Laser unit for a rotary laser and rotary laser having the same

Abstract

Laser unit (130) for a rotary laser apparatus, having a laser module housing (210) in which a laser diode (135) for generating a laser beam and a collimator lens (230) for collimating the laser beam are arranged, the laser diode (135) being arranged on a flexible and foldable circuit board (300).

Description

Technical Field

[0001] The present invention relates to a laser unit for a rotating laser instrument, having a laser module housing in which a laser diode for generating a laser beam and a collimating lens for collimating the laser beam are arranged. Background Technology

[0002] A rotating laser instrument having such a laser unit is known from the prior art. The laser unit has a laser module housing in which a laser diode for generating a laser beam and a collimating lens for collimating the laser beam are arranged. Summary of the Invention

[0003] This invention relates to a laser unit for a rotating laser instrument, comprising a laser module housing in which a laser diode for generating a laser beam and a collimating lens for collimating the laser beam are arranged. The laser diode is mounted on a flexible and foldable circuit board.

[0004] Therefore, the present invention can provide a laser unit in which a simple and stable arrangement of laser diodes in a laser module housing can be achieved through a flexible and foldable circuit board.

[0005] Preferably, the flexible and foldable circuit board has a first circuit board section and a second circuit board section arranged perpendicular to or parallel to the first circuit board section.

[0006] Therefore, a circuit board that is ready to accommodate different components can be provided.

[0007] Preferably, the first circuit board section is configured to house laser diodes, and the second circuit board section is configured to house photodiodes.

[0008] Therefore, the flexible and foldable circuit board can be used simply and uncomplicatedly to arrange laser diodes and photodiodes.

[0009] Preferably, a laser diode holder is provided for arranging the laser diode in the laser module housing, wherein the laser diode holder is arranged in an internal receiving portion of the laser module housing.

[0010] Therefore, the arrangement of laser diodes in the laser module housing can be achieved in a simple way.

[0011] Preferably, the laser diode holder is movably arranged in the internal receiving portion of the laser module housing along the longitudinal extension direction of the laser module housing.

[0012] Therefore, it is possible to achieve precise and accurate placement of the laser diode holder in the laser module housing.

[0013] Preferably, the flexible and foldable circuit board is arranged on the laser diode holder.

[0014] Therefore, it is possible to achieve a safe and reliable arrangement of flexible and foldable circuit boards in the laser module housing.

[0015] Preferably, a photodiode is provided, which is arranged in a photodiode holder, and the photodiode holder is arranged on a laser diode holder.

[0016] Therefore, it is possible to achieve a simple and robust arrangement of the photodiode holder in the laser module housing.

[0017] Preferably, a third circuit board section is provided, arranged parallel to the first circuit board section.

[0018] Therefore, it is possible to realize an alternative configuration for flexible and foldable circuit boards to accommodate other components.

[0019] Preferably, the first circuit board segment or the third circuit board segment is connected to the contact element via a flexible connection segment.

[0020] Therefore, contact with the current supply and / or electronic units can be achieved easily and without complexity.

[0021] According to one embodiment, a receiving portion is constructed between the first circuit board segment and the third circuit board segment, and a spacer element is arranged in the receiving portion.

[0022] Therefore, a safe and reliable arrangement of the first circuit board section relative to the third circuit board section can be achieved.

[0023] Preferably, the first circuit board segment is fixed to the laser diode holder by means of a material-locking connection, the second circuit board segment is fixed to the photodiode holder by means of a material-locking connection, and / or the spacer element is fixed to the first circuit board segment and / or the third circuit board segment by means of a material-locking connection.

[0024] Therefore, the connection between the first circuit board segment and the laser diode holder, the second circuit board segment and the photodiode holder, and / or the spacer element and the first and / or third circuit board segment can be achieved in a simple manner.

[0025] Preferably, a shielding element is provided for the flexible and foldable circuit board.

[0026] Therefore, the electromagnetic compatibility of laser units can be improved simply and reliably.

[0027] Preferably, the flexible and foldable circuit board has a receiving area defined by lateral slats, and the shielding element has an internal receiving portion for placement within the receiving area of ​​the flexible and foldable circuit board.

[0028] Therefore, it is possible to achieve a safe and robust arrangement of shielding elements within the laser module housing.

[0029] Preferably, the shielding element is fixed to the flexible and foldable circuit board by means of material locking connection, snap-lock connection and / or compression connection.

[0030] Therefore, the shielding element can be fixed in a simple and reliable manner.

[0031] Furthermore, the present invention relates to a rotating laser device having the aforementioned laser unit.

