Automatic lamination device for transformer core

Abstract

The application discloses a kind of transformer core automatic lamination device, it is related to transformer technical field, including placement component, placement component includes workbench and storage platform, the top of workbench is fixedly installed with mechanical arm, further include: suction assembly, it is set to the output end bottom of mechanical arm, including upper suction disc group, mechanical arm drives upper suction disc group to move and the iron core piece placed on storage platform is absorbed and transferred to workbench and is stacked;Separation component, it is set to the output end side of mechanical arm, including lower suction disc group, after upper suction disc group absorbs top of upper layer iron core piece and lifts, lower suction disc group absorbs bottom of lower layer iron core piece, then moves horizontally after a preset distance and staggered lower layer iron core piece, again, move downward and peel off lower layer iron core piece;Through upper suction disc group control single piece absorption and cooperate with lower suction disc group separation associated iron core piece, guarantee iron core piece stacking precision, improve iron core piece stacking efficiency.

Description

Technical Field

[0001] This invention relates to the field of transformer technology, and in particular to an automatic lamination device for transformer cores. Background Technology

[0002] Transformers are formed by stacking a large number of ultra-thin oriented silicon steel sheets, i.e. iron chips, layer by layer. The alignment accuracy of the stacked sheets and the density and uniformity between layers directly affect the overall energy efficiency index of the transformer.

[0003] In the prior art, Chinese Patent No. CN109087803A discloses an automatic lamination device for transformer cores, including a support, a picking and placing mechanism, a conveying mechanism, and a lamination platform. The picking and placing mechanism and the conveying mechanism are fixed on the support. The picking and placing mechanism is used to pick up the laminations and place them on the lamination platform.

[0004] Chinese patent CN113470965A discloses an automated lamination device for transformer cores, including a horizontal base plate, a platform fixedly installed on the base plate by a support column, a positioning mechanism and a supporting mechanism installed on the base plate, and a stacking mechanism installed on the base plate.

[0005] Similar technical solutions have some problems in use. Existing solutions use negative pressure adsorption to transfer iron chips through the upper suction cup group. However, in the stacked state, different iron chips are prone to adsorption, resulting in multiple layers of iron chips being lifted and transferred simultaneously. If only vertical movement is used to adsorb and separate the lower layer of iron chips, the lower layer of iron chips requires a large suction force, and excessive suction force may cause the upper layer of iron chips to separate from the upper suction cup group. If multiple layers of iron chips are separated by only lateral movement and misalignment, it may cause severe wear on the multiple layers of iron chips.

[0006] Furthermore, there may be multiple sets of adsorbed iron chips, which may lead to incomplete removal of the middle layer iron chips and subsequent stacking failure. During the separation of the lower layer iron chips, the adsorbed upper layer iron chips may deviate from the preset position, causing a large error that affects the transformer core forming effect. Moreover, the middle and lower layer iron chips may detach during the transfer process after separation, which may cause safety hazards.

[0007] Therefore, it is necessary to invent an automatic lamination device for transformer cores to solve the above problems. Summary of the Invention

[0008] The purpose of this invention is to provide an automatic lamination device for transformer cores to solve the problems mentioned in the background art.

[0009] To achieve the above objectives, the present invention provides the following technical solution: an automatic lamination device for transformer cores, comprising a placement assembly, the placement assembly including a workbench and a storage platform, a robotic arm fixedly mounted above the workbench, and further comprising: The adsorption assembly is located at the bottom of the output end of the robotic arm, including an upper suction cup assembly. The robotic arm drives the upper suction cup assembly to move and adsorb and transfer the iron chips placed on the storage table to the worktable for stacking. The separation component is located on the side of the output end of the robotic arm. It includes a lower suction cup group. After the upper suction cup group adsorbs the top of the upper iron chip and lifts it, the lower suction cup group adsorbs the bottom of the lower iron chip and moves laterally a preset distance to offset the lower iron chip. Then it moves downward to peel off the lower iron chip. The limiting component, which is located on the side of the separating component, includes a limiting frame and a protrusion, for calibrating the position of the upper iron chip adsorbed by the upper suction cup assembly. When the middle iron chip is misaligned with the upper iron chip, the protrusion moves downward and hooks down to peel off the middle iron chip. When the middle and lower iron chips are transferred with the lower suction cup assembly, the limiting frame and the protrusion press against the top edges of the middle and lower iron chips.

