Flexible features for circuit board connectors

Abstract

The present disclosure relates to flexible features for circuit board connectors. The systems and methods disclosed herein are for a protected connector with a male pin and a flexible mechanical trigger. The flexible mechanical trigger can include a fixed segment and a flexible segment that surrounds the fixed segment. The flexible segment can protect the pin. The flexible mechanical trigger can align and couple with a receiving element of a circuit board. The flexible segment can move relative to the fixed segment, at least enabling movement by the receiving element. This movement can expose the pin and allow the pin to couple with a protected receiving connector having a receiving element and a surface contact pad on the circuit board.

Description

[0001] Cross-references to related applications This application claims priority to U.S. Provisional Patent Application 63 / 791,249, U.S. Provisional Patent Application 63 / 774,580, and U.S. Patent Application 19 / 378,993. The entire contents of these three applications are incorporated herein by reference and form part of this specification for all purposes. Technical Field

[0002] This article relates in at least one aspect to circuit board connectors in general, and more specifically to flexible features used within circuit board connectors. Background Technology

[0003] The contact pins in a circuit board connector can provide a temporary or permanent electrical connection between two surfaces, thus providing reliable contact during repeated mating cycles. Attached Figure Description

[0004] Various embodiments according to this disclosure will now be described with reference to the accompanying drawings.

[0005] Figure 1A The illustration shows the external features of a protected connector according to an example.

[0006] Figure 1B The illustration shows a cross-sectional detail of a protected connector with a flexible mechanical trigger, according to an example, which has a fixed section and an extended flexible section.

[0007] Figure 1C The illustration shows a cross-sectional detail of a protected connector with a flexible mechanical trigger, which has a fixed section and a... Figure 1B The retracted flexible segment.

[0008] Figure 1D The illustration shows yet another example of a protected connector, which has an established ground reference and an established signal connection.

[0009] Figure 1E The illustration shows the external features of a protected connector according to an example, which has an extended flexible segment.

[0010] Figure 1F The illustration shows a protected receiver connector in an example.

[0011] Figure 1G The illustration shows a perspective view of a protected connector having a first circuit board that will be coupled to a protected receiving connector on a second circuit board.

[0012] Figure 1AAA conventional view and a cross-sectional view of a grounded cage socket for a lead frame connector, according to at least some embodiments, are shown, the grounded cage socket being designed to couple with a receiving cage socket.

[0013] Figure 1BB A conventional view and a cross-sectional view of a grounding cage socket for a lead frame connector according to at least some embodiments are shown, the grounding cage socket being coupled to a receiving cage socket via an internal coupling.

[0014] Figure 1CC A conventional view and a cross-sectional view of a grounding cage socket for a lead frame connector according to at least some embodiments are shown, the grounding cage socket being coupled to a receiving cage socket via an external coupling.

[0015] Figure 1DD Different lead frame connectors having lead segments and barrel segments are shown according to at least some embodiments.

[0016] Figure 1EE A cross-sectional view of a lead frame connector having lead segments and a barrel segment according to at least some embodiments is shown.

[0017] Figure 1FF Process details of a cylindrical section having a needle and a spring, according to at least some embodiments, are shown.

[0018] Figure 1GG It is a perspective view of an angled feature according to at least some embodiments, which allows the cylindrical sections of the connector, which are part of the lead frame connector, to be separated at a 90-degree angle.

[0019] Figure 1HH It is a side view of an angled feature according to at least some embodiments, which allows the cylindrical segments of the connector, which are part of the lead frame connector, to maintain a 90-degree angle of separation.

[0020] Figure 1II This is a partial view of a connector according to at least some embodiments, the connector having retractable pins within its cylindrical section.

[0021] Figure 1JJ A partial cross-sectional view of a connector according to at least some embodiments is shown, the connector having a retractable pin and a compression spring within its cylindrical section.

[0022] Figure 2A A connection is shown between two circuit boards and used for differential signal transmission via a lead frame connector, according to at least some embodiments.

[0023] Figure 2B The connection between the sub-plate and the back plate or middle plate is shown according to at least some embodiments.

[0024] Figure 2C An exploded view of a right-angle connector according to at least some embodiments is shown. The connector may include an insulated conductor and may be located between a daughterboard and a backplate or middleboard.

[0025] Figure 2D The illustration shows a perspective view of a right-angle connector according to at least some embodiments, which may include an insulated conductor and may be located between a daughterboard and a backplate or middleboard.

[0026] Figure 2E The illustration shows a representative cross-sectional view of a right-angle connector according to at least some embodiments, which may include an insulated conductor and may be located between a daughterboard and a backplate or middleboard.

[0027] Figure 2F The illustration shows various aspects of the grounding reference in a transparent view of a right-angle connector according to at least some embodiments.

[0028] Figure 2G The illustrations depict various aspects of a receiving connector supported by a spring retaining device according to at least some embodiments.

[0029] Figure 2H Further aspects of a receiving connector supported by a spring retaining device according to at least some embodiments are illustrated.

[0030] Figure 2I The illustration shows various aspects of the receiving connector according to at least some embodiments before it is supported by a spring retaining device.

[0031] Figure 3A The illustration depicts a process or method for protecting a connector according to at least some embodiments.

[0032] Figure 3AA A process or method for a connector having a lead segment and a barrel segment is shown according to at least some embodiments.

[0033] Figure 3BB A process or method for a connector having a grounded cage socket is shown according to at least some embodiments.

[0034] Figure 4 The application is shown. Figure 1A-3BB and Figure 5-7 An example data center for at least one embodiment of power connection.

[0035] Figure 5 The application is shown in Figures 1-4 and Figure 6A-7 Various aspects of an example rack in at least one embodiment.

[0036] Figure 6A An example data center system according to at least one embodiment is shown.

[0037] Figure 6B This is a schematic diagram illustrating a computing system (which may be a data center or a high-performance computing (HPC) cluster) in which at least one embodiment described herein can be used.

[0038] Figure 6C A computer system according to at least one example is shown, in which at least one embodiment described herein can be used.

[0039] Figure 7 An example network configuration is shown that can be used to implement various aspects of the embodiments, such as providing, generating, modifying, encoding, processing, fusing and / or transmitting generated image data, calculated measurements or other such content. Detailed Implementation

[0040] The following description will illustrate various embodiments. For ease of explanation, specific configurations and details are listed herein to enable the reader to thoroughly understand these embodiments. However, those skilled in the art will also understand that these embodiments can be implemented even without considering these specific details. Furthermore, to avoid obscuring the described embodiments, some well-known features may be omitted or simplified.

[0041] A leadframe connector can be a bridging connector used between circuit boards (also referred to herein as printed circuit boards (PCBs)). A PCB can be a daughterboard (or card) and backplane or middleboard of a rack in a data center. In one example, each leadframe connector may include multiple connectors that can form one or more protected connectors within the leadframe connector. Pairs of these multiple connectors can be used for differential signal transmission and in some examples may represent a single protected connector; in others, the connector may be used for power supply. Each of the multiple connectors can be coupled to a corresponding receiver connector via a protected connector. The protected connector may include a grounded cage socket surrounding a lead segment and a lead housing segment. When more than one lead is available, such as a lead pair for differential signal transmission, the grounded cage socket may surround this pair of leads. The housing segment may be formed from or associated with the lead segment and contains pins and springs internally. The grounded cage socket is coupled to the receiver cage socket of the receiver connector. The receiving cage socket includes one or more stop features for securing the grounding cage socket and the cylinder section in a predetermined position, such that the spring-supported pins of each of the plurality of connectors can apply a predetermined connection pressure or have a predetermined connection resistance, thereby sending a signal to the surface contact pads of the back plate or middle plate.

[0042] In some examples, the protected connector may include a flexible mechanical trigger that surrounds a grounded cage receptacle array and its associated leads. The flexible mechanical trigger may be a shield comprising a fixed segment surrounding the grounded cage receptacle and a flexible segment surrounding the fixed segment. The flexible mechanical trigger protects the grounded cage receptacle and the leads. The flexible mechanical trigger may be coupled to a receiving element on a circuit board to provide a ground reference. Based at least in part on this coupling, and at least through the receiving element, the flexible segment may be movable relative to the fixed segment. This movement may expose the grounded cage receptacle and the leads, and couple the grounded cage receptacle and the leads to a protected receiving connector fixed to the circuit board and surface contact pads on the circuit board.

[0043] In some examples, a flexible mechanical trigger can provide a ground reference for differential signal transmission, which is provided via at least one lead. The ground reference can be implemented via ground surface contact pads, channels, or lines on the backplane or middleplane, which may be located around the periphery of signal-dependent surface contact pads (different from ground surface contact pads). Protected connectors allow coupling from the daughterboard to the backplane or middleplane of the data center.

[0044] In some examples, the protected receiver connector on the circuit board may also include a shield forming a receiver element. The receiver element may include or surround a receiver cage receptacle and a stop feature. The receiver element may be fixed to a circuit board containing surface contact pads. The stop feature of the protected receiver connector allows movement of the applied connector with a flexible mechanical trigger. This movement allows the flexible segment of the flexible mechanical trigger to move relative to the fixed segment, thereby exposing the grounded cage receptacle and coupling the grounded cage receptacle to the receiver element. This movement also allows at least one lead for coupling to at least one surface contact pad in the surface contact pads of the circuit board.

[0045] In some examples, the stop feature of the protected receiver connector can complement or replace one or more stop features of the receiver cage receptacle for securing the grounding cage receptacle and the housing section in a predetermined position. For example, the stop feature of the protected receiver connector may allow a flexible mechanical trigger to be mounted on the receiver element, but restricts the movement of the flexible section to a predetermined distance. This predetermined distance may limit the contact force or contact pressure associated with one or more of the grounding cage receptacle or at least one lead.

[0046] The problem addressed is that connectors with grounding cage sockets and pins may have their grounding cage sockets and pins exposed before use, making them vulnerable and susceptible to damage. Furthermore, misalignment may occur when this connector is coupled to a receiving connector. At least when connecting such connectors, significant insertion or compression forces may exist. Potential issues include the need to convert the ground reference to a straight-through ground pin, the requirement for additional hardware to support the ground pin connection, and problems related to pin bending due to misalignment and stress during component connection. Additionally, improper separation of the grounding and signal interfaces can affect high-speed signal performance and may interfere with signal performance.

[0047] The solution employed here is a flexible mechanical trigger that is movable relative to the connector body it interfaces with. This allows the flexible mechanical trigger to protrude or extend further than the connector pin in a flat, stationary, or disconnected connection position or state, thus protecting the pin. When the protected connector presses against the receiving connector (e.g., the protected receiving connector), the flexible mechanical trigger engages first in the mating sequence for alignment. The flexible mechanical trigger can extend beyond the pin in a flat, stationary, or disconnected connection position or state to mask or protect the pin, and also retracts when mating with the protected receiving connector to form the appropriate interface. This approach ensures that the pin is only exposed during connection when the flexible mechanical trigger is fully engaged, and provides improved alignment and protection compared to a fixed shield design. A feature of the receiving connector can mate with the bottom (e.g., shoulder or surface) of the flexible mechanical trigger, causing the trigger to retract and expose the pin. In some examples, the flexible mechanical trigger can maintain the integrity of the pin.

[0048] In some examples, when the protected connector is in the disconnected position relative to the protected receiving connector, the flexible mechanical trigger protects the grounding cage receptacle because the flexible segment extends. The grounding cage receptacle provides grounding and mechanical support. The grounding cage receptacle ensures the pins are properly grounded during mating. Continuous grounding is maintained between the pins and the mating circuit board, which may be vertically aligned, thus enhancing signal integrity. When the protected connector is used with the protected receiving connector, the flexible segment of the flexible mechanical trigger can retract. This allows the overextended flexible segment of the flexible mechanical trigger to move away from the fixed segment, and is achieved through alignment and pressure on the receiving element. The flexible segment can retract to expose the grounding cage receptacle and leads, thus achieving aligned coupling. Furthermore, a stop feature prevents damage from insertion forces. The mechanical structure of the protected connector, including the grounding cage receptacle and the flexible mechanical trigger, is configured to provide both protection and alignment. This structure also ensures a reliable connection.

[0049] In some examples, because the pins of the electrical signal or power connector protrude from the male portion of the connector, this exposure makes them susceptible to bending or other damage before assembly. In some examples, the damage may be due to manipulation. In some examples, while a plastic protective cover on the connector may be used at some point before assembly, there is no guarantee that the pins or any parts manipulated at some point after or before assembly will not be susceptible to damage or breakage. If fixed parts are used for protection, these fixed parts need to be removed, and additional manipulation of the pins and other features may be required. The protected connectors described herein do not use such protective devices, but instead use flexible mechanical triggers (e.g., shields). The flexible mechanical trigger can be actuated by the corresponding protected receiver connector, causing the flexible segment to move to expose the pins of the protected connector and any grounding cage receptacle for connection with the surface contact pads and other components of the protected receiver connector. When the flexible segment retracts, the pins and grounding cage receptacle are exposed, thus forming a connection. When the flexible mechanical trigger extends, its shield covers the pins, or extends beyond the pins, to protect the pins and grounding cage receptacle (if used). In some examples, a ground reference can be provided by a flexible mechanical trigger without the need for a grounded cage socket. When the protected connector is pressed against the protected receiving connector, the flexible mechanical trigger can first engage with the receiving element via its flexible segment for alignment in a mating sequence, and then engage with one or more pins or cage sockets. In some examples, the flexible mechanical trigger is mounted on the receiving element, and a stop feature therein restricts the movement of the flexible segment to a predetermined distance.

[0050] In some examples, the flexible mechanical trigger is first assembled onto the receiving element to provide a presence signal. In some examples, after the flexible mechanical trigger is assembled onto the receiving element, one or more pins or cage sockets may provide a presence signal. This presence signal indicates whether coupling has been established, is about to be established, or is in the process of being established between the flexible mechanical trigger and the receiving element. In some examples, one or more of the flexible mechanical triggers, pins, or cage sockets may have different lengths or stopping features to allow, support, or facilitate a sequence of engagements that are partly based on the protection provided by one or more presence signals or at least one flexible mechanical trigger.

[0051] A flexible mechanical trigger can be fitted onto pins of varying lengths. The flexible mechanical trigger extends to cover the longest pin. This difference in pin length may allow a ground reference to be formed or connected first, as part of a mating sequence, and allow pins to contact after the ground reference for signal transmission. In some examples, the length difference may be 1 millimeter (mil) or 1.5 millimeters (mil). In some examples, the different lengths may also be to allow the flexible mechanical trigger to form the ground reference first, relative to the pins that may contact the signal after the ground reference. These pins can also allow a presence signal to be sent via one or more pins before the differential signal is processed using the remaining pins. Therefore, a presence signal can be sent via pins of different lengths with different signals and ground references. One or more pins used for the presence signal can form contact after or before all the remaining pins have contacted.

[0052] In addition to providing a ground reference for protected connectors and protected receiver connectors, grounded cage receptacles and receiver cage receptacles can also support or allow the establishment of a ground reference between multiple connectors and receiver connectors. Lead segments and housing segments provide differential signal transmission, while grounded cage receptacles provide a ground reference for lead-pair-specific differential signal transmission. Grounded cage receptacles allow ground connections on the daughterboard to be coupled to ground surface contact pads, channels, or wires on the backplane or middleplane. Ground surface contact pads, channels, or wires can be located around signal surface contact pads for internal pin contact, while grounded cage receptacles can provide external contact between the leadframe connector and receiver connector. In one example, using at least a channel or wire instead of a contact pad as a ground reference can improve signal integrity.

[0053] In another example, one or more stop features of the receiver cage socket may be formed on the exterior or interior of the receiver connector, and may be formed by insulating material between the pins and the receiver cage socket or by insulating material on the exterior of the receiver connector. In one example, the insulating material may have dielectric properties to prevent short circuits between pins and between the pins and the receiver cage socket or grounding cage socket. Furthermore, the insulating material also helps maintain impedance control within the lead frame connector and the receiver connector. In another example, the one or more stop features may act on one or more of the grounding cage socket or shell section to prevent the grounding cage socket and shell section from extending too far toward the back plate or middle plate, thereby preventing complete pin compression.

