Flexible rewiring structure assembly, electronic skin, and preparation method

Abstract

The application discloses a flexible rewiring structure assembly, an electronic skin and a preparation method, and relates to the technical field of flexible electronics and fabric sensing. In order to solve the problems of large occupied area of the edge pin of the existing flexible sensing array, poor flexibility and tensile resistance, difficult peripheral circuit connection, and being not conducive to large-area electronic skin coverage and modular packaging, the flexible rewiring structure assembly of the application is attached to the surface of the flexible sensing array, and includes a flexible insulating base material and a conductive circuit adopting a tensile-resistant flexible wiring structure. The array electrode is connected through a windowing structure, the row / columnelectrode is converged to an output position area, and a standardized interface connection can be realized by matching a clamping terminal. The application realizes fabric-based flexible rewiring, greatly reduces the pin area, maintains flexibility and tensile resistance, supports standardized packaging and large-area electronic skin modular expansion, and improves connection reliability and manufacturability.

Description

Technical Field

[0001] This application relates to the fields of flexible electronics and fabric sensing technology, specifically to a flexible redistribution layer (T-RDL) structural component for flexible sensing arrays, electronic skin, and a method for manufacturing the same. Background Technology

[0002] With the deep integration of flexible electronics technology and textile processing technology, fabric-based pressure sensors, with their unique advantages of being soft and breathable, skin-friendly, and seamlessly integrated with conventional textiles, have gradually become a research hotspot in the field of flexible tactile sensing, demonstrating great application value in rehabilitation medicine, intelligent robots, wearable devices, and other fields. Currently, mainstream flexible sensor arrays (such as fabric pressure sensor arrays) generally adopt a crossbar row-column cross electrode architecture: several rows of conductive yarns and columns of conductive yarns are arranged orthogonally on the fabric substrate, and piezoresistive, capacitive, or piezoelectric pressure sensing units are placed at their intersections. The pressure distribution on the array can be detected by row and column scanning addressing.

[0003] In practical industrial applications, the scale of fabric pressure sensing arrays continues to expand to improve the spatial resolution and coverage of pressure detection. Since the number of electrode leads in a crossbar architecture is positively correlated with the array's side length, the number of externally led-out electrode pins increases linearly and rapidly as the array size increases: for example, a 16×16 pixel sensing array requires 32 electrode pins, while when the array size increases to 64×64 pixels, the total number of electrode pins can reach 128. This surge in the number of pins directly places higher demands on the electrode lead-out method and the external connection structure.

[0004] like Figure 1A As shown, the traditional method for connecting array electrodes to back-end circuits (such as PCB circuits) involves laying rigid metal traces around the periphery of the sensor array, or adding an external flexible printed circuit board (FPC) / flexible flat cable (FFC) adapter structure. This involves using fan-shaped wiring to gather the dispersed electrodes to a standard spacing before connecting them to the back-end PCB circuit. However, this edge-converging solution still has many technical shortcomings: Firstly, even with pin convergence, a wide edge wiring area still needs to be reserved around the sensing area to form a surrounding non-sensing border. The edge lead-out area occupies too much space, significantly reducing the effective sensing area. For example... Figure 1A For example, in the pressure sensing array area ①, metal traces are laid around the perimeter to bring out the sensor's electrode signals. The edge area formed by the column electrode pins ② and the row electrode pins ③ occupies too large a region. Figure 1BIn the traditional wiring connection scheme, the electrode wiring / wiring area significantly encroaches on the area of ​​the sensing area formed by the pressure sensing array. This wiring method results in low overall array integration, making it difficult to meet the application requirements of scenarios such as robotic electronic skin that require large-area seamless coverage. Secondly, in scenarios requiring large-area tactile coverage, if multiple sensor arrays need to be assembled, the independent edge pin areas of each array will cause spatial interference, making it impossible to achieve seamless splicing of the sensing surface. This significantly reduces the integration of large-area electronic skin and makes it difficult to adapt to the application requirements of full-body tactile sensing in robots.

[0005] Third, the edge wiring itself has poor tensile and bending resistance. Under frequent stretching and pressing scenarios, the edge wiring itself is prone to breakage. The mechanical modulus difference between the rigid metal circuit and the fabric substrate is huge, causing a sudden change in stiffness in the array edge area. Stress concentration is prone to occur at the junction of soft and hard, leading to circuit breakage, plating peeling and reduced contact reliability. Fourth, after the edge wiring converges, it cannot be directly matched with the standard interface to connect the peripheral circuit. During the production and assembly process, it is usually necessary to wire and position and solder each wire individually. The process is cumbersome, the assembly efficiency is low, and it is easy to have poor contact, insufficient flexibility, and easy breakage. In addition, it has the defects of difficult maintenance and low assembly efficiency.

