Heating and temperature sensing integrated device and method of manufacture

Abstract

The application discloses a heating and temperature sensing integrated device and a preparation method thereof. The heating and temperature sensing integrated device belongs to the technical field of flexible electronics and comprises a heating assembly, a sensing assembly and a plurality of insulation layers. The heating assembly comprises a heating functional layer and a heating electrode layer, and the heating electrode layer comprises a plurality of heating electrodes. The sensing assembly is arranged above the heating assembly in a laminated mode and comprises a temperature sensing functional layer and a sensing electrode layer, and the sensing electrode layer comprises a plurality of sensing electrodes. The plurality of heating electrodes and the plurality of sensing electrodes correspond to each other in a one-to-one mode, and each heating electrode or a combination of a plurality of heating electrodes can be associated with at least one sensing electrode to control the heating of a corresponding region and synchronously sense the temperature of the region. By laminating the heating and sensing functions and arranging a one-to-one corresponding electrode array, independent temperature control and global temperature sensing of each region of the device are realized, local overheating can be recognized and local closed-loop adjustment can be performed, and the risk of thermal runaway is reduced.

Description

Technical Field

[0001] This invention relates to the field of flexible electronics technology, and in particular to an integrated heating and temperature sensing device, as well as a method for fabricating such an integrated heating and temperature sensing device. Background Technology

[0002] With the development of flexible electronics technology, flexible devices with heating functions have shown broad application prospects in wearable devices, biomedicine, new energy power batteries, and aerospace. In related technologies, flexible devices with heating functions often adopt a discrete approach, using resistance wires or various heating films for independent heating, while external temperature sensors such as thermistors and thermocouples are placed on the surface of the heating film for point-based temperature monitoring. Data is collected by the temperature sensors and fed back to a temperature controller, which then uses PID control algorithms to dynamically adjust the heating power. However, single-point temperature measurement cannot perceive the overall temperature distribution of the heating film, making it difficult to identify localized overheating; and relying on an external temperature controller for overall control prevents independent temperature control and synchronous feedback for specific heating areas, increasing the risk of thermal runaway if the controller fails. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes an integrated heating and temperature sensing device, which has the advantages of regional independent temperature control and global temperature sensing.

[0004] The present invention also proposes a method for fabricating the above-mentioned integrated heating and temperature sensing device.

[0005] The integrated heating and temperature sensing device according to the present invention includes: A heating assembly includes a heating functional layer and a heating electrode layer, wherein the heating functional layer is electrically connected to the heating electrode layer, and the heating electrode layer includes a plurality of heating electrodes; A sensing component is stacked on the heating component. The sensing component includes a temperature sensing functional layer and a sensing electrode layer. The temperature sensing functional layer is electrically connected to the sensing electrode layer. The sensing electrode layer includes a plurality of sensing electrodes. Multiple insulating layers are disposed between and on the outside of the heating component and the sensing component for electrical isolation; The plurality of heating electrodes correspond one-to-one with the plurality of sensing electrodes. Each heating electrode or a combination of the plurality of heating electrodes can be associated with at least one sensing electrode to control the heating of the corresponding area and simultaneously sense the temperature of the corresponding area.

[0006] The integrated heating and temperature sensing device according to the present invention has at least the following beneficial effects: By using stacked heating and sensing components, and setting multiple one-to-one corresponding heating and sensing electrodes, each heating electrode or combination thereof is responsible for a specific local heating area, while the corresponding sensing electrode senses the temperature change of that area in real time, achieving independent heating and synchronous temperature sensing of different areas of the device. Simultaneously, since each area can independently control its heating power using its corresponding heating electrode and perform local closed-loop adjustment based on the temperature signal fed back from the associated sensing electrode, it no longer relies entirely on an external temperature controller for unified overall control. Therefore, even if the external temperature controller malfunctions, each area can still autonomously adjust its heating state based on its own temperature feedback, reducing the risk of overall thermal runaway, thereby achieving safe and accurate independent temperature control of specific areas and global temperature sensing.

[0007] According to some embodiments of the present invention, the integrated heating and temperature sensing device is wherein both the heating functional layer and the temperature sensing functional layer are made of a material having a positive temperature coefficient effect.

[0008] According to some embodiments of the present invention, the heating and temperature sensing integrated device uses a PTC material with a preset Curie temperature point, which is the same as the target heating temperature. When the temperature of the heating functional layer reaches the Curie temperature point, the resistance of the PTC material increases.

