Antenna device and IC card having the same

Abstract

The present disclosure provides an antenna device capable of achieving high designability even when a card base material having light-transmitting properties is used. An antenna device (1) includes a conductor pattern (100). The conductor pattern (100) has a first winding portion (110) wound in a first direction, a second winding portion (120) wound in a second direction opposite to the first direction, a connection portion (130) including a plurality of connection patterns connecting the first winding portion (110) and the second winding portion (120), and an end portion including one end (101) and the other end (102) of the conductor pattern (100). The second winding portion (120) and the end portions (101, 102) are located inside the first winding portion, and the first winding portion (110) is configured by a plurality of conductive wires (111c, 112c, 113c) arranged in a grid shape. The second winding portion (120) and the end portions (101, 102) are configured by solid conductive wires.

Description

Technical Field

[0001] This disclosure relates to an antenna device and an IC card equipped with the antenna device. Background Technology

[0002] Patent document 1 discloses an IC card with an antenna device.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Publication No. 2024-544048 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] In the IC card disclosed in Patent Document 1, because the conductor pattern constituting the antenna device has a relatively wide pattern width, the conductor pattern constituting the antenna device can be visually identified when a transparent card substrate is used. Therefore, when a transparent card substrate is used, there is a problem of design compromise.

[0008] This disclosure describes an antenna device with high design flexibility that can be obtained even when using a light-transmitting card substrate, and an IC card equipped with the antenna device.

[0009] Means for solving technical problems

[0010] One aspect of the antenna device disclosed herein includes a conductor pattern. The conductor pattern comprises: a first winding portion wound along a first direction; a second winding portion wound along a second direction opposite to the first direction; a connecting portion including a plurality of connecting patterns connecting the first winding portion and the second winding portion; and an end portion including one end and the other end of the conductor pattern. The second winding portion and the end portion are located inside the first winding portion. The first winding portion is composed of a plurality of first conductive wires arranged in a grid pattern. The second winding portion and the end portion are composed of solid second conductive wires.

[0011] One aspect of the IC card disclosed herein includes: a first card substrate that is transparent to light; a second card substrate that is transparent to light; the aforementioned antenna device disposed between the first card substrate and the second card substrate; and an IC module that overlaps with a second winding portion and an end portion of a conductor pattern.

[0012] The effects of the invention

[0013] According to this disclosure, it is possible to provide an antenna device with high design flexibility even when using a light-transmitting card substrate, and an IC card equipped with the antenna device. Attached Figure Description

[0014] Figure 1 This is a simplified perspective view showing the appearance of the IC card 3 equipped with an antenna device according to the first embodiment of this disclosure.

[0015] Figure 2 This is a simplified exploded perspective view used to illustrate the structure of an IC card 3 equipped with an antenna device 1.

[0016] Figure 3 This is a simplified cross-sectional view used to illustrate the structure of the IC card 3 equipped with antenna device 1.

[0017] Figure 4 This is a simplified top view used to illustrate the structure of conductor pattern 100.

[0018] Figure 5 It is a simplified top view that enlarges a portion of the conductor pattern 100.

[0019] Figure 6 This is a magnified view of part of the grid pattern 140.

[0020] Figure 7 (a) ~ Figure 7 (e) is an exploded view of capacitor 60.

[0021] Figure 8 This is a simplified 3D view of IC module 50 from the back side.

[0022] Figure 9 This is a schematic diagram showing the communication status between IC card 3 and card reader 7.

[0023] Figure 10 This is a simplified top view used to illustrate the structure of the conductor pattern 100A in the first modified example.

[0024] Figure 11 This is a simplified top view used to illustrate the structure of the conductor pattern 100B in the second variation.

[0025] Figure 12 This is a simplified top view showing a portion of the conductor pattern 100B.

[0026] Figure 13 This is a schematic diagram illustrating an example where the ends of the conductive wires overlap each other in the winding direction between adjacent turns.

[0027] Figure 14 This is a simplified cross-sectional view illustrating the structure of an IC card 4 equipped with an antenna device 2 according to the second embodiment of this disclosure.

[0028] Figure 15 (a) ~ Figure 15 (i) is an exploded view of capacitor 70.

[0029] Symbol Explanation

[0030] 1, 2 Antenna Devices

[0031] 3, 4 IC cards

[0032] The top surface of 3a and 4a IC cards

[0033] The back of 3b and 4b IC cards

[0034] 7. Card reader

[0035] 10, 30 plastic sheets

[0036] 20 Support body

[0037] 31 Through Hole

[0038] 41 Adhesive layer

[0039] 41, 42 Adhesive layers

[0040] 50 IC modules

[0041] 51 Module Baseboard

[0042] 52 IC chips

[0043] 53 Coupled coil

[0044] 54 Protective Resin

[0045] 55, 56 Connecting terminals

[0046] 60 capacitor

[0047] 61 Covering layer

[0048] 61a, 61b openings

[0049] 62, 65 planar conductors

[0050] 62a, 63 terminal conductors

[0051] 62b, 65b slits

[0052] 64 substrates

[0053] 64a Through Hole

[0054] 65a Connecting part

[0055] 66 Covering layer

[0056] 70 capacitor

[0057] 70a Cavity 71

[0059] 71a, 71b Plated Terminal Conductors

[0060] 72 Covering layer

[0061] 72a, 72b openings

[0062] 73a and 73b terminal conductors

[0063] 74 Planar conductors

[0064] 75 Insulation layer

[0065] 75a, 75b through holes

[0066] 76 Planar conductors

[0067] 77a, 77b terminal conductors

[0068] 78 Covering layer

[0069] 78a, 78b openings

[0070] 79a, 79b Plated Terminal Conductors

[0071] 100, 100A, 100B conductor patterns

[0072] 101 End (one end)

