Connector with ground cage receptacle for data center

Abstract

The present disclosure relates to connectors with ground cage receptacles for data centers. The systems and methods disclosed herein are applicable to connectors with ground cage receptacles that can surround at least a barrel segment of the connector. The barrel segment can include pins and springs for transmitting data signals. The ground cage receptacle can be coupled to a receiving cage receptacle of a circuit board to provide a ground reference for the data signals. The pins can be extended from or retracted into the barrel segment based at least in part on at least one detent feature associated with the receiving cage receptacle. The detent feature can hold the ground cage receptacle in a predetermined position relative to the receiving cage receptacle. The detent feature allows the pins to contact signal surface contact pads on the circuit board for transmitting the data signals to the circuit board.

Description

[0001] Cross-references to related applications This application claims priority to U.S. Provisional Patent Application No. 63 / 791,249, U.S. Provisional Patent Application Serial No. 63 / 774,580, and U.S. Patent Application No. 19 / 378,870. The entire contents of these three applications are incorporated herein by reference and form part of this specification for all purposes. Technical Field

[0002] This article relates in at least one aspect to circuit board connectors in general, and more specifically to features used inside circuit board connectors. Background Technology

[0003] Circuit board connectors (such as lead frame connectors) can serve as bridges for signals, power, or other connections. They can be used between circuit boards, such as between daughterboards or cards and backplanes or middleboards in racks in data centers. Attached Figure Description

[0004] Various embodiments according to this disclosure will now be described with reference to the accompanying drawings.

[0005] Figure 1A Details of a circuit board connector with a grounded cage socket are shown in one example. The grounded cage socket is isolated from the cylindrical section and pins of the lead pairs therein by one or more dielectric structures.

[0006] Figure 1B Another example of a dielectric structure that can be used in circuit board connectors is shown (compared to...) Figure 1A Furthermore, the dielectric structure has different sizes or shapes that are predetermined, at least in part, based on the expected impedance distribution curve.

[0007] Figure 1C Another example of a dielectric structure that can be used in a circuit board connector is shown, which has different dimensions or shapes, and which are predetermined at least in part based on a desired impedance distribution curve.

[0008] Figure 1D Another example of a dielectric structure that can be used in a circuit board connector is shown, which has different dimensions or shapes, and which are predetermined at least in part based on a desired impedance distribution curve.

[0009] Figure 1E Another example of a dielectric structure that can be used in a circuit board connector is shown, which has different dimensions or shapes that are predetermined based at least in part on a desired impedance distribution curve.

[0010] Figure 1FAn example is shown from Figure 1A The expected impedance distribution curve of the dielectric structure in the circuit board connector is shown.

[0011] Figure 1G Showing from Figure 1B Another example of the expected impedance distribution curve of the dielectric structure in the circuit board connector shown.

[0012] Figure 1H Showing from Figure 1C Another example of the expected impedance distribution curve of the dielectric structure in the circuit board connector shown.

[0013] Figure 1AA A conventional view and a cross-sectional view of a grounded cage socket for a lead frame connector, according to at least some embodiments, are shown, the grounded cage socket being designed to couple with a receiving cage socket.

[0014] Figure 1BB A conventional view and a cross-sectional view of a grounding cage socket for a lead frame connector according to at least some embodiments are shown, the grounding cage socket being coupled to a receiving cage socket via an internal coupling.

[0015] Figure 1CC A conventional view and a cross-sectional view of a grounding cage socket for a lead frame connector according to at least some embodiments are shown, the grounding cage socket being coupled to a receiving cage socket via an external coupling.

[0016] Figure 1DD Different lead frame connectors having lead segments and barrel segments are shown according to at least some embodiments.

[0017] Figure 1EE A cross-sectional view of a lead frame connector having lead segments and a barrel segment according to at least some embodiments is shown.

[0018] Figure 1FF Process details of a cylindrical section having a needle and a spring, according to at least some embodiments, are shown.

[0019] Figure 1GG It is a perspective view of an angled feature according to at least some embodiments, which allows the cylindrical sections of the connector, which are part of the lead frame connector, to be separated at a 90-degree angle.

[0020] Figure 1HH It is a side view of an angled feature according to at least some embodiments, which allows the cylindrical segments of the connector, which are part of the lead frame connector, to maintain a 90-degree angle of separation.

[0021] Figure 1IIThis is a partial view of a connector according to at least some embodiments, the connector having retractable pins within its cylindrical section.

[0022] Figure 1JJ A partial cross-sectional view of a connector according to at least some embodiments is shown, the connector having a retractable pin and a compression spring within its cylindrical section.

[0023] Figure 2A A connection is shown between two circuit boards and used for differential signal transmission via a lead frame connector, according to at least some embodiments.

[0024] Figure 2B The connection between the sub-plate and the back plate or middle plate is shown according to at least some embodiments.

[0025] Figure 3A A process or method for a circuit board connector having a grounded cage socket according to at least some embodiments is shown, the grounded cage socket being isolated from the cylindrical section and pins of the lead pairs therein by one or more dielectric structures.

[0026] Figure 3AA A process or method for a connector having a lead segment and a barrel segment is shown according to at least some embodiments.

[0027] Figure 3BB A process or method for a connector having a grounded cage socket is shown according to at least some embodiments.

[0028] Figure 4 The application is shown. Figure 1A-3BB and Figure 5-7 An example data center for at least one embodiment of power connection.

[0029] Figure 5 The application is shown in Figures 1-4 and Figure 6A-7 Various aspects of an example rack in at least one embodiment.

[0030] Figure 6A An example data center system according to at least one embodiment is shown.

[0031] Figure 6B This is a schematic diagram illustrating a computing system (which may be a data center or a high-performance computing (HPC) cluster) in which at least one embodiment described herein can be used.

[0032] Figure 6C A computer system according to at least one example is shown, in which at least one embodiment described herein can be used.

[0033] Figure 7An example network configuration is shown that can be used to implement various aspects of the embodiments, such as providing, generating, modifying, encoding, processing, fusing and / or transmitting generated image data, calculated measurements or other such content. Detailed Implementation

[0034] The following description will illustrate various embodiments. For ease of explanation, specific configurations and details are listed herein to enable the reader to thoroughly understand these embodiments. However, those skilled in the art will also understand that these embodiments can be implemented even without considering these specific details. Furthermore, to avoid obscuring the described embodiments, some well-known features may be omitted or simplified.

[0035] Leadframe connectors can be bridging connectors used between circuit boards (also referred to herein as printed circuit boards (PCBs)). These PCBs can be daughterboards (or expansion cards) in racks in data centers, as well as backplanes or middleboards. For example, in one example, each leadframe connector may include multiple connectors that form one or more circuit board connectors within the leadframe connector. In some examples, pairs of connectors among the multiple connectors can be used to implement differential signal transmission and may represent a circuit board connector. Each of the multiple connectors can be coupled to a corresponding receiver connector via the circuit board connector. The circuit board connector may include a grounded cage receptacle surrounding the lead segment and the housing segment of the lead. When more than one lead is available (e.g., a lead pair for differential signal transmission), the grounded cage receptacle surrounds the lead pair. The housing segment may be integrally formed with or associated with the lead segment and internally houses pins and springs. The grounded cage receptacle is designed to couple to the receiver cage receptacle of the receiver connector. The receiving cage socket includes one or more stop features for securing the grounding cage socket and the cylindrical section in a predetermined position, so that the pins of each of the multiple connectors can apply a predetermined connection pressure or maintain a predetermined connection resistance under spring support, to achieve signal transmission to surface contact pads on the backplane or middle plate. As referred to herein, a "surface contact pad" can be either a conductive area on the PCB surface or a lead from a component on the PCB designed for electrical connection to other components inside or outside the PCB.

[0036] As part of a circuit board connector, it may include lead pairs, each representing at least two connectors, for providing differential signal transmission, while a grounding cage receptacle provides a ground reference. For example, the circuit board connector may include a grounding cage receptacle surrounding the lead pairs; these lead pairs may include a barrel section and a lead section housing a pin. The dimensions of the barrel section may differ from the dimensions of the pin, at least because the pin is thinner and can slide inside the barrel section when in contact with the receiving connector of the circuit board. The grounding cage receptacle may be separated from the barrel section and the pin by one or more dielectric structures. These dielectric structures may have one or more sizes or shapes predetermined, at least in part, based on an expected impedance distribution profile that needs to be maintained between the barrel section and the pin. In some examples, the expected impedance distribution profile may include an expected impedance value in the range of about 82 to about 100 ohms differential impedance. In some examples, the expected impedance distribution profile may include an expected impedance value in the range of about 85 to about 100 ohms differential impedance. In some examples, the expected impedance profile may include expected impedance values ​​within a differential impedance range of approximately 82 or 83 ohms. The size or shape of the dielectric structure may be predetermined to allow or support a deviation of less than 1% from the expected impedance profile in practical applications. The dielectric structure enables pin alignment and ensures impedance consistency throughout the board connector. The dielectric structure also provides mechanical rigidity to the pins, ensuring they remain parallel and aligned. This rigidity also supports or ensures signal integrity in high-speed applications.

[0037] The one or more dielectric structures can have a variety of different shapes and sizes, including cases where air gaps are included within the dielectric structures. The impedance distribution curves can exist as part of different impedance distribution curves achievable through the one or more dielectric structures. In differential signal transmission, these different impedance distribution curves help prevent signal reflections caused by impedance mismatch, minimize signal or signal characteristic loss, improve noise immunity, reduce sensitivity to noise, support differential signal transmission at different frequencies, times, or rates, achieve predictable signal transmission, and allow for improved simulations before the signal is physically applied.

[0038] The grounded cage socket with dielectric structure described in this article addresses issues related to signal and power interconnects (connectors); such connectors typically contain lead pairs of varying sizes, such as shell sections and pins on the lead sections. These shell sections and pins need to be held securely and may require support from a grounded shield that can accommodate their different sizes. The method of wrapping the lead pairs can introduce impedance problems—such as impedance mismatch—which can adversely affect differential signal transmission. This wrapping method may not provide the necessary electrical performance tuning capabilities, making it difficult to ensure effective impedance is maintained within the connector. While the wrapping material provides mechanical support, the resulting impedance may be too low for high-speed signal transmission. In some examples, deviations from the intended impedance profile may even exceed 30%.

[0039] The grounding cage receptacle with dielectric structure described herein provides a solution that can accommodate different lead pair sizes and provide a predetermined impedance profile, partly based on a specific application. Such applications may include differential signal transmission involving specific frequencies. One or more dielectric structures may include one or more pre-determined sizes or shapes, at least partly based on maintaining a predetermined impedance profile between the housing section and the pins. In some examples, the dielectric structure located inside the grounding cage receptacle also provides mechanical support and / or electrical tuning for the lead pairs and ground reference point. This dielectric structure aims to address the problem that simply filling the space between the grounding cage receptacle and the housing section and pins with dielectric material, while providing necessary mechanical support, often fails to provide a satisfactory electrical solution or tuning, at least in specific applications such as differential signal circuit board connectors. In some embodiments, this tuning is primarily targeted at the effective differential impedance within the circuit board connector, thereby simultaneously addressing mechanical stability and electrical performance in the lead frame connector. In some examples, simply filling the space with material, even if mechanically feasible, may introduce additional or unintended impedance that is too low and may conflict with the requirements of high-speed signal transmission. In some examples, the deviation may be as high as 30% or more, while with the dielectric structure described herein, this deviation can be controlled to within 1%.

[0040] Furthermore, in use, grounding cage sockets and receiver cage sockets can support or implement ground references between multiple connectors and receiver connectors. Lead segments and housing segments provide differential signal transmission, while the grounding cage socket provides a ground reference for this differential signal transmission. The grounding cage socket allows ground connections on the daughterboard to be coupled to ground surface contact pads, channels, or wires on the backplane or middleplane. These ground surface contact pads, channels, or wires can surround the signal surface contact pads, allowing pins to make contact internally, while the grounding cage socket provides external contact between the leadframe connector and the receiver connector. In one example, using channels or wires instead of contact pads to provide a ground reference at least improves signal integrity.

[0041] In some examples, a ground reference may be provided via a ground cage socket and a receiver cage socket in a mating sequence. For example, in a mating sequence, the ground cage socket and the receiver cage socket may first make contact or mate. In some examples, the pin may make contact after the ground cage socket and the receiver cage socket have mated for differential signal transmission, other signal transmission, or power supply. In other examples, the sequence order may be reversed, i.e., the ground reference may be provided after differential signal transmission, other signal transmission, or power supply; however, in some cases, a presence signal transmitted via the pin may be provided as part of the mating sequence. This presence signal may occur before or after the ground reference, and / or before or after differential signal transmission, other signal transmission, or power supply. This presence signal is used to indicate the presence status of the board connector when coupled to the receiver connector. In some examples, the ground cage socket may be used for this presence signal.

[0042] In another example, one or more stop features may be formed on the exterior or interior of the receiver connector, and they may be formed of an insulating material located between the pins and the receiver cage socket, or of an insulating material located on the exterior of the receiver connector. In one example, the insulating material may have dielectric properties to prevent short circuits between pins, and between pins and the receiver cage socket or grounding cage socket. Furthermore, these insulating materials help maintain impedance control within the lead frame connector and the receiver connector. In another example, one or more stop features may act on one or more of the grounding cage socket or shell section to prevent the grounding cage socket and shell section from extending too far towards the back plate or middle plate, thereby preventing the pins from being fully pressed in.

[0043] The leadframe connector may include an array of connectors. Each connector may include a lead segment and a shell segment. The shell segment may be formed from a portion of the lead segment. In another example, the shell segment may be fabricated separately from the lead segment and associated with the lead segment by soldering. The pin and spring arrangement within the shell segment may allow the pin to extend from or retract into the shell segment, in part based on the interface between the pin and the spring or one or more of one or more stop features. Each connector with such pins and springs may be a single spring pin function of the leadframe connector. A spring pin is a pin configured or adapted to extend from or retract into the shell segment, which maintains its power and signal communication functions. The pin may contact surface contact pads on a circuit board to transmit signals from the circuit board to the connector. The leadframe connector may include multiple parallel-configured connectors, which may be arranged in a connector array or other similar configurations.

[0044] Parallel-configured connectors may include at least two connectors providing differential signals. Each of the paired connectors may be located within a cage socket or other structure to support connection to a pair of surface contact pads. The connector may include a stamped lead frame segment forming a lead segment. The width of the connector end may be adjusted or preset as needed, such that the end is formed into a cylinder or tubular shape, referred to herein as the connector's tubular segment. A pin may be inserted through the tubular segment and engage with a spring that is also inserted into the tubular segment. A portion of the top of the tubular segment may be folded at the opening of the tubular segment to prevent the spring from ejecting the tubular segment from the top. The pin may be compressed from the bottom, and the top of the tubular segment may be rolled inward to prevent the pin from being ejected after the spring is compressed, simplifying the connection process. This forms the connector's tubular segment. This connector can be used with other similar connectors for surface contact pads on a backplane or middle plate.

[0045] Another problem addressed by the connectors described in this article is that copper-based signal and power interconnects (i.e., connectors) typically employ flexible pin interfaces that need to be anchored to the PCB. This anchoring is usually achieved through plated through-hole technology or by using compression pins that mate with surface pads. Regardless of the method used, such solutions often require significant force during mating or compression. Furthermore, if compression pins are used, a special fixture is usually required to apply constant pressure to the connector to ensure that the pins remain in contact with the surface contact pads on the PCB. While a spring-loaded connector can be added between the connector and the PCB, this introduces an additional interface between the connector and the PCB. Moreover, such solutions can introduce a number of problems: for example, ground reference conversion is required for transmission via ground pins, often necessitating auxiliary hardware to support the ground pin connection, which undoubtedly complicates the design and assembly process; misalignment during component mating can cause pin bending; and improper isolation design between the ground and signal interfaces can adversely affect the performance of high-speed signals and even cause potential interference.

[0046] Another issue addressed in this paper is that copper-based signal and power interconnects (connectors) may contain pins with flexible interface designs intended to anchor to the PCB. This anchoring can be achieved through plated through-holes or compression pins that mate with surface contact pads. In either case, these solutions often require relatively high insertion or compression forces. Furthermore, compression pins may require clamps to apply constant pressure to the connector to ensure that the pins maintain tight contact with the surface contact pads on the PCB. While it is also possible to insert a spring-loaded connector between the connector and the PCB, these solutions often introduce an additional interface between the connector and the PCB.

