A top heat dissipation PCBA module and an integrated assembly method thereof

Abstract

The application discloses a top heat dissipation PCBA module and an integrated assembling method thereof, and relates to the technical field of PCBA modules, and the technical field of PCBA modules, and comprises a heat dissipation device, a control device, a power device and a heat-conducting insulating material, wherein the power device comprises a PCB power plate, a plurality of power semiconductors, a signal connecting piece and a power connecting piece; the PCB power plate has a device mounting side and a connecting piece mounting side, and the device mounting side and the connecting piece mounting side are located on different sides of the PCB power plate; the plurality of power semiconductors are discrete top heat dissipation packaged power semiconductors and are surface-mounted on the device mounting side of the PCB power plate; through the cooperation of the surface mounting integration of the discrete top heat dissipation power semiconductors and the PCB power plate, the power connection and the signal connection and the split arrangement of the top direct heat conduction path, the integrated adaptability of the PCBA module, the interconnection flexibility between the plates and the heat dissipation efficiency are improved.

Description

Technical Field

[0001] This invention relates to the field of PCBA module technology, specifically to a top-heat-dissipating PCBA module and its integration and assembly method. Background Technology

[0002] As power electronic devices develop towards higher power density, miniaturization, and modularization, PCBA modules need to simultaneously realize functions such as power conversion, control drive, signal sampling, and heat dissipation management within a limited space. Power semiconductors are core heat-generating devices in power conversion, motor drive, vehicle power supply, energy storage converter, and industrial power supply devices. Their installation method, interconnection method, and heat dissipation path directly affect the power density, assembly adaptability, and operational reliability of PCBA modules.

[0003] In existing power modules, multiple power semiconductors are often integrated into a single power module through die integration, custom packaging, or complex internal interconnections. While this approach can improve power density to some extent, it places high demands on customized packaging, internal interconnect structures, specialized manufacturing processes, and subsequent maintenance. When different product models require changes in power rating, connection interfaces, board height, or installation space, the overall power module structure usually needs to be redesigned, making it difficult to achieve rapid integration using mature standard surface mount production lines.

[0004] On the other hand, in conventional PCBA modules, power semiconductors, signal connection terminals, and power connection terminals may be concentrated on the same side, or the positions of the connectors may lack a unified match with the interface positions of the control devices, power input / output nodes, and inter-board insertion distances. This type of structure can easily lead to interference between power connection paths and signal connection paths, and is also not conducive to forming an adjustable height and position inter-board electrical connection between the power device and the control device. For power supply products that require platform-based design, if the power connectors and signal connectors cannot be adapted to the interface positions, power nodes, and insertion distances, it will reduce the convenience of module replacement, functional expansion, and structural upgrades.

[0005] Furthermore, in traditional bottom-heat dissipation or PCB-based heat transfer solutions, the heat generated by the power semiconductor must first pass through pads, copper foil, thermal vias, or the PCB substrate before being transferred to the heat dissipation structure. Due to the limited thermal conductivity of the PCB substrate and the long heat transfer path, heat dissipation channels with high thermal resistance are easily formed. When the power semiconductor operates at high current or high power density, relying solely on the PCB as the primary heat dissipation channel may not be sufficient to dissipate heat in a timely manner, potentially affecting the operating temperature of the power semiconductor and the reliability of the module.

[0006] Therefore, a top-heat-dissipating PCBA module and its integrated assembly method are proposed. Summary of the Invention

[0007] The purpose of this invention is to provide a top-heat-dissipating PCBA module and its integration and assembly method, which has the advantages of improving the heat dissipation efficiency of power semiconductors and simultaneously improving the convenience of module replacement, functional expansion and structural upgrade. It solves the problems of insufficient integration adaptability of discrete power semiconductors in existing PCBA modules, difficulty in adapting the height and position of inter-board interconnection, and long heat dissipation path of power semiconductors.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a top-heat-dissipating PCBA module, comprising a heat dissipation device, a control device, a power device, and a thermally conductive insulating material; The power device includes a PCB power board, multiple power semiconductors, signal connectors, and power connectors; The PCB power board has a component mounting side and a connector mounting side, which are located on different sides of the PCB power board. All of the power semiconductors are discrete top-heat-dissipating packaged power semiconductors and are surface-mounted on the device mounting side of the PCB power board; Both the signal connector and the power connector are electrically connected and fixed to the connector mounting side of the PCB power board; The thermally conductive insulating material is disposed between the top heat dissipation surface of the power semiconductor and the heat dissipation device. The heat dissipation device abuts against the top heat dissipation surface of the power semiconductor through the thermally conductive insulating material to form a heat dissipation path from the top heat dissipation surface of the power semiconductor through the thermally conductive insulating material to the heat dissipation device.

