High isolation in-band full duplex antenna system, antenna design method, and communication device

Abstract

This invention discloses a high-isolation in-band full-duplex antenna system, antenna design method, and communication equipment. The high-isolation in-band full-duplex antenna system includes: a first antenna array and a second antenna array, each composed of multiple radiating elements; an inter-array decoupling module disposed between the first and second antenna arrays, used to suppress electromagnetic coupling between the first and second antenna arrays; and an intra-array decoupling module used to reduce mutual coupling between multiple radiating elements within the first and second antenna arrays. This invention can solve the self-interference problem of in-band full-duplex antennas, achieving high isolation between transmitted and received signals through multi-dimensional decoupling design, while simultaneously improving channel capacity by leveraging the radiation advantage of magnetoelectric dipoles.

Description

Technical Field

[0001] This invention relates to the field of antenna technology, and more particularly to a high-isolation full-duplex antenna system, antenna design method, and communication equipment. Background Technology

[0002] In-band full-duplex mode can significantly increase channel capacity and is a key enabling technology for next-generation wireless networks. However, the main challenge in achieving in-band full-duplex communication lies in the high isolation requirement between transmitted and received signals to avoid severe self-interference problems. Achieving high isolation between transmit and receive antennas within a limited space is a technical challenge.

[0003] Traditional solutions typically employ time-division or frequency-division techniques, but these methods fail to fully utilize spectrum resources. While isolation can be improved through antenna layout optimization, decoupling networks, and electromagnetic structures, existing technologies struggle to simultaneously meet the requirements of high isolation, stable radiation characteristics, and compact size in high-density integrated base station environments. This is particularly true in the 5.2-5.8 GHz band, where dual-polarized antennas need to be implemented within a limited area while ensuring stable radiated beams, high cross-polarization discrimination, and low back radiation. Existing technologies often fail to simultaneously meet stringent specifications in this band, such as intra-array port isolation greater than 15 dB and inter-array isolation greater than 65 dB. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this invention is to provide a high-isolation in-band full-duplex antenna system, antenna design method and communication device to solve the problem of insufficient isolation between transmitting and receiving antennas in in-band full-duplex communication.

[0005] The technical solution of the present invention is as follows: A high-isolation, full-duplex antenna system includes: The first antenna array and the second antenna array are composed of multiple radiating elements; An inter-array decoupling module is disposed between the first antenna array and the second antenna array, and the inter-array decoupling module is used to suppress electromagnetic coupling between the first antenna array and the second antenna array; An in-array decoupling module is used to reduce the mutual coupling between multiple radiating elements in the first antenna array and the second antenna array.

[0006] Optionally, the radiating element includes a top radiating patch, a grounded metal plate, and a Γ-shaped probe feeding structure.

[0007] Optionally, the array decoupling module is a multilayer composite absorbing metasurface, which includes multiple two-ring dual-resistance resonant array elements and multiple metal ground planes; wherein, a metal ground plane is provided between every two two-ring dual-resistance resonant array elements to reflect incident electromagnetic waves to the absorbing structure.

[0008] Optionally, the two-ring dual-resistance resonant array element includes an inner square-ring dual-resistance resonant array element and an outer square-ring dual-resistance resonant array element; both the inner square-ring dual-resistance resonant array element and the outer square-ring dual-resistance resonant array element include a square-ring metal patch and a patch resistor, and the inner square-ring dual-resistance resonant array element and the outer square-ring dual-resistance resonant array element are equivalent to two parallel RLC resonant circuits.

[0009] Optionally, the in-array decoupling module includes parasitic stubs, a decoupling reflective surface, and a guiding patch; the decoupling reflective surface is composed of a metal patch printed on a dielectric substrate, and the decoupling reflective surface is suspended above the first antenna array and the second antenna array at a preset height, thereby generating a 180° phase difference between the reflected wave and the directly coupled wave at the target radiating element.

[0010] Optionally, the parasitic stubs are printed on a dielectric substrate and disposed between the radiating elements; the parasitic stubs generate secondary radiation to form an indirect coupling path that is 180° out of phase with the original coupling path.

[0011] Optionally, the full-duplex antenna system within a high isolation zone further includes a lateral absorbing metasurface and a metal enclosure, disposed outside the first antenna array and the second antenna array, for suppressing electromagnetic wave diffraction; the metal enclosure has a slit with a slit length of half a wavelength, for radiating incident electromagnetic waves to the absorbing metasurface.

[0012] This invention also proposes an antenna design method for the above-mentioned high-isolation full-duplex antenna system, comprising the following steps: Magnetoelectric dipole antennas are selected as radiating array elements to form the first antenna array and the second antenna array. Design parasitic stubs and decoupling reflective surfaces, which are suspended at a preset height above the first and second antenna arrays; A multi-layered composite absorbing metasurface is designed and placed between the first antenna array and the second antenna array; Metal enclosures and slotted structures are designed at the edges of the first and second antenna arrays; Optimize the parameters of each component in the first and second antenna arrays so that the port isolation within the first and second antenna arrays is greater than 15dB and the port isolation between the first and second antenna arrays is greater than 65dB in the 5.2-5.8GHz frequency band.

