Power module, power assembly and electric vehicle

Abstract

The application relates to the technical field of power electronics, and particularly relates to a power module, a power assembly and an electric vehicle. The power module comprises a substrate, an input end, an output end, a first switch device group and a second switch device group; the substrate comprises a first metal layer, a second metal layer and a third metal layer which are separated; the first switch device group and the second switch device group are arranged along a first direction, and the third metal layer is arranged between the first switch device group and the second switch device group along the first direction; the first switch device group comprises a plurality of first switch devices, the second switch device group comprises a plurality of second switch devices, each first switch device is arranged on the first metal layer and connected to the second metal layer, each second switch device is arranged on the second metal layer and connected to the third metal layer, a first input terminal is arranged on the first metal layer, a second input terminal is arranged on the third metal layer, and the output end is arranged on the second metal layer. The power module can consider both low parasitic inductance and miniaturization design.

Description

Technical Field

[0001] This application relates to the field of power electronics technology, and more particularly to a power module, powertrain, and electric vehicle. Background Technology

[0002] Power modules are core components in power electronic devices. They integrate one or more power semiconductor devices to achieve the conversion and management of electrical energy, and are therefore widely used in photovoltaics, energy storage, electric vehicles and other fields.

[0003] The presence of parasitic inductance can lead to a series of problems such as circuit oscillation, making low parasitic inductance one of the key objectives in power module design. At the same time, the structural design of the power module also needs to consider the miniaturization requirements of the product. Summary of the Invention

[0004] This application provides a power module, powertrain, and electric vehicle, wherein the power module can achieve both low parasitic inductance and miniaturized design.

[0005] In a first aspect, this application provides a power module, which includes a substrate, an input terminal, an output terminal, a first switching device group, and a second switching device group. The substrate includes multiple metal layers that are isolated from each other, including a first metal layer, a second metal layer, and a third metal layer. The first switching device group and the second switching device group are arranged along a first direction, and the third metal layer is arranged along the first direction between the first switching device group and the second switching device group. The first switching device group includes multiple first switching devices disposed on the first metal layer, and the second switching device group includes multiple second switching devices disposed on the second metal layer. Each first switching device is disposed on the first metal layer and connected to the second metal layer, and each second switching device is disposed on the second metal layer and connected to the third metal layer. The input terminal and the output terminal are disposed on both sides of the substrate along a second direction, and the thickness direction of the substrate, the first direction, and the second direction are perpendicular to each other. The input terminal includes a first input terminal and a second input terminal arranged at intervals along the first direction. The first input terminal is used to connect to the first metal layer, and the second input terminal is used to connect to the third metal layer. The first input terminal and the second input terminal are respectively used to connect to the positive and negative terminals of a power supply. The output terminal is used to connect to the second metal layer and is used to output alternating current.

[0006] The power module provided in this application embodiment arranges a first group of switching devices forming the upper bridge arm and a second group of switching devices forming the lower bridge arm at intervals along a first direction. The circuits connecting the power supply in the bridge arm circuits formed by the power module have current paths in opposite directions, which can reduce parasitic inductance in the current loops and reduce the impact of parasitic inductance on the power module's function. A third metal layer for connecting the second input terminal is positioned between the first and second switching device groups. The circuit traces of each first and second switching device can utilize the gap between the first and second switching device groups, which helps to reduce the size of the power module along the first direction. For the overall structural design of the power module, parasitic inductance in the circuit can be reduced while maintaining device miniaturization, which is beneficial for optimizing the function of the power module.

[0007] In one embodiment, at least a portion of the second switching devices are arranged along a second direction, and the end of the second input terminal facing the output terminal extends along the second direction between the first switching device group and the second switching device group to connect to the third metal layer; along the thickness direction of the substrate, the orthographic projection of the second input terminal on the substrate at least partially overlaps with the third metal layer. The second input terminal can extend between the first switching device group and the second switching device group, facilitating the routing of the second switching devices to the second input terminal through the third metal layer circuit.

[0008] In one embodiment, the second input terminal includes a body and at least one spring for connecting to a third metal layer; one or both ends of each spring are connected to the body, and each spring protrudes from the surface of the body facing the third metal layer along the thickness direction of the substrate. The second input terminal connects to the third metal layer via springs, which enhances connection reliability while meeting good electrical connection requirements.

[0009] In one embodiment, the spring is connected to the body along a second direction, and extends relative to the body along the second direction to connect with a third metal layer. The current path from the spring to the second input terminal is different. In the structural design of the power module, combining the structure of the second switching device and the spring at different positions can reduce the difference in current paths between different second switching devices and improve the current sharing effect.

[0010] In one embodiment, the second input terminal includes at least one pair of parallel slots, each pair of slots being arranged along a first direction, and the portion of the second input terminal located between each pair of slots forming a spring. The current path travels along the second direction from the third metal layer to both ends of the spring and the second input terminal at different distances, which can change the path length from the second switching device to the input terminal at different locations.

[0011] In one embodiment, the second terminal includes at least one U-shaped groove, the opening of which along a second direction faces the output or input terminal. The portion of the second input terminal located within the U-shaped groove forms a spring contact. The distance of the current path along the second direction from the third metal layer to the spring contact and the second input terminal can be changed according to the groove opening design, thereby altering the path length from the second switching device at different locations to the input terminal.

[0012] In one embodiment, the second metal layer and the third metal layer are disposed in the same layer. The second metal layer includes a notch, and the third metal layer is accommodated within the notch. A gap exists between the second metal layer and the third metal layer. The second metal layer and the third metal layer can be disposed in the same layer by means of etching or other methods, simplifying the fabrication process.

[0013] In one embodiment, the notch includes at least one hollow structure penetrating the second metal layer; along the first direction, the connection position of each first switching device to the second metal layer is located between the third metal layer and the first metal layer. The circuit connections of multiple first switching devices and multiple second switching devices can share the space between the first switching device group and the second switching device group, which is beneficial to reducing the size of the power module along the first direction.

[0014] In one embodiment, the notch includes at least one groove on the edge of the second metal layer facing the first metal layer; along the second direction, connection positions of a first switching device to the second metal layer and connection positions of a second switching device to an input terminal are spaced apart. The circuit connections of multiple first switching devices and multiple second switching devices can share the space between the first switching device group and the second switching device group, which is beneficial to reducing the size of the power module along the first direction.

[0015] In one embodiment, the third metal layer includes a plurality of third metal islands, each of which is connected to a second input terminal; the plurality of third metal islands are arranged at intervals along a second direction, and each second switching device is used to connect to one third metal island; the second connection terminal is connected to the plurality of third metal islands at multiple points. According to the different positions of the third metal islands, the current path of the second switching device connected to the input terminal at different positions can be changed, which is beneficial to improving the current sharing effect of the circuit.

[0016] In one embodiment, the first input terminal includes two ends, and a second input terminal is arranged between the two ends along a first direction; along the thickness direction of the substrate, the orthographic projection of the second input terminal on the metal layer overlaps with the first metal layer, and the second input terminal avoids the first metal layer. The design of the first input terminal with two ends can further reduce the parasitic inductance of the current loop.

[0017] In one embodiment, the first metal layer and the third metal layer are disposed on the same layer; along the thickness direction of the substrate, there is a gap between the second input terminal and the first metal layer, and the surface of the second input terminal facing the third metal layer is connected to the third metal layer via a pad. The second input terminal can avoid other metal layers except the third metal layer.

[0018] In one embodiment, the first metal layer includes two isolated first metal islands arranged along a first direction on both sides of the second input terminal; the two first metal islands are connected by a connecting bridge that crosses the second input terminal along the first direction. The second input terminal is able to avoid other metal layers except for the third metal layer.

[0019] In one embodiment, along the first direction, the plurality of second switching devices included in the first switching device group and the plurality of second switching devices included in the second switching device group are axially symmetrically distributed about the third metal layer, which can further reduce the parasitic inductance generated by the current loop.

[0020] Secondly, this application provides a powertrain, which includes a controller and a motor. The controller includes multiple power modules as described in the first aspect above. Each power module has a first input terminal and a second input terminal for connecting to the positive and negative terminals of a power supply, respectively, and an output terminal for connecting to one phase of the motor circuit. The aforementioned power modules can achieve both small size and low parasitic inductance, which is beneficial for improving the efficiency of the powertrain and reducing its size.