[0009] Preferably, the control device includes a control circuit interface, a drive circuit interface, a sampling circuit interface, and an auxiliary power source circuit interface, and the positions of the multiple circuit interfaces correspond to the positions of the signal connectors.

[0010] Preferably, the power device is electrically connected to the control device via a signal connector, and is also electrically connected to the power conversion interface in the control device via a power connector, thereby forming an inter-board electrical connection between the power device and the control device.

[0011] Preferably, the PCB power board is provided with a temperature sampling resistor NTC, and the power device includes at least a temperature sampling resistor NTC, a power semiconductor, a signal connector, and a power connector; The power connector is selected from at least one of conductive copper pillars, conductive aluminum pillars, copper busbars and aluminum busbars. The power connector is electrically connected and fixed to the PCB power board by welding, plugging or screw connection. The signal connector is selected from at least one of pin headers, pins, and cables, and is electrically connected and fixed to the PCB power board by soldering or plugging.

[0012] Preferably, the heat dissipation device is a metal heat sink, which is selected from at least one of liquid cooling devices, air cooling devices, finned heat sinks, and toothed heat sinks. The thermally conductive and insulating material is formed by a composite of insulating and thermally conductive materials, or is a material that simultaneously possesses insulating and thermally conductive functions.

[0013] Preferably, the number of power semiconductors is matched with the target output power, target operating current, and number of power conversion branches of the PCBA module.

[0014] Preferably, a PCBA module integration and assembly method, applied to a top-heat-dissipating PCBA module, includes the following steps: S1. Component preparation: Provide heat dissipation devices, control devices, PCB power boards, multiple power semiconductors, signal connectors, power connectors and thermally conductive insulating materials, and determine the shape, size and assembly position of the PCB power board according to the installation space of the top heat dissipation PCBA module. S2. Component mounting: Based on the power requirements of the top heat dissipation PCBA module, multiple power semiconductors are mounted on one side of the PCB power board using standard surface mount technology. S3. Connection and Assembly: Based on the interface position of the control device, the power input and output nodes on the PCB power board, and the insertion distance between the PCB power board and the control device, install signal connectors and power connectors on the other side of the PCB power board respectively. S4. Top heat conduction: A thermally conductive insulating material is placed between the top heat dissipation surface of the power semiconductor and the heat dissipation device, so that the top heat dissipation surface of the power semiconductor can transfer heat to the heat dissipation device through the thermally conductive insulating material. S5. Inter-board interconnection: The PCB power board equipped with power semiconductors, signal connectors and power connectors is used as a power device, and the power device and the control device are electrically connected to each other through the signal connectors and power connectors.

[0015] Preferably, in S2, the surface mount process includes solder paste printing, device mounting, reflow soldering, and solder joint inspection. After the solder joint inspection is qualified, the assembly of signal connectors and power connectors is then performed.

[0016] Preferably, in S4, before setting the thermally conductive insulating material, the corresponding contact area between the top heat dissipation surface of the power semiconductor and the heat dissipation device is cleaned; after setting the thermally conductive insulating material, the bonding status between the top heat dissipation surface of the power semiconductor, the thermally conductive insulating material, and the heat dissipation device is checked.

[0017] Preferably, in S3, the assembly position of the signal connector on the PCB power board is first determined based on the positions of the control circuit interface, drive circuit interface, sampling circuit interface and auxiliary power source circuit interface of the control device; Then, the assembly position of the power connector on the PCB power board is determined according to the position of the power input and output nodes on the PCB power board and the power conversion interface in the control device. The connection heights of the signal connectors and power connectors are determined based on the insertion distance between the PCB power board and the control device.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. This invention places the power semiconductor on the device mounting side of the PCB power board and the signal connector and power connector on the connector mounting side of the PCB power board. This allows the power semiconductor and the connector to be located on different sides of the PCB power board, which is beneficial for forming a spatial division of the device mounting area, signal interconnection area and power interconnection area in the same power device, and facilitates the inter-board electrical connection between the power device and the control device.

