A device for precisely controlling the temperature of a lower electrode and a method thereof, and a dry etching machine

Abstract

The application provides a device and a method for precisely controlling the temperature of a lower electrode, and a dry etching machine. The method comprises the following steps: a total temperature control sensing element on a total temperature control layer acquires overall temperature data of the lower electrode, and determines whether the overall temperature of the lower electrode is qualified according to the overall temperature data; if the overall temperature of the lower electrode is qualified, a regional temperature control sensing element at each monitoring point on a precise temperature control layer starts to acquire regional temperature data, and forms regional temperature adjustment information of the corresponding monitoring point according to the regional temperature data; and a regional temperature adjustment element performs regional temperature compensation processing on the region where the corresponding monitoring point is located according to the regional temperature adjustment information. The application sets the precise temperature control layer on the total temperature control layer, so as to realize the precise temperature control and local temperature adjustment of the lower electrode, and further improve the problem of local display brightness unevenness of the display panel.

Description

Technical Field

[0001] This application belongs to the field of display panel manufacturing technology, and more specifically, relates to a device and method for precise temperature control of the lower electrode, as well as a dry etching machine. Background Technology

[0002] Currently, flat panel displays are widely used in various industries, and the formation of array patterns in the display panel manufacturing process requires dry etching. In the dry etching process, the glass substrate, serving as the carrier, needs to be placed horizontally on the lower electrode of the dry etching process chamber. The glass substrate is in contact with the electrode, and plasma is coated between them. Etching is then completed under the action of the plasma. However, as the conductive coating (plasma) on the surface of the lower electrode is consumed, differences in heat transfer caused by electrode processing steps become apparent, leading to uneven display brightness in the display panel. Of course, pin holes within the substrate also contribute to uneven display brightness. Furthermore, temperature control of the lower electrode is only achieved through temperature control pipes and a circulating pump, and there is only one central temperature sensor, resulting in insufficient precision in temperature feedback and adjustment. Therefore, due to the processing stage difference of the lower electrode and the presence of pin holes in the substrate, the temperature control of the lower electrode is only accomplished through temperature control pipes and circulation pumps, and there is only one temperature sensor in the center. This results in incomplete temperature feedback and inaccurate adjustment of the lower electrode, which in turn easily leads to problems such as uneven display brightness caused by various temperature differences. Summary of the Invention

[0003] The purpose of this application is to provide a device for precisely controlling the temperature of the lower electrode, so as to solve the technical problem of uneven local display brightness of the display panel caused by insufficient precision in the temperature control and adjustment of the lower electrode in the prior art.

[0004] To achieve the above objectives, the technical solution adopted in this application is: a device for precisely controlling the temperature of a lower electrode, installed on a dry etching machine used in display panel manufacturing processes. The display panel includes a substrate, the dry etching machine includes a lower electrode, a plate-shaped lower electrode is stacked below the substrate, and a conductive coating is provided between the lower electrode and the substrate. The device for precisely controlling the temperature of the lower electrode includes:

[0005] The main temperature control layer is laid below the lower electrode and includes the main temperature control pipe and the main temperature control sensor located between the main temperature control pipe;

[0006] A precision temperature control layer, laid between the lower electrode and the main temperature control layer, includes a precision temperature control network, multiple zone temperature control sensors, and multiple zone temperature regulators. The precision temperature control network is grid-like, with the multiple zone temperature control sensors and multiple zone temperature regulators distributed intermittently within it.

[0007] The communication system, the overall temperature control, and the temperature control sensors for each zone are all connected to the host computer of the dry etching machine via the communication system.

[0008] Optionally, the precision temperature control network includes horizontal and vertical pipes, and each junction of the horizontal and vertical pipes is equipped with a zone temperature control sensor.

[0009] Optionally, an installation cavity is formed at the junction of the horizontal and vertical pipes, and the zone temperature control sensor is integrated and built into the installation cavity;

[0010] The zone temperature regulating element is located in the cavity of the horizontal and / or vertical pipes and is located near the zone temperature control sensor; or, the zone temperature regulating element is located in the mounting cavity.

[0011] Optionally, the lower electrode is divided into multiple plate areas, and the total temperature control layer includes multiple total temperature control pipes, each of which is laid under the plate area corresponding to its position.

[0012] The precision temperature control layer includes multiple precision temperature control pipe networks, each of which corresponds to a main temperature control pipe in its corresponding plate area.

[0013] Optionally, the main temperature control layer also includes a circulation pump, and the main temperature control pipeline includes an inlet and an outlet, which are respectively connected to the circulation pump; the main temperature control sensor is located in the middle of the main temperature control layer;

[0014] The precision temperature control network includes a grid-like network of metal pipes, with the metal pipes positioned to avoid the positions corresponding to the pin holes on the substrate.

[0015] This application also proposes a method for precisely controlling the temperature of a lower electrode, which is accomplished using the device for precisely controlling the temperature of a lower electrode as described above. The method for precisely controlling the temperature of a lower electrode includes the following steps:

[0016] The overall temperature control sensor on the overall temperature control layer acquires the overall temperature data of the lower electrode and determines whether the overall temperature of the lower electrode is qualified based on the overall temperature data.

[0017] If the overall temperature of the lower electrode is qualified, the area temperature control sensor at each monitoring point on the precision temperature control layer begins to acquire area temperature data and forms area temperature adjustment information for the corresponding monitoring point based on the area temperature data.

