Systems, optical modules, methods, and related apparatus

Abstract

The application provides a system, an optical module, a method and related devices, by integrating a liquid cooling component in the optical module, the heat dissipation efficiency of the optical module is improved, and by detecting abnormal conditions of the liquid cooling component in the optical module, the reliability of the liquid cooling component is improved, so that the performance of the optical module is ensured.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, and in particular to a system, optical module, method and related apparatus. Background Technology

[0002] With the rapid development of information technology, optical communication networks are increasingly widely used in data centers, 5G communications, cloud computing, and other fields. Optical modules, as core components of optical communication systems, undertake the crucial functions of photoelectric conversion and signal transmission. In recent years, to meet the demands of high-speed, high-bandwidth communication, the transmission rate of optical modules has been continuously improved. However, with the increase in transmission rate, the power consumption of optical modules has also increased significantly. The increased power of optical modules directly leads to an increase in heat generation. In high-density deployment scenarios, such as data center racks, the concentrated use of a large number of optical modules can cause a significant rise in temperature.

[0003] Excessive temperature not only affects the performance and stability of optical modules, but may also shorten device lifespan and even cause system failures. Therefore, effectively managing the heat generation of optical modules has become a pressing technical challenge in the field of optical communication. Summary of the Invention

[0004] This application provides a system, optical module, method, and related apparatus for improving the heat dissipation efficiency of an optical module by integrating a liquid cooling component in the optical module, and for improving the reliability of the liquid cooling component by detecting abnormal conditions in the liquid cooling component in the optical module, thereby ensuring the performance of the optical module.

[0005] Firstly, this application provides a system, which is a hardware system. The system may include a liquid supply device, a communication device, an optical module, and a processing unit. The optical module includes an optical communication component, a liquid cooling component, and a measurement component. The liquid cooling component includes a liquid inlet structure, a liquid outlet structure, and a cold plate structure, with a flow channel inside the cold plate structure. The communication device is used to transmit electrical signals to the optical communication component. The optical communication component is used to perform electro-optical conversion or photoelectric conversion on the received signals. The liquid supply device is used to provide coolant. The liquid inlet structure is used to guide the coolant into the flow channel. The cold plate structure is used to transfer the heat generated by the optical communication component to the coolant in the flow channel. The liquid outlet structure is used to guide the coolant out of the flow channel. The measurement component is used to output a measurement signal, which indicates the operating parameters of the optical module, including the temperature in the optical module and / or the parameters of the coolant in the liquid cooling component. The processing unit is used to acquire the measurement signal and detect abnormalities in the liquid cooling component based on the measurement signal. In this way, integrating liquid cooling components into the optical module can improve the heat dissipation efficiency of the optical module, and detecting abnormalities in the liquid cooling components can improve their reliability, thereby ensuring the performance of the optical module.

[0006] Optionally, the measurement component includes a plurality of first measuring devices, which are installed inside the optical communication component and / or at an external location adjacent to the optical communication component. The plurality of first measuring devices are respectively used to output a first signal, which indicates the temperature at the location of the corresponding first measuring device. The processing unit is used to determine that the abnormality has been detected based on the temperature abnormality indicated by the first signal output by the plurality of first measuring devices.

[0007] In this way, the processing unit can detect abnormalities in the liquid cooling component based on the signal output by the first measurement component deployed for the optical communication component. This helps to avoid deploying a dedicated detection component for the liquid cooling component in the optical module, thereby reducing the cost of the optical module and saving layout space in the optical module.

[0008] Optionally, the types of abnormal conditions include leakage in the liquid cooling component and / or blockage in the flow channel. This helps to avoid the processing unit determining an abnormality in the liquid supply device (e.g., insufficient flow of coolant into the inlet structure) when the liquid cooling component leaks or the flow channel is blocked, and instructing the liquid supply device to increase the coolant flow rate. When the liquid cooling component is blocked, an increased flow rate into the inlet structure can easily lead to excessive hydraulic pressure in the liquid cooling component, causing leakage. When the flow channel of the liquid cooling component leaks, an increased flow rate into the inlet structure can easily exacerbate the leakage, reducing the reliability of the optical module.

[0009] Optionally, the conditions for the temperature anomaly include that the temperature at the location of a portion of the plurality of first measuring devices is greater than the temperature threshold of the corresponding first measuring device. This facilitates the processing unit in detecting localized temperature anomalies in the liquid cooling assembly based on the acquired signals, thereby detecting any abnormalities in the liquid cooling assembly.

[0010] Optionally, the flow channel includes multiple microchannels for diverting the coolant, and the multiple first measuring devices are located adjacent to two or more of the multiple microchannels; the condition for the temperature anomaly also includes that a portion of the first measuring devices corresponds to a portion of the two or more microchannels. This allows the processing unit to detect blockage or leakage in the microchannels based on the acquired measurement signals, improving detection accuracy.

[0011] Optionally, the conditions for the temperature anomaly include that the difference between the first temperature and the second temperature is less than a first temperature difference threshold or greater than a second temperature difference threshold; wherein, the first temperature is the temperature of the first measuring device located near the liquid inlet structure among the plurality of first measuring devices, and the second temperature is the temperature of the first measuring device located near the liquid outlet structure among the plurality of first measuring devices.

[0012] Optionally, the temperature thresholds of the plurality of first measuring devices are determined based on a first correspondence, which indicates one or more temperature thresholds corresponding to each of the plurality of first measuring devices. This facilitates configuring different temperature thresholds for temperature measuring devices at different locations, improving the accuracy of anomaly detection.

[0013] Optionally, the temperature thresholds of the plurality of first measuring devices are determined based on the power consumption mode of the optical communication component. This allows for the configuration of different temperature thresholds for optical modules under different power consumption modes, thereby improving the accuracy of anomaly detection.

[0014] Optionally, the measuring component includes one or more second measuring devices, which are installed within the liquid inlet structure and / or the liquid outlet structure. Each of the one or more second measuring devices outputs a second signal indicating the flow rate and / or hydraulic pressure of the coolant flowing through the corresponding second measuring device. The processing unit is used to determine that an abnormality has been detected based on the second signal output by the one or more second measuring devices indicating an abnormal flow rate or hydraulic pressure. This helps to shorten the time delay in detecting the abnormality and prevents the optical module from continuing to heat up after an abnormality, which could damage the optical communication components.

[0015] Optionally, the processing unit is further configured to output an alarm message based on the detected anomaly, the alarm message indicating that the liquid cooling component is malfunctioning. This allows maintenance personnel to handle the anomaly promptly, preventing the optical module from continuing to heat up and causing damage to the optical communication component, thus improving the reliability of optical communication.

[0016] Optionally, the alarm information also indicates the type of the abnormal situation. This helps maintenance personnel quickly and accurately locate the type of abnormality in the liquid cooling component, thereby handling the abnormality in a timely manner, preventing the optical module from continuing to heat up after the abnormality and causing damage to the optical communication component, and improving the reliability of optical communication.

[0017] Optionally, the processing unit is deployed in the communication device or in the optical module.

[0018] A second aspect of this application provides a method. This method can be executed by a processing unit. The processing unit can be deployed in a communication device within the system provided in the first aspect or within the optical module. The method includes: acquiring a measurement signal output by a measurement component in the optical module, the optical module including an optical communication component, a liquid cooling component, and a measurement component; the liquid cooling component including a liquid inlet structure, a liquid outlet structure, and a cold plate structure; the cold plate structure having an internal flow channel; the optical communication component performing electro-optical conversion or photoelectric conversion on the received signal; the liquid inlet structure guiding coolant into the flow channel; the cold plate structure transferring heat generated by the optical communication component to the coolant in the flow channel; and the liquid outlet structure guiding the coolant out of the flow channel. The measurement signal indicates operating parameters of the optical module, including the temperature in the optical module and / or the parameters of the coolant in the liquid cooling component; and detecting abnormal conditions of the liquid cooling component based on the measurement signal.

[0019] Optionally, the measurement component includes a plurality of first measuring devices, which are installed inside the optical communication component and / or at an external location adjacent to the optical communication component. The plurality of first measuring devices are respectively used to output a first signal, which indicates the temperature at the location of the corresponding first measuring device. The method further includes: determining that the abnormal situation has been detected based on the first signal output by the plurality of first measuring devices indicating a temperature abnormality.

[0020] Optionally, the types of abnormal conditions include leakage in the liquid cooling assembly and / or blockage in the flow channel.

[0021] Optionally, the conditions for the temperature anomaly include that the temperature at the location of a portion of the plurality of first measuring devices is greater than the temperature threshold of the corresponding first measuring device.

[0022] Optionally, the flow channel includes multiple microchannels for diverting the coolant, and the multiple first measuring devices are located adjacent to two or more of the multiple microchannels; the condition for the temperature anomaly also includes that a portion of the first measuring devices corresponds to a portion of the two or more microchannels.

[0023] Optionally, the conditions for the temperature anomaly include that the difference between the first temperature and the second temperature is less than a first temperature difference threshold or greater than a second temperature difference threshold; wherein, the first temperature is the temperature of the first measuring device located near the liquid inlet structure among the plurality of first measuring devices, and the second temperature is the temperature of the first measuring device located near the liquid outlet structure among the plurality of first measuring devices.

[0024] Optionally, the temperature thresholds of the plurality of first measuring devices are determined based on a first correspondence, wherein the first correspondence indicates one or more temperature thresholds corresponding to the plurality of first measuring devices.

[0025] Optionally, the temperature thresholds of the plurality of first measuring devices are determined based on the power consumption mode of the optical communication component.

[0026] Optionally, the measuring component includes one or more second measuring devices, which are installed within the liquid inlet structure and / or the liquid outlet structure. The one or more second measuring devices are respectively used to output a second signal, which indicates the flow rate and / or hydraulic pressure of the coolant flowing through the corresponding second measuring device. The method further includes: determining that the abnormality has been detected based on the second signal output by the one or more second measuring devices indicating an abnormal flow rate or hydraulic pressure.

[0027] Optionally, the method further includes: based on the detection of the abnormal situation, outputting alarm information, the alarm information indicating that the liquid cooling component is abnormal.

[0028] Optionally, the alarm information may also indicate the type of the abnormal situation.

[0029] A third aspect of this application provides an optical module. The optical module includes a processing unit, an optical communication component, a liquid cooling component, and a measurement component. The liquid cooling component includes a liquid inlet structure, a liquid outlet structure, and a cold plate structure, the cold plate structure having an internal flow channel. The optical communication component is used to perform electro-optical conversion or photoelectric conversion on received signals. The liquid inlet structure guides coolant into the flow channel. The cold plate structure transfers heat generated by the optical communication component to the coolant in the flow channel. The liquid outlet structure guides the coolant out of the flow channel. The measurement component outputs a measurement signal indicating the operating parameters of the optical module, including the temperature in the optical module and / or the parameters of the coolant in the liquid cooling component. The processing unit is used to detect abnormal conditions of the liquid cooling component based on the measurement signal.

