A high-efficiency heat dissipation optimization control system for a circuit board with raised heat dissipation

Abstract

This invention discloses a high-efficiency heat dissipation optimization control system for elevated heat-dissipating circuit boards, comprising an adjustable elevation support mechanism, a heat dissipation execution unit, a parameter acquisition unit, and a main control unit. The adjustable elevation support mechanism is positioned between the circuit board and the mounting substrate to adjust the height difference between them. The heat dissipation execution unit includes a guide fan assembly, a side air guide plate, and a heat dissipation fin array, forming a transversely flowing heat dissipation airflow channel. The parameter acquisition unit collects real-time data on circuit board temperature, airflow through the airflow channel, and environmental parameters. The main control unit coordinates the control of the support height and fan power to dynamically match heat dissipation requirements. The system supports graded speed adjustment, temperature difference balancing, power consumption optimization, resonance avoidance, and dust accumulation compensation, and provides three operating modes: automatic, forced, and silent. This invention dynamically adjusts heat dissipation parameters according to the actual heat generation status, balancing heat dissipation effect, operational efficiency, and operational stability.

Description

Technical Field

[0001] This invention belongs to the field of circuit board heat dissipation technology, specifically relating to a high-efficiency heat dissipation optimization control system for elevated heat dissipation circuit boards. Background Technology

[0002] As the main carrier of electronic devices, circuit boards integrate processors, power devices, and other components that continuously generate heat during operation. If this heat cannot be dissipated in time, the increased device temperature will lead to performance degradation, shortened lifespan, and in severe cases, thermal runaway failure.

[0003] Existing circuit board heat dissipation solutions mostly employ fixed structures, commonly including adding heat sink fins to the back of the circuit board in conjunction with a fan, or using thermal pads to conduct heat to the casing for dissipation. These solutions have several drawbacks: First, the fixed heat dissipation gaps prevent dynamic adjustment of airflow parameters based on actual heat generation. At low loads, the fan maintains a high speed, resulting in wasted energy, while at high loads, its cooling capacity may be insufficient. Second, fan speed adjustments are often based solely on single-point temperatures, failing to address temperature differences between different components on the circuit board, making targeted cooling of localized hotspots difficult. Third, long-term use leads to dust accumulation on the fins, increasing airflow resistance and gradually reducing cooling capacity, with the device lacking automatic compensation capabilities. Fourth, the fixed structure makes the fan prone to resonance with the supporting structure, resulting in excessive operating noise.

[0004] In addition, traditional raised cooling systems mostly use support columns of fixed height. Although they leave room for ventilation at the bottom, the height cannot be dynamically adjusted, and they cannot take into account the cooling needs under different loads as well as noise and power consumption control. Summary of the Invention

[0005] The purpose of this invention is to provide an efficient heat dissipation optimization control system for elevated heat dissipation circuit boards, in order to solve the technical problems that existing circuit board heat dissipation solutions mostly adopt fixed structures with bottom ventilation space, but the height cannot be dynamically adjusted, and cannot take into account the heat dissipation requirements under different loads as well as noise and power consumption control.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A high-efficiency heat dissipation optimization control system for raised heat dissipation circuit boards includes a heat dissipation execution unit and a main control unit, as well as an adjustable raising support mechanism and a parameter acquisition unit.

[0008] An adjustable lifting support mechanism is located between the circuit board and the mounting base to support the circuit board and adjust the height of the distance between the circuit board and the mounting base; the interior of the mounting base is a hollow cavity, and an air intake grille is embedded on one side of the mounting base.

[0009] The heat dissipation unit is located on the other side of the mounting base plate and is used to drive airflow from the air intake grille into the heat dissipation fin area above the mounting base plate to dissipate heat from the bottom of the circuit board.

[0010] The parameter acquisition units are respectively arranged on the circuit board, the heat dissipation duct and the environment side, and are used to collect circuit board temperature parameters, airflow parameters and environmental parameters in real time.

[0011] The main control unit is electrically connected to the adjustable lifting support mechanism, the heat dissipation execution unit, and the parameter acquisition unit, respectively. It is used to receive the data collected by the parameter acquisition unit, and output control signals to the adjustable lifting support mechanism and the heat dissipation execution unit in coordination according to the preset control strategy, so as to dynamically match the spacing and height between the circuit board and the mounting base and the output power of the heat dissipation execution unit.