[0018] The regional temperature regulation component performs regional temperature compensation processing on the area where the corresponding monitoring point is located based on the regional temperature regulation information.

[0019] Optionally, the step of the overall temperature control sensor on the overall temperature control layer acquiring the overall temperature data of the lower electrode and determining whether the overall temperature of the lower electrode is qualified based on the overall temperature data includes:

[0020] The main temperature control pipe heats the lower electrode;

[0021] The overall temperature control sensor located in the middle of the overall temperature control layer monitors the temperature of the lower electrode and obtains the temperature data of the middle of the lower electrode as the overall temperature data of the lower electrode.

[0022] Compare the overall temperature data with the pre-stored standard temperature data;

[0023] If the overall temperature data is consistent with the standard temperature data, then the overall temperature of the lower electrode is considered to be qualified.

[0024] If the overall temperature data is inconsistent with the standard temperature data, it is determined that the overall temperature of the lower electrode is unqualified. The main temperature control pipeline needs to heat or cool the lower electrode again until the overall temperature data is consistent with the pre-stored standard temperature data.

[0025] Optionally, if the overall temperature of the lower electrode is qualified, the step of the area temperature control sensor at each monitoring point on the precision temperature control layer starting to acquire area temperature data and forming area temperature adjustment information for the corresponding monitoring point based on the area temperature data includes:

[0026] The temperature control sensor at each monitoring point measures the temperature at the corresponding monitoring point and obtains the regional temperature data at that monitoring point.

[0027] Compare the regional temperature data with the pre-stored standard temperature data;

[0028] If the regional temperature data is consistent with the standard temperature data, it is determined that the regional temperature at the inspection point is qualified and no regional temperature adjustment information is generated.

[0029] If the regional temperature data is inconsistent with the standard temperature data, it is determined that the regional temperature at that inspection point is unqualified, and the difference between the regional temperature data and the standard temperature data forms the regional temperature adjustment information.

[0030] Optionally, the process of the regional temperature regulating component performing regional temperature compensation processing on the area where the corresponding monitoring point is located based on regional temperature regulation information includes automatic compensation mode and / or manual compensation mode:

[0031] In automatic compensation mode, the steps for the area temperature regulator to perform area temperature compensation processing on the area where the corresponding monitoring point is located, based on the area temperature regulation information, include the following:

[0032] The main unit of the dry etching machine sends a start signal to the area temperature regulator at the corresponding monitoring point based on the generated area temperature regulation information.

[0033] After receiving the start signal, the zone temperature regulator automatically starts to heat the pipes in the corresponding monitoring point area;

[0034] The regional temperature control sensor measures the temperature at the corresponding monitoring point again, obtains the regional temperature data at that monitoring point, and sends it to the host of the dry etching machine.

[0035] The main unit of the dry etching machine compares the regional temperature data with the pre-stored standard temperature data;

[0036] If the two are consistent, it is determined that the temperature compensation treatment at the monitoring point is qualified, and the main unit of the dry engraving machine will automatically control the temperature adjustment component of the area to stop heating.

[0037] If the two are inconsistent, it is determined that the temperature compensation treatment at the monitoring point is unqualified, and the main unit of the dry engraving machine will automatically control the temperature adjustment component to continue heating until the temperature compensation treatment is qualified.

[0038] In manual compensation mode, the steps for the area temperature regulator to perform area temperature compensation processing on the area where the corresponding monitoring point is located, based on the area temperature regulation information, include the following:

[0039] The main unit of the dry engraving machine displays the regional temperature adjustment information of each monitoring point on the control screen. The staff can manually select the monitoring point that needs to be processed for regional temperature compensation based on the displayed regional temperature adjustment information.

[0040] The main unit of the dry etching machine sends a start signal to the temperature regulator of the area at the manually selected monitoring point;

[0041] The area temperature control sensor measures the temperature at the corresponding monitoring point again, obtains the area temperature data at the monitoring point, and sends it to the host of the dry etching machine. After judgment, it generates area temperature adjustment information that can be displayed on the control screen.

[0042] Based on the regional temperature adjustment information, the staff will select the monitoring points that need to undergo regional temperature compensation processing again.

[0043] Repeat the above steps until the control screen displays that the temperature compensation processing for all monitoring points is qualified.

[0044] This application also proposes a dry etching machine, characterized by including a device for precise temperature control of the lower electrode as described above.

[0045] The beneficial effects of the device and method for precise temperature control of the lower electrode provided in this application are as follows: Compared with the prior art, this application adds a precise temperature control layer below the overall temperature control layer of the device for precise temperature control of the lower electrode. This precise temperature control layer includes a grid-like precise temperature control network and multiple area temperature control sensors and area temperature regulators distributed at intervals within the precise temperature control network. Therefore, the precise temperature control layer has multiple monitoring points. Each monitoring point can monitor the temperature of its area through the area temperature control sensor located at that monitoring point. Then, the measured area temperature data is transmitted to the host of the dry etching machine through a communication system. Then, the host of the dry etching machine generates area temperature adjustment information based on the area temperature data and controls the area temperature regulator to adjust the area temperature of the corresponding monitoring point. In this way, precise temperature adjustment of the lower electrode can be achieved, that is, precise temperature control and local temperature adjustment of the lower electrode in dry etching. This allows for precise adjustment of the temperature of each point of the lower electrode, improving various display brightness unevenness problems caused by temperature differences in dry etching, and effectively improving the display effect of the display panel. Attached Figure Description

[0046] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0047] Figure 1 A schematic diagram of the overall temperature control layer of a device for precise temperature control of the lower electrode provided in an embodiment of this application;

[0048] Figure 2 A schematic diagram of the precise temperature control layer of a device for precise temperature control of the lower electrode provided in an embodiment of this application;

[0049] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0050] Figure 4 A flowchart of a method for precise temperature control of a lower electrode provided in an embodiment of this application;

[0051] Figure 5 A flowchart of step S1 of a method for precise temperature control of a lower electrode provided in an embodiment of this application;

[0052] Figure 6 A flowchart of step S2 of a method for precise temperature control of the lower electrode provided in an embodiment of this application.

