Electronic device

Abstract

The application provides an electronic device, which comprises a receiving coil, a conductive structure and an auxiliary layer arranged on the surface of the conductive structure, the receiving coil is used for converting an alternating field generated by a transmitting coil of a wireless charging device into an alternating current to charge the electronic device, and the conductivity of the auxiliary layer is greater than that of the conductive structure. The auxiliary layer is arranged on the conductive structure close to the wireless charging alternating magnetic field, and the conductivity of the auxiliary layer is relatively large, so that the alternating magnetic field can form a relatively large and reversed magnetic field on the auxiliary layer, and the magnetic fields are superposed and offset to weaken the magnetic field reaching the conductive structure, thereby reducing the loss on the conductive structure. In addition, since the auxiliary layer is a film layer structure, compared with other structures capable of generating a reversed magnetic field, the thickness is relatively thin, which is beneficial to the light and thin setting of the electronic device.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more particularly to an electronic device. Background Technology

[0002] Because wireless charging is safer, more reliable, and more convenient than wired charging, more and more electronic devices, such as mobile phones, tablets, and smartwatches, are adopting wireless charging technology.

[0003] Existing wireless charging technologies generally use the principle of electromagnetic coupling to achieve power transmission. That is, the alternating current carried by the transmitting coil in the charging device generates a changing magnetic field, and the receiving coil in the receiving device generates an induced current in the changing magnetic field, thereby achieving charging of the receiving device.

[0004] However, one or more components in the receiving device may also sense the magnetic field and generate induced current (i.e., eddy current effect), which in turn causes eddy current loss and reduces the charging efficiency of the receiving device. Summary of the Invention

[0005] To address the aforementioned technical problems, this application provides an electronic device that can reduce the magnetic field reaching one or more components, decrease eddy current losses on those components, and improve the charging efficiency of the receiving device.

[0006] This application provides an electronic device, which includes: a receiving coil, a conductive structure, and an auxiliary layer disposed on the surface of the conductive structure. The receiving coil is used to convert the alternating field generated by the transmitting coil of a wireless charging device into alternating current to charge the electronic device. The conductivity of the auxiliary layer is greater than that of the conductive structure.

[0007] An auxiliary layer is placed on the conductive structure near the alternating magnetic field of wireless charging. The conductivity of the auxiliary layer is greater than that of the conductive structure. Therefore, the alternating magnetic field can form a larger and opposite magnetic field on the auxiliary layer. The superposition of these magnetic fields cancels each other out, weakening the magnetic field reaching the conductive structure and thus reducing eddy current losses on the conductive structure. Furthermore, since the auxiliary layer is a film structure, it is thinner than other structures that can generate opposite magnetic fields, which is beneficial for the miniaturization of electronic devices.

[0008] For example, the conductive structure can be any structure in an electronic device that can sense the changing magnetic field generated by the wireless charging transmitter and generate an induced current (i.e., generate an eddy current effect) and affect wireless charging, including but not limited to camera decorations in mobile phones or support structures in smartwatches.

[0009] For example, the electronic device may be a wireless charging receiver as described below.

[0010] In some possible implementations, the auxiliary layer includes multiple auxiliary blocks.

[0011] This configuration further reduces eddy current losses. Because a complete auxiliary layer forms a large loop, it generates relatively large eddy currents, and the central part of the auxiliary layer may lack eddy currents to shield and weaken the AC magnetic field generated by the transmitting coil. By including multiple auxiliary blocks, the auxiliary layer becomes discontinuous, allowing each auxiliary block to generate small eddy currents to weaken the magnetic field reaching the conductive structure, thus further weakening the magnetic field reaching the conductive structure.

[0012] In some possible implementations, the shape of the auxiliary block includes, but is not limited to, square, rectangle, rhombus, triangle, trapezoid, circle, or irregular shape.

[0013] When the shape of the auxiliary blocks includes squares, rectangles, rhombuses, triangles, or trapezoids, the number of auxiliary blocks in the same area is increased, and the increased number of auxiliary blocks can further weaken the magnetic field reaching the conductive structure.

[0014] In some possible implementations, the thickness of the auxiliary layer is less than or equal to twice the skin depth of the auxiliary layer.

[0015] This design avoids creating new eddy current losses on the auxiliary layer and prevents the design of the auxiliary layer from affecting the slim and lightweight design of the electronic device.

[0016] In some possible implementations, the auxiliary layer may be made of materials including, but not limited to, silver, gold, or copper. The auxiliary layer may also comprise other materials with high electrical conductivity and low magnetic permeability.

[0017] In some possible implementations, an anti-oxidation layer is provided on the surface of the auxiliary layer on the side opposite to the conductive structure.

[0018] The anti-oxidation layer can prevent the auxiliary layer from oxidizing and affecting its conductivity.

[0019] In some possible implementations, the material of the anti-oxidation layer includes chromium. Of course, the material of the anti-oxidation layer is not limited to chromium; any material that can prevent the oxidation of the auxiliary layer is within the scope of protection of this application.

[0020] In some possible implementations, a connecting layer is provided between the auxiliary layer and the conductive structure. That is, a connecting layer can be placed on the conductive structure, and then the auxiliary layer can be placed on the connecting layer.

[0021] This design avoids the situation where the auxiliary layer cannot be directly plated on the conductive structure, thus preventing the implementation of this solution and expanding its application scope.

[0022] For example, the conductive structure can be made of stainless steel, the auxiliary layer can be made of copper, a nickel bonding layer can be provided on the stainless steel conductive structure, and then a copper auxiliary layer can be plated on the nickel bonding layer.