[0054] Leadframe connectors may include connector arrays. Each connector may include a lead segment and a shell segment. The shell segment may be formed from a portion of the lead segment. In another example, the shell segment may be fabricated separately from the lead segment and associated with the lead segment by solder. Pin and spring devices in the shell segment may allow pins to extend from or retract into the shell segment, partially based on an interface with one or more springs or one or more stop features. Each connector having such pins and springs may be a single spring pin feature of the leadframe connector. The spring pin may be a pin configured or adapted to extend from or retract into the shell segment, which maintains its power and signal communication functions. The pin may contact surface contact pads on a circuit board to transmit signals from the circuit board to the connector. Leadframe connectors may include multiple parallel-configured connectors in a parallel configuration, which may be arranged in a connector array or may take other similar forms.

[0055] Parallel-configured connectors may include at least two connectors providing differential signals. Each of the paired connectors may be located within a cage socket or other structure to support connection to a pair of surface contact pads. The connector may include a stamped lead frame segment forming a lead segment. The width of the connector end may be adjusted or preset as needed, such that the end is formed as a cylinder or tubular body, referred to herein as the connector's tubular segment. A pin may be inserted through the tubular segment and engage with a spring that is also inserted into the tubular body. The top portion of the tubular segment may be folded at the opening of the tubular body to prevent the spring from ejecting the tubular body from the top. The pin may be compressed from the bottom, and the bottom of the tubular body may be rolled inward to further prevent the pin from being ejected after the spring is compressed, simplifying the connection process. This forms the connector's tubular segment. This connector can be used with other similar connectors for surface contact pads on a backplane or middle plate.

[0056] Another problem addressed by the connectors described in this article is that copper-based signal and power interconnects (i.e., connectors) typically employ "pin-flex" interfaces, where the pins need to be anchored to the PCB. This anchoring is usually achieved through plated through-hole technology or using compression pins that mate with surface pads. Regardless of the method used, such solutions often require significant force during mating or compression. Furthermore, if compression pins are used, a special clamp is usually required to apply constant pressure to the connector to ensure that the pins remain in contact with the surface contact pads on the PCB. While a spring-loaded connector can be added between the connector and the PCB, this introduces an additional interface between the connector and the PCB. Moreover, such solutions can introduce a number of problems: for example, ground reference conversion is required for transmission via ground pins, often necessitating auxiliary hardware to support the ground pin connection; misalignment during component mating can cause pin bending; and improper isolation design between the ground and signal interfaces can adversely affect the performance of high-speed signals and even cause potential interference.

[0057] Another issue addressed in this paper is that copper-based signal and power interconnects (connectors) may contain pins with compliant interface designs intended to anchor to the PCB. This anchoring can be achieved through plated through-holes or compression pins that mate with surface contact pads. In either case, these solutions often require high insertion or compression forces. Furthermore, compression pins may require clamps to apply constant pressure to the connector to ensure the pins maintain tight contact with the PCB surface where the surface contact pads are located. While it is also possible to insert a spring-loaded connector between the connector and the PCB, these solutions often introduce an additional interface between the connector and the PCB.

[0058] Another solution is to use a grounded cage socket and / or a flexible mechanical trigger, which can be naturally extended from the connector's internal design without requiring a physical conversion via a grounding pin to obtain a ground reference. This solution not only eliminates the additional hardware of the grounding pin, thus eliminating the possibility of pin bending due to misalignment, but also supports signal integrity by properly isolating the ground reference from the data signal in the pin. Furthermore, this solution integrates spring-loaded pins as part of the leadframe connector's internal structure and employs a right-angle topology connection between two circuit boards, typically achievable only with traditional two-piece male-female connector combinations. The solution proposed in this paper also uses a leadframe connector that integrates spring-loaded pins as part of the leadframe connector's internal structure, such as lead segments and a cylindrical segment composed of portions of the lead segments. Besides right-angle topologies (which may be a possible example using two-piece male-female connectors), the leadframe connector described herein may also support through-type connectors.

[0059] At least in terms of differential signal transmission, this can refer to the use of complementary signals to communicate or transmit information through two separate connectors (forming conductors). In this leadframe, the conductors can represent separate connectors used together for differential signal transmission. At the receiving end, the difference between the complementary signals can be used to recover the information associated with the communication or transmission. The leadframe connector described herein is used for differential signal transmission with traces via a connection between pins and surface contact pads on the traces on the circuit board. The leadframe connector can be used with differential pair connectors for conductors in cables. For example, leadframe connectors can be used between cables and circuit boards, or between computing components, while cables are used between two leadframe connectors.

[0060] In one example, complementary signals can include information transmitted with opposite polarities on individual conductors or connectors of a leadframe connector. When one of the individual conductors or connectors uses a positive voltage swing, the other conductor can use a negative voltage swing of the same amplitude. This amplitude can be referenced to the common-mode voltage. Differential signal transmission via leadframe connectors offers the advantage of significantly improved noise immunity, including immunity to electromagnetic interference and crosstalk. Noise can affect individual conductors within individual conductors. Since information exists only in the differences between signals, the impact of common-mode noise on the signal is negligible. Differential signal transmission, used in conjunction with leadframe connectors, provides signal integrity and noise immunity for protocols such as High Speed ​​(HS) communication, USB (Universal Serial Bus®), HDMI (High Definition Multimedia Interface®), Ethernet®, PCI Express® (PCIe), SATA (Serial ATA), NVlink®, InfiniBand® (IB), and LVDS (Low Voltage Differential Signaling).

[0061] The systems and methods described herein can be used for a variety of purposes, including but not limited to machine control, synthetic data generation, model training or updating, perception, augmented reality, virtual reality, mixed reality, robotics, security and supervision, simulation and digital twins, autonomous or semi-autonomous machine applications, deep learning, environmental simulation, object or character simulation and / or digital twins, data center processing, conversational artificial intelligence (AI), generative AI based on large language models (LLM), optical transport simulation (e.g., ray tracing, path tracing, etc.), collaborative content creation for 3D assets, cloud computing and / or any other suitable application.

[0062] The examples disclosed herein can be included in a variety of different systems, such as: systems for performing deep learning operations, systems for performing simulation operations, systems for performing digital twin operations, systems implemented using edge devices, systems containing one or more virtual machines (VMs), systems for performing synthetic data generation operations, systems implemented at least partially in a data center, systems for performing conversational AI operations, systems for performing generative AI operations using LLM, systems for performing optical transport simulations, systems for performing collaborative content creation for 3D assets, systems implemented at least partially using cloud computing resources, and / or other types of systems.

[0063] In one example, a computing device benefiting from the leadframe connector described herein may include different types of processors. These processors may include a central processing unit (CPU), a graphics processing unit (GPU), a data processing unit (DPU), a quantum processing unit (QPU), a parallel processing unit (PPU), and an application-specific integrated circuit (ASIC). A QPU may be configured to perform one or more operations associated with a quantum algorithm. In some examples, each of one or more QPUs may include a qubit. One or more QPUs may communicate with each other via a quantum channel. In some examples, each qubit may include local qubits, global qubits, and / or synchronization qubits. In some examples, the local qubits of each QPU may be configured to perform one or more operations associated with a quantum algorithm on that QPU associated with the local qubits.

[0064] Figure 1A The illustration shows the external feature 100A of a protected connector according to an example. Figure 1A The diagram shows a protected connector 101A in a connected position relative to a protected receiving connector 101J. In some examples, the protected connector 101A may also include an access feature 141 in the fixed segment 101G of a flexible mechanical trigger 101H. The access feature 141 may allow the fixed segment 101G to be fitted to a connector having a grounded cage socket 101B and at least one lead 101C (e.g., Figure 1AA On connector 104). The fixed segment 101G may include the associated flexible segment 101F, or may include the flexible segment 101F added after installation. As at least combined Figure 1B and Figure 1C As supported and described in the cross-sectional diagram, access feature 141 allows the grounded cage socket 101B to pass through it.

[0065] In some examples, the protected connector 101A may comprise one or more of a copper alloy or gold-plated, nickel-plated, or stainless steel to form one or more of the fixed segment 101G or the flexible segment 101F. This allows the flexible mechanical trigger 101H to provide a ground reference, which may be provided independently of or in conjunction with the grounding cage receptacle 101B. In some examples, the protected connector 101A may also include allowances in the fixed segment 101G to support the angled feature 143. The angled feature 143 allows a 90-degree angle separation between the flexible mechanical trigger 101H and the other connection side 145 of the protected connector 101A. Further description of the angled feature can be found in conjunction with... Figure 1DD and Figure 1GG To explain, Figure 1DD and Figure 1GG It has been incorporated into this article by reference.

[0066] Figure 1B The illustration shows a cross-sectional detail 100B of a protected connector according to an example, which has a flexible mechanical trigger having a fixed segment and an extended flexible segment (e.g., fully mating). As shown, the protected connector may be associated with a receiving connector at a retractable housing base plate 101K of the flexible mechanical trigger 101H. In some examples, the retractable housing base plate 101K may contact a shoulder or surface of the receiving element 101I to retract the flexible segment. The protected connector 101A may include a grounding cage receptacle 101B surrounding at least one lead 101C. In some examples, the lead 101C may include a barrel segment 108 and a lead segment 106. The barrel segment 108 and the lead segment 106 may together form a connector 104. The lead 101C may include a pin 101D. In some examples, the grounding cage receptacle 101B may retract from the pin 101D and, as shown, does not cover the pin. From one side formed by at least two leads 101C, a lead pair 101E (visible from the top view shown in the annotation, and hidden behind the cross-sectional detail 100A) may exist for differential signal transmission. The protected connector 101A may include a flexible mechanical trigger 101H. The flexible mechanical trigger 101H may include a fixed segment 101G surrounding the grounded cage receptacle 101B. The flexible mechanical trigger 101H may include a flexible segment 101F surrounding the fixed segment 101G. The flexible segment 101F protects the grounded cage receptacle 101B and at least one lead 101C.

[0067] Figure 1B The diagram also illustrates a flexible mechanical trigger 101H that can be aligned and coupled to a receiving element 101I on a circuit board 109 (typically indicated as a coupling element 105) (e.g. Figure 1C (As shown). In some examples, circuit board 109 may be a middle plate or back plate 202. Flexible segment 101F may be movable relative to fixed segment 101G, and this can be achieved at least by receiving element 101I. This movement exposes grounding cage socket 101B and at least one lead 101C, which are coupled to a protected receiving connector 101J having receiving element 101I. In addition to grounding cage socket 101B, at least one lead 101C may also be coupled to at least one of the different surface contact pads 220 on circuit board 109. In some examples, grounding cage socket 101B may contact at least the ground surface contact pad among the different surface contact pads 220, while at least one lead 101C may contact the signal surface contact pad among the different surface contact pads 220.

[0068] Figure 1BThe diagram also illustrates a flexible mechanical trigger 101H that can be coupled to a receiving element 101I to provide a ground reference for a protected connector 101A. For example, a protected receiving connector 101J can be soldered or electrically coupled to one or more ground surface contact pads 220 of different surface contact pads 220. The protected receiving connector 101J can be a metal housing or shield. The protected connector 101A can also be a metal housing or shield. Once coupled, the protected receiving connector 101J and the protected connector 101A can provide a ground reference for one or more leads 137 associated with at least one lead 101C (e.g., ...). Figure 1C The circuit board on the other side (as shown) provides a ground reference. The protected connector 101A may include rigid insulation 150 forming part of the protected connector 101A for shielding or isolating conductor 137. The ground reference may be relative to the circuit board 109 constituting or partially constituting the middle or backplane 202 (e.g., as shown). Figure 1AA As shown). Figure 1B As shown, when the protected connector 101A is in the disconnected position relative to the protected receiving connector 101J, the protected connector 101A can extend its flexible segment 101F by 105A.

[0069] Figure 1C The diagram illustrates the relationship between... Figure 1B The protected connector has a cross-sectional detail 100C, which includes a flexible mechanical trigger having a fixed section and a retractable (before mating) flexible section. As shown, when the protected connector 101A is in the mating position relative to the protected receiving connector 101J, the flexible section 101F of the protected connector 101A can retract. The flexible section 101F can be positioned above the guide 101L of the fixed section 101G. A retaining element (e.g., at least for mating) may be provided. Figure 2A The retaining element described herein is used to hold the protected connector 101A in the connected position relative to the protected receiving connector 101J. Figure 2B The diagram also illustrates that the protected connector 101A may be associated with or include the stop feature 131. The stop feature 131 may be one or more portions of the flexible segment 101F or the fixed segment 101G. Figure 2B In this embodiment, the stop feature may be the end of a post on the flexible segment 101F (as shown in the figure) for contacting a shoulder or surface on the fixed segment 101G. In some examples, the receiving element 101I of the protected receiving connector 101J may be used to align, couple, and trigger the flexible mechanical trigger 101H. In some examples, the flexible mechanical trigger 101H is fitted onto the receiving element 101I and moves until the stop feature 131 restricts the movement of the flexible segment 101F within a predetermined distance.

[0070] In some examples, the predetermined distance can be from Figure 1B and Figure 1C As can be clearly seen, and can be based in part on the length of pin 101D. In some examples, for the surface contact pad 220 used to allow proper connection, a predetermined distance can limit the contact force or contact pressure associated with the grounding cage socket 101B or at least one or more leads 101C without damaging the leads 101C or applying excessive force or pressure to them. In some examples, proper connection may be based in part on a predetermined impedance or a differential impedance anticipated in a connection consisting of at least one pair of leads 10, and may include a ground reference via the grounding cage socket 101B or one or more flexible mechanical triggers 101H.

[0071] Figure 1C It is also shown that the grounding cage socket 101B can be coupled to the receiver cage socket 103 of the protected receiver connector 101J. In some examples, the protected connector 101A and the protected receiver connector 101J can be lead frame connectors 102A, 102B and receiver connector 210, such as Figure 2A As shown. In some embodiments, the protected connector 101A may further include a biasing element 133. The biasing element 133 may be located between the flexible segment 101F and the fixed segment 101G, as shown. Figure 1B and Figure 1C As shown. The biasing element 133 can bias the flexible segment 101F, causing it to extend outwards at 105A. When extended at 105A, the flexible segment 101F provides protection for the grounding cage socket 101B and at least one lead 101C, ensuring that at least two sides of the grounding cage socket 101B and at least one lead 101C are not exposed. Figure 1B As shown, this protection can be provided in the protected connector 101A when the protected connector 101A is in the disconnected position relative to the protected receiving connector 101J. This protection can prevent damage to either the grounding cage socket 101B or at least one lead 101C before coupling, installing, or assembling one or more protected connectors 101A or a circuit board (e.g., a daughterboard) having protected connectors 101A.

[0072] The protected connector 101A can be located on the daughterboard 204, for example Figure 2A , Figure 2B As shown. The protected receiver connector 101J can be located on the backplane or middle plate 202, or as... Figure 2A , Figure 2BAs shown. The protected connector 101A may include a receiving element 101I, which is soldered or fixed as a feature to one or more ground surface contact pads among the different surface contact pads 220 shown. In some examples, the ground surface contact pad may include or be a channel or line on the backplane or middle plate 202. One or more of the ground surface contact pads, channels, or lines may be located on the periphery of the lead surface contact pads relative to the different surface contact pads 220.

[0073] In some examples, the protected connector 101A may be a portion of the differential signal connection provided by lead pair 101E, with a ground reference provided by flexible mechanical trigger 101H. In some examples, at least one lead 101C in lead pair 101E may include one of a set of differential signal pins 101D and may be supported by a ground reference provided by one or more of ground cage socket 101B or flexible mechanical trigger 101H.