[0053] Explanation of icon numbers:

[0054] label name label name 100 Total temperature control layer 200 Precision temperature control layer 210 Precision temperature control pipeline network 220 Longitudinal pipes 300 Pin hole 110 Main temperature control piping 120 Inlet 130 water outlet 230 Horizontal pipes Detailed Implementation

[0055] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0056] This application provides a device and method for precisely controlling the temperature of the lower electrode.

[0057] Please refer to Figures 1 to 3 In one embodiment of the present invention, the device for precise temperature control of the lower electrode is installed on a dry etching machine used in the manufacturing process of a display panel. The display panel includes a substrate, and the dry etching machine includes a lower electrode. The plate-shaped lower electrode is stacked below the substrate, and a conductive coating is provided between the lower electrode and the substrate. Specifically, the device for precise temperature control of the lower electrode includes a total temperature control layer 100, a precise temperature control layer 200, and a communication system. The total temperature control layer 100 is laid below the lower electrode and includes a total temperature control pipe 110 and a total temperature control sensor disposed between the total temperature control pipe 110. The precise temperature control layer 200 is laid between the lower electrode and the total temperature control layer 100. The precise temperature control layer 200 includes a precise temperature control network 210, multiple area temperature control sensors, and multiple area temperature regulators. The precise temperature control network 210 is in the form of a grid, and the multiple area temperature control sensors and multiple area temperature regulators are distributed at intervals in the precise temperature control network 210. The overall temperature control and the temperature control sensors for each area are all connected to the host computer of the dry etching machine via a communication system. In other words, from the bottom up, the layers stacked in the cross-section are the overall temperature control layer 100, the precision temperature control layer 200, the lower electrode, the plasma, and the substrate. The areas and positions of these layers are basically the same to facilitate the dry etching process on the substrate.

[0058] It should be noted that in the dry etching process, the glass substrate, serving as the carrier, needs to be placed horizontally on the lower electrode of the dry etching process chamber. The glass substrate is in contact with the electrode, and plasma is coated between them. Etching is then completed under the action of the plasma to form a predetermined array pattern. Specifically, the dry etching machine includes a reaction chamber, an upper electrode, and a lower electrode. Both the upper and lower electrodes are located in the reaction chamber. After the glass substrate is placed on the lower electrode, the reaction chamber is sealed. Then, a voltage is applied to the upper and lower electrodes, creating a potential difference between them, which causes plasma to move towards the glass substrate, completing the etching of the glass substrate. However, as the conductive coating (plasma) on the surface of the lower electrode is consumed, the heat transfer differences caused by the processing steps of the lower electrode become apparent, resulting in uneven brightness of the display panel. Specifically, when the glass substrate is placed on the lower electrode coated with a conductive coating, initially, conductivity is achieved through contact with the conductive coating. However, as the conductive coating is continuously consumed, due to the processing differences in the lower electrode, its surface appears microscopically as having some convex areas and others concave areas. In the microscopically convex areas, the lower electrode is in direct contact with the glass substrate; that is, heat conduction at these locations is direct contact conduction between the metal and the glass. In other words, heat transfer occurs through contact between the microscopically convex portion of the lower electrode and the glass substrate. In the microscopically concave areas, the surface of the lower electrode is not in contact with the glass substrate; a gap exists between them, and heat transfer occurs through the flow of He gas molecules. As is well known, the thermal conductivity of metal contact conduction and the thermal conductivity of gas flow conduction differ significantly, thus highlighting this difference in heat transfer. Of course, besides the differences in heat transfer caused by the processing steps of the lower electrode, the following, but not limited to, situations can also lead to differences in heat transfer: For example, at the pin holes in the glass substrate, contact issues can easily cause uneven display brightness on the display panel due to the pin holes 300; also, if there are foreign objects on the surface of the lower electrode, their presence can also cause a ring-shaped uneven display brightness. Furthermore, the temperature control of the lower electrode is only achieved through temperature control pipes and a circulation pump, with only a single central temperature sensor for temperature monitoring, which makes temperature feedback and adjustment inaccurate. Therefore, due to the processing steps of the lower electrode, the presence of pin holes 300 within the substrate, or foreign objects on the electrode surface, the temperature control of the lower electrode is only achieved through temperature control pipes and a circulation pump, with only a single central temperature sensor, resulting in incomplete temperature feedback and inaccurate adjustment of the lower electrode, which easily leads to various problems such as uneven display brightness caused by temperature differences.