[0023] In some possible implementations, the material of the bonding layer includes nickel. Of course, the material of the bonding layer is not limited to nickel. Those skilled in the art can select the material of the bonding layer according to the material of the conductive structure and the material of the auxiliary layer, so that the auxiliary layer can be plated onto the conductive structure.

[0024] In some possible implementations, the auxiliary layer is formed through processes such as electroplating, bonding, or high-temperature, high-pressure metal diffusion.

[0025] In some possible implementations, the projection of the conductive structure onto the reference plane overlaps with the projection of the receiving coil onto the reference plane; or, the distance between the projection of the conductive structure onto the reference plane and the projection of the receiving coil onto the reference plane is less than or equal to a first threshold, i.e., the conductive structure and the receiving coil are relatively close. For example, the first threshold can be 30 mm, 20 mm, 10 mm, 8 mm, or 5 mm, etc.; wherein, the reference plane is parallel to the plane where the receiving coil is located.

[0026] In some possible implementations, the electronic device also includes a camera, a camera trim, and a back cover. The camera trim includes a decorative part and a fixing part. An opening is provided on the back cover, and the decorative part is located in the opening. The fixing part is disposed around the decorative part and is fixedly connected to the inner surface of the back cover so that the camera trim is fixedly connected to the back cover. The decorative part has at least one decorative hole that exposes the camera. The conductive structure includes the fixing part, and an auxiliary layer is disposed on the surface of the fixing part facing the back cover.

[0027] This design avoids the alternating magnetic field inducing eddy currents on the fixed part of the camera decoration, which could lead to energy loss and, in severe cases, even cause wireless charging to stop working.

[0028] For example, electronic devices may include mobile phones or tablets.

[0029] In some possible implementations, the electronic device further includes a housing and a support structure disposed on one side of the housing; a receiving coil is disposed on the side of the support structure facing the housing; the conductive structure includes the support structure, and an auxiliary layer is disposed on the surface of the support structure facing the receiving coil.

[0030] This design avoids the problem of energy loss caused by eddy currents induced in the support structure by the alternating magnetic field.

[0031] For example, electronic devices may include smart wearable devices, such as smartwatches or wristbands. Attached Figure Description

[0032] Figure 1 A schematic diagram of a wireless charging scenario provided in an embodiment of this application;

[0033] Figure 2a This is a schematic diagram of the structure of a coil provided in an embodiment of this application;

[0034] Figure 2b for Figure 2a Cross-sectional view along the AA' direction

[0035] Figure 3 A schematic diagram illustrating an application scenario for wireless charging;

[0036] Figure 4 This is a schematic diagram of the disassembled structure of a wireless charging receiver provided in an embodiment of this application;

[0037] Figure 5 This is a schematic diagram of the rear structure of a wireless charging receiver provided in an embodiment of this application;

[0038] Figure 6a for Figure 5 The diagram shows a cross-sectional view of the wireless charging receiver along the BB' direction.

[0039] Figure 6b for Figure 5 Another cross-sectional view of the wireless charging receiver along the BB' direction is shown;

[0040] Figure 7 A schematic diagram illustrating another application scenario for wireless charging;

[0041] Figure 8 A film layer diagram of a wireless charging receiver device provided in an embodiment of this application;

[0042] Figure 9 A front view of the positional relationship between a support structure and a receiving coil provided in an embodiment of this application;

[0043] Figure 10 A diagram showing the rear positional relationship between a support structure and a receiving coil, provided in an embodiment of this application;

[0044] Figure 11 A top view of a conductive structure and an auxiliary layer provided for implementation of this application;

[0045] Figure 12 A side view of a conductive structure and an auxiliary layer provided for implementation of this application;

[0046] Figure 13 for Figure 5 Another cross-sectional view of the wireless charging receiver along the BB' direction is shown;

[0047] Figure 14 A film layer diagram of another wireless charging receiver device provided in an embodiment of this application;

[0048] Figure 15 A side view of another conductive structure and auxiliary layer provided for implementation of this application;

[0049] Figure 16 A side view of another conductive structure and auxiliary layer provided for implementation of this application;

[0050] Figure 17 A top view of another conductive structure and auxiliary layer provided for the implementation of this application;

[0051] Figure 18 A side view of another conductive structure and auxiliary layer provided for implementation of this application;

[0052] Figure 19 A top view of another conductive structure and auxiliary layer provided for the implementation of this application;

[0053] Figure 20 A top view of another conductive structure and auxiliary layer provided for the implementation of this application;

[0054] Figure 21 A top view of another conductive structure and auxiliary layer provided for the implementation of this application;

[0055] Figure 22 Structural comparison diagrams provided for embodiments of this application;

[0056] Figure 23 for Figure 22 The simulation diagrams show a comparison of the three structures. Detailed Implementation

[0057] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0058] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0059] The terms "first" and "second," etc., used in the specification and claims of this application are used to distinguish different objects, not to describe a specific order of objects. For example, "first target object" and "second target object," etc., are used to distinguish different target objects, not to describe a specific order of target objects.

[0060] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0061] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more. For example, multiple processing units means two or more processing units; multiple systems means two or more systems.

[0062] With the development of wireless technology, wireless charging is increasingly becoming a more convenient charging trend. Compared with traditional cable-plugged power transmission technology, wireless charging technology is safer, more convenient, and more reliable because there is no cable connection between the power source and the load during the wireless power transmission process.

