Tabless interconnect board

Abstract

An interconnect board for an electrical system of a vehicle includes: a busbar encapsulated between and within a top laminate and a bottom laminate; a flexible circuit attached to a top surface of the top laminate and including: a flexible circuit copper trace positioned to contact the top laminate of the busbar; a flexible circuit overlay positioned on the top laminate of the busbar and extending to cover a first portion of the top surface of the flexible circuit copper trace, the busbar, the top laminate, the bottom laminate, and the flexible copper trace defining a cylindrical aperture through the interconnect board; and a copper coating extending to cover a second portion of the top surface of the flexible circuit copper trace, extending to cover the inner diameter of the cylindrical aperture and electrically interconnecting the busbar to the flexible circuit copper trace.

Description

Technical Field

[0001] This disclosure relates to an interconnecting board for connecting electrical buses to electrical systems within a vehicle. Background Technology

[0002] Conventional sensing circuits made of rigid or flexible printed circuit boards (PCBs) use contacts made of copper or nickel to connect to the busbar. This intermediate contact connection uses solder joints to attach the contact to the sensing circuit at one end and laser or ultrasonic welding to connect the contact to the busbar at the other end. These contacts inevitably increase the resistance of the sensing circuit and create an additional voltage drop across the battery. Furthermore, sensing circuits made with contact contacts and conventional techniques require complex manufacturing processes.

[0003] Therefore, while current systems and methods achieve their intended purpose, there is a need for an interconnect board that includes direct connections from flexible circuit copper traces to electrical buses via copper coating, applies copper plating between the sensing circuit and the electrical bus, and interconnects the sensing circuit to the electrical bus without utilizing sensing tabs, solder joints, or laser welding. Furthermore, there is a need for a sensing circuit that can be manufactured using vertically integrated manufacturing processes. Summary of the Invention

[0004] According to several aspects of this disclosure, an interconnect board for an electrical system of a vehicle includes: a busbar encapsulated between and within a top laminate and a bottom laminate; a flexible circuit attached to the top surface of the top laminate of the busbar and including flexible circuit copper traces positioned to contact the top laminate of the busbar; a flexible circuit cover layer positioned on the top laminate of the busbar and extending to cover a first portion of the top surface of the flexible circuit copper traces, the busbar, the top laminate, the bottom laminate, and the flexible circuit copper traces defining a cylindrical aperture through the interconnect board; and a copper coating extending to cover a second portion of the top surface of the flexible circuit copper traces, extending to cover the inner diameter of the cylindrical aperture, and electrically interconnecting the busbar to the flexible circuit copper traces.

[0005] According to another aspect, the interconnect board further includes: an adhesive bond between the busbar and the top laminate, which mechanically bonds the top laminate to the top surface of the busbar; an adhesive bond between the busbar and the bottom laminate, which mechanically bonds the bottom laminate to the bottom surface of the busbar; an adhesive bond between the top laminate of the busbar and the flexible circuit, which mechanically bonds the flexible circuit to the top surface of the top laminate; and an adhesive bond between the top surface of a first portion of the flexible circuit copper trace and the flexible circuit cover layer, which mechanically bonds the top surface of the first portion of the flexible circuit copper trace to the flexible circuit cover layer.

[0006] According to another aspect, the inner diameter of the cylindrical hole is also defined by a first inner diameter and a second inner diameter, the first inner diameter is defined by a busbar and flexible circuit copper traces, and the second inner diameter is defined by a top laminate and a bottom laminate, wherein the first inner diameter is smaller than the second inner diameter, and wherein the flexible circuit copper traces and busbars extend into the cylindrical hole beyond the second inner diameter defined by the top laminate and the bottom laminate.

[0007] According to another aspect, the busbar is punched from a rolled aluminum sheet, and the top and bottom laminates are simultaneously laminated to the top and bottom surfaces of the busbar through roll-to-roll lamination.

[0008] According to another aspect, the busbar is formed and pressed from a rolled aluminum plate, and the top laminate and the bottom laminate are simultaneously laminated to the top and bottom surfaces of the busbar by hot pressing.

[0009] According to another aspect, the copper traces of the flexible circuit are punched from a copper-aluminum composite material roll and laminated onto the flexible circuit cover layer to form a flexible circuit.

[0010] According to another aspect, the flexible circuit is roll-bonded to the top surface of the top laminate of the busbar.

[0011] According to another aspect, the flexible circuit is heat-pressed onto the top surface of the top laminate of the busbar.

[0012] According to another method, after the flexible circuit is positioned on the top surface of the top laminate of the busbar, cylindrical holes are formed in the copper traces of the flexible circuit and the busbar, and a copper coating is applied to the interconnect board by electroless copper plating.

[0013] According to several aspects of this disclosure, a method of forming an interconnect board for an electrical system of a vehicle includes: encapsulating a busbar between and within a top laminate and a bottom laminate; forming a flexible circuit including flexible circuit copper traces and a flexible circuit cover layer; attaching the flexible circuit to a top surface of the top laminate of the busbar, wherein: the flexible circuit copper traces are positioned to contact the top laminate of the busbar; and the flexible circuit cover layer is positioned on the top laminate of the busbar and extends to cover a first portion of the top surface of the flexible circuit copper traces; forming a cylindrical hole through the interconnect board; and applying a copper coating on a second portion of the top surface of the flexible circuit copper traces and on the inner diameter of the cylindrical hole, and electrically interconnecting the busbar to the flexible circuit copper traces.

