Antenna assembly and electronic device
Patent Information
- Application Number
- CN202510349912.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-21
- Publication Date
- 2026-09-22
AI Technical Summary
[0011]上述天线组件和电子设备,包括辐射体、寄生枝节、馈源和耦合电路,其中,辐射体通过缝隙与寄生枝节容性耦合,且辐射体与寄生枝节之间设有用于增加耦合量的耦合电路,其馈源提供的激励信号可经辐射体、耦合电路耦合至寄生枝节,以支持第一频段和第二频段,还可以激励寄生枝节支持第三频段,如此,在不需要额外引入天线开关的情况下,可实现三个频段的覆盖,例如可支持中频、高频和超高频的覆盖,进而可实现三频段之间的多种载波聚合态,可以提高天线组件的通信性能,且成本低;另外,其采用单极子和寄生枝节的天线结构,极大地简化了天线组件的结构,提高天线组件集成度,减小了天线组件的整体体积,利于提高安装有该天线组件的电子设备的整体小型化设计,电子设备安装该天线组件的布局灵活性。
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Figure CN122800923A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of antenna technology, and in particular to an antenna assembly and electronic device. Background Technology
[0002] With technological advancements, electronic devices such as mobile phones and tablets with communication capabilities are becoming increasingly widespread and powerful, requiring coverage across a wider range of frequency bands. However, as electronic devices become increasingly thinner and lighter, a key technical challenge is how to improve multi-band coverage while minimizing the space occupied by antenna components. Summary of the Invention
[0003] This application provides an antenna assembly and an electronic device that can achieve multi-band coverage and greatly simplify the structure of the antenna assembly.
[0004] This application provides an antenna assembly, including:
[0005] A radiator includes a first end and a second end disposed opposite to each other, and a first feed point disposed on the radiator;
[0006] The parasitic branch has a gap between its first end and the first end of the radiator, and the parasitic branch is provided with a grounding point connected to a common ground.
[0007] The feed source is connected to the feed point;
[0008] The coupling circuit is connected to the first end of the radiator and the first end of the parasitic branch, respectively.
[0009] The excitation signal provided by the feed source is transmitted to the parasitic stub via the coupling circuit to excite the radiator and the parasitic stub to support the first frequency band and the second frequency band, and to excite the radiator to support the third frequency band; wherein the center frequency of the first frequency band and the second frequency band is less than the center frequency of the third frequency band.
[0010] This application provides an electronic device including the aforementioned antenna assembly.
[0011] The aforementioned antenna assembly and electronic device include a radiator, a parasitic stub, a feed source, and a coupling circuit. The radiator is capacitively coupled to the parasitic stub through a gap, and a coupling circuit is provided between the radiator and the parasitic stub to increase the coupling amount. The excitation signal provided by the feed source can be coupled to the parasitic stub via the radiator and the coupling circuit to support the first and second frequency bands, and can also excite the parasitic stub to support the third frequency band. In this way, coverage of three frequency bands can be achieved without the need for an additional antenna switch, such as supporting intermediate frequency, high frequency, and ultra-high frequency coverage. Furthermore, multiple carrier aggregation states between the three frequency bands can be achieved, which can improve the communication performance of the antenna assembly and reduce costs. In addition, the antenna structure using a monopole and parasitic stub greatly simplifies the structure of the antenna assembly, improves the integration of the antenna assembly, and reduces the overall size of the antenna assembly. This facilitates the overall miniaturization design of the electronic device with the antenna assembly installed, and increases the layout flexibility of the electronic device with the antenna assembly installed. Attached Figure Description
[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0013] Figure 1 This is a schematic diagram of the structure of an electronic device according to an embodiment;
[0014] Figure 2 This is a schematic diagram of the structure of an antenna assembly according to one embodiment;
[0015] Figure 3a A color diagram of the current distribution corresponding to the first resonant mode of the antenna assembly in one embodiment;
[0016] Figure 3b This is a grayscale image of the current distribution corresponding to the first resonant mode of the antenna assembly in one embodiment.
[0017] Figure 4a A color diagram showing the current distribution corresponding to the second resonant mode of the antenna assembly in one embodiment;
[0018] Figure 4b This is a grayscale image of the current distribution corresponding to the second resonant mode of the antenna assembly in one embodiment.
[0019] Figure 5 This is a schematic diagram of the antenna assembly according to another embodiment;
[0020] Figure 6a A color diagram showing the current distribution corresponding to the third resonant mode of the antenna assembly in one embodiment;
[0021] Figure 6b This is a grayscale image of the current distribution corresponding to the third resonant mode of the antenna assembly in one embodiment;
[0022] Figure 7 This is a schematic diagram of the antenna assembly according to yet another embodiment;
[0023] Figure 8 A circuit diagram of a matching circuit according to one embodiment;
[0024] Figure 9 This is a schematic diagram of the S1,1 curve of an antenna assembly according to one embodiment;
[0025] Figure 10 This is a schematic diagram of the reflection coefficient and Smith circle of an antenna assembly according to one embodiment.
[0026] Figure 11 The following is a simulation diagram of the efficiency of an antenna assembly according to one embodiment;
[0027] Figure 12 This is a block diagram of the internal structure of an electronic device in one embodiment.