[0006] Fifth, the number, spacing, and arrangement of pins in sensor arrays of different sizes and resolutions vary, there is a lack of unified interface specifications, the modularity of products is low, and the cost of product maintenance, upgrades and iterations is high.

[0007] Sixth, it is difficult to achieve standardized packaging and mass production. Due to the inconsistent pin output forms, different models of sensor arrays require customized design of adapter structures and packaging schemes, making it impossible to form a universal and standardized packaging system, which restricts the mass production and commercial promotion of fabric pressure sensor arrays. Summary of the Invention

[0008] To address the technical problems in existing technologies, such as excessive additional area occupied by pin convergence encroaching on the effective sensing area, spatial interference in scenarios with large-area tactile coverage, poor tensile and bending resistance of edge wiring, and inability to directly match standard interfaces for high-density connection of peripheral circuits after edge wiring convergence, this application provides a flexible rewiring structure component: The flexible rewiring structure assembly is attached to one or both sides of the sensing area of ​​the flexible sensing array, including a flexible insulating substrate and conductive lines. The flexible insulating substrate is used to achieve electrical isolation between the conductive lines and the electrodes of the flexible sensing array in non-connection areas and to fix the conductive lines. The conductive lines adopt a tensile-resistant flexible wiring structure to flexibly converge the row and column electrodes of the flexible sensing array to the output position area, and achieve electrical connection with the electrodes of the flexible sensing array through a window structure in the connection area. Finally, signal transmission is completed with the peripheral circuit through an interface in the output position area.

[0009] The technical solutions provided in the embodiments of this specification have the following beneficial effects: 1. This application is the first to apply the concept of flexible redistribution to flexible sensor arrays, especially fabric pressure sensor arrays. It achieves spatial redistribution of fabric electrodes through flexible redistribution structure components, breaking through the limitations of traditional architectures that directly lead out the electrodes from the edge.

[0010] 2. It can significantly reduce the size of the pin area, flexibly shrinking the originally large-pitch electrodes scattered around the array into a narrow-pitch standardized output interface, effectively increasing the effective sensing area ratio; at the same time, it supports seamless splicing of multiple arrays, greatly improving the array expansion capability and adapting to large-area tactile coverage scenarios such as robot electronic skin.

[0011] 3. The flexible rewiring structure component adopts a tensile-resistant flexible wiring structure, combined with a flexible insulating substrate, which enables the conductive lines to have excellent deformation resistance under lateral, longitudinal and bending conditions. It effectively solves the problems of easy breakage and poor contact of traditional rigid wiring lines and contacts, and maintains the overall flexibility and fit of the array.

[0012] 4. The output interface adopts a standardized design, which can achieve quick and reliable docking with the peripheral circuit through the clamping terminal components, without the need for soldering each component individually, effectively improving the system's manufacturability and assembly efficiency; at the same time, the interface specifications are unified, supporting modular packaging and rapid iterative maintenance, reducing the cost of large-scale production and application.

[0013] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this specification. Attached Figure Description

[0014] Figure 1A A schematic diagram of the planar structure for a traditional edge metal trace routing scheme; Figure 1B This is a diagram comparing the area ratio of traditional edge cabling solutions. Figure 2A This is a schematic diagram of the planar structure of a flexible rewiring structure component provided in an embodiment of this application; Figure 2BThis is a partially enlarged schematic diagram of a tensile-resistant flexible wiring structure provided in an embodiment of this application; Figure 3A This is a front view of the flexible rewiring structure component and the fabric pressure sensor array attached and connected in one embodiment of this application. Figure 3B This is a schematic diagram of the back structure of the flexible rewiring structure component and the fabric pressure sensor array attached and connected in one embodiment of this application. Figure 4 This is a schematic diagram of the structure in which the conductive yarn and the fabric pressure sensing array electrode are connected by ultrasonic welding in one embodiment of this application. Figure 5A A schematic diagram of the layered three-dimensional structure of an electronic skin provided in an embodiment of this application; Figure 5B This is a schematic diagram illustrating the sensing principle of a fabric pressure sensing array in one embodiment of this application. Figure 6A This is a schematic diagram of the overall assembly structure of the terminal clamping component in one embodiment of this application; Figure 6B This is a three-dimensional structural diagram of the clamping terminal component in one embodiment of this application; Figure 6C This is a partial cross-sectional structural diagram of the terminal clamping component in one embodiment of this application; Figure 7A This is a schematic diagram of the overall structure of the robot electronic skin using a flexible rewiring structure component in one embodiment of this application; Figure 7B This is a schematic diagram of the layered structure and conductive circuit topology of the robot electronic skin in one embodiment of this application. Detailed Implementation

[0015] The present application is further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the application. Furthermore, it should be understood that after reading the teachings of this application, those skilled in the art can make various alterations or modifications to this application, and these equivalent forms also fall within the scope defined by the appended claims.