[0059] It should also be noted that in this embodiment, the substrate is specifically a glass substrate, and the conductive coating on the surface of the lower electrode is specifically a Y2O3 (Yttrium(III) oxide) coating. This Y2O3 coating is a functional coating with various excellent properties, including high thermal stability, corrosion resistance, and good plasticity. It can also improve the oxidation resistance, corrosion resistance, and wear resistance of metals. Of course, in other embodiments, different plasmas, i.e., conductive coatings, can be used according to different process requirements. Furthermore, in this embodiment, the machining step difference of the lower electrode may originate from equipment tolerances, alignment tolerances, etc. To minimize the machining step difference on the surface of the lower electrode, methods such as physical grinding can also be used.

[0060] To address the aforementioned issues, in this embodiment, a precision temperature control layer 200 is added below the overall temperature control layer 100 of the precision temperature control lower electrode device. This precision temperature control layer 200 includes a grid-like precision temperature control network 210 and multiple area temperature control sensors and area temperature regulators spaced apart within the precision temperature control network 210. Therefore, the precision temperature control layer 200 has multiple monitoring points. Each monitoring point can monitor the temperature of its area through the area temperature control sensor located at that point. The measured area temperature data is then transmitted to the host computer of the dry etching machine via a communication system. The host computer of the dry etching machine then generates area temperature adjustment information based on the area temperature data and controls the area temperature regulator to adjust the area temperature of the corresponding monitoring point. This achieves precise temperature adjustment of the lower electrode, enabling precise temperature control and local temperature adjustment of the lower electrode during dry etching. This allows for precise temperature adjustment of each point on the lower electrode, improving various display brightness unevenness issues caused by temperature differences during dry etching and effectively enhancing the display panel's display effect.

[0061] Furthermore, in one embodiment, the precision temperature control network includes horizontal pipes 230 and vertical pipes 220, and a zone temperature control sensor is provided at the junction of each horizontal pipe 230 and vertical pipe 220. Figure 2 and Figure 3 As shown, in this embodiment, multiple horizontal pipes and multiple vertical pipes 220 are all straight pipes, which intersect to form a rectangular grid of precise temperature control pipes. Then, a zone temperature control sensor is installed at the junction of each pipe. In other words, each junction of a horizontal pipe 230 and a vertical pipe 220 is a monitoring point. The denser the grid, the more monitoring points there are, and the more accurate the temperature monitoring and adjustment. However, from a cost perspective, an excessively dense grid is unnecessary. Figure 2 and Figure 3The design shown represents a more optimized grid density. However, this design is not limited to this. In other embodiments, the grid of the precision temperature control network is not limited to rectangles; it can also be other shapes, such as, but not limited to, square grids or honeycomb grids. However, the rectangular grid in this embodiment has advantages such as ease of fabrication, convenient integration with temperature control sensors, and lower cost. Of course, in other embodiments, the horizontal pipe 230 and the vertical pipe 220 are not limited to straight pipes; they can also be curved pipes. The materials used for the pipes can be, but are not limited to, copper pipes.

[0062] Furthermore, in one embodiment, an installation cavity is formed at the junction of the transverse pipe 230 and the longitudinal pipe 220, and the area temperature control sensor is integratedly built into the installation cavity; the area temperature regulating component is disposed in the cavity of the transverse pipe 230 and / or the longitudinal pipe 220, and is disposed adjacent to the area temperature control sensor; or, the area temperature regulating component is disposed in the installation cavity. However, this design is not limited to this, and the area temperature control sensor can also be disposed separately from the transverse pipe 230 and / or the longitudinal pipe 220, for example, disposed within the area enclosed by the transverse pipe 230 and the longitudinal pipe 220. In this embodiment, the integrated design of the zone temperature control sensor within the mounting cavity formed at the junction of the transverse pipe 230 and the longitudinal pipe 220 effectively accommodates the zone temperature control sensor. This design simplifies the structure, maintains the flatness of the lower electrode, and allows cables connecting the various zone temperature regulators and sensors to be routed through the cavity. The positions of the zone temperature sensors and regulators are also easily fixed, preventing monitoring errors and temperature regulation problems caused by easy displacement of the sensors and regulators. It should be noted that the zone temperature regulator can be, but is not limited to, a heating wire. If the zone temperature regulator is located within the cavity of the transverse pipe 230 and / or the longitudinal pipe 220, it is preferable that one zone temperature regulator is integrated into the cavity of each pipe surrounding the zone temperature sensor to improve the uniformity of temperature regulation. If the zone temperature regulator is also located within the mounting cavity, it is preferable to separate it from the zone temperature sensor and place it as close as possible to the inner wall of the pipe to avoid affecting the zone temperature sensor and to improve heating efficiency.

[0063] Furthermore, in one embodiment, the lower electrode is divided into multiple plate regions, and the overall temperature control layer 100 includes multiple overall temperature control pipes 110, each of which is laid below the corresponding plate region. Correspondingly, the precision temperature control layer 200 includes multiple precision temperature control networks 210, each of which corresponds to an overall temperature control pipe 110 in its corresponding plate region. Specifically, as follows... Figure 1 and Figure 2As shown, in this embodiment, the lower electrode is divided into two regions arranged vertically. Correspondingly, the total temperature control layer 100 also includes two half-plate regions, each half-plate region being equipped with a total temperature control pipe 110. That is, the lower electrode achieves temperature control of the two half-plates through two-stage temperature control cycles. However, this design is not limited to this. In other embodiments, the total temperature control layer 100 can also be set as a single plate, and correspondingly, the precision temperature control layer 200 can also be set as a single plate. Of course, it can also be a design of a single plate total temperature control layer 100 plus multiple plates of precision temperature control pipe network 210, or a design of multiple plates of total temperature control layer 100 plus one plate of precision temperature control pipe network 210. The number of plates of the total temperature control layer 100 and the precision temperature control layer 200 can be the same or different, as long as it can achieve whole-plate temperature control heating of the lower electrode. In addition, in this embodiment, each total temperature control pipe 110 is arranged in a Z-shaped loop to increase the uniformity of temperature control heating of the lower electrode by the total temperature control pipe 110. Of course, in other embodiments, the main temperature control circuit can also be designed in other ways, which are not limited here.