[0019] 2. This invention places a thermally conductive insulating material between the top heat dissipation surface of the power semiconductor and the heat dissipation device, so that the top heat dissipation surface of the power semiconductor can directly transfer heat to the heat dissipation device through the thermally conductive insulating material. Compared with the method of mainly relying on the PCB power board for heat transfer, it can shorten the heat transfer path, reduce the thermal resistance of the heat dissipation path, and improve the heat dissipation efficiency of the power semiconductor.

[0020] 3. This invention integrates multiple discrete top-heat-dissipated packaged power semiconductors onto the device mounting side of the same PCB power board using standard surface mount technology. This allows for the assembly of multiple power semiconductors using mature SMT production lines, avoiding reliance on custom bare chip integration or complex package-level interconnects. This helps reduce manufacturing complexity and improves the convenience of expanding the module's power level. Attached Figure Description

[0021] Figure 1 This is an exploded view of the PCBA module of the present invention; Figure 2 This is a schematic diagram of the control device of the present invention; Figure 3 This is a schematic diagram of the connector mounting side structure in the power device of the present invention; Figure 4 This is a schematic diagram of the device mounting side structure in the power device of the present invention; Figure 5 This is a simplified equivalent diagram of the PCBA module of the present invention; Figure 6 This is a schematic diagram of the PCBA module integration and assembly method of the present invention; Figure 7 This is a schematic diagram of the hardware system principle of the PCBA module of the present invention.

[0022] In the diagram: 1. Heat dissipation device; 2. Control device; 3. Signal connector; 4. Power connector; 5. Power device; 6. Power semiconductor. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0024] Please see Figures 1 to 7 The present invention provides a technical solution: a top heat dissipation PCBA module, including a heat dissipation device 1, a control device 2, a power device 5, and a thermally conductive insulating material; The power device 5 includes a PCB power board, multiple power semiconductors 6, signal connectors 3 and power connectors 4. The PCB power board has a device mounting side and a connector mounting side, which are located on different sides of the PCB power board. The power semiconductors 6 are all discrete top heat-dissipating packaged power semiconductors and are surface-mounted on the device mounting side of the PCB power board. The signal connectors 3 and power connectors 4 are electrically connected and fixed to the connector mounting side of the PCB power board. The thermally conductive insulating material is disposed between the top heat dissipation surface of the power semiconductor 6 and the heat dissipation device 1. The heat dissipation device 1 abuts against the top heat dissipation surface of the power semiconductor 6 through the thermally conductive insulating material to form a heat dissipation path from the top heat dissipation surface of the power semiconductor 6 through the thermally conductive insulating material to the heat dissipation device 1.

[0025] like Figures 1-5 As shown, the multiple power semiconductors 6 are all discrete top-heat-dissipated packaged power semiconductors. The discrete top-heat-dissipated packaged power semiconductor refers to a single power device existing in an independent package form and having a top heat dissipation surface for transferring heat to an external heat dissipation structure. The power semiconductor 6 can be a silicon carbide power device, an insulated gate bipolar transistor, a gallium nitride power device, or a metal oxide semiconductor field-effect transistor. The package of the power semiconductor 6 can be QDPAK, HU3PAK, TCOP10, SSOT10, DFN5X6, TOLT, or other discrete packages with a top heat dissipation surface.

[0026] Meanwhile, the number of power semiconductors 6 can be determined based on the target output power, target operating current, and number of power conversion branches of the top heat dissipation PCBA module. When the target output power is high or the number of power conversion branches is large, more power semiconductors 6 can be set on the PCB power board. When the product needs to reduce the power level or shrink the module size, the number of power semiconductors 6 can be reduced. Thus, the power device 5 can form variant solutions with different power levels based on the same PCB power board layout.

