Circuit module and optical device

Abstract

The present disclosure relates to a circuit module and an optical apparatus. The circuit module includes a first wiring board including a first main surface and a second main surface, and a second wiring board including a third main surface intersecting a direction along the first main surface. The first main surface and the second main surface of the first wiring board are soldered to the third main surface of the second wiring board. The third main surface of the second wiring board includes an overlapping portion overlapping the first wiring board in a first direction orthogonal to the third main surface, a first portion extending from the overlapping portion on one side in a second direction orthogonal to the first direction, and a second portion extending from the overlapping portion on the other side in the second direction. The circuit module further includes a plurality of electronic components mounted on the second portion.

Description

Technical Field

[0001] This disclosure relates to circuit modules and optical devices. Background Technology

[0002] In interchangeable lens camera systems, a circuit board is provided in the optical device (interchangeable lens) coupled to the camera body. This circuit board includes a wiring board and electronic components mounted on the wiring board for implementing systems such as autofocus. Because the optical system is also provided in the interchangeable lens, a wiring board with a ring or arc shape is used to avoid obstructing light.

[0003] With the miniaturization of the camera body, improvements in image quality, and overall performance, the performance of interchangeable lenses has been enhanced through miniaturization of electronic components and image stabilization. Furthermore, the circuit board deployed inside the interchangeable lens includes system circuitry primarily housing semiconductor components such as a central processing unit (CPU), as well as drive circuitry such as a power supply. In such circuit boards, a large number of electronic components, including semiconductor and passive components, are increasingly being mounted at high density. Moreover, regarding the circuit board, since its size is determined by the size, number, and arrangement of the electronic components, the outer diameter of the lens inside the circuit board is limited, or the outer diameter of the optical device is increased. To achieve optical devices with small size and high performance, further increases in mounting density are desired. Similar issues arise not only in camera systems with interchangeable lenses but also in optical devices of camera systems with fixed lenses.

[0004] Japanese Patent Application Publication No. 2024-77627 discloses a circuit module including a first circuit board and a second circuit board. The first circuit board includes a first main surface and a second main surface, and the second circuit board includes a third main surface and a fourth main surface extending in a direction intersecting with the first main surface. In this circuit module, the first circuit board and the second circuit board are soldered to each other.

[0005] In the circuit modules of electronic devices such as optical equipment, the demand for higher mounting density of a large number of electronic components has been increasing, and there is room for improvement. Summary of the Invention

[0006] This disclosure provides techniques that facilitate the high-density mounting of a large number of electronic components.

[0007] According to a first aspect of this disclosure, a circuit module includes a first wiring board and a second wiring board. The first wiring board includes a first main surface and a second main surface, the second main surface being provided on a side opposite to the first main surface. The second wiring board includes a third main surface intersecting a direction along the first main surface. The first main surface and the second main surface of the first wiring board are soldered to the third main surface of the second wiring board. The third main surface of the second wiring board includes an overlapping portion, a first portion, and a second portion. The overlapping portion overlaps with the first wiring board in a first direction orthogonal to the third main surface. The first portion extends from the overlapping portion on one side in a second direction orthogonal to the first direction, and the second portion extends from the overlapping portion on the other side in the second direction. W2 < W1 is satisfied, where W1 represents the length of the first wiring board in a third direction orthogonal to both the first and second directions, and W2 represents the length of the second wiring board in that third direction. L1 < L2 is satisfied, where L1 represents the length of the first portion in the second direction, and L2 represents the length of the second portion in the second direction. The circuit module also includes multiple electronic components mounted on the second part.

[0008] According to a second aspect of this disclosure, a circuit module includes a first wiring board, a second wiring board, and a plurality of electronic components. The first wiring board includes a first main surface, a second main surface, and an end surface, the second main surface being provided on a side opposite to the first main surface, the end surface interconnecting the first main surface and the second main surface. The second wiring board includes a third main surface intersecting the first main surface in a direction along the first main surface. The plurality of electronic components are mounted on the third main surface. The end surface includes a non-bent surface portion and a first bent surface portion, the first bent surface portion being connected to the non-bent surface portion. With the non-bent surface portion facing the third main surface of the second wiring board, the first main surface and the second main surface of the first wiring board are soldered to the third main surface of the second wiring board.

[0009] The features of this disclosure will become clear from the following description of embodiments with reference to the accompanying drawings. The following description of embodiments is by way of example. Attached Figure Description

[0010] Figure 1 This is an explanatory diagram of the optical device according to the first embodiment.

[0011] Figure 2A This is a perspective view of the circuit module according to the first embodiment.

[0012] Figure 2B This is a side view of the circuit module according to the first embodiment.

[0013] Figure 3 This is a top view of the circuit module according to the first embodiment.

[0014] Figure 4A This is a front view of the circuit module according to the first embodiment.

[0015] Figure 4B This is an enlarged front view of a portion of the circuit module according to the first embodiment.

[0016] Figure 5 This is an enlarged perspective view of a portion of the circuit module according to the first embodiment.

[0017] Figure 6 This is a cross-sectional view of a portion of the circuit module according to the first embodiment.

[0018] Figure 7 This is a cross-sectional view of a portion of the circuit module according to the second embodiment.

[0019] Figure 8A This is a schematic perspective view of the circuit module based on the first modified example.

[0020] Figure 8B This is a schematic perspective view of the circuit module based on the first modified example.

[0021] Figure 8C This is a schematic perspective view of the circuit module based on the second modified example.

[0022] Figure 8D This is a schematic perspective view of the circuit module based on the second modified example.

[0023] Figure 8E This is a schematic perspective view of the circuit module based on the third modified example.

[0024] Figure 8F This is a schematic perspective view of the circuit module based on the third modified example. Detailed Implementation

[0025] Embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. The embodiments shown below are merely examples, and, for example, the details of their configuration can be appropriately modified by those skilled in the art for implementation within the spirit of this disclosure.

[0026] It should be noted that in the following description of the embodiments, unless otherwise stated, elements represented by the same reference numerals are considered to have substantially the same function. In the drawings, where multiple identical elements are provided, the addition of reference numerals and their descriptions may be omitted. Furthermore, since the drawings are sometimes used schematically for ease of illustration and description, the shape, size, arrangement, etc., of the elements illustrated in the drawings may not strictly match the shape, size, arrangement, etc., of elements illustrated in other drawings or elements in the real world.

[0027] Furthermore, in the description of the following embodiments, directions are indicated in the XYZ coordinate system, which is an orthogonal coordinate system. The X-axis, Y-axis, and Z-axis are orthogonal to each other. Additionally, the directions of the X-axis, Y-axis, and Z-axis will be referred to as the X-direction, Y-direction, and Z-direction, respectively.

[0028] Furthermore, for example, the X direction includes two opposite directions along the X-axis (+X direction and -X direction). The +X direction indicates one of the two directions, and the -X direction indicates the other of the two directions, that is, the direction opposite to the +X direction. The same applies to the Y-axis and Z-axis in addition to the X-axis.

[0029] Furthermore, the plane including the X-axis and Y-axis will be called the XY plane, the plane including the X-axis and Z-axis will be called the XZ plane, and the plane including the Y-axis and Z-axis will be called the YZ plane.

