A resistor made of a circuit board and a manufacturing method thereof

Abstract

The application discloses a resistor made of a circuit board and a manufacturing method. The resistor comprises: an insulating substrate layer containing insulating resin; metal electrodes arranged on the front surface and the back surface of the insulating substrate layer, wherein the front surface is a first electrode, the back surface is a second electrode, and the first electrode and the second electrode are at least two; an impedance layer arranged on the front surface of the insulating substrate layer, the impedance layer electrically connects the at least two first electrodes, and the second electrode forms a welding electrode; and a through hole penetrating through the insulating substrate layer, the first electrode and the second electrode are electrically connected through the impedance layer in the through hole, or / and the first electrode and the second electrode are electrically connected through a metal layer on the wall of the through hole. The resistor can realize large plate production and has lower production cost.

Description

Technical Field

[0001] This invention relates to the field of resistors, specifically a resistor made using a circuit board and a method for making it. Background Technology

[0002] Resistors are used for current limiting or voltage division and are widely used in electronic products. Ceramic resistors are widely used in current technology, and their production process involves at least the following issues: The insulating substrate of ceramic resistors uses alumina ceramic plates, and alumina is very expensive; To facilitate breaking the ceramic plate into individual resistors later, many longitudinal and transverse grooves need to be pre-pressed into the ceramic plate, which makes it easy to break at the grooves during production. The larger the production plate, the easier it is to break. Therefore, it cannot be designed to be too large for production. On the other hand, if the production plate is too small, it will affect the production efficiency. Ceramic resistors require multiple high-temperature sintering processes during production, resulting in significant energy consumption.

[0003] To control the resistance accuracy of ceramic resistors, lasers are needed for resistance correction, but laser equipment is extremely expensive, further increasing the production cost of ceramic resistors.

[0004] Therefore, ceramic resistors are widely recognized as resistors with high investment, low output, and high selling price. For this reason, it is necessary to optimize and improve existing resistors. Summary of the Invention

[0005] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a resistor made of a circuit board and a manufacturing method thereof, which enables large-scale board production and reduces production costs.

[0006] In a first aspect, embodiments of the present invention provide a resistor fabricated using a circuit board, comprising: The insulating substrate layer contains insulating resin; Metal electrodes are disposed on the front and back sides of the insulating substrate layer, wherein the front side is the first electrode and the back side is the second electrode, and there are at least two of both the first electrode and the second electrode; An impedance layer is disposed on the front side of an insulating substrate layer, and the impedance layer electrically connects at least two first electrodes, wherein the second electrodes form welding electrodes. A via is provided, which penetrates the insulating substrate layer. At the location of the via, the first electrode and the second electrode are electrically connected through an impedance layer in the via, or / and the first electrode and the second electrode are electrically connected through a metal layer on the wall of the via.

[0007] Optionally, the through holes are disposed at both ends of the insulating substrate layer, and the through holes are either half-hole structures or full-hole structures.

[0008] Optionally, the via is a blind via that passes through the first electrode or the second electrode; or, the via is a through-hole that passes through the first electrode and the second electrode.

[0009] Optionally, the via is a half-hole structure, and the metal layer is disposed on the wall of the via. The metal layer electrically connects the first electrode and the second electrode at both ends of the via, and the impedance layer at least partially covers the first electrode.

[0010] Optionally, the via is a blind via, and the via is disposed on the back side of the resistor; or, the via is a blind via, and the via is disposed on the front side of the resistor, and the impedance layer does not extend into the via, or extends into the via; or, the via is a through-hole, and the impedance layer does not extend into the via, or extends into the via.

[0011] Optionally, the via is a half-hole structure, the via is disposed on the front side of the resistor, the impedance layer extends into the via, and the first electrode and the second electrode at both ends of the via are electrically connected.

[0012] Optionally, the via is a full-hole structure and a blind via, and the via is located on the front or back of the resistor. The metal layer is provided on the wall of the via, and the first electrode and the second electrode at both ends of the via are electrically connected through the metal layer.

[0013] Optionally, the via is disposed on the front side of the resistor, and the impedance layer extends into the via, or does not extend into the via; or, the via is disposed on the back side of the resistor, and the impedance layer does not extend into the via.

