Multi-igbt module partition temperature measurement and cooperative thermal protection system and control method

Abstract

The present application relates to electromagnetic heating furnace power electronic device thermal management and protection control technical field, especially to a kind of multi-IGBT module partition temperature measurement and collaborative thermal protection system and control method.The method includes: receiving the partition temperature data of each temperature monitoring area, module identification, area identification and sampling time stamp, and binding generation module partition temperature record;In preset time window, the maximum temperature difference in module and partition temperature change rate are calculated, and the thermal state evaluation result containing local overheating risk state is generated;Compare the local overheating risk state between multiple IGBT modules, and generate multi-module thermal deviation determination data;According to the preset thermal protection rule, generate collaborative protection instruction and output to driving execution module, and update protection level based on subsequent partition temperature data after protection action.The present application effectively improves the continuity of multi-IGBT module local overheating identification and collaborative protection control.

Description

Technical Field

[0001] This invention relates to the field of thermal management and protection control technology for power electronic devices in electromagnetic heating furnaces, and particularly to a multi-IGBT module zoned temperature measurement and coordinated thermal protection system and control method. Background Technology

[0002] In the field of thermal management and protection control technology for power electronic devices in electromagnetic heating boilers, existing solutions for multiple IGBT modules typically involve placing temperature sensors on the radiator, power board, or near the IGBT module. The main controller receives the temperature signals and combines them with current, voltage, operating time, or drive status to determine overheat protection. While this approach can perform basic processing such as temperature acquisition, threshold comparison, power reduction, or shutdown protection under normal operating conditions, it is prone to limitations when operating multiple IGBT modules in an electromagnetic heating boiler under varying operating conditions. These limitations include limited coverage of temperature measurement points, difficulty in reflecting differences in internal temperature distribution within the modules, and insufficient thermal connectivity between multiple modules.

[0003] Existing solutions often rely on single-point temperature monitoring, a limited number of temperature acquisition points, or fixed protection thresholds. When the load state of the electromagnetic heating furnace changes, the temperature difference along the heat dissipation path widens, or a localized area of ​​a certain IGBT module experiences rapid temperature rise, the lack of stable connection between the temperature acquisition stage and subsequent drive protection control stages can easily lead to delayed judgment of localized overheating risk and asynchronous protection actions of multiple IGBT modules. For structures that rely solely on radiator temperature or power board temperature for protection, the temperature differences between adjacent areas of the chip, the heat dissipation substrate area, and the power terminal area are difficult to incorporate into the thermal state determination within the same control cycle.

[0004] Regarding the joint processing of zoned temperature data, module identification, thermal deviation judgment, and collaborative protection commands under the operation of multi-IGBT modules in electromagnetic heating boilers, existing technologies still suffer from common shortcomings, including insufficient coordination between temperature recording, local overheating risk states, inter-module thermal deviation data, and protection level updates. Therefore, it is necessary to address the technical challenges of generating collaborative protection commands and updating protection levels based on zoned temperature data and module identification in the thermal protection control of multi-IGBT modules in electromagnetic heating boilers. Summary of the Invention

[0005] To address the aforementioned technical problems, this invention provides a method for multi-IGBT module zoned temperature measurement and coordinated thermal protection control, comprising:

[0006] S100: Receive the zone temperature data, module identifier, area identifier, and sampling timestamp of each temperature monitoring area; bind the zone temperature data according to the module identifier and area identifier to generate module zone temperature records;

[0007] S200. Based on the temperature records of the module sections, calculate the maximum temperature difference and the temperature change rate of the sections within the same IGBT module within a preset time window, and generate a thermal state assessment result that includes the risk of local overheating.

[0008] S300: Based on the thermal status assessment results of multiple IGBT modules, compare the local overheating risk status between different IGBT modules and generate multi-module thermal deviation judgment data.

[0009] S400: Based on the multi-module thermal deviation judgment data and preset thermal protection rules, generate a collaborative protection command and output it to the drive execution module; after the drive execution module performs the protection action, update the protection level based on subsequent zone temperature data.

[0010] Furthermore, the plurality of temperature monitoring areas include two or more areas of the chip adjacent area, the heat dissipation substrate area, the key area of ​​the heat sink, and the power terminal area; temperature sensors are respectively provided in the chip adjacent area, the heat dissipation substrate area, the key area of ​​the heat sink, and the power terminal area.

[0011] Furthermore, the module-level zoned temperature record includes a module identifier, a region identifier, a sensor identifier, a sampling timestamp, and a zoned temperature value; the module-level zoned temperature record generates a zoned temperature matrix according to the module identifier and the region identifier.

[0012] Furthermore, before generating the thermal state assessment result based on the temperature records of the module partitions, the validity of the partition temperature data is verified. The validity verification includes over-range determination, temperature jump determination, and communication loss determination. Areas that meet the over-range determination, temperature jump determination, or communication loss determination are marked as abnormal partitions, and the partition temperature data corresponding to the abnormal partitions are removed from the temperature calculation objects of the thermal state assessment result.

[0013] Furthermore, the maximum temperature difference within the module is the difference between the highest and lowest zone temperatures of the same IGBT module within a preset time window; the zone temperature change rate is the ratio of the difference in zone temperature values ​​under continuous sampling timestamps to the difference in sampling time for the same temperature monitoring area.

[0014] Furthermore, a thermal state assessment result containing local overheating risk states is generated, including: obtaining the highest partition temperature, average partition temperature, maximum temperature difference within the module, and partition temperature change rate of the same IGBT module within a preset time window; and mapping the highest partition temperature, average partition temperature, maximum temperature difference within the module, and partition temperature change rate to normal level, warning level, derating protection level, or shutdown protection level according to the protection level mapping rule.