[0047] Another solution proposed in this paper utilizes a grounding cage socket, which can be considered a natural extension of the connector's internal design, enabling ground reference without the need for physical conversion via grounding pins. This grounding cage socket is specifically designed for use with high-speed signaling connectors. It may not include any signal pins and can establish an interface between the connector's grounding structure and the corresponding grounding surface pads or other grounding surface features on the PCB. By independently managing the grounding connection function through its external grounding perimeter, the grounding cage socket enhances PCB interface connectivity, eliminating the need for additional hardware and providing excellent support for compressed signal pins (such as the aforementioned spring probes). The grounding cage socket improves signal integrity; for spring probes, it effectively prevents pin bending due to misalignment and maintains the electrical modes of signal propagation by isolating the grounding interface from the signal interface within the connector assembly. This solution not only eliminates the need for additional hardware in the form of grounding pins, thus eliminating the possibility of additional pin bending due to misalignment, but also supports signal integrity by properly isolating the ground reference from the data signal within the pin. Furthermore, this solution integrates spring-loaded pins as part of the internal structure of the leadframe connector and employs a connection between two circuit boards via lead segments and a shell segment, enabling a right-angle topology, which is typically only achievable with traditional two-piece male-female connectors. The solution proposed in this paper also uses a leadframe connector that integrates spring-loaded pins as part of the internal structure, for example, lead segments and a shell segment composed of portions of the lead segments. Besides the right-angle topology (which may be a possible example using a two-piece male-female connector), the leadframe connector described herein may also support through-type connectors.

[0048] In the context of differential signaling, this refers to the use of complementary signals to communicate or transmit information over two separate conductors. In this embodiment, a leadframe connector can represent these separate conductors. At the receiving end, the difference between the complementary signals can be used to recover the information associated with the communication or transmission. The leadframe connector described herein is used for differential signal transmission over circuit board traces via a connection between pins and surface contact pads of the traces. Leadframe connectors can be used with differential pair conductors in cables. For example, leadframe connectors can be used between cables and circuit boards or between computing components, where the cable is used between two leadframe connectors.

[0049] In one example, complementary signals can include information transmitted with opposite polarities on individual conductors of a leadframe connector. When one of the individual conductors uses a positive voltage swing, the other conductor can use a negative voltage swing of the same amplitude. This amplitude can be referenced to the common-mode voltage. Differential signal transmission via leadframe connectors offers the advantage of significantly improved noise immunity, including immunity to electromagnetic interference and crosstalk. Noise can affect individual conductors within the individual conductors. Since information exists only in the differences between signals, the impact of common-mode noise on the signal is negligible. Differential signal transmission, used in conjunction with leadframe connectors, provides signal integrity and noise immunity for protocols such as High Speed ​​(HS) communication, USB (Universal Serial Bus®), HDMI (High Definition Multimedia Interface®), Ethernet®, PCI Express® (PCIe), SATA (Serial ATA), NVlink®, InfiniBand® (IB), and LVDS (Low Voltage Differential Signaling).

[0050] The systems and methods described herein can be used for a variety of purposes, including but not limited to machine control, synthetic data generation, model training or updating, perception, augmented reality, virtual reality, mixed reality, robotics, security and supervision, simulation and digital twins, autonomous or semi-autonomous machine applications, deep learning, environmental simulation, object or character simulation and / or digital twins, data center processing, conversational artificial intelligence (AI), generative AI based on large language models (LLM), optical transport simulation (e.g., ray tracing, path tracing, etc.), collaborative content creation for 3D assets, cloud computing and / or any other suitable application.

[0051] The examples disclosed herein can be included in a variety of different systems, such as: systems for performing deep learning operations, systems for performing simulation operations, systems for performing digital twin operations, systems implemented using edge devices, systems containing one or more virtual machines (VMs), systems for performing synthetic data generation operations, systems implemented at least partially in a data center, systems for performing conversational AI operations, systems for performing generative AI operations using LLM, systems for performing optical transport simulations, systems for performing collaborative content creation for 3D assets, systems implemented at least partially using cloud computing resources, and / or other types of systems.

[0052] In one example, a computing device benefiting from the leadframe connector described herein may include different types of processors. These processors may include a central processing unit (CPU), a graphics processing unit (GPU), a data processing unit (DPU), a quantum processing unit (QPU), a parallel processing unit (PPU), and an application-specific integrated circuit (ASIC). A QPU may be configured to perform one or more operations associated with a quantum algorithm. In some examples, each of one or more QPUs may include a qubit. One or more QPUs may communicate with each other via a quantum channel. In some examples, each qubit may include local qubits, global qubits, and / or synchronization qubits. In some examples, the local qubits of each QPU may be configured to perform one or more operations associated with a quantum algorithm on that QPU associated with the local qubits.

[0053] Figure 1A The illustration shows details of a circuit board connector 100A with a grounded cage receptacle, which is separated from the barrel sections and pins of lead pairs by one or more dielectric structures. As shown, the circuit board connector 101A may include a grounded cage receptacle 101B. The grounded cage receptacle 101B may surround a lead pair 101C. Each lead in the lead pair 101C is represented as a separate connector 104. Each connector 104 in the lead pair 101C may include a barrel section 108 and a pin 110 (e.g., ...). Figure 1B (As shown). The cylindrical section of connector 104 can have different dimensions relative to the pin, such as... Figure 1B As shown. The grounding cage socket 101B can be separated from the paired or individual cylindrical sections 108 and pins 110. This separation can be provided, filled, or supplemented by one or more dielectric structures 1091.

[0054] In some examples, the circuit board connector 101A allows connection between the daughter card or daughter board 204 and the circuit board 102 of the middle board or back board 202, such as in combination. Figure 1AA and Figure 2A Further details. In some examples, the lead pair allows for differential signal transmission connections, and the grounding cage socket 101B allows for a ground connection between the daughter card or daughterboard 204 and the circuit board 102 of the middle or backplane 202. In some examples, a single lead may allow for a power or signal connection between the daughter card or daughterboard 204 and the circuit board 102 of the middle or backplane 202. Each connection may utilize one or more surface contact pads 220, e.g., Figure 1A-1E As shown in 1AA-1CC.

[0055] One or more dielectric structures 1091 may include one or more sizes or shapes. For example, there may be a width 109A and a thickness 109B associated with each dielectric structure 1091. In some examples, shape 109C is illustrated (top view only, but clearly the same throughout the dielectric structure 1091 or varying throughout the dielectric structure 1091), which is specific to each dielectric structure 1091. Filler 109E may or may not be present between the provisions 109D for the barrel section 108 and the pin 110. In some examples, the dielectric structure 1091 extends entirely into or contains filler 109E. The size and shape of each dielectric structure 1091 may be predetermined, at least in part, based on a desired impedance distribution curve, such as in combination with Figure 1F-1H One or more diagrams further illustrate that the expected impedance distribution curve needs to be maintained between the cylinder section 108 and the needle 110.

[0056] Figure 1B The illustration shows another example 100B of dielectric structure that can be used for circuit board connectors (with...). Figure 1A In contrast, the dielectric structure has a different size or shape that is at least partially determined based on the expected impedance distribution curve. Figure 1B The circuit board connector 101AB in the middle may be related to Figure 1A The circuit board connector 101A is similar. The circuit board connector 101AB may include different dielectric structures 1092, which can be achieved at least by means of different dielectric structures 1092 including spacers or partitions 109F. For example, each dielectric structure 1092 in the circuit board connector 101AB may include a respective spacer 109F having a predetermined spacing or space 109G therebetween. In some examples, the space 109G includes, represents, or is permitted to be a portion of an air gap as part of the dielectric structure 1092. Each spacer 109F may have its own predetermined dimensions (e.g., width and length) and predetermined shape, variations of which can be achieved from... Figure 1A This is clearly seen in the description of width 109A, thickness 109B, and shape 109C. In some examples, the predetermined dimensions may include a length of approximately 1.04 mm and a width of approximately 0.64 mm.

[0057] Each of the predetermined space, predetermined size, and predetermined shape can be partially based on the expected impedance distribution curve, such as in combination. Figure 1F-1H As shown in one or more figures, the expected impedance distribution curve must be maintained between the cylinder section 108 and the needle 110. Furthermore, Figure 1BThe diagram also illustrates that the shell section 108 of connector 104 may have a first size or shell size 108A, while the pin 110 may have a second size or pin size 106A. The shell size 108A and pin size 106A may represent different sizes in the shell section 108 and the lead section 106, respectively, and may benefit from one or more dielectric structures 1091, 1092 used in circuit board connectors 101A, 101AB. Figure 1B The diagram also illustrates that circuit board connectors 101A and 101AB can be coupled to corresponding receiver connectors 210, for example, from... Figure 1AA The receiving connector of the middle plate or back plate 202 in the middle plate.

[0058] Figure 1C Another example 100C of dielectric structure that can be used for circuit board connectors is illustrated, and the dielectric structure has different sizes or shapes that are predetermined at least in part based on the expected impedance distribution curve. Figure 1C The illustration shows an example circuit board connector 101AC having spacers 109FA, 109FB, and 109FC forming a dielectric structure 1093. A first spacer 109FA may be located at a distal position 131A relative to a first end of the lead pair 101C. A second spacer 109FB may be located at a proximal position 131B relative to a second end of the lead pair 101C. A third spacer 109FC or multiple third spacers may be located at an intermediate position relative to the first and second ends of the lead pair 101C.

[0059] Figure 1C The diagram illustrates the relationship between... Figure 1A and Figure 1B The circuit board connectors 101A and 101AB, and dielectric structures 1091 and 1092, and the spacers 109FA, 109FB, and 109FC in circuit board connector 101AC may include one of different predetermined thicknesses 109B (as part of the size or shape of dielectric structure 1093). The different predetermined thicknesses 109B located on spacers 109FA, 109FB, and 109FC or dielectric structures 1091, 1092, and 1093 can be associated with different impedance distribution curves, such as in combination with... Figure 1F-1H One or more figures are further described, and can be maintained on the cylindrical section 108 and the needle 110 as needed. In some examples, the predetermined thickness can be a value of approximately 0.30 mm. As mentioned earlier, although three spacers are discussed in the text, Figure 1C It includes four or more spacers, and some spacers can be used together to achieve the effect described herein at least with respect to the impedance distribution curve. For example, a third spacer 109FC or more third spacers may be present at a position midway between the first and second ends of lead pair 101C.

[0060] also, Figure 1C It is also shown that one or more dielectric structures 1093 may include axial elements 133 associated with distributed spacers 109FD. Multiple such distributed spacers 109FD may be present at the corners and midsections of the grounding cage socket 101B. In some examples, there may be four to eight distributed spacers 109FD. The axial element 133 may extend generally along a length or axis 133A, which includes the cylindrical section 108 and the pin 110. The distributed spacers 109FD may include the same predetermined spacing or space 109H between them. This predetermined space 109H may be based in part on a desired impedance distribution profile that needs to be maintained on the cylindrical section 108 and the pin 110, such as in combination with... Figure 1F-1H One or more figures are shown. Figure 1A-1C The illustration also shows that spacers 109FA, 109FB, and 109FC can have different thicknesses in different circuit board connectors 101A, 101AB, and 101AC. These different thicknesses may also be partly based on the different impedance distribution curves expected for the different circuit board connectors 101A, 101AB, and 101AC, as combined with... Figure 1F-1H One or more figures are further described.

[0061] Figure 1D Another example 100D of the dielectric structure available in the connector is illustrated, and the dielectric structure has different sizes or shapes that are predetermined at least in part based on the expected impedance distribution curve. Figure 1D The diagram also illustrates that the shapes of spacers 109FA, 109FB, and 109FC in circuit board connector 101AD can be different, for example, relative to... Figure 1A-1C The spacers 109FA, 109FB, and 109FC in the other circuit board connectors 101A, 101AB, and 101AC have different shapes. In addition to the different shapes, the spacers 109FA, 109FB, and 109FC also have different dimensions, such as different thicknesses and / or widths. Figure 1D The diagram also illustrates one or more media structures that may include different axial elements 133 of the distributed spacer 109FD. The distributed spacer 109FD may include axial elements 133 located at various corners of the grounding cage socket 101B. Each axial element 133 extends substantially along the length including the cylindrical section 108 and the pin 110. In some examples, each axial element 133 may extend laterally through the length of the grounding cage socket 101B.

[0062] Figure 1EAnother example 100E of the dielectric structure available in the connector is illustrated, and this dielectric structure has different dimensions or shapes predetermined at least in part based on a desired impedance distribution curve. In example 100E, relative to... Figure 1A-1D The dielectric structure 1094 may occupy the space between the grounding cage socket 101B and the barrel section 108 and pin 110, which may be used in pairs or individually. Example 100E may be unused or independent of... Figure 1A-1D In other examples, spacers are used in other ways. Furthermore, even when used as a single or integrated structure, the medium structure 1094 can have different shapes throughout the spacer.

[0063] In some examples, when circuit board connectors 101A, 101AB, 101AC, 101AD, 101AE are connected to the receiving connector 210 of circuit board 102 (e.g., middle plate or back plate 202), dielectric structures 1091, 1092, 1093, 1094 may be elastically movable or deformable. In some examples, the one or more dielectric structures are made of a material such as Teflon®, or contain Teflon or other polytetrafluoroethylene (PTFE). In some examples, dielectric structures 1091, 1092, 1093, and 1094 may include an edge 135. In some examples, edge 135 may be or may include an edge discontinuity structure 137, which represents a discontinuous edge along the boundary of dielectric structures 1091, 1092, 1093, and 1094. The boundary may be located within the grounding cage socket 101B and may include at least one air gap (e.g., within the arcuate structure forming the edge discontinuity structure 137) within the dielectric structures 1091, 1092, 1093 and 1094 and between the lead pairs 101C.

[0064] In some examples, dielectric structures 1091, 1092, 1093, and 1094 (whether a single dielectric material, an integrated dielectric material, or a separate spacer (or wafer)) can be fabricated to match the diameter of the barrel segment 108 and the pin 110. For example, dielectric structures 1091, 1092, 1093, and 1094 can be fabricated based on the dimensions of the grounding cage socket 101B to a predetermined size (e.g., in millimeters) smaller than the dimensions of the grounding cage socket 101B. Furthermore, the number and thickness of the spacers can be optimized. This optimization can be partly based on or related to the desired characteristics or expected impedance distribution curve of the lead pair 101C. For example, once determined for a specific application, such as... Figure 1G-1HThe impedance distribution curves in the diagram provide predetermined metric dielectric structures 1091, 1092, 1093, and 1094 for the circuit board connectors in this application. In some examples, dielectric structures 1091, 1092, 1093, and 1094 may have rigid properties to act as rigid diaphragms, providing mechanical support along the length of each connector 104 of the 101C along the leads of the integrated wafers. In some examples, dielectric structures 1091, 1092, 1093, and 1094 may include spacers integrated therein as individual or integrated features. In some examples, material (in the form of axial elements) may be removed or added to the spacers to provide mechanical support (e.g., forming posts) and to provide further tuning of the electrical performance of the circuit board connectors. In some examples, dielectric structures 1091, 1092, 1093, and 1094 may be formed by molding or milling rather than by machining.

[0065] In some embodiments, Figure 1B-1E Also shown is a receiver connector 210, which includes a receiver cage socket, such as at least Figure 1AA-1CC Further details and descriptions are provided below. The receiving cage socket 103 (e.g., in...) Figure 1AA (The middle) can be disposed on the circuit board 102. Even in some embodiments such as Figure 1B-1E As shown, the receiving cage socket 103 may not extend completely to the grounding cage socket 101B. The receiving connector 210 can be used to receive the applied circuit board connector 101AB (which can be applied against the receiving connector). The applied circuit board connector 101AB may have a grounding cage socket 101B surrounding the lead pair 101C. The lead pair 101C may include a barrel section 108 and a pin 110. The barrel section 108 may have a different barrel size 108A relative to the pin size 106A of the pin 110. The grounding cage socket 101B may be separated from the barrel section 108 and the pin 110 by one or more dielectric structures 1092. One or more dielectric structures 1092 may include one or more sizes or shapes (e.g., sizes 109A, 109B, and shape 109C), which are predetermined at least in part based on a desired impedance distribution profile, such as... Figure 1F-1H As shown. Figure 1F-1H The expected impedance distribution curve shown can be maintained between the barrel section 108 and the pin 110, and relative to the ground terminal of the receiving cage socket 103 or the circuit board (represented at least in part by at least some of the surface contact pads 220).