[0030] Optionally, the measurement component includes a plurality of first measuring devices, which are installed inside the optical communication component and / or at an external location adjacent to the optical communication component. The plurality of first measuring devices are respectively used to output a first signal, which indicates the temperature at the location of the corresponding first measuring device. The processing unit is further used to determine that the abnormal situation has been detected based on the temperature abnormality indicated by the first signal output by the plurality of first measuring devices.

[0031] Optionally, the types of abnormal conditions include leakage in the liquid cooling assembly and / or blockage in the flow channel.

[0032] Optionally, the conditions for the temperature anomaly include that the temperature at the location of a portion of the plurality of first measuring devices is greater than the temperature threshold of the corresponding first measuring device.

[0033] Optionally, the flow channel includes multiple microchannels for diverting the coolant, and the multiple first measuring devices are located adjacent to two or more of the multiple microchannels; the condition for the temperature anomaly also includes that a portion of the first measuring devices corresponds to a portion of the two or more microchannels.

[0034] Optionally, the conditions for the temperature anomaly include that the difference between the first temperature and the second temperature is less than a first temperature difference threshold or greater than a second temperature difference threshold; wherein, the first temperature is the temperature of the first measuring device located near the liquid inlet structure among the plurality of first measuring devices, and the second temperature is the temperature of the first measuring device located near the liquid outlet structure among the plurality of first measuring devices.

[0035] Optionally, the temperature thresholds of the plurality of first measuring devices are determined based on a first correspondence, wherein the first correspondence indicates one or more temperature thresholds corresponding to the plurality of first measuring devices.

[0036] Optionally, the temperature thresholds of the plurality of first measuring devices are determined based on the power consumption mode of the optical communication component.

[0037] Optionally, the measuring component includes one or more second measuring devices, which are installed within the liquid inlet structure and / or the liquid outlet structure. The one or more second measuring devices are respectively used to output a second signal, which indicates the flow rate and / or hydraulic pressure of the coolant flowing through the corresponding second measuring device. The processing unit is further used to determine that the abnormality has been detected based on the second signal output by the one or more second measuring devices indicating abnormal flow rate or abnormal hydraulic pressure.

[0038] Optionally, the processing unit is further configured to output alarm information based on the detected abnormality, the alarm information indicating that there is an abnormality in the liquid cooling component.

[0039] Optionally, the alarm information may also indicate the type of the abnormal situation.

[0040] Fourthly, this application provides an apparatus. The apparatus may be a processing unit mentioned in the first or second aspect. The apparatus may include a processor configured to execute a computer program or computer instructions stored in memory to perform the method described in any implementation of the second aspect.

[0041] Fifthly, this application provides an apparatus, which can be the processing unit mentioned in the first or second aspect. The apparatus may include a transceiver module and a processing module. The transceiver module is used to acquire measurement signals output by a measurement component in an optical module. The optical module includes an optical communication component, a liquid cooling component, and a measurement component. The liquid cooling component includes a liquid inlet structure, a liquid outlet structure, and a cold plate structure. The cold plate structure has a flow channel inside. The optical communication component is used to perform electro-optical conversion or photoelectric conversion on the received signal. The liquid inlet structure is used to guide coolant into the flow channel. The cold plate structure is used to transfer the heat generated by the optical communication component to the coolant in the flow channel. The liquid outlet structure is used to guide the coolant out of the flow channel. The measurement signal indicates the operating parameters of the optical module, including the temperature in the optical module and / or the parameters of the coolant in the liquid cooling component. The processing module is used to detect abnormal conditions of the liquid cooling component based on the measurement signal.

[0042] Optionally, the measurement component includes a plurality of first measuring devices, which are installed inside the optical communication component and / or at an external location adjacent to the optical communication component. The plurality of first measuring devices are respectively used to output a first signal, which indicates the temperature at the location of the corresponding first measuring device. The processing module is further used to determine that the abnormal situation has been detected based on the temperature abnormality indicated by the first signal output by the plurality of first measuring devices.

[0043] Optionally, the types of abnormal conditions include leakage in the liquid cooling assembly and / or blockage in the flow channel.

[0044] Optionally, the conditions for the temperature anomaly include that the temperature at the location of a portion of the plurality of first measuring devices is greater than the temperature threshold of the corresponding first measuring device.

[0045] Optionally, the flow channel includes multiple microchannels for diverting the coolant, and the multiple first measuring devices are located adjacent to two or more of the multiple microchannels; the condition for the temperature anomaly also includes that a portion of the first measuring devices corresponds to a portion of the two or more microchannels.

[0046] Optionally, the conditions for the temperature anomaly include that the difference between the first temperature and the second temperature is less than a first temperature difference threshold or greater than a second temperature difference threshold; wherein, the first temperature is the temperature of the first measuring device located near the liquid inlet structure among the plurality of first measuring devices, and the second temperature is the temperature of the first measuring device located near the liquid outlet structure among the plurality of first measuring devices.

[0047] Optionally, the temperature thresholds of the plurality of first measuring devices are determined based on a first correspondence, wherein the first correspondence indicates one or more temperature thresholds corresponding to the plurality of first measuring devices.

[0048] Optionally, the temperature thresholds of the plurality of first measuring devices are determined based on the power consumption mode of the optical communication component.

[0049] Optionally, the measuring component includes one or more second measuring devices, which are installed within the liquid inlet structure and / or the liquid outlet structure. The one or more second measuring devices are respectively used to output a second signal, which indicates the flow rate and / or hydraulic pressure of the coolant flowing through the corresponding second measuring device. The processing module is further used to determine that the abnormality has been detected based on the second signal output by the one or more second measuring devices indicating abnormal flow rate or abnormal hydraulic pressure.

[0050] Optionally, the processing module is further configured to output alarm information based on the detected abnormality, the alarm information indicating that there is an abnormality in the liquid cooling component.

[0051] Optionally, the alarm information may also indicate the type of the abnormal situation.

[0052] Sixthly, this application provides a chip or chip system. The chip or chip system can be the processing unit mentioned above. The chip or chip system includes at least one processor for implementing the methods described in the second aspect or any implementation thereof. For example, the chip can be a baseband chip, a modem chip, a system-on-chip (SoC) chip (such as an SoC chip containing a modem core), a system-in-a-package (SIP) chip, or a communication module, etc.

[0053] In one possible design, the chip or chip system may further include a memory for storing program instructions and data necessary for the device. The chip system may consist of chips or may include chips and other discrete devices. Optionally, the chip system may also include interface circuitry that provides program instructions and / or data to the at least one processor.

[0054] In a seventh aspect, this application provides an apparatus. The apparatus can be the processing unit mentioned in the first or second aspect. The apparatus includes at least one logic circuit and an input / output interface, the logic circuit being used to implement the method as described in any implementation of the second aspect.

[0055] Eighthly, this application provides a computer-readable storage medium having a computer program or instructions stored thereon, which, when executed by a processor, cause the method described in any implementation of the second aspect to be performed.

[0056] Ninthly, this application provides a computer program product containing instructions that, when run on a computer, cause the method described in any implementation of the second or first aspect to be executed.

[0057] The technical effects of any of the design methods in aspects two through nine can be found in the technical effects of the corresponding design methods in aspect one above, and will not be repeated here. Attached Figure Description

[0058] Figure 1 The structure of the system provided in this application is illustrated schematically;

[0059] Figure 2 The structure of PCBA 2 is shown schematically;

[0060] Figure 3 A schematic front view of the liquid cooling assembly 1 is shown;

[0061] Figure 4 A partial cross-sectional view of the cold plate structure 130 at the liquid inlet structure 110 is schematically shown;

[0062] Figure 5 A schematic bottom view of the cold plate structure 130 is shown;

[0063] Figure 6 The schematic cross-sectional view of the cold plate structure 130 and PCBA 2 is shown.

[0064] Figure 7 A schematic cross-sectional view of the cold plate structure 130 is shown.

[0065] Figure 8 This schematically shows a top view of the cold plate structure 130 after the cover plate has been removed;

[0066] Figure 9 The cold plate structure 130 is schematically shown in the process of removing... Figure 4 The front view of the structure within the dashed region z1 shown;

[0067] Figure 10 This schematically shows a top view of the cold plate structure 130 after the cover plate has been removed;

[0068] Figure 11 A schematic front view of the liquid cooling assembly 1 is shown;

[0069] Figure 12 This schematically illustrates another structure of PCBA 2;

[0070] Figure 13 A schematic side view of liquid cooling assembly 1 and PCBA 2 is shown.

[0071] Figure 14 The flowchart of the method provided in this application is illustrated schematically;

[0072] Figure 15 and Figure 16 The flowcharts of the methods in the system provided in this application are illustrated schematically.

[0073] Figure 17 A schematic diagram of the structure of the device provided in this application is shown. Detailed Implementation

[0074] Optical modules, as core components of optical communication systems, undertake crucial functions of photoelectric conversion and signal transmission. In recent years, to meet the demands of high-speed, high-bandwidth communication, the transmission rates of optical modules have continuously increased, from the early 1Gbps and 10Gbps to today's 100Gbps, 400Gbps, and even 800Gbps and 1.6Tbps. However, with the increase in transmission rates, the power consumption of optical modules has also increased significantly. This increased power directly leads to increased heat generation. In high-density deployment scenarios, such as data center racks, the concentrated use of a large number of optical modules can cause a significant rise in temperature.

[0075] Optical modules typically rely on air cooling technology for heat dissipation. However, because air cooling depends on air convection, its heat dissipation capacity is significantly affected by ambient temperature, resulting in limited efficiency. As the heat generated by optical modules continues to increase, their temperature rises. Excessively high temperatures not only affect the performance and stability of the optical modules but may also shorten device lifespan and even cause system failures. Therefore, improving the heat dissipation efficiency of optical modules has become a pressing technical challenge in the field of optical communication.

[0076] To address this, this application provides an optical module that improves heat dissipation efficiency by integrating a liquid cooling component. The optical module based on this concept and a system using this optical module are described below.

[0077] Figure 1 The structure of the system provided in this application is illustrated schematically. For example... Figure 1 As shown, the system includes a liquid supply device, a communication device, and an optical module.

[0078] A coolant supply system is used to provide coolant. The supply system may include a reservoir, a circulation power source (e.g., a pump), and piping. The coolant acts as a heat transfer medium, absorbing and carrying away heat generated by the equipment. The reservoir stores the coolant. The circulation power source drives the coolant to circulate within the system, ensuring continuous heat transfer. Piping transports the coolant and connects the various components in the liquid cooling system.