[0015] Furthermore, generating multi-module thermal deviation judgment data includes: comparing the local overheating risk status between different IGBT modules; calculating the highest zone temperature difference, the average zone temperature difference, and the maximum temperature difference within the module between different IGBT modules; and associating the local overheating risk status, the highest zone temperature difference, the average zone temperature difference, and the maximum temperature difference within the module with the corresponding module identifier to generate the multi-module thermal deviation judgment data.

[0016] Furthermore, based on the multi-module thermal deviation judgment data and preset thermal protection rules, a collaborative protection command is generated, including: when the local overheating risk state of a single IGBT module is higher than that of other IGBT modules, a derating protection command is generated for that IGBT module; when multiple IGBT modules reach the same preset thermal state level, a gradient power reduction command for the entire system is generated; when the inter-module thermal deviation data is greater than the inter-module temperature difference threshold, an output power limiting command is generated for the IGBT module with the higher temperature.

[0017] Furthermore, the driving parameters corresponding to the collaborative protection command include any one or a combination of the following: switching frequency, duty cycle, upper limit of output power, and drive enable state; within the feedback time window, the local overheating risk state is regenerated based on subsequent partition temperature data; when the regenerated local overheating risk state does not decrease, or the partition temperature change rate is greater than the partition temperature rise rate threshold, a protection upgrade command is generated; when the regenerated local overheating risk state meets the protection release threshold, a protection release command is generated.

[0018] Furthermore, a multi-IGBT module zoned temperature measurement and collaborative thermal protection system includes: a zoned temperature recording module, a thermal status assessment module, a thermal deviation determination module, a collaborative protection command module, and a drive execution and feedback update module; the system is used to implement the method described in any of the above embodiments.

[0019] The key innovations of this invention include:

[0020] (1) Bind the zoned temperature data of each temperature monitoring area with the module identifier, area identifier and sampling timestamp to generate the module zoned temperature record, so that the temperature data of different temperature monitoring areas in the same IGBT module can form a data structure that can be called by module and area.

[0021] (2) Based on the temperature records of the module, calculate the maximum temperature difference and the temperature change rate of the same IGBT module within a preset time window, and generate a thermal state assessment result that includes the risk of local overheating, so that the temperature distribution of the partition and the continuous sampling change enter the same thermal state determination link.

[0022] (3) Based on the thermal status assessment results of multiple IGBT modules, compare the local overheating risk status between different IGBT modules, generate multi-module thermal deviation judgment data, and generate collaborative protection instructions in combination with preset thermal protection rules; after the drive execution module performs the protection action, update the protection level based on the subsequent partition temperature data.

[0023] The following are its main beneficial effects:

[0024] (1) In response to the problem that single-point temperature or a small number of temperature collection points in the existing solution cannot reflect the temperature distribution difference inside the IGBT module, the temperature data of the partition is bound by the module identifier and the area identifier, so that the temperature records of the chip adjacent area, heat dissipation substrate area, key heat sink area or power terminal area are associated with the corresponding IGBT module, providing temperature data with clear location for subsequent thermal status assessment results.

[0025] (2) To address the problem that local temperature rise trends are difficult to control when relying solely on fixed temperature thresholds for overheating determination, a local overheating risk state is generated by the maximum temperature difference within the module and the temperature change rate of the partition, so that the temperature distribution differences and continuous sampling changes within the same IGBT module are included in the thermal state assessment results.

[0026] (3) To address the issues of insufficient thermal state connection and asynchronous protection actions among multiple IGBT modules, collaborative protection instructions are generated using multi-module thermal deviation judgment data. After the protection action is executed, the protection level is updated based on subsequent zone temperature data, thus forming a continuous control link between thermal deviation judgment, drive protection control, and protection level update. Attached Figure Description

[0027] Figure 1 A schematic flowchart illustrating the multi-IGBT module zoned temperature measurement and coordinated thermal protection control method provided in this application embodiment;

[0028] Figure 2 This is a structural block diagram of the multi-IGBT module zoned temperature measurement and coordinated thermal protection system provided in the embodiments of this application. Detailed Implementation

[0029] Example 1: Refer to Figure 1 This is a flowchart illustrating the multi-IGBT module zoned temperature measurement and coordinated thermal protection control method provided in this embodiment of the invention. The process may include at least steps S100-S400:

[0030] S100: Receive the zone temperature data, module identifier, area identifier, and sampling timestamp of each temperature monitoring area; bind the zone temperature data according to the module identifier and area identifier to generate module zone temperature records;

[0031] S200. Based on the temperature records of the module sections, calculate the maximum temperature difference and the temperature change rate of the sections within the same IGBT module within a preset time window, and generate a thermal state assessment result that includes the risk of local overheating.

[0032] S300: Based on the thermal status assessment results of multiple IGBT modules, compare the local overheating risk status between different IGBT modules and generate multi-module thermal deviation judgment data.

[0033] S400: Based on the multi-module thermal deviation judgment data and preset thermal protection rules, generate a collaborative protection command and output it to the drive execution module; after the drive execution module performs the protection action, update the protection level based on subsequent zone temperature data.

[0034] S100: Receive zone temperature data, module identifier, area identifier, and sampling timestamp for each temperature monitoring area; bind the zone temperature data according to the module identifier and area identifier to generate module zone temperature records.

