Wireless beam nickel-free sheet integrated slave bcs module acquisition structure and battery module

Abstract

The application belongs to the technical field of lithium batteries, and particularly relates to a wireless beam nickel-free sheet integrated slave control type BCS module acquisition structure and a battery module. The wireless beam nickel-free sheet integrated slave control type BCS module acquisition structure comprises an acquisition branch sheet, a blister support, an aluminum row, a slave plate BMU and a slave plate BMU fixing support. The aluminum row is fixedly arranged on the blister support. An FPC is arranged on the blister support. Voltage sampling lines, temperature sampling lines and daisy chain communication lines are etched on the FPC. The slave plate BMU is arranged above the blister support through the slave plate BMU fixing support. The second solder pad is directly connected with the first solder pad through laser tin soldering. The first end of one part of the acquisition branch sheet is connected with the FPC, and the second end is welded on the aluminum row. The first end of the other acquisition branch sheet is connected with the slave plate BMU, and the second end is welded on the aluminum row. The application realizes the improvement of the space utilization rate of the battery pack, the weight reduction of the whole battery pack and the cost reduction of materials.

Description

Technical Field

[0001] This invention belongs to the field of lithium battery technology, specifically relating to a wireless, nickel-free integrated slave-controlled BCS module acquisition structure and battery module. Background Technology

[0002] The electric vehicle industry is currently facing continuous pressure to increase integration and reduce material costs. As the core component of electric vehicles, the internal structural design of the power battery system directly affects the space utilization, cost control, and lightweighting level of the entire vehicle. The battery module typically uses a CCS (Cells Contact System) to collect the voltage and temperature signals of the module and transmit them to the slave board BMU (Battery Management Unit).

[0003] In existing CCS data acquisition solutions, the slave board BMU is typically located on one side of the module end board along a certain direction. This layout occupies space in that direction within the battery pack. Furthermore, securing and protecting the slave board BMU requires additional brackets and housings, further encroaching on the already limited space within the battery pack. In addition, communication between slave boards relies on twisted-pair daisy-chain harnesses, the arrangement and securing of which also require space within the pack and additional fixing structures.

[0004] To address the aforementioned issues, some technical solutions have attempted improvements through integrated design. For example, CN223427538U discloses a highly integrated secondary battery management board and battery module, integrating the analog front-end circuitry onto the CCS, eliminating the need for a separate slave control board and the adapter harness for analog signal transmission. Yutong Bus Co., Ltd.'s patent CN219286493U proposes integrating all components from the slave control module onto the FPC, eliminating the connector between the CSC chip and the FPC, and using wireless communication to transmit collected battery data, thus eliminating the need for a communication harness. Furthermore, an EVE Energy patent integrates the bracket for mounting the CCS module and the bracket for mounting the BMS board into one unit, allowing the CCS module to be directly electrically connected to the BMS board.

[0005] However, the aforementioned existing technologies still have the following shortcomings: First, although existing patents have integrated the control function into the CCS or FPC (Flexible Printed Circuit), the arrangement of the slave board BMU as an independent circuit board and the required slave board BMU fixing brackets, protective shells and other auxiliary structural components have not been effectively eliminated, and the space occupation problem of the slave board in the battery pack has not been fundamentally solved.

[0006] Secondly, communication between boards still relies on separate communication harnesses or wireless communication modules. While wireless communication eliminates physical harnesses, it increases the cost of wireless modules and raises concerns about communication reliability; while in wired solutions, the arrangement and fixing of communication harnesses still occupy space within the package and increase material costs. Summary of the Invention

[0007] The purpose of this invention is to provide a wireless, nickel-free integrated slave-controlled BCS module acquisition structure and battery module, thereby achieving the goals of saving battery pack space, reducing weight, and lowering costs.

[0008] To achieve the above objectives, the present invention provides the following technical solution: This invention provides a wireless, nickel-free integrated slave-controlled BCS module acquisition structure, characterized in that it includes: an acquisition branch plate, a vacuum-formed bracket, an aluminum busbar, a slave board BMU, and a slave board BMU fixing bracket; The aluminum strip is fixedly mounted on the vacuum forming bracket; The FPC is disposed on the blister bracket, and voltage sampling lines, temperature sampling lines and daisy-chain communication lines are etched on the FPC. The FPC is provided with a first pad. The slave board BMU is mounted above the vacuum forming bracket via a slave board BMU fixing bracket. The slave board BMU is provided with a second pad, and the second pad is directly connected to the first pad by laser soldering. One portion of the acquisition branch piece has its first end connected to the FPC and its second end welded to the aluminum busbar, while the other acquisition branch piece has its first end connected to the slave board BMU and its second end welded to the aluminum busbar.