[0030] First Embodiment

[0031] Optical equipment

[0032] Figure 1 This is an explanatory diagram of the optical device 500 according to the first embodiment. Figure 1 The illustration shows a camera 1000 including an optical device 500. The camera 1000 may also be referred to as a camera system. The camera 1000 includes a camera body 600. The optical device 500 is detachably attached to the camera body 600. The optical device 500 may be, for example, an replaceable lens (replaceable lens unit) in a lens-interchangeable type camera, but may also be a lens unit in a fixed-lens type camera.

[0033] The camera body 600 includes an image acquisition device 700, which is an image sensor such as a complementary metal-oxide-semiconductor (CMOS) image sensor or a charge-coupled device (CCD) image sensor. The camera body 600 may include a processing device 800 (image processing device) that performs image processing on the image signal output from the image acquisition device 700. The camera body 600 may include a display device 900 that displays the image processed by the processing device 800. The display device 900 is a liquid crystal display or an organic electroluminescent display. The display device 900 may be an electronic viewfinder.

[0034] Optical device 500 includes a lens optical system 100, a circuit module 1, and a lens barrel 400. The lens optical system 100 may include multiple lenses. The circuit module 1 includes a main circuit board 200 and a secondary circuit board 300. The main circuit board 200 is an example of a first circuit board. The secondary circuit board 300 is an example of a second circuit board. The main circuit board 200 and the secondary circuit board 300 are soldered to each other.

[0035] The circuit module 1 and the lens optical system 100 are deployed inside the lens barrel 400, and the circuit module 1 is fixed to the lens barrel 400. At least one lens in the lens optical system 100 can be fixed to the lens barrel 400, but at least one lens in the lens optical system 100 can be moved in the lens barrel 400 by being driven by an ultrasonic motor (USM) (not shown) as an example of a motor.

[0036] Multiple lenses, including those in the lens optical system 100, are arranged along the optical axis OA. Light from the object (the imaging subject)... The light is incident on the lens optical system 100. The object-side OS and image-side IS are defined relative to the lens optical system 100. The object (the imaging subject) is located on the object-side OS of the lens optical system 100, and the image pickup device 700 of the camera body 600 is located on the image-side IS of the lens optical system 100. The sub-circuit board 300 is deployed on the side of the main circuit board 200 opposite to the optical axis OA so as not to obstruct the light. That is, the sub-circuit board 300 is deployed on the inner periphery of the lens barrel 400 of the main circuit board 200.

[0037] Optical device 500 includes coupling mechanism 510, and camera body 600 includes coupling mechanism 610. Coupling mechanisms 510 and 610 are each mounting parts. Coupling mechanism 510 of optical device 500 is coupled to coupling mechanism 610 of camera body 600, and optical device 500 and camera body 600 are thus mechanically and electrically connected to each other. As a result, image acquisition device 700 captures the image focused by optical device 500. Coupling mechanisms 510 and 610 are omitted in fixed-lens type cameras.

[0038] Figure 2A This is a perspective view of circuit module 1 according to the first embodiment. Figure 2B Is Figure 2A The side view of circuit module 1 as seen in the direction of arrow I. Figure 3 Is Figure 2A The top view of circuit module 1 as seen in the direction of arrow II. Figure 4A Is Figure 2A The front view of circuit module 1 as seen in the direction of arrow III. Figure 4B yes Figure 4A An enlarged front view of a portion of circuit module 1 shown in the figure. Figure 5 This is an enlarged perspective view of a portion of the circuit module 1 according to the first embodiment. Figure 6 This is a cross-sectional view of a portion of the circuit module 1 according to the first embodiment.

[0039] Circuit module 1 is a three-dimensional mounting structure. The main circuit board 200 includes a main wiring board 2 and multiple electronic components 101 mounted on the main wiring board 2. The secondary circuit board 300 includes a secondary wiring board 3 and multiple electronic components 102 and multiple electronic components 103 mounted on the secondary wiring board 3. The main wiring board 2 is an example of a first wiring board. The secondary wiring board 3 is an example of a second wiring board. The electronic components 101 are examples of third electronic components.

[0040] The main patch panel 2 includes a main surface 201, a main surface 202 provided on the side opposite to the main surface 201, and an end surface 203 interconnecting the main surfaces 201 and 202. The main surface 202 is parallel to the main surface 201. The secondary patch panel 3 includes a main surface 301, a main surface 302 on the side opposite to the main surface 301, and an end surface 303 interconnecting the main surfaces 301 and 302. The main surface 302 is parallel to the main surface 301. The main surface 201 is an example of a first main surface. The main surface 202 is an example of a second main surface. The main surface 301 is an example of a third main surface. The main surface 302 is an example of a fourth main surface.

[0041] Both the main wiring board 2 and the auxiliary wiring board 3 can be, for example, rigid boards. Alternatively, both the main wiring board 2 and the auxiliary wiring board 3 can be printed wiring boards.

[0042] The main wiring board 2 includes an insulating substrate and at least two conductive layers. Two of the at least two conductive layers are outer layers respectively deployed on two main surfaces of the insulating substrate. Solder resist is deployed on each of the two outer layers.

[0043] The sub-wiring board 3 includes an insulating substrate and at least one conductive layer. One of the at least two conductive layers is an outer layer disposed on the insulating substrate. In this embodiment, the sub-wiring board 3 includes at least two conductive layers. Two of the at least two conductive layers are outer layers disposed on two main surfaces of the insulating substrate, respectively. Solder resist is disposed on each of the two outer layers.

[0044] Each conductive layer of the main wiring board 2 and the sub-wiring board 3 includes wiring made of conductive components such as copper. Examples of the insulating substrate for each of the main wiring board 2 and the sub-wiring board 3 include a glass epoxy resin substrate, a resin substrate other than a glass epoxy resin substrate, and a ceramic substrate.

[0045] At least one of the main surfaces 201 and 202 of the main wiring board 2 is a mounting surface on which the mounted components can be mounted, and in the first embodiment, the main surfaces 201 and 202 are each mounting surfaces. A plurality of electronic components 101 are surface-mounted on the main surfaces 201 and 202.

[0046] At least one of the main surfaces 301 and 302 of the sub-panel 3 is a mounting surface on which the mounted components can be mounted, and in the first embodiment, the main surfaces 301 and 302 are each mounting surfaces. A plurality of electronic components 102 are surface-mounted on the main surface 301, and a plurality of electronic components 103 are surface-mounted on the main surface 302.

[0047] Multiple electronic components 101 can each be an active integrated circuit component (semiconductor component) or a passive component. Multiple electronic components 102 can each be an active integrated circuit component (semiconductor component) or a passive component. Multiple electronic components 103 can each be an active integrated circuit component (semiconductor component) or a passive component.

[0048] Integrated circuit components can include control circuitry for autofocus, power supply circuitry for sensors, drive circuitry for actuation, and so on. Passive components can be, for example, surface-mount chip components such as chip resistors, chip capacitors, or chip inductors, or coils.

[0049] In the first embodiment, the X, Y, and Z directions are based on the main surface 301 of the sub-connector 3. Here, the main surfaces 301 and 302 of the sub-connector 3 may each include minute protrusions and recesses, and the main surfaces 201 and 202 of the main connector 2 may each include minute protrusions and recesses. The direction based on the main surface 301 of the sub-connector 3 is based on the flat surface with the largest area in the main surface 301. This also applies to the cases based on the main surfaces 302, 201, and 202.