[0035] In this embodiment, the IGBT is an Insulated Gate Bipolar Transistor; the electromagnetic heating furnace includes multiple IGBT modules, each IGBT module is configured with multiple temperature monitoring areas; the multiple temperature monitoring areas are temperature measurement positions divided according to the heat source location, heat conduction path and heat dissipation connection location of the IGBT module, and the temperature monitoring area includes two or more areas in the chip adjacent area, heat dissipation substrate area, key heat sink area and power terminal area; each temperature monitoring area is respectively equipped with a temperature sensor, the temperature sensor is connected to a signal conditioning module, the signal conditioning module is connected to a main controller, and the main controller receives the zone temperature data after being processed by the signal conditioning module.

[0036] The partition temperature data refers to the temperature values ​​collected by the temperature sensors in the corresponding temperature monitoring areas; the module identifier refers to the number field configured for each IGBT module in the electromagnetic heating furnace control system; the area identifier refers to the number field configured for different temperature monitoring areas within each IGBT module; and the sampling timestamp refers to the time field recorded by the temperature acquisition module or the main controller within the sampling period. Specifically, when the main controller receives the partition temperature data, it simultaneously reads the module identifier and area identifier of the temperature sensor; when the signal conditioning module uploads the collected values ​​in the form of communication frames, the communication frames carry the sensor identifier, sampling timestamp, and partition temperature value; when the signal conditioning module outputs the collected values ​​in the form of analog channels, the main controller obtains the module identifier and area identifier according to the correspondence between the analog channels and the preset area configuration table.

[0037] In one embodiment, the temperature sensor is a thermistor, PT100, PT1000, thermocouple, or digital temperature sensor; the signal conditioning module filters, amplifies, isolates, and performs analog-to-digital conversion on the temperature signal output by the temperature sensor, and sends the converted zone temperature data to the main controller; the filtering process suppresses transient interference within the sampling period, and the analog-to-digital conversion converts the temperature signal into a digital quantity that the main controller can read; the signal conditioning module retains the sensor identifier, enabling the main controller to write the zone temperature data into the corresponding module zone temperature record.

[0038] S100 can be triggered by periodic sampling or by changes in the working state of the IGBT module. When the electromagnetic heating furnace enters the heating operation state, power level switching state, or protection recovery state, the main controller starts the partition temperature acquisition of the corresponding IGBT module. When the main controller detects a temperature jump or communication loss marker in a certain temperature monitoring area, the main controller rereads the partition temperature data of the corresponding temperature monitoring area in the next sampling cycle and records the reread partition temperature data separately from the original sampling timestamp.

[0039] Specifically, the main controller establishes a record index according to the module identifier and the area identifier; for multiple partition temperature data obtained under the same sampling timestamp, the main controller writes the temperature value of each partition to the corresponding index position; when there are multiple temperature monitoring area sampling values ​​of the same IGBT module under the same sampling timestamp, the main controller arranges the partition temperature values ​​according to the area identifier to form the partition temperature record of the IGBT module under the sampling timestamp; when multiple IGBT modules complete the acquisition in the same sampling period, the main controller arranges the partition temperature records of each module according to the module identifier to form the module partition temperature record for subsequent calculation.

[0040] The module-level zoned temperature record includes a module identifier, a region identifier, a sensor identifier, a sampling timestamp, and a zoned temperature value. In one embodiment, the module-level zoned temperature record generates a zoned temperature matrix according to the module identifier and the region identifier. The row index of the zoned temperature matrix corresponds to the module identifier, the column index corresponds to the region identifier, and the matrix elements correspond to the zoned temperature values. When a temperature monitoring area does not obtain a valid sampled value at the current sampling timestamp, the main controller retains the corresponding index position and writes a communication loss flag or an abnormal sampling flag, so that subsequent steps can identify the temperature calculation object of the area that does not participate in the thermal state assessment results.

[0041] In the engineering implementation, the power control board of the electromagnetic heating furnace is equipped with four IGBT modules. Each IGBT module corresponds to three temperature monitoring areas: the chip proximity area, the heat dissipation substrate area, and the critical area of ​​the radiator. The temperature signals collected by the temperature sensors are converted by the signal conditioning module and then sent to the main controller. The main controller reads the module identifiers M1 to M4, the area identifiers R1 to R3, and the sampling timestamp Tn. The main controller writes the zone temperature values ​​of M1-R1-Tn, M1-R2-Tn, and M1-R3-Tn into the record group of the same IGBT module, and writes the corresponding records of M2 to M4 in the same way to form the module zone temperature record. This module zone temperature record is cached by the main controller and used as input in S200 to calculate the maximum temperature difference and zone temperature change rate within the module.

[0042] S200. Based on the temperature records of the module sections, calculate the maximum temperature difference and the temperature change rate of each section within the same IGBT module within a preset time window, and generate a thermal state assessment result that includes the risk of local overheating.

[0043] S200 is executed by the main controller. The main controller receives the module zone temperature records generated by S100 and calls historical sampling records within a preset time window. The preset time window refers to the time interval used by the main controller to organize zone temperature data under multiple consecutive sampling timestamps. Within this time interval, the main controller performs temperature characteristic calculations on multiple temperature monitoring areas of the same IGBT module, generating a thermal state assessment result that includes local overheating risk states. The thermal state assessment result is used to represent the thermal state of a single IGBT module within the current time window. Subsequently, S300 will call the thermal state assessment results of multiple IGBT modules for cross-module comparison.

