laser

CN122801026APending Publication Date: 2026-09-22QINGDAO HISENSE LASER DISPLAY CO LTD
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Patent Information

Application Number
CN202510329522.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-19
Publication Date
2026-09-22

AI Technical Summary

Technical Problem

但是,基于塑料材质进行封装无法达到较高的气密等级,而对激光芯片来说,对空气中湿度和污染物的隔绝又尤其重要,因此,激光芯片的封装方案中始终无法有效引入塑料材质的封装方案,属于本领域技术人员亟需解决的技术问题

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Abstract

The application provides a laser, an assembly chamber is arranged in the inside of a packaging shell, a chamber window is arranged in the packaging shell and communicates with the assembly chamber, at least a part of the packaging shell is configured as a plastic material, a liquid blocking cavity is further arranged in the inside of the packaging shell and is located between the outside environment of the packaging shell and the assembly chamber of the packaging shell, and electronic components are assembled in the packaging shell. In the laser, the liquid blocking performance of the packaging shell is improved based on the design of the liquid blocking cavity, that is, the penetration of liquid is prevented to the greatest extent, so that the packaging shell made of the plastic material can also achieve high airtightness, and the packaging shell made of the plastic material can also achieve sufficient airtightness compared with a packaging scheme of metal and ceramic when the packaging shell is applied to products such as lasers, the assembly requirement of the laser is met, and the production cost of the product is effectively reduced in the selection of the material.
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Description

Technical Field

[0001] This application relates to the field of laser display projection technology, and in particular to lasers. Background Technology

[0002] Laser display applications are expanding from industrial to home use, greatly enriching consumers' visual experience in areas such as home laser projection displays, AR / VR, and automotive applications. However, home-use products using laser display solutions are relatively expensive; for example, laser TVs of the same size are more expensive than regular TVs. Therefore, cost reduction for home-use laser display products is particularly important. As the core component of laser display products, the pressure to reduce the cost of lasers is also increasing.

[0003] As a semiconductor packaged device, the reliability of the packaging scheme directly affects the performance and lifespan of the laser. Currently, semiconductor packaged devices typically use metal or ceramic housings, primarily employing welded sealing methods. The packaging of a laser involves hundreds of processes. Besides the normal costs incurred at each process, defects are generated at each stage, inevitably leading to high laser costs and hindering cost reduction efforts in laser display products.

[0004] Currently, based on chip usage and reliability requirements, semiconductor packaging solutions include metal packaging, ceramic packaging, plastic packaging, and hybrid applications of these solutions. Among them, plastic packaging has the lowest cost due to its low-priced materials, fewer production steps, and suitability for mass production. However, plastic packaging cannot achieve high hermeticity levels, and for laser chips, isolation from air humidity and contaminants is particularly important. Therefore, the effective integration of plastic packaging solutions into laser chip packaging has remained a challenge, representing a pressing technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] Therefore, it is necessary to provide a laser to address the aforementioned technical problems.

[0006] This application provides a laser, the laser comprising:

[0007] The encapsulation housing has an assembly chamber inside and a chamber window communicating with the assembly chamber. At least a portion of the encapsulation housing is made of plastic. The encapsulation housing also has a liquid-resistant cavity inside and the liquid-resistant cavity is located between the external environment of the encapsulation housing and the assembly chamber of the encapsulation housing.

[0008] Electronic components, which are assembled within the package housing.

[0009] The liquid-resistant cavity design in the aforementioned laser packaging housing improves the liquid-resistant performance of the housing, effectively preventing liquid penetration to a certain extent. This allows the housing to achieve high airtightness even when made of plastic. When used in products such as lasers, plastic housings provide sufficient airtightness compared to metal and ceramic packaging solutions, meeting the assembly requirements of lasers and thus effectively reducing production costs in terms of material selection.

[0010] The liquid-blocking performance is mainly reflected in the fact that after liquid-blocking cavities are set in the plastic material, the liquid cannot continue to seep into the plastic material, thereby achieving the effect of blocking liquid seepage. At the same time, the design of the liquid-blocking cavity can also store the liquid to a certain extent.

[0011] In this embodiment, the laser mainly includes a package housing and electronic components and other auxiliary components disposed within the package housing. For example, for the laser, the electronic component is a laser chip, and the corresponding auxiliary components may include matching prisms, etc. Those skilled in the art can design the required electronic components and other auxiliary components of the laser according to the actual needs of the laser, which is not limited here.