[0028] Explanation of reference numerals in the attached figures:
[0029] 100 - Electronic device; 110 - Display assembly; 120 - Bezel; 121 - Top bezel; 123 - Bottom bezel; 122 - First side bezel; 124 - Second side bezel;
[0030] 110 - Radiator; 120 - Parasitic branch; 130 - Coupled circuit; 140 - Inductive component;
[0031] 150 - Matching circuit; 151 - First matching unit; 152 - Second matching unit; 153 - Third matching unit;
[0032] 31-Memory; 311-Operating System; 312-Communication Module (or Instruction Set); 313-Global Positioning System (GPS) Module (or Instruction Set);
[0033] 32 - Processing circuitry; 33 - Peripheral device interface; 36 - Input / output (I / O) subsystem; 361 - User-pressed buttons;
[0034] 39 - Communication bus or signal line. Detailed Implementation
[0035] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0036] It is understood that the terms "first," "second," etc., used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intervening element present.
[0037] The electronic devices involved in the embodiments of this application can be handheld devices, in-vehicle devices, smart cars, wearable devices, computing devices or other processing devices connected to a wireless modem, as well as various forms of user equipment (UE) (e.g., mobile phones), mobile stations (MS), etc. For ease of description, the devices mentioned above are collectively referred to as electronic devices.
[0038] refer to Figure 1 In one embodiment, a mobile phone is used as an example for description. The electronic device 100 includes a display assembly 110 and a housing (not shown in the figure). The display assembly 110 includes a display screen, which can be an OLED (Organic Light-Emitting Diode) screen or an LCD (Liquid Crystal Display) screen. The display assembly 110 can be used to display information and provide an interactive interface for the user. The shape of the display screen can be rectangular or rounded rectangle. A rounded rectangle is sometimes also called a rounded rectangle, meaning that the four corners of the rectangle are rounded, and the four sides of the rectangle are approximately straight lines.
[0039] The housing includes a bezel 120 and a rear cover. The bezel 120 can be made of a metal material such as aluminum alloy, magnesium alloy, or stainless steel, or it can be made of an insulating material such as plastic. The bezel 120 is located on the outer periphery of the display assembly 110 to support and protect the display assembly 110. The bezel 120 can further extend into the electronic device to form a middle plate; the integrally formed middle plate and bezel 120 are sometimes referred to as a mid-frame. The rear cover is located on the side facing away from the display area and is connected to the bezel 120. Furthermore, the display assembly 110 and the rear cover are located on opposite sides of the middle plate.
[0040] The frame 120 is generally rectangular, comprising a top frame 121 and a bottom frame 123 facing away from each other, and a first side frame 122 and a second side frame 124 connecting the top frame 121 and the bottom frame 123. The first side frame 122 and the second side frame 124 are facing away from each other, and the top frame 121, the first side frame 122, the bottom frame 123, and the second side frame 124 are connected end-to-end and located on the outer periphery of the middle plate. Specifically, the connections between the frames 120 can be right-angle connections or arc transition connections. Furthermore, when the frame 120 is a metal frame, multiple metal frame antennas can be formed within the frame 120. Specifically, these metal frame antennas can be formed through slots provided on the frame 120.
[0041] The back cover connects to the frame 120 to define a receiving cavity, i.e., an installation space, for installing electronic components such as batteries, motherboards, and camera modules of electronic devices. The motherboard can be a PCB (Printed Circuit Board) or an FPC (Flexible Printed Circuit). The motherboard can integrate functional devices such as processors, storage units, power management modules, baseband chips, cameras, sensors, and receivers of electronic devices.
[0042] The electronic device also includes a floor. Optionally, the frame 120 surrounds the floor, and it can be understood that the floor is disposed within the receiving space formed by the frame 120. The floor is generally rectangular in shape. Because various slots, holes, etc. are formed on the reference ground edge of the floor as needed to house devices or avoid other structures in the mobile phone. The floor can form a common ground of the electronic device 100, and the floor can be a plane or structure with zero potential. For example, the floor can be formed by conductors, printed circuits, or metal printed layers in the electronic device; or, the floor can be formed on the motherboard, small board, or other carrier board of the electronic device 100; or, the floor can be part of the middle frame (also called the middle plate) of the electronic device 100. It should be noted that the above are several examples of the floor and should not be construed as limiting the floor provided in the embodiments of this application.
[0043] The following examples, with reference to the accompanying drawings, illustrate the specific structures of the antenna assembly and electronic equipment.
[0044] like Figure 2 As shown, the antenna assembly includes a radiator 110, a parasitic stub 120, a coupling circuit 130, and a feed source S. The radiator 110 includes a first end A1 and a second end A2 positioned opposite each other, and a feed point K located on the radiator 110. The radiator 110 only has a feed point K connected to the feed source S and does not have a grounding terminal connected to a common ground. The radiator 110 can be understood as the radiator 110 of a monopole antenna, and can be simply referred to as a monopole.
[0045] The feed point K is located between the first end A1 and the second end A2. Optionally, the feed point K can be a protrusion of the radiator 110 facing the floor.
[0046] The feed point K can be electrically connected to the feed source S. Exemplarily, the electrical connection includes a direct electrical connection between the two structures, or an indirect electrical connection through other components. In this embodiment, the feed point K can be electrically connected to the feed source S through a feed structure. Optionally, the feed structure includes, but is not limited to, conductive springs, conductive screws, coaxial cables, microstrip lines, etc.
