An automatic chip mounter and a processing method of integrated circuit

Abstract

The application discloses an automatic patching machine and a processing method of an integrated circuit, and relates to the technical field of integrated circuit processing. In the application, the positions and angles of a printed circuit board and electrical elements are detected by a visual detection camera. A translation driving part transports the patching base and the electrical elements sucked and grabbed by the translation driving part to the printed circuit board in the patching station according to the position detection result of the visual detection camera, so that the electrical elements are accurately aligned with the mounting positions on the printed circuit board. The patching unit can rotate and adjust the angle of the electrical elements according to the angle detection result of the visual detection camera during the sucking and transporting process of the electrical elements, so that the electrical elements can be correctly mounted on the mounting positions on the printed circuit board. Therefore, the patching precision is greatly improved through the cooperation of the translation position adjustment and the rotation angle adjustment, the virtual welding or short circuit defects caused by the pin mispositioning during the patching of the electrical elements are prevented, and the quality of the final printed circuit board product is improved.

Description

Technical Field

[0001] This invention belongs to the field of integrated circuit processing technology, and more specifically, relates to an automatic chip mounter and a method for processing integrated circuits. Background Technology

[0002] Printed circuit boards (PCBs), serving as the electrical interconnection carrier and mechanical support substrate for electronic components, typically use an insulating substrate as their core material. Precision processes such as photolithography and etching are used to construct copper foil conductive lines with a pre-defined topology on the surface and inner layers. Mechanical drilling and metallization of the hole walls further ensure interlayer electrical conductivity. Various components, including resistors, capacitors, integrated circuits, and connectors, are then fixed to predetermined coordinates on the board surface using automated surface mount technology (SMT). Chinese Patent CN118804497B discloses a surface mount positioning method for a bulk surface mount machine. This method uses machine vision algorithms to analyze PCB images, automatically calculates the mapping relationship between reference marker points and the positions to be mounted, and then dynamically compensates for the movement trajectory of the mounting head to improve mounting accuracy.

[0003] However, this existing technology has significant limitations in adjustment dimensions: although it can effectively eliminate linear positional deviations between components and the circuit board through planar translation correction along the X and Y axes, in actual working conditions, components often experience both planar displacement and angular deflection due to multiple factors such as mechanical vibration, pickup posture, and airflow interference. Because this solution lacks a compensation mechanism for the component's rotation angle around the Z-axis, single X and Y-axis translation correction cannot eliminate pin misalignment caused by angular deviations. This makes it difficult for components to achieve precise alignment with the circuit board, ultimately limiting further improvements in placement accuracy. Furthermore, pin misalignment can lead to poor soldering or short circuit defects, thus affecting the quality of the final printed circuit board product. Summary of the Invention

[0004] In view of the problems in the related technologies, the present invention proposes an automatic chip mounter and a method for processing integrated circuits to overcome the above-mentioned technical problems existing in the existing related technologies.

[0005] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: This invention relates to an automatic chip mounter, comprising a frame, wherein a positioning part, a material preparation part, and a mounting part are provided on the frame. The positioning part can transport and fix the substrate to be mounted at the mounting station on the frame, and the material preparation part can simultaneously transport multiple electrical components to be mounted to the material preparation station on the frame. The placement unit includes a placement base and a translation drive unit. The translation drive unit can drive the placement base to reciprocate between the placement station and the material preparation station. The placement base is equipped with a vision inspection camera and multiple placement units. The vision inspection camera can detect the position and angle of the substrate and electrical components. The placement units can adsorb and grasp the electrical components in the material preparation station. The translation drive unit, based on the position detection results of the vision inspection camera, transports the placement base and the adsorbed electrical components towards the substrate in the placement station, so that the electrical components are precisely aligned with the placement positions on the substrate. During the adsorption and transport of electrical components, the placement units can rotate and adjust the angle of the electrical components based on the angle detection results of the vision inspection camera, so that the electrical components can be properly mounted on the substrate.

[0006] Preferably, the positioning part includes a fixture drive screw and a fixture conveying slide rail. The fixture conveying slide rail is fixedly installed on the top surface of the frame. A positioning fixture is slidably installed on the fixture conveying slide rail. The top surface of the positioning fixture is provided with a plurality of fixture slots. The fixture drive screw is rotatably mounted on the top surface of the frame. A fixture drive screw pair is threadedly mounted on the fixture drive screw. The fixture drive screw pair is fixedly connected to the bottom surface of the positioning fixture. A rotary drive component is also driven at the end of the fixture drive screw.