[0010] Preferably, the adsorption component further includes: The top of the top frame is fixedly connected to the bottom output end of the robotic arm. The top of the upper suction cup assembly is fixedly installed to the bottom of the top frame. The robotic arm drives the upper suction cup assembly to move through the top frame. The upper suction cup assembly adsorbs the upper iron chip on the storage platform and transfers it to the worktable for stacking.

[0011] Preferably, the separation component further includes: The drive unit has one end fixedly connected to the side of the output end of the robotic arm; The base frame is fixedly connected to the output end of the drive unit at its bottom. The bottom of the lower suction cup assembly is fixedly installed to the top of the base frame. The drive unit drives the lower suction cup assembly to move through the base frame. After the upper suction cup assembly adsorbs the top of the upper iron chip and lifts it, the drive unit drives the lower suction cup assembly to move to the bottom of the lower iron chip for adsorption through the base frame.

[0012] Preferably, the upper suction cup group adsorbs the upper layer of iron chip, i.e., a single layer of iron chip, and the lower suction cup group adsorbs the lower layer of iron chip, i.e., a single layer of iron chip, while there is also a middle layer of iron chip, i.e., multiple layers of iron chips connected between the upper suction cup group and the lower suction cup group.

[0013] Preferably, the limiting component further includes: The telescopic pole is fixedly installed at one end to the side of the base frame; The connector is fixedly connected at its bottom to the telescopic end of the telescopic rod, and the inner side of the connector is slidably connected to the side of the base frame. The telescopic end of the telescopic rod drives the connector to move laterally along the side of the base frame. The bottom of the adjusting rod is fixedly connected to the top of the connecting piece, and the bottom of the limiting frame is fixedly connected to the telescopic end of the top of the adjusting rod. The telescopic end of the adjusting rod drives the limiting frame and the protrusion to move up and down for adjustment.

[0014] Preferably, the limiting frame limits and fixes the sides of the lower and middle iron chips, and the side of the protrusion is fixedly connected to the inner top of the limiting frame.

[0015] Preferably, the placement component further includes: The stacking rack has its bottom fixedly connected to the top of the workbench. The robotic arm moves the upper suction cup assembly through the top frame to stack the upper iron chips in the stacking rack. The storage rack is fixedly connected at the bottom to the top of the storage platform. The robotic arm moves the upper suction cup assembly through the top frame and performs adsorption and transfer of the upper iron chip in the storage rack.

[0016] Preferably, the storage platform is located on the side of the workbench, and a spare platform is provided on the side of the workbench for storing the transferred lower-layer iron chips and middle-layer iron chips on the spare platform.

[0017] The technical effects and advantages of this invention are as follows: 1. In this invention, the upper suction cup group is used to adsorb the upper iron chip, and the lower suction cup group is used to separate the lower iron chip, so as to ensure the accuracy of the iron chip stacking operation and thus improve the efficiency of transformer core lamination.

[0018] 2. In this invention, by combining the lateral misalignment and vertical downward movement of the lower suction cup group, the adhesion between the iron chips can be broken, achieving efficient separation, automatically increasing the adsorption force of the lower suction cup group, and improving the success rate of separation of the lower iron chips.

[0019] 3. In this invention, the middle layer iron chip is hooked down by the bump, thereby overcoming the limitations of the suction cup misalignment separation and achieving complete separation of the upper layer iron chip and the middle layer iron chip.

[0020] 4. In this invention, the limiting frame and the protrusion calibrate the position of the upper iron chip adsorbed by the upper suction cup group, correct the slight offset generated during the separation process, greatly improve the accuracy of subsequent lamination, and ensure the forming quality of transformer core lamination.