[0066] Figure 1F It shows Figure 1AThe expected impedance profile 100F of the dielectric structure in the circuit board connector is specified. This expected impedance profile is maintained between the barrel segment and the pin, while providing appropriate mechanical support to prevent damage to the barrel segment and pin due to coupling, decoupling, or other movement of the circuit board connector (or the circuit board with the circuit board connector between them). In some examples, the expected impedance profile 100F may be reflected in the relationship 147 between the differential impedance characteristic 145A of the dielectric structure 1091 and a time measure 145B. The unit of time 145B may be picoseconds (ps). The differential impedance characteristic 145A may include impedance from the perspective of the differential signal driven across the lead pair 101C. In some examples, the differential impedance characteristic 145A may include the odd-mode impedance of each connector in the lead pair 101C.

[0067] The odd-mode impedance can be referenced to a single connector 104 in lead pair 101C. The odd-mode impedance can be the impedance of a single connector 104 in lead pair 101C when the single connector 104 is driven by a signal of equal amplitude and opposite polarity. In some examples, the differential impedance characteristic 145A can include a time-domain reflectometry (TDR) measurement. A TDR can be used to measure the impedance of connector 104 (or board connectors 101A, 101AB, 101AC, 101AD, 101AE), including the differential impedance represented by the two lines in relation 147, as a function of time 145B. In some examples, the TDR can include providing a pulse through the connector and tracking the reflections relative to the pulse in relation 147. Relation 147 can be used to construct an impedance distribution curve relating to impedance changes. When this impedance distribution curve is retained and used for specific applications of circuit board connectors 101A, 101AB, 101AC, 101AD, and 101AE, the impedance distribution curve can be regarded as the expected impedance distribution curve 100F.

[0068] In some examples, the expected impedance distribution curve 100F allows visualization of the variation of the differential impedance characteristics 145A along the length of lead pair 101C over time 145B. A smooth and consistent relationship 147A may indicate the level of control for lead pair 101C relative to an expected value. A smooth and consistent relationship 147A may be at the target impedance. In contrast, a discontinuous relationship 147B may include rises and falls, indicating a deviation from the target impedance. A discontinuous relationship 147B may indicate the presence of impedance discontinuities. In some examples, impedance discontinuities may be caused at least by differences in the ground reference provided by the grounding cage 101B through the dielectric structures 1091, 1092, 1093, and 1094 between the grounding cage 101B and the lead pair 101C. For example, different dimensions and shapes of the dielectric structures 1091, 1092, 1093, and 1094, including material thickness and characteristics (e.g., for different spacers), may cause differences in the ground reference, which is part of the expected impedance distribution curve 100F for the application.

[0069] In some examples, the expected impedance profile 100F allows for the determination of discontinuities 147B within a tolerance range suitable for the application. For example, for a particular high-speed interconnect, a ground reference difference may be allowed to result in impedance variations of approximately ±5%, ±10%, or other predetermined tolerances. The expected impedance profile 100F allows for the determination of specific dielectric structures 1091, 1092, 1093, and 1094 to provide mechanical support for applications of board connectors 101A, 101AB, 101AC, 101AD, and 101AE, while also providing an acceptable differential impedance for that application. At least in Figure 1F In the middle, the expected impedance distribution curve 100F can be used for... Figure 1A The dielectric structure 1091 is a continuous, spacer-free dielectric structure. While providing mechanical support for the entire length of the lead pair 101C, the dielectric structure 1091 can also be used in certain applications other than high-speed interconnects or differential signal transmission.

[0070] Figure 1G The diagram shows Figure 1B The expected impedance distribution curve 100G is shown for the dielectric structure in the connector. The discussion regarding the relationship in the expected impedance distribution curve 100F also applies. Figure 1G The expected impedance distribution curve 100G is shown in the figure, and is referenced relative to it. Figure 1G The expected impedance distribution curve 100G is merged. Furthermore, the expected impedance distribution curve 100G can correspond to... Figure 1BThe dielectric structure 1092 is discontinuous and includes spacers 109F. As shown, the expected impedance distribution curve 100G exhibits a less pronounced discontinuity 147B at a lower time 145B and a fairly smooth and consistent relationship 147A relative to the differential impedance characteristic 145A. While providing mechanical support at least for the far, near, and middle portions of its lead pair 101C length, the dielectric structure 1092, due to its less pronounced discontinuity 147B, can meet the tolerance requirements of certain applications, including high-speed interconnects or differential signal transmission.

[0071] Figure 1H The diagram shows Figure 1C The expected impedance distribution curve 100H represents the dielectric structure in the connector. The discussion regarding the representation in the expected impedance distribution curve 100F also applies. Figure 1F The expected impedance distribution curve 100H is shown in the figure, and is referenced relative to the curve. Figure 1H The expected impedance distribution curve 100H is merged. Furthermore, the expected impedance distribution curve 100H can correspond to... Figure 1C The discontinuous dielectric structure 1093 in the figure has spacers 109F, including distributed spacers 109FD. As shown in the figure, with... Figure 1F Compared to the expected impedance distribution curve 100F, the expected impedance distribution curve 100H exhibits a less pronounced discontinuity at a lower time 145B 147B, but compared to... Figure 1G Compared to the expected impedance distribution curve 100G, the expected impedance distribution curve 100H exhibits a more pronounced discontinuity 147B at a lower time 145B. Furthermore, the expected impedance distribution curve 100H has a fairly smooth and consistent relationship 147A relative to the differential impedance distribution curve 145A. While providing additional mechanical support through the distributed spacers 109FD, and in addition to spacers 109F at least at the far, near, and middle portions of the lead pair 101C length, the dielectric structure 1093 can also meet the tolerance requirements of certain applications, including high-speed interconnects or differential signal transmissions, due to the moderate pronouncement of the discontinuity 147B.

[0072] Circuit board connectors 101A, 101AB, 101AC, 101AD, and 101AE can be part of a circuit board connector array that constitutes a leadframe connector, such as in combination. Figure 1DD , Figure 2A and Figure 2BAs shown. In some examples, the leadframe connector may be located between the first circuit board and the second circuit board or computing component, such as between a daughterboard or daughter card and a middle board or backplane, as shown. Furthermore, the dimensions or shapes of the dielectric structures 1091, 1092, 1093, and 1094 can be predetermined to allow or support a deviation of less than one percent from the expected impedance distribution curve in the actual application. In some examples, the leadframe connector can withstand the forces and pressures required to couple, decouple, and maintain the coupling between the first and second circuit boards. In addition to the differential impedance intended for the leadframe connector, the forces and pressures can also be considered regarding the type of dielectric structures 1091, 1092, 1093, and 1094 used, at least because of the expected impedance distribution curve 100F-H generated and maintained by the different types of dielectric structures 1091, 1092, 1093, and 1094 available. In some examples, the expected impedance distribution curve 100F-H also allows for variations in the shape and size of the dielectric structures 1091, 1092, 1093, and 1094, for example, as a reference to the expected impedance distribution curve.

[0073] In some examples, although different board connectors 101A, 101AB, 101AC, 101AD, and 101AE are described herein, a single leadframe connector, as described above... Figure 1DD , Figure 1GG , Figure 2A and Figure 2B The illustrated and described circuit board connectors can use the same type of dielectric structure. The same type of dielectric structure can include the same thickness, the same width, the same shape, the same spacing (if provided), and the same spacers (if provided). In some examples, such as... Figure 1DD , Figure 1GG , Figure 2A and Figure 2B As shown, the different board connectors 101A, 101AB, 101AC, 101AD, and 101AE described herein can be used in a single leadframe connector to achieve mixed impedance profiles. For example, different signal transmissions and / or power supplies can be implemented within a single leadframe connector, thereby providing different (or different types) dielectric structures for different leads or lead pairs. In some examples, although, as described, the thickness, width, shape, pitch (if provided), and spacers (if provided) may vary for individual connectors, individual board connectors, or individual leadframe connectors, each use case may require different thicknesses, widths, shapes, pitches (if provided), and spacers (if provided) to remain symmetrical. Dielectric structures 1091, 1092, 1093, and 1094 can contain any suitable dielectric material, but in some examples, elastically movable or deformable dielectric materials may be used.

[0074] In some examples, Figure 1A-1H (Depend on Figure 1AA , Figure 1DD , Figure 2A and Figure 2B (For support purposes) A ​​system of lead frame connectors 102A and 102B is shown. The system may include multiple grounding cage receptacles 101B, which are portions of multiple circuit board connectors 101A, 101AB, 101AC, 101AD, and 101AE, which in turn may be portions of lead frame connectors 102A and 102B. The system may include lead segments 106 having respective lead pairs 101C within each grounding cage receptacle 101B. Lead pairs 101C may include a shell segment 108 and a pin 110. The dimensions of the shell segment 108 (e.g., shell size 108A) may differ from the dimensions of the pin (e.g., having pin size 106A). Each grounding cage receptacle in the grounding cage receptacle 101B may be separated from the corresponding shell segment 108 and the corresponding pin 110 by one or more dielectric structures 1091, 1092, 1093, 1094. The one or more dielectric structures 1091, 1092, 1093, 1094 may include one or more sizes or shapes (e.g., sizes 109A, 109B, and shape 109C), which may be at least partially based on a desired impedance distribution profile that needs to be maintained on the barrel section 108 and the needle 110 (e.g., Figure 1F-1H (as shown) and is predetermined.

[0075] In some examples, Figure 1A-1H (Depend on Figure 1AA , Figure 1DD , Figure 2A , Figure 2B , Figure 4 and Figure 5 (Support provided) shows a data center (e.g., using lead frame connectors 102A, 102B) that provides support. Figure 4 Data center 400, which has Figure 5 (Aspect 500 of the middle rack 404). The data center may include a middle board or backplane 202. The middle board or backplane 202 may include signal surface contact pads and ground surface contact pads, for example... Figure 1A , Figure 1BA portion of the surface contact pad 220 in the data center. In some examples, at least for ground references, channels or wires may be used instead of surface contact pads. The data center may include one or more daughterboards 204 coupled to a middleboard or backboard 202 via leadframe connectors 102A, 102B. Leadframe connectors 102A, 102B may include ground cage sockets 101B. Leadframe connectors 102A, 102B may include lead segments 106 having respective lead pairs 101C within each ground cage socket 101B. Lead pairs 101C may include a body segment 108 and a pin 110. The dimensions of the body segment 108 (e.g., body size 108A) may differ relative to the dimensions of the pin (e.g., having pin size 106A). Each grounding cage socket 101B in the grounding cage socket 101B may be separated from the corresponding barrel section 108 and the corresponding pin 110 by one or more dielectric structures 1091, 1092, 1093 and 1094. One or more dielectric structures 1091, 1092, 1093 and 1094 may include one or more sizes or shapes (e.g., sizes 109A, 109B and shape 109C), which may be at least partially based on a desired impedance distribution profile to be maintained on the barrel section 108 and the pin 110 (e.g., [missing information]). Figure 1F-1H (as shown) and is predetermined.

[0076] Figure 1AA The illustration shows a conventional view and a cross-sectional view 100AA of a grounding cage socket of a leadframe connector according to at least some embodiments, the leadframe connector being coupled to a receiving cage socket. As at least in combination Figure 1HH Further details: The lead frame connector may include multiple individual connectors 104. Each connector 104 may include a lead segment 106 and a shell segment 108. The shell segment 108 may be formed from a portion of the lead segment 106 (e.g., as combined). Figure 1FF (As illustrated and described). In another example, the barrel segment 108 may be fabricated separately from the lead segment 106 and may be associated with the lead segment 106 by solder. The barrel segment 108 may include a pin 110 and a spring 112, for example, as combined Figure 1DD-1JJ Further illustration and description. Each connector 104 may include at least a grounded cage socket 101B surrounding a housing section 108. Pins 110 and springs 112 of the housing section 108 may be used to transmit data signals. Additionally, the grounded cage socket 101B may be used to couple 105 to a receiving cage socket 103 of a circuit board, which may be a middle board or backplane 202 in a data center. The grounded cage socket 101B, through coupling 105, can provide a ground reference for data signals.

[0077] In one example, the needle 110 may extend from or retract into the cylindrical section in part based on at least one stop feature associated with the receiving cage socket 103, the stop feature being at least combined with Figure 1BB and Figure 1CC More detailed instructions are available. This stop feature can also secure the grounding cage socket 101B in a predetermined position (e.g., in...). Figure 1BB , Figure 1CC (Description and illustrations are provided). The predetermined position can be relative to the receiver cage socket 103. The predetermined position allows the pin 110 to contact the signal surface contact pad 220 on the circuit board to transmit data signals to the circuit board. The signal surface contact pad 220 may be different from the ground surface contact pad 107, which is coupled to the receiver cage socket 103 and, through the receiver cage socket 103, to the ground cage socket 101B. As shown, the signal surface contact pad 220 may be located within or inside the perimeter formed by the ground surface contact pad 107. Furthermore, as further combined... Figure 1BB , Figure 1CC As detailed in one or more figures, the ground surface contact pad 107 may be in the form of a channel or line 119 surrounding the signal surface contact pad 220.

[0078] Figure 1BB The illustration shows a conventional view and a cross-sectional view 100BB of a grounded cage receptacle for a leadframe connector, having an internal coupling with a receiving cage receptacle, according to at least some embodiments. In one example, the grounded cage receptacle 101B is fitted inside the receiving cage receptacle 103 of the receiving connector 210. This may represent an interface 111 of internal ground coupling between the connector 104 and the receiving connector. The contact between the grounded cage receptacle 101B and the receiving cage receptacle 103 allows a ground reference to be connected to a ground surface contact pad 107 on the circuit board. In one example, one or more stop features may be present associated with the receiving cage receptacle 103. For example, the first stop feature 113 may be part of the internal insulation 123 within the receiving cage receptacle 103. In another example, the first stop feature 113 may be part of the receiving cage receptacle 103 itself and may allow a ground reference to the ground surface contact pad 107 on the circuit board via the first stop feature 113. The first stop feature 113 can act on the grounding cage socket 101B to prevent further movement between the grounding cage socket 101B and the receiving cage socket 103, while ensuring that the grounding cage socket 101B is in a predetermined position 117, so that the pins 110 in the grounding cage socket 101B can contact the signal surface contact pads 220 on the circuit board to transmit data signals to the circuit board.

[0079] The second stop feature 115 may be part of the internal insulation 123 within the receiving cage receptacle 103. The internal insulation 123 may also insulate between the plurality of pins and the plurality of barrel segments within the connector 104. The internal insulation 123 may also insulate between the plurality of pins, the plurality of barrel segments, and the grounding cage receptacle. The second stop feature 115 may have allowances (e.g., orifices or holes) for the pin 110 to pass through, but may restrict the barrel segment 108 of the connector 104. The second stop feature 115 may act on the barrel segment 108 of the connector 104 to prevent further movement of the barrel segment 108 relative to the receiving cage receptacle 103. The pin 110 may be allowed to extend from the barrel segment 108, through the allowances in the second stop feature 115 to contact the signal surface contact pad 220 on the circuit board for transmitting data signals to the circuit board. The position of the second stop feature 115 can ensure that one or more grounding cage sockets 101B or cylindrical sections 108 are in a predetermined position 117, so that the pins 110 of the grounding cage socket 101B can contact the signal surface contact pads 220 on the circuit board, thereby transmitting data signals to the circuit board.

[0080] In one example, the predetermined position 117 may coincide with the position of the first stop feature 113 and the second stop feature 115. In another example, the predetermined position 117 may differ from one or more of the first stop feature 113 or the second stop feature 115, but may allow the contact between the pin 110 and the signal surface contact pad 220 to be in a predetermined contact application. In one example, the predetermined contact application may include one or more predetermined pressures or contact resistances between the pin 110 and the signal surface contact pad 220. The predetermined contact application ensures sufficient contact to support or allow high-speed signal performance of the data signals transmitted through it without potential interference or damage to the spring 112 or pin 110 of the circuit board or connector 104.

[0081] Figure 1CC The illustration shows a conventional view and a cross-sectional view 100CC of a grounded cage socket for a lead frame connector, having an external coupling to a receiving cage socket, according to at least some embodiments. As shown, with... Figure 1BBThe difference is that the grounding cage socket 101B can be mounted on the receiving cage socket 103 of the receiving connector 210. This can represent an interface 121 for external ground coupling between the connector 104 and the receiving connector 210. In one example, one or more stop features may be present associated with the receiving cage socket 103. The first stop feature 113 may be part of the external insulation surrounding the receiving cage socket 103 of the receiving connector 210. In another example, the first stop feature 113 may be detached from and associated with the receiving cage socket 103. The contact between the grounding cage socket 101B and the receiving cage socket 103 may allow access to the ground reference of the contact pad 107 on the ground surface of the circuit board. The first stop feature 113 can act on the grounding cage socket 101B to prevent further movement between the grounding cage socket 101B and the receiving cage socket 103, while ensuring that the grounding cage socket 101B is in a predetermined position 117, so that the pins 110 of the grounding cage socket 101B can contact the signal surface contact pads 220 on the circuit board in order to transmit data signals to the circuit board.