[0063] Existing wireless charging technologies generally use the principle of electromagnetic coupling to achieve power transmission. For example, see... Figure 1 , Figure 1 This is a schematic diagram of a wireless charging scenario provided in an embodiment of this application. A wireless charging scenario generally includes a wireless charging transmitting device (also called a wireless charging device) 10 and a wireless charging receiving device (also called a device to be charged or a device receiving power, etc.) 20. For example, the wireless charging device can be a wireless charging power bank, a wireless charging pad, a wireless charger, etc., and the device to be charged can be a mobile phone, tablet, laptop, personal digital assistant (PDA), in-vehicle computer, smart wearable device (such as a smartwatch, smart bracelet, earphone, etc.), virtual reality (VR), augmented reality (AR), and other electronic devices. The aforementioned device to be charged can also be a wireless charging electric vehicle, a wireless charging home appliance (such as a robot vacuum cleaner), a drone, and other electronic products. Furthermore, the wireless charging device can be a tablet, laptop, or mobile phone, and the device to be charged can be a stylus, a magnetic keyboard, etc.

[0064] The wireless charging transmitter 10 may include a power supply 11 and a wireless transmitter 12. The power supply 11 can be connected to mains power and is used to provide a DC voltage. To distinguish it from other DC voltages, the DC voltage provided by the power supply 11 is a first DC voltage. The wireless transmitter 12 includes a DC / AC circuit 122, a resonant capacitor C1, and a transmitting coil L1.

[0065] In some embodiments, the wireless transmitting device 12 further includes a voltage conversion circuit 121. The voltage conversion circuit 121 is electrically connected to the power supply 11 and is used to convert the first DC voltage output from the power supply terminal 11 into a stable second DC voltage. For example, the voltage conversion circuit 121 can be a boost circuit (such as a boost circuit, a boost transformer, or a power amplifier) ​​to boost the first DC voltage output from the power supply terminal 11 before outputting it.

[0066] When the voltage conversion circuit 121 is a boost circuit, it can increase the potential difference between the wireless charging transmitter 10 and the wireless charging receiver 20, thereby improving the system's energy transfer capability and facilitating high-power transmission.

[0067] Of course, the voltage conversion circuit 121 is not limited to a boost circuit; it can also be a buck circuit, used to step down the first DC voltage output from the power supply terminal 11 before outputting it. Those skilled in the art can configure the voltage conversion circuit 121 according to the actual situation.

[0068] The DC / AC circuit 122 is electrically connected to the voltage conversion circuit 121 and is used to convert the second DC voltage output by the voltage conversion circuit 121 into AC voltage. The DC / AC circuit 122 is also referred to as a transmit (TX) chip.

[0069] The resonant capacitor C1 and the transmitting coil L1 are connected in series to form a series resonant network. The transmitting coil L1 is electrically connected to the DC / AC circuit 122 through the resonant capacitor C1. During the charging and discharging process of the resonant capacitor C1 and the transmitting coil L1 by the DC / AC circuit 122, the transmitting coil L1 can convert alternating current into an alternating magnetic field.

[0070] The wireless charging receiver 20 also includes a wireless receiver 22 and a battery 21. The wireless receiver 22 includes a receiving coil L2, a resonant capacitor C2, and an AC / DC circuit 222.

[0071] When the wireless charging transmitter 10 needs to charge the wireless charging receiver 20, the receiving coil L2 approaches or comes into contact with the transmitting coil L1. At this time, the receiving coil L2 in the wireless charging receiver 20 generates alternating current through electromagnetic induction. The AC / DC circuit 222 converts the alternating current generated by the receiving coil L2 into direct current and outputs it to the battery 21 to charge the battery 21. The AC / DC circuit 222 is also called a receiver (RX) chip.

[0072] In some embodiments, when the DC power output by the AC / DC circuit 222 is too large to be directly supplied to the battery 21, the wireless receiver 22 may further include a voltage conversion circuit 221. The voltage conversion circuit 221 is electrically connected to both the AC / DC circuit 222 and the battery 21, and is used to reduce the large voltage output by the AC / DC circuit 222 to the voltage required by the battery 21. Exemplarily, the voltage conversion circuit 221 may be a buck circuit (also known as a step-down circuit).

[0073] Understandably, see Figure 2a and Figure 2b , Figure 2a This is a schematic diagram of the structure of a coil provided in an embodiment of this application. Figure 2b for Figure 2aIn a cross-sectional view along the AA' direction, the aforementioned coils (transmitting coil L1 and / or receiving coil L2) may include a ring coil L11 and a magnetically conductive layer L12 located on one side of the ring coil L11 (the material of the magnetically conductive layer may include nanocrystals, etc.). The ring coil L11 and the magnetically conductive layer L12 can be fixed together by a double-sided adhesive layer (such as double-sided tape) (not shown in the figure). The magnetically conductive layer L12 can concentrate the magnetic field and improve the coil inductance. In addition, the magnetically conductive layer L12 can also shield part of the magnetic field, preventing eddy current losses on other metal structures. Of course, in other optional embodiments of this application, the aforementioned coils (transmitting coil L1 and / or receiving coil L2) may not include the magnetically conductive layer L12. As can be seen from the above, wireless charging is based on the magnetic coupling between the transmitting coil L1 of the wireless charging transmitting device 10 and the receiving coil L2 of the wireless charging receiving device 20 for the transmission of wireless power. However, in addition to the wireless receiver 22 and the battery 21, the wireless charging receiver 20 also includes other structures. These structures may also sense the magnetic field and generate induced currents (i.e., eddy current effects), leading to eddy current losses and reducing the charging efficiency of the receiving device. In other words, the magnetic layer L12 of the receiving coil L2 cannot shield all magnetic fields; some magnetic fields will still generate induced currents (i.e., eddy current effects) on other structures, resulting in eddy current losses and reducing the charging efficiency of the receiving device. The structures in the wireless charging receiver 20 that can sense the changing magnetic field generated by the wireless charging transmitter 10 and generate induced currents (i.e., eddy current effects) can also be collectively referred to as conductive structures.