[0021] 5. In this invention, the middle layer iron chip and the lower layer iron chip are locked by a combination of pressing the top of the protrusion and lateral limiting of the limiting frame, so as to avoid displacement or falling off during the transportation process. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the placement component structure of the present invention; Figure 3 This is a schematic diagram of the robotic arm structure of the present invention; Figure 4 This is a schematic diagram of the adsorption component structure of the present invention; Figure 5This is a schematic diagram of the separation component structure of the present invention; Figure 6 This is a schematic diagram of the limiting component structure of the present invention; Figure 7 This is a schematic diagram of the limiting frame structure of the present invention.

[0023] In the diagram: 1. Placement component; 101. Workbench; 102. Stacking rack; 103. Storage platform; 104. Storage rack; 105. Spare platform; 2. Robotic arm; 3. Adsorption component; 301. Top frame; 302. Upper suction cup assembly; 4. Separation component; 401. Drive unit; 402. Base frame; 403. Lower suction cup assembly; 5. Limiting component; 501. Telescopic rod; 502. Connector; 503. Adjusting rod; 504. Limiting frame; 505. Protrusion. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] Example 1 This invention provides, for example Figures 1 to 7 The transformer core automatic lamination device shown includes a placement component 1, which includes a workbench 101 and a storage platform 103. A robotic arm 2 is fixedly installed above the workbench 101 and the robotic arm 2 transfers the laminations.

[0026] The placement component 1 also includes a stacking rack 102, the bottom of which is fixedly connected to the top of the workbench 101. The robotic arm 2 drives the upper suction cup group 302 to move and adsorb the upper iron chip through the top frame 301, and then stacks the chips in the stacking rack 102.

[0027] The storage rack 104 is fixedly connected to the top of the storage platform 103 at its bottom. The robotic arm 2 drives the upper suction cup group 302 to move through the top frame 301. The upper suction cup group 302 adsorbs the iron chip in the storage rack 104 and transfers it to the stacking rack 102. Single chip handling ensures that the stacked iron chip is pressed evenly and stably formed.

[0028] The storage platform 103 is located on the side of the workbench 101. A spare platform 105 is provided on the side of the workbench 101 for storing the transferred lower and middle iron chips. The iron chips to be assembled are stacked in the storage rack 104. The upper suction cup group 302 is aligned with the top of the stacked iron chips in the storage rack 104 and vacuum adsorbs the top of the stacked iron chips to transfer a single layer of iron chips.

[0029] The adsorption component 3 is located at the bottom of the output end of the robotic arm 2. It includes an upper suction cup assembly 302. The robotic arm 2 drives the upper suction cup assembly 302 to move and adsorb and transfer the iron chips placed on the storage platform 103 to the worktable 101 for stacking, thereby completing the required transfer process.

[0030] The adsorption assembly 3 also includes a top frame 301, the top of which is fixedly connected to the bottom output end of the robotic arm 2. The top of the upper suction cup assembly 302 is fixedly installed to the bottom of the top frame 301. The robotic arm 2 drives the upper suction cup assembly 302 to move through the top frame 301. The upper suction cup assembly 302 adsorbs the upper iron chip on the storage platform 103 and transfers it to the worktable 101 for stacking. The upper suction cup assembly 302 adsorbs and transfers the upper iron chip, realizing the orderly stacking of multiple layers of iron chips to form a standard transformer core assembly.

[0031] The separation component 4 is located on the side of the output end of the robotic arm 2. It includes a lower suction cup group 403. After the upper suction cup group 302 adsorbs the top of the upper iron chip and lifts it up, the lower suction cup group 403 adsorbs the bottom of the lower iron chip and moves laterally a preset distance to offset the lower iron chip, and then moves downward to peel off the lower iron chip; thus further realizing the separation process of the lower iron chip.

