Fluid self-constant temperature crystal oscillator phase-locked power amplifier

Abstract

This invention discloses a fluid-driven, self-contained, temperature-controlled crystal oscillator (TCSLO) phase-locked power amplifier, belonging to the field of radio frequency and microwave technology. It includes a temperature-controlled crystal oscillator module, a TCSLO power amplifier module, a mounting base, a fluid connector, and an RF connector. The temperature-controlled crystal oscillator module adopts a cylindrical shell structure with 12 fluid channels evenly distributed along its circumference, forming a reciprocating fluid channel. This invention utilizes the heat generated during the operation of the TCSLO power amplifier module as a heat source, using the fluid as a heat carrier to guide the heat to the periphery and bottom surface of the temperature-controlled crystal oscillator module shell, achieving rapid preheating and temperature control of the crystal oscillator. Simultaneously, the heat from the power amplifier module is conducted away through the fluid to protect the power amplifier circuit. This application achieves rapid response and stable operation of the crystal oscillator without external intervention; it avoids the need for open-window milling designs on the crystal oscillator printed circuit board, maintaining the integrity of the printed circuit board structure and improving the stability of the output signal under vibration operating conditions.

Description

Technical Field

[0001] This invention belongs to the field of radio frequency microwave technology, specifically, it relates to a fluid self-contained thermostatic crystal lock-in power amplifier. Background Technology

[0002] In radio frequency (RF) and microwave communication systems, temperature-controlled crystal oscillator (TCS) phase-locked loop (PLL) power amplifiers are widely used in military radar detection, electronic warfare, satellite communication, and high-power RF power amplifier transmission. The current mainstream design involves embedding a temperature-controlled crystal oscillator (TCS) within the RF system circuit as a signal reference source. The RF signal output from the TCS is then processed sequentially through a PLL circuit, a power amplifier circuit, and a filter circuit to ultimately output a specific signal for user use.

[0003] However, in the aforementioned existing technical solutions, the cryogenic crystal oscillator typically requires a certain warm-up time to reach a stable operating state. This characteristic directly results in a long startup waiting time for the entire RF system, hindering its ability to respond quickly and effectively to operational demands and severely impacting system efficiency. Furthermore, because the mounting holes on the printed circuit board and metal casing of the cryogenic crystal oscillator need to prevent rapid heat dissipation to maintain a constant temperature environment, traditional designs typically employ a window milling process at these mounting locations to create thermal resistance for temperature control. This window milling design inevitably leads to a significant reduction in the structural strength of the printed circuit board and poor circuit grounding performance. Especially under vibration conditions, the window milling locations on the printed circuit board are highly susceptible to breakage, requiring engineers to invest considerable time in structural mechanics modeling, simulation, and topology optimization to achieve a compromise. Poor grounding also causes instability in the crystal oscillator output signal and deteriorates phase noise, creating potential hazards for subsequent circuits.

[0004] Meanwhile, the power amplifier circuit module generates a significant amount of heat during operation, typically cooled by liquid cooling. However, existing technologies have limited fluid channel path lengths. To meet heat dissipation requirements, it is often necessary to increase the cross-sectional area of ​​the fluid channel and the fluid velocity. This leads to a series of problems, including increased structural volume, higher pressure on the inner wall of the fluid channel, the need for more expensive high-pressure fluid connectors, thicker fluid channel covers sealed by friction stir welding, and increased welding process requirements. Consequently, the power consumption load of the external liquid supply pump also increases, significantly driving up the overall cost.

[0005] In summary, designing a fluid-driven, self-contained, temperature-controlled crystal phase-locked power amplifier (PLA) capable of guiding and utilizing the heat generated during power amplifier operation, enabling rapid temperature-controlled preheating of the crystal oscillator, reducing system startup waiting time, ensuring stable operation under vibration conditions and providing a stable RF output signal, while also increasing the fluid heat conduction path length of the subsequent power amplifier to optimize heat dissipation performance and reduce system cost, has become a pressing technical challenge in the RF and microwave field, and has significant engineering and application value. Summary of the Invention

[0006] The purpose of this invention is to provide a fluid self-contained thermostatic crystal lock-in power amplifier, which mainly solves the problems of long preheating time of crystal oscillators, insufficient strength of printed circuit board structure and low heat dissipation efficiency of power amplifier in the prior art.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0008] A fluid-powered self-contained cryogenic crystal phase-locked power amplifier includes a cryogenic crystal oscillator module, a phase-locked power amplifier module, a mounting base, a fluid connector, and an RF connector. The cryogenic crystal oscillator module has a fluid channel for achieving temperature control. The cryogenic crystal oscillator module and the phase-locked power amplifier module are connected through the fluid connector to form a complete fluid circulation loop. The phase-locked power amplifier module is equipped with an RF connector for outputting RF signals. The mounting base is used to fix the cryogenic crystal oscillator module and the phase-locked power amplifier module. The cryogenic crystal oscillator module and the phase-locked power amplifier module transmit RF signals through an RF cable.