[0074] To make it easier to understand, we will explain this through several application scenarios.

[0075] Scenario 1, see Figure 3 , Figure 3 This diagram illustrates an application scenario for wireless charging, using a wireless charging transmitter 10 as a wireless charging dock and a wireless charging receiver 20 as a mobile phone as an example. It should be noted that... Figure 3 The wireless charging stand shown has a certain tilt angle so that the mobile phone can lean against and fit snugly against the wireless charging stand. Of course, this does not constitute a limitation of this application. In other optional embodiments of this application, the wireless charging stand may also have other forms. For example, the wireless charging stand is flat, and the wireless charging stand supports the mobile phone to be placed horizontally on it.

[0076] See Figure 4 , Figure 4This is a schematic diagram showing the disassembled structure of a wireless charging receiver device according to an embodiment of this application. The wireless charging receiver device 20 also includes a display module 201, a back cover (also called a battery cover or housing, etc.) 202, and a mid-frame 203. The display module 201 includes a display screen and a cover stacked together. The cover can protect the display screen. The display screen can include a liquid crystal display (LCD), an organic light-emitting diode (OLED) display screen, and an LED display screen, etc., wherein the LED display screen includes, for example, a micro-LED display screen, a mini-LED display screen, etc. This application embodiment does not limit the type of display screen.

[0077] The back cover 202 is located on the side of the display screen away from the cover body. The material of the back cover 202 may include, for example, opaque materials such as plastic, vegan leather, and fiberglass; or it may include light-transmitting materials such as glass. This application embodiment does not limit the material of the back cover 202.

[0078] The middle frame 203 is located between the cover and the back cover 202. The middle frame 203 includes an annular outer part 2031 and a support part 2032 located within the area surrounded by the annular outer part 2031 and between the display screen and the back cover 202. The annular outer part 2031 and the support part 2032 are fixedly connected. The annular outer part 2031 and the support part 2032 can be integrally formed or separately formed and then fixedly connected by welding or bonding. The display module 201 can be provided on the support part 2032 through an adhesive layer, and the support part 2032 supports the display module 201, etc. The adhesive layer can be an adhesive structure such as adhesive backing that can place the display module 201 on the support part 2032.

[0079] The display module 201, the annular outer part 2031, and the back cover 202 can form the entire housing. The wireless charging receiver 20 also includes printed circuit boards (PCBs) 204, a flash 205, and a camera 206, etc., wherein the PCB 204 includes a main board 2041 and a sub-board 2042. The battery 21, the main board 2041, the sub-board 2042, the receiving coil L2, the flash 205, and the camera 206 are located within the housing.

[0080] Along the length of the phone, the main board 2041 and the secondary board 2042 are respectively located on both sides of the battery 21. A flexible printed circuit (FPC) (not shown in the figure) connects the main board 2041 and the secondary board 2042 to realize the transmission of data and signals between the main board 2041 and the secondary board 2042.

[0081] The flash 205 and camera 206 are positioned adjacent to the mainboard 2041. The receiving coil L2 can be located between the battery 21 and the back cover 202. The resonant capacitor C2 and the AC / DC circuit 222 can be located on the mainboard 2041. The display screen, battery 21, receiving coil L2, flash 205, and camera 206 are electrically connected to the mainboard 2041 (or to the sub-board 2042; or some components may be electrically connected to the mainboard 2041 and others to the sub-board 2042). The battery 21 can supply power to the display screen, flash 205, and camera 206 through the mainboard 2041 or the sub-board 2042 to ensure their normal operation.

[0082] Combination Figure 5 and Figure 6a , Figure 5 This is a schematic diagram of the back structure of a wireless charging receiver provided in an embodiment of this application. Figure 6a for Figure 5 The diagram shows a cross-sectional view of the wireless charging receiver along the BB' direction. The diagram is provided to clearly illustrate the structure relevant to the invention of this application. Figure 6a Only a portion of the structure is shown. The wireless charging receiver 20 also includes a camera trim 207, which is used to decorate the camera 206 to enhance the aesthetic appearance of the wireless charging receiver 20.

[0083] The camera trim 207 includes a trim part 2071, a fixing part 2072, and a light-transmitting lens 2073. The fixing part 2072 is arranged around the trim part 2071. The trim part 2071 and the fixing part 2072 can be integrally formed; or they can be formed separately and then fixedly connected by welding or bonding.

[0084] The back cover 202 includes an outer surface 202a and an inner surface 202b facing away from each other. A cutout portion 202c is formed on the back cover 202, penetrating both the outer surface 202a and the inner surface 202b. A decorative portion 2071 is located at the cutout portion 202c, and at least a portion of the decorative portion 2071 protrudes relative to the outer surface 202a of the back cover 202. A fixing portion 2072 is fixedly connected to the inner surface 202b of the back cover 202, thereby fixing the camera decorative piece 207 to the back cover 202.

[0085] A ring-shaped step 20711 is formed at the portion of the decorative part 2071 that protrudes from the outer surface 202a of the back cover 202. The light-transmitting lens 2073 is fixed to the ring-shaped step 20711 so that the light-transmitting lens 2073 is fixedly connected to the decorative part 2071. In some embodiments, a buffer structure is provided in front of the light-transmitting lens 2073 and the ring-shaped step 20711, wherein the buffer structure may include Mylar, foam, etc.