[0032] Therefore, the present invention can provide a rotating laser with a laser unit, wherein the laser diode can be simply and safely arranged in the laser module housing by means of a flexible and foldable circuit board. Attached Figure Description

[0033] The invention will now be described in more detail with reference to the embodiments shown in the accompanying drawings. The drawings show: Figure 1 A perspective view of a rotating laser device with a laser unit according to the present invention. Figure 2 Figure 1 A schematic view of the laser unit in the diagram. Figure 3 Figure 1 and Figure 2 A schematic view of the circuit board to which the laser unit is attached. Figure 4 Figure 1 A schematic view of the first circuit to which the laser unit is attached. Figure 5 Figure 1 A schematic view of an alternative configuration of the laser unit in the image. Figure 6 Figure 1 An exploded stereo view of another configuration of the laser unit in the image. Figure 7 Figure 6 A cross-sectional view of the laser unit in the image. Figure 8 Figure 1 A schematic view of the second circuit associated with the laser unit in the diagram. Figure 9 Figure 6 and Figure 7 A three-dimensional view of the circuit board with laser diodes and photodiodes associated with the laser unit. Figure 10 from Figure 9 The direction of arrow 901 in the image is observed. Figure 9 A view of a circuit board containing a laser diode and a photodiode. Figure 11 Figure 1 A schematic view of an alternative configuration of the laser unit in the image. Figure 12 Figure 6 and Figure 7 A perspective view of an alternative circuit board with laser diodes and photodiodes associated with the laser unit in the image. Figure 13 Figure 12 Top view of the first side of the circuit board. Figure 14 Figure 12 and Figure 13 A top view of the second side of the circuit board. Figure 15 Figures 12 to 14 A perspective view of the circuit board in its installed state, including the fixing components. Figure 16 Figure 6 and Figure 7 The laser unit in the middle has Figures 12 to 15 A three-dimensional view of the circuit board in the image. Figure 17 Figure 16 A three-dimensional view of the laser unit with shielding elements arranged on the circuit board. Figure 18 Figure 17 The laser unit in the image includes a three-dimensional view of the circuit board and a three-dimensional view of the shielding components. Figure 19 Figure 18 A cross-sectional view of the laser unit in the image. Detailed Implementation

[0034] In the accompanying drawings, elements that have the same or comparable functions are labeled with the same reference numerals and are described in detail only once.

[0035] Figure 1 An exemplary rotating laser device 100 is shown, which has a laser housing 110 in which a laser unit 130 is arranged, the laser unit 130 having functions for generating a laser beam. Figure 2The laser diode 135 (251) is also referred to in this invention. In the context of this invention, "rotating laser" can also be understood as a building laser or a leveling laser. Furthermore, a drive unit 120 for rotatably driving the drive shaft 125 is exemplary arranged in the laser housing 110.

[0036] The laser unit 130 is illustrated as being arranged on the drive shaft 125 such that, through the rotation of the drive shaft 125, the laser beam generated by the laser unit 130 ( Figure 2 (251) rotates in the associated plane. For this purpose, drive shaft 125 is preferably equipped with a rotating head 160, which has a beam deflector 165. Beam deflector 165 is preferably configured to deflect the laser beam ( Figure 2 254 in the middle), thus the laser beam ( Figure 2 (254) projects the associated plane. Alternatively, the beam deflector 165 is configured as a beam splitter, thereby projecting a beam along the laser axis in addition to the projected plane. Figure 2 (254) emits a laser beam perpendicular to the laser plane. Depending on the configuration of the rotating laser device 100, the projected plane can be horizontal, vertical, or, for example, tilted at a defined angle relative to the Earth's surface. The drive unit 120 is preferably configured as an electric motor.

[0037] Furthermore, an electronic unit 190 with an adjustment and monitoring device 195 is preferably arranged in the laser housing 110. The adjustment and monitoring device 195 is preferably configured to adjust the laser power of the laser unit 130 according to the operating mode. Here, the rotational speed of the drive shaft 125 of the drive unit 120 is controlled or adjusted. For this purpose, the drive shaft 125 is preferably equipped with a calculation unit 170.

[0038] According to one embodiment, the laser housing 110 is provided with a protective cover 112 attached to the rotating head 160 to prevent the rotating head 160 from being impacted.

[0039] The electronic unit 190 preferably includes an operation unit 150, which has a display 151 and / or an input unit 152. The operation unit 150 is preferably connected to the electronic unit 190, particularly to the adjustment and monitoring device 195, in terms of control or regulation technology. The input unit 152 preferably includes at least one keyboard. In a minimal configuration, the input unit 152 has only one on / off switch, particularly an on / off button. Alternatively, the input unit 152 has a knob, touchscreen, slider, remote control, etc. Through the input unit 152, the user can, for example, input the rotational speed of the drive shaft 125. Alternatively, the rotational speed of the laser unit 130 can be automatically adjusted in an operating mode.

[0040] Preferably, the rotating laser device 100 has a leveling unit 180. The leveling unit 180 preferably has at least one tilt sensor 184 configured to determine the tilt of the rotating head 160, particularly the beam deflector 165, and / or the laser unit 130, relative to a predetermined, preferably horizontal, direction or relative to a vertical line. Furthermore, the leveling unit 180 preferably has at least one tilt adjustment motor 182 configured to, based on the orientation (Lage) determined by means of the at least one tilt sensor 184, preferably align the rotating head 160, particularly the beam deflector 165, and / or the laser unit 130 relative to a vertical line, preferably where the orientation is the tilt of the laser unit 130 and / or the rotating head 160.

[0041] Figure 2 It shows Figure 1 An exemplary configuration of the laser unit 130 of the rotating laser instrument 100 is shown. The laser unit 130 is schematically provided with a laser module housing 210, in which a laser diode 135 for generating a laser beam 251 and a collimating lens 230 for collimating the laser beam 251 are arranged. A monitoring diode 299 is provided with the laser diode 135. The monitoring diode 299 is configured to measure the laser power associated with the laser diode 135. According to one embodiment, the monitoring diode 299 is a monitoring diode integrated into the laser diode 135. Such a laser diode 135 with an integrated monitoring diode 299 is well known from the prior art, and therefore will not be described further here for the sake of simplicity.