[0014] Optionally, the via is a full-hole structure, the via is a blind via and is located on the front side of the resistor, or the via is a through-hole; the impedance layer extends into the via and electrically connects the first electrode and the second electrode at both ends of the via.

[0015] Optionally, the via is a full-hole structure and is a through hole, and the metal layer is provided on the wall of the via. The metal layer electrically connects the first electrode and the second electrode at both ends of the via, and the impedance layer extends into the via.

[0016] Optionally, the impedance layer is a resistive ink containing graphite and / or metal.

[0017] Optionally, the metal electrode is copper, nickel, tin, or any two or three of these metals; the insulating substrate layer is an insulating substrate layer composed of insulating resin and glass fiber bonded together.

[0018] Optionally, the front side of the impedance layer is covered with a waterproof protective layer.

[0019] Optionally, the impedance layer has two ends in the length direction and two ends in the width direction, wherein at least one end is tapered inward, such that the tapered end is shorter than the length or width of the resistor, and the waterproof protective layer extends to the sidewall of the tapered end, and the front, part or all of the sides of the impedance layer are covered by the waterproof protective layer.

[0020] The first aspect of the present invention has at least one of the following beneficial effects: The present invention uses a material containing insulating resin as the insulating substrate layer, and utilizes vias penetrating the insulating substrate layer. The first and second electrodes at both ends of the vias are electrically connected through an impedance layer and / or a metal layer on the via wall. This eliminates the need for ceramic resistors in traditional technologies. The resistors manufactured by the circuit board described in the present invention do not require high-temperature sintering, nor do they require high-cost alumina, nor do they require laser resistance repair, greatly reducing the manufacturing cost of the resistors. Furthermore, the resistors manufactured by the circuit board can be cut into individual resistors using a die, thus eliminating the need to pre-press longitudinal and transverse grooves on the insulating substrate layer, thereby avoiding the problem of easy breakage during production. Therefore, the resistors manufactured by the circuit board can be mass-produced in large boards, further reducing the manufacturing cost of the resistors.

[0021] Secondly, embodiments of the present invention provide a method for manufacturing a circuit board resistor, comprising: Prepare a double-sided metal-clad laminate, which includes an insulating substrate layer and metal on both sides of the insulating substrate layer, wherein the insulating substrate layer includes insulating resin and glass fiber bonded together. Fabricate through holes on a double-sided metal-clad plate; The double-sided metal-clad laminate is etched so that the metal on both sides of the insulating substrate layer forms the first electrode and the second electrode, respectively; or, by depositing conductive material on the wall of the via and then electroplating copper to form copper metal on the wall, the double-sided metal-clad laminate is etched so that the metal on both sides of the insulating substrate layer forms the first electrode and the second electrode, and the first electrode and the second electrode are electrically connected through the copper metal on the wall. A release film with an impedance layer is pressed onto the first electrode and its insulating substrate layer, with the impedance layer connected to the first electrode, and then the release film is removed; or, the release film with an impedance layer is die-cut on a die-cutting machine, then pressed onto the first electrode and its insulating substrate layer, the release film and unwanted portions of the impedance layer are removed, allowing the remaining portion of the desired impedance layer to adhere to the first electrode and the insulating substrate layer, and then an adhesive resin film is applied to the impedance layer and the insulating substrate layer, and pressed together, so that the resin film seals the front side and part or all of the sides of the impedance layer; or, the resin film with an impedance layer is pressed onto the first electrode and its insulating substrate layer, and pressed together, so that the resin film seals the front side of the impedance layer. It is divided into multiple resistors.

[0022] Optionally, when making the via, the via penetrates the insulating substrate layer and the metal on one side, forming a blind via; or, when making the via, the via penetrates the insulating substrate layer and the metal on both sides, forming a through via.