[0073] 102 End (the other end)

[0074] 110 First winding section

[0075] 110a Inner Diameter Area

[0076] Turns 111-113

[0077] Conductive wires 111a~111c, 112a~112c, 113a~113c, 140a, 140b

[0078] 111d, 112d ends

[0079] 120 Second winding section

[0080] 120a inner diameter area

[0081] Turns 121-123

[0082] 130 Connecting part

[0083] 130a~130c conductive wire

[0084] Connecting patterns 131-136

[0085] 140 grid pattern

[0086] 140c slit

[0087] 141 Fine line pattern

[0088] Intervals 1111~1115, 1121~1125, 1131~1135

[0089] E terminal electrode Detailed Implementation

[0090] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0091] <First Implementation Method>

[0092] Figure 1 This is a simplified perspective view showing the appearance of the IC card 3 equipped with an antenna device according to the first embodiment of this disclosure.

[0093] like Figure 1 As shown, the IC card 3 of this embodiment is a plate-shaped body with the Y direction as its length direction, the X direction as its width direction, and the Z direction as its thickness direction, having an upper surface 3a and a back surface 3b constituting the XY plane. An IC module, described later, is built into the IC card 3, and the terminal electrodes E of the IC module are exposed on the upper surface 3a of the IC card 3.

[0094] Figure 2 and Figure 3 These are a simplified exploded perspective view and a simplified cross-sectional view, respectively, used to illustrate the structure of the IC card 3 equipped with the antenna device 1 in this embodiment.

[0095] Figure 2 and Figure 3The IC card 3 shown has a structure in which a plastic plate 10, a capacitor 60, a support 20, a conductor pattern 100 supported by the support 20, and a plastic plate 30 are stacked sequentially from the back side 3b towards the top surface 3a. The antenna device 1 of this embodiment is composed of the conductor pattern 100 and the capacitor 60. In this embodiment, the conductor pattern 100 is located on the plastic plate 10 side, and the support 20 is located on the plastic plate 30 side. The plastic plate 10 is bonded to the support 20 and the capacitor 60 via an adhesive layer 41. The plastic plate 30 is bonded to the support 20 via an adhesive layer 42. The materials of the adhesive layers 41 and 42 can be adhesive sheets made of highly transparent thermoplastic or thermosetting resins. The materials of the adhesive sheets of the adhesive layers 41 and 42 can be acrylic, polyurethane, epoxy, or phenolic materials. The material of the support 20 can be a transparent resin film with light transmittance. Examples of transparent resin films constituting the support 20 include films made of polyethylene terephthalate (PET), polycarbonate (PC), polyethylene naphthalate (PEN), cyclic olefin polymer (COP), or polymethyl methacrylate (PMMA). Alternatively, the support 20 may be made of a glass substrate. The total light transmittance of the support 20 and adhesive layers 41 and 42 in the visible light region may be 80% or more, or 90% or more.

[0096] Plastic plates 10 and 30 are card substrates made of resin material that does not impede magnetic flux. The outer surface of plastic plate 10 forms the back surface 3b of IC card 3. The outer surface of plastic plate 30 forms the top surface 3a of IC card 3. Both plastic plates 10 and 30 are made of a light-transmitting material. Plastic plates 10 and 30 can also be made of a transparent resin material. Examples of transparent resin materials for plastic plates 10 and 30 include cellulose propionate (CP), polyvinyl chloride (PVC), and polycarbonate (PC). Plastic plate 30 has a through hole 31, and an IC module 50 is disposed inside the through hole 31. Light-transmitting tempered glass can also be used instead of plastic plates 10 and 30. In general IC cards, since the planar position of the terminal electrode E is determined by specifications, the planar position of the through hole 31 in plastic plate 30 must also follow these specifications.

[0097] Figure 4 This is a simplified top view used to illustrate the structure of conductor pattern 100. Furthermore, Figure 4 The AA line shown represents Figure 3 The location of the cross section.

[0098] like Figure 4As shown, the conductor pattern 100 included in the antenna device 1 of this embodiment has: a first winding portion 110 with multiple turns; a second winding portion 120 with multiple turns; a connecting portion 130 having a portion connecting the first winding portion 110 and the second winding portion 120; an end portion 101 constituting one end of the conductor pattern 100; and an end portion 102 constituting the other end of the conductor pattern 100. Copper, aluminum, silver, etc., can be used as the material for the conductor pattern 100. Furthermore, resin can be present between the conductor pattern 100 and the support 20. Here, taking end portion 101 as the starting point and end portion 102 as the ending point, from... Figure 4 Viewed in the indicated direction, the first winding portion 110 winds to the right (clockwise), and the second winding portion 120 winds to the left (counterclockwise). That is, when the winding direction of the first winding portion 110 is set as the first direction, and the winding direction of the second winding portion 120 is set as the second direction, the first direction and the second direction are opposite to each other. Furthermore, the antenna device 1 of this embodiment includes a grid pattern 140. The grid pattern 140 can be made of the same material as the conductor pattern 100, or it can be made of a different material than the conductor pattern 100.

[0099] The second winding portion 120 and the ends 101 and 102 are located within the inner diameter region 110a surrounded by the first winding portion 110. That is, the second winding portion 120 and the ends 101 and 102 are located inside the first winding portion 110. Furthermore, the end 101 is located within the inner diameter region 120a surrounded by the second winding portion 120. That is, the end 101 is located inside the second winding portion 120. Additionally, the end 102 is located within the inner diameter region 110a surrounded by the first winding portion 110 and outside the inner diameter region 120a surrounded by the second winding portion 120. That is, the end 102 is located inside the first winding portion 110 and outside the second winding portion 120.

[0100] like Figure 4 As shown, the second winding portion 120 and the ends 101 and 102 are made of solid conductive wires, while the first winding portion 110 is made of multiple conductive wires arranged in a grid.

