oscillator

Abstract

The present application provides an oscillator, which can shorten the wiring connecting the circuit element and the capacitor driving the vibrating reed and improve the characteristics. The oscillator is provided with: a first package accommodating the vibrating reed and the circuit element outputting the oscillation signal, having a first side along a first direction and a second side along a second direction perpendicular to the first direction, the first package being provided with a filter terminal and a first power terminal arranged along the first side; and a second package accommodating the first package, a first capacitor adjacent to the first package along the first side, and a second capacitor adjacent to the first package along the second side, the first power terminal and one end of the first capacitor being electrically connected by a first wiring provided in an inner layer of the second package, and the filter terminal and one end of the second capacitor being electrically connected by a second wiring provided in the inner layer of the second package.

Description

Technical Field

[0001] This invention relates to oscillators. Background Technology

[0002] Patent document 1 discloses a piezoelectric oscillator as follows: a piezoelectric vibrator with a built-in vibrating plate, an IC that drives the vibrating plate, and two chip capacitors connected to the IC are housed in a package. The terminal electrodes of the piezoelectric vibrator are connected to the terminal electrodes of the IC by wires, and the terminal electrodes of the IC are connected to the connecting pad electrodes of the package by wires.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2014-53663

[0004] However, in the piezoelectric oscillator described in Patent Document 1, since the terminal electrodes of the IC and the connection pad electrodes of the package are connected by wires, it is impossible to place electronic components in the area where the wires exist inside the package. Therefore, it is difficult to place one of the two chip capacitors in an area close to the IC. Consequently, the wiring connecting the IC and one chip capacitor becomes longer, and noise easily accumulates on this wiring. Therefore, the noise reduction effect of the chip capacitor is reduced, making it difficult to improve the characteristics of the piezoelectric oscillator. Summary of the Invention

[0005] One embodiment of the oscillator of the present invention comprises: a vibrating plate; a circuit element that drives the vibrating plate to output an oscillation signal; a first package that houses the vibrating plate and the circuit element, having a first side along a first direction and a second side along a second direction perpendicular to the first direction; a first power supply terminal disposed in the first package and arranged along the first side; a filter terminal disposed in the first package; a first capacitor adjacent to the first package along the first side; a second capacitor adjacent to the first package along the second side; and a second package that houses the first package, the first capacitor, and the second capacitor, wherein the first power supply terminal is electrically connected to one end of the first capacitor via a first wiring disposed in the inner layer of the second package, and the filter terminal is electrically connected to one end of the second capacitor via a second wiring disposed in the inner layer of the second package. Attached Figure Description

[0006] Figure 1 This is a functional block diagram of the oscillator in this embodiment.

[0007] Figure 2 This is a 3D diagram of the internal oscillator.

[0008] Figure 3 This is a top view of the internal oscillator.

[0009] Figure 4 This is a cross-sectional view of the internal oscillator.

[0010] Figure 5 This is a bottom view of the internal oscillator.

[0011] Figure 6 This is a perspective view of the oscillator in this embodiment.

[0012] Figure 7 This is a top view of the oscillator in this embodiment.

[0013] Figure 8 This is a cross-sectional view of the oscillator in this embodiment.

[0014] Figure 9 This diagram shows an example of an electrode and wiring disposed on the L1 wiring layer.

[0015] Figure 10 This diagram shows an example of an electrode and wiring disposed on the L2 wiring layer.

[0016] Figure 11 This is a diagram showing an example of an electrode disposed on the L3 wiring layer.

[0017] Label Explanation

[0018] 1: Oscillator; 1a, 1b, 1c, 1d: Side; 2: Internal oscillator; 2a, 2b, 2c, 2d: Side; 3: Vibrating plate; 3a, 3b: Electrodes; 4: Circuit element; 5, 6: Capacitor; 5a, 5b: Electrodes; 6a, 6b: Electrodes; 10: Package; 10a: Substrate; 10b, 10c, 10d: Frame-shaped sidewalls; 10U: Recess; 11: Cover; 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h, 12i, 12j: Electrodes; 13a, 13b, 13c, 13d, 13e, 13f: Electrodes; 14: Wiring; 15a, 15b: Electrodes; 16a, 16b: Electrodes; 17a, 17b... 17c, 17d, 17e: Wiring; 20: Package; 20a: Substrate; 20b, 20c: Frame-like sidewalls; 20U, 20Ua, 20Ub: Recesses; 21: Cover; 22a, 22b, 22c, 22d, 22e, 22f: Electrodes; 23a, 23b: Electrodes; 24: Electrodes; 41: Electrodes; 71a, 71b, 72: Connecting components; 100: Oscillator circuit; 101: Regulator; 102: Temperature sensor; 103: Temperature compensation circuit; 104, 105: Gain correction circuit; 106: Resistor; 107, 108: Variable capacitor element; 109: Buffer circuit; 110: Frequency divider circuit; 111: Buffer circuit; 112: Memory. Detailed Implementation

[0019] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, the embodiments described below do not unduly limit the scope of the invention as defined in the claims. Additionally, not all structures described below are necessarily essential components of the present invention.

[0020] 1. Functional structure of an oscillator

[0021] Figure 1 This is a functional block diagram illustrating an example of the functional structure of the oscillator in this embodiment. For example... Figure 1 As shown, the oscillator 1 in this embodiment includes an internal oscillator 2 and two capacitors 5 and 6, and has Vcc2, GND2, OUT2, VC2 and OE2 terminals as external connection terminals. The internal oscillator 2 has Vcc1, GND1, OUT1, VC1, OE1 and LPF1 terminals as external connection terminals.

[0022] The Vcc2 terminal is the power supply terminal from which the power supply voltage is supplied from outside the oscillator 1, and is electrically connected to the Vcc1 terminal, which is also a power supply terminal. The GND2 terminal is the grounding terminal from outside the oscillator 1, and is electrically connected to the GND1 terminal, which is also a grounding terminal. One end of the capacitor 5 is electrically connected to the Vcc1 and Vcc2 terminals, and the other end of the capacitor 5 is electrically connected to the GND1 and GND2 terminals. The capacitor 5 functions as a bypass capacitor to stabilize the power supply voltage by bypassing noise superimposed on the power supply voltage to ground.

[0023] Terminal OUT1 is the output terminal for the oscillation signal CLK generated by oscillator 1. Terminal OUT2, which is also an output terminal, is electrically connected to terminal OUT1. Terminal VC2 is the frequency control terminal for the input signal that controls the frequency of the oscillation signal CLK, and is electrically connected to terminal VC1, which is also a frequency control terminal. Terminal OE2 is the output control terminal for the input signal that controls the output of the oscillation signal CLK, and is electrically connected to terminal OE1, which is also an output control terminal.