[0042] According to the present invention, the laser unit 130 has a photodiode 260 configured to measure laser power independently of the monitoring diode 299.

[0043] Preferably, the laser diode 135 is provided with a laser diode holding element 295. Figure 6 In the 660), photodiode 260 is provided with photodiode holding element 265 ( Figure 6 The collimating lens 230 (622) and / or the collimating lens 230 are provided with a collimating lens holder 220. The collimating lens holder 220 is arranged in the internal receiving portion 212 of the laser module housing 210. The internal receiving portion 212 is oriented along the longitudinal extension direction 201 of the preferably cylindrical laser module housing 210. Furthermore, the internal receiving portion 212 is preferably arranged collinearly with the optical axis 232 of the collimating lens 230.

[0044] Preferably, the distance 290 between the laser diode 135 and the collimating lens 230 is variable. For this purpose, the collimating lens holder 220 is preferably movably arranged in the internal receiving portion 212 along the longitudinal extension direction 201 of the laser module housing 210. The collimating lens 230 is preferably provided with an aperture 240.

[0045] As illustrated, the internal receiving portion 212 has a lower receiving region 213, which widens to an upper receiving region 214 via a bottom surface 215. Exemplarily, an illustrated lower segment 221 of the collimating lens holder 220 is disposed in the lower receiving region 213 of the internal receiving portion 212, and an illustrated upper segment 222 of the collimating lens holder 220 is preferably disposed in the upper receiving region 214 of the internal receiving portion 212. Here, the bottom side 225 of the upper segment 222 of the collimating lens holder 220 is illustratedly disposed on the bottom surface 215 of the upper receiving region 214. The upper segment 222 of the collimating lens holder 220 exemplaryly has a lens receiving portion 223 in which a collimating lens 230 is disposed.

[0046] The collimating lens 230 is illustrated to have an optical axis 232. The laser beam 251 is collimated along the optical axis 232. The optical axis 232 is preferably arranged parallel to the longitudinal extension direction 201 of the laser module housing 210 within a pre-given tolerance. In the context of this invention, the optical axis 232 should be understood as a straight line passing through the center, particularly the center of curvature of the optical device (here, the lens or collimating lens 230).

[0047] according to Figure 2 The laser unit 130 has a beam splitter 270 that preferably splits the laser beam 251 emitted by the laser diode 135 into two outgoing laser beams 252 and 253. For this purpose, the laser diode 135 is arranged on the incident side 271 of the beam splitter 270. A photodiode 260 is preferably arranged on one outgoing side 272 of the beam splitter 270. A collimating lens 230 is preferably arranged on the other outgoing side 273 of the beam splitter 270.

[0048] The laser module housing 210 preferably has a receiving portion 211, which constitutes a laser diode holder 295 for accommodating a laser diode 135 and a photodiode holder 265 for accommodating a photodiode 260. The receiving portion 211 is preferably arranged along the transverse direction 202 of the laser module housing 210, which is perpendicular to the longitudinal extension direction 201 of the laser module housing 210. The beam splitter 270 is also preferably arranged in the receiving portion 211.

[0049] As illustrated, laser diode 135 is arranged on the right side of beam splitter 270, while photodiode 260 is arranged on the left side of beam splitter 270. Therefore, laser diode 135 and photodiode 260 are illustratedly offset from each other by 180°, or opposite each other, on beam splitter 270. Alternatively, laser diode 135 can also be illustratedly arranged on the left side of beam splitter 270, while photodiode 260 can be exemplarily arranged on the right side of beam splitter 270. Alternatively, laser diode 135 and photodiode 260 can also be arranged at different angles to each other, for example, offset from each other by 90°.

[0050] The laser beam 251 is schematically split into an output laser beam 252 directed toward the photodiode 260 and an output laser beam 253 directed toward the collimating lens 230. The laser beam 253 is collimated, or collected or focused, into a collimated laser beam 254 by the collimating lens 230. Here, the light rays of the laser beam 253 are substantially aligned parallel by the collimating lens 230, so that they spread only to a minimum during propagation.

[0051] Figure 3 It shows Figure 1 and Figure 2 The circuit board 300 associated with the laser unit 130. Preferably, the circuit board 300 has the following components arranged on it: Figure 1 and Figure 2 Laser diode 135 and Figure 2 The photodiode 260 is included. Circuit portions 310 are preferably arranged on the circuit board 300. As illustrated, three circuit portions 310 are arranged on the circuit board 300. However, it should be noted that the circuit board 300 can have any number of circuit portions 310.

[0052] According to one embodiment, the circuit board 300 is constructed as a flexible and foldable circuit board. Here, the segments of the circuit board 300 can be arranged at a predetermined angle or parallel to each other.

[0053] Figure 4 It shows Figure 1 The circuit 400 associated with the laser unit 130. The circuit 400 preferably includes an automatic power adjustment circuit 410 associated with at least one laser diode 135 and a corresponding photodiode, for example... Figure 2 The protection circuit 420 associated with the photodiode 260 in the circuit.

