A wall-mounted switch structure and method of use

Abstract

The application discloses a wall-mounted switch structure and a use method, and relates to the technical field of network communication equipment.The application comprises a concave part located at the back side of a switch shell, a heat dissipation plate fixed between a PCB and the concave part, the heat dissipation plate comprising a center clamping frame and peripheral heat conduction fins, the center clamping frame being surrounded by clamping frame fins, and the concave part being provided with an outer through hole for connecting the heat conduction fin area and the outside.The back side gap is formed between the PCB and the heat dissipation plate, and the exhaust ring plate embedded with a micro axial flow fan is fixed between the heat dissipation plate and the inner wall of the shell.The center clamping frame is fixed with a damping part with a damping rod at the outside, and the damping rod is connected with a dustproof cover at the end.The passive heat conduction of the heat conduction fins and the active exhaust of the micro axial flow fan are cooperated to avoid the problem of heat accumulation at the back of the wall-mounted switch, and the automatic dustproof of the heat dissipation port is realized, so that the stability and service life of the equipment are improved.

Description

Technical Field

[0001] This invention relates to the field of network communication equipment technology, and in particular to a wall-mounted switch structure and its usage method. Background Technology

[0002] With the rapid development of network communication technology, switches, as core network connection devices, are widely used in homes, businesses, and data centers. Wall-mounted switches, due to their small footprint and easy installation, have become one of the preferred solutions for indoor network deployment. However, existing wall-mounted switches have significant technical shortcomings in their use.

[0003] First, when a wall-mounted switch is installed with its back flush against the wall, a narrow, enclosed space is created between the back of the switch and the wall. Heat generated by the internal PCB board tends to accumulate in this area and cannot dissipate effectively. Traditional passive cooling methods rely solely on the casing for natural heat dissipation, which is inefficient. Prolonged operation at high temperatures accelerates the aging of electronic components, reducing the switch's stability and lifespan.

[0004] Secondly, in order to improve heat dissipation, some wall-mounted switches have ventilation holes on the back. However, these ventilation holes are always open, which can easily allow dust, insects and other pollutants to enter the switch and accumulate on the PCB board and the surface of electronic components. This will not only further affect the heat dissipation effect, but may also cause faults such as short circuits and increase equipment maintenance costs.

[0005] Therefore, there is an urgent need for a wall-mounted switch that can effectively solve the problem of heat accumulation on the back and also has a dustproof function. Summary of the Invention

[0006] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: A wall-mounted switch structure includes: The recessed section is located on the back side of the switch housing. A heat sink is fixed between the PCB board inside the switch and the recessed section. The heat sink includes a central frame and heat-conducting fins around the central frame. The central frame is fixedly connected to the recessed section. The inner circumference of the central frame has outward-facing heat-dissipating fins. The heat-conducting fins are located inside the switch and abut against the inner wall of the switch housing's backplate. The heat-conducting fins absorb heat conducted by the heat sink and dissipate it quickly through airflow over their surface. The recessed section has multiple external through-holes connecting the heat-conducting fin area inside the switch housing to the outside of the switch housing. A back-side gap is located between the PCB board inside the switch and the heat sink, used for heat dissipation in the back-side area of ​​the PCB board. An exhaust ring plate is fixed between the heat sink and the inner wall of the switch housing. Multiple micro-axial flow fans are evenly embedded in the exhaust ring plate, with the airflow output direction of the micro-axial flow fans towards the heat-conducting fins. A damping element is fixed on the outward-facing side of the central frame, with a damping rod at the output end. The dust cover is fixed to the end of the damping rod and keeps the opening of the recessed part closed when the switch is not cooling.

[0007] Preferably, a removable air filter is installed at the bottom of the switch housing.

[0008] Preferably, an opening frame is provided at the center of the recess, and the central card frame is inserted from inside the switch and sealed and fixed to the inner perimeter of the opening frame.

[0009] Preferably, a spacing pad is provided between the PCB board and the heat sink inside the switch to form a back-side gap.

[0010] Preferably, the concave portion has a first inclined surface, and the dust cover has a second inclined surface around its periphery that cooperates with the first inclined surface.

[0011] Preferably, the exhaust ring plate has multiple mounting slots, and the micro axial flow fan is installed at the mounting slot position, with the air inlet of the micro axial flow fan flush with the back side gap in the vertical direction.