[0064] Specifically, in one embodiment, the main temperature control layer 100 further includes a circulation pump, and the main temperature control pipe 110 includes an inlet 120 and an outlet 130, which are respectively connected to the circulation pump; the main temperature control sensor is located in the middle of the main temperature control layer 100. Figure 1 As shown, the main temperature control layer 100 includes upper and lower half-plate areas. To facilitate water inlet and outlet, the inlet 120 and outlet 130 of the main temperature control pipe 110 in each half-plate area are located near the center of the main temperature control layer 100 and are respectively located on the left and right sides. Furthermore, as... Figure 2 As shown, the precision temperature control network 210 includes metal pipes forming a grid, and the positions occupied by the metal pipes avoid the positions corresponding to the pin holes 300 on the substrate, thus avoiding adverse effects on the pin holes 300 on the glass substrate.

[0065] Based on the aforementioned design of the precise temperature control lower electrode device, this application also proposes a method for precise temperature control of the lower electrode, which is implemented using the aforementioned precise temperature control lower electrode device. Figure 4 As shown, in one embodiment, the method for precisely controlling the temperature of the lower electrode includes the following steps:

[0066] S1. The overall temperature control sensor on the overall temperature control layer 100 acquires the overall temperature data of the lower electrode and determines whether the overall temperature of the lower electrode is qualified based on the overall temperature data.

[0067] S2. If the overall temperature of the lower electrode is qualified, the area temperature control sensor at each monitoring point on the precision temperature control layer 200 begins to acquire area temperature data and forms area temperature adjustment information for the corresponding monitoring point based on the area temperature data.

[0068] S3. The regional temperature regulating component performs regional temperature compensation processing on the area where the corresponding monitoring point is located based on the regional temperature regulation information.

[0069] Refer to together Figures 1 to 3 In this method for precise temperature control of the lower electrode, the overall temperature of the lower electrode is first ensured to reach the required temperature through temperature monitoring and heating of the total temperature control layer 100. Then, the temperature difference at each point of the lower electrode is monitored by the added precise temperature control layer 200 to form regional temperature adjustment information. Then, the main unit of the lithography machine controls the corresponding regional temperature adjustment component to perform regional temperature compensation processing on the area where the monitoring point is located based on the regional temperature adjustment information. This enables precise temperature control and temperature compensation at each monitoring point, thereby improving various display brightness unevenness problems caused by temperature differences in dry etching and effectively improving the display effect of the display panel.

[0070] Here, the main temperature control sensor, the area temperature control sensor, and the area temperature regulator are all connected to the host computer of the dry etching machine through the aforementioned communication system. This information connection can be wireless or wired. The communication system can include, but is not limited to, a signal receiving module and a signal transmitting module, or a signal transceiver module that integrates both.

[0071] Furthermore, such as Figure 5 As shown, in one embodiment, the step of the overall temperature control sensor on the overall temperature control layer 100 acquiring the overall temperature data of the lower electrode and determining whether the overall temperature of the lower electrode is qualified based on the overall temperature data includes:

[0072] S11, the main temperature control pipe 110 heats the lower electrode;

[0073] S12. The total temperature control sensor located in the middle of the total temperature control layer 100 monitors the temperature of the lower electrode and obtains the temperature data of the middle of the lower electrode as the overall temperature data of the lower electrode.

[0074] S13. Compare the overall temperature data with the pre-stored standard temperature data;

[0075] S14. If the overall temperature data is consistent with the standard temperature data, the overall temperature of the lower electrode is deemed to be qualified.

[0076] S15. If the overall temperature data is inconsistent with the standard temperature data, it is determined that the overall temperature of the lower electrode is unqualified. The main temperature control pipe 110 needs to heat or cool the lower electrode again until the overall temperature data is consistent with the pre-stored standard temperature data.

[0077] Specifically, this step first uses the main temperature control pipe 110 to initially heat the lower electrode, instead of first using the precision temperature control layer 200. This is because the main temperature control pipe 110 is usually present in the original equipment and can basically heat the lower electrode to the predetermined temperature, although it is not as precise in temperature control and adjustment for small areas. The pipe network design of the precision temperature control layer 200 is more suitable for temperature control in smaller areas, aiming to achieve heating of small areas, but its heating efficiency is not as good as the original main temperature control pipe 110. Then, the main temperature control sensor detects the temperature in the middle of the lower electrode; here, the main temperature control sensor is located in the middle to obtain more accurate overall temperature data of the lower electrode. Then, the overall temperature data is sent to the host of the lithography machine through the communication system. The host of the lithography machine compares the overall temperature data with the pre-stored standard temperature data to determine whether the overall temperature of the lower electrode is qualified. If the judgment result is qualified, the process of precise temperature control adjustment through the precise temperature control layer 200 will proceed directly. If the judgment result is qualified, the lower electrode needs to be heated by the main temperature control pipe 110 until the overall temperature data is consistent with the pre-stored standard temperature data, that is, the overall temperature of the lower electrode is judged to be qualified, before the subsequent precise temperature control adjustment process can proceed.

