Tab heat management structure and battery pack

CN122800812APending Publication Date: 2026-09-22FARASIS TECH (GANZHOU) CO LTD
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Patent Information

Application Number
CN202611074862.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-07-20
Publication Date
2026-09-22

AI Technical Summary

Technical Problem

若极耳产生的热量不能及时散出,会导致局部温度急剧升高,进而引发一系列问题:一方面,高温会加速极耳根部胶粘剂的老化失效,降低焊接点的机械强度与电气连接可靠性;另一方面,过高的极耳温度可能诱发热失控风险,严重制约了电池系统的快充性能与安全边界

Benefits of technology

1、本发明引入了受温度驱动的第一调节柱和第二调节柱,利用形状记忆合金等材料的相变特性,构建了“温度-热导率”的闭环反馈机制,当极耳温度超过预设阈值时,调节柱自动动作增大接触压力或减小间隙,从而动态降低界面热阻,而在低温常态下则保持适当间隙以适应装配公差并减少不必要的热传导;

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides an electrode lug thermal management structure and a battery pack, and relates to the technical field of batteries.A kind of electrode lug thermal management structure, comprising: electrode lug;Electrode lug support, first adjusting column is provided on electrode lug support, one end of first adjusting column is connected with electrode lug support, the other end of first adjusting column is connected with electrode lug;Wherein, the length of first adjusting column is affected by temperature, when the temperature of first adjusting column is higher than threshold value, first adjusting column acts, increase the contact pressure between electrode lug and electrode lug support, the thermal conductivity between electrode lug and electrode lug support increases.The application introduces the first adjusting column and the second adjusting column driven by temperature, utilizes the phase change characteristics of shape memory alloy and other materials, constructs the closed-loop feedback mechanism of "temperature-thermal conductivity", when the electrode lug temperature exceeds the preset threshold value, adjusting column automatically acts to increase contact pressure or reduce gap, so as to dynamically reduce interface thermal resistance.
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Description

Technical Field

[0001] This invention belongs to the field of battery technology, specifically relating to a tab thermal management structure and a battery pack. Background Technology

[0002] With the rapid development of the new energy vehicle industry, the performance of the power battery, as a core component, directly determines the vehicle's range, charging efficiency, and safety. Among various battery packaging forms, pouch batteries are increasingly widely used in electric vehicles and other fields due to their advantages such as high energy density, high safety, and design flexibility. However, as the market demands higher vehicle charging efficiency, fast charging technology gradually becomes more widespread, and battery power density continues to increase, posing more stringent challenges to battery thermal management systems.

[0003] During battery charging and discharging, especially under high-current fast charging conditions, the tabs often become significant heat accumulation points in the battery module due to their highly concentrated current density and relatively high contact resistance. If the heat generated by the tabs cannot be dissipated in time, it will cause a sharp rise in local temperature, leading to a series of problems: on the one hand, high temperatures will accelerate the aging and failure of the adhesive at the base of the tabs, reducing the mechanical strength and electrical connection reliability of the weld; on the other hand, excessively high tab temperatures may induce thermal runaway risks, severely restricting the fast charging performance and safety limits of the battery system.

[0004] In existing technologies, thermal management solutions for battery modules mainly focus on cooling the cell body (i.e., the large surface area of ​​the cell), such as conducting heat dissipation through liquid cooling plates attached to the large surface area of ​​the cell. However, conventional technologies often have significant shortcomings for the tabs, a critical heat-generating area. Existing tab cooling typically relies on natural air convection within the module or limited heat conduction only through tab connectors (such as busbars). This traditional cooling method suffers from drawbacks such as long heat dissipation paths, high thermal resistance, and low heat exchange efficiency, making it difficult to effectively cope with the instantaneous high heat load in the tab area during fast charging. Furthermore, existing structures lack a dynamic response mechanism for tab temperature changes, failing to intelligently adjust heat dissipation capabilities at different temperature rise stages and making it difficult to prevent reverse heat flow in the heat dissipation path, resulting in poor thermal management performance.

[0005] Therefore, there is an urgent need to develop a new type of electrode thermal management structure to solve the technical problems of low electrode heat dissipation efficiency, inability to adapt to high heat loads during fast charging, and lack of dynamic thermal regulation capabilities in existing technologies. Summary of the Invention

[0006] The purpose of this invention is to address the aforementioned problems in the prior art by proposing a battery cell tab structure.