[0009] According to some embodiments of the present invention, the integrated heating and temperature sensing device includes a temperature sensing functional layer comprising a plurality of PTC material segments connected in series, wherein at least two of the PTC material segments have different Curie temperatures.

[0010] According to some embodiments of the present invention, the multiple heating electrodes and multiple sensing electrodes are arranged in an M×N array in the horizontal direction, where M and N are both natural numbers greater than or equal to 2.

[0011] According to some embodiments of the present invention, in the integrated heating and temperature sensing device, each of the heating electrodes at least partially overlaps with at least one of the sensing electrodes in a vertical projection.

[0012] According to some embodiments of the present invention, the heating electrode layer includes a first electrode layer and a second electrode layer, and each sensing electrode layer includes a third electrode layer and a fourth electrode layer. An insulating layer is provided between the first electrode layer and the second electrode layer, and between the third electrode layer and the fourth electrode layer.

[0013] According to the preparation method of the present invention, the method for preparing the integrated heating and temperature sensing device of the present invention includes the following steps: S1. Prepare a heating electrode layer, a sensing electrode layer, and an insulating layer between the heating electrode layer and the sensing electrode layer to form a base layer; S2. Prepare a temperature sensing functional layer and cover the sensing electrode layer with the temperature sensing functional layer to form a sensing component; S3. Place in an oven to dry, and repeat step S2 until the temperature sensing functional layer reaches the target thickness. S4. Prepare a heating functional layer and cover the heating electrode layer with the heating functional layer to form a heating assembly; S5. Place in an oven to dry, and repeat step S4 until the heated functional layer reaches the target thickness to obtain the sensing component. S6. An insulating layer is attached to the outside of the heating functional layer and the temperature sensing functional layer respectively, leaving a position for lead wire soldering, to obtain the integrated heating and temperature sensing device.

[0014] According to the preparation method described in some embodiments of the present invention, the target thickness of the temperature sensing functional layer is A, and the target thickness of the heating functional layer is B, where A ≥ 0.1 mm and B ≥ 0.12 mm.

[0015] According to the preparation method described in some embodiments of the present invention, in steps S2 and S4, one of the following processes is used: screen printing, scraping, thermal transfer, spraying, inkjet printing or electrospinning technology, to coat the temperature sensing functional layer and the heating functional layer onto the sensing electrode layer and the heating electrode layer, respectively.

[0016] The fabrication method described in this invention has at least the following advantages: by integrally molding the heating electrode layer, the sensing electrode layer, and the third insulating layer between them into a multilayer flexible circuit board substrate, and directly printing the temperature sensing functional layer and the heating functional layer on the substrate, the mounting process of independent sensor components and additional wiring harness connections are eliminated. The temperature sensing functional layer and the heating functional layer need to reach the target thickness to ensure that both layers have sufficient mechanical strength and stable PTC response. The fabrication method realizes wafer-level, mass-production integrated manufacturing of heating and sensing functions, reducing the types of materials and assembly steps, and lowering production costs; at the same time, since each functional layer is integrally molded inside the device, the risk of externally mounted sensors falling off due to vibration or thermal cycling is eliminated, improving the long-term stability and safety of the device under harsh conditions such as power batteries and wearable devices.

[0017] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the integrated heating and temperature sensing device according to an embodiment of the present invention; Figure 2 for Figure 1 A top view of the sensing electrode layer is shown. Figure 3 for Figure 1 A top view of the sensing electrodes shown; Figure 4 for Figure 1 A top view of the heating electrode layer is shown. Figure 5 for Figure 1 The top view of the second motor layer is shown; Figure 6 This is a resistance-temperature relationship characterization diagram of the integrated heating and temperature sensing device according to an embodiment of the present invention.