[0101] Figure 5 This is a simplified top view showing a portion of the conductor pattern 100 magnified.

[0102] like Figure 5 As shown, the first winding portion 110 includes a turn 111 as the outermost circumferential turn, a turn 113 as the innermost circumferential turn, and a turn 112 located between the turns 111 and 113. One end of the turn 111 of the first winding portion 110 is connected to the end 101 of the conductor pattern 100 via a connection pattern 131 included in the connection portion 130.

[0103] Turn 111 is composed of a conductive line 111a extending circumferentially and forming an outer peripheral edge, a conductive line 111b extending circumferentially and forming an inner peripheral edge, and multiple conductive lines 111c located in the area sandwiched between conductive lines 111a and 111b and extending obliquely in a grid pattern relative to conductive lines 111a and 111b. Turn 112 is composed of a conductive line 112a extending circumferentially and forming an outer peripheral edge, a conductive line 112b extending circumferentially and forming an inner peripheral edge, and multiple conductive lines 112c located in the area sandwiched between conductive lines 112a and 112b and extending obliquely in a grid pattern relative to conductive lines 112a and 112b. The turn 113 is composed of a conductive line 113a extending circumferentially and forming an outer peripheral edge, a conductive line 113b extending circumferentially and forming an inner peripheral edge, and multiple conductive lines 113c located in the area sandwiched between the conductive lines 113a and 113b and extending obliquely in a grid pattern relative to the conductive lines 113a and 113b.

[0104] exist Figure 5 In the example shown, the mesh-like conductive lines 111c, 112c, and 113c have a structure in which multiple portions extending along a direction B, inclined at 45° relative to the X and Y directions, intersect with each other, and multiple portions extending along a direction C, orthogonal to the direction B. The inclination of the directions B and C relative to the X and Y directions is not mandatory, but by inclining the directions B and C relative to the X and Y directions, breakage is less likely to occur when forming the mesh-like conductive lines 111c, 112c, and 113c along the X or Y directions using methods such as screen printing. Alternatively... Figure 5 The example shown employs mesh-like conductive lines 111c, 112c, 113c with a structure in which multiple portions extending parallel to the X direction intersect each other with multiple portions extending parallel to the Y direction.

[0105] The second winding portion 120 includes a turn 121 as the innermost circumferential turn, a turn 123 as the outermost circumferential turn, and a turn 122 located between the turns 121 and 123. One end of the turn 121 of the second winding portion 120 is connected to the other end of the turn 111 of the first winding portion 110 via a connecting pattern 132 included in the connecting portion 130. The other end of the turn 121 of the second winding portion 120 is connected to one end of the turn 112 of the first winding portion 110 via a connecting pattern 133 included in the connecting portion 130. One end of the turn 122 of the second winding portion 120 is connected to the other end of the turn 112 of the first winding portion 110 via a connecting pattern 134 included in the connecting portion 130. The other end of the turn 122 of the second winding portion 120 is connected to one end of the turn 113 of the first winding portion 110 via a connecting pattern 135 included in the connecting portion 130. One end of the turn 123 of the second winding portion 120 is connected to the other end of the turn 113 of the first winding portion 110 via a connecting pattern 136 included in the connecting portion 130. The other end of the turn 123 of the second winding portion 120 is connected to the end 102 of the conductor pattern 100. In this embodiment, the end 102 of the conductor pattern 100 is located on the outer side in the Y direction of the second winding portion 120. Therefore, the turn 123 of the second winding portion 120 is approximately 1 / 2 turn. In addition, the line length of the turn 123 of the second winding portion 120 varies depending on the position of the end 102 of the conductor pattern 100.

[0106] The connecting patterns 131-136 included in the connecting portion 130 also have the same grid structure as the first winding portion 110. That is, they are composed of conductive wires 130a, conductive wires 130b, and multiple conductive wires 130c, wherein conductive wires 130a form one edge, conductive wires 130b form another edge, and multiple conductive wires 130c are located in the area sandwiched between conductive wires 130a and 130b and extend obliquely in a grid pattern relative to conductive wires 130a and 130b. However, if the area sandwiched between conductive wires 130a and 130b is narrow, the conductive wires 130c may form an incomplete grid. Alternatively, the grid may be formed by conductive wires 130a, 130b, and 130c.

[0107] In contrast, the turns 121-123 constituting the second winding section 120 do not have a mesh structure, but are composed of a solid conductor pattern. The ends 101 and 102 are the same. Figure 5As shown, the pattern widths of the ends 101 and 102 can also be wider than the turn width of the second winding portion 120. The turn widths of each turn 121 to 123 constituting the second winding portion 120 are wider than the line widths of the conductive lines 111a to 111c, 112a to 112c, and 113a to 113c constituting the first winding portion 110 and the line widths of the conductive lines 130a to 130c constituting the connecting portion 130. Therefore, the second winding portion 120, with a diameter smaller than that of the first winding portion 110 and a turn width narrower than that of the first winding portion 110, can achieve low resistance.

[0108] In contrast, the first winding portion 110, composed of a grid-like fine line pattern, is difficult to discern with the naked eye and appears almost transparent. Therefore, when the plastic plates 10 and 30 are made of transparent resin material, they are almost entirely transparent except for the portion where the IC module 50 is located. This allows for designs that are impossible with IC cards made of opaque materials, improving design flexibility. Although the second winding portion 120 is composed of a solid conductor pattern, its location overlapping with the IC module 50 does not compromise design flexibility.