[0027] Meanwhile, multiple power semiconductors 6 are mounted on the device mounting side of the PCB power board using a standard surface mount process. The standard surface mount process may include solder paste printing, device mounting, reflow soldering, and solder joint inspection. Solder paste printing is used to apply solder paste to the corresponding pads on the PCB power board. Device mounting is used to place the power semiconductors 6 in the corresponding pad positions. Reflow soldering is used to form reliable solder joints with the solder paste. Solder joint inspection is used to check for defects such as cold solder joints, misalignment, bridging, insufficient solder, and excessive solder. After the solder joint inspection is qualified, the assembly of signal connectors 3 and power connectors 4 is performed to reduce the obstruction of the solder joint inspection area by the connectors and improve the convenience of mounting quality confirmation.

[0028] One side of the PCB power board serves as the device mounting side, where multiple power semiconductors 6 are mounted in a concentrated manner; the other side serves as the connector mounting side, where signal connectors 3 and power connectors 4 are mounted. This arrangement allows the side where the power semiconductors 6 are located to face the heat dissipation device 1 to form a top heat dissipation path, while allowing the side where the signal connectors 3 and power connectors 4 are located to face the control device 2 to form an inter-board connection path, thereby spatially separating the heat dissipation contact area and the inter-board interconnection area.

[0029] The signal connector 3 is used to transmit control signals, drive-related signals, sampling signals, or auxiliary source connection signals between the power device 5 and the control device 2. The signal connector 3 can be selected from at least one of pin headers, pins, and cables, and can be electrically connected and fixed to the PCB power board by soldering or plugging. In the actual assembly process, when the signal connector 3 is a pin header or a pin, the control device 2 should be provided with a corresponding socket, soldering hole, or connection terminal so that the power device 5 and the control device 2 form a signal connection when assembled.

[0030] The power connector 4 is used to transmit power current between the power device 5 and the power transfer interface in the control device 2. The power connector 4 can be selected from at least one of conductive copper pillars, conductive aluminum pillars, copper busbars, and aluminum busbars, and can be electrically connected and fixed to the PCB power board by welding, plugging, or screw connection. The cross-sectional area, quantity, and installation position of the power connector 4 can be determined according to the target operating current, the position of the power input and output nodes, and the position of the power transfer interface in the control device 2. The power connector 4 and the signal connector 3 are set separately, which helps to avoid interference of high current power paths to control signals or sampling signals.

[0031] Furthermore, the control device 2 includes a control circuit interface, a drive circuit interface, a sampling circuit interface, and an auxiliary power source circuit interface, and the positions of the multiple circuit interfaces correspond to the positions of the signal connectors 3.

[0032] like Figures 1-3 As shown, the control circuit interface is used to connect to the control circuit; the control circuit is a digital signal control unit capable of emitting high and low level PWM signals, which may include an MCU, DSP or other digital signal controller; the MCU may be a microcontroller that integrates a timer, analog-to-digital conversion module, communication interface and PWM output module; the DSP may be a digital signal processor with high-speed computing capabilities, used to perform control tasks such as current loop control, voltage loop control, duty cycle adjustment, fault protection judgment and working status management.

[0033] In practical implementation, the control circuit can store and run software control algorithm code. The software control algorithm code can calculate the required drive control timing of the power semiconductor 6 based on the voltage, current, temperature or fault signals fed back by the sampling circuit, and output high and low level PWM signals through the PWM output channel. The PWM signal can include switching frequency, duty cycle, dead time, synchronous rectification control logic and protection shutdown logic. The PWM signal output by the control circuit can be directly or indirectly transmitted to the drive circuit, which drives the gate or control terminal of the power semiconductor 6.

[0034] The drive circuit is used to convert the PWM signal output by the control circuit into a drive signal suitable for driving the power semiconductor 6. The drive circuit may include an isolation driver, a gate resistor, an undervoltage protection circuit, an overcurrent protection circuit, or a fault feedback circuit. It should be noted that the drive circuit is not necessarily located in the control device 2. In some configurations, the drive circuit is located in the control device 2 and outputs a drive signal to the power device 5 through the signal connector 3. In other configurations, the drive circuit is integrated on the PCB power board of the power device 5, and the control device 2 sends a PWM control signal to the power device 5 through the signal connector 3. The drive circuit on the power device 5 then converts the PWM control signal into a drive signal for the power semiconductor 6. The specific configuration is selected based on product layout, electromagnetic compatibility requirements, drive loop length, and heat dissipation requirements.