[0012] In one embodiment, the path through which liquid seeps from the external environment of the encapsulation housing into the assembly chamber of the encapsulation housing is defined as the seepage path, and the liquid-blocking cavity is located within the seepage path, the liquid-blocking cavity being configured to slow down or prevent liquid seepage within the seepage path; and / or,

[0013] The encapsulation housing has a housing annular wall surrounding the assembly chamber, the penetration path being configured from the external environment of the encapsulation housing through the thickness direction of the housing annular wall toward the assembly chamber of the encapsulation housing, and the liquid-resistant cavity being disposed within the housing annular wall; and / or,

[0014] The assembly chamber is configured for assembling electronic components; and / or,

[0015] The package housing is provided with at least one lead element that penetrates the package housing and is configured for connecting electronic components.

[0016] In this embodiment, when liquid seeps into the assembly chamber of the packaging shell from the external environment, there is a specific seepage path within the packaging shell. Therefore, the liquid-blocking cavity is designed to be located within this seepage path. Once liquid seeps into the plastic portion of the packaging shell and continues its seepage into the assembly chamber along the seepage path, the liquid-blocking cavity constructed within the packaging shell can encounter the seeping liquid along that path. By utilizing the design of the liquid-blocking cavity within the packaging shell, the seepage of liquid from the external environment into the assembly chamber can be slowed or prevented.

[0017] In one embodiment, the encapsulation housing includes a bottom wall and an annular wall, the annular wall being disposed on the bottom wall, and the bottom wall and the annular wall together enclosing an assembly chamber having a chamber window; wherein, at least a portion of the bottom wall and the annular wall of the encapsulation housing is made of plastic; and / or,

[0018] The housing annular wall is provided with a through hole, and the lead element penetrates the housing annular wall through the through hole. At least a portion of the inner wall of the through hole is provided with a first concave-convex mating surface, and at least a portion of the outer surface of the lead element is provided with a second concave-convex mating surface. The first concave-convex mating surface of the through hole and the second concave-convex mating surface of the lead element are configured to make mutual contact, and the lead element and the through hole are sealed together.

[0019] In this embodiment, the packaging housing is further specified to be generally square in shape, in addition to hemispherical, square, and polygonal shapes. The square structure is composed of a bottom wall and annular walls. Simultaneously, the design of the concave-convex mating surfaces between the through-hole and the lead element is specified, thereby increasing the sealing strength of the connection between them by increasing the contact area.

[0020] In one embodiment, the liquid-blocking cavity may be arranged around the assembly chamber in a complete circle, or the liquid-blocking cavity may be arranged in a partial circle around the assembly chamber.

[0021] In this embodiment, the circumferential length of the liquid-blocking cavity is defined, which can be either a complete circumference or a partial circumference, and can therefore be designed specifically according to the specific airtightness requirements and assembly requirements.

[0022] In one embodiment, the liquid-blocking cavity includes a plurality of unit cavities, which are arranged around the assembly chamber in a complete circle or less than a circle, wherein at least a portion of the unit cavities of the liquid-blocking cavity are interconnected or not interconnected.

[0023] In this embodiment, the cavity design of the liquid-blocking cavity is defined. For example, the liquid-blocking cavity is not just a single cavity, but is composed of several unit cavities. Moreover, the several unit cavities can be connected or disconnected, or partially connected and partially disconnected, and have several different combination methods.

[0024] In one embodiment, the housing annular wall has at least one unit cavity opening, and each unit cavity opening communicates with at least one unit cavity.

[0025] In this embodiment, it is further defined whether the unit cavity is a sealed cavity or an open cavity. That is, if the unit cavity does not have a unit cavity opening, the unit cavity is a sealed cavity, and if the unit cavity has a unit cavity opening, the unit cavity is an open cavity.

[0026] In one embodiment, at least one of the unit cavities is arranged to surround the assembly chamber in a full circle or less than a full circle.

[0027] In this embodiment, the circumferential length of the unit cavity opening can be either a complete circumference or a partial circumference. This means that some of the unit cavities can be sealed, some can be open, or all can be open. Therefore, it can be designed specifically according to the specific airtightness and assembly requirements.

[0028] In one embodiment, the housing annular wall has a unit cavity opening that surrounds the assembly chamber for a complete circumference. The liquid-blocking cavity includes a plurality of unit cavities that are interconnected, and the unit cavity opening is connected to the plurality of unit cavities, thereby forming an annular groove in the housing annular wall. The annular groove is configured to form a liquid-blocking cavity inside the housing annular wall.

[0029] In this embodiment, several unit cavities are further defined as open cavities, and a design structure forming an annular groove is provided.

[0030] In one embodiment, the orientation of the unit cavity opening of the liquid-blocking cavity is the same as the orientation of the cavity window of the assembly chamber.

[0031] In one embodiment, the end wall of the housing annular wall is divided into an inner unit end wall and an outer unit end wall via the unit cavity of the liquid-blocking cavity. The inner unit end wall is located between the assembly chamber and the liquid-blocking cavity, and the liquid-blocking cavity is located between the inner unit end wall and the outer unit end wall.