[0016] The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this specification. The singular forms “a,” “the,” and “the” used in this specification are also intended to include the plural forms unless the context clearly indicates otherwise. This specification may use terms such as “first,” “second,” “third,” etc., to describe various information or structural modules for the purpose of more clearly describing the scheme, and should not be construed as indicating or implying relative importance or implicitly specifying the number, order, or position of the indicated technical features. Thus, a feature defined with “first,” “second,” “third,” etc., may explicitly or implicitly include one or more of that feature. In the description of this specification, unless otherwise stated, “multiple” means two or more; “if” can be interpreted as “when,” “when,” or “in response to a determination.” In this specification, “and / or” is used to describe the relationship between related objects, indicating that three relationships may exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural.

[0017] In this specification, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Furthermore, the term "coupled connection" can be a direct electrical connection or an indirect electrical connection through an intermediate medium. The term "contact" can be direct contact or indirect contact through an intermediate medium.

[0018] Figure 2A This is a planar schematic diagram of a flexible rewiring structure component provided in an embodiment of this application.

[0019] like Figure 2A As shown in the example, the flexible rewiring structure component in this embodiment has an overall L-shaped topology. The input end has a wide, evenly spaced electrode spacing corresponding to the flexible sensing array, while the output end has a narrow, standard spacing arrangement. The electrode spacing is reduced through the flexible wiring structure. This structure can be directly attached to the sensing area surface of the flexible sensing array without occupying additional border space around the array, fundamentally solving the problem of traditional edge wiring encroaching on the effective sensing area. At the same time, the entire wiring is made of flexible material, matching the mechanical properties of the sensing array, and avoiding stress concentration problems at the soft-hard interface.

[0020] The flexible redistribution structure component in this embodiment includes at least: a flexible insulating substrate and conductive lines; The flexible insulating substrate is used to isolate the conductive lines from the flexible sensing array electrodes in non-connection areas, and to fix the conductive lines; the non-connection areas refer to the areas outside the connection areas between the conductive lines and the flexible sensing array electrodes. Flexible insulating substrates can be selected from one or more combinations of flexible fabric substrates, thermoplastic polyurethane (TPU), ordinary cross-linked PU film, hot melt adhesive film, etc., depending on the specific application scenario.

[0021] Different types of flexible insulating substrates have different applicable scenarios and characteristics: (1) Flexible fabric substrate: It can be made of the same material as the non-conductive yarn used in the fabric pressure sensing array, and its mechanical properties and tensile resilience are perfectly matched. It has the best fit and breathability. Conductive circuits can be directly prepared on it through embroidery and sewing processes. It is suitable for close-fitting electronic skin and high breathability scenarios. The disadvantage is that its insulation and pressure resistance performance is slightly lower than that of polymer film. High-density circuits need to be treated with an additional insulating coating.

[0022] (2) Thermoplastic polyurethane (TPU) film: It has excellent elasticity and tear resistance, and the elongation can reach more than 500%. It can be glued to the fabric substrate through hot pressing process. It has stable insulation performance and is suitable for high-strength and waterproof encapsulation scenarios, such as robot joint electronic skin and sports wearable sensing devices.

[0023] (3) Ordinary cross-linked PU film: The film is uniform, ultra-thin, and has excellent insulation properties. It is suitable as an insulating substrate for ultra-thin rewiring structures and is often used in small sensor arrays with low deformation and high precision. The disadvantage is that it cannot be hot-pressed and must be bonded with adhesive. Its tensile properties are weaker than those of TPU film.

[0024] (4) Hot melt adhesive film: It has both bonding and insulation functions, and can simultaneously fix conductive lines and attach sensor arrays. It has a simple process, high processing efficiency, and is suitable for standardized module packaging scenarios for mass production.

[0025] The flexible redistribution structure component of this application is adaptable to various types of flexible sensor arrays, including but not limited to textile-based flexible sensor devices such as fabric pressure sensor arrays, fabric capacitance sensor arrays, and fabric piezoelectric sensor arrays. It is also adaptable to flexible transition scenarios for thin-film flexible sensor arrays. When using different types of flexible sensor arrays, a flexible insulating substrate that is compatible with the characteristics of the flexible sensor array can be selected to fabricate the flexible redistribution structure component.

[0026] The conductive lines in the flexible rewiring structure assembly are used to flexibly converge the loosely arranged row / column electrodes of the flexible sensor array to the output position area. In the output position area, electrical signal connection with the peripheral circuit is realized through the interface; in the connection area, connection with the flexible sensor array electrodes is realized through the window structure.