[0050] The main surface 301 of the secondary patch panel 3 includes a flat surface parallel to the XZ plane. The direction orthogonal to the main surface 301 of the secondary patch panel 3 is the Y direction. The main surface 301 faces the +Y direction, and the main surface 302 faces the -Y direction. The main patch panel 2 is deployed on the +Y direction side relative to the secondary patch panel 3.

[0051] The Y direction is also the out-of-plane direction of the main surface 301 and the thickness direction of the sub-wiring board 3. The Z and X directions are also along the direction of the main surface 301, that is, the in-plane direction of the main surface 301. Here, the Y direction is an example of the first direction, the Z direction, which is orthogonal to the Y direction, is an example of the second direction, and the X direction, which is orthogonal to both the Y and Z directions, is an example of the third direction.

[0052] The main surface 301 of the sub-wiring board 3 extends in the direction intersecting with the main surface 201 of the main wiring board 2. In other words, the main surface 201 of the main wiring board 2 extends in the direction intersecting with the main surface 301 of the sub-wiring board 3. The main surface 302 of the sub-wiring board 3 faces the inner peripheral surface of the lens barrel 400.

[0053] It should be noted that in the first embodiment, the angle between the Z-axis and the optical axis OA is, for example, 0°, but can be greater than 0°, and can be 30° or less. Furthermore, although the main surface 201 of the main wiring board 2 can be orthogonal to the main surface 301 of the sub-wiring board 3, the main surface 201 of the main wiring board 2 can be slightly inclined relative to the main surface 301 of the sub-wiring board 3. That is, the angle between the main surface 201 and the main surface 301 can be 90°, but can be within the range of 90° ± 30°.

[0054] In the first embodiment, as an example, the case where the angle between the Z-axis and the optical axis OA is 0° (i.e., the optical axis OA is parallel to the Z-axis) and the angle between the main surface 201 and the main surface 301 is 90° (i.e., the direction orthogonal to the main surface 201 is the Z-direction) will be described. The +Z direction is the light... The incident direction (direction of travel). The flat surface of each of the main surfaces 201 and 202 of the main wiring board 2 is parallel to the XY plane.

[0055] From the viewpoint of ensuring a large mounting area, the main distribution board 2 can have a shape that follows the inner circumferential surface of the lens barrel 400 so as not to obstruct light. It has a shape in which a portion of an arcuate shape, as viewed in the Z direction orthogonal to the main surface 201, is cut off, or a shape in which a portion of an annular shape, as viewed in the Z direction orthogonal to the main surface 201, is cut off. In this embodiment, the main wiring board 2 has a shape in which a portion of an arcuate shape, as viewed in the Z direction orthogonal to the main surface 201, is cut off.

[0056] Furthermore, the sub-patch panel 3 is a patch panel with a portion of its rectangular shape cut off when viewed in the Y direction orthogonal to the main surface 301. The sub-patch panel 3 includes a wide region in the X direction and a narrow protruding region in the X direction.

[0057] Here, viewing in the Z direction includes perspective in the Z direction. Furthermore, the expression "in the Z direction" can include "what is seen in the Z direction." The same applies to the X and Y directions.

[0058] The end surface 203 of the main patch panel 2 includes a non-bent surface portion 2030, a pair of bent surface portions 2031 connected to the non-bent surface portion 2030, and a bent surface portion 2032 provided on the side opposite to the non-bent surface portion 2030 in the Y direction. The non-bent surface portion 2030 and the pair of bent surface portions 2031 are located at the outer periphery of the main patch panel 2, and the bent surface portion 2032 is located at the inner periphery of the main patch panel 2. Each of the pair of bent surface portions 2031 is an example of a first bent surface portion, and the bent surface portion 2032 is an example of a second bent surface portion. The non-bent surface portion 2030 is disposed between the pair of bent surface portions 2031. Note that one of the pair of bent surface portions 2031 may be omitted.

[0059] In the first embodiment, the non-curved surface portion 2030 is a flat surface portion. The X direction is used as the longitudinal direction of the non-curved surface portion 2030. One of the pair of curved surface portions 2031 is connected to one of the two ends of the non-curved surface portion 2030 in the X direction, and the other of the pair of curved surface portions 2031 is connected to the other of the two ends of the non-curved surface portion 2030 in the X direction.

[0060] Here, as Figure 3 As shown, two virtual circles VC1 and VC2 are defined parallel to the XY plane and have different radii. The virtual circle VC2, with a smaller radius, is located inside the virtual circle VC1, which has a larger radius. The two virtual circles VC1 and VC2 can be concentric circles. Furthermore, Figure 1 The optical axis OA passes through the inside of two virtual circles VC1 and VC2.

[0061] A pair of curved surface portions 2031 extend along the virtual circle VC1 with a larger radius among the two virtual circles VC1 and VC2, and a curved surface portion 2032 extends along the virtual circle VC2 with a smaller radius among the two virtual circles VC1 and VC2. As described above, in the first embodiment, from the viewpoint of ensuring the area of ​​the main surfaces 201 and 202, the radius of curvature of the curved surface portion 2032 is smaller than the radius of curvature of the pair of curved surface portions 2031.

[0062] In the first embodiment, at least a portion of the non-bent surface portion 2030 is directly opposite a portion of the main surface 301 of the sub-wiring board 3 in the Y direction, or with a member therebetween. Furthermore, with the non-bent surface portion 2030 opposite the main surface 301 of the sub-wiring board 3, the main surfaces 201 and 202 of the main wiring board 2 are welded to the main surface 301 of the sub-wiring board 3.

[0063] As described above, with a portion of the end surface 203 of the main wiring board 2 facing the main surface 301 of the sub-wiring board 3, the main wiring board 2 and the sub-wiring board 3 are soldered together. This ensures a more sufficient area for mounting multiple electronic components 101 on the main surfaces 201 and 202 of the main wiring board 2 compared to when a portion of the end surface of the sub-wiring board faces the mounting surface of the main wiring board. Furthermore, while ensuring an area where a large number of electronic components 101 to 103 can be mounted in the circuit module 1, the circuit module 1 can be miniaturized, and therefore, the circuit module 1 can be mounted without obstructing light. They are deployed in a small space inside the lens barrel 400 in a certain state. According to the above configuration, a higher density of installation of a large number of electronic components 101, 102 and 103 in the circuit module 1 can be achieved.

[0064] Furthermore, in the first embodiment, the main surface 301 of the sub-panel 3 includes an overlapping portion 3010 that overlaps with the main panel 2 in the Y direction orthogonal to the main surface 301, an extension portion 3011 extending from the overlapping portion 3010 on one side (+Z side) in the Z direction orthogonal to the Y direction, and an extension portion 3012 extending from the overlapping portion 3010 on the other side (-Z side) in the Z direction. The extension portion 3011 is an example of the first portion, and the extension portion 3012 is an example of the second portion.

[0065] The electrical and mechanical connections between the main wiring board 2 and the secondary wiring board 3 will be described in detail here. The main wiring board 2 includes solder resist 41 and multiple pads constituting the main surface 201, and solder resist 42 and multiple pads constituting the main surface 202. The secondary wiring board 3 includes solder resist 43 and multiple pads constituting the main surface 301, and solder resist 44 and multiple pads constituting the main surface 302. Each of the multiple pads is formed of a conductor such as copper, and each of the solder resists 41 to 44 is a film formed of solder resist material.

[0066] The multiple pads formed on the main wiring board 2 and the multiple pads formed on the sub wiring board 3 can each be either solder mask defined (SMD) pads or non-solder mask defined (NSMD) pads. Considering solderability, each pad can be an NSMD pad.