[0082] The second stop feature 115 may be part of the internal insulation 123 inside the receiving cage socket 103. The internal insulation 123 may also insulate multiple pins and multiple barrel segments within the connector 104. The internal insulation 123 may also insulate multiple pins, multiple barrel segments, and the grounding cage socket. The second stop feature 115 may allow pins 110 to pass through, but may restrict the barrel segment 108 of the connector 104, such as... Figure 1BB The conventional view and sectional view 100BB are shown. The second stop feature 115 can act on the shell section 108 of the connector 104 to prevent the shell section 108 from moving further relative to the receiving cage socket 103.

[0083] like Figure 1CCAs indicated by reference numeral 125, pin 110 extends from the barrel section 108, passes through allowances 127 having dielectric material 129 and providing internal insulation 123 for a second stop feature 115, and contacts signal surface contact pad 220 on the circuit board. The dielectric material 129 has dielectric properties that, in one example, prevent short circuits between pins 110; in other examples, it prevents short circuits between pins 110 and the receiver cage socket 103 or the ground cage socket 101B. This dielectric property also allows impedance control to be maintained within the lead frame connector and the receiver connector. In one example, similar internal insulation 123 may be provided in the lead segments of the lead frame connector to prevent short circuits between lead segments and to allow impedance control to be maintained at the lead segments within the lead frame connector. The contact between pin 110 and signal surface contact pad 220 allows data signals to be transmitted to the circuit board. The position of the second stop feature 115 can ensure that one or more grounding cage sockets 101B or cylindrical sections 108 are in a predetermined position 117 so that the pins 110 of the grounding cage socket 101B can contact the signal surface contact pads 220 on the circuit board, thereby transmitting data signals to the circuit board.

[0084] In one example, the predetermined position 117 may coincide with the first stop feature 113 and the second stop feature 115. In another example, the predetermined position 117 may differ from one or more of the first stop feature 113 or the second stop feature 115, but may allow the contact between the pin 110 and the signal surface contact pad 220 to be in a predetermined contact application. In one example, the predetermined contact application may include one or more of a predetermined pressure or contact resistance between the pin 110 and the signal surface contact pad 220. The predetermined contact application ensures sufficient contact to support or allow high-speed data signal performance of the data signal passing through it without potential interference, damage to the circuit board, or damage to the spring 112 or pin 110 of the connector 104.

[0085] Figure 1AA-1CC Connector 104 in the middle can be located on the daughterboard (at least as shown in the example). Figure 2A As shown, the receiver connector 210 can be located on the middle board or back panel 202 to receive the connector 104 for transmitting data signals and to provide a ground reference between the daughter board and the middle board or back panel 202. The receiver cage socket 103 can be soldered or fixed to the ground surface contact pad 107 or ground surface contact channel or line 119 on the middle board or back panel 202. The signal surface contact pad 220 can be located within the perimeter formed by the ground surface contact pad 107 or the ground surface contact channel or line 119.

[0086] Connector 104 can be a portion of a differential signal connection with a ground reference. The data signal of pin 110 can be one of a set of differential signals; pin 110 is one of a set of differential signal pins. Figure 1AA-1CC These pins are also illustrated in the cross-sectional view. Differential signal pins can be supported by a ground reference from the grounded cage socket 101B. Connector 104 can be made part of a connector array, for example... Figure 1GG 1DD array and Figure 2A A 2D array of connectors. This connector array can form a leadframe connector, for example... Figure 1HH and Figure 2A The lead frame connector is shown. This lead frame connector can be located between a circuit board constituting the middle plate or back plate 202 and another circuit board (which may be a daughter board), or between the middle plate or back plate 202 and the computing component.

[0087] Connector 104 may include lead segment 106 and may include shell segment 108, which may be coupled to or formed from a portion of lead segment 106. Lead segment 106 allows data signals to be transmitted within connector 104. In addition to surrounding shell segment 108, grounding cage socket 101B may surround lead segment 106, such as... Figure 1AA-1CC One or more of the following are shown. Connector 104 may include rigid insulation, for example, as part of the external insulation having a first stop feature 113. The rigid insulation may surround the grounded cage socket 101B to allow connector 104 to have rigid specifications.

[0088] Connector 104 may include a second cylindrical section, which is coupled to the cylindrical section via a lead section, as in Figure 1 GG-2B As shown and described in detail in the examples. The second cylindrical section can be coupled to the sub-board, and this cylindrical section can be used to couple to the middle plate or backplane 202 of the rack in the data center, such as... Figure 5 As shown. The grounding cage socket 101B can extend from the second shell section to the shell section to provide a grounding reference between the sub-plate and the middle plate or back plate.

[0089] Connector 104 may include parallel leads in lead segment 106, such as Figure 1 GG-2B As illustrated and described in detail, connector 104 may include a parallel barrel located on the barrel segment, as in the same example. Connector 104 may include a grounding cage socket 101B on the parallel leads and the parallel barrel. The parallel barrel may include additional pins and additional springs. These pins and additional pins (the pins and additional pins of the parallel barrel) may support or allow differential signals between them, while the grounding cage socket 101B supports or allows a ground reference. Furthermore, the parallel lead array may make connector 104 part of a lead frame connector, as described in the example. Figure 1HH and Figure 2A As detailed above.

[0090] In one example, connector 104 may allow grounding cage receptacle 101B to comprise a copper alloy. In one example, receiver connector 210 may allow receiver cage receptacle 103 to comprise a copper alloy. This at least allows for predetermined contact with a ground reference for data signals. Connector 104 may also include lead segment 106 and grounding cage receptacle 101B having an angled feature, which may be provided independently for each lead segment and grounding cage receptacle 101B. As at least in Figure 1GG and 1HH As further detailed, this angled feature allows the cylindrical section 108 of connector 104 to form a 90-degree angle separation with another cylindrical section of another connector.

[0091] Figure 1AA-1CC as well as Figure 1 DD-7 A system of lead frame connectors with multiple grounded cage sockets is also illustrated. In one example, Figure 1 GG-2B The connector array may include at least a plurality of grounding cage receptacles. Within these plurality of grounding cage receptacles may be multiple cylindrical pin segments having pins (e.g., a set of differential signal pins) and springs. Furthermore, each grounding cage receptacle may surround a respective cylindrical pin pair. The grounding cage receptacle is coupled to a receiving cage receptacle on the circuit board, providing a ground reference for the data signal via pins and springs. Pins extend from or retract into their respective cylindrical pin segments, at least in part, based on corresponding stop features 113, 115 associated with corresponding receiving cage receptacles in the receiving cage receptacles. In one example, the corresponding stop features 113 and 115 may hold each grounding cage receptacle at a predetermined position 117 relative to the receiving cage receptacle. In another example, the corresponding stop features 113 and 115 may allow pins to contact signal surface contact pads on the circuit board to transmit data signals to the circuit board.

[0092] Figure 1AA-1CC as well as Figure 1 DD-7 The diagram also illustrates a receiver connector 210, which has a receiver cage socket 103 and stop features 113, 115 associated with the receiver cage socket 103. The receiver cage socket 103 can be fixed to a circuit board, as shown. Figure 1AA-1CCAs shown. Stop features 113 and 115 hold the grounded cage receptacle of the applied connector 104 in a predetermined position 117 relative to the receiving cage receptacle 103, and allow the pins 110 of the applied connector 104 to contact the signal surface contact pads 220 on the circuit board, thereby transmitting data signals to the circuit board. The receiving cage receptacle 103 can be coupled to the grounded cage receptacle 101B of the applied connector 104 to provide a ground reference between the receiving connector 210 and the applied connector 104.

[0093] Figure 1DD The illustration shows different lead frame connectors 100DD having lead segments and shell segments according to at least some embodiments. In one example, each lead frame connector 102A, 102B may include a series of connectors 104. Each connector 104 may include a lead segment 106 and a shell segment 108, as combined Figure 1AA-1CC As discussed, the cylindrical section 108 can be formed from a portion of the lead section 106 (e.g., as in combination). Figure 1FF (As shown and described). The cylindrical section 108 may include a needle and a spring, for example, as combined Figure 1EE , Figure 1FF As shown and described.

[0094] Figure 1DD The diagram also illustrates that the cylindrical section 108 may include a cylindrical section formed by a lead segment 106. In one example, the lead segment 106 may be a portion of a strip of material having a wide portion at its ends. The material is 0.05 mm thick along its longest length, and its length is sufficient to reach the opposite ends of the lead frame connectors 102A and 102B at its longest length. The material may be wide at both ends of its longest length 122, and narrow at the center of the longest length relative to the wide 122 124. The material may include one or more of copper alloy or nickel plating. The pin may be formed of one or more of copper alloy or gold plating. The spring may be formed of stainless steel. All of these materials are conductive. The cylindrical section 108 allows electrical connections from the pins and through the cylindrical section to be used for transmitting signals or power from the circuit board via the connector.

[0095] Figure 1DD The diagram also illustrates that each lead segment 106 may include an angled feature 118. As shown, this angled feature may include one or more angles. The angled feature 118 allows a 90-degree angle separation 120 between the shell segment 108 of the same connector 104 and the shell segment of another connector. The one or more angles are provided to allow multiple lead segments to properly pass through the available space of the lead frame connectors 102A, 102B.

[0096] Figure 1EEA cross-sectional view 100EE of a lead frame connector having lead segments and a shell segment according to at least some embodiments is illustrated. Figure 1DD The above and Figure 1FF The wider portion shown can be folded into the cylinder. Additionally, a strip of material with the wider portion can be included in the top and bottom sections of the cylinder segment. The portion at the top of the cylinder can be folded 116A at the opening of the cylinder to prevent the spring 112 from popping out from the top of the cylinder. Needle 110 (as shown) Figure 1EE (As shown) It can be compressed from the bottom of the cylinder. The portion at the bottom of the cylinder can be folded inward or rolled up 116B to also prevent the pin from popping out after it is pressed down. This provides the cylinder section 108 of connector 104. Connector 104 and other similar connectors can have surface contact pads with the backplate or middle plate, as detailed below. Figure 1EE-7 .

[0097] Figure 1FF The illustration depicts process details 100FF of a cylindrical segment having a needle and a spring according to at least some embodiments. As shown, the first step may include forming a cylindrical segment 130 108 using a material with a width 124 narrow at the center and 122 wide at both ends. The width 122 of the material may be adapted or predetermined to allow the ends to be formed into a cylindrical segment 140 as part of the forming step 130. Process detail 100FF shows that the steps of adding the spring 132 and the needle can be performed. The needle 110 and the spring 112 may be inserted from the top or bottom of the cylindrical segment, with the head 110A of the needle 110 engaging 128 with the spring 112. The spring may have a compression 126 capability for insertion into the cylindrical segment.

[0098] After inserting the spring 112, the portion 142A at the top of the cylinder can be folded 116A at the opening of the cylinder to prevent the spring 112 from dislodging from the top of the cylinder. The pin 110 can be separately located at the bottom of the cylinder and can be configured to compress the spring from the bottom. The portion 142B at the bottom of the cylinder can be rolled inward 116B to also prevent the pin 110 from popping out after it has compressed the spring 112. This completes 134, or provides the cylinder section 108 for connector 104. Connector 104 and other similar connectors can be used to abut against surface contact pads on the backplate or middle plate; see details below. Figure 1 GG-7 One or more diagrams.

[0099] Figure 1GG It is a perspective view 100GG of the angled features according to at least some embodiments for forming a 90-degree angle separation between the cylindrical sections of the partial connector, which are part of the lead frame connector. Figure 1GGThe diagram illustrates a set of connectors 104 operating together as part of a differential signal connection, with at least two pins 110 forming a set of differential signal pins 152. Each connector can be part of a connector array, such as the one-dimensional (1DD) array shown, but is at least capable of supporting two-dimensional (2D) arrays, at least as shown. Figure 2A As shown. A 1D or 2D array can form leadframe connectors 102A, 102B, which can be located between a circuit board and another circuit board or computing component. Two connectors 104 can be aligned to form a connector pair, which includes at least a shell pair 156 and a lead pair 154. Each lead pair 154 can have at least two shell pairs 156, each shell pair 156 located at an end of the lead pair 154. Furthermore, these ends can be supported by angled features 118, thereby allowing a 90-degree angle separation 120 to be formed between the shell segments 108 of the connector 104.

[0100] Each connector 104 may have a lead segment 106 that is part of a lead pair 154 and may contain an insulating medium between the lead pairs 154. In one example, the insulating medium may be air. In another example, rigid insulation 150 may be provided around the lead segment 106 and may extend onto the housing segment 108. The rigid insulation 150 may give the connector a rigid profile 206 and may allow the rigid profile of the connector array to form lead frame connectors 102A, 102B. The lead segment 106 may include lead pairs 154 in the form of parallel leads. These parallel leads may have parallel housings in the housing segment 108. In one example, these parallel housings form a housing pair 156, which may include additional pins and additional springs. The pins in the housing pair 156 may be a set of different signal pins used to support or allow differential signals between them. Figure 1GG An array of parallel leads (e.g., in lead pair 154) may be included to make connector 104 part of lead frame connectors 102A, 102B.

[0101] Figure 1HHThe image 100HH is a side view 100HH showing an angled feature according to at least some embodiments, which allows a 90-degree angle separation between the shell segments of the connectors, which are part of the leadframe connectors. The 90-degree angle separation 120 between the shell segments 108 of the respective connectors 104 allows the leadframe connectors 102A, 102B to be coupled between circuit boards perpendicular to each other, between computing components perpendicular to each other, or between circuit boards and computing components perpendicular to each other. The connector 104 may include rigid insulation 150 throughout the lead segment 106, but a grounded cage socket may also be used, which may itself include a rigidly insulated grounded cage socket 158. Furthermore, the grounded cage socket 158 ​​can guide the connection between the leadframe connectors 102A, 102B and the receiving connector, such as at least regarding... Figure 2A As described. In one example, a short grounding cage receptacle 158 may support a connection between leadframe connectors 102A, 102B and a daughterboard. The short grounding cage receptacle 158 may include a daughterboard connector for 160A. A long grounding cage receptacle 158 (relative to the short grounding cage receptacle) may support a connection between leadframe connectors 102A, 102B and a backplane or middleplane. The long grounding cage receptacle 158 may include a middleplane or backplane connector for 160B. In one example, connector 104 is located between the daughterboard and the backplane or middleplane, these further relate to Figure 2A To elaborate further.

[0102] Figure 1II This is a partial view 100II of a connector having retracted pins in its cylindrical section according to at least some embodiments. Figure 1II As illustrated, when coupled to a circuit board or computing component, pin 110 can be in the retracted pin 110B position within the cylindrical section 108 of each cylindrical pair 156. Figure 1II The illustration shows that air insulation or rigid insulation may be included between lead pair 154 and tubular pair 156. In one example, a grounded cage socket 158 ​​may support the distance maintained between connectors 104 in each of lead pair 154 and tubular pair 156. Figure 1II The illustration also shows that the number of lead pairs 154 and tubular pairs 156 can be multiple, depending in part on the type of lead frame connectors 102A and 102B. For example, in one example, the lead frame connector can transmit signals of different standards mentioned herein, or it can transmit power, such as at least in combination. Figure 4 and Figure 5 As described in [the text].

[0103] Figure 1II The diagram also illustrates the situation when the frame connectors 102A and 102B of the daughter board are coupled to the middle board or backplane 202 (still...). Figure 2A , Figure 2B The receiving connector (e.g., shown in the image) Figure 2A , 2B As shown in the diagram, when the pins 110 of connector 104 pass through the receiving connector and make contact 162 with the surface contact pads 220 of the middle plate or back plate 202, the contact 162 includes a predetermined pressure 164 between the pins 110 and the surface contact pads 220, which is sufficient to bring each pin 110 into the retracted pin 110B position. The pressure 164 is also sufficient to ensure that the retracted pins 110B maintain electrical connectivity through the contact 162, thereby transmitting signals from the middle plate or back plate 202 and through each connector 104 of the lead frame connectors 102A, 102B.