[0024] Terminal LPF1 is the filter terminal used to form a low-pass filter and is electrically connected to one end of capacitor 6. The other end of capacitor 6 is electrically connected to terminals GND1 and GND2 and is supplied with ground voltage.

[0025] The internal oscillator 2 includes a vibrating plate 3 and circuit elements 4. The circuit elements 4 drive the vibrating plate 3 and output an oscillation signal CLK. The vibrating plate 3 is a quartz vibrating plate using quartz as the substrate material, such as an AT-cut quartz vibrating plate. Besides quartz, other piezoelectric materials such as lithium tantalate, lithium niobate, and lead zirconate titanate piezoelectric ceramics can also be used as the substrate material for the vibrating plate 3. The excitation unit for the vibrating plate 3 can also be an excitation unit based on the piezoelectric effect.

[0026] like Figure 1 As shown, circuit element 4 has Vcc, GND, OUT, VC, OE, LPF, XO, and XI terminals as external connection terminals. The Vcc terminal is the power supply terminal for which the power supply voltage is supplied, and it is electrically connected to the Vcc1 terminal. The GND terminal is the ground terminal for which the ground voltage is supplied, and it is electrically connected to the GND1 terminal. The OUT terminal is the output terminal for the output oscillation signal CLK, and it is electrically connected to the OUT1 terminal. The VC terminal is the frequency control terminal for which the input signal controls the frequency of the oscillation signal CLK, and it is electrically connected to the VC1 terminal. The OE terminal is the output control terminal for which the input signal controls the output of the oscillation signal CLK, and it is electrically connected to the OE1 terminal. The LPF terminal is the filter terminal for forming a low-pass filter, and it is electrically connected to the LPF1 terminal. The XO terminal is the terminal connected to electrode 3a (described later) of the vibrator 3, and the XI terminal is the terminal connected to electrode 3b (described later) of the vibrator 3.

[0027] like Figure 1 As shown, circuit element 4 includes an oscillation circuit 100, a regulator 101, a temperature sensor 102, a temperature compensation circuit 103, gain correction circuits 104 and 105, a resistor 106, variable capacitors 107 and 108, a buffer circuit 109, a frequency divider circuit 110, a buffer circuit 111, and a memory 112. In this embodiment, circuit element 4 is implemented using a single-chip integrated circuit. However, at least a portion of circuit element 4 can also be composed of discrete components.

[0028] The memory 112 stores various data for controlling the operation of each part of the circuit element 4.

[0029] Regulator 101 is electrically connected to the Vcc and GND terminals. It receives a power supply voltage from outside the oscillator 1 via the Vcc2, Vcc1, and Gcc terminals, and a ground voltage from outside the oscillator 1 via the GND2, GND1, and GND terminals. Furthermore, regulator 101 generates a constant voltage Vosc based on the power supply voltage and the ground voltage. For example, regulator 101 generates a constant voltage Vosc based on the output voltage of a band gap reference circuit. Voltage Vosc is supplied to the oscillation circuit 100.

[0030] The oscillation circuit 100 is electrically connected to the XO terminal and the XI terminal, and uses the voltage Vosc supplied from the regulator 101 as the power supply voltage to cause the vibrator 3 to oscillate and generate an oscillation signal CK1. The oscillation circuit 100 amplifies the signal from the XO terminal and outputs it to the XI terminal. That is, the signal output from the vibrator 3 is input to the oscillation circuit 100 via the XO terminal, the oscillation circuit 100 amplifies the signal and outputs it to the vibrator 3 via the XI terminal, thereby causing the vibrator 3 to oscillate.

[0031] The oscillation circuit 100 is electrically connected to one end of each of the variable capacitor elements 107 and 108. The other end of each of the variable capacitor elements 107 and 108 is electrically connected to the GND terminal and supplied with ground voltage. The variable capacitor elements 107 and 108 function as load capacitors of the oscillation circuit 100, and the frequency of the oscillation signal CK1 varies according to the capacitance values ​​of the variable capacitor elements 107 and 108. The variable capacitor elements 107 and 108 can be, for example, varactor diodes, or a capacitor array of multiple capacitor elements connected in parallel via switching elements.

[0032] Temperature sensor 102 detects the temperature of circuit element 4 and outputs a temperature signal corresponding to the temperature voltage. Temperature sensor 102 is implemented, for example, by a circuit that utilizes the temperature characteristics of a bandgap reference circuit or a diode element.

[0033] The temperature compensation circuit 103 generates a temperature compensation voltage to correct the frequency-temperature characteristics of the oscillation signal CK1 output from the oscillation circuit 100, based on the temperature signal output from the temperature sensor 102 and the temperature compensation data corresponding to the frequency-temperature characteristics of the vibrating plate 3. The temperature compensation data is stored in the memory 112.

[0034] Gain correction circuit 104 corrects the scale of the temperature compensation voltage output from temperature compensation circuit 103. The gain of gain correction circuit 104 is stored in memory 112. Gain correction circuit 104 is connected to one end of resistor 106, the other end of resistor 106 is electrically connected to variable capacitor element 107, and is electrically connected to capacitor 6 via LPF terminal and LPF1 terminal. Therefore, the temperature compensation voltage corrected by gain correction circuit 104 is supplied to variable capacitor element 107 through a low-pass filter composed of resistor 106 and capacitor 6. Moreover, the capacitance value of variable capacitor element 107 changes according to temperature compensation voltage, thereby canceling the change in oscillation frequency of oscillation circuit 100 caused by temperature variation, and the frequency of oscillation signal CK1 remains approximately constant regardless of temperature.

[0035] The gain correction circuit 105 is connected to the VC terminal, and a frequency control signal for controlling the frequency of the oscillation signal CLK is input from outside the oscillator 1 via the VC2, VC1, and VC terminals. Furthermore, the gain correction circuit 105 outputs a frequency control voltage that has been scaled to the voltage of the frequency control signal. The gain of the gain correction circuit 105 is stored in the memory 112. The gain correction circuit 105 is electrically connected to the variable capacitor element 108, and the frequency control voltage output from the gain correction circuit 105 is supplied to the variable capacitor element 108. The capacitance value of the variable capacitor element 108 changes according to the frequency control voltage, thereby changing the oscillation frequency of the oscillation circuit 100, and the oscillation signal CK1 becomes a frequency corresponding to the voltage of the frequency control signal.

[0036] The buffer circuit 109 buffers the oscillation signal CK1 output from the oscillation circuit 100 and outputs a rectangular wave oscillation signal CK2.