[0067] The main surface 201 of the main wiring board 2 includes multiple pads for bonding with electronic components 101, and two or more pads 11 for bonding with the main surface 301 of the sub wiring board 3.

[0068] The main surface 202 of the main wiring board 2 includes multiple pads for bonding with electronic components 101, and two or more pads 12 for bonding with the main surface 301 of the sub wiring board 3.

[0069] Two or more pads 11 and two or more pads 12 are arranged at the far end of the main wiring board 2 in the -Y direction.

[0070] The plurality of pads on the main surface 301 of the sub-wiring board 3 include two or more pads for bonding with electronic components 102, two or more pads 21 for bonding with the main surface 201 of the main wiring board 2, and two or more pads 22 for bonding with the main surface 202 of the main wiring board 2.

[0071] The multiple pads on the main surface 302 of the sub-wiring board 3 include two or more pads for bonding with electronic components 103.

[0072] With the non-bent surface portion 2030, which is part of the end surface 203 of the main wiring board 2, facing the main surface 301 of the sub wiring board 3, two or more pads 11 on the main surface 201 of the main wiring board 2 and two or more pads 21 on the main surface 301 of the sub wiring board 3 are respectively bonded to each other via solder 61, and two or more pads 12 on the main surface 202 of the main wiring board 2 and two or more pads 22 on the main surface 301 of the sub wiring board 3 are respectively bonded to each other via solder 62.

[0073] In a first embodiment, circuit module 1 is provided with a plurality of auxiliary members 30 for strengthening the connection between the main wiring board 2 and the sub-wiring board 3. Each of the plurality of auxiliary members 30 is a member for assisting the mechanical connection between the main wiring board 2 and the sub-wiring board 3. Each of the plurality of auxiliary members 30 may be a conductive and rigid member, and each may be, for example, a metal member having a cuboid shape. The plurality of auxiliary members 30 are arranged separately on each side of the main wiring board 2 in the Z direction, which is the thickness direction of the main wiring board 2, such that the main wiring board 2 is positioned therebetween. Figure 5 and Figure 6 As shown in the image. Note that... Figure 5 The diagram shows a perspective view of the area in circuit module 1 that includes the junction between the main wiring board 2 and the sub wiring board 3. Figure 6 The diagram shows a cross-sectional view of the area in circuit module 1 including the junction between the main wiring board 2 and the auxiliary wiring board 3. Specifically, Figure 6 This is a diagram showing a cross-section of the circuit module 1 as viewed in the -X direction, taken along a plane parallel to the YZ plane and intersecting with the auxiliary member 30.

[0074] The main surface 201 of the main wiring board 2 includes multiple pads 5 for engaging with auxiliary components 30 deployed on the side of the main surface 201. The main surface 202 of the main wiring board 2 includes multiple pads 6 for engaging with auxiliary components 30 deployed on the side of the main surface 202.

[0075] The secondary wiring board 3 has multiple pads on its main surface 301, including pad 7 for engaging with auxiliary components 30 deployed on the main surface 201 side and pad 8 for engaging with auxiliary components 30 deployed on the main surface 202 side.

[0076] The auxiliary component 30 deployed on the main surface 201 side is bonded to pads 5 and 7 via solder 31. The auxiliary component 30 deployed on the main surface 202 side is bonded to pads 6 and 8 via solder 32. As a result, the connection between the main wiring board 2 and the sub wiring board 3 is strengthened.

[0077] Furthermore, as a result of providing the auxiliary component 30, the amount of tilting of the main wiring board 2 relative to the main surface 301 of the sub-wiring board 3, caused by vibration or hot air during transport when the solder melts during the soldering step, can be reduced. That is, the auxiliary component 30 also assists the main wiring board 2 in standing upright relative to the sub-wiring board 3 during the manufacturing process of the circuit module 1. As a result, the shape and thickness of the solder joints 31, 32, 61, and 62 that join the main wiring board 2 and the sub-wiring board 3 are less likely to vary. Therefore, the uniformity of the solder joint shape and thickness of the solder joints 31, 32, 61, and 62 is improved, and the bonding strength of the solder joints 31, 32, 61, and 62 is increased.

[0078] It should be noted that although the case where auxiliary component 30 is a conductive component has been described as an example, the configuration is not limited to this. Auxiliary component 30 can be a component such as an adhesive or resin that fixes the main wiring board 2 to the sub wiring board 3. In this case, pads 5, 6, 7, and 8, as well as solders 31 and 32, can be omitted.

[0079] When the length of the main distribution board 2 in the X direction (orthogonal to the Y and Z directions) is represented by W1, and the length of the secondary distribution board 3 in the X direction is represented by W2, W2 < W1. The length W1 can also be the width of the main distribution board 2, and the length W2 can also be the width of the secondary distribution board 3. That is, the width of the main distribution board 2 is greater than the width of the secondary distribution board 3.

[0080] In the first embodiment, the main wiring board 2 has a shape in which a portion of the arcuate shape viewed in the Z direction orthogonal to the main surface 201 has been cut off. When the length of the non-curved surface portion 2030 in the X direction (which is a straight line viewed in the Z direction) is represented by W3, W2 ≤ W3 < W1 is satisfied.

[0081] Here, the wiring of the sub-distribution board 3 is connected to each of the plurality of electronic components 102 deployed on the main surface 301 of the sub-distribution board 3. In the first embodiment, from the viewpoint of impedance, etc., the wiring of the sub-distribution board 3 can be as short as possible. From this viewpoint, the plurality of electronic components 102 can be arranged in an integrated manner on the main surface 301 without being separated by the main distribution board 2.

[0082] In the first embodiment, when the length of the extension portion 3011 in the Z direction is represented by L1 and the length of the extension portion 3012 in the Z direction is represented by L2, 0 < L1 < L2 is satisfied. That is, the area of ​​the extension portion 3012 is larger than the area of ​​the extension portion 3011. As a result, multiple electronic components 102 can be integrated and mounted on the extension portion 3012. Therefore, wiring can be shortened, and multiple electronic components 102 can be mounted at a high density on the sub-wiring board 3 while ensuring the electrical reliability of the wiring connected to the multiple electronic components 102. As described above, according to the first embodiment, a higher density mounting of a large number of electronic components 101, 102, and 103 in the circuit module 1 can be achieved.

[0083] Furthermore, as a result of satisfying 0 < L1 < L2, the multiple electronic components 102 mounted on the sub-panel 3 do not need to be arranged such that the main panel 2 is located between them. In the first embodiment, the multiple electronic components 102 are mounted on the extension portion 3012. As a result, relatively large electronic components (i.e., the multiple electronic components 102 included among the multiple electronic components in the circuit module 1) can be deployed on the extension portion 3012 of the main surface 301 of the sub-panel 3. In addition, the wiring interconnecting the multiple electronic components 102 does not need to be provided to extend around the main panel 2, does not need to be provided in the inner layer of the sub-panel 3, and can be deployed in the outermost conductive layer in the sub-panel 3. Therefore, the wiring length of the wiring interconnecting the multiple electronic components 102 can be shortened, and thus disconnections can be reduced.

[0084] Furthermore, integrated circuit components, which are relatively large electronic components, are not mounted on the extension portion 3011. It should be noted that passive components, which are relatively small electronic components, can be mounted on the extension portion 3011.