[0104] Contact 162 avoids problems that arise when anchoring flexible interfaces to the PCB. The retracted pin 110B allows for coupling and decoupling without the need for through-holes or compressed pins mating with surface contact pads. In each case, the pin 110, being in the retracted pin 110B position, allows for the application of a predetermined insertion or compression force without damage or poor contact after repeated coupling and decoupling using the leadframe connectors 102A, 102B described herein. Furthermore, the pin 110's ability to be in the retracted pin 110B position allows for a constant force, as part of pressure 164, to maintain contact between the pin 110 and the surface contact pad 220. The leadframe connectors 102A, 102B described herein ensure that no additional interface is required between each connector 104 and the circuit board (e.g., middle board or backplane 202).

[0105] Figure 1JJ The illustration shows a partial cross-sectional view 100JJ of a connector according to at least some embodiments, the connector having a retracted pin and a compression spring in its cylindrical section. In one example, Figure 1JJ The diagram shows Figure 1II A partial view of the cross section at 100FF. Figure 1JJ As shown, when the needle 110 is coupled to the circuit board or computing component, the needle 110 can be in the retracted needle 110B position within the cylinder section 108 of each cylinder pair 156, which is achieved at least by compressing the corresponding spring 112, such that the spring 112 is in the compressed spring 112A position.

[0106] Figure 2AThe illustration shows a connection 200A between two circuit boards according to at least some embodiments, and this connection is used for differential signal transmission via leadframe connectors. One circuit board may be a middle board or back board 202, and the other circuit board may be a daughter board 204. Leadframe connectors 102A, 102B may include: a rigid profile 206 provided by at least rigid insulation that may extend throughout the lead segment 106, and one or more barrel segments 108 of each connector 104. As shown, leadframe connectors 102A, 102B may be held by grounded cage receptacles 158 of each daughter board connector pair 160A and each middle board or back board connector pair 160B. In another example, an external fastener or other external retainer 208 may be used between the circuit board and the leadframe connectors 102A, 102B. The external fastener or other external retainer 208 may be used to secure or limit the leadframe connectors 102A, 102B to prevent them from being disconnected from or displaced by the receiving connector 210 of the circuit board. For example, on at least daughterboard 204, the receiving connector may be a surface contact pad and an external tie or other external retainer 208. On the middle or backplane, the surface contact pad 220 may be aligned with the receiving connector 210 and its associated grounding cage receptacle 158 to allow connection of the leadframe connectors 102A, 102B. The pins 110 on the leadframe connectors 102A, 102B are pressed (e.g., pressured or forceped) against the surface contact pad 220, at least under the bias of the spring 112.

[0107] Figure 2B The diagram illustrates a connection 200B between a sub-board and a backplane or middleboard, and other computing components, according to at least some embodiments. Figure 2B The diagram illustrates the use of a right-angle leadframe connector 262 between the daughterboard 204 and the middle or backplane 202. The right-angle leadframe connector 262 can be used as follows: Figure 2A Specifically, as described in the text, it can be as follows: Figure 2A The lead frame connectors 102A and 102B are described in the text. Figure 2B The use of a through-type leadframe connector 264 is also illustrated, each connector 104 of which has a straight lead segment 106 and a straight cylindrical body segment 108. The through-type leadframe connector 264 can be positioned between a computing component 266 and a daughterboard 204. The computing component can be an adapter, memory stick, communication card, or other components that may be intended for use with the daughterboard 204, middleboard, or backplane 202 via the daughterboard 204. In one example, the through-type leadframe connector 264 does not need to include the angled feature 118 in its individual connectors 104.

[0108] Both the right-angle leadframe connector 262 and the straight-through leadframe connector 264 may include a portion of their internal structure that integrates a spring-loaded pin 110 as part of their leadframe connector internal structure. This internal structure includes a lead segment 106 and a cylindrical segment 108 formed by portions of the lead segment. See details. Figure 1AA-1JJ As shown in one or more figures. In at least one example, pins 110 in each connector 104 of the right-angle leadframe connector 262 and the through-type leadframe connector 264 may extend or retract from the cylindrical section 108 partially based on engagement 128 with the spring 112. Pins 110 are used to contact surface contact pads on a circuit board (which may be a daughter board 204, a middle board, or a back board 202, depending on the connection method). This contact can be used to transmit signals from the circuit board through the connector. Furthermore, each connector 104 may include a first cylindrical section for coupling to a second cylindrical section via a lead section. Each conductor may be part of a conductor array of the leadframe connector, and the first cylindrical section may be coupled to the daughter board 204, and the second cylindrical section may be coupled to the middle board or back board 202 of a rack in a data center, at least in Figure 5 A more detailed description is available in the text.

[0109] Figure 3A The illustration depicts a process or method 300A for a circuit board connector with a grounded cage socket according to at least some embodiments, the grounded cage socket being separated from its cylindrical section and pins of lead pairs by one or more dielectric structures. Method 300A is compatible with the methods described herein. Figure 3AA and Figure 3BB Either method 300AA or 300BB may be used together. Method 300A may include the step of forming a grounded cage socket 3002 around the lead pair. The lead pair may include a barrel segment and a pin. The barrel segment may be sized differently relative to the pin. Method 300A may include the step of determining a desired impedance distribution profile 3004 to be maintained on the barrel segment and the pin. Method 300A may include the step of determining the size or shape of the dielectric structure 3006 based on the desired impedance distribution profile.

[0110] Method 300A may include the step of determining 3008 one or more dielectric structures comprising one or more of the dimensions or shapes. In some examples, one or more of the dimensions or shapes of the dielectric structures may be at least partially based on the expected impedance distribution curves to be maintained on the barrel segment and the needle (e.g., Figure 1F-1H (As shown) and predetermined. A data repository can be maintained to store expected impedance distribution curves for different curves. For example, the expected impedance distribution curve can serve as a reference for the dielectric structure used in circuit board connectors. Method 300A may include a step that allows the 3010 grounded cage socket 3010 to be separated from the housing segment and pins via one or more dielectric structures.

[0111] Method 300A may include steps or sub-steps for determining individual spacers having predetermined dimensions, in part based on a desired impedance distribution profile that needs to be maintained on the barrel segment and the pin. Method 300A may include steps or sub-steps for allowing one or more dielectric structures to contain individual spacers with a predetermined spacing between them. This predetermined spacing may also be based in part on a desired impedance distribution profile that needs to be maintained on the barrel segment and the pin.

[0112] Method 300A may include a step or sub-step for allowing each spacer to include a first spacer located at a distal position relative to a first end of the lead pair. Each spacer may include a second spacer located at a proximal position relative to a second end of the lead pair. Each spacer may include a third spacer located at an intermediate position relative to the first and second ends of the lead pair. Method 300A may include a step or sub-step for allowing each spacer to include one of different predetermined thicknesses as a portion of its size or shape. The different predetermined thicknesses may be associated with different impedance profiles that can be maintained on the barrel segment and the needle.

[0113] Method 300A may include a step or sub-step for determining an axial element that extends substantially along the length comprising the barrel segment and the needle. Method 300A may include a step or sub-step for allowing one or more dielectric structures to include axial elements having distributed spacers. Method 300A may include a step or sub-step for preparing distributed spacers having the same predetermined spacing between them, the predetermined spacing being based in part on a desired impedance distribution profile that needs to be maintained on the barrel segment and the needle.

[0114] Method 300A may include steps or sub-steps for determining axial elements with distributed spacers in a circuit board connector. Method 300A may include steps or sub-steps for allowing individual axial elements to be located at individual corners of a grounding cage receptacle. Method 300A may include steps or sub-steps for allowing individual axial elements to extend substantially along a length including the cylindrical section and pins, or for allowing individual axial elements of a plurality of axial elements to extend laterally through the length of the grounding cage receptacle.

[0115] Method 300A may include a step or sub-step for allowing one or more dielectric structures to resiliently move or deform when the connector is associated with a receiving connector of a circuit board. Method 300A may include a step or sub-step for allowing one or more dielectric structures to include discontinuous edges along a boundary within a grounded cage socket. One or more dielectric structures may be permitted within one or more dielectric structures and to include at least one air gap between lead pairs.

[0116] Method 300A may include steps or sub-steps for allowing a circuit board connector to become part of a connector array that forms a lead frame connector between a first circuit board and a second circuit board or computing component. Method 300A may include steps or sub-steps for pre-determining the size or shape to allow or support an impedance profile deviation of less than one percent relative to a desired impedance profile in practical applications.

[0117] Figure 3AA The illustration depicts a process or method 300AA for manufacturing a connector having lead segments and a housing segment according to at least some embodiments. For example, method 300AA may include the step of forming a lead segment 302 according to a connector layout. In one example, this layout may be provided during circuit board design. In another example, the layout may be provided during rack design. In one example, the layout may include one or more circuit boards for coupling together and available distance and space for use with cables or other computing devices. Method 300AA may include the step of forming a housing segment 304 from a portion of the lead segment. Method 300AA may include the step of associating a pin and a spring 306 within the housing segment. Method 300AA may include the step of allowing a pin 308 to extend or retract partially from or into the housing segment based on engagement with a spring. Method 300AA may include the step of allowing a connector 310 for signal transmission between at least two circuit boards or components of circuit boards. The pin may contact a surface contact pad on at least one circuit board to transmit signals from the circuit board and through the connector. In another example, the steps to allow 310 to use the connector may include using it for power connection between the power supply and the circuit board.

[0118] Figure 3BB The illustration depicts a process or method 300BB for a connector having a grounded cage socket, according to at least some embodiments. Figure 3BB Method 300BB can be used with Figure 3AAMethod 300AA is used in conjunction with method 300BB. Method 300BB can provide a connector for signal transmission. Method 300BB may include steps for forming a lead segment 352 according to the layout of the connector. Method 300BB may include steps for forming a housing segment 354 associated with or to be associated with the lead segment. Method 300BB may include steps for associating pins and springs 356 within the housing segment. Method 300BB may include steps for forming a grounding cage receptacle 358 at least surrounding the housing segment of the connector. The grounding cage receptacle may be configured to couple with and provide a grounding reference to a receiving cage receptacle. Method 300B may include steps for allowing pin 360 to extend or retract partially from or into the housing segment based on engagement with a spring. Method 300BB may include steps for allowing pin 362 to extend and retract partially based on a stop feature associated with the receiving cage receptacle. The stop feature may hold the grounding cage receptacle in a predetermined position relative to the receiving cage receptacle. Method 300BB may include steps for allowing connector 364 to be used for signal transmission between at least two circuit boards or components of circuit boards. As part of method 300BB, the pin may contact at least one surface contact pad on a circuit board to transmit signals between circuit boards via a connector.

[0119] Method 300BB may include steps or sub-steps for forming a grounded cage receptacle for mounting on a receiver connector. Method 300BB may include steps or sub-steps for forming a stop feature, which may serve as part of external insulation around the receiver cage receptacle or as part of internal insulation within the receiver cage receptacle. Method 300BB may include steps or sub-steps for determining a contact application including a predetermined pressure or contact resistance between a pin and a signal surface contact pad. Method 300BB may include steps or sub-steps for allowing contact between a pin and a signal surface contact pad, in part based on this contact application.

[0120] Method 300BB may include steps or sub-steps that allow the connector to become a daughterboard portion. Method 300BB may include steps or sub-steps that allow the receive connector to become a backplane or middleplane portion. Method 300BB may include steps or sub-steps that solder or attach a receive cage receptacle to ground surface contact pads, channels, or wires on the backplane or middleplane. Signal surface contact pads may be located within a perimeter formed by the ground surface contact pads, channels, or wires. Method 300BB may include steps or sub-steps that allow the connector to establish a differential signal connection with a ground reference. The pin's data signal may be one of a set of differential signals. The pin itself may be one of a set of differential signal pins supported by a ground reference of the ground cage receptacle.

[0121] Figure 4 The illustration shows an example data center that utilizes... Figure 1A-3BB and Figure 5-7At least one power connection embodiment is described. Data center 400 may include racks 404, which may be associated with servers 406 therein (in the form of server bays, server chassis, or server / computer modules), and racks 404 may contain computing devices therein for performing workloads. Although servers 406 are shown horizontally in the figures, they may also be mounted vertically within racks 404. These racks 404 may be tethered as part of the data center 400 infrastructure (e.g., via hardwired connections or natively within rack rows). For example, racks 404 may be associated with power supply units (PSUs) and may be connected to busbars 416 for receiving and distributing power for servers 406. These racks 404 may necessarily contain power supply components (e.g., busbars 418) closely associated with racks 404. These power supply components may be part of the infrastructure in data center 400. Racks 404 may include high-speed interconnects to enable high-speed communication between various subsystems, including servers 406.

[0122] Computing devices can be mounted on a circuit board and can include processors (such as central processing units (CPUs), quantum processing units (QPUs), graphics processing units (GPUs), data processing units (DPUs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), physical processing units (PPUs), etc.) and other components (such as memory, communication modules, input / output modules, etc.).

[0123] In at least one embodiment, data center 400 may include a server room 402 with one or more racks 404, wherein racks 404 may include server bays or servers 406. Data center 400 may be powered by a power distribution system 408 via one or more transformers 410 (Tr.), thereby adapting the power supplied to switching device 412 to the data center. For example, power distribution system 408 may be part of a power transmission system. The power transmission system may provide high-voltage power from a public power grid. Each transformer 410 may step down the voltage to a level suitable for data center equipment and apparatus (e.g., the aforementioned processors in server bays or servers 406 within each rack 404). Switching device 412 may be able to control, protect, and isolate downstream and upstream power.

[0124] Switching device 412 can be used to manage power flow reliably and efficiently using switches for control circuits and circuit breakers and fuses to detect and respond to faults or overloads in the downstream and upstream directions. In addition to the external power supplied by the transmission system, a backup system 414 (e.g., a generator or uninterruptible power supply (UPS)) can be used in conjunction with the power distribution system 408 (Power Dist.) to ensure uninterrupted power supply. Furthermore, cooling unit 426 can provide air cooling at least for the cold aisle 430 side of the data center 400 and deliver cooled air through rack 404 to the hot aisle 428 side. In one example, fans can assist in the air cooling flow.

[0125] Switching device 412 may be associated with busbar 416. Busbar 416 may power one or more racks 404. In one example, busbar 416 may power one or more racks 404 via a provided busbar 418. Busbar 418 may be a conductive strip for delivering current to various loads, including those represented by the processors mentioned above, which may be located within server racks or computer modules (also referred to as servers 406) in each rack 404 of the data center 400. Busbar 418 may be made of copper, aluminum, or a suitable power supply material. Busbar 418 may be able to work collaboratively to meet the high current requirements of the data center 400.

[0126] Data center 400 may include a midplane or backplane 202, such as Figure 2A , Figure 2B As shown in the related discussion, the middle or back plate 202 may have surface contact pads for receiving signals from other circuit boards (e.g., Figure 2A and Figure 2B The lead frame connectors 102A, 102B, 262, 264 (e.g., daughterboard 204) or other components in the data center Figure 1DD and Figure 2B (e.g., lead frame connectors in the design). For example, these components may include the power supply components described herein and, as in combination with... Figure 2B The computing component 266 described herein. A middle plate or back plate 202 may be associated with a receiving connector 210 for receiving a leadframe connector of a daughter plate 204, wherein multiple daughter plates 204 may be inserted into the middle plate or back plate 202. The leadframe connector may include a separate connector 104 with pins 110 and springs 112. Pins 110 may be used to contact surface contact pads within the receiving connector. A robust connection may be formed between the pins 110 and the surface contact pads, based in part on the spring bias of the springs 112 of the leadframe connector against the surface contact pads of the receiving connector, and in part on the alignment supported by the grounded cage receptacle 158 and any rigid insulation 150 provided as part of the leadframe connectors 102A, 102B.

[0127] Figure 5 The illustration shows aspect 500 of an example rack, which can be applied to Figure 1A-4 and Figure 6A-7 At least one embodiment of the above. Aspect 500 illustrates that rack 404 may have at least one circuit board, which may be a middle plate or back plate 202. Although shown as open, rack 404 may be fully enclosed with a front cover, rear cover, side cover, and top cover or access panel. Furthermore, although shown as a high-level flat structure, the circuit board may include at least one PCB (also as...). Figure 2A and Figure 2B (As shown and described). When used as a backplane, the circuit board may include a single-sided receive connector 506 for receiving a lead frame connector 504 of a daughter board or card 204. When used as a middle board, the circuit board may include dual-sided receive connectors 506 for receiving lead frame connectors 504 of daughter boards or cards 204 on both sides of the circuit board. Figure 5 In aspect 500, the circuit board is a middle board located in the middle of rack 404. The middle board can receive a vertical board server 406 or a daughter board 204. The daughter board 204 can be pushed to insert 502 against, for example, the receiving connector 506 of the middle board, thereby forming one or more connections between the middle board and the server or daughter board 204.

