An EMI filter integrated with boost function, a vehicle power supply and a vehicle

Abstract

The application provides an EMI filter integrated with a Boost voltage-boosting function, a vehicle power supply and a vehicle. The EMI filter comprises a shell assembly, a capacitor array, a magnetic ring inductor and a circuit board arranged in the shell assembly; a Boost voltage-boosting topology circuit and an EMI filter network are integrated in the shell assembly; the magnetic ring inductor simultaneously serves as a voltage-boosting inductor of the Boost voltage-boosting topology circuit and a common-mode filter inductor and / or a differential-mode filter inductor of the EMI filter network; a voltage-boosting switch node of the Boost voltage-boosting topology circuit is embedded in the EMI filter network. The vehicle power supply comprises the EMI filter. The vehicle comprises the vehicle power supply. According to the application, the wiring length between the Boost voltage-boosting topology circuit and the EMI filter network can be obviously shortened, the parasitic parameters in the system can be reduced, the suppression bandwidth of high-frequency noise can be significantly widened, the volume and BOM cost of the overall assembly can be greatly reduced, and the power density and vehicle-grade reliability of the high-voltage power supply system can be comprehensively improved.

Description

Technical Field

[0001] This application belongs to the field of automotive power supply filtering and voltage conversion technology, and more specifically, relates to an EMI filter with integrated boost function, an automotive power supply, and a vehicle. Background Technology

[0002] In existing high-voltage DC systems of new energy vehicles, the on-board power supply generates electromagnetic interference (EMI) noise due to high-frequency switching operations. To ensure the system meets electromagnetic compatibility (EMC) standards, and to boost the DC voltage provided by the battery pack or fuel cell to the high voltage required by the motor drive network, the system typically includes both an EMI filter and a boost converter circuit.

[0003] However, in existing technologies, the EMI filter and the boost converter circuit exist separately. During vehicle assembly, these two circuits require independent installation, layout, and wiring. This separate approach has the following drawbacks. First, it occupies a large space: each circuit occupies its own installation space and requires its own housing and mounting bracket, leading to limited space in the vehicle layout. Second, it suffers from high parasitic parameters and poor high-frequency filtering: the EMI filter and boost converter circuit require long cables or copper busbars for connection, resulting in long wiring paths and the introduction of parasitic inductance and capacitance, thus affecting the EMI filter's ability to suppress high-frequency noise.

[0004] Therefore, there is an ongoing need in the field to develop an EMI filter, automotive power supply, and vehicle with integrated boost functionality that can significantly reduce the overall component size and BOM cost. Summary of the Invention

[0005] In view of this, this application provides an EMI filter, automotive power supply, and vehicle with integrated boost function that can significantly reduce the overall component size and BOM cost.

[0006] According to a first aspect of this application, an EMI filter with integrated Boost function is provided. The EMI filter includes a housing assembly and a capacitor array, a magnetic ring inductor, and multiple circuit boards disposed inside the housing assembly. The housing assembly integrates a Boost converter topology circuit and an EMI filter network. The magnetic ring inductor is configured to simultaneously serve as the boost inductor of the Boost topology circuit and the common-mode filter inductor and / or differential-mode filter inductor of the EMI filter network. The boost switching node of the Boost topology is embedded inside the EMI filter network.

[0007] Optionally, the EMI filter network includes an electrical connection topology consisting of a high-voltage output port A1, a negative port B1, a low-voltage input port C1, and a grounding port G. The capacitor array includes a first differential-mode capacitor network connected between the high-voltage output port A1 and the negative port B1, and a second differential-mode capacitor network connected between the negative port B1 and the low-voltage input port C1. The capacitor array further includes a common-mode capacitor network, which includes capacitors connected between the high-voltage output port A1 and the ground port G, capacitors connected between the negative port B1 and the ground port G, and capacitors connected between the low-voltage input port C1 and the ground port G.

[0008] Optionally, the magnetic ring inductor includes two U-shaped ferrite magnetic rings and two I-shaped ferrite magnetic rings; Each U-shaped ferrite magnetic ring is spliced ​​with the corresponding I-shaped ferrite magnetic ring to form a closed magnetic circuit.

[0009] Optionally, four magnetic ring clamps are also provided inside the housing assembly, the four magnetic ring clamps being used to fix the two U-shaped ferrite magnetic rings and the two I-shaped ferrite magnetic rings respectively.