[0085] The length L2 of the extension portion 3012 in the Z direction can be equal to or greater than nine times the length L1 of the extension portion 3011 in the Z direction. As a result, the area of ​​the extension portion 3012 of the sub-distribution board 3 can be made as large as possible while ensuring the reliability of the connection between the main distribution board 2 and the sub-distribution board 3, and thus more electronic components 102 can be mounted on the extension portion 3012 with high density.

[0086] The plurality of electronic components 102 mounted on the extension 3012 of the main surface 301 include one or more integrated circuit components and one or more passive components. One or more integrated circuit components are, for example, integrated circuit components 1021, 1022, and 1023. Integrated circuit components 1021, 1022, and 1023 are each semiconductor components. Integrated circuit component 1021 is an example of a first electronic component. Integrated circuit components 1022 and 1023 are each examples of a second electronic component. One or more passive components are, for example, chip components 1025. Integrated circuit components 1021, 1022, and 1023 are each larger in size than the passive component, i.e., chip component 1025. Integrated circuit component 1021 is larger in size than each of the plurality of electronic components 101. That is, the larger integrated circuit component can be mounted on the sub-wiring board 3. Note that the second electronic component electrically connected to integrated circuit component 1021 via wiring from the sub-wiring board 3 can be a passive component, for example, chip component 1025.

[0087] At least one of the plurality of electronic components 102 (i.e., each of the integrated circuit components 1022 and 1023 in the first embodiment) is a component including a drive circuit that controls the driving of a lens by a USM (not shown). Integrated circuit component 1021 controls integrated circuit components 1022 and 1023 overall. Integrated circuit components 1021 and 1022 are electrically interconnected via wiring 311 of the sub-wiring board 3. Furthermore, integrated circuit components 1021 and 1023 are electrically interconnected via wiring 312 of the sub-wiring board 3. Note that integrated circuit components 1021, 1022, and 1023 are electrically connected to the main wiring board 2 via wirings 313, 314, and 315 of the sub-wiring board 3, respectively.

[0088] For circuit module 1, since integrated circuit components such as integrated circuit components 1022 and 1023, including drive circuits, are deployed on the sub-wiring board 3, the number of components deployed on the main wiring board 2 can be reduced, and thus the area of ​​the main wiring board 2 can be reduced. As a method for reducing the area of ​​the main wiring board 2, a wider space can be ensured for the lens optical system 100 by increasing the inner diameter of the main wiring board 2, which has an arc shape. As a result, the outer diameter of each lens in the lens optical system 100 can be increased, the length of the lens optical system 100 in the direction of the optical axis OA can be reduced, and as a result, the optical device 500 can be miniaturized and a wider viewing angle can be obtained as an optical function.

[0089] In the first embodiment, integrated circuit components 1021, 1022, and 1023 are mounted on an extension 3012 of the main surface 301. That is, relatively large integrated circuit components 1021, 1022, and 1023 can be mounted on the extension 3012. Furthermore, wirings 311 and 312 of the sub-wiring board 3 are positioned in the Y direction orthogonal to the main surface 301 of the sub-wiring board 3, without overlapping with the main wiring board 2. As a result, wirings 311 and 312 can be shortened. Moreover, wirings 311 and 312 are provided without extending around the main wiring board 2. Therefore, a higher density of mounting of a large number of electronic components 101, 102, and 103 in the circuit module 1 can be achieved while ensuring the electrical reliability of wirings 311 and 312.

[0090] Furthermore, in the first embodiment, the main wiring board 2 has a shape in which a portion of the arcuate shape viewed in the Z direction orthogonal to the main surface 201 is cut off. As a result, the non-curved surface portion 2030 of the end surface 203 of the main wiring board 2 can be brought closer to the main surface 301 of the sub-wiring board 3, and the main wiring board 2 can be easily bonded to the sub-wiring board 3 using solder. Furthermore, the increase in the size of the optical device 500 toward the outside in the radial direction of the lens barrel 400 can be suppressed without restricting the outer diameter of the lens inside the main wiring board 2.

[0091] Here, as Figure 4A As shown, two virtual planes, V1 and V2, are defined. Virtual plane V1 is an example of a first virtual plane, and virtual plane V2 is an example of a second virtual plane. Virtual plane V1 is a virtual plane that extends in the Y and Z directions and is parallel to the YZ plane. Virtual plane V2 is a virtual plane that is parallel to virtual plane V1 and separated from virtual plane V1 by a length W2 in the X direction. Virtual plane V1 contacts one of the two ends E1 and E2 of the sub-patch panel 3 in the X direction, E1. Virtual plane V2 contacts the other end E2 of the two ends E1 and E2 of the sub-patch panel 3 in the X direction, E2. End E1 is an example of a first end, and end E2 is an example of a second end.

[0092] In the first embodiment, at least a portion of at least one of the plurality of electronic components 101 is located outside the region R1 between the virtual planes V1 and V2. Figure 3 and Figure 4AIn the example, each of two of the four electronic components 101 is entirely located outside region R1, and each of the two electronic components 101 is partially located outside region R1. That is, because the main wiring board 2 has an arc shape with a cutout, the relatively large electronic components 101 are partially or entirely deployed outside region R1.

[0093] In addition, such as Figure 4A As shown, the length W4 (= W1 - W2) of the portion of the main wiring board 2 outside region R1 in the X direction can be equal to or greater than the length of the shortest side of the smallest of the plurality of electronic components 101 mounted on the main wiring board 2. In other words, when the thickness of the main wiring board 2 is represented by L3, W1 - W2 ≥ L3 is satisfied. By adopting such dimensions, the area on which the plurality of electronic components 101 are mounted on the main wiring board 2 can be ensured.

[0094] Furthermore, the portions of the main wiring board 2 and the sub-wiring board 3 on the extension portion 3012 side are fixed to each other via components constituting the lens of the optical device 500, rubber bushings (not shown) between the inner housing and the outer housing, etc. In contrast, the portion of the sub-wiring board 3 on the extension portion 3011 side cannot be fixed by rubber bushings, etc., and is in a free state.

[0095] In the first embodiment, when the distance between the end of the solder 31 that protrudes the most from the main surface 201 toward one side (+Z side) in the Z direction among the plurality of solders 61 and the plurality of solders 31, and the end of the solder 32 that protrudes the most from the main surface 202 toward the other side (-Z side) in the Z direction among the plurality of solders 62 and the plurality of solders 32, denoted by L4, is satisfied that L1 ≤ L4. As a result of satisfying L1 ≤ L4, the bonding strength of the solder joint portion between the main wiring board 2 and the sub wiring board 3 is increased, vibration on the extension portion 3011 side of the sub wiring board 3 is suppressed in the event of an impact such as a drop of the optical device 500, and the reliability of the solder joint is improved.

[0096] Furthermore, the length of the extension 3011 in the X direction will be represented by W5. For example... Figure 1 As shown, the sub-circuit board 300 is deployed on the outer periphery of the main circuit board 200. Therefore, in the first embodiment, from the viewpoint of deploying the circuit module 1 in the narrow space inside the lens barrel 400, the length W5 of the extension portion 3011 is less than the length W3 of the non-curved surface portion 2030 (W5 < W3).