[0009] Furthermore, in this invention, the isothermal crystal oscillator module includes a crystal housing, a crystal printed circuit board disposed within the crystal housing, a crystal oscillator mounted on the crystal printed circuit board, and a cover plate assembly for sealing the fluid channel.

[0010] Furthermore, in this invention, the crystal oscillator housing adopts a cylindrical structure, and 12 fluid channels are evenly distributed along the circumferential axial direction of the crystal oscillator housing. The 12 fluid channels are connected by through channels that are staggered on the front and back of the crystal oscillator housing to form a reciprocating fluid channel. The first and last numbered channels are respectively connected to the fluid inlet and fluid outlet provided on the radial side of the crystal oscillator housing. The fluid inlet and fluid outlet are both designed with threaded mounting holes for fluid connectors for installing the plugs of fluid connectors.

[0011] Furthermore, in this invention, the cover plate assembly includes multiple identical cover plates A and multiple identical cover plates B disposed on the back side; both cover plates A and cover plates B are machined with semi-circular grooves inside; when the cover plate assembly is fitted with the crystal oscillator housing, the cross-section of the through channel is formed by combining the semi-circular cross-sections of the cover plate assembly and the crystal oscillator housing into a full circular cross-section.

[0012] Furthermore, in this invention, the mounting base is provided with a crystal oscillator mounting cavity and a phase-locked power amplifier module mounting position. The bottom inner side of the crystal oscillator mounting cavity is provided with a plurality of crystal oscillator mounting holes, and the phase-locked power amplifier module mounting position is provided with screw holes.

[0013] Furthermore, in this invention, a circular stepped groove is designed in the central area of ​​the front side of the crystal oscillator housing, and a boss is provided in the circular stepped groove. A threaded mounting hole is designed on the boss. The crystal oscillator printed circuit board is fixedly installed through the mounting hole on it corresponding to the threaded mounting hole on the boss. An RF cable outlet hole is provided on the side of the crystal oscillator housing.

[0014] Furthermore, in this invention, the phase-locked power amplifier module includes a power amplifier housing, a phase-locked circuit board, a power amplifier circuit, and a channel cover plate disposed within the power amplifier housing; the back of the power amplifier housing is provided with two independent circulation channels, an inlet channel and an outlet channel, which are sealed by the channel cover plate; fluid connectors are respectively provided on both sides of the power amplifier housing for the inlet channel and the outlet channel.

[0015] Furthermore, in this invention, the front of the power amplifier housing is milled to form a power amplifier cavity for mounting the phase-locked circuit board and the power amplifier circuit. The inner end face of the power amplifier housing is designed with a wire hole for passing through and soldering the radio frequency cable led out from the temperature-controlled crystal oscillator module to the phase-locked circuit board.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] (1) This invention uses the heat generated by the operation of the phase-locked power amplifier module as a heat source and a fluid as a heat carrier, which is connected to the reciprocating fluid channel of the thermostatic crystal oscillator module via a fluid connector to achieve three-dimensional heating and thermostatic control of the crystal oscillator housing. This self-contained thermostatic method does not require an external dedicated heating system, and can enable the crystal oscillator to quickly reach a stable operating temperature, significantly shortening the system startup waiting time and realizing rapid response and immediate stable operation of the radio frequency system.

[0018] (2) In this invention, the printed circuit board of the isothermal crystal oscillator module adopts a complete plate structure and is fixedly installed on the circular stepped groove boss of the crystal oscillator housing, avoiding the need for opening and milling at the installation position of the crystal oscillator in the traditional design. The complete printed circuit board maintains good structural strength and is not prone to breakage under vibration conditions. At the same time, it improves the circuit grounding performance and effectively suppresses the problem of unstable crystal oscillator output signal and phase noise deterioration caused by poor grounding, thus meeting the requirement of stable and reliable output signal under vibration conditions.