[0010] Optionally, the magnetic ring inductor is wound with two independent windings. When the Boost topology circuit is working, the two independent windings are in parallel or series connection to achieve boost energy storage. When the EMI filter network is working, they are connected in series in the high voltage positive circuit and the high voltage negative circuit respectively to suppress differential mode noise and common mode noise.

[0011] Optionally, the housing assembly is encapsulated with a thermally conductive insulating medium to enclose the capacitor array, the magnetic ring inductor, and the circuit board.

[0012] Alternatively, the Boost topology can be replaced with a Buck-Boost buck-boost topology.

[0013] Alternatively, the U-shaped and I-shaped ferrite cores that are spliced ​​together can be replaced entirely with PQ-type and EE-type ferrite cores.

[0014] According to a second aspect of this application, an on-board power supply is provided, the on-board power supply including any of the above-described EMI filters with integrated boost function.

[0015] According to a third aspect of this application, a vehicle is provided that includes the aforementioned vehicle.

[0016] Compared with the prior art, the beneficial effects of this application are as follows: The EMI filter integrating Boost converter functionality in this application achieves several improvements. Firstly, by integrating the Boost converter topology and the EMI filter network into the same housing and circuit structure, the overall size is reduced by over 40%. Secondly, by directly embedding the boost switching node of the Boost converter topology into the EMI filter network, the high-frequency, high-current loop path is significantly shortened. This optimized current path design effectively reduces internal parasitic inductance, thereby improving the common-mode and differential-mode noise suppression bandwidth of the EMI filter and enhancing its high-frequency noise suppression performance. Furthermore, the magnetic core inductor serves a dual role as both Boost converter energy storage and EMI filter. This configuration effectively improves core utilization, reduces the space occupied by the core, and simultaneously reduces magnetic resonance and eddy current losses.

[0017] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0018] This application can be better understood by referring to the following description taken in conjunction with the accompanying drawings, in which the same or similar reference numerals are used throughout the drawings to denote the same or similar parts.

[0019] Figure 1 A circuit schematic of an EMI filter with integrated boost function according to an embodiment of this application is shown; Figure 2 This shows a schematic diagram of the appearance of an EMI filter according to an embodiment of this application; Figure 3 This diagram shows an exploded view of an EMI filter with integrated boost function according to an embodiment of this application. Figure 4 This shows a schematic diagram of the structure of the magnetic ring press according to an embodiment of the present application; Figure 5 This shows a cross-sectional view along the longitudinal axis of an EMI filter with integrated boost function according to an embodiment of this application.

[0020] In the above figures, the meanings of the reference numerals are as follows: Among them, 1 is the outer casing assembly, 2 is a 22nF Y2 capacitor, 3 is a 330nF X1 capacitor, 4 is a 4.7nF Y1 capacitor, 5 is a 2.2nF Y2 capacitor, 6 is a 10nF Y2 capacitor, 7 is a screw, 8 is a U-shaped ferrite magnetic ring, 9 is an I-shaped ferrite magnetic ring, 10 is the first circuit board, 11 is the second circuit board, 12 is the third circuit board, 13 is the fourth circuit board, and 14 is the magnetic ring clamping plate. Detailed Implementation

[0021] To enable those skilled in the art to more fully understand the technical solutions of this application, exemplary embodiments of this application will be described more comprehensively and in detail below with reference to the accompanying drawings. Obviously, the one or more embodiments of this application described below are merely one or more specific ways to implement the technical solutions of this application, and are not exhaustive. It should be understood that other ways belonging to a general inventive concept can be used to implement the technical solutions of this application, and should not be limited to the embodiments described exemplary. Based on one or more embodiments of this application, all other embodiments obtained by those skilled in the art without inventive effort should fall within the scope of protection of this application.

[0022] Example Figure 1 This diagram shows the circuit schematic of an EMI filter with integrated boost function according to an embodiment of this application. Figure 2 This diagram shows the appearance of an EMI filter according to an embodiment of this application. Figure 3 This diagram shows an exploded view of the EMI filter with integrated boost function according to an embodiment of this application. Figure 4 This shows a cross-sectional view along the longitudinal axis of an EMI filter with integrated boost function according to an embodiment of this application. Figure 5 This shows a cross-sectional view of an EMI filter with integrated boost function according to an embodiment of this application, along its longitudinal axis.