[0079] The communication device is used to send a first electrical signal to the optical communication component 220 and / or receive a second electrical signal from the optical communication component 220. This application does not limit the type of communication device; for example, the communication device may be an optical line terminal (OLT), an optical network unit (ONU), a server, an optical access device, an optical switching device, an optical amplification device, an optical transport network (OTN) transmission device, or a computer device, etc.

[0080] A communication device with an installed optical module can be called an optical communication device. Installing an optical module on a communication device can be understood as the optical module being fixed to the communication device, and the optical module and the communication device having a communication connection. An example of this type of optical module is a co-packaged optics (CPO). Alternatively, the optical module can be pluggably installed on the communication device; an example of this type of optical module is a linear-drive pluggable optics (LPO).

[0081] Continue to refer to Figure 1 The optical module includes an optical port connector (referred to as optical port) 3 and a printed circuit board assembly (PCBA) 2. Figure 2 The structure of PCBA 2 is schematically shown. Figure 2 As shown, PCBA 2 includes a PCB, an optical communication component 220, and an electrical connector (hereinafter referred to as an electrical port) 210, wherein the optical communication component 220 and the electrical port 210 are mounted on the PCB.

[0082] Electrical port 210 is used for electrical connection between optical communication component 220 and communication device. This application does not limit the type of electrical port 210; for example, electrical port 210 includes, but is not limited to, PCB gold fingers, flexible connectors, etc.

[0083] Optical port 3 is used to connect optical communication component 220 and optical fiber. This application does not limit the type of optical port 3. For example, optical port 3 can be a subscriber connector (SC), a multi-fiber push-on / pull-off connector (MPO / MTP), a ferrule connector (FC), or a straighttip connector (ST), etc.

[0084] The optical communication component 220 is used to receive an electrical signal (referred to as a first electrical signal) sent by the communication device through the electrical port 210 connector, convert the first electrical signal into an optical signal (referred to as a first optical signal), and then transmit it through... Figure 1 The optical port shown emits a first optical signal, which can then be transmitted to other optical communication devices via optical fiber.

[0085] Alternatively, the optical communication component 220 is used to receive an optical signal (referred to as the second optical signal) through the optical port, convert the second optical signal into an electrical signal (referred to as the second electrical signal), and then send the second electrical signal to the communication device through the electrical port 210.

[0086] Continue to refer to Figure 2The optical communication component 220 includes an optical transmitting unit 221, an optical receiving unit 222, and an ODSP 223.

[0087] The optical transmitting unit 221 is used to receive electrical signals (such as a first electrical signal) through the electrical port 210 and convert the first electrical signal into an optical signal (e.g., a first optical signal). For example, the optical transmitting unit 221 may include a laser and a digital-to-analog converter (DAC). The DAC is used to convert the first electrical signal in digital form into an analog electrical signal, and the laser is used to convert the analog electrical signal into an optical signal. The laser can be replaced with other types of optical transmitters.

[0088] The optical receiving unit 222 is used to receive optical signals (such as a second optical signal) through optical port 3 and convert the second optical signal into an electrical signal (such as a second electrical signal). For example, the optical receiving unit 222 may include a photodetector and an analog-to-digital converter (ADC). The photodetector is used to receive the second optical signal from optical port 3 and convert the second optical signal into an analog electrical signal. The ADC is used to convert the analog electrical signal into a digital electrical signal.

[0089] The ODSP 223 is used to process a first electrical signal and input the processed first electrical signal into the optical transmitting unit 221, or to process a second electrical signal and output the processed second electrical signal through the electrical port 210. This application does not limit the specific function of the ODSP 223; for example, the ODSP 223 is used to perform at least one processing operation on the first or second electrical signal, such as equalization, compensation, or clock data recovery (CDR). The ODSP 223 can be replaced by other types of signal processing units.

[0090] Figure 2 The optical communication component 220 shown is merely an example. The optical communication component 220 may have fewer functions; for example, it may not include the functions of the optical transmitting unit 221, or the optical receiving unit 222, or the ODSP 223. Alternatively, the optical communication component 220 may also have more functions, such as including a power supply function. Figure 2 Taking the optical communication component 220 as an example implemented by three independent devices, this application does not limit the number of devices corresponding to the optical communication component 220.

[0091] Continue to refer to Figure 1 The optical module also includes a liquid cooling component 1. Figure 3 A schematic front view of liquid cooling assembly 1 is shown. (Reference) Figure 1 or Figure 3 The liquid cooling assembly includes a liquid inlet structure 110, a liquid outlet structure 120, and a cold plate structure 130. (Reference) Figure 1 The liquid inlet structure 110 is connected to the liquid supply device through the liquid inlet pipe, and the liquid outlet structure 120 is connected to the liquid supply device through the liquid outlet pipe.

[0092] In this application, the end face where the optical port 3 is located on the optical module is referred to as the front end face, and the end face where the power port 210 is located on the optical module is referred to as the rear end face. The accompanying drawings of this application show the liquid inlet structure 110 and the liquid outlet structure 120 near the front end face of the optical module as an example. Optionally, the liquid inlet structure 110 and the liquid outlet structure 120 can be near the rear end face of the optical module or other locations on the optical module. The accompanying drawings of this application show the liquid inlet structure 110 and the liquid outlet structure 120 deployed adjacent to each other as an example. Optionally, the liquid inlet structure 110 and the liquid outlet structure 120 can be deployed separately at different locations on the optical module. For example, the liquid inlet structure 110 can be deployed near the front end face of the optical module, and the liquid outlet structure can be deployed near the rear end face of the optical module.

[0093] Figure 4 A schematic partial cross-sectional view of the cold plate structure 130 at the liquid inlet structure 110 is shown. (See diagram below.) Figure 4 As shown, the cold plate structure 130 has internal flow channels for conveying or guiding coolant flow within the cold plate structure 130. The flow channels are connected to the inlet structure 110 and the outlet structure 120, respectively, to form a coolant circuit within the cold plate structure 130. The inlet structure 110 guides coolant into the flow channels. After the inlet structure 110 is connected to a coolant supply device via an inlet pipe, the coolant supplied by the supply device can flow sequentially into the flow channels inside the cold plate through the inlet pipe and the inlet structure 110. This application does not limit the type of the inlet structure 110; for example, the inlet structure 110 can be a quick-connect fitting, a threaded fitting, or a compression fitting, etc.

[0094] The cold plate structure 130 is used to transfer the heat generated by the optical module to the coolant in the flow channel. After the coolant flows into the flow channel through the inlet structure 110, the cold plate structure 130 can exchange heat between the environment and the coolant in the flow channel.

[0095] Figure 5 A schematic bottom view of the cold plate structure 130 is shown. (As shown) Figure 5 As shown, the cold plate structure 130 also includes a boss structure 132, which is used to improve the heat dissipation efficiency of the cold plate structure 130 by optimizing the heat conduction path and surface area.

[0096] Figure 6 The diagram schematically shows cross-sectional views of the cold plate structure 130 and PCBA 2. See also... Figure 6The cold plate structure 130 and PCBA 2 are mounted adjacent to each other in the optical module. More specifically, the boss structure 132 and the optical communication component 220 are mounted adjacent to each other. Therefore, the cold plate structure 130 can be used to transfer the heat generated by the heat-generating devices (such as the optical communication component 220) on PCBA 2 to the coolant in the flow channel, so as to avoid the devices on PCBA 2 from performance degradation or even damage due to overheating.

[0097] Figure 7 A schematic cross-sectional view of the cold plate structure 130 is shown. (See diagram below.) Figure 7 As shown, the outlet structure 120 is used to guide the coolant out of the flow channel. After the coolant flows in the flow channel to the outlet structure 120, it can flow back to the supply device via the outlet structure 120 and the outlet pipe. For example, this application does not limit the type of the outlet structure 120; for example, the outlet structure 120 can be a quick connector, a threaded connector, or a compression fitting, etc.

[0098] Optionally, the cold plate structure 130 has multiple microchannels. Figure 8 This schematically shows a top view of the cold plate structure 130 after the cover plate has been removed. Figure 8 As shown, the cold plate structure 130 may have fin groups 131 and fin groups 132 within the flow channel. Fin group 131 includes two fins, forming three microchannels between the two fins, which are used to distribute coolant into the three microchannels. Fin group 132 includes three fins, forming four microchannels between the three fins, which are used to distribute coolant into the four microchannels.

[0099] Figure 8 Cross-sectional views of the liquid inlet structure 110 and the liquid outlet structure 120 are also schematically shown. For example... Figure 8 As shown, the coolant enters the cavity region c1 (or inlet) through the inlet structure 110. The three microchannels formed by the fin assembly 131 are connected to the cavity region c1. Figure 9 The cold plate structure 130 is schematically shown in the process of removing... Figure 4 The front view of the structure within the dashed region z1 shown. Figure 9 As shown, after the coolant enters cavity region c1, it can flow into cavity region c2. Then, the coolant in cavity region c2 is distributed to three microchannels via fin assembly 131. (Continue to refer to...) Figure 8 The three coolant streams from the three microchannels converge into one stream within cavity c3. The four microchannels formed by fin assembly 132 are connected to cavity region c4. The coolant in cavity c3 is distributed to the four microchannels via fin assembly 132, and the four coolant streams within the four microchannels flow through... Figure 9 It collects in cavity c4 as shown. (Continue to refer to...) Figure 8The coolant in cavity c4 flows into cavity region c5 (or outlet), and the coolant in cavity region c5 flows out of liquid cooling component 1 through outlet structure 120.

[0100] Figure 8 The fin groups 131 and fin groups 132 shown may each include more or fewer fins. Figure 8 Taking the cold plate structure 130 as an example of forming microchannels through fins, this application does not limit the method of forming multiple microchannels in the flow channel, nor does it limit the number of microchannels in the flow channel. Figure 8 Taking the coolant flowing into the flow channel through the inlet structure 110 and undergoing two rounds of diversion and convergence as an example, the coolant may optionally undergo more or fewer rounds of diversion and convergence in the flow channel.

[0101] Continue to refer to Figure 2 PCBA 2 also includes a temperature measurement component 230. The temperature measurement component 230 is used to output a temperature measurement signal, which indicates the temperature in the optical module. That is, the temperature measured by the temperature measurement component 230, or the temperature indicated by the temperature measurement signal, is located (or in the region) within the optical module.