[0013] Optionally, the step of designing the multilayer composite absorbing metasurface specifically includes: Determine the dimensions and chip resistor values ​​of the dual-ring resonant array element; Determine the spacing between layers in a multi-layer structure and the placement of the metal floor; The parameters of the metasurface array elements were optimized to maximize their absorption performance in the 5.2-5.8 GHz frequency band.

[0014] The present invention also proposes a communication device, including the high isolation band full-duplex antenna system described above.

[0015] This invention provides a high-isolation in-band full-duplex antenna system comprised of a first antenna array, a second antenna array, an inter-array decoupling module, and an intra-array decoupling module. The first and second antenna arrays each consist of multiple radiating elements, which are magnetoelectric dipole antennas. The inter-array decoupling module, positioned between the two antenna arrays, suppresses electromagnetic coupling between them. The intra-array decoupling module reduces mutual coupling between the multiple radiating elements within both the first and second antenna arrays. Thus, this invention effectively solves the self-interference problem of in-band full-duplex antennas, achieving high isolation between transmitted and received signals through multi-dimensional decoupling design. Simultaneously, it leverages the radiation advantage of magnetoelectric dipoles to enhance channel capacity, providing crucial technical support for next-generation wireless networks. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 This is a functional module diagram of an embodiment of the high-isolation full-duplex antenna system of the present invention.

[0018] Figure 2 This is a schematic diagram of the overall structure of the magnetoelectric dipole antenna in the high-isolation full-duplex antenna system of the present invention.

[0019] Figure 3 This is a top view of the magnetoelectric dipole antenna in the high-isolation full-duplex antenna system of the present invention.

[0020] Figure 4 This is a schematic diagram of the Γ-shaped probe of the magnetoelectric dipole antenna in the high-isolation full-duplex antenna system of the present invention.

[0021] Figure 5This is a surface current distribution diagram of the radiating array element in the first embodiment of the high-isolation full-duplex antenna system of the present invention.

[0022] Figure 6 This is a surface current distribution diagram of the radiating array element in the high isolation band full-duplex antenna system of the present invention.

[0023] Figure 7 This is a surface current distribution diagram of the radiating array element in the high isolation band full-duplex antenna system of the present invention.

[0024] Figure 8 This is a surface current distribution diagram of the radiating array element in the high-isolation full-duplex antenna system of the present invention.

[0025] Figure 9 This is a schematic diagram illustrating the decoupling reflective surface radiation cancellation principle in the high-isolation full-duplex antenna system of the present invention.

[0026] Figure 10 This is a schematic diagram illustrating the principle of parasitic structure radiation cancellation in the high-isolation full-duplex antenna system of the present invention.

[0027] Figure 11 This is a schematic diagram of the multilayer composite absorbing metasurface structure in the high isolation band full-duplex antenna system of the present invention.

[0028] Figure 12 This is a schematic diagram of the equivalent circuit model of the multilayer composite absorbing metasurface in the high isolation band full-duplex antenna system of the present invention.

[0029] Figure 13 This is a schematic diagram of the overall structure of the multilayer composite absorbing metasurface in the high isolation band full-duplex antenna system of the present invention.

[0030] Figure 14 This is a schematic diagram of the overall structure of the antenna array in the high isolation band full-duplex antenna system of the present invention.

[0031] Figure 15 This is a schematic diagram of the bottom feed network of the antenna array in the high isolation band full-duplex antenna system of the present invention.

[0032] Figure 16 This is a schematic diagram of the overall structure of the full-duplex antenna system within the high isolation zone of the present invention.

[0033] Figure 17 This is a schematic diagram of the bottom feed network of the full-duplex antenna system within the high isolation band of the present invention.

[0034] Figure 18 This is a graph showing the S-parameter performance of the magnetoelectric dipole antenna in the high-isolation full-duplex antenna system of this invention.

[0035] Figure 19This is the 3D radiation pattern of the magnetoelectric dipole antenna in the high-isolation full-duplex antenna system of the present invention.

[0036] Figure 20 This is a simulation result of the return loss of the transmit and receive antenna array in the high isolation band full-duplex antenna system of this invention.

[0037] Figure 21 This is a simulation result of the radiation efficiency of the transmit and receive antenna array in the high isolation band full-duplex antenna system of this invention.

[0038] Figure 22 This is a simulation result diagram of the port isolation of the subarray within the transceiver antenna array in the high isolation band full-duplex antenna system of the present invention.

[0039] Figure 23 This is a simulation result diagram of the first embodiment of the port isolation between the transmit and receive antenna arrays in the high isolation band full-duplex antenna system of the present invention.

[0040] Figure 24 This is a simulation result diagram of the second embodiment of the port isolation between the transmit and receive antenna arrays in the high isolation band full-duplex antenna system of the present invention.