[0035] The sampling circuit interface is used to receive sampling signals from the power device 5. The sampling signals may include temperature sampling signals, current sampling signals, voltage sampling signals, fault signals, or switch status signals. A temperature sampling resistor NTC is provided on the PCB power board. The temperature sampling resistor NTC can be located near the power semiconductor 6 to reflect the temperature of the working area of ​​the power semiconductor 6 or a local area of ​​the PCB power board. The sampling signal of the temperature sampling resistor NTC can be transmitted to the control device 2 through the signal connector 3. The control device 2 determines whether it is necessary to reduce the output power, adjust the PWM duty cycle, limit the operating current, or perform a protection shutdown.

[0036] The auxiliary power supply circuit interface is used for auxiliary power supply connection; the auxiliary power supply circuit can provide low voltage power to the control device 2, drive circuit, sampling circuit or communication circuit. The auxiliary power supply circuit can be set in the control device 2, or it can be set in the power device 5 or other boards according to the module layout; when the auxiliary power supply circuit is set in the control device 2, the power device 5 can receive or feed back relevant low voltage power supply signals through the signal connector 3; when the auxiliary power supply circuit is set in the power device 5, the control device 2 can enable, detect or communicate with the auxiliary power supply circuit through the signal connector 3.

[0037] Furthermore, the heat dissipation device 1 is a metal heat sink; the metal heat sink can be selected from at least one of liquid cooling devices, air cooling devices, finned heat sinks, and toothed heat sinks; the liquid cooling device can be a metal cold plate or heat sink shell with coolant channels; the air cooling device can be a metal heat sink that cooperates with air ducts, fans, or air heat exchange structures; the finned heat sink can include multiple heat dissipation fins to expand the heat exchange area; the toothed heat sink can include multiple toothed protrusions to enhance the convective heat transfer capacity; wherein, the material of the heat dissipation device 1 can be aluminum, aluminum alloy, copper, copper alloy, or other metal materials suitable for thermal conductivity.

[0038] The thermally conductive insulating material is disposed between the top heat dissipation surface of the power semiconductor 6 and the heat dissipation device 1. This material needs to transfer heat between the power semiconductor 6 and the heat dissipation device 1, and also form electrical insulation between them. The thermally conductive insulating material can be a composite of insulating and thermally conductive materials, or it can be a material that simultaneously possesses insulating and thermally conductive functions. Specifically, the insulating material can be a polyimide film, silicone cloth, or insulating paper. Polyimide film has good temperature resistance and electrical insulation properties, making it suitable for thinner insulating layers. Silicone cloth is flexible and heat-resistant, and can be used to fill small local gaps. Insulating paper can be used for general insulating scenarios. The thermally conductive material can be a thermally conductive gel, a one-component thermally conductive sealant, a two-component thermally conductive sealant, or a potting compound. Thermally conductive gel is suitable for filling irregular gaps. One-component or two-component thermally conductive sealants are suitable for forming thermally conductive fillers in larger gaps. Potting compounds can be used in scenarios that combine filling, fixing, and thermal conduction.

[0039] Meanwhile, materials with both insulating and thermally conductive functions can be alumina ceramic substrates, aluminum nitride ceramic substrates, silicone sheets containing silicone cloth, or phase change materials. Alumina ceramic substrates have good insulation properties and mechanical strength, making them suitable for applications requiring stable insulation support. Aluminum nitride ceramic substrates have high thermal conductivity, making them suitable for heat dissipation interfaces with high power density. Silicone sheets containing silicone cloth have flexibility and insulating thermal conductivity, and can adapt to certain surface unevenness. Phase change materials can soften and fill tiny gaps after reaching the phase change temperature, reducing interfacial contact thermal resistance.

[0040] It should be noted that, in the actual assembly process, the placement method of the thermally conductive insulating material can be adjusted according to different material forms. When the thermally conductive insulating material is a sheet, it can be cut into a shape that matches the top heat dissipation surface of the power semiconductor 6, and then placed between the top heat dissipation surface of the power semiconductor 6 and the heat dissipation device 1. When the thermally conductive insulating material is a paste, gel, or sealant, it can be placed on the corresponding contact area of ​​the top heat dissipation surface of the power semiconductor 6 or the heat dissipation device 1 by dispensing, coating, scraping, or quantitative extrusion. When the thermally conductive insulating material is a potting compound, it can be potted in a limited area and cured to form a thermally conductive insulating interface.