[0021] Thirdly, this application provides an electric vehicle, which includes a power battery, wheels, and a powertrain as provided in the second aspect. The powertrain's power conversion device receives direct current (DC) from the power battery and converts it into alternating current (AC) for output to a motor, which drives the wheels. The electric vehicle including the aforementioned powertrain has better power performance.

[0022] The technical effects that can be achieved by the second and third aspects mentioned above can be referred to the corresponding effect descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0023] Figure 1a This application provides a schematic diagram of the structure of an electric vehicle.

[0024] Figure 1b A schematic diagram illustrating the working principle of a powertrain for an electric vehicle provided in an embodiment of this application;

[0025] Figure 2 A schematic diagram of a power total efficiency conversion circuit provided in an embodiment of this application;

[0026] Figure 3 This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0027] Figure 4a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0028] Figure 4b This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0029] Figure 5a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0030] Figure 5b This is a partial structural schematic diagram of a power module provided in an embodiment of this application;

[0031] Figure 6a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0032] Figure 6b A cross-sectional structural diagram of a power module provided in an embodiment of this application;

[0033] Figure 6c A cross-sectional structural diagram of a power module provided in an embodiment of this application;

[0034] Figure 7a A schematic diagram of the current loop of a power module provided in an embodiment of this application;

[0035] Figure 7b This is a schematic diagram of a partial current loop of a power module provided in an embodiment of this application;

[0036] Figure 8a A schematic diagram of the current loop of a power module provided in an embodiment of this application;

[0037] Figure 8b This is a schematic diagram of a partial current loop of a power module provided in an embodiment of this application;

[0038] Figure 9a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0039] Figure 9b A cross-sectional structural diagram of a power module provided in an embodiment of this application;

[0040] Figure 9c A cross-sectional structural diagram of a power module provided in an embodiment of this application;

[0041] Figure 10aA schematic diagram of the current loop of a power module provided in an embodiment of this application;

[0042] Figure 10b This is a schematic diagram of a partial current loop of a power module provided in an embodiment of this application;

[0043] Figure 11 This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0044] Figure 12a This is a partial structural diagram of the second input terminal of a power module provided in an embodiment of this application;

[0045] Figure 12b This is a partial cross-sectional view of the second input terminal of a power module provided in an embodiment of this application;

[0046] Figure 13a This is a partial structural diagram of the second input terminal of a power module provided in an embodiment of this application;

[0047] Figure 13b This is a partial cross-sectional view of the second input terminal of a power module provided in an embodiment of this application;

[0048] Figure 14 This is a schematic diagram of a partial current loop of a power module provided in an embodiment of this application;

[0049] Figure 15a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0050] Figure 15b A cross-sectional structural diagram of a power module provided in an embodiment of this application;

[0051] Figure 15c A cross-sectional structural diagram of a power module provided in an embodiment of this application;

[0052] Figure 16 A schematic diagram of the current loop of a power module provided in an embodiment of this application;

[0053] Figure 17 This is a partial structural schematic diagram of a power module provided in an embodiment of this application;

[0054] Figure 18a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0055] Figure 18b A cross-sectional structural diagram of a power module provided in an embodiment of this application;

[0056] Figure 18c A cross-sectional structural diagram of a power module provided in an embodiment of this application;

[0057] Figure 19a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0058] Figure 19b This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0059] Figure 19c This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0060] Figure 20 This is a partial structural schematic diagram of a power module provided in an embodiment of this application;

[0061] Figure 21 This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0062] Figure 22a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0063] Figure 22b A cross-sectional structural diagram of a power module provided in an embodiment of this application;

[0064] Figure 23a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0065] Figure 23b This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0066] Figure 23c This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0067] Figure 24a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0068] Figure 24b This is a schematic diagram of the structure of a power module provided in an embodiment of this application.

[0069] Figure label:

[0070] 1000 - Powertrain; 2000 - Vehicle body; 3000 - Wheels; 4000 - Power battery;

[0071] 100 - Motor controller; 200 - Motor;

[0072] 10 - Power conversion circuit; 20 - Drive circuit; 30 - Controller;

[0073] 1-Substrate; 11-Base plate; 12-Metal layer; 121-First metal layer; 1211-First metal island; 1212-Connecting bridge; 122-Second metal layer; 123-Third metal layer; 1231-Third metal island; 13-Insulating layer; 2-Input terminal; 21-First input terminal; 211-Terminal; 22-Second input terminal; 3-Output terminal; 4-Power switching device; 41-First switching device; 42, 42a, 42b, 42c-Second switching devices; 5-Package; 6-Adapter;

[0074] A1 - First direction; A2 - Second direction; G1 - First switching device group; G2 - Second switching device group; K - Hollow structure; P - Pad; W - Groove; t1, t2 - Springs. Detailed Implementation

[0075] Power electronic converter systems composed of power modules can convert energy through power conversion circuits. Parasitic inductance in power conversion circuits can easily cause circuit oscillations, and existing power module designs that reduce parasitic inductance are insufficient to meet the miniaturization requirements of power modules in specific application scenarios.

[0076] Based on this, embodiments of this application provide a power module, a powertrain, and an electric vehicle. The power module can reduce parasitic inductance in the circuit while also meeting the miniaturization design requirements of the module.

[0077] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0078] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0079] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0080] Figure 1a This application illustrates the structure of an electric vehicle according to an embodiment. In this embodiment, an electric vehicle refers to a wheeled device driven or towed by a power unit. In one implementation, the electric vehicle includes passenger cars, commercial vehicles, or specialized vehicles such as emergency rescue vehicles, water trucks, sewage suction trucks, cement mixer trucks, crane trucks, and medical vehicles. Exemplarily, electric vehicles include electric vehicles (EVs), pure electric vehicles / battery electric vehicles (PEVs / BEVs), hybrid electric vehicles (HEVs), range-extended electric vehicles (REEVs), and plug-in hybrid electric vehicles (PHEVs).

[0081] like Figure 1a As shown, the electric vehicle includes a power battery 4000, wheels 3000, a vehicle body 2000, and a powertrain 1000. The powertrain 1000, power battery 4000, and wheels 3000 are assembled on the vehicle body 2000.

[0082] like Figure 1b As shown, the powertrain 1000 includes a motor controller 100 and a motor 200. The motor controller 100 receives DC power from the power battery 4000 and outputs AC power to the motor 200. The motor 200 receives the AC power output from the motor controller 100 and drives the wheels 3000 of the electric vehicle. In one embodiment, the powertrain 100 integrates the motor 200 and the motor controller 100 into a single housing, increasing the integration density of the powertrain 1000, reducing its size and cost, facilitating a lightweight design, and improving power density.

[0083] In this embodiment of the application, the motor controller 100 includes as follows: Figure 2 The power conversion circuit 10, drive circuit 20, and controller 30 shown are included. The power conversion circuit 10 includes a three-phase bridge arm circuit. The two ends of each phase bridge arm circuit are used to receive power from the power battery 4000, and the midpoint M of each phase bridge arm circuit is used to output one phase of AC power to the motor 200 to drive the motor 200. The power battery 4000 is the power source for the electric vehicle.

[0084] like Figure 2As shown, a set of power switching devices Q is connected in series between the end of each phase bridge arm that connects to the positive terminal of the power battery 4000 and the midpoint M of the bridge arm to form the upper bridge arm of the bridge arm circuit. This set of power switching devices Q is used to control the on / off state of the upper bridge arm circuit. A set of power switching devices Q is also connected in series between the end of each phase bridge arm that connects to the negative terminal of the power battery 4000 and the midpoint M of the bridge arm to form the lower bridge arm of the bridge arm circuit. This set of power switching devices Q is used to control the on / off state of the lower bridge arm circuit. The drive circuit 20 can output a drive signal to each of the power switching devices Q through the control signal sent by the controller 30 to control the conduction and cutoff of each power switching device Q, thereby outputting three-phase AC power to the three-phase windings of the motor 200 so that the motor 200 outputs the required torque and drives the electric vehicle.

[0085] In one embodiment, the motor controller 100 includes a plurality of power modules, which are used to form Figure 2 The power conversion circuit shown is an assembly of power electronic devices that enable power conversion. These power electronic devices include insulated-gate bipolar transistors (IGBTs), silicon carbide power transistors, silicon transistors, metal-oxide-semiconductor field-effect transistors (MOSFETs), and diodes. The power electronic devices within each power module are electrically interconnected to form... Figure 2 The circuit shown is a single-phase bridge arm circuit.