[0014] According to another aspect, encapsulating the busbar between and within the top laminate and the bottom laminate further includes: applying an adhesive bond between the busbar and the top laminate and mechanically bonding the top laminate to the top surface of the busbar, and applying an adhesive bond between the busbar and the bottom laminate and mechanically bonding the bottom laminate to the bottom surface of the busbar; forming a flexible circuit including flexible circuit copper traces and a flexible circuit cover layer further includes: applying an adhesive bond between the top surface of a first portion of the flexible circuit copper traces and the flexible circuit cover layer and mechanically bonding the top surface of the first portion of the flexible circuit copper traces to the flexible circuit cover layer; and attaching the flexible circuit to the top surface of the top laminate of the busbar further includes: applying an adhesive bond between the top laminate of the busbar and the flexible circuit and mechanically bonding the flexible circuit to the top surface of the top laminate.

[0015] According to another aspect, forming a cylindrical hole through the interconnect board further includes: a first inner diameter of the cylindrical hole defined by a busbar and flexible circuit copper traces; and a second inner diameter of the cylindrical hole defined by a top laminate and a bottom laminate of the busbar, the second inner diameter of the cylindrical hole being larger than the first inner diameter of the cylindrical hole, wherein the flexible circuit copper traces and the busbar extend into the cylindrical hole beyond the second inner diameter defined by the top laminate and the bottom laminate.

[0016] According to another aspect, encapsulating the busbar between and within the top laminate and the bottom laminate also includes: punching the busbar from a rolled sheet of aluminum material, and simultaneously laminating the top laminate onto the top surface of the busbar and the bottom laminate onto the bottom surface of the busbar by roll-to-roll lamination.

[0017] According to another aspect, encapsulating the busbar between and within the top and bottom laminates further includes: forming and pressing the busbar from a rolled sheet of aluminum material, and simultaneously laminating the top laminate onto the top surface of the busbar and the bottom laminate onto the bottom surface of the busbar by hot pressing.

[0018] According to another aspect, forming a flexible circuit also includes: punching the flexible circuit copper traces from a copper-aluminum composite material roll, and laminating the flexible circuit copper traces onto the flexible circuit cover layer.

[0019] According to another aspect, attaching the flexible circuit to the top surface of the top laminate of the busbar also includes: roll-bonding the flexible circuit to the top surface of the top laminate of the busbar.

[0020] According to another aspect, attaching the flexible circuit to the top surface of the top laminate of the busbar also includes: laminating the flexible circuit to the top surface of the top laminate of the busbar by hot pressing.

[0021] According to another aspect, applying a copper coating to a second portion of the top surface of the flexible circuit copper trace and to the inner diameter of the cylindrical hole and electrically interconnecting the busbar to the flexible circuit copper trace further includes: applying the copper coating by chemical copper plating.

[0022] According to another aspect, encapsulating the busbar between and within the top and bottom laminates further includes one of the following: punching or forming the busbar from a rolled aluminum sheet; applying an adhesive bond between the busbar and the top laminate; applying an adhesive bond between the busbar and the bottom laminate; and simultaneously laminating the top laminate onto the top surface of the busbar and the bottom laminate onto the bottom surface of the busbar by roll-to-roll lamination or hot pressing; mechanically bonding the top laminate to the top surface of the busbar and the bottom laminate to the bottom surface of the busbar; forming a flexible circuit including flexible circuit copper traces and a flexible circuit cover layer further includes: punching the flexible circuit copper traces from a copper-aluminum composite material roll; applying an adhesive bond between the top surface of a first portion of the flexible circuit copper traces and the flexible circuit cover layer; and laminating the flexible circuit copper traces onto the flexible circuit cover layer; and bonding the top surface of the first portion of the flexible circuit copper traces to the flexible circuit cover layer. Mechanically bonding to a flexible circuit overlay; attaching the flexible circuit to the top surface of the top laminate of the busbar further includes: applying an adhesive bond between the top laminate of the busbar and the flexible circuit, roll-bonding or hot-pressing the flexible circuit to the top surface of the top laminate of the busbar, and mechanically bonding the flexible circuit to the top surface of the top laminate; forming a cylindrical hole through the interconnect further includes: defining a first inner diameter of the cylindrical hole by the busbar and the flexible copper trace, and defining a second inner diameter of the cylindrical hole by the top laminate and the bottom laminate of the busbar, the second inner diameter of the cylindrical hole being larger than the first inner diameter of the cylindrical hole, wherein the flexible circuit copper trace and the busbar extend into the cylindrical hole beyond the second inner diameter defined by the top laminate and the bottom laminate; and applying a copper coating on a second portion of the top surface of the flexible circuit copper trace and on the inner diameter of the cylindrical hole, and electrically interconnecting the busbar to the flexible circuit copper trace further includes: applying the copper coating by chemical copper plating.

[0023] Further applicability will become apparent from the description provided herein. It should be understood that the specification and specific examples are for illustrative purposes only and are not intended to limit the scope of this disclosure. Attached Figure Description

[0024] The accompanying drawings described herein are for illustrative purposes only and are not intended to limit the scope of this disclosure in any way.

[0025] Figure 1 This is a top view schematic diagram of a car equipped with an electrical system having interconnecting boards, according to exemplary embodiments of the present disclosure;

[0026] Figure 2 yes Figure 1 A schematic diagram of the vehicle's electrical system is shown.

[0027] Figure 3 yes Figure 2 A top view of the interconnecting board of the electrical system shown;

[0028] Figure 4 It is along Figure 3 The middle is marked as " Figure 4 – Figure 4 The cross-sectional view of the interconnect board taken by the line "".

[0029] Figure 5A yes Figure 4 An enlarged side view of the cross-section;

[0030] Figure 5B yes Figure 5A A side view magnified view, showing the first and second portions of the top surface of the flexible circuit copper trace;

[0031] Figure 6 This is a schematic diagram of the top and bottom laminates applied to the busbar through roll-to-roll lamination.

[0032] Figure 7 This is a schematic diagram of the top and bottom laminates applied to the busbar by hot pressing.