[0037] The frequency divider circuit 110 outputs an oscillation signal CK3, which is obtained by dividing the oscillation signal CK2 output from the buffer circuit 109. The division ratio of the frequency divider circuit 110 is stored in the memory 112.

[0038] The buffer circuit 111 is electrically connected to the OE terminal, and an output control signal for controlling the output of the oscillation signal CLK is input from outside the oscillator 1 via the OE2, OE1, and OE terminals. When the output control signal is high, the buffer circuit 111 buffers the oscillation signal CK3 output from the frequency divider circuit 110 and outputs the oscillation signal CLK. When the output control signal is low, the output impedance of the buffer circuit 111 becomes high impedance, for example, the oscillation signal CLK outputs a ground voltage. The buffer circuit 111 is electrically connected to the OUT terminal, and the oscillation signal CLK is output to the outside of the oscillator 1 via the OUT, OUT1, and OUT2 terminals.

[0039] The oscillator 1 and internal oscillator 2 configured in this way are voltage-controlled temperature-compensated oscillators such as VC-TCXO, which have temperature compensation and frequency control functions. VC-TCXO is short for Voltage Controlled Temperature Compensated Crystal Oscillator.

[0040] 2. Construction of the internal oscillator

[0041] Figures 2-5 This is a diagram showing an example of the construction of the internal oscillator 2. Figure 2 This is a 3D view of the internal oscillator 2. Figure 3 This is a top view of the internal oscillator 2. Figure 4 yes Figure 2 and Figure 3 AA sectional view. Figure 5 This is a bottom view of internal oscillator 2. Additionally, Figure 5 This is a perspective view of the bottom surface as seen from the upper surface of the internal oscillator 2. Figures 2-5 In order to understand the relationship between their orientations, the diagram shows the mutually orthogonal X, Y and Z directions.

[0042] like Figures 2-5 As shown, the internal oscillator 2 includes a vibrating plate 3, circuit elements 4, a package 20, and a cover 21. Additionally, Figure 3 This is a diagram showing the internal oscillator 2 viewed from above with the cover 21 removed.

[0043] like Figure 3 As shown, package 20, when viewed from the top in the Z direction, has a side 2a along the Y direction, a side 2b along the X direction, a side 2c along the Y direction opposite to side 2a, and a side 2d along the X direction opposite to side 2b. That is, package 20 is approximately rectangular when viewed from the top in the Z direction.

[0044] exist Figures 2-5 In this context, the vibrator 3 is an AT-cut quartz vibrator, but it can also be an SC-cut quartz vibrator, a BT-cut quartz vibrator, a tuning fork-type quartz vibrator, a surface acoustic wave resonator, other piezoelectric vibrators, or electrostatically driven MEMS (Micro-Electro-Mechanical Systems) resonant elements. MEMS is short for Micro Electro Mechanical Systems. Additionally, in... Figures 2-5 In this circuit, circuit element 4 is a single-chip integrated circuit, but it can also be at least partially composed of discrete components.

[0045] The internal oscillator 2 is a single-sealed oscillator, and the package 20 is a container that houses the vibrating element 3 and the circuit element 4 in the same space. The package 20 is composed of a substrate 20a, a frame-shaped sidewall 20b joined to the substrate 20a, and a frame-shaped sidewall 20c joined to the frame-shaped sidewall 20b. A recess 20U is formed by the substrate 20a and the frame-shaped sidewalls 20b and 20c. The vibrating element 3 and the circuit element 4 are housed in an airtight internal space formed by covering the recess 20U with a cover 21. This protects the vibrating element 3 and the circuit element 4 from impacts or external environmental factors, especially dust, moisture, and humidity. In addition, although not particularly limited, the package 20 can be made of ceramic such as alumina, and the cover 21 can be made of a metal material such as Kovar alloy.

[0046] The atmosphere of the internal space is not particularly limited. For example, it is preferably a depressurized state where the gas is replaced by inactive gases such as nitrogen or argon, and the pressure is reduced relative to atmospheric pressure. It is even more preferably a state closer to vacuum. As a result, the viscous resistance is reduced, which can effectively reduce the Q value of the vibrator 3 and improve the oscillation characteristics of the vibrator 3. However, the atmosphere of the internal space is not limited to this. It can also be atmospheric pressure or a pressurized state.

[0047] The recess 20U has a step and is composed of recesses 20Ua and 20Ub. Recess 20Ua is formed by a substrate 20a and a frame-shaped sidewall 20b, while recess 20Ub is formed by frame-shaped sidewalls 20b and 20c, and its opening is smaller than that of recess 20Ua. Two electrodes 23a and 23b, arranged in the Y direction along edge 2a, are provided on the bottom surface of recess 20Ub, i.e., the upper surface of frame-shaped sidewall 20b. Electrode 23a is electrically connected to electrode 3a provided on the upper surface of vibrating plate 3 via a bonding member 71a, and electrode 23b is electrically connected to electrode 3b provided on the lower surface of vibrating plate 3 via a bonding member 71b. Furthermore, vibrating plate 3 is fixed to the bottom surface of recess 20Ub, i.e., the upper surface of frame-shaped sidewall 20b, via bonding members 71a and 71b. That is, vibrating plate 3 is mounted on package 20 at the positions of bonding members 71a and 71b.

[0048] A plurality of electrodes 24 are provided on the bottom surface of the recess 20Ua, i.e., the upper surface of the substrate 20a. The plurality of electrodes 24 are electrically connected to a plurality of electrodes 41 provided on the lower surface of the circuit element 4 via a plurality of bonding members 72. Furthermore, the circuit element 4 is fixed to the bottom surface of the recess 20Ua, i.e., the upper surface of the substrate 20a, via the plurality of bonding members 72. That is, the circuit element 4 is mounted on the upper surface of the substrate 20a in a flip-chip manner. Additionally, the plurality of electrodes 41 correspond to... Figure 1 The terminals shown are Vcc, GND, OUT, VC, OE, LPF, XO, and XI.

[0049] As for the bonding components 71a, 71b, and 72, there are no particular limitations as long as they possess both conductivity and bonding properties. For example, various metal bumps such as gold bumps, silver bumps, copper bumps, and solder bumps can be used, as well as conductive adhesives made by dispersing conductive fillers such as silver fillers in various adhesives based on polyimide, epoxy, silicon, and acrylic.