[0007] The objective of this invention can be achieved through the following technical solution: a tab thermal management structure, comprising: Extreme ear; A tab support, wherein a first adjustment post is provided on the tab support, one end of the first adjustment post is connected to the tab support, and the other end of the first adjustment post is connected to the tab. The length of the first adjusting column is affected by temperature. When the temperature of the first adjusting column is higher than the threshold, the first adjusting column elongates, increasing the contact pressure between the electrode tab and the electrode tab support, and increasing the thermal conductivity between the electrode tab and the electrode tab support.

[0008] As a further improvement of the present invention, the electrode bracket includes a heat-conducting shell and a heat-absorbing block disposed in the heat-conducting shell, and the heat-conducting shell and the heat-absorbing block are detachably connected.

[0009] As a further improvement of the present invention, at least one side of the heat-conducting shell is provided with a dovetail groove and a positioning hole, and at least one side of the heat-absorbing block is provided with a dovetail boss and a positioning boss. The dovetail groove and the dovetail boss are in a concave-convex fit, and the positioning boss is inserted into the positioning hole.

[0010] As a further improvement of the present invention, the heat-absorbing block is provided with at least one sealed cavity, and the sealed cavity is filled with a phase change material.

[0011] As a further improvement of the present invention, the electrode lug includes a first bent portion extending in a vertical direction and a second bent portion extending in a horizontal direction, the first bent portion and the second bent portion are connected, the electrode lug bracket includes a first wall surface and a second wall surface connected together, the first wall surface abuts against the first bent portion, the second wall surface abuts against or is welded to the second bent portion, and the first adjusting column is disposed on the first wall surface.

[0012] The present invention also provides a battery pack including the above-described electrode thermal management structure.

[0013] As a further improvement of the present invention, it also includes a liquid cooling plate and a thermally conductive adhesive layer. The liquid cooling plate is vertically disposed on the side of the tab. The tab support also includes a third wall surface, which is disposed at the end of the first wall surface and the second wall surface and is perpendicular to the first wall surface and the second wall surface. A gap is provided between the liquid cooling plate and the third wall surface, and the thermally conductive adhesive layer fills the gap.

[0014] As a further improvement of the present invention, the electrode thermal management structure further includes a second adjusting column, one end of which is connected to the third wall surface and the other end of which is connected to the liquid cooling plate. The length of the second adjusting column is affected by temperature. When the temperature of the second adjusting column is higher than a threshold, the second adjusting column extends, reducing the gap between the third wall surface and the liquid cooling plate, and increasing the thermal conductivity between the liquid cooling plate and the electrode support.

[0015] As a further improvement of the present invention, a thermal diode layer is provided on the surface of the third wall and the surface of the second adjusting column. The thermal diode layer has a first thermal conductivity in the direction from the third wall to the liquid cooling plate and a second thermal conductivity in the direction from the liquid cooling plate to the third wall. The first thermal conductivity is greater than the second thermal conductivity.

[0016] As a further improvement of the present invention, the electrode thermal management structure further includes a buffer module, the buffer module being configured as a sheet-like phase change material, the buffer module being disposed at the root of the electrode and / or the first bend, and the buffer module being connected to the liquid cooling plate.

[0017] Based on the above technical solution, the present invention can produce at least the following technical effects: 1. This invention introduces a first and second regulating column driven by temperature. By utilizing the phase change characteristics of materials such as shape memory alloys, a closed-loop feedback mechanism of "temperature-thermal conductivity" is constructed. When the electrode temperature exceeds the preset threshold, the regulating column automatically increases the contact pressure or reduces the gap, thereby dynamically reducing the interface thermal resistance. At low temperature and normal conditions, an appropriate gap is maintained to adapt to assembly tolerances and reduce unnecessary heat conduction. 2. This invention constructs a dual-synergistic heat dissipation system of "active guidance + passive buffering," significantly enhancing its resistance to thermal shock. On one hand, the thermally conductive shell, in conjunction with the liquid cooling plate and thermally conductive adhesive layer, establishes a low-thermal-resistance active and rapid guidance channel from the tabs to the coolant, responsible for continuously dissipating steady-state heat. On the other hand, the phase change material located at the root of the tabs absorbs instantaneous pulse heat using the latent heat of solid-liquid phase change, playing a "peak-shaving and valley-filling" thermal buffering role. The synergistic work of both not only increases the overall heat dissipation limit but also smooths out the temperature fluctuation rate, enabling the battery system to safely support higher charging rates and extend its service life under high-power conditions. 3. The tab bracket of the present invention adopts a detachable connection between the heat-conducting shell and the heat-absorbing block. Through the precise cooperation of the dovetail groove and the positioning boss, it not only ensures the high-precision positioning and stable connection between components, but also facilitates later maintenance and replacement and independent packaging of phase change materials. At the same time, the thermally conductive adhesive layer fills the tiny gap between the tab bracket and the liquid cooling plate, effectively absorbing the thermal stress caused by the difference in the thermal expansion coefficient of the materials, and avoiding structural fatigue or cracking caused by long-term thermal cycling. 4. The present invention sets a thermal diode layer at the connection interface between the electrode bracket and the liquid cooling plate, and utilizes its anisotropic thermal conductivity to achieve unidirectional and efficient heat transfer from the electrode side to the liquid cooling plate side. Attached Figure Description