[0033] Figure 8 This is a schematic diagram of the flexible circuit copper traces laminated onto the flexible circuit cover layer;

[0034] Figure 9 This is a schematic diagram of applying flexible circuitry to the top laminate of the busbar via roll bonding.

[0035] Figure 10 This is a schematic diagram of applying a flexible circuit onto the top laminate of the busbar via hot pressing.

[0036] Figure 11 yes Figure 5B The amplified portion, such as by Figure 5B Circle it in the middle and mark it as " Figure 11 The part shown is ""; and

[0037] Figure 12 This is a schematic flowchart illustrating a method according to an exemplary embodiment of the present disclosure.

[0038] The accompanying drawings are not necessarily drawn to scale, and some features may be enlarged or reduced to show, for example, details of specific components. In some cases, well-known components, systems, materials, or methods have not been described in detail to avoid obscuring this disclosure. Therefore, the specific structural and functional details disclosed herein should not be construed as limiting, but only as the basis for the claims and as a representative basis for teaching those skilled in the art to use this disclosure in various ways. Detailed Implementation

[0039] The following description is merely exemplary in nature and is not intended to limit this disclosure, its application, or its uses. Furthermore, it is not intended to be bound by any express or implied theory presented in the foregoing technical field, background art, summary of the invention, or the following detailed description. It should be understood that in all the figures, corresponding reference numerals denote the same or corresponding parts and features. As used herein, the term "module" individually or in any combination refers to any hardware, software, firmware, electronic control components, processing logic, and / or processor device, including but not limited to: application-specific integrated circuits (ASICs), electronic circuits, processors (shared, dedicated, or grouped) and memories executing one or more software or firmware programs, combinational logic circuits, and / or other suitable components providing the said functionality. Although the figures shown herein depict examples with certain element arrangements, additional intermediate elements, devices, features, or components may be present in actual embodiments. It should also be understood that the figures are merely illustrative and may not be drawn to scale.

[0040] As used herein, the term "vehicle" is not limited to automobiles. Although this technology is primarily described in connection with automobiles, it is not limited to automobiles. The concept can be used in a variety of applications, such as in conjunction with aircraft, ships, other vehicles, and consumer electronics components.

[0041] Exemplary embodiments are provided to make this disclosure thorough and to fully convey the scope to those skilled in the art. Numerous specific details, such as examples of specific compositions, components, apparatuses, and methods, are set forth to provide a thorough understanding of embodiments of this disclosure. It will be apparent to those skilled in the art that specific details are not required, that the exemplary embodiments may be implemented in many different forms, and none of them should be construed as limiting the scope of this disclosure. In some exemplary embodiments, well-known processes, well-known apparatus structures, and well-known techniques are not described in detail.

[0042] The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” may also be intended to include the plural forms unless the context clearly indicates otherwise. The terms “comprising,” “including,” “containing,” and “having” are inclusive and thus specify the presence of the stated features, elements, compositions, steps, integrals, operations, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. While the open-ended term “comprising” should be understood as a non-limiting term used to describe and claim the various embodiments described herein, in some respects it may be understood alternatively as a more restrictive and binding term, such as “consisting of” or “substantially consisting of,” and thus, for any given embodiment describing compositions, materials, components, elements, features, integrals, operations, and / or process steps, this disclosure also specifically includes embodiments consisting of or substantially consisting of those described compositions, materials, components, elements, features, integrals, operations, and / or process steps. In the case of “consisting of…”, the alternative embodiments exclude any additional compositions, materials, parts, elements, features, integrals, operations and / or process steps, while in the case of “consisting substantially of…”, any additional compositions, materials, parts, elements, features, integrals, operations and / or process steps that substantially affect the basic and novel characteristics are excluded from this embodiment, but any compositions, materials, parts, elements, features, integrals, operations and / or process steps that do not substantially affect the basic and novel characteristics may be included in the embodiments.

[0043] Unless explicitly specified as the order of execution, no method steps, procedures, and operations described herein should be construed as requiring them to be performed in the particular order shown or illustrated. It should also be understood that, unless otherwise indicated, additional or alternative steps may be employed.

[0044] When a component, element, or layer is referred to as “on another component or layer,” “joined to another component or layer,” “connected to another component or layer,” or “attached to another component or layer,” it may be directly on, directly joined to, directly connected to, or directly coupled to another component, element, or layer, or there may be intermediate components or layers present. Conversely, when an element is referred to as “directly on another component or layer,” “directly joined to another component or layer,” “directly connected to,” or “directly coupled to another component or layer,” there may be no intermediate components or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0045] Although the terms first, second, third, etc., may be used herein to describe various steps, elements, components, regions, layers, and / or portions, these steps, elements, components, regions, layers, and / or portions should not be limited by these terms unless otherwise indicated. These terms are used only to distinguish one step, element, component, region, layer, or portion from another. Unless the context clearly indicates otherwise, terms such as “first,” “second,” and other numerical terms, when used herein, do not imply order or sequence. Therefore, the first step, element, component, region, layer, or portion discussed below may be referred to as the second step, element, component, region, layer, or portion without departing from the teachings of the exemplary embodiments.

[0046] For ease of description, spatial or temporal relative terms (e.g., "before," "after," "inside," "outside," "below," "below," "lower," "above," "upper," etc.) may be used herein to describe the relationship of an element or feature to another element or feature shown in the figures. Spatial or temporal relative terms may be intended to include different orientations of the apparatus or system in use or operation other than those shown in the figures.