[0019] (3) This invention provides two independent circulation channels, an inlet channel and an outlet channel, on the back of the phase-locked power amplifier module. The inlet channel is concentrated in the area of ​​the power amplifier chip with high heat generation to fully absorb heat, while the outlet channel is far away from the high-heat area to avoid backflow of heat affecting the heat concentration area of ​​the power amplifier module. This design not only extends the fluid heat conduction path length of the power amplifier module and optimizes the heat dissipation effect, but also eliminates the need to increase the cross-sectional area and flow rate of the fluid channel, thereby reducing the requirements for the pressure resistance rating of the fluid connector, the thickness of the channel cover plate, and the welding process, effectively reducing the overall system cost.

[0020] (4) In this invention, the crystal oscillator module adopts a cylindrical structure with 12 reciprocating fluid channels evenly distributed along the circumferential axis. The bottom surface of the fluid channel and the reciprocating bend position are all smoothly transitioned by rounded corners to avoid vortexing when the fluid turns, reduce the pressure of the fluid on the inner wall of the channel, and extend the service life of the product. At the same time, the cover plate assembly and the crystal oscillator housing form a fluid channel with a full circular cross section through a semi-circular groove, which maximizes the heat conduction contact surface between the fluid and the channel wall, and greatly improves the heat exchange efficiency and the uniformity of the constant temperature effect. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0022] Figure 2 This is a diagram showing the flow path of the fluid channel on the front side of the crystal oscillator housing in this invention.

[0023] Figure 3 This is a side view of the crystal oscillator housing in this invention.

[0024] Figure 4 This is a diagram showing the flow path of the fluid channel on the back of the crystal oscillator housing in this invention.

[0025] Figure 5 This is a three-dimensional front view of the crystal oscillator housing in this invention.

[0026] Figure 6 This is a cross-sectional schematic diagram of the fluid channel in this invention.

[0027] Figure 7This is a schematic diagram of the structure of cover plate A and cover plate B in this invention.

[0028] Figure 8 This is a schematic diagram of the assembly of the crystal oscillator printed circuit board and the crystal oscillator in this invention.

[0029] Figure 9 This is an exploded structural diagram of the isothermal crystal oscillator module in this invention.

[0030] Figure 10 This is a schematic diagram of the mounting base in this invention.

[0031] Figure 11 This is a front view of the phase-locked power amplifier module structure in this invention.

[0032] Figure 12 This is a schematic diagram of the back side of the phase-locked power amplifier module structure in this invention.

[0033] Figure 13 This is a schematic diagram of the assembly of the phase-locked power amplifier module in this invention.

[0034] Figure 14 This is a schematic diagram of the back of the assembly structure of the phase-locked power amplifier module in this invention.

[0035] Figure 15 This is a schematic diagram illustrating the simulation effect of the present invention.

[0036] The names corresponding to the reference numerals in the attached figures are as follows:

[0037] 1-Thermostatic crystal oscillator module, 2-Phase-locked power amplifier module, 3-Mounting base, 4-Fluid connector, 5-RF connector, 6-Fluid channel, 7-RF cable, 10-Crystal oscillator housing, 11-Crystal oscillator printed circuit board, 12-Crystal oscillator, 13-Cover plate assembly, 14-Fluid inlet, 15-Fluid outlet, 21-Power amplifier housing, 22-Phase-locked circuit board, 23-Power amplifier circuit, 24-Channel cover plate, 25-Liquid inlet channel, 26-Liquid outlet channel, 31-Crystal oscillator mounting cavity, 32-Phase-locked power amplifier module mounting position, 33-Crystal oscillator mounting hole, 34-Screw hole, 101-Circular stepped groove, 102-Boss, 103-Threaded mounting hole, 104-RF cable outlet hole, 131-Cover plate A, 132-Cover plate B, 133-Semi-circular groove, 211-Power amplifier cavity, 212-Wire passage hole. Detailed Implementation

[0038] The present invention will be further described below with reference to the accompanying drawings and embodiments. The embodiments of the present invention include, but are not limited to, the following embodiments.

[0039] like Figure 1As shown, the fluid-powered self-contained cryogenic crystal phase-locked power amplifier disclosed in this invention mainly includes a cryogenic crystal oscillator module 1, a phase-locked power amplifier module 2, a mounting base 3, a fluid connector 4, and an RF connector 5. The cryogenic crystal oscillator module 1 and the phase-locked power amplifier module 2 are connected via the fluid connector 4 to form a complete fluid circulation loop through a fluid channel 6. The RF connector 5 is mounted on the phase-locked power amplifier module 2 for outputting RF signals. The mounting base 3 is used to securely mount the cryogenic crystal oscillator module 1 and the phase-locked power amplifier module 2.