[0086] The decorative section 2071 also has a plurality of light-transmitting holes 20712, and a light-transmitting lens 2073 covers the plurality of light-transmitting holes 20712. A flash 205 and a plurality of cameras 206 are respectively opposite to the plurality of light-transmitting holes 20712. For example, there are three cameras 206, one flash 205, and four light-transmitting holes 20712, with the three cameras 206 and one flash 205 respectively opposite to the four light-transmitting holes 20712. That is, one light-transmitting hole 20712 can expose at least a portion of one of the cameras 206, another light-transmitting hole 20712 can expose at least a portion of another camera 206, yet another light-transmitting hole 20712 can expose at least a portion of a third camera 206, and yet another light-transmitting hole 20712 can expose at least a portion of the flash 205. In this way, the light emitted by the flash 205 can illuminate the object being photographed through its corresponding light-transmitting hole 20712 and light-transmitting lens 2073, providing supplemental lighting for the object; the camera 206 can collect light sources through its corresponding light-transmitting hole 20712 and light-transmitting lens 2073 to capture still images or videos.

[0087] The materials of the aforementioned decorative part 2071 and fixing part 2072 may include metal (such as stainless steel or magnesium-aluminum alloy) to better protect and / or support the camera 206, flash 205, etc. However, as users' requirements for image quality increase and mobile phone photography functions continue to upgrade, the number of cameras on mobile phones is increasing, resulting in the camera decorative part 207 becoming larger and larger. Consequently, the fixing part 2072 of the camera decorative part 207 is getting closer and closer to the receiving coil L2. For example, the distance M1 between the projection of the fixing part 2072 on the plane of the back cover 202 and the projection of the receiving coil L2 on the plane of the back cover 202 is less than a first threshold. The first threshold can be 30 mm, 20 mm, 10 mm, 8 mm, or 5 mm, etc., and this application embodiment does not limit this; even the fixing part 2072 may overlap with the receiving coil L2, such as Figure 6b As shown, Figure 6b for Figure 5 The diagram shows another cross-sectional view of the wireless charging receiver along the BB' direction. The projection of the fixing part 2072 onto the plane of the back cover 202 overlaps with the projection of the receiving coil L2 onto the plane of the back cover 202. Thus, during wireless charging, not only will the receiving coil L2 generate an induced current in the changing magnetic field, but since the fixing part 2072 is made of metal (i.e., a conductive material), the fixing part 2072 (i.e., the conductive structure) may also sense the magnetic field and generate an induced current (i.e., eddy current effect), leading to eddy current losses, reducing the charging efficiency of the device, and in severe cases, even causing wireless charging to stop.

[0088] It is understandable that the structure that can sense a magnetic field and generate eddy current effect during wireless charging, thus causing eddy current loss, is not limited to the fixed part 2072. This explanation uses the fixed part 2072 as an example to illustrate that it can sense a magnetic field and generate eddy current effect, thus causing eddy current loss.

[0089] Scenario 2, see Figure 7 , Figure 7 This is a schematic diagram of another application scenario for wireless charging, which uses wireless charging transmitter 10 as a wireless charger and wireless charging receiver 20 as a smartwatch as an example. Figure 7 In the middle, the wireless charger is attached to the smartwatch to wirelessly charge it.

[0090] See Figure 8 , Figure 8 This is a membrane layer diagram of a wireless charging receiver device provided in an embodiment of this application. The wireless charging receiver device 20 also includes a display module 201, a back cover (also called a battery cover or housing) 202, and a mid-frame 203. The specific structure and positional relationship of the display module 201, back cover 202, and mid-frame 203 are similar to those in the above scenario (i.e., scenario one), and can be referred to the above scenario for details, which will not be repeated here.

[0091] The wireless charging receiver 20 also includes a support structure 208 and a circuit board (not shown in the figure). The battery 21, circuit board, receiving coil L2, and support structure 208 are located inside the smartwatch's main body.

[0092] Combination Figure 9 and Figure 10 , Figure 9 This is a front view of the positional relationship between a support structure and a receiving coil, provided in an embodiment of this application. Figure 10 This diagram illustrates the rear-side positional relationship between a support structure and a receiving coil, provided in an embodiment of this application. Along the direction from the display module 201 to the rear cover 202, the battery 21 is located between the support structure 208 and the display module 201. The receiving coil L2 is located on the side of the support structure 208 opposite to the battery 21, and is fixed and supported by the support structure 208. Furthermore, the support structure 208 can also be reused as an antenna to radiate electromagnetic wave signals.

[0093] Along a direction parallel to the plane where the display module 201 is located, the circuit board is located on at least one side of the battery 21. For example, if both the circuit board and the battery 21 are rectangular, the circuit board can be located on one side of the battery 21; if the battery 21 is rectangular and the circuit board is "L" shaped, the circuit board can be located on both sides of the battery 21. The resonant capacitor C2 and the AC / DC circuit 222 can be disposed on the circuit board.

[0094] In some embodiments, the smartwatch also includes a heart rate sensor (not shown). The support structure 208 protrudes at its center towards the back cover 202 to form a recess CC with a hollowed-out bottom, within which the heart rate sensor is housed. The smartwatch can perform functions such as electrocardiogram (ECG) monitoring via the heart rate sensor. In this case, the receiving coil L2 can be arranged around the recess CC. Correspondingly, the back cover 202 may have a protrusion 2021 on the side near the wireless charging transmitter 10, which facilitates the smartwatch's contact with the user's body and makes it easier to collect the user's physiological information data.

[0095] The material of the aforementioned support structure 208 may include metal (such as stainless steel or magnesium-aluminum alloy) to better support the receiving coil L2 and to better radiate electromagnetic wave signals. Since the support structure 208 is in contact with the receiving coil L2, during wireless charging of the smartwatch, not only will the receiving coil L2 generate an induced current in the changing magnetic field, but the support structure 208 (i.e., the conductive structure) may also sense this magnetic field and generate an induced current (i.e., eddy current effect), thereby causing eddy current losses, reducing the charging efficiency of the receiving device, and in severe cases, even causing wireless charging to stop.