[0109] like Figure 4 As shown, the first winding portion 110's turn 111 includes sections 1111, 1113, and 1115 extending along the X direction and sections 1112 and 1114 extending along the Y direction. One end of section 1111 is connected to the end 101 of the conductor pattern 100 via a connecting portion 130. One end of section 1112 is connected to the other end of section 1111. One end of section 1113 is connected to the other end of section 1112. One end of section 1114 is connected to the other end of section 1113. One end of section 1115 is connected to the other end of section 1114, and the other end of section 1115 is connected to the second winding portion 120 via the connecting portion 130. When the turn widths of sections 1111 to 1115 are respectively set to W1111 to W1115, in Figure 4 In the example shown,

[0110] W1112 = W1113 = W1114 > W1111 = W1115.

[0111] Here, the pattern width of turn 111 refers to the radial width of turn 111, that is, the dimension in the direction orthogonal to the thickness direction of the conductor pattern and the winding direction of turn 111. Alternatively, the turn width of turn 111 can be defined not by intervals, but by the average turn width of intervals 1111 to 1115, or by the maximum turn width of intervals 1111 to 1115. The pattern widths of turns 112 and 113 are defined similarly.

[0112] The first winding portion 110 has a turn 112 comprising sections 1121, 1123, and 1125 extending along the X direction and sections 1122 and 1124 extending along the Y direction. One end of section 1121 is connected to the second winding portion 120 via a connecting portion 130. One end of section 1122 is connected to the other end of section 1121. One end of section 1123 is connected to the other end of section 1122. One end of section 1124 is connected to the other end of section 1123. One end of section 1125 is connected to the other end of section 1124, and the other end of section 1125 is connected to the second winding portion 120 via the connecting portion 130. When the turn widths of sections 1121 to 1125 are respectively set to W1121 to W1125, in Figure 4 In the example shown,

[0113] W1122 = W1123 = W1124 > W1121 = W1125.

[0114] The first winding portion 110 has a turn 113 comprising sections 1131, 1133, and 1135 extending in the X direction and sections 1132 and 1134 extending in the Y direction. One end of section 1131 is connected to the second winding portion 120 via a connecting portion 130. One end of section 1132 is connected to the other end of section 1131. One end of section 1133 is connected to the other end of section 1132. One end of section 1134 is connected to the other end of section 1133. One end of section 1135 is connected to the other end of section 1134, and the other end of section 1135 is connected to the second winding portion 120 via the connecting portion 130. When the turn widths of sections 1131 to 1135 are respectively set to W1131 to W1135, in Figure 4 In the example shown,

[0115] W1132 = W1133 = W1134 > W1131 = W1135.

[0116] The turn widths W1112 to W1114 of intervals 1111 can be wider than the turn widths W1122 to W1124 of intervals 1122 to W1124 of turn 112, or the turn widths W1132 to W1134 of intervals 1132 to W1134 of turn 113. Similarly, the turn widths W1111 and W1115 of intervals 1111 and 1115 of turn 111 can be wider than the turn widths W1121 and W1125 of intervals 1121 and 1125 of turn 112, or the turn widths W1131 and W1135 of intervals 1131 and 1135 of turn 113. This allows for a reduction in the resistance value of turn 111 when the line length is longer than that of turns 112 and 113. That is, the outermost turn 111 of the first winding portion 110 has a wider turn width than the other turns 112 and 113 located further inside the first winding portion 110. This reduces the resistance value deviation caused by different winding positions. In addition, by making the turn width of turn 111 wider than the turn width of turns 112 and 113, the grid structure can reach the periphery of the IC card 3 while ensuring the required characteristics of the antenna device 1, thus suppressing the impact on visibility.

[0117] In addition, such as Figure 5 As shown, the pattern width of the connecting patterns 131 to 136 constituting the connecting portion 130 is narrower than the pattern width of each turn 111 to 113 constituting the first winding portion 110. As a result, the two ends of each turn 111 to 113 can be brought closer together in the X direction, so the winding angle of each turn 111 to 113 is closer to 360°, thereby improving the inductance.

[0118] Furthermore, such as Figure 4 As shown, the antenna device 1 of this embodiment includes a grid pattern 140. The grid pattern 140 is disposed on the outer side of the inner diameter region 110a surrounded by the first winding portion 110 and the inner diameter region 120a surrounded by the second winding portion 120. Like the first winding portion 110, the grid pattern 140 is composed of a grid-like fine line pattern. The grid width of the grid pattern 140 and the grid width of the first winding portion 110 can be the same. By providing such a grid pattern 140, the difference between the light transmittance of the region where the first winding portion 110 is located and the light transmittance of the inner diameter region 110a surrounded by the first winding portion 110 can be reduced. Therefore, the overall light transmittance deviation of the antenna device 1 is reduced, and the design is further improved.

[0119] exist Figure 5In the example shown, the grid pattern 140 is composed of conductive lines 140a forming the outer peripheral edge and conductive lines 140b arranged in a grid pattern in the area surrounded by the conductive lines 140a. By making the line widths of the conductive lines 140a and 140b constituting the grid pattern 140 the same as the line widths of the conductive lines 111a-111c, 112a-112c, and 113a-113c constituting the first winding portion 110, the light transmittance of the area where the first winding portion 110 is located is approximately the same as the light transmittance of the inner diameter area 110a surrounded by the first winding portion 110.

[0120] The grid pattern 140 can be insulated from or electrically connected to the first winding portion 110. Figure 5 In the example shown, the ends of the grid pattern 140 in the +Y direction are connected to the innermost circumferential turn 1135 of the first winding portion 110 via a grid-like fine line pattern 141. Thus, if a conductive material is used as the material of the grid pattern 140 and the grid pattern 140 is electrically connected to the first winding portion 110, power can be supplied to the grid pattern 140 during electroplating.