[0032] The separation assembly 4 also includes: a drive unit 401, one end of which is fixedly connected to the side of the output end of the robotic arm 2; a base frame 402, the bottom of which is fixedly connected to the output end of the drive unit 401; the bottom of the lower suction cup assembly 403 is fixedly installed to the top of the base frame 402; the drive unit 401 drives the lower suction cup assembly 403 to move through the base frame 402, and avoids the upper suction cup assembly 302 during the adsorption of the upper iron chip; after the upper suction cup assembly 302 adsorbs the top of the upper iron chip and lifts it, the drive unit 401 drives the lower suction cup assembly 403 to move to the bottom of the lower iron chip for adsorption through the base frame 402.

[0033] The drive unit 401 can use a conventional electric drive rotation structure. The output end of the electric drive rotation mechanism is fixedly connected to an electric push rod. The output end of the electric push rod is fixedly connected to the base frame 402 and the side wall, thereby realizing the position adjustment of the base frame 402 and the lower suction cup group 403 driven by the drive unit 401. In the initial case, the drive unit 401 drives the base frame 402 and the lower suction cup group 403 to the side of the upper suction cup group 302 to avoid affecting the normal adsorption and transfer of the upper suction cup group 302. At the same time, when the lower suction cup group 403 needs to work, the drive unit 401 drives the base frame 402 and the lower suction cup group 403 to move below the upper suction cup group 302 to adsorb the lower iron chip and move it laterally to offset it.

[0034] The lower suction cup assembly 403 and the adsorbed lower iron chip are moved laterally. Then, the lower suction cup assembly 403 moves downward to pull and peel off the lower iron chip, thus effectively separating the lower iron chip from the upper iron chip adsorbed by the upper suction cup assembly 302.

[0035] The upper suction cup group 302 adsorbs the upper layer of iron chip, i.e., a single layer of iron chip, and the lower suction cup group 403 adsorbs the lower layer of iron chip, i.e., a single layer of iron chip. There is also a middle layer of iron chip, i.e., multiple layers of iron chips, between the upper suction cup group 302 and the lower suction cup group 403.

[0036] The lower suction cup assembly 403 adsorbs the bottom of the lower iron chip and moves laterally, then moves downwards to separate and peel off the lower iron chip. When the lower suction cup assembly 403 moves laterally without separating the lower iron chip, the suction force of the lower suction cup assembly 403 on the bottom of the lower iron chip is increased. During the lateral movement of the lower suction cup assembly 403, the vacuum suction force of the lower suction cup assembly 403 is increased to ensure that the upper iron chip adsorbed by the upper suction cup assembly 302 and the lower iron chip adsorbed by the lower suction cup assembly 403 are effectively separated.

[0037] In summary, during use, the workbench 101 is equipped with a stacking rack 102 on top as a core stacking station. The storage rack 104 installed on the storage platform 103 on one side of the workbench 101 stacks the iron chips to be assembled. The robotic arm 2 mounted on the top of the workbench 101 is started. The output end of the robotic arm 2 drives the upper suction cup group 302 to move to the preset position through the top frame 301. The upper suction cup group 302 at the bottom of the top frame 301 is aligned with the top of the stacked iron chips in the storage rack 104.

[0038] Then, the upper suction cup assembly 302 moves down to the top surface of the stacked iron chips. At the same time, the upper suction cup assembly 302 starts vacuum adsorption of the stacked iron chips. Then, the robotic arm 2 lifts up the top layer of iron chips. At this time, the output end of the drive unit 401 drives the lower suction cup assembly 403 to move sideways through the base frame 402 to avoid the adsorption path of the upper suction cup assembly 302, so as to avoid affecting the adsorption of iron chips by the upper suction cup assembly 302.

[0039] Furthermore, the output end of the robotic arm 2 drives the upper suction cup group 302 and the adsorbed upper iron chip to move through the top frame 301. The robotic arm 2 smoothly transfers the iron core to the stacking rack 102 on the top of the worktable 101. After the alignment is completed, the upper suction cup group 302 drives the upper iron chip to fall smoothly to the preset position, and each preset position increases the height of one layer of iron chip compared to the previous one.