[0044] Before generating thermal state assessment results based on the temperature records of the module zones, the main controller performs validity checks on the zone temperature data. The validity checks include over-range determination, temperature jump determination, and communication loss determination. Specifically, over-range determination means that the main controller compares the zone temperature value with the sampling range corresponding to the temperature sensor; zone temperature values ​​exceeding the sampling range are marked as over-range. Temperature jump determination means that the main controller calculates the difference between the zone temperature values ​​of the same temperature monitoring area at consecutive sampling timestamps; records with differences exceeding the temperature jump threshold are marked as temperature jumps. Communication loss determination means that when the main controller does not receive temperature data identified by the corresponding sensor within a preset sampling period, or receives a data frame with a communication error check result, the corresponding area is marked as having lost communication.

[0045] When a temperature monitoring area meets the criteria for over-range judgment, temperature jump judgment, or communication loss judgment, the main controller marks the temperature monitoring area as an abnormal zone and removes the temperature data of the abnormal zone from the temperature calculation object of the thermal state assessment result. The module identifier, area identifier, sensor identifier, sampling timestamp, and abnormality type corresponding to the abnormal zone are written into the status recording module. When an abnormal zone exists in the same IGBT module within a preset time window, the main controller retains the remaining valid zone temperature data of the IGBT module and calculates the maximum temperature difference within the module and the zone temperature change rate based on the valid zone temperature data. When no valid zone temperature data exists in the same IGBT module within a preset time window, the main controller maintains the protection level of the IGBT module in the previous time window and generates the corresponding abnormal instruction information.

[0046] The maximum temperature difference within the module is the difference between the highest and lowest zone temperatures of the same IGBT module within a preset time window. Specifically, the main controller reads the valid zone temperature values ​​corresponding to multiple region identifiers under the same module identifier, and extracts the maximum and minimum values ​​of the valid zone temperature values ​​within the current sampling timestamp or preset time window. The highest zone temperature is the maximum value among the valid zone temperature values, and the lowest zone temperature is the minimum value among the valid zone temperature values. The difference between the highest and lowest zone temperatures is written into the maximum temperature difference field within the module corresponding to the IGBT module. The average zone temperature is the average of multiple valid zone temperature values ​​of the same IGBT module within the same sampling timestamp or preset time window. The average zone temperature and the highest zone temperature jointly participate in the generation of local overheating risk states.

[0047] The partition temperature change rate is the ratio of the difference in partition temperature values ​​under consecutive sampling timestamps to the difference in sampling time for the same temperature monitoring area. Specifically, the main controller reads the valid partition temperature values ​​corresponding to two or more consecutive sampling timestamps under the same module identifier and the same area identifier, calculates the temperature difference between adjacent sampling timestamps, and calculates the ratio of the temperature difference to the sampling time difference. When there are multiple consecutive sampling intervals within a preset time window, the main controller generates a partition temperature change rate field for that area based on the temperature change rate corresponding to the multiple sampling intervals. When there are multiple temperature monitoring areas for the same IGBT module, the main controller retains the partition temperature change rate for each area and records the area identifier with the higher value.

[0048] When generating a thermal state assessment result that includes a local overheating risk state, the main controller acquires the highest zone temperature, average zone temperature, maximum temperature difference within the module, and zone temperature change rate of the same IGBT module within a preset time window. The main controller maps the highest zone temperature, average zone temperature, maximum temperature difference within the module, and zone temperature change rate to normal level, warning level, derating protection level, or shutdown protection level according to the protection level mapping rules. Specifically, the protection level mapping rules include temperature threshold conditions corresponding to the highest zone temperature, temperature difference threshold conditions corresponding to the maximum temperature difference within the module, and temperature rise rate threshold conditions corresponding to the zone temperature change rate. The main controller combines the matching results of the above conditions into a local overheating risk state and writes the local overheating risk state into the thermal state assessment result. The local overheating risk state corresponds to a state field indicating whether a certain temperature monitoring area within a single IGBT module experiences a localized temperature rise relative to other areas.

[0049] During engineering implementation, the main controller reads the zoned temperature values ​​of the IGBT module M1 at sampling timestamps Tn, Tn-1, and Tn-2 from the module zoned temperature records generated by S100 for the chip's adjacent area, heat dissipation substrate area, and critical heat sink area. If the temperature of the chip's adjacent area rises at consecutive sampling timestamps, and the temperature of the chip's adjacent area at the current sampling timestamp is higher than that of the heat dissipation substrate area and the critical heat sink area, the main controller calculates the highest zoned temperature, average zoned temperature, maximum temperature difference within the module, and zoned temperature change rate of the chip's adjacent area for M1. Subsequently, the main controller maps M1 to a warning level or a derating protection level according to the protection level mapping rules, and writes this level and the local overheating risk status of M1 together into the thermal state assessment result. The thermal state assessment result is stored according to the module identifier and serves as input for S300 to generate multi-module thermal deviation judgment data.

[0050] S300: Based on the thermal status assessment results of multiple IGBT modules, compare the local overheating risk status among different IGBT modules and generate multi-module thermal deviation judgment data.

[0051] S300 is executed by the main controller, which receives the thermal status assessment results of multiple IGBT modules generated in S200. The thermal status assessment results include the corresponding module identifier, highest zone temperature, average zone temperature, maximum temperature difference within the module, zone temperature change rate, local overheating risk status, and thermal status level. Within the same control cycle, the main controller reads the thermal status assessment results of multiple IGBT modules and compares the local overheating risk status between different IGBT modules to generate multi-module thermal deviation judgment data. This multi-module thermal deviation judgment data is used to record the thermal status differences between multiple IGBT modules. Subsequently, S400 generates a collaborative protection command based on this multi-module thermal deviation judgment data.