[0027] The flexible convergence method for conductive lines can be selected from the following different topologies depending on the application scenario: (1) Fan-shaped convergence topology: The input ends are arranged in a wide and equal-spaced manner, and the output ends are converged in the same direction to a narrow spacing. It is suitable for rectangular sensor arrays with single-sided lead-out. The structure is simple and the wiring is relatively simple.

[0028] (2) L-shaped convergence topology: The input ends are arranged in the same direction along the electrode direction, and the output ends are turned out. It is suitable for scenarios where the interface needs to be concentrated in the corner of the array, such as the side interface design of the electronic skin of the robot body.

[0029] (3) Tree-shaped convergence topology: Multiple branch lines are aggregated to the main line step by step, which is suitable for the centralized output of large-area partitioned sensor arrays. It can greatly reduce the number of output lines and improve the integration.

[0030] It should be noted that, since the flexible rewiring structure component of this application is stacked on the flexible sensing array and has a wide wiring area, this application does not specifically limit the routing topology and convergence method of conductive lines on the flexible insulating substrate, as long as it can be suitable for the application requirements of different application scenarios.

[0031] like Figure 2A and Figure 2B For example, the conductive circuit consists of multiple conductive yarns evenly arranged in space, and the conductive yarns adopt a tensile-resistant flexible routing structure. The tensile-resistant flexible routing structure can be a combination of one or more routing structures such as serpentine, wavy, zigzag, and straight.

[0032] Different tensile-resistant flexible wiring structures are suitable for different deformation scenarios: (1) Straight wiring: The structure is the simplest and the wiring density is the highest. It is suitable for areas with small deformation or static sensing scenarios, such as fixed seat pressure sensing pads, which can maximize the use of wiring space.

[0033] (2) Snake-shaped wiring: By reserving stretching allowance through continuous bending wiring, it can withstand a certain deformation in both the horizontal and vertical directions. It is the best tensile structure in terms of comprehensive performance and is suitable for conventional wearable electronic skin with moderate deformation.

[0034] (3) Wavy routing: It has better deformation buffering capacity than serpentine routing and longer bending fatigue life. It is suitable for sensor arrays in areas that are frequently bent, such as wrists and elbows.

[0035] (4) Zigzag pattern: low processing difficulty and outstanding transverse tensile strength.

[0036] like Figure 2B As shown, taking serpentine or wavy wiring as an example, when the flexible rewiring structure component is subjected to lateral / longitudinal stretching, the serpentine or wavy yarns gradually flatten with the tension, absorbing the tensile deformation. The actual elongation of the conductive yarn itself is much smaller than the overall structural stretch, thus significantly reducing the deformation stress of the metal plating and preventing plating cracking and circuit breakage. When subjected to longitudinal bending or pressing, the bent wiring structure can release bending stress through deformation, also exhibiting excellent bending resistance. The multi-directional flexible wiring design enables the conductive lines to maintain stable conductivity under lateral, longitudinal, and arbitrary angle bending conditions, comprehensively improving the deformation resistance of the rewiring structure.

[0037] The conductive lines are based on a preset topology path and can be arranged on the surface or in the interlayer of a flexible fabric substrate, and fixed by sewing, embroidery, hot pressing, bonding or ultrasonic welding.

[0038] In one embodiment of this application, the flexible insulating substrate used in the flexible rewiring structure component is a flexible fabric substrate. Conductive lines are formed on the flexible fabric substrate using an embroidery process. Non-conductive threads are used to embroider conductive yarn onto the flexible fabric substrate, thereby fixing the conductive yarn and forming the overall topology of the conductive line.

[0039] In one embodiment of this application, the conductive yarn of the conductive circuit is a metal-based conductive yarn, including but not limited to the conductive yarns of the following material types: Metal-plated conductive yarns: such as silver-plated nylon yarn and silver-plated copper yarn; Metal fiber blend / filament type conductive metal yarn: such as stainless steel conductive yarn; Metal-coated composite conductive yarn: Metal-coated yarn.

[0040] Metal-based conductive yarn has the characteristics of being resistant to damp heat and poor sweat resistance. Metals such as silver and copper are easily oxidized and turn black when exposed to human sweat and moisture, and the plating may peel off. Therefore, in one embodiment of this application, the conductive yarn also includes a waterproof insulating layer.

[0041] Metal-based conductive yarns are characterized by poor durability under large strain. Repeated stretching and bending easily cause the metal coating to crack and peel off, leading to a decrease in conductivity. Therefore, this application designs a flexible, tensile-resistant yarn structure to reduce the deformation of the metal-based conductive yarn under stretching and bending conditions, thereby improving the tensile strength of the conductive circuit. Furthermore, the tensile strength of the conductive circuit can be further improved by adding a flexible insulating coating to the conductive yarn or by adding a flexible insulating coating to the entire conductive circuit.