[0023] The second aspect of the present invention has at least one of the following beneficial effects: The present invention uses existing double-sided metal-clad laminates as raw materials for resistor production. The fabrication of vias and the etching of circuits on the double-sided metal-clad laminate are all circuit board manufacturing processes, which are mature and reliable. By pressing a resistive adhesive film formed from a release film or resin film with an impedance layer onto the first electrode and its insulating substrate layer, the length and width dimensional tolerances of the resin film are very small (≤±0.05mm), and the alignment during pressing is precise. The resulting resistor has excellent stability and consistency, and the resistance range is easily controlled within ±5%. Therefore, the resistor does not require resistance correction, significantly reducing the investment in production equipment and production costs. The present invention, by fabricating vias, enables the first and second electrodes on both sides of the insulating substrate layer to be electrically connected through the impedance layer in the vias and / or the copper plated on the via walls, cleverly solving the problem of conduction between the two electrodes. The present invention also has the beneficial effects described in the first aspect of the present invention. Attached Figure Description

[0024] Figure 1.1 This is a cross-sectional view of the resistor in Embodiment 1 of the present invention; Figure 1.2 yes Figure 1.1 A front view diagram (impedance layer not shown); Figure 1.3 yes Figure 1.1 A front view diagram (showing the impedance layer); Figure 1.4 yes Figure 1.1 A diagram of the back of the building; Figure 1.5 yes Figure 1.1 The structure shown is a cross-sectional view when a waterproof protective layer is incorporated. Figure 2.1 This is a cross-sectional view of the resistor in Embodiment 2 of the present invention; Figure 2.2 yes Figure 2.1 A front view diagram (showing the impedance layer, etc.); Figure 2.3 yes Figure 2.1 A diagram of the back of the building; Figure 2.4 yes Figure 2.1 The structure shown is a cross-sectional view when a waterproof protective layer is incorporated. Figure 3.1This is a cross-sectional view of the resistor in Embodiment 3 of the present invention; Figure 3.2 yes Figure 3.1 The structure shown is a cross-sectional view when a waterproof protective layer is incorporated. Figure 4.1 This is a cross-sectional view of the resistor in Embodiment 4 of the present invention; Figure 4.2 yes Figure 4.1 The structure shown is a cross-sectional view when a waterproof protective layer is incorporated. Figure 5.1 This is a cross-sectional view of the resistor in Embodiment 5 of the present invention; Figure 5.2 yes Figure 5.1 A front view diagram (showing the impedance layer, etc.); Figure 5.3 yes Figure 5.1 A diagram of the back of the building; Figure 5.4 yes Figure 5.1 The structure shown is a cross-sectional view when a waterproof protective layer is incorporated. Figure 6.1 This is a cross-sectional view of the resistor in Embodiment 6 of the present invention; Figure 6.2 yes Figure 6.1 A front view diagram (impedance layer not shown); Figure 6.3 yes Figure 6.1 A front view diagram (showing the impedance layer); Figure 6.4 yes Figure 6.1 A diagram of the back of the building; Figure 6.5 yes Figure 6.1 The diagram shown is a cross-sectional view of the structure when a waterproof protective layer is incorporated. Figure 7.1 This is a front view of the resistor in Embodiment 7 of the present invention (showing the impedance layer). Figure 7.2 yes Figure 7.1 Sectional view of AA; Figure 7.3 yes Figure 7.1 Cross-sectional view of BB (for easier reading, the cross-sectional view is rotated 90° counterclockwise). Figure 8.1 This is a cross-sectional view of the resistor in Embodiment 8 of the present invention; Figure 8.2 yes Figure 8.1 A diagram of the back of the building; Figure 8.3 yes Figure 8.1 The structure shown is a cross-sectional view when a waterproof protective layer is incorporated. Figure 9.1 This is a cross-sectional view of the resistor in Embodiment 9 of the present invention; Figure 9.2 yes Figure 9.1 The structure shown is a cross-sectional view when a waterproof protective layer is incorporated. Figure 10.1 This is a cross-sectional view of the resistor in Embodiment 10 of the present invention; Figure 10.2 yes Figure 10.1 The structure shown is a cross-sectional view when a waterproof protective layer is incorporated. Figure 11.1 This is a cross-sectional view of the resistor in Embodiment 11 of the present invention; Figure 11.2 yes Figure 11.1 The structure shown is a cross-sectional view when a waterproof protective layer is incorporated. Figure 12 This is a planar schematic diagram of the production of resistors using long plates in an embodiment of the present invention.

[0025] Explanation of reference numerals: 1-Insulating substrate layer, 21-First electrode, 22-Second electrode, 3-Impedance layer, 4-Conducting hole, 5-Metal layer, 6-Waterproof protective layer. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described below can be arbitrarily combined with each other.

[0027] The following provides many different implementation methods or examples for implementing the structure of the present invention.