[0086] like Figure 3 As shown, the power module provided in this embodiment includes a substrate 1, an input terminal 2, an output terminal 3, and a power switch assembly 4, which is the aforementioned power electronic device. The substrate 1 includes a base plate 11 and a conductive layer 12 disposed on the base plate 11. The conductive layer 12 and the plurality of power switch devices 4 form a [structure / structure]. Figure 2 The bridge arm circuit shown has its input terminal 2 connected to the positive and negative terminals of the power supply, and its output terminal 3 outputs AC power.

[0087] In some embodiments, substrate 1 is a direct-bonded copper board. Taking double-sided copper clad laminate (DCL) as an example, the base plate 11 can be an insulating material such as ceramic or glass, and a conductive layer 12 is respectively disposed on both sides of the base plate 11 in the thickness direction. The conductive layer 12 is specifically a copper layer. The conductive layer 12 can also be an aluminum layer or other conductive metal layer. The power switch assembly 4 of the power module is connected to one of the conductive layers 12 to form a bridge arm circuit, and the input terminal 2 and the output terminal 3 are connected to this conductive layer 12. The other conductive layer 12 does not participate in the electrical connection of the bridge arm circuit, and therefore is omitted in the following embodiments.

[0088] In one embodiment, the power module further includes a package 5, which encapsulates the substrate 1 and multiple power switching devices 4. The ends of the input terminal 2 and the output terminal 3 that are away from the substrate 1 are exposed outside the package 5, which facilitates the connection of electrical devices.

[0089] Figure 4a and Figure 4b Two power module structural layouts are illustrated. Exemplarily, substrate 1 is rectangular. For ease of understanding, a first direction A1 and a second direction A2 perpendicular to the thickness direction of substrate 1 are defined by the shape of substrate 1, with the first direction A1 perpendicular to the second direction A2. The input terminal 2 and output terminal 3 of the power module are opposite each other along the second direction A2. Input terminal 2 includes a first input terminal 21 and a second input terminal 22 spaced apart along the first direction A1, which are used to connect the positive and negative terminals of the power supply, respectively. The power switching assembly 4 includes a first switching device group G1 and a second switching device group G2. The first switching device group G1 is connected to the conductive layer 12 to form an upper bridge arm, and the second switching device group G2 is connected to the conductive layer 12 to form a lower bridge arm. The dashed lines with arrows indicate the circuits in the bridge arm circuits used to connect the power supply.

[0090] Figure 4a The power module shown is a 2DC (direct current) architecture design. The input terminal 2 includes a first input terminal 21 and a second input terminal 22. The first switching device group G1 and the second switching device group G2 are arranged along the first direction A1. Both the first switching device group G1 and the second switching device group G2 are laid out with traces running to the left along the first direction A1. The power module has a large size along the first direction A1.

[0091] Figure 4bThe power module shown is a 3DC (direct current) architecture design. Input terminal 2 includes two first input terminals 21 and one second input terminal 22. The second input terminal 22 is arranged between the two first input terminals 21 along a first direction A1. A first switching device group G1 and a second switching device group G2 are arranged along a second direction A2, both with traces running to the left along the first direction A1. The power module has a relatively large size along the second direction A2. Furthermore, to connect the first switching device group G1 to the two first input terminals 21, circuit traces need to be laid out on both sides of the base plate 11 along the first direction A1, occupying space of the power module along the first direction A1.

[0092] With the development of technology, the design of power modules needs to balance low parasitic inductance and miniaturization. This application provides a solution such as... Figure 5a The power module shown aims to reduce parasitic inductance while ensuring that the size of the power module can be reduced or even decreased to meet application requirements.

[0093] Figure 5a This is a schematic diagram of the structural layout of the power module provided in this application embodiment. For ease of illustration, the structure of the package 5 is omitted. Exemplarily, the conductive layer 12 of the substrate 1 includes multiple metal layers that are isolated from each other, including a first metal layer 121, a second metal layer 122, and a third metal layer 123. The power switch assembly 4 includes two switch device groups. The first switch device group G1 and the second switch device group G2 are arranged at intervals along a first direction A1, facing each other along the first direction A1, and there is a gap between the two groups. The first switch device group G1 is disposed on the first metal layer 121, and the second switch device group G2 is disposed on the second metal layer 122. Based on the relative positions of the first switch device group G1 and the second switch device group G2 along the first direction A1, the area of ​​the first metal layer 121 used to support the multiple first switch device groups G1 and the area of ​​the second metal layer 122 used to support the second switch device group G2 are arranged at intervals along the first direction A1. The third metal layer 123 is arranged along the first direction A1 between the first switching device group G1 and the second switching device group G2.

[0094] Each switching device includes a first electrode and a second electrode, and the switching devices can be connected in series in a circuit via the first and second electrodes. Specifically, a first switching device group G1 is disposed on a first metal layer 121, with the first electrode of each switching device in the first switching device group G1 connected to the first metal layer 121 and the second electrode connected to the second metal layer 122. A second switching device group G2 is disposed on the second metal layer 122, with the first electrode of each switch in the second switching device group G2 connected to the second metal layer 122 and the second electrode connected to the third metal layer 123. A first input terminal 21 is connected to the first metal layer 121, and a second input terminal 22 is used to connect to the third metal layer 123. An output terminal 3 is connected to the second metal layer 122 and is used to output alternating current.

[0095] like Figure 5a The power module shown is connected in sequence through a first switching device group G1, a second metal layer 122, a second switching device group G2, and a third metal layer 123 to form a bridge arm circuit. The first metal layer 121, the first switching device group G1, and the second metal layer 122 can be electrically connected in sequence to form the upper bridge arm between the first input terminal 21 and the output terminal 3. The second metal layer 122, the second switching device group G2, and the third metal layer 123 can be electrically connected in sequence to form the lower bridge arm between the second input terminal 22 and the output terminal 3. The second metal layer 122 is used to form the midpoint of the bridge arm.

[0096] Please continue to refer to Figure 5a As shown, taking the first input terminal 21 connected to the positive terminal of the power supply and the second input terminal 22 connected to the negative terminal of the power supply as an example, the dashed line with arrows illustrates a current loop connecting the positive and negative terminals of the power supply. Since the first switching device group G1 and the second switching device group G2 are arranged at intervals along the first direction, the current path corresponding to the first switching device group G1 and the current path corresponding to the second switching device group G2 have opposite current directions, which can reduce the parasitic inductance in the current loop and reduce the impact of parasitic inductance on the function of the power module. Along the first direction A1, the circuit traces of the first switching device group G1 extend towards the second switching device group G2 to connect to the second metal layer 122, and the circuit traces of the second switching device group G2 extend towards the first switching device group G2 to connect to the third metal layer 123. The first switching device group G1 and the second switching device group G2 can utilize the gap between the first switching device group G1 and the second switching device group G2 for circuit wiring, which is beneficial to reducing the size of the power module along the first direction A1. Furthermore, the circuit traces of the bridge arm circuit do not need to occupy the space on both sides of the substrate 1 along the first direction A1, nor will they increase the size of the power module along the first direction A1.

[0097] As can be seen, the power module provided in this application arranges the switching devices of the upper and lower bridge arms along the first direction A1 in the bridge arm circuit, and connects one of the input terminals through a third metal layer located between the switching devices of the upper and lower bridge arms. This reduces the parasitic inductance in the current loop connected to the power supply and is beneficial for reducing the size of the power module along the first direction A1. In some embodiments, the size of the power module in the first direction A1 is similar to... Figure 4a and Figure 4b The power module shown has a size equivalent to that in the first direction A1, and a size equivalent to that in the second direction A2. Figure 4a The power module shown is comparable to and smaller than the size in the second direction A2. Figure 4b The dimensions of the power module shown in the second direction A2 allow the parasitic inductance generated in the circuit formed by the power module to be reduced to below [value missing]. Figure 4a and Figure 4b The parasitic inductance of the power module shown balances the design requirements of low parasitic inductance and miniaturization.