[0054] The laser diode 135 is illustrated as being connected to the automatic power adjustment circuit 410 via a connector 421. The automatic power adjustment circuit 410 is preferably configured based on a monitoring diode associated with the laser diode 135, for example... Figure 2The monitoring diode 299 measures the laser power to automatically adjust the laser power of the laser diode 135. The connection 421 is preferably bidirectional. This automatic power adjustment circuit 410 is well known from the prior art and will not be described in detail. The automatic power adjustment circuit 410 is schematically constructed as an integral regulator.

[0055] The laser beam emitted by laser diode 135 is also guided to photodiode 260, as visualized by arrow 402. In another configuration, arrow 402 may also visualize or include stray light. Photodiode 260 is preferably connected to protection circuit 420 via connection 422. Connection 422 is preferably unidirectional. The photocurrent obtained by photodiode 260 is preferably transmitted to protection circuit 420 via connection 422.

[0056] As described above, photodiode 260 is configured to be independent of Figure 2 The monitoring diode 299 measures the laser power. The protection circuit 420 is preferably connected to the automatic power adjustment circuit 410 via the control line 423, and if the laser power measured by the photodiode 260 exceeds a predetermined laser power limit, the automatic power adjustment circuit 410 can be deactivated via the control line 423.

[0057] Furthermore, other circuit components 430 are preferably connected to the protection circuit 420 via a connection portion 425. Preferably, other circuit components 430 are connected to the automatic power regulation circuit 410 via a connection portion 424. Other circuit components 430 include, for example, current / voltage sources and / or control units, particularly... Figure 1 Rotating laser 100 Figure 1 The electronic unit 190 in it.

[0058] The adjustment of the laser power is preferably based on comparing the laser power measured by the monitoring diode 299 with a pre-defined laser power rating. The laser power rating is here less than the laser power limit of the protection circuit 420. The laser power rating and the laser power limit are configured, for example, by the control circuitry associated with circuit section 430, and are preferably variable.

[0059] Figure 5 It shows Figure 1 An alternative configuration of the laser unit 130 includes a laser diode 135, a photodiode 260, and a collimating lens 230. Similar to... Figure 2 The collimating lens holder 220 is arranged in the upper receiving area 214 of the internal receiving portion 212 shown in the figure.

[0060] according to Figure 5 The collimating lens holder 220 only has Figure 2The upper section 222 of the collimating lens holder 220. Preferably, the bottom side 225 of the upper section 222 of the collimating lens holder 220 abuts against the bottom surface 215 of the upper receiving region 214. Here, the collimating lens holder 220 is preferably fixed, that is, immovably arranged in the inner receiving portion 212.

[0061] The laser diode holder 295 of the laser diode 135 is illustrated to have a base 510 with an internal receiving portion 511 in which the laser diode 135 is disposed. The laser diode holder 295 is preferably disposed in a receiving portion 502 of the laser module housing 210. The receiving portion 502 is preferably arranged collinearly with the optical axis 232 of the collimating lens 230. Here, the center point of the receiving portion 502 is located on the optical axis 232. According to one embodiment, the laser diode holder 295 is movably disposed in the receiving portion 502 along the longitudinal extension direction 201 of the laser module housing 210 to adjust the distance 290 between the laser diode 135 and the collimating lens 230.

[0062] Furthermore, the laser module housing 210 exemplarily has a receiving portion 501, which is arranged perpendicular to the receiving portion 502 of the laser diode holder 295 within a predetermined tolerance. Here, the receiving portion 501 is illustrated as being arranged perpendicular to the internal receiving portion 212 of the laser module housing 210 within a predetermined tolerance. The receiving portion 501 is exemplarily constructed in the lower section 213 of the internal receiving portion 212 of the laser module housing 210. The receiving portion 501 exemplarily constitutes the photodiode holder 265.

[0063] The receiving portion 501, or photodiode holder 265, is schematically arranged spaced apart from the receiving portion 502 of the laser diode holder 295 along the longitudinal extension direction 201 of the laser module housing 210. Here, the receiving portion 501 is preferably arranged along the radiation characteristics of the laser diode 135 (…). Figure 9 The direction of maximum divergence of 911 in ( Figure 9 (922) Arrangement. The photocurrent associated with the photodiode 260 is preferably derived from the stray light of the laser diode 135, which is generated by the divergence of the uncollimated laser beam 253 of the laser diode 135.

[0064] The laser diode 135 and the photodiode 260 can be arranged on separate circuit boards. Here, the circuit board is preferably constructed as a rigid or flexible circuit board.

[0065] Figure 6 It shows Figure 1Another configuration of the laser unit 130 is shown, in which the laser diode 135 and the photodiode 260 are exemplarily arranged on a common circuit board 300. As described above, the circuit board 300 is preferably constructed as a flexible and foldable circuit board.

[0066] As illustrated, the circuit board 300 has at least one first circuit board segment 611 and one second circuit board segment 610. The second circuit board segment 610 is preferably constructed as a stamped and bent piece. The second circuit board segment 610 is exemplarily arranged approximately perpendicular to the first circuit board segment 611. Here, the first circuit board segment 611 preferably forms the bottom segment 611, while the second circuit board segment 610 forms the wall segment 610. A laser diode 135 is preferably disposed on the first circuit board segment 611, or the bottom segment 611, while a photodiode 135 is disposed on the second circuit board segment 610, or the wall segment 610.