[0023] Reference Figures 1 to 5 The EMI filter with integrated Boost function in this application embodiment includes a housing assembly 1 and a capacitor array, a magnetic ring inductor, a first circuit board 10, a second circuit board 11, a third circuit board 12 and a fourth circuit board 13 disposed inside the housing assembly 1. The Boost converter topology circuit and EMI filter network are integrated within the housing assembly 1. The magnetic ring inductor is configured to serve simultaneously as the boost inductor in the Boost topology circuit and as the common-mode filter inductor and differential-mode filter inductor in the EMI filter network; The boost switching node of the Boost converter topology is embedded inside the EMI filter network. The boost switching node corresponds to... Figure 1 The part of the circuit that is highlighted.

[0024] Specifically, in this embodiment, the outer casing assembly 1 is made of high-temperature resistant, high-strength PA66+GF30, which, compared to a tracking index (CTI) ≥ 400, not only possesses excellent flame retardant and high-voltage creepage resistance but also effectively prevents potting compound overflow during production. The first circuit board 10, second circuit board 11, third circuit board 12, and fourth circuit board 13 are all made of high-insulation-strength FR-4 material, which has stronger high-voltage creepage resistance, compared to a tracking index (CTI) ≥ 600. In this embodiment of the EMI filter, the leakage current is ≤ 1mA when the inter-electrode withstand voltage meets 1300VDC for 1 minute; and the leakage current is ≤ 1mA when the ground withstand voltage meets 3200VDC for 1 minute.

[0025] Furthermore, in this embodiment of the application, the EMI filter network includes an electrical connection topology consisting of a high-voltage output port A1, a negative terminal port B1, a low-voltage input port C1, and a grounding port G; The capacitor array includes a first differential-mode capacitor network connected between the high-voltage output port A1 and the negative port B1, and a second differential-mode capacitor network connected between the negative port B1 and the low-voltage input port C1. The capacitor array also includes a common-mode capacitor network, which includes capacitors connected between the high-voltage output port A1 and the ground port G, capacitors connected between the negative port B1 and the ground port G, and capacitors connected between the low-voltage input port C1 and the ground port G.

[0026] Specifically, refer to Figure 1 In this embodiment, the first differential-mode capacitor network includes capacitors CX7, CX9, CX2, CX3, and CX4; the second differential-mode capacitor network includes capacitors CX8, CX10, CX1, CX6, and CX5; the common-mode capacitor network includes capacitors Cy1-Cy9; and capacitors Cy10-Cy12 are integrated in the DCLink. Accordingly, refer to... Figure 3 Capacitor 2 is a 22nF Y2 capacitor, and there are 3 of them, which correspond to... Figure 1 The capacitors CX10, CX6, and CX3 are included; capacitor 3 is a 330 nF X1 capacitor, and there are two of them, corresponding to... Figure 1 The capacitors CX4 and CX5 are included; capacitor 4 is a 4.7nF Y1 capacitor, and there are 5 of them, corresponding to... Figure 1The capacitors CX7, CX8, Cy1-Cy3 are included; capacitor 5 is a 2.2nF Y2 capacitor, and there are 8 of them, corresponding to... Figure 1 The capacitors CX1, CX2, Cy4, and Cy9 are included; capacitor 6 is a 10nF Y2 capacitor, corresponding to... Figure 1 The capacitor CX9 is an example. All of the above capacitors are film capacitors, using polypropylene metallized film dielectric.

[0027] Specifically, in this embodiment, the high-voltage output port A1 corresponds to a 935VDC voltage level, the low-voltage input port C1 corresponds to a 480VDC voltage level, and the negative port B1 corresponds to the negative terminal. The high-voltage output port A1 and the negative port B1 are boost converter copper busbars, and the negative port B1 and the low-voltage input port C1 are 480VDC copper busbars. The three copper busbars are embedded copper busbars, injection molded into the housing assembly 1.

[0028] Furthermore, in this embodiment, the magnetic ring inductor includes two U-shaped ferrite magnetic rings 8 and two I-shaped ferrite magnetic rings 9; each U-shaped ferrite magnetic ring 8 and its corresponding I-shaped ferrite magnetic ring 9 are interconnected to form a closed magnetic circuit. (Reference) Figure 1 One set of U-shaped ferrite magnetic rings 8 and the corresponding I-shaped ferrite magnetic rings 9 form a magnetic ring inductor L1 with an inductance of 13 μH. The other set of U-shaped ferrite magnetic rings 8 and the corresponding I-shaped ferrite magnetic rings 9 form a magnetic ring inductor L2 with an inductance of 13 μH. The sum of the inductances of magnetic ring inductors L1 and L2 is 26 μH.