[0128] Figure 5 as well as Figure 1A-1CC The diagram also illustrates various aspects of a data center 500, including a midplane or backplane 202, one or more sub-boards 204, and multiple connectors 104 arranged in an array (such as...). Figure 1GG and Figure 2A (as shown) and the grounding cage socket within the connector (such as Figure 1AA-1CC (As shown). The middle board or backplane 202 may include signal surface contact pads and ground surface contact pads, channels, or lines for differential signals. The middle board or backplane 202 may include a receive connector 506 separately associated with the ground surface contact pads, channels, or lines.

[0129] One or more daughterboards 204 can be coupled to a middleboard or backboard 202 via a leadframe connector 504. The leadframe connector 504 may include connectors arranged in an array and may include a grounding cage receptacle within the connector. The grounding cage receptacle may surround a pin- and spring-loaded cylindrical section of the leadframe connector 504. Individual grounding cage receptacles may surround a respective pair of cylindrical sections. The grounding cage receptacle may be coupled to a receiving cage receptacle to provide a ground reference for data signals transmitted via pins and springs. Pins can extend from or retract into a corresponding cylindrical section of the cylindrical section, at least in part, based on a corresponding stop feature associated with a corresponding receiving cage receptacle. The corresponding stop feature holds the grounding cage receptacle in a predetermined position relative to the receiving cage receptacle. The corresponding stop feature allows pins to contact signal surfaces to contact pads for transmitting data signals between one or more daughterboards and the middleboard or backboard.

[0130] Figure 6A An example data center 600 in which at least one embodiment can be used is illustrated. In at least one embodiment, the data center 600 includes a data center infrastructure layer 610, a framework layer 620, a software layer 630, and an application layer 640. Figure 6A An example data center 600 in which at least one embodiment can be used is illustrated. In at least one embodiment, the data center 600 includes a data center infrastructure layer 610, a framework layer 620, a software layer 630, and an application layer 640. The data center 600 may include one or more racks, for example, in combination. Figure 1DD and Figure 1EE The racks described herein. These racks may include one or more server racks. These one or more server racks may include one or more electronic components for performing at least a portion of the workload in the data center. The racks and server racks may be represented at least by a data center infrastructure layer 610. These electronic components may be represented by node computing resources 616(1)-616(N), which may be cooled using cold plates.

[0131] The data center 600 may include a cooling loop for removing heat from electronic components during workload execution. The cooling loop may include a manifold, which comprises a manifold module and a cover, as shown in the figure. Figures 2A to 5As detailed in one or more figures in D. A cover may include a curved surface located within the manifold's passageway. This curved surface may be configured to receive cooling fluid flow and guide the cooling fluid flow away from stagnant areas within the manifold. Data center 600 may include multiple segmented cooling loops for removing heat from electronic components during workload execution. A segmented cooling loop may include multiple manifold modules. Individual outlets of the manifold modules may guide cooling fluid. Multiple covers located at different ends of the multiple manifold modules may reduce the cooling fluid flow rate at each outlet to a predetermined threshold.

[0132] In at least one embodiment, such as Figure 6A As shown, the data center infrastructure layer 610 may include a resource orchestrator 612, packet computing resources 614, and node computing resources (“nodes CR”) 616(1)-616(N), where “N” represents any positive integer. In at least one embodiment, nodes CR 616(1)-616(N) may include, but are not limited to, any number of central processing units (“CPUs”) or other processors (including accelerators, field-programmable gate arrays (“FPGAs”), graphics processors, etc.), memory devices (e.g., dynamic read-only memory), storage devices (e.g., solid-state drives or disk drives), network input / output (“NW I / O”) devices, network switches, virtual machines (“VMs”), power modules, and cooling modules, etc. In at least one embodiment, one or more nodes CR 616(1)-616(N) may be servers having one or more of the aforementioned computing resources.

[0133] In at least one embodiment, the grouped computing resource 614 may include multiple individual groups of node CRs housed within one or more racks (not shown), or multiple racks housed within data centers (not shown) in different geographical locations. The individual groups of node CRs within the grouped computing resource 614 may include computing, networking, memory, or storage resources that can be configured or allocated to support one or more workloads. In at least one embodiment, several node CRs, including CPUs or processors, may be grouped within one or more racks to provide computing resources to support one or more workloads. In at least one embodiment, the one or more racks may also include any number of power modules, cooling modules, and network switches, in any combination thereof.

[0134] In at least one embodiment, resource orchestrator 612 may configure or otherwise control one or more nodes CR 616(1)-616(N) and / or group computing resources 614. In at least one embodiment, resource orchestrator 612 may include a software design infrastructure (“SDI”) management entity for data center 600. In at least one embodiment, resource orchestrator may include hardware, software, or some combination thereof.

[0135] In at least one embodiment, such as Figure 6A As shown, framework layer 620 includes job scheduler 622, configuration manager 624, resource manager 626, and distributed file system 628. In at least one embodiment, framework layer 620 may include a framework for supporting software 632 of software layer 630 and / or one or more applications 642 of application layer 640. In at least one embodiment, software 632 or application 642 may respectively include web-based service software or applications, such as services or applications provided by Amazon Web Services, Google Cloud, and Microsoft Azure. In at least one embodiment, framework layer 620 may be, but is not limited to, a free and open-source software web application framework, such as Apache Spark™ (hereinafter “Spark”), which can leverage distributed file system 628 for large-scale data processing (e.g., “big data”). In at least one embodiment, job scheduler 622 may include Spark drivers to facilitate scheduling workloads supported by the various layers of data center 600. In at least one embodiment, configuration manager 624 may be able to configure different layers, such as software layer 630 and framework layer 620, including Spark and distributed file system 628, to support large-scale data processing. In at least one embodiment, resource manager 626 may be able to manage cluster or group computing resources mapped to or allocated to support distributed file system 628 and job scheduler 622. In at least one embodiment, cluster or group computing resources may include group computing resources 614 at data center infrastructure layer 610. In at least one embodiment, resource manager 626 may coordinate with resource orchestrator 612 to manage these mapped or allocated computing resources.

[0136] In at least one embodiment, the software 632 included in the software layer 630 may include software used by at least a portion of the nodes CR 616(1)-616(N), the grouped computing resources 614, and / or the distributed file system 628 of the framework layer 620. One or more types of software may include, but are not limited to, internet web search software, email virus scanning software, database software, and streaming video content software.

[0137] In at least one embodiment, the application 642 included in the application layer 640 may include one or more types of applications available for use by at least a portion of the nodes CR 616(1)-616(N), the grouped computing resources 614, and / or the distributed file system 628 of the framework layer 620. One or more types of applications may include, but are not limited to, genomics applications, cognitive computing applications, and machine learning applications, including training or inference software, machine learning framework software (e.g., PyTorch, TensorFlow, Caffe, etc.), or other machine learning applications used in conjunction with one or more embodiments.

[0138] In at least one embodiment, any of the configuration manager 624, resource manager 626, and resource orchestrator 612 can implement any number and type of self-modification actions based on any amount and type of data obtained in any technically feasible manner. In at least one embodiment, the self-modification actions can enable the data center operator of data center 600 to avoid making potentially erroneous configuration decisions and may avoid using underutilized and / or poorly performing portions of the data center.

[0139] In at least one embodiment, data center 600 may include tools, services, software, or other resources for training one or more machine learning models, or for using one or more machine learning models to predict or infer information, according to one or more embodiments described herein. For example, in at least one embodiment, a machine learning model can be trained by calculating weight parameters based on a neural network architecture using the software and computing resources described above for data center 600. In at least one embodiment, the trained machine learning model corresponding to one or more neural networks can be used to infer or predict information using the resources described above for data center 600 by utilizing weight parameters calculated via one or more training techniques described herein.

[0140] In at least one embodiment, the data center may use a CPU, application-specific integrated circuit (ASIC), GPU, FPGA, DPU, QPU, or PPU, or other hardware, to perform training and / or inference using the aforementioned resources. Furthermore, one or more of the aforementioned software and / or hardware resources may be configured as services to allow users to train or perform information inference, such as image recognition, speech recognition, or other artificial intelligence services.

[0141] Inference and / or training logic 615 is used to perform inference and / or training operations associated with one or more embodiments. In at least one embodiment, inference and / or training logic 615 may be used... Figure 6AIn the system shown, inference or prediction operations are performed based at least in part on weight parameters calculated using the neural network training operations, neural network functions and / or architecture or neural network use cases described herein.

[0142] Figure 6B This is a block diagram schematically illustrating a computing system, which could be a data center or a high-performance computing (HPC) cluster, in which various technologies can be used. Figure 1A-5 At least one embodiment of the above. According to at least some embodiments, the computing system 650 may include multiple subsystems, such as multiple processing devices, multiple network devices, and multiple networks coupled to each other. The computing system 650 is designed to have multiple integrated circuits (referred to as processing devices), wherein each integrated circuit may include one or more CPUs and GPUs, thereby forming a powerful and flexible architecture.

[0143] The various processing devices are interconnected via NVLink or other high-speed interconnects to enable high-speed communication between subsystems and are connected via NICs or DPUs to ensure efficient data transmission across computing system 650 and with one or more external networks 6530, 653. In this example, computing system 650 includes: packet switch 6548 for connecting NIC / DPU 6528 to external network 6530; and packet switch 6550 for connecting NIC / DPU 6532 to external network 6536.

[0144] Coupling processing devices via NVLink enables seamless data exchange and parallel processing, thereby improving overall computing performance. Processing devices connect to multiple networks via one or more Network Interface Controllers (NICs) or Data Processing Units (DPUs), enabling the system to handle complex multi-network tasks with high bandwidth and low latency. This configuration is ideal for demanding applications requiring powerful processing capabilities, such as artificial intelligence (AI), machine learning (ML), and data-intensive computing, while ensuring robust connectivity and scalability across diverse network environments. The integrated circuits of the Computing System 650 may include one or more CPUs and one or more GPUs.

[0145] Figure 6BAn example architecture of a multi-GPU architecture is also demonstrated. As shown in the figure, computing system 650 includes a processing device 6502 with a multi-GPU architecture. Specifically, processing device 6502 may be a system-on-a-chip (SoC) and includes multiple subsystems, such as CPU 6506, GPU 6508, and GPU 6510. CPU 6506 may be coupled to GPU 6508 via die-to-die interconnect (D2D) or chip-to-chip interconnect (C2C) 6512 (e.g., ground reference signaling interconnect (GRS interconnect)). CPU 6506 may be coupled to GPU 6510 via D2D or C2C interconnect 6514. CPU 6506 may also be coupled to GPU 6508 and GPU 6510 via PCIe interconnect.

[0146] The CPU 6506 can be coupled to one or more NICs or DPUs, which in turn are coupled to one or more networks. For example, Figure 6B As shown, CPU 6506 is coupled to a first NIC / DPU 6526, which is coupled to an external network 6530. CPU 6506 is also coupled to a second NIC / DPU 6528, which is coupled to the external network 6530 via a packet switch 6548. NIC / DPU 6526 and NIC / DPU 6528 can be coupled to the external network 6530 via Ethernet (ETH), NVLINK, or InfiniBand (IB) connections.

[0147] The computing system 650 also includes a processing device 6504 with a multi-GPU architecture. Specifically, the processing device 6504 includes multiple subsystems, including a CPU 6516, a GPU 6518, and a GPU 6520. The CPU 6516 may be coupled to the GPU 6518 via a D2D or C2C interconnect 6522. The CPU 6516 may be coupled to the GPU 6520 via a D2D or C2C interconnect 6524. The CPU 6516 may also be coupled to the GPUs 6518 and 6520 via a PCIe interconnect. The CPU 6516 may be coupled to one or more NICs or DPUs, which in turn are coupled to one or more networks. For example, as Figure 6BAs shown, CPU 6516 is coupled to a first NIC / DPU 6534, which is coupled to an external network 6536. CPU 6516 is also coupled to a second NIC / DPU 6532, which is coupled to the external network 6536 via a packet switch 6550. NIC / DPU 6532 and NIC / DPU 6534 can be coupled to the external network 6536 via Ethernet (ETH), NVLink, or InfiniBand (IB) connections.

[0148] In at least one embodiment, processing device 6502 and processing device 6504 can communicate with each other via NIC / DPU 6538, for example, via PCIe interconnect. Processing device 6502 and processing device 6504 can also communicate with each other via high-bandwidth communication interconnect 6540, such as NVLink interconnect or other high-speed interconnects. For example, Figure 6B The packet switches in the diagram can include Nvidia Quantum-2 switches. The NIC / DPU shown in the diagram can include, for example, an Nvidia Bluefield DPU.

[0149] In various embodiments, any network device of computing system 650, such as any of NIC / DPU 6526, 6528, 6532, 6534 and 6538, and / or any of packet switches 6548 and 6550, may include a suitably shaped leakage sensor that can be matched to the geometry around the components and features in computing system 650 and can be communicatively coupled to each other to extend leakage detection capabilities.

[0150] Figure 6C The illustration depicts a computer system according to at least one example, in which... Figure 1A-6B and Figure 7 At least one embodiment of the present disclosure. In at least one embodiment, the computer system 690 is configured to implement the various processes and methods described herein.

[0151] In at least one embodiment, the computer system 690 includes, but is not limited to, at least one central processing unit (“CPU”) 6902 connected to a communication bus 6910, which is implemented using any suitable protocol, such as PCI (“Peripheral Component Interconnect”), Peripheral Component Fast Interconnect (“PCI-Express”), AGP (“Accelerated Graphics Port”), HyperTransport, or any other bus or point-to-point communication protocol. In at least one embodiment, the computer system 690 includes, but is not limited to, main memory 6904 and control logic (e.g., implemented in hardware, software, or a combination thereof), and data is stored in main memory 6904, which may be in the form of random access memory (“RAM”). In at least one embodiment, a network interface subsystem (“network interface”) 6922 provides an interface to other computing devices and networks for receiving data from the computer system 690 and sending data to other systems.

[0152] In at least one embodiment, the computer system 690 includes, but is not limited to, an input device 6908, a parallel processing system 6912, and a display device 6906, which may be implemented using conventional cathode ray tube (“CRT”), liquid crystal display (“LCD”), light-emitting diode (“LED”), plasma display, or other suitable display technologies. In at least one embodiment, user input is received from the input device 6908, such as a keyboard, mouse, touchpad, microphone, etc. In at least one embodiment, each of the above modules may reside on a single semiconductor platform to form a processing system.

[0153] In at least one embodiment, a computer program, existing in the form of machine-readable executable code or computer control logic algorithms, is stored in main memory 6904 and / or secondary storage devices. If executed by one or more processors, the computer program enables computer system 690 to perform various functions according to at least one embodiment. Main memory 6904, storage devices, and / or any other storage medium are examples of computer-readable media. In at least some embodiments, secondary storage devices may refer to any suitable storage device or system, such as hard disk drives and / or removable storage drives, e.g., representing floppy disk drives, magnetic tape drives, optical disk drives, digital versatile optical disc (“DVD”) drives, recording devices, Universal Serial Bus (“USB”) flash memory, etc. In at least one embodiment, the architecture and / or functionality shown in the foregoing figures are implemented in the context of: CPU 6902, parallel processing system 6912; integrated circuits capable of implementing at least some of the functions of CPU 6902 and parallel processing system 6912; chipsets (e.g., a set of integrated circuits designed to operate and be sold as units performing related functions); and any suitable combination of integrated circuits.

[0154] In at least one embodiment, the architecture and / or functionality shown in the foregoing figures are implemented within the context of a general-purpose computer system, a circuit board system, a game console system dedicated to entertainment, a special-purpose application system, etc. In at least one embodiment, the computer system 690 may be a desktop computer, laptop computer, tablet computer, server, supercomputer, smartphone (e.g., wireless handheld device), personal digital assistant (“PDA”), digital camera, vehicle, head-mounted display, handheld electronic device, mobile phone device, television, workstation, game console, embedded system, and / or any other type of logic.

[0155] In at least one embodiment, the parallel processing system 6912 includes, but is not limited to, multiple parallel processing units (“PPUs”) 6914 and associated memory 6916. In at least one embodiment, the PPUs 6914 are connected to a host processor or other peripheral devices via interconnects 6918 and switches 6920 or multiplexers. In at least one embodiment, the parallel processing system 6912 distributes computational tasks to the PPUs 6914, and these tasks can be executed in parallel, for example, as part of distributing computational tasks across multiple graphics processing units (“GPUs”) thread blocks. In at least one embodiment, memory can be shared and accessed (e.g., for read and / or write access) on some or all of the PPUs 6914, although such shared memory may result in performance degradation compared to using local memory and registers residing on the PPUs 6914. In at least one embodiment, the operation of the PPUs 6914 is synchronized using commands such as _syncthreads(), where all threads in a block (e.g., executing across multiple PPUs 6914) must reach a specific point in code execution before continuing execution.

