Highly reliable and highly integrated optoelectronic fusion load device

Abstract

This invention discloses a highly reliable and integrated optoelectronic fusion payload device, belonging to the field of satellite communication technology. The device includes an optical amplification module, a coherent optical processing module, a routing and switching module, a main control module, an optical drive module, an interface processing module, and a power management module. The optical amplification module includes a high-power amplifier (EYDFA) and a low-noise amplifier (EDFA) for amplifying fiber optic signals in inter-satellite laser communication terminals. The coherent optical processing module is used to convert 100G signals from the client side to high-order modulation and coherent demodulation from the line side, and performs FEC encoding and decoding. The routing and switching module is used to achieve high-capacity data exchange between satellites and ground stations. The main control module manages the power on / off, remote control, telemetry, and health management of each module. This invention adopts an integrated optoelectronic common substrate architecture, achieving deep optoelectronic fusion, and has the advantages of high integration, small size, low power consumption, and high reliability, making it suitable for low-Earth orbit internet and inter-satellite laser communication fields.

Description

Technical Field

[0001] This invention relates to the field of satellite communication technology, specifically to a highly reliable and integrated optoelectronic fusion payload device for low-Earth orbit internet, inter-satellite laser communication, and on-board real-time information processing. Background Technology

[0002] With the rapid development of next-generation information technologies such as 6G, cloud computing, and artificial intelligence, traditional satellite communication network architectures are facing increasingly severe bottlenecks. Laser communication has significant advantages such as ultra-high bandwidth, high security, and low power consumption, which can effectively overcome the transmission bottleneck caused by the explosive growth of onboard data. However, existing onboard communication payloads still have the following shortcomings: 1. Low system integration. Traditional payloads adopt a discrete architecture design, with optical modules, electrical processing modules, routing and switching modules, etc., packaged independently. This results in a large overall size, power consumption, and weight, making it difficult to meet the urgent needs of low-Earth orbit satellite constellations for lightweight and low-cost launch.

[0003] 2. Bottlenecks exist in optoelectronic interconnection. High-speed data interconnection between optoelectronic devices requires multiple levels of signal conversion, resulting in long signal transmission paths and significant conversion losses. This places enormous pressure on the satellite platform and limits the improvement of overall system performance.

[0004] 3. Insufficient on-orbit reliability. The discrete architecture has limited resistance to space radiation, insufficient redundancy in links and interfaces, a large number of external connectors, a high risk of contact failure, a high probability of single-point failure, and poor on-orbit reliability. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of existing technologies and provide a highly reliable and integrated optoelectronic fusion payload device. This device adopts an integrated optoelectronic common substrate architecture, unifying the laser transceiver front-end, high-speed optoelectronic conversion unit, onboard hardened switching module, and multi-domain redundant control circuitry into a single package. It also incorporates multi-level redundancy design, radiation hardening, and fault self-healing control mechanisms, aiming to effectively improve the payload's on-orbit reliability while significantly reducing the overall satellite size, power consumption, and weight, thereby lowering the overall satellite development and launch costs.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A highly reliable and highly integrated optoelectronic fusion payload device includes an optical amplification module, a coherent light processing module, a routing and switching module, a main control module, and an optical driving module; The optical amplification module is used to amplify the fiber optic signal of the inter-satellite laser communication terminal, and it includes a high-power amplifier EYDFA and a low-noise amplifier EDFA. The coherent optical processing module is used to convert between the 100G signal on the client side and the high-order modulation signal on the line side, and to perform FEC encoding and decoding. The routing and switching module is used to exchange large amounts of data between satellites and between satellites and ground according to routing protocols. The main control module is used to manage the working mode, power on / off control, remote control and telemetry, and health management of each module; The optical drive module is used to drive and control the optical wires.

[0007] Furthermore, it also includes an interface processing module and a power management module; The interface processing module is used to convert external interfaces; The power management module is used to perform power conversion and supply power to all modules of the machine.