[0040] In applications such as military radar detection, electronic countermeasures, satellite communication, and high-power radio frequency amplifier transmission, when this fluid-powered self-contained isothermal crystal oscillator phase-locked power amplifier is working, the heat generated by the phase-locked power amplifier module 2 is guided through the fluid to the periphery and bottom of the isothermal crystal oscillator module 1, achieving rapid preheating and temperature control of the crystal oscillator 12. This self-contained temperature control method eliminates the need for an external dedicated heating system, enabling the crystal oscillator 12 to quickly reach a stable operating temperature, significantly shortening the system startup waiting time and improving overall operating efficiency.

[0041] like Figures 2-5 and Figure 9 As shown, the isothermal crystal oscillator module 1 in this embodiment of the invention mainly includes a crystal housing 10, a crystal printed circuit board 11 disposed within the crystal housing 10, a crystal oscillator 12 mounted on the crystal printed circuit board 11, and a cover plate assembly 13 for sealing the fluid channel 6. The crystal housing 10 adopts a cylindrical structure, and 12 fluid channels 6 are evenly distributed along the circumferential axial direction of the cylindrical housing. These 12 fluid channels 6 are connected to form a reciprocating fluid channel through a specific structural design. At this point, the entire fluid channel is as follows: Channels #1 and #12 are connected to the fluid connector plugs at the fluid inlet and outlet, respectively; Channels #2 to #11 are reciprocating through slots along the circumference: this allows fluid to flow from the inlet to the back channel #1, then to the front channel #2, then to the back channel #3, and so on... finally to the back channel #11 and channel #12. The first channel #1 and the last channel #12 are connected to the fluid inlet 14 and fluid outlet 15 on the radial side of the circle, respectively. The inlet and outlet are designed with threaded mounting holes for the fluid connector plugs. This reciprocating fluid channel design allows the fluid to flow fully through the circumference and bottom surface of the crystal oscillator housing 10, creating a three-dimensional constant temperature effect. This makes the temperature distribution of the crystal oscillator 12 more uniform, the constant temperature effect more significant, and effectively ensures the stable operation of the crystal oscillator 12 and the output of a stable radio frequency signal.

[0042] In this embodiment, stepped grooves are milled on both ends of the crystal oscillator housing 10. These stepped grooves are used to install and position the cover plate assembly 13. Specifically, the cover plate assembly 13 includes five identical cover plates A131 on the front and six identical cover plates B132 on the back. The front and back are designed with a corresponding number of stepped groove structures to match the corresponding number of cover plates, so that a flat sealing surface is formed between the cover plate assembly 13 and the crystal oscillator housing 10. The cover plates A131 and B132 are sealed to the crystal oscillator housing 10 by welding to ensure the airtightness and liquid tightness requirements of the fluid channel 6. The back of the crystal oscillator housing 10 is designed with screw mounting holes for fixing the entire crystal oscillator housing 10 onto the mounting base 3.

[0043] like Figure 6 As shown, the fluid channel 6 in this embodiment of the invention has a specific cross-sectional shape and structural features. The bottom surface of the fluid channel 6 and the reciprocating 90° bends are all rounded to achieve a rounded tangent transition. This rounded transition design effectively prevents the fluid from swirling and stagnating during bends, smoothly guiding the fluid channel 6 along its path, reducing the pressure of the internal fluid on the channel's inner wall, thereby extending the product's service life.

[0044] like Figure 7 As shown, in this embodiment, both cover plate A131 and cover plate B132 have semi-circular grooves 133 machined inside. When the cover plate assembly 13 is fitted with the crystal oscillator housing 10, the cross-section of the internal fluid channel 6 is formed by the semi-circular groove on the crystal oscillator housing 10 and the semi-circular protrusion on the cover plate assembly, resulting in a complete circular cross-section. From a geometric perspective, the circular cross-section can obtain the maximum thermally conductive contact surface. Compared with square or other shaped cross-sections, the circular cross-section allows for more complete and efficient heat exchange between the fluid and the channel wall, thereby improving the overall temperature control effect of the isothermal crystal oscillator module 1.

[0045] like Figure 8 As shown, the crystal oscillator printed circuit board 11 in this embodiment of the invention adopts a complete plate structure, eliminating the need for window milling at the installation location of the crystal oscillator 12. A circular stepped groove 101 is designed in the central area of ​​the front of the crystal oscillator housing 10, and a boss 102 is provided within the groove. The boss 102 has threaded mounting holes. The crystal oscillator printed circuit board 11 is fixed in place by screws, with its mounting holes corresponding to the threaded mounting holes 103 on the boss 102. This installation method allows the crystal oscillator printed circuit board 11 to maintain its complete structural form, avoiding the structural strength reduction and poor grounding problems caused by window milling in traditional technologies.