[0040] Simultaneously, the upper suction cup group 302 closes the vacuum adsorption to release the iron chip fixation, allowing the upper iron chips to be neatly stacked inside the stacking rack 102, completing a single stacking operation. The equipment can achieve orderly stacking of multiple upper iron chips layer by layer through repeated cycles to form a standard transformer core group, thereby ensuring uniform and stable pressing of the stacked iron chips and ensuring the quality of the transformer core formed by stacking iron chips. Furthermore, during the movement of the iron chips, the machine vision detection module set at the end of the robotic arm 2 obtains the position of each structure and adjusts the operation of each component accordingly to achieve precise control of adsorption and transfer.

[0041] During the vacuum adsorption process of the upper suction cup group 302, multiple layers of iron chips may adhere and stick together, causing the upper layer of iron chips to be lifted along with the upper layer of iron chips adsorbed by the upper suction cup group 302. After the robotic arm 2 drives the upper suction cup group 302 to adsorb the upper layer of iron chips and lift it away from the storage rack 104 via the top frame 301, the output end of the drive unit 401 drives the lower suction cup group 403 to move to the bottom of the lower layer of iron chips via the base frame 402, and starts the lower suction cup group 403 to vacuum adsorb the bottom of the lower layer of iron chips, thus forming a state in which the upper suction cup group 302 adsorbs the top of the upper layer of iron chips and the lower suction cup group 403 adsorbs the bottom of the lower layer of iron chips. The adsorption force of the lower suction cup group 403 is always less than that of the upper suction cup group 302 to avoid the upper layer of iron chips adsorbed by the upper suction cup group 302 from detaching.

[0042] After the lower suction cup assembly 403 adsorbs the bottom surface of the lower iron chip, the drive unit 401 drives the lower suction cup assembly 403 and the adsorbed lower iron chip to make lateral displacement through the base frame 402, so that the upper iron chip and the lower iron chip adsorbed by the upper suction cup assembly 302 and the lower suction cup assembly 403 are laterally misaligned by a preset distance. This distance is a preset distance and is less than the width of the iron chip itself, so as to avoid the iron chips from sliding against each other and causing scratches.

[0043] Because the upper and lower iron chips are misaligned, air can more easily enter between them and form a gap. Then, the lower suction cup group 403 moves downward and pulls and peels off the lower iron chip, thereby effectively separating the lower iron chip and ensuring that the single upper iron chip adsorbed by the upper suction cup group 302 enters the stacking rack 102 for stacking.

[0044] When the suction cup assembly 403 moves laterally, but the upper iron chip adsorbed by the upper suction cup assembly 302 and the lower iron chip adsorbed by the lower suction cup assembly 403 are not effectively separated, the vacuum adsorption force of the lower suction cup assembly 403 is increased to strengthen the adsorption and fixation force on the lower iron chip, ensuring the subsequent peeling of the upper iron chip adsorbed by the upper suction cup assembly 302 and the lower iron chip adsorbed by the lower suction cup assembly 403.

[0045] After the lower suction cup assembly 403 adsorbs the lower iron chip and separates it from the upper iron chip, the drive unit 401 drives the lower suction cup assembly 403 through the base frame 402 to move the lower iron chip to the top of the spare platform 105, and flips it over to place it on the spare platform 105 for subsequent reuse or centralized sorting.

[0046] Example 2 Based on the above embodiments, during the process of using the lower suction cup group 403 to drive the lower layer iron chip to move laterally first and then vertically for peeling, since there may be multiple sets of associated iron chips, that is, there are multiple middle layer iron chips connected between the upper layer iron chip adsorbed by the upper suction cup group 302 and the lower layer iron chip of the lower suction cup group 403, the lower suction cup group 403 moves laterally, driving the lower layer iron chip to move a preset distance. However, the middle layer iron chips may only move partially, resulting in the lower suction cup group 403 not effectively peeling off the middle layer iron chips during the subsequent downward movement. The middle layer iron chips are still attached to the upper layer iron chips adsorbed by the upper suction cup group 302, thus affecting the adsorption stability of the upper suction cup group 302, and even damaging the iron chips during the stacking process, causing the stacking failure; and the lower suction cup group 403 moves laterally... During the movement of the lower core by the displacement, the upper iron chip adsorbed by the upper suction cup group 302 may move laterally and deviate from the preset position due to friction. If the upper iron chip adsorbed by the upper suction cup group 302 is directly stacked, it may cause a large error, thus affecting the transformer core forming effect. Furthermore, during the transfer of the middle and lower iron chips with the lower suction cup group 403, the lower iron chip is adsorbed and fixed to the lower suction cup group 403, while the middle iron chip only relies on residual adsorption to maintain its contact with the lower iron chip. In some cases, the middle and lower iron chips may not even be adsorbed and attached. During the process of the lower suction cup group 403 moving above the standby platform 105 and being flipped, the middle iron chip may detach from the lower iron chip and fall off, causing damage.