[0096] It is understandable that during wireless charging, the structure that can sense a magnetic field and generate eddy currents, thus causing eddy current losses, is not limited to the support structure 208. This scenario uses the example of the support structure 208 sensing a magnetic field and generating eddy currents, thus causing eddy current losses, for illustration.

[0097] As can be seen from the two scenarios above, during the wireless charging process, some structures in the wireless charging receiver 20 may also sense the changing magnetic field generated by the wireless charging transmitter 10 and generate induced current (i.e., generate eddy current effect), which in turn generates eddy current loss and reduces the charging efficiency of the receiving device.

[0098] Based on this, the present application provides a technical solution that can be applied to the wireless charging receiver 10 described above. The technical solution will be described below.

[0099] See Figure 11 and Figure 12 , Figure 11 A top view of a conductive structure and an auxiliary layer provided for implementation of this application. Figure 12The side view of a conductive structure and auxiliary layer provided for implementation of this application shows that an auxiliary layer 40 can be disposed on the surface of the conductive structure 30, and the conductivity of the auxiliary layer 40 is greater than that of the conductive structure 30. Since the conductivity of the auxiliary layer 40 is greater than that of the conductive structure 30, the alternating magnetic field generated by the wireless charging transmitter 10 can not only generate alternating current in the conductive structure 30, but also form a larger magnetic field on the auxiliary layer 40, which is opposite in direction to the magnetic field of the conductive structure 30. The superposition of these magnetic fields cancels each other out, thereby weakening the magnetic field reaching the conductive structure 30 and reducing eddy current losses on the conductive structure 30. Furthermore, since the auxiliary layer 40 is a film structure, it is thinner than other structures that can generate reverse magnetic fields, which is beneficial for the slimming and lightweight design of electronic devices. Compared to creating holes in the conductive structure 30, it reduces damage to the eddy current loops on the conductive structure 30, without altering the structure of the conductive structure 30, thus ensuring the original performance of the conductive structure 30. For example, when the conductive structure 30 functions as a support, the supporting strength of the conductive structure 30 can be guaranteed.

[0100] For example, when this solution is applied to scenario one above, the conductive structure 30 can be the fixing part 2072 of the camera decorative part 207. See also Figure 13 , Figure 13 for Figure 5 Another cross-sectional view of the wireless charging receiver shown along the BB' direction shows that an auxiliary layer 40 can be provided on the surface of the fixing part 2072 facing the rear cover 202, that is, the auxiliary layer 40 is located between the fixing part 2072 and the inner surface 202b of the rear cover 202.

[0101] With this configuration, during wireless charging, the alternating magnetic field generated by the wireless charging transmitter 10 can not only produce alternating current in the fixed part 2072, but also form a magnetic field on the auxiliary layer 40 with the opposite direction to the magnetic field of the fixed part 2072. The superposition and cancellation of these magnetic fields weakens the magnetic field of the fixed part 2072, thereby reducing eddy current losses on the fixed part 2072. Furthermore, since the auxiliary layer 40 is a thin film structure, it does not occupy a large amount of internal space in the phone, which is beneficial for the arrangement of other internal structures and for the phone's slim design; it also eliminates the need to change the structure of the fixed part 2072, thus maintaining its original strength.

[0102] For example, when this solution is applied to scenario two above, the conductive structure 30 can be the support structure 208. See also Figure 14 , Figure 14 The membrane layer diagram of another wireless charging receiving device provided in the embodiments of this application shows that an auxiliary layer 40 can be provided on the surface of the support structure 208 facing the receiving coil L2, that is, the auxiliary layer 40 is located between the receiving coil L2 and the support structure 208.

[0103] With this configuration, during wireless charging, the alternating magnetic field generated by the wireless charging transmitter 10 can not only produce alternating current on the support structure 208, but also form a magnetic field on the auxiliary layer 40 with the opposite direction to the magnetic field of the support structure 208. The superposition and cancellation of these magnetic fields weakens the magnetic field of the support structure 208, thereby reducing eddy current losses on the support structure 208. Verification has shown that if the auxiliary layer 40, with a copper plating material and a thickness of 10μm, is applied to the support structure 208, the eddy current losses on the support structure 208 can be reduced from 490mW to 184mW, indicating a significant reduction. Furthermore, since the auxiliary layer 40 is a thin film structure, it does not occupy a large amount of space inside the smartwatch, which is beneficial for the arrangement of other structures within the smartwatch and for the slimmer design of the smartwatch; it also does not require altering the structure of the support structure 208, thus maintaining the original strength of the support structure 208.

[0104] It should be noted that the above examples are illustrated using the conductive structure 30 as the fixing part 2072 of the camera decorative part 207 in a mobile phone, or as the support structure 208 in a smartwatch. However, this does not constitute a limitation of this application. In the wireless charging receiver 20, any structure that may sense the changing magnetic field generated by the wireless charging transmitter 10 and generate an induced current (i.e., generate an eddy current effect) can adopt this solution. That is, the conductive structure 30 can be any structure in the wireless charging receiver 20 that affects wireless charging.

[0105] It should also be noted that the above description uses a metallic material for the conductive structure 30 as an example, but this does not constitute a limitation of this application. Any material capable of sensing the changing magnetic field generated by the wireless charging transmitter 10 and generating an induced current (i.e., producing an eddy current effect) is within the scope of protection of this application. For example, materials with a conductivity of 10... 3 Up to 10 7 The materials between.