[0047] In this disclosure, numerical values ​​represent approximate measurements or limitations on ranges to cover minor deviations from a given value, as well as embodiments having approximately the stated value and embodiments having the precise stated value. Except for the working examples provided at the end of the detailed description, all numerical values ​​of parameters (e.g., quantities or conditions) in this specification (including the appended claims) should in all cases be understood to be modified by the term “approximately,” regardless of whether “approximately” actually precedes the numerical value. “Approximately” indicates that the numerical value allows for some slight inaccuracy (numerically approximately precise; roughly or reasonably close to the value; nearly). If the inaccuracy provided by “approximately” cannot be understood in this common sense in the art, then “approximately” as used herein at least indicates a variation that may be caused by common methods of measuring and using these parameters. For example, “approximately” relating to percentages includes a variation of ±5%, “approximately” relating to temperature includes a variation of ±5 degrees, and “approximately” relating to distance includes ±10%. Furthermore, the disclosure of ranges includes the disclosure of all values ​​throughout the range and further subdivisions of the range, including the endpoints and sub-ranges of the range.

[0048] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. According to exemplary embodiments, Figure 1 A vehicle 10 with an associated electrical system 50 according to various embodiments is shown, the electrical system including an interconnecting board 52 adapted to connect a busbar 54 to electrical subsystems 56a-56n within the electrical system 50. The vehicle 10 generally includes a chassis 12, a body 14, front wheels 16, and rear wheels 18. The body 14 is disposed on the chassis 12 and substantially surrounds the components of the vehicle 10. The body 14 and the chassis 12 may together form a frame. The front wheels 16 and the rear wheels 18 are each rotatably coupled to the chassis 12 near a respective corner of the body 14.

[0049] In various embodiments, vehicle 10 is an autonomous vehicle, and electrical system 50 and interconnect board 52 are incorporated into autonomous vehicle 10. Autonomous vehicle 10 is, for example, a vehicle 10 automatically controlled to transport passengers from one location to another. In the illustrated embodiment, vehicle 10 is described as a passenger car, but it should be understood that any other vehicle, including motorcycles, trucks, sports utility vehicles (SUVs), recreational vehicles (RVs), etc., may also be used. In exemplary embodiments, vehicle 10 is equipped with a so-called Level 4 or Level 5 automation system. Level 4 system means "high automation," referring to the driving mode-specific performance of an autonomous driving system for all aspects of a dynamic driving task, even if the human driver does not respond appropriately to intervention requests. Level 5 system means "fully automated," referring to the full-time execution of an autonomous driving system for all aspects of a dynamic driving task under all road and environmental conditions that can be managed by a human driver.

[0050] As shown in the figure, vehicle 10 generally includes a propulsion system 20, a transmission system 22, a steering system 24, a braking system 26, a sensor system 28, an actuator system 30, at least one data storage device 32, a vehicle controller 34, and a communication system 36. In embodiments where vehicle 10 is an electric vehicle, the transmission system 22 may be absent. In various embodiments, the propulsion system may include an internal combustion engine, an electric motor such as a traction motor, and / or a fuel cell propulsion system. The transmission system 22 is configured to transmit power from the propulsion system 20 to the front wheels 16 and rear wheels 18 of the vehicle according to a selectable speed ratio. According to various embodiments, the transmission system 22 may include a stepped automatic transmission, a continuously variable transmission (CVT), or other suitable transmission. The braking system 26 is configured to provide braking torque to the front wheels 16 and rear wheels 18 of the vehicle. In various embodiments, the braking system 26 may include friction brakes, brake-by-wire brakes, a regenerative braking system such as an electric motor, and / or other suitable braking systems. The steering system 24 influences the position of the front wheels 16 and rear wheels 18. Although depicted as including a steering wheel for illustrative purposes, in some embodiments contemplated within the scope of this disclosure, the steering system 24 may not include a steering wheel.

[0051] Sensor system 28 includes one or more sensing devices 40a-40n that sense observable conditions of the external and / or internal environment of the autonomous vehicle 10. Sensing devices 40a-40n may include, but are not limited to, radar, lidar, global positioning system, optical camera, thermal camera, ultrasonic sensor, and / or other sensors. In an exemplary embodiment, the plurality of sensing devices 40a-40n includes at least one of a motor speed sensor, a motor torque sensor, an electric drive motor voltage and / or current sensor, an accelerator pedal position sensor, a coolant temperature sensor, a cooling fan speed sensor, a transmission oil temperature sensor, and a sensor suitable for measuring lateral and longitudinal acceleration. In another exemplary embodiment, the plurality of sensing devices 40a-40n also includes sensors to determine information about the environment surrounding the vehicle 10, such as an ambient air temperature sensor, an atmospheric pressure sensor, and / or a photographic and / or video camera positioned to observe the environment in front of the vehicle 10. Actuator system 30 includes one or more actuator devices 42a-42n that control one or more features of the vehicle 10, such as, but not limited to, a propulsion system 20, a transmission system 22, a steering system 24, and a braking system 26.

[0052] The vehicle controller 34 includes at least one processor 44 and a computer-readable storage device or medium 46. The at least one data processor 44 can be any custom or commercially available processor, central processing unit (CPU), graphics processing unit (GPU), an auxiliary processor among several processors associated with the vehicle controller 34, a semiconductor-based microprocessor (in the form of a microchip or chipset), a macroprocessor, any combination thereof, or any means generally used for executing instructions. The computer-readable storage device or medium 46 can include, for example, volatile and non-volatile memory in the form of read-only memory (ROM), random access memory (RAM), and keep-alive memory (KAM). KAM is persistent or non-volatile memory that can be used to store various operational variables when the at least one data processor 44 is powered off. The computer-readable storage device or medium 46 can be implemented using any of a variety of known memory devices, such as PROM (programmable read-only memory), EPROM (electrical PROM), EEPROM (electrically erasable PROM), flash memory, or any other electrical, magnetic, optical, or combined memory device capable of storing data, some of which represents executable instructions used by the vehicle controller 34 in controlling the vehicle 10.

