[0001] This invention relates to the field of oxygen sensor detection, specifically to an oxygen sensor chip testing device. Background Technology

[0002] Oxygen sensor chips are typically surface-mount zirconia ceramic chips. The operating temperature range of these chips is 300–900℃. However, when the vehicle is turned off, the chip is exposed to ambient temperature, resulting in a significant temperature difference. To ensure proper functioning of the oxygen sensor, the chip undergoes high-temperature testing during installation. This process guarantees the chip's performance. After high-temperature treatment, the chip is then placed under ambient temperature to observe for any potential damage.

[0003] When heating ceramic chips in an atmosphere furnace used for high-temperature testing, the ceramic chips are placed on an alumina ceramic substrate or a corundum support substrate. The bottom of the ceramic chip is in contact with the object for conductive heating, while the top surface is not in contact with the object for radiative heating. During the heating process, the ceramic chip is not heated evenly, and a temperature difference will occur between the top and bottom surfaces of the ceramic chip during testing. When the temperature difference reaches 20-50°C, it will cause physical damage to the chip, resulting in distorted test results. Summary of the Invention

[0004] The purpose of this invention is to provide an oxygen sensor chip testing device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an oxygen sensor chip testing device, comprising: a high-temperature testing furnace and a first through hole and a second through hole opened inside the high-temperature testing furnace, the first through hole and the second through hole being distributed oppositely, a first sealing block being installed inside the second through hole, and a heat-resistant rod being installed inside the first through hole, a limiting component being provided at one end of the heat-resistant rod extending into the heating chamber of the high-temperature testing furnace, the limiting component being used to load the oxygen sensor chip, and a rotating component being provided at the other end of the heat-resistant rod, the rotating component being used to drive the limiting component to rotate and heat the oxygen sensor chip in the heating chamber of the high-temperature testing furnace; It also includes: a moving unit for removing the heated oxygen sensor chip out of the heating chamber of the high-temperature test furnace, the moving unit being disposed outside the high-temperature test furnace; The rotating component includes a connecting plate rotatably sleeved on the end of the heat-resistant rod away from the limiting component, and a motor is fixedly installed on the outer wall of the connecting plate. An extension shaft is fixedly installed coaxially on the end of the heat-resistant rod located outside the high-temperature testing furnace. Sprockets are fixedly sleeved on the output end of the motor and the outer surface of the extension shaft, and a transmission chain is provided between the two sprockets.

[0006] Preferably, the limiting component includes an upper limiting block and a lower limiting block distributed vertically. The upper limiting block and the lower limiting block are respectively fixedly mounted with a movable support plate and a fixed support plate by fixing bolts. A second sealing block is fixedly mounted at the end of the heat-resistant rod away from the extension shaft. The movable support plate and the second sealing block are hinged together, and the fixed support plate and the second sealing block are fixedly mounted together. The upper end face of the lower limiting block is provided with a receiving groove for placing an oxygen sensor. An opening and closing assembly is provided between the movable support plate and the fixed support plate.

[0007] Preferably, the opening and closing assembly includes a slide rod slidably embedded inside the heat-resistant rod body, the slide rod and the heat-resistant rod body being coaxially arranged, a pin being provided between the movable support plate and the fixed support plate, and a first hinge plate being hinged to both the pin and the fixed support plate, a second hinge plate being hinged to the end of the slide rod near the lower limit block and the pin, and a driving component being provided between the slide rod and the heat-resistant rod body.

[0008] Preferably, the driving component includes two mating discs and an arc-shaped plate fixed between the two mating discs, and the two arc-shaped plates are circumferentially equidistant. The interior of the heat-resistant rod body has a partition space, and the two mating discs are located in the partition space. The ends of the two mating discs away from the arc-shaped plates are fixed to the heat-resistant rod body. The sliding rod slides through the mating discs. The inner walls of the two arc-shaped plates have internal threaded grooves. An external threaded sleeve is threaded between the two arc-shaped plates through the internal threaded grooves. The end of the sliding rod away from the lower limit block is rotatably mounted inside the external threaded sleeve. A column is fixedly provided on one end face of the external threaded sleeve, and the outer surface of the column has a plurality of radially arranged limiting holes.