[0067] The first circuit board segment 611 is preferably provided with contact elements 625. The contact elements 625 are used to make electrical contact between the circuit board 300 and at least one power source.

[0068] The photodiode 260, particularly the second circuit board section 610, is preferably provided with a photodiode holder 622. The laser diode 135 is preferably provided with a laser diode holder 660. The laser diode holder 660 is configured to arrange the laser diode 135 within the laser module housing 210. Here, the laser diode holder 660 is preferably arranged within an internal receiving portion 643 of the laser module housing 210.

[0069] The laser diode holder 660 is illustrated to have a cylindrical base 635 with an internal receiving portion 636. Furthermore, the cylindrical base 635 exemplarily has a receiving portion 631 on its outer periphery, the receiving portion 631 having a groove (…). Figure 7 721) is used to arrange the photodiode 260 in the internal receiving portion 636 of the laser diode holder 660. On its side opposite to the laser module housing 210, the laser diode holder 660 schematically has a peripheral flange 637. The peripheral flange 637 exemplarily has a groove 632 associated with the receiving portion 631, which is configured to arrange the photodiode holder 622 in the receiving portion 631.

[0070] The laser module housing 210 preferably has a cylindrical base 641 with an internal receiving portion 643 for outputting laser light generated and collimated by the laser diode 135. Figure 2 and Figure 5 The laser beam 254 is located within the internal housing 643. Figure 2The aperture 240 in the middle has a function. The laser module housing 210 preferably has a peripheral flange 642 facing the laser diode 135.

[0071] A flexible and foldable circuit board 300 is exemplarily arranged on a laser diode holder 660. For this purpose, the first circuit board segment 611 is preferably arranged on the peripheral flange 637 such that the laser diode 135 is arranged in the internal receiving portion 636 of the laser diode holder 660. When the laser diode 135 is arranged in the internal receiving portion 636, the second circuit board segment 610 and the photodiode holder 622 are not arranged perpendicular to the first circuit board segment 611. Thus, the second circuit board segment 610 can be bent through the groove 632 and arranged in the receiving portion 631 of the laser diode holder 660. The photodiode holder 622 is preferably fixed to the laser diode holder 660, and preferably fixed to the receiving portion 631 of the laser diode holder 660. By bending, the second circuit board segment 610 is arranged approximately perpendicular to the first circuit board segment 611, such that the photodiode 260 is similar to... Figure 5 The laser beam 253 is basically perpendicular to the laser diode 135. Figure 2 and Figure 5 The launch direction is arranged at 601.

[0072] The collimating lens 230 is preferably arranged and fixed in the internal receiving portion 643 of the laser module housing 210. A laser diode holder 660, which includes the circuit board 300, the laser diode 135, and the photodiode 260, is also arranged in the internal receiving portion 643. For this purpose, the laser diode holder 660 is, for example, pressed into the internal receiving portion 643 of the laser module housing 210.

[0073] Figure 7 It shows Figure 6 The laser unit 130 is shown in its installed state. Here, the collimating lens 230 is preferably arranged in the upper receiving section 711 of the internal receiving portion 643 of the illustrated laser module housing 210 and is preferably fixed. The receiving section 711 here constitutes the collimating lens holder 220. The collimating lens 230 is preferably fixed in the internal receiving portion 643, or the receiving section 711, by means of a material-locking connection, particularly an adhesive connection, and / or a press-fit connection.

[0074] Furthermore, as described above, the cylindrical base 635 of the laser diode holder 660 is arranged in the inner receiving portion 643, particularly in a lower receiving section 712 shown in the figure. Preferably, a clamping connection is at least sectionally constructed between the outer periphery 713 of the cylindrical base 635 and the receiving section 712. Alternatively, the cylindrical base 635 can be fixed in the inner receiving portion 643, or the receiving section 712, by a material-locking connection.

[0075] Furthermore, the first circuit board segment 611 of the flexible and foldable circuit board 300 is preferably fixed to the laser diode holder 660. The first circuit board segment 611 is preferably fixed to the laser diode holder 660 by means of a material-locking connection 1898. The material-locking connection 1898 is preferably constructed between the upper side 732 of the first circuit board segment 611 of the flexible and foldable circuit board 300 facing the laser diode holder 660 and the lower side 731 of the peripheral flange 637 of the laser diode holder 660 facing the first circuit board segment 611.

[0076] Furthermore, the second circuit board segment 610 of the flexible and foldable circuit board 300 is preferably fixed to the photodiode holder 622 by means of a material-locking connection 1899. Specifically, the side 735 of the second circuit board segment 610 facing away from the photodiode 260 is illustratedly fixed to the side 736 of the photodiode holder 622 facing the second circuit board segment 610 by means of a material-locking connection 1899. The photodiode holder 622 is preferably fixed in the internal receiving portion 643 by a press-fit, preferably in the lower receiving segment 712 of the illustrated laser module housing 210. According to one embodiment, at least one material-locking connection 1898, 1899 is an adhesive connection.