[0042] Figure 3AThis is a front view of a flexible redistribution structure assembly attached to a fabric pressure sensing array according to an embodiment of this application. In this embodiment, the flexible sensing array is a fabric pressure sensing array made using a knitting process. Conductive silver yarn (the darker part) is used to weave the sensing array electrodes, and non-conductive yarn (the white part, such as nylon, cotton, or linen) is used to weave the non-conductive areas, isolating the array electrodes. The flexible redistribution structure assembly also uses a flexible fabric substrate made of the same non-conductive yarn as the fabric pressure sensing array. Conductive yarn is embroidered onto this flexible fabric substrate using an embroidery process to form conductive lines. The flexible fabric substrate isolates the fabric sensing array from the conductive lines. The flexible redistribution structure assembly is attached to a portion of the surface of one side of the sensing area of ​​the flexible sensing array. The conductive lines adopt an L-shaped topology, and the conductive yarns adopt a flexible, tensile-resistant routing structure (such as a serpentine pattern). The conductive yarns are connected to the array electrodes using ultrasonic welding. The conductive circuit converges the electrodes of the flexible sensing array to the output position area, and outputs the physical signals such as the touch position and pressure magnitude sensed by the fabric pressure sensing array to the peripheral circuit through the output interface of the output position area.

[0043] Figure 3B This is a schematic diagram of the back side of the flexible rewiring structure assembly attached to the fabric pressure sensor array. Figure 3B It can be clearly seen that the flexible rewiring structure component is attached to the fabric pressure sensing array, as well as the welding position of its conductive yarns to the array electrodes. The flexible rewiring structure component can neatly arrange the connection points of the conductive yarns and array electrodes through flexible wiring topology, which is more conducive to the modular assembly and manufacturing of electronic skin, and improves the standardization, modularity and maintainability of electronic skin.

[0044] Figure 4 This is a schematic diagram of the structure in which the conductive yarns of the flexible rewiring structure component are connected to the fabric pressure sensing array electrodes by ultrasonic welding in one embodiment of this application. Figure 4 The example illustrates the connection structure between row or column electrodes on one side of a fabric pressure sensing array and conductive yarns of a flexible redistribution structure component. First, the conductive yarns are aligned with the row / column electrodes in the fabric pressure sensing array. Then, the conductive yarns are connected to the electrodes using an ultrasonic welding and pressing process, achieving both electrical conductivity and mechanical bonding. Localized plastic deformation occurs in the ultrasonic welding and pressing area. To reinforce and protect the connection points, flexible insulating material can be used for encapsulation and reinforcement.

[0045] In addition, when wiring conductive lines, the ends of the conductive yarns are usually designed to run in the same direction as the fabric electrodes. This allows for the design of multiple connection points between the conductive yarns and the corresponding fabric electrodes, thereby achieving a more stable and reliable connection between the conductive yarns and the fabric electrodes.

[0046] The conductive lines in this application can also be connected to the flexible sensing array electrodes in the connection area via a window structure using one or more of the following connection methods in combination: ultrasonic welding connection, conductive adhesive connection, thermoforming connection, sewing or embroidery connection.

[0047] Figure 5A This is a three-dimensional structural diagram of a flexible electronic skin provided in an embodiment of this application. The electronic skin illustrated in the figure includes, from top to bottom: (1) Upper flexible rewire structure component, attached to the upper surface of the upper electrode layer sensing area of ​​the flexible sensing array, used to converge the upper electrodes (such as column electrodes) of the flexible sensing array to the upper output position area through conductive lines. (2) The upper electrode layer of a flexible sensing array (such as a fabric pressure sensing array); (3) Sensitive layer, which is the middle layer of the flexible sensing array (such as piezoresistive yarn or carbon cloth). (4) The lower electrode layer of a flexible sensing array (such as a fabric pressure sensing array); (5) Lower layer flexible rewiring structure assembly; attached to the lower surface of the sensing area of ​​the lower electrode layer of the flexible sensing array, used to converge the lower layer electrodes (such as row electrodes) of the flexible sensing array to the lower layer output position area through conductive lines; The conductive yarns in the upper and lower electrode layers have double-sided conductivity; the side closer to the sensitive layer participates in sensing, while the side farther from the sensitive layer connects to the flexible redistribution structure component. The upper and lower electrode layers of the flexible sensor array are connected to the conductive lines of the upper and lower flexible redistribution structure components, respectively, via ultrasonic welding.