[0012] Preferably, an air guide support frame is also fixedly installed inside the switch, and the air guide support frame is located between the exhaust ring plate and the heat conduction fins; wherein, the air guide support frame has an airflow ring cavity and multiple air guide holes, the airflow ring cavity is connected to the airflow output side of the micro axial flow fan, and the multiple air guide holes are connected to the area where the airflow ring cavity and the heat conduction fins are located.

[0013] Preferably, the back side of the switch housing is provided with multiple back hooks, which are distributed around the periphery of the recess.

[0014] A mounting plate adapted to the above-mentioned wall-mounted switch structure, the mounting plate is fixed to the wall by expansion screws, and the mounting plate has a hook groove that matches the back hook of the switch housing.

[0015] A method for using a wall-mounted switch includes the following steps: S1. Wall-mount the switch onto the wall surface. S2. After the switch is powered on, the internal temperature monitoring module activates, collecting real-time temperature information from within the switch. S3. When the collected temperature exceeds a preset threshold, all micro-axial flow fans embedded in the exhaust ring plate are activated. S4. The micro-axial flow fans extract hot air from the back side gap and around the PCB board, directing the hot air to the area where the heat-conducting fins are located. S5. The hot air flows over the surface of the heat-conducting fins, carrying away the heat absorbed by the heat sink, and then enters the space between the concave part and the dust cover through the external through-hole on the concave part, generating a continuous thrust on the dust cover. S6. The dust cover moves outward, overcoming the resistance of the damping element, causing the dust cover to separate from the concave part. The hot air is discharged from the gap between the dust cover and the concave part, while the heat from the frame fins dissipates outward through the gap between the central frame and the dust cover. S7. When the collected temperature drops below the preset threshold, all micro-axial flow fans are turned off. S8. The damping element drives the damping rod to retract inward, causing the dust cover to reseal the opening of the concave part.

[0016] Compared with the prior art, the beneficial effects of the present invention are: This invention achieves a combination of passive heat conduction and active exhaust by incorporating a synergistic heat dissipation system consisting of a heat sink, an exhaust ring plate, and a micro axial fan inside the switch. The heat-conducting fins of the heat sink can quickly absorb the heat conducted from the PCB board to the heat sink, while the micro axial fan forces the hot airflow accumulated on the back side of the PCB board towards the heat-conducting fin area. As the hot airflow flows over the surface of the heat-conducting fins, it carries away the absorbed heat. These two processes work together without conflict, improving the heat dissipation efficiency of the back of the wall-mounted switch, effectively avoiding the aging of electronic components caused by heat accumulation, and enhancing the stability and lifespan of the equipment.

[0017] In addition, when the internal temperature of the switch drops to the normal range, the damping component drives the damping rod to retract, causing the dust cover to automatically close the opening of the concave part, forming a sealed dustproof structure to prevent dust, insects, etc. from entering the switch, reducing the frequency of equipment maintenance and lowering maintenance costs. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the wall-mounted switch of the present invention.

[0019] Figure 2 This is a schematic diagram of the switch dissipating heat externally in this invention.

[0020] Figure 3 for Figure 1 A magnified structural diagram of part A in the middle.

[0021] Figure 4 for Figure 1 A magnified structural diagram of section B in the middle.

[0022] Figure 5 This is a schematic diagram of the switch in this invention when it is not dissipating heat externally.

[0023] Figure 6 This is a schematic diagram of the heat sink structure in this invention.

[0024] Figure 7 This is a schematic diagram of the combined structure of the air guide support frame and the exhaust ring plate in this invention.

[0025] Figure 8 This is a schematic diagram of the separate structure of the air guide support frame and the exhaust ring plate in this invention.

[0026] Figure 9 for Figure 8 A schematic diagram of the other side of the central air guide support frame and exhaust ring plate.