[0121] Furthermore, as shown in the enlarged view of a portion of grid pattern 140. Figure 6 As shown, the grid constituting the grid pattern 140 can also be partially cut by slits 140c extending inward from the periphery. A portion of the slit 140c cuts the conductive wires 140a constituting the grid pattern 140, and the remaining portion of the slit 140c cuts the grid-like conductive wires 140b constituting the grid pattern 140. If a portion of the grid pattern 140 is cut through such a slit 140c, the eddy currents generated in the grid pattern 140 will be impeded by the slit 140c, thus reducing losses caused by eddy currents. Figure 6 In the example shown, by placing slits 140c near the corners of the grid formed by conductive lines 140b, adjacent grids share a single slit 140c. Furthermore, by placing the two slits 140c assigned to a grid near opposite corners, the positions of the slits 140c are jagged, making them more difficult to visually identify. Thus, the impact of the slits 140c on visibility is further reduced.

[0122] Figure 7 (a) ~ Figure 7 (e) is an exploded view of capacitor 60.

[0123] exist Figure 7 (a) ~ Figure 7 In the example shown in (e), Figure 7 One side of the substrate 64 shown in (c) is provided Figure 7 The planar conductor 62 shown in (b) is in Figure 7The other side of the substrate 64 shown in (c) is provided with Figure 7 The planar conductor 65 is shown in (d). Planar conductors 62 and 65 overlap each other via a substrate 64, thereby forming a capacitor 60 with the substrate 64 serving as a capacitor insulating film. The substrate 64 can be made of materials such as polyimide (PI) or polyethylene terephthalate (PET). Terminal conductors 62a connected to the planar conductor 62 originate from the substrate... Figure 7 The opening 61a of the cover layer 61 shown in (a) is exposed. The connecting portion 65a, which is connected to the planar conductor 65, is via... Figure 7 The through-hole 64a shown in (c) is connected to a terminal conductor 63 disposed on one side of the substrate 64. The terminal conductor 63 is connected from the through-hole 64a disposed on one side of the substrate 64. Figure 7 The opening 61b of the cover layer 61 shown in (a) is exposed. The planar conductor 65 is covered by the cover layer 66. Thus, in the capacitor 60, a pair of terminal conductors 62a and 63 are both located on one side of the substrate 64.

[0124] The capacitor 60 with this structure is configured such that terminal conductor 62a is connected to end 101 of conductor pattern 100 and terminal conductor 63 is connected to end 102 of conductor pattern 100. Thus, since the capacitor 60 is connected between end 101 and end 102 of conductor pattern 100, it constitutes an LC resonant circuit.

[0125] like Figure 3 As shown, the capacitor 60 is disposed between the conductor pattern 100 and the plastic plate 10, overlapping with the IC module 50. Therefore, when viewed from the upper surface 3a side of the IC card 3, the capacitor 60 located on the back side of the IC module 50 is not visible. In this way, by overlapping the IC module 50, which is an opaque component, with the capacitor 60, a sufficiently transparent area can be ensured.

[0126] Figure 8 This is a simplified 3D view of IC module 50 from the back side.

[0127] like Figure 8 As shown, the IC module 50 includes a module substrate 51, an IC chip 52 mounted or embedded in the module substrate 51, and a coupling coil 53. The IC chip 52 is protected by a dome-shaped protective resin 54. The protective resin 54 is composed of insulating components. On the surface side of the module substrate 51, there are... Figure 1The terminal electrode E is shown. The IC module 50 with this structure is housed in a through-hole 31 provided in the plastic plate 30. When the IC module 50 is housed in the through-hole 31, the coupling coil 53 is electromagnetically coupled to the second winding portion 120 of the conductor pattern 100. Furthermore, since the second winding portion 120 of the conductor pattern 100 is connected to the first winding portion 110 of the conductor pattern 100, which functions as an antenna coil, the IC module 50 can communicate with the outside via the first winding portion 110.

[0128] Therefore, as Figure 9 As shown, if the upper surface 3a or the back surface 3b of the IC card 3 faces the card reader 7, communication can be established between the card reader 7 and the IC chip 52. That is, the card reader 7 is coupled to the coupling coil 53 of the IC module 50 via the conductor pattern 100, thereby realizing communication with the IC chip 52.

[0129] Figure 7 The planar conductor 62 shown in (b) has a slit 62b extending inward from the periphery. Figure 7 The planar conductor 65 shown in (d) has a slit 65b extending inward from its periphery. Slits 62b and 65b may also overlap each other in the stacking direction. In the top view from the Z direction, slits 62b and 65b are positioned to overlap with the inner diameter region 120a of the second winding portion 120 of the conductor pattern 100 and the inner diameter region of the coupling coil 53 of the IC module 50. If such slits 62b and 65b are provided in the planar conductors 62 and 65, the magnetic flux required for electromagnetic field coupling between the second winding portion 120 of the conductor pattern 100 and the coupling coil 53 of the IC module 50 will pass through the slits 62b and 65b, thus reducing the eddy currents generated in the planar conductors 62 and 65.

[0130] As explained above, the first winding portion 110 of the antenna device 1 of this embodiment, which has a conductor pattern 100 that functions as an antenna coil, is composed of a grid-like fine line pattern. Therefore, when using transparent plastic plates 10 and 30, almost the entire IC card 3 can be made transparent or semi-transparent, except for the portion where the IC module 50 is disposed.

[0131] Figure 10 This is a simplified top view used to illustrate the structure of the conductor pattern 100A in the first modified example.

[0132] Figure 10 The conductor pattern 100A shown in the first variant example omits the grid pattern 140, which differs from the conductor pattern 100 described above. As illustrated by the conductor pattern 100A in the first variant example, it is not necessary to include the grid pattern 140 in the conductor pattern 100.

[0133] Figure 11 This is a simplified top view used to illustrate the structure of the conductor pattern 100B in the second variation.