[0098] Figure 5b The example illustrates a portion of the power module's structure. The substrate 1 is a double-sided copper-clad laminate, with two conductive layers 12 respectively disposed on the two surfaces of the base plate 11. One of the conductive layers 12 comprises multiple metal layers, which are disposed in the same layer, meaning each metal layer is attached and fixed to the same surface of the base plate 11. In the fabrication of the substrate 1, multiple metal layers can be fabricated in the same layer by means of etching, simplifying the fabrication process. These multiple metal layers include the aforementioned second metal layer 122 and third metal layer 123, which are arranged at intervals on the same surface of the base plate 11 in a co-layer configuration.

[0099] The power module provided in this application embodiment can have its various structures reasonably adjusted in its specific layout design as needed. Next, the power module provided in this application embodiment will be described exemplarily through a specific power module design structure.

[0100] Figure 6a An example of a 2DC architecture power module is provided, including a positive input terminal and a negative input terminal. For example... Figure 6aAs shown, the power switching assembly 4 includes multiple first switching devices 41 and multiple second switching devices 42. The multiple first switching devices 41 are disposed on a first metal layer 121, and the multiple second switching devices 42 are disposed on a second metal layer 122. The multiple first switching devices 41 form a first switching device group G1, and the multiple second switching devices 42 form a second switching device group G2, with a gap between the two groups. The first metal layer 121, the multiple first switching devices 41, and the second metal layer 122 can be electrically connected to form an upper bridge arm between the first input terminal 21 and the output terminal 3. The second metal layer 122, the multiple second switching devices 42, and the third metal layer 123 can be electrically connected to form a lower bridge arm between the second input terminal 22 and the output terminal 3. Along the second direction A2, the first input terminal 21 is opposite to the first switching device group G1, and the second input terminal 22 is opposite to the second switching device group G2.

[0101] In one embodiment, the plurality of first switching devices 41 included in the first switching device group G1 and the plurality of second switching devices 42 included in the second switching device group G2 are axially symmetrically distributed about the second direction A2, which can further reduce parasitic inductance.

[0102] In some embodiments, based on the scheme where the second metal layer 122 and the third metal layer 123 are disposed in the same layer, the second metal layer 122 includes a notch, the third metal layer 123 is accommodated within the notch, and a gap exists between the second metal layer 122 and the third metal layer 123. Along a direction perpendicular to the substrate 1, the orthographic projection of the second metal layer 122 on the base plate 11 does not overlap with the orthographic projection of the third metal layer 123 on the base plate 11. The notch can be implemented by forming a hollow through the second metal layer 122, or by forming a groove at the edge of the second metal layer 122. The third metal layer 123 is accommodated within the notch, and the third metal layer 123 and the second metal layer 122 are structurally avoided from contact.

[0103] like Figure 6aAs shown, in one embodiment, the second metal layer 122 includes a cutout region K, and the third metal layer 123 is located within the cutout region K. The second input terminal 22 is connected to the end of the third metal layer 123 opposite to the output terminal 3. In the first switching device group G1, at least a portion of the first switching devices 41 are arranged at intervals along the second direction A2. The second electrode of each first switching device 41 is routed along the first direction A1 to the circuit side of a plurality of second switching devices 42 to connect to the second metal layer 122. This portion of the second metal layer 122 used to connect the first switching devices 41 is located between the third metal layer 123 and the first metal layer 121. The connection positions of the plurality of first switching devices 41 and the second metal layer 122 are arranged at intervals along the second direction A2. At least a portion of the second switching devices 42 are arranged at intervals along the second direction A2. The second electrode of each second switching device 42 is routed along the first direction A1 to the circuit side of a plurality of first switching devices 41 to connect to the third metal layer 123. The connection positions of the plurality of second switching devices 42 and the third metal layer 123 are arranged at intervals along the second direction A2. The connection positions of the second electrodes of the plurality of first switching devices 41 to the second metal layer 122 and the connection positions of the plurality of second switching devices 42 to the third metal layer 123 are arranged along the first direction A1.

[0104] In one embodiment, along the first direction A1, a first switching device 41 and a second switching device 42 are opposite each other, and the connection position of the second electrode of the first switching device 41 to the second metal layer 122 and the connection position of the second switching device 42 to the third metal layer 123 are opposite each other.

[0105] along Figure 6a By cutting the power module at the location of the interrupt line Z, we can obtain... Figure 6b and Figure 6c The diagram shows a cross-sectional structure. Wherein, Figure 6b This diagram illustrates a cross-sectional view of the structure on one side of the first input terminal 21, viewed along the first direction A1. Figure 6c The diagram illustrates a cross-sectional view of the structure on one side of the second input terminal 22, viewed along the first direction A1. For ease of illustration, the structures of the switching device, output terminal 3, and first input terminal 21 have been simplified.

[0106] Combination Figure 6a Please refer to the above. Figure 6b and Figure 6cAs shown, multiple first switching devices 41 are disposed on a first metal layer 121. The first electrode of each first switching device 41 is connected to the first metal layer 121, and the second electrode of each first switching device 41 is connected to a second metal layer 122. This portion of the second metal layer 122 is located between a third metal layer 123 and the first metal layer 121 along a first direction A1. Multiple second switching devices 42 are disposed on the second metal layer 122. The first electrode of each second switching device 42 is connected to the second metal layer 122, and the second electrode of each second switching device 42 is used to connect to the third metal layer 123. The first electrode of each first switching device 41 can be fixed to the first metal layer 121 using a pressure silver sintering process to achieve electrical connection between the first electrode and the first metal layer 121. The second electrode of each first switching device 41 can be connected to the second metal layer 122 using leads, copper busbars, bonding wires, etc. Similarly, the first electrode of each second switching device 42 can be fixed to the second metal layer 122 by a pressure silver sintering process to achieve electrical connection between the first electrode and the second metal layer 122. The second electrode of each second switching device 42 can be connected to the third metal layer 123 by means of leads, copper busbars, bonding wires, etc. The second input terminal 22 is connected to the surface of the third metal layer 123 opposite to the base plate 11 along the thickness direction of the substrate 1.

[0107] As an example, the third metal layer 123, the first metal layer 121, and the second metal layer 122 are all several metal layers among the multiple metal layers of the conductive layer 12. In the fabrication of the substrate 1, the third metal layer 123, the first metal layer 121, and the second metal layer 122 can be simultaneously fabricated using the same process. The third metal layer 123, the first metal layer 121, and the second metal layer 122 are metallic structures and have the same thickness. Figures 6a to 6c As can be seen, along the thickness direction of substrate 1, the projection of the second input terminal 22 on substrate 1 partially overlaps with the second metal layer 122. To prevent the second input terminal 22 from contacting other metal layers besides the third metal layer 123, the distance between the second input terminal 22 and the base plate 11 is greater than the thickness of the conductive layer 12, resulting in a gap between the second input terminal 22 and the second metal layer 122 along the thickness direction of substrate 1, thus allowing the second input terminal 22 to avoid contact with the second metal layer 122. As a specific example, the second input terminal 22 is connected to the third metal layer 123 via a pad P. The height of the pad P allows for a gap between the second input terminal 22 and the conductive layer 12, preventing the second input terminal 22 from connecting to other metal layers besides the third metal layer 123. The position of the pad P is the soldering position between the third metal layer 123 and the second input terminal 22.

[0108] based on Figures 6a to 6c The power module shown is as follows: Figure 7aAs shown, taking the example of the first input terminal 21 connected to the positive terminal of the power supply and the second input terminal 22 connected to the negative terminal of the power supply, the dashed power module with arrows represents the current paths at multiple locations in the bridge arm circuit. A first switching device group G1 composed of multiple first switching devices 41 and a second switching device group G2 composed of multiple second switching devices 42 are opposite each other along the first direction A1, and the first switching device group G1 and the second switching device group G2 are symmetrical about the second direction A2. The current path of the first metal layer 121 extends from the first input terminal 21 side along the second direction A2 to the output terminal 3 side, so as to electrically connect with the multiple first switching devices 41 arranged along the second direction A2. Each first switching device 41 forms a current path with the second metal layer 122 extending along the first direction A1 to the multiple second switching devices 42. The current path of the second metal layer 122 extends from the output terminal 3 side along the second direction A2 to the second input terminal 22 side, so as to electrically connect with the multiple second switching devices 42 arranged along the second direction A2. Each second switching device 42 forms a current path with the third metal layer 123, pointing towards the first switching device group G1 along the first direction A1. The current path of the third metal layer 123 points from the output terminal 3 side along the second direction A2 towards the second input terminal 22 side. Multiple first switching devices 41 are connected in parallel in the circuit connection between the first metal layer 121 and the second metal layer 122, and multiple second switching devices 42 are connected in parallel in the current connection between the second metal layer 122 and the third metal layer 123. The current loop of the entire power module includes at least two current paths with opposite current directions, which can reduce the parasitic inductance in the current loop and reduce the impact of parasitic inductance on the function of the power module. Along the first direction A1, the circuit traces between the second electrode of each first switching device 41 and the second metal layer 122, and the circuit traces connecting the second electrode of each second switching device 42 to the third metal layer 123, can all utilize the space between the first switching device group G1 and the second switching device group G2, without occupying the space on both sides of the substrate 1 along the first direction A1, which is beneficial to reducing the size of the power module along the first direction A1.