[0047] The feed source S includes, but is not limited to, an RF transceiver chip, which can be used to provide an excitation signal (or current signal). Optionally, the feed source S can be located on the motherboard of the electronic device.
[0048] The parasitic branch 120 is provided with a grounding point G connected to a common ground. Exemplarily, the grounding point G is located at the second end B2 of the parasitic branch 120. The grounding point G can be connected to the common ground. In this embodiment, the common ground can be understood as a reference ground, such as the floor of an electronic device. Each grounding point G in this embodiment can be connected to a different location on the floor. In this embodiment, the ends of the radiator 110 and the parasitic branch 120 refer to the ends that are disconnected from other conductive parts on the frame through an insulating gap.
[0049] A gap F exists between the first end B1 of the parasitic branch 120 and the first end A1 of the radiator 110, allowing capacitive coupling between the parasitic branch 120 and the radiator 110. The first end B1 of the parasitic branch 120 can also be understood as an open circuit. Capacitive coupling means that an electric field is generated between the radiator 110 and the parasitic branch 120, allowing the signal from the radiator 110 to be transmitted to the parasitic branch 120 through the electric field, and vice versa, so that electrical signals can be conducted between the radiator 110 and the parasitic branch 120 even when they are disconnected.
[0050] Optionally, the width of the slot F can satisfy the boundary conditions for capacitive coupling between the radiator 110 and the parasitic stub 120. For example, the width of the slot F can be less than or equal to 5 mm. Optionally, the slot F can be filled with an insulating dielectric material to improve the structural strength of the antenna assembly frame 120.
[0051] The coupling circuit 130 is connected to the first terminal A1 of the radiator 110 and the first terminal B1 of the parasitic branch 120, respectively. It can be understood that the coupling circuit 130 is connected in series between the radiator 110 and the parasitic branch 120, and it can be used to increase the coupling between the radiator 110 and the parasitic branch 120.
[0052] The feed source S is used to excite the radiator 110 and the parasitic stub 120 to jointly support the first and second frequency bands. It can be understood that the excitation signal provided by the feed source S is fed to the feed point K, and then transmitted to the radiator 110. The coupling circuit 130 can increase the coupling amount and couple it to the parasitic stub 120, which can excite and generate a resonant current in the radiator 110 and the parasitic stub 120, generating a resonant mode, thereby supporting the first and second frequency bands corresponding to this resonant current. It should be noted that the distribution of the resonant current corresponding to different frequency bands is different. The resonant modes corresponding to the first and second frequency bands are the same, but the resonant modes corresponding to the first and second frequency bands are not the same.
[0053] Furthermore, the feed source S is also used to excite the parasitic stub 120 to support the third frequency band. It can be understood that the excitation signal provided by the feed source S is fed to the feed point K, and then transmitted to the radiator 110. The coupling amount can be increased through the coupling circuit 130, and the signal is coupled to the parasitic stub 120, which can excite and generate a resonant current in the parasitic stub 120, generating a resonant mode, and thus supporting the third frequency band corresponding to the resonant current. It can be understood that the antenna assembly provided in this embodiment can generate three resonant frequency points under the action of the excitation signal provided by the feed source S. The resonant frequency points can be the centerline frequency points of each frequency band.
[0054] The center frequencies of the first, second, and third frequency bands are different. The center frequencies of the first and second frequency bands are lower than the center frequency of the third frequency band. The center frequency of the first frequency band is lower than the center frequency of the second frequency band. In other words, the minimum frequency of the corresponding frequency range of the second frequency band is greater than the maximum frequency of the corresponding frequency range of the first frequency band.
[0055] In an exemplary embodiment, the communication standards of the first, second, and third frequency bands can be the same or different. These communication standards include, but are not limited to, cellular standards, WiFi communication standards, Bluetooth communication standards, and GPS communication standards. In this embodiment, for ease of explanation, an example is provided where the first, second, and third frequency bands are all cellular standard frequency bands. Exemplarily, the first, second, and third frequency bands can be 4G LTE signal bands or 5G NR signal bands. Exemplarily, the first frequency band can be an intermediate frequency band (MHB, 300kHz-3MHz), such as, but not limited to, 4G LTE intermediate frequency bands such as B1, B3, B2, B4, B9, B34, and B39, or the corresponding 5G NR intermediate frequency bands of 4G LTE intermediate frequency bands. The second frequency band can be a high-frequency band (HB, 3MHz-30MHz), such as, but not limited to, 4G LTE high-frequency bands such as B7, B38, B40, and B41, or 5G NR high-frequency bands corresponding to 4G LTE high-frequency bands. The third frequency band can be an ultra-high-frequency band (UHB, 300MHz-30GHz), such as, the N77, N78, or N79 bands.
[0056] It should be noted that the first frequency band, second frequency band, and third frequency band are not limited to the examples described above. They can also be low-frequency bands, WiFi bands, Bluetooth bands, and GPS bands, respectively. In this embodiment, the specific frequency bands and corresponding frequency ranges of the first, second, and third frequency bands are not further limited.