[0134] Figure 11 The conductor pattern 100B of the second variation shown omits the conductive lines 111a, 111b, 112a, 112b, 113a, 113b, and 140a that form the edges of the first winding portion 110 and the grid pattern 140, which differs from the conductor pattern 100 described above. Alternatively, as illustrated in the conductor pattern 100B of the second variation, the conductive lines forming the edges of the first winding portion 110 and the grid pattern 140 can be omitted, with the first winding portion 110 consisting only of grid-shaped conductive lines 111c, 112c, and 113c, and the grid pattern 140 consisting only of grid-shaped conductive lines 140b. This makes it more difficult to visually identify the adjacent turns of the first winding portion 110 and the boundary between the first winding portion 110 and the grid pattern 140, thus further improving design flexibility.

[0135] In this case, through, as Figure 12 As shown, using conductive lines 130a and 130b forming the edges of the connection patterns 131-136 constituting the connection portion 130 can also prevent wire breakage in the connection portion 130. The entire Y-direction section of the connection patterns 131-136 constituting the connection portion 130 can be composed of a grid-like fine line pattern, or a portion located on the side of the second winding portion 120 can be composed of a solid conductor pattern. When a portion of the connection patterns 131-136 is composed of a solid conductor pattern, by limiting this section to the section overlapping with the IC module 50, the section composed of the solid conductor pattern can be hidden by the IC module 50. However, considering that alignment errors may occur during the assembly process of overlapping the IC module 50 with the conductor pattern 100, the connection patterns 131-136 can also be partially closed. Figure 12 At least a portion of the section represented by symbol 50, consisting of grid-like conductive lines 130a to 130c, is designed to overlap with IC module 50.

[0136] In addition, it can also be like Figure 13 As shown, between adjacent turns of the first winding 110, the mesh-like conductive lines are arranged to overlap each other in the winding direction. Figure 13In the example shown, the ends 111d of the conductive wire 111c constituting turn 111 and the ends 112d of the conductive wire 112c constituting turn 112 are nested in an overlapping manner in the winding direction. This makes it more difficult to visually identify adjacent turns of the first winding portion 110, thus further improving design flexibility. Not only between adjacent turns of the first winding portion 110, but also at the boundary between the first winding portion 110 and the grid pattern 140, the grid-like conductive wires can be arranged in a nested form with overlapping in the winding direction. Figure 13 The conductor pattern shown can be a pattern that extends obliquely relative to the winding direction, or a pattern that is parallel and perpendicular to the winding direction.

[0137] <Second Implementation Method>

[0138] Figure 14 This is a simplified cross-sectional view illustrating the structure of an IC card 4 equipped with an antenna device 2 according to the second embodiment of this disclosure.

[0139] like Figure 14 As shown, in the second embodiment of the IC card 4, the capacitor 70 is used instead of the capacitor 60, and the coupling coil 53 provided on the IC module 50 is replaced with a pair of connection terminals 55, 56, which are different from the IC card 3 of the first embodiment. Furthermore, in this embodiment, the conductor pattern 100 is located on the side of the plastic plate 30, and the support 20 is located on the side of the plastic plate 10. In addition, the capacitor 70 is disposed between the conductor pattern 100 and the IC module 50. Other basic structures are the same as those of the IC card 3 of the first embodiment; therefore, the same symbols are used for the same elements, and repeated descriptions are omitted. The antenna device 2 of this embodiment is composed of the conductor pattern 100 and the capacitor 70. The capacitor 70 is a cylindrical body with a cavity 70a, and a portion of the IC chip 52 or protective resin 54 is located in the cavity 70a of the capacitor 70. The outer surface of the plastic plate 10 constitutes the back surface 4b of the IC card 4. The outer surface of the plastic plate 30 constitutes the upper surface 4a of the IC card 4.

[0140] Figure 15 (a) ~ Figure 15 (i) is an exploded view of capacitor 70.

[0141] exist Figure 15 (a) ~ Figure 15 In the example shown in (i), Figure 15 (e) shows an insulating layer 75 with one side disposed. Figure 15 The planar conductor 74 shown in (d) is in Figure 15 The other side of the insulating layer 75 shown in (e) is provided Figure 15Planar conductor 76 is shown in (f). Planar conductor 74 and planar conductor 76 overlap each other via insulating layer 75, thereby forming capacitor 70 with insulating layer 75 as the capacitor insulating film. Planar conductor 74 is connected to (not shown) through a through-hole provided in another insulating layer covering one side of insulating layer 75. Figure 15 The terminal conductor 73a shown in (c) is connected to the through-hole 75a provided in the insulating layer 75 and through-hole (not shown) provided in another insulating layer covering the other side of the insulating layer 75 via a through-hole 75a provided in the insulating layer 75. Figure 15 Terminal conductor 77a is shown in (g). Planar conductor 76 is connected to, via a through-hole (not shown) in another insulating layer disposed on the other side of the covering insulating layer 75. Figure 15 The terminal conductor 77b shown in (g) is connected to the through-hole 75b provided in the insulating layer 75 and through-hole (not shown) provided in another insulating layer covering one side of the insulating layer 75 via a through-hole 75b provided in the insulating layer 75. Figure 15 The terminal conductor 73b is shown in (c). An insulating layer 75 and other insulating layers disposed on both sides thereon constitute a substrate with a multilayer structure. Terminal conductors 73a and 73b are disposed on one side, and terminal conductors 77a and 77b are disposed on the other side. Additionally, planar conductors 74 and 76 are located within the multilayer substrate and are arranged opposite each other at intervals in the thickness direction of the substrate, separated by the insulating layer 75. The terminal conductors 73a, 73b, 77a, 77b, and planar conductors 74 and 76 are, for example, made of copper.