[0046] The front side of the crystal oscillator printed circuit board 11 is provided with an oscillation circuit and radio frequency signal output pads for generating and outputting radio frequency signals. The crystal oscillator 12 is located below the crystal oscillator printed circuit board 11 and is vertically soldered to the pads of the crystal oscillator printed circuit board 11 via its pins. The position of the crystal oscillator 12 corresponds precisely to the reciprocating tortuous fluid channels 6 evenly distributed on the crystal oscillator housing 10. Heat is transferred through the housing wall to the hot fluid in the fluid channels 6, and then to the crystal oscillator 12, achieving a balanced three-dimensional constant temperature preheating effect.

[0047] Compared to existing technologies, traditional crystal oscillator modules require milling openings at the mounting locations on the crystal oscillator printed circuit board (PCB) 11 to reduce heat dissipation and create thermal resistance for temperature control. However, this milling design significantly reduces the structural strength of the PCB and causes poor circuit grounding performance. When the entire system is under vibration, the milled openings are prone to breakage, leading to unstable crystal output signals and deteriorated phase noise. In this embodiment, the crystal oscillator PCB 11 adopts a complete plate structure, eliminating the need for milling openings. This maintains structural strength while improving grounding performance, meeting the technical requirements of stable and reliable output signals and excellent dynamic phase noise under vibration conditions.

[0048] In this embodiment, the radio frequency (RF) signal of the crystal oscillator 12 is led out from the RF signal output pad of the crystal oscillator printed circuit board 11 via the RF cable 7. The side of the crystal oscillator housing 10 is designed with an RF cable outlet hole 104 for leading out the RF cable 7. After passing through this opening, the RF cable 7 passes through a through-hole designed on the inner end face of the phase-locked power amplifier module 2 and is led to the phase-locked circuit board 22 for soldering, thus realizing the transmission of the crystal oscillator RF signal.

[0049] like Figures 11-14 As shown, the phase-locked power amplifier module 2 in this embodiment of the invention mainly includes a power amplifier housing 21, a phase-locked circuit board 22 disposed within the power amplifier housing 21, a power amplifier circuit 23, and a channel cover plate 24. The power amplifier housing 21 is made of aluminum alloy, which has good thermal conductivity and can effectively transfer the heat generated by the power amplifier circuit 23 during operation to the fluid channel for heat dissipation.

[0050] The phase-locked power amplifier module 2 has two independent circulation channels: an inlet channel 25 and an outlet channel 26, defined as path A and path B, respectively. These two circulation channels are located on the back of the power amplifier housing 21 and are sealed by frictional agitation with two cover plates of different shapes. The cover plate for path A is defined as the path A cover plate, and the cover plate for path B is defined as the path B cover plate. The shapes of these two cover plates are specifically designed according to the direction of their respective channels to match the different circulation channel path layouts.

[0051] Path A is the liquid inlet channel 25. After entering through the fluid connector 4 on the outside of the phase-locked power amplifier module 2, the fluid mainly concentrates on the high-heat-generating area on the back of the module, namely the area where the power amplifier chip is installed, and meanders back and forth to fully absorb the heat generated during the operation of the power amplifier. Then, it connects to the fluid inlet plug of the thermostatic crystal oscillator module 1 through the socket of the fluid connector 4, carrying the heat to the thermostatic crystal oscillator module 1 for thermostatic utilization. Path A passes through the area below the power amplifier chip and the bottom of the power amplifier cavity. These areas are the main heat-generating parts of the power amplifier circuit 23, with the highest heat density. By arranging a longer fluid path in the high-temperature area, heat absorption and conduction can be maximized.

[0052] Path B is the liquid outlet channel 26. After flowing out from the fluid outlet of the thermostatic crystal oscillator module 1, the fluid enters Path B through the fluid outlet plug on the side of the thermostatic crystal oscillator module 1 and connects to the socket of the fluid connector 4 inside the phase-locked power amplifier module 2. Path B should be designed to be far away from the heat-generating areas on the power amplifier module so that the heat from the returning liquid does not backfire on the heat-concentrated areas of the power amplifier module, thus preventing the temperature of the power amplifier chip from further increasing and affecting its operating performance.