[0009] Preferably, the partition space is located outside the high-temperature testing furnace, and the outer surface of the heat-resistant rod is provided with a plurality of heat dissipation holes for heat dissipation. The heat dissipation holes are also located outside the high-temperature testing furnace, and the heat dissipation holes are located on the side of the partition space closer to the high-temperature testing furnace.

[0010] Preferably, both the upper limit block and the lower limit block are made of corundum material, and the upper limit block and the lower limit block are provided with a number of ventilation holes inside.

[0011] Preferably, the heat-resistant rod, the movable support plate, the fixed support plate, the fixing bolt, and the driving component are all made of nickel-iron-chromium alloy.

[0012] Preferably, the moving unit includes a telescopic component fixed to the top of the high-temperature testing furnace, and a curved rod is fixedly provided at the output end of the telescopic component. The curved end of the curved rod is fixed to the first sealing block, and the other end is fixedly assembled to the connecting plate. The telescopic component is an electric push rod or a cylinder push rod. The outer diameter of the second sealing block is the same as the outer diameter of the first sealing block. The upper limit block and the lower limit block can pass through the second through hole.

[0013] Preferably, a rotating cylinder is rotatably sleeved on the outer surface of the crank rod, and the rotating cylinder is located at the top of the high-temperature testing furnace. A water box is fixedly sleeved on the outer surface of one end of the rotating cylinder. One end of the water box is open and the other end is closed. A drip pipe is connected to the closed end face of the water box. An oblique arc groove with an arc of ° is opened on the surface of the rotating cylinder, and straight grooves are opened at both ends of the oblique arc groove. A limiting post is fixedly installed on the upper end face of the high-temperature testing furnace, which is slidably assembled with the oblique arc groove and the straight groove.

[0014] Preferably, when the first sealing block is assembled with the second through hole, the drip pipe faces upward; when the first sealing block and the second through hole are separated, the drip pipe faces downward.

[0015] Compared with the prior art, the beneficial effects of the present invention are: In this invention, the rotating component allows the oxygen sensor ceramic chip inside the limiting component to be heated in a rotating state, thereby ensuring the uniformity of heating on the upper and lower surfaces of the oxygen sensor ceramic chip and ensuring the effectiveness of high-temperature detection. At the same time, under the action of the moving unit, the oxygen sensor ceramic chip that has been heated for a certain period of time can be quickly removed from the inside of the high-temperature test furnace for cooling and observation. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the heat-resistant rod body and the first sealing block structure of the present invention; Figure 3 This is a schematic diagram of the sprocket and transmission chain structure of the present invention; Figure 4 This is a schematic diagram of the arc-shaped plate structure of the present invention; Figure 5 This is a schematic diagram of the limiting hole structure of the present invention; Figure 6 This is a schematic diagram of the upper limit block and lower limit block structure of the present invention; Figure 7 This is a schematic diagram of the oblique arc groove and straight groove structure of the present invention.

[0017] In the diagram: 1. High-temperature testing furnace; 2. Telescopic component; 3. Curved rod; 4. Connecting plate; 5. Temperature-resistant rod body; 6. Motor; 7. First through hole; 8. Second through hole; 9. First sealing block; 10. Second sealing block; 11. Upper limit block; 12. Lower limit block; 13. Movable support plate; 14. Fixed support plate; 15. Fixing bolt; 16. Arc plate; 17. External threaded sleeve; 18. Column; 19. Limiting hole; 20. Sliding rod; 21. Heat dissipation hole; 22. Connecting plate; 23. Pin shaft; 24. First hinge plate; 25. Second hinge plate; 26. Receiving groove; 27. Rotary cylinder; 28. Inclined arc groove; 29. ​​Straight groove; 30. Water box; 31. Drip pipe; 32. Extension shaft; 33. Sprocket; 34. Transmission chain. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Example 1: Please refer to Figures 1-7 The diagram shows an oxygen sensor chip testing device, including: a high-temperature testing furnace 1 and a first through hole 7 and a second through hole 8 opened inside the high-temperature testing furnace 1. The first through hole 7 and the second through hole 8 are distributed opposite to each other. A first sealing block 9 is installed inside the second through hole 8, and a heat-resistant rod 5 is installed inside the first through hole 7. A limiting component is provided at one end of the heat-resistant rod 5 that extends into the heating chamber of the high-temperature testing furnace 1. The limiting component is used to load the oxygen sensor chip. A rotating component is provided at the other end of the heat-resistant rod 5. The rotating component is used to drive the limiting component to rotate and heat the oxygen sensor chip in the heating chamber of the high-temperature testing furnace 1. It also includes: a moving unit for removing the heated oxygen sensor chip out of the heating chamber of the high-temperature test furnace 1, the moving unit being located outside the high-temperature test furnace 1; The rotating component includes a connecting plate 4 that is rotatably sleeved on the end of the heat-resistant rod 5 away from the limiting component, and a motor 6 is fixedly installed on the outer wall of the connecting plate 4. An extension shaft 32 is fixedly installed on the coaxial axis at the end of the heat-resistant rod 5 located outside the high-temperature test furnace 1. A sprocket 33 is fixedly sleeved on both the output end of the motor 6 and the outer surface of the extension shaft 32, and a transmission chain 34 is provided between the two sprockets 33.