[0009] Preferably, the daisy-chain communication lines are arranged in an "S" shape on the FPC, and the "S" shape is used to reduce electromagnetic interference between the CAN high signal line and the CAN low signal line.

[0010] Preferably, the bottom surface of the slave plate BMU7 is directly sprayed with a fire-resistant, heat-insulating, and insulating coating, which is sandwiched between the slave plate BMU7 and the vacuum forming bracket, and is used to replace the independent mica sheet disposed between the slave plate BMU7 and the vacuum forming bracket.

[0011] Preferably, the second end of the acquisition branch is fixed to the aluminum busbar by ultrasonic welding, and the acquisition branch is used to replace the independent voltage acquisition nickel plate.

[0012] Preferably, it also includes an external signal connector, which is disposed on the FPC or the blister bracket and is used to connect and cooperate with an external communication harness.

[0013] Preferably, the external signal connector includes a daisy-chain input connector and a daisy-chain output connector, which are respectively plugged into the input and output interfaces of the external communication harness.

[0014] Preferably, the slave plate BMU is a bare plate structure without an independent protective shell. The slave plate BMU is fixed above the blister bracket by the slave plate BMU fixing bracket, and there is no independent shell or bracket structure between the slave plate BMU and the blister bracket.

[0015] Preferably, the slave plate BMU fixing bracket is fixedly disposed on the upper end surface of the blister bracket, and the slave plate BMU is fixed above the slave plate BMU fixing bracket.

[0016] Preferably, the FPC includes multiple sub-FPCs, each of which has its own line etching design based on the arrangement position of the slave board BMU, and the daisy-chain communication lines on each of the sub-FPCs are connected in series with each slave board BMU.

[0017] The present invention also discloses a battery module, including the aforementioned wireless nickel-free integrated slave-controlled BCS module acquisition structure.

[0018] The beneficial effects of this invention are as follows: This invention eliminates the BMU shell, the slave board BMU fixing bracket, the slave board communication harness and the harness slave board BMU fixing bracket, and uses laser soldering direct soldering process to replace the connector between the slave board and the FPC, and the acquisition branch plate to replace the independent nickel sheet, thereby improving the space utilization rate of the battery pack, reducing the overall weight of the pack and reducing material costs; in addition, the fire-resistant and heat-insulating coating sprayed on the bottom of the slave board replaces the independent mica sheet, further achieving lightweighting. At the same time, the daisy-chain communication lines on the FPC adopt S-shaped routing, which effectively reduces the electromagnetic interference between CAN signal lines under planar wiring conditions and ensures communication reliability. Attached Figure Description

[0019] Figure 1 This is a perspective view of the present invention; Figure 2 This is a partially enlarged view of the present invention; Figure 3 This is a three-dimensional view of the branch slices acquired in this invention; Figure 4 This is an assembly diagram of the slave plate BMU and the slave plate BMU fixing bracket in this invention; Figure 5 This is a perspective view of the vacuum forming support in this invention; Figure 6 This is an enlarged view of the vacuum forming bracket in this invention; Figure 7 This is an enlarged view of the FPC in this invention; Figure 8 This is a perspective view of the aluminum busbar in this invention; Figure 9 This is a diagram showing the daisy-chain communication line layout on the FPC in this invention. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to specific embodiments. The following embodiments are for illustrative purposes only and are not intended to limit the scope of protection of this invention. Any modifications, equivalent substitutions, or improvements made based on the concept of this invention are within the scope of protection of this invention.

[0021] like Figures 1 to 9 As shown, this embodiment provides a wireless, nickel-free integrated slave-controlled BCS module acquisition structure.

[0022] like Figure 1 and Figure 2 As shown, the acquisition structure mainly includes: acquisition branch plate 1, daisy chain input connector 2, daisy chain output connector 3, blister bracket 4, FPC 5, aluminum busbar 6, slave board BMU 7, and slave board BMU fixing bracket 8.

[0023] The vacuum-formed bracket 4 serves as the supporting base for the entire acquisition structure, and its shape matches the top contour of the battery module. The upper surface of the vacuum-formed bracket 4 is provided with several mounting slots and positioning structures for mounting the aluminum busbar 6, FPC 5, and the slave board BMU fixing bracket 8.

[0024] Aluminum busbars 6 are fixedly mounted on the vacuum forming bracket 4. The number and arrangement of aluminum busbars 6 correspond to the positions of the battery cells' terminals in the battery module. Aluminum busbars 6 are fixed to the corresponding mounting slots in the vacuum forming bracket 4 by heat riveting or snap-fit. The lower end face of aluminum busbars 6 is used for welding or bolting to the battery cell terminals, and the upper end face is used for welding to the data acquisition branch plate 1.