[0053] The instructions may include one or more separate programs, each including an ordered list of executable instructions for implementing logical functions. When executed by at least one processor 44, the instructions receive and process signals from the sensor system 28, execute logic, calculations, methods, and / or algorithms for automatically controlling components of the vehicle 10, and generate control signals to the actuator system 30 based on the logic, calculations, methods, and / or algorithms to automatically control components of the vehicle 10. Figure 1 Only one vehicle controller 34 is shown, but embodiments of vehicle 10 may include any number of controllers 34 that communicate via any suitable communication medium or combination of communication media and cooperate to process sensor signals, perform logic, calculations, methods and / or algorithms, and generate control signals to automatically control the features of autonomous vehicle 10.

[0054] Communication system 36 is configured to wirelessly transmit information to and from other remote entities 48, such as, but not limited to, other vehicles (“V2V” communication), infrastructure (“V2I” communication), remote systems, remote servers, cloud computers, and / or personal devices. In an exemplary embodiment, communication system 36 is a wireless communication system configured to communicate using the IEEE 802.11 standard or via a wireless local area network (WLAN) using cellular data communication. However, additional or alternative communication methods, such as Dedicated Short Range Communication (DSRC) channels, are also considered within the scope of this disclosure. A DSRC channel refers to a one-way or two-way short-to-medium range wireless communication channel specifically designed for automotive use and a corresponding set of protocols and standards.

[0055] The vehicle controller 34 is a non-general-purpose electronic control device that includes a pre-programmed digital computer or processor, memory or non-transient computer-readable medium for storing data such as control logic, software applications, instructions, computer code, data, lookup tables, etc., and a transceiver (or input / output port). Computer-readable medium includes any type of media accessible by a computer, such as read-only memory (ROM), random access memory (RAM), hard disk drive, optical disc (CD), digital video disc (DVD), or any other type of memory. "Non-transient" computer-readable medium excludes wired, wireless, optical, or other communication links that transmit transient electrical signals or other signals. Non-transient computer-readable medium includes media in which data can be permanently stored and media in which data can be stored and later rewritten, such as rewritable optical discs or erasable memory devices. Computer code includes any type of program code, including source code, object code, and executable code.

[0056] Reference Figure 2 The electrical system 50 consists of wiring harnesses and electrical components. The primary function of the electrical system 50 is to generate, store, and distribute voltage to all electrical components and electrical subsystems 56a-56n within the vehicle 10. The electrical system 50 comprises numerous different components, including a battery 58, an alternator, a starter motor, and various sensors, actuators, motors, instruments, power windows, a radio, headlights, a sunroof, and many other electrical subsystems 56a-56n. As an example, electrical subsystems 56a-56n may include an ignition system 56a, a charging system 56b, a starting system 56c, a fuel system 56d, a lighting system 56e, etc.

[0057] Battery 58 is the primary power source in electrical system 50, supplying current to all electrical components and electrical subsystems 56a-56n when propulsion system 20 (engine) is off. When propulsion system 20 is running, all electrical components receive energy from an alternator or starter / generator. The alternator generates a higher current than battery 58, thus simultaneously charging battery 58 and supplying current to all other needs of vehicle 10 when propulsion system 20 is running. All these components work together to ensure the proper functioning of electrical system 50.

[0058] In an exemplary embodiment, the wiring harness includes or is replaced by a busbar 54. The busbar 54 is a conductive strip or bar used to efficiently distribute electrical power across multiple circuits in the vehicle 9. It is designed to be compact and reliable, ensuring an uninterrupted power flow to critical automotive systems. The busbar 54 is typically made of highly conductive materials such as copper or aluminum and is often coated or laminated to provide insulation and resistance to environmental factors such as moisture and corrosion. Unlike conventional wiring harnesses, which can become complex and bulky, the busbar 54 provides a simplified and systematic approach to managing electrical connections. The busbar 54 is designed to be adapted to the specific needs of the electrical system 50 based on factors such as flexibility, current capacity, and environmental conditions. The busbar 54 can be solid, wherein it is made of a single sheet of conductive material, typically copper or aluminum or a copper / aluminum alloy. The busbar 54 can be laminated, wherein it consists of multiple conductive layers separated by insulation. Busbar 54 can be flexible, wherein busbar 54 uses a thin layer of conductive material to allow flexibility to accommodate vibration and movement and reduce the risk of connection failure.

[0059] Busbar 54 can be made of a variety of different materials, such as copper, which provides high conductivity, excellent heat dissipation and durability, as non-limiting examples; aluminum, which is lightweight, low cost and corrosion resistant; silver-plated copper, which combines the conductivity of copper and the corrosion resistance of silver; and composite materials, such as carbon-reinforced polymers, which are being developed due to their lightweight and sustainable properties.

[0060] Interconnect board 52 is adapted to connect bus 54 to flexible circuit 60, which is adapted to direct voltage to electrical subsystems 56a-56n. (Refer to...) Figure 3 , Figure 4 , Figure 5A and Figure 5B The interconnect board 52 includes a busbar 54 encapsulated between and within the top laminate 62 and the bottom laminate 64.