[0018] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the electrode thermal management structure of the present invention.

[0020] Figure 2 yes Figure 1 A magnified view of a section at point A.

[0021] Figure 3 yes Figure 2 AA sectional view.

[0022] Figure 4 This is a schematic diagram of the electrode holder in this invention.

[0023] Figure 5 This is an exploded view of the electrode bracket in this invention.

[0024] Figure 6 This is a top view of the electrode heat management structure of the present invention.

[0025] Figure 7 yes Figure 6 A magnified view of section B.

[0026] Figure 8 yes Figure 7 BB cross-sectional view.

[0027] Figure 9 This is a cross-sectional view of the electrode heat management structure of the present invention.

[0028] Figure 10 This is a front view of the heat-conducting shell in this invention.

[0029] Figure 11 yes Figure 10 CC section view.

[0030] Figure 12 yes Figure 10 DD sectional view.

[0031] In the figure, 100 is the battery cell body; 110 is the electrode tab; 111 is the first bend; 112 is the second bend; 200 is the electrode tab bracket; 210 is the heat-conducting shell; 211 is the positioning hole; 212 is the dovetail groove; 213 is the first wall surface; 214 is the second wall surface; 215 is the third wall surface; 216 is the first adjusting column; 217 is the second adjusting column; 220 is the heat-absorbing block; 221 is the positioning boss; 222 is the dovetail boss; 223 is the sealing cavity; 230 is the thermal diode layer; 300 is the liquid cooling plate; 310 is the gap; and 400 is the buffer module. Detailed Implementation

[0032] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the attached figures). If the specific posture changes, the directional indication will also change accordingly. Furthermore, descriptions involving "first," "second," or "a" in the present invention are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. In the description of the present invention, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly defined. In the present invention, unless otherwise explicitly specified and defined, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components or the interaction between two components, unless otherwise explicitly defined. For those skilled in the art, the specific meanings of the above terms in this invention can be understood according to the specific circumstances. Furthermore, the technical solutions of the various embodiments of this invention can be combined with each other, but only on the basis that those skilled in the art can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0033] The following are specific embodiments of the present invention, in conjunction with the appendix. Figure 1-12 The technical solution of the present invention will be further described below, but the present invention is not limited to the following embodiments.

[0034] This embodiment provides a tab thermal management structure and a battery pack including the structure, aiming to solve the technical problems of low heat dissipation efficiency, lag in thermal response, and lack of dynamic thermal regulation capability in the tab 110 area of ​​the existing soft-pack battery under fast charging conditions.

[0035] In this embodiment, the tab thermal management structure, as one of the core components of the battery pack thermal management system, is housed within the battery casing. The battery casing contains multiple battery modules arranged side-by-side. An integrated liquid cooling plate 300 is vertically positioned between adjacent battery modules. The liquid cooling plate 300 is fixed to the battery casing by welding or riveting and interconnected via internal piping to form a coolant circulation loop. Each battery module includes at least one pouch cell, a tab bracket 200 for supporting and positioning the tabs 110, and the aforementioned liquid cooling plate 300. The tabs 110 of the pouch cell extend from the cell body 100 and are bent, precisely positioned and supported by the tab bracket 200 to prevent displacement or short circuits during vibration or thermal expansion. To achieve efficient and intelligent thermal management of the tab 110 area, this embodiment constructs a composite heat dissipation system integrating active rapid guidance and passive buffering temperature equalization.