[0077] also, Figure 7 The diagram shows a laser diode holder 660 with a cylindrical base 635 having a receiving portion 631 on its outer periphery. The receiving portion 631 preferably has a groove 721 for arranging a photodiode 260 within the internal receiving portion 636 of the laser diode holder 660. The groove 721 is preferably arranged perpendicular to the receiving portion 631 within a predetermined tolerance.

[0078] Figure 8 It shows Figure 2 or Figures 5 to 7 An exemplary circuit 800 associated with the laser unit 130. Similar to... Figure 4The circuits 400 and 800 in the circuit exemplarily include a protection circuit 420 associated with the photodiode 260, which is connected to other circuit parts 430 via a connection portion 425, and an automatic power adjustment circuit 410 associated with the laser diode 135, which is connected to other circuit parts 430 via a connection portion 424. As described above, the other circuit parts 430 include, for example, current / voltage sources and / or control units, particularly... Figure 1 Rotating laser 100 Figure 1 The electronic unit 190 in it.

[0079] Photodiode 260 is illustrated to be optically coupled to laser diode 135 via stray light 811 associated with laser diode 135. Alternatively, a beam splitter, for example... Figure 2 The beam splitter 270 or Figure 2 Optical coupling is performed on the output side 272 of the beam splitter 270. The automatic power adjustment circuit 410 measures the laser power using the photocurrent of the monitoring diode 299 integrated in the laser diode 135 and adjusts the current supply to the laser diode 260. The protection circuit 420 measures the laser power using the photocurrent of the photodiode 260.

[0080] The protection circuit 420 is preferably configured such that if the laser power measured by the photodiode 260 exceeds a predetermined laser power limit, the current supply 813 to the laser diode 135 is interrupted, and the laser diode 135 is deactivated via the control circuit 812. Alternatively, the protection circuit 420 deactivates the automatic power adjustment circuit 410 via the associated control circuit, as in... Figure 4 As described in [the text].

[0081] Figure 9 It shows Figure 6 and Figure 7 The flexible and foldable circuit board 300 includes a first circuit board segment 611 on which a laser diode 135 is disposed, and a second circuit board segment 610, illustrated as being perpendicular to the first circuit board segment 611, on which a photodiode 260 and a photodiode holder 622 are disposed. The laser diode 135 preferably has a radiation characteristic 911 with divergence, i.e., broadening of the laser beam 253 over a defined distance, the laser beam having an elliptical cross-section 920. The divergence of the laser beam 253 emitted by the laser diode 135 is preferably configured perpendicular to the optical axis 912 of the laser beam 253.

[0082] Due to the elliptical cross-section, the divergence preferably has a relatively small value in the first direction 921 extending perpendicular to the optical axis 912, while it preferably has a relatively large value in the second direction 922, which is arranged perpendicular to both the optical axis 912 and the first direction 921. To couple stray light 811 into the photodiode 260 as well as possible, the photodiode 260 is therefore preferably positioned substantially / approximately along the direction 922, which has the greatest divergence relative to the laser diode 135.

[0083] Knowing the divergence of laser diode 135, the appropriate positions of photodiode 260 relative to the optical axis 912 of the laser beam 253 of laser diode 135 in the radial direction 902 and axial direction 903 can be determined. This position allows the protection circuit 420 to perform laser power measurement with a sufficient signal-to-noise ratio, while eliminating the interference between photodiode 260 and the laser beam 253 of laser diode 135. Figures 5 to 7 The optical path between the laser diode 135 and the collimating lens 230 is blocked.

[0084] Figure 10 It shows from Figure 9 The arrangement of the photodiode 260 relative to the laser diode 135, viewed in the direction of arrow 901, clarifies the radiation characteristics 911 of the laser diode 135. This clarifies the elliptical cross-section 920 and the first direction 921, preferably with minimum divergence, and the second direction 922, preferably with maximum divergence. As described above, the photodiode 260 is preferably arranged substantially / approximately in the direction of maximum divergence 922.

[0085] Figure 11 It shows Figure 2 The laser unit 130 has an alternative configuration with a collimating lens holder 220. The collimating lens holder 220 preferably has only a lens receiving portion 223 in which the collimating lens 230 is disposed. The outer periphery 1105 of the collimating lens holder 220 is preferably disposed in an internal receiving portion 212 of the laser module housing 210. Here, the collimating lens holder 220 is illustrated to be movably disposed in the internal receiving portion 212 of the laser module housing 210 along the longitudinal extension direction 201 of the laser module housing 210 to adjust the distance 290 between the laser diode 135 and the collimating lens 230.

[0086] Figure 12 It shows Figure 3The flexible and foldable circuit board 300 is shown in its unfolded state, viewed from the top 1201 of the circuit board 300. The circuit board has a first circuit board segment 611 and a second circuit board segment 610 with a photodiode 260. A laser diode 135 is arranged on the first circuit board segment. Here, the second circuit board segment 610 is illustrated to be arranged in the same plane 1290 as the first circuit board segment 611.

[0087] As illustrated, a third circuit board segment 1220 is provided, which can be arranged parallel to the first circuit board segment 611. As illustrated, the third circuit board segment 1220 is also arranged in plane 1290. The third circuit board segment 1220 is preferably connected to the first circuit board segment 611 via a connecting segment 1230.