[0074] In some examples, the protected connector 101A may include an array of grounded cage sockets 101B and leads 101C forming lead frame connectors 102A, 102B, such as Figure 1DD , Figure 2A and Figure 2B As shown in one or more figures. Leadframe connectors 102A, 102B may be located between the circuit board 109 forming the middle or backplane 202 and another circuit board or computing component (e.g., a component on a daughterboard), as shown in... Figure 1DD , Figure 2A and Figure 2B One or more figures are shown.

[0075] In some examples, the protected connector 101A includes a shoulder or surface 135 within the flexible segment 101F at its retractable housing base plate 101K. The shoulder or surface 135 is used to contact the receiving element 101I. This contact can support or allow the flexible segment 101F to move relative to the fixed segment 101G, thereby bringing the flexible segment 101F to a retracted state 105B or an extended state 105A. Furthermore, although the protected connector 101A is shown on one side of the trace or conductor 137, it is clear that the other side of the conductor 137 can also contain and benefit from the protected connector 101A. In some examples, the protected connector 101A may include rigid insulation 139, which is located at least between the flexible mechanical trigger 101H and at least one lead 101C, to maintain a signal or power supply different from a ground reference.

[0076] Figure 1DAnother example 100D of the protected connector is illustrated, wherein the protected connector has an established ground reference and an established signal connection. The signal connection is considered to be established when the protected connector 101A is in the connected position relative to the protected receiving connector 101J. Figure 1D The illustration shows that a gap 151 may exist between the protected connector 101A and the protected receiving connector 101J, but this is only exemplary and gap 151 may not exist in some examples. Alternatively, the connection between the protected connector 101A and the protected receiving connector 101J can be a tight connection. (As at least combined) Figure 1A The angled feature 143 allows for a 90-degree angle separation between the flexible mechanical trigger 101H and the other connection side 145 of the protected connector 101A. Further description of the angled feature can be found in conjunction with... Figure 1DD and Figure 1GG The descriptions provided are incorporated herein by reference.

[0077] Figure 1E An external feature 100E of a protected connector extending from a flexible segment according to an example is shown. External feature 100E includes a protected connector 101A coupled to a sub-board 204 located on another connection side 145, and is ready to connect to a middle plate or back plate 202 having a protected receiving connector 101J. (As in combination) Figure 1A and Figure 1B As detailed, the protected connector 101A may include a grounded cage receptacle 101B surrounding at least one lead 101C. The protected connector 101A may also include a flexible mechanical trigger 101H. The flexible mechanical trigger 101H may include a fixed segment 101G surrounding the grounded cage receptacle 101B. A flexible segment 101F may surround the fixed segment 101G and protect the grounded cage receptacle 101B and at least one lead 101C. The flexible mechanical trigger 101H may be aligned and coupled to a receiving element 101I on a circuit board (e.g., a middle plate or back plate 202). The flexible segment 101F is shown protruding relative to the fixed segment 101G, but is movable at least by the receiving element 101I. This movement exposes the grounded cage receptacle and at least one lead, allowing the grounded cage receptacle and at least one lead to be coupled to a protected receiving connector 101J with the receiving element 101I and surface contact pads on the middle plate or back plate 20.

[0078] Figure 1F The illustration shows a protected receiver connector 100F in an example. (Combined) Figure 1A and 1AAAs shown in the details, the protected receiver connector 101J may include a receiver element 101I, a receiver cage receptacle 103, and a stop feature (e.g., a shoulder or surface 135). The receiver element 101I may be attached to a circuit board, such as a middle plate or back plate 202. The middle plate or back plate 202 may include surface contact pads 220 (e.g., ...). Figure 1A and Figure 1AA (As shown). The stop feature allows movement of the applied protected connector 101A, which has a grounded cage receptacle 101B surrounding at least one lead 101C. The protected connector 101A may include a flexible mechanical trigger 101H. A receiving element 101I may allow alignment of the flexible mechanical trigger 101H. The flexible mechanical trigger 101H may include a fixed segment 101G surrounding the grounded cage receptacle 101B and a flexible segment 101F surrounding the fixed segment 101G. The movement may be relative to the fixed segment 101G towards the flexible segment 101F. This movement exposes the grounded cage receptacle 101B and allows it to be coupled to the receiving cage receptacle 103, and couples at least one lead 101C to at least one surface contact pad 220 on the circuit board. Furthermore, although in Figure 1A , Figure 1B The image is shown as a column, but the receiving element 101I may be a continuous feature surrounding the protected receiving connector 101J.

[0079] Figure 1G The illustration shows a perspective view 100G of a protected connector, where a first circuit board is coupled to a protected receiving connector located on a second circuit board. The first circuit board can be a middle board or a back board 202. The second circuit board can be a daughter board 204. (As shown in the diagram...) Figure 1A and Figure 1AA As shown in the details, the protected receiver connector 101J may include a receiver element 101I, a receiver cage receptacle 103, and a stop feature, such as a shoulder or surface 135 (e.g., Figure 1F (As shown). In some examples, the receiving cage socket 103 can be metallic or non-metallic. When the receiving cage socket 103 is metallic, it can establish a ground reference between the protected connector 101A and the protected receiving connector 101J, and transmit differential signals via a pair of leads 101E.

[0080] like Figure 1A -F and Figure 1AA As shown in one or more figures, the receiving element 101I may be fixed to the middle plate or back plate 202. The middle plate or back plate 202 may include surface contact pads 220 (e.g., ...). Figure 1A and Figure 1AA(As shown). The stop feature allows movement of an applied protected connector 101A having a grounded cage receptacle 101B surrounding at least one lead 101C. The protected connector 101A may include a flexible mechanical trigger 101H. A receiving element 101I may allow alignment of the flexible mechanical trigger 101H. The flexible mechanical trigger 101H may include a fixed segment 101G surrounding the grounded cage receptacle 101B and a flexible segment 101F surrounding the fixed segment 101G. The movement may be relative to the fixed segment 101G towards the flexible segment 101F. This movement may expose the grounded cage receptacle 101B and couple it to the receiving cage receptacle 103, and allow at least one lead 101C to be coupled to at least one surface contact pad 220 of the circuit board. Furthermore, although in Figure 1A and Figure 1B It is shown in columnar form, but the receiving element 101I can also be a continuous feature surrounding the protected receiving connector 101J.

[0081] In some examples, the middle or backplane 202 can be part of the data center, for example, combined with Figure 2A , Figure 2B , Figure 3A , Figure 4 , Figure 5 and Figure 6AOne or more data centers as shown in the figures. A data center may include a middle plate or back plate 202 having a plurality of receiver cage receptacles 103, a plurality of lead surface contact pads for differential signals (from surface contact pads 220), and one or more ground surface contact pads (also from surface contact pads 220, but alternatively may include channels or lines). A data center may include at least one receiver element 101I associated with one or more of the ground surface contact pads, channels, or lines. When conductor 137 is part of a leadframe connector, the data center may include one or more daughter boards 204 coupled to the middle plate or back plate 202 via the leadframe connector. The leadframe connector may include a plurality of ground cage receptacles 101B surrounding a plurality of leads 101C. The leadframe connector may include a flexible mechanical trigger 101H. The flexible mechanical trigger 101H may include a fixed segment 101G surrounding the ground cage receptacles 101B and may include a flexible segment 101F surrounding the fixed segment 101G. A flexible mechanical trigger 101H protects the grounding cage socket 101B and lead 101C. The flexible mechanical trigger 101H can be aligned and coupled to at least one receiving element 101I of the middle plate or back plate 202 to provide a ground reference via one or more grounding surface contact pads, channels, or lines. A flexible segment 101F can be moved relative to a fixed segment 101G by at least one receiving element 101I. This movement exposes and allows the grounding cage socket 101B and lead 101C to be coupled to the receiving cage socket 103 and lead surface contact pads of the middle plate or back plate 202.

[0082] Figure 1AA The illustration shows a conventional view and a cross-sectional view 100AA of a grounding cage socket of a leadframe connector according to at least some embodiments, the leadframe connector being coupled to a receiving cage socket. As at least in combination Figure 1HH Further details: The lead frame connector may include multiple individual connectors 104. Each connector 104 may include a lead segment 106 and a shell segment 108. The shell segment 108 may be formed from a portion of the lead segment 106 (e.g., as combined). Figure 1FF (As illustrated and described). In another example, the barrel segment 108 may be fabricated separately from the lead segment 106 and may be associated with the lead segment 106 by solder. The barrel segment 108 may include a pin 110 and a spring 112, for example, as combined Figure 1DD-1JJFurther illustration and description. Each connector 104 may include at least a grounded cage socket 101B surrounding a housing section 108. Pins 110 and springs 112 of the housing section 108 may be used to transmit data signals. Additionally, the grounded cage socket 101B may be used to couple 105 to a receiving cage socket 103 of a circuit board, which may be a middle board or backplane 202 in a data center. The grounded cage socket 101B, through coupling 105, can provide a ground reference for data signals.

[0083] In one example, the needle 110 may extend from or retract into the cylindrical section in part based on at least one stop feature associated with the receiving cage socket 103, the stop feature being at least combined with Figure 1BB and Figure 1CC More detailed instructions are available. This stop feature can also secure the grounding cage socket 101B in a predetermined position (e.g., in...). Figure 1BB , Figure 1CC (Description and illustrations are provided). The predetermined position can be relative to the receiver cage socket 103. The predetermined position allows the pin 110 to contact the signal surface contact pad 220 on the circuit board to transmit data signals to the circuit board. The signal surface contact pad 220 may be different from the ground surface contact pad 107, which is coupled to the receiver cage socket 103 and, through the receiver cage socket 103, to the ground cage socket 101B. As shown, the signal surface contact pad 220 may be located within or inside the perimeter formed by the ground surface contact pad 107. Furthermore, as further combined... Figure 1BB , Figure 1CC As detailed in one or more figures, the ground surface contact pad 107 may be in the form of a channel or line 119 surrounding the signal surface contact pad 220.

[0084] Figure 1BBThe illustration shows a conventional view and a cross-sectional view 100BB of a grounded cage receptacle for a leadframe connector, having an internal coupling with a receiving cage receptacle, according to at least some embodiments. In one example, the grounded cage receptacle 101B is fitted inside the receiving cage receptacle 103 of the receiving connector 210. This may represent an interface 111 of internal ground coupling between the connector 104 and the receiving connector. The contact between the grounded cage receptacle 101B and the receiving cage receptacle 103 allows a ground reference to be connected to a ground surface contact pad 107 on the circuit board. In one example, one or more stop features may be present associated with the receiving cage receptacle 103. For example, the first stop feature 113 may be part of the internal insulation 123 within the receiving cage receptacle 103. In another example, the first stop feature 113 may be part of the receiving cage receptacle 103 itself and may allow a ground reference to the ground surface contact pad 107 on the circuit board via the first stop feature 113. The first stop feature 113 can act on the grounding cage socket 101B to prevent further movement between the grounding cage socket 101B and the receiving cage socket 103, while ensuring that the grounding cage socket 101B is in a predetermined position 117, so that the pins 110 in the grounding cage socket 101B can contact the signal surface contact pads 220 on the circuit board to transmit data signals to the circuit board.

[0085] The second stop feature 115 may be part of the internal insulation 123 within the receiving cage receptacle 103. The internal insulation 123 may also insulate between the plurality of pins and the plurality of barrel segments within the connector 104. The internal insulation 123 may also insulate between the plurality of pins, the plurality of barrel segments, and the grounding cage receptacle. The second stop feature 115 may have allowances (e.g., orifices or holes) for the pin 110 to pass through, but may restrict the barrel segment 108 of the connector 104. The second stop feature 115 may act on the barrel segment 108 of the connector 104 to prevent further movement of the barrel segment 108 relative to the receiving cage receptacle 103. The pin 110 may be allowed to extend from the barrel segment 108, through the allowances in the second stop feature 115 to contact the signal surface contact pad 220 on the circuit board for transmitting data signals to the circuit board. The position of the second stop feature 115 can ensure that one or more grounding cage sockets 101B or cylindrical sections 108 are in a predetermined position 117, so that the pins 110 of the grounding cage socket 101B can contact the signal surface contact pads 220 on the circuit board, thereby transmitting data signals to the circuit board.

[0086] In one example, the predetermined position 117 may coincide with the position of the first stop feature 113 and the second stop feature 115. In another example, the predetermined position 117 may differ from one or more of the first stop feature 113 or the second stop feature 115, but may allow the contact between the pin 110 and the signal surface contact pad 220 to be in a predetermined contact application. In one example, the predetermined contact application may include one or more predetermined pressures or contact resistances between the pin 110 and the signal surface contact pad 220. The predetermined contact application ensures sufficient contact to support or allow high-speed signal performance of the data signals transmitted through it without potential interference or damage to the spring 112 or pin 110 of the circuit board or connector 104.

[0087] Figure 1CC The illustration shows a conventional view and a cross-sectional view 100CC of a grounded cage socket for a lead frame connector, having an external coupling to a receiving cage socket, according to at least some embodiments. As shown, with... Figure 1BB The difference is that the grounding cage socket 101B can be mounted on the receiving cage socket 103 of the receiving connector 210. This can represent an interface 121 for external ground coupling between the connector 104 and the receiving connector 210. In one example, one or more stop features may be present associated with the receiving cage socket 103. The first stop feature 113 may be part of the external insulation surrounding the receiving cage socket 103 of the receiving connector 210. In another example, the first stop feature 113 may be detached from and associated with the receiving cage socket 103. The contact between the grounding cage socket 101B and the receiving cage socket 103 may allow access to the ground reference of the contact pad 107 on the ground surface of the circuit board. The first stop feature 113 can act on the grounding cage socket 101B to prevent further movement between the grounding cage socket 101B and the receiving cage socket 103, while ensuring that the grounding cage socket 101B is in a predetermined position 117, so that the pins 110 of the grounding cage socket 101B can contact the signal surface contact pads 220 on the circuit board in order to transmit data signals to the circuit board.

[0088] The second stop feature 115 may be part of the internal insulation 123 inside the receiving cage socket 103. The internal insulation 123 may also insulate multiple pins and multiple barrel segments within the connector 104. The internal insulation 123 may also insulate multiple pins, multiple barrel segments, and the grounding cage socket. The second stop feature 115 may allow pins 110 to pass through, but may restrict the barrel segment 108 of the connector 104, such as... Figure 1BBThe conventional view and sectional view 100BB are shown. The second stop feature 115 can act on the shell section 108 of the connector 104 to prevent the shell section 108 from moving further relative to the receiving cage socket 103.

[0089] like Figure 1CC As indicated by reference numeral 125, pin 110 extends from the barrel section 108, passes through allowances 127 having dielectric material 129 and providing internal insulation 123 for a second stop feature 115, and contacts signal surface contact pad 220 on the circuit board. The dielectric material 129 has dielectric properties that, in one example, prevent short circuits between pins 110; in other examples, it prevents short circuits between pins 110 and the receiver cage socket 103 or the ground cage socket 101B. This dielectric property also allows impedance control to be maintained within the lead frame connector and the receiver connector. In one example, similar internal insulation 123 may be provided in the lead segments of the lead frame connector to prevent short circuits between lead segments and to allow impedance control to be maintained at the lead segments within the lead frame connector. The contact between pin 110 and signal surface contact pad 220 allows data signals to be transmitted to the circuit board. The position of the second stop feature 115 can ensure that one or more grounding cage sockets 101B or cylindrical sections 108 are in a predetermined position 117 so that the pins 110 of the grounding cage socket 101B can contact the signal surface contact pads 220 on the circuit board, thereby transmitting data signals to the circuit board.

[0090] In one example, the predetermined position 117 may coincide with the first stop feature 113 and the second stop feature 115. In another example, the predetermined position 117 may differ from one or more of the first stop feature 113 or the second stop feature 115, but may allow the contact between the pin 110 and the signal surface contact pad 220 to be in a predetermined contact application. In one example, the predetermined contact application may include one or more of a predetermined pressure or contact resistance between the pin 110 and the signal surface contact pad 220. The predetermined contact application ensures sufficient contact to support or allow high-speed data signal performance of the data signal passing through it without potential interference, damage to the circuit board, or damage to the spring 112 or pin 110 of the connector 104.