[0097] In addition, such as Figure 1As shown, with the optical device 500 attached to the camera body 600, the extension portion 3011 is closer to the camera body 600 than the extension portion 3012. That is, the optical device 500 includes a coupling mechanism 510, which is an example of a mounting portion for attaching the optical device 500 to the camera body 600. Therefore, the extension portion 3011 is closer to the coupling mechanism 510 than the extension portion 3012. As a result, the amount of protrusion of the sub-wiring board 3 (sub-circuit board 300) towards the camera body 600 can be reduced, and collisions between the sub-wiring board 3 and surrounding components can be suppressed.

[0098] As described above, according to the first embodiment, a technology that facilitates the higher density mounting of a large number of electronic components can be provided.

[0099] Second Embodiment

[0100] The second embodiment will be described. In the following description, unless otherwise stated, elements indicated by the same reference numerals as in the first embodiment are considered to have substantially the same configuration and function as those described in the first embodiment, and the parts that differ from the first embodiment will be described primarily.

[0101] Figure 7 This is a cross-sectional view of a portion of the circuit module 1A according to the second embodiment. The optical device of the second embodiment has... Figure 1 In the optical device 500 of the first embodiment shown, a circuit module 1A is deployed inside the lens barrel 400 instead of the circuit module 1. Except for the circuit module 1A, the components in the optical device of the second embodiment are substantially the same as those in the optical device 500 of the first embodiment, and therefore their description will be omitted.

[0102] Circuit module 1A is a three-dimensional mounting structure. The circuit module 1A of the second embodiment includes a main wiring board 2A replacing the main wiring board 2, a secondary wiring board 3, and a plurality of passive components 30A serving as examples of auxiliary components, replacing the plurality of auxiliary components 30. In circuit module 1A, the components other than the main wiring board 2A and the passive components 30A are the same as in circuit module 1. Note that... Figure 7 The diagram shows a cross-sectional view of the region in circuit module 1A including the junction between the main wiring board 2A and the sub-wiring board 3. Specifically, Figure 7 This is a diagram showing a cross-section of circuit module 1A as viewed in the -X direction, taken along a plane parallel to the YZ plane and intersecting with the passive component 30A.

[0103] Part of the configuration of main patch panel 2A differs from that of main patch panel 2. Specifically, main patch panel 2A includes pads 5A and 5B that replace pad 5, and pads 6A and 6B that replace pad 6. Apart from pads 5A, 5B, 6A, and 6B, the components in main patch panel 2A are substantially the same as those in main patch panel 2.

[0104] On the main surface 201 of the main wiring board 2A, pad 5A is arranged to be spaced from pad 5B in the Y direction, and on the main surface 202 of the main wiring board 2A, pad 6A is arranged to be spaced from pad 6B in the Y direction.

[0105] Passive component 30A is an electronic component such as a resistor, capacitor, or inductor. In the second embodiment, passive component 30A is a surface-mount chip component. Passive component 30A includes two electrodes 31A and 31B. In passive component 30A, the two electrodes 31A and 31B are arranged in a longitudinal direction.

[0106] The electrodes 31A and 31B of the passive component 30A, deployed on the main surface 201 side of the main wiring board 2A, are opposite to the pads 5A and 5B in the Z direction, respectively. The electrodes 31A and 31B of the passive component 30A, deployed on the main surface 202 side of the main wiring board 2A, are opposite to the pads 6A and 6B in the Z direction, respectively. As a result, the passive component 30A is deployed such that the longitudinal direction of the passive component 30A is parallel to or approximately parallel to the Y direction orthogonal to the main surface 301 of the sub-wiring board 3.

[0107] The electrode 31A of the passive component 30A deployed on the main surface 201 side of the main wiring board 2A is opposite to the pad 7 in the Y direction. The electrode 31A of the passive component 30A deployed on the main surface 202 side of the main wiring board 2A is opposite to the pad 8 in the Y direction.

[0108] The electrodes 31A of the passive component 30A deployed on the main surface 201 side of the main wiring board 2A are electrically and mechanically connected to pads 5A and 7 by being bonded to pads 5A and 7 via solder 31. The electrodes 31A of the passive component 30A deployed on the main surface 202 side of the main wiring board 2A are electrically and mechanically connected to pads 6A and 8 by being bonded to pads 6A and 8 via solder 32.

[0109] As a passive component 30A, an appropriate size is selected based on the thickness and dimensions of the main wiring board 2A and the space between the main wiring board 2A and the sub-wiring board 3. Considering the upright nature of the main wiring board 2A, multiple passive components 30A can be deployed on various sides of the main wiring board 2A.

[0110] The passive component 30A can be a chip component including two electrodes 31A and 31B, and the main wiring board 2A and the sub-wiring board 3 can be deployed such that the main wiring board 2A and the sub-wiring board 3 are orthogonal to each other. As a result, the uniformity of the solder joint shape is improved, and therefore the bonding strength of the solder joint is improved. In addition, noise can be reduced by providing the passive component 30A, and the stability of electrical operation in the circuit module 1A can be improved by electrically connecting one of the two electrodes 31A and 31B of the passive component 30A to the ground of the power supply circuit.

[0111] It should be noted that although the second embodiment describes a configuration where pad 5A on the main wiring board 2A is spaced apart from pad 5B in the Y direction and pad 6A is also spaced apart from pad 6B in the Y direction, the configuration is not limited to this. For example, pad 5A may be spaced apart from pad 5B in the X direction, and pad 6A may be spaced apart from pad 6B in the X direction. In this case, passive component 30A is configured such that its longitudinal direction is parallel or approximately parallel to the X direction.

[0112] As described above, according to the second embodiment, similar to the first embodiment, a technology that facilitates the higher density mounting of a large number of electronic components can be provided.

[0113] Modify Example

[0114] Modified examples of the first embodiment will be described below. In the following description, unless otherwise stated, elements represented by the same reference numerals as in the first embodiment are considered to have substantially the same configuration and function as those described in the first embodiment, and the differences from the first embodiment will be described primarily.

[0115] Figure 8A and Figure 8B Each is a schematic perspective view of circuit module 1B based on the first modified example. Figure 8C and Figure 8D Each is a schematic perspective view of circuit module 1C based on the second modified example. Figure 8E and Figure 8F Each is a schematic perspective view of circuit module 1D according to the third modified example. In circuit modules 1B to 1D, the size and arrangement of electronic components, as well as the shape and size of the main wiring board 2 or the sub-wiring board 3, differ from those in the first embodiment.

[0116] In circuit module 1B, the secondary wiring board 3 is rectangular in plan view. In circuit module 1C, the secondary wiring board 3 has a rectangular shape with cutouts in plan view, and similar to the first embodiment, includes a wide region and a narrow protruding region, but the narrow protruding region is longer in the longitudinal direction than the secondary wiring board 3 of the first embodiment. In circuit module 1D, the shape of the primary wiring board 2 differs from that of the first embodiment. That is, the end surface 203 of the primary wiring board 2 includes a curved surface portion 2031 only on one side of the non-curved surface portion 2030 in the longitudinal direction.

[0117] In the circuit modules 1B to 1D of the first to third modified examples, for example, electronic components (e.g., integrated circuit components) susceptible to external noise can be deployed on the main surface 301 of the sub-wiring board 3. These electronic components susceptible to external noise can be deployed to overlap with the inner layer of the sub-wiring board 3, where a grounding pattern is deployed, in the thickness direction of the sub-wiring board 3.