[0061] Reference Figure 6 In an exemplary embodiment, the busbar 54 is punched from a rolled sheet of aluminum material 66 by a punching roll 128, and a top laminate 62 and a bottom laminate 64 are simultaneously laminated onto the top surface 68 and bottom surface 70 of the busbar 54 by roll-to-roll lamination. Roll-to-roll lamination is a continuous manufacturing process involving bonding flexible material layers using adhesives, heat, or pressure. Figure 6As shown, a first material roll 72 for the top laminate 62 and a second material roll 74 for the bottom laminate 64 are supported above and below the aluminum profile 66. A punched busbar 54 is fed between the first material roll 72 and the second material roll 74, as indicated by arrow 76. The first material roll 72 rotates as indicated by arrow 72A, and material from the first material roll 72 is applied to the top surface 68 of the busbar 54. The second material roll 74 rotates as indicated by arrow 74A, and material from the second material roll 74 is applied to the bottom surface 70 of the busbar 54. The materials from the first material roll 72 and the second material roll 74 are laminated using adhesives, heat, or pressure to encapsulate the busbar 54 between the top laminate 62 and the bottom laminate 64.

[0062] Reference Figure 7 In another exemplary embodiment, the busbar 54 is formed by forming and pressing a rolled sheet of aluminum 66. A top laminate 62 and a bottom laminate 64 are simultaneously laminated onto the top surface 68 and bottom surface 70 of the busbar 54 by hot pressing. Forming and pressing is the process of placing material (aluminum sheet 66) between two plates or molds 78 and applying pressure, as indicated by arrow 80, to force the aluminum sheet 66 into the desired shape. After the busbar 54 has been formed and pressed, it is fed into a hot press 82, as indicated by arrow 84. Hot pressing is the process of using the machine 82 to hold the material for the top laminate 62 against the top surface 68 of the busbar 54 and the material for the bottom laminate 64 against the bottom surface 70 of the busbar 54 for a period of time under pressure, as indicated by arrow 85, and at elevated temperature.

[0063] In another exemplary embodiment, the interconnect 52 includes an adhesive bond 86A between the top surface 68 of the busbar 54 and the top laminate 62, and an adhesive bond 86B between the bottom surface 70 of the busbar 54 and the bottom laminate 64. The adhesive bonds 86A and 86B are adapted to mechanically bond the top laminate 62 to the top surface 68 of the busbar 54 and to the bottom laminate 64 to the bottom surface 70 of the busbar 54.

[0064] Adhesive bonds 86A, 86B may be adhesives placed between the top laminate 62 and the top surface 68 of the busbar 54 and between the bottom laminate 64 and the bottom surface 70 of the busbar 54 before or during the lamination process, wherein one or more of time, heat, and pressure cure the adhesive to form a mechanical bond between the top laminate 62 and the top surface 68 of the busbar 54 and between the bottom laminate 64 and the bottom surface 70 of the busbar 54. Alternatively, adhesive bonds 86A, 86B may include mechanical bonds formed between the top laminate 62 and the top surface 68 of the busbar 54 and between the bottom laminate 64 and the bottom surface 70 of the busbar 54 during roll-to-roll lamination or hot pressing of the top and bottom laminates 62, 64 onto the busbar 54.

[0065] The flexible circuit 60 is attached to the top surface 62A of the top laminate 62 of the bus 54. The flexible circuit 60 includes a flexible circuit copper trace 88 positioned in contact with the top laminate 62 of the bus 54, and a flexible circuit cover layer 90 positioned on the top laminate 62 of the bus 54 and extending to cover a first portion 88A of the top surface 88T of the flexible circuit copper trace 88.

[0066] Reference Figure 8 In an exemplary embodiment, the flexible circuit copper trace 88 is punched from a coil of copper-aluminum composite sheet 92. The copper-aluminum composite sheet 92 is pulled from the coil and fed to a punching roller 94, as shown by arrow 96, which rotates as shown by arrow 98, shaping the flexible circuit copper trace 88. After the shape of the flexible circuit copper trace 88 is formed, the flexible circuit copper trace 88 is laminated onto a flexible circuit cover layer 90 to form a flexible circuit 60. As the flexible circuit copper trace moves as shown by arrow 104, the flexible circuit cover layer 90 is pulled from a coil of flexible circuit cover layer material 100 that is rotating as shown by arrow 102.

[0067] In another exemplary embodiment, the interconnect 52 includes an adhesive bond 86C between the top surface 88T of a first portion 88A of a flexible circuit copper trace 88 and a flexible circuit cover layer 90. The adhesive bond 86C is adapted to mechanically bond the top surface 88T of the first portion 88A of the flexible circuit copper trace 88 to the flexible circuit cover layer 90. As described above with respect to adhesive bonds 86A and 86B, the adhesive bond 86C may be a binder placed therein before or during the lamination process, or alternatively, may include a mechanical bond formed during lamination.

[0068] Reference Figure 9In an exemplary embodiment, the flexible circuit 60 is roll-bonded to the top surface 62A of the top laminate 62 of the busbar 54. Roll bonding is a solid-state cold welding process obtained by flat rolling of sheet metal. In roll bonding, the flexible circuit 60 passes over a rotating roller 106 as indicated by arrow 108, and is applied to the top surface 62A of the top laminate 62 under pressure, as indicated by arrow 110. The pressure is high enough to deform the material. This process can be performed at room temperature or at a heating temperature. In hot roll bonding, heat is applied before rolling to preheat the material in order to increase its ductility and improve the bond strength.

[0069] Reference Figure 10 In another exemplary embodiment, the flexible circuit 60 is thermally laminated to the top surface 62A of the top laminate 62 of the busbar 54. The flexible circuit 60 is placed on the top surface 62A of the top laminate 62 of the busbar 54 and placed in a machine 112 in which heat and pressure are applied for a period of time, as indicated by arrow 114.

[0070] In another exemplary embodiment, the interconnect 52 includes an adhesive bond 86D between the top laminate 62 of the busbar 54 and the flexible circuit 60. The adhesive bond 86D is adapted to mechanically bond the top laminate 62 of the busbar 54 and the flexible circuit 60. As described above with respect to adhesive bonds 86A, 86B, and 86C, the adhesive bond 86D may be a binder placed therein before or during a roll bonding or hot pressing process, or alternatively, may include a mechanical bond formed between the flexible circuit 60 and the top laminate 62 during a roll bonding or hot pressing process.