[0019] Explanation of icon numbers: Heating component 100; heating functional layer 110; heating electrode layer 120; heating electrode 121; first electrode layer 122; second electrode layer 123; Sensing component 200; temperature sensing functional layer 210; sensing electrode layer 220; sensing electrode 221; third electrode layer 222; fourth electrode layer 223; via 240; First insulating layer 300; insulating spacer 310; second insulating layer 311; fourth insulating layer 312; third insulating layer 320; fifth insulating layer 340. Detailed Implementation

[0020] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0021] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0022] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0023] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0024] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0025] In related technologies, flexible devices with heating functions often employ a separate design, using resistance wires or various heating films for independent heating, while external temperature sensors such as thermistors and thermocouples are placed on the surface of the heating film for point-based temperature monitoring. Data collected by the temperature sensors is fed back to a temperature controller, which then uses PID control algorithms to dynamically adjust the heating power. However, single-point temperature measurement cannot perceive the overall temperature distribution of the heating film, making it difficult to identify localized overheating; furthermore, relying on an external temperature controller for overall control prevents independent temperature control and synchronous feedback for specific heating areas, increasing the risk of thermal runaway should a failure occur.

[0026] In some embodiments of the present invention, such as Figure 1As shown, the integrated heating and temperature sensing device includes a heating component 100, a sensing component 200, and multiple insulating layers. The device has an overall rectangular structure. The heating component 100 includes a heating functional layer 110 and a heating electrode layer 120, which are electrically connected. The heating electrode layer 120 includes multiple heating electrodes 121 arranged in an array. The sensing component 200 is stacked on top of the heating component 100. The sensing component 200 includes a temperature sensing functional layer 210 and a sensing electrode layer 220, which are electrically connected. The sensing electrode layer 220 includes multiple sensing electrodes 221 arranged in an array. Multiple insulating layers are disposed between the heating component 100 and the sensing component 200, and on the outer side of the entire device, for electrical isolation. Each heating electrode 121 corresponds to one of the multiple sensing electrodes 221. Each heating electrode 121 or a combination of multiple heating electrodes 121 can be associated with at least one sensing electrode 221 to control the heating of the corresponding area and simultaneously sense the temperature of that area. By stacking and integrating the heating component 100 and the sensing component 200 and setting up a one-to-one corresponding electrode array, the device can independently control the heating power of each local area and read the temperature feedback of that area in real time, thereby achieving global temperature distribution monitoring and local closed-loop temperature control without relying on the overall regulation of an external temperature controller.

[0027] In some embodiments of the present invention, specifically, both the heating functional layer 110 and the temperature sensing functional layer 210 are made of materials with a positive temperature coefficient effect. The PTC material used in the heating functional layer 110 has a preset Curie temperature point, which is the same as the target heating temperature. When the temperature of the heating functional layer 110 reaches the Curie temperature point, the resistance of the PTC material increases sharply. Utilizing the positive temperature coefficient characteristic of the PTC material, the heating functional layer 110 automatically reduces the heating power after reaching the set temperature, forming an inherent self-limiting temperature mechanism that prevents overheating without the need for external controller intervention, thus improving the safety of the device.

[0028] In some embodiments of the present invention, such as Figures 2 to 3As shown, the temperature sensing functional layer 210 includes multiple PTC material segments connected in series. At least two of the PTC material segments have different Curie temperatures. For example, PTC material segments with Curie temperatures of 30℃, 35℃, 37℃, 40℃, and 42℃ can be connected in series to form the temperature sensing functional layer 210. By connecting multiple PTC material segments with different Curie temperatures in series, the resistance-temperature characteristic curve of the temperature sensing functional layer 210 maintains high linearity over a wide temperature range, with an effective temperature measurement range covering 25℃ to 50℃ and a resistance temperature coefficient greater than 2.8% / ℃. This enables the device to accurately sense temperature changes in various regions, effectively solving the problems of narrow temperature measurement range and strong nonlinearity associated with single PTC materials.

[0029] In some embodiments of the present invention, such as Figures 1 to 5 As shown, multiple heating electrodes 121 and multiple sensing electrodes 221 are arranged in an M×N array in the horizontal direction, where M and N are both natural numbers greater than or equal to 2. For example, a 5×5 array can be used, with a total of 25 functional units. Each heating electrode 121 at least partially overlaps with at least one sensing electrode 221 in the vertical projection. Through the arrayed arrangement and projection overlap design, each heating unit and its corresponding sensing unit form a one-to-one spatial correspondence, enabling the device to perform gating control and synchronous temperature reading for each independent unit, achieving high spatial resolution temperature field measurement.