[0027] Wherein: 1-Switch housing; 101-Air filter; 102-Inner recess; 103-Opening frame; 104-Outer through hole; 105-First inclined surface; 106-Back hook; 2-PCB board; 201-Spacing pad; 202-Back side gap; 3-Heat sink; 301-Center frame; 3011-Frame fins; 302-Heat-conducting fins; 4-Air guide support frame; 401-Airflow annular cavity; 402-Air guide through hole; 5-Exhaust ring plate; 501-Embedding groove; 6-Micro axial flow fan; 7-Damping component; 701-Damping rod; 8-Dust cover; 9-Wall; 10-Fixing plate; 1001-Hook groove. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0029] Example 1 This invention designs a wall-mounted switch structure, with the specific structural configuration as follows: like Figure 1 , Figure 2 , Figure 5 , Figure 6As shown, a recessed portion 102 is provided on the back side of the switch housing 1, and an opening frame 103 is provided at the center of the recessed portion 102. A PCB board 2 is disposed inside the switch, and a heat sink 3 is fixedly installed between the PCB board 2 and the recessed portion 102. The heat sink 3 includes a central frame 301 and multiple heat-conducting fins 302 located around the central frame 301. The central frame 301 is inserted into and sealed within the inner perimeter of the opening frame 103 from inside the switch. Multiple outward-facing heat-dissipating frame fins 3011 are provided within the inner perimeter of the central frame 301. The heat-conducting fins 302 are located inside the switch and abut against the inner wall of the back panel of the switch housing 1. The heat-conducting fins 302 are used to absorb heat conducted from the PCB board 2 to the heat sink 3 and quickly dissipate the heat through airflow flowing over their surface. Multiple external through holes 104 are provided in the recessed portion 102, connecting the area of ​​the heat-conducting fins 302 inside the switch housing 1 to the outside of the switch housing 1.

[0030] like Figure 3 , Figure 7 , Figure 8 , Figure 9 As shown, multiple spacer pads 201 are provided between the PCB board 2 and the heat sink 3. The spacer pads 201 are used to form a back-side gap 202 between the PCB board 2 and the heat sink 3. The back-side gap 202 is used for heat dissipation in the back-side area of ​​the PCB board 2. An exhaust ring plate 5 is fixedly installed between the heat sink 3 and the inner wall of the switch housing 1. The exhaust ring plate 5 has multiple mounting slots 501. Each mounting slot 501 is equipped with a micro axial flow fan 6. The airflow output direction of the micro axial flow fan 6 is towards the heat guide fins 302, and the air inlet of the micro axial flow fan 6 is flush with the back-side gap 202 in the vertical direction.

[0031] like Figure 3 , Figure 7 , Figure 8 , Figure 9 As shown, an air guide support frame 4 is fixedly installed between the exhaust ring plate 5 and the heat-conducting fins 302. The air guide support frame 4 has an airflow annular cavity 401 and multiple air guide holes 402. The airflow annular cavity 401 is connected to the airflow output side of all micro axial flow fans 6. The multiple air guide holes 402 are evenly distributed on the side of the air guide support frame 4 facing the heat-conducting fins 302, and connect the airflow annular cavity 401 with the area where the heat-conducting fins 302 are located. The air guide support frame 4 can evenly distribute the hot airflow output by the micro axial flow fans 6 to the surface of each heat-conducting fin 302, improving the uniformity of heat exchange.

[0032] like Figure 2 , Figure 3 , Figure 4 , Figure 5As shown, a damping element 7 is fixedly installed on the outward-facing side of the central frame 301, and a damping rod 701 is provided at the output end of the damping element 7. The damping rod 701 adopts an inward-retracting structure, extending outward when subjected to external tension, and gradually retracting inward after the external force disappears. A dust cover 8 is fixedly connected to the end of the damping rod 701. When the switch is not in heat dissipation mode, the dust cover 8 keeps the opening end of the recessed portion 102 closed. The opening end of the recessed portion 102 is provided with a first inclined surface 105, and a second inclined surface that cooperates with the first inclined surface 105 is provided on the periphery of the dust cover 8 to improve the sealing performance when the dust cover 8 is closed.

[0033] like Figure 1 , Figure 2 As shown, a removable air filter 101 is installed at the bottom of the switch housing 1 to filter the air entering the switch. Multiple back hooks 106 are provided on the back side of the switch housing 1, evenly distributed around the periphery of the recessed portion 102. A mounting plate 10 is fixed to the wall 9 with expansion screws. The mounting plate 10 has hook grooves 1001 that mate with the back hooks 106, enabling wall mounting of the switch.

[0034] Example 2 The difference between this embodiment and Embodiment 1 is that the area of ​​the central frame 301 accounts for 40% to 60% of the total area of ​​the heat sink 3. By reasonably increasing the area ratio of the central frame 301 in the heat sink 3, the central frame 301 can directly absorb and conduct most of the heat of the heat sink 3. The frame fins 3011 around the central frame 301 can directly release this heat to the outside, reducing the heat retention in the heat sink 3. At the same time, this design complements the heat dissipation path of the micro axial fan 6 driving the hot airflow through the heat-conducting fins 302, constructing a dual heat dissipation channel that combines direct central heat dissipation and peripheral convection heat dissipation, further improving the overall heat dissipation efficiency of the switch.