[0050] like Figure 5 As shown, six electrodes 22a to 22f are disposed on the bottom surface of the internal oscillator 2, i.e., the bottom surface of the package 20. Electrode 22a corresponds to the Vcc1 terminal, electrode 22b corresponds to the LPF1 terminal, electrode 22c corresponds to the OUT1 terminal, electrode 22d corresponds to the VC1 terminal, electrode 22e corresponds to the OE1 terminal, and electrode 22f corresponds to the GND terminal. In other words, the Vcc1 terminal, LPF1 terminal, OUT1 terminal, VC1 terminal, OE1 terminal, and GND1 terminal are disposed on the bottom surface of the package 20.

[0051] Electrodes 22a and 22d are arranged along edge 2a, and electrodes 22c and 22f are arranged along edge 2c. Furthermore, electrodes 22d, 22e, and 22f are arranged along edge 2b, and electrodes 22a, 22b, and 22c are arranged along edge 2d. That is, electrode 22a is located at the corner where edges 2a and 2d intersect, electrode 22c is located at the corner where edges 2c and 2d intersect, electrode 22d is located at the corner where edges 2a and 2b intersect, and electrode 22f is located at the corner where edges 2b and 2c intersect.

[0052] Inside the package 20 or on the surface of the recess 20U, there are unshown wirings for electrically connecting the two electrodes 41 of the circuit element 4 corresponding to the XI and XO terminals and the two electrodes 3a and 3b of the vibrating plate 3, respectively. Furthermore, inside the package 20 or on the surface of the recess 20U, there are unshown wirings for electrically connecting the six electrodes 41 of the circuit element 4 corresponding to the Vcc, LPF, OUT, VC, OE, and GND terminals and the six electrodes 22a, 22b, 22c, 22d, 22e, and 22f of the internal oscillator 2 corresponding to the Vcc1, LPF1, OUT1, VC1, OE1, and GND1 terminals.

[0053] 3. Oscillator Construction

[0054] Figures 6-11 This is a diagram showing an example of the construction of oscillator 1. Figure 6 This is a 3D view of oscillator 1. Figure 7 This is a top view of oscillator 1. Figure 8 yes Figure 6 and Figure 7 BB section view. In Figures 6-11To understand the relationship between their orientations, the diagram illustrates the mutually orthogonal X, Y, and Z directions. Figures 6-11 In the diagram, the X, Y, and Z directions represent the parallel and perpendicular directions. Figures 2-5 The same three directions.

[0055] like Figures 6-8 As shown, oscillator 1 includes an internal oscillator 2, capacitors 5 and 6, a package 10, and a cover 11. Additionally, Figure 7 This is a diagram showing the oscillator 1 viewed from above with the cover 11 removed.

[0056] like Figure 7 As shown, package 10, when viewed from the top in the Z direction, has a side 1a along the Y direction, a side 1b along the X direction, a side 1c along the Y direction opposite to side 1a, and a side 1d along the X direction opposite to side 1b. That is, package 10 is approximately rectangular when viewed from the top in the Z direction.

[0057] The oscillator 1 is a double-sealed oscillator, and the package 10 is a container that houses the internal oscillator 2 and capacitors 5 and 6 within the same space. The package 10 is composed of a substrate 10a, a frame-shaped sidewall 10b joined to the substrate 10a, a frame-shaped sidewall 10c joined to the frame-shaped sidewall 10b, and a frame-shaped sidewall 10d joined to the frame-shaped sidewall 10c. A recess 10U is formed by the substrate 10a and the frame-shaped sidewalls 10b, 10c, and 10d. The internal oscillator 2 and capacitors 5 and 6 are housed within the internal space formed by covering the recess 10U with a cover 11. This protects the internal oscillator 2 and capacitors 5 and 6 from impacts and external environmental factors, particularly dust, moisture, and humidity. Furthermore, although not particularly limited, the package 10 can be made of ceramic such as alumina, and the cover 11 can be made of a metallic material such as Kovar alloy.

[0058] The substrate 10a has an L1 wiring layer, an L2 wiring layer, and an L3 wiring layer. The L1 wiring layer is disposed on the upper surface of the substrate 10a, i.e., the bottom surface of the recess 10U; the L2 wiring layer is disposed on the inner surface of the substrate 10a; and the L3 wiring layer is disposed on the lower surface of the substrate 10a, i.e., the bottom surface of the package 10. In the following description, the electrical connections between the L1, L2, and L3 wiring layers are made through through-hole wiring, vias, and side wiring of the substrate 10a.

[0059] Figure 9 This diagram illustrates an example of electrodes and wiring disposed in the L1 wiring layer. (See diagram for example.) Figure 9As shown, electrodes 13a, 13b, 13c, 13d, 13e, 13f, 15a, 15b, 16a, 16b and wiring 14 extending from electrode 13d are provided in the L1 wiring layer. Figure 7 and Figure 8 As shown, electrodes 13a, 13b, 13c, 13d, 13e, and 13f are respectively bonded to... via solder or conductive adhesive or other bonding components (not shown). Figure 5 Electrodes 22a, 22b, 22c, 22d, 22e, and 22f, which are located on the bottom surface of the internal oscillator 2, are electrically connected. Specifically, electrode 13a is electrically connected to the Vcc1 terminal, electrode 13b is electrically connected to the LPF1 terminal, electrode 13c is electrically connected to the OUT1 terminal, electrode 13d is electrically connected to the VC1 terminal, electrode 13e is electrically connected to the OE1 terminal, and electrode 13f is electrically connected to the GND1 terminal.

[0060] like Figure 7 and Figure 8 As shown, electrodes 15a and 15b are electrically connected to electrode 5a (one end of capacitor 5) and electrode 5b (the other end of capacitor 5) via solder or conductive adhesive (or other bonding components not shown). Similarly, electrodes 16a and 16b are electrically connected to electrode 6a (one end of capacitor 6) and electrode 6b (the other end of capacitor 6) via solder or conductive adhesive (or other bonding components not shown).

[0061] And, as Figure 7 As shown, capacitor 5 is adjacent to side 2a of the package 20 of the internal oscillator 2. That is, capacitor 5 is disposed near side 2a, and there are no electronic components between capacitor 5 and side 2a. Furthermore, the electrodes 5a and 5b, which are one end and the other end of capacitor 5, are arranged along the Y direction. That is, since one end and the other end of capacitor 5 are arranged along side 2a of package 20, the distance between one end of capacitor 5 and the Vcc1 terminal and the distance between the other end of capacitor 5 and the GND1 terminal can be shortened.