[0091] Figure 1AA-1CC Connector 104 in the middle can be located on the daughterboard (at least as shown in the example). Figure 2AAs shown, the receiver connector 210 can be located on the middle board or back panel 202 to receive the connector 104 for transmitting data signals and to provide a ground reference between the daughter board and the middle board or back panel 202. The receiver cage socket 103 can be soldered or fixed to the ground surface contact pad 107 or ground surface contact channel or line 119 on the middle board or back panel 202. The signal surface contact pad 220 can be located within the perimeter formed by the ground surface contact pad 107 or the ground surface contact channel or line 119.

[0092] Connector 104 can be a portion of a differential signal connection with a ground reference. The data signal of pin 110 can be one of a set of differential signals; pin 110 is one of a set of differential signal pins. Figure 1AA-1CC These pins are also illustrated in the cross-sectional view. Differential signal pins can be supported by a ground reference from the grounded cage socket 101B. Connector 104 can be made part of a connector array, for example... Figure 1GG 1DD array and Figure 2A A 2D array of connectors. This connector array can form a leadframe connector, for example... Figure 1HH and Figure 2A The lead frame connector is shown. This lead frame connector can be located between a circuit board constituting the middle plate or back plate 202 and another circuit board (which may be a daughter board), or between the middle plate or back plate 202 and the computing component.

[0093] Connector 104 may include lead segment 106 and may include shell segment 108, which may be coupled to or formed from a portion of lead segment 106. Lead segment 106 allows data signals to be transmitted within connector 104. In addition to surrounding shell segment 108, grounding cage socket 101B may surround lead segment 106, such as... Figure 1AA-1CC One or more of the following are shown. Connector 104 may include rigid insulation, for example, as part of the external insulation having a first stop feature 113. The rigid insulation may surround the grounded cage socket 101B to allow connector 104 to have rigid specifications.

[0094] Connector 104 may include a second cylindrical section, which is coupled to the cylindrical section via a lead section, as in Figure 1 GG-2B As shown and described in detail in the examples. The second cylindrical section can be coupled to the sub-board, and this cylindrical section can be used to couple to the middle plate or backplane 202 of the rack in the data center, such as... Figure 5 As shown. The grounding cage socket 101B can extend from the second shell section to the shell section to provide a grounding reference between the sub-plate and the middle plate or back plate.

[0095] Connector 104 may include parallel leads in lead segment 106, such as Figure 1 GG-2B As illustrated and described in detail, connector 104 may include a parallel barrel located on the barrel segment, as in the same example. Connector 104 may include a grounding cage socket 101B on the parallel leads and the parallel barrel. The parallel barrel may include additional pins and additional springs. These pins and additional pins (the pins and additional pins of the parallel barrel) may support or allow differential signals between them, while the grounding cage socket 101B supports or allows a ground reference. Furthermore, the parallel lead array may make connector 104 part of a lead frame connector, as described in the example. Figure 1HH and Figure 2A As detailed above.

[0096] In one example, connector 104 may allow grounding cage receptacle 101B to comprise a copper alloy. In one example, receiver connector 210 may allow receiver cage receptacle 103 to comprise a copper alloy. This at least allows for predetermined contact with a ground reference for data signals. Connector 104 may also include lead segment 106 and grounding cage receptacle 101B having an angled feature, which may be provided independently for each lead segment and grounding cage receptacle 101B. As at least in Figure 1GG and 1HH As further detailed, this angled feature allows the cylindrical section 108 of connector 104 to form a 90-degree angle separation with another cylindrical section of another connector.

[0097] Figure 1AA-1CC as well as Figure 1 DD-7 A system of lead frame connectors with multiple grounded cage sockets is also illustrated. In one example, Figure 1GG-2F The connector array may include at least a plurality of grounding cage receptacles. Within these plurality of grounding cage receptacles may be multiple cylindrical pin segments having pins (e.g., a set of differential signal pins) and springs. Furthermore, each grounding cage receptacle may surround a respective cylindrical pin pair. The grounding cage receptacle is coupled to a receiving cage receptacle on the circuit board, providing a ground reference for the data signal via pins and springs. Pins extend from or retract into their respective cylindrical pin segments, at least in part, based on corresponding stop features 113, 115 associated with corresponding receiving cage receptacles in the receiving cage receptacles. In one example, the corresponding stop features 113 and 115 may hold each grounding cage receptacle at a predetermined position 117 relative to the receiving cage receptacle. In another example, the corresponding stop features 113 and 115 may allow pins to contact signal surface contact pads on the circuit board to transmit data signals to the circuit board.

[0098] Figure 1AA-1CC as well as Figure 1 DD-7The diagram also illustrates a receiver connector 210, which has a receiver cage socket 103 and stop features 113, 115 associated with the receiver cage socket 103. The receiver cage socket 103 can be fixed to a circuit board, as shown. Figure 1AA-1CC As shown. Stop features 113 and 115 hold the grounded cage receptacle of the applied connector 104 in a predetermined position 117 relative to the receiving cage receptacle 103, and allow the pins 110 of the applied connector 104 to contact the signal surface contact pads 220 on the circuit board, thereby transmitting data signals to the circuit board. The receiving cage receptacle 103 can be coupled to the grounded cage receptacle 101B of the applied connector 104 to provide a ground reference between the receiving connector 210 and the applied connector 104.

[0099] Figure 1DD The illustration shows different lead frame connectors 100DD having lead segments and shell segments according to at least some embodiments. In one example, each lead frame connector 102A, 102B may include a series of connectors 104. Each connector 104 may include a lead segment 106 and a shell segment 108, as combined Figure 1AA-1CC As discussed, the cylindrical section 108 can be formed from a portion of the lead section 106 (e.g., as in combination). Figure 1FF (As shown and described). The cylindrical section 108 may include a needle and a spring, for example, as combined Figure 1EE , Figure 1FF As shown and described.

[0100] Figure 1DD The diagram also illustrates that the cylindrical section 108 may include a cylindrical section formed by a lead segment 106. In one example, the lead segment 106 may be a portion of a strip of material having a wide portion at its ends. The material is 0.05 mm thick along its longest length, and its length is sufficient to reach the opposite ends of the lead frame connectors 102A and 102B at its longest length. The material may be wide at both ends of its longest length 122, and narrow at the center of the longest length relative to the wide 122 124. The material may include one or more of copper alloy or nickel plating. The pin may be formed of one or more of copper alloy or gold plating. The spring may be formed of stainless steel. All of these materials are conductive. The cylindrical section 108 allows electrical connections from the pins and through the cylindrical section to be used for transmitting signals or power from the circuit board via the connector.

[0101] Figure 1DDThe diagram also illustrates that each lead segment 106 may include an angled feature 118. As shown, this angled feature may include one or more angles. The angled feature 118 allows a 90-degree angle separation 120 between the shell segment 108 of the same connector 104 and the shell segment of another connector. The one or more angles are provided to allow multiple lead segments to properly pass through the available space of the lead frame connectors 102A, 102B.

[0102] Figure 1EE A cross-sectional view 100EE of a lead frame connector having lead segments and a shell segment according to at least some embodiments is illustrated. Figure 1DD The above and Figure 1FF The wider portion shown can be folded into the cylinder. Additionally, a strip of material with the wider portion can be included in the top and bottom sections of the cylinder segment. The portion at the top of the cylinder can be folded 116A at the opening of the cylinder to prevent the spring 112 from popping out from the top of the cylinder. Needle 110 (as shown) Figure 1EE (As shown) It can be compressed from the bottom of the cylinder. The portion at the bottom of the cylinder can be folded inward or rolled up 116B to also prevent the pin from popping out after it is pressed down. This provides the cylinder section 108 of connector 104. Connector 104 and other similar connectors can have surface contact pads with the backplate or middle plate, as detailed below. Figure 1EE-7 .

[0103] Figure 1FF The illustration depicts process details 100FF of a cylindrical segment having a needle and a spring according to at least some embodiments. As shown, the first step may include forming a cylindrical segment 130 108 using a material with a width 124 narrow at the center and 122 wide at both ends. The width 122 of the material may be adapted or predetermined to allow the ends to be formed into a cylindrical segment 140 as part of the forming step 130. Process detail 100FF shows that the steps of adding the spring 132 and the needle can be performed. The needle 110 and the spring 112 may be inserted from the top or bottom of the cylindrical segment, with the head 110A of the needle 110 engaging 128 with the spring 112. The spring may have a compression 126 capability for insertion into the cylindrical segment.

[0104] After inserting the spring 112, the portion 142A at the top of the cylinder can be folded 116A at the opening of the cylinder to prevent the spring 112 from dislodging from the top of the cylinder. The pin 110 can be separately located at the bottom of the cylinder and can be configured to compress the spring from the bottom. The portion 142B at the bottom of the cylinder can be rolled inward 116B to also prevent the pin 110 from popping out after it has compressed the spring 112. This completes 134, or provides the cylinder section 108 for connector 104. Connector 104 and other similar connectors can be used to abut against surface contact pads on the backplate or middle plate; see details below. Figure 1 GG-7One or more diagrams.

[0105] Figure 1GG It is a perspective view 100GG of the angled features according to at least some embodiments for forming a 90-degree angle separation between the cylindrical sections of the partial connector, which are part of the lead frame connector. Figure 1GG The diagram illustrates a set of connectors 104 operating together as part of a differential signal connection, with at least two pins 110 forming a set of differential signal pins 152. Each connector can be part of a connector array, such as the one-dimensional (1DD) array shown, but is at least capable of supporting two-dimensional (2D) arrays, at least as shown. Figure 2A As shown. A 1D or 2D array can form leadframe connectors 102A, 102B, which can be located between a circuit board and another circuit board or computing component. Two connectors 104 can be aligned to form a connector pair, which includes at least a shell pair 156 and a lead pair 154. Each lead pair 154 can have at least two shell pairs 156, each shell pair 156 located at an end of the lead pair 154. Furthermore, these ends can be supported by angled features 118, thereby allowing a 90-degree angle separation 120 to be formed between the shell segments 108 of the connector 104.

[0106] Each connector 104 may have a lead segment 106 that is part of a lead pair 154 and may contain an insulating medium between the lead pairs 154. In one example, the insulating medium may be air. In another example, rigid insulation 150 may be provided around the lead segment 106 and may extend onto the housing segment 108. The rigid insulation 150 may give the connector a rigid profile 206 and may allow the rigid profile of the connector array to form lead frame connectors 102A, 102B. The lead segment 106 may include lead pairs 154 in the form of parallel leads. These parallel leads may have parallel housings in the housing segment 108. In one example, these parallel housings form a housing pair 156, which may include additional pins and additional springs. The pins in the housing pair 156 may be a set of different signal pins used to support or allow differential signals between them. Figure 1GG An array of parallel leads (e.g., in lead pair 154) may be included to make connector 104 part of lead frame connectors 102A, 102B.

[0107] Figure 1HHThe image 100HH is a side view 100HH showing an angled feature according to at least some embodiments, which allows a 90-degree angle separation between the shell segments of the connectors, which are part of the leadframe connectors. The 90-degree angle separation 120 between the shell segments 108 of the respective connectors 104 allows the leadframe connectors 102A, 102B to be coupled between circuit boards perpendicular to each other, between computing components perpendicular to each other, or between circuit boards and computing components perpendicular to each other. The connector 104 may include rigid insulation 150 throughout the lead segment 106, but a grounded cage socket may also be used, which may itself include a rigidly insulated grounded cage socket 158. Furthermore, the grounded cage socket 158 ​​can guide the connection between the leadframe connectors 102A, 102B and the receiving connector, such as at least regarding... Figure 2A As described. In one example, a short grounding cage receptacle 158 may support a connection between leadframe connectors 102A, 102B and a daughterboard. The short grounding cage receptacle 158 may include a daughterboard connector for 160A. A long grounding cage receptacle 158 (relative to the short grounding cage receptacle) may support a connection between leadframe connectors 102A, 102B and a backplane or middleplane. The long grounding cage receptacle 158 may include a middleplane or backplane connector for 160B. In one example, connector 104 is located between the daughterboard and the backplane or middleplane, these further relate to Figure 2A To elaborate further.

[0108] Figure 1II This is a partial view 100II of a connector having retracted pins in its cylindrical section according to at least some embodiments. Figure 1II As illustrated, when coupled to a circuit board or computing component, pin 110 can be in the retracted pin 110B position within the cylindrical section 108 of each cylindrical pair 156. Figure 1II The illustration shows that air insulation or rigid insulation may be included between lead pair 154 and tubular pair 156. In one example, a grounded cage socket 158 ​​may support the distance maintained between connectors 104 in each of lead pair 154 and tubular pair 156. Figure 1II The illustration also shows that the number of lead pairs 154 and tubular pairs 156 can be multiple, depending in part on the type of lead frame connectors 102A and 102B. For example, in one example, the lead frame connector can transmit signals of different standards mentioned herein, or it can transmit power, such as at least in combination. Figure 4 and Figure 5 As described in [the text].

[0109] Figure 1II The diagram also illustrates the situation when the frame connectors 102A and 102B of the daughter board are coupled to the middle board or backplane 202 (still...). Figure 2A , Figure 2B The receiving connector (e.g., shown in the image) Figure 2A , 2B As shown in the diagram, when the pins 110 of connector 104 pass through the receiving connector and make contact 162 with the surface contact pads 220 of the middle plate or back plate 202, the contact 162 includes a predetermined pressure 164 between the pins 110 and the surface contact pads 220, which is sufficient to bring each pin 110 into the retracted pin 110B position. The pressure 164 is also sufficient to ensure that the retracted pins 110B maintain electrical connectivity through the contact 162, thereby transmitting signals from the middle plate or back plate 202 and through each connector 104 of the lead frame connectors 102A, 102B.

[0110] Contact 162 avoids problems that arise when anchoring flexible interfaces to the PCB. The retracted pin 110B allows for coupling and decoupling without the need for through-holes or compressed pins mating with surface contact pads. In each case, the pin 110, being in the retracted pin 110B position, allows for the application of a predetermined insertion or compression force without damage or poor contact after repeated coupling and decoupling using the leadframe connectors 102A, 102B described herein. Furthermore, the pin 110's ability to be in the retracted pin 110B position allows for a constant force, as part of pressure 164, to maintain contact between the pin 110 and the surface contact pad 220. The leadframe connectors 102A, 102B described herein ensure that no additional interface is required between each connector 104 and the circuit board (e.g., middle board or backplane 202).

[0111] Figure 1JJ The illustration shows a partial cross-sectional view 100JJ of a connector according to at least some embodiments, the connector having a retracted pin and a compression spring in its cylindrical section. In one example, Figure 1JJ The diagram shows Figure 1II The process details are shown in the 100FF cross-section. Figure 1JJ As shown, when the needle 110 is coupled to the circuit board or computing component, the needle 110 can be in the retracted needle 110B position within the cylinder section 108 of each cylinder pair 156, which is achieved at least by compressing the corresponding spring 112, such that the spring 112 is in the compressed spring 112A position.

[0112] Figure 2AThe illustration shows a connection 200A between two circuit boards according to at least some embodiments, and this connection is used for differential signal transmission via leadframe connectors. One circuit board may be a middle board or back board 202, and the other circuit board may be a daughter board 204. Leadframe connectors 102A, 102B may include: a rigid profile 206 provided by at least rigid insulation that may extend throughout the lead segment 106, and one or more barrel segments 108 of each connector 104. As shown, leadframe connectors 102A, 102B may be held by grounded cage receptacles 158 of each daughter board connector pair 160A and each middle board or back board connector pair 160B. In another example, an external fastener or other external retainer 208 may be used between the circuit board and the leadframe connectors 102A, 102B. The external fastener or other external retainer 208 may be used to secure or limit the leadframe connectors 102A, 102B to prevent them from being disconnected from or displaced by the receiving connector 210 of the circuit board. For example, on at least daughterboard 204, the receiving connector may be a surface contact pad and an external tie or other external retainer 208. On the middle or backplane, the surface contact pad 220 may be aligned with the receiving connector 210 and its associated grounding cage receptacle 158 to allow connection of the leadframe connectors 102A, 102B. The pins 110 on the leadframe connectors 102A, 102B are pressed (e.g., pressured or forceped) against the surface contact pad 220, at least under the bias of the spring 112.