[0048] Figure 5B This is a schematic diagram of the sensing principle of a fabric sensing array. Each intersection of conductive yarns in the upper and lower electrode layers forms a sensing unit. When the conductive yarn at the intersection is pressed, the piezoresistive yarn is squeezed and thinned, resulting in a decrease in resistance between the upper and lower electrodes. The peripheral circuit can detect physical information such as the pressing position and intensity by scanning the row and column electrodes.

[0049] Since the flexible rewiring structure component provided in this application is attached to the upper and lower surfaces of the flexible sensing array, the trace area of ​​the conductive lines is much larger than that of the traditional edge trace method. Therefore, the trace path can be flexibly designed according to the layout of the peripheral circuit, and the upper and lower conductive lines can be converged in the same output position area, thereby improving the overall design flexibility, integration and maintainability of the electronic skin.

[0050] Figure 6AThis is a schematic diagram of the clamping terminal component of the flexible redistribution structure assembly in one embodiment of this application. After the flexible redistribution structure assembly gathers the row / column electrodes of the flexible sensor array to the output position area, it achieves soft-hard switching through the clamping terminal component. The clamping terminal component connects the conductive yarn and the conductive terminal (pin header) in a concentrated, tight and reliable manner. The conductive terminal can be connected to the peripheral circuit through soldering, plugging, or other methods.

[0051] Figure 6B This is a three-dimensional structural diagram of a clamping terminal component provided in an embodiment of the present application. The clamping terminal component includes: a positioning base, a conductive terminal, and a pressing cover plate.

[0052] The positioning base has multiple concave slots for positioning wires. The spacing between the slots corresponds to the spacing between the conductive yarns in the conductive circuit of the flexible redistribution structure component. The conductive yarns are embedded in the slots, and the positioning base is used to position and fix the conductive yarns and conductive terminals. The positioning base can be fixed to the flexible insulating substrate of the flexible redistribution structure component by means of gluing, hook and loop fasteners, riveting, etc.

[0053] The conductive terminals are arranged to correspond to the grooves of the positioning base, and are used to connect the conductive yarn and the external circuit. The press-fit cover plate is used to achieve a stable electrical connection between the conductive yarn and the conductive terminal in the positioning groove of the positioning base through a press-fit method.

[0054] Figure 6C This is a partial cross-sectional view of the terminal clamping component in one embodiment of this application. As shown in the view, the conductive yarn and conductive pins of the flexible rewiring structure are simultaneously embedded in the positioning groove of the positioning base. A protruding structure is provided on the pressing cover plate at the corresponding position of the positioning groove. In the pressing state, the protruding structure is embedded in the positioning groove. The bottom of the positioning groove is wider than its opening (trapezoidal groove). The protruding part of the pressing cover plate is narrow at the root and wide at the top (trapezoidal protrusion) and has a certain degree of elasticity. After applying pressure, the protruding part of the pressing cover plate can be embedded into the positioning groove, thereby tightly pressing the conductive terminal (conductive pin) and the conductive yarn together, achieving a reliable connection between the conductive terminal and the flexible sensing array electrode.

[0055] The clamping terminal component provided in this application enables the soft-hard transition of conductive lines between the flexible rewiring structure component and the peripheral circuit, solving the technical problems of unstable contact and easy breakage in traditional welding, riveting and other connection methods. It can effectively reduce contact resistance fluctuations and improve contact reliability. In addition, the high-density and standardized connection of the clamping terminals can also improve the maintainability and assembly efficiency of the overall component.

[0056] Figure 7A This is a schematic diagram of a robot structure using a flexible rewiring structure component in one embodiment of this application. Figure 7A(a) and (b) are the back and front views of the robot, respectively. The robot's electronic skin uses the flexible rewiring structure component provided in this application. For application scenarios such as robot electronic skin that use a large-area flexible sensor array, the advantages of the flexible rewiring structure component provided in this application can be fully utilized.

[0057] like Figure 7A As shown in Figure (c), the flexible rewiring structure component provided in this application can be used to concentrate the electrodes of the robot's electronic skin flexible sensor array at the opening of the robot's body shell (e.g., the neck or shoulder joint), and then connect them to the acquisition and detection circuit inside the robot body through an electrical connection interface (clamping terminal component).

[0058] Figure 7B This is a schematic diagram of the conductive circuit topology of the layered and flexible redistribution structure component of the robotic electronic skin flexible sensing array in one embodiment of this application. To achieve a high-density, reliable connection with the lateral row electrodes of the upper electrode layer of the flexible sensing array, the flexible redistribution structure component adopts an L-shaped routing topology, forming lateral connection areas at the ends of the conductive yarns to achieve lateral connections with the row electrodes. Simultaneously, to achieve a high-density, reliable connection with the vertical column electrodes of the lower electrode layer of the flexible sensing array, the flexible redistribution structure component adopts a tree-shaped routing topology, forming vertical connection areas at the ends of the conductive yarns to achieve vertical connections with the column electrodes. Both the upper and lower flexible redistribution structure components converge at the same output location area, achieving interface connections with external circuits.