[0109] Combination Figure 7a As shown, Figure 7b The diagram illustrates the current path of multiple second switching devices 42, which is then fed to the second input terminal 22 via the third metal layer 123. The welding position between the third metal layer 123 and the second input terminal 22 is located near one end of the third metal layer 123 along the second direction A2, and multiple second switching devices 42 are connected to the second input terminal 22 through this welding position. The current paths from the third metal layer 123 to the second input terminal 22 are different for different second switching devices 42.

[0110] Refer to together Figure 7a and Figure 7bAs shown, taking three second switching devices 42 as an example, along the second direction A2, from the second input terminal 22 to the output terminal 3, the second switching device 42a, the second switching device 42b, and the third switching device 42c are arranged sequentially. The second switching device 42a is closer to the second input terminal 22, and the second switching device 42c is closer to the output terminal 3. The current path a of the second switching device 42a through the third metal layer 123 to the second input terminal 22 is less than the current path b of the second switching device 42b through the third metal layer 123 to the second input terminal 22. The current path b of the second switching device 42b through the third metal layer 123 to the second input terminal 22 is less than the current path c of the second switching device 42c through the third metal layer 123 to the second input terminal 22.

[0111] Figure 8a Another power module is illustrated, in which the third metal layer 123 is connected to the second input terminal 22 via multiple pads P, the number and location of which differ from the example. Figure 7a The power module shown. As an example, along the second direction A2, for three second switching devices 42, the third metal layer 123 is provided with two pads P, with one pad P corresponding to every two second switching devices 42.

[0112] Figure 8b It shows Figure 8a The current of the multiple second switching devices 42 in the power module passes through the third metal layer 123 to the second input terminal 22.

[0113] Refer to together Figure 8a and Figure 8b As shown, taking the second switching device 42a, the second switching device 42b, and the third switching device 42c as examples, the second switching device 42a is closer to the second input terminal 22, and the second switching device 42c is closer to the output terminal 3. Along the second direction A2, the two pads P are respectively the pad P1 located between the second switching devices 42a and 42b, and the pad P2 located between the second switching devices 42b and 42c. The current path a of the second switching device 42a includes the distance between the second switching device 42a and the pad P2 and the distance from the pad P2 to the input terminal 2 side. The current path c of the second switching device 42c includes the distance between the second switching device 42c and the pad P1 and the distance from the pad P1 to the input terminal 2 side. The current path b of the second switching device 42b goes through the pad P1 to the second input terminal 22, and may also go through the pad P2 to the second input terminal 22. Figure 7b compared to, Figure 8bIn the power module shown, the difference in length between the three current paths is smaller, which means that the difference in the current path from the different second switching devices 42 through the third metal layer 123 to the second input terminal 22 is reduced, resulting in better current sharing.

[0114] like Figure 9a The power module shown is similar to... Figure 6a The difference in the power module shown is that, specifically, the third metal layer 123 includes a plurality of third metal islands 1231, which are spaced apart along the second direction A2. Figure 9a By cutting the power module at the location of the interrupt line Z, we can obtain... Figure 9b and Figure 9c The diagram shows a cross-sectional structure. Wherein, Figure 9b This diagram illustrates a cross-sectional view of the structure on one side of the first input terminal 21, viewed along the first direction A1. Figure 9c The diagram shows a cross-sectional view of the structure on one side of the second input terminal 22, viewed along the first direction A1.

[0115] Refer to together Figures 9a to 9c As shown, the second metal layer 122 includes multiple cutout structures K, with each third metal island 1231 located within one cutout structure K. The second input terminal 22 extends along the second direction A2 towards the output terminal 3 between the first switching device group G1 and the second switching device group G2. The second input terminal 22 and the third metal layer 123 are connected via multiple pads P along the thickness direction of the substrate 1. Dividing the third metal layer 123 into multiple isolated third metal islands 1231 facilitates the electrical connection layout between the multiple second switching devices 42 and the third metal layer 123, and also improves maintainability. Figures 9a to 9c The power module shown is as follows: Figure 10a As shown, taking the example of the first input terminal 21 connected to the positive terminal of the power supply and the second input terminal 22 connected to the negative terminal of the power supply, the dashed line with arrows shows the current paths at multiple locations in the bridge arm circuit formed by the power module. The first switching device group G1 and the second switching device group G2 are opposite to each other and symmetrically positioned along the first direction A1. Each second switching device 42 can be connected to the second input terminal 22 through a pad P on a third metal island 1231 to form a current path. The current loop of the entire power module includes at least two current paths with opposite current directions, which can reduce the parasitic inductance in the current loop and reduce the impact of parasitic inductance on the function of the power module. Along the first direction A1, the circuit traces of the second electrode of each first switching device 41 to the second metal layer 122 and the circuit traces of the second electrode of each second switching device 42 to the third metal island 1231 do not need to occupy the space on both sides of the substrate 1 along the first direction A1, which is beneficial to reducing the size of the power module along the first direction A1.

[0116] Combination Figure 10a As shown, Figure 10b The diagram illustrates the current paths of multiple second switching devices 42, which are connected to the second input terminal 22 via multiple third metal islands 1231. The current paths of different second switching devices 42 to the second input terminal 22 via their corresponding third metal islands 1231 are different.

[0117] As an example, such as Figure 10b As shown, along the second direction A2, for the three second switching devices 42, the third metal layer 123 includes three third metal islands 1231, each of which has a pad P for connecting to the second input terminal 22. Along the first direction A1, the second switching device 42a corresponds to pad P1, the second switching device 42b corresponds to pad P2, and the second switching device 42c corresponds to pad P3. The current path a of the second switching device 42a through the pad P1 of the third metal layer 123 to the second input terminal 22 is less than the current path b of the second switching device 42b through the pad P2 of the third metal layer 123 to the second input terminal 22. The current path b of the second switching device 42b through the pad P2 of the third metal layer 123 to the second input terminal 22 is less than the current path c of the second switching device 42c through the pad P3 of the third metal layer 123 to the second input terminal 22. The current paths of the three second switching devices 42 are... Figure 7b The current paths of the three second switching devices 42 shown are similar.

[0118] In some embodiments, such as Figure 11 The power module shown is similar to... Figure 9a The difference in the power module shown is that the second input terminal 22, where it is connected to the pad P, features a spring-loaded design. This spring-loaded design provides a flexible connection to the pad P, resulting in higher connection reliability. In one embodiment, the second input terminal 22 includes a body and at least one spring-loaded piece for connecting to the third metal layer 123. Each spring-loaded piece is connected to one or both ends of the body along the second direction A1, and each spring-loaded piece protrudes from the surface of the body facing the third metal layer 123 along the thickness direction of the substrate 1. The second input terminal 22 connects to the third metal layer 123 via the spring-loaded piece, which enhances connection reliability while meeting good electrical connection requirements. The spring-loaded piece extends along the second direction and connects to the third metal layer 123, resulting in different current paths from the spring-loaded piece to the second input terminal 22. In the structural design of the power module, combining the structure of the second switching device 42 at different locations with the spring-loaded piece can reduce the current path differences between different second switching devices 42 and improve current sharing.

[0119] As an example, Figure 11 In the middle, the second input terminal 22 includes two types of spring contact structures. The structure of spring contact structure t1 can be referred to Figure 12a and Figure 12b As shown, the structure of the spring piece t2 can be referred to Figure 13a and Figure 13b As shown.