[0062] Similarly, capacitor 6 is adjacent to side 2b of the package 20 of the internal oscillator 2. That is, capacitor 6 is disposed near side 2b, and there are no electronic components between capacitor 6 and side 2b. Furthermore, the electrodes 6a and 6b, which are one end and the other end of capacitor 6, are arranged along the X direction. That is, since one end and the other end of capacitor 6 are arranged along side 2b of package 20, the distance between one end of capacitor 6 and the LPF1 terminal and the distance between the other end of capacitor 6 and the GND1 terminal can be shortened.

[0063] Figure 10 This is a diagram showing an example of electrodes and wiring disposed in the L2 wiring layer. Figure 11This is a diagram showing an example of an electrode disposed in the L3 wiring layer. Figure 11 This is a perspective view of the lower surface as seen from the upper surface of substrate 10a. Additionally, in Figure 10 In the middle, it is represented by a dashed line. Figure 7 The capacitors 5 and 6 shown are Figure 9 Electrodes 15a, 15b, 16a, and 16b are shown. Additionally, in... Figure 11 In the middle, it is represented by a dashed line. Figure 7 Electrodes 5a, 5b, 6a, 6b shown and Figure 5 The electrodes 22a to 22f of the internal oscillator 2 shown.

[0064] like Figure 10 As shown, wiring 17a, 17b, 17c, 17d, and 17e are provided on the L2 wiring layer. Wiring 17e is a grounding pattern.

[0065] like Figure 11 As shown, ten electrodes 12a to 12j are disposed on the L3 wiring layer. Electrode 12a corresponds to the Vcc2 terminal, electrode 12b corresponds to the OE2 terminal, electrode 12e corresponds to the OUT2 terminal, electrode 12f corresponds to the VC2 terminal, and electrode 12j corresponds to the GND2 terminal. In other words, the Vcc2, OE2, OUT2, VC2, and GND2 terminals are disposed on the bottom surface of package 10. Electrodes 12c, 12d, 12g, 12h, and 12i are NC terminals. NC is an abbreviation for Non-Connection or No Connecting.

[0066] Electrodes 12a and 12f are arranged along edge 1a, and electrodes 12e and 12j are arranged along edge 1c. In addition, electrodes 12g, 12h, and 12i are arranged along edge 1b, and electrodes 12b, 12c, and 12d are arranged along edge 1d.

[0067] like Figures 9-11 As shown, wiring 17a connects electrodes 12a, 15a, and 13a. Specifically, wiring 17a connects the Vcc2 terminal, one end of the capacitor 5, and the Vcc1 terminal. Thus, through wiring 17a, which is located in the L2 wiring layer (the inner layer of the package 10), the Vcc1 terminal is electrically connected to one end of the capacitor 5, and one end of the capacitor 5 is electrically connected to the Vcc2 terminal.

[0068] In addition, such as Figures 9-11 As shown, wiring 17b is the wiring that connects electrode 12b and electrode 13e. That is, wiring 17b is the wiring that connects OE2 terminal and OE1 terminal. In this way, OE1 terminal and OE2 terminal are electrically connected through wiring 17b, which is provided in the L2 wiring layer, which is the inner layer of package 10.

[0069] In addition, such as Figures 9-11 As shown, wiring 17c is the wiring connecting electrode 13b and electrode 16a. That is, wiring 17c is the wiring connecting the LPF1 terminal to one end of capacitor 6. Thus, through wiring 17c provided in the L2 wiring layer, which is the inner layer of package 10, the LPF1 terminal is electrically connected to one end of capacitor 6.

[0070] In addition, such as Figures 9-11 As shown, wiring 17d is the wiring that connects electrode 12e and electrode 13c. That is, wiring 17d is the wiring that connects terminal OUT2 and terminal OUT1. Thus, terminal OUT1 and terminal OUT2 are electrically connected through wiring 17d, which is provided in the L2 wiring layer, which is the inner layer of package 10.

[0071] In addition, such as Figures 9-11 As shown, wiring 17e connects electrodes 12j, 15b, 16b, and 13f. Specifically, wiring 17e connects the GND2 terminal, the other end of capacitor 5, the other end of capacitor 6, and the GND1 terminal. Thus, through wiring 17e, which is located in the L2 wiring layer (the inner layer of the package 10), the GND1 terminal is electrically connected to the other ends of capacitors 5 and 6, and the other ends of capacitors 5 and 6 are electrically connected to the GND2 terminal.

[0072] In addition, such as Figures 9-11 As shown, wiring 14 is the wiring connecting electrode 12f and electrode 13d. That is, wiring 14 is the wiring connecting the VC2 terminal and the VC1 terminal. Thus, the VC1 terminal and the VC2 terminal are electrically connected through wiring 14, which is provided on the surface layer of package 10, i.e., the L1 wiring layer. Assuming that the wiring connecting the VC2 terminal and the VC1 terminal is provided on the L2 wiring layer, in order to bypass the wiring 17e, which is a ground pattern, this wiring becomes longer, but as... Figure 9 As shown, by placing the wiring 14 on the L1 wiring layer, the wiring 14 can be shortened.

[0073] like Figure 11 As shown, electrode 12e is closest to electrode 22c among electrodes 22a to 22f disposed in package 20. That is, the OUT2 terminal is closest to the OUT1 terminal among all terminals disposed in package 20, namely Vcc1, LPF1, OUT1, VC1, OE1, and GND1. Therefore, the wiring 17d connecting the OUT1 and OUT2 terminals is shortened, thus reducing the noise superimposed on the oscillation signal CLK output from the OUT1 terminal and improving the phase noise characteristics.

[0074] In addition, such as Figure 11As shown, electrode 12f is closest to electrode 22d among electrodes 22a to 22f provided in package 20. That is, the VC2 terminal is closest to the VC1 terminal among all terminals provided in package 20. Therefore, the wiring 14 connecting the VC2 terminal and the VC1 terminal is shortened, thus reducing the noise superimposed on the frequency control signal input from the VC2 terminal and improving the frequency accuracy of the oscillation signal CLK.

[0075] In addition, such as Figure 11 As shown, electrode 12a is closest to electrode 22a among electrodes 22a to 22f provided in package 20. That is, the Vcc2 terminal is closest to the Vcc1 terminal among all terminals provided in package 20. Therefore, the wiring 17a connecting the Vcc2 terminal and the Vcc1 terminal is shortened, thus reducing the noise superimposed on the power supply voltage supplied from the Vcc2 terminal. As a result, the noise superimposed on the oscillation signal CLK via the Vcc1 terminal is reduced, and the phase noise characteristics are improved.