[0028] A first aspect of this invention provides a resistor fabricated using a circuit board, comprising: an insulating substrate layer 1, which is an insulating substrate layer containing insulating resin, using the insulating resin as an insulating material to form an organic material resistor, unlike traditional ceramic inorganic material resistors; and metal electrodes disposed on the front and back sides of the insulating substrate layer, wherein the front side is a first electrode 21 and the back side is a second electrode 22. Due to the requirement for positive and negative electrode electrical connection, there are at least two first electrodes 21 and two second electrodes 22. It should be noted that if there is no electroplating process during resistor fabrication, there is no electroplated layer; the first electrode 21 and the second electrode 22 are metals on a double-sided metal-clad plate. If an electroplating process is performed during resistor fabrication, the first electrode 21 and the second electrode 22 include the metals on the double-sided metal-clad plate and an electroplated layer (such as electroplated copper) on the metal. After electroplating, the metal and the electroplated layer are integrated. Impedance layer 3: In this embodiment, impedance layer 3 is resistive ink containing graphite and / or metal. Electrical connection is achieved through the graphite or metal in the resistive ink, and the resistive ink simultaneously forms a resistance value. The impedance layer 3 is disposed on the front side of the insulating substrate layer 1. The impedance layer 3 electrically connects at least two first electrodes 21. Thus, the two first electrodes 21 form the required resistance value due to the resistive ink, and an electrical connection is formed due to the graphite or metal. The second electrode 22 forms a welding electrode. In use, the welding electrode is used to weld the resistor onto the circuit board. Through hole 4: The through hole 4 penetrates the insulating substrate layer 1. At the through hole 4, the first electrode 21 and the second electrode 22 are electrically connected through the impedance layer 3 in the through hole 4. If there is an electroplating process, a metal layer 5 will be formed on the hole wall of the through hole 4. At this time, the first electrode 21 and the second electrode 22 can also be electrically connected through the metal layer 5 on the hole wall of the through hole 4, i.e., the electroplating layer (e.g., electroplated copper).

[0029] See details Figures 1.1-5.4 As shown, in some embodiments of the present invention, the through-hole 4 is disposed at both ends of the insulating substrate layer 1, and the through-hole 4 is a half-hole structure, such as... Figure 12 As shown, during the production of resistors from long plates, when the slitting tool passes through the middle of the through-hole 4, the through-hole on the resulting individual resistors forms a half-hole structure; when the slitting tool does not pass through the through-hole 4, the through-hole 4 remains intact on the individual resistor, forming a full-hole structure, as shown. Figures 6.1-11.2 As shown.

[0030] See details Figures 1.1-4.2 ,or Figures 6.1-9.2 As shown, in some embodiments of the present invention, the through hole 4 is a blind hole, and the through hole 4 penetrates the first electrode 21 or the second electrode 22; or, see specifically... Figures 5.1-5.4 , Figures 10.1-11.2As shown, the through hole 4 can also be a through hole, penetrating through the first electrode 21 and the second electrode 22. The through hole 4 can be a blind hole or a through hole, which can be achieved by controlling the depth of the die during the through hole manufacturing process.

[0031] See details Figure 1.1 , Figure 2.1 , Figure 3.1 , Figure 5.1 As shown, the resistor undergoes an electroplating process during manufacturing. Therefore, in some embodiments of the present invention, the via 4 is a semi-hole structure, and the metal layer 5 is disposed on the wall of the via 4. The metal layer 5 electrically connects the first electrode 21 and the second electrode 22 at both ends of the via 4. The impedance layer 3 at least partially covers the first electrode 21, that is, the impedance layer 3 can completely cover the first electrode 21 or partially cover the first electrode 21 (partial coverage can be found in [reference]). Figure 7.1 (As shown).

[0032] See details Figure 1.1 , Figure 6.1 , Figure 7.2 As shown, in some embodiments of the present invention, the via 4 is a blind via, and the via 4 is disposed on the back side of the resistor. In this case, the impedance layer 3 is located on the front side of the resistor and does not extend into the via 4, and the via 4 has a hole-like structure and is exposed. In other embodiments, see details below. Figure 2.1 , Figure 3.1 , Figure 4.1 , Figure 8.1 , Figure 9.1 As shown, the via 4 is a blind via, and the via 4 is disposed on the front side of the resistor. The impedance layer 3 may not extend into the via 4, or it may extend into the via 4. Similarly, in some other embodiments, the via 4 is a through-hole, and the impedance layer 3 may not extend into the via 4, or it may extend into the via 4.