[0142] Terminal conductors 73a and 73b are disposed at... Figure 15 The openings 72a and 72b of the covering layer 72 shown in (b) are exposed, and its surface is covered by Figure 15 The plated terminal conductors 71a and 71b shown in (a) are covered. Terminal conductors 77a and 77b are disposed on... Figure 15 The openings 78a and 78b of the covering layer 78 shown in (h) are exposed, and its surface is covered by Figure 15 The plated terminal conductors 79a and 79b shown in (i) are covered. Thus, the capacitor 70 uses a substrate with a multilayer structure, with a pair of terminal conductors 73a and 73b and a pair of plated terminal conductors 71a and 71b located on one side of the substrate, and a pair of terminal conductors 77a and 77b and a pair of plated terminal conductors 79a and 79b located on the other side of the substrate.

[0143] In the capacitor 70 with this configuration, terminal conductors 73a and plated terminal conductors 71a are connected to the end 101 of the conductor pattern 100, terminal conductors 73b and plated terminal conductors 71b are connected to the end 102 of the conductor pattern 100, and terminal conductors 77a and plated terminal conductors 79a are connected to the connection terminal 55 of the IC module 50, and terminal conductors 77b and plated terminal conductors 79b are connected to the connection terminal 56 of the IC module 50. Thus, the end 101 of the conductor pattern 100 is directly connected to the connection terminal 55 of the IC module 50, the end 102 of the conductor pattern 100 is directly connected to the connection terminal 56 of the IC module 50, and the capacitor 70 is connected between the end 101 (connection terminal 55 of the IC module 50) and the end 102 (connection terminal 56 of the IC module 50) of the conductor pattern 100. The capacitor 70 also serves to fix the IC module 50 within the through-hole 31.

[0144] Thus, in the second embodiment, the conductor pattern 100 and the IC module 50 are not electromagnetically coupled, but are directly connected via a conductor contained in the capacitor 70. As illustrated in the second embodiment, the conductor pattern 100 can also be directly connected to the IC module 50. In this case, the second winding portion 120 is theoretically unnecessary, but compatibility can be ensured by using the same conductor pattern 100 as in the first embodiment. That is, if using... Figure 4 The conductor pattern 100 shown can be configured as the first embodiment by connecting the capacitor 60, and can also be configured as the second embodiment by connecting the capacitor 70.

[0145] The above describes the implementation of the technology involved in this disclosure. However, the technology involved in this disclosure is not limited to the above implementation. Various changes can be made without departing from its spirit, and these changes are of course included in the scope of the technology involved in this disclosure.

[0146] The technologies involved in this disclosure include, but are not limited to, the following structural examples.

[0147] One aspect of the antenna device disclosed herein includes a conductor pattern. The conductor pattern comprises: a first winding portion wound along a first direction; a second winding portion wound along a second direction opposite to the first direction; a connecting portion including a plurality of connecting patterns connecting the first and second winding portions; and an end portion including one end and the other end of the conductor pattern. The second winding portion and the end portion are located inside the first winding portion. The first winding portion is composed of a plurality of first conductive lines arranged in a grid pattern. The second winding portion and the end portion are composed of solid second conductive lines. Therefore, the first winding portion is difficult to visually identify, and thus, apart from the second winding portion, the antenna device itself appears almost transparent.

[0148] In the antenna device described above, the turn width of the second winding section can be wider than the line width of the first conductive line. This allows for low resistance in the second winding section.

[0149] In the antenna device described above, the turn width of the second winding portion can be narrower than the turn width of the first winding portion. This allows for increased inductance while maintaining the dimensions of the second winding portion.

[0150] In the antenna device described above, the width of the outermost turn of the first winding portion can be wider than that of other turns located further inward than the outermost turn of the first winding portion. This reduces resistance deviation caused by the winding position.

[0151] In the antenna device described above, the width of each of the multiple connection patterns can be narrower than the turn width of the first winding portion. This increases the inductance of the first winding portion.

[0152] The antenna device described above may also have a grid-like pattern disposed on the inner side of the first winding portion. This reduces the difference in light transmittance between the first winding portion and the inner side of the first winding portion.

[0153] In the aforementioned antenna device, the grid pattern can also be formed by a third conductive line arranged in a grid pattern. This allows for a more uniform overall light transmittance of the antenna device.

[0154] In the antenna device described above, the grid forming the mesh pattern can also be partially cut off by slits extending from the periphery inward. This reduces the eddies generated in the mesh pattern.

[0155] The antenna device described above may also include a capacitor connected to the end of the conductor pattern. This enables the formation of an LC resonant circuit.

[0156] In the aforementioned antenna device, the capacitor may include: a substrate; a first planar conductor formed on one side of the substrate; a second planar conductor formed on the other side of the substrate; a first terminal conductor connected to the first planar conductor; and a second terminal conductor connected to the second planar conductor. Both the first and second terminal conductors are located on one side of the substrate, with the first terminal conductor connected to one end of the conductor pattern and the second terminal conductor connected to the other end of the conductor pattern. This allows the capacitor to be positioned overlapping the conductor pattern.

[0157] In the aforementioned antenna device, the capacitor may also include: a substrate; a first terminal conductor and a second terminal conductor formed on one side of the substrate; a third terminal conductor and a fourth terminal conductor formed on the other side of the substrate; and a first planar conductor and a second planar conductor disposed within the substrate and spaced apart from each other in the thickness direction of the substrate. The first planar conductor is connected to the first terminal conductor and the third terminal conductor, and the second planar conductor is connected to the second terminal conductor and the fourth terminal conductor. The first terminal conductor is connected to one end of a conductor pattern, and the second terminal conductor is connected to the other end of the conductor pattern. This allows an IC module disposed on the other side of the substrate to be directly connected to the capacitor.

[0158] In the antenna device described above, the first planar conductor and the second planar conductor may have slits extending inward from the periphery. This reduces eddy currents generated in the first and second planar conductors.

