Highly reliable printed board structure

Abstract

This invention relates to the field of electrical engineering technology. It discloses a highly reliable printed circuit board (PCB) structure, comprising a PCB with multiple enameled wire exit slots, multiple enameled wire pads, a waist-shaped slot, and binding holes on its front side. The back side of the PCB has Hall effect elements, Hall effect element pads, and Hall effect element lead-out pads. The Hall effect element lead-out pads are used to solder Hall effect element leads, which pass through the waist-shaped slots to the front side of the PCB and are fixed to the binding holes by binding wires. This invention, by designing heat dissipation slots on the surface and placing the pads on the back side, achieves improved motor heat dissipation, effective protection of Hall effect element lead-out solder joints, and rapid positioning and reliable fixing of the enameled wires. Precise arrangement ensures that the enameled wires in the exit slots correspond to the pads, and guide angles enable automatic wire exit, clamping, and soldering, allowing the PCB to be directly adapted to automated equipment, improving production consistency and efficiency.

Description

Technical Field

[0001] This invention relates to the field of electrical engineering technology, and in particular to a high-reliability printed circuit board structure integrating Hall elements, which is adapted to printed circuit boards for automated operations and is mainly used in permanent magnet generators. Background Technology

[0002] Permanent magnet generators, with their flat structure and high power density, occupy an important position in modern industrial drives, consumer electronics, and aerospace. Among these, Hall effect printed circuit boards (PCBs) are widely used in these motors due to their simple structure, low cost, and high fault tolerance. In these motors, the PCB typically performs the dual functions of Hall element signal acquisition and winding electrical connection; the rationality of its structural design directly determines the motor's assembly efficiency and operational reliability.

[0003] In the current mainstream manufacturing of permanent magnet generators, the connection method between the printed circuit board and the winding enameled wire and Hall element lead wire has the following problems: 1. In the assembly of Hall element leads, conventional designs place the Hall element lead solder joints on the front side of the printed circuit board (PCB). After the Hall lead is soldered to the solder joints on the front side of the PCB, it is led out. During use, equipment vibration, assembly tension, or external contact will directly apply tensile and torsional forces to the solder joints. Furthermore, the Hall lead has no fixed position, and the large amplitude of vibration displacement easily causes problems such as cold solder joints, detachment, or even wire breakage at the solder joints. This leads to the loss of the Hall position signal, causing motor malfunction, stalling, or starting failure. Even with binding structures, the tension on the lead can only be alleviated; it cannot prevent instantaneous stress on the solder joints from collisions and contact, leading to Hall element failure and affecting the normal operation of the entire equipment. This problem is particularly prominent in industrial equipment with high vibration and frequency, becoming one of the key factors limiting motor lifespan. Moreover, subsequent maintenance and replacement costs are high.

[0004] 2. In terms of motor heat dissipation, the printed circuit board is usually axially mounted to the armature and covers the entire stator winding, reducing the heat dissipation area of ​​the winding, which in turn affects the heat dissipation of the motor, resulting in increased temperature and decreased performance during motor operation.

[0005] 3. Regarding the winding lead-out processing, traditional printed circuit boards only provide simple through-hole structures. After the enameled wire emerges, there is a lack of effective spatial positioning constraints, resulting in messy and disordered leads. Assembly requires manual sorting and soldering, leading to low assembly efficiency. Furthermore, the randomness of manual operation easily causes deviations in lead layout and soldering positions, making it difficult to guarantee product consistency. The lack of effective fixation for the enameled wire after exiting the circuit means that vibrations from high-speed motor rotation cause repeated stress at the connection point between the enameled wire and the solder pad, reducing the lifespan of the soldered area.