[0076] Furthermore, electrode 5a, which is one end of capacitor 5, is closest to electrode 22a among electrodes 22a to 22f provided in package 20. That is, one end of capacitor 5 is closest to terminal Vcc1 among all terminals provided in package 20. Therefore, the wiring 17a connecting one end of capacitor 5 to terminal Vcc1 is shortened. Additionally, as... Figure 10 As shown, when viewed from above, the electrode 5b, which is the other end of the capacitor 5, overlaps with the wiring 17e, which is a ground pattern, provided in the L2 wiring layer, which is the inner layer of the package 10. That is, the other end of the capacitor 5 is directly mounted on the large ground pattern. Therefore, the capacitor 5 can function effectively as a bypass capacitor that stabilizes the power supply voltage by bypassing noise superimposed on the power supply voltage to ground.

[0077] In addition, such as Figure 11 As shown, electrode 12j is closest to electrode 22f among electrodes 22a to 22f provided in package 20. That is, the GND2 terminal is closest to the GND1 terminal among all terminals provided in package 20. Therefore, the wiring 17e connecting the GND2 terminal and the GND1 terminal is shortened, thus reducing the noise superimposed on the ground voltage supplied from the GND2 terminal. As a result, the noise superimposed on the oscillation signal CLK via the GND1 terminal is reduced, and the phase noise characteristics are improved.

[0078] Furthermore, the electrode 6b, which is the other end of the capacitor 6, is closest to electrode 22f among the electrodes 22a to 22f provided in the package 20. That is, the other end of the capacitor 6 is closest to the GND1 terminal among all the terminals provided in the package 20. Therefore, the wiring 17e connecting the other end of the capacitor 6 to the GND1 terminal is shortened. In addition, as Figure 10As shown, when viewed from above, the electrode 6b, which is the other end of the capacitor 6, overlaps with the wiring 17e, which is a ground pattern, disposed in the L2 wiring layer, which is the inner layer of the package 10. That is, the other end of the capacitor 6 is directly mounted on the large ground pattern. Therefore, by... Figure 1 The low-pass filter consisting of resistor 106 and capacitor 6 shown can effectively reduce high-frequency noise superimposed on the temperature compensation voltage.

[0079] As described above, the vibrating plate 3 is mounted on the package 20 at the positions of the engaging parts 71a and 71b. Figure 7 As shown, when the position of the connecting member 71a is set to the mounting position P of the vibrating plate 3 in the package 20, the distance d between the mounting position P and the center O of the package 10 is smaller than the distance d1 between the mounting position P and the edge 1a and the distance d2 between the mounting position P and the edge 1b. Furthermore, the distance d between the mounting position P and the center O of the package 10 is smaller than the distance d3 between the mounting position P and the edge 1c and the distance d4 between the mounting position P and the edge 1d. When the position of the connecting member 71b is set to the mounting position P, the distance d is also smaller than distances d1, d2, d3, and d4. That is, the vibrating plate 3 is mounted close to the center O of the package 10, therefore, even if stress is applied to the package 10, poor connection or deformation of the vibrating plate 3 is less likely to occur. Therefore, even if stress is applied to the package 10, the frequency accuracy of the oscillation signal CLK is less likely to decrease.

[0080] In addition, in order to minimize the noise superimposed on the oscillation signal CLK output from the OUT1 terminal, such as Figure 11 As shown, it is preferable to minimize the distance between terminals OUT1 and OUT2. Therefore, as... Figure 7 As shown, the internal oscillator 2 is positioned near the corner where sides 1c and 1d of the package 10 intersect, creating an L-shaped free space in the substrate 10a of the package 10. Therefore, by arranging capacitors 5 and 6 and wiring 14 in this L-shaped region, the free space can be effectively utilized, thus achieving miniaturization of the oscillator 1.

[0081] Additionally, there is an example where the Y direction is "direction 1" and an example where the X direction is "direction 2". Furthermore, package 20 is an example of "package 1", side 2a is an example of "side 1", and side 2b is an example of "side 2". Furthermore, package 10 is an example of "package 2", side 1a is an example of "side 3", and side 1b is an example of "side 4". Furthermore, Vcc1 terminal is an example of "power supply terminal 1", and Vcc2 terminal is an example of "power supply terminal 2". Furthermore, GND1 terminal is an example of "ground terminal 1", and GND2 terminal is an example of "ground terminal 2". Furthermore, OUT1 terminal is an example of "output terminal 1", and OUT2 terminal is an example of "output terminal 2". Furthermore, VC1 terminal is an example of "frequency control terminal 1", and VC2 terminal is an example of "frequency control terminal 2". Furthermore, capacitor 5 is an example of "capacitor 1", and capacitor 6 is an example of "capacitor 2". Furthermore, wiring 17a is an example of "first wiring" and wiring 17c is an example of "second wiring".

[0082] 4. Effects

[0083] As explained above, in the oscillator 1 of this embodiment, since the vibrating plate 3 and the circuit element 4 that drives the vibrating plate 3 are housed in the package 20, it is not necessary to connect the circuit element 4 and the package 10 via bonding wires. Therefore, since there is no area on the upper surface of the substrate 10a, which serves as the mounting surface of the package 10, where bonding wires are not needed, capacitor 5 can be placed near edge 2a of the package 20, and capacitor 6 can be placed near edge 2b of the package 20. Therefore, the wiring 17a, which electrically connects the Vcc1 terminal of the package 20 to one end of the capacitor 5, is shortened, and the wiring 17c, which electrically connects the LPF1 terminal of the package 20 to one end of the capacitor 6, is shortened. Furthermore, since the Vcc1 terminal is arranged along edge 2a of the package 20, wiring 17a is further shortened. Therefore, according to the oscillator 1 of this embodiment, the noise superimposed on wirings 17a and 17c can be reduced, and the phase noise characteristics of the oscillation signal CLK can be improved through the noise reduction effect of capacitors 5 and 6.

[0084] Furthermore, in the oscillator 1 of this embodiment, since the vibrating plate 3 and the circuit element 4 that drives the vibrating plate 3 are housed in the package 20, and the package 20 is housed in the package 10, the vibrating plate 3 and the circuit element 4 are less susceptible to the effects of external air temperature changes. Moreover, since the vibrating plate 3 and the circuit element 4 that drives the vibrating plate 3 are housed in one package 20, the temperature difference between the vibrating plate 3 and the circuit element 4 is small. Therefore, according to the oscillator 1 of this embodiment, the accuracy of temperature compensation for the circuit element 4 is improved, and the frequency-temperature characteristics of the oscillation signal CLK are improved.

[0085] Furthermore, in the oscillator 1 of this embodiment, the OUT2 terminal is the closest to the OUT1 terminal among all the terminals provided in the package 20. Therefore, the wiring 17d connecting the OUT1 terminal and the OUT2 terminal is shortened. As a result, according to the oscillator 1 of this embodiment, the noise superimposed on the oscillation signal CLK output from the OUT1 terminal is reduced, and the phase noise characteristics of the oscillation signal CLK are improved.