[0053] The inner side of the phase-locked power amplifier module 2, which is the side that interfaces with the isothermal crystal oscillator module 1, is equipped with sockets for fluid connectors 4 at both the inlet and outlet. The sockets of the fluid connectors 4 mate with the fluid connector plugs on the fluid inlet 14 and fluid outlet 15 on the side of the isothermal crystal oscillator module 1, thus establishing a continuous fluid channel 6. The fluid connectors 4 employ a quick-connect blind-mating structure, enabling automatic calibration and mating without precise alignment, eliminating the need for pipe connection steps, significantly reducing space requirements, and simplifying installation and operation.

[0054] The inlet and outlet ports of the phase-locked power amplifier module 2, i.e., the user's side, are equipped with flange-type external fluid connectors, serving as external fluid supply and outlet ports for the product user. The flange structure of the external fluid connector facilitates connection and sealing with external piping systems, ensuring the reliability and sealing of the fluid delivery process.

[0055] The power amplifier housing 21 is milled to form a power amplifier cavity for mounting the phase-locked loop circuit board 22 and the power amplifier circuit 23. The power amplifier circuit 23 generally includes a power amplifier transmission microstrip and a power amplifier chip. The power amplifier chip is fixed to the inner surface of the power amplifier cavity through a sintering process to ensure good electrical and thermal performance. The heat generated by the power amplifier chip during operation is transferred to the power amplifier housing 21 through the sintered layer and then carried away by fluid flowing through the bottom and back surfaces of the power amplifier housing 21.

[0056] The phase-locked circuit board 22 is fixedly installed inside the power amplifier cavity. A through-hole 212 is designed on the inner end face of the power amplifier housing 21 for passing the RF cable 7, which is led out from the RF cable outlet hole 104 of the temperature-controlled crystal oscillator module 1, through and soldered to the phase-locked circuit board 22. After the RF signal is output from the crystal oscillator 12, it is transmitted to the phase-locked circuit board 22 via the RF cable 7. A PLL circuit is provided on the phase-locked circuit board 22 to perform phase-locking processing on the RF signal, locking the signal phase to the reference source or multiplying it to the target frequency. The phase-locked signal is then cascaded to the power amplifier circuit 23 for power amplification, achieving effective signal amplification through the power amplifier transmission microstrip and power amplifier chip. Finally, the amplified RF signal is output through the RF connector 5 for user use.

[0057] The power amplifier housing 21 is designed with mounting holes for fixed installation onto the mounting base 3. The phase-locked power amplifier module 2 can be translatably pushed along the surface of the mounting base 3, so that the sockets of its two fluid connectors 4 correspond to the plugs of the two fluid connectors on the side of the temperature-controlled crystal oscillator module 1 mounted on the mounting base 3 and are fixed in place. This translational pushing assembly method simplifies the installation process, improves assembly efficiency, and ensures a reliable connection between the fluid connector plugs and sockets.

[0058] like Figure 10 As shown, the mounting base 3 in this embodiment of the invention mainly includes a base body. The mounting base 3 is provided with a crystal oscillator mounting cavity 31 and a phase-locked power amplifier module mounting position 32. The bottom inner side of the crystal oscillator mounting cavity 31 is provided with several crystal oscillator mounting holes 33, and the phase-locked power amplifier module mounting position 32 is provided with screw holes 34. The base body is designed with a countersunk hole for mounting the crystal oscillator module, used to accommodate and position the thermostatic crystal oscillator module 1. The space of the countersunk hole is appropriately enlarged, maintaining a certain gap between the thermostatic crystal oscillator module 1 and the countersunk hole wall. Except for the screw mounting hole positions, the other surfaces of the mounting contact surface are appropriately designed with stepped structures. These gaps and stepped positions can be covered with heat-insulating pads, which not only effectively reduce heat dissipation around and on the bottom surface of the thermostatic crystal oscillator module 1, providing insulation and enabling the crystal oscillator 12 to reach and maintain a stable operating temperature more quickly, but also, to a certain extent, provide vibration damping, reducing the impact of external vibrations on the thermostatic crystal oscillator module 1 and improving the system's reliability in vibration environments.