[0030] In some embodiments of the present invention, such as Figures 1 to 5 As shown, the heating electrode layer 120 includes a first electrode layer 122 and a second electrode layer 123, and the insulating layer 310 includes a second insulating layer 311 and a fourth insulating layer 312. An insulating layer 310, specifically the second insulating layer 311, is disposed between the first electrode layer 122 and the second electrode layer 123. Similarly, the sensing electrode layer 220 includes a third electrode layer 222 and a fourth electrode layer 223, and an insulating layer 310, specifically the fourth insulating layer 312, is also disposed between the third electrode layer 222 and the fourth electrode layer 223. The first electrode layer 122 and the second electrode layer 123 are electrically connected through a via 240. The third electrode layer 222 and the fourth electrode layer 223 are also electrically connected through a via 240. By employing a double-layer electrode structure and achieving vertical interconnection through the via 240, more independently addressable electrode units can be arranged within a limited planar space. Simultaneously, the insulating layer 310 avoids the risk of short circuits between electrodes on the same layer, improving electrode layout density and signal reliability.

[0031] In some embodiments of the present invention, such as Figure 1As shown, multiple insulating layers include a first insulating layer 300, a second insulating layer 311, a third insulating layer 320, a fourth insulating layer 312, and a fifth insulating layer 340. The first insulating layer 300 covers the upper surface of the temperature sensing functional layer 210, serving as the outermost layer of protection for the device. The second insulating layer 311 is disposed between the sensing electrode layer 220 and the heating assembly 100. The third insulating layer 320 is disposed between the first electrode layer 122 and the second electrode layer 123 inside the heating electrode layer 120. The fourth insulating layer 312 is disposed between the heating electrode layer 120 and the heating functional layer 110. The fifth insulating layer 340 covers the lower surface of the heating functional layer 110, serving as the bottom layer insulation. All insulating layers are made of flexible dielectric materials such as polyimide (PI) or polyester (PET). The thickness of each insulating layer is at least 0.0125 mm. Through this multi-layered insulating structure, high-voltage isolation between the heating circuit and the sensing circuit is ensured, while also providing sufficient mechanical strength and moisture protection for the device under repeated bending conditions, thus improving long-term reliability.

[0032] According to the preparation method of the present invention, a heating and temperature sensing integrated device of the present invention is prepared, comprising the following steps: First, a heating electrode layer 120, a sensing electrode layer 220, and a third insulating layer 320 between the heating electrode layer 120 and the sensing electrode layer 220 are prepared to form a base layer. A multilayer flexible circuit board process is employed, including processes such as circuit etching, multilayer lamination, drilling of vias, and metallization of vias. Specifically, a polyimide substrate is used, the substrate being the third insulating layer 320, and the substrate thickness is at least 0.0125 mm, for example, 0.05 mm. The copper foil thickness is 18 μm. Circuit patterns of a first electrode layer 122, a second electrode layer 123, a third electrode layer 222, and a fourth electrode layer 223 are formed on the substrate, and vias 240 are drilled and filled with conductive material. Then, a temperature sensing functional layer 210 is prepared, and the temperature sensing functional layer 210 is covered on the sensing electrode layer 220 to form a sensing component 200. PTC sensing ink is printed onto the third electrode layer 222 and the fourth electrode layer 223 using screen printing, scraping, heat transfer, or spraying methods. The PTC sensing ink contains conductive particles and PTC materials with different Curie temperatures. After printing, the layers are placed in an oven to dry, and the printing and drying process is repeated until the temperature sensing functional layer 210 reaches the target thickness A, where A ≥ 0.1 mm. After drying, the thickness of the temperature sensing functional layer 210 is controlled to be above 0.1 mm to ensure that the sensing layer has sufficient mechanical strength and a stable PTC response.

[0033] According to the fabrication method of this invention, by employing the integrated heating and temperature sensing device of this invention, the heating electrode layer 120, the sensing electrode layer 220, and the third insulating layer 320 between them are integrally formed into a multilayer flexible circuit board base layer. The temperature sensing functional layer 210 and the heating functional layer 110 are directly printed on the base layer, eliminating the need for separate sensor mounting processes and additional wiring connections. The use of a polyimide substrate combined with 0.05mm thick and 18μm copper foil ensures the device's flexibility and conductivity reliability. The temperature sensing functional layer 210 and the heating functional layer 110 need to reach target thicknesses to ensure sufficient mechanical strength and stable PTC response for both layers. This fabrication method achieves wafer-level, mass-production integration of heating and sensing functions, reducing material types and assembly steps, and lowering production costs. Simultaneously, the integral molding of each functional layer within the device eliminates the risk of externally mounted sensors detaching due to vibration or thermal cycling, improving the long-term stability and safety of the device under harsh conditions such as power batteries and wearable devices.