[0041] Furthermore, a PCBA module integration and assembly method, applied to a top-heat-dissipating PCBA module, includes the following steps: S1. Component preparation: Provide heat dissipation device 1, control device 2, PCB power board, multiple power semiconductors 6, signal connectors 3, power connectors 4 and thermally conductive insulating materials, and determine the shape, size and assembly position of PCB power board according to the installation space of the top heat dissipation PCBA module. Specifically, the heat dissipation device 1 is used to receive the heat transferred from the top heat dissipation surface of the power semiconductor 6, the control device 2 is used to make signal connection and power conversion connection with the power device 5, and the PCB power board is used to carry multiple power semiconductors 6, signal connectors 3 and power connectors 4; the signal connectors 3 are used to transmit control signals, sampling signals, drive-related signals or auxiliary source connection signals between the power device 5 and the control device 2; the power connectors 4 are used to transmit power current or form a high current connection path between the power device 5 and the control device 2.

[0042] When determining the shape, size, and assembly position of the PCB power board, the following factors can be considered: the installation space inside or above the heat dissipation device 1; the interface position of the control device 2; the number of power semiconductors 6; the insertion space of the signal connectors 3 and power connectors 4; and the crimping gap between the top heat dissipation surface of the power semiconductor 6 and the heat dissipation device 1. The PCB power board can be set as a regular rectangle, a stepped shape, a partially recessed shape, or other board shapes that are compatible with the assembly space, depending on the installation space. The size of the PCB power board should meet the requirements for the mounting space of multiple power semiconductors 6, the installation space of the signal connectors 3 and power connectors 4, and the board connection distance between the PCB power board and the control device 2.

[0043] S2. Component mounting: Based on the power requirements of the top heat dissipation PCBA module, multiple power semiconductors 6 are mounted on one side of the PCB power board using a standard surface mount process. Specifically, the power requirements of the top heat dissipation PCBA module include, but are not limited to, target output power, target operating current, number of power conversion branches, allowable temperature rise, switching frequency, and heat dissipation conditions. The number, device type, and mounting area of ​​the power semiconductors 6 are determined according to the power requirements, so that multiple power semiconductors 6 can meet the target power level, and the top heat dissipation surface of each power semiconductor 6 faces the heat dissipation device 1. At the same time, multiple power semiconductors 6 can use the same model, or different models can be used according to the power branch or circuit function.

[0044] S3. Connection and assembly: According to the interface position of the control device 2, the power input and output nodes on the PCB power board, and the insertion distance between the PCB power board and the control device 2, the signal connector 3 and the power connector 4 are respectively assembled on the other side of the PCB power board. Specifically, one side of the PCB power board is used to mount the power semiconductor 6, and the other side is used to assemble the signal connector 3 and the power connector 4. Through this division of labor, the side where the power semiconductor 6 is located can face the heat dissipation device 1 to form a top heat dissipation path, and the side where the signal connector 3 and the power connector 4 are located can face the control device 2 to form an inter-board electrical connection path.

[0045] Meanwhile, the assembly position and connection height of the signal connector 3 and the power connector 4 can be determined according to the interface position of the control device 2, the power input and output nodes on the PCB power board, and the insertion distance between the PCB power board and the control device 2.

[0046] S4. Top heat conduction: A thermally conductive insulating material is placed between the top heat dissipation surface of the power semiconductor 6 and the heat dissipation device 1, so that the top heat dissipation surface of the power semiconductor 6 can transfer heat to the heat dissipation device 1 through the thermally conductive insulating material. Specifically, before setting the thermally conductive insulating material, the top heat dissipation surface of the power semiconductor 6 and the corresponding contact area of ​​the heat dissipation device 1 can be cleaned. The cleaning method can include wiping with a lint-free cloth, wiping with isopropyl alcohol, air blowing dust removal or plasma cleaning, to remove dust, oil, flux residue, particulate matter or surface contaminants, so as to avoid contaminants affecting the adhesion and insulation performance of the thermally conductive insulating material.