[0102] The location at which the temperature measuring component 230 measures the temperature can be the location of the temperature measuring component 230 itself. The temperature measuring component can also be called a temperature sensor or a thermal sensor. This application does not limit the type of temperature measuring component 230. For example, the temperature measuring component 230 can be a contact temperature sensor, such as a thermocouple or a thermistor, or it can be a non-contact temperature sensor, such as an infrared sensor or a thermal imager. Taking a contact temperature sensor as an example, the location of the temperature measuring component 230 can specifically be the contact point between the temperature measuring component 230 and the object being measured. Taking a non-contact temperature sensor as an example, the location of the temperature measuring component 230 can specifically be the surrounding environmental area of ​​the temperature measuring component 230.

[0103] like Figure 2 As shown, the temperature measurement assembly 230 includes three temperature measuring devices, denoted as S1, S2, and S3. S1 to S3 are used to output temperature measurement signals. This application does not limit the number of temperature measuring devices in the temperature measurement assembly 230; the temperature measurement assembly 230 may include more or fewer temperature measuring devices.

[0104] For ease of description, the temperature measurement signal output by S1 is referred to as first signal 1, the temperature measurement signal output by S2 is referred to as first signal 2, and the temperature measurement signal output by S3 is referred to as first signal 3. First signal 1 can be used to indicate the temperature at the location of S1, first signal 2 is used to indicate the temperature at the location of S2, and first signal 3 is used to indicate the temperature at the location of S3.

[0105] Continue to refer to Figure 2 S1 is located at an external adjacent position to the optical transmitting unit 221 (denoted as position 1). Correspondingly, the first signal 1 can be used to indicate the temperature of the optical transmitting unit 221; more specifically, the first signal 1 is used to indicate the temperature of the optical transmitting unit 221 at position 1 (denoted as T1). S2 is located at an external adjacent position to the optical receiving unit 222 (denoted as position 2). Correspondingly, the first signal 2 can be used to indicate the temperature of the optical receiving unit 222; more specifically, the first signal 2 is used to indicate the temperature of the optical receiving unit 222 at position 2 (denoted as T2). S3 is located at an external adjacent position to the ODSP 223 (denoted as position 3). Correspondingly, the first signal 3 is used to indicate the temperature of the ODSP 223; more specifically, the first signal 3 is used to indicate the temperature of the ODSP 223 at position 3 (denoted as T3). Here, the external adjacent position of the optical communication component 220 refers to the position outside the optical communication component 220 that is adjacent to the optical communication component 220.

[0106] By installing the temperature measuring component 230 in a location adjacent to the outside of the optical communication component 220, it is beneficial to measure the temperature of the optical communication component 220 more accurately through the temperature measuring component 230, thereby helping to avoid overheating of the optical communication component 220.

[0107] Figure 2 Taking the temperature measurement component 230 as an example located on the outside of the optical communication component 220, the temperature measurement component 230 can optionally be integrated inside the optical communication component 220. For example, S1, S2 and S3 are integrated inside the optical transmitting unit 221, the optical receiving unit 222 and the ODSP 223, respectively.

[0108] Continue to refer to Figure 2 PCBA 2 also includes a processing unit 240. The processing unit 240 can be used to acquire the temperature measurement signal output by the temperature measurement component 230. This application does not limit the communication connection method between the processing unit 240 and the temperature measurement component 230. For example, the processing unit 240 can communicate with the temperature measurement component 230 through traces in the PCB. Alternatively, the processing unit 240 and the temperature measurement component 230 each have a wireless communication interface, which is used to send and / or receive wireless signals, and the processing unit 240 and the temperature measurement component 230 can communicate through the wireless communication interface.

[0109] The processing unit 240 can be used to detect abnormalities in the liquid cooling component based on the acquired temperature measurement signal, so as to improve the reliability of the liquid cooling component and ensure the performance of the optical module.

[0110] With the continuous miniaturization of optical modules and the increasing number of internal components, their physical packaging space is facing a severe challenge of compression under the trend of high-density integration. The processing unit 240 can detect abnormalities in the liquid cooling component 1 based on the signal output by the temperature measurement component 230 deployed for the optical communication component 220. This helps avoid the need to deploy a dedicated detection component for the liquid cooling component in the optical module, thereby reducing the cost of the optical module and saving layout space.

[0111] In one possible implementation, the types of abnormal conditions include leakage in the liquid cooling component and / or blockage in the flow channel. This helps prevent the processing unit 240 from determining an abnormality in the liquid supply device (e.g., insufficient flow of coolant into the inlet structure 110) and instructing the supply device to increase the coolant flow rate when the liquid cooling component leaks or the flow channel is blocked. When the liquid cooling component 1 is blocked, an increased flow rate into the inlet structure 110 can easily lead to excessive hydraulic pressure in the liquid cooling component 1, causing leakage. When the flow channel of the liquid cooling component 1 leaks, an increased flow rate into the inlet structure 110 can easily exacerbate the leakage, reducing the reliability of the optical module.

[0112] Since the temperature measurement component 230 includes multiple temperature measuring devices (e.g., S1 to S3), the processing unit 240 can be used to determine that an abnormality has been detected based on the signals output by the multiple temperature measuring devices indicating a temperature anomaly. For example, the processing unit 240 can acquire the first signal 1 output by S1, the first signal 2 output by S2, and the first signal 3 output by S3, and then detect a temperature anomaly based on the first signals 1 to 3. Based on the temperature anomaly detected by the processing unit 240 (or simply temperature anomaly), the processing unit 240 can determine that an abnormality has been detected in the liquid cooling component.

[0113] In one possible implementation, the type of temperature anomaly includes localized temperature anomalies. The conditions satisfied by a localized temperature anomaly may include a first condition, which may include a portion of the temperature measuring devices located at locations where the temperatures are respectively greater than the temperature thresholds of their respective measuring devices.

[0114] The temperature thresholds for S1, S2, and S3 will be denoted as Mth1, Mth2, and Mth3, respectively. When a portion of the temperatures at location 1 indicated by the first signal 1 (T1), location 2 indicated by the first signal 2 (T2), and location 3 indicated by the first signal 3 (T3) exceed the corresponding temperature threshold, the processing unit 240 can determine that a local temperature anomaly has been detected. For example, when T1 is greater than Mth1, T2 is less than Mth2, and T3 is less than Mth3; or when T1 is greater than Mth1, T2 is greater than Mth2, and T3 is less than Mth3, the processing unit 240 can determine that a local temperature anomaly has been detected.

[0115] When T1, T2, and T3 are all greater than their respective temperature thresholds, or when T1, T2, and T3 are all less than their respective temperature thresholds, the processing unit 240 can determine that no local temperature anomaly has been detected. For example, when T1 is less than Mth1, T2 is less than Mth2, and T3 is less than Mth3, or when T1 is greater than Mth1, T2 is greater than Mth2, and T3 is greater than Mth3, the processing unit 240 can determine that no local temperature anomaly has been detected.

[0116] Since the flow channels in the cold plate structure 130 include multiple microchannels, the temperature measuring device in the temperature measuring assembly 230 can be located adjacent to two or more of the multiple microchannels. Optionally, the first condition may also include that the location of the aforementioned portion of the temperature measuring device is adjacent to a portion of the two or more microchannels.

[0117] Figure 10 The schematic diagram shows a top view of the cold plate structure 130 after the cover plate has been removed, and in Figure 10 The projections of the optical communication component 220 and the temperature measurement component 230 in this top view are shown by dashed lines. The microchannels adjacent to the location of the temperature measurement device can be one or more microchannels covered by the projection of the temperature measurement device in the channel. Figure 10 As shown, the temperature measuring device S1 assembled in the optical transmitting unit 221 is adjacent to one of the three microchannels formed by the fin group 131, which is microchannel a. The temperature measuring device S2 assembled in the optical transmitting unit 222 and the temperature measuring device S3 assembled in the ODSP 223 are respectively adjacent to the same microchannel b in the four microchannels formed by the fin group 132. That is, the temperature measuring devices S1 to S3 are located adjacent to two of the seven microchannels.

[0118] The following text refers to temperature measuring devices whose measured temperature exceeds their own temperature threshold as abnormal temperature measuring devices, and all microchannels adjacent to the location of the temperature measuring device in temperature measuring assembly 230 as the complete set of microchannels. When some of the multiple temperature measuring devices are abnormal, if the microchannels adjacent to the location of the abnormal temperature measuring device are a subset of the complete set of microchannels, then processing unit 240 can determine that the first condition is met; if the microchannels adjacent to the location of the abnormal temperature measuring device are the complete set of microchannels, then processing unit 240 can determine that the first condition is not met.

[0119] In this application, temperature measuring devices located near the same microchannel are referred to as the same device group. For example, S1 corresponds to device group 1, and S2 and S3 correspond to device group 2. The processing unit 240 can obtain grouping information, which indicates the number of device groups corresponding to the temperature measuring component 230 and the temperature measuring devices in each device group. Then, based on the grouping information, it determines whether the microchannels near the location of the abnormal temperature measuring device are the entire set of microchannels or a subset of the entire set of microchannels.

[0120] For example, when S1 and S2 are abnormal temperature measuring devices, the processing unit 240 can determine that the temperature measuring component 230 corresponds to device group 1 and device group 2 through the grouping information. Furthermore, the abnormal temperature measuring device includes the temperature measuring devices of each device group. Then, it can determine that the microchannels adjacent to the location of the abnormal temperature measuring device are the complete set of microchannels, and thus determine that the first condition is not met.

[0121] For example, when S2 and S3 are abnormal temperature measuring devices, the processing unit 240 can determine that the temperature measuring component 230 corresponds to device group 1 and device group 2 through the grouping information, and that the abnormal temperature measuring devices only include the temperature measuring devices of device group 2. Then, it can determine that the microchannels adjacent to the location of the abnormal temperature measuring device are a subset of the entire set of microchannels, and thus determine that the first condition is met.

[0122] In one possible implementation, the temperature thresholds of each temperature measuring device are determined based on a first correspondence, which indicates a set of temperature thresholds corresponding to each of the multiple temperature measuring devices. For example, the processing unit 240 can obtain the first correspondence, which indicates that S1 corresponds to temperature threshold set 1, S2 corresponds to temperature threshold set 2, and S3 corresponds to temperature threshold set 3. A single temperature threshold set may include one or more temperature thresholds. Then, the processing unit 240 can determine the temperature thresholds of S1 to S3 respectively based on the first correspondence. This facilitates configuring different temperature thresholds for temperature measuring devices at different locations, improving the accuracy of anomaly detection.

[0123] In one possible implementation, the temperature threshold set for the temperature measuring device includes multiple temperature thresholds. The processing unit 240 can determine the temperature threshold of the temperature measuring device from the temperature threshold set based on the power consumption mode of the optical communication component. Optionally, for two power consumption modes with different heat generation, the temperature threshold corresponding to the power consumption mode with higher heat generation is higher than the temperature threshold corresponding to the power consumption mode with lower heat generation. The processing unit 240 can determine the temperature threshold of the temperature measuring device from the temperature threshold set based on the power consumption mode of the optical communication component using a formula or a second correspondence. The second correspondence can indicate the power consumption mode corresponding to each temperature threshold in the temperature threshold set.