[0006] 4. Regarding adaptability to automated production, existing printed circuit board (PCB) structures do not consider the operational characteristics of automated equipment. On one hand, traditional wire guide holes often have right-angle transitions at their edges. When automated equipment pulls the wires, the enameled wire is prone to rubbing against the edges of the PCB exit holes, easily causing insulation damage and increasing the risk of short circuits. On the other hand, the lack of standardized wire clamping and limiting structures prevents automated equipment from accurately positioning solder joints, hindering unmanned operation. Summary of the Invention

[0007] The purpose of this invention is to provide a highly reliable printed circuit board structure that effectively protects the solder joints of Hall element lead wires, enables rapid positioning and reliable fixing of enameled wires, improves welding quality, considers motor heat dissipation in the structure, and meets the adaptation requirements of automated production lines.

[0008] To address the aforementioned technical problems, this invention provides a highly reliable printed circuit board (PCB) structure, comprising a PCB with multiple enameled wire exit slots, multiple enameled wire pads, a waist-shaped slot, and binding holes on its front side. The back side of the PCB has Hall elements, Hall element pads, and Hall element lead-out pads. The Hall element lead-out pads are used to solder Hall element leads, which pass through the waist-shaped slots to the front side of the PCB and are fixed to the binding holes by binding wires. Each enameled wire exit slot includes a large heat dissipation slot and a small wire-clamping slot connected to each other, with the small slots located at both ends of the large heat dissipation slot. The opening of each small slot has a guide bevel for guiding the enameled wire into the slot for positioning. The enameled wire pads correspond one-to-one with the positions of the enameled wire exit slots and are used to solder the enameled wire after it has been positioned by the small slots.

[0009] The wire clamping groove is a U-shaped groove structure, with its opening width being smaller than the inner diameter of the groove, used to clamp and fix the enameled wire.

[0010] The guide angle is set at the opening edge of the wire clamping groove and tilts outward along the groove opening to guide the enameled wire to slide smoothly into the groove.

[0011] The large heat dissipation slot is an open slot that penetrates the printed circuit board. Its width is greater than that of the small wire-holding slot, which is used to allow the enameled wire to pass through and increase the heat dissipation area of ​​the winding.

[0012] The waist-shaped groove is an elongated through hole that runs along the thickness direction of the printed circuit board, allowing the Hall element lead wires to pass from the back to the front.

[0013] There are two binding holes, located on both sides of the waist-shaped groove, for threading binding wires to fix the Hall element lead wires.

[0014] The enameled wire pad is located outside the slot of the wire clamping groove and is aligned with the center line of the slot.

[0015] The Hall element pads are used to solder the pins of the Hall element.

[0016] The binding wire is an insulated wire, which is wound around the binding hole and binds and fixes the Hall element lead wire, so that the stress point of the Hall element lead wire is transferred to the binding hole.

[0017] The printed circuit board is a circular board body, with enameled wire outlet grooves and enameled wire pads evenly distributed along its front circumference, and waist-shaped grooves located in the inner ring area of ​​the board body.

[0018] Compared with the prior art, this invention improves motor heat dissipation, effectively protects the solder joints of Hall element lead wires, and enables rapid positioning and reliable fixing of enameled wires by designing heat dissipation grooves on the surface and placing the solder pads on the reverse side. Through precise arrangement, the enameled wires in the lead wire grooves correspond to the solder pads, and the setting of guide angles enables automatic wire output, wire clamping and soldering, making the printed circuit board directly compatible with automated equipment and improving production consistency and efficiency.

[0019] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0020] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0021] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a front view of the present invention; Figure 3 This is a reverse view of the invention; Figure 4 This is an enlarged schematic diagram of the wire outlet groove of the present invention.

[0022] In the diagram: 1-Printed circuit board, 11-Enameled wire outlet groove, 111-Wire clamping groove, 112-Heat dissipation groove, 113-Guide angle, 12-Enameled wire pad, 13-Oval groove, 14-Binding hole, 15-Hall element pad, 16-Hall element lead pad, 2-Binding wire, 3-Hall element lead, 4-Hall element. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the embodiments of this invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details are presented in the embodiments of this invention to facilitate a better understanding of this application. However, the technical solutions claimed in this application can be implemented even without these technical details and various variations and modifications based on the following embodiments. The division of the following embodiments is for ease of description and should not constitute any limitation on the specific implementation of this invention. The embodiments can be combined with and referenced by each other without contradiction.