[0052] The local overheating risk status is a status field generated by S200 based on the highest zone temperature, average zone temperature, maximum temperature difference within the module, and zone temperature change rate within the same IGBT module. In S300, the main controller no longer recalculates the internal temperature characteristics of a single IGBT module, but instead performs a horizontal comparison of the local overheating risk status of different IGBT modules. This horizontal comparison includes level comparison and temperature characteristic difference calculation. Level comparison refers to the main controller sorting the thermal status levels of different IGBT modules and identifying the modules with higher protection levels. Temperature characteristic difference calculation refers to the main controller calculating the difference in the highest zone temperature, the difference in the average zone temperature, and the difference in the maximum temperature difference within the module between different IGBT modules.

[0053] Specifically, the main controller reads the highest zone temperature of each IGBT module according to the module identifier; compares multiple highest zone temperatures to generate a highest zone temperature difference value; the main controller reads the average zone temperature in the same way to generate an average zone temperature difference value; the main controller reads the maximum temperature difference within each IGBT module to generate a maximum temperature difference value within the module. The highest zone temperature difference value is used to characterize the temperature difference of the highest temperature region among multiple IGBT modules; the average zone temperature difference value is used to characterize the difference in the overall temperature level among multiple IGBT modules; and the maximum temperature difference value within the module is used to characterize the difference in the degree of internal temperature unevenness among multiple IGBT modules.

[0054] When generating multi-module thermal deviation judgment data, the main controller associates the local overheating risk status, the highest zone temperature difference, the average zone temperature difference, and the maximum temperature difference within a module with the corresponding module identifier. Specifically, when the local overheating risk status of a certain IGBT module is higher than that of other IGBT modules, the main controller writes a high-risk module mark under that module identifier. When multiple IGBT modules are at the same preset thermal state level, the main controller writes a synchronous heating mark under multiple module identifiers. When the inter-module thermal deviation data exceeds the inter-module temperature difference threshold, the main controller writes a thermal deviation exceeding limit mark in the corresponding record of the IGBT module with the higher temperature. The above marks and the temperature difference field together constitute the multi-module thermal deviation judgment data.

[0055] S300 can be triggered by the completion of the thermal status assessment results of S200. When the main controller obtains the thermal status assessment results of multiple IGBT modules in the same control cycle, it starts cross-module comparison. When the thermal status assessment result of a certain IGBT module is in a reserved state due to too many abnormal partitions, the main controller marks the IGBT module as a module to be degraded in the multi-module thermal deviation judgment data and retains the thermal status level of the module in the previous control cycle. When the sampling timestamps of multiple IGBT modules are inconsistent, the main controller synchronizes the thermal status assessment results according to the sampling timestamps. Thermal status assessment results that are outside the synchronization range do not participate in the generation of multi-module thermal deviation judgment data in the current control cycle.

[0056] In one implementation, the main controller establishes a recording structure for multi-module thermal deviation judgment data according to the module identifier; each record includes the current module identifier, the current module thermal state level, the current module local overheating risk state, the highest zone temperature difference between the module and other IGBT modules, the average zone temperature difference, the maximum temperature difference within the module, and a thermal deviation exceeding limit flag; in another implementation, the main controller divides multiple IGBT modules into the same power output group, and the multiple IGBT modules in the same power output group participate in the same electromagnetic heating power output, and the main controller only generates multi-module thermal deviation judgment data within the same power output group.

[0057] During project implementation, the main controller receives the thermal status assessment results of M1, M2, M3, and M4. M1's local overheating risk status is at the derating protection level, while M2, M3, and M4 are at the normal or warning level. The main controller calculates the highest zone temperature difference, the average zone temperature difference, and the maximum intra-module temperature difference between M1 and M2, M3, and M4. When the thermal deviation data of M1 relative to the other modules exceeds the inter-module temperature difference threshold, the main controller marks M1 as a high-temperature IGBT module and generates multi-module thermal deviation judgment data containing the M1 module identifier, thermal deviation exceeding the limit marker, and the corresponding difference field. This multi-module thermal deviation judgment data is transmitted to S400 and used as input for matching preset thermal protection rules.

[0058] S400: Based on the multi-module thermal deviation judgment data and preset thermal protection rules, generate a collaborative protection command and output it to the drive execution module; after the drive execution module executes the protection action, update the protection level based on subsequent zone temperature data.

[0059] S400 is jointly executed by the main controller, drive execution module, and status recording module. The main controller receives multi-module thermal deviation judgment data generated by S300 and calls preset thermal protection rules. The preset thermal protection rules include protection level mapping rules, inter-module temperature difference thresholds, zone temperature rise rate thresholds, protection release thresholds, feedback time windows, and drive parameter adjustment rules corresponding to different protection levels. The main controller generates collaborative protection instructions based on the multi-module thermal deviation judgment data and preset thermal protection rules, and outputs the collaborative protection instructions to the drive execution module. The drive execution module adjusts the drive parameters of the corresponding IGBT module or triggers protection actions according to the collaborative protection instructions. The status recording module records the collaborative protection instructions, protection level update results, and fault records.

[0060] The coordinated protection command refers to the drive control command generated by the main controller based on the thermal state differences between multiple IGBT modules. The coordinated protection command includes a module identifier, protection level, drive parameter adjustment type, drive parameter target field, protection action type, and feedback time window identifier. The drive parameters include any one or a combination of switching frequency, duty cycle, output power limit, and drive enable state. The protection action includes any one of drive pause and soft shutdown. Specifically, the switching frequency field corresponds to the switching frequency of the IGBT module drive signal; the duty cycle field corresponds to the conduction ratio of the drive control signal; the output power limit field corresponds to the limit value when the IGBT module participates in power output; and the drive enable state field corresponds to whether the IGBT module is allowed to receive drive signals.