[0047] To solve the above problems, an automatic lamination device for transformer cores further includes: a limiting component 5, which is disposed on the side of the separation component 4, including a limiting frame 504 and a protrusion 505, used to calibrate the position of the upper lamination of the upper core adsorbed by the upper suction cup group 302. When the middle core is misaligned with the upper core, the protrusion 505 moves downward and hooks down to peel off the middle core. When the middle core and the lower core are transferred with the lower suction cup group 403, the limiting frame 504 and the protrusion 505 press against the top edges of the middle core and the lower core, that is, the lower side of the protrusion 505 is in contact with the top surface of the middle core core core and presses it to limit the movement, ensuring the stability of the lower core and the middle core as they are transferred with the lower suction cup group 403.

[0048] The limiting component 5 also includes: a telescopic rod 501, one end of which is fixedly installed to the side of the base frame 402; a connector 502, the bottom of which is fixedly connected to the telescopic end of the telescopic rod 501, the inner side of the connector 502 is slidably connected to the side of the base frame 402, and the telescopic end of the telescopic rod 501 drives the connector 502 to move laterally along the side of the base frame 402, thereby further realizing the adjustment of the position of the connector 502.

[0049] The bottom of the adjusting rod 503 is fixedly connected to the top of the connecting piece 502. The bottom of the limiting frame 504 is fixedly connected to the telescopic end of the adjusting rod 503. The telescopic end of the adjusting rod 503 drives the limiting frame 504 and the protrusion 505 to move up and down for adjustment. The telescopic end of the adjusting rod 503 drives the fixed limiting frame 504 and the protrusion 505 to move vertically. The telescopic end of the telescopic rod 501 drives the fixed connecting piece 502 to move laterally. The connecting piece 502 drives the limiting frame 504 and the protrusion 505 to move laterally through the adjusting rod 503.

[0050] The limiting frame 504 limits and fixes the sides of the lower and middle iron chips. The side of the protrusion 505 is fixedly connected to the inner top of the limiting frame 504. The protrusion 505 hooks the middle iron chip downward to make it separate from the upper iron chip and merge with the lower iron chip for transfer processing.

[0051] In summary, during use, if the upper suction cup group 302 adsorbs multiple iron chips along with the upper iron chip, that is, the middle and lower iron chips are connected by electrostatic adsorption between multiple iron chips, and the lower suction cup group 403 adsorbs the lower iron chip but does not completely peel off the middle iron chip, the lateral displacement of the lower suction cup group 403 causes both the middle and lower iron chips to move laterally. The displacement distance of some middle iron chips is too small, resulting in the middle iron chips not being able to completely peel off the upper iron chip adsorbed by the upper suction cup group 302.

[0052] At this time, the extension end of the adjustment rod 503 drives the fixed limiting frame 504 and protrusion 505 to move upward. At the same time, the extension end of the extension rod 501 drives the fixed connector 502 to move laterally outward. The connector 502 drives the limiting frame 504 and protrusion 505 to move laterally outward through the adjustment rod 503 until the extension rod 501 and the adjustment rod 503 drive the protrusion 505 to move to the top edge of the middle layer iron chip. Then, the extension end of the adjustment rod 503 drives the fixed limiting frame 504 and protrusion 505 to move downward. The protrusion 505 hooks and peels off multiple middle layer iron chips and merges them with the lower layer iron chips adsorbed by the lower suction cup assembly 403.