[0113] Figure 2B The diagram illustrates a connection 200B between a sub-board and a backplane or middleboard, and other computing components, according to at least some embodiments. Figure 2B The diagram illustrates the use of a right-angle leadframe connector 262 between the daughterboard 204 and the middle or backplane 202. The right-angle leadframe connector 262 can be used as follows: Figure 2A Specifically, as described in the text, it can be as follows: Figure 2A The lead frame connectors 102A and 102B are described in the text. Figure 2B The use of a through-type leadframe connector 264 is also illustrated, each connector 104 of which has a straight lead segment 106 and a straight cylindrical body segment 108. The through-type leadframe connector 264 can be positioned between a computing component 266 and a daughterboard 204. The computing component can be an adapter, memory stick, communication card, or other components that may be intended for use with the daughterboard 204, middleboard, or backplane 202 via the daughterboard 204. In one example, the through-type leadframe connector 264 does not need to include the angled feature 118 in its individual connectors 104.

[0114] Both the right-angle leadframe connector 262 and the straight-through leadframe connector 264 may include a portion of their internal structure that integrates a spring-loaded pin 110 as part of their leadframe connector internal structure. This internal structure includes a lead segment 106 and a cylindrical segment 108 formed by portions of the lead segment. See details. Figure 1AA-1JJ As shown in one or more figures. In at least one example, pins 110 in each connector 104 of the right-angle leadframe connector 262 and the through-type leadframe connector 264 may extend or retract from the cylindrical section 108 partially based on engagement 128 with the spring 112. Pins 110 are used to contact surface contact pads on a circuit board (which may be a daughter board 204, a middle board, or a back board 202, depending on the connection method). This contact can be used to transmit signals from the circuit board through the connector. Furthermore, each connector 104 may include a first cylindrical section for coupling to a second cylindrical section via a lead section. Each conductor may be part of a conductor array of the leadframe connector, and the first cylindrical section may be coupled to the daughter board 204, and the second cylindrical section may be coupled to the middle board or back board 202 of a rack in a data center, at least in Figure 5 A more detailed description is available in the text.

[0115] Figure 2C An exploded view of a right-angle connector 200C according to at least some embodiments is illustrated. The right-angle connector may include an insulated conductor and may be located between a daughterboard and a backplane or middleboard. In some examples, a right-angle connector 102C may be used instead. Figure 2A The lead frame connectors 102A, 102B or Figure 2B The right-angle lead frame connector 262 is used in the middle. The right-angle connector 102C can be used as a coaxial or biaxial transmission line as an insulated wire 230, instead of like Figure 1B The right-angle connector 102C uses a stamped lead frame with rigid insulation 150, as described above. This allows the right-angle connector 102C to benefit from further signal integrity by reducing signal loss, skew, and reflections that may occur in certain differential signal transmissions. Furthermore, the insulated conductor 230 eliminates the need for rigid insulation 150 as part of the fixed section 101G, and also eliminates any air gaps that may exist between the rigid insulation sections 150.

[0116] In some examples, the insulated conductor 230 can utilize the shielding of a coaxial or biaxial transmission line, as shown in the figure. This shielding can be used for noise isolation. Furthermore, the right-angle connector 102C can include similar... Figure 1A and Figure 1BThe pins 101D can be presented as coaxial leads. Pins 101D can be located within the grounded cage socket 101B and can be directly attached to the connector interface or mechanically converted to support the spring load described throughout this document. This allows the right-angle connector 102C to provide a more reliable and electrically superior alternative to the circuit board connector.

[0117] In some examples, integrating coaxial or biaxial transmission lines into the right-angle connector 102C alters the geometry and shielding available for certain board connectors that might otherwise require linear connections. Furthermore, in some cases, removing non-uniform dielectrics in the form of rigid insulation 150 can address signal degradation issues. In some examples, the insulated conductor 230 can be redesigned within the hollow internal structure 101M of the fixed segment 101G, thereby improving electrical performance without relying on conventional stamped metal and dielectric constructions with rigid insulation 150. The insulated conductor 230 can be flexible, at least in its central portion, to support the geometry shown. Also... Figure 2C As shown, the insulated conductor 230 has pins 101D (which may be a lead pair) that are bendable to provide a right-angle geometry and are fitted within a hollow internal structure 101M, with both ends exposed or protruding for external connection via a right-angle connector 102C. When bent, the insulated conductor 230 can be arranged within the hollow internal structure 101M according to a predetermined arrangement 234A for signal transmission via a mating sequence in at least some examples. A cover 232 can be attached 234B to enclose the right-angle connector 102C.

[0118] Can be added such as combination Figure 1A and Figure 1B The described flexible segment protects the exposed end of the insulated conductor 230. In some examples, the flexible segment may be on the guide 101L shown. A frame rail 236 may be provided on the back of the right-angle connector 102C to place the board or frame on the right-angle connector 102C and multiple other connectors in large-scale deployments between daughterboards and motherboards (e.g., in data centers). In some examples, after the flexible segment is added, it can be stopped by a stop feature 131 to prevent it from moving against the fixed segment 101G, as in combination. Figure 1B As described.

[0119] Figure 2D The illustration shows a perspective view 200D of a right-angle connector 102C according to at least some embodiments, which may include an insulated conductor and may be located between a daughterboard and a backplate or middleboard. Figure 2D The diagram illustrates a closed right-angle connector 102C. The central portion of the insulated conductor 230 may be at least flexible to support the geometry shown. Also... Figure 2CAs shown, the insulated conductor 230 has pins 101D (which may be a lead pair) that can be bent to form a right-angle geometry and fitted within the right-angle connector 102C, while protruding or extending at both ends to allow external connection from the right-angle connector 102C. For each insulated conductor 230, this protrusion or extension is at least relative to the grounded cage socket 101B. As shown, and already combined with at least... Figure 2C As described, insulated conductors 230 can be arranged in a predetermined pattern within the hollow internal structure 101M for signal transmission via a mating sequence (at least in some embodiments). A cover 232 can be attached to 234B to enclose the right-angle connector 102C.

[0120] For example Figure 1A and Figure 1B As shown, a flexible segment can be added to the fixed segment 101G to protect the exposed end of the insulated conductor 230. In some embodiments, the flexible segment can be on the guide 101L shown. A retaining rail 236 located on the back of the right-angle connector 102C is also illustrated to allow for the placement of a baffle on the right-angle connector 102C and multiple other connectors in large-scale deployments between daughterboards and motherboards (e.g., in data centers). In some examples, after the flexible segment is added, it can be stopped by a stop feature 131 to prevent the flexible segment from moving against the fixed segment 101G as if combined. Figure 1B As described.

[0121] Figure 2E The illustration shows a representative cross-sectional view 200E of a right-angle connector according to at least some embodiments, which may include an insulated conductor and may be located between a daughterboard and a backplate or middleboard. Figure 2E The illustration shows at least as Figure 2D The enclosed right-angle connector 102C is shown. The central portion of the insulated conductor 230 can be at least flexible to support the geometry shown. Also... Figure 2C and Figure 2D As shown, an insulated conductor 230 with pins 101D (which may be a lead pair) can be bent to form a right-angle geometry and fitted within a right-angle connector 102C. This fitting may also expose or protrude both ends of the insulated conductor 230 for external connection via the right-angle connector 102C. This exposure or protrusion is at least relative to the grounding cage socket 101B of each insulated conductor 230. (As at least combined) Figure 2C and Figure 2D As shown and described, in at least some examples, insulated conductors 230 can be arranged in a predetermined pattern within the hollow internal structure 101M, thereby allowing signal transmission via mating sequences. A cover 232 can be attached to 234B to enclose the right-angle connector 102C.

[0122] like Figure 1A and Figure 1B As shown, the flexible segment can be added to the fixed segment 101G, and also... Figure 1A and Figure 1B As shown, this is used to protect the exposed end of the insulated conductor 230. In some examples, a flexible segment may be present on the guide 101L shown. The retaining rail 236 is also located on the back of the right-angle connector 102C to allow for the placement of a baffle on the right-angle connector 102C and multiple other connectors in large-scale deployments between daughterboards and motherboards (e.g., in data centers). In some examples, the addition of the flexible segment allows for the use of a stop feature 131 (such as a coupling). Figure 1B (As described in the text) Stop the flexible section to prevent the flexible section from moving and hitting the fixed section 101G.

[0123] Figure 2F The illustration shows aspects 200F of a ground reference in a transparent view of a right-angle connector according to at least some embodiments. Aspect 200F includes at least one insulated conductor 230 having a grounding cage socket 101B, which can be coupled to a receiving connector 210 via a jumper pin 238. In some examples, the jumper pin 238 may allow a ground reference to be established between each insulated conductor 230, which may be established individually or additional to flexible and fixed sections, such as in combination. Figure 1A and Figure 1B As stated in [the text]. Therefore, Figure 1A and Figure 1B The description of aspects that are clearly useful in the examples may be applicable Figures 2C to 2F Examples are provided in the examples, which are incorporated herein by reference. Such descriptions may include signaling descriptions, ground reference descriptions, mating sequence descriptions, and other descriptions that are obvious from the examples in this document.

[0124] Figure 2GThe illustration shows aspect 200G of a receiver connector supported by a spring retaining device according to at least some embodiments. In some examples, the lead frame connectors 102A, 102B, or right-angle connector 102C may be compression connectors, and the receiver connection 210 may be located above the middle plate or back plate 202. The lead frame connectors 102A, 102B, or right-angle connector 102C must be securely fixed to the middle plate or back plate 202 to ensure consistent signal integrity across all contacts. This can be achieved by securing the lead frame connectors 102A, 102B, or right-angle connector 102C to the middle plate or back plate 202 from the back side using fasteners 244 (e.g., screws). In some examples, the fasteners 244 may be solder-tailed. In some examples, the lead frame connectors 102A, 102B, or right-angle connector 102C may be mounted on the front and rear sides of the middle plate or back plate 202. A retaining bracket or plate (referred to herein as pressure plate 240) can be used to secure the lead frame connectors 102A, 102B, or right-angle connector 102C in place. Additionally, a wave spring 242 can be used to further ensure that a consistent pressure is applied across the entire lead frame connectors 102A, 102B, or right-angle connector 102C relative to the receiving connector 210. This consistent pressure compensates for any machining tolerances present in the pressure plate 240.

[0125] Figure 2H The illustration shows another aspect 200H of a receiving connector that is spring-loaded and fixedly supported according to at least some embodiments. In some examples, such as... Figure 2G The leadframe connectors 102A, 102B, or right-angle connector 102C may be crimp connectors, with their receiving connection 210 located on the middle plate or back plate 202. The leadframe connectors 102A, 102B, or right-angle connector 102C must be securely attached to the middle plate or back plate 202 to ensure consistent signal integrity across all contacts. This can be achieved by using fasteners 244 (e.g., screws) to secure the leadframe connectors 102A, 102B, or right-angle connector 102C to the middle plate or back plate 202 from the back side. In some examples, the fasteners 244 may be solder-tailed. In some examples, the leadframe connectors 102A, 102B, or right-angle connector 102C may be mounted on the front and rear sides of the middle plate or back plate 202. A clamping plate 240 can be used to secure the leadframe connectors 102A, 102B, or right-angle connector 102C in place. In addition, wave springs 242 can be used to further ensure that consistent pressure is applied across the entire lead frame connectors 102A, 102B, or right-angle connector 102C relative to the receiving connector 210. This consistent pressure can compensate for any machining tolerances present in the pressure plate 240.

[0126] Figure 2IThe illustration depicts various aspects 200I of the receiving connector prior to spring-loaded support, according to at least some embodiments. As shown, leadframe connectors 102A, 102B, or right-angle connector 102C may be coupled to a receiving connection 210, which may be located on a middle plate or back plate 202. The leadframe connectors 102A, 102B, or right-angle connector 102C must be securely attached to the middle plate or back plate 202 to ensure consistent signal integrity across all contacts. This is achieved by using provided fastener provisions 246 and fasteners 244 (e.g., screws) from the back of the middle plate or back plate 202 to secure the leadframe connectors 102A, 102B, or right-angle connector 102C to the middle plate or back plate 202. In some examples, the fasteners 244 may be solder-tailed. In some examples, lead frame connectors 102A, 102B or right-angle connector 102C may be mounted (and coupled to receiver connector 210) on the front and rear sides of the middle plate or back plate 202.

[0127] After the lead frame connectors 102A, 102B, or right-angle connectors are coupled to the receiving connector 210, the clamping plate 240 can be used to secure the lead frame connectors 102A, 102B, or right-angle connector 102C in place. In some examples, the clamping plate 240 can be used to apply pressure to the frame guide rail 236, such as during coupling. Figures 2C to 2E As shown. Additionally, a wave spring 242 (or other suitable spring) can be used to further ensure consistent pressure is applied to the entire lead frame connectors 102A, 102B, or right-angle connector 102C relative to the receiving connector 210. This consistent pressure compensates for any machining tolerances present in the pressure plate 240.

[0128] Figure 3A The illustration depicts a process or method 300A for a protected connector according to at least some embodiments. Method 300A is compatible with this document. Figure 3AA and Figure 3BBThe method may be used in conjunction with either method 300AA or 300BB. Method 300A may include steps for facilitating at least one lead of the 3002 grounding cage receptacle 3002 around the protected connector. Method 300A may include steps for facilitating the 3004 flexible mechanical trigger to be positioned above the grounding cage receptacle. The flexible mechanical trigger may include a fixed segment around the grounding cage receptacle and a flexible segment around the fixed segment. Method 300A may include steps for protecting the 3006 grounding cage receptacle and at least one lead by means of the flexible mechanical trigger when the protected connector is in a disconnected position relative to the protected receiving connector. Method 300A may include steps for determining the coupling to be performed between the 3008 flexible mechanical trigger and the receiving element of the protected receiving connector on the circuit board. Method 300A may include the step of moving the 3010 flexible segment relative to the fixed segment to expose the grounding cage receptacle, in part based on the coupling to be performed, when the protected connector is in a connected position relative to the protected receiving connector. The step of moving the flexible segment 3010 can be performed after or based on the determination in step 3008 regarding the coupling to be performed between the flexible mechanical trigger and the receiving element of the protected receiving connector. For example, this coupling can allow the flexible segment to move.

[0129] Method 300A may include a step or sub-step for allowing a stop feature to limit movement of the flexible segment within a predetermined distance. Method 300A may include a step or sub-step for limiting contact force or contact pressure associated with one or more of the grounding cage socket or at least one lead via the predetermined distance. In some examples, method 300A may include a step or sub-step for biasing the flexible segment with a biasing element to provide protection to the grounding cage socket and at least one lead. This protection ensures that when the protected connector is in a disconnected position relative to the protected receiving connector, the grounding cage socket and at least one lead are not exposed on at least one side of the grounding cage socket and at least one lead.

[0130] Method 300A may include the following steps or sub-steps: providing a ground reference, in part based on the performed coupling, between the grounded cage receptacle and the protected receiving connector, and the surface contact pads of the circuit board. Method 300A may include steps or sub-steps for associating the protected connector with the daughter card. Method 300A may include steps or sub-steps for coupling the protected connector of the daughter card to a protected receiving connector located on a backplane or middle plate. This may allow or support movement of the flexible segment relative to the fixed segment. The receiving element may be soldered or fixed to one or more grounded surface contact pads, channels, or lines on the backplane or middle plate. The one or more grounded surface contact pads, channels, or lines may be located on the periphery of lead surface contact pads relative to the circuit board.