[0025] FPC5 is mounted on the vacuum-formed bracket 4. FPC5 is etched with voltage sampling lines, temperature sampling lines, and daisy-chain communication lines. FPC5 also has a first solder pad. FPC5 is etched using various designs based on the placement of the slave board BMU7 to meet the needs of different module layouts.

[0026] like Figure 3As shown, the acquisition branch 1 is a standardized etched FPC branch structure, formed through an etching process. The acquisition branch 1 is fixed to the aluminum busbar 6 by ultrasonic welding for voltage sampling. Specifically, the welding head of the ultrasonic welding machine is aligned with the overlapping area between the acquisition branch 1 and the aluminum busbar 6, and ultrasonic vibration is applied to achieve a metallurgical bond between the two in a solid state. The acquisition branch 1 directly replaces the traditional independent voltage acquisition nickel sheet, eliminating the need for nickel sheet material and its welding process with the FPC.

[0027] The acquisition branch 1 comprises several components. One portion of the acquisition branch 1 is connected at one end to the FPC5 and soldered at the other end to the aluminum busbar 6, used to transmit the voltage signal on the aluminum busbar 6 to the first pad of the FPC5 via the etched lines on the FPC5. Another acquisition branch 1 is connected at one end to the slave board BMU7 and soldered at the other end to the aluminum busbar 6, used to directly transmit the voltage signal on the aluminum busbar 6 to the slave board BMU7.

[0028] An NTC thermistor is connected to the end of the temperature sampling line on FPC5. The NTC thermistor is attached near aluminum busbar 6 or on the surface of the cell to collect the cell's temperature signal. The voltage and temperature sampling signals are transmitted to the first pad through etched lines on FPC5.

[0029] The slave board BMU7 is mounted above the vacuum forming bracket 4 via the slave board BMU fixing bracket 8. The slave board BMU7 is a bare board structure without a separate housing; its circuit board integrates the control chip of the battery management unit, the analog front-end chip, the CAN communication transceiver, and related peripheral circuits. The slave board BMU7 has a second pad, corresponding to the first pad on the FPC5. The slave board BMU7 and the FPC5 are connected via a laser soldering direct bonding process: a laser beam is focused on the overlapping area of ​​the first and second pads, melting the solder paste or solder wire to form a solder joint, achieving electrical connection and mechanical fixation. This direct bonding process eliminates the traditional connector insertion method, reducing contact impedance and material costs.

[0030] like Figure 4 As shown, the BMU mounting bracket 8 is fixedly mounted on the upper surface of the blister packer 4. The BMU mounting bracket 8 is fixed to the blister packer 4 by screws, clips, or heat riveting. The BMU 7 is fixed above the BMU mounting bracket 8, so that the BMU 7 is located in the height direction of the blister packer 4. There is no separate outer shell or additional support structure between the BMU 7 and the blister packer 4.

[0031] A fire-resistant, heat-insulating, and insulating coating is directly sprayed onto the bottom surface of panel BMU7. This coating uses a ceramic-based high-temperature resistant insulating paint with a thickness of 0.1 mm to 0.5 mm. Before spraying, the bottom surface of panel BMU7 is cleaned and roughened. After spraying, it is cured at high temperature to form a dense insulating protective layer. This coating is sandwiched between panel BMU7 and vacuum forming bracket 4, replacing the separate mica sheet added between panel BMU7 and vacuum forming bracket 4 in the traditional solution, thus achieving weight reduction.

[0032] like Figure 9 As shown, the daisy-chain communication lines on FPC5 are arranged in an "S" shape in the FPC area between adjacent slave boards BMU7. The communication signals between slave boards BMU7 are CAN signals, which include CAN high signal lines and CAN low signal lines. In the planar routing of FPC5, the CAN high signal lines and CAN low signal lines are arranged in an "S" shape to minimize electromagnetic interference between signal lines, replacing the function of traditional twisted-pair cable harnesses.

[0033] like Figure 2 As shown, this embodiment also includes an external signal connector 9. The external signal connector 9 is mounted on the FPC 5 or the blister pack 4, and specifically includes a daisy-chain input connector 2 and a daisy-chain output connector 3. The daisy-chain input connector 2 and the daisy-chain output connector 3 are used to connect and mate with the input and output interfaces of the external communication harness, respectively. The external signal connector 9 is pre-installed at the edge of the BCS module, allowing PACK factory workers to manually connect and mate the connectors on the communication harness directly after installing the BCS module.