[0035] Example 3 The difference between this embodiment and Embodiment 1 is that the number of damping elements 7 is set to multiple, for example, three. The three damping elements 7 are evenly distributed on the circumferential direction of the outward side of the central frame 301. The output end of each damping element 7 is connected to a damping rod 701, and the ends of the three damping rods 701 are connected to the inner side of the dust cover 8. By setting multiple damping elements 7, the opening and closing of the dust cover 8 is more stable, avoiding unilateral tilting and improving the sealing effect.

[0036] Example 4 The difference between this embodiment and Embodiment 1 is that the surface of the heat-conducting fin 302 is provided with multiple heat dissipation grooves, which extend along the length of the heat-conducting fin 302. By providing heat dissipation grooves on the surface of the heat-conducting fin 302, the contact area between the heat-conducting fin 302 and the hot airflow can be increased, further improving the heat exchange efficiency.

[0037] Example 5 This invention provides a method for using a wall-mounted switch, comprising the following steps: The first step is to fix the fixing plate 10 to the preset installation position on the wall 9 using expansion screws, ensuring that the fixing plate 10 is installed firmly and horizontally.

[0038] The second step is to align the back hook 106 on the back side of the switch housing 1 with the hook groove 1001 on the fixing plate 10, press down on the switch housing 1, so that the back hook 106 is fully inserted into the hook groove 1001, and complete the wall-mounted installation of the switch.

[0039] The third step is to connect the power supply to the switch and start the internal temperature monitoring system. The temperature sensor will then begin collecting the internal temperature data of the switch in real time.

[0040] The fourth step involves the temperature sensor transmitting the collected temperature data to the switch's control unit, which then compares the real-time temperature with a preset temperature threshold.

[0041] Fifth, when the control unit determines that the real-time temperature exceeds the preset threshold, it sends a start command to all micro axial flow fans 6, and the micro axial flow fans 6 start to operate.

[0042] Step 6: The micro axial fan 6 extracts the hot airflow from the back side gap 202 and the area around the PCB board 2, and sends the hot airflow into the airflow annular cavity 401 of the air guide support frame 4.

[0043] In the seventh step, the hot airflow is evenly blown into the area of ​​the heat-conducting fins 302 through multiple air-conducting holes 402 on the air-conducting support frame 4. When the hot airflow flows over the surface of the heat-conducting fins 302, it carries away the heat absorbed by the heat sink 3.

[0044] In the eighth step, after the hot air flows through the heat-conducting fins 302 area, it enters the space between the concave part 102 and the dust cover 8 through the external through hole 104 on the concave part 102, generating a continuous thrust on the dust cover 8.

[0045] In the ninth step, the dust cover 8 drives the damping rod 701 to move outward against the resistance of the damping component 7, so that the dust cover 8 separates from the inner recess 102 and forms a heat dissipation gap.

[0046] In the tenth step, the hot airflow is discharged to the outside of the switch through the heat dissipation gap between the dust cover 8 and the recess 102, while the heat of the card frame fins 3011 is dissipated outward through the gap between the central card frame 301 and the dust cover 8.

[0047] In the eleventh step, when the control unit determines that the real-time temperature has dropped below the preset threshold, it sends a shutdown command to all micro axial flow fans 6, and the micro axial flow fans 6 stop operating.

[0048] In the twelfth step, the damping element 7 drives the damping rod 701 to retract inward, causing the dust cover 8 to move towards the concave portion 102 until the second inclined surface of the dust cover 8 is tightly fitted with the first inclined surface 105 of the concave portion 102, thus resealing the opening end of the concave portion 102.

[0049] Step 13: Periodically disassemble the air filter 101 at the bottom of the switch housing 1, clean or replace it to ensure that the air entering the switch is clean.