[0036] Specifically, the tab bracket 200 is not a simple insulating support component, but is designed as a heat dissipation hub with multiple functions. The tab bracket 200 mainly consists of two parts: a heat-conducting shell 210 and a heat-absorbing block 220 embedded in the heat-conducting shell 210, which are detachably connected. The advantage of this split design is that the heat-conducting shell 210 can be made of high-strength, high-thermal-conductivity aluminum alloy to undertake the dual tasks of structural support and heat transfer, while the heat-absorbing block 220 can focus on the encapsulation and thermal buffering functions of the phase change material, making it easy to manufacture, replace, and maintain independently. In terms of assembly structure, at least one mating surface of the heat-conducting shell 210 is precision-machined with a dovetail groove 212 and a positioning hole 211. Correspondingly, the corresponding surface of the heat-absorbing block 220 is provided with a matching dovetail boss 222 and a positioning boss 221. During installation, the dovetail boss 222 slides into the dovetail groove 212 to prevent detachment and limit positioning, and the positioning boss 221 is inserted into the positioning hole 211 to achieve precise centering. This mechanical interlocking structure with concave and convex fits ensures the stability and positional accuracy of the connection between the heat-absorbing block 220 and the heat-conducting shell 210.

[0037] The heat absorber block 220 has at least one sealed cavity 223 inside, which is filled with phase change material after being strictly sealed. The selection of the phase change material is determined based on the expected temperature rise range during battery fast charging. When the temperature of the tab 110 rises and transfers heat to the heat absorber block 220, the phase change material absorbs latent heat and undergoes a solid-liquid phase change, thereby storing a large amount of heat energy without significant temperature rise, playing a crucial thermal buffering role and effectively suppressing the instantaneous temperature surge of the tab 110.

[0038] To establish an efficient thermal path from the tab 110 to the cooling system, this embodiment includes a first adjusting post 216 on the tab support 200. One end of the first adjusting post 216 is fixedly connected to the tab support 200, specifically to the surface of the heat-conducting housing 210, while the other end abuts against or connects to the tab 110. A key feature of the first adjusting post 216 is that its length is affected by temperature; specifically, it is made of a shape memory alloy with a first phase transition temperature set at approximately 40°C. Under normal temperature or low-load conditions, the first adjusting post 216 is in a contracted state, maintaining a moderate contact pressure between the tab 110 and the tab support 200. This ensures basic electrical insulation and mechanical support while preventing excessive stress damage to the tab 110. However, when the battery enters a high-current fast-charging mode, and the temperature of the tab 110 gradually rises and exceeds the 40°C threshold, the first adjusting post 216 is triggered by heat to undergo a phase transition, elongating axially and generating a force. This force is directly converted into contact pressure between the tab 110 and the tab support 200. The increase in interfacial contact pressure can significantly reduce the micro-gap 310 and increase the actual contact area, thereby causing a non-linear increase in the thermal conductivity between the tab 110 and the tab support 200. This means that the more severe the heat generation, the stronger the conductivity of the heat dissipation channel, achieving adaptive adjustment of heat dissipation performance. At this time, the heat generated by the tab 110 is quickly conducted into the tab support 200 and temporarily absorbed and stored by the internal phase change material, preventing heat from accumulating locally on the tab 110.

[0039] In this embodiment, the tab 110 includes a first bent portion 111 extending vertically and a second bent portion 112 extending horizontally, which are smoothly connected. Correspondingly, the tab support 200 is designed with a connected first wall surface 213 and a second wall surface 214. The first wall surface 213 abuts against the first bent portion 111 of the tab 110, and the second wall surface 214 abuts against or is fixedly connected to the second bent portion 112 of the tab 110 by means of laser welding or other methods. The first adjustment column 216 is disposed on the first wall surface 213, specifically for pressure adjustment and heat conduction enhancement of the vertical section of the tab 110.

[0040] In addition, to further reduce the thermal stress concentration at the root of the tab 110 and provide additional thermal buffering, this embodiment also includes a buffer module 400. The buffer module 400 is a sheet-like phase change material attached to the root of the tab 110 and the outer surface of the first bend 111, commonly known as the "tab air pocket". The coverage area of ​​this sheet-like phase change material at least includes the area with the highest current density and the most concentrated heat generation, and its outer side is directly connected to the liquid cooling plate 300 or coupled to the liquid cooling plate 300 through a thermally conductive interface material.