[0032] Wherein, the inner unit end wall and the outer unit end wall are in the same plane, or the inner unit end wall and the outer unit end wall are not in the same plane.

[0033] In this embodiment, when the liquid-blocking cavity is provided, the end wall of the housing annular wall is divided into an inner unit end wall and an outer unit end wall. Therefore, the inner and outer unit end walls are not in the same plane. After the lens and lens are assembled, the lens only contacts the inner unit end wall, and the lens only contacts the outer unit end wall. Alternatively, if the inner and outer unit end walls are in the same plane, after the lens and lens are assembled, the lens does not contact the inner unit end wall, but the lens contacts both the inner and outer unit end walls. This results in different structural assembly effects for the lens and lens, forming different chamber structures.

[0034] In one embodiment, at least one splicing structure is provided between the bottom wall of the housing and the annular wall of the housing, and the bottom wall of the housing and the annular wall of the housing are spliced ​​and assembled with each other based on at least one splicing structure;

[0035] The splicing structure includes a first concave-convex splicing surface and a second concave-convex splicing surface respectively disposed on the bottom wall of the shell and the annular wall of the shell, and the first concave-convex splicing surface and the second concave-convex splicing surface of each splicing structure are interlocked with each other.

[0036] In this embodiment, when the first concave-convex splicing surface and the second concave-convex splicing surface of each splicing structure are interlocked, the contact area between the first concave-convex splicing surface and the second concave-convex splicing surface can be increased, thereby increasing the sealing strength between the two and improving the water-blocking performance at the corresponding position.

[0037] In one embodiment, at least one of the outer and inner sidewalls of the housing annular wall is provided with a liquid-resistant thickened wall;

[0038] The liquid-blocking cavity is located between the assembly chamber and the liquid-blocking thickened wall, or the liquid-blocking thickened wall is located between the liquid-blocking cavity and the assembly chamber.

[0039] In this embodiment, a liquid-resistant thickened wall is designed on the outer and inner walls of the housing ring wall. This is equivalent to increasing the wall thickness in the liquid penetration path and lengthening the penetration path. This greatly increases the difficulty of liquid penetration into the assembly chamber along the penetration path, thereby slowing down or preventing liquid from penetrating from the external environment of the packaging housing into the assembly chamber of the packaging housing and improving the water-resistant performance at the corresponding location.

[0040] In one embodiment, the liquid-blocking thickened wall and the housing annular wall are configured as an integrally formed structure; and / or,

[0041] The thickness of the liquid-resistant thickened wall is between 2 mm and 3 mm.

[0042] In one embodiment, the laser includes:

[0043] A lens, the lens being disposed in the chamber window of the assembly chamber;

[0044] A lens is disposed in the chamber window of the assembly chamber, and the lens is located between the lens and the assembly chamber, with a gap between the lens and the lens.

[0045] In this embodiment, the assembly relationship between the lens, the lens housing, and the encapsulation housing is defined.

[0046] In one embodiment, the lens and the assembly chamber of the encapsulation housing together form a first sealed space, and the lens and the liquid-resistant cavity of the encapsulation housing together form a second sealed space.

[0047] In this embodiment, a cavity structure is defined after the lens, lens, etc. are assembled into the packaging housing.

[0048] In one embodiment, the second sealing space is located between the first sealing space and the external environment of the packaging housing; and / or,

[0049] The second sealed space is in communication with the interval space; and / or,

[0050] At least one of the first sealed space and the second sealed space is configured as a negative pressure space.

[0051] In this embodiment, the relative positional relationship between the first sealing space and the second sealing space is defined, and the first sealing space and the second sealing space are further defined to be interconnected to form two through-space mating forms. Attached Figure Description

[0052] Figure 1 A perspective view of a laser provided in one embodiment of this application.

[0053] Figure 2 For example Figure 1 The image shows an exploded view of the laser.

[0054] Figure 3 For example Figure 1 The laser shown is a three-dimensional cross-sectional view.

[0055] Figure 4 For example Figure 1 The laser shown is a planar cross-sectional view.

[0056] Figure 5 For example Figure 1 The image shows a top view of the laser's packaging housing.

[0057] Figure 6 For example Figure 1 A perspective cross-sectional view of another embodiment of the laser shown.

[0058] Figure 7 For example Figure 6 The laser shown is a planar cross-sectional view.

[0059] Figure 8 A perspective cross-sectional view of a packaging housing provided in one embodiment of this application, which has several non-connected unit cavities.

[0060] Figure 9 For example Figure 8 The diagram shows a top perspective view of the encapsulation housing, which has several non-connected unit cavities.

[0061] Figure 10 A three-dimensional cross-sectional view of a packaging housing provided in one embodiment of this application, which has a plurality of interconnected unit cavities.