[0071] Referring again to Figure 5, the busbar 54, top laminate 62, bottom laminate 64, and flexible circuit copper trace 88 define a cylindrical hole 116 passing through the interconnect 52. In an exemplary embodiment, the cylindrical hole 116 is formed within the flexible circuit copper trace 88 and the busbar 54 after the flexible circuit 60 is positioned on the top surface 62A of the top laminate 62 of the busbar 54. In an exemplary embodiment, as... Figure 5B As shown, busbar 54 and flexible circuit copper trace 88 define a first inner diameter 118 of cylindrical hole 16, and top laminate 62 and bottom laminate 64 define a second inner diameter 120 of cylindrical hole 116. The first inner diameter 118 is smaller than the second inner diameter 120, wherein the flexible circuit copper trace 88 and busbar 54 extend into cylindrical hole 116 beyond the second inner diameter 120 defined by top laminate 62 and bottom laminate 64.

[0072] The copper coating 122 extends to cover the second portion 88B of the top surface 88T of the flexible circuit copper trace 88, extends to cover the inner diameter of the cylindrical hole 116 (first inner diameter 118 and second inner diameter 120), and electrically interconnects the busbar 54 to the flexible circuit copper trace 88, as shown. Figure 11 As indicated by arrow 124. The copper coating 122 defines the final inner diameter 126 of the cylindrical hole 116. Therefore, voltage flows from bus 54 to the flexible circuit copper trace 88, which directs the voltage to the various electrical subsystems 56a-56n within the vehicle 10. In an exemplary embodiment, the copper coating 122 is applied to the interconnect board 52 by chemical plating. Figure 5A As shown, the copper coating 122 extends outward to cover the top surface 88T of the second portion 88B of the flexible circuit copper trace 88, wherein the second portion 88B of the flexible circuit copper trace 88 defines a diameter 124, at which the copper coating 122 abuts against the flexible circuit cover layer 90.

[0073] Electroless copper plating is a chemical process for depositing a uniform copper layer on the surface of a solid substrate such as metal or plastic. The process involves immersing the substrate (in this case, on which busbars 54 of a flexible circuit 60 are positioned) in an aqueous solution containing copper salts and a reducing agent (e.g., formaldehyde). Electroless plating is a non-electrolytic method of deposition from solution that provides a uniform copper plating layer on all surfaces, regardless of size and shape. Electroless copper plating allows a copper coating 122 to adhere to both conductive elements (busbars 54 and flexible circuit copper traces 88) and non-conductive elements (top laminate 62, bottom laminate 64, and flexible circuit capping layer 90). This is because, unlike electroplating, the electroless plating process typically does not require the passage of current through the bath and the substrate. The reduction of metal cations in the solution to metal is achieved through a purely chemical method, via an autocatalytic reaction. Therefore, compared to electroplating, which results in non-uniform current densities due to the influence of the substrate shape on the electric field on its surface, electroless copper plating produces a uniform copper layer independent of the surface geometry.

[0074] Reference Figure 12The flowchart illustrates a method 200 for forming an interconnect board 52 for an electrical system 50 of a vehicle 10. The method begins at frame 202, encapsulating a busbar 54 between and within a top laminate 62 and a bottom laminate 64. Moving to frame 204, a flexible circuit 60 is formed, including flexible circuit copper traces 88 and a flexible circuit cover layer 90. Moving to frame 206, the flexible circuit 60 is attached to the top surface 62A of the top laminate 62 of the busbar 54, wherein the flexible circuit copper traces 88 are positioned to be connected to the busbar 54. The top laminate 62 contacts, and the flexible circuit cover layer 90 is positioned on the top laminate 62 of the bus 54 and extends to cover the first portion 88A of the top surface 88T of the flexible circuit copper trace 88. It moves to frame 208 to form a cylindrical hole 116 through the interconnect plate 52, and moves to frame 210 to apply a copper coating 122 on the second portion 88B of the top surface 88T of the flexible circuit copper trace 88 and on the inner diameter of the cylindrical hole 116, and electrically interconnects the bus 54 to the flexible circuit copper trace 88.

[0075] In an exemplary embodiment, encapsulating the busbar 54 between and within the top laminate 62 and the bottom laminate 64 at frame 202 further includes one of the following: moving to frame 212 to punch the busbar from a rolled sheet of aluminum material, or moving to frame 214 to form and press the busbar from a rolled sheet of aluminum material, moving to frame 216 to apply an adhesive bond 86A between the busbar 54 and the top laminate 62, moving to frame 218 to apply an adhesive bond 86B between the busbar 54 and the bottom laminate 64, and simultaneously laminating the top laminate 62 onto the top surface 68 of the busbar 54 and the bottom laminate 64 onto the bottom surface 70 of the busbar 54 by one of the following: moving to frame 220 for roll-to-roll lamination, or moving to frame 222 to hot-press and mechanically bond the top laminate 62 to the top surface 68 of the busbar 54 and mechanically bond the bottom laminate 64 to the bottom surface 70 of the busbar 54.

[0076] In another exemplary embodiment, forming a flexible circuit 60 including a flexible circuit copper trace 88 and a flexible circuit cover layer 90 at frame 204 further includes: moving to frame 224 to punch the flexible circuit copper trace 88 from a coil of copper-aluminum material 92; moving to frame 226 to apply an adhesive bond 86C between the top surface 88T of the first portion 88A of the flexible circuit copper trace 88 and the flexible circuit cover layer 90; and moving to frame 228 to laminate the flexible circuit copper trace 88 onto the flexible circuit cover layer 90 and mechanically bond the top surface 88T of the first portion 88A of the flexible circuit copper trace 88 to the flexible circuit cover layer 90.