[0012] As a further embodiment of the present invention, the adjustable lifting support mechanism includes at least four electrically operated lifting support columns, each electrically operated lifting support column being evenly distributed in the corresponding area of ​​the corner of the circuit board, and the stroke range of the electrically operated lifting support column being 5mm to 50mm; the top end of the electrically operated lifting support column is provided with an insulating buffer pad for supporting the circuit board, and the bottom end is fixed to the surface of the mounting base plate.

[0013] As a preferred embodiment of the present invention, the heat dissipation execution unit includes a bottom airflow fan assembly, a side airflow guide plate, and a heat dissipation fin array; the heat dissipation fin array is attached to the upper surface of the mounting substrate and is located between the mounting substrate and the circuit board; the bottom airflow fan assembly is located on the air outlet side of the mounting substrate and is used to drive the airflow laterally through the gaps in the heat dissipation fin array; the side airflow guide plate is located on both sides of the mounting substrate and is used to constrain the airflow to flow along the extension direction of the heat dissipation fin array and prevent the airflow from laterally dissipating.

[0014] As a further aspect of the present invention, the fin height of the heat dissipation fin array ranges from 2mm to 4mm, the fin thickness ranges from 0.5mm to 2mm, the spacing between adjacent fins ranges from 1mm to 5mm, and the fin height is less than the minimum support height of the adjustable lifting support mechanism; the bottom airflow fan assembly includes at least two axial fans, and the rated speed of a single fan ranges from 1000rpm to 6000rpm.

[0015] As a preferred embodiment of the present invention, the parameter acquisition unit includes a multi-point temperature sensor array, a duct wind speed sensor, and an ambient temperature and humidity sensor; the multi-point temperature sensor array is arranged at the positions of each heat-generating device on the upper surface of the circuit board to collect the real-time operating temperature of each heat-generating device; the duct wind speed sensor is arranged at the air outlet side to collect the actual air outlet speed in the heat dissipation duct; the ambient temperature and humidity sensor is arranged at the air inlet of the device to collect the temperature and humidity of the ambient air.

[0016] As a further preferred embodiment of the present invention, the parameter acquisition unit includes a multi-point temperature sensor array, and the main control unit has multiple preset temperature threshold ranges. The main control unit matches the corresponding temperature threshold range with the highest operating temperature collected by the multi-point temperature sensor array, and adjusts the operating speed of the bottom guide fan group in stages. When the highest operating temperature rises to the upper limit of the corresponding range, the fan operating speed is increased; when the highest operating temperature drops to the lower limit of the corresponding range, the fan operating speed is decreased.

[0017] As a further aspect of the present invention, the main control unit calculates the maximum temperature difference between each point collected by the multi-point temperature sensor array in real time. When the maximum temperature difference exceeds the preset temperature difference threshold, the main control unit adjusts the height of each electric lifting support column in a differentiated manner to make the circuit board tilt to change the spacing between different areas and the heat dissipation fin array, thereby increasing the ventilation volume of the high-temperature area until the maximum temperature difference falls back to within the preset temperature difference threshold.

[0018] As a further aspect of the present invention, the main control unit has a built-in power consumption optimization module. When the highest operating temperature of the circuit board is stably lower than the preset safe temperature threshold, the power consumption optimization module aims to minimize the total power consumption of the system, and simultaneously adjusts the support height and the output power of the heat dissipation execution unit to select the lowest power consumption operating parameter combination that meets the temperature constraints.

[0019] As a preferred embodiment of the present invention, the main control unit stores a table corresponding to the support height and the resonant speed. When the target fan speed of the heat dissipation execution unit falls into the resonant speed range corresponding to the current support height, the main control unit adjusts the support height of the adjustable lifting support mechanism to offset the resonant speed range, or finely adjusts the fan speed to avoid the resonant speed range.

[0020] As a preferred embodiment of the present invention, the parameter acquisition unit includes a duct wind speed sensor, and the main control unit has a built-in dust accumulation compensation module. The dust accumulation compensation module accumulates the system running time and compares the measured duct wind speed at the rated speed with the initial standard wind speed value in real time to calculate the duct wind resistance attenuation rate. When the wind resistance attenuation rate exceeds the preset attenuation threshold, the main control unit automatically increases the reference speed of the bottom guide fan group and adjusts the support height to compensate for the attenuation of heat dissipation capacity.