[0034] Referring to the figures, in an embodiment of the present invention, a heating functional layer 110 is prepared and then covered on the heating electrode layer 120 to form a heating assembly 100. PTC heating ink is printed on the first electrode layer 122 and the second electrode layer 123 using screen printing, scraping, heat transfer, or spraying. The PTC heating ink is a PTC material with a single Curie temperature, selected according to the target heating temperature, for example, 40°C. After printing, the material is placed in an oven to dry, and the printing and drying process is repeated until the heating functional layer 110 reaches the target thickness B, where B ≥ 0.12 mm. After drying, the thickness of the heating functional layer 110 is controlled to be above 0.12 mm to ensure that the heating layer has sufficient heating power and service life. Insulating layers, namely the first insulating layer 300 and the fifth insulating layer 340, are respectively bonded to the outer sides of the heating functional layer 110 and the temperature sensing functional layer 210, leaving positions for lead wire soldering. One of the following processes is employed: vertical hot pressing, cold pressing, roll pressing, or screen printing and drying, resulting in a flexible electronic device integrating heating and temperature sensing. When using hot pressing, the pressing temperature can be 25°C to 35°C above the Curie temperature of the heating functional layer 110, the pressure can be 0.01MPa to 0.1MPa, and the time can be 5s to 10s. The temperature sensing functional layer 210 and the heating functional layer 110 achieve their target thicknesses, ensuring their respective electrical performance and mechanical stability. Simultaneously, the printing process is compatible with multilayer FPC processes, enabling mass production.

[0035] In some embodiments of the present invention, during device use, an external control unit is electrically connected to the heating electrode layer 120 and the sensing electrode layer 220 via leads. The control unit independently selects any one or a combination of heating electrodes 121, causing the corresponding heating functional layer 110 to generate Joule heating. The control unit synchronously reads the electrical signal of the sensing electrode 221 associated with the selected heating electrode 121 and calculates the current temperature based on the electrical signal. The current temperature is compared with the target temperature; if the current temperature is lower than the target temperature, the heating power is continued or increased; if the current temperature reaches or exceeds the target temperature, the heating power is reduced or stopped. Since each functional unit can be independently addressed and closed-loop regulated, even if the external temperature controller fails as a whole, each unit can still maintain a safe temperature range based on its own temperature feedback, thereby significantly reducing the risk of thermal runaway. At the same time, by sequentially scanning all units, a two-dimensional temperature distribution map of the entire device can be obtained, accurately locating local overheated areas and providing timely warnings.

[0036] In one specific embodiment of the present invention, the temperature sensing performance of the integrated heating and temperature sensing device prepared using the above structure is characterized by the resistance-temperature relationship. (Refer to...) Figure 6 The resistance of the PTC temperature sensing layer 210 increases approximately linearly with increasing temperature. The temperature sensing layer 210 is composed of five PTC material segments connected in series, with Curie temperatures of 30℃, 35℃, 37℃, 40℃, and 42℃. Each segment is electrically connected to the sensing electrode layer 220 via a via 240. Testing shows that the effective temperature measurement range of this device is 25℃ to 50℃, and the temperature coefficient of resistance (TCR) is greater than 2.8% / ℃. By connecting multiple PTC material segments with different Curie temperatures in series, the temperature sensing layer 210 maintains a high linearity resistance-temperature response over a wide temperature range of 25℃ to 50℃, significantly improving temperature measurement accuracy. It can accurately identify localized overheating areas and solves the problems of narrow temperature measurement range and strong nonlinearity associated with single PTC materials.

[0037] In some specific embodiments of the present invention (not shown in the figures), the heating and temperature sensing integrated device prepared using the above structure is characterized by temperature-voltage-time variation. The PTC heating functional layer 110 is made of PTC material with a Curie temperature of 40°C, and multiple heating electrodes 121 in the heating electrode layer 120 are arranged in an array. After applying a voltage from 4V to 20V, the temperature of the heating functional layer 110 rises rapidly and automatically stabilizes after reaching about 40°C. Under different voltages of 4V, 8V, 12V, 16V, and 20V, the equilibrium temperature of the heating functional layer 110 is maintained between 37°C and 40°C, and the time to reach the equilibrium temperature is less than 100 seconds. Utilizing the positive temperature coefficient characteristic of PTC material, the resistance of the heating functional layer 110 increases sharply after reaching the preset Curie temperature, and the heating power automatically decreases, forming a self-limiting temperature mechanism that does not rely on an external controller. Even when the applied voltage fluctuates within a wide range of 4V to 20V, the device can still stabilize the temperature within a safe range of 37℃ to 40℃, effectively preventing local overheating and improving the safety of applications such as low-temperature heating of power batteries.