[0131] Figure 3AA The illustration depicts a process or method 300AA for manufacturing a connector having a lead segment and a barrel segment, according to at least some embodiments. Figure 3AA Method 300AA can be used with Figure 3A Method 300AA can be used in conjunction with other methods. For example, method 300AA may include the step of forming a lead segment 302 according to a connector layout. In one example, this layout may be provided during circuit board design. In another example, this layout may be provided during rack design. In one example, the layout may include one or more circuit boards for coupling together and available distance and space for use with cables or other computing devices. Method 300AA may include the step of forming a barrel segment 304 from a portion of the lead segment. Method 300AA may include the step of associating a pin and a spring 306 within the barrel segment. Method 300AA may include the step of allowing a pin 308 to extend or retract partially from or into the barrel segment based on engagement with a spring. Method 300AA may include the step of allowing a connector 310 to be used for signal transmission between at least two circuit boards or components of circuit boards. The pin may contact a surface contact pad on at least one circuit board to transmit signals from the circuit board and through the connector. In another example, the step of allowing 310 to use the connector may include using it for a power connection between a power source and a circuit board.

[0132] Figure 3BB The illustration depicts a process or method 300BB for a connector having a grounded cage socket, according to at least some embodiments. Figure 3BB Method 300BB can be used with Figure 3AAMethod 300AA is used in conjunction with method 300BB. Method 300BB can provide a connector for signal transmission. Method 300BB may include steps for forming a lead segment 352 according to the layout of the connector. Method 300BB may include steps for forming a housing segment 354 associated with or to be associated with the lead segment. Method 300BB may include steps for associating pins and springs 356 within the housing segment. Method 300BB may include steps for forming a grounding cage receptacle 358 at least surrounding the housing segment of the connector. The grounding cage receptacle may be configured to couple with and provide a grounding reference to a receiving cage receptacle. Method 300B may include steps for allowing pin 360 to extend or retract partially from or into the housing segment based on engagement with a spring. Method 300BB may include steps for allowing pin 362 to extend and retract partially based on a stop feature associated with the receiving cage receptacle. The stop feature may hold the grounding cage receptacle in a predetermined position relative to the receiving cage receptacle. Method 300BB may include steps for allowing connector 364 to be used for signal transmission between at least two circuit boards or components of circuit boards. As part of method 300BB, the pin may contact at least one surface contact pad on a circuit board to transmit signals between circuit boards via a connector.

[0133] Method 300BB may include steps or sub-steps for forming a grounded cage receptacle for mounting on a receiver connector. Method 300BB may include steps or sub-steps for forming a stop feature, which may serve as part of external insulation around the receiver cage receptacle or as part of internal insulation within the receiver cage receptacle. Method 300BB may include steps or sub-steps for determining a contact application including a predetermined pressure or contact resistance between a pin and a signal surface contact pad. Method 300BB may include steps or sub-steps for allowing contact between a pin and a signal surface contact pad, in part based on this contact application.

[0134] Method 300BB may include steps or sub-steps that allow the connector to become a daughterboard portion. Method 300BB may include steps or sub-steps that allow the receive connector to become a backplane or middleplane portion. Method 300BB may include steps or sub-steps that solder or attach a receive cage receptacle to ground surface contact pads, channels, or wires on the backplane or middleplane. Signal surface contact pads may be located within a perimeter formed by the ground surface contact pads, channels, or wires. Method 300BB may include steps or sub-steps that allow the connector to establish a differential signal connection with a ground reference. The pin's data signal may be one of a set of differential signals. The pin itself may be one of a set of differential signal pins supported by a ground reference of the ground cage receptacle.

[0135] Figure 4 The illustration shows an example data center that utilizes... Figure 1A-3BB and Figure 5-7At least one power connection embodiment is described. Data center 400 may include racks 404, which may be associated with servers 406 therein (in the form of server bays, server chassis, or server / computer modules), and racks 404 may contain computing devices therein for performing workloads. Although servers 406 are shown horizontally in the figures, they may also be mounted vertically within racks 404. These racks 404 may be tethered as part of the data center 400 infrastructure (e.g., via hardwired connections or natively within rack rows). For example, racks 404 may be associated with power supply units (PSUs) and may be connected to busbars 416 for receiving and distributing power for servers 406. These racks 404 may necessarily contain power supply components (e.g., busbars 418) closely associated with racks 404. These power supply components may be part of the infrastructure in data center 400. Racks 404 may include high-speed interconnects to enable high-speed communication between various subsystems, including servers 406.

[0136] Computing devices can be mounted on a circuit board and can include processors (such as central processing units (CPUs), quantum processing units (QPUs), graphics processing units (GPUs), data processing units (DPUs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), physical processing units (PPUs), etc.) and other components (such as memory, communication modules, input / output modules, etc.).

[0137] In at least one embodiment, data center 400 may include a server room 402 with one or more racks 404, wherein racks 404 may include server bays or servers 406. Data center 400 may be powered by a power distribution system 408 via one or more transformers 410 (Tr.), thereby adapting the power supplied to switching device 412 to the data center. For example, power distribution system 408 may be part of a power transmission system. The power transmission system may provide high-voltage power from a public power grid. Each transformer 410 may step down the voltage to a level suitable for data center equipment and apparatus (e.g., the aforementioned processors in server bays or servers 406 within each rack 404). Switching device 412 may be able to control, protect, and isolate downstream and upstream power.

[0138] Switching device 412 can be used to manage power flow reliably and efficiently using switches for control circuits and circuit breakers and fuses to detect and respond to faults or overloads in the downstream and upstream directions. In addition to the external power supplied by the transmission system, a backup system 414 (e.g., a generator or uninterruptible power supply (UPS)) can be used in conjunction with the power distribution system 408 (Power Dist.) to ensure uninterrupted power supply. Furthermore, cooling unit 426 can provide air cooling at least for the cold aisle 430 side of the data center 400 and deliver cooled air through rack 404 to the hot aisle 428 side. In one example, fans can assist in the air cooling flow.

[0139] Switching device 412 may be associated with busbar 416. Busbar 416 may power one or more racks 404. In one example, busbar 416 may power one or more racks 404 via a provided busbar 418. Busbar 418 may be a conductive strip for delivering current to various loads, including those represented by the processors mentioned above, which may be located within server racks or computer modules (also referred to as servers 406) in each rack 404 of the data center 400. Busbar 418 may be made of copper, aluminum, or a suitable power supply material. Busbar 418 may be able to work collaboratively to meet the high current requirements of the data center 400.

[0140] Data center 400 may include a midplane or backplane 202, such as Figure 2A , Figure 2B As shown in the related discussion, the middle or back plate 202 may have surface contact pads for receiving signals from other circuit boards (e.g., Figure 2A and Figure 2B The lead frame connectors 102A, 102B, 262, 264 (e.g., daughterboard 204) or other components in the data center Figure 1DD and Figure 2B (e.g., lead frame connectors in the design). For example, these components may include the power supply components described herein and, as in combination with... Figure 2B The computing component 266 described herein. A middle plate or back plate 202 may be associated with a receiving connector 210 for receiving a leadframe connector of daughter boards 204, wherein multiple daughter boards 204 may be inserted into the middle plate or back plate 202. The leadframe connector may include a separate connector 104 with pins 110 and springs 112. Pins 110 may be used to contact surface contact pads within the receiving connector. A robust connection may be formed between the pins 110 and the surface contact pads, based in part on the spring bias of the springs 112 of the leadframe connector against the surface contact pads of the receiving connector, and in part on the alignment supported by the grounded cage receptacle 158 and any rigid insulation 150 provided as portions of the leadframe connectors 102A, 102B.

[0141] Figure 5 The illustration shows aspect 500 of an example rack, which can be applied to Figure 1A-4 and Figure 6A-7 At least one embodiment of the above. Aspect 500 illustrates that rack 404 may have at least one circuit board, which may be a middle plate or back plate 202. Although shown as open, rack 404 may be fully enclosed with a front cover, rear cover, side cover, and top cover or access panel. Furthermore, although shown as a high-level flat structure, the circuit board may include at least one PCB (also as...). Figure 2A and Figure 2B (As shown and described). When used as a backplane, the circuit board may include a single-sided receive connector 506 for receiving a lead frame connector 504 of a daughter board or card 204. When used as a middle board, the circuit board may include dual-sided receive connectors 506 for receiving lead frame connectors 504 of daughter boards or cards 204 on both sides of the circuit board. Figure 5 In aspect 500, the circuit board is a middle board located in the middle of rack 404. The middle board can receive a vertical board server 406 or a daughter board 204. The daughter board 204 can be pushed to insert 502 against, for example, the receiving connector 506 of the middle board, thereby forming one or more connections between the middle board and the server or daughter board 204.

[0142] Figure 5 as well as Figure 1AA-1CC The diagram also illustrates various aspects of a data center 500, including a midplane or backplane 202, one or more sub-boards 204, and multiple connectors 104 arranged in an array (such as...). Figure 1GG and Figure 2A (as shown) and the grounding cage socket within the connector (such as Figure 1AA-1CC (As shown). The middle board or backplane 202 may include signal surface contact pads and ground surface contact pads, channels, or lines for differential signals. The middle board or backplane 202 may include a receiver connector 506 separately associated with the ground surface contact pads, channels, or lines.

[0143] One or more daughterboards 204 can be coupled to a middleboard or backboard 202 via a leadframe connector 504. The leadframe connector 504 may include connectors arranged in an array and may include a grounding cage receptacle within the connector. The grounding cage receptacle may surround a pin- and spring-loaded cylindrical section of the leadframe connector 504. Individual grounding cage receptacles may surround a respective pair of cylindrical sections. The grounding cage receptacle may be coupled to a receiving cage receptacle to provide a ground reference for data signals transmitted via pins and springs. Pins can extend from or retract into a corresponding cylindrical section of the cylindrical section, at least in part, based on a corresponding stop feature associated with a corresponding receiving cage receptacle. The corresponding stop feature holds the grounding cage receptacle in a predetermined position relative to the receiving cage receptacle. The corresponding stop feature allows pins to contact signal surfaces to contact pads for transmitting data signals between one or more daughterboards and the middleboard or backboard.

[0144] Figure 6A An example data center 600 in which at least one embodiment can be used is illustrated. In at least one embodiment, the data center 600 includes a data center infrastructure layer 610, a framework layer 620, a software layer 630, and an application layer 640. Figure 6A An example data center 600 in which at least one embodiment can be used is illustrated. In at least one embodiment, the data center 600 includes a data center infrastructure layer 610, a framework layer 620, a software layer 630, and an application layer 640. The data center 600 may include one or more racks, for example, in combination. Figure 1DD and Figure 1EE The racks described herein. These racks may include one or more server racks. These one or more server racks may include one or more electronic components for performing at least a portion of the workload in the data center. The racks and server racks may be represented at least by a data center infrastructure layer 610. These electronic components may be represented by node computing resources 616(1)-616(N), which may be cooled using cold plates.

[0145] The data center 600 may include a cooling loop for removing heat from electronic components during workload execution. The cooling loop may include a manifold, which comprises a manifold module and a cover, as shown in the figure. Figures 2A to 5As detailed in one or more figures. A cover may include a curved surface located within the manifold's passageway. This curved surface may be configured to receive cooling fluid flow and guide the cooling fluid flow away from stagnant areas within the manifold. Data center 600 may include multiple segmented cooling loops for removing heat from electronic components during workload execution. A segmented cooling loop may include multiple manifold modules. Individual outlets of the manifold modules may guide cooling fluid. Multiple covers located at different ends of the multiple manifold modules may reduce the cooling fluid flow rate at each outlet to a predetermined threshold.

[0146] In at least one embodiment, such as Figure 6A As shown, the data center infrastructure layer 610 may include a resource orchestrator 612, packet computing resources 614, and node computing resources (“nodes CR”) 616(1)-616(N), where “N” represents any positive integer. In at least one embodiment, nodes CR 616(1)-616(N) may include, but are not limited to, any number of central processing units (“CPUs”) or other processors (including accelerators, field-programmable gate arrays (“FPGAs”), graphics processors, etc.), memory devices (e.g., dynamic read-only memory), storage devices (e.g., solid-state drives or disk drives), network input / output (“NW I / O”) devices, network switches, virtual machines (“VMs”), power modules, and cooling modules, etc. In at least one embodiment, one or more nodes CR 616(1)-616(N) may be servers having one or more of the aforementioned computing resources.

[0147] In at least one embodiment, the grouped computing resource 614 may include multiple individual groups of node CRs housed within one or more racks (not shown), or multiple racks housed within data centers (not shown) in different geographical locations. The individual groups of node CRs within the grouped computing resource 614 may include computing, networking, memory, or storage resources that can be configured or allocated to support one or more workloads. In at least one embodiment, several node CRs, including CPUs or processors, may be grouped within one or more racks to provide computing resources to support one or more workloads. In at least one embodiment, the one or more racks may also include any number of power modules, cooling modules, and network switches, in any combination thereof.

[0148] In at least one embodiment, resource orchestrator 612 may configure or otherwise control one or more nodes CR 616(1)-616(N) and / or group computing resources 614. In at least one embodiment, resource orchestrator 612 may include a software design infrastructure (“SDI”) management entity for data center 600. In at least one embodiment, resource orchestrator may include hardware, software, or some combination thereof.

[0149] In at least one embodiment, such as Figure 6A As shown, framework layer 620 includes job scheduler 622, configuration manager 624, resource manager 626, and distributed file system 628. In at least one embodiment, framework layer 620 may include a framework for supporting software 632 of software layer 630 and / or one or more applications 642 of application layer 640. In at least one embodiment, software 632 or application 642 may respectively include web-based service software or applications, such as services or applications provided by Amazon Web Services, Google Cloud, and Microsoft Azure. In at least one embodiment, framework layer 620 may be, but is not limited to, a free and open-source software web application framework, such as Apache Spark™ (hereinafter “Spark”), which can leverage distributed file system 628 for large-scale data processing (e.g., “big data”). In at least one embodiment, job scheduler 622 may include Spark drivers to facilitate scheduling workloads supported by the various layers of data center 600. In at least one embodiment, configuration manager 624 may be able to configure different layers, such as software layer 630 and framework layer 620, including Spark and distributed file system 628, to support large-scale data processing. In at least one embodiment, resource manager 626 may be able to manage cluster or group computing resources mapped to or allocated to support distributed file system 628 and job scheduler 622. In at least one embodiment, cluster or group computing resources may include group computing resources 614 at data center infrastructure layer 610. In at least one embodiment, resource manager 626 may coordinate with resource orchestrator 612 to manage these mapped or allocated computing resources.

[0150] In at least one embodiment, the software 632 included in the software layer 630 may include software used by at least a portion of the nodes CR 616(1)-616(N), the grouped computing resources 614, and / or the distributed file system 628 of the framework layer 620. One or more types of software may include, but are not limited to, internet web search software, email virus scanning software, database software, and streaming video content software.

[0151] In at least one embodiment, the application 642 included in the application layer 640 may include one or more types of applications available for use by at least a portion of the nodes CR 616(1)-616(N), the grouped computing resources 614, and / or the distributed file system 628 of the framework layer 620. One or more types of applications may include, but are not limited to, genomics applications, cognitive computing applications, and machine learning applications, including training or inference software, machine learning framework software (e.g., PyTorch, TensorFlow, Caffe, etc.), or other machine learning applications used in conjunction with one or more embodiments.

[0152] In at least one embodiment, any of the configuration manager 624, resource manager 626, and resource orchestrator 612 can implement any number and type of self-modification actions based on any amount and type of data obtained in any technically feasible manner. In at least one embodiment, the self-modification actions can enable the data center operator of data center 600 to avoid making potentially erroneous configuration decisions and may avoid using underutilized and / or poorly performing portions of the data center.

[0153] In at least one embodiment, data center 600 may include tools, services, software, or other resources for training one or more machine learning models, or for using one or more machine learning models to predict or infer information, according to one or more embodiments described herein. For example, in at least one embodiment, a machine learning model can be trained by calculating weight parameters based on a neural network architecture using the software and computing resources described above for data center 600. In at least one embodiment, the trained machine learning model corresponding to one or more neural networks can be used to infer or predict information using the resources described above for data center 600 by utilizing weight parameters calculated via one or more training techniques described herein.