[0021] As a further preferred embodiment of the present invention, the main control unit supports at least three operating modes, namely automatic heat dissipation mode, forced heat dissipation mode and silent operation mode; in automatic heat dissipation mode, it executes full parameter dynamic adjustment logic; in forced heat dissipation mode, it operates with maximum heat dissipation capacity; and in silent operation mode, it limits the maximum fan speed and the upper limit of the support height.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The heat dissipation capacity is dynamically adjustable. By coordinating the adjustment of the air duct height and the fan airflow, the system can match the corresponding heat dissipation intensity within a wide range of heat generation, taking into account both energy saving under light load and heat dissipation under heavy load.

[0024] 2. The temperature distribution is more uniform, and the differentiated height adjustment can specifically improve local hot spots, avoid the performance bottleneck caused by excessive temperature difference between different components on the circuit board, and help the entire board operate stably.

[0025] 3. Improved energy efficiency: The power consumption optimization mechanism actively reduces energy consumption when there is sufficient heat dissipation margin, which can reduce unnecessary power consumption during long-term operation and is in line with the trend of low power consumption design.

[0026] 4. Improved operational stability: The resonance avoidance function reduces structural vibration and noise, while the dust accumulation compensation function extends the stable heat dissipation cycle. Together, these two features enhance the reliability of the equipment throughout its entire life cycle and reduce maintenance frequency.

[0027] 5. It has strong adaptability to different scenarios. The three operating modes cover different needs such as normal use, full load heat dissipation, and low noise operation. Users can choose flexibly according to actual working conditions for a better user experience. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only examples of embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention.

[0030] Figure label:

[0031] 1. Circuit board; 2. Mounting base plate; 3. Electric lifting support column; 4. Bottom airflow fan assembly; 5. Side airflow guide plate; 6. Heat dissipation fin array; 7. Air intake grille; Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only for explaining the present invention and are not intended to limit the present invention.

[0033] See Figure 1 As shown in the figure, an embodiment of the present invention provides a high-efficiency heat dissipation optimization control system for a raised heat dissipation circuit board, comprising a heat dissipation execution unit, a main control unit, an adjustable raising support mechanism, and a parameter acquisition unit.

[0034] An adjustable lifting support mechanism is provided between the circuit board 1 and the mounting base 2 to support the circuit board 1 and adjust the height of the distance between the circuit board 1 and the mounting base 2; the interior of the mounting base 2 is a hollow cavity, and an air intake grille 7 is embedded on one side of the mounting base 2.

[0035] The heat dissipation unit is located on the other side of the mounting base plate 2 and is used to drive airflow from the air intake grille 7 into the heat dissipation fin area above the mounting base plate 2 to dissipate heat from the bottom of the circuit board 1.

[0036] The parameter acquisition units are respectively arranged on the circuit board 1, the heat dissipation duct and the environment side, and are used to collect the temperature parameters of the circuit board 1, the airflow parameters of the duct and the environmental parameters in real time.

[0037] The main control unit is electrically connected to the adjustable lifting support mechanism, the heat dissipation execution unit, and the parameter acquisition unit, respectively. It is used to receive the data collected by the parameter acquisition unit, and output control signals to the adjustable lifting support mechanism and the heat dissipation execution unit in coordination according to the preset control strategy, so as to dynamically match the spacing and height between the circuit board and the mounting base and the output power of the heat dissipation execution unit.

[0038] The above solution utilizes the coordinated control of the adjustable lifting support mechanism and the heat dissipation execution unit to dynamically adjust the air duct height and airflow according to actual heat dissipation needs. Compared with a fixed-height heat dissipation structure, it can reduce operating power consumption under low load and increase the heat dissipation limit under high load. Multi-parameter acquisition provides a comprehensive basis for the control strategy, making heat dissipation adjustment more precise and in line with the actual heat dissipation state of the circuit board.