[0124] Optionally, the power consumption mode of the optical communication component can be the power consumption mode of the entire optical module. Correspondingly, the power consumption mode used by the processing unit 240 when determining the temperature threshold of each temperature measuring device is the power consumption mode of the entire optical module. Alternatively, based on the fact that the optical communication component includes multiple separately deployed optical communication devices (e.g., optical transmitting unit 221, optical receiving unit 222, and ODSP 223), the power consumption mode of the optical communication component can be the power consumption mode of the optical communication devices adjacent to the temperature measuring devices. Correspondingly, the power consumption mode used by the processing unit 240 when determining the temperature threshold of different temperature measuring devices can be different.

[0125] Continue to refer to Figure 9 Temperature measurement component 230 in Figure 8 The projection in the top view shown may also include the projections of temperature measuring devices S4 and S5. Correspondingly, the temperature measuring assembly 230 may also include temperature measuring devices S4 and S5. S4 is adjacent to the liquid inlet structure 110, and S5 is adjacent to the liquid inlet structure 120. The temperature measured by S4 is referred to as the first temperature, and the temperature measured by S5 is referred to as the second temperature.

[0126] Optionally, the conditions satisfied by a local temperature anomaly may include a second condition but not the first condition. The second condition may include that the difference between the first temperature and the second temperature is less than a first temperature difference threshold or greater than a second temperature difference threshold. The first temperature difference threshold may be less than the second temperature difference threshold.

[0127] Given the power consumption mode of the optical module and the flow rate of the coolant, when there are no abnormalities in the liquid cooling component 1, the difference between the first temperature and the second temperature is generally within a certain fixed temperature range. The first temperature difference threshold can be equal to or less than the lower limit of the temperature range, and the second temperature difference threshold can be equal to or greater than the upper limit of the temperature range. Given the power consumption mode of the optical module and the flow rate of the coolant, when the difference is less than the first temperature difference threshold, it indicates that the heat absorbed by the coolant flowing through the liquid cooling component 1 is reduced. Accordingly, the processing unit 240 can determine that the area through which the coolant flows in the liquid cooling component 1 is reduced, and thus determine that there is blockage in the flow channel of the liquid cooling component 1. Given the power consumption mode of the optical module and the flow rate of the coolant, when the difference is greater than the second temperature difference threshold, it indicates that the actual flow rate of the coolant flowing through the liquid cooling component 1 is reduced. Accordingly, the processing unit 240 can determine that there is leakage in the liquid cooling component 1.

[0128] Optionally, the conditions for a local temperature anomaly may further include a second condition, meaning the conditions for a local temperature anomaly include both the first and second conditions. Optionally, when the processing unit 240 determines that the first condition or the second condition is met, the processing unit 240 may determine that a local temperature anomaly has been detected. When the processing unit 240 determines that neither the first nor the second condition is met, the processing unit 240 may determine that no local temperature anomaly has been detected.

[0129] Continue to refer to Figure 10 In the optical communication assembly 220, each optical communication device is located adjacent to a section of the microchannel, and in the temperature measurement assembly 230, each temperature measurement device is located downstream of the microchannel section adjacent to the corresponding optical communication device. For example, the optical transmitting unit 221 is located adjacent to a section of the microchannel formed by the fin assembly 131, and S1 is located downstream of this microchannel section. Since the downstream location has a higher temperature, installing the temperature measurement devices downstream of the microchannel section adjacent to the corresponding optical communication device helps to reduce the temperature of the devices from the higher-temperature locations among the multiple external adjacent locations of the optical communication device. This allows the processing unit 240 to more accurately detect temperature anomalies in the optical communication device and prevents damage due to overheating.

[0130] Optionally, the processing unit 240 may acquire other measurement signals besides the temperature measurement signal. For example, the processing unit 240 may acquire a second signal (or fluid measurement signal) indicating the parameters of the coolant in the liquid cooling assembly. The parameters of the coolant include, but are not limited to, one or more parameters including the flow rate and hydraulic pressure of the coolant.

[0131] Correspondingly, the optical module may also include a measurement component (referred to as a fluid measurement component) for outputting fluid measurement signals. Optionally, the fluid measurement component may include one or more fluid measurement devices. A fluid measurement device for measuring hydraulic pressure may be referred to as a hydraulic monitoring device or hydraulic measurement device, and a fluid measurement device for measuring flow rate may be referred to as a flow monitoring device or flow measurement device. The fluid measurement component may include one or more hydraulic measurement devices, or one or more flow measurement devices, or one or more hydraulic measurement devices and one or more flow measurement devices.

[0132] The location of the one or more fluid measuring devices may be located at or near the inlet structure 110, or at or near the outlet structure 120, or a portion of the one or more fluid measuring devices may be located at or near the inlet structure 110, while the remaining fluid measuring devices may be located at or near the outlet structure 120, or the location of the one or more fluid measuring devices may include other locations besides the inlet structure 110 and the outlet structure 120.

[0133] The processing unit 240 can acquire the signal output by the fluid measurement component 610, and based on the signal indicating that the parameters of the coolant are abnormal, determine that an abnormality has been detected in the liquid cooling component 1.

[0134] Figure 11 A schematic front view of the liquid cooling assembly 1 is shown, and, in Figure 11 The front view shown schematically illustrates the perspective view of the liquid inlet structure 110 and the liquid outlet structure 120. (See diagram below.) Figure 11 As shown, the fluid measurement assembly 610 may include two fluid measurement devices, which are respectively installed within the inlet structure 110 and the outlet structure 120. More specifically, the two fluid measurement devices in the fluid measurement assembly 610 are respectively installed within... Figure 8 Or, respectively installed in cavities c1 and c5 as shown. Figure 9 In cavities c2 and c4 shown.

[0135] Taking the signal output by the fluid measuring device as an example to indicate the flow rate of the coolant, the flow rate measured by the fluid measuring device located at or near the inlet structure 110 will be referred to as the first flow rate, and the flow rate measured by the fluid measuring device located at or near the outlet structure 120 will be referred to as the second flow rate. The processing unit 240 can determine the difference between the first flow rate and the second flow rate based on the signal output by the fluid measuring component 610. If the difference is greater than the flow rate difference threshold, it can determine that the coolant parameters are abnormal, and thus determine that there is an abnormality in the liquid cooling component 1. For example, if the first flow rate is greater than the second flow rate, and the difference between the first flow rate and the second flow rate is greater than the flow rate difference threshold, the processing unit 240 can determine that there is a leak in the liquid cooling component 1.

[0136] Taking the signal output by the fluid measuring device as an example to indicate the hydraulic pressure of the coolant, the hydraulic pressure measured by the fluid measuring device located at or near the inlet structure 110 will be referred to as the first hydraulic pressure, and the hydraulic pressure measured by the fluid measuring device located at or near the outlet structure 120 will be referred to as the second hydraulic pressure. The processing unit 240 can determine the first hydraulic pressure and / or the second hydraulic pressure based on the signal output by the fluid measuring component 610. If the first hydraulic pressure and / or the second hydraulic pressure are greater than the hydraulic pressure threshold, it can determine that the coolant parameters are abnormal, and thus determine that there is an abnormality in the liquid cooling component 1. For example, if the first hydraulic pressure and / or the second hydraulic pressure are greater than the hydraulic pressure threshold, the processing unit 240 can determine that there is fluid blockage in the liquid cooling component 1.

[0137] This application does not limit the method by which the processing unit 240 acquires the signal output by the fluid measurement component 610. See also... Figure 11 In one possible implementation, a transceiver 620 and a battery 630 may also be installed in the liquid cooling assembly 1. The battery 630 powers the transceiver 620 and / or the fluid measurement assembly 610. The transceiver 620 is connected to the fluid measurement assembly 610 and is used to receive and transmit signals output by the fluid measurement assembly 610. Optionally, two or more of the transceiver 620, fluid measurement assembly 610, and battery 630 may be integrated together. Optionally, the liquid cooling assembly 1 may not have the battery 630 installed, and the transceiver 620 and fluid measurement assembly 610 may be connected to a power source via power lines in the PCBA. Figure 11 Taking the transceiver 620 and battery 630 installed in the area between the front end of the optical module and the liquid inlet structure 110 and liquid outlet structure 120 as an example, this application does not limit the installation position of the transceiver 620 and battery 630.

[0138] In one possible implementation, transceiver 620 is used to transmit signals wirelessly. Accordingly, see reference... Figure 12 PCBA 2 may also include a wireless transceiver 250, which receives wireless signals transmitted by wireless transceiver 620 and transmits the received signals to processing unit 240. Alternatively, wireless transceiver 250 may be integrated into processing unit 240.

[0139] Alternatively, in one possible implementation, refer to Figure 13 The transceiver 620 is used to connect to the processing unit 240 via conductive lines, and correspondingly, to send signals to the processing unit 240 via a wired connection. For example, the transceiver 620 is connected to the pads of the PCB via conductive lines, and then connected to the processing unit 240 via traces in the PCB.

[0140] Optionally, the processing unit 240 can acquire other types of measurement signals besides temperature measurement signals and fluid measurement signals, which indicate other operating parameters of the optical module besides temperature and coolant parameters, such as the parameters of the optical signals transmitted by the optical module.

[0141] Optionally, the processing unit 240 can acquire various types of measurement signals, such as temperature measurement signals and fluid measurement signals, and then detect abnormalities in the liquid cooling component based on the acquired various types of measurement signals.

[0142] Optionally, the processing unit 240 is used to acquire measurement signals over a certain period of time and detect abnormalities in the liquid cooling assembly based on these measurement signals. This helps to improve the accuracy of the detection results.

[0143] For example, the first signals 1 to 3 mentioned above are temperature measurement signals output by S1 to S3 during the first time period (denoted as t1). The temperature Ti at position i indicated by the first signal i can refer to the statistical result of multiple temperatures indicated by the first signal i within t1, where i is 1, 2, or 3. The statistical result of multiple temperatures can refer to the maximum value, minimum value, average value, or the temperature corresponding to the latest time within t1 among multiple temperatures.

[0144] For example, the processing unit 240 can acquire the fluid measurement signal output by the fluid measurement component 610 within a second time period (denoted as t2), and determine that an abnormality has been detected in the liquid cooling component 1 based on the fluid measurement signal indicating an abnormality in the coolant parameters. For example, the first flow rate and the second flow rate can be statistical results of multiple flow rates measured by the corresponding fluid measurement device within t2. The statistical results of multiple flow rates can refer to the maximum value, minimum value, average value, or the flow rate corresponding to the latest time within t2 among the multiple flow rates. For example, the first hydraulic pressure and the second hydraulic pressure can be statistical results of multiple hydraulic pressures measured by the corresponding fluid measurement device within t2. The statistical results of multiple hydraulic pressures can refer to the maximum value, minimum value, average value, or the hydraulic pressure corresponding to the latest time within t2 among the multiple hydraulic pressures.