[0057] In an exemplary embodiment, the radiator 110 and the parasitic branch 120 may be one of the following: a flexible printed circuit (FPC) antenna radiator, a laser direct structural (LDS) antenna radiator, a printed direct structural (PDS) antenna radiator, a metal radiating branch, or a mode decoration antenna (MDA). In this embodiment, the types of the radiator 110 and the parasitic branch 120 are not further limited, and the types of the radiator 110 and the parasitic branch 120 may be the same or different. In this embodiment, the shapes of the radiator 110 and the parasitic branch 120 may be strip-shaped, bent, curved, etc. In this embodiment, the shapes of the radiator 110 and the parasitic branch 120 are not limited.
[0058] The aforementioned antenna assembly includes a radiator, a parasitic stub, a feed, and a coupling circuit. The radiator is capacitively coupled to the parasitic stub through a slot, and a coupling circuit is provided between the radiator and the parasitic stub to increase the coupling. The excitation signal provided by the feed can be coupled to the parasitic stub via the radiator and the coupling circuit, increasing the coupling between the radiator and the parasitic stub to support the first and second frequency bands. It can also excite the parasitic stub to support the third frequency band. Thus, coverage of three frequency bands can be achieved without the need for an additional antenna switch, such as supporting intermediate frequency, high frequency, and ultra-high frequency coverage. Furthermore, multiple carrier aggregation states between the three frequency bands can be achieved, improving the communication performance of the antenna assembly and reducing costs. In addition, the use of a monopole and parasitic stub antenna structure greatly simplifies the structure of the antenna assembly, improves the integration of the antenna assembly, and reduces the overall size of the antenna assembly. This facilitates the miniaturization design of electronic devices equipped with the antenna assembly and increases the layout flexibility of the electronic devices with the antenna assembly.
[0059] In an exemplary embodiment, a coupling circuit 130 is connected in series between the radiator 110 and the parasitic stub 120. For example, a first terminal of the coupling circuit 130 is connected to a first terminal A1 of the radiator 110, and a second terminal of the coupling circuit 130 is connected to a first terminal B1 of the parasitic stub 120. The coupling circuit 130, connected in series between the radiator 110 and the parasitic capacitor, can increase the coupling between the radiator 110 and the parasitic stub 120, and can excite the entire arm of the radiator 110 and the parasitic stub 120 to generate corresponding resonant modes, thereby supporting a first frequency band and a second frequency band. Exemplarily, the coupling circuit 130 connected in series between the radiator 110 and the parasitic capacitor can excite the radiator 110 and the parasitic stub 120 to generate a first resonant mode to support the first frequency band, and a second resonant mode to support the second frequency band.
[0060] In an exemplary embodiment, the resonant modes corresponding to the first and second frequency bands include quarter-wavelength modes of the radiator 110 and the parasitic stub 120. That is, both the first and second resonant modes include quarter-wavelength modes of the radiator 110 and the parasitic stub 120. It should be noted that although both the first and second resonant modes are quarter-wavelength modes of the entire arm, the current distributions corresponding to the first and second resonant modes are slightly different. For example, for ease of explanation, the first frequency band is described as a mid-frequency band and the second frequency band as a high-frequency band. Figure 3a This is a color diagram of the current distribution corresponding to the first resonant mode. Figure 3b This is a grayscale image of the current distribution corresponding to the first resonant mode. (Example:) Figure 3a and Figure 3bAs shown, under the excitation signal provided by the feed S, the radiator 110 and the parasitic stub 120 can be excited to generate a first resonant mode to support a first frequency band. For example, the first resonant frequency of the first resonant mode is 1.8 GHz, and the corresponding first frequency band is the B3 band.
[0061] Figure 4a This is a color diagram of the current distribution corresponding to the second resonant mode. Figure 4b This is a grayscale image of the current distribution corresponding to the second resonant mode. (Example:) Figure 4a and Figure 4b As shown, under the excitation signal provided by the feed S, the radiator 110 and the parasitic stub 120 can also be excited to generate a second resonant mode to support a second frequency band. For example, the second resonant frequency of the second resonant mode is 2.6 GHz, and the corresponding second frequency band is the B41 band.
[0062] In an exemplary embodiment, the coupling circuit 130 includes one or more capacitors. In this embodiment, the total capacitance of the coupling circuit 130 affects the first resonant frequency and the second resonant frequency. The first resonant frequency is the resonant point of a first resonant mode, and the second resonant frequency is the resonant point of a second resonant mode. For example, the total capacitance of the coupling circuit 130 is negatively correlated with both the first and second resonant frequencies. For instance, the larger the total capacitance of the coupling circuit 130, the lower the first and second resonant frequencies, meaning the first and second resonant frequencies shift towards lower frequencies.
[0063] For example, such as Figure 5 As shown, the coupling circuit 130 may include a capacitor C1, the first end of which is connected to the first end of the radiator 110, and the second end of which is connected to the first end of the parasitic stub 120. For example, the capacitance value of the capacitor C may be 0.5pF to 1pF, such as 0.5pF, 0.6pF, 0.7pF, 0.8pF, 0.9pF, or 1pF, or any other value between 0.5pF and 1pF.
[0064] For example, the coupling circuit 130 may include multiple capacitors, which may be connected in series, parallel, or series-parallel configurations. The total capacitance of the coupling circuit 130 may be determined based on the connection method of the multiple capacitors, and is not specifically limited thereto.