[0041] Figure 25 This is a simulation result diagram of the third embodiment of the port isolation between the transmit and receive antenna arrays in the high isolation band full-duplex antenna system of the present invention.

[0042] Figure 26 This is a simulation result diagram of the fourth embodiment of the port isolation between the transmit and receive antenna arrays in the high isolation band full-duplex antenna system of the present invention.

[0043] Figure 27 This is the radiation pattern of the first embodiment of the horizontal and vertical plane radiation of the transceiver antenna array in the high isolation band full-duplex antenna system of the present invention.

[0044] Figure 28 This is the radiation pattern of the second embodiment of the horizontal and vertical plane radiation of the transceiver antenna array in the high isolation band full-duplex antenna system of the present invention.

[0045] Figure 29 This is the radiation pattern of the third embodiment of the horizontal and vertical plane radiation of the transceiver antenna array in the high isolation band full-duplex antenna system of the present invention.

[0046] Figure 30 This is the first embodiment of the main polarization and cross polarization of the transmit and receive antenna array in the high isolation band full-duplex antenna system of the present invention.

[0047] Figure 31 This is the second embodiment of the radiation pattern of the main polarization and cross polarization of the transmit and receive antenna array in the high isolation band full-duplex antenna system of the present invention.

[0048] Figure 32 This is the third embodiment of the radiation pattern of the main polarization and cross polarization of the transmit and receive antenna array in the high isolation band full-duplex antenna system of the present invention.

[0049] Figure 33 This is a performance comparison diagram of the transmit and receive antenna arrays before and after in the high isolation band full-duplex antenna system of this invention.

[0050] Figure 34 This is a diagram showing the S-parameter performance of the multilayer composite absorbing metasurface in the high-isolation full-duplex antenna system of this invention.

[0051] Figure 35 This is a diagram showing the S-parameter performance of a single-layer absorbing metasurface in the high-isolation full-duplex antenna system of this invention.

[0052] Figure 36 This is a diagram showing the port isolation of the antenna array in the high isolation band full-duplex antenna system of the present invention when no isolation structure is added.

[0053] Figure 37 This invention relates to an antenna patch with parasitic stubs added to a full-duplex antenna system within a high isolation band, and a current distribution diagram on the parasitic stubs.

[0054] Figure 38 This is a diagram showing the port isolation of the antenna array after adding parasitic stubs to the high isolation band full-duplex antenna system of the present invention.

[0055] Figure 39 This is a diagram showing the port isolation of the antenna array after adding a decoupling reflective surface and a guide patch to the high isolation band full-duplex antenna system of the present invention.

[0056] Figure 40 This is a diagram showing the overall isolation performance of the full-duplex antenna in the high isolation band full-duplex antenna system of this invention before any decoupling structure is added.

[0057] Figure 41 This is a diagram showing the overall isolation performance of the full-duplex antenna after adding a multi-layer composite absorbing metasurface to the high isolation band full-duplex antenna system of the present invention.

[0058] Figure 42 This is a diagram showing the overall isolation performance of the full-duplex antenna in the high isolation band full-duplex antenna system of the present invention after adding a diffraction wave suppression metasurface and a metal baffle.

[0059] Figure 43 This is a flowchart of the method steps of an embodiment of the antenna design method of the present invention.

[0060] Figure 44 This is a flowchart of the method steps of another embodiment of the antenna design method of the present invention.

[0061] Explanation of reference numerals in the attached figures: 10, First antenna array; 11, Radiating element; 111, Top radiating patch; 112, Grounding metal plate; 121, First dielectric substrate; 122, Second dielectric substrate; 123, First parasitic stub; 124, Second parasitic stub; 125, Reflector; 20, Second antenna array; 30, Inter-array decoupling module; 311, Outer square ring dual-resistor resonant array element; 312, Inner square ring dual-resistor resonant array element; 32, Metal ground plane; 40, Intra-array decoupling module. Detailed Implementation

[0062] To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0063] In the implementation methods and claims, unless otherwise specified in the text, the terms "a," "an," "the," and "the" may also include plural forms. If the embodiments of the present invention involve descriptions of "first," "second," etc., such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0064] It should be further understood that the term "comprising" as used in this specification means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should be understood that when an element is referred to as "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be intermediate elements present. Furthermore, "connected" or "coupled" as used herein can include wireless connection or wireless coupling. The term "and / or" as used herein includes all or any combination of one or more associated listed items.

[0065] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0066] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0067] In-band full-duplex mode can significantly increase channel capacity and is a key enabling technology for next-generation wireless networks. However, the main challenge in achieving in-band full-duplex communication lies in the high isolation requirement between transmitted and received signals to avoid severe self-interference problems. Achieving high isolation between transmit and receive antennas within a limited space is a technical challenge.