[0145] In one possible implementation, the processing unit 240 is further configured to output alarm information based on the detected abnormality, the alarm information indicating an abnormality in the liquid cooling component. Optionally, the processing unit 240 can determine the type of abnormality based on the acquired measurement signal, and then indicate the type of abnormality through the alarm information. For example, the alarm information can indicate liquid blockage in the flow channel of the liquid cooling component 1 or leakage in the liquid cooling component 1. This helps maintenance personnel to quickly and accurately locate the type of abnormality in the liquid cooling component 1, thereby handling the abnormality in a timely manner.

[0146] This application does not limit the method by which the processing unit 240 outputs alarm information. For example, the processing unit 240 can control the optical module to output alarm information, such as by outputting alarm information through the indicator light of the optical module. Alternatively, the processing unit 240 can output alarm information by sending alarm information to other devices. Other devices may include communication devices and / or network management systems, etc. The alarm information can be output to the user via audio or text.

[0147] In one possible implementation, the processing unit 240 is also used to control the optical module to power off based on the detection of an abnormality, so as to protect the optical module.

[0148] Continue to refer to Figure 2 The processing unit 240 may include two devices, which will be referred to as the first processing subunit and the second processing subunit, respectively. The first processing subunit acquires the measurement signals output by the measurement components and processes them to obtain the operating parameters of the optical module. For example, the first processing subunit processes temperature measurement signals to obtain the temperature at the location of the corresponding temperature measuring device, and / or processes fluid measurement signals to obtain the hydraulic pressure and / or flow rate of the coolant at the location of the corresponding fluid measuring device. The second processing subunit stores the operating parameters obtained by the first processing subunit and then detects abnormalities in the liquid cooling components based on the stored operating parameters over a specified period. Optionally, the second processing subunit may also implement corresponding micro-control protection measures for the optical module according to the type of abnormality. These micro-control protection measures include one or more of the following: alarm at the optical module end, power failure protection, and sending alarm information to the remote host. The alarm signal sent by the second processing subunit to the remote host can be a signal transmitted through the electrical connector 210, including but not limited to I2C and differential signals.

[0149] This application does not limit the implementation of the processing unit 240. Figure 2 By way of example only, the function of processing unit 240 can be implemented by a single device or by multiple devices together.

[0150] The above example uses processing unit 240 to detect abnormalities in the liquid cooling assembly. Processing unit 240 can also be used to detect abnormalities in other components of the optical module (e.g., optical communication assembly 220) or in the liquid supply device. For example, processing unit 240 can determine that the optical communication assembly 220 is generating heat abnormally or the liquid supply device is supplying insufficient liquid, based on the signal output by temperature measurement assembly 230 indicating an overall temperature abnormality in the optical module. Optionally, alarm information can indicate an overall temperature abnormality in the optical module, or indicate that the optical communication assembly 220 is generating heat abnormally or the liquid supply device is supplying insufficient liquid. For example, processing unit 240 can indicate that the flow rate of coolant flowing into the liquid cooling assembly 1 is less than a set flow rate, indicating insufficient liquid supply from the liquid supply device, based on the signal output by fluid measurement assembly 610.

[0151] The conditions for an overall temperature anomaly can include the temperature at the location of all temperature measuring devices among multiple temperature measuring devices being greater than the temperature threshold of the corresponding temperature measuring device. Alternatively, the conditions for an overall temperature anomaly can include the temperature at the location of a subset of temperature measuring devices among multiple temperature measuring devices being greater than the temperature threshold of the corresponding temperature measuring device, and the location of this subset of temperature measuring devices being adjacent to the entire set of microchannels described above.

[0152] For example, the processing unit 240 determines the temperature T1 at position 1 of S1, the temperature T2 at position 2 of S2, and the temperature T3 at position 3 of S3 based on the signals output by S1 to S3 in the temperature measurement components 230, and determines the temperature thresholds for S1 to S3 respectively. Assume that the temperature thresholds corresponding to Si include Mthi and Nthi, where i is 1, 2, or 3.

[0153] When i is any value of 1, 2 or 3, Nthi≤Ti≤Mthi holds true, and the processing unit 240 can determine whether the optical module is normal or the liquid cooling component 1 is normal.

[0154] When 1, 2, and 3 are divided into two sets (referred to as set 1 and set 2 respectively), and when i is any value in set 1, Nthi ≤ Ti ≤ Mthi holds true, and when i is any value in set 2, Ti > Mthi holds true, the processing unit 240 can determine that the local point temperature in the optical module is abnormal, and can determine that the liquid cooling component 1 is abnormal or that the microchannel of the liquid cooling component 1 is blocked. Both set 1 and set 2 are not empty sets; for example, set 1 includes 1, and set 2 includes 2 and 3.

[0155] When i is any value of 1, 2 or 3, Ti > Mthi holds true. The processing unit 240 can determine whether the overall temperature of the optical module is abnormal or the temperature of multiple points is abnormal. It can determine whether the overall optical module is abnormal or the liquid supply device is abnormal (e.g., insufficient liquid supply flow or abnormal liquid inlet pipe).

[0156] When i is a value of 1, 2, or 3 or any value, Ti < Nthi holds true. The processing unit 240 can determine that some optical communication devices in the optical module are not working or have malfunctioned, resulting in reduced heat generation and thus lower local or overall temperature of the optical module.

[0157] In addition to the optical communication component 220, liquid cooling component 1, measurement components (e.g., temperature measurement component 230 and / or fluid measurement component 610), and processing unit 240, the optical module may also include other components. For example, continue to refer to Figure 1 The optical module may also include a housing 4 and an unlocking component 5. The housing 4 is used to integrate and seal other components within the optical module. For example, mounting slots are provided on both sides of the housing 4. The unlocking component 5 may include a spring, a pull ring, and a spring. Hooks are provided on both sides of the spring, and the spring is fixed to the pull ring. The spring is placed in the mounting slot, and the hooks on the spring restrict the spring within the mounting slot. Pulling the pull ring towards the front end causes the pull ring to move the spring towards the front end, compressing the spring by the hooks. Releasing the pull ring causes the spring to return to its original position, moving the spring back to its original position.

[0158] The optical module and system including the optical module provided in this application have been described above. The optical module includes a liquid cooling component and supports the detection of abnormal conditions of the liquid cooling component. A method for detecting abnormal conditions of the liquid cooling component is described below, which can be executed by a processing unit. This processing unit is, for example, the processing unit 240 mentioned above. Figure 14 The flow of the method is illustrated schematically, as follows: Figure 14 As shown, the method may include S1401 to S1402.

[0159] S1401. Obtain the measurement signal output by the measurement component 1 in the optical module;

[0160] The processing unit can acquire the measurement signals output by the measurement components in the optical module. This optical module can be understood by referring to the previous section on optical modules. The measurement components may include the signals output by the temperature measurement component 230 and / or the signals output by the fluid measurement component 610 mentioned earlier. The signal output by the temperature measurement component 230 is used to indicate the temperature in the optical module, and the signal output by the fluid measurement component 610 is used to indicate the parameters of the coolant in the liquid cooling component. The signals output by the temperature measurement component 230 and the signals output by the fluid measurement component 610 can be understood by referring to the relevant content above.

[0161] S1402. Detect abnormal conditions of the liquid cooling component based on the acquired measurement signals;

[0162] After acquiring the measurement signal output by the measurement component 1, the processing unit can detect abnormalities in the liquid cooling component 1 based on the acquired measurement signal. For details on how the processing unit detects abnormalities in the liquid cooling component 1 based on the measurement signal, please refer to the relevant content described above.

[0163] For example, the processing unit can determine that an abnormality has been detected based on the signal output by the temperature measurement component 230 indicating a temperature abnormality (such as a local temperature abnormality). For example, the processing unit can determine that an abnormality has been detected in the liquid cooling component 1 based on the signal output by the fluid measurement component 610 indicating an abnormality in the coolant parameters.

[0164] Optionally, after the processing unit detects an abnormality in the liquid cooling component, it may execute S1403, S1404, or both S1403 and S1404.

[0165] S1403. When an abnormal situation is detected, an alarm message is output;

[0166] Optionally, after detecting an abnormality in the liquid cooling component, the processing unit can output an alarm message. The alarm message indicates that an abnormality exists in the liquid cooling component. Optionally, the processing unit can determine the type of abnormality based on the acquired measurement signals, and then indicate the type of abnormality through the alarm message. For example, the alarm message can indicate that the flow channel in liquid cooling component 1 is blocked or that liquid cooling component 1 is leaking. This helps maintenance personnel to quickly and accurately locate the type of abnormality in liquid cooling component 1, thereby handling the abnormality in a timely manner.

[0167] S1404. When an abnormal situation is detected, the optical module is powered off.

[0168] Optionally, after detecting an abnormality in the liquid cooling components, the processing unit can control the optical module to shut down. This helps protect the optical module.

[0169] This application does not specify the order of S1404 and S1403.

[0170] Taking the measurement component 1, which includes a temperature measurement component 230, and the processing unit 240, which includes a first processing subunit and a second processing subunit, as an example, Figure 15 This schematically illustrates the flow of methods within the system. For example... Figure 15 As shown, the method in the system provided in this application may include S1501 to S1505.

[0171] S1501, the temperature measurement component 230 outputs a temperature measurement signal, and correspondingly, the first processing subunit acquires the temperature measurement signal;

[0172] As described above, the temperature measurement signal can be the temperature measurement signal output by the temperature measurement component 230 during the first time period (denoted as t1). For example, the temperature measurement signal can include the first signal 1 to the first signal 3 output by the temperature measurement devices S1 to S3 mentioned above.

[0173] S1502, The first processing subunit processes the temperature measurement signal to obtain temperature information;

[0174] The temperature information can indicate multiple temperatures measured by the temperature measuring component 230 at multiple times within t1. For example, the temperature information indicates multiple temperatures measured by S1 at multiple times within t1, multiple temperatures measured by S2 at multiple times within t1, and multiple temperatures measured by S3 at multiple times within t1.

[0175] S1503: The second processing subunit determines whether there is an abnormal temperature based on the temperature information. If so, S1504 is triggered; otherwise, S1501 is triggered.

[0176] The second processing subunit can determine whether there is an abnormal temperature based on the temperature information obtained by the first processing subunit. For example, when the temperature information indicates multiple temperatures including temperatures greater than a temperature threshold, the second processing subunit can determine that there is an abnormal temperature; when the temperature information indicates multiple temperatures all less than the temperature threshold, the second processing subunit can determine that there is no abnormal temperature.