[0008] Furthermore, the routing and switching module includes a switching chip, an SPI FPGA, a CPU, and an SSD; The switching chip connects high-speed data and low-speed control data between satellite and ground, and performs data exchange according to the routing table entries issued. It adopts a standard Ethernet data interface. The firmware program of the SPI FPGA storage switching chip is used for initialization and startup; The CPU deploys a routing protocol stack to implement routing algorithms and exchanges configuration tables with the switching chip through the PCIe interface. The SSD serves as external storage for the CPU, used to store important data and log information.

[0009] Furthermore, the interface processing module includes a 100Gbps electrical interface, a first PHY chip, a gigabit Ethernet port, a second PHY chip, a 10 Gigabit Ethernet port, a 10G optical module, a 10G optical interface, and a 1G electrical interface. The 100Gbps electrical interface is used for high-speed data transmission with other payloads; The first PHY chip uses a 1000M / 100M / 10M adaptive PHY driver chip and works with a gigabit network port (6-3) to transmit low-speed control information; The second PHY chip uses a 10 Gigabit high-speed PHY driver chip and works with a 10 Gigabit Ethernet port to transmit high-speed service information. The 10G optical module is used to realize photoelectric conversion and works with the 10G optical interface to transmit high-speed service information; The 1G electrical interface is used for control data transmission with other payloads.

[0010] Furthermore, the optical amplification module, coherent light processing module, routing and switching module, main control module, optical drive module, interface processing module, and power management module adopt an integrated layout of optoelectronic common substrate to achieve direct optoelectronic coupling.

[0011] Furthermore, the coherent optical processing module converts the client-side 100G electrical signal into a line-side high-order modulated optical signal, demodulates the received line-side coherent optical signal into a client-side 100G electrical signal, and performs FEC encoding and decoding simultaneously.

[0012] Furthermore, the main control module controls the power-on and power-off sequence of each module according to a preset working mode or remote control command, and collects the telemetry parameters of each module to perform fault detection and health status management.

[0013] Furthermore, the optical drive module receives control commands from the main control module and drives the actuators in the optical wires to complete optical path switching or attenuation adjustment.

[0014] Furthermore, the switching chip simultaneously processes high-speed service data and low-speed control data, and realizes data exchange between different ports through routing table entries issued by the CPU.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. This invention adopts a highly integrated optoelectronic architecture, which integrates the optical amplification module, coherent light processing module, routing and switching module, main control module, optical drive module, interface processing module and power management module into a single layout, which greatly reduces the size and weight of the payload, improves power efficiency, and effectively reduces the overall power consumption pressure of the satellite.

[0016] 2. This invention employs optoelectronic deep fusion technology to achieve direct optoelectronic coupling, shorten the signal transmission path, reduce multi-level optoelectronic signal conversion losses, and effectively solve the bandwidth bottleneck and reliability problems of traditional load interconnection.

[0017] 3. This invention simplifies the traditional discrete architecture, reduces the number of external connectors, lowers the risk of contact failure, integrates redundant design and fault self-healing logic, significantly reduces the probability of single-point failure, and significantly improves on-orbit reliability. Attached Figure Description

[0018] Figure 1 This is a block diagram illustrating the electrical principle of an embodiment of the present invention.

[0019] Figure 2 This is a block diagram of the electrical principle of the routing and switching module of the present invention.

[0020] Figure 3 This is a block diagram of the electrical principle of the interface processing module of the present invention. Detailed Implementation

[0021] Reference Figure 1This embodiment provides a highly reliable and highly integrated optoelectronic fusion payload device, including an optical amplification module 1, a coherent light processing module 2, a routing and switching module 3, a main control module 4, an optical driving module 5, an interface processing module 6, and a power management module 7. Figure 1 This is an electrical schematic diagram of an embodiment of a highly reliable and highly integrated optoelectronic fusion load device according to the present invention.

[0022] In this embodiment, each module adopts an integrated layout of optoelectronic common substrate, and direct optoelectronic coupling is achieved through deep optoelectronic fusion to shorten the signal transmission path and reduce multi-level signal conversion loss.

[0023] Optical amplification module 1 is mainly used to amplify the fiber optic signal of the inter-satellite laser communication terminal. Optical amplification module 1 consists of two parts: a high-power amplifier EYDFA and a low-noise amplifier EDFA.