[0020] The limiting components include an upper limit block 11 and a lower limit block 12 distributed vertically. The upper limit block 11 and the lower limit block 12 are respectively fixedly mounted with a movable support plate 13 and a fixed support plate 14 by fixing bolts 15. A second closing block 10 is fixedly mounted at the end of the heat-resistant rod body 5 away from the extension shaft 32. The movable support plate 13 and the second closing block 10 are hinged together, and the fixed support plate 14 and the second closing block 10 are fixedly mounted together. The upper end face of the lower limit block 12 is provided with a receiving groove 26 for placing an oxygen sensor. An opening and closing assembly is provided between the movable support plate 13 and the fixed support plate 14. By operating the opening and closing assembly, the closed state and the open state of the upper limit block 11 and the lower limit block 12 can be adjusted.

[0021] The opening and closing assembly includes a slide rod 20 slidably embedded inside the heat-resistant rod body 5. The slide rod 20 and the heat-resistant rod body 5 are coaxially arranged. A pin 23 is provided between the movable support plate 13 and the fixed support plate 14, and a first hinge plate 24 is hinged to both the pin 23 and the fixed support plate 14. A second hinge plate 25 is hinged between the end of the slide rod 20 near the lower limit block 12 and the pin 23. A driving component is also provided between the slide rod 20 and the heat-resistant rod body 5. The driving component allows the slide rod 20 to move axially inside the heat-resistant rod body 5. During the movement, the end of the slide rod 20 can push or pull the two first hinge plates 24 through the second hinge plate 25 and the pin 23, thereby allowing the upper limit block 11 and the lower limit block 12 to open or close.

[0022] The driving component includes two mating discs 22 and an arc-shaped plate 16 fixed between the two mating discs 22. The two arc-shaped plates 16 are equidistant from each other on the circumference. A partition space is provided inside the heat-resistant rod body 5. The two mating discs 22 are located in the partition space, and the ends of the two mating discs 22 away from the arc-shaped plate 16 are fixed to the heat-resistant rod body 5. The heat-resistant rod body 5, the mating discs 22, and the arc-shaped plate 16 are fixed together by bolts. The sliding rod 20 slides through the mating discs 22. The inner walls of the two arc-shaped plates 16 are provided with internal threaded grooves. An external threaded sleeve 17 is threaded through an internal threaded groove. The end of the slide rod 20 away from the lower limit block 12 is rotatably fitted inside the external threaded sleeve 17. A column 18 is fixedly installed on one end face of the external threaded sleeve 17, and several radially arranged limit holes 19 are opened on the outer surface of the column 18. By inserting a wrench into the limit holes 19, the column 18 and the external threaded sleeve 17 can be rotated. During the rotation, the external threaded sleeve 17 is threadedly fitted with the arc plate 16, allowing the slide rod 20 to slide inside the heat-resistant rod body 5.

[0023] Both the upper limit block 11 and the lower limit block 12 are made of corundum, and several vent holes are provided inside the upper limit block 11 and the lower limit block 12. The thickness difference between the receiving groove 26 and the thickness of the oxygen sensor ceramic chip is less than 1mm. The upper limit block 11 and the lower limit block 12 can be disassembled and replaced by fixing bolts 15. The design of the vent holes makes it easier to heat the oxygen sensor ceramic chip inside the lower limit block 12.