[0041] The tab support 200 also includes a third wall surface 215, which is vertically connected to the ends of the first wall surface 213 and the second wall surface 214, forming an extension structure of the tab support 200 towards the liquid cooling plate 300. A small gap 310 is reserved between the third wall surface 215 and the vertically arranged liquid cooling plate 300, and this gap 310 is filled with a thermally conductive adhesive layer. After the thermally conductive adhesive layer cures, it forms a solid thermally conductive medium with a thickness controlled between 0.05 mm and 0.5 mm. The ingenuity of this design lies in the fact that it is not used for rigid bonding and fixation, but rather provides a certain degree of flexibility to accommodate assembly tolerances and differences in the coefficients of thermal expansion between different materials while ensuring extremely low thermal resistance and heat conduction, thus avoiding the risk of stress cracking that may be caused by rigid connections.

[0042] Based on this, a second adjusting column 217 is also provided between the third wall surface 215 and the liquid cooling plate 300. One end of the second adjusting column 217 is connected to the third wall surface 215, and the other end is connected to the liquid cooling plate 300. It is also made of shape memory alloy, but its second phase change temperature is set at 45°C, which is higher than the 40°C of the first adjusting column 216. This stepped phase change temperature design constructs a graded thermal management logic: when the temperature of the tab 110 rises to 40°C, the first adjusting column 216 acts first to enhance the heat conduction from the tab 110 to the support, using the phase change material to absorb heat and buffer; if the heating continues to intensify and the temperature further rises to 45°C, the second adjusting column 217 acts accordingly to reduce the gap 310 between the third wall surface 215 and the liquid cooling plate 300, or even push the two to fit tightly together, thereby significantly reducing the interfacial thermal resistance between the support and the liquid cooling plate 300, and quickly pumping the heat stored in the phase change material and the heat generated in real time to the liquid cooling plate 300, where it is carried away by the flowing coolant. This strategy perfectly matches the dynamic change curve of heat load during fast charging, avoiding energy waste caused by the cooling system running at full power too early, and also preventing temperature overshoot caused by heat dissipation lag.

[0043] To prevent adverse reverse heat flow in the heat dissipation path, this embodiment also provides a thermal diode layer 230 on the surfaces of the third wall 215 and the second adjusting column 217. The thermal diode layer 230 is a composite coating material with anisotropic thermal conductivity, prepared by a spray curing process. It has a high first thermal conductivity in the direction from the third wall 215 to the liquid cooling plate 300, and a low second thermal conductivity in the opposite direction, with the first thermal conductivity being significantly greater than the second thermal conductivity. During normal heat dissipation, heat flows smoothly to the liquid cooling plate 300 along the direction of high thermal conductivity; however, when the liquid cooling system is shut down, the coolant temperature rises, or the ambient temperature is higher than the temperature of the tab 110, the high reverse thermal resistance of the thermal diode layer 230 can effectively prevent heat from flowing back from the liquid cooling plate 300 to the tab support 200 and the phase change material.

[0044] The electrode thermal management structure provided in this embodiment comprehensively manages the heat generation of the electrode 110 through two collaborative paths during battery charging and discharging, especially during high-current fast charging. Path one is an active and rapid conduction path: heat is conducted to the heat absorber 220 through the contact interface between the electrode 110 and the thermally conductive shell 210, and then efficiently transferred to the liquid cooling plate 300 through the extension of the liquid cooling plate 300 and the thermally conductive adhesive layer of the micro-gap 310, and finally carried away by the coolant. This path has low thermal resistance and fast response, and is mainly responsible for handling continuous steady-state heat generation and the later discharge of peak heat load. Path two is a passive buffering and temperature equalization path: the phase change material in the electrode air bag and the heat absorber 220 absorbs instantaneous pulse heat, stores latent heat through solid-liquid phase change, and suppresses rapid temperature rise. At the same time, it continuously releases heat to the cooling system through the contact interface with the liquid cooling plate 300. This path focuses on peak shaving and valley filling, reducing the damage of instantaneous thermal shock to the cell and connectors. The two paths coordinate with each other in time and space. The first regulating column 216 and the second regulating column 217 act as intelligent valves, dynamically adjusting the on / off state and flow rate of the two paths based on temperature feedback. The thermal diode layer 230 acts as a one-way valve to ensure the orderly and directional transmission of heat flow. This systematic design, which combines multi-threshold stepped control, unidirectional heat transfer by thermal diodes, and embedded phase change materials, breaks through the limitations of traditional tab 110 heat dissipation relying on air convection or busbar conduction. It tightly couples the heat source of tab 110 with the liquid cooling source through an ultra-short path and variable thermal resistance, achieving a leap in heat dissipation efficiency.