[0061] When generating collaborative protection commands based on the multi-module thermal deviation judgment data and preset thermal protection rules, the main controller reads the local overheating risk status, thermal status level, highest zone temperature difference, average zone temperature difference, maximum temperature difference within the module, and thermal deviation exceeding limit flag according to the module identifier. When the local overheating risk status of a single IGBT module is higher than that of other IGBT modules, the main controller generates a derating protection command for that IGBT module. The derating protection command includes control fields for reducing the switching frequency, reducing the duty cycle, limiting the upper limit of output power, or adjusting the drive enable status. When multiple IGBT modules reach the same preset thermal status level, the main controller generates a system-wide gradient power reduction command. The system-wide gradient power reduction command corresponds to the upper limit of output power fields of multiple IGBT modules. When the inter-module thermal deviation data is greater than the inter-module temperature difference threshold, the main controller generates an output power limiting command for the IGBT module with the higher temperature.

[0062] In one embodiment, the drive execution module includes drive circuits corresponding to multiple IGBT modules. After the main controller sends a collaborative protection command to the drive execution module, the drive execution module selects the corresponding drive channel according to the module identifier and updates the drive control parameter group according to the drive parameters in the collaborative protection command. When the collaborative protection command is a derating protection command, the drive execution module updates the switching frequency, duty cycle, or output power limit of the corresponding IGBT module. When the collaborative protection command is a drive pause command, the drive execution module switches the drive enable state of the corresponding IGBT module. When the collaborative protection command is a soft shutdown command, the drive execution module stops the drive output of the corresponding IGBT module according to a preset shutdown sequence and sends a protection action completion flag back to the main controller.

[0063] After the drive execution module performs the protection action, the main controller enters a feedback time window. This feedback time window is configured by a preset thermal protection rule and is bound to the module identifier and protection action type in the collaborative protection instruction. Within the feedback time window, the main controller continues to receive subsequent zone temperature data for the corresponding IGBT module and calls the binding rule of S100 to write the subsequent zone temperature data into a new module zone temperature record. The main controller regenerates the local overheating risk state based on the subsequent zone temperature data and compares it with the local overheating risk state before the protection action was executed. When the regenerated local overheating risk state does not decrease, or the zone temperature change rate is greater than the zone temperature rise rate threshold, the main controller generates a protection upgrade instruction. When the regenerated local overheating risk state meets the protection release threshold, the main controller generates a protection release instruction.

[0064] When updating the protection level, the main controller writes the current protection level, the regenerated local overheating risk status, subsequent zone temperature data, and protection upgrade or protection deactivation instructions into the protection level update result. When a protection upgrade instruction is generated, the main controller updates the protection level of the corresponding IGBT module from the warning level to the derating protection level, or from the derating protection level to the shutdown protection level. When a protection deactivation instruction is generated, the main controller reduces the protection level of the corresponding IGBT module to the warning level or the normal level, and outputs the corresponding drive control instruction to the drive execution module. When there is an over-range judgment, a temperature jump judgment, or a communication loss judgment in the subsequent zone temperature data, the main controller writes the abnormal zone record into the protection level update result and writes the fault record into the status record module.

[0065] The fault records recorded by the status recording module include module identifier, area identifier, sensor identifier, sampling timestamp, abnormal zone, protection level, collaborative protection command, protection action type, and protection execution feedback data. The protection execution feedback data includes a protection action completion marker, subsequent zone temperature data within the feedback time window, regenerated local overheating risk status, and protection level update results. These fault records are stored in a memory area readable by the main controller and are retrieved as status records for the same IGBT module in subsequent control cycles. When the same module identifier generates protection upgrade commands in multiple consecutive control cycles, the main controller maintains the shutdown protection level of that module and outputs abnormal command information.

[0066] During project implementation, the multi-module thermal deviation judgment data generated by S300 indicates that IGBT module M1 is in the derating protection level, while M2, M3, and M4 are in the normal level. The main controller generates a derating protection command for M1 according to the preset thermal protection rules and sends the switching frequency adjustment field, duty cycle adjustment field, and output power upper limit field of M1 to the drive execution module. The drive execution module selects the drive channel corresponding to M1 and performs drive parameter adjustment. After the protection action is completed, the main controller receives the subsequent zone temperature data of M1 within the feedback time window and recalculates the local overheating risk state of M1. If the zone temperature change rate of M1 is still greater than the zone temperature rise rate threshold, the main controller updates the protection level of M1 to the shutdown protection level and outputs a soft shutdown command to the drive execution module. If the local overheating risk state of M1 meets the protection release threshold, the main controller generates a protection release command and writes the protection level update result into the status recording module. The protection level update result serves as the status input when the preset thermal protection rules are invoked in the next control cycle.

[0067] Example 2: Figure 2 A structural block diagram of a multi-IGBT module zoned temperature measurement and coordinated thermal protection system according to an embodiment of the present invention is shown. Figure 2 As shown, the structure may include:

[0068] The zone temperature recording module 01 is used to receive zone temperature data, module identifiers, area identifiers, and sampling timestamps for each temperature monitoring area; it binds the zone temperature data according to the module identifier and area identifier to generate a module zone temperature record; specifically, the zone temperature recording module receives zone temperature data from each temperature monitoring area and simultaneously receives the module identifier, area identifier, and sampling timestamp corresponding to the zone temperature data; the module identifier corresponds to the IGBT module in the electromagnetic heating furnace, and the area identifier corresponds to the temperature monitoring area within the same IGBT module; the zone temperature recording module establishes a module record position according to the module identifier and writes the zone temperature data into the corresponding area record position according to the area identifier; when the same sampling time... When both the module identifier and the region identifier are matched, the partition temperature data, module identifier, region identifier, and sampling timestamp are encapsulated into a module partition temperature record. When the received partition temperature data lacks a module identifier or region identifier, the partition temperature record module marks the partition temperature data as unbound data and retains the sampling timestamp. When duplicate partition temperature data appear for the same module identifier and the same region identifier at the same sampling timestamp, the latest partition temperature data is retained according to the receiving order of the sampling timestamps, and the replaced partition temperature data is written to the record cache. The module partition temperature record includes the module identifier, region identifier, sampling timestamp, and partition temperature data, and is provided to the thermal state assessment module.