[0024] The heat-resistant rod 5, movable support plate 13, fixed support plate 14, fixing bolt 15 and driving component are all made of nickel-iron-chromium alloy. Incoloy 800HT material has good heat resistance and can ensure the structural performance of the workpiece when it is heated inside the high-temperature test furnace 1.

[0025] The moving unit includes a telescopic component 2 fixed to the top of the high-temperature testing furnace 1, and a curved rod 3 is fixedly provided at the output end of the telescopic component 2. The curved end of the curved rod 3 is fixed to the first sealing block 9, and the other end is fixedly assembled to the connecting plate 4. The telescopic component 2 is an electric push rod or a cylinder push rod. That is, by driving the curved rod 3 through the telescopic component 2, the heat-resistant rod 5 can be inserted into the interior of the high-temperature testing furnace 1, and the first sealing block 9 can be moved out from the interior of the second through hole 8. This allows the upper limit block 11 and the lower limit block 12 to be moved to the exterior of the high-temperature testing furnace 1 through the second through hole 8. The outer diameter of the second sealing block 10 is the same as the outer diameter of the first sealing block 9. The upper limit block 11 and the lower limit block 12 can pass through the second through hole 8, which facilitates the removal of the oxygen sensor ceramic chip inside the upper limit block 11 and the lower limit block 12 from the interior of the high-temperature testing furnace 1 for cooling and detection.

[0026] Example 2: Please refer to Figure 4 This embodiment is a further explanation of the above embodiment. The partition space is located outside the high-temperature testing furnace 1. The outer surface of the heat-resistant rod 5 is provided with a number of heat dissipation holes 21 for heat dissipation. The heat dissipation holes 21 are also located outside the high-temperature testing furnace 1, and the heat dissipation holes 21 are located on the side of the partition space close to the high-temperature testing furnace 1. When the end of the heat-resistant rod 5 that extends into the high-temperature testing furnace 1 is heated, the heat will be conducted to the outside. Through the heat dissipation effect of the heat dissipation holes 21, the temperature of the part of the heat-resistant rod 5 located outside the high-temperature testing furnace 1 can be prevented from being too high.

[0027] Example 3: Please refer to Figure 7This embodiment is a further explanation of Embodiment 1. A rotating cylinder 27 is rotatably sleeved on the outer surface of the crank 3, and the rotating cylinder 27 is located on top of the high-temperature testing furnace 1. A water box 30 is fixedly sleeved on the outer surface of one end of the rotating cylinder 27. One end of the water box 30 is open, and the other end is closed. A drip pipe 31 is connected to the closed end face of the water box 30. A 180° inclined arc groove 28 is formed on the surface of the rotating cylinder 27, and straight grooves 2 are connected to both ends of the inclined arc groove 28. 9. A limiting post is fixedly provided on the upper end face of the high temperature test furnace 1, which is slidably assembled with the inclined arc groove 28 and the straight groove 29. When the crank rod 3 drives the upper limit block 11 and the lower limit block 12 to fully extend out of the interior of the high temperature test furnace 1, the engagement of the limiting post with the inclined arc groove 28 allows the rotating drum 27 to rotate 180° on the surface of the crank rod 3 with the water box 30. By changing the orientation of the water box 30 and the drip pipe 31, the end of the drip pipe 31 away from the water box 30 can be located directly above the receiving groove 26.

[0028] When the first sealing block 9 is assembled with the second through hole 8, the drip pipe 31 faces upward; when the first sealing block 9 is separated from the second through hole 8, the drip pipe 31 faces downward. Through the cooperation of the water box 30 and the drip pipe 31, the heated oxygen sensor ceramic chip can be subjected to a drip cooling test, which can further test the performance of the ceramic chip.