[0068] Traditional solutions typically employ time-division or frequency-division techniques, but these methods fail to fully utilize spectrum resources. While isolation can be improved through antenna layout optimization, decoupling networks, and electromagnetic structures, existing technologies struggle to simultaneously meet the requirements of high isolation, stable radiation characteristics, and compact size in high-density integrated base station environments. This is particularly true in the 5.2-5.8 GHz band, where dual-polarized antennas need to be implemented within a limited area while ensuring stable radiated beams, high cross-polarization discrimination, and low back radiation. Existing technologies often fail to simultaneously meet stringent specifications in this band, such as intra-array port isolation greater than 15 dB and inter-array isolation greater than 65 dB.

[0069] Metasurface and metamaterial technologies offer new ideas for solving this problem, but how to effectively integrate these technologies into antenna systems to achieve high-isolation in-band full-duplex antennas remains a current challenge.

[0070] To address the aforementioned problems, this invention proposes a full-duplex antenna system with high isolation band.

[0071] Based on the aforementioned issues, the main challenge currently facing in-band full-duplex communication technology lies in the high isolation requirement for transmitted / received signals to avoid severe self-interference problems. To address this issue, this solution provides a high-isolation in-band full-duplex antenna system that achieves high isolation within a limited space through innovative structural design.

[0072] Reference Figure 1 In one embodiment, the high-isolation full-duplex antenna system includes: A first antenna array 10 and a second antenna array 20, wherein the first antenna array 10 and the second antenna array 20 are composed of a plurality of radiating array elements 11, and the radiating array elements 11 are magnetoelectric dipole antennas. An inter-array decoupling module 30 is disposed between the first antenna array 10 and the second antenna array 20. The inter-array decoupling module 30 is used to suppress electromagnetic coupling between the first antenna array 10 and the second antenna array 20. The array decoupling module 40 is used to reduce the mutual coupling between the plurality of radiating elements 11 in the first antenna array 10 and the second antenna array 20.

[0073] In this embodiment, the first antenna array 10 and the second antenna array 20 can be configured as a transmitting antenna array and a receiving antenna array, respectively, to support full-duplex communication operation mode with simultaneous transmission and reception at the same frequency. Both the first antenna array 10 and the second antenna array 20 can be composed of multiple radiating elements 11 arranged according to a preset rule. In this embodiment, the radiating elements 11 can be magnetoelectric dipole antennas. Magnetoelectric dipole antennas themselves have the characteristics of wide bandwidth, stable radiation pattern, and low profile, which can adapt to the antenna radiation performance and bandwidth requirements of full-duplex communication. The inter-array decoupling module 30 suppresses the electromagnetic coupling between the first antenna array 10 and the second antenna array 20, which can reduce the leakage of the same-frequency signal from the transmitting end to the receiving end, improve the isolation between the transmitting and receiving ports from a structural level, and reduce the self-interference of the full-duplex system from the source. The intra-array decoupling module 40 can avoid the coupling interference of adjacent radiating elements from degrading the element radiation efficiency and affecting the overall beamforming accuracy of the array, further improving the overall performance indicators and operational stability of the antenna system.

[0074] Specifically, the radiating element 11 can use a magnetoelectric dipole as the core radiating element, the in-array decoupling module 40 can integrate various decoupling structures such as antenna decoupling surfaces, decoupling resonators, and frequency selective surfaces, and the inter-array decoupling module 30 can be composed of a frequency selective surface and a directional receiving antenna with an ohm-matched load at the port. The working mechanism of the antenna is simulated and analyzed to obtain the signal transmission characteristics data of the radiating element, the data of the in-array coupling suppression effect, and the data of the inter-array coupling suppression effect. Based on the signal transmission characteristics data of the radiating element, the data of the in-array coupling suppression effect, and the data of the inter-array coupling suppression effect, the target isolation and radiation performance of the antenna are obtained. Combining the self-interference suppression requirements of the in-band full-duplex mode, the structural parameters of the radiating element and the configuration scheme of the decoupling module are optimized and solved to obtain the optimal balance solution between target isolation and radiation performance.

[0075] The technical solution of this invention constructs a high-isolation in-band full-duplex antenna system using a first antenna array 10, a second antenna array 20, an inter-array decoupling module 30, and an intra-array decoupling module 40. The first antenna array 10 and the second antenna array 20 each consist of multiple radiating elements 11, which are magnetoelectric dipole antennas. The inter-array decoupling module 30 is positioned between the two antenna arrays and suppresses electromagnetic coupling between the first antenna array 10 and the second antenna array 20. The intra-array decoupling module 40 reduces mutual coupling between the multiple radiating elements 11 within the first antenna array 10 and the second antenna array 20. Thus, this invention effectively solves the self-interference problem of in-band full-duplex antennas, achieves high isolation between transmitted and received signals through multi-dimensional decoupling design, and enhances channel capacity by leveraging the radiation advantage of magnetoelectric dipoles, providing key technical support for next-generation wireless networks.

[0076] Reference Figure 2 , Figure 3 and Figure 4 In one embodiment, the radiating element 11 includes a top radiating patch 111, a grounded metal plate 112, and a Γ-shaped probe feeding structure.