[0033] When an electroplating process is involved, the first electrode 21 and the second electrode 22 at both ends of the through hole 4 can be electrically connected through the metal layer 5 on the hole wall of the through hole 4; when no electroplating process is involved, the first electrode 21 and the second electrode 22 at both ends of the through hole 4 need to be electrically connected through the impedance layer 3 inside the through hole 4. Therefore, in some embodiments of the present invention, see [details omitted]. Figure 4.1 , Figure 5.1 As shown, the via is a half-hole structure, the via 4 is disposed on the front side of the resistor, the impedance layer 3 extends into the via 4, and electrically connects the first electrode 21 and the second electrode 22 at both ends of the via 4.

[0034] See details Figures 6.1-8.3As shown, in some embodiments of the present invention, the via 4 is a full-hole structure and a blind via. The via 4 is disposed on the front or back of the resistor. The metal layer 5 is disposed on the wall of the via 4. The first electrode 21 and the second electrode 22 at both ends of the via 4 are electrically connected through the metal layer 5. That is, the reliable electrical connection between the first electrode 21 and the second electrode 22 on both sides of the resistor is achieved by electroplating the metal layer 5. In this case, if the via 4 is disposed on the front of the resistor, the impedance layer 3 can extend into the via 4, or it can not extend into the via 4, neither of which affects the electrical connection between the first electrode 21 and the second electrode 22; if the via 4 is disposed on the back of the resistor, the impedance layer 3 does not extend into the via 4 because it is located on the front of the resistor.

[0035] See details Figures 9.1-9.2 As shown, in some embodiments of the present invention, the via 4 is a full-hole structure, or a blind via disposed on the front side of the resistor. In other embodiments, the via 4 can also be a through-hole. See details below. Figures 11.1-11.2 As shown; at this time, since there is no electroplating process, there is no electroplated metal in the through hole 4. Therefore, the first electrode 21 and the second electrode 22 at both ends of the through hole 4 are electrically connected by extending the impedance layer 3 into the through hole 4. It can be understood that the resistance values ​​of the first electrode 21 and the second electrode 22 are not the same when the first electrode 21 and the second electrode 22 are electrically connected by the electroplated metal layer 5 or by the impedance layer 3.

[0036] See Figures 10.1-10.2 As shown, in some embodiments of the present invention, the through hole 4 is a full hole structure and is a through hole. The metal layer 5 is provided on the hole wall of the through hole 4. The metal layer 5 electrically connects the first electrode 21 and the second electrode 22 at both ends of the through hole 4. The impedance layer 3 extends into the through hole 4.

[0037] The first electrode 21 and the second electrode 22 can be copper, nickel, tin, or any two or three of these metals, which are easy to obtain and have low cost.

[0038] To protect impedance layer 3, see details. Figure 2.1 In some embodiments of the present invention, the front side of the impedance layer 3 is covered with a waterproof protective layer 6. This is to ensure that if there is resin in the impedance layer 3 (for example, resin in solder resist ink), the waterproof protective layer 6 isolates the impedance layer 3 from the air as much as possible, preventing the resin from absorbing moisture and increasing the resistance, thus ensuring the stability and durability of the resistance value.

[0039] See details Figures 7.1-7.3As shown, in some embodiments of the present invention, the impedance layer 3 has two ends in the length direction (left and right ends in the illustration) and two ends in the width direction (top and bottom ends in the illustration), wherein at least one end is tapered inward, such that the tapered end is shorter than the length or width of the resistor, and the waterproof protective layer 6 extends to the sidewall of the tapered end, and the front, part or all of the sidewalls of the impedance layer 3 are covered by the waterproof protective layer 6. By tapering the impedance layer 3 inward, the sidewalls of the impedance layer 3 can be covered by the waterproof protective layer 6, thereby achieving a better moisture-proof effect.

[0040] The following is a brief description of the embodiments: Example 1: See details Figure 1.1 As shown, the via 4 is located on the back of the resistor. The via 4 is a half-hole structure and a blind hole. The first electrode 21 and the second electrode 22 are electrically connected through the metal layer 5 on the side wall of the via 4.