[0069] Thermal state assessment module 02, connected to the partition temperature recording module, is used to calculate the maximum temperature difference within the same IGBT module and the partition temperature change rate within a preset time window based on the partition temperature records of the module, generating a thermal state assessment result including local overheating risk states. Specifically, the thermal state assessment module receives the partition temperature records of the module from the partition temperature recording module, and extracts the partition temperature data corresponding to multiple region identifiers of the same IGBT module within the preset time window according to the module identifier; the thermal state assessment module sorts the partition temperature data under the same sampling timestamp to obtain the highest partition temperature and the lowest partition temperature, and generates the maximum temperature difference within the module based on the highest and lowest partition temperatures; the thermal state assessment module reads the partition temperature data under consecutive sampling timestamps according to the region identifier, and calculates the maximum temperature difference within the module based on the consecutive sampling timestamps. The thermal state assessment module generates the partition temperature change rate by analyzing the difference between the partition temperature data and the sampling timestamp. When there is unbound data or missing sampling timestamps in the module's partition temperature record, the thermal state assessment module does not write this data into the calculation objects for the maximum temperature difference and partition temperature change rate within the module. When the number of valid partition temperature data for the same IGBT module within a preset time window is insufficient, the thermal state assessment module uses the thermal state assessment result of the IGBT module in the previous preset time window and records the status retention mark in the thermal state assessment result. The thermal state assessment module generates a local overheating risk state based on the maximum temperature difference within the module, the partition temperature change rate, and the partition temperature data within the preset time window, and associates the local overheating risk state with the module identifier to form a thermal state assessment result. The thermal state assessment result is transmitted to the thermal deviation determination module.

[0070] The thermal deviation determination module 03, connected to the thermal state assessment module, is used to compare the local overheating risk status between different IGBT modules based on the thermal state assessment results of multiple IGBT modules, and generate multi-module thermal deviation determination data. Specifically, the thermal deviation determination module receives the thermal state assessment results of multiple IGBT modules from the thermal state assessment module, and performs control cycle matching on the thermal state assessment results according to the sampling timestamp. The thermal deviation determination module reads the module identifier, maximum temperature difference within the module, zone temperature change rate, and local overheating risk status from each thermal state assessment result, and compares the local overheating risk status corresponding to different module identifiers. When the thermal state assessment results of different IGBT modules are in the same control cycle, The thermal deviation determination module generates differences in local overheating risk states between modules and associates these differences with corresponding module identifiers. When the thermal status assessment result of a certain IGBT module has a status retention mark, the thermal deviation determination module retains the module identifier and writes it to the pending confirmation state. When the sampling timestamps of multiple IGBT modules do not belong to the same control cycle, the thermal deviation determination module pauses cross-module comparison and waits for the thermal status assessment module to provide thermal status assessment results under the same control cycle. The multi-module thermal deviation determination data includes module identifiers, local overheating risk states, differences in local overheating risk states between modules, and pending confirmation states, and is provided by the thermal deviation determination module to the collaborative protection command module.

[0071] The collaborative protection instruction module 04, connected to the thermal deviation determination module, is used to generate collaborative protection instructions based on the multi-module thermal deviation determination data and preset thermal protection rules. Specifically, the collaborative protection instruction module receives multi-module thermal deviation determination data from the thermal deviation determination module and calls preset thermal protection rules corresponding to the operating status of the electromagnetic heating boiler. The preset thermal protection rules include the correspondence between local overheating risk status and protection level, and the correspondence between protection level and drive parameter adjustment type. The collaborative protection instruction module reads the local overheating risk status and the difference in local overheating risk status between modules in the multi-module thermal deviation determination data according to the module identifier, and compares the reading results with the preset thermal protection rules. The system performs line matching; when the local overheating risk state of a single IGBT module is higher than that of other IGBT modules, the collaborative protection instruction module generates a collaborative protection instruction for that IGBT module; when the local overheating risk states of multiple IGBT modules simultaneously match the same protection level, the collaborative protection instruction module generates collaborative protection instructions for multiple module identifiers; when there is a pending confirmation state in the thermal deviation judgment data of multiple modules, the collaborative protection instruction module retains the collaborative protection instruction for the corresponding module identifier of the previous control cycle and writes a pending confirmation mark into the current collaborative protection instruction; the collaborative protection instruction includes module identifier, protection level, drive parameter adjustment type and protection action type, and is output to the drive execution and feedback update module.