[0045] It should be noted that the above embodiments are merely illustrative examples of the technical solution of the present invention, and not restrictive limitations. For example, the phase change temperatures of the first regulating column 216 and the second regulating column 217 can be adjusted according to the specific cell system and fast charging strategy, and are not limited to 40℃ and 45℃; the shape memory alloy can also be replaced with other temperature-sensitive driving materials; the dovetail groove 212 connection method can be replaced with a buckle, bolt or other detachable fastening form; the attachment position and area of ​​the sheet phase change material can also be flexibly arranged according to the simulation optimization results.

[0046] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A tab thermal management structure, characterized in that, include: Polar ear (110); A tab support (200) is provided with a first adjusting post (216), one end of the first adjusting post (216) is connected to the tab support (200), and the other end of the first adjusting post (216) is connected to the tab (110). The length of the first adjusting column (216) is affected by temperature. When the temperature of the first adjusting column (216) is higher than the threshold, the first adjusting column (216) elongates, increasing the contact pressure between the tab (110) and the tab support (200), and increasing the thermal conductivity between the tab (110) and the tab support (200).

2. The electrode thermal management structure according to claim 1, characterized in that, The tab support (200) includes a heat-conducting shell (210) and a heat-absorbing block (220) disposed in the heat-conducting shell (210), and the heat-conducting shell (210) and the heat-absorbing block (220) are detachably connected.

3. The electrode thermal management structure according to claim 2, characterized in that, The heat-conducting housing (210) has a dovetail groove (212) and a positioning hole (211) on at least one side, and the heat-absorbing block (220) has a dovetail boss (222) and a positioning boss (221) on at least one side. The dovetail groove (212) and the dovetail boss (222) are in concave-convex fit, and the positioning boss (221) is inserted into the positioning hole (211).

4. The electrode thermal management structure according to claim 2, characterized in that, The heat-absorbing block (220) is provided with at least one sealed cavity (223), and the sealed cavity (223) is filled with a phase change material.

5. The electrode thermal management structure according to claim 1, characterized in that, The electrode tab (110) includes a first bent portion (111) extending in a vertical direction and a second bent portion (112) extending in a horizontal direction. The first bent portion (111) and the second bent portion (112) are connected. The electrode tab support (200) includes a first wall surface (213) and a second wall surface (214) connected together. The first wall surface (213) abuts against the first bent portion (111), and the second wall surface (214) abuts against or is welded to the second bent portion (112). The first adjusting column (216) is disposed on the first wall surface (213).

6. A battery pack comprising the tab thermal management structure according to any one of claims 1-5.

7. The battery pack according to claim 6, characterized in that, It also includes a liquid cooling plate (300) and a thermally conductive adhesive layer. The liquid cooling plate (300) is vertically disposed on the side of the tab (110). The tab support (200) also includes a third wall surface (215). The third wall surface (215) is disposed at the end of the first wall surface (213) and the second wall surface (214) and is perpendicular to the first wall surface (213) and the second wall surface (214). A gap (310) is provided between the liquid cooling plate (300) and the third wall surface (215). The thermally conductive adhesive layer fills the gap (310).

8. The battery pack according to claim 7, characterized in that, The electrode thermal management structure further includes a second adjusting column (217), one end of which is connected to the third wall surface (215), and the other end of which is connected to the liquid cooling plate (300). The length of the second adjusting column (217) is affected by temperature. When the temperature of the second adjusting column (217) is higher than the threshold, the second adjusting column (217) extends, reducing the gap (310) between the third wall surface (215) and the liquid cooling plate (300), and increasing the thermal conductivity between the liquid cooling plate (300) and the electrode bracket (200).

9. The battery pack according to claim 8, characterized in that, A thermal diode layer (230) is provided on the surface of the third wall (215) and the second adjusting column (217). The thermal diode layer (230) has a first thermal conductivity in the direction from the third wall (215) to the liquid cooling plate (300) and a second thermal conductivity in the direction from the liquid cooling plate (300) to the third wall (215). The first thermal conductivity is greater than the second thermal conductivity.

10. The battery pack according to claim 6, characterized in that, The electrode thermal management structure further includes a buffer module (400), which is configured as a sheet-like phase change material. The buffer module (400) is disposed at the root of the electrode (110) and / or the first bend (111), and the buffer module (400) is connected to the liquid cooling plate (300).