[0041] Example 2: See details Figure 2.1 As shown, the via 4 is located on the front side of the resistor. The via 4 is a half-hole structure and a blind hole. The first electrode 21 and the second electrode 22 are electrically connected through the metal layer 5 on the side wall of the via 4.

[0042] Example 3: See details Figure 3.1 As shown, the via 4 is located on the front side of the resistor. The via 4 is a half-hole structure and a blind hole. The first electrode 21 and the second electrode 22 are electrically connected through the metal layer 5 on the side wall of the via 4. The impedance layer 3 extends into the via 4.

[0043] Example 4: See details Figure 4.1 As shown, the via 4 is located on the front side of the resistor. The via 4 is a half-hole structure and a blind hole. The first electrode 21 and the second electrode 22 are electrically connected through the impedance layer 3 inside the via 4. There is no electroplated metal layer 5.

[0044] Example 5: See details Figure 5.1 As shown, the through hole 4 is a semi-hole structure and a through hole. The first electrode 21 and the second electrode 22 are electrically connected through the metal layer 5 on the side wall of the through hole 4.

[0045] Example 6: See details Figure 6.1 As shown, the via 4 is located on the back of the resistor. The via 4 is a full-hole structure and a blind hole. The first electrode 21 and the second electrode 22 are electrically connected through the metal layer 5 on the sidewall of the via 4.

[0046] Example 7: See details Figure 7.1As shown, the via 4 is located on the back of the resistor. The via 4 is a full-hole structure and a blind hole. The first electrode 21 and the second electrode 22 are electrically connected through the metal layer 5 on the side wall of the via 4. The four end faces of the impedance layer 3 are all recessed to facilitate the waterproof protective layer 4 to cover the sides.

[0047] Example 8: See details Figure 8.1 As shown, the via 4 is located on the front side of the resistor. The via 4 is a full-hole structure and a blind hole. The first electrode 21 and the second electrode 22 are electrically connected through the metal layer 5 on the sidewall of the via 4.

[0048] Example 9: See details Figure 9.1 As shown, the via 4 is located on the front side of the resistor. The via 4 is a full-hole structure and a blind hole. The first electrode 21 and the second electrode 22 are electrically connected through the impedance layer 3 in the via 4. There is no electroplated metal layer inside the via 4.

[0049] Example 10: See details Figure 10.1 As shown, the through hole 4 is a full hole structure and is a through hole. The first electrode 21 and the second electrode 22 are electrically connected through the metal layer 5 on the side wall of the through hole 4.

[0050] Example 11: See details Figure 11.1 As shown, the via 4 is a full-hole structure and is a through hole. The first electrode 21 and the second electrode 22 are electrically connected through the impedance layer 3 in the via 4. There is no electroplated metal layer in the via 4.

[0051] The above embodiments 1-11 all have at least one of the following beneficial effects: By using a material containing insulating resin as the insulating substrate layer 1, and utilizing a through hole 4 to penetrate the insulating substrate layer 1, the first electrode 21 and the second electrode 22 at both ends of the through hole 4 are electrically connected through the impedance layer 3 and / or the metal layer 5 on the hole wall of the through hole 4. This eliminates the need for ceramic resistors in traditional technology. The resistors made by the circuit board described in this invention do not require high-temperature sintering during the manufacturing process, nor do they require the use of high-cost alumina, nor do they require laser repair, which greatly reduces the manufacturing cost of the resistors. Furthermore, the resistors made by the circuit board can be cut into individual resistors by a die, so there is no need to pre-press longitudinal and transverse grooves on the insulating substrate layer, thereby avoiding the problem of easy breakage during production. Therefore, the resistors made by the circuit board can be mass-produced in large boards, further reducing the manufacturing cost of the resistors.

[0052] For information on large sheet production, see [link / reference]. Figure 12 As shown, the large plate is positioned using multiple peripheral holes of varying sizes, and contains multiple interconnected resistors in its center. After the large plate is fabricated, it is cut using a cutting tool at the positions indicated by the single-dotted lines, resulting in multiple individual resistors C as framed by the double-dotted lines. A structural diagram of an individual resistor C can be found in [reference needed]. Figure 6.1 As shown.