[0120] Combination Figure 12a and Figure 12b As shown, the second input terminal 22 has two parallel strip slots c, each strip slot c extending through the second input terminal 22 along its thickness direction. A spring clip structure t1 is formed between the two strip slots c. The structure of the second input terminal 22, excluding the spring clip structure t1, is the main body. The spring clip structure t1 is deformed so that its middle position can sink towards the pad P, forming a downwardly convex structure, which facilitates the connection between the spring clip structure t1 and the pad P.

[0121] In some embodiments, the length direction of each strip c is parallel to or approximately parallel to the second direction A2, then the length direction of the spring structure t1 is parallel to the second direction A2. When the second input terminal 22 is connected to the pad P through the spring structure t1, the current path is related to the length direction of the spring structure t1. Based on the arrangement of multiple second switching devices 42 along the second direction A2, the current path of the second switching devices 42 connected to the second input terminal 22 through the pad P can be changed by the spring structure t1.

[0122] Combination Figure 13a and Figure 13b As shown, the second input terminal 22 has a U-shaped groove d that extends through the second input terminal 22 along its thickness direction, forming a cantilever beam-type spring structure t2. The structure of the second input terminal 22, excluding the spring structure t1, is the main body. The spring structure t2 is deformed so that its free end sinks towards the pad P, forming a downwardly convex structure, facilitating the connection between the spring structure t2 and the pad P.

[0123] In some embodiments, if the opening direction of the U-shaped groove d is parallel to or approximately parallel to the second direction A2, then the length direction of the spring structure t2 is parallel to the second direction A2. When the second input terminal 22 is connected to the pad P through the spring structure t2, the current path is related to the length direction of the spring structure t2. Based on the arrangement of multiple second switching devices 42 along the second direction A2, the current path of the second switching devices 42 connected to the second input terminal 22 through the pad P can be changed by the spring structure t2.

[0124] Figure 14 It shows Figure 11 The current of multiple second switching devices 42 in the power module shown passes through multiple third metal islands 1231 and is connected to the second input terminal 22 via the current path.

[0125] As an example, such as Figure 14 As shown, along the second direction A2, for the three second switching devices 42, the third metal layer 123 includes three third metal islands 1231, each of which has a pad P for connecting the second input terminal 22. Along the first direction A1, the second switching device 42a corresponds to pad P1, the second switching device 42b corresponds to pad P2, and the second switching device 42c corresponds to pad P3.

[0126] The second input terminal 22 has a spring structure t2 corresponding to the pad P1. The second switching device 42a is connected to the second input terminal 22 through the pad P1 and the spring structure t2 to form a current path a. The current path a includes the distance between the second switching device 42a and the pad P1, the length of the spring structure t2 along the second direction A2, and the distance from the end of the spring structure t2 toward the output terminal 3 to the side of the input terminal 2.

[0127] The second input terminal 22 has a spring structure t1 corresponding to the pad P2. The second switching device 42b is connected to the second input terminal 22 through the pad P2 and the spring structure t1 to form a current path b. The current path b may include the distance between the second switching device 42b and the pad P2, the distance from the connection position of the spring structure t1 and the pad P2 along the second direction A2 to the end of the spring structure t1 facing the output terminal 3, and the distance from the end of the spring structure t1 facing the output terminal 3 to the side of the input terminal 2. The current path b may also include the distance between the second switching device 42b and the pad P2, and the distance from the connection position of the spring structure t1 and the pad P2 along the second direction A2 to the side of the input terminal 2.

[0128] and Figure 10b compared to, Figure 16 In the power module shown, the difference in length between the three current paths is smaller, which means that the difference in the current path from the different second switching devices 42 through the third metal layer 123 to the second input terminal 22 is reduced, resulting in better current sharing.

[0129] like Figure 15a A power module is shown, which is related to Figure 9a The difference in the power module shown is that the connection positions of the second electrodes of the multiple first switching devices 41 to the second metal layer 122 and the connection positions of the multiple second switching devices 42 to the third metal layer 123 are alternately distributed along the second direction A2, sharing the space between the first switching device group G1 and the second switching device group G2.

[0130] Specifically, such as Figure 15aAs shown, the third metal layer 123 includes a plurality of third metal islands 1231, which are spaced apart along the second direction A2. The second electrode of each second switching device 42 is traced along the first direction A1 toward one of the plurality of first switching devices 41 to connect to a third metal island 1231. Correspondingly, the second metal layer 122 includes a plurality of notches exemplified by grooves W along the first direction A1 toward the edge of the first switching device group G1, which are spaced apart along the second direction A2. Each third metal island 1231 is located within one groove W.

[0131] Along the second direction A2, the protruding portion of the second metal layer 122 adjacent to a groove W is used to connect at least one first switching device 41. It can be considered that multiple first switching devices...

[0132] The connection positions of the second electrode of component 41 and the second metal layer 122 are alternately arranged with multiple third metal islands 1231, thereby sharing the space between the first switching device group G1 and the second switching device group G.

[0133] along Figure 15a By cutting the power module at the location of the interrupt line Z, we can obtain... Figure 15b and Figure 15c The diagram shows a cross-sectional structure. Wherein, Figure 15b This diagram illustrates a cross-sectional view of the structure on one side of the first input terminal 21, viewed along the first direction A1. Figure 15c The diagram shows a cross-sectional view of the structure on one side of the second input terminal 22, viewed along the first direction A1.

[0134] Combination Figure 15a Please refer to the above. Figure 15b and Figure 15c As shown, along the first direction A1, a third metal island 1231 is housed within a plurality of grooves W on the side of the second metal layer 122 facing the first metal layer 121. Each of the third metal islands 1231 is connected to a second input terminal 22. The second input terminal 22 is connected along the thickness direction of the substrate 1 to the surface of each third metal island 1231 opposite to the base plate 11.

[0135] based on Figures 15a to 15c The power module shown is as follows: Figure 16As shown, taking the first input terminal 21 connected to the positive terminal of the power supply and the second input terminal 22 connected to the negative terminal of the power supply as an example, the current paths at multiple locations included in the bridge arm circuit formed by the power module are indicated by dashed lines with arrows. The current loop of the entire power module includes current paths with opposite current directions, which can reduce the parasitic inductance in the current loop and reduce the impact of parasitic inductance on the function of the power module. Along the first direction A1, the connection positions of the second electrode of each first switching device 41 to the second metal layer 122 and the connection positions of each second switching device 42 to the third metal island 1231 are located between the first switching device group G1 and the second switching device group G2, and the circuit traces do not need to occupy the space on both sides of the substrate 1 along the first direction A1. The connection positions of the second electrodes of multiple first switching devices 41 to the second metal layer 122 and the connection positions of multiple second switching devices 42 to the third metal island 1231 are alternately distributed along the second direction A2, which can facilitate circuit traces without increasing the size of the power module along the first direction A1.

[0136] In some embodiments, the substrate 1 includes a plurality of phase-isolating metal layers, in which different metal layers are stacked. Along a direction perpendicular to the substrate 1, one sub-metal layer is arranged on one side of the thickness direction of another sub-metal layer, and the two stacked metal layers are insulated from each other by an insulating material to achieve phase isolation. In the power module provided in the embodiments of this application, as... Figure 17 As shown, the third metal layer 123 and the second metal layer 122 can also be implemented by stacking. The substrate 1 includes a base plate 11 and conductive layers 12 disposed on both sides of the base plate 11, one of which includes the second metal layer 122. The substrate 1 also includes a third metal layer 123, which is disposed along the thickness direction of the base plate 11 on the side of the second metal layer 122 opposite to the base plate 11. An insulating layer 13 is disposed between the third metal layer 123 and the second metal layer 122 to insulate and isolate them.

[0137] Next, some embodiments of power modules will be introduced with the third metal layer 123 and the second metal layer 122 stacked together.

[0138] like Figure 18a The power module shown is similar to... Figure 6aThe difference in the provided power module lies in that the third metal layer 123 is stacked on the surface of the second metal layer 122 facing away from the base plate 11, and the third metal layer 123 and the second metal layer 122 are insulated from each other by an insulating layer 13. Along the direction perpendicular to the substrate 1, the orthographic projection of the third metal layer 123 on the base plate 11 at least partially overlaps with the orthographic projection of the second metal layer 122 on the base plate 11. On the surface of the substrate 1 used to mount the first switching device 41 and the second switching device 42, the third metal layer 123 and the second metal layer 122 share a portion of space in a stacked manner, which helps to reduce the size of the power module along the first direction A1 and the second direction A2.