[0077] In this embodiment, the radiating element 11 can be a magnetoelectric dipole antenna, specifically composed of a top radiating patch 111 (a top metal patch) and a grounding metal plate 112, as detailed in the following reference. Figure 3 The middle consists of two Γ-shaped probes ( Figure 3 Not shown in the image; please refer to the following for details. Figure 4 The top-layer radiating patch 111 serves as the main radiator, forming an electric dipole. The grounded metal plate 112 can be considered as a magnetic dipole. The two probes excite 45° polarization and -45° polarization radiation, respectively.

[0078] in addition, Figure 5 , Figure 6 , Figure 7 and Figure 8 The surface current distribution during antenna port excitation is shown. (Refer to...) Figure 5 When t=0, the current on the radiating patch, which acts as an electric dipole, is relatively strong; refer to Figure 6 When t=T / 4, the current is mainly concentrated on the vertically grounded patch, which is equivalent to a magnetic dipole; refer to Figure 7 When t = T / 2, the electric dipole is excited again; refer to Figure 8 At t=3T / 4, the magnetic dipole is excited. Within one period, the electric dipole and the magnetic dipole are excited alternately, therefore this antenna is a magnetoelectric dipole antenna.

[0079] In one embodiment, the in-array decoupling module 40 includes parasitic stubs, a decoupling reflective surface, and a guiding patch; the decoupling reflective surface is composed of a metal patch printed on a dielectric substrate, and the decoupling reflective surface is suspended above the first antenna array 10 and the second antenna array 20 at a preset height, so as to generate a 180° phase difference between the reflected wave and the direct coupled wave at the target radiating element 11.

[0080] In this embodiment, the decoupling reflective surface is composed of a metal patch printed on a dielectric substrate, suspended at a specific height above the first antenna array 10 and the second antenna array 20. Its working principle is as follows: when a magnetoelectric dipole antenna is excited, the radiated electromagnetic waves will propagate along multiple paths, as detailed in [reference needed]. Figure 9 In this diagram, 1, 2, 3, and N represent antenna elements, i.e., magnetoelectric dipole antennas, while ①, ②, ③, ④, and ⑤ represent propagation paths. Through parameter optimization, the induced current amplitudes of the directly coupled wave and the indirectly coupled wave at the target magnetoelectric dipole antenna are made equal and their phase difference is 180°, thus canceling each other out and reducing the mutual coupling between the magnetoelectric dipole antennas.

[0081] In one embodiment, the parasitic stubs are printed on a dielectric substrate and disposed between the radiating elements 11; the parasitic stubs generate secondary radiation to form an indirect coupling path that is 180° out of phase with the original coupling path.

[0082] In this embodiment, the parasitic stubs consist of metal microstrips printed on a dielectric substrate and placed between the radiating elements 11 of the antenna array. When the radiating element 11 is excited, by adjusting the parameters of the parasitic stubs, the amplitudes of the induced currents excited on the target element by the original coupling path and the newly introduced path are equal, but their phases differ by 180°, thus canceling each other out and achieving a decoupling effect. For details, please refer to... Figure 10 In this context, 1 and 2 represent antenna array elements, namely magnetoelectric dipole antennas, while ①, ②, ③, and ④ represent propagation paths.

[0083] In one embodiment, the inter-array decoupling module 30 is a multi-layer composite absorbing metasurface, which includes multiple two-ring dual-resistance resonant array elements and multiple metal ground planes 32; wherein, a metal ground plane 32 is provided between every two two-ring dual-resistance resonant array elements to reflect incident electromagnetic waves to the absorbing structure.

[0084] Further, in one embodiment, the two-ring dual-resistance resonant array element includes an inner square-ring dual-resistance resonant array element 312 and an outer square-ring dual-resistance resonant array element 311; both the inner square-ring dual-resistance resonant array element 312 and the outer square-ring dual-resistance resonant array element 311 include a square-ring metal patch and a patch resistor, and the inner square-ring dual-resistance resonant array element 312 and the outer square-ring dual-resistance resonant array element 311 are equivalent to two parallel RLC resonant circuits.

[0085] In this embodiment, refer to Figure 11 and Figure 12 The multilayer composite absorbing metasurface includes multiple square-ring dual-resistance resonant array elements. Each square-ring dual-resistance resonant array element comprises an inner square-ring dual-resistance resonant array element 312 and an outer square-ring dual-resistance resonant array element 311. Both the inner square-ring dual-resistance resonant array element 312 and the outer square-ring dual-resistance resonant array element 311 include a square-ring metal patch and a patch resistor, printed on a dielectric substrate. The inner square-ring dual-resistance resonant array element 312 and the outer square-ring dual-resistance resonant array element 311 can be equivalent to two parallel RLC resonant circuits. When an electromagnetic wave resonates on the square ring, the incident electromagnetic wave is released in the form of heat energy. Figure 13 As shown, the multilayer composite metasurface is composed of multiple such array elements stacked together. A metal ground plane 32 is added between every two layers of resonant array elements, which mainly reflects the electromagnetic waves incident on it onto the wave-absorbing structure, further enhancing the wave-absorbing effect.