[0062] Figure 11 For example Figure 10 The diagram shows a top perspective view of the encapsulation housing, which has several interconnected unit cavities.

[0063] Figure 12 A perspective sectional view of a packaging housing provided in one embodiment of this application, showing a plurality of non-connected unit cavities.

[0064] Figure 13 For example Figure 12 The diagram shows a top view of the encapsulation housing with several non-connected unit cavities.

[0065] Figure 14 A perspective sectional view of a package housing provided in one embodiment of this application, showing a plurality of interconnected unit cavities.

[0066] Figure 15 For example Figure 14The diagram shows a top view of the encapsulation housing with several interconnected unit cavities.

[0067] Figure 16 A planar cross-sectional view of a packaging housing with a liquid-resistant thickened wall provided in one embodiment of this application.

[0068] Icon labels:

[0069] 1000, Encapsulation housing; 2000, Lead element; 3000, Lens; 4000, Lens; 5000, First sealing material; 6000, Second sealing material;

[0070] 1001, Infiltration path; 1010, Assembly chamber; 1020, Liquid-resistant cavity; 1100, Shell annular wall; 1200, Shell bottom wall; 1300, Liquid-resistant thickened wall;

[0071] 1011, First sealed space; 1012, Second sealed space; 1013, Interval space;

[0072] 1021. Unit cavity; 1022. Unit cavity opening;

[0073] 1110. Inner unit end wall; 1120. Outer unit end wall;

[0074] 1210. Splicing structure; 1211. First concave-convex splicing surface; 1212. Second concave-convex splicing surface. Detailed Implementation

[0075] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0076] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0077] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0078] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0079] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0080] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0081] See Figure 1As shown, this application provides a laser, such as a laser in a laser display product. The laser mainly includes a package housing 1000 and electronic components and other auxiliary components disposed within the package housing 1000. For example, for a laser, the electronic component is a laser chip, and the corresponding auxiliary components may include matching prisms, etc. Those skilled in the art can design the required electronic components and other auxiliary components of the laser according to the actual needs of the laser, and no limitation is made here.

[0082] Given that the use of plastic materials in cost-reduction design schemes has the disadvantage of poor water resistance, this application provides the following technical solution, which is mainly based on structural improvements to the packaging shell 1000 to improve the water resistance performance of the plastic packaging shell 1000, so as to ensure that the laser has sufficient water resistance performance and guarantee the service life of the laser while maintaining low cost.

[0083] Continue reading Figures 2 to 4 As shown, regarding the aforementioned encapsulation housing 1000, at least a portion of the encapsulation housing 1000 is configured to be made of plastic material. For example, those skilled in the art can select a portion or all of the structure of the encapsulation housing 1000 to be made of plastic material according to the design shape, size, etc. of the encapsulation housing 1000. The plastic material can be epoxy resin-based plastic material. Therefore, the portion of the encapsulation housing 1000 made of plastic material is the main location for design improvement in the encapsulation housing 1000, so that the water-blocking performance of the plastic material portion is improved based on the corresponding structural design improvement.

[0084] In one embodiment, the encapsulation housing 1000 has an assembly chamber 1010 inside, and the encapsulation housing 1000 has a chamber window communicating with the assembly chamber 1010. This allows the encapsulation housing 1000 to construct a recessed structure within the encapsulation housing 1000 based on the assembly chamber 1010 and the chamber window, for mounting the aforementioned electronic components and other auxiliary components. In this case, the encapsulation housing 1000 may include at least one lead element 2000, which penetrates the encapsulation housing 1000. A portion of the lead element 2000 is located within the assembly chamber 1010 of the encapsulation housing 1000, while a portion is located in the external environment of the encapsulation housing 1000, and it is configured to connect to the electronic components.

[0085] Regarding the structural design improvements to enhance water-blocking performance, this application provides a liquid-blocking cavity 1020 inside the encapsulation housing 1000, and the liquid-blocking cavity 1020 is located between the external environment of the encapsulation housing 1000 (or the relative positional relationship can be defined based on the outer wall of the encapsulation housing 1000) and the assembly chamber 1010 of the encapsulation housing 1000.

[0086] In one embodiment, if liquid seeps into the assembly chamber 1010 of the packaging housing 1000 from the external environment (or the outer wall of the packaging housing 1000), there is a certain seepage path 1001 in the packaging housing 1000. The design position of the liquid-blocking cavity 1020 is limited to the seepage path 1001 in which the liquid seeps into the assembly chamber 1010 of the packaging housing 1000 from the external environment of the packaging housing 1000.