[0156] Figure 7An example network configuration 700 of components is illustrated, which includes aspects that can be used to implement various embodiments, such as providing, generating, modifying, encoding, processing, fusing, and / or transmitting generated image data, calculated measurements, or other such content. In at least one embodiment, client device 702 can use components of content application 704 on client device 702, as well as data stored locally on the client device, to generate or receive data for a dialogue. In at least one embodiment, content application 724 executing on computer or processor 720 (e.g., cloud server or control system) can initiate a dialogue associated with at least one client device 702 (e.g., vehicle or robot), which can use a dialogue manager and user data stored in user database 736, and can select and / or retrieve content such as liquid coolant or server thermal data from thermal storage repository 734 for use by test module 732 to calculate one or more performance metrics in an environment where the data will be used to determine appropriate operation, for use by monitoring module 728, which can provide flow data or thermal data to control module 730 to control flow or temperature. Content manager 726 can act on these different modules to perform tests and analyses, and potentially indicate any actions to be taken in response to performance metrics failing to meet operational requirements. At least a portion of the data or instruction content can be transmitted to client device 702 and / or physical device 770 via download, streaming, or other such transmission channels using appropriate delivery manager 722. An encoder can be used to encode and / or compress at least a portion of the data before transmission to client device 702. In at least one embodiment, client device 702 receiving such content can provide it to a corresponding content application 704, which may also or optionally include a graphical user interface (GUI) 710, a streaming monitoring module 712, and a control module 714 for providing, compositing, rendering, combining, modifying, or using the content on or through client device 702 for presentation, navigation, control (or other purposes), such as transmission to physical device 770. In some embodiments, computer / processor 720 and client device 702 may be able to communicate directly without transmitting data over network 740 to avoid problems such as latency and availability. The decoder can also be used to decode data received via network 740 for presentation via client device 702, such as through the image content or performance metrics of display device 706, and through audio via at least one audio playback device 708 (e.g., a speaker or headphones), such as corresponding sound or synthesized speech.In at least one embodiment, at least a portion of the content may already be stored on, rendered on, or accessible to client device 702, thus at least this portion of the content does not need to be transmitted over network 740. For example, this portion of the content (e.g., hot data) may have been pre-downloaded or stored locally on a hard disk or optical disk. In at least one embodiment, the content may be transmitted from computer / processor 720 or user database 736 to client device 702 using a transmission mechanism such as data streaming. In at least one embodiment, at least a portion of the content may be obtained, enhanced, and / or streamed from other sources (e.g., third-party service 760 or other client device 750), which may also contain applications for generating, updating, enhancing, or providing map content. In at least one embodiment, a portion of this functionality may be executed using multiple computing devices or multiple processors within one or more computing devices, for example, a combination of CPU and GPU (graphics processing unit).

[0157] In at least one embodiment, the cold plate described herein may include adjustable fins that form microchannels through which fluid flows. In at least one embodiment, the fins in the cold plate allow heat from at least one associated computing device to be transferred to fluid flowing through the microchannels formed between the multiple fins. In at least one embodiment, the fins of the cold plate may be dynamically and in real-time adjusted to allow more heat to be transferred from at least one computing device to fluid flowing through the finned cold plate. In at least one embodiment, such fins may be regulated by a processor or processorless system in part based on a determined (e.g., sensed) cold plate temperature. In at least one embodiment, the temperature may be associated with at least one computing device, the workload of at least one computing device, or the fluid at different time periods and at the inlet and outlet of the cold plate. In at least one embodiment, the processorless system may rely on the thermal properties of at least two materials used to form the cold plate fins, such that these fins can react without a processor, thereby exposing more surface area to the fluid. In at least one embodiment, these fins may include overlapping portions that may be exposed by the action of a control mechanism or by the properties of the at least two materials associated with each other that together constitute the fins.

[0158] In at least some examples, client devices can include any suitable computing device, such as desktop computers, laptops, set-top boxes, streaming media devices, game consoles, smartphones, tablets, VR headsets, AR glasses, wearable computers, or smart TVs. Each client device can submit requests via at least one wired or wireless network, such as the Internet, Ethernet, a local area network (LAN), or a cellular network, and other such options. In this example, these requests can be submitted to an address associated with a cloud provider that operates or controls one or more electronic resources within the cloud provider's environment, such as data centers or server clusters. In at least one embodiment, requests can be received or processed by at least one edge server located at the network edge and outside at least one security layer associated with the cloud provider's environment. This reduces latency and improves the security of resources within the cloud provider's environment by allowing client devices to interact with closer servers.

[0159] In at least one embodiment, such a system can be used to monitor or manage the thermal condition of a server that includes a cold plate as a liquid manifold. In other embodiments, such a system can be used for other purposes, such as controlling the flow rate of liquid coolant or performing deep learning operations. In at least one embodiment, such a system can be implemented using an edge device or may include one or more virtual machines (VMs). In at least one embodiment, such a system can be implemented at least partially within a data center or at least partially utilizing cloud computing resources.

[0160] Other variations also fall within the scope of this disclosure. Therefore, while the disclosed technology can be modified and alternatively constructed in various ways, certain exemplary embodiments have been shown in the accompanying drawings and described in detail above. However, it should be understood that this disclosure is not intended to limit the scope to the specific forms or multiple specific forms disclosed, but rather to cover all modifications, alternative constructions, and equivalents that fall within the spirit and scope of this disclosure as defined in the appended claims.

[0161] In describing the disclosed embodiments (particularly in the following claims), the terms “a,” “an,” “the,” and similar pronouns should be interpreted to cover both singular and plural forms unless otherwise stated herein or the context clearly indicates otherwise, and should not be considered as limiting the terms. The terms “comprising,” “having,” “including,” and “containing” should be interpreted as open-ended terms (meaning “including but not limited to”) unless otherwise stated. When the word “connection” is unmodified and refers to a physical connection, it should be interpreted as partially or wholly contained within, attached to, or linked together, even with the intervention of an intermediary. The enumeration of numerical ranges herein is intended only as a convenient method to individually refer to each individual value falling within a range, unless otherwise stated herein, and each individual value is incorporated into the specification as if it had been individually enumerated herein. Unless otherwise stated or the context clearly indicates otherwise, the terms “set” (e.g., “item set”) or “subset” should be interpreted as a non-empty set containing one or more members. Furthermore, unless otherwise stated or the context indicates otherwise, a “subset” of a set does not necessarily mean a proper subset of the set, but rather a subset and the set can be equal.

[0162] Conjunctive phrases such as "at least one of A, B, and C" or "at least one of A, B, and C" are generally understood, depending on the context, to mean that an item, term, etc., can be A, B, or C, or any non-empty subset of the set A, B, and C, unless explicitly stated otherwise or contradicted by the context. For example, in an illustrative example of a set containing three members, the conjunctive phrases "at least one of A, B, and C" and "at least one of A, B, and C" refer to any of the following sets: {A}, {B}, {C}, {A,B}, {A,C}, {B,C}, {A,B,C}. Therefore, such conjunctive phrases are generally not intended to imply that some embodiments require the simultaneous inclusion of at least one A, at least one B, and at least one C. Furthermore, unless explicitly stated otherwise or contradicted by the context, the term "multiple" indicates a plural state (e.g., "multiple items" means multiple items). A plural number means at least two items, but the number can be more if explicitly stated or determined by the context. Furthermore, unless otherwise stated or the context clearly indicates otherwise, the phrase “based on” means “at least partially based on”, not “completely based on”.

[0163] The operations of the processes described herein can be performed in any suitable order unless otherwise stated herein or there is a clear contradiction in the context. In at least one embodiment, processes such as those described herein (or variations and / or combinations thereof) are executed under the control of one or more computer systems configured with executable instructions and implemented in the form of code (e.g., executable instructions, one or more computer programs, or one or more application programs) that execute cooperatively on one or more processors, or implemented by hardware or a combination thereof. In at least one embodiment, the code is stored on a computer-readable storage medium, for example, in the form of a computer program containing multiple instructions executable by one or more processors. In at least one embodiment, the computer-readable storage medium is a non-volatile computer-readable storage medium that excludes transient signals (e.g., propagating transient electrical or electromagnetic transmissions) but includes a non-volatile data storage circuitry system (e.g., buffers, caches, and queues) within a transient signal transceiver. In at least one embodiment, code (e.g., executable code or source code) is stored on a collection of one or more non-volatile computer-readable storage media that store executable instructions (or other memory for storing executable instructions) that, when executed by one or more processors of a computer system (i.e., as a result of execution), cause the computer system to perform the operations described herein. In at least one embodiment, the collection of non-volatile computer-readable storage media includes multiple non-volatile computer-readable storage media, and one or more individual non-volatile storage media do not contain all the code, while the multiple non-volatile computer-readable storage media collectively store all the code. In at least one embodiment, the executable instructions are executed such that different instructions are executed by different processors—for example, instructions are stored on non-transitory computer-readable storage media, and the main central processing unit (“CPU”) executes some instructions, while the graphics processing unit (“GPU”) executes the remaining instructions. In at least one embodiment, different components of the computer system have separate processors, and different processors execute different subsets of instructions.

[0164] The transmission medium can be any type of network cable, such as a direct-connect copper cable (DAC), an active copper cable (ACC), an active optical cable (AOC), a cable assembly with an OSFP connector, or an interconnect used in data center racks and related switching modules (e.g., Small Form Factor (SFP), Quad Small Form Factor (QSFP), etc.). It can also be a passive copper cable (PCC), an active optical cable, and an active optical module for transmitting optical signals. Alternatively, the cable may include an Ethernet cable, an active optical cable (AOC), or a cable assembly with an OSFP connector. The semiconductor device can be a pluggable network interface device, which may include the male portion of a direct-connect cable assembly (DAC). Network connectors can each be configured to connect to any type of network device (e.g., QSFP, direct-connect copper cable, active optical cable (AOC), etc.), so their dimensions (e.g., size and shape) can be matched to or otherwise connected to any corresponding network device. Cable connectors can be of any type (e.g., AOC connectors, Ethernet connectors, direct-connect copper cable connectors, active optical modules, etc.). A PCB is used to electrically connect electronic components via conductive paths or traces etched onto a metal plate. In many electronic systems, one or more Very Large Scale Integration (VLSI) components are coupled to the printed circuit board (PCB) of the host system. Such VLSI components may include a central processing unit (CPU) and a graphics processing unit (GPU), etc. The PCB may accommodate at least one processing circuit. This processing circuit may include hardware such as an application-specific integrated circuit (ASIC). The processing circuit may include an ASIC and / or may be capable of operating as a central processing unit (CPU), a graphics processing unit (GPU), a network interface controller (NIC), a data processing unit (DPU), or any other computing device for receiving and / or transmitting data. Other non-limiting examples of processing circuits include integrated circuit (IC) chips, central processing units (CPUs), graphics processing units (GPUs), microprocessors, field-programmable gate arrays (FPGAs), sets of logic gates or transistors, resistors, capacitors, inductors, diodes, etc. It should be understood that any suitable electrical or optical component or set of electrical or optical components is suitable for inclusion in the processing circuit. Many embodiments are described below in which semiconductor packages are mounted within through-holes in the PCB. Although PCBs of specific types and dimensions are shown in the accompanying drawings and discussion, it should be noted that the types and dimensions shown and described are provided by way of example only. Those skilled in the art, upon reference to this disclosure, will understand that the same or similar apparatus and techniques can also be used for PCBs of other types and dimensions. For example, in some embodiments, the PCB mounting the semiconductor package may include an add-on card, such as a PCIe card, configured to be coupled to a system board or motherboard of a host system. In other embodiments, the PCB mounting the semiconductor package may itself be a system board or motherboard of a host system.Furthermore, the system board or motherboard can be associated with any type of host system. For example, the PCB can include a system board in a multi-node rack-mounted server in a data center, or it can include a motherboard for a workstation, desktop, laptop, or mobile device. Other embodiments are also possible.

[0165] Therefore, in at least one embodiment, the computer system is configured to implement one or more services that individually or collectively perform the operations of the processes described herein, and the computer system is configured with corresponding hardware and / or software to enable the execution of these operations. Furthermore, the computer system implementing at least one embodiment of this disclosure may be a single device, or in another embodiment, a distributed computer system comprising multiple devices operating in different ways, such that the distributed computer system performs the operations described herein, and that a single device does not perform all operations.

[0166] Any and all examples or exemplary language (e.g., “such as”) provided herein are for the purpose of better illustrating embodiments of this disclosure and, unless otherwise stated, do not constitute a limitation on the scope of this disclosure. No language in the specification should be construed as indicating that any unstated element is essential to the practice of this disclosure.

[0167] In the specification and claims, the terms “coupled” and “connected” and their derivatives may be used. It should be understood that these terms are not synonymous with each other. More specifically, in some examples, “connected” or “coupled” may be used to indicate that two or more elements are in direct or indirect physical or electrical contact with each other. “Coupled” may also indicate that two or more elements are not in direct contact with each other, but still cooperate or interact with each other.

[0168] Unless otherwise expressly stated, it will be understood that throughout this specification, terms such as “processing,” “calculation,” “operation,” and “determine” refer to the operations and / or processes of a computer or computing system or similar electronic computing device that manipulate data represented as physical quantities (such as electronic quantities) in the registers and / or memory of the computing system and / or convert them into other data represented as physical quantities in the memory, registers, or other such information storage, transmission, or display devices of the computing system.

[0169] Similarly, the term "processor" can refer to any device or part of a device that processes electronic data from registers and / or memory and transforms that electronic data into other electronic data that can be stored in registers and / or memory. As a non-limiting example, "processor" can be a CPU, GPU, DPU, QPU, or PPU. A "computing platform" can include one or more processors. As used herein, a "software" process can include, for example, software and / or hardware entities that perform work over time, such as tasks, threads, and intelligent agents. Furthermore, each process can refer to multiple processes for executing instructions sequentially or in parallel, continuously or intermittently. The terms "system" and "method" are used interchangeably herein, as a system can contain one or more methods, and a method can be considered a system.

[0170] This document may refer to the acquisition, reception, or input of analog or digital data into a subsystem, computer system, or computer-implemented machine. Acquiring, receiving, or inputting analog and digital data can be achieved in various ways, such as receiving data as a parameter of a function call or application programming interface (API) call. In at least some embodiments, the process of acquiring, receiving, or inputting analog or digital data can be implemented by transmitting data via a serial or parallel interface. In at least another embodiment, the process of acquiring, receiving, or inputting analog or digital data can be implemented by transferring data from a providing entity to an receiving entity via a computer network. The provision, output, transmission, sending, or presentation of analog or digital data may also be mentioned. In various examples, the process of providing, outputting, transmitting, sending, or presenting analog or digital data can be implemented by transmitting data as an input or output parameter of a function call, a parameter of an application programming interface, or a parameter of an inter-process communication mechanism.

[0171] While the foregoing discussion illustrates exemplary implementations of the described technology, other architectures can be used to implement the described functionality, and all such architectures are within the scope of this disclosure. Furthermore, although specific assignments of responsibilities may have been defined above for ease of description, various functions and responsibilities may be allocated and divided in different ways depending on the specific circumstances.

[0172] Furthermore, although this document has described the subject matter using language specific to structural features and / or method steps, it should be understood that the subject matter claimed in the appended claims is not necessarily limited to the specific features or steps described. Rather, the specific features and steps described are disclosed only as exemplary forms for implementing the claims.

[0173] Other terms are provided below.

[0174] Clause 1. A circuit board connector comprising a grounded cage receptacle surrounding a lead pair, the lead pair including a cylindrical section and a pin, the cylindrical section having a different dimension relative to the pin, wherein the grounded cage receptacle is separated from the cylindrical section and the pin by one or more dielectric structures, and wherein the one or more dielectric structures include one or more of a predetermined size or shape based at least in part on a desired impedance profile to be maintained on the cylindrical section and the pin. In some examples, the impedance profile may include impedance values ​​in the differential impedance range of about 82 ohms to about 100 ohms. In some examples, the impedance profile may include impedance values ​​in the differential impedance range of about 85 ohms to about 100 ohms. In some examples, the impedance profile may include impedance values ​​of a differential impedance of about 82 ohms or 83 ohms.