[0086] like Figure 14 and Figure 15 As shown, in an exemplary technique, the antenna array consists of four magnetoelectric dipole antennas. Each antenna has a first dielectric substrate 121 below it and a second dielectric substrate 122 above it. The inner surface of the second dielectric substrate 122 may have a central decoupling reflective surface and director metal patches distributed symmetrically around it. A first parasitic stub 123 is loaded between two adjacent antennas, and a second parasitic stub 124 is loaded in the E-plane direction. The bottom is the antenna reflector 125, and below that is the feed network, mainly composed of four Wilkinson power dividers.

[0087] In one embodiment, a lateral absorbing metasurface and a metal enclosure are further disposed outside the first antenna array 10 and the second antenna array 20 to suppress electromagnetic wave diffraction; the metal enclosure has a slit with a slit length of half a wavelength to radiate the incident electromagnetic wave to the absorbing metasurface.

[0088] In this embodiment, as Figure 16 and Figure 17As shown, in the overall structure of the high-isolation full-duplex antenna provided in this embodiment, the two sides of the array are a first antenna array 10 and a second antenna array 20, respectively, with an inter-array decoupling module 30 (a multi-layer composite absorbing metasurface) between the two antenna arrays. To control electromagnetic wave diffraction, a metal enclosure is added around the central reflector 125 and connected to the reflector 125, with a gap in the middle of the enclosure. Similarly, half-wavelength gaps are also opened on the metal reflectors 125 on both sides, which can be equivalent to slot antennas, radiating the incident electromagnetic waves through the gaps to the adjacent absorbing metasurface. Absorbing metasurfaces are also added on both sides of the antenna array, and metal reflectors 125 are added at the metasurface connection to isolate the diffracted electromagnetic waves.

[0089] In addition, the antenna system in this embodiment was simulated in simulation software. For example... Figure 18 As shown, the antenna array elements exhibit excellent S-parameter performance, with a maximum value of S11 around -30dB and a maximum value of S22 around -25dB. The two-port isolation remains around -30dB throughout the entire frequency band. Figure 19 The 3D radiation pattern of the antenna array elements is shown, exhibiting stable, uniform radiation characteristics with low backscattering.

[0090] like Figure 20 and Figure 21 As shown, the return loss of the transceiver antenna array is below -15dB, and the radiation efficiency remains above 80% at the three frequency points of 5.2 / 5.5 / 5.8. Figure 22 This indicates that the port isolation of the transmit and receive antenna subarrays is better than 18dB across the entire frequency band, and the port isolation of the cross-polarization is better than 20dB.

[0091] Figures 23 to 26 This demonstrates the port isolation between transmit and receive antenna arrays, categorized into four types based on port characteristics: co-array and co-polarized (…). Figure 23 ), same column, different polarization ( Figure 24 Different columns are homopolarized ( Figure 25 ) and different polarizations in different columns ( Figure 26 The isolation between the transmitting and receiving antennas is at least 50dB and at most close to 70dB, demonstrating excellent isolation performance.

[0092] like Figures 27 to 32 As shown, the antenna exhibits good performance in both horizontal and vertical radiation patterns, as well as main polarization and cross-polarization patterns, at the three frequency points of 5.2 / 5.5 / 5.8. The horizontal half-power beamwidths are 85.5° / 86° / 88.4°, and the vertical half-power beamwidths are 45.8° / 45.4° / 44.1°, respectively, demonstrating stable beamwidth and radiation pattern across the entire frequency band. Figure 33 The antenna's front-to-back ratio is greater than 23 dB across the entire frequency band, indicating low back-radiation performance. Figures 27 to 29 The radiation patterns of the transceiver antenna array in the horizontal and vertical planes are shown, where Figure 27 It is 5.2GHz. Figure 28 It is 5.5GHz. Figure 29 It is 5.8GHz; Figures 30 to 32 The main polarization and cross-polarization radiation patterns of the transmit and receive antenna array are shown below. Figure 30 It is 5.2GHz. Figure 31 It is 5.5GHz. Figure 32 It is 5.8GHz.

[0093] Furthermore, in order to verify the effectiveness of each structure, a comparative analysis was conducted in this embodiment. Figure 34 and Figure 35 The S-parameter performance of multilayer composite absorbing metasurface and single-layer absorbing metasurface were demonstrated respectively. The multilayer structure exhibited the maximum absorption performance near 5.5 GHz and the minimum return loss of 23 dB.

[0094] Figures 36 to 39 This demonstrates the effect of the decoupling structure within the array. Without any isolation structure ( Figure 36 The worst port isolation in a 2x2 antenna array is only 12.5dB, which does not meet the requirements. Figure 37 This image shows the antenna patch after the addition of parasitic stubs and the current distribution on the parasitic stubs. (After adding parasitic stubs...) Figure 38 The same polarization coupling remained below -15dB across the entire frequency band, while the cross-polarization port coupling saw a maximum improvement of nearly 10dB. Further improvements were achieved by adding a decoupling reflective surface and a guide patch. Figure 39 The isolation of the same polarization ports is better than 22dB, and the maximum isolation is close to 36dB.