[0053] When the lower suction cup assembly 403 moves the lower iron core laterally and causes the position of the upper iron chip adsorbed by the upper suction cup assembly 302 to shift, the telescopic end of the adjusting rod 503 drives the fixed limiting frame 504 and the protrusion 505 to move upward to the side of the upper iron chip adsorbed by the upper suction cup assembly 302. At the same time, the telescopic end of the telescopic rod 501 drives the fixed connecting piece 502 to move laterally, and the connecting piece 502 drives the limiting frame 504 and the protrusion 505 to move laterally through the adjusting rod 503, thereby causing the inner side of the limiting frame 504 and the protrusion 505 to push the upper iron chip adsorbed by the upper suction cup assembly 302 to move laterally.

[0054] At this point, the suction force of the upper suction cup assembly 302 on the upper iron chip disappears. However, since the limiting frame 504 clamps the upper iron chip on both sides, the upper iron chip will not fall off. Under the lateral force of the limiting frame 504 and the protrusion 505, the upper iron chip is partially laterally slid to calibrate the upper iron chip to the preset position. The upper suction cup assembly 302 then regains its suction force on the upper iron chip. The telescopic rod 501 and the adjusting rod 503 can then reset the limiting frame 504 and the protrusion 505.

[0055] When the lower layer iron chip and the middle layer iron chip are transferred with the lower suction cup assembly 403, the telescopic end of the telescopic rod 501 drives the fixed connector 502 to move laterally inward, and the connector 502 drives the limiting frame 504 and the protrusion 505 to move laterally inward through the adjusting rod 503, so that the limiting frame 504 clamps and limits the lower layer iron chip and the middle layer iron chip adsorbed on the top of the lower suction cup assembly 403, ensuring the stability of the middle layer iron chip and the lower layer iron chip during the transfer with the lower suction cup assembly 403.

[0056] Furthermore, the extension end of the adjusting rod 503 drives the fixed limiting frame 504 and the protrusion 505 to move downward, so that the lower side of the protrusion 505 fits and presses against the top surface of the middle layer iron chip, further ensuring the stability of the middle layer iron chip and the lower layer iron chip during the transfer process with the lower suction cup assembly 403.

[0057] The drive unit 401 moves the middle and lower iron chips above the base frame 402 and the lower suction cup assembly 403 to the standby stage 105. Then, the drive unit 401 drives the middle and lower iron chips above the base frame 402 and the lower suction cup assembly 403 to flip. During this process, the limiting frame 504 and the protrusion 505 clamp and limit the middle and lower iron chips. After flipping, the protrusion 505 is located at the bottom of the middle iron chip, ensuring that the middle and lower iron chips are placed stably after flipping, and avoiding the middle and lower iron chips from slipping and falling, which may cause safety hazards.

[0058] At this time, the adjusting rod 503 drives the limiting frame 504 and the protrusion 505 away from the moving middle layer iron chip and the lower layer iron chip, and the telescopic rod 501 drives the limiting frame 504 and the protrusion 505 to move laterally outward through the connector 502, so that the middle layer iron chip and the lower layer iron chip fall smoothly onto the standby table 105, waiting for subsequent centralized processing.

[0059] Repeat the above process to adsorb and transfer the iron chip.

[0060] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An automatic lamination device for transformer cores, comprising a placement assembly (1), the placement assembly (1) including a workbench (101) and a storage platform (103), wherein a robotic arm (2) is fixedly mounted above the workbench (101), characterized in that, Also includes: The adsorption component (3) is located at the bottom of the output end of the robotic arm (2), including an upper suction cup assembly (302). The robotic arm (2) drives the upper suction cup assembly (302) to move and adsorbs and transfers the iron chips placed on the storage platform (103) to the worktable (101) for stacking. The separation component (4) is located on the side of the output end of the robotic arm (2), including a lower suction cup group (403). After the upper suction cup group (302) adsorbs the top of the upper iron chip and lifts it up, the lower suction cup group (403) adsorbs the bottom of the lower iron chip and moves laterally a preset distance and offsets the lower iron chip, and then moves downward to peel off the lower iron chip. The limiting component (5), which is located on the side of the separating component (4), includes a limiting frame (504) and a protrusion (505) for calibrating the position of the upper iron chip adsorbed by the upper suction cup assembly (302). When the middle iron chip is misaligned with the upper iron chip, the protrusion (505) moves downward and hooks down to peel off the middle iron chip. When the middle iron chip and the lower iron chip are transferred with the lower suction cup assembly (403), the limiting frame (504) and the protrusion (505) press against the top edges of the middle iron chip and the lower iron chip.