[0039] The adjustable lifting support mechanism includes at least four electrically operated lifting support columns 3, which are evenly distributed in the corresponding corner areas of the circuit board 1. The stroke range of the electrically operated lifting support columns 3 is 5mm to 50mm. The top of each electrically operated lifting support column 3 is equipped with an insulating buffer pad for supporting the circuit board 1, and the bottom is fixed to the surface of the mounting base plate 2. Multi-point support ensures uniform stress on the circuit board and avoids bending deformation of the board surface. The corner arrangement does not occupy the component layout space in the middle of the circuit board. The insulating buffer pad prevents short circuits and absorbs operating vibrations. The lifting structure provides the basis for adjusting the height of the air duct.

[0040] The heat dissipation unit includes a bottom airflow fan assembly 4, a side airflow guide plate 5, and a heat dissipation fin array 6. The heat dissipation fin array 6 is attached to the upper surface of the mounting base plate 2 and is located between the mounting base plate 2 and the circuit board 1. The bottom airflow fan assembly 4 is located on the air outlet side of the mounting base plate and is used to drive the airflow laterally through the gaps in the heat dissipation fin array 6. The side airflow guide plate 5 is located on both sides of the mounting base plate 2 and is used to constrain the airflow along the extension direction of the heat dissipation fin array 6 to prevent the airflow from escaping laterally.

[0041] The heat dissipation fin array increases the heat exchange area, and the horizontal airflow design allows the airflow to fully contact the heat-generating area at the bottom of the circuit board. The side air guide plate reduces airflow bypass loss and increases effective ventilation. The whole structure forms a regular horizontal heat dissipation airflow channel, which has a higher heat dissipation efficiency than natural convection or unconstrained open heat dissipation.

[0042] The fin array 6 has a fin height range of 2mm to 4mm, a fin thickness range of 0.5mm to 2mm, and a spacing between adjacent fins range of 1mm to 5mm. The fin height is less than the minimum support height of the adjustable lifting support mechanism. The bottom airflow fan group 4 includes at least two axial fans, with a rated speed range of 1000rpm to 6000rpm for each fan.

[0043] The fin size is matched with the minimum support height to ensure that the fins are not squeezed or damaged when the circuit board is raised to the lowest position; the parallel arrangement of multiple fans increases the total airflow redundancy, and the basic heat dissipation capacity can still be maintained when a single fan fails; the wide speed range provides sufficient adjustment margin for graded speed adjustment.

[0044] The parameter acquisition unit includes a multi-point temperature sensor array, a duct wind speed sensor, and an ambient temperature and humidity sensor. The multi-point temperature sensor array is arranged on the upper surface of the circuit board 1 at the positions of each heat-generating device to collect the real-time operating temperature of each heat-generating device. The duct wind speed sensor is arranged on the air outlet side to collect the actual air outlet speed in the heat dissipation duct. The ambient temperature and humidity sensor is arranged at the air inlet of the equipment to collect the temperature and humidity of the ambient air.

[0045] Multi-point temperature acquisition can capture the heat dissipation differences of different devices and avoid misjudgments caused by single-point temperature measurement; synchronous acquisition of wind speed and environmental parameters enables the control system to distinguish between environmental changes and changes in the state of the air duct itself, providing a data foundation for subsequent advanced functions such as dust accumulation compensation and power consumption optimization.

[0046] The parameter acquisition unit includes a multi-point temperature sensor array. The main control unit has multiple preset temperature threshold ranges. The main control unit matches the corresponding temperature threshold range with the highest operating temperature collected by the multi-point temperature sensor array and adjusts the operating speed of the bottom guide fan group 4 in stages. When the highest operating temperature rises to the upper limit of the corresponding range, the fan operating speed is increased; when the highest operating temperature drops to the lower limit of the corresponding range, the fan operating speed is decreased.

[0047] The graded speed control avoids frequent changes in fan speed, resulting in smoother operation. Using the highest temperature point as the basis for speed adjustment ensures that the most heat-generating components are always within a safe temperature range. The range hysteresis design reduces the number of speed adjustment actions and extends the fan's lifespan.

[0048] The main control unit calculates the maximum temperature difference between the points collected by the multi-point temperature sensor array in real time. When the maximum difference exceeds the preset temperature difference threshold, the main control unit adjusts the height of each electric lifting support column 3 in a differentiated manner, so that the circuit board 1 tilts to change the distance between different areas and the heat dissipation fin array 6, thereby increasing the ventilation volume of the high-temperature area until the maximum temperature difference falls back to within the preset temperature difference threshold.