[0029] Specifically, in this embodiment, the U-shaped ferrite magnetic ring 8 and the I-shaped ferrite magnetic ring 9, which are spliced ​​together, can be replaced as a whole with a pair of PQ-type ferrite magnetic cores and EE-type ferrite magnetic cores. The PQ-type ferrite magnetic core and the EE-type ferrite magnetic core can also form a closed-loop magnetic circuit (closed magnetic ring), and the inductance value can be kept constant at 26μH.

[0030] Furthermore, in the embodiments of this application, reference is made to... Figure 4 The outer casing assembly 1 also includes four magnetic ring clamping plates 14, which are used to fix two U-shaped ferrite magnetic rings 8 and two I-shaped ferrite magnetic rings 9 respectively.

[0031] In this embodiment, the capacitor array, the magnetic ring inductor, and the four circuit boards 10-13 are all disposed within the housing assembly 1. Specifically, a first accommodating space and a second accommodating space are provided on the housing assembly 1. The magnetic ring inductor specifically includes a first closed magnetic ring 8 and a second closed magnetic ring 9, which are respectively disposed within the first accommodating space and the second accommodating space. The capacitors included in the capacitor array are integrated into the housing assembly 1 based on the four circuit boards 10-13, which are respectively the first circuit board 10, the second circuit board 11, the third circuit board 12, and the fourth circuit board 13. (Refer to...) Figure 3 Five capacitors 4, one capacitor 2, and one capacitor 6 are installed on the first circuit board 10; two capacitors 5 are installed on the second circuit board 11; two capacitors 2, two capacitors 3, and five capacitors 5 are installed on the third circuit board 12; and one capacitor 5 is installed on the fourth circuit board 13. According to... Figure 3 As shown in the relative positional relationship, the first circuit board 10 is located at one end of the housing assembly 1, while the second circuit board 11, the third circuit board 12 and the fourth circuit board 13 are concentrated at the other end of the housing assembly 1.

[0032] Furthermore, in this embodiment of the application, a standardized automotive-grade mounting interface is provided on the housing assembly 1. The standardized automotive-grade mounting interface includes three M6 threaded holes (3×M6-6H) and two M4 threaded holes (2×M4-4H), with an effective thread depth of ≥11mm for each hole.

[0033] Furthermore, in this embodiment, the interior of the housing assembly 1 is encapsulated with a thermally conductive insulating medium, which is either thermally conductive epoxy resin or thermally conductive polyurethane. The thermally conductive insulating medium encapsulates the capacitor array, magnetic ring inductor, and circuit board, and there is no excess adhesive at the edges of the housing assembly 1.

[0034] Furthermore, in this embodiment, the Boost topology circuit can be replaced with a Buck-Boost buck-boost topology circuit to be compatible with high-voltage DC power supply platforms of multiple voltage levels.

[0035] The EMI filter with integrated Boost function in the embodiments of this application will be described in more detail below.

[0036] 1) Regarding magnetic circuit reuse and structural improvements: Traditionally, the boost inductor and EMI filter inductor are independent, resulting in a large core size and long wiring. The key structural improvement in this application's embodiments lies in multiplexing the magnetic ring inductor as both the boost inductor and the common-mode / differential-mode inductor for EMI filtering. For example... Figure 3As shown, the magnetic ring inductor is composed of two ferrite U-shaped magnetic rings 8 and two ferrite I-shaped magnetic rings 9, forming a highly efficient closed magnetic circuit. It is securely locked into the pre-set slots of the housing assembly 1 by four stainless steel magnetic ring clamps 14. Under test conditions of 10kHz and 0.1V, the inductance of this magnetic ring inductor is 26±30%μH. Through specific wiring on the corresponding circuit board, the coil wound on the magnetic ring inductor is connected in series in the main circuit of the DC boost converter to handle energy storage and release during the switching cycle, while simultaneously introducing high impedance to the common-mode interference current flowing through the high-voltage port, achieving efficient multiplexing of the magnetic circuit.

[0037] This embodiment embeds the boost switching node of the Boost converter topology within the EMI filter network. The internal current-carrying structure for high-voltage, high-current flow utilizes bare copper busbars free of cracks, peeling, and burrs. All components are mechanically and electrically secured to the circuit board using screws. This compact, integrated internal connection significantly shortens the high-frequency current path, resulting in a substantial reduction in parasitic inductance and capacitance within the system, thereby correspondingly widening the electromagnetic suppression bandwidth of the EMI filter.