[0087] Therefore, once liquid seeps into the plastic part of the packaging housing 1000 and seeps into the assembly chamber 1010 along the seepage path 1001, the liquid-blocking cavity 1020 constructed inside the packaging housing 1000 can meet the seeped liquid in the corresponding seepage path 1001. By means of the design of the liquid-blocking cavity 1020 inside the packaging housing 1000, the seepage of liquid from the external environment of the packaging housing 1000 into the assembly chamber 1010 of the packaging housing 1000 can be slowed down or prevented.

[0088] The improved liquid-blocking performance of the above-mentioned structure is mainly reflected in the fact that after the liquid-blocking cavity 1020 is set in the plastic material, the liquid cannot continue to seep into the plastic material, thereby achieving the effect of blocking liquid seepage. At the same time, the design of the liquid-blocking cavity 1020 can also store the liquid to a certain extent. As the size and structure of the liquid-blocking cavity 1020 are designed differently, the liquid storage effect will also change accordingly. Those skilled in the art can design the size and structure of the liquid-blocking cavity 1020 according to actual needs, and no limitation is made here.

[0089] Regarding the relative position design of the liquid-blocking cavity 1020 and the penetration path 1001, in one embodiment, the encapsulation housing 1000 may be defined to have a housing annular wall 1100 surrounding the assembly chamber 1010. That is, the assembly chamber 1010 is mainly surrounded by the housing annular wall 1100. The encapsulation housing 1000 can be designed in various shapes, such as hemispherical, square, polygonal, etc., thereby causing the housing annular wall 1100 to be constructed into different annular structures accordingly. For example, in one embodiment, the encapsulation housing 1000 may include a housing bottom wall 1200 and a housing annular wall 1100. The housing annular wall 1100 is disposed on the housing bottom wall 1200, and the housing bottom wall 1200 and the housing annular wall 1100 together enclose the assembly chamber 1010 with a chamber window. In this case, the encapsulation housing 1000 can be... Figure 2 The structure shown is roughly square.

[0090] In the bottom wall 1200 and the annular wall 1100 of the encapsulation housing 1000, at least a portion of the annular wall 1100 is made of plastic. That is, at least the annular wall 1100 is made of plastic, and it is also possible that at least a portion of the annular wall 1100 is made of plastic. For example, the bottom wall 1200 may be designed as an oxygen-free copper plate, on which electronic components and other auxiliary components are mounted, and the annular wall 1100 may be designed as an epoxy resin-based plastic. Therefore, based on the design location of the plastic material, the penetration path 1001 can be configured to start from the external environment of the encapsulation housing 1000, pass through the thickness direction of the annular wall 1100, and extend towards the assembly chamber 1010 of the encapsulation housing 1000.

[0091] It should be noted that, as Figure 4 Although the penetration path 1001 shown is represented by a straight line, it only indicates a general direction and not the actual penetration path. Depending on the method of liquid penetration, liquid can penetrate into the assembly chamber 1010 of the packaging housing 1000 along different penetration paths 1001 in the thickness direction of the housing annular wall 1100, such as straight lines, curves, or broken lines, without limitation here. Therefore, by providing a liquid-blocking cavity 1020 inside the housing annular wall 1100, the liquid-blocking cavity 1020 is positioned within the penetration path 1001, thus blocking liquid penetration.

[0092] Therefore, please continue reading Figures 1 to 4 As shown, a through hole can be provided in the housing annular wall 1100, allowing the lead element 2000 to penetrate the housing annular wall 1100 through the through hole and achieve penetration into the packaging housing 1000. At least a portion of the inner wall of the through hole can be provided with a first convex-concave mating surface, and at least a portion of the outer surface of the lead element 2000 can be provided with a second convex-concave mating surface. Both the first and second convex-concave mating surfaces are non-planar structures.

[0093] For example, the first concave-convex mating surface and the second concave-convex mating surface of the lead element 2000 can be uneven structures designed by etching or knurling. The first concave-convex mating surface of the through hole and the second concave-convex mating surface of the lead element 2000 are configured to make mutual contact, and the lead element 2000 and the through hole are sealed together. This increases the contact area between the outer surface of the lead element 2000 and the inner wall of the through hole when the lead element 2000 penetrates the through hole, thereby increasing the sealing strength between the two.

[0094] Regarding the design of the liquid-blocking cavity 1020, the liquid-blocking cavity 1020 can be constructed in a targeted manner according to the actual penetration path 1001 of the liquid. Therefore, the liquid-blocking cavity 1020 is theoretically not limited to any size, shape, structure, etc. Those skilled in the art can construct the liquid-blocking cavity 1020 in a suitable position in the packaging shell 1000 based on the actual liquid-blocking requirements, without any limitation.