[0154] In at least one embodiment, the data center may use a CPU, application-specific integrated circuit (ASIC), GPU, FPGA, DPU, QPU, or PPU, or other hardware, to perform training and / or inference using the aforementioned resources. Furthermore, one or more of the aforementioned software and / or hardware resources may be configured as services to allow users to train or perform information inference, such as image recognition, speech recognition, or other artificial intelligence services.

[0155] Inference and / or training logic 615 is used to perform inference and / or training operations associated with one or more embodiments. In at least one embodiment, inference and / or training logic 615 may be used... Figure 6AIn the system shown, inference or prediction operations are performed based at least in part on weight parameters calculated using the neural network training operations, neural network functions and / or architecture or neural network use cases described herein.

[0156] Figure 6B This is a block diagram schematically illustrating a computing system, which could be a data center or a high-performance computing (HPC) cluster, in which various technologies can be used. Figure 1A-5 At least one embodiment of the above. According to at least some embodiments, the computing system 650 may include multiple subsystems, such as multiple processing devices, multiple network devices, and multiple networks coupled to each other. The computing system 650 is designed to have multiple integrated circuits (referred to as processing devices), wherein each integrated circuit may include one or more CPUs and GPUs, thereby forming a powerful and flexible architecture.

[0157] The various processing devices are interconnected via NVLink or other high-speed interconnects to enable high-speed communication between subsystems and are connected via NICs or DPUs to ensure efficient data transmission across computing system 650 and with one or more external networks 6530, 653. In this example, computing system 650 includes: packet switch 6548 for connecting NIC / DPU 6528 to external network 6530; and packet switch 6550 for connecting NIC / DPU 6532 to external network 6536.

[0158] Coupling processing devices via NVLink enables seamless data exchange and parallel processing, thereby improving overall computing performance. Processing devices connect to multiple networks via one or more Network Interface Controllers (NICs) or Data Processing Units (DPUs), enabling the system to handle complex multi-network tasks with high bandwidth and low latency. This configuration is ideal for demanding applications requiring powerful processing capabilities, such as artificial intelligence (AI), machine learning (ML), and data-intensive computing, while ensuring robust connectivity and scalability across diverse network environments. The integrated circuits of the Computing System 650 may include one or more CPUs and one or more GPUs.

[0159] Figure 6BAn example architecture of a multi-GPU architecture is also demonstrated. As shown in the figure, computing system 650 includes a processing device 6502 with a multi-GPU architecture. Specifically, processing device 6502 may be a system-on-a-chip (SoC) and includes multiple subsystems, such as CPU 6506, GPU 6508, and GPU 6510. CPU 6506 may be coupled to GPU 6508 via die-to-die interconnect (D2D) or chip-to-chip interconnect (C2C) 6512 (e.g., ground reference signaling interconnect (GRS interconnect)). CPU 6506 may be coupled to GPU 6510 via D2D or C2C interconnect 6514. CPU 6506 may also be coupled to GPU 6508 and GPU 6510 via PCIe interconnect.

[0160] The CPU 6506 can be coupled to one or more NICs or DPUs, which in turn are coupled to one or more networks. For example, Figure 6B As shown, CPU 6506 is coupled to a first NIC / DPU 6526, which is coupled to an external network 6530. CPU 6506 is also coupled to a second NIC / DPU 6528, which is coupled to the external network 6530 via a packet switch 6548. NIC / DPU 6526 and NIC / DPU 6528 can be coupled to the external network 6530 via Ethernet (ETH), NVLINK, or InfiniBand (IB) connections.

[0161] The computing system 650 also includes a processing device 6504 with a multi-GPU architecture. Specifically, the processing device 6504 includes multiple subsystems, including a CPU 6516, a GPU 6518, and a GPU 6520. The CPU 6516 may be coupled to the GPU 6518 via a D2D or C2C interconnect 6522. The CPU 6516 may be coupled to the GPU 6520 via a D2D or C2C interconnect 6524. The CPU 6516 may also be coupled to the GPUs 6518 and 6520 via a PCIe interconnect. The CPU 6516 may be coupled to one or more NICs or DPUs, which in turn are coupled to one or more networks. For example, as Figure 6BAs shown, CPU 6516 is coupled to a first NIC / DPU 6534, which is coupled to an external network 6536. CPU 6516 is also coupled to a second NIC / DPU 6532, which is coupled to the external network 6536 via a packet switch 6550. NIC / DPU 6532 and NIC / DPU 6534 can be coupled to the external network 6536 via Ethernet (ETH), NVLink, or InfiniBand (IB) connections.

[0162] In at least one embodiment, processing device 6502 and processing device 6504 can communicate with each other via NIC / DPU 6538, for example, via PCIe interconnect. Processing device 6502 and processing device 6504 can also communicate with each other via high-bandwidth communication interconnect 6540, such as NVLink interconnect or other high-speed interconnects. For example, Figure 6B The packet switches in the diagram can include Nvidia Quantum-2 switches. The NIC / DPU shown in the diagram can include, for example, an Nvidia Bluefield DPU.

[0163] In various embodiments, any network device of computing system 650, such as any of NIC / DPU 6526, 6528, 6532, 6534 and 6538, and / or any of packet switches 6548 and 6550, may include a suitably shaped leakage sensor that can be matched to the geometry around the components and features in computing system 650 and can be communicatively coupled to each other to extend leakage detection capabilities.

[0164] Figure 6C The illustration depicts a computer system according to at least one example, in which... Figure 1A-6B and Figure 7 At least one embodiment of the present disclosure. In at least one embodiment, the computer system 690 is configured to implement the various processes and methods described herein.

[0165] In at least one embodiment, the computer system 690 includes, but is not limited to, at least one central processing unit (“CPU”) 6902 connected to a communication bus 6910, which is implemented using any suitable protocol, such as PCI (“Peripheral Component Interconnect”), Peripheral Component Fast Interconnect (“PCI-Express”), AGP (“Accelerated Graphics Port”), HyperTransport, or any other bus or point-to-point communication protocol. In at least one embodiment, the computer system 690 includes, but is not limited to, main memory 6904 and control logic (e.g., implemented in hardware, software, or a combination thereof), and data is stored in main memory 6904, which may be in the form of random access memory (“RAM”). In at least one embodiment, a network interface subsystem (“network interface”) 6922 provides an interface to other computing devices and networks for receiving data from the computer system 690 and sending data to other systems.

[0166] In at least one embodiment, the computer system 690 includes, but is not limited to, an input device 6908, a parallel processing system 6912, and a display device 6906, which may be implemented using conventional cathode ray tube (“CRT”), liquid crystal display (“LCD”), light-emitting diode (“LED”), plasma display, or other suitable display technologies. In at least one embodiment, user input is received from the input device 6908, such as a keyboard, mouse, touchpad, microphone, etc. In at least one embodiment, each of the above modules may reside on a single semiconductor platform to form a processing system.

[0167] In at least one embodiment, a computer program, existing in the form of machine-readable executable code or computer control logic algorithms, is stored in main memory 6904 and / or secondary storage devices. If executed by one or more processors, the computer program enables computer system 690 to perform various functions according to at least one embodiment. Main memory 6904, storage devices, and / or any other storage medium are examples of computer-readable media. In at least some embodiments, secondary storage devices may refer to any suitable storage device or system, such as hard disk drives and / or removable storage drives, e.g., representing floppy disk drives, magnetic tape drives, optical disk drives, digital versatile optical disc (“DVD”) drives, recording devices, Universal Serial Bus (“USB”) flash memory, etc. In at least one embodiment, the architecture and / or functionality shown in the foregoing figures are implemented in the context of: CPU 6902, parallel processing system 6912; integrated circuits capable of implementing at least some of the functions of CPU 6902 and parallel processing system 6912; chipsets (e.g., a set of integrated circuits designed to operate and be sold as units performing related functions); and any suitable combination of integrated circuits.

[0168] In at least one embodiment, the architecture and / or functionality shown in the foregoing figures are implemented within the context of a general-purpose computer system, a circuit board system, a game console system dedicated to entertainment, a special-purpose application system, etc. In at least one embodiment, the computer system 690 may be a desktop computer, laptop computer, tablet computer, server, supercomputer, smartphone (e.g., wireless handheld device), personal digital assistant (“PDA”), digital camera, vehicle, head-mounted display, handheld electronic device, mobile phone device, television, workstation, game console, embedded system, and / or any other type of logic.

[0169] In at least one embodiment, the parallel processing system 6912 includes, but is not limited to, multiple parallel processing units (“PPUs”) 6914 and associated memory 6916. In at least one embodiment, the PPUs 6914 are connected to a host processor or other peripheral devices via interconnects 6918 and switches 6920 or multiplexers. In at least one embodiment, the parallel processing system 6912 distributes computational tasks to the PPUs 6914, and these tasks can be executed in parallel, for example, as part of distributing computational tasks across multiple graphics processing units (“GPUs”) thread blocks. In at least one embodiment, memory can be shared and accessed (e.g., for read and / or write access) on some or all of the PPUs 6914, although such shared memory may result in performance degradation compared to using local memory and registers residing on the PPUs 6914. In at least one embodiment, the operation of the PPUs 6914 is synchronized using commands such as _syncthreads(), where all threads in a block (e.g., executing across multiple PPUs 6914) must reach a specific point in code execution before continuing execution.

[0170] Figure 7An example network configuration 700 of components is illustrated, which includes aspects that can be used to implement various embodiments, such as providing, generating, modifying, encoding, processing, fusing, and / or transmitting generated image data, calculated measurements, or other such content. In at least one embodiment, client device 702 can use components of content application 704 on client device 702, as well as data stored locally on the client device, to generate or receive data for a dialogue. In at least one embodiment, content application 724 executing on computer or processor 720 (e.g., cloud server or control system) can initiate a dialogue associated with at least one client device 702 (e.g., vehicle or robot), which can use a dialogue manager and user data stored in user database 736, and can select and / or retrieve content such as liquid coolant or server thermal data from thermal storage repository 734 for use by test module 732 to calculate one or more performance metrics in an environment where the data will be used to determine appropriate operation, for use by monitoring module 728, which can provide flow data or thermal data to control module 730 to control flow or temperature. Content manager 726 can act on these different modules to perform tests and analyses, and potentially indicate any actions to be taken in response to performance metrics failing to meet operational requirements. At least a portion of the data or instruction content can be transmitted to client device 702 and / or physical device 770 via download, streaming, or other such transmission channels using appropriate delivery manager 722. An encoder can be used to encode and / or compress at least a portion of the data before transmission to client device 702. In at least one embodiment, client device 702 receiving such content can provide it to a corresponding content application 704, which may also or optionally include a graphical user interface (GUI) 710, a streaming monitoring module 712, and a control module 714 for providing, compositing, rendering, combining, modifying, or using the content on or through client device 702 for presentation, navigation, control (or other purposes), such as transmission to physical device 770. In some embodiments, computer / processor 720 and client device 702 may be able to communicate directly without transmitting data over network 740 to avoid problems such as latency and availability. The decoder can also be used to decode data received via network 740 for presentation via client device 702, such as through the image content or performance metrics of display device 706, and through audio via at least one audio playback device 708 (e.g., a speaker or headphones), such as corresponding sound or synthesized speech.In at least one embodiment, at least a portion of the content may already be stored on, rendered on, or accessible to client device 702, thus at least this portion of the content does not need to be transmitted over network 740. For example, this portion of the content (e.g., hot data) may have been pre-downloaded or stored locally on a hard disk or optical disk. In at least one embodiment, the content may be transmitted from computer / processor 720 or user database 736 to client device 702 using a transmission mechanism such as data streaming. In at least one embodiment, at least a portion of the content may be obtained, enhanced, and / or streamed from other sources (e.g., third-party service 760 or other client device 750), which may also contain applications for generating, updating, enhancing, or providing map content. In at least one embodiment, a portion of this functionality may be executed using multiple computing devices or multiple processors within one or more computing devices, for example, a combination of CPU and GPU (graphics processing unit).

[0171] In at least one embodiment, the cold plate described herein may include adjustable fins that form microchannels through which fluid flows. In at least one embodiment, the fins in the cold plate allow heat from at least one associated computing device to be transferred to fluid flowing through the microchannels formed between the multiple fins. In at least one embodiment, the fins of the cold plate may be dynamically and in real-time adjusted to allow more heat to be transferred from at least one computing device to fluid flowing through the finned cold plate. In at least one embodiment, such fins may be regulated by a processor or processorless system in part based on a determined (e.g., sensed) cold plate temperature. In at least one embodiment, the temperature may be associated with at least one computing device, the workload of at least one computing device, or the fluid at different time periods and at the inlet and outlet of the cold plate. In at least one embodiment, the processorless system may rely on the thermal properties of at least two materials used to form the cold plate fins, such that these fins can react without a processor, thereby exposing more surface area to the fluid. In at least one embodiment, these fins may include overlapping portions that may be exposed by the action of a control mechanism or by the properties of the at least two materials associated with each other that together constitute the fins.

[0172] In at least some examples, client devices can include any suitable computing device, such as desktop computers, laptops, set-top boxes, streaming media devices, game consoles, smartphones, tablets, VR headsets, AR glasses, wearable computers, or smart TVs. Each client device can submit requests via at least one wired or wireless network, such as the Internet, Ethernet, a local area network (LAN), or a cellular network, and other such options. In this example, these requests can be submitted to an address associated with a cloud provider that operates or controls one or more electronic resources within the cloud provider's environment, such as data centers or server clusters. In at least one embodiment, requests can be received or processed by at least one edge server located at the network edge and outside at least one security layer associated with the cloud provider's environment. This reduces latency and improves the security of resources within the cloud provider's environment by allowing client devices to interact with closer servers.

[0173] In at least one embodiment, such a system can be used to monitor or manage the thermal condition of a server that includes a cold plate as a liquid manifold. In other embodiments, such a system can be used for other purposes, such as controlling the flow rate of liquid coolant or performing deep learning operations. In at least one embodiment, such a system can be implemented using an edge device or may include one or more virtual machines (VMs). In at least one embodiment, such a system can be implemented at least partially within a data center or at least partially utilizing cloud computing resources.

[0174] Other variations also fall within the scope of this disclosure. Therefore, while the disclosed technology can be modified and alternatively constructed in various ways, certain exemplary embodiments have been shown in the accompanying drawings and described in detail above. However, it should be understood that this disclosure is not intended to limit the scope to the specific forms or multiple specific forms disclosed, but rather to cover all modifications, alternative constructions, and equivalents that fall within the spirit and scope of this disclosure as defined in the appended claims.

[0175] In describing the disclosed embodiments (particularly in the following claims), the terms “a,” “an,” “the,” and similar pronouns should be interpreted to cover both singular and plural forms unless otherwise stated herein or the context clearly indicates otherwise, and should not be considered as limiting the terms. The terms “comprising,” “having,” “including,” and “containing” should be interpreted as open-ended terms (meaning “including but not limited to”) unless otherwise stated. When the word “connection” is unmodified and refers to a physical connection, it should be interpreted as partially or wholly contained within, attached to, or linked together, even with the intervention of an intermediary. The enumeration of numerical ranges herein is intended only as a convenient method to individually refer to each individual value falling within a range, unless otherwise stated herein, and each individual value is incorporated into the specification as if it had been individually enumerated herein. Unless otherwise stated or the context clearly indicates otherwise, the terms “set” (e.g., “item set”) or “subset” should be interpreted as a non-empty set containing one or more members. Furthermore, unless otherwise stated or the context indicates otherwise, a “subset” of a set does not necessarily mean a proper subset of the set, but rather a subset and the set can be equal.