[0059] The fluid circulation path of the isothermal crystal lock-in power amplifier in this embodiment of the invention is as follows: After the device has been working for a period of time, the cooling fluid provided by the external liquid supply system enters path A from the external fluid connector on the outside of the lock-in power amplifier module 2; the cooling fluid first passes through the bottom area of ​​the lock-in power amplifier module 2, directly absorbing a large amount of heat generated by the power amplifier chip and the power amplifier transmission microstrip during operation, and the temperature rises rapidly; the high-temperature fluid transitions through the socket of the fluid connector 4 and the fluid inlet plug on the side of the isothermal crystal oscillator module 1, and enters the isothermal crystal oscillator module 1; the high-temperature fluid circulates in the 12 fluid channels 6 of the crystal housing 10. The fluid flows through various areas of the circumference and bottom surface, transferring convective heat to the crystal oscillator 12 via the shell wall, achieving a three-dimensional heating and constant temperature effect. After completing the constant temperature heat exchange, the fluid flows out from the fluid outlet 15 on the side of the crystal oscillator shell 10, and transitions through the connection between the fluid outlet plug on the side of the constant temperature crystal oscillator module 1 and the fluid connector 4 socket on the inside of the phase-locked power amplifier module 2. The hot fluid enters path B, and since path B is designed to be far away from the heat-generating area, the heat no longer backflows into the heat concentration area of ​​the phase-locked power amplifier module 2. Finally, the hot fluid is discharged from the external fluid connector on the outside of the phase-locked power amplifier module 2 and returns to the external liquid supply system for cooling.

[0060] The entire fluid link can be summarized as follows: external user fluid connector inlet, fluid connection socket and plug transition, temperature control around and bottom of crystal oscillator housing, fluid connection plug and socket transition, and external user fluid connector outlet.

[0061] Taking a specific implementation project as an example, the main parameters of this embodiment are defined as follows: a conventional crystal oscillator 12 with a nominal frequency of 100MHz is selected, which achieves stable operation under a constant temperature of about 75℃; the power consumption of the power amplifier circuit is 95W, and the safe operating junction temperature of the power amplifier chip does not exceed 150℃; the working flow rate of the fluid connector is set to 200mL / min, and the cross-sectional diameter of the fluid channel 6 is 4mm; the material of the housing structure is 6061 aluminum alloy, which has excellent thermal conductivity and machinability.

[0062] Based on the above parameters, an equivalent three-dimensional geometric model was established, and the housing was set to 6061 aluminum alloy. A 95W power consumption was added at the power amplifier chip location as a heat flux load. Simultaneously, liquid water was used as the flow medium throughout the entire fluid channel from the fluid inlet to the fluid outlet, and the fluid velocity was set to a working flow rate of 200 mL / min. Fluid-thermal coupling co-simulation analysis was then performed.

[0063] Thermal simulation analysis results are as follows Figure 15As shown in the figure, the units of the temperature ladder are in °C, and the color of the temperature ladder changes from dark to light to indicate that the temperature is from low to high. It can be clearly observed that the temperature in the area where the crystal oscillator 12 is located is stable in the range of approximately 71.9 to 77.5 °C, which meets the design requirement of a preheating temperature of 75 °C for the crystal oscillator 12, and the temperature fluctuation range is within acceptable limits. The temperature at the location of the power amplifier circuit 23 is approximately 77 °C, which meets the requirement that the junction temperature of the RF power amplifier is ≤150 °C for safe operation, and there is a margin of >30 °C (in engineering, thermal design usually reserves a margin of more than 30 °C to avoid gain compression, decreased efficiency, and deterioration of performance caused by high temperatures). Therefore, this implementation example meets the usage requirements. That is, the fluid self-contained isothermal crystal lock-in power amplifier of this invention is indeed feasible.

[0064] By using a self-contained fluid method to preheat the crystal oscillator housing at a constant temperature, the crystal oscillator 12 can achieve rapid response and stable operation without external intervention, significantly reducing the waiting time for system stabilization. The crystal oscillator printed circuit board 11 avoids the need for open-cut milling at the mounting location, maintaining the integrity of the printed circuit board structure, improving the structural strength of the mounting location, and meeting the technical requirements of stable and reliable output signal and excellent dynamic phase noise under vibration operating conditions. This solution extends the fluid heat conduction channel length of the phase-locked power amplifier module 2, making fluid heat conduction more optimized. Simultaneously, the independent design of paths A and B effectively avoids the problem of backflow heat affecting the heat concentration area of ​​the phase-locked power amplifier module 2.

[0065] The above embodiments are merely one of the preferred embodiments of the present invention and should not be used to limit the scope of protection of the present invention. Any modifications or refinements made to the main design concept and spirit of the present invention that are not of substantial significance, but solve the same technical problem as the present invention, should be included within the scope of protection of the present invention.