[0024] Example 1 like Figures 1-4 As shown, during processing, the Hall element lead 3 is soldered to the Hall element lead pad 16 and leads out through the slot 13. The Hall element lead pad 16 is located on the reverse side of the printed circuit board 1, which can significantly reduce the probability of the solder joint being subjected to force due to contact and collision during use. The Hall element lead 3 is tied with binding wire 2 at the binding holes 14 on both sides of the slot 13 and fixed to the binding holes 14, so that the external force on the Hall element lead 3 is transferred to the binding point and does not directly act on the solder joint on the reverse side, and the Hall element lead 3 is oriented and limited, restricting its irregular swing. Since the Hall element lead 3 is soldered on the reverse side of the printed circuit board 1, a protrusion is formed on the reverse side. In order to avoid installation interference, the corresponding position on the armature is grooved to ensure that no interference occurs after installation on the armature.

[0025] Furthermore, the printed circuit board 1 is designed with multiple independent enameled wire exit slots 11, which can be divided into two parts: a large heat dissipation slot 112 and a small wire-holding slot 111. The large heat dissipation slot 112 is used for the exit of the winding enameled wire and to increase the heat dissipation area, which facilitates the heat dissipation of the motor. The small wire-holding slot 111 is a U-shaped slot with a guide angle 113 at the opening of the U-shaped slot. After the enameled wire passes through the large heat dissipation slot 112, it slides into the U-shaped slot through the guide angle 113 for positioning, which limits the enameled wire and prevents the enameled wire from shifting or shaking.

[0026] Furthermore, through standardized layout design, the positions of the large heat dissipation slot 112, the small wire clamping slot 111, and the enameled wire pad 12 correspond one-to-one, enabling the printed circuit board to be compatible with automated equipment. The automated equipment clamps the winding enameled wire, passes it through the large heat dissipation slot 112, and then rotates to allow the enameled wire to slide along the guide angle 113 into the U-shaped groove for positioning. At this point, the automatic welding equipment can weld it to the corresponding enameled wire pad 12, thus automating the winding enameled wire exit, clamping, and welding processes.

[0027] Example 2 The implementation steps of this invention are as follows: 1) After the Hall element lead wire 3 is soldered to the Hall element lead wire pad 16, it passes through the waist-shaped groove 13 and is led out of the printed circuit board 1, and is tied and fixed at the binding hole 14 using the binding wire 2. 2) The automated equipment clamps the enameled wire through the heat dissipation slot 112. At this time, the equipment rotates the enameled wire and it can slide through the guide angle 113 to the wire clamping slot 111 for fixed positioning. Since the enameled wire pad 12 corresponds one-to-one with the enameled wire outlet slot 11, the automatic welding equipment can weld the enameled wire to the corresponding enameled wire pad 12 after the enameled wire is positioned.

[0028] The beneficial effects of this invention are as follows: 1) The wire exit groove and the wire solder pad correspond one-to-one, ensuring precise positioning and neat wire exit, avoiding tangling and misalignment. The overall structure can be directly adapted to automated equipment to achieve automatic wire exit, wire clamping and soldering, reducing reliance on manual labor and improving production consistency and efficiency. 2) The large heat dissipation slot increases the heat dissipation area of ​​the winding, which can effectively reduce the motor temperature, thereby improving the motor performance and lifespan; the wire clamping slot has a guide angle, which makes it easy to thread the wire when the automated equipment clamps the enameled wire, and it is not easy to scratch the insulation layer of the enameled wire, reducing the assembly risk and improving the assembly efficiency. 3) The Hall element lead wire pads are located on the reverse side of the printed circuit board, which structurally reduces the probability of collision and contact stress during assembly, transportation, use and operation, and solves the defect of easy interference of the solder joints on the front side of the traditional printed circuit board; the Hall element lead wire pads on the reverse side, together with the waist-shaped groove and binding hole structure, allow the tension of the Hall element lead wires to be borne by the binding point and not directly transmitted to the solder joint, achieving dual protection against collision and tension, and significantly improving the vibration resistance and fatigue resistance of the solder joints.