[0176] Conjunctive phrases such as "at least one of A, B, and C" or "at least one of A, B, and C" are generally understood, depending on the context, to mean that an item, term, etc., can be A, B, or C, or any non-empty subset of the set A, B, and C, unless explicitly stated otherwise or contradicted by the context. For example, in an illustrative example of a set containing three members, the conjunctive phrases "at least one of A, B, and C" and "at least one of A, B, and C" refer to any of the following sets: {A}, {B}, {C}, {A,B}, {A,C}, {B,C}, {A,B,C}. Therefore, such conjunctive phrases are generally not intended to imply that some embodiments require the simultaneous inclusion of at least one A, at least one B, and at least one C. Furthermore, unless explicitly stated otherwise or contradicted by the context, the term "multiple" indicates a plural state (e.g., "multiple items" means multiple items). A plural number means at least two items, but the number can be more if explicitly stated or determined by the context. Furthermore, unless otherwise stated or the context clearly indicates otherwise, the phrase “based on” means “at least partially based on”, not “completely based on”.

[0177] The operations of the processes described herein can be performed in any suitable order unless otherwise stated herein or there is a clear contradiction in the context. In at least one embodiment, processes such as those described herein (or variations and / or combinations thereof) are executed under the control of one or more computer systems configured with executable instructions and implemented in the form of code (e.g., executable instructions, one or more computer programs, or one or more application programs) that execute cooperatively on one or more processors, or implemented by hardware or a combination thereof. In at least one embodiment, the code is stored on a computer-readable storage medium, for example, in the form of a computer program containing multiple instructions executable by one or more processors. In at least one embodiment, the computer-readable storage medium is a non-volatile computer-readable storage medium that excludes transient signals (e.g., propagating transient electrical or electromagnetic transmissions) but includes a non-volatile data storage circuitry system (e.g., buffers, caches, and queues) within a transient signal transceiver. In at least one embodiment, code (e.g., executable code or source code) is stored on a collection of one or more non-volatile computer-readable storage media that store executable instructions (or other memory for storing executable instructions) that, when executed by one or more processors of a computer system (i.e., as a result of execution), cause the computer system to perform the operations described herein. In at least one embodiment, the collection of non-volatile computer-readable storage media includes multiple non-volatile computer-readable storage media, and one or more individual non-volatile storage media do not contain all the code, while the multiple non-volatile computer-readable storage media collectively store all the code. In at least one embodiment, the executable instructions are executed such that different instructions are executed by different processors—for example, instructions are stored on non-transitory computer-readable storage media, and the main central processing unit (“CPU”) executes some instructions, while the graphics processing unit (“GPU”) executes the remaining instructions. In at least one embodiment, different components of the computer system have separate processors, and different processors execute different subsets of instructions.

[0178] The transmission medium can be any type of network cable, such as a direct-connect copper cable (DAC), an active copper cable (ACC), an active optical cable (AOC), a cable assembly with an OSFP connector, or an interconnect used in data center racks and related switching modules (e.g., Small Form Factor (SFP), Quad Small Form Factor (QSFP), etc.). It can also be a passive copper cable (PCC), an active optical cable, and an active optical module for transmitting optical signals. Alternatively, the cable may include an Ethernet cable, an active optical cable (AOC), or a cable assembly with an OSFP connector. The semiconductor device can be a pluggable network interface device, which may include the male portion of a direct-connect cable assembly (DAC). Network connectors can each be configured to connect to any type of network device (e.g., QSFP, direct-connect copper cable, active optical cable (AOC), etc.), so their dimensions (e.g., size and shape) can be matched to or otherwise connected to any corresponding network device. Cable connectors can be of any type (e.g., AOC connectors, Ethernet connectors, direct-connect copper cable connectors, active optical modules, etc.). A PCB is used to electrically connect electronic components via conductive paths or traces etched onto a metal plate. In many electronic systems, one or more Very Large Scale Integration (VLSI) components are coupled to the printed circuit board (PCB) of the host system. Such VLSI components may include a central processing unit (CPU) and a graphics processing unit (GPU), etc. The PCB may accommodate at least one processing circuit. This processing circuit may include hardware such as an application-specific integrated circuit (ASIC). The processing circuit may include an ASIC and / or may be capable of operating as a central processing unit (CPU), a graphics processing unit (GPU), a network interface controller (NIC), a data processing unit (DPU), or any other computing device for receiving and / or transmitting data. Other non-limiting examples of processing circuits include integrated circuit (IC) chips, central processing units (CPUs), graphics processing units (GPUs), microprocessors, field-programmable gate arrays (FPGAs), sets of logic gates or transistors, resistors, capacitors, inductors, diodes, etc. It should be understood that any suitable electrical or optical component or set of electrical or optical components is suitable for inclusion in the processing circuit. Many embodiments are described below in which semiconductor packages are mounted within through-holes in the PCB. Although PCBs of specific types and dimensions are shown in the accompanying drawings and discussion, it should be noted that the types and dimensions shown and described are provided by way of example only. Those skilled in the art, upon reference to this disclosure, will understand that the same or similar apparatus and techniques can also be used for PCBs of other types and dimensions. For example, in some embodiments, the PCB mounting the semiconductor package may include an add-on card, such as a PCIe card, configured to be coupled to a system board or motherboard of a host system. In other embodiments, the PCB mounting the semiconductor package may itself be a system board or motherboard of a host system.Furthermore, the system board or motherboard can be associated with any type of host system. For example, the PCB can include a system board in a multi-node rack-mounted server in a data center, or it can include a motherboard for a workstation, desktop, laptop, or mobile device. Other embodiments are also possible.

[0179] Therefore, in at least one embodiment, the computer system is configured to implement one or more services that individually or collectively perform the operations of the processes described herein, and the computer system is configured with corresponding hardware and / or software to enable the execution of these operations. Furthermore, the computer system implementing at least one embodiment of this disclosure may be a single device, or in another embodiment, a distributed computer system comprising multiple devices operating in different ways, such that the distributed computer system performs the operations described herein, and that a single device does not perform all operations.

[0180] Any and all examples or exemplary language (e.g., “such as”) provided herein are for the purpose of better illustrating embodiments of this disclosure and, unless otherwise stated, do not constitute a limitation on the scope of this disclosure. No language in the specification should be construed as indicating that any unstated element is essential to the practice of this disclosure.

[0181] In the specification and claims, the terms “coupled” and “connected” and their derivatives may be used. It should be understood that these terms are not synonymous with each other. More specifically, in some examples, “connected” or “coupled” may be used to indicate that two or more elements are in direct or indirect physical or electrical contact with each other. “Coupled” may also indicate that two or more elements are not in direct contact with each other, but still cooperate or interact with each other.

[0182] Unless otherwise expressly stated, it will be understood that throughout this specification, terms such as “processing,” “calculation,” “operation,” and “determine” refer to the operations and / or processes of a computer or computing system or similar electronic computing device that manipulate data represented as physical quantities (such as electronic quantities) in the registers and / or memory of the computing system and / or convert them into other data represented as physical quantities in the memory, registers, or other such information storage, transmission, or display devices of the computing system.

[0183] Similarly, the term "processor" can refer to any device or part of a device that processes electronic data from registers and / or memory and transforms that electronic data into other electronic data that can be stored in registers and / or memory. As a non-limiting example, "processor" can be a CPU, GPU, DPU, QPU, or PPU. A "computing platform" can include one or more processors. As used herein, a "software" process can include, for example, software and / or hardware entities that perform work over time, such as tasks, threads, and intelligent agents. Furthermore, each process can refer to multiple processes for executing instructions sequentially or in parallel, continuously or intermittently. The terms "system" and "method" are used interchangeably herein, as a system can contain one or more methods, and a method can be considered a system.

[0184] This document may refer to the acquisition, reception, or input of analog or digital data into a subsystem, computer system, or computer-implemented machine. Acquiring, receiving, or inputting analog and digital data can be achieved in various ways, such as receiving data as a parameter of a function call or application programming interface (API) call. In at least some embodiments, the process of acquiring, receiving, or inputting analog or digital data can be implemented by transmitting data via a serial or parallel interface. In at least another embodiment, the process of acquiring, receiving, or inputting analog or digital data can be implemented by transferring data from a providing entity to an receiving entity via a computer network. The provision, output, transmission, sending, or presentation of analog or digital data may also be mentioned. In various examples, the process of providing, outputting, transmitting, sending, or presenting analog or digital data can be implemented by transmitting data as an input or output parameter of a function call, a parameter of an application programming interface, or a parameter of an inter-process communication mechanism.

[0185] While the foregoing discussion illustrates exemplary implementations of the described technology, other architectures can be used to implement the described functionality, and all such architectures are within the scope of this disclosure. Furthermore, although specific assignments of responsibilities may have been defined above for ease of description, various functions and responsibilities may be allocated and divided in different ways depending on the specific circumstances.

[0186] Furthermore, although this document has described the subject matter using language specific to structural features and / or method steps, it should be understood that the subject matter claimed in the appended claims is not necessarily limited to the specific features or steps described. Rather, the specific features and steps described are disclosed only as exemplary forms for implementing the claims.

Claims

1. A connector comprising a protruding signal pin and a flexible mechanical trigger, the flexible mechanical trigger comprising a fixed segment and a flexible segment surrounding the fixed segment, wherein, The flexible segment protects the protruding signal pin, wherein the flexible mechanical trigger is aligned with and coupled to a receiving element on the circuit board, wherein the flexible segment is moved relative to the fixed segment at least through the receiving element, the movement exposing the protruding signal pin and allowing the protruding signal pin to be coupled to a receiving connector having the receiving element and to a surface contact pad on the circuit board.

2. The connector of claim 1, further comprising a grounding cage-type socket surrounding at least one lead, said at least one lead including the protruding signal pin, wherein, The fixed section surrounds the grounded cage socket and the at least one lead, and wherein the flexible mechanical trigger is coupled to the receiving element to provide a ground reference for the connector relative to the circuit board.

3. The connector according to claim 2, wherein, The connector is a portion of the differential signal connection having the ground reference, and the protruding signal pins are a set of differential pins supported by the ground reference from one or more of the ground cage socket or the flexible mechanical trigger.

4. The connector according to claim 2, further comprising: Rigid insulation, at least between the flexible mechanical trigger and the at least one lead, is provided to maintain a signal or power source that is different from the ground reference.

5. The connector according to claim 1, wherein, The flexible segment extends when the connector is in the disconnected position relative to the receiving connector, and retracts when the connector is in the connected position relative to the receiving connector.

6. The connector according to claim 1, further comprising: A stop feature, wherein the flexible mechanical trigger is mounted on the receiving element, and wherein the stop feature restricts the movement of the flexible segment to a predetermined distance, and wherein the predetermined distance restricts the contact force or contact pressure associated with one or more of a grounding cage socket or at least one lead, the at least one lead including the protruding signal pin.

7. The connector according to claim 6, further comprising: A biasing element is located between the flexible segment and the fixed segment, wherein the biasing element biases the flexible segment to provide protection for the grounding cage socket and the at least one lead, such that when the connector is in a disconnected position relative to the receiving connector, the grounding cage socket and the at least one lead are not exposed at least on the sides of the grounding cage socket and the at least one lead.

8. The connector according to claim 6, further comprising: The access feature in the fixed segment of the flexible mechanical trigger allows the fixed segment to be mounted onto a connector having the grounding cage socket and the at least one lead, wherein the access feature allows the grounding cage socket to pass through it.

9. The connector according to claim 1, wherein, The connector includes an array of grounded cage sockets and leads, which form a lead frame connector between the circuit board and another circuit board or computing component.

10. The connector of claim 1, further comprising a shoulder or surface of the flexible segment for contacting the receiving element, the contact being for supporting or allowing the movement of the flexible segment relative to the fixed segment.

11. The connector according to claim 1, wherein, One or more of the fixed segment or the flexible segment includes one or more of copper alloy or gold-plated, nickel-plated, or stainless steel.

12. The connector of claim 1, further comprising a slack structure in the fixed segment for an angled feature, the angled feature being configured to allow a 90-degree separation between the flexible mechanical trigger and the other connection side of the connector.

13. The connector according to claim 1, wherein, The connector is located on the daughter card, and wherein the receiving connector is located on the back plate or middle plate forming the circuit board, wherein the receiving element is soldered or fixed to one or more of a ground surface contact pad, a channel or a line on the back plate or middle plate, and wherein one or more of the ground surface contact pad, the channel or the line is located on the periphery of the lead surface contact pad relative to the circuit board.

14. A data center, the data center comprising: A middle plate or back plate, the middle plate or back plate including one or more of a plurality of receiving cage sockets, a plurality of lead surface contact pads for differential signals, a ground surface contact pad or a channel or line, and including at least one receiving element associated with one or more of the ground surface contact pads, the channel or the line; as well as One or more sub-boards, said one or more sub-boards being coupled to the middle plate or back plate via lead frame connectors, said lead frame connectors comprising: Multiple grounded cage sockets surrounding multiple leads; and A flexible mechanical trigger includes a fixed section surrounding the plurality of grounding cage sockets and a flexible section surrounding the fixed section, wherein the flexible mechanical trigger protects the plurality of grounding cage sockets and the plurality of leads, wherein the flexible mechanical trigger is aligned and coupled to at least one receiving element of the middle plate or back plate to provide a ground reference via one or more of the grounding surface contact pads, the channels, or the lines, and wherein the flexible section is moved relative to the fixed section by the at least one receiving element, the movement exposing the plurality of grounding cage sockets and the plurality of leads and allowing the plurality of grounding cage sockets and the plurality of leads to couple to the plurality of receiving cage sockets and the plurality of lead surface contact pads of the middle plate or back plate.

15. A protected receiver connector, the protected receiver connector comprising a receiver element, a receiver cage receptacle, and a stop feature, the receiver element being fixed to a circuit board including surface contact pads, wherein, The stop feature causes the applied protected connector to move, the applied protected connector including a grounded cage receptacle surrounding at least one lead and including a flexible mechanical trigger, wherein the receiving element allows alignment of the flexible mechanical trigger, wherein the flexible mechanical trigger includes a fixed segment surrounding the grounded cage receptacle and a flexible segment surrounding the fixed segment, and wherein the movement is a movement of the flexible segment relative to the fixed segment and is for exposing the grounded cage receptacle and allowing the grounded cage receptacle to couple to the receiving cage receptacle, and exposing the at least one lead and allowing the at least one lead to couple to at least one of the surface contact pads of the circuit board.

16. A method for a protected connector, the method comprising: A grounding cage socket is provided for use around at least one lead of the protected connector, and includes a flexible mechanical trigger on the grounding cage socket, the flexible mechanical trigger including a fixed section around the grounding cage socket and a flexible section around the fixed section; When the protected connector is in a disconnected position relative to the protected receiving connector, the flexible mechanical trigger protects the grounding cage socket and the at least one lead. as well as When the protected connector is in the connected position relative to the protected receiver connector and partly based on the coupling performed between the flexible mechanical trigger and the receiving element of the protected receiver connector located on the circuit board, the flexible segment moves relative to the fixed segment to expose the grounding cage socket.

17. The method of claim 16, further comprising: The stop feature allows the movement of the flexible segment to be limited to a predetermined distance; as well as The predetermined distance limits the contact force or contact pressure associated with the grounding cage socket or one or more of the at least one lead.

18. The method of claim 16, further comprising one or more of the following: The flexible segment is biased by a biasing element to provide protection for the grounding cage socket and the at least one lead, such that when the protected connector is in the disconnected position relative to the protected receiving connector, the grounding cage socket and the at least one lead are not exposed at least on the sides of the grounding cage socket and the at least one lead.

19. The method of claim 16, further comprising: A grounding reference is provided, in part, between the grounded cage socket and the protected receiving connector and the surface contact pads of the circuit board, based on the coupling performed.

20. The method of claim 16, further comprising: Associate the protected connector with the daughter card; as well as The protected connector of the daughter card is coupled to the protected receiving connector located on the backplane or middle plate to allow or support the movement of the flexible segment relative to the fixed segment, wherein the receiving element is soldered or fixed to one or more of a ground surface contact pad, a channel, or a line on the backplane or middle plate, and wherein one or more of the ground surface contact pad, the channel, or the line is located on the periphery of the lead surface contact pad relative to the circuit board.

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