[0065] In this embodiment, by providing a coupling circuit including at least one capacitor between the radiator and the parasitic branch, the radiator and the parasitic branch can be excited to generate a full-arm (radiator and parasitic branch) current mode to support the first and second frequency bands. In addition, the center frequency of the first and second frequency bands can be adjusted by changing the total capacitance value of the coupling circuit. Without adding an antenna switch, for example, frequency bands such as B3, B1, B40, and B41 can be covered. This not only eliminates the need for an antenna switch but also enables carrier aggregation (CA) between mid- and high-frequency bands, improving the communication performance of the antenna assembly.
[0066] In one exemplary embodiment, under the excitation signal provided by the feed source S, the parasitic stub 120 can also be excited to generate a third resonant mode to support a third frequency band. The resonant modes corresponding to the third frequency band include the quarter-wavelength mode of the parasitic stub 120. Figure 6a This is a color diagram of the current distribution corresponding to the third resonant mode. Figure 6b This is a grayscale image of the current distribution corresponding to the third resonant mode. (Example:) Figure 6a and Figure 6b As shown, under the action of the excitation signal, an excitation current can also be generated on its radiator 110, but the third resonant mode is the main current mode, which is the 1 / 4 wavelength mode of the parasitic branch 120. That is, here, the 1 / 4 wavelength mode of the parasitic branch 120 accounts for a relatively high proportion, and its third frequency band is generated by the parasitic branch 120.
[0067] The antenna assembly provided in this embodiment can excite the full-arm current mode of the radiator and parasitic stubs to support the first and second frequency bands, and can also excite the 1 / 4 wavelength mode of the parasitic stubs to support the third frequency band. In this way, coverage of three frequency bands can be achieved without the need to introduce an additional antenna switch, such as supporting intermediate frequency, high frequency and ultra-high frequency coverage. Furthermore, multiple carrier aggregation states between the three frequency bands can be achieved, which can improve the communication performance of the antenna assembly and reduce costs.
[0068] Please continue to refer to this. Figure 5 In one exemplary embodiment, the antenna assembly further includes an inductive component 140. A first end of the inductive component 140 is connected to a connection point of the parasitic stub 120, and a second end of the inductive component 140 is connected to a common ground. The connection point is located near the first end of the parasitic stub 120. It is understood that the connection point is the point where the inductive component 140 connects to the parasitic stub 120. That is, this connection point is located near the gap F. Thus, the inductive component 140 is located at the open end of the parasitic stub 120 and connected in parallel with the parasitic stub 120.
[0069] The inductive component 140 is connected in parallel with the open terminal of the parasitic stub 120. This connection allows adjustment of the electrical length of the parasitic stub 120 to change the center frequency of the third frequency band, thus achieving adjustment of the center frequency of the third frequency band. It should be noted that electrical length refers to the effective length of the antenna or other components relative to the wavelength of the electromagnetic wave. The electrical length of the parasitic stub 120 is negatively correlated with the operating wavelength. That is, the longer the electrical length, the lower the frequency corresponding to its operating band.
[0070] In this embodiment, by connecting an inductive component in parallel with the open end of the parasitic stub, the electrical length of the parasitic stub can be changed to generate a third resonant mode supporting the third frequency band. For example, the inductive component can increase the electrical length of the parasitic stub to shift the third resonant frequency of the third resonant mode towards a lower frequency. For instance, the third resonant frequency corresponding to the third resonant mode can be shifted from a frequency greater than 3.5 GHz to 3.5 GHz to support the N78 frequency band. Thus, by adding an inductive component to the open end of the parasitic stub, the electrical length of the parasitic stub can be increased without increasing the physical length of the parasitic support to support the third frequency band. This further reduces the physical size of the antenna assembly, which is beneficial for the miniaturization design of the antenna assembly.
[0071] In one exemplary embodiment, the inductive component 140 includes one or more inductors, wherein the total inductance value of the inductive component 140 is negatively correlated with the center frequency of the third frequency band. It is understood that the larger the total inductance of the inductive component, the lower its center frequency of the third frequency band. For example, please refer to... Figure 5 The inductive component 140 includes an inductor L1, a first end of which is connected to a connection point on the parasitic stub 120, and a second end of which is connected to a common ground. The inductance value of the inductor L1 can be designed based on the physical length of the parasitic stub 120, the location of the connection point and the ground point G, and the third frequency band (e.g., N78 band) that the antenna assembly needs to support.
[0072] In one exemplary embodiment, the inductive component 140 may further include multiple inductors. The multiple inductors may be connected in series, parallel, or series-parallel configurations. In this application embodiment, the number of inductors included in the inductive component 140 and the connection method are not limited, nor are they limited to the examples described above.
[0073] The antenna assembly provided in this embodiment can excite the full-arm current mode of the radiator and parasitic stubs to support the first and second frequency bands, and can also excite the 1 / 4 wavelength mode of the parasitic stubs to support the third frequency band. Furthermore, by incorporating an inductive component, the frequency point of the third frequency band can be adjusted without changing the physical dimensions of the parasitic stubs, thereby achieving coverage of the three frequency bands. For example, it can cover 1.8GHz-3.8GHz, covering the MHB and N78 bands, thus enabling multiple carrier aggregation states among the three frequency bands and improving the communication performance of the antenna assembly.