[0078] Alternatively, in other embodiments, if the overall temperature control sensor has its own related chip, the overall temperature control sensor can directly compare the acquired temperature data with the standard temperature data pre-stored in the chip to determine whether the overall temperature of the lower electrode is qualified, and send the relevant judgment result to the host of the lithography machine. Then, the host of the lithography machine will implement the next step of operation based on the judgment result.

[0079] Furthermore, in one embodiment, if the overall temperature of the lower electrode is qualified, the step of the area temperature control sensor at each monitoring point on the precision temperature control layer 200 starting to acquire area temperature data and forming area temperature adjustment information for the corresponding monitoring point based on the area temperature data includes:

[0080] S21. The temperature control sensor at each monitoring point measures the temperature at the corresponding monitoring point and obtains the regional temperature data at that monitoring point.

[0081] S22. Compare the regional temperature data with the pre-stored standard temperature data;

[0082] S23. If the area temperature data is consistent with the standard temperature data, it is determined that the area temperature at the inspection point is qualified and no area temperature adjustment information is generated.

[0083] S24. If the area temperature data is inconsistent with the standard temperature data, it is determined that the area temperature at the inspection point is unqualified. The difference between the area temperature data and the standard temperature data forms the area temperature adjustment information.

[0084] Specifically, in this step, once the overall temperature of the lower electrode reaches the predetermined temperature, the temperature control sensors at all monitoring points first monitor the temperature of their respective monitored areas. Then, the monitored area temperature data is compared with pre-stored standard temperature data to determine whether it is qualified. If the area temperature at the monitoring point is determined to be qualified, no area temperature adjustment information is generated. If the lithography machine's main unit does not receive area temperature adjustment information within the predetermined time, it can automatically determine that no temperature compensation adjustment is needed at that monitoring point, and the area temperature adjustment device at that monitoring point will not be activated. If the area temperature at the monitoring point is determined to be unqualified, area temperature adjustment information, including the temperature difference, is sent to the dry lithography machine's main unit, and subsequent temperature compensation is then performed. This cycle continues until the area temperature at the monitoring point is determined to be qualified.

[0085] Here, since the goal is to achieve precise temperature control of the lower electrode, the temperature of the lower electrode should ideally be consistent. That is, the pre-stored standard temperature data is predetermined, and the regional temperature data at each monitoring point must be compared with the same standard temperature data. Of course, if the process requires different standards for the temperature of different regions of the lower electrode, then multiple pre-stored standard temperature data sets are needed, each matching a corresponding monitoring point. Furthermore, in other embodiments, if the regional temperature control sensor has its own chip, the comparison and judgment of relevant data can also be automatically completed by the regional temperature control sensor, and the judgment results can be sent to the host computer of the lithography machine.

[0086] Furthermore, it's important to note that the actual temperature at each monitoring point may not be exactly the same; some temperatures may be higher than others. Therefore, the resulting regional temperature regulation information will differ. For monitoring points with higher temperatures, the difference between the regional temperature data and the standard temperature data will be smaller, resulting in less subsequent temperature compensation and a shorter heating time for the regional temperature regulation components. Conversely, for monitoring points with lower temperatures, the difference will be larger, leading to greater subsequent temperature compensation and a longer heating time for the regional temperature regulation components. Of course, there's also the possibility that a monitoring point's temperature monitoring result is initially deemed acceptable, but during subsequent monitoring, the temperature may drop. In this case, the conditions for generating regional temperature regulation information are triggered, and the area temperature at that monitoring point will be judged as unacceptable, requiring subsequent temperature compensation processing. Of course, a less common situation may occur where the zone temperature regulator overheats temporarily, causing the zone temperature data at a certain monitoring point to be higher than the pre-stored standard temperature data. In this case, zone temperature regulation information is also generated and sent to the host of the dry etching machine. However, the host of the dry etching machine will determine based on this special situation that although the zone temperature at the monitoring point is unqualified, it is higher than the pre-stored standard temperature. Therefore, in subsequent steps, the host of the dry etching machine will not send a start signal to the zone temperature regulator at that monitoring point. The zone temperature regulator does not need to be started, but waits for its temperature to drop until it matches the pre-stored standard temperature data.

[0087] Furthermore, in one embodiment, the step of the regional temperature regulating component performing regional temperature compensation processing on the region where the corresponding monitoring point is located based on regional temperature regulation information includes an automatic compensation mode and / or a manual compensation mode:

[0088] In automatic compensation mode, the steps for the area temperature regulator to perform area temperature compensation processing on the area where the corresponding monitoring point is located, based on the area temperature regulation information, include the following:

[0089] The main unit of the dry etching machine sends a start signal to the area temperature regulator at the corresponding monitoring point based on the generated area temperature regulation information.

[0090] After receiving the start signal, the zone temperature regulator automatically starts to heat the pipes in the corresponding monitoring point area;

[0091] The regional temperature control sensor measures the temperature at the corresponding monitoring point again, obtains the regional temperature data at that monitoring point, and sends it to the host of the dry etching machine.

[0092] The main unit of the dry etching machine compares the regional temperature data with the pre-stored standard temperature data;

[0093] If the two are consistent, it is determined that the temperature compensation treatment at the monitoring point is qualified, and the main unit of the dry engraving machine will automatically control the temperature adjustment component of the area to stop heating.