[0118] The shape of the sub-wiring board 3, the joint position between the main wiring board 2 and the sub-wiring board 3, and the size, quantity and arrangement of the electronic components are appropriately set according to the function of the optical equipment 500, the arrangement of the lens optical system 100, the gap between the lens barrel 400 and the components.

[0119] It should be noted that modifications such as the first to third modification examples described above can also be applied to circuit module 1A of the second embodiment.

[0120] Example

[0121] Example 1, corresponding to the first embodiment, and Example 2, corresponding to the second embodiment, will be described below.

[0122] Example 1

[0123] The dimensions of each part of circuit module 1 are as follows. The main wiring board 2 is a two-layer printed wiring board with a cut-out arc shape, and includes an FR-4 insulating layer and copper wiring layers formed on the front and back sides of the insulating layer.

[0124] The main patch panel 2 has an outer radius of 32 mm, an inner radius of 22 mm, and a thickness of 0.8 mm. The angle between the radial outer angle of the main patch panel 2 and the center of the arc is 125°. The length W3 of the non-bent surface portion 2030 is 30 mm. The non-bent surface portion 2030 of the end surface 203 of the main patch panel 2 is a flat surface orthogonal to the main surfaces 201 and 202. Multiple pads 11 and multiple pads 12 each have a thickness of 0.015 mm, a width of 0.125 mm, and a length of 1.0 mm. The spacing of the multiple pads 11 in the X direction and the spacing of the multiple pads 12 in the X direction are each 0.25 mm. The number of multiple pads 11 is 30, and the number of multiple pads 12 is 30.

[0125] Two pads 5 are formed on the main surface 201 of the main wiring board 2, and two pads 6 are formed on the main surface 202 of the main wiring board 2. A plurality of pads 11 are arranged between the two pads 5, and a plurality of pads 12 are arranged between the two pads 6. Each pad 5 and pad 6 has a thickness of 0.015 mm, a width of 1.2 mm, and a length of 1.2 mm.

[0126] Among the electronic components 101 mounted on the main wiring board 2, the smallest electronic component is a 3216-sized (3.2mm × 1.6mm) chip component. Among the electronic components 101 mounted on the main wiring board 2, the largest electronic component is a 20mm × 9mm connector component.

[0127] Sub-wiring board 3 is a six-layer printed wiring board, and is composed of a laminate of FR-4 insulation layer and copper wiring layer.

[0128] A pad group comprising multiple pads 21 and multiple pads 22 is formed in a narrow protruding area on the sub-wiring board 3. The narrow protruding area forming the pad group on the sub-wiring board 3 has a width of 13 mm, a length of 10 mm, and a thickness of 0.8 mm. A wide area on the sub-wiring board 3 where electronic components are primarily mounted has a width W2 of 25 mm, a length of 20 mm, and a thickness of 0.8 mm. Each of the multiple pads 21 and multiple pads 22 has a thickness of 0.015 mm, a width of 0.125 mm, and a length of 1.0 mm. The spacing between the multiple pads 21 and multiple pads 22 in the X-direction is 0.25 mm, and the number of multiple pads 21 and multiple pads 22 is 30.

[0129] Two pads 7 and two pads 8 are formed on the main surface 301 of the sub-wiring board 3. Multiple pads 21 are positioned between the two pads 7, and multiple pads 22 are positioned between the two pads 8. Each pad 7 and pad 8 has a thickness of 0.015 mm, a width of 1.2 mm, and a length of 1.2 mm. The distance in the Z-direction between the multiple pads 21 and the multiple pads 22, and the distance in the Z-direction between the pads 7 and the pads 8, are each 0.8 mm.

[0130] On the main surface 301 of the sub-wiring board 3, an electronic component with a maximum size of 15mm × 15mm and two electronic components each with a size of 5mm × 5mm are mounted.

[0131] Multiple pads 11 on the main wiring board 2 are respectively bonded to multiple pads 21 on the sub wiring board 3 via solder 61, and multiple pads 12 on the main wiring board 2 are respectively bonded to multiple pads 22 on the sub wiring board 3 via solder 62.

[0132] The auxiliary component 30 is a cubic copper chip with each side length of 1 mm. The auxiliary component 30 deployed on the main surface 201 side of the main wiring board 2 is bonded to pads 5 and 7 via solder 31, and the auxiliary component 30 deployed on the main surface 202 side of the main wiring board 2 is bonded to pads 6 and 8 via solder 32. The metal composition of the solder is Sn-3.0Ag-0.5Cu.

[0133] The length L1 of the extension portion 3011 of the secondary wiring board 3 is 2.5 mm, and the length L2 of the extension portion 3012 is 26.7 mm. The length W4 of the main wiring board 2 is 10 mm. The length L4 between the end of solder 31 and the end of solder 32 is 3.4 mm.

[0134] The multiple electronic components 102 mounted on the secondary patch panel 3 are not arranged such that the joint between the primary patch panel 2 and the secondary patch panel 3 is located therebetween; instead, they are integrated on the extension portion 3012. Larger electronic components 102 can be deployed on the extension portion 3012 of the secondary patch panel 3. Wiring connecting each of the multiple electronic components 102 mounted on the main surface 301 of the secondary patch panel 3 is deployed on the side of the extension portion 3012 without bypassing the primary patch panel 2. Furthermore, since it is not necessary to deploy the wiring in the inner layer of the secondary patch panel 3, the wiring length can be reduced, and disconnections can be reduced. In addition, wiring design constraints are reduced, and the degree of freedom in wiring design is increased.

[0135] As a result of the main wiring board 2 including the non-bent surface portion 2030, the main wiring board 2 can be joined to the sub-wiring board 3 when the non-bent surface portion 2030 is opposite to the main surface 301 of the sub-wiring board 3. As a result, the outer diameter of the lens is not restricted, and the outer diameter of the optical device 500 does not increase. Furthermore, as a result of providing the auxiliary member 30, the amount of tilting of the main wiring board 2 relative to the direction orthogonal to the main surface 301 of the sub-wiring board 3 due to shaking or hot air during transport when the solder melts in the soldering step can be reduced, and the shape and thickness of the solder joint where the main wiring board 2 and the sub-wiring board 3 are joined together are less likely to change. Therefore, the uniformity of the solder joint shape and thickness is improved, and the bonding strength of the solder joint is improved.

[0136] Furthermore, the portions of the main wiring board 2 and the sub-wiring board 3 on the extension 3012 side are secured by the lens components of the optical device 500 or by a rubber bushing (not shown) between the inner housing and the outer housing. In contrast, the portion of the sub-wiring board 3 on the extension 3011 side cannot be secured by a rubber bushing or the like and is in a free state. As a result of satisfying L1 ≤ L4, the joint strength of the solder joint between the main wiring board 2 and the sub-wiring board 3 is increased, vibration on the extension 3011 side of the sub-wiring board 3 is suppressed in the event of an impact such as a drop of the optical device 500, and therefore the reliability of the solder joint is improved.

[0137] With the solder bonding the main wiring board 2 and the sub wiring board 3 molten, the main wiring board 2 is pulled by the molten solder wetting and spreading on pads 5 and 7, and on pads 6 and 8, generating a self-aligning force on the main wiring board 2. As a result of this self-aligning effect, the sub wiring board 3 and the main wiring board 2 become orthogonal or nearly orthogonal to each other. As a result, the uniformity of the solder corner shapes of solders 31, 32, 61, and 62 is improved, and the bonding strength of the solder joints is enhanced.