[0024] EYDFA (Erbium-Ytterbium Co-doped Fiber Amplifier) ​​is used to amplify transmitted optical signals at high power to meet the transmission power requirements of long-distance inter-satellite laser communication. EDFA (Erbium-doped Fiber Amplifier) ​​is used to amplify received weak optical signals with low noise to improve receiver sensitivity.

[0025] The optical amplification module 1 uses an optical fiber input / output interface and is connected to the coherent light processing module 2 via a polarization-maintaining optical fiber.

[0026] The coherent optical processing module 2 realizes the conversion between the 100G signal on the customer side and the high-order modulation and coherent demodulation on the line side, and performs functions such as FEC (forward error correction) encoding and decoding.

[0027] In the transmission direction, the coherent optical processing module 2 performs FEC encoding on the 100G electrical signal input from the client side, then performs high-order modulation, and converts it into a line-side high-order modulated coherent optical signal for output to the optical amplification module 1.

[0028] In the receiving direction, the coherent optical processing module 2 coherently demodulates the amplified optical signal output by the optical amplification module 1 to recover the baseband electrical signal, and outputs the 100G electrical signal on the client side after FEC decoding.

[0029] Reference Figure 2 The routing and switching module 3 includes a switching chip 3-1, an SPI FPGA 3-2, a CPU 3-3, and an SSD 3-4.

[0030] Switching chip 3-1 primarily connects high-speed data and low-speed control data between satellite and ground stations, and performs data exchange based on the routing table entries. The switching chip uses a standard Ethernet data interface.

[0031] The SPI FPGA 3-2 stores the firmware program for the switching chip 3-1, which is used for the initialization and startup of the switching chip. When the device is powered on, the stored firmware program is loaded into the switching chip 3-1 via the SPI interface, and then the initialization of the switching chip 3-1 is completed.

[0032] CPU 3-3 primarily deploys the routing protocol stack to implement routing algorithms, and performs table exchange with switching chip 3-1 through the PCIe interface. CPU 3-3 runs the routing protocol, dynamically calculates routing table entries based on the network topology, and distributes the routing table entries to switching chip 3-1 through the PCIe interface.

[0033] SSD 3-4 is primarily used as external storage for CPU 3-3 to store important data and log information, including routing table backups, configuration parameters, and operation logs, for on-orbit troubleshooting.

[0034] SSD 3-4 primarily stores routing table information and important parameters generated during CPU 3-3 operation for information synchronization between the primary and backup systems. It also stores log information generated by CPU 3-3, which is transmitted to the ground via the satellite-to-ground link for on-orbit fault diagnosis.

[0035] The main control module 4 primarily manages the power on / off control, remote control and telemetry, and health management of each module according to its operating mode. The main control module 4 connects to each module via an internal bus, collecting real-time telemetry parameters such as the operating status, temperature, voltage, and current of each module.

[0036] The main control module 4 controls the power-on and power-off sequence of each module according to the preset working mode or ground remote control commands. When an abnormality is detected, the main control module 4 can perform operations such as fault isolation, module reset, or switching to redundant channels.

[0037] The optical drive module 5 primarily controls the optical cable's movement. It receives control commands from the main control module 4 and drives the actuators (such as optical switches and attenuators) in the optical cable to perform optical path switching or optical power adjustment. Simultaneously, the optical drive module 5 collects status feedback signals from the actuators and reports them to the main control module 4.

[0038] Reference Figure 3 The interface processing module 6 includes a 100Gbps electrical interface 6-1, a first PHY chip 6-2, a gigabit Ethernet port 6-3, a second PHY chip 6-4, a 10 Gigabit Ethernet port 6-5, a 10G optical module 6-6, a 10G optical interface 6-7, and a 1G electrical interface 6-8.

[0039] The 100Gbps electrical interface 6-1 is primarily used for high-speed data transmission with other payloads and is implemented using a high-speed electrical connector. Electrical interfaces can save space, power consumption, and weight; however, transmission distance limitations must be considered during design.