[0053] A second aspect of the present invention also provides a method for manufacturing a circuit board resistor, comprising: Prepare a double-sided metal-clad laminate, which includes an insulating substrate layer and metal on both sides of the insulating substrate layer. The metal is copper-nickel. The insulating substrate layer includes insulating resin and glass fiber bonded together, specifically FR4, which is commonly used in the circuit board industry. Use a mold to punch holes in the double-sided metal-clad plate to create through holes; the holes can be made on the front or back of the double-sided metal-clad plate, and the holes can be blind holes or through holes. Regarding the fabrication of the metal electrodes: In some embodiments, an etching method known in the circuit board industry is used to etch the double-sided metal-clad laminate after drilling, so that the metal portions on both sides of the insulating substrate layer are etched away, while some are retained, and the retained metals form the first electrode and the second electrode respectively; or, in other embodiments, an electroplating method known in the circuit board industry is used to first electroplat the double-sided metal-clad laminate after drilling. The basic process is to deposit a conductive material on the hole wall and then electroplat copper to form metallic copper on the hole wall. At this time, metallic copper is also electroplated on the metal surfaces on both sides of the double-sided metal-clad laminate. Then, the double-sided metal-clad laminate is etched so that the metal on both sides of the insulating substrate layer (including the electroplated metallic copper) forms the first electrode and the second electrode. The first electrode and the second electrode are electrically connected through the metallic copper on the hole wall. Regarding the fabrication of the impedance layer: In some embodiments, a release film with impedance ink is pressed onto the first electrode and its insulating substrate layer, with the impedance layer connected to the first electrode, and then the release film is removed; in other embodiments, the release film with the impedance layer is die-cut on a die-cutting machine, then pressed onto the first electrode and its insulating substrate layer, the release film and unwanted portions of the impedance layer are removed, and the remaining desired portion of the impedance layer is bonded to the first electrode and the insulating substrate layer. Then, an adhesive resin film is applied to the impedance layer and the insulating substrate layer, and pressed together, so that the resin film seals the front side and part or all of the sides of the impedance layer, thereby forming a waterproof protective layer; or, in other embodiments, a resin film with an impedance layer is pressed onto the first electrode and its insulating substrate layer, and pressed together, so that the resin film seals the front side of the impedance layer, thereby forming a waterproof impedance layer; It is divided into multiple resistors.

[0054] The second aspect of the present invention has at least one of the following beneficial effects: The present invention uses existing double-sided metal-clad laminates as raw materials for resistor production. The fabrication of vias and the etching of circuits on the double-sided metal-clad laminate are all circuit board manufacturing processes, which are mature and reliable. By pressing a resistive adhesive film formed from a release film or resin film with an impedance layer onto the first electrode and its insulating substrate layer, the length and width dimensional tolerances of the resin film are very small (≤±0.05mm), and the alignment during pressing is precise. The resulting resistor has excellent stability and consistency, and the resistance range is easily controlled within ±5%. Therefore, the resistor does not require resistance repair, which obviously reduces the investment in production equipment and production costs. It also cleverly solves the problem of conduction between the two electrodes. The present invention also has the beneficial effects described in the first aspect of the present invention.

[0055] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A resistor made using a circuit board, characterized in that, include: The insulating substrate layer contains insulating resin; Metal electrodes are disposed on the front and back sides of the insulating substrate layer, wherein the front side is the first electrode and the back side is the second electrode, and there are at least two of both the first electrode and the second electrode; An impedance layer is disposed on the front side of an insulating substrate layer, and the impedance layer electrically connects at least two first electrodes, wherein the second electrodes form welding electrodes. A via is provided, which penetrates the insulating substrate layer. At the location of the via, the first electrode and the second electrode are electrically connected through an impedance layer in the via, or / and the first electrode and the second electrode are electrically connected through a metal layer on the wall of the via.

2. A resistor made of a circuit board according to claim 1, characterized in that: The through holes are located at both ends of the insulating substrate layer. The through holes can be either half-holes or full-holes.

3. A resistor made of a circuit board according to claim 2, characterized in that: The via is a blind via that passes through the first electrode or the second electrode; or, the via is a through-hole that passes through the first electrode and the second electrode.

4. A resistor made of a circuit board according to claim 3, characterized in that: The via is a semi-hole structure, and the metal layer is disposed on the hole wall. The metal layer electrically connects the first electrode and the second electrode at both ends of the via, and the impedance layer at least partially covers the first electrode.