[0047] After the thermally conductive insulating material is applied, the bonding status between the top heat dissipation surface of the power semiconductor 6, the thermally conductive insulating material, and the heat dissipation device 1 is checked. The bonding status check may include one or more of the following: appearance check, thickness check, crimping status check, contact coverage check, insulation withstand voltage test, aging test, thermal cycling test, temperature rise test, and continuity test. Among them, the appearance check is used to confirm that the thermally conductive insulating material has not been significantly offset, missing, damaged, or overflowed; the thickness check is used to confirm that the thermally conductive insulating material meets the assembly gap requirements; the crimping status check is used to confirm that there is no obvious suspension or air gap between the top heat dissipation surface of the power semiconductor 6, the thermally conductive insulating material, and the heat dissipation device 1; and the contact coverage check is used to confirm that the thermally conductive insulating material covers the effective thermally conductive area of ​​the top heat dissipation surface of the power semiconductor 6.

[0048] Insulation withstand voltage test is used to verify the electrical insulation capability between power semiconductor 6 and heat dissipation device 1. During the test, a specified withstand voltage test voltage can be applied between the corresponding electrical connection terminal of power semiconductor 6 and heat dissipation device 1, and the leakage current is checked to see if it is within the preset range. Among them, aging test can include high temperature power-on aging, high temperature storage aging, or power cycle aging, used to verify the stability of thermally conductive insulating material under continuous operating conditions; thermal cycling test is used to verify whether the thermally conductive insulating material cracks, delaminates, pumps out, or peels off at the interface under alternating hot and cold conditions; temperature rise test is used to verify the actual effect of heat transfer from power semiconductor 6 to heat dissipation device 1 through thermally conductive insulating material; continuity test is used to confirm that the electrical connection between signal connector 3 and power connector 4 and the corresponding interface is normal.

[0049] S5. Inter-board interconnection: The PCB power board equipped with power semiconductors 6, signal connectors 3 and power connectors 4 is used as power device 5, and the power device 5 is electrically connected to the control device 2 through signal connectors 3 and power connectors 4.

[0050] Specifically, the power device 5 forms a signal connection with the control device 2 through the signal connector 3, and forms an electrical connection with the power conversion interface in the control device 2 through the power connector 4. The inter-board electrical connection can be achieved by plugging, soldering, screw connection or a combination thereof. During assembly, the alignment of the corresponding interface of the signal connector 3 and the control device 2 can be completed first, and then the alignment of the power connector 4 and the power conversion interface can be completed, and then fixed after the alignment is completed. After the inter-board interconnection is completed, the electrical connection of the signal connector 3 and the power connector 4 can be checked. The electrical connection check can include one or more of the following: signal connectivity test, power path continuity test and contact resistance test.

[0051] By connecting the boards through the signal connector 3 and the power connector 4, the power device 5 and the control device 2 can be structurally independent but electrically connected, thus facilitating the replacement and expansion of power devices 5 with different power levels or sizes.

[0052] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A top-heat-dissipating PCBA module, characterized in that: It includes a heat dissipation device (1), a control device (2), a power device (5), and thermally conductive insulating materials; The power device (5) includes a PCB power board, multiple power semiconductors (6), signal connectors (3) and power connectors (4); The PCB power board has a component mounting side and a connector mounting side, which are located on different sides of the PCB power board. The power semiconductors (6) are all discrete top heat dissipation packaged power semiconductors and are surface mounted on the device mounting side of the PCB power board; The signal connector (3) and the power connector (4) are both electrically connected and fixed to the connector mounting side of the PCB power board; The thermally conductive insulating material is disposed between the top heat dissipation surface of the power semiconductor (6) and the heat dissipation device (1). The heat dissipation device (1) abuts against the top heat dissipation surface of the power semiconductor (6) through the thermally conductive insulating material to form a heat dissipation path from the top heat dissipation surface of the power semiconductor (6) through the thermally conductive insulating material to the heat dissipation device (1).

2. The top-heat-dissipating PCBA module according to claim 1, characterized in that: The control device (2) includes a control circuit interface, a drive circuit interface, a sampling circuit interface and an auxiliary power source circuit interface, and the positions of multiple circuit interfaces correspond to the positions of the signal connectors (3).