[0072] The drive execution and feedback update module 05, connected to the collaborative protection instruction module, is used to receive the collaborative protection instruction and adjust the drive parameters of the corresponding IGBT module or trigger a protection action; after the protection action is executed, the protection level is updated based on subsequent zone temperature data. Specifically, the drive execution and feedback update module receives the collaborative protection instruction from the collaborative protection instruction module and selects the corresponding IGBT module according to the module identifier in the collaborative protection instruction; the drive execution and feedback update module reads the protection level, drive parameter adjustment type, and protection action type in the collaborative protection instruction, and adjusts the drive parameters of the corresponding IGBT module, the drive parameters including switching frequency, duty cycle, output power limit, and drive enable state; when the collaborative protection instruction contains a protection action type, the drive execution and feedback update module triggers drive pause or soft shutdown and records the protection action execution status; after the protection action is executed, the drive execution and feedback update module receives subsequent zone temperature data and associates the subsequent zone temperature data with the corresponding module identifier and zone identifier; The drive execution and feedback update module reads the current local overheating risk status based on subsequent zone temperature data and compares the current local overheating risk status with the local overheating risk status before the protection action was executed. When the current local overheating risk status has not decreased, the drive execution and feedback update module updates the protection level and generates a protection level update result. When the current local overheating risk status meets the protection release threshold, the drive execution and feedback update module generates a protection release status and provides the protection level update result to the collaborative protection instruction module as the rule matching input for the next control cycle. The drive execution and feedback update module records the collaborative protection instruction, protection action execution status, subsequent zone temperature data, and protection level update result, and maintains the association between the above records and the module identifier, area identifier, and sampling timestamp.

Claims

1. A method for multi-IGBT module zoned temperature measurement and coordinated thermal protection control, characterized in that, include: S100: Receives zone temperature data, module identifier, zone identifier, and sampling timestamp for each temperature monitoring area; Bind the partition temperature data according to the module identifier and region identifier to generate module partition temperature records; S200. Based on the temperature records of the module sections, calculate the maximum temperature difference and the temperature change rate of the sections within the same IGBT module within a preset time window, and generate a thermal state assessment result that includes the risk of local overheating. S300: Based on the thermal status assessment results of multiple IGBT modules, compare the local overheating risk status between different IGBT modules and generate multi-module thermal deviation judgment data. S400: Based on the multi-module thermal deviation judgment data and preset thermal protection rules, generate a collaborative protection command and output it to the drive execution module; After the drive execution module performs the protection action, the protection level is updated based on subsequent zone temperature data.

2. The method according to claim 1, characterized in that, The multiple temperature monitoring areas include two or more areas in the chip adjacent area, the heat dissipation substrate area, the key area of ​​the heat sink, and the power terminal area; temperature sensors are respectively installed in the chip adjacent area, the heat dissipation substrate area, the key area of ​​the heat sink, and the power terminal area.

3. The method according to claim 1, characterized in that, The module-level temperature record includes module identifier, region identifier, sensor identifier, sampling timestamp, and zone temperature value; the module-level temperature record generates a zone temperature matrix according to the module identifier and region identifier.

4. The method according to claim 1, characterized in that, Before generating thermal state assessment results based on the temperature records of the module partitions, the validity of the partition temperature data is verified. The validity verification includes over-range determination, temperature jump determination, and communication loss determination. Areas that meet the over-range determination, temperature jump determination, or communication loss determination are marked as abnormal partitions, and the partition temperature data corresponding to the abnormal partitions are removed from the temperature calculation objects of the thermal state assessment results.

5. The method according to claim 1, characterized in that, The maximum temperature difference within the module is the difference between the highest and lowest zone temperatures of the same IGBT module within a preset time window; the zone temperature change rate is the ratio of the difference in zone temperature values ​​under continuous sampling timestamps to the difference in sampling time for the same temperature monitoring area.

6. The method according to claim 1, characterized in that, Generate thermal state assessment results that include local overheating risk states, including: obtaining the highest zone temperature, average zone temperature, maximum temperature difference within the module, and zone temperature change rate of the same IGBT module within a preset time window; and mapping the highest zone temperature, average zone temperature, maximum temperature difference within the module, and zone temperature change rate to normal level, warning level, derating protection level, or shutdown protection level according to the protection level mapping rules.

7. The method according to claim 1, characterized in that, Generating multi-module thermal deviation judgment data includes: comparing the local overheating risk status between different IGBT modules; calculating the highest zone temperature difference, average zone temperature difference, and maximum temperature difference within the module between different IGBT modules; and associating the local overheating risk status, the highest zone temperature difference, the average zone temperature difference, and the maximum temperature difference within the module with the corresponding module identifier to generate the multi-module thermal deviation judgment data.

8. The method according to claim 1, characterized in that, Based on the multi-module thermal deviation judgment data and preset thermal protection rules, a collaborative protection command is generated, including: when the local overheating risk state of a single IGBT module is higher than that of other IGBT modules, a derating protection command is generated for that IGBT module; when multiple IGBT modules reach the same preset thermal state level, a gradient power reduction command for the entire machine is generated; when the inter-module thermal deviation data is greater than the inter-module temperature difference threshold, an output power limiting command is generated for the IGBT module with the higher temperature.

9. The method according to claim 1, characterized in that, The driving parameters corresponding to the collaborative protection command include any one or a combination of the following: switching frequency, duty cycle, upper limit of output power, and drive enable state; within the feedback time window, the local overheating risk state is regenerated based on subsequent partition temperature data; when the regenerated local overheating risk state does not decrease, or the partition temperature change rate is greater than the partition temperature rise rate threshold, a protection upgrade command is generated; when the regenerated local overheating risk state meets the protection release threshold, a protection release command is generated.

10. A multi-IGBT module zoned temperature measurement and coordinated thermal protection system, characterized in that, include: The module includes a zone temperature recording module, a thermal status assessment module, a thermal deviation determination module, a collaborative protection command module, and a drive execution and feedback update module. The system is used to implement the method described in any one of claims 1-9.

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