[0074] like Figure 7 As shown, in an exemplary embodiment, the antenna assembly may further include a matching circuit 150. A first terminal of the matching circuit 150 is connected to the feed point K, and a second terminal is connected to the feed source S. The feed source S is connected to the feed point K via the matching circuit 150. The excitation signal provided by the feed source S is output to the feed point K after passing through the matching circuit 150, and then fed into the radiator 110. Under the action of the coupling circuit 130, the radiator 110 and the parasitic stub 120 can be excited to generate two resonant modes to support the first and second frequency bands, such as the mid-high frequency band. Furthermore, the parasitic stub 120 can also be excited to generate a third resonant mode to support the third frequency band, such as the ultra-high frequency band. Simultaneously, the matching circuit 150 can also be used to adjust the resonant frequency of each resonant mode.
[0075] The matching circuit 150 may include multiple lumped elements, which can be connected in series, parallel, or series-parallel configurations. These lumped elements include, but are not limited to, capacitors and inductors. By adjusting the matching parameters of the matching circuit 150, the resonant frequency of each resonant mode can be adjusted. These matching parameters include, but are not limited to, capacitance and inductance values.
[0076] In this embodiment, the antenna assembly, by setting up coupling and matching circuits, can generate three resonant frequencies and adjust the resonant frequencies to achieve broadband matching, covering 1.8GHz-3.8GHz, and covering the MHB and N78 bands.
[0077] like Figure 8 As shown, in an exemplary embodiment, the matching circuit 150 includes a first matching unit 151, a second matching unit 152, and a third matching unit 153. The first matching unit 151, the second matching unit 152, and the third matching unit 153 are sequentially connected to the path between the feed point K and the feed source S. The second matching unit 152 and the third matching unit 153 are also connected to a common ground terminal. Exemplarily, the second matching unit 152 and the third matching unit 153 may include three connection terminals, such as a first terminal, a second terminal, and a third terminal.
[0078] The first end of the first matching unit 151 is connected to the feed point K, and the second end of the first matching unit 151 is connected to the first end of the second matching unit 152. The first matching unit 151 can be used to adjust the resonant frequency (e.g., the first resonant frequency) of the first resonant mode corresponding to the first frequency band.
[0079] For example, the first matching unit 151 may include a second capacitor C2. The first terminal of the second capacitor C2 serves as the first terminal of the first matching unit 151 and is electrically connected to the feed point K of the radiator 110; the second terminal of the second capacitor serves as the second terminal of the first matching unit 151 and is connected to the first terminal of the second matching unit 152. The capacitance of the second capacitor C2 is negatively correlated with the first resonant frequency. That is, the larger the capacitance of the second capacitor C2, the lower the frequency of the first resonant mode.
[0080] For example, by adjusting the capacitance value of the second capacitor C2 in the first matching unit 151, the resonant frequency generated by the radiator 110 and the parasitic branch 120 can be excited to 1.8 GHz to support the B3 and B1 bands.
[0081] The second end of the second matching unit 152 is connected to the first end of the third matching unit 153, and the third end of the second matching unit 152 is connected to the common ground. The second matching unit 152 is used to adjust the resonant frequency (e.g., the second resonant frequency) of the second resonant mode corresponding to the second frequency band.
[0082] For example, the second matching unit 152 may include a second inductor L2 and a third inductor L3. The first end of the second inductor L2 can serve as the first end of the second matching unit 152 and is connected to the second end of the first matching unit 151. The second end of the second inductor L2 is connected to the first ends of both the third inductor L3 and the third matching unit 153. The second end of the third inductor L3 can serve as the third end of the second matching unit 152 and is connected to a common ground. The second end of the second inductor L2, or the first end of the third inductor L3, or the connection node between the second inductor L2 and the third inductor L3 can serve as the second end of the second matching unit 152.
[0083] The second matching unit 152 includes a second inductor L2, which can be understood as a series inductor, and a third inductor L3, which can be understood as a parallel inductor. These components can be used to tune the second resonant mode, thereby adjusting the resonant frequency of the second resonant mode. For example, by adjusting the second matching unit 152, the resonant frequency generated by the radiator 110 and the parasitic stub 120 can be excited to 2.6 GHz to support the B41 band.
[0084] Furthermore, under the action of the first matching unit 151 and the second matching unit 152, the radiator 110 and the parasitic branch 120 can support the B40 frequency band in addition to supporting the B3, B1, and B41 frequency bands. Since the B40 frequency band is located between the resonant frequency point corresponding to the first resonant mode and the resonant frequency point corresponding to the second resonant mode, the B40 frequency band can be covered by adjusting the component parameters of the first matching unit 151 and the second matching unit 152.
[0085] The second end of the third matching unit 153 is connected to the feed S, and the third end of the third matching unit 153 is connected to the common ground. The third matching unit 153 can be used to adjust the resonant frequency of the third resonant mode corresponding to the third frequency band (e.g., the third resonant frequency).