[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wall-mounted switch structure, characterized in that, include: The recess (102) is located on the back side of the switch housing (1); The heat sink (3) is fixed between the PCB board (2) and the recess (102) inside the switch. It includes a central frame (301) and heat-conducting fins (302) located around the central frame (301). The central frame (301) is fixedly connected to the recess (102). The central frame (301) is surrounded by frame fins (3011) that dissipate heat outward. The heat-conducting fins (302) are located inside the switch and abut against the inner wall of the back plate of the switch housing (1). The recess (102) has multiple external through holes (104). The external through holes (104) connect the heat-conducting fin (302) area inside the switch housing (1) and the outside of the switch housing (1). The back side gap (202) is located between the PCB board (2) and the heat sink (3) inside the switch and is used for heat dissipation of the back side area of ​​the PCB board (2). An exhaust ring plate (5) is fixed between the heat sink plate (3) and the inner wall of the switch housing (1), and multiple micro axial flow fans (6) are uniformly embedded therein. The airflow output direction of the micro axial flow fans (6) is towards the heat guide fins (302). The damping component (7) is fixed on the outward side of the central frame (301), and the output end is provided with a damping rod (701). The dust cover (8) is fixed to the end of the damping rod (701) and keeps the opening of the recess (102) closed when the switch is not in heat dissipation mode.

2. The wall-mounted switch structure according to claim 1, characterized in that: A removable air filter (101) is installed at the bottom of the switch housing (1).

3. The wall-mounted switch structure according to claim 1, characterized in that: An opening frame (103) is provided at the center of the recess (102), and the central card frame (301) is inserted into the inside of the switch and sealed and fixed to the inner perimeter of the opening frame (103).

4. The wall-mounted switch structure according to claim 1, characterized in that: The PCB board (2) inside the switch and the heat sink (3) are provided with a spacing pad (201) for forming a back side gap (202).

5. The wall-mounted switch structure according to claim 1, characterized in that: The recessed portion (102) has a first inclined surface (105), and the dust cover (8) has a second inclined surface around its periphery that cooperates with the first inclined surface (105).

6. The wall-mounted switch structure according to claim 1, characterized in that: The exhaust ring plate (5) has multiple mounting slots (501), and the micro axial flow fan (6) is installed at the mounting slot (501). The air inlet of the micro axial flow fan (6) is flush with the back side gap (202) in the vertical direction.

7. The wall-mounted switch structure according to claim 1, characterized in that: An air guide support frame (4) is also fixedly installed inside the switch. The air guide support frame (4) is located between the exhaust ring plate (5) and the heat conduction fins (302). The air guide support frame (4) has an airflow annular cavity (401) and multiple air guide holes (402). The airflow annular cavity (401) is connected to the airflow output side of the micro axial flow fan (6), and the multiple air guide holes (402) are connected to the area where the airflow annular cavity (401) and the heat-conducting fins (302) are located.

8. The wall-mounted switch structure according to claim 1, characterized in that: The back side of the switch housing (1) is provided with a plurality of back hooks (106), which are distributed around the concave portion (102).

9. A mounting plate adapted to the wall-mounted switch structure of claim 8, characterized in that, The fixing plate (10) is fixed to the wall (9) by expansion screws. The fixing plate (10) has a hook groove (1001) that matches the back hook (106) of the switch housing (1).

10. A method of using a wall-mounted switch, applied to the wall-mounted switch structure according to any one of claims 1 to 8, characterized in that, Includes the following steps: S1. Wall mount the switch on the surface of the wall (9); S2. After the switch is powered on, the internal temperature monitoring module of the switch starts up and collects the internal temperature information of the switch in real time. S3. When the collected temperature information exceeds the preset threshold, start all the micro axial flow fans (6) embedded in the exhaust ring plate (5); S4. The micro axial flow fan (6) extracts the hot airflow around the back side gap (202) and the PCB board (2), and directs the hot airflow to the area where the heat-conducting fins (302) are located; S5. Hot air flows over the surface of the heat-conducting fins (302), carrying away the heat absorbed by the heat sink (3) by the heat-conducting fins (302), and then enters the space between the concave part (102) and the dust cover (8) through the external through hole (104) on the concave part (102), generating a continuous thrust on the dust cover (8); S6. The dust cover (8) drives the damping rod (701) to overcome the resistance of the damping element (7) and move outward, so that the dust cover (8) separates from the inner recess (102), and the hot airflow is discharged from the gap between the dust cover (8) and the inner recess (102). At the same time, the heat of the frame fin (3011) is dissipated outward through the gap between the central frame (301) and the dust cover (8). S7. When the collected temperature information drops below the preset threshold, all micro axial flow fans are turned off (6); S8. The damping element (7) drives the damping rod (701) to retract inward, so that the dust cover (8) re-seals the opening end of the concave part (102).

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