[0059] Figure 7A and Figure 7B The conductive lines of the flexible rewiring structure component can be made of conductive yarn with certain tensile strength. When the deformation of the robot's electronic skin is not large, the conductive lines of the flexible rewiring structure component can be straight. In order to increase tensile and bending resistance, a combination of one or more of the following wiring structures can also be used: serpentine, wavy, zigzag, and straight. For example, in the electronic skin of the joint, the tensile strength of the rewiring conductive lines in the joint can be improved by using serpentine or wavy wiring structures.

[0060] An embodiment of this application also provides a method for manufacturing and using the above-described flexible redistribution structure component, the method comprising: S1. Generate the routing topology pattern of the conductive lines based on the number of row / column electrodes and their mounting locations in the flexible sensing array. This step involves creating the wiring topology pattern of the conductive lines of the flexible rewiring structure component in computer design software based on the number of row / column electrodes and the installation location of the flexible sensor array, for use in the subsequent standardized production of the flexible rewiring structure component.

[0061] S2. Based on the material type of the flexible insulating substrate and the fixing method of the conductive lines, convert the wiring topology pattern into a programmable processing file; This step can convert the routing topology pattern into a program-controlled processing file for processing equipment, based on the material type of the flexible insulating substrate of the flexible rewiring structure component and the method of fixing the conductive lines on the substrate. For example, the routing topology pattern can be converted into a program-controlled processing file for embroidering and fixing conductive yarns on a flexible insulating fabric by an embroidery machine.

[0062] S3. Use a programmable machining file to fabricate conductive lines on a flexible insulating substrate, and fabricate connection areas (e.g., window structures) and output location areas (e.g., interfaces with peripheral circuits). This step involves running a programmable machining file on a processing device to fabricate conductive lines on a flexible insulating substrate, and to fabricate connection areas (e.g., creating window structures at electrode connections) and output location areas (e.g., fabricating clamping terminal components at interfaces with peripheral circuits).

[0063] S4. Attach the flexible redistribution structure component to the flexible sensor array, connect the flexible redistribution structure component to the row / column electrodes of the flexible sensor array, and use flexible insulating material to insulate the exposed parts of the conductive lines. This step involves attaching the prepared flexible redistribution structure assembly to the upper and lower surfaces of the flexible sensing array. Attachment methods can include bonding, adhesive bonding, or stitching. Then, the flexible redistribution structure assembly is connected to the row / column electrodes of the flexible sensing array using ultrasonic welding, adhesive bonding, or other connection methods. This step uses flexible insulating material to insulate the exposed locations of the conductive lines (such as the locations of window structures, gaps between conductive yarns, and the junctions between conductive yarns and the positioning base in the output area). The purpose of the insulation is to prevent mutual interference or crosstalk between the conductive yarns of the conductive lines, at the connection points between the conductive yarns and the electrodes, between the conductive yarns and other electrodes of the flexible sensing array, and at the output interface, thereby enhancing connection reliability and anti-interference capabilities.

[0064] This step can also further mechanically reinforce the connection points, perform local encapsulation, redundant connection processing, and continuity testing to further improve the reliability and anti-interference performance of the connection.

[0065] After completing the above steps, the conductive yarn of the conductive line can be connected to the signal lead-out end (such as the clamping terminal component) in the output position area, and then the flexible rewiring structure assembly can be connected to the peripheral circuit (the peripheral circuit can be an external acquisition circuit, an external connector, a wireless module, etc.).

[0066] The above description is merely a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this specification should be included within the scope of protection of this specification.

Claims

1. A flexible rewiring structure component, characterized in that, The flexible redistribution structure assembly is attached to one or both surfaces of the sensing area of ​​the flexible sensing array, and is used to converge the electrodes of the flexible sensing array to the output location area through conductive lines. The flexible redistribution structure assembly includes: Flexible insulating substrate is used to isolate conductive lines from flexible sensing array electrodes in non-connected areas, and to fix conductive lines. Conductive lines are used to flexibly converge the row / column electrodes of the flexible sensing array to the output position area, and to realize electrical signal connection with the external circuit through the interface in the output position area; The conductive lines adopt a tensile-resistant flexible wiring structure. The conductive lines are connected to the flexible sensing array electrodes in the connection area through a window structure.

2. The flexible rewiring structure component according to claim 1, characterized in that, The conductive circuit consists of multiple conductive yarns arranged uniformly in space; The conductive yarn adopts a tensile-resistant flexible yarn structure, which is a combination of one or more yarn structures such as serpentine, wavy, zigzag, and straight.