[0049] Tilting the board surface alters the height of local air ducts, which can specifically enhance convection heat transfer in high-temperature areas and solve the problem of localized overheating of the circuit board. Compared to simply increasing the overall fan speed, the differentiated height adjustment method can balance the temperature without significantly increasing the overall power consumption or causing a significant increase in noise.

[0050] The main control unit has a built-in power optimization module. When the highest operating temperature of the circuit board 1 is stably lower than the preset safe temperature threshold, the power optimization module aims to minimize the total power consumption of the system, and simultaneously adjusts the support height and the output power of the heat dissipation execution unit to select the lowest power consumption operating parameter combination that meets the temperature constraints.

[0051] When there is sufficient heat dissipation margin, it actively seeks the lowest power consumption operating point to avoid the heat dissipation system being in a high power consumption state for a long time; the linkage between height and power optimization can approach the optimal energy efficiency point better than single variable adjustment, and can significantly reduce equipment energy consumption in the long run.

[0052] The main control unit stores a table corresponding to the support height and the resonant speed. When the target fan speed of the heat dissipation unit falls into the resonant speed range corresponding to the current support height, the main control unit adjusts the support height of the adjustable lifting support mechanism to shift away from the resonant speed range, or fine-tunes the fan speed to avoid the resonant speed range.

[0053] The natural frequency of the system varies at different support heights. Actively avoiding resonance points can prevent structural vibration amplification, reduce operating noise, and avoid loose connections and component fatigue damage caused by long-term resonance, thereby improving the stability and reliability of system operation.

[0054] The parameter acquisition unit includes a duct wind speed sensor, and the main control unit has a built-in dust accumulation compensation module. This module accumulates the system's runtime and compares the measured duct wind speed at rated speed with the initial standard wind speed in real time to calculate the duct resistance attenuation rate. When the resistance attenuation rate exceeds a preset attenuation threshold, the main control unit automatically increases the base speed of the bottom airflow fan group 4 and adjusts the support height to compensate for the decrease in heat dissipation capacity. As usage time increases, dust accumulation on the fins leads to increased wind resistance and decreased heat dissipation capacity. The automatic compensation mechanism can counteract this attenuation trend, ensuring stable heat dissipation performance throughout the equipment's lifespan and reducing the frequency of manual dust cleaning and maintenance.

[0055] The main control unit supports at least three operating modes: automatic cooling mode, forced cooling mode, and silent operation mode. In automatic cooling mode, it executes dynamic adjustment logic for all parameters; in forced cooling mode, it operates at maximum cooling capacity; and in silent operation mode, it limits the maximum fan speed and the upper limit of the support height. This multi-mode design adapts to different usage scenarios. Under high load conditions, forced mode can be switched to ensure heat dissipation; at night or in scenarios requiring low noise, silent mode can be switched to balance user experience; and automatic mode is suitable for most normal operating conditions, balancing heat dissipation and energy consumption without manual intervention.

[0056] This system uses an adjustable lifting support mechanism to form a horizontally adjustable heat dissipation duct between the circuit board 1 and the mounting base 2. The heat dissipation fin array 6 is arranged at the bottom of the duct, and the bottom guide fan assembly 4 draws air from one end of the duct, allowing outside air to enter through the air intake grille 7, sweeping laterally across the surface of the heat dissipation fin array 6, carrying away the heat conducted down from the bottom of the circuit board 1, and finally exhausting it from the fan side. The side guide plates 5 prevent airflow from escaping from both sides, ensuring that the airflow is concentrated and passes through the fin gaps.

[0057] At the control level, the parameter acquisition unit continuously collects data on multiple points of the circuit board temperature, airflow velocity in the duct, and ambient temperature and humidity, and sends it to the main control unit. The main control unit outputs two control signals according to a preset strategy: one controls the speed of the bottom guide fan group 4 to adjust the total airflow, and the other controls the lifting of each electric lifting support column 3 to adjust the duct height.

[0058] During normal operation, the system adjusts the fan speed in stages based on the highest temperature point. When the temperature difference between different points on the circuit board is too large, the height of the four corner support pillars is adjusted to slightly tilt the circuit board, increasing the ventilation cross-section of some areas to enhance local heat dissipation. When there is sufficient temperature margin, the power optimization module adjusts the height and fan power in conjunction to find the lowest energy consumption operating point while meeting temperature requirements.