[0029] In summary, this invention can reduce the stress on the solder joints of the Hall element leads, guide and fix the winding enameled wire leads, improve ventilation and heat dissipation during armature installation, and is adaptable to automated production. Those skilled in the art will understand that the above embodiments can be modified in form and detail in practical applications without departing from the spirit and scope of the invention.

Claims

1. A highly reliable printed circuit board structure, characterized in that: The circuit board (1) includes a printed circuit board (1). The front side of the printed circuit board (1) is provided with multiple enameled wire exit grooves (11), multiple enameled wire pads (12), a waist-shaped groove (13), and binding holes (14). The back side of the printed circuit board (1) is provided with a Hall element (4), a Hall element pad (15), and a Hall element lead wire pad (16). The Hall element lead wire pad (16) is used to solder the Hall element lead wire (3). The Hall element lead wire (3) passes through the waist-shaped groove (13) and is led out to the front side of the printed circuit board (1), and is fixed by binding wire (2). The wire exit groove (11) is fixed on the binding hole (14); the wire exit groove (11) includes a heat dissipation large groove (112) and a wire clamping small groove (111) that are interconnected. The wire clamping small groove (111) is set at both ends of the heat dissipation large groove (112); the opening of the wire clamping small groove (111) is provided with a guide angle (113) to guide the wire into the wire clamping small groove (111) for limiting; the positions of the wire solder pad (12) and the wire exit groove (11) are one-to-one, and are used to solder the wire after it has been limited by the wire clamping small groove (111).

2. The high-reliability printed circuit board structure as described in claim 1, characterized in that: The wire clamping groove (111) is a U-shaped groove structure with an opening width smaller than the inner diameter of the groove, used to clamp and fix the enameled wire.

3. The high-reliability printed circuit board structure as described in claim 1, characterized in that: The guide angle (113) is located at the opening edge of the wire clamping groove (111) and tilts outward along the groove opening to guide the enameled wire to slide smoothly into the groove.

4. The high-reliability printed circuit board structure as described in claim 1, characterized in that: The heat dissipation slot (112) is an open slot that penetrates the printed circuit board (1). Its width is greater than that of the wire clamping slot (111), which is used to allow the enameled wire to pass through and increase the heat dissipation area of ​​the winding.

5. The high-reliability printed circuit board structure as described in claim 1, characterized in that: The waist-shaped groove (13) is an elongated through hole that runs through the thickness direction of the printed circuit board (1) and is used to allow the Hall element lead wire (3) to pass from the back to the front.

6. The high-reliability printed circuit board structure as described in claim 1, characterized in that: There are two binding holes (14), which are respectively placed on both sides of the waist-shaped groove (13) for threading binding wire (2) to fix the Hall element lead wire (3).

7. The high-reliability printed circuit board structure as described in claim 1, characterized in that: The enameled wire pad (12) is located outside the slot of the wire clamping groove (111) and is aligned with the center line of the slot of the wire clamping groove (111).

8. The high-reliability printed circuit board structure as described in claim 1, characterized in that: The Hall element pad (15) is used to solder the pins of the Hall element (4).

9. The high-reliability printed circuit board structure as described in claim 1, characterized in that: The binding wire (2) is an insulated wire, which is wound around the binding hole (14) and binds and fixes the Hall element lead wire (3), so that the stress point of the Hall element lead wire (3) is transferred to the binding hole (14).

10. The high-reliability printed circuit board structure as described in claim 1, characterized in that: The printed circuit board (1) is a circular board body, with enameled wire outlet grooves (11) and enameled wire pads (12) evenly distributed along its front circumference, and waist-shaped grooves (13) located in the inner ring area of ​​the board body.

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