[0040] The first PHY chip 6-2 uses 1000M, 100M, and 10M adaptive PHY driver chips, and together with the gigabit network port 6-3, it interfaces with other payloads, mainly for transmitting low-speed control information.

[0041] The second PHY chip 6-4 uses a 10 Gigabit high-speed PHY driver chip, which, together with the 10 Gigabit Ethernet port 6-5, connects to other payloads and is mainly used to transmit high-speed service information.

[0042] The 10G optical module 6-6 mainly performs photoelectric conversion and, together with the 10G optical interface 6-7, interfaces with other payloads. It is mainly used to transmit high-speed service information, and the transmission distance is unlimited.

[0043] The 1G electrical interface 6-8 is mainly used for control data transmission with other payloads.

[0044] The power management module 7 performs power conversion and supplies power to all modules of the whole machine. The power management module 7 converts the external primary power supply (such as the 28V or 100V DC bus voltage provided by the satellite platform) into multiple DC voltages, providing the required operating voltages (such as 3.3V, 5V, 12V, etc.) for the optical amplification module 1, coherent optical processing module 2, routing and switching module 3, main control module 4, optical drive module 5 and interface processing module 6 respectively.

[0045] The power management module 7 has built-in overvoltage protection, overcurrent protection, and undervoltage protection circuits to ensure safe and reliable power supply to each module. Each power supply channel supports independent switching control of the main control module 4.

[0046] The overall implementation process of the highly reliable and highly integrated optoelectronic fusion payload device of the present invention is as follows: (a) Data transmission process After being switched by the routing and switching module 3, the service data enters the coherent optical processing module 2 for high-order modulation, FEC encoding, and electro-optical conversion. The optical signal then enters the EYDFA power amplifier in the optical amplification module 1 for optical amplification. The amplified optical signal is then transmitted to the inter-satellite laser link through the optical head.

[0047] (II) Data Reception Process The optical signal received by the laser inter-satellite link first passes through the EDFA low-noise amplifier in the optical amplification module 1, and then enters the coherent optical processing module 2 for photoelectric conversion, high-order demodulation, and FEC decoding to restore the original service data, which then enters the routing and switching module 3 for routing and switching processing.

[0048] (III) Data Exchange Process Inter-satellite laser data and satellite-to-ground link data are uniformly fed into the switching chip 3-1 of the routing switching module 3. Inter-satellite laser data that has passed through the coherent optical processing module 2 is connected to the switching chip 3-1 of the routing switching module 3 through the internal SerDes high-speed interface. Other data, including satellite-to-ground data, are connected to the switching chip 3-1 of the routing switching module 3 through the interface processing module 6. The CPU 3-3 of the routing switching module 3 runs the routing protocol and is configured to the switching chip 3-1 through the internal PCIE interface. The switching chip 3-1 completes the data exchange according to the issued routing table.

[0049] (iv) Operation and Management Process During device operation, the main control module 4 continuously collects telemetry data from each module and performs health status assessments. The optical drive module 5, according to instructions from the main control module 4, drives and controls the actuators in the optical cables in real time to complete optical path switching or optical power adjustment. The power management module 7 provides a stable power supply to all modules of the device.

[0050] The timing control and data flow scheduling of the above processes are all coordinated and managed by the main control module 4.

[0051] This embodiment employs a highly integrated optoelectronic architecture, integrating the optical amplification module 1, coherent light processing module 2, routing and switching module 3, main control module 4, optical drive module 5, interface processing module 6, and power management module 7 into a single unit, significantly reducing the payload's size and weight. Deep optoelectronic fusion enables direct optoelectronic coupling, reducing multi-stage optoelectronic signal conversion losses. Simultaneously, it simplifies the traditional discrete architecture, reduces the number of external connectors, and integrates redundant design and fault self-healing logic internally, effectively reducing the probability of single-point failures and improving on-orbit operational reliability.