[0088] Preferably, the first circuit board segment 611 or the third circuit board segment 1220 is connected to the contact element 1210 via a flexible connecting segment 1240. Illustrated, the third circuit board segment 1220 is connected to the contact element 1210 via the flexible connecting segment 1240. The contact element 1210 is preferably constructed only on the upper side 1201 of the circuit board 300.

[0089] Figure 13 It shows from Figure 12 The flexible and foldable circuit board 300, viewed from the upper side 1201, is located in plane 1290. Preferably, the first circuit board segment 611, the third circuit board segment 1220, and / or the contact element 1210 have reinforcing elements 1310, 1320, and 1340. Illustrated, the first circuit board segment 611 is provided with reinforcing element 1310, the third circuit board segment 1220 is provided with reinforcing element 1320, and the contact element 1210 is provided with reinforcing element 1340.

[0090] For example, the first circuit board segment 611 is at least segmentally provided with fixing elements 1350 for use with... Figure 6 and Figure 7 The laser diode holder 660 forms a material-locking connection 1898. The fixing element 1350 is preferably double-sided adhesive tape.

[0091] Figure 14 It shows from and Figure 12 and Figure 13 Viewed from the upper side 1201 opposite the lower side 1401 in plane 1290 Figure 12 and Figure 13The circuit board 300 is flexible and foldable. The first circuit board segment 611 and / or the third circuit board segment 1220 preferably have electrical components 1420 and 1430 on the lower side 1401. As illustrated, electrical component 1420 is associated with the first circuit board segment 611, and electrical component 1430 is associated with the third circuit board segment 1220.

[0092] The second circuit board segment 610 is preferably provided with reinforcing elements 1450. The second circuit board segment 610 is preferably at least segmentally provided with fixing elements 1410 for use with… Figure 6 and Figure 7 The photodiode holder 622 forms a material-locking connection 1899. The fixing element 1410 is preferably double-sided tape.

[0093] Figure 15 It shows Figures 12 to 14 The diagram shows a flexible and foldable circuit board 300 in its folded state, in which the second circuit board segment 610 is arranged at least approximately perpendicular to the first circuit board segment 611, and the third circuit board segment 1220 is arranged at least approximately parallel to the first circuit board segment 611. Furthermore, the flexible connecting segment 1240 is folded. Figure 15 The fixing element 1350 associated with the first circuit board section 611 and the fixing element 1410 associated with the second circuit board section 610 are shown.

[0094] The first and third circuit board sections 611 and 1220 preferably constitute a receiving portion 1510. The receiving portion 1510 is preferably constructed in a sandwich manner. Spacer elements can preferably be arranged in the receiving portion 1510. Figure 16 (1610 in the example). Exemplarily, the first and / or third circuit board segments 611, 1220 are at least segmentally provided with fixing elements 1520, 1530 for forming a material-locking connection ( Figure 16 (1896, 1897).

[0095] Figure 16 It shows Figure 6 and Figure 7 The laser unit 130 in the middle has Figures 12 to 15The circuit board 300 is flexible and foldable. A spacer element 1610 is arranged in the receiving portion 1510 constructed between the first and third circuit board sections 611 and 1220. The bending radius of the connecting section 1230 of the circuit board 300 can be controlled by the spacer element 1610, particularly by its sufficient thickness. Furthermore, the spacer element 1610 serves as electrical insulation to prevent short circuits between the first and third circuit board sections 611 and 1220. Simultaneously, the components 1420 and 1430 arranged on the first and / or third circuit board sections 611 and 1220 are also mechanically protected.

[0096] The spacer element 1610 is preferably fixed to the first circuit board segment 611 and / or the third circuit board segment 1220 by means of material-locking connections 1897, 1896. The material-locking connections 1897, 1896 are preferably adhesive connections, wherein the fixing element 1520 associated with the first circuit board segment 611 and / or the fixing element 1530 associated with the third circuit board segment 1220 forms corresponding adhesive connections 1896, 1897 with the spacer element 1610. The spacer element 1610 is preferably made of a non-conductive material.

[0097] The spacer element 1610 preferably has a soft material. Exemplarily, the spacer element 1610 has a foam material, rubber, or felt. Alternatively, the spacer element 1610 is an injection molded part.

[0098] also, Figure 16 The connection 1898 of the first circuit board segment 611 to the laser diode holder 660 via an exemplary fixing element 1350 is shown.

[0099] Figure 17 It shows Figure 16 The laser unit 130 is shown. As illustrated, a flexible and foldable circuit board 300 is provided with shielding elements 1700. The shielding elements 1700 are preferably fixed to the flexible and foldable circuit board 300 by means of material-locking connections, snap-locking connections, and / or compression connections. The shielding elements 1700 are preferably arranged on the flexible connection section 1240.

[0100] The shielding element 1700 preferably has ferrite. The shielding element 1700 is configured to improve the electromagnetic compatibility of the laser unit 130.

[0101] Figure 18 It shows Figure 17The laser unit 130 is shown in the diagram, with the shielding element 1700 arranged beside the flexible connection section 1240. The flexible and foldable circuit board 300 preferably has receiving areas 1815, 1816, which are preferably defined by lateral strips 1811, 1812, 1813, 1814. Exemplarily, the shielding element 1700 has an internal receiving portion 1831 for arrangement in the receiving areas 1815, 1816 of the flexible and foldable circuit board 300.