[0095] Figures 40 to 42 This demonstrates the effect of the inter-array decoupling structure. Before adding any decoupling structure ( Figure 40 The worst isolation between ports is approximately 40 dB. After adding a multilayer composite absorbing metasurface ( Figure 41 The isolation between ports 27 and 18 was significantly improved, with a maximum improvement of nearly 23 dB. Finally, after adding a diffraction wave suppression metasurface and a metal baffle... Figure 42 The coupling at most ports of the antenna can be kept below 55dB, and the optimal isolation is close to 70dB. In particular, the isolation between the 26 ports is improved by 17dB.

[0096] In summary, this embodiment provides a high-isolation in-band full-duplex antenna system. Through innovative structural design, it achieves excellent isolation performance and radiation characteristics in the 5.2-5.8 GHz frequency band. The intra-array port isolation is greater than 15 dB, and the inter-array port isolation is greater than 65 dB, while maintaining a stable radiated beam, high cross-polarization discrimination, and low backscattering, providing an effective antenna solution for in-band full-duplex communication. Compared with existing technologies, the high-isolation in-band full-duplex antenna system and design method provided by this invention have the following advantages: Using a magnetoelectric dipole antenna as the radiating element naturally provides wide impedance bandwidth, low backscattering, and stable gain, meeting the requirements of dual-polarization radiation; through the combined design of parasitic stubs and decoupling reflective surfaces, the mutual coupling between elements within the antenna array is effectively reduced, achieving an array port isolation better than 22dB, with a maximum of 36dB; the use of a multi-layer composite absorbing metasurface structure between the transmitting and receiving antenna arrays, combined with metal wall blocking, significantly improves the isolation between the transmitting and receiving antennas, achieving an array port isolation of 50-70dB; and by designing gaps at the edge of the reflector... The structure allows electromagnetic waves incident on the reflector to radiate through gaps to the adjacent absorbing metasurface, preventing diffraction along the reflector's edge and further improving isolation. The antenna system of this invention exhibits stable beamwidth and radiation pattern in the 5.2-5.8 GHz frequency band, with a horizontal half-power beamwidth of 85.5°-88.4° and a vertical half-power beamwidth of 44.1°-45.8°, a front-to-back ratio greater than 23 dB, and high cross-polarization discrimination. The antenna radiation efficiency remains above 80% throughout the operating frequency band, meeting practical application requirements. The design method of this invention is highly systematic, enabling parameter optimization and allowing adjustment of antenna performance according to specific application needs.

[0097] This invention also proposes an antenna design method for the aforementioned high-isolation full-duplex antenna system.

[0098] Reference Figure 43 In one embodiment, the antenna design method includes the following steps: S100. Select a magnetoelectric dipole antenna as a radiating element to form a first antenna array 10 and a second antenna array 20. S200, designing parasitic branches and decoupling reflective surfaces, suspended at a preset height above the first antenna array 10 and the second antenna array 20; S300: A multi-layer composite absorbing metasurface is designed and placed between the first antenna array 10 and the second antenna array 20; S400: Metal enclosures and slotted structures are designed at the edges of the first antenna array 10 and the second antenna array 20. S500 optimizes the parameters of each component of the first antenna array 10 and the second antenna array 20 so that the port isolation within the first antenna array 10 and the second antenna array 20 is greater than 15dB and the port isolation between the first antenna array 10 and the second antenna array 20 is greater than 65dB in the 5.2-5.8GHz frequency band.

[0099] Furthermore, referring to Figure 44 In one embodiment, the step of designing the multilayer composite absorbing metasurface specifically includes: S310. Determine the dimensions and chip resistor values ​​of the dual-ring dual-resistor resonant array element; S320. Determine the spacing between layers in a multi-layer structure and the installation of the metal floor. S330 optimizes the parameters of the metasurface array elements to achieve maximum absorption performance in the 5.2-5.8GHz frequency band.

[0100] In this embodiment, a magnetoelectric dipole antenna is first selected as the basic radiating element, and dual-polarization feeding is achieved through a Γ-shaped probe. A parasitic stub structure is designed, and its size, location, and material parameters are determined to reduce mutual coupling between adjacent elements within the antenna array. A decoupling reflective surface is designed, and the shape, size, arrangement, and relative height of the metal patch to the antenna array are determined to further improve the isolation within the array. A dual-loop dual-resistor resonant array element is designed, and the parameters of the metal patch and resistor are determined to ensure optimal absorption performance within the operating frequency band. A multi-layer composite absorbing metasurface is constructed, and the number of layers, the spacing between layers, and the location of the metal ground plane are determined, placing it between the transmitting and receiving antenna arrays. A metal enclosure and slot structure are designed, and the height, thickness, and slot size, number, and location are determined to control electromagnetic wave diffraction. A lateral absorbing metasurface for the antenna array is designed, which, in conjunction with the parameters of the intermediate metasurface, forms a complete isolation system. The overall structural parameters are optimized, and performance is verified through electromagnetic simulation, adjusting to meet all technical specifications. The design method provided in this embodiment can systematically realize the design of a full-duplex antenna with high isolation band, while simultaneously meeting multiple performance indicators such as intra-array port isolation greater than 15dB, inter-array port isolation greater than 65dB, radiation efficiency greater than 80%, front-to-back ratio greater than 23dB, and high cross-polarization discrimination in the 5.2-5.8GHz frequency band.