[0094] If the two are inconsistent, it is determined that the temperature compensation treatment at the monitoring point is unqualified, and the main unit of the dry engraving machine will automatically control the temperature adjustment component to continue heating until the temperature compensation treatment is qualified.

[0095] Specifically, for a given monitoring point, the temperature control component at that location only heats up after receiving a start signal from the dry etching machine's main unit. Furthermore, the degree of temperature compensation is determined by the relevant information sent to that monitoring point, achieving truly individual control for each monitoring point. This effectively improves the accuracy of temperature control and helps reduce various issues such as uneven display brightness caused by temperature differences. In other words, after the initial temperature monitoring of all monitoring points, some areas may require temperature compensation, while others may not. Then, after temperature compensation for these areas, some areas may still require further temperature compensation, and this cycle continues until the temperature compensation for all monitoring points is satisfactory.

[0096] In manual compensation mode, the steps for the area temperature regulator to perform area temperature compensation processing on the area where the corresponding monitoring point is located, based on the area temperature regulation information, include the following:

[0097] The main unit of the dry engraving machine displays the regional temperature adjustment information of each monitoring point on the control screen. The staff can manually select the monitoring point that needs to be processed for regional temperature compensation based on the displayed regional temperature adjustment information.

[0098] The main unit of the dry etching machine sends a start signal to the temperature regulator of the area at the manually selected monitoring point;

[0099] The area temperature control sensor measures the temperature at the corresponding monitoring point again, obtains the area temperature data at the monitoring point, and sends it to the host of the dry etching machine. After judgment, it generates area temperature adjustment information that can be displayed on the control screen.

[0100] Based on the regional temperature adjustment information, the staff will select the monitoring points that need to undergo regional temperature compensation processing again.

[0101] Repeat the above steps until the control screen displays that the temperature compensation processing for all monitoring points is qualified.

[0102] Specifically, unlike the automatic compensation mode, the manual compensation mode first sends the temperature adjustment information measured at each monitoring point to the main unit of the dry etching machine and displays it on the control screen. Then, the operator manually selects which areas need temperature compensation based on the displayed temperature information. During this process, the temperature compensation may not be completed at all monitoring points in one go; it may require multiple cycles to achieve the desired result.

[0103] In the precise temperature control method for the lower electrode of this application, the compensation mode can be automatic, manual, or a combination of both. The monitoring time interval can be set according to actual needs. While automatic compensation offers advantages of automation and speed, it may experience monitoring or adjustment failures due to damage to the zone temperature control sensor or regulator, or communication system malfunctions. Manual compensation, though less convenient, allows operators to better understand the specific temperature control situation and make more appropriate judgments. Furthermore, having both automatic and manual compensation modes avoids the need to switch directly to manual compensation mode in case of automatic mode failure, thus preventing disruption to normal production.

[0104] This application also proposes a dry etching machine for the dry etching process in the manufacturing of display panels, which is a type of flat panel display production equipment. The dry etching machine includes a device for precisely temperature-controlled lower electrode as described above, a flat lower electrode for etching the glass substrate, and a conductive coating, commonly known in the industry as plasma, on the surface of the lower electrode. In the dry etching process, the glass substrate is placed horizontally on the lower electrode in the dry etching process chamber, and etching is completed under the action of plasma, thereby forming a preset array pattern. The specific structure of the device for precisely temperature-controlled lower electrode is as described in the above embodiments. Since this dry etching machine adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0105] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A device for precisely controlling the temperature of a lower electrode, mounted on a dry etching machine used in a display panel manufacturing process, the display panel including a substrate, the dry etching machine including a lower electrode, the plate-shaped lower electrode being stacked below the substrate, and a conductive coating being provided between the lower electrode and the substrate, characterized in that... The device for precisely controlling the lower electrode includes: The overall temperature control layer, laid below the lower electrode, includes an overall temperature control pipe and an overall temperature control sensor disposed between the overall temperature control pipes; A precision temperature control layer is laid between the lower electrode and the overall temperature control layer. The precision temperature control layer includes a precision temperature control network, multiple zone temperature control sensors, and multiple zone temperature regulating components. The precision temperature control network is grid-like, and the multiple zone temperature control sensors and multiple zone temperature regulating components are spaced apart within the precision temperature control network. The communication system connects the total temperature control and each of the zone temperature control sensors to the host computer of the dry etching machine.

2. The device for precise temperature control of the lower electrode as described in claim 1, characterized in that, The precise temperature control network includes horizontal pipes and vertical pipes, and each junction of the horizontal pipes and the vertical pipes is equipped with a regional temperature control sensor.

3. The device for precise temperature control of the lower electrode as described in claim 2, characterized in that, An installation cavity is formed at the junction of the transverse pipe and the longitudinal pipe, and the area temperature control sensor is integrated and built into the installation cavity; The area temperature regulating component is disposed in the cavity of the transverse pipe and / or the longitudinal pipe, and is located adjacent to the area temperature control sensor; or, the area temperature regulating component is disposed in the mounting cavity.

4. The device for precise temperature control of the lower electrode as described in claim 2, characterized in that, The lower electrode is divided into multiple plate areas, and the total temperature control layer includes multiple total temperature control pipes, each of which is laid below the corresponding plate area. The precision temperature control layer includes multiple precision temperature control pipe networks, and each of the precision temperature control pipe networks corresponds to the position of a total temperature control pipe in its corresponding plate area.