[0095] See Figure 3 and Figure 4 As shown in the embodiments, or refer to Figures 5 to 7 As shown in the embodiment, the liquid-blocking cavity 1020 is arranged around the assembly chamber 1010 for a complete circumference. Therefore, based on the liquid-blocking cavity 1020 surrounding the assembly chamber 1010 for a complete circumference, the penetration of liquid can be slowed down or blocked, thereby improving the liquid-blocking performance at the corresponding location. Alternatively, the liquid-blocking cavity 1020 can also be designed to not be arranged around the assembly chamber 1010 for a complete circumference, thereby improving the water-blocking performance at the required location. This is not a limitation.

[0096] In one embodiment, the orientation of the unit cavity opening 1022 of the liquid-blocking cavity 1020 can be set to be different from the orientation of the chamber window of the assembly chamber 1010, or the orientation of the unit cavity opening 1022 of the liquid-blocking cavity 1020 can be set to be the same as the orientation of the chamber window of the assembly chamber 1010. When the orientation of the unit cavity opening 1022 of the liquid-blocking cavity 1020 is the same as the orientation of the chamber window of the assembly chamber 1010, such as Figures 3 to 7 The end wall of the housing ring wall 1100 is divided into an inner unit end wall 1110 and an outer unit end wall 1120 by the unit cavity 1022 of the liquid-blocking cavity 1020. The inner unit end wall 1110 is located between the assembly chamber 1010 and the liquid-blocking cavity 1020, and the liquid-blocking cavity 1020 is located between the inner unit end wall 1110 and the outer unit end wall 1120.

[0097] exist Figure 3 and Figure 4 In the illustrated embodiment, the inner unit end wall 1110 and the outer unit end wall 1120 may be located in different planes, i.e., the inner unit end wall 1110 is higher than the outer unit end wall 1120, so that when the lens 3000 and the lens 4000 are assembled, the lens 3000 only contacts the inner unit end wall 1110, and the lens 4000 only contacts the outer unit end wall 1120. Figures 5 to 7 In the embodiment shown, the inner unit end wall 1110 and the outer unit end wall 1120 may also be in the same plane, so that when the lens 3000 and the lens 4000 are assembled, the lens 3000 does not contact the inner unit end wall 1110, but the lens 4000 contacts both the inner unit end wall 1110 and the outer unit end wall 1120 at the same time.

[0098] like Figures 3 to 7 As shown, lens 3000 is located between lens 4000 and assembly chamber 1010; therefore, there is a gap space 1013 between lens 3000 and lens 4000. Figure 3 and Figure 4 In the illustrated embodiment, the inner unit end wall 1110 and the outer unit end wall 1120 are not in the same plane, which allows the assembly chamber 1010 to not communicate with either the liquid-blocking cavity 1020 or the spacer space 1013 after the lens 3000 and lens 4000 are assembled, but the liquid-blocking cavity 1020 and the spacer space 1013 are interconnected. Figures 5 to 7 In the embodiment shown, the inner unit end wall 1110 and the outer unit end wall 1120 are in the same plane, such that when the lens 3000 and the lens 4000 are assembled, the assembly chamber 1010 is not connected to either the liquid-blocking cavity 1020 or the spacer space 1013, and the liquid-blocking cavity 1020 and the spacer space 1013 are also not connected to each other.

[0099] Regarding the shape or structural design of the liquid-blocking cavity 1020 mentioned above, the liquid-blocking cavity 1020 can be a continuous, complete cavity, or it can be several non-connected cavities, for example, see [reference needed]. Figure 8 and Figure 9 As shown, in one embodiment, the liquid-blocking cavity 1020 includes a plurality of unit cavities 1021. The plurality of unit cavities 1021 are arranged around the assembly chamber 1010 in a complete circle or a partial circle. At least a portion of the unit cavities 1021 of the liquid-blocking cavity 1020 can be designed to be interconnected or non-interconnected based on factors such as relative position, structure, and size. That is, the plurality of unit cavities 1021 can be arranged as follows: Figure 8 and Figure 9 All of the above can be disconnected, or all of them can be interconnected, or they can be as shown in the diagram. Figure 10 and Figure 11 The design shown includes some unit cavities 1021 that are interconnected and some that are not interconnected. In addition, those skilled in the art may choose other design schemes, which are not limited here.

[0100] Continue reading Figure 12 and Figure 13As shown, in one embodiment, the housing annular wall 1100 has at least one unit cavity 1022, and each unit cavity 1022 connects to at least one unit cavity 1021. In different structural designs, the number of unit cavities 1022 can be the same as the number of unit cavities 1021, so that each unit cavity 1022 can be connected to each unit cavity 1021 in a one-to-one manner; or the number of unit cavities 1022 can be different from the number of unit cavities 1021, so that one unit cavity 1022 can connect to one or more unit cavities 1021, or one unit cavity 1021 can connect to one or more unit cavities 1022. No limitation is made here.