[0138] Example 2

[0139] The dimensions of each part of circuit module 1A are as follows. A chip component serving as a capacitor is used as passive component 30A. Passive component 30A is a laminated ceramic capacitor with dimensions of 2012 (2.0 mm × 1.2 mm) at each end where electrodes 31A and 31B are formed. Pads 5A, 5B, 6A, and 6B each have a thickness of 0.015 mm, a width of 1.2 mm, and a length of 0.4 mm, and the distance between electrodes 31A and 31B is 1.2 mm. Other parts are substantially the same as in Example 1.

[0140] Furthermore, as a result of the separation of pads 5A and 5B, and pads 6A and 6B, when solders 31 and 32 are in a molten state, a greater force is generated on the passive component 30A, which serves as an auxiliary component, to pull the main wiring board 2A from both sides and to push the main wiring board 2A toward the sub-wiring board 3. As a result of this self-aligning force, the main wiring board 2A and the sub-wiring board 3 become orthogonal or nearly orthogonal to each other. As a result of this, the uniformity of the solder corner shapes of solders 31, 32, 61, and 62 is improved, and the joint strength of the solder joints is increased.

[0141] Other modification examples

[0142] This disclosure is not limited to the embodiments described above, and modifications can be made in many ways within the scope of the technical concept. Furthermore, the effects described in this embodiment are merely an enumeration of the most preferred effects and are not limited to this disclosure. Moreover, at least two of the above embodiments and modified examples can be combined.

[0143] Furthermore, the electronic devices to which the above embodiments can be applied are not limited to the optical devices described above, and the embodiments can also be applied, for example, to information devices such as smartphones and personal computers, communication devices such as modems and routers, office equipment such as printers and copiers, medical devices such as X-ray imaging equipment and endoscopes, industrial equipment such as robots and semiconductor manufacturing apparatuses, and transportation equipment such as automobiles, airplanes and ships.

[0144] Furthermore, the electronic components to which the above embodiments can be applied are not limited to the examples described above, and the above embodiments can also be applied, for example, to image pickup devices, semiconductor devices for image processing, memory ICs, and power ICs.

[0145] The disclosure of this specification includes not only what is explicitly described herein, but also all matters that can be grasped from this specification and the accompanying drawings. Furthermore, the disclosure of this specification includes a complementary set of each individual concept described herein. That is, for example, where this specification includes the description "A is B," even if the description "A is not B" is omitted, it can be said that this specification discloses the concept "A is not B." This is because "A is B" is described under the premise that the case "A is not B" has already been considered.

[0146] As described above, according to this disclosure, a technique can be provided that facilitates the higher density mounting of a large number of electronic components.

[0147] While this disclosure has been described with reference to embodiments, it is to be understood that this disclosure is not limited to the disclosed embodiments. The scope of the appended claims is to be given the broadest interpretation in order to cover all such modifications and equivalent structures and functions.

Claims

1. A circuit module, comprising: A first wiring board, the first wiring board including a first main surface and a second main surface, the second main surface being provided on a side opposite to the first main surface; as well as The second wiring board includes a third main surface, which intersects a direction along the first main surface; The first main surface and the second main surface of the first wiring board are soldered to the third main surface of the second wiring board. The third main surface of the second wiring board includes an overlapping portion, a first portion, and a second portion. The overlapping portion overlaps with the first wiring board in a first direction orthogonal to the third main surface. The first portion extends from the overlapping portion on one side in a second direction orthogonal to the first direction, and the second portion extends from the overlapping portion on the other side of the second direction. Where W2 < W1 is satisfied, where W1 represents the length of the first wiring board in a third direction orthogonal to the first and second directions, and W2 represents the length of the second wiring board in that third direction. Where L1 < L2 is satisfied, where L1 represents the length of the first part in the second direction, and L2 represents the length of the second part in the second direction, and The circuit module further includes multiple electronic components mounted on the second part.

2. The circuit module according to claim 1, wherein the length L2 of the second portion in the second direction is equal to or greater than nine times the length L1 of the first portion in the second direction.

3. The circuit module according to claim 1, The first wiring board includes an end surface that interconnects the first main surface and the second main surface. The end surface includes a non-curved surface portion, and The non-curved surface portion of the end surface is opposite to the third main surface.

4. The circuit module of claim 3, wherein the end surface includes a first curved surface portion connected to the non-curved surface portion.

5. A circuit module, comprising: A first wiring board, the first wiring board including a first main surface, a second main surface, and an end surface, the second main surface being provided on a side opposite to the first main surface, the end surface interconnecting the first main surface and the second main surface; The second wiring board includes a third main surface, which intersects a direction along the first main surface; as well as Multiple electronic components are mounted on the third main surface. The end surface includes a non-bent surface portion and a first bent surface portion, the first bent surface portion being connected to the non-bent surface portion, and In the state where the non-bent surface portion is opposite to the third main surface of the second wiring board, the first main surface and the second main surface of the first wiring board are soldered to the third main surface of the second wiring board.

6. The circuit module according to any one of claims 3 to 5, wherein the non-curved surface portion of the end surface is a flat surface portion.

7. The circuit module according to any one of claims 3 to 5, wherein the end surface includes a second curved surface portion located on a side opposite to the non-curved surface portion in a first direction orthogonal to the third main surface of the second wiring board.

8. The circuit module of claim 3, wherein W2 ≤ W3 < W1 is satisfied, and W3 represents the length of the non-curved surface portion in the third direction.

9. The circuit module according to any one of claims 1 to 4, The plurality of electronic components includes a first electronic component and a second electronic component. The first electronic component is an integrated circuit component, and the second electronic component is electrically connected to the first electronic component via wiring on the second wiring board. The first electronic component and the second electronic component are mounted on the second part.

10. The circuit module of claim 9, wherein no integrated circuit components are mounted on the first portion.

11. The circuit module of claim 9, wherein the wiring does not overlap with the first wiring board in the first direction.

12. The circuit module of claim 9, wherein at least one of the plurality of electronic components includes a drive circuit configured to control a motor.

13. The circuit module according to any one of claims 1 to 4, further comprising: A third electronic component, which is mounted on the first wiring board. At least a portion of the third electronic component is located outside the region between the first virtual plane and the second virtual plane, the first virtual plane being in contact with a first end of the third-oriented second wiring board and extending in both the first and second directions, and the second virtual plane being in contact with a second end of the third-oriented second wiring board and parallel to the first virtual plane.

14. The circuit module according to any one of claims 1 to 4, wherein W1 - W2 ≥ L3 is satisfied, and L3 represents the thickness of the first wiring board.

15. The circuit module according to any one of claims 1 to 4, wherein L1 ≤ L4 is satisfied, wherein L4 represents the distance between the end of the solder protruding from one side of the first main surface in the second direction and the end of the solder protruding from the other side of the second main surface in the second direction.

16. The circuit module according to any one of claims 1 to 4, further comprising an auxiliary component configured to assist the mechanical connection between the first wiring board and the second wiring board.

17. The circuit module of claim 16, wherein the auxiliary component is a passive component.

18. An optical device, comprising: Multiple lenses are arranged along the optical axis; as well as The circuit module according to any one of claims 1 to 17.

19. The optical device of claim 18, wherein the optical device is a replaceable lens that is attachable to and detachable from the camera body.

20. The optical device of claim 19, wherein the optical device includes a mounting portion for attaching the optical device to the camera body, and the first portion is closer to the mounting portion than the second portion.

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