[0106] This application embodiment limits the material of the auxiliary layer 40, as long as its electrical conductivity is greater than that of the conductive structure 30. For example, the auxiliary layer 40 may include silver, gold, or copper. Of course, the auxiliary layer 40 may also include other materials with high electrical conductivity and low magnetic permeability (e.g., magnetic permeability between 0.99 (H / m) and 1.01 (H / m)).

[0107] The embodiments of this application do not limit the manner in which the auxiliary layer 40 is disposed on the surface of the conductive structure 30. For example, the auxiliary layer 40 can be disposed on the surface of the conductive structure 30 by electroplating, bonding, or high-temperature and high-pressure metal diffusion.

[0108] In some embodiments, the thickness of the auxiliary layer 40 is less than or equal to twice the skin depth of the auxiliary layer 40, wherein the skin depth of the auxiliary layer 40 is related to the magnetic permeability and electrical conductivity of the auxiliary layer 40, and the skin depth of the auxiliary layer 40 can be determined based on the magnetic permeability and electrical conductivity of the auxiliary layer 40, thereby determining the thickness of the auxiliary layer 40.

[0109] When the thickness of the auxiliary layer 40 is less than or equal to twice the skin depth of the auxiliary layer 40, large eddy current losses can be avoided in the auxiliary layer 40 itself, and the thin and light design of the electronic device will not be affected by the setting of the auxiliary layer 40.

[0110] In some embodiments, see Figure 15 , Figure 15 This is a side view of another conductive structure and auxiliary layer provided for implementation of this application. The auxiliary layer 40 has an anti-oxidation layer 50 on the surface of the side opposite to the conductive structure 30. The thickness M2 of the anti-oxidation layer 50 is less than or equal to 2 mm and greater than or equal to 1 mm, such as 1 mm, 1.2 mm, 1.5 mm, 1.6 mm, 1.8 mm or 2 mm.

[0111] The anti-oxidation layer 50 can prevent the formation of oxides (usually insulating) on ​​the surface of the auxiliary layer 40, which would increase the resistance of the auxiliary layer 40 and thus affect its conductivity.

[0112] The materials used for the anti-oxidation layer 50 are not limited in this application embodiment; any material that can prevent the auxiliary layer 40 from oxidizing is within the scope of protection of this application. For example, the materials for the anti-oxidation layer 50 include, but are not limited to, chromium.

[0113] In some embodiments, see Figure 16 , Figure 16 This is a side view of another conductive structure and auxiliary layer provided for implementation of this application. A connecting layer 60 is provided between the auxiliary layer 40 and the conductive structure 30. The thickness M3 of the connecting layer 60 can be less than or equal to 2 mm and greater than or equal to 1 mm, such as 1 mm, 1.2 mm, 1.5 mm, 1.6 mm, 1.8 mm, or 2 mm. That is, the connecting layer 60 can be first provided on the conductive structure 30, and then the auxiliary layer 40 can be provided on the connecting layer 60.

[0114] This design avoids the situation where the auxiliary layer 40 cannot be directly plated on the conductive structure 30, which would prevent the implementation of this solution. The design of the connecting layer 60 can expand the application range of this solution. For example, the selection of materials for the conductive structure 30 can be more flexible, without the need to select materials that can be directly plated on the auxiliary layer 40.

[0115] The material of the connecting layer 60 is not limited in this embodiment, as long as the auxiliary layer 40 can be disposed on the conductive structure 30. For example, the material of the connecting layer 60 includes, but is not limited to, nickel.

[0116] For example, the conductive structure 30 can be made of stainless steel, the auxiliary layer 40 can be made of copper, a nickel-based bonding layer 60 can be provided on the stainless steel conductive structure 30, and then the copper-based auxiliary layer 40 can be plated on the nickel-based bonding layer 60.

[0117] In some embodiments, see Figure 17 and Figure 18 , Figure 17 A top view of another conductive structure and auxiliary layer provided for implementation of this application. Figure 18 This is a side view of another conductive structure and auxiliary layer provided for implementation of this application. The auxiliary layer 40 includes multiple auxiliary blocks 41. The auxiliary layer 40 can be fragmented to form multiple auxiliary blocks 41.

[0118] The shape of the auxiliary block 41 may include a rectangle (such as...) Figure 17 As shown), square (as shown) Figure 19 As shown), rhombus (as shown) Figure 20 As shown), triangle (as shown) Figure 21 The shape of the auxiliary block 41 may be circular (not shown in the figure) or trapezoidal (not shown in the figure). Of course, this does not constitute a limitation on this application. In other optional embodiments of this application, the shape of the auxiliary block 41 may also include a circle (not shown in the figure), an irregular shape (not shown in the figure), etc.

[0119] The auxiliary block 41 further reduces eddy current losses. Because the complete auxiliary layer 40 forms a large loop, it generates relatively large eddy currents. The central part of the auxiliary layer 40 may lack eddy currents to shield and weaken the AC magnetic field generated by the transmitting coil L1. By including multiple auxiliary blocks 41, the auxiliary layer 40 becomes discontinuous, allowing each auxiliary block 41 to generate small eddy currents to weaken the magnetic field reaching the conductive structure 30, thus further weakening the magnetic field reaching the conductive structure 30.

[0120] In summary, the technical solution provided in this application, by adding an auxiliary layer 40 to the conductive structure 30, can weaken the magnetic field reaching the conductive structure 30, thereby reducing eddy current losses on the conductive structure 30. Furthermore, fragmenting the auxiliary layer 40 can further weaken the magnetic field reaching the conductive structure 30.

[0121] To illustrate this beneficial effect in detail, the following explanation is based on simulation results.