[0159] In the antenna device described above, the slits provided on the first planar conductor and the slits provided on the second planar conductor can have overlapping portions in the stacking direction. This reduces the generation of eddy currents.

[0160] In the aforementioned antenna device, the radial end of the grid-shaped first conductive wire constituting the first turn included in the first winding portion, and the radial end of the grid-shaped first conductive wire constituting the second turn included in the first winding portion adjacent to the first turn, may overlap in the winding direction. As a result, the boundary between the first turn and the second turn becomes more difficult to visually confirm.

[0161] One aspect of this disclosure provides an IC card comprising: a first card substrate that is transparent to light; a second card substrate that is transparent to light; the aforementioned antenna device disposed between the first card substrate and the second card substrate; and an IC module overlapping a second winding portion and an end portion of a conductor pattern. Thus, it is possible to provide an IC card that is transparent to light except for the portion in which the IC module is disposed.

[0162] In the aforementioned IC card, at least a portion of the connecting part of the conductor pattern may be composed of multiple first conductive lines arranged in a grid pattern, and at least a portion of the portion composed of multiple first conductive lines arranged in a grid pattern in the connecting part of the conductor pattern overlaps with the IC module. Therefore, even if alignment errors occur during assembly, the transparency of the connecting part can be ensured.

[0163] Another aspect of the IC card disclosed herein may include: a first card substrate having light transmittance; a second card substrate having light transmittance; the aforementioned antenna device disposed between the first card substrate and the second card substrate; and an IC module overlapping a second winding portion and an end portion of a conductor pattern, wherein a third terminal conductor and a fourth terminal conductor are connected to the IC module. Thus, the conductor pattern can be directly connected to the IC module.

Claims

1. An antenna device, wherein, The antenna device features a conductor pattern. The conductor pattern has: a first winding portion wound along a first direction; a second winding portion wound along a second direction opposite to the first direction; a connecting portion including a plurality of connecting patterns connecting the first winding portion and the second winding portion; and an end portion including one end and the other end of the conductor pattern. The second winding portion and the end portion are located inside the first winding portion. The first winding section is composed of multiple first conductive wires arranged in a grid pattern. The second winding portion and the end portion are composed of solid second conductive wires.

2. The antenna device as claimed in claim 1, wherein, The width of the second winding is wider than the width of the first conductive wire.

3. The antenna device as claimed in claim 1, wherein, The turn width of the second winding is narrower than the turn width of the first winding.

4. The antenna device as claimed in claim 1, wherein, The outermost circumferential turn of the first winding portion has a wider turn width than the other turns located further inside the outermost circumferential turn of the first winding portion.

5. The antenna device as claimed in claim 1, wherein, The width of each of the plurality of connecting patterns is narrower than the turn width of the first winding portion.

6. The antenna device as claimed in claim 1, wherein, It also has a grid-like pattern disposed on the inner side of the first winding portion.

7. The antenna device as claimed in claim 6, wherein, The grid pattern is composed of multiple third conductive lines arranged in a grid pattern.

8. The antenna device as claimed in claim 6, wherein, The grid that forms the grid pattern is partially cut off by slits extending from the periphery inward.

9. The antenna device as claimed in claim 1, wherein, It also includes a capacitor connected to the end of the conductor pattern.

10. The antenna device as claimed in claim 9, wherein, The capacitor has: substrate; A first planar conductor formed on one side of the substrate; A second planar conductor formed on the other side of the substrate; The first terminal conductor connected to the first planar conductor; and The second terminal conductor connected to the second planar conductor, Both the first terminal conductor and the second terminal conductor are located on one side of the substrate. The first terminal conductor is connected to one end of the conductor pattern. The second terminal conductor is connected to the other end of the conductor pattern.

11. The antenna device as claimed in claim 9, wherein, The capacitor has: substrate; A first terminal conductor and a second terminal conductor are formed on one side of the substrate; A third terminal conductor and a fourth terminal conductor formed on the other side of the substrate; and A first planar conductor and a second planar conductor disposed within the substrate and arranged opposite to each other in the thickness direction of the substrate. The first planar conductor is connected to the first terminal conductor and the third terminal conductor. The second planar conductor is connected to the second terminal conductor and the fourth terminal conductor. The first terminal conductor is connected to one end of the conductor pattern. The second terminal conductor is connected to the other end of the conductor pattern.

12. The antenna device as claimed in claim 10, wherein, The first planar conductor and the second planar conductor have slits extending from the periphery inward.

13. The antenna device as claimed in claim 12, wherein, The slits disposed on the first planar conductor and the slits disposed on the second planar conductor have portions that overlap each other in the stacking direction.

14. The antenna device as claimed in claim 1, wherein, The radial end of the first conductive wire, which forms a mesh-like structure included in the first winding portion, overlaps with the radial end of the first conductive wire, which forms a mesh-like structure adjacent to the first winding portion, in the winding direction.

15. An IC card, in, include: A first card substrate that is translucent; A second card substrate that is translucent; The antenna device according to any one of claims 1 to 14, disposed between the first card substrate and the second card substrate; and An IC module that overlaps with the second winding portion and the end of the conductor pattern.

16. The IC card as described in claim 15, wherein, At least a portion of the connecting portion of the conductor pattern is formed by the plurality of first conductive lines arranged in a grid pattern. At least a portion of the portion formed by the plurality of first conductive lines arranged in a grid pattern in the connection portion of the conductor pattern overlaps with the IC module.

17. An IC card, in, include: A first card substrate that is translucent; A second card substrate that is translucent; The antenna device of claim 11 disposed between the first card substrate and the second card substrate; and The IC module that overlaps with the second winding portion and the end of the conductor pattern. The third terminal conductor and the fourth terminal conductor are connected to the IC module.

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