[0038] Other configurations and operations of the preparation method according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0039] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. An integrated heating and temperature sensing device, characterized in that, include: A heating assembly includes a heating functional layer and a heating electrode layer, wherein the heating functional layer is electrically connected to the heating electrode layer, and the heating electrode layer includes a plurality of heating electrodes; A sensing component is stacked on the heating component. The sensing component includes a temperature sensing functional layer and a sensing electrode layer. The temperature sensing functional layer is electrically connected to the sensing electrode layer. The sensing electrode layer includes a plurality of sensing electrodes. Multiple insulating layers are disposed between and on the outside of the heating component and the sensing component for electrical isolation; The plurality of heating electrodes correspond one-to-one with the plurality of sensing electrodes. Each heating electrode or a combination of the plurality of heating electrodes can be associated with at least one sensing electrode to control the heating of the corresponding area and simultaneously sense the temperature of the corresponding area.

2. The integrated heating and temperature sensing device according to claim 1, characterized in that: Both the heating functional layer and the temperature sensing functional layer are made of materials with a positive temperature coefficient effect.

3. The integrated heating and temperature sensing device according to claim 2, characterized in that: The heating functional layer uses PTC material with a preset Curie temperature point, which is the same as the target heating temperature. When the temperature of the heating functional layer reaches the Curie temperature point, the resistance value of the PTC material increases.

4. The integrated heating and temperature sensing device according to claim 2, characterized in that: The temperature sensing functional layer includes multiple PTC material segments connected in series, and at least two of the PTC material segments have different Curie temperature points.

5. The integrated heating and temperature sensing device according to claim 1, characterized in that: The plurality of heating electrodes and the plurality of sensing electrodes are arranged in an M×N array in the horizontal direction, wherein M and N are both natural numbers greater than or equal to 2.

6. The integrated heating and temperature sensing device according to claim 1, characterized in that: Each of the heating electrodes overlaps at least partially with at least one of the sensing electrodes in its vertical projection.

7. The integrated heating and temperature sensing device according to claim 1, characterized in that: The heating electrode layer includes a first electrode layer and a second electrode layer, and each of the sensing electrode layers includes a third electrode layer and a fourth electrode layer. An insulating layer is provided between the first electrode layer and the second electrode layer, as well as between the third electrode layer and the fourth electrode layer.

8. The preparation method, characterized in that... The method for fabricating the integrated heating and temperature sensing device as described in any one of claims 1 to 7 comprises the following steps: S1. Prepare a heating electrode layer, a sensing electrode layer, and an insulating layer between the heating electrode layer and the sensing electrode layer to form a base layer; S2. Prepare a temperature sensing functional layer and cover the sensing electrode layer with the temperature sensing functional layer to form a sensing component; S3. Place in an oven to dry, and repeat step S2 until the temperature sensing functional layer reaches the target thickness. S4. Prepare a heating functional layer and cover the heating electrode layer with the heating functional layer to form a heating assembly; S5. Place in an oven to dry, and repeat step S4 until the heated functional layer reaches the target thickness to obtain the sensing component. S6. An insulating layer is attached to the outside of the heating functional layer and the temperature sensing functional layer respectively, leaving a position for lead wire soldering, to obtain the integrated heating and temperature sensing device.

9. The preparation method according to claim 8, characterized in that, The target thickness of the temperature sensing functional layer is A, and the target thickness of the heating functional layer is B, where A ≥ 0.1 mm and B ≥ 0.12 mm.

10. The preparation method according to claim 8, characterized in that, In steps S2 and S4, one of the following processes is used: screen printing, scraping, thermal transfer, spraying, inkjet printing, or electrospinning technology, to coat the temperature sensing functional layer and the heating functional layer onto the sensing electrode layer and the heating electrode layer, respectively.

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