Claims

1. A fluid-powered self-contained thermostatic crystal phase-locked power amplifier, comprising a thermostatic crystal oscillator module (1), a phase-locked power amplifier module (2), a mounting base (3), a fluid connector (4), and an RF connector (5), characterized in that: The thermostatic crystal oscillator module (1) has a fluid channel (6) for achieving thermostatic function; the thermostatic crystal oscillator module (1) and the phase-locked power amplifier module (2) are connected through the fluid channel (6) by a fluid connector (4) to form a complete fluid circulation loop; the phase-locked power amplifier module (2) is provided with an RF connector (5) for outputting RF signals; the mounting base (3) is used to fix the thermostatic crystal oscillator module (1) and the phase-locked power amplifier module (2); the thermostatic crystal oscillator module (1) and the phase-locked power amplifier module (2) are connected through an RF cable (7) to achieve RF signal transmission.

2. The fluid-powered, self-contained, temperature-controlled crystal lock-in power amplifier according to claim 1, characterized in that: The isothermal crystal oscillator module (1) includes a crystal housing (10), a crystal printed circuit board (11) disposed in the crystal housing (10), a crystal oscillator (12) mounted on the crystal printed circuit board (11), and a cover plate assembly (13) for sealing the fluid channel (6).

3. The fluid-self-contained isothermal crystal lock-in power amplifier according to claim 2, characterized in that: The crystal oscillator housing (10) adopts a cylindrical structure. Twelve fluid channels (6) are evenly distributed along the circumferential axial direction of the crystal oscillator housing (10). The twelve fluid channels (6) are connected by through channels that are staggered on the front and back sides of the crystal oscillator housing (10) to form a reciprocating fluid channel. The first and last numbered channels are respectively connected to the fluid inlet (14) and fluid outlet (15) provided on the radial side of the crystal oscillator housing (10). The fluid inlet (14) and fluid outlet (15) are both designed with threaded mounting holes for fluid connectors for installing the plug of the fluid connector (4).

4. The fluid-self-contained isothermal crystal lock-in power amplifier according to claim 3, characterized in that: The cover plate assembly (13) includes multiple identical cover plates A (131) and multiple identical cover plates B (132) disposed on the back; both cover plates A (131) and cover plates B (132) have semi-circular grooves (133) machined inside; when the cover plate assembly (13) is fitted with the crystal oscillator housing (10), the cross-section of the through channel is formed by combining the semi-circular cross-sections of the cover plate assembly (13) and the crystal oscillator housing (10) into a full circular cross-section.

5. A fluid-driven, temperature-controlled crystal lock-in power amplifier according to claim 4, characterized in that: The mounting base (3) is provided with a crystal oscillator mounting cavity (31) and a phase-locked power amplifier module mounting position (32). The bottom inner side of the crystal oscillator mounting cavity (31) is provided with a plurality of crystal oscillator mounting holes (33), and the phase-locked power amplifier module mounting position (32) is provided with screw holes (34).

6. A fluid-powered, self-contained, temperature-controlled crystal lock-in power amplifier according to claim 5, characterized in that: The crystal oscillator housing (10) has a circular stepped groove (101) in the central area of ​​the front side, and a boss (102) is provided in the circular stepped groove (101). The boss (102) has a threaded mounting hole (103). The crystal oscillator printed circuit board (11) is fixedly installed through the mounting hole on it corresponding to the threaded mounting hole (103) on the boss (102). The side of the crystal oscillator housing (10) has an RF cable outlet hole (104).

7. A fluid-driven, temperature-controlled crystal lock-in power amplifier according to claim 6, characterized in that: The phase-locked power amplifier module (2) includes a power amplifier housing (21), a phase-locked circuit board (22), a power amplifier circuit (23), and a channel cover plate (24) disposed in the power amplifier housing (21); the back of the power amplifier housing (21) is provided with two independent circulation channels, an inlet channel (25) and an outlet channel (26), which are sealed by the channel cover plate (24); the inlet channel (25) and the outlet channel (26) are respectively provided with fluid connectors (4) on both sides of the power amplifier housing (21).

8. A fluid-driven, temperature-controlled crystal lock-in power amplifier according to claim 7, characterized in that: The power amplifier housing (21) has a power amplifier cavity (211) milled on the front side for mounting the phase-locked circuit board (22) and the power amplifier circuit (23). The inner end face of the power amplifier housing (21) is designed with a wire hole (212) for passing through and soldering the radio frequency cable (7) led out from the temperature-controlled crystal oscillator module (1) to the phase-locked circuit board (22).

Images