[0059] The system also features resonance avoidance and dust accumulation compensation. If the fan speed is detected to be close to the resonance range at the current height during operation, the support height will be adjusted or the speed will be fine-tuned to avoid resonance. If an increase in wind resistance is detected after long-term operation, the system will automatically increase the fan's base speed and adjust the height to offset the heat dissipation reduction caused by dust accumulation.

[0060] Usage: After power-on, the system defaults to automatic cooling mode. The main control unit reads the initial data from each sensor, adjusts the electric lifting support column 3 to its initial height, and starts the bottom airflow fan group 4 at low speed. It then enters closed-loop regulation mode. No manual operation is required during daily use; the system automatically adjusts the fan speed and support height based on the circuit board's heat output to maintain the temperature of each component within a reasonable range.

[0061] When the device is under high load conditions, such as full-load operation or high-power output, it can be switched to forced cooling mode. At this time, the support height is adjusted to the maximum, the fan runs at full speed, and the heat dissipation capacity reaches the upper limit, which is suitable for scenarios that require rapid cooling in a short period of time.

[0062] When the device is in a noise-sensitive environment, such as when running at night or on a desk, it can be switched to silent operation mode. In this mode, the maximum fan speed and the upper limit of the support height are limited. By sacrificing some heat dissipation capacity, lower operating noise is achieved. This mode is suitable for occasions where the heat load is not high but quietness is required.

[0063] After long-term use, the dust accumulation compensation mechanism will automatically maintain stable heat dissipation capacity. If deep maintenance is required, the support column can be raised to its highest position after power is turned off, and the heat dissipation fin array 6 and air intake grille 7 can be cleaned. After the dust is cleaned, the system will recalibrate the initial wind speed reference.

[0064] The above description illustrates the basic principles of the present invention. The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. The above embodiments and descriptions in the specification are only for illustrating the principles of the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and scope of the present invention without departing from the scope of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-efficiency heat dissipation optimization control system for elevated heat-dissipating circuit boards, comprising a heat dissipation execution unit and a main control unit, characterized in that: It also includes an adjustable lifting support mechanism and a parameter acquisition unit; The adjustable lifting support mechanism is disposed between the circuit board (1) and the mounting base (2) to support the circuit board (1) and adjust the distance between the circuit board (1) and the mounting base (2); the interior of the mounting base (2) is a hollow cavity, and an air intake grille (7) is embedded on one side of the mounting base (2). The heat dissipation unit is located on the other side of the mounting base plate (2) and is used to drive airflow from the air intake grille (7) to flow through the heat dissipation fin area above the mounting base plate (2) to dissipate heat from the bottom of the circuit board (1). The parameter acquisition units are respectively arranged on the circuit board (1), the heat dissipation duct and the environment side, and are used to collect the temperature parameters of the circuit board (1), the airflow parameters of the duct and the environmental parameters in real time. The main control unit is electrically connected to the adjustable lifting support mechanism, the heat dissipation execution unit, and the parameter acquisition unit, respectively. It is used to receive the data collected by the parameter acquisition unit, and output control signals to the adjustable lifting support mechanism and the heat dissipation execution unit in coordination according to the preset control strategy, so as to dynamically match the distance between the circuit board and the mounting base and the output power of the heat dissipation execution unit.

2. The high-efficiency heat dissipation optimization control system for elevated heat-dissipating circuit boards according to claim 1, characterized in that: The adjustable lifting support mechanism includes at least four electric lifting support columns (3), each electric lifting support column (3) is evenly distributed in the corresponding area of ​​the corner of the circuit board (1), and the stroke range of the electric lifting support column (3) is 5mm to 50mm; the top of the electric lifting support column (3) is provided with an insulating buffer pad and used to support the circuit board (1), and the bottom is fixed to the surface of the mounting base plate (2).