[0034] This embodiment provides a battery module, including multiple battery cells and a wireless, nickel-free integrated slave-controlled BCS module acquisition structure as described in Embodiment 1.

[0035] Multiple battery cells are arranged along the length of the battery module. The BCS module acquisition structure is located above the multiple battery cells. Aluminum busbars 6 are connected to the terminals of each battery cell. Acquisition branch 1 acquires the voltage signals of each battery cell through aluminum busbars 6. NTC thermistors on FPC5 acquire the temperature signals of each battery cell or the vicinity of the aluminum busbars. The acquired voltage and temperature signals are transmitted to slave board BMU7 via etched lines on FPC5. After processing, the signals are transmitted between slave boards BMU7 via an "S"-shaped daisy-chain communication line on FPC5, and communicate with the external main control unit via daisy-chain input connector 2 and daisy-chain output connector 3.

[0036] For those skilled in the art, various improvements and modifications can be made without departing from the principles of this invention, and these improvements and modifications should also be considered within the scope of protection of this invention.

Claims

1. A wireless, nickel-free integrated slave-controlled BCS module acquisition structure, characterized in that, include: The acquisition branch plate (1), the vacuum forming bracket (4), the aluminum strip (6), the slave plate BMU (7) and the slave plate BMU fixing bracket (8); The aluminum strip (6) is fixedly mounted on the vacuum forming bracket (4); The FPC (5) is disposed on the blister bracket (4), and voltage sampling lines, temperature sampling lines and daisy-chain communication lines are etched on the FPC (5). The FPC (5) is provided with a first pad. The slave board BMU (7) is mounted above the vacuum forming bracket (4) via a slave board BMU fixing bracket (8). The slave board BMU (7) is provided with a second pad, and the second pad is directly connected to the first pad by laser soldering. One of the acquisition branch pieces has its first end connected to the FPC (5) and its second end welded to the aluminum busbar (6), while the other acquisition branch piece has its first end connected to the slave board BMU (7) and its second end welded to the aluminum busbar (6).

2. The wireless, nickel-free integrated slave-controlled BCS module acquisition structure according to claim 1, characterized in that, The daisy-chain communication lines are arranged in an "S" shape on the FPC (5), and the "S" shape is used to reduce electromagnetic interference between the CAN high signal line and the CAN low signal line.

3. The wireless, nickel-free integrated slave-controlled BCS module acquisition structure according to claim 1, characterized in that, The bottom surface of the slave plate BMU (7) is directly sprayed with a fire-resistant, heat-insulating and insulating coating. The fire-resistant, heat-insulating and insulating coating is sandwiched between the slave plate BMU (7) and the vacuum forming bracket (4) to replace the independent mica sheet set between the slave plate BMU (7) and the vacuum forming bracket (4).

4. The wireless, nickel-free integrated slave-controlled BCS module acquisition structure according to claim 1, characterized in that, The second end of the acquisition branch is fixed to the aluminum busbar (6) by ultrasonic welding. The acquisition branch is used to replace the independent voltage acquisition nickel plate.

5. The wireless, nickel-free integrated slave-controlled BCS module acquisition structure according to claim 1, characterized in that, It also includes an external signal connector, which is disposed on the FPC (5) or the blister bracket (4) and is used to connect and cooperate with an external communication harness.

6. The wireless, nickel-free integrated slave-controlled BCS module acquisition structure according to claim 5, characterized in that, The external signal connector includes a daisy-chain input connector (2) and a daisy-chain output connector (3), which are respectively plugged into the input and output interfaces of the external communication harness.

7. The wireless, nickel-free integrated slave-controlled BCS module acquisition structure according to claim 1, characterized in that, The slave plate BMU (7) is a bare plate structure without an independent protective shell. The slave plate BMU (7) is fixed above the blister bracket (4) by the slave plate BMU fixing bracket (8). There is no independent shell or bracket structure between the slave plate BMU (7) and the blister bracket (4).

8. The wireless, nickel-free integrated slave-controlled BCS module acquisition structure according to claim 1, characterized in that, The slave plate BMU fixing bracket (8) is fixedly disposed on the upper end face of the blister bracket (4), and the slave plate BMU (7) is fixed above the slave plate BMU fixing bracket (8).

9. The wireless, nickel-free integrated slave-controlled BCS module acquisition structure according to claim 1, characterized in that, The FPC (5) includes multiple sub-FPCs. Each sub-FPC has a line etching design according to the arrangement position of the slave board BMU (7). The daisy-chain communication lines on each sub-FPC are connected in series with each slave board BMU (7).

10. A battery module, characterized in that, The acquisition structure includes a wireless, nickel-free integrated slave-controlled BCS module as described in any one of claims 1 to 9.

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