2. The automatic lamination device for transformer cores according to claim 1, characterized in that, The adsorption component (3) further includes: The top of the top frame (301) is fixedly connected to the bottom output end of the robotic arm (2). The top of the upper suction cup assembly (302) is fixedly installed to the bottom of the top frame (301). The robotic arm (2) drives the upper suction cup assembly (302) to move through the top frame (301). The upper suction cup assembly (302) adsorbs the upper iron chip on the storage platform (103) and transfers it to the worktable (101) for stacking.

3. The automatic lamination device for transformer cores according to claim 1, characterized in that, The separation component (4) further includes: The drive unit (401) has one end fixedly connected to the side of the output end of the robotic arm (2); The bottom of the base frame (402) is fixedly connected to the output end of the drive unit (401). The bottom of the lower suction cup assembly (403) is fixedly installed to the top of the base frame (402). The drive unit (401) drives the lower suction cup assembly (403) to move through the base frame (402). After the upper suction cup assembly (302) adsorbs the top of the upper iron chip and lifts it, the drive unit (401) drives the lower suction cup assembly (403) to move to the bottom of the lower iron chip to adsorb through the base frame (402).

4. The automatic lamination device for transformer cores according to claim 1, characterized in that, The upper suction cup group (302) adsorbs the upper iron chip, i.e., the single-layer iron chip, and the lower suction cup group (403) adsorbs the lower iron chip, i.e., the single-layer iron chip. There is also a middle layer iron chip, i.e., multiple layers of iron chips, between the upper suction cup group (302) and the lower suction cup group (403).

5. The automatic lamination device for transformer cores according to claim 3, characterized in that, The limiting component (5) also includes: The telescopic rod (501) is fixedly installed at one end to the side of the base frame (402); The connector (502) is fixedly connected at its bottom to the telescopic end of the telescopic rod (501), and the inner side of the connector (502) is slidably connected to the side of the base frame (402). The telescopic end of the telescopic rod (501) drives the connector (502) to move laterally along the side of the base frame (402). The bottom of the adjusting rod (503) is fixedly connected to the top of the connector (502), and the bottom of the limiting frame (504) is fixedly connected to the telescopic end of the top of the adjusting rod (503). The telescopic end of the adjusting rod (503) drives the limiting frame (504) and the protrusion (505) to move up and down for adjustment.

6. The automatic lamination device for transformer cores according to claim 5, characterized in that, The limiting frame (504) limits and fixes the sides of the lower and middle iron chips, and the side of the protrusion (505) is fixedly connected to the inner top of the limiting frame (504).

7. The automatic lamination device for transformer cores according to claim 1, characterized in that, The placement component (1) further includes: The bottom of the stacking rack (102) is fixedly connected to the top of the workbench (101). The robotic arm (2) drives the upper suction cup group (302) to move and adsorb the upper iron chip in the stacking rack (102) through the top frame (301). The storage rack (104) is fixedly connected at its bottom to the top of the storage platform (103). The robotic arm (2) moves the upper suction cup assembly (302) through the top frame (301) and performs adsorption and transfer of the upper iron chip in the storage rack (104).

8. The automatic lamination device for transformer cores according to claim 1, characterized in that, The storage platform (103) is located on the side of the workbench (101), and a spare platform (105) is provided on the side of the workbench (101) for storing the transferred lower-layer iron chips and middle-layer iron chips on the spare platform (105).

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