3. The high-efficiency heat dissipation optimization control system for elevated heat-dissipating circuit boards according to claim 1, characterized in that: The heat dissipation unit includes a bottom airflow fan assembly (4), a side airflow guide plate (5), and a heat dissipation fin array (6). The heat dissipation fin array (6) is attached to the upper surface of the mounting base plate (2) and is located between the mounting base plate (2) and the circuit board (1). The bottom airflow fan assembly (4) is located on the air outlet side of the mounting base plate and is used to drive the airflow to pass laterally through the gap of the heat dissipation fin array (6). The side airflow guide plate (5) is located on both sides of the mounting base plate (2) and is used to constrain the airflow to flow along the extension direction of the heat dissipation fin array (6) and prevent the airflow from lateral dissipation.

4. The high-efficiency heat dissipation optimization control system for elevated heat-dissipating circuit boards according to claim 3, characterized in that: The fin array (6) has a fin height range of 2mm to 4mm, a fin thickness range of 0.5mm to 2mm, a spacing between adjacent fins range of 1mm to 5mm, and the fin height is less than the minimum support height of the adjustable lifting support mechanism; the bottom airflow fan group (4) includes at least two axial fans, and the rated speed of a single fan ranges from 1000rpm to 6000rpm.

5. The high-efficiency heat dissipation optimization control system for elevated heat-dissipating circuit boards according to claim 1, characterized in that: The parameter acquisition unit includes a multi-point temperature sensor array, a duct wind speed sensor, and an ambient temperature and humidity sensor. The multi-point temperature sensor array is arranged on the upper surface of the circuit board (1) at the positions of each heat-generating device to collect the real-time operating temperature of each heat-generating device. The duct wind speed sensor is arranged on the air outlet side to collect the actual air outlet speed in the heat dissipation duct. The ambient temperature and humidity sensor is arranged at the air inlet of the equipment to collect the temperature and humidity of the ambient air.

6. The high-efficiency heat dissipation optimization control system for elevated heat-dissipating circuit boards according to claim 3, characterized in that: The parameter acquisition unit includes a multi-point temperature sensor array. The main control unit has multiple temperature threshold ranges preset. The main control unit matches the corresponding temperature threshold range with the highest working temperature collected by the multi-point temperature sensor array and adjusts the operating speed of the bottom guide fan group (4) in stages. When the highest working temperature rises to the upper limit of the corresponding range, the fan operating speed is increased. When the highest working temperature drops to the lower limit of the corresponding range, the fan operating speed is reduced.

7. The high-efficiency heat dissipation optimization control system for elevated heat-dissipating circuit boards according to claim 5, characterized in that: The main control unit calculates the maximum temperature difference between the points collected by the multi-point temperature sensor array in real time. When the maximum temperature difference exceeds the preset temperature difference threshold, the main control unit adjusts the height of each electric lifting support column (3) in a differentiated manner to make the circuit board (1) tilt to change the distance between different areas and the heat dissipation fin array (6), increase the ventilation volume of the high temperature area, until the maximum temperature difference falls back to within the preset temperature difference threshold.

8. The high-efficiency heat dissipation optimization control system for elevated heat-dissipating circuit boards according to claim 7, characterized in that: The main control unit has a built-in power optimization module. When the highest operating temperature of the circuit board (1) is stable below the preset safe temperature threshold, the power optimization module aims to minimize the total power consumption of the system, and simultaneously adjusts the support height and the output power of the heat dissipation execution unit to select the lowest power consumption operating parameter combination that meets the temperature constraints.

9. The high-efficiency heat dissipation optimization control system for elevated heat-dissipating circuit boards according to claim 1, characterized in that: The main control unit stores a table corresponding to the support height and the resonant speed. When the target fan speed of the heat dissipation execution unit falls into the resonant speed range corresponding to the current support height, the main control unit adjusts the support height of the adjustable lifting support mechanism to shift away from the resonant speed range, or fine-tunes the fan speed to avoid the resonant speed range.

10. The high-efficiency heat dissipation optimization control system for elevated heat-dissipating circuit boards according to claim 3, characterized in that: The parameter acquisition unit includes a duct wind speed sensor. The main control unit has a built-in dust accumulation compensation module. The dust accumulation compensation module accumulates the system running time and compares the measured duct wind speed at the rated speed with the initial standard wind speed value in real time to calculate the duct wind resistance attenuation rate. When the wind resistance attenuation rate exceeds the preset attenuation threshold, the main control unit automatically increases the reference speed of the bottom guide fan group (4) and adjusts the support height to compensate for the attenuation of heat dissipation capacity.

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