[0086] For example, the third matching unit 153 may include a fourth inductor L4 and a third capacitor C3. The first terminal of the fourth inductor L4 is connected to the first terminal of the third capacitor C3 and the second terminal of the second matching unit 152, respectively. The second terminal of the third capacitor C3 can serve as the third terminal of the third matching unit 153, connected to a common ground. The first terminal of the fourth inductor L4 can serve as the second terminal of the third matching unit 153, connected to the feed S. The first terminal of the fourth inductor L4, or the first terminal of the third capacitor C3, or the connection node between the fourth inductor L4 and the third capacitor C3 can serve as the first terminal of the third matching unit 153. The third capacitor C3 included in the third matching unit 153 can be understood as a parallel capacitor, and the fourth inductor L4 can be understood as a series inductor. These can be used to tune the third resonant mode, thereby adjusting the resonant frequency of the third resonant mode. For example, by adjusting the third matching unit 153, the resonant frequency generated by the radiator 110 and the parasitic stub 120 can be excited to 3.5 GHz to support the N78 band.
[0087] It should be noted that, in the embodiments of this application, the specific forms of the first matching unit 151, the second matching unit 152, and the third matching unit 153 are not limited to the examples described above.
[0088] In this embodiment, the antenna assembly, by setting coupling and matching circuits, can generate three resonant frequencies and adjust these frequencies to achieve broadband matching, covering 1.8GHz-3.8GHz. This achieves broadband coverage of the MHB and N78 bands, such as the B3, B1, B40, B41, and N78 bands. Furthermore, it enables multiple carrier aggregation states across the three bands, improving the communication performance of the antenna assembly at a low cost. Additionally, its monopole and parasitic stub antenna structure greatly simplifies the antenna assembly's structure, increases its integration, and reduces its overall size to 20mm. This facilitates the miniaturization of electronic devices equipped with the antenna assembly and enhances the layout flexibility of the device.
[0089] In this embodiment, for ease of explanation, the radiator 110 and parasitic stub 120 are described as metallic radiating stubs (e.g., the conductive frame of an electronic device) to illustrate the specific structure of the antenna assembly. The antenna assembly includes a radiator 110, a parasitic stub 120, a coupling circuit 130, an inductive component 140, and a matching circuit 150. A series coupling capacitor C is connected between the radiator 110 and the parasitic stub 120, increasing the coupling and exciting the entire arm of the radiator 110 and parasitic stub 120 into a current mode. Furthermore, an inductor L is connected in parallel to the open terminal of the parasitic stub 120, allowing adjustment of its electrical length to shift it towards lower frequencies. The matching circuit 150 at the feed point K of the radiator 110 is as follows... Figure 8 As shown, the second capacitor C2 is used to adjust the first resonant frequency of the first resonant mode. If the capacitance of the second capacitor C2 increases, the first resonant frequency will be lower. The second inductor L2 and the third inductor L3 are used to adjust the second resonant frequency of the second resonant mode. The third capacitor C3 and the fourth inductor L4 are connected in parallel (capacitor-inductor) to adjust the third resonant frequency of the third resonant mode.
[0090] Figure 9 The S1,1 curve of the antenna assembly is shown. Figure 10 The image shows the reflection coefficient of the antenna assembly versus the Smith chart. Figure 11 This is a simulation diagram of the antenna assembly's efficiency. Figure 11 In the diagram, curve ① represents the radiation efficiency of the antenna assembly; curve ② represents the overall efficiency of the antenna assembly. For example... Figures 9-11As shown in the simulation data, the antenna assembly can generate three resonant frequency points, covering 1.8GHz-3.8GHz, and can cover the MHB plus N78 bands. For example, it can cover the B3, B1, B40, B41 and N78 bands, and can also improve antenna impedance matching and increase antenna efficiency. Furthermore, its monopole and parasitic stub 120 antenna structure greatly simplifies the antenna assembly structure, improves the antenna assembly integration, and reduces the overall size of the antenna assembly. The physical dimensions of the radiator 110 and parasitic stub 120 are approximately 20mm, which is beneficial for improving the overall miniaturization design of electronic devices equipped with this antenna assembly and increasing the layout flexibility of the electronic device. When this antenna assembly is applied to electronic devices, it can serve as a MIMO antenna for the MHB band, eliminating the need for a switch while supporting CA states between the MHB and N78 bands and between different MHB bands, thus improving the communication performance of the electronic device.
[0091] This application also provides an electronic device including the antenna assembly from any of the foregoing embodiments.
[0092] For example, for ease of illustration, an antenna assembly is applied to, such as Figure 1 The illustrated electronic device is used as an example for illustration. The radiator 110 and parasitic branch 120 in the antenna assembly may be located on the same side of the electronic device or at a corner of the electronic device. For example, the radiator 110 and parasitic branch 120 of the antenna assembly may be located on any edge of the electronic device, such as the top edge 121, the bottom edge 123, or any side edge.
[0093] Optionally, the radiator 110 and parasitic stub 120 of the antenna assembly are disposed at a corner position of the electronic device. In an exemplary embodiment, the extending direction of the radiator 110 is different from and intersects the extending direction of the parasitic stub 120. Exemplarily, the radiator 110 may be located on the top edge 121 of the electronic device, and the parasitic stub 120 may be located on the first side edge 122 or the second side edge 124 of the electronic device. Exemplarily, the radiator 110 may be located on the bottom edge 123 of the electronic device, and the parasitic stub 120 may be located on the first side edge 122 or the second side edge 124 of the electronic device. It should be noted that the antenna assembly in any of the foregoing embodiments can be arranged at any position on the electronic device, not limited to the side or corner.