[0122] See Figure 22 , Figure 22The structural comparison diagrams provided for embodiments of this application are as follows. Figure 22 (1) is a diagram showing the positional relationship between the conductive structure 30 and the transmitting coil L1 when the auxiliary layer 40 is not provided on the conductive structure 30; Figure 22 (2) is a diagram showing the positional relationship between the conductive structure 30, the auxiliary layer 40 and the transmitting coil L1 when the auxiliary layer 40 is provided on the surface of the conductive structure 30 facing the transmitting coil L1. Figure 22 Figure (3) shows the positional relationship between the conductive structure 30, the auxiliary layer 40, and the transmitting coil L1 when an auxiliary layer 40 is provided on the surface of the conductive structure 30 facing the transmitting coil L1, and the auxiliary layer 40 includes multiple auxiliary blocks 41. In the simulation, the conductive structure 30 is selected as a cuboid with dimensions of 48mm width, 48mm length, and 1mm height; the material is 316L stainless steel. The vertical distance between the conductive structure 30 and the transmitting coil L1 is 4mm. The transmitting coil L1 is selected as an MP-A2 coil, and the transmitting coil L1 is supplied with 1A, 100KHz AC power. The transmitting coil L1 includes a ring coil L11 and a magnetically conductive layer L12 located on the side of the ring coil L11 away from the conductive structure 30. The auxiliary layer 40 is selected as a cuboid with dimensions of 48mm width, 48mm length, and 0.1mm height; the material is copper. When the auxiliary layer 40 is broken into multiple small auxiliary blocks 41, the width of the auxiliary block 41 is 1 mm and the length is 1 mm.

[0123] See Figure 23 , Figure 23 for Figure 22 The simulation diagrams comparing the three structures are shown, where the vertical axis represents eddy current loss. Figure 23 It can be seen that when the auxiliary layer 40 is not provided on the conductive structure 30, the eddy current loss generated by the conductive structure 30 is approximately 250mW. When the auxiliary layer 40 is provided on the conductive structure 30, the eddy current loss generated by the conductive structure 30 is reduced to 125mW, a reduction of 50%. When the auxiliary layer 40 is provided on the conductive structure 30 and the auxiliary layer 40 is broken into multiple small auxiliary blocks 41, the eddy current loss generated by the conductive structure 30 is reduced to 50mW, a reduction of 80% compared to when the auxiliary layer 40 is not provided on the conductive structure 30.

[0124] Therefore, simulations show that by adding an auxiliary layer 40 to the conductive structure 30, the magnetic field reaching the conductive structure 30 can be weakened, thereby reducing eddy current losses on the conductive structure 30. Fragmenting the auxiliary layer 40 can further weaken the magnetic field reaching the conductive structure 30, further reducing eddy current losses on the conductive structure 30, and thus improving charging efficiency.

[0125] Any content in the various embodiments of this application, as well as any content in the same embodiment, can be freely combined. Any combination of the above content is within the scope of this application.

[0126] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, characterized in that, include: A receiving coil is used to convert the alternating field generated by the transmitting coil of the wireless charging device into alternating current to charge the electronic device. A conductive structure and an auxiliary layer disposed on the surface of the conductive structure, wherein the conductivity of the auxiliary layer is greater than that of the conductive structure.

2. The electronic device according to claim 1, characterized in that, The auxiliary layer includes multiple auxiliary blocks.

3. The electronic device according to claim 2, characterized in that, The auxiliary blocks can be square, rectangular, rhomboid, triangular, or trapezoidal in shape.

4. The electronic device according to any one of claims 1-3, characterized in that, The thickness of the auxiliary layer is less than or equal to twice the skin depth of the auxiliary layer.

5. The electronic device according to any one of claims 1-4, characterized in that, The auxiliary layer may be made of silver, gold, or copper.

6. The electronic device according to any one of claims 1-5, characterized in that, An anti-oxidation layer is provided on the surface of the auxiliary layer on the side opposite to the conductive structure.

7. The electronic device according to claim 6, characterized in that, The material of the anti-oxidation layer includes chromium.

8. The electronic device according to any one of claims 1-7, characterized in that, A connecting layer is provided between the auxiliary layer and the conductive structure.

9. The electronic device according to claim 8, characterized in that, The material of the bonding layer includes nickel.

10. The electronic device according to any one of claims 1-9, characterized in that, The auxiliary layer is formed by electroplating, bonding, or high-temperature and high-pressure metal diffusion processes.

11. The electronic device according to any one of claims 1-10, characterized in that, The projection of the conductive structure onto the reference plane overlaps with the projection of the receiving coil onto the reference plane; or, The distance between the projection of the conductive structure onto the reference plane and the projection of the receiving coil onto the reference plane is less than or equal to a first threshold. The reference plane is parallel to the plane containing the receiving coil.

12. The electronic device according to claim 11, characterized in that, The electronic device also includes a camera, a camera trim, and a back cover, wherein the camera trim includes a decorative part and a fixing part; The rear cover has an opening, and the decorative part is located in the opening; The fixing part is arranged around the decorative part and is fixedly connected to the inner surface of the back cover so that the camera decoration is fixedly connected to the back cover; the decorative part has at least one decorative hole, and the decorative hole exposes the camera. The conductive structure includes the fixing part, and the auxiliary layer is disposed on the surface of the fixing part facing the rear cover.

13. The electronic device according to claim 11, characterized in that, The electronic device also includes a housing and a support structure disposed on one side of the housing; The receiving coil is located on the side of the support structure facing the outer casing; The conductive structure includes the support structure, and the auxiliary layer is disposed on the surface of the support structure facing the receiving coil.

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