[0175] Clause 2. The circuit board connector according to Clause 1, wherein the one or more dielectric structures include individual spacers having a predetermined spacing therebetween, wherein the individual spacers include predetermined dimensions, in part, based on an expected impedance distribution profile to be maintained between the barrel segment and the pin. In some examples, the predetermined dimensions may include a length of about 1.04 mm and a width of about 0.64 mm.

[0176] Clause 3. The circuit board connector according to Clause 2, wherein the individual spacers comprise: a first spacer located at a distal position relative to a first end of the lead pair; a second spacer located at a proximal position relative to a second end of the lead pair; and a third spacer located at an intermediate position relative to the first and second ends of the lead pair.

[0177] Clause 4. The circuit board connector according to Clause 2, wherein the individual spacers include one of different predetermined thicknesses as part of their size or shape; and wherein each of the different predetermined thicknesses is associated with a different impedance distribution profile that can be maintained on the barrel section and the pin. In some examples, the predetermined thickness may be a value of approximately 0.30 mm.

[0178] Clause 5. The circuit board connector according to Clause 1, wherein the one or more dielectric structures include an axial element having a plurality of distributed spacers; wherein the axial element extends generally along a length comprising a barrel segment and a pin; and wherein the plurality of distributed spacers include the same predetermined spacing, the predetermined spacing being based in part on an expected impedance distribution profile to be maintained on the barrel segment and the pin.

[0179] Clause 6. The circuit board connector according to Clause 1, wherein the one or more dielectric structures include a plurality of axial elements having distributed spacers, wherein each of the plurality of axial elements is located at a respective corner of the grounded cage receptacle, and wherein each of the plurality of axial elements extends substantially along a length including a cylindrical section and a pin.

[0180] Clause 7. The circuit board connector according to Clause 6, wherein each of the plurality of axial elements extends laterally through the length of the grounding cage socket.

[0181] Clause 8. The circuit board connector according to Clause 1, wherein the circuit board connector is part of a circuit board connector array constituting a lead frame connector between a first circuit board and a second circuit board or computing component, and wherein the size or shape is predetermined to allow or support a deviation of less than one percent of the impedance distribution curve relative to the expected impedance distribution curve in actual application.

[0182] Clause 9. The circuit board connector as described in Clause 1, wherein the one or more dielectric structures are resiliently movable or deformable when associated with a receiving connector of a circuit board. In some examples, the one or more dielectric structures are made of a material such as Teflon®, or contain Teflon or other polytetrafluoroethylene (PTFE).

[0183] Clause 10. The circuit board connector according to Clause 1, wherein the one or more dielectric structures include discontinuous edges along the boundary within the grounded cage socket, and include at least one air gap located within the one or more dielectric structures and between lead pairs.

[0184] Clause 11. A system comprising: a plurality of grounding cage sockets; and a plurality of lead segments, the plurality of lead segments comprising respective lead pairs located within respective grounding cage sockets of the plurality of grounding cage sockets, wherein each lead pair comprises a body segment and a pin, the body segment having a different size relative to the pin, wherein each grounding cage socket of the plurality of grounding cage sockets is separated from a corresponding body segment and a corresponding pin by one or more dielectric structures, and wherein the one or more dielectric structures comprise one or more of a predetermined size or shape based at least in part on a desired impedance distribution curve to be maintained on the body segment and the pin.

[0185] Clause 12. A data center comprising: a middle board or back board including a plurality of signal surface contact pads and a plurality of ground surface contact pads, channels or lines; and one or more daughter boards coupled to the middle board or back board via leadframe connectors, the leadframe connectors including: a plurality of ground cage sockets; and a plurality of lead segments, each lead segment including a lead pair located within a respective ground cage socket of the plurality of ground cage sockets, wherein the lead pair includes a body segment and a pin, the body segment having a different size relative to the pin, wherein each ground cage socket of the plurality of ground cage sockets is separated from a corresponding body segment and a corresponding pin by one or more dielectric structures, and wherein the one or more dielectric structures include one or more of a predetermined size or shape based at least in part on an impedance distribution profile to be maintained between the body segment and the pin.

[0186] Clause 13. A receiving connector comprising a receiving cage receptacle disposed on a circuit board, wherein the receiving connector is for receiving an application circuit board connector comprising a grounding cage receptacle surrounding a lead pair comprising a barrel segment and a pin, the barrel segment having a different size relative to the pin, wherein the grounding cage receptacle is separated from the barrel segment and the pin by one or more dielectric structures, and wherein the one or more dielectric structures comprise one or more of a predetermined size or shape based at least in part on a desired impedance distribution profile to be maintained between the barrel segment and the pin, and relative to the receiving cage receptacle or a ground terminal of the circuit board.

[0187] Clause 14. A method of using a circuit board connector, the method comprising: forming a grounding cage receptacle around a pair of leads, the pair of leads including a barrel segment and a pin, the barrel segment having a different size relative to the pin; determining one or more dielectric structures including one or more of pre-determined sizes or shapes based at least in part on a desired impedance distribution profile to be maintained on the barrel segment and the pin; and allowing the grounding cage receptacle to be separated from the barrel segment and the pin by the one or more dielectric structures.

[0188] Clause 15. The method according to Clause 14 further comprises: determining respective spacers, each spacer comprising respective predetermined dimensions, the respective predetermined dimensions being based in part on a desired impedance distribution profile to be maintained on the barrel segment and the pin; and allowing the one or more dielectric structures to include the respective spacers, the respective spacers having a predetermined spacing between them, wherein the predetermined spacing is also based in part on the desired impedance distribution profile to be maintained on the barrel segment and the pin.

[0189] Clause 16. The method according to Clause 15 further comprises one or more of the following: allowing each spacer to include a first spacer located at a distal position relative to a first end of the lead pair, a second spacer located at a proximal position relative to a second end of the lead pair, and a third spacer located at an intermediate position relative to the first and second ends of the lead pair; or allowing each spacer to include one of different predetermined thicknesses as part of the size or shape, wherein each of the different predetermined thicknesses is associated with different impedance distribution profiles that can be used to maintain on the barrel segment and the needle.

[0190] Clause 17. The method according to Clause 14 further comprises: determining an axial element that extends substantially along a length including the barrel segment and the needle; allowing one or more dielectric structures to include the axial element having a plurality of distributed spacers; and preparing the plurality of distributed spacers to include the same predetermined spacing between them, the predetermined spacing being based in part on a desired impedance distribution profile to be maintained on the barrel segment and the needle.

[0191] Clause 18. The method according to Clause 14 further comprises: determining a plurality of axial elements having distributed spacers for a circuit board connector; allowing each of the plurality of axial elements to be located at a respective corner of a grounding cage socket; and allowing each of the plurality of axial elements to extend substantially along a length including the cylindrical section and the pin, or allowing each of the plurality of axial elements to extend laterally through a length of the grounding cage socket.

[0192] Clause 19. The method according to Clause 14 further includes one or more of the following: allowing the one or more dielectric structures to elastically move or deform when the connector is associated with the receiving connector of the circuit board; or allowing the one or more dielectric structures to have discontinuous edges along the boundary within the grounded cage socket, and including at least one air gap within the one or more dielectric structures and between the lead pairs.

[0193] Clause 20. The method according to Clause 14 further includes: allowing the circuit board connector to become part of a connector array constituting a lead frame connector between the first circuit board and the second circuit board or computing component; and pre-determining the size or shape to allow or support a deviation of less than one percent of the impedance distribution curve relative to the expected impedance distribution curve in actual application.

[0194] Clause 21. A circuit board connector comprising a grounding cage receptacle surrounding a lead pair, the lead pair including a barrel section and a pin, the barrel section having different dimensions relative to the pin, wherein the grounding cage receptacle is separated from the barrel section and the pin by one or more dielectric structures, and wherein the dielectric structures within the grounding cage receptacle provide mechanical support and / or electrical tuning for the lead pair and a ground reference.

[0195] Clause 22. A circuit board connector comprising a grounding cage receptacle surrounding a lead pair, the lead pair including a barrel section and a pin, the barrel section having a different size relative to the pin, wherein the grounding cage receptacle is separated from the barrel section and the pin by one or more dielectric structures, and wherein the pin is spring-loaded to retract into the barrel section upon contact with a receiving connector.

[0196] Therefore, in at least one embodiment, the systems and methods disclosed herein can also be used with circuit board connectors having a grounded cage receptacle surrounding a lead pair. The lead pair may include a barrel segment and a pin. The barrel segment may have different dimensions relative to the pin. The grounded cage receptacle may be separated from the barrel segment and the pin by one or more dielectric structures. The one or more dielectric structures may include one or more of a predetermined size or shape based at least in part on a desired impedance distribution profile to be maintained on the barrel segment and the pin.

Claims

1. A connector comprising a grounded cage-type receptacle, wherein, The grounding cage socket is coupled to a receiving cage socket on the circuit board to provide a ground reference for the data signal, wherein a plurality of compressed signal pins engage with the circuit board to provide the data signal, and wherein the grounding cage socket also isolates the ground reference and the data signal.

2. The connector according to claim 1, wherein, The grounding cage socket is mounted on the receiving cage socket, and wherein the stop feature is an external insulating portion surrounding the receiving cage socket; or wherein the grounding cage socket is mounted on the inner side of the receiving cage socket, and wherein the stop feature is an internal insulating portion within the receiving cage socket.

3. The connector according to claim 1, wherein, The contact between the plurality of compression signal pins and the signal surface contact pads of the receiving connector on the circuit board is a predetermined contact application, which includes a predetermined pressure or contact resistance between the plurality of compression signal pins and the signal surface contact pads.

4. The connector according to claim 1, wherein, Partly based on at least one stop feature associated with the receiving cage receptacle, the plurality of compressed signal pins extend from or retract into a cylindrical section within the connector, wherein the stop feature holds the grounding cage receptacle in a predetermined position relative to the receiving cage receptacle and allows the plurality of compressed signal pins to contact signal surface contact pads on the circuit board for transmitting the data signal to the circuit board.

5. The connector according to claim 1, wherein, The connector is one or more of the following: A portion having differential signal connections of multiple signal surface contact pads of a receiving connector, wherein the data signal of the multiple compressed signal pins is one of a set of differential signals to the multiple signal surface contact pads, and the data signal is supported by the ground reference from the grounded cage socket; or Located on a daughterboard, wherein the receiver cage socket is associated with a receiver connector on a backplane or middleboard, wherein the receiver cage socket is soldered or fixed to a ground surface contact pad, channel, or line on the backplane or middleboard, and wherein the signal surface contact pad is within a perimeter formed by the ground surface contact pad, channel, or line.

6. The connector according to claim 1, wherein, The connector is part of a connector array that forms a lead frame connector between the circuit board and an additional circuit board or computing component.

7. The connector according to claim 1, further comprising: The connector includes a lead segment and a housing segment, wherein the housing segment is partially coupled to or formed by a portion of the lead segment, wherein the lead segment allows the data signal to be transmitted within the connector, and wherein the grounding cage socket also surrounds the lead segment.

8. The connector according to claim 1, further comprising: Rigid insulation surrounds the grounding cage socket to allow the connector to have a rigid form factor.

9. The connector according to claim 1, further comprising: A first cylindrical section is coupled to a second cylindrical section via a lead segment, wherein the second cylindrical section is coupled to a sub-board, and the first cylindrical section is used to couple to a middle plate or back plate of a rack in a data center, wherein the grounding cage socket extends from the second cylindrical section to the first cylindrical section to provide the grounding reference between the sub-board and the middle plate or the back plate.

10. The connector according to claim 1, further comprising: The parallel leads in the lead segment, the parallel cylinder in the cylinder segment, and the grounding cage socket located on the parallel leads and the parallel cylinder, wherein the parallel cylinder includes additional compressed signal pins, and wherein the additional compressed signal pins are used to support or allow differential signals therebetween, and the grounding cage socket is used to support or allow a ground reference for the differential signals; and The array of parallel leads is used to allow the connector to be part of a lead frame connector.

11. The connector according to claim 1, wherein, The grounding cage socket comprises a copper alloy, the pin comprises one or more of a copper alloy or gold plating, wherein the cylinder inside the grounding cage socket comprises one or more of a copper alloy or nickel plating, and wherein the spring inside the cylinder comprises stainless steel.

12. The connector according to claim 1, further comprising lead segments, wherein, The lead segment and the grounding cage socket include angled features to allow a 90-degree angle separation between one cylindrical segment of the connector and another cylindrical segment of another connector.

13. A system comprising: Multiple grounded cage sockets; as well as The device comprises multiple cylindrical segments including a pin and a spring, wherein each of the plurality of grounding cage sockets surrounds a pair of cylindrical segments, wherein the plurality of grounding cage sockets are coupled to a plurality of receiving cage sockets on a circuit board to provide a ground reference for a data signal via the pin and the spring, wherein the pin extends from or retracts into a corresponding cylindrical segment of the plurality of cylindrical segments based in part on at least one corresponding stop feature associated with a corresponding receiving cage socket of the plurality of receiving cage sockets, and wherein the corresponding stop feature is used to hold the plurality of grounding cage sockets in a predetermined position relative to the plurality of receiving cage sockets and to allow the pin to contact a signal surface contact pad on the circuit board for transmitting the data signal to the circuit board.

14. A data center, the data center comprising: A middle plate or back plate, the middle plate or back plate including a plurality of signal surface contact pads for differential signals, a plurality of ground surface contact pads, channels or lines, and a plurality of receiver cage sockets respectively associated with the plurality of ground surface contact pads, channels or lines; as well as One or more sub-boards, said one or more sub-boards being coupled to the middle plate or back plate via lead frame connectors, said lead frame connectors comprising: Multiple connectors arranged in an array; and Multiple grounding cage sockets within the plurality of connectors, the plurality of grounding cage sockets surrounding multiple cylindrical segments including pins and springs, wherein each of the plurality of grounding cage sockets surrounds a pair of cylindrical segments, wherein the plurality of grounding cage sockets are coupled to the plurality of receiving cage sockets to provide a ground reference for data signals via the pins and the springs, wherein the pins extend or retract from a corresponding cylindrical segment of the plurality of cylindrical segments at least in part based on a corresponding stop feature associated with a corresponding receiving cage socket, and wherein the corresponding stop feature is used to hold the plurality of grounding cage sockets in a predetermined position relative to the plurality of receiving cage sockets and to allow the pins to contact the signal surface contact pads for transmitting the data signals between the one or more daughterboards and the middle board or the backplane.

15. A receiving connector comprising a receiving cage socket and a stop feature associated with the receiving cage socket fixed to a circuit board, wherein, The stop feature holds the grounded cage socket of the applied connector in a predetermined position relative to the receiving cage socket and allows the pins of the applied connector to contact the signal surface contact pads on the circuit board for transmitting data signals to the circuit board, wherein the receiving cage socket is coupled to the grounded cage socket of the applied connector for providing a ground reference between the receiving connector and the applied connector.

16. A method for implementing signal transmission in a connector, the method comprising: Lead segments are formed according to the layout of the connector; Form a cylindrical segment associated with the lead segment; The needle and spring are connected within the cylindrical section; A grounding cage socket is formed at least around the cylindrical section of the connector, the grounding cage socket being coupled to a receiving cage socket and used to provide a grounding reference; The pin is allowed to extend from or retract into the cylindrical section, partially based on engagement with the spring and a stop feature associated with the receiving cage socket, the stop feature serving to hold the grounding cage socket in a predetermined position relative to the receiving cage socket; and The connector is permitted for signal transmission between at least two circuit boards or components of the circuit boards, wherein the pins are used to contact surface contact pads on at least one of the circuit boards to transmit signals between the circuit boards and through the connector.

17. The method of claim 16, further comprising: The grounding cage socket is formed for assembly on the receiving cage socket; as well as The stop feature is formed as part of the external insulation surrounding the receiving cage socket or the receiving connector, or as part of the internal insulation within the receiving cage socket and the receiving connector.

18. The method of claim 16, further comprising: Determine the contact application, which includes a predetermined pressure or contact resistance between the pin and the contact pad on the signal surface; as well as The contact application, in part, allows for the contact between the pin and the signal surface contact pad.

19. The method of claim 16, further comprising: The connector is allowed to be part of the daughterboard; The receiving cage socket may be part of the back panel or middle panel; as well as The receiving cage socket is soldered or fixed to the grounding surface contact pads, channels or lines on the back plate or middle plate, and wherein signal surface contact pads are present within the perimeter formed by the grounding surface contact pads, channels or lines.

20. The method of claim 16, further comprising: Using the connector, differential signal connection to the ground reference is permitted, wherein the data signal of the pin is one of a set of differential signals, and wherein the pin is one of a set of differential signal pins supported by the ground reference from the ground cage socket.

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