3. The flexible rewiring structure component according to claim 2, characterized in that, The conductive yarn is a metal-based conductive yarn, which includes: metal-plated conductive yarn, metal fiber blended / filament metal conductive yarn, and metal-coated composite conductive yarn.

4. The flexible rewiring structure component according to claim 1, characterized in that, The flexible insulating substrate is one or more of the following: flexible fabric substrate, thermoplastic polyurethane (TPU), ordinary cross-linked PU film, and hot melt adhesive film; the conductive lines are arranged on the surface or in the interlayer of the flexible fabric substrate based on a preset path and are fixed by sewing, embroidery, hot pressing, bonding or ultrasonic welding.

5. The flexible rewiring structure component according to claim 2, characterized in that, The flexible rewiring structure assembly also includes a clamping terminal component; the conductive line is connected to the external circuit via the clamping terminal component in the output position area; The clamping terminal component includes: A positioning base is used to position and fix conductive yarns and conductive terminals; the positioning base is provided with multiple concave positioning grooves, and the spacing of the grooves corresponds to the spacing of the conductive yarns in the conductive circuit. Conductive terminals are provided corresponding to the grooves of the positioning base and are used to connect conductive yarn and external circuits; The press-fit cover plate is used to achieve a stable electrical connection between the conductive yarn and the conductive terminal in the positioning groove of the positioning base through a press-fit method.

6. The flexible rewiring structure component according to claim 5, characterized in that, The coupling method between the pressing cover plate and the positioning base is a combination of one or more of the following: The pressing cover is fastened to the positioning base by a snap-fit ​​mechanism; The pressing cover is screwed onto the positioning base using screws; The press-fit cover plate is riveted to the positioning base by hot riveting; The press-fit cover plate is coupled to the positioning base by an interference fit.

7. The flexible rewiring structure component according to claim 2, characterized in that, The conductive line is connected to the flexible sensing array electrode in the connection area through a window structure in a combination of one or more of the following connection methods: ultrasonic welding connection, conductive adhesive connection, hot pressing connection, sewing or embroidery connection. Each conductive yarn in the conductive circuit has multiple connection points with the corresponding electrode of the flexible sensing array.

8. An electronic skin, characterized in that, The electronic skin includes: Flexible sensor arrays are used for full-area, multi-point synchronous detection of external contact loads; A flexible rewiring structure assembly is used to converge the electrodes of a flexible sensing array to an output location region via conductive lines; the flexible rewiring structure assembly is attached to one or both surfaces of the sensing region of the flexible sensing array. The flexible rewiring structure component includes: Flexible insulating substrate is used to isolate conductive lines from flexible sensing array electrodes in non-connected areas, and to fix conductive lines. Conductive lines are used to flexibly converge the row / column electrodes of the flexible sensing array to the output position area, and to realize electrical signal connection with the external circuit through the interface in the output position area; The conductive lines adopt a tensile-resistant flexible wiring structure. The conductive lines are connected to the flexible sensing array electrodes in the connection area through a window structure.

9. The electronic skin as described in claim 8, characterized in that, The flexible sensing array is a fabric pressure sensing array. The flexible insulating substrate is one or more of the following: flexible fabric substrate, thermoplastic polyurethane (TPU), ordinary cross-linked PU film, and hot melt adhesive film; the conductive lines are arranged on the surface or in the interlayer of the flexible fabric substrate based on a preset path and are fixed by sewing, embroidery, hot pressing, bonding or ultrasonic welding. The conductive line is composed of multiple conductive yarns evenly arranged in space; the conductive yarns adopt a tensile-resistant flexible yarn structure, which is a combination of one or more yarn structures such as serpentine, wavy, zigzag, and straight. The flexible rewiring structure component is attached to one or both sides of the sensing area of ​​the flexible sensing array by a combination of one or more methods such as knitting, embroidery, bonding, and lamination.

10. A method for manufacturing a flexible rewiring structure component, characterized in that, This method is applied to the flexible redistribution structure assembly as described in claim 1, the method comprising: Based on the number of row / column electrodes and their mounting locations in the flexible sensor array, a routing topology pattern for conductive lines is generated. Based on the material type of the flexible insulating substrate and the method of fixing the conductive lines, the wiring pattern is converted into a programmable processing file; Conductive circuits are fabricated on a flexible insulating substrate using a programmable machining file, and connection areas and output location areas are also fabricated. The flexible redistribution structure component is attached to the flexible sensor array, and the flexible redistribution structure component is connected to the row / column electrodes of the flexible sensor array. Flexible insulating material is used to insulate the exposed parts of the conductive lines.

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