[0038] 2) Definition of electrical topology and capacitor network: Reference Figure 1 The EMI filter with integrated Boost converter function in this application includes a high-voltage output port A1, a negative port B1, a low-voltage input port C1, and a ground port G. In practical applications (such as the high-voltage DC circuit of the main drive or on-board power supply of new energy vehicles), the input terminal receives 480VDC (low-voltage input through port B1 and port C1), and after passing through the internally integrated Boost converter topology circuit and EMI filter network, it outputs 935VDC (high-voltage output through port A1 and port B1).

[0039] To perfectly suppress differential-mode and common-mode noise at both voltage levels (935VDC / 480VDC), a thin-film capacitor array is deployed within housing assembly 1: Capacitor 3: X1 capacitor, quantity 2, capacitance value 330nF (model DB1556025). Capacitor 4: Y1 capacitor, quantity 5, capacitance value 4.7nF (model DB1563128). Capacitor 2: Y2 capacitor, quantity 3, capacitance value 22nF (model DB1563087). Capacitor 5: Y2 capacitor, quantity 8, capacitance value 2.2nF (model DB1563086). Capacitor 6: Y2 capacitor, quantity 1, capacitance value 10nF (model DB1563127).

[0040] The above capacitors are intertwined to form a composite capacitor filter network: Differential mode capacitor network: Capacitors CX1 to CX8 (with capacitance values ​​ranging from 2.2nF to 330nF, including the aforementioned X1 capacitor and part of the Y2 capacitor) are connected across the positive and negative circuit terminals to provide a low differential mode impedance path; Common-mode capacitor network: Capacitors Cy1~Cy12 (including the aforementioned Y1 capacitor and part of the Y2 capacitor) are connected between each high-voltage bus and the grounding port G to provide a common-mode noise discharge path.

[0041] The measured inter-port capacitance of the above composite capacitor filter network is as follows: Between ports A1 and B1: 0.368 ± 20% μF; Between ports B1 and C1: 0.381±20%μF; Between ports A1 and C1: 0.180±20%μF; Between ports A1 / B1 / C1-G: 0.009±20%μF.

[0042] 3) Key manufacturing processes and mechanical interfaces: After assembling the above components and tightening the screws, a thermally conductive insulating medium needs to be injected into the housing assembly 1 for overall potting. The potting material can be thermally conductive epoxy resin or thermally conductive polyurethane. The process requires complete curing, with no internal bubbles and no excess adhesive on the outer surface.

[0043] After potting and curing, this integrated component exhibits exceptional automotive-grade withstand voltage and insulation quality. Verification using high-voltage testing equipment shows that its inter-electrode withstand voltage is 1300VDC / 1min with a leakage current ≤1mA; its ground withstand voltage (each polarity port to the ground) is 3200VDC / 1min with a leakage current ≤1mA; and at a test voltage of 1000VDC, its overall insulation resistance is ≥500MΩ, ensuring stable operation in harsh automotive-grade temperature environments ranging from -40℃ to 105℃.

[0044] To facilitate standardized and rapid assembly by vehicle manufacturers, the bottom surface of housing component 1 is equipped with a reference system for three-dimensional positioning and locking: reference A is the coplanarity of the insert's bottom surface, reference B is the main positioning hole, and reference C is the auxiliary positioning hole. Its geometric tolerances meet the following standards: MT5 for plastic parts, FT5 for copper busbars, with an unspecified angle tolerance of ±1° and a chamfer tolerance of R±0.5. The standardized mounting interface consists of three M6 threaded holes (3×M6-6H) and two M4 threaded holes (2×M4-4H), with an effective locking depth of ≥11mm for all threaded holes. Furthermore, to ensure the oxidation resistance of the bare copper busbars during supply chain circulation, their appearance must strictly meet the Level 0 to Level 2 low-oxidation discoloration standards within 6 months before unopening the packaging and within 3 weeks after opening.

[0045] The EMI filter with integrated boost function in this application embodiment has the following beneficial effects: Highly integrated structure, significantly improving power density: By integrating the Boost topology circuit and the high-voltage DC EMI filter network into the same housing and the same circuit structure, the independent housing and connecting cables required by traditional discrete solutions are eliminated, reducing the overall product volume by more than 40%.

[0046] Electromagnetic compatibility performance is significantly optimized: In this embodiment, the boost switching node is directly embedded inside the filter network, greatly shortening the loop path for high-frequency, high-current applications. This short-path design reduces internal parasitic inductance to an extremely low level, thereby widening the suppression bandwidth for common-mode and differential-mode noise and enhancing high-frequency attenuation characteristics.