[0029] Working principle: (Reference) Figure 1 and Figure 3 The upper limit block 11 and lower limit block 12 are in their initial positions. At this time, by inserting the end of the wrench into the limiting hole 19, the external threaded sleeve 17 can be rotated, allowing the external threaded sleeve 17 to push the slide rod 20 to move, thus unfolding the movable support plate 13 and the fixed support plate 14. At this time, the operator can place the oxygen sensor ceramic chip that needs to be tested at high temperature into the receiving groove 26. Then, by rotating the external threaded sleeve 17 in the opposite direction, the ceramic chip can be confined between the upper limit block 11 and the lower limit block 12. Driven by the motor 6, and with the cooperation of the sprocket 33 and the transmission chain 34, the heat-resistant rod 5 can rotate inside the high-temperature testing furnace 1, causing the upper limit block 11 and the lower limit block 12 to rotate with the ceramic chip. After closing the furnace door of the high-temperature testing furnace 1, high-temperature testing is performed. The ceramic chip in the rotating state can be heated evenly, avoiding distortion of the detection structure due to excessive temperature difference between the upper and lower end faces of the ceramic chip.

[0030] After the high-temperature test is completed within a unit time, the ceramic chip needs to be quickly transferred out of the high-temperature test furnace 1 for cooling test to observe whether cracks appear on the surface of the ceramic chip. After the high-temperature test furnace 1 is turned off, the staff drives the crank rod 3 through the telescopic component 2, so that the crank rod 3 moves laterally along with the heat-resistant rod 5 and the first sealing block 9. The first sealing block 9 will separate from the second through hole 8, and the second sealing block 10 at the end of the heat-resistant rod 5 will re-seal the second through hole 8, preventing the hot air flow in the high-temperature test furnace 1 from spreading directly towards the upper limit block 11 and the lower limit block 12, which would affect the cooling efficiency of the ceramic chip. In this solution, the projected area of ​​the upper limit block 11 and the lower limit block 12 after unfolding is smaller than the minimum end face area of ​​the second through hole 8. In this case, the heated upper limit block 11 and the lower limit block 12 can be unfolded inside the high-temperature test furnace 1 and then moved out from inside the second through hole 8, which is more convenient for subsequent testing.

[0031] It should be noted that when performing water-drop cooling tests on special ceramic chips, the water-drop cooling test can verify the high-temperature rapid cooling of the ceramic chips. When the crank 3 is moved laterally, the limiting post and the inclined arc groove 28 and straight groove 29 can make the rotating drum 27 carry the water box 30 to flip. After flipping, test water can be added into the water box 30. The test water will continuously drip onto the surface of the ceramic chip through the drip pipe 31 to perform high-performance high-temperature rapid cooling test.

[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0033] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An oxygen sensor chip testing device, characterized in that, include: A high-temperature testing furnace (1) and a first through hole (7) and a second through hole (8) are opened inside the high-temperature testing furnace (1). A first sealing block (9) is installed inside the second through hole (8), and a heat-resistant rod (5) is installed inside the first through hole (7). A limiting component is provided at one end of the heat-resistant rod (5) that extends into the heating chamber of the high-temperature testing furnace (1). The limiting component is used to load an oxygen sensor chip. A rotating component is provided at the other end of the heat-resistant rod (5). The rotating component is used to drive the limiting component to rotate and heat the oxygen sensor chip in the heating chamber of the high-temperature testing furnace (1). Also includes: A moving unit is used to move the heated oxygen sensor chip out of the heating chamber of the high-temperature test furnace (1), and the moving unit is disposed outside the high-temperature test furnace (1); The rotating component includes a connecting plate (4) rotatably sleeved on the end of the heat-resistant rod (5) away from the limiting component, and a motor (6) is fixedly installed on the outer wall of the connecting plate (4). An extension shaft (32) is fixedly installed on the coaxial axis of the end of the heat-resistant rod (5) located outside the high-temperature test furnace (1). A sprocket (33) is fixedly sleeved on the output end of the motor (6) and the outer surface of the extension shaft (32), and a transmission chain (34) is provided between the two sprockets (33).