[0052] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural modifications made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A highly reliable and highly integrated optoelectronic fusion payload device, comprising an optical amplification module (1), a coherent light processing module (2), a routing and switching module (3), a main control module (4), and an optical driving module (5); The optical amplification module (1) is used to amplify the fiber optic signal of the inter-satellite laser communication terminal, and it includes a high-power amplifier EYDFA and a low-noise amplifier EDFA. The coherent optical processing module (2) is used to realize the conversion between the 100G signal on the customer side and the high-order modulation signal on the line side, and to perform FEC encoding and decoding; The routing and switching module (3) is used to exchange large amounts of data between satellites and between satellites and ground according to the routing protocol; The main control module (4) is used to manage the working mode, power on / off control, remote control and telemetry and health management of each module; The optical drive module (5) is used to drive and control the optical wires.

2. The highly reliable and highly integrated optoelectronic fusion payload device according to claim 1, characterized in that, It also includes an interface processing module (6) and a power management module (7); The interface processing module (6) is used to convert external interfaces; The power management module (7) is used to perform power conversion and supply power to all modules of the machine.

3. The highly reliable and highly integrated optoelectronic fusion payload device according to claim 1, characterized in that, The routing and switching module (3) includes a switching chip (3-1), an SPI FPGA (3-2), a CPU (3-3), and an SSD (3-4). The switching chip (3-1) connects high-speed data between satellite and ground and low-speed control data, and performs data exchange according to the routing table entries issued. It adopts a standard Ethernet data interface. The SPI FPGA (3-2) stores the firmware program of the switching chip (3-1) for initialization and startup; The CPU (3-3) deploys a routing protocol stack to implement routing algorithms and exchanges configuration tables with the switching chip (3-1) through the PCIe interface; The SSD (3-4) serves as external storage for the CPU (3-3) and is used to store important data and log information.

4. The highly reliable and highly integrated optoelectronic fusion payload device according to claim 2, characterized in that: The interface processing module (6) includes a 100Gbps electrical interface (6-1), a first PHY chip (6-2), a gigabit network port (6-3), a second PHY chip (6-4), a 10-gigabit network port (6-5), a 10G optical module (6-6), a 10G optical interface (6-7), and a 1G electrical interface (6-8). The 100Gbps electrical interface (6-1) is used for high-speed data transmission with other payloads; The first PHY chip (6-2) adopts a 1000M / 100M / 10M adaptive PHY driver chip and works with the gigabit network port (6-3) to transmit low-speed control information; The second PHY chip (6-4) is a 10 Gigabit high-speed PHY driver chip, and works with the 10 Gigabit Ethernet port (6-5) to transmit high-speed service information; The 10G optical module (6-6) is used to realize photoelectric conversion and works with the 10G optical interface (6-7) to transmit high-speed service information; The 1G electrical interface (6-8) is used for control data transmission with other payloads.

5. The highly reliable and highly integrated optoelectronic fusion payload device according to claim 2, characterized in that: The optical amplification module (1), coherent light processing module (2), routing and switching module (3), main control module (4), optical drive module (5), interface processing module (6) and power management module (7) adopt an integrated layout of optoelectronic common substrate to achieve direct optoelectronic coupling.

6. The highly reliable and highly integrated optoelectronic fusion payload device according to claim 1, characterized in that: The coherent optical processing module (2) converts the 100G electrical signal on the client side into a high-order modulated optical signal on the line side, and demodulates the received coherent optical signal on the line side into a 100G electrical signal on the client side, while performing FEC encoding and decoding.

7. The highly reliable and highly integrated optoelectronic fusion payload device according to claim 1, characterized in that: The main control module (4) controls the power-on and power-off sequence of each module according to the preset working mode or remote control command, and collects the telemetry parameters of each module to perform fault detection and health status management.

8. The highly reliable and highly integrated optoelectronic fusion payload device according to claim 1, characterized in that: The optical drive module (5) receives the control command from the main control module (4) and drives the actuator in the optical wire to complete the optical path switching or attenuation adjustment.

9. The highly reliable and highly integrated optoelectronic fusion payload device according to claim 3, characterized in that: The switching chip (3-1) processes both high-speed service data and low-speed control data simultaneously, and achieves data exchange between different ports through routing table entries issued by the CPU (3-3).

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