[0101] The present invention also proposes a communication device.

[0102] In one embodiment, the communication device includes the high-isolation in-band full-duplex antenna system described above. The communication device employing the high-isolation in-band full-duplex antenna system can achieve in-band full-duplex communication. The communication device can be a 5G or 6G base station device, operating in the 5.2-5.8 GHz frequency band. It is understood that, since the communication device of the present invention uses the aforementioned high-isolation in-band full-duplex antenna system, the embodiments of the communication device of the present invention include all the technical solutions of all embodiments of the aforementioned high-isolation in-band full-duplex antenna system, and the achieved technical effects are completely identical, and will not be repeated here.

[0103] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A full-duplex antenna system within a high isolation band, characterized in that, include: The first antenna array and the second antenna array are composed of multiple radiating elements; An inter-array decoupling module is disposed between the first antenna array and the second antenna array, and the inter-array decoupling module is used to suppress electromagnetic coupling between the first antenna array and the second antenna array; An in-array decoupling module is used to reduce the mutual coupling between multiple radiating elements in the first antenna array and the second antenna array.

2. The high-isolation full-duplex antenna system as described in claim 1, characterized in that, The radiating element includes a top radiating patch, a grounding metal plate, and a Γ-shaped probe feeding structure.

3. The high-isolation, full-duplex antenna system as described in claim 1, characterized in that, The array decoupling module is a multi-layer composite absorbing metasurface, which includes multiple two-ring dual-resistance resonant array elements and multiple metal ground planes; wherein, the metal ground plane is provided between every two two-ring dual-resistance resonant array elements to reflect the incident electromagnetic waves to the absorbing structure.

4. The high-isolation full-duplex antenna system as described in claim 3, characterized in that, The dual-ring dual-resistance resonant array element includes an inner square-ring dual-resistance resonant array element and an outer square-ring dual-resistance resonant array element. Both the inner square-ring dual-resistance resonant array element and the outer square-ring dual-resistance resonant array element include a square-ring metal patch and a patch resistor. The inner square-ring dual-resistance resonant array element and the outer square-ring dual-resistance resonant array element are equivalent to two parallel RLC resonant circuits.

5. The high-isolation, full-duplex antenna system as described in claim 1, characterized in that, The array decoupling module includes parasitic stubs, a decoupling reflective surface, and a guiding patch; the decoupling reflective surface is composed of a metal patch printed on a dielectric substrate, and the decoupling reflective surface is suspended above the first antenna array and the second antenna array at a preset height, so as to generate a 180° phase difference between the reflected wave and the direct coupled wave at the target radiating element.

6. The high-isolation full-duplex antenna system as described in claim 5, characterized in that, The parasitic stubs are printed on a dielectric substrate and positioned between the radiating elements; the parasitic stubs generate secondary radiation to form an indirect coupling path that is 180° out of phase with the original coupling path.

7. The high-isolation full-duplex antenna system as described in claim 1, characterized in that, It also includes a lateral absorbing metasurface and a metal enclosure, which are disposed outside the first antenna array and the second antenna array to suppress electromagnetic wave diffraction; the metal enclosure has a slit with a slit length of half a wavelength to radiate the incident electromagnetic wave to the absorbing metasurface.

8. An antenna design method applied to the high-isolation in-band full-duplex antenna system according to any one of claims 1-7, characterized in that, Includes the following steps: Magnetoelectric dipole antennas are selected as radiating array elements to form the first antenna array and the second antenna array. Design parasitic stubs and decoupling reflective surfaces, which are suspended at a preset height above the first and second antenna arrays; A multi-layered composite absorbing metasurface is designed and placed between the first antenna array and the second antenna array; Metal enclosures and slotted structures are designed at the edges of the first and second antenna arrays; Optimize the parameters of each component in the first and second antenna arrays so that the port isolation within the first and second antenna arrays is greater than 15dB and the port isolation between the first and second antenna arrays is greater than 65dB in the 5.2-5.8GHz frequency band.

9. The antenna design method as described in claim 8, characterized in that, The steps for designing the multilayer composite absorbing metasurface specifically include: Determine the dimensions and chip resistor values ​​of the dual-ring resonant array element; Determine the spacing between layers in a multi-layer structure and the placement of the metal floor; The parameters of the metasurface array elements were optimized to maximize their absorption performance in the 5.2-5.8 GHz frequency band.

10. A communication device, characterized in that, Including the high isolation band full-duplex antenna system as described in any one of claims 1-7.

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