[0077] In another exemplary embodiment, attaching the flexible circuit 60 to the top surface 62A of the top laminate 62 of the busbar 54 further includes: moving to frame 230 to apply an adhesive bond 86D between the top laminate 62 of the busbar 54 and the flexible circuit 60, and one of the following: moving to frame 232 to roll bond or moving to frame 234 to thermally press the flexible circuit 60 to the top surface 62A of the top laminate 62 of the busbar 54, and mechanically bonding the flexible circuit 60 to the top surface 62A of the top laminate 62.

[0078] In another exemplary embodiment, forming a cylindrical hole 116 through the interconnect 52 at frame 208 further includes moving to frame 236, where a first inner diameter 118 of the cylindrical hole 116 is defined by busbar 54 and flexible circuit copper trace 88, and moving to frame 238, where a second inner diameter 120 of the cylindrical hole 116 is defined by a top laminate 62 and a bottom laminate 64 of busbar 54, the second inner diameter of the cylindrical hole being larger than the first inner diameter 118 of the cylindrical hole 116, wherein the flexible circuit copper trace 88 and busbar 54 extend into the cylindrical hole 116 beyond the second inner diameter 120 defined by the top laminate 62 and the bottom laminate 64.

[0079] In another exemplary embodiment, at block 210, a copper coating 122 is applied to the second portion 88B of the top surface 88T of the flexible circuit copper trace 88 and to the inner diameter of the cylindrical hole 116, and electrically interconnecting the busbar 54 to the flexible circuit copper trace 88 further includes applying the copper coating 122 by chemical copper plating.

[0080] The description in this disclosure is merely exemplary in nature, and variations thereof without departing from the spirit and scope of this disclosure are intended to fall within its scope. Such variations should not be considered as departing from the spirit and scope of this disclosure.

Claims

1. An interconnecting board for an electrical system of a vehicle, comprising: Busbar, the busbar being encapsulated between and within the top laminate and the bottom laminate; A flexible circuit, the flexible circuit being attached to the top surface of the top laminate of the busbar and comprising: Flexible circuit copper traces, the flexible circuit copper traces being positioned to contact the top laminate of the busbar; and A flexible circuit cover layer, the flexible circuit cover layer being positioned on the top laminate of the busbar and extending to cover a first portion of the top surface of the flexible circuit copper traces; The busbar, the top laminate, the bottom laminate, and the flexible circuit copper trace define cylindrical holes passing through the interconnect board; and A copper coating extends to cover a second portion of the top surface of the flexible circuit copper trace, extends to cover the inner diameter of the cylindrical hole, and electrically interconnects the busbar to the flexible circuit copper trace.

2. The interconnect board according to claim 1, further comprising: An adhesive bond is used between the busbar and the top laminate to mechanically bond the top laminate to the top surface of the busbar; An adhesive bond is used between the busbar and the bottom laminate to mechanically bond the bottom laminate to the bottom surface of the busbar; An adhesive is used to bond the flexible circuit to the top surface of the top laminate, thereby mechanically bonding the flexible circuit to the top surface of the top laminate. as well as An adhesive is used to bond the top surface of the first portion of the flexible circuit copper trace to the flexible circuit cover layer, mechanically bonding the top surface of the first portion of the flexible circuit copper trace to the flexible circuit cover layer.

3. The interconnect board according to claim 2, wherein, The inner diameter of the cylindrical hole is further defined by the following: The first inner diameter defined by the busbar and the flexible circuit copper traces; and The second inner diameter is defined by the top laminate and the bottom laminate; Wherein, the first inner diameter is smaller than the second inner diameter, and the flexible circuit copper trace and the busbar extend into the cylindrical hole, exceeding the second inner diameter defined by the top laminate and the bottom laminate.

4. The interconnect board according to claim 3, wherein, The busbar is punched from a rolled aluminum plate, and the top laminate and the bottom laminate are simultaneously laminated to the top surface and the bottom surface of the busbar through roll-to-roll lamination.

5. The interconnect board according to claim 3, wherein, The busbar is formed and pressed from a rolled aluminum plate. The top laminate and the bottom laminate are simultaneously laminated to the top surface and the bottom surface of the busbar by hot pressing.

6. The interconnect board according to claim 3, wherein, The flexible circuit copper traces are punched from a copper-aluminum composite material roll and laminated onto the flexible circuit cover layer to form the flexible circuit.

7. The interconnect board according to claim 3, wherein, The flexible circuit is roll-bonded to the top surface of the top laminate of the busbar.

8. The interconnect board according to claim 3, wherein, The flexible circuit is hot-pressed onto the top surface of the top laminate of the busbar.

9. The interconnect board according to claim 3, wherein, After the flexible circuit is positioned on the top surface of the top laminate of the busbar, the cylindrical hole is formed in the copper traces of the flexible circuit and the busbar; and The copper coating is applied to the interconnect board by chemical copper plating.

10. A method of forming an interconnecting board for an electrical system of a vehicle, comprising: The busbar is encapsulated between and within the top and bottom laminates; Forming a flexible circuit that includes flexible circuit copper traces and a flexible circuit cover layer; The flexible circuit is attached to the top surface of the top laminate of the busbar, wherein: The flexible circuit copper traces are positioned to contact the top laminate of the busbar; and The flexible circuit overlay is positioned on the top laminate of the busbar and extends to cover a first portion of the top surface of the flexible circuit copper traces; Forming cylindrical holes through the interconnect plate; and A copper coating is applied to the second portion of the top surface of the flexible circuit copper trace and to the inner diameter of the cylindrical hole, and the busbar is electrically interconnected to the flexible circuit copper trace.

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