5. The device for precise temperature control of the lower electrode as described in claim 2, characterized in that, The overall temperature control layer also includes a circulation pump, and the overall temperature control pipeline includes an inlet and an outlet, which are respectively connected to the circulation pump; the overall temperature control sensor is located in the middle of the overall temperature control layer; The precision temperature control network includes metal pipes forming a grid, and the positions occupied by the metal pipes avoid the positions corresponding to the pin holes on the substrate.

6. A method for precisely controlling the temperature of a lower electrode, characterized in that, The method for precisely controlling the temperature of the lower electrode, as described in any one of claims 1 to 5, comprises the following steps: The overall temperature control sensor on the overall temperature control layer acquires the overall temperature data of the lower electrode and determines whether the overall temperature of the lower electrode is qualified based on the overall temperature data. If the overall temperature of the lower electrode is qualified, the area temperature control sensor at each monitoring point on the precision temperature control layer begins to acquire area temperature data and forms area temperature adjustment information for the corresponding monitoring point based on the area temperature data. The regional temperature regulating component performs regional temperature compensation processing on the area where the corresponding monitoring point is located based on the regional temperature regulation information.

7. The method for precisely controlling the temperature of the lower electrode as described in claim 6, characterized in that, The step of acquiring the overall temperature data of the lower electrode from the overall temperature control layer and determining whether the overall temperature of the lower electrode is qualified based on the overall temperature data includes: The main temperature control pipe heats the lower electrode; The overall temperature control sensor located in the middle of the overall temperature control layer monitors the temperature of the lower electrode and obtains the temperature data of the middle of the lower electrode as the overall temperature data of the lower electrode; The overall temperature data is compared with the pre-stored standard temperature data; If the overall temperature data is consistent with the standard temperature data, then the overall temperature of the lower electrode is deemed to be qualified. If the overall temperature data is inconsistent with the standard temperature data, it is determined that the overall temperature of the lower electrode is unqualified. The overall temperature control pipeline needs to heat or cool the lower electrode again until the overall temperature data is consistent with the pre-stored standard temperature data.

8. The method for precisely controlling the temperature of the lower electrode as described in claim 6, characterized in that, If the overall temperature of the lower electrode is qualified, the regional temperature control sensor at each monitoring point on the precision temperature control layer begins to acquire regional temperature data, and forms regional temperature adjustment information for the corresponding monitoring point based on the regional temperature data, including: The temperature control sensor at each monitoring point measures the temperature at the corresponding monitoring point and obtains the temperature data of the area at that monitoring point. The temperature data of the region is compared with the pre-stored standard temperature data; If the temperature data of the area is consistent with the standard temperature data, it is determined that the temperature of the area at the inspection point is qualified, and no temperature adjustment information for the area is generated. If the regional temperature data is inconsistent with the standard temperature data, it is determined that the regional temperature at the inspection point is unqualified, and the difference between the regional temperature data and the standard temperature data forms the regional temperature adjustment information.

9. The method for precisely controlling the temperature of the lower electrode as described in claim 6, characterized in that, The steps of the regional temperature regulation component performing regional temperature compensation processing on the corresponding monitoring point area based on the regional temperature regulation information include automatic compensation mode and / or manual compensation mode: In the automatic compensation mode, the step of the area temperature regulator performing area temperature compensation processing on the area where the corresponding monitoring point is located based on the area temperature regulation information includes the following steps: The main unit of the dry etching machine sends a start signal to the area temperature regulating component at the corresponding monitoring point based on the generated area temperature regulation information. After receiving the start signal, the temperature regulating component automatically starts to heat the pipes in the corresponding monitoring point area. The temperature control sensor in the area measures the temperature at the corresponding monitoring point again, obtains the temperature data of the area at that monitoring point, and sends it to the host of the dry etching machine. The main unit of the dry etching machine compares the temperature data of the area with the pre-stored standard temperature data; If the two are consistent, it is determined that the temperature compensation treatment of the area at the monitoring point is qualified, and the main unit of the dry engraving machine automatically controls the area temperature regulating component to stop heating; If the two are inconsistent, it is determined that the temperature compensation treatment of the area at the monitoring point is unqualified, and the main unit of the dry engraving machine automatically controls the area temperature regulating component to continue heating until the area temperature compensation treatment is qualified. In the manual compensation mode, the step of the area temperature regulator performing area temperature compensation processing on the area where the corresponding monitoring point is located based on the area temperature regulation information includes the following steps: The main unit of the dry etching machine displays the temperature adjustment information of the area at each monitoring point on the control screen. The operator can manually select the monitoring point that needs to be processed for temperature compensation based on the displayed temperature adjustment information. The main unit of the dry etching machine sends a start signal to the temperature regulator of the area at the manually selected monitoring point; The temperature control sensor measures the temperature at the corresponding monitoring point again, obtains the temperature data of the area at the monitoring point, and sends it to the host of the dry etching machine. After judgment, it generates the temperature adjustment information of the area that can be displayed on the control screen. Based on the regional temperature adjustment information, the staff will select the monitoring points that need to undergo regional temperature compensation processing again. Repeat the above steps until the control screen displays that the temperature compensation processing of all monitoring points in the area is qualified.

10. A dry engraving machine, characterized in that, The device includes a precision temperature-controlled lower electrode as described in any one of claims 1 to 6.

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