[0102] As illustrated, the contact element 1210 has a width 1821, which extends through at least one ramp-shaped strip 1813, 1814, and illustratedly through two opposing ramp-shaped strips 1813, 1814, to the width 1822 of the receiving areas 1815, 1816. The two ramp-shaped strips 1813, 1814 preferably form a locking function with an abutment edge 1818. The abutment edge 1818 preferably prevents the shielding element 1700 from slipping off the receiving areas 1815, 1816 of the circuit board 300.

[0103] Preferably, at least one slat, illustrated floor slats 1811 and 1812, is constructed as a protrusion and forms a stop function. The slats 1811, 1812, 1813, and 1814 preferably have a width greater than the width 1822 constructed between the receiving regions 1815 and 1816. Alternatively or optionally, a compression fit is constructed between the receiving regions 1815 and 1816 and the internal receiving portion 1831 of the shielding element 1700 due to the excessive size of the receiving regions 1815 and 1816.

[0104] The shielding element 1700 is preferably pushed onto the circuit board 300 in the area of ​​the contact element 1210 during installation and arranged in the receiving areas 1815 and 1816 by ramp-shaped strips 1813 and 1814.

[0105] Figure 19 It shows Figure 17 and Figure 18 The laser unit 130 includes a shielding element 1700 located on a flexible connection section 1240 of a flexible and foldable circuit board 300. Furthermore, Figure 19 Material-locking connections 1896, 1897, 1898, and 1899 are illustrated, which are exemplarily constructed using fastening elements, particularly adhesive elements 1520, 1530, 1350, and 1410. The fastening elements 1520, 1530, 1350, and 1410 are preferably constructed as adhesive elements. It should be noted that the material-locking connections 1896, 1897, 1898, and 1899 can also be constructed as welded connections or similar connections.

[0106] Alternatively, the flexible and foldable circuit board 300, or the first circuit board segment 611, is secured to the laser diode holder 660 by welding the laser diode 135, which is pressed into the laser diode holder 660, to the first circuit board segment 611.

Claims

1. A laser unit (130) for a rotating laser instrument (100), comprising a laser module housing (210) in which a laser diode (135) for generating a laser beam (251) and a collimating lens (230) for collimating the laser beam (251) are arranged, characterized in that, The laser diode (135) is arranged on a flexible and foldable circuit board (300).

2. The laser unit according to claim 1, characterized in that, The flexible and foldable circuit board (300) has a first circuit board section (611) and a second circuit board section (610) arranged perpendicular to or parallel to the first circuit board section (611).

3. The laser unit according to claim 2, characterized in that, The first circuit board section (611) is configured to accommodate a laser diode (135), and the second circuit board section (610) is configured to accommodate a photodiode (260).

4. The laser unit according to any one of the preceding claims, characterized in that, A laser diode holder (660) is provided for arranging the laser diode (135) in the laser module housing (210), wherein the laser diode holder (660) is arranged in an internal receiving portion (643) of the laser module housing (210).

5. The laser unit according to claim 4, characterized in that, The laser diode holder (660) is movably arranged in the internal receiving portion (643) of the laser module housing (210) along the longitudinal extension direction (201) of the laser module housing (210).

6. The laser unit according to claim 4 or 5, characterized in that, The flexible and foldable circuit board (300) is arranged on the laser diode holder (660).

7. The laser unit according to any one of claims 4 to 6, characterized in that, A photodiode (260) is provided, the photodiode being arranged in a photodiode holder (622), the photodiode holder (622) being arranged on the laser diode holder (660).

8. The laser unit according to any one of claims 2 to 7, characterized in that, A third circuit board section (1220) is arranged parallel to the first circuit board section (611).

9. The laser unit according to any one of claims 2 to 8, characterized in that, The first circuit board segment (611) or the third circuit board segment (1220) is connected to the contact element (1210) via a flexible connection segment (1240).

10. The laser unit according to any one of claims 2 to 9, characterized in that, A receiving portion (1510) is constructed between the first circuit board section and the third circuit board section (611, 1220), and a spacer element (1610) is arranged in the receiving portion (1510).

11. The laser unit according to any one of claims 2 to 10, characterized in that, The first circuit board segment (611) is fixed to the laser diode holder (660) by means of a material-locking connection (1898), the second circuit board segment (610) is fixed to the photodiode holder (622) by means of a material-locking connection (1899), and / or the spacer element (1610) is fixed to the first circuit board segment (611) and / or the third circuit board segment (1220) by means of a material-locking connection (1897, 1896).

12. The laser unit according to any one of the preceding claims, characterized in that, A shielding element (1700) is applied to the flexible and foldable circuit board (300).

13. The laser unit according to claim 12, characterized in that, The flexible and foldable circuit board (300) has receiving areas (1815, 1816) defined by lateral strips (1811, 1812, 1813, 1814), and the shielding element (1700) has an internal receiving portion (1831) for placement in the receiving areas (1815, 1816) of the flexible and foldable circuit board (300).

14. The laser unit according to claim 12 or 13, characterized in that, The shielding element (1700) is fixed to the flexible and foldable circuit board (300) by means of material locking connection, snap-lock connection and / or compression connection.

15. A rotating laser device (100) having a laser unit (130) according to any one of the preceding claims.

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