[0177] For example, when multiple temperatures in S1 include temperatures greater than Mth1, or when multiple temperatures in S2 indicated by the temperature information include temperatures greater than Mth2, or when multiple temperatures in S3 indicated by the temperature information include temperatures greater than Mth3, the second processing subunit can determine that an abnormal temperature exists. When multiple temperatures in S1 are all less than Mth1, and multiple temperatures in S2 indicated by the temperature information are all less than Mth2, and multiple temperatures in S3 indicated by the temperature information are all less than Mth3, the second processing subunit can determine that no abnormal temperature exists.

[0178] If an abnormal temperature is present, the second processing subunit can trigger S1504. If no abnormal temperature is present, the second processing subunit can trigger S1501. For example, the second processing subunit can trigger the first processing subunit to continue acquiring the temperature measurement signal output by the temperature measurement component 230.

[0179] S1504. The second processing subunit determines whether there is a temperature abnormality based on the temperature information. If yes, S1505 is triggered; otherwise, S1501 is triggered.

[0180] When the second processing subunit determines that an abnormal temperature exists based on the temperature information, it can then determine whether a temperature anomaly exists. For example, the second processing subunit can determine the statistical results of multiple temperatures based on the temperature information, and then determine whether a temperature anomaly exists based on the statistical results. As described above, the statistical results of multiple temperatures can include the statistical results of multiple temperatures indicated by the temperature information in S1 (e.g., T1), S2 (e.g., T2), and S3 (e.g., T3).

[0181] As mentioned earlier, temperature anomalies can include localized temperature anomalies and overall temperature anomalies. The method used by the second processing subunit to detect temperature anomalies based on T1 to T3 can be found in the relevant content above and will not be repeated here. After determining the existence of a temperature anomaly based on the temperature information, the second processing subunit can also determine the type of the anomaly. For example, based on the temperature anomaly, it can be determined that the anomaly is due to an anomaly in liquid cooling component 1 or an anomaly in the liquid supply device.

[0182] If a temperature anomaly is detected, the second processing subunit can trigger S1505. If no temperature anomaly is detected, the second processing subunit can trigger S1501. For example, the second processing subunit can trigger the first processing subunit to continue acquiring the temperature measurement signal output by the temperature measurement component 230.

[0183] S1505, The second processing subunit outputs alarm information.

[0184] When the second processing subunit detects a temperature anomaly, it can output an alarm message. For example, the second processing subunit can control the optical module to output an alarm message or send an alarm message to a communication device. As described above, the alarm message can also indicate the type of abnormality. For example, the alarm message can indicate an abnormality in the liquid cooling component 1; optionally, the alarm message can indicate microchannel blockage or leakage in the cold plate structure 130, etc.

[0185] Taking the measurement component 1, which includes a fluid measurement component 610, and the processing unit 240, which includes a first processing subunit and a second processing subunit, as an example, Figure 16 This schematically illustrates the flow of methods within the system. For example... Figure 16 As shown, the method in the system provided in this application may include S1601 to S1606.

[0186] S1601, fluid measurement component 610 outputs fluid measurement signal;

[0187] The fluid measurement component 610 can output fluid measurement signals to the transceiver 620.

[0188] S1602, transceiver 620 sends fluid measurement signals, and correspondingly, the first processing subunit receives fluid measurement signals;

[0189] Optionally, the transceiver 620 is integrated into the fluid measurement component 610, so that the output of the fluid measurement signal by the fluid measurement component 610 can be understood as the fluid measurement component 610 sending a fluid measurement signal.

[0190] As described above, the fluid measurement signal can be the fluid measurement signal output by the fluid measurement component 610 during the second time period (denoted as t2).

[0191] S1603, The first processing subunit processes the fluid measurement signal to obtain fluid information;

[0192] The fluid information can indicate multiple parameters measured by the fluid measurement component 610 at multiple times within t2, and these multiple parameters may include multiple flow rates and / or multiple hydraulic pressures. For example, the fluid information indicates multiple flow rate differences between multiple flow rates measured by the fluid measurement device on the inlet structure 110 side and the fluid measurement device on the outlet structure 120 side within t2.

[0193] S1604. The second processing subunit determines whether there are abnormal parameters based on the fluid information. If yes, it triggers S1605; otherwise, it triggers S1601.

[0194] The second processing subunit can determine whether there are abnormal parameters based on the fluid information obtained by the first processing subunit. For example, when multiple flow rate differences indicated by the fluid information are greater than the flow rate difference threshold, the second processing subunit can determine that there are abnormal parameters; when multiple flow rate differences indicated by the fluid information are all less than the flow rate difference threshold, the second processing subunit can determine that there are no abnormal parameters.

[0195] If abnormal parameters exist, the second processing subunit can trigger S1605. If abnormal parameters do not exist, the second processing subunit can trigger S1601.

[0196] S1605: The second processing subunit determines whether there is an abnormality in the parameters of the coolant based on the fluid. If yes, it triggers S1606; otherwise, it triggers S1601.

[0197] When the second processing subunit determines the presence of abnormal parameters based on fluid information, it can then determine whether there are any abnormalities in coolant parameters. For example, the second processing subunit can determine the statistical results of multiple flow rate differences based on fluid information, and then determine whether there are any temperature anomalies based on these statistical results. The statistical results of the multiple fluid differences refer to the difference between the first flow rate and the second flow rate described earlier.

[0198] The method used by the second processing subunit to detect abnormal coolant parameters based on the difference between the first and second flow rates can be found in the relevant content above, and will not be repeated here.

[0199] If there is an abnormality in the coolant parameters, the second processing subunit can trigger S1606. If there is no abnormality in the coolant parameters, the second processing subunit can trigger S1601.

[0200] S1606, The second processing subunit outputs alarm information.

[0201] When the second processing subunit detects an abnormality in the coolant parameters, it can output an alarm message. For example, the second processing subunit can control the optical module to output an alarm message or send an alarm message to a communication device. As described above, the alarm message can also indicate the type of abnormality. For example, the alarm message can indicate an abnormality in the liquid cooling assembly 1; optionally, the alarm message can indicate microchannel blockage or leakage in the cold plate structure 130, etc.

[0202] Optionally, the optical module may include an optical communication component 220, a liquid cooling component, and a measurement component, but the optical module may not include a processing unit 240. That is, it is used for execution... Figure 14 The processing unit of the method shown can be deployed not in the optical module, but in other devices outside the optical module. For example, the processing unit can be deployed in... Figure 1 In the communication device shown, or, the processing unit 240 may be deployed in Figure 1 In devices other than the communication device and optical module shown.

[0203] This application example uses a liquid cooling component installed in an optical module. This liquid cooling component can be installed in other devices used to connect to the liquid supply device, and the processing unit 240 can detect any abnormalities in the liquid cooling components of these other devices. Optionally, other devices include, but are not limited to, liquid-cooled computers, air conditioning liquid cooling systems, and automotive liquid cooling systems.

[0204] The equipment provided in the fourth aspect of this application has also been described above. Figure 17 A schematic diagram of the device provided in this application. Figure 17 The device 17 shown can be used to perform Figure 14 As shown in the method, device 17 can be the processing unit or processing unit 240 mentioned above, or the processing unit or processing unit 240 mentioned above can be deployed in device 17, and device 17 can have all or part of the functions of the processing unit or processing unit 240 described above. For example... Figure 17As shown, device 17 may include a processor 1701 and a memory 1702. Optionally, device 17 may also include a bus 1703 and a communication interface 1704. The processor 1701, memory 1702, and communication interface 1704 communicate with each other via bus 1703. Device 17 may be a server or a terminal device. It should be understood that this application does not limit the number of processors and memories in device 17.

[0205] The 1703 bus can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of representation, Figure 17 The bus 1703 may be represented by a single line, but this does not mean that there is only one bus or one type of bus. The bus 1703 may include a path for transmitting information between various components of the device 17 (e.g., memory 1702, processor 1701, communication interface 1704).

[0206] Processor 1701 may include any one or more of the following processors: central processing unit (CPU), microprocessor (MP), microcontroller unit (MCU), or digital signal processor (DSP).

[0207] The memory 1702 may include volatile memory, such as random access memory (RAM). The processor 1701 may also include non-volatile memory, such as read-only memory (ROM), flash memory, hard disk drive (HDD), or solid state drive (SSD).

[0208] The memory 1702 stores executable program code, which the processor 1701 executes to implement the functions of the aforementioned processing unit or processing unit 240, thereby implementing the above-described method for detecting abnormalities in the liquid cooling component. That is, the memory 1702 stores code for executing the method provided in this application (e.g., Figure 14 The instructions for the method shown.

[0209] The communication interface 1704 uses transceiver modules such as, but not limited to, network interface cards and transceivers to enable communication between device 17 and other devices (such as transceiver device 620).

[0210] Optionally, the device provided in the fourth aspect of this application may include a processor, which can be understood with reference to the processor 1701 in device 17. The processor can execute executable program code in memory outside the device to implement the functions of the aforementioned processing unit or processing unit 240.

[0211] The apparatus provided in the fifth aspect of this application has also been described above. This apparatus may include a transceiver module and a processing module. The transceiver module is used to perform transceiver operations, and the processing module is used to perform processing operations. For example, the transceiver module is used to perform S1401, and the processing module is used to perform S1402.

[0212] The transceiver module can be implemented through software, hardware, or a combination of both. Similarly, the processing module can be implemented through software, hardware, or a combination of both. For example, the implementation of the processing module will be illustrated below. Likewise, the implementation of the transceiver module can be understood by referring to the implementation of the processing module.

[0213] As an example of a software functional unit, a processing module may include code running on a computing instance. As an example of a hardware functional unit, a processing module may include at least one computing device. Alternatively, a processing module may be implemented using a CPU, an application-specific integrated circuit (ASIC), or a programmable logic device (PLD). The aforementioned PLD may be implemented using a complex programmable logical device (CPLD), a field-programmable gate array (FPGA), a generic array logic (GAL), a data processing unit (DPU), a system-on-chip (SoC), an offload card, an accelerator card, or any combination thereof.

[0214] The preceding text also describes a chip or chip system provided in the sixth aspect of this application, which includes at least one processor for implementing the steps performed by the processing device or processor as described in the preceding example.

[0215] In this application, any processor or chip mentioned herein may be a general-purpose central processing unit, a microprocessor, an MCU, an ASIC, an FPGA, or one or more integrated circuits for controlling the execution of a program that controls the methods provided in any of the above embodiments.