[0101] In one embodiment, at least one unit cavity 1022 is arranged around the assembly chamber 1010 in a complete circle or less, thereby connecting several unit cavities 1021 circumferentially within the assembly chamber 1010. For example, in one embodiment, a unit cavity 1022 is formed in the housing annular wall 1100, the unit cavity 1022 is arranged around the assembly chamber 1010 in a complete circle, the several unit cavities 1021 included in the liquid-resistant cavity 1020 are interconnected, and the unit cavity 1022 is connected to the several unit cavities 1021. Therefore, by designing the unit cavity 1022 and the unit cavities 1021 in terms of structure and position, a structure such as... can be formed. Figures 3 to 7 The design structure presented in the two different embodiments is such that an annular groove is formed in the housing annular wall 1100, and the annular groove is configured to form a liquid-resistant cavity 1020 inside the housing annular wall 1100.

[0102] It should be noted that the above Figure 9 and Figure 11 The unit cavities 1021, indicated by dashed lines, represent sealed cavities formed within the encapsulation housing 1000 (primarily in the housing annular wall 1100), and are not connected to the external environment. The above... Figure 13 and Figure 15 The unit cavity 1021 represented by solid lines indicates that at this time, several unit cavities 1021 belong to the cavity formed in the encapsulation shell 1000 (mainly in the shell annular wall 1100), but are connected to the external environment through the unit cavity opening 1022, forming an open cavity.

[0103] Continue reading Figures 2 to 7As shown, in one embodiment, at least one splicing structure 1210 is provided between the bottom wall 1200 and the annular wall 1100 of the housing, and the bottom wall 1200 and the annular wall 1100 are spliced ​​together based on the at least one splicing structure 1210. The splicing structure 1210 includes a first concave-convex splicing surface 1211 and a second concave-convex splicing surface 1212 respectively disposed on the bottom wall 1200 and the annular wall 1100 of the housing, and the first concave-convex splicing surface 1211 and the second concave-convex splicing surface 1212 of each splicing structure 1210 are interlocked.

[0104] The first concave-convex splicing surface 1211 and the second concave-convex splicing surface 1212 can be uneven structures designed by arc surfaces, stepped surfaces, etc. The first concave-convex splicing surface 1211 and the second concave-convex splicing surface 1212 are configured to fit together. When the first concave-convex splicing surface 1211 and the second concave-convex splicing surface 1212 of each splicing structure 1210 are inserted and fitted together, the contact area between the first concave-convex splicing surface 1211 and the second concave-convex splicing surface 1212 can be increased, thereby increasing the sealing strength between the two and improving the water-blocking performance at the corresponding position.

[0105] In addition to using the liquid-blocking cavity 1020 mentioned in the above embodiments to improve water resistance, in one embodiment, at least one of the outer and inner sidewalls of the housing annular wall 1100 may also be provided with a liquid-blocking thickened wall 1300. Since once liquid penetrates the plastic portion of the packaging housing 1000, the liquid mainly penetrates along the penetration path 1001 into the assembly chamber 1010 from the plastic portion of the packaging housing 1000. Therefore, as... Figure 16 As shown, liquid-resistant thickened walls 1300 are designed on the outer and inner walls of the housing ring wall 1100. This is equivalent to increasing the wall thickness in the liquid penetration path 1001 and lengthening the penetration path 1001. This greatly increases the difficulty of liquid penetration into the assembly chamber 1010 along the penetration path 1001, thereby slowing down or preventing liquid from penetrating from the external environment of the packaging housing 1000 into the assembly chamber 1010 of the packaging housing 1000 and improving the water-resistant performance at the corresponding location.

[0106] When the outer side wall of the housing annular wall 1100 is provided with a liquid-blocking thickened wall 1300, the liquid-blocking cavity 1020 is located between the assembly chamber 1010 and the liquid-blocking thickened wall 1300. When the inner side wall of the housing annular wall 1100 is provided with a liquid-blocking thickened wall 1300, the liquid-blocking thickened wall 1300 is located between the liquid-blocking cavity 1020 and the assembly chamber 1010. In one embodiment, the liquid-blocking thickened wall 1300 and the housing annular wall 1100 are configured as an integrally formed structure, or as two originally separate structures combined together. Moreover, the materials of the liquid-blocking thickened wall 1300 and the housing annular wall 1100 can be the same or different, which is not limited here. The thickness of the liquid-blocking thickened wall 1300 can be limited to between 2 mm and 3 mm, for example, the thickness of the liquid-blocking thickened wall 1300 is 2 mm, 2.1 mm, 2.2 mm, 2.3 mm, 2.4 mm, 2.5 mm, 2.6 mm, 2.7 mm, 2.8 mm, 2.9 mm or 3 mm.