[0139] along Figure 18a By cutting the power module at the location of the interrupt line Z, we can obtain... Figure 18b and Figure 18c The diagram shows a cross-sectional structure. Wherein, Figure 18b This diagram illustrates a cross-sectional view of one side of the plurality of first switching devices 41 viewed along the first direction A1. Figure 18c The diagram shows a cross-sectional view of one side of multiple second switching devices 42 along the first direction A1.

[0140] Combination Figure 18a Please refer to the above. Figure 18b and Figure 18c As shown, along a plane perpendicular to the first direction A1 and the second direction A2, a third metal layer 123 is stacked on the side of the second metal layer 122 facing away from the base plate 11, and the third metal layer 123 and the second metal layer 122 are insulated from each other by an insulating layer 13. Along the thickness direction of the substrate 1, the distance between the third metal layer 123 and the base plate 11 is greater than the thickness of the second metal layer 122. The second input terminal 22 can be connected to the third metal layer 123 along the thickness direction of the substrate 1 through the pad P, or the second input terminal 22 can be directly connected to the third metal layer 123, with the second input terminal 22 avoiding the second metal layer 122.

[0141] Figures 18a to 18b The current path of the bridge arm circuit of the power module shown is... Figure 7a The current paths of the bridge arm circuits of the power modules shown are similar and will not be illustrated here.

[0142] by Figure 18a The power module shown is for reference. Figures 19a to 19c Several structural variations of power modules are illustrated. The common feature is that the third metal layer 123 is stacked on the side of the second metal layer 122 away from the base plate 11, and the third metal layer 123 and the second metal layer 122 are insulated from each other by an insulating layer 13.

[0143] like Figure 19a The power module shown is similar to... Figure 19aThe difference in the power module shown is that, as an example, along the second direction A2, for the three second switching devices 42, the solder layer 123 has two solder pads P, with one solder pad P corresponding to every two second switching devices 42. The current path of the bridge arm circuit of this power module is... Figure 8a The current paths of the bridge arm circuits of the power modules shown are similar, and the difference in the length of the current paths from different second switching devices 42 to the input terminal 2 side is small, resulting in better current sharing.

[0144] like Figure 19b The power module shown is similar to... Figure 18a The difference in the power module shown is that the solder layer 123 includes multiple third metal islands 1231, which are spaced apart along the second direction A2. Each third metal island 1231 is stacked on the side of the second metal layer 122 facing away from the base plate 11, and each third metal island 1231 is insulated from the second metal layer 122 by an insulating layer 13. The current path of the bridge arm circuit of this power module is... Figure 10a The current paths of the bridge arm circuits of the power modules shown are similar.

[0145] like Figure 19c The power module shown is similar to... Figure 19b The difference in the power module shown is that the second input terminal 22, where it connects to the solder layer 123, features a spring-loaded design. This spring-loaded design provides a flexible connection with the solder pad P, resulting in higher connection reliability. The spring-loaded structures t1 and t2 can be referenced from [reference needed]. Figure 11 The power module shown changes the current path of the second switching device 42 connected to the second input terminal 22 via pad P through a spring contact. The current path of the bridge arm circuit of this power module is... Figure 14 The current paths of the bridge arm circuits of the power modules shown are similar.

[0146] In some embodiments, substrate 1 is a stacked structure of multiple layers of double-sided copper-clad laminates. For example... Figure 20 As shown, the substrate 1 includes two base plates 11, and a conductive layer 12 is disposed on each side of the base plate 11 in the thickness direction. Along the thickness direction of the substrate 1, an insulating layer 13 is disposed between the conductive layer 12 of the upper base plate 11 facing the lower base plate 11 and the conductive layer 12 of the lower base plate 11 facing the upper base plate 11. The conductive layer 12 of the lower base plate 11 facing the upper base plate 11 includes a second metal layer 122, and the conductive layer 12 of the upper base plate 11 facing away from the lower base plate 11 includes a third metal layer 123.

[0147] This application also provides some 3DC architecture power modules, which differ from the power modules described above in that the input terminals of these power modules include three input terminals, namely two positive input terminals and one negative input terminal, or the three input terminals can be two negative input terminals and one positive input terminal.

[0148] Figure 21 An example of a power module with three input terminals is provided. Figure 21 As shown, the first input terminal 21 of the power module includes two ends 211, and the second input terminal 22 is arranged between the two ends 211 along the first direction A1. Both ends 211 are used to connect to the first metal layer 121. Taking the first input terminal 21 connected to the positive terminal of the power supply and the second input terminal 22 connected to the negative terminal of the power supply as an example, the dashed line with arrows illustrates a current loop connecting the positive and negative terminals of the power supply. The current path corresponding to the first switching device group G1 and the current path corresponding to the second switching device group G2 have opposite current directions, which can reduce the parasitic inductance in the current loop and reduce the impact of parasitic inductance on the function of the power module. The first switching device group G1 and the second switching device group G2 can utilize the gap between the first switching device group G1 and the second switching device group G2 for circuit wiring, which is beneficial to reducing the size of the power module along the first direction A1. In addition, the circuit wiring of the bridge arm circuit does not need to occupy the space on both sides of the substrate 1 along the first direction A1, and will not increase the size of the power module along the first direction A1.

[0149] Figure 21 The power module shown has a first switching device group G1 and a second switching device group G2 arranged at intervals along the first direction A1. Using three input terminals will not increase the size of the power module, so that the size of the power module with three input terminals is comparable to that of the power module with two input terminals.

[0150] Figure 22a This is a power module with three input terminals, the structure of which is similar to... Figure 6a The power module shown is similar. (And...) Figure 6a The difference in the power module shown is that, along the second direction A2, the first switching device group G1 is opposite to one end 211, the second switching device group G2 is opposite to the other end 211, and the second input terminal 22 is opposite to the third metal layer 123. To connect the two ends 211 of the first input terminal 21, the first metal layer 121 extends along the first direction A1 to the side of the plurality of second switching devices 42 facing the input terminal 2, such that a portion of the first metal layer 121 is arranged along the second direction A2 between the second metal layer 122 and the input terminal 2.

[0151] In one embodiment, along Figure 22a The power module is sectioned at the location of the interrupt line Z in the diagram. Figure 22b The cross-sectional structure shown is Figure 22b The diagram shows a cross-sectional view of one side of multiple first switching devices 41 along the first direction A1.

[0152] Combination Figure 22a and Figure 22b As shown, along the thickness direction of substrate 1, the projection of the second input terminal 22 on substrate 1 partially overlaps with both the second metal layer 122 and the first metal layer 121. To prevent the second input terminal 22 from contacting other metal layers besides the third metal layer 123, the distance between the second input terminal 22 and the base plate 11 is greater than the thickness of the conductive layer 12. The third metal layer 123 is disposed in the same layer as the first metal layer 121, and there is a gap between the second input terminal 22 and the conductive layer 12 along the thickness direction of substrate 1, allowing the second input terminal 22 to avoid contact with the second metal layer 122 and the first metal layer 121. As a specific example, the second input terminal 22 is connected to the third metal layer 123 via a pad P. The height of the pad P allows for a gap between the second input terminal 22 and the conductive layer 12, preventing the second input terminal 22 from connecting to other metal layers besides the third metal layer 123. The position of the pad P is the soldering position between the third metal layer 123 and the second input terminal 22.

[0153] Figures 23a to 23c Three power modules with three input terminals are illustrated, and the structure of the first metal layer 121 and the second input terminal 22 in these three power modules is similar to... Figure 22a The power modules shown are similar.

[0154] Specifically, Figure 23a The power module shown has a second input terminal 22 extending along the second direction A2 toward the output terminal 3 between the first switching device group G1 and the second switching device group G2. The second input terminal 22 and the third metal layer 123 can be connected in the circuit through multiple soldering points along the thickness direction of the substrate 1. Figure 23b The power module shown exemplarily includes a third metal layer 123 comprising a plurality of third metal islands 1231, which are spaced apart along the second direction A2. The second metal layer 122 includes a plurality of notches in the form of cutout structures K, with each third metal island 1231 located within a cutout structure K. Along a direction perpendicular to the substrate 1, the cutout structure K is located within the range of the second metal layer 122, penetrating the second metal layer 122 to expose a portion of the base plate 11. Each conductive layer 1231 is disposed on the exposed base plate 11 of one cutout structure K. The second input terminal 22 and the third metal layer 123 are connected to the plurality of third metal islands 1231 along the thickness direction of the substrate 1 to achieve multi-point circuit connections.