[0086] Furthermore, in the oscillator 1 of this embodiment, the Vcc2 terminal is the closest to the Vcc1 terminal among all the terminals provided in the package 20. Therefore, the wiring 17a connecting the Vcc2 and Vcc1 terminals is shortened. As a result, in the oscillator 1 of this embodiment, the noise superimposed on the power supply voltage supplied from the Vcc2 terminal is reduced, and the noise superimposed on the oscillation signal CLK via the Vcc1 terminal is reduced. Therefore, the phase noise characteristics of the oscillation signal CLK are improved.

[0087] Furthermore, in the oscillator 1 of this embodiment, the GND2 terminal is the closest to the GND1 terminal among all the terminals provided in the package 20. Therefore, the wiring 17e connecting the GND2 terminal and the GND1 terminal is shortened. As a result, in the oscillator 1 according to this embodiment, the noise superimposed on the ground voltage supplied from the GND2 terminal is reduced, and the noise superimposed on the oscillation signal CLK via the GND1 terminal is reduced. Therefore, the phase noise characteristics of the oscillation signal CLK are improved.

[0088] Furthermore, in the oscillator 1 of this embodiment, the VC2 terminal is the closest to the VC1 terminal among all the terminals provided in the package 20. Therefore, the wiring 14 connecting the VC2 terminal and the VC1 terminal is shortened. As a result, in the oscillator 1 according to this embodiment, the noise superimposed on the frequency control signal input from the VC2 terminal is reduced, and the frequency accuracy of the oscillation signal CLK is improved.

[0089] Furthermore, according to the oscillator 1 of this embodiment, the vibrating plate 3 is installed at a position close to the center O of the package 10. Therefore, even if stress is applied to the package 10, it is not easy for the vibrating plate 3 to be poorly connected or deformed, and the frequency accuracy of the oscillation signal CLK is not easily reduced.

[0090] Furthermore, in the oscillator 1 of this embodiment, one end of the capacitor 5 is closest to the Vcc1 terminal among all the terminals provided in the package 20, and the other end of the capacitor 5 is directly mounted on a grounding pattern with a large area. Therefore, the capacitor 5 can play a more effective role as a bypass capacitor for stabilizing the power supply voltage.

[0091] Furthermore, in the oscillator 1 of this embodiment, the other end of the capacitor 6 is closest to the GND1 terminal among all the terminals provided in the package 20, and the other end of the capacitor 6 is directly mounted on a grounding pattern with a large area. Therefore, the low-pass filter composed of the resistor 106 and the capacitor 6 can effectively reduce the high-frequency noise superimposed on the temperature compensation voltage.

[0092] 5. Variations

[0093] This invention is not limited to this embodiment, and various modifications can be made within the scope of the spirit of this invention.

[0094] For example, the oscillator 1 and internal oscillator 2 in the above embodiments are voltage-controlled temperature-compensated oscillators, but are not limited thereto. For example, oscillator 1 and internal oscillator 2 can be temperature-compensated oscillators such as TCXOs without frequency control functions, or oscillators such as SPXOs without temperature compensation and frequency control functions. TCXO is an abbreviation for Temperature Compensated Crystal Oscillator, and SPXO is an abbreviation for Simple Packaged Crystal Oscillator.

[0095] The above-described embodiments and modifications are examples and are not limited thereto. For example, the various embodiments and modifications can be appropriately combined.

[0096] This invention includes structures that are substantially the same as those described in the embodiments, such as structures with the same function, method, and result, or structures with the same purpose and effect. Additionally, this invention includes structures that replace non-essential parts of the structures described in the embodiments. Furthermore, this invention includes structures that perform the same function or effect as those described in the embodiments, or structures capable of achieving the same purpose. Additionally, this invention includes structures that incorporate known techniques into the structures described in the embodiments.

[0097] The following content is derived from the above implementation methods and variations.

[0098] One embodiment of the oscillator includes: a vibrating plate; a circuit element that drives the vibrating plate to output an oscillation signal; a first package that houses the vibrating plate and the circuit element, having a first side along a first direction and a second side along a second direction perpendicular to the first direction; a first power supply terminal disposed in the first package and arranged along the first side; a filter terminal disposed in the first package; a first capacitor adjacent to the first package along the first side; a second capacitor adjacent to the first package along the second side; and a second package that houses the first package, the first capacitor, and the second capacitor, wherein the first power supply terminal is electrically connected to one end of the first capacitor via a first wiring disposed in the inner layer of the second package, and the filter terminal is electrically connected to one end of the second capacitor via a second wiring disposed in the inner layer of the second package.

[0099] In this oscillator, since the vibrating plate and the circuit elements driving the vibrating plate are housed in the first package, there is no need to connect the circuit elements and the second package via bonding wires. Therefore, there is no area on the mounting surface of the second package that requires bonding wires, allowing the first capacitor to be positioned near the first side of the first package and the second capacitor near the second side of the first package. Consequently, the first wiring connecting the first power terminal of the first package to one end of the first capacitor is shortened, and the second wiring connecting the filter terminal of the first package to one end of the second capacitor is also shortened. Furthermore, since the first power terminal is positioned along the first side of the first package, the first wiring is further shortened. Therefore, according to this oscillator, noise superimposed on the first and second wirings can be reduced, and the phase noise characteristics of the oscillation signal can be improved through the noise reduction effect of the first and second capacitors.

[0100] In one embodiment of the oscillator, a first output terminal for outputting the oscillation signal may be provided in the first package, and a second output terminal electrically connected to the first output terminal may be provided in the second package, wherein the second output terminal is the closest to the first output terminal among all the terminals provided in the first package.

[0101] According to this oscillator, the wiring connecting the first output terminal and the second output terminal is shortened, thus reducing the noise superimposed on the oscillation signal output from the first output terminal and improving the phase noise characteristics.

[0102] In one embodiment of the oscillator, the second package may have a second power terminal electrically connected to the first power terminal, the second power terminal being the closest to the first power terminal among all the terminals provided in the first package.

[0103] According to this oscillator, the wiring connecting the second power terminal and the first power terminal is shortened, thus reducing the noise superimposed on the power supply voltage supplied from the second power terminal. Therefore, the noise superimposed on the oscillation signal via the first power terminal is reduced, and the phase noise characteristics are improved.