[0107] Regarding the aforementioned laser, the laser may include a lens 3000 and a collimating lens 4000. The lens 4000 is disposed at the chamber window of the assembly chamber 1010. For example, the lens 3000 is sealed at the chamber window of the assembly chamber 1010 based on a first sealing material 5000, which may be a sealant, sealing ring, or other sealing material. The lens 4000 is disposed at the chamber window of the assembly chamber 1010. For example, the lens 4000 is sealed at the chamber window of the assembly chamber 1010 based on a second sealing material 6000, which may be a sealant, sealing ring, or other sealing material. The lens 3000 is located between the lens 4000 and the assembly chamber 1010, with a gap space 1013 between the lens 3000 and the lens 4000.

[0108] The assembly chamber 1010 of the lens 3000 and the encapsulation housing 1000 together form a first sealed space 1011, and the liquid-blocking cavity 1020 of the lens 4000 and the encapsulation housing 1000 together form a second sealed space 1012. The second sealed space 1012 is located between the first sealed space 1011 and the external environment of the encapsulation housing 1000. Therefore, after electronic components and other auxiliary components are assembled in the first sealed space 1011, the second sealed space 1012 can form a water-blocking isolation of the first sealed space 1011 from the outside. The second sealed space 1012 may or may not be connected to the spacer 1013, and at least one of the first sealed space 1011 and the second sealed space 1012 is configured as a negative pressure space.

[0109] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0110] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A laser, characterized in that, The laser includes: The encapsulation housing has an assembly chamber inside and a chamber window communicating with the assembly chamber. At least a portion of the encapsulation housing is made of plastic. The encapsulation housing also has a liquid-resistant cavity inside and the liquid-resistant cavity is located between the external environment of the encapsulation housing and the assembly chamber of the encapsulation housing. Electronic components, which are assembled within the package housing.

2. The laser according to claim 1, characterized in that, The path through which liquid seeps from the external environment of the encapsulation housing into the assembly chamber of the encapsulation housing is defined as the seepage path. The liquid-blocking cavity is located within the seepage path and is configured to slow down or prevent liquid seepage within the seepage path; and / or, The encapsulation housing has a housing annular wall surrounding the assembly chamber, and the liquid-resistant cavity is disposed inside the housing annular wall; And / or, The assembly chamber is configured for assembling electronic components; and / or, The package housing is provided with at least one lead element that penetrates the package housing and is configured for connecting electronic components.

3. The laser according to claim 2, characterized in that, The encapsulation housing includes a bottom wall and an annular wall, the annular wall being disposed on the bottom wall, and the bottom wall and the annular wall together enclosing an assembly chamber having a chamber window; wherein, at least a portion of the bottom wall and the annular wall of the encapsulation housing are made of plastic; and / or, The housing annular wall is provided with a through hole, and the lead element penetrates the housing annular wall through the through hole. At least a portion of the inner wall of the through hole is provided with a first concave-convex mating surface, and at least a portion of the outer surface of the lead element is provided with a second concave-convex mating surface. The first concave-convex mating surface of the through hole and the second concave-convex mating surface of the lead element are configured to make mutual contact, and the lead element and the through hole are sealed together.

4. The laser according to claim 2, characterized in that, The liquid-blocking cavity may be arranged around the assembly chamber in a complete circle, or the liquid-blocking cavity may be arranged around the assembly chamber in a less than complete circle.

5. The laser according to claim 4, characterized in that, The liquid-blocking cavity comprises several unit cavities, which are arranged around the assembly chamber in a complete circle or less than a circle. At least a portion of the unit cavities of the liquid-blocking cavity are interconnected or not interconnected.

6. The laser according to claim 5, characterized in that, The shell annular wall has at least one unit cavity opening, and each unit cavity opening is connected to at least one unit cavity.

7. The laser according to claim 6, characterized in that, At least one of the unit openings is arranged to surround the assembly chamber in a complete circle or less than a complete circle.

8. The laser according to claim 7, characterized in that, The housing annular wall has a unit cavity opening, which is arranged around the assembly chamber in a complete circle. The liquid-blocking cavity includes a plurality of unit cavities that are interconnected, and the unit cavity opening is connected to the plurality of unit cavities, thereby forming an annular groove in the housing annular wall. The annular groove is configured to form a liquid-blocking cavity inside the housing annular wall.

9. The laser according to claim 8, characterized in that, The orientation of the unit cavity opening of the liquid-blocking cavity is the same as the orientation of the cavity window of the assembly chamber.

10. The laser according to claim 8, characterized in that, The end wall of the housing ring is divided into an inner unit end wall and an outer unit end wall by the unit cavity of the liquid-blocking cavity. The inner unit end wall is located between the assembly chamber and the liquid-blocking cavity, and the liquid-blocking cavity is located between the inner unit end wall and the outer unit end wall. Wherein, the inner unit end wall and the outer unit end wall are in the same plane, or the inner unit end wall and the outer unit end wall are not in the same plane.