3. A top-heat-dissipating PCBA module according to claim 1, characterized in that: The power device (5) is electrically connected to the control device (2) through the signal connector (3) and electrically connected to the power transfer interface in the control device (2) through the power connector (4), so that the power device (5) and the control device (2) form an inter-board electrical connection.

4. A top-heat-dissipating PCBA module according to claim 3, characterized in that: The PCB power board is provided with a temperature sampling resistor NTC, and the power device (5) includes at least a temperature sampling resistor NTC, a power semiconductor (6), a signal connector (3) and a power connector (4). The power connector (4) is selected from at least one of conductive copper pillars, conductive aluminum pillars, copper busbars and aluminum busbars. The power connector (4) is electrically connected and fixed to the PCB power board by welding, plugging or screw connection. The signal connector (3) is selected from at least one of pin headers, pins and cables, and the signal connector (3) is electrically connected and fixed to the PCB power board by soldering or plugging.

5. A top-heat-dissipating PCBA module according to claim 1, characterized in that: The heat dissipation device (1) is a metal heat dissipation component, which is selected from at least one of liquid cooling device, air cooling device, finned heat dissipation component and toothed heat dissipation component; The thermally conductive and insulating material is formed by a composite of insulating and thermally conductive materials, or is a material that simultaneously possesses insulating and thermally conductive functions.

6. A top-heat-dissipating PCBA module according to claim 1, characterized in that: The number of power semiconductors (6) is matched with the target output power, target operating current and number of power conversion branches of the PCBA module.

7. A PCBA module integration and assembly method, applied to a top-heat-dissipating PCBA module as described in any one of claims 1-6, characterized in that, Includes the following steps: S1. Component preparation: Provide heat dissipation device (1), control device (2), PCB power board, multiple power semiconductors (6), signal connectors (3), power connectors (4) and thermally conductive insulating materials, and determine the shape, size and assembly position of PCB power board according to the installation space of the top heat dissipation PCBA module; S2. Component mounting: Based on the power requirements of the top heat dissipation PCBA module, multiple power semiconductors (6) are mounted on one side of the PCB power board using standard surface mount technology. S3. Connection and assembly: According to the interface position of the control device (2), the power input and output nodes on the PCB power board and the insertion distance between the PCB power board and the control device (2), the signal connector (3) and the power connector (4) are respectively assembled on the other side of the PCB power board. S4, Top heat conduction: A thermally conductive insulating material is placed between the top heat dissipation surface of the power semiconductor (6) and the heat dissipation device (1), so that the top heat dissipation surface of the power semiconductor (6) can transfer heat to the heat dissipation device (1) through the thermally conductive insulating material. S5. Inter-board interconnection: The PCB power board equipped with power semiconductor (6), signal connector (3) and power connector (4) is used as power device (5), and the power device (5) is electrically connected to the control device (2) through the signal connector (3) and power connector (4).

8. The PCBA module integration and assembly method according to claim 7, characterized in that: In S2, the surface mount process includes solder paste printing, device mounting, reflow soldering and solder joint inspection. After the solder joint inspection is qualified, the assembly of signal connector (3) and power connector (4) is performed.

9. A PCBA module integration and assembly method according to claim 7, characterized in that: In S4, before setting the thermally conductive insulating material, the top heat dissipation surface of the power semiconductor (6) and the corresponding contact area of ​​the heat dissipation device (1) are cleaned. After setting the thermally conductive insulating material, the bonding state between the top heat dissipation surface of the power semiconductor (6), the thermally conductive insulating material and the heat dissipation device (1) is checked.

10. A PCBA module integration and assembly method according to claim 7, characterized in that: In S3, the assembly position of the signal connector (3) on the PCB power board is first determined according to the positions of the control circuit interface, drive circuit interface, sampling circuit interface and auxiliary power source circuit interface of the control device (2); Then, the assembly position of the power connector (4) on the PCB power board is determined according to the position of the power input and output nodes on the PCB power board and the power conversion interface in the control device (2); The connection heights of the signal connector (3) and the power connector (4) are determined based on the insertion distance between the PCB power board and the control device (2).

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