5. A resistor made of a circuit board according to claim 4, characterized in that: The via is a blind via, located on the back side of the resistor; or, the via is a blind via, located on the front side of the resistor, with the impedance layer either not extending into the via or extending into the via; or, the via is a through-hole, with the impedance layer either not extending into the via or extending into the via.

6. A resistor fabricated on a circuit board according to claim 3, characterized in that: The via is a half-hole structure, and the via is located on the front side of the resistor. The impedance layer extends into the via, electrically connecting the first electrode and the second electrode at both ends of the via.

7. A resistor fabricated on a circuit board according to claim 3, characterized in that: The via is a full-hole structure and a blind via. The via is located on the front or back of the resistor. The metal layer is provided on the wall of the via. The first electrode and the second electrode at both ends of the via are electrically connected through the metal layer.

8. A resistor fabricated on a circuit board according to claim 7, characterized in that: The via is disposed on the front side of the resistor, and the impedance layer extends into the via, or does not extend into the via; or, the via is disposed on the back side of the resistor, and the impedance layer does not extend into the via.

9. A resistor fabricated on a circuit board according to claim 3, characterized in that: The via is a full-hole structure, the via is a blind via and is located on the front side of the resistor, or the via is a through-hole; the impedance layer extends into the via and electrically connects the first electrode and the second electrode at both ends of the via.

10. A resistor fabricated on a circuit board according to claim 3, characterized in that: The via is a full-hole structure and is a through hole. The metal layer is provided on the wall of the via. The metal layer electrically connects the first electrode and the second electrode at both ends of the via. The impedance layer extends into the via.

11. A resistor manufactured on a circuit board according to any one of claims 1-10, characterized in that: The impedance layer is a resistive ink, which contains graphite and / or metal.

12. A resistor manufactured on a circuit board according to any one of claims 1-10, characterized in that: The metal electrode is copper, nickel, tin, or any two or three of these metals; the insulating substrate layer is an insulating substrate layer composed of insulating resin and glass fiber bonded together.

13. A resistor manufactured on a circuit board according to any one of claims 1-10, characterized in that: The front side of the impedance layer is covered with a waterproof protective layer.

14. A resistor fabricated on a circuit board according to claim 13, characterized in that: The impedance layer has two ends in the length direction and two ends in the width direction, wherein at least one end is tapered inward, such that the tapered end is shorter than the length or width of the resistor, and the waterproof protective layer extends to the sidewall of the tapered end, and the front, part or all of the sides of the impedance layer are covered by the waterproof protective layer.

15. A method for manufacturing a circuit board resistor, characterized in that, include: Prepare a double-sided metal-clad laminate, which includes an insulating substrate layer and metal on both sides of the insulating substrate layer, wherein the insulating substrate layer includes insulating resin and glass fiber bonded together. Fabricate through holes on a double-sided metal-clad plate; The double-sided metal-clad laminate is etched so that the metal on both sides of the insulating substrate layer forms the first electrode and the second electrode, respectively; or, by depositing conductive material on the wall of the via and then electroplating copper to form copper metal on the wall, the double-sided metal-clad laminate is etched so that the metal on both sides of the insulating substrate layer forms the first electrode and the second electrode, and the first electrode and the second electrode are electrically connected through the copper metal on the wall. A release film with an impedance layer is pressed onto the first electrode and its insulating substrate layer, with the impedance layer connected to the first electrode, and then the release film is removed; or, the release film with an impedance layer is die-cut on a die-cutting machine, then pressed onto the first electrode and its insulating substrate layer, the release film and unwanted portions of the impedance layer are removed, allowing the remaining portion of the desired impedance layer to adhere to the first electrode and the insulating substrate layer, and then an adhesive resin film is applied to the impedance layer and the insulating substrate layer, and pressed together, so that the resin film seals the front side and part or all of the sides of the impedance layer; or, the resin film with an impedance layer is pressed onto the first electrode and its insulating substrate layer, and pressed together, so that the resin film seals the front side of the impedance layer. It is divided into multiple resistors.

16. A method for manufacturing a circuit board resistor according to claim 15, characterized in that: When creating a via, the via can penetrate the insulating substrate layer and the metal on one side, forming a blind via; or, when creating a via, the via can penetrate the insulating substrate layer and the metal on both sides, forming a through via.

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