[0104] In one embodiment of the oscillator, a first ground terminal may be provided in the first package, and a second ground terminal electrically connected to the first ground terminal may be provided in the second package, wherein the second ground terminal is the closest to the first ground terminal among all the terminals provided in the first package.

[0105] According to this oscillator, the wiring connecting the second ground terminal and the first ground terminal is shortened, thus reducing the noise superimposed on the ground voltage supplied from the second ground terminal. Therefore, the noise superimposed on the oscillation signal via the first ground terminal is reduced, and the phase noise characteristics are improved.

[0106] In one embodiment of the oscillator, a first frequency control terminal may be provided in the first package, and a second frequency control terminal electrically connected to the first frequency control terminal may be provided in the second package. The second frequency control terminal is input with a signal that controls the frequency of the oscillation signal, and the second frequency control terminal is the closest to the first frequency control terminal among all the terminals provided in the first package.

[0107] According to this oscillator, the wiring connecting the second frequency control terminal and the first frequency control terminal is shortened, thus reducing the noise superimposed on the signal input from the second frequency control terminal. Therefore, the frequency accuracy of the oscillation signal is improved.

[0108] In one embodiment of the oscillator, the second package may have a third side along the first direction and a fourth side along the second direction, the vibrating plate is mounted on the first package, and the distance between the mounting position of the vibrating plate in the first package and the center of the second package is less than the distance between the mounting position and the third side and the distance between the mounting position and the fourth side.

[0109] In this oscillator, the vibrating plate is mounted near the center of the second package, i.e., at a position that is not easily deformed even when stress is applied to the second package. Therefore, poor connection or deformation of the vibrating plate is less likely to occur. Consequently, according to this oscillator, the frequency accuracy of the oscillation signal is not easily reduced even when stress is applied to the second package.

[0110] In one embodiment of the oscillator, one end of the first capacitor may be closest to the first power supply terminal among all the terminals disposed in the first package.

[0111] According to this oscillator, the wiring connecting one end of the first capacitor and the first power supply terminal is shortened, so the first capacitor can perform better as a bypass capacitor to stabilize the power supply voltage.

[0112] In one embodiment of the oscillator, a first ground terminal may be provided in the first package, and the other end of the second capacitor may be electrically connected to the first ground terminal and be closest to the first ground terminal among all the terminals provided in the first package.

[0113] According to this oscillator, the wiring connecting the other end of the second capacitor and the first ground terminal is shortened, so the low-pass filter containing the second capacitor can effectively reduce high-frequency noise.

[0114] In one embodiment of the oscillator, a first ground terminal may be provided in the first package, and the other ends of the first capacitor and the second capacitor may be electrically connected to the first ground terminal. When the second package is viewed from above, the other ends of the first capacitor and the second capacitor may overlap with the grounding pattern provided in the inner layer of the second package.

[0115] According to this oscillator, since the other ends of the first capacitor and the second capacitor can be directly mounted on a large grounding pattern, the first capacitor and the second capacitor can achieve a high efficiency.

[0116] In one embodiment of the oscillator, one end of the first capacitor and the other end are arranged along the first direction, and one end of the second capacitor and the other end are arranged along the second direction.

[0117] According to this oscillator, the two ends of the first capacitor can be brought close to the first side of the first package, thus shortening both the distance between one end of the first capacitor and the first power supply terminal, and the distance between the other end of the first capacitor and the first ground terminal. Therefore, the first capacitor can effectively function as a bypass capacitor for stabilizing the power supply voltage. Furthermore, according to this oscillator, since the two ends of the second capacitor can be brought close to the second side of the first package, both the distance between one end of the second capacitor and the filter terminal, and the distance between the other end of the second capacitor and the first ground terminal, can be shortened. Therefore, a low-pass filter configured to include the second capacitor can effectively reduce high-frequency noise.

Claims

1. An oscillator comprising: Vibrating pad; A circuit element that drives the vibrating plate to output an oscillation signal; A first package, which houses the vibrating plate and the circuit elements, has a first side along a first direction and a second side along a second direction perpendicular to the first direction. A first power terminal is disposed in the first package and arranged along the first side; A filter terminal is disposed in the first package; A first capacitor, which is adjacent to the first package along the first side; A second capacitor, which is adjacent to the first package along the second side; as well as The second package houses the first package, the first capacitor, and the second capacitor. The first power terminal is electrically connected to one end of the first capacitor via a first wiring disposed in the inner layer of the second package. The filter terminal is electrically connected to one end of the second capacitor via a second wiring disposed in the inner layer of the second package.

2. The oscillator according to claim 1, wherein, The first package is provided with a first output terminal for outputting the oscillation signal. The second package is provided with a second output terminal that is electrically connected to the first output terminal. The second output terminal is the closest to the first output terminal among all the terminals disposed in the first package.

3. The oscillator according to claim 1, wherein, The second package is provided with a second power terminal that is electrically connected to the first power terminal. The second power terminal is the closest to the first power terminal among all the terminals disposed in the first package.

4. The oscillator according to claim 1, wherein, A first grounding terminal is provided in the first package. The second package is provided with a second grounding terminal that is electrically connected to the first grounding terminal. The second grounding terminal is the closest to the first grounding terminal among all the terminals disposed in the first package.

5. The oscillator according to claim 1, wherein, The first package is provided with a first frequency control terminal. The second package is provided with a second frequency control terminal electrically connected to the first frequency control terminal. This second frequency control terminal is input with a signal to control the frequency of the oscillation signal. The second frequency control terminal is the closest to the first frequency control terminal among all the terminals disposed in the first package.

6. The oscillator according to claim 1, wherein, The second package has a third side along the first direction and a fourth side along the second direction. The vibrating plate is mounted on the first package. The distance between the mounting position of the vibrating plate in the first package and the center of the second package is less than the distance between the mounting position and the third side and the distance between the mounting position and the fourth side.

7. The oscillator according to claim 1, wherein, One end of the first capacitor is closest to the first power supply terminal among all the terminals disposed in the first package.

8. The oscillator according to claim 1, wherein, A first grounding terminal is provided in the first package. The other end of the second capacitor is electrically connected to the first ground terminal and is closest to the first ground terminal among all the terminals disposed in the first package.

9. The oscillator according to claim 1, wherein, A first grounding terminal is provided in the first package. The other end of the first capacitor and the other end of the second capacitor are electrically connected to the first ground terminal. When the second package is viewed from above, the other end of the first capacitor and the other end of the second capacitor overlap with the grounding pattern disposed on the inner layer of the second package.

10. The oscillator according to claim 1, wherein, One end and the other end of the first capacitor are arranged along the first direction. One end and the other end of the second capacitor are arranged along the second direction.

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