[0047] Magnetic circuit reuse reduces losses: The magnetic ring inductor simultaneously serves as a boost voltage energy storage and EMI filter, effectively improving the utilization rate of the magnetic core, reducing the core size, and lowering magnetic resonance and eddy current losses.

[0048] Reduced BOM and manufacturing costs: By reusing the casing and structural fasteners and eliminating complex external wiring, the material costs and assembly and testing processes of the product are greatly reduced, and the overall BOM cost can be reduced by 20% to 30%.

[0049] Automotive-grade high reliability and compliance: The materials and electrical clearances selected in this application embodiment meet the stringent automotive-grade high-voltage insulation and withstand voltage requirements. The number of system interfaces and connection points is greatly reduced, significantly lowering the probability of faults such as poor contact and high-voltage breakdown, and complying with environmental regulations such as RoHS, REACH and ELV.

[0050] Accordingly, based on the EMI filter with integrated Boost function in the embodiments of this application, the embodiments of this application also propose an on-board power supply that includes the above-mentioned EMI filter with integrated Boost function.

[0051] Accordingly, based on the vehicle power supply of the embodiments of this application, the embodiments of this application also propose a vehicle including the above-mentioned vehicle power supply, especially a new energy electric vehicle.

[0052] While one or more embodiments of this application have been described above, those skilled in the art will recognize that this application can be implemented in any other form without departing from its spirit and scope. Therefore, the embodiments described above are illustrative and not restrictive, and many modifications and substitutions will be apparent to those skilled in the art without departing from the spirit and scope of this application as defined in the appended claims.

Claims

1. An EMI filter with integrated boost converter function, characterized in that, It includes a housing assembly and a capacitor array, a magnetic ring inductor, and multiple circuit boards disposed inside the housing assembly; The housing assembly integrates a Boost converter topology circuit and an EMI filter network. The magnetic ring inductor is configured to simultaneously serve as the boost inductor of the Boost topology circuit and the common-mode filter inductor and / or differential-mode filter inductor of the EMI filter network. The boost switching node of the Boost topology is embedded inside the EMI filter network.

2. The EMI filter with integrated Boost converter function according to claim 1, characterized in that, The EMI filter network includes an electrical connection topology consisting of a high-voltage output port A1, a negative port B1, a low-voltage input port C1, and a grounding port G. The capacitor array includes a first differential-mode capacitor network connected between the high-voltage output port A1 and the negative port B1, and a second differential-mode capacitor network connected between the negative port B1 and the low-voltage input port C1. The capacitor array further includes a common-mode capacitor network, which includes capacitors connected between the high-voltage output port A1 and the ground port G, capacitors connected between the negative port B1 and the ground port G, and capacitors connected between the low-voltage input port C1 and the ground port G.

3. The EMI filter with integrated Boost converter function according to claim 2, characterized in that, The magnetic ring inductor includes two U-shaped ferrite magnetic rings and two I-shaped ferrite magnetic rings; Each U-shaped ferrite magnetic ring is spliced ​​with the corresponding I-shaped ferrite magnetic ring to form a closed magnetic circuit.

4. The EMI filter with integrated Boost converter function according to claim 3, characterized in that, The housing assembly also includes four magnetic ring clamps, which are used to fix the two U-shaped ferrite magnetic rings and the two I-shaped ferrite magnetic rings, respectively.

5. The EMI filter with integrated Boost converter function according to claim 1, characterized in that, The magnetic ring inductor has two independent windings wound on it. When the Boost topology circuit is working, the two independent windings are in parallel or series connection to achieve boost energy storage. When the EMI filter network is working, they are connected in series in the high voltage positive circuit and the high voltage negative circuit respectively to suppress differential mode noise and common mode noise.

6. The EMI filter with integrated Boost converter function according to claim 1, characterized in that, The housing assembly is internally encapsulated with a thermally conductive and insulating medium to enclose the capacitor array, the magnetic ring inductor, and the circuit board.

7. The EMI filter with integrated Boost converter function according to claim 1, characterized in that, The Boost converter topology circuit is replaced with a Buck-Boost converter topology circuit.

8. The EMI filter with integrated Boost converter function according to claim 3, characterized in that, The U-shaped and I-shaped ferrite cores that are spliced ​​together are replaced with PQ-type and EE-type ferrite cores.

9. A vehicle-mounted power supply, characterized in that, An EMI filter including the integrated boost function as described in any one of claims 1-8.

10. A vehicle, characterized in that, Includes the vehicle power supply as described in claim 9.

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