[0094] like Figure 12 As shown, further explanation will be given using a mobile phone as an example of the aforementioned electronic device. Specifically, as follows... Figure 12As shown, the mobile phone may include a memory 31 (which optionally includes one or more computer-readable storage media), processing circuitry 32, a peripheral device interface 33, an antenna assembly as described in the above embodiments, and an input / output (I / O) subsystem 36. These components optionally communicate via one or more communication buses or signal lines 39. Those skilled in the art will understand that... Figure 12 The mobile phone shown does not constitute a limitation on the mobile phone and may include more or fewer components than shown, or combine certain components, or have different component arrangements. Figure 12 The various components shown are implemented in hardware, software, or a combination of both, including one or more signal processing and / or application-specific integrated circuits.
[0095] Memory 31 optionally includes high-speed random access memory, and also optionally includes non-volatile memory, such as one or more disk storage devices, flash memory devices, or other non-volatile solid-state memory devices. Exemplary examples include software components stored in memory 31 such as an operating system 311, a communication module (or instruction set) 312, a global positioning system (GPS) module (or instruction set) 313, etc.
[0096] The processing circuit 32 and other control circuits can be used to control the operation of the mobile phone. The processing circuit 32 can be based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application-specific integrated circuits, etc. The processing circuit 32 can be configured to implement control algorithms for controlling the use of electronic devices in the mobile phone. The processing circuit 32 can also issue control commands for controlling various switches in the electronic devices.
[0097] I / O subsystem 36 couples input / output peripherals on the mobile phone, such as the keypad and other input control devices, to peripheral interface 33. I / O subsystem 36 optionally includes a touchscreen, buttons, a tone generator, an accelerometer (motion sensor), an ambient light sensor and other sensors, light-emitting diodes and other status indicators, data ports, etc. For example, a user can control the operation of the mobile phone by supplying commands via I / O subsystem 36, and can use the output resources of I / O subsystem 36 to receive status information and other outputs from the mobile phone. For example, a user can press button 361 to turn the mobile phone on or off.
[0098] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered within the scope of this specification. The above embodiments only illustrate several implementation methods of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this patent application. It should be noted that for those skilled in the art, several modifications and improvements can be made without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. An antenna assembly, characterized in that, include: A radiator includes a first end and a second end disposed opposite to each other, and a first feed point disposed on the radiator; The parasitic branch has a gap between its first end and the first end of the radiator, and the parasitic branch is provided with a grounding point connected to a common ground. The feed source is connected to the feed point; The coupling circuit is connected to the first end of the radiator and the first end of the parasitic branch, respectively. The excitation signal provided by the feed source is transmitted to the parasitic stub via the coupling circuit to excite the radiator and the parasitic stub to support the first frequency band and the second frequency band, and to excite the radiator to support the third frequency band; wherein the center frequency of the first frequency band and the second frequency band is less than the center frequency of the third frequency band.
2. The antenna assembly according to claim 1, characterized in that, The coupling circuit includes at least one capacitor and is used to excite the current modes of the radiator and the parasitic branch.
3. The antenna assembly according to claim 2, characterized in that, The resonant modes corresponding to the first frequency band and the second frequency band include the quarter-wavelength modes of the radiator and the parasitic branch.
4. The antenna assembly according to claim 1, characterized in that, The antenna assembly also includes: A sensing component, wherein a first end of the sensing component is connected to the connection point of the parasitic branch, and a second end of the sensing component is connected to the common ground terminal, for adjusting the center frequency of the third frequency band, wherein the connection point is located near the first end of the parasitic branch.
5. The antenna assembly according to claim 4, characterized in that, The inductive component includes at least one inductor, wherein the total inductance of the inductive component is negatively correlated with the center frequency of the third frequency band.
6. The antenna assembly according to claim 1, characterized in that, The resonant modes corresponding to the third frequency band include the quarter-wavelength mode of the parasitic stub.
7. The antenna assembly according to claim 1, characterized in that, The antenna assembly also includes: A matching circuit, wherein a first terminal of the matching circuit is connected to the feed point and a second terminal of the matching circuit is connected to the feed source, is used to adjust the resonant frequency points of the resonant modes corresponding to the first frequency band, the second frequency band and the third frequency band respectively.
8. The antenna assembly according to claim 7, characterized in that, The matching circuit includes a first matching unit, a second matching unit, and a third matching unit, wherein, The first end of the first matching unit is connected to the feed point, and the second end of the first matching unit is connected to the first end of the second matching unit, for adjusting the resonant frequency of the first resonant mode corresponding to the first frequency band; The second end of the second matching unit is connected to the first end of the third matching unit, and the third end of the second matching unit is connected to the common ground terminal, for adjusting the resonant frequency of the second resonant mode corresponding to the second frequency band; The second end of the third matching unit is connected to the feed source, and the third end of the third matching unit is connected to the common ground terminal, which is used to adjust the resonant frequency of the third resonant mode corresponding to the third frequency band.
9. An electronic device, characterized in that, include: The antenna assembly as described in any one of claims 1-8.
10. The electronic device according to claim 9, characterized in that, The electronic device also includes: The frame includes a top frame, a first side frame, a bottom frame, and a second side frame connected in sequence, wherein the radiator and the parasitic branch are both located on the first side frame or the second side frame.