2. The oxygen sensor chip testing device according to claim 1, characterized in that: The limiting component includes an upper limiting block (11) and a lower limiting block (12) distributed vertically. The upper limiting block (11) and the lower limiting block (12) are respectively fixedly provided with a movable support plate (13) and a fixed support plate (14) by fixing bolts (15). A second sealing block (10) is fixedly provided at one end of the heat-resistant rod body (5) away from the extension shaft (32). The movable support plate (13) and the second sealing block (10) are hinged together, and the fixed support plate (14) and the second sealing block (10) are fixedly assembled. The upper end face of the lower limiting block (12) is provided with a receiving groove (26) for placing an oxygen sensor. An opening and closing assembly is provided between the movable support plate (13) and the fixed support plate (14).

3. The oxygen sensor chip testing device according to claim 2, characterized in that: The opening and closing assembly includes a slide rod (20) that is slidably embedded inside the heat-resistant rod body (5). A pin (23) is provided between the movable support plate (13) and the fixed support plate (14), and a first hinge plate (24) is hinged to both the pin (23). A second hinge plate (25) is hinged between the end of the slide rod (20) near the lower limit block (12) and the pin (23). A driving component is also provided between the slide rod (20) and the heat-resistant rod body (5).

4. The oxygen sensor chip testing device according to claim 3, characterized in that: The driving component includes two docking discs (22) and an arc plate (16) fixed between the two docking discs (22). The two arc plates (16) are circumferentially distributed. The interior of the heat-resistant rod body (5) is provided with a partition space. The two docking discs (22) are located in the partition space. The ends of the two docking discs (22) away from the arc plate (16) are fixed to the heat-resistant rod body (5). The sliding rod (20) slides through the docking discs (22). The inner walls of the two arc plates (16) are provided with internal thread grooves. An external threaded sleeve (17) is threaded between the two arc plates (16). The end of the sliding rod (20) away from the lower limit block (12) is rotatably assembled inside the external threaded sleeve (17). A column (18) is fixedly provided on one end face of the external threaded sleeve (17). The outer surface of the column (18) is provided with a plurality of radially arranged limiting holes (19).

5. The oxygen sensor chip testing device according to claim 4, characterized in that: The partition space is located outside the high temperature test furnace (1). The outer surface of the heat-resistant rod (5) is provided with a number of heat dissipation holes (21) that serve to dissipate heat. The heat dissipation holes (21) are also located outside the high temperature test furnace (1), and the heat dissipation holes (21) are located on the side of the partition space close to the high temperature test furnace (1).

6. The oxygen sensor chip testing device according to claim 5, characterized in that: Both the upper limit block (11) and the lower limit block (12) are made of corundum, and the upper limit block (11) and the lower limit block (12) have several ventilation holes inside.

7. The oxygen sensor chip testing device according to claim 4, characterized in that: The heat-resistant rod (5), the movable support plate (13), the fixed support plate (14), the fixed bolt (15), and the driving component are all made of nickel-iron-chromium alloy.

8. The oxygen sensor chip testing device according to claim 2, characterized in that: The moving unit includes a telescopic component (2) fixed to the top of the high-temperature test furnace (1), and a curved rod (3) is fixedly provided at the output end of the telescopic component (2). The curved end of the curved rod (3) is fixed to the first sealing block (9), and the other end is fixedly assembled to the connecting plate (4). The telescopic component (2) is an electric push rod or a cylinder push rod. The outer diameter of the second sealing block (10) is consistent with the outer diameter of the first sealing block (9). The upper limit block (11) and the lower limit block (12) can pass through the second through hole (8).

9. The oxygen sensor chip testing device according to claim 8, characterized in that: The outer surface of the crank (3) is rotatably fitted with a rotating cylinder (27), and the rotating cylinder (27) is located at the top of the high temperature test furnace (1). A water box (30) is fixedly fitted on the outer surface of one end of the rotating cylinder (27). One end of the water box (30) is open and the other end is closed. A drip pipe (31) is connected to the closed end face of the water box (30). A 180° arc groove (28) is opened on the surface of the rotating cylinder (27), and straight grooves (29) are opened at both ends of the arc groove (28). A limiting post is fixedly installed on the upper end face of the high temperature test furnace (1) and slides with the arc groove (28) and the straight groove (29).

10. The oxygen sensor chip testing device according to claim 9, characterized in that: When the first sealing block (9) is assembled with the second through hole (8), the drip pipe (31) faces upward; when the first sealing block (9) and the second through hole (8) are separated, the drip pipe (31) faces downward.

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