[0155] Figure 23cThe power module shown has a second metal layer 122 with multiple grooves W along the edge of the second switching devices 42 in the first direction A1. The grooves W are spaced apart along the second direction A2. Each third metal island 1231 is located in one groove W. The second input terminal 22 and the third metal layer 123 are connected to the multiple third metal islands 1231 along the thickness direction of the substrate 1 to form a multi-point circuit.

[0156] It should be understood that Figures 23a to 23b In the power module shown, the second input terminal 22 can also be configured as follows: Figure 11 The spring structure t1 and spring structure t2 shown are electrically connected to the third metal layer 123. By changing the current path length between the second switching device 42 and the input terminal 2 at different positions through the structural design of the spring structure t2, the current sharing effect is optimized.

[0157] Figure 24a A power module with three input terminals is shown. For example... Figure 24a As shown, the third metal layer 123 includes multiple isolated third metal islands 1231, and the second input terminal 22 is connected to one of the third metal islands 1231 near the input terminal 2. The multiple third metal islands 1231 are electrically connected to each other via an adapter 6, which can be a copper busbar or a bonding wire. The first metal layer 121 includes two isolated first metal islands 1211, which are arranged along a first direction A1 on both sides of the second input terminal 22. The two first metal islands 1211 are connected to each other via a connecting bridge 1212, which crosses the second input terminal 22 along the first direction A1, thus allowing the first metal layer 121 to avoid the second input terminal 22.

[0158] along Figure 24a By cutting the power module at the location of the interrupt line Z, we can obtain... Figure 24b The diagram shows a cross-sectional structure. Figure 22b The diagram shows a cross-section of the structure on one side of the first input terminal 21 viewed along the first direction A1. Along the thickness direction of the substrate 1, the second input terminal 22 does not overlap with the first metal layer 121. The second input terminal 22 can be directly connected to the third metal island 1231 without needing to avoid other conductive layers 12 except for the third metal layer 123.

[0159] In the above embodiment, the first switching device group G1 and the second switching device group G2 are arranged opposite to each other along the first direction A2, and the three input terminals realize a three-input power module architecture. Compared with a two-output power module, the three-input power module architecture does not increase the size of the power module, and at the same time can further reduce the parasitic inductance in the circuit.

[0160] It should be understood that in the power module of the 3DC architecture design, the second metal layer 122 and the third metal layer 123 can also be... Figure 17 or Figure 20 The stacking method settings will not be illustrated again here.

[0161] In summary, the power module provided in this application arranges the first switching device group G1 for forming the upper bridge arm and the second switching device group G2 for forming the lower bridge arm at intervals along the first direction A1. The circuits in the bridge arm circuit formed by the power module that connect to the power supply have current paths in opposite directions, which can reduce parasitic inductance in the current loops and reduce the impact of parasitic inductance on the power module's function. Simultaneously, the third metal layer 123 for connecting the second input terminal 22 is disposed between the first switching device group G1 and the second switching device group G2 for forming the lower bridge arm. The circuit traces of the multiple first switching devices 41 and the multiple second switching devices 42 can utilize the gap between the first switching device group G1 and the second switching device group G2 for forming the lower bridge arm, which helps to reduce the size of the power module along the first direction A1. For the overall structural design of the power module, it is possible to reduce parasitic inductance in the circuit while maintaining device miniaturization, which is beneficial for optimizing the function of the power module.

[0162] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power module, characterized in that, The power module includes a substrate, an input terminal, an output terminal, a first switching device group, and a second switching device group; the substrate includes multiple phase-isolated metal layers, the multiple metal layers including a first metal layer, a second metal layer, and a third metal layer; The first switching device group and the second switching device group are arranged along a first direction, and the third metal layer is arranged between the first switching device group and the second switching device group along the first direction; The first switching device group includes a plurality of first switching devices disposed on the first metal layer, and each first switching device is connected to the second metal layer; The second switching device group includes a plurality of second switching devices disposed on the second metal layer, each of the second switching devices being connected to the third metal layer; The input terminal and the output terminal are disposed on both sides of the substrate along the second direction, and the thickness direction of the substrate, the first direction and the second direction are perpendicular to each other; The input terminal includes a first input terminal and a second input terminal arranged at intervals along a first direction. The first input terminal is disposed on the first metal layer, the second input terminal is disposed on the third metal layer, and the output terminal is disposed on the second metal layer.

2. The power module as described in claim 1, characterized in that, At least a portion of the second switching devices are arranged along the second direction, and the end of the second input terminal facing the output terminal extends along the second direction between the first switching device group and the second switching device group to connect the third metal layer; Along the thickness direction of the substrate, the orthographic projection of the second input terminal on the substrate at least partially overlaps with the third metal layer.

3. The power module as described in claim 2, characterized in that, The second input terminal includes a body and at least one spring for connecting the third metal layer; One or both ends of each of the spring pieces are connected to the body, and each of the spring pieces protrudes from the surface of the body facing the third metal layer along the thickness direction of the substrate.

4. The power module as described in claim 3, characterized in that, The second input terminal includes at least one pair of parallel slots, each pair of slots being arranged along the first direction, and the portion of the second input terminal located between each pair of slots forming a spring.

5. The power module as described in claim 3 or 4, characterized in that, The second terminal includes at least one U-shaped groove, the opening of the U-shaped groove in a second direction facing the output terminal or the input terminal, and the portion of the second input terminal located inside the U-shaped groove forms a spring.

6. The power module according to any one of claims 1-5, characterized in that, The second metal layer and the third metal layer are disposed in the same layer. The second metal layer includes a notch, and the third metal layer is accommodated in the notch. There is a gap between the second metal layer and the third metal layer.

7. The power module as described in claim 6, characterized in that, The notch includes at least one hollow structure penetrating the second metal layer; along the first direction, the connection position of each first switching device to the second metal layer is located between the third metal layer and the first metal layer.

8. The power module as described in claim 6, characterized in that, The notch includes at least one groove in the second metal layer toward the edge of the first metal layer; Along the second direction, a connection position between the first switching device and the second metal layer and a connection position between the second switching device and the input terminal are arranged at intervals.

9. The power module according to any one of claims 1-5, characterized in that, Along a direction perpendicular to the substrate, the third metal layer is stacked with the second metal layer, and the orthographic projection of the second metal layer on the substrate overlaps with the orthographic projection of the third metal layer on the substrate.

10. The power module according to any one of claims 1-9, characterized in that, The third metal layer includes a plurality of third metal islands, each of which is connected to the second input terminal; The plurality of third metal islands are arranged at intervals along the second direction, and each of the second switching devices is connected to one of the third metal islands.

11. The power module according to any one of claims 1-10, characterized in that, The first input terminal includes two ends, and the second input terminal is arranged between the two ends along the first direction; Along the thickness direction of the substrate, the orthographic projection of the second input terminal on the metal layer overlaps with the first metal layer, and the second input terminal avoids the first metal layer.

12. The power module as described in claim 11, characterized in that, The first metal layer and the third metal layer are disposed in the same layer; Along the thickness direction of the substrate, there is a gap between the second input terminal and the first metal layer, and the surface of the second input terminal facing the third metal layer is connected to the third metal layer by a solder pad.

13. The power module as described in claim 11, characterized in that, The first metal layer includes two isolated first metal islands, which are arranged along the first direction on both sides of the second input terminal; The two first metal islands are connected by a connecting bridge that spans the second input terminal along the first direction.

14. A powertrain, characterized in that, The powertrain includes a controller and a motor, the controller including a plurality of power modules as described in any one of claims 1-13; The first input terminal and the second input terminal of each power module are respectively used to connect to the positive and negative terminals of the power supply, and the output terminal of each power module is used to connect to one phase circuit of the motor.

15. An electric vehicle, characterized in that, The electric vehicle includes a power source, wheels, and a powertrain as described in claim 14, wherein the powertrain's power conversion device receives direct current from the power source and converts the direct current into alternating current for output to the motor, and the motor is drivenly connected to the wheels.

Images