[0216] The memory mentioned above can be read-only memory (ROM) or other types of static storage devices that can store static information and instructions, such as random access memory (RAM).

[0217] The preceding text also describes the apparatus provided in the seventh aspect of this application, which includes at least one logic circuit and an input / output interface, the logic circuit being used to implement the steps performed by the processing device or processor in the preceding examples.

[0218] The preceding text also describes a computer-readable storage medium provided in the eighth aspect of this application, which includes computer instructions that, when executed on a computer, cause the computer to perform the steps performed by the processing device or processor in the preceding examples.

[0219] The preceding text also describes a computer program product including computer instructions provided in the ninth aspect of this application, which, when run on a computer, causes the computer to perform steps as described in the preceding example performed by a processing device or processor.

[0220] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the explanations and beneficial effects of the relevant contents in any of the above-mentioned devices can be referred to the corresponding method embodiments provided above, and will not be repeated here.

[0221] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces, or indirect coupling or communication connection between apparatuses or units, and may be electrical, mechanical, or other forms.

[0222] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0223] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0224] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the essential contribution of the technical solution of this application, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, ROM, RAM, magnetic disks, or optical disks.

[0225] In this application, unless otherwise specified, the same or similar parts between the various embodiments can be referred to each other. In the various embodiments of this application, and the various methods / designs / implementations within each embodiment, unless otherwise specified or logically conflicting, the terminology and / or descriptions between different embodiments and between the various methods / designs / implementations within each embodiment are consistent and can be mutually referenced. The technical features in different embodiments and the various methods / designs / implementations within each embodiment can be combined to form new embodiments, methods, or implementations based on their inherent logical relationships. The following descriptions of the embodiments of this application do not constitute a limitation on the scope of protection of this application.

[0226] In this application embodiment, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, "at least one of A, B, and C" includes A, B, C, AB, AC, BC, or ABC. Furthermore, unless otherwise specified, the ordinal numbers such as "first" and "second" mentioned in this application embodiment are used to distinguish multiple objects and are not used to limit the order, sequence, priority, or importance of multiple objects.

[0227] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A system, characterized in that, The system includes a liquid supply device, a communication device, an optical module, and a processing unit. The optical module includes an optical communication component, a liquid cooling component, and a measurement component. The liquid cooling component includes a liquid inlet structure, a liquid outlet structure, and a cold plate structure. The internal structure of the cold plate structure has a flow channel. The communication device is used to transmit electrical signals with the optical communication component; The optical communication component is used to perform electro-optical conversion or photoelectric conversion on the received signal; The liquid supply device is used to provide coolant; The inlet structure is used to guide the coolant into the flow channel; The cold plate structure is used to transfer the heat generated by the optical communication component to the coolant in the flow channel; The liquid outlet structure is used to guide the coolant out of the flow channel; The measurement component is used to output a measurement signal, which indicates the operating parameters of the optical module, including the temperature in the optical module and / or the parameters of the coolant in the liquid cooling component; The processing unit is used to acquire the measurement signal and detect abnormalities in the liquid cooling assembly based on the measurement signal.

2. The system according to claim 1, characterized in that, The measurement component includes a plurality of first measuring devices, which are installed inside the optical communication component and / or at an external location adjacent to the optical communication component. The plurality of first measuring devices are respectively used to output a first signal, which indicates the temperature at the location of the corresponding first measuring device. The processing unit is used to determine that the abnormal situation has been detected based on the first signal indicating a temperature abnormality output by the plurality of first measuring devices.

3. The system according to claim 2, characterized in that, The conditions for the temperature anomaly include that the temperature at the location of a portion of the plurality of first measuring devices is greater than the temperature threshold of the corresponding first measuring device.

4. The system according to claim 3, characterized in that, The flow channel includes multiple microchannels, which are used to divide the coolant. The multiple first measuring devices are located adjacent to two or more of the multiple microchannels. The conditions for the temperature anomaly also include that the portion of the first measuring device corresponds to a portion of the two or more microchannels.

5. The system according to any one of claims 2-4, characterized in that, The conditions for the temperature anomaly include that the difference between the first temperature and the second temperature is less than a first temperature difference threshold or greater than a second temperature difference threshold. Wherein, the first temperature is the temperature of the first measuring device located near the liquid inlet structure among the plurality of first measuring devices, and the second temperature is the temperature of the first measuring device located near the liquid outlet structure among the plurality of first measuring devices.

6. The system according to any one of claims 3-5, characterized in that, The temperature thresholds of the plurality of first measuring devices are determined based on a first correspondence, wherein the first correspondence indicates one or more temperature thresholds corresponding to the plurality of first measuring devices.

7. The system according to any one of claims 3-6, characterized in that, The temperature thresholds of the plurality of first measuring devices are determined based on the power consumption mode of the optical communication component.

8. The system according to any one of claims 1-7, characterized in that, The measuring component includes one or more second measuring devices, which are installed in the liquid inlet structure and / or the liquid outlet structure. The one or more second measuring devices are respectively used to output a second signal, which indicates the flow rate and / or hydraulic pressure of the coolant flowing through the corresponding second measuring device. The processing unit is used to determine that the abnormality has been detected based on the second signal output by the one or more second measuring devices indicating abnormal flow or abnormal hydraulic pressure.

9. The system according to any one of claims 1-8, characterized in that, The types of abnormal conditions include leakage in the liquid cooling assembly and / or blockage in the flow channel.

10. The system according to any one of claims 1-9, characterized in that, The processing unit is also configured to output alarm information based on the detected abnormality, the alarm information indicating that there is an abnormality in the liquid cooling component.

11. The system according to claim 10, characterized in that, The alarm information also indicates the type of the abnormal situation.

12. The system according to any one of claims 1-11, characterized in that, The processing unit is deployed in the communication device or in the optical module.

13. A method, characterized in that, The method includes: The measurement signal output by the measurement component in the optical module is acquired. The optical module includes an optical communication component, a liquid cooling component, and a measurement component. The liquid cooling component includes a liquid inlet structure, a liquid outlet structure, and a cold plate structure. The cold plate structure has a flow channel inside. The optical communication component is used to perform electro-optical conversion or photoelectric conversion on the received signal. The liquid inlet structure is used to guide the coolant into the flow channel. The cold plate structure is used to transfer the heat generated by the optical communication component to the coolant in the flow channel. The liquid outlet structure is used to guide the coolant out of the flow channel. The measurement signal indicates the operating parameters of the optical module, including the temperature in the optical module and / or the parameters of the coolant in the liquid cooling component. The abnormality of the liquid cooling component is detected based on the measurement signal.

14. The method according to claim 13, characterized in that, The measurement component includes a plurality of first measuring devices, which are installed inside the optical communication component and / or on the outside of the optical communication component. Each of the plurality of first measuring devices is used to output a first signal, which indicates the temperature at the location of the corresponding first measuring device. The detection of abnormalities in the liquid cooling component based on the measurement signals includes: Based on the first signal output by the plurality of first measuring devices indicating a temperature abnormality, it is determined that the abnormal situation has been detected.

15. The method according to claim 14, characterized in that, The conditions for the temperature anomaly include that the temperature at the location of a portion of the plurality of first measuring devices is greater than the temperature threshold of the corresponding first measuring device.

16. The method according to claim 15, characterized in that, The flow channel includes multiple microchannels, which are used to divide the coolant. The multiple first measuring devices are located adjacent to two or more of the multiple microchannels. The conditions for the temperature anomaly also include that the portion of the first measuring device corresponds to a portion of the two or more microchannels.

17. The method according to any one of claims 14-16, characterized in that, The conditions for the temperature anomaly include that the difference between the first temperature and the second temperature is less than a first temperature difference threshold or greater than a second temperature difference threshold. Wherein, the first temperature is the temperature of the first measuring device located near the liquid inlet structure among the plurality of first measuring devices, and the second temperature is the temperature of the first measuring device located near the liquid outlet structure among the plurality of first measuring devices.

18. The method according to any one of claims 13-17, characterized in that, The measuring component includes one or more second measuring devices, which are installed within the liquid inlet structure and / or the liquid outlet structure. Each of the one or more second measuring devices outputs a second signal, indicating the flow rate and / or hydraulic pressure of the coolant flowing through the corresponding second measuring device. Detecting abnormalities in the liquid cooling component based on the measuring signals includes: Based on the second signal output by the one or more second measuring devices indicating abnormal flow or hydraulic pressure, it is determined that the abnormal situation has been detected.

19. The method according to any one of claims 13-18, characterized in that, The types of abnormal conditions include leakage in the liquid cooling assembly and / or blockage in the flow channel.

20. The method according to any one of claims 13-19, characterized in that, The processing unit is also configured to output alarm information based on the detected abnormality, the alarm information indicating that there is an abnormality in the liquid cooling component.

21. An optical module, characterized in that, The optical module includes a processing unit, an optical communication component, a liquid cooling component, and a measurement component. The liquid cooling component includes a liquid inlet structure, a liquid outlet structure, and a cold plate structure. The internal structure of the cold plate structure has a flow channel. The optical communication component is used to perform electro-optical conversion or photoelectric conversion on the received signal; The inlet structure is used to guide the coolant into the flow channel; The cold plate structure is used to transfer the heat generated by the optical communication component to the coolant in the flow channel; The liquid outlet structure is used to guide the coolant out of the flow channel; The measurement component is used to output a measurement signal, which indicates the operating parameters of the optical module, including the temperature in the optical module and / or the parameters of the coolant in the liquid cooling component; The processing unit is used to detect abnormalities in the liquid cooling assembly based on the measurement signal.

22. An apparatus, characterized in that, The device includes: A transceiver module is used to acquire measurement signals output by the measurement component in the optical module. The optical module includes an optical communication component, a liquid cooling component, and the measurement component. The liquid cooling component includes a liquid inlet structure, a liquid outlet structure, and a cold plate structure. The cold plate structure has a flow channel inside. The optical communication component is used to perform electro-optical conversion or photoelectric conversion on the received signal. The liquid inlet structure is used to guide the coolant into the flow channel. The cold plate structure is used to transfer the heat generated by the optical communication component to the coolant in the flow channel. The liquid outlet structure is used to guide the coolant out of the flow channel. The measurement signal indicates the operating parameters of the optical module, including the temperature in the optical module and / or the parameters of the coolant in the liquid cooling component. The processing module is used to detect abnormalities in the liquid cooling component based on the measurement signal.

23. A device, characterized in that, The device includes a processor and a memory, the processor being configured to execute a computer program or computer instructions in the memory to perform the method as described in any one of claims 13-20.

24. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program or computer instructions that, when executed on a computer, cause the method as described in any one of claims 13-20 to be performed.

25. A computer program product, characterized in that, When the computer program product is run on a computer, the method described in any one of claims 13-20 is performed.

Images