[0007] Preferably, the material preparation section includes an unwinding section, a winding section, a stripping section, and a material preparation tray. A roll of tape is wound on the unwinding section, and multiple electrical components are attached to the roll of tape at equal intervals in sequence. One end of the roll of tape passes through the stripping section and is wound on the winding section. The material preparation tray is fixedly installed on one side of the stripping section, and the material preparation tray is provided with a material preparation groove corresponding to the roll of tape. The take-up section can pull and unwind the belt on the unwind section. After unwinding, the belt moves through the stripping section and then winds back onto the take-up section. The stripping section can peel off the electrical components on the belt as it moves through, and then the belt transports the peeled electrical components to the material preparation trough on the material preparation tray.

[0008] Preferably, the unwinding section includes a support plate, which is fixedly installed on the top surface of the frame. An unwinding shaft is fixedly installed on the support plate, and multiple unwinding reels are rotatably installed on the unwinding shaft. Each unwinding reel has a roll of tape wound around it, and multiple electrical components are attached to the roll of tape at equal intervals in sequence.

[0009] Preferably, the winding section includes a winding shaft rotatably mounted on a frame, and multiple winding reels are fixedly mounted on the winding shaft. The end of the tape can be wound onto the corresponding winding reel. One end of the winding shaft is also connected to a winding drive component, which can drive the winding shaft to rotate so that the winding shaft drives the multiple winding reels to rotate synchronously for winding.

[0010] Preferably, the stripping section includes a stripping plate, which is inclinedly disposed on one side of the preparation tray, and the roll on the unwinding section is bent past the top edge of the stripping plate and then wound onto the take-up section. A limit shaft is provided on one side of the stripping plate, and a tensioning limit wheel located on the conveyor belt moving path is rotatably mounted on the limit shaft.

[0011] Preferably, the translation drive unit includes a bracket, which is fixedly installed on the top surface of the frame. A crossbeam is slidably installed on the top of the bracket via a slide rail. A crossbeam drive screw is rotatably installed on the bracket and arranged parallel to the slide rail. A crossbeam drive motor is driven at one end of the crossbeam drive screw. A crossbeam drive screw pair is threadedly installed on the crossbeam drive screw and is fixedly connected to the crossbeam. A base drive screw is rotatably mounted on the crossbeam. A base drive motor is driven at one end of the base drive screw. A base drive screw pair is threadedly mounted on the base drive screw. The patch base is slidably mounted on the crossbeam via a slide rail. The base drive screw pair is fixedly connected to the patch base.

[0012] Preferably, the patch unit includes a lifting drive motor, a lifting drive driven wheel, and a lifting seat. The lifting seat is slidably inserted into the patch base via a guide shaft. A negative pressure suction tube is fixedly inserted into the lifting seat. The top end of the negative pressure suction tube can be connected to a negative pressure air source through a flexible tube. A negative pressure suction nozzle is connected and installed at the bottom end of the negative pressure suction tube. The lifting drive motor is fixedly mounted on the patch base. The output end of the lifting drive motor is driven by a lifting drive drive wheel. The lifting drive driven wheel is rotatably mounted on the patch base. A lifting drive belt is driven between the lifting drive drive wheel and the lifting drive driven wheel. A clamping block is fixedly mounted on one side of the lifting seat and is fixedly clamped to the lifting drive belt.

[0013] Preferably, the patch unit further includes a correction motor and a spline sleeve. The correction motor is fixedly mounted on the patch base. A correction drive wheel is driven and mounted on the output end of the correction motor. The spline sleeve is slidably fitted onto the outer ring of the negative pressure suction tube through a keyway. A correction driven wheel is fixedly mounted on the outer ring of the spline sleeve. The correction drive wheel and the correction driven wheel are connected by a correction transmission belt.

[0014] Preferably, the automatic placement machine also includes a PLC controller. The vision inspection camera is signal-connected to the PLC controller to transmit inspection information to the PLC controller. The PLC controller is electrically connected to the positioning unit, the material preparation unit, the translation drive unit, and the placement unit to achieve automatic placement and correction adjustment during placement through the intelligent control of the PLC controller.

[0015] A method for fabricating an integrated circuit, comprising the following specific steps: Apply solder paste to the surface mount locations on the printed circuit board; The positioning section transports and fixes the printed circuit board coated with solder paste to the placement station on the rack. The material preparation department transports the electrical components that need to be surface mounted to the material preparation station on the rack; The translation drive unit drives the surface mount base to move to the material preparation station, and the surface mount unit adsorbs the electrical components in the material preparation station; The translation drive unit then drives the placement base to move toward the placement station, so that the placement base moves the placement unit and the adsorbed electrical components toward the printed circuit board in the placement station. The visual inspection camera performs real-time detection of the orientation of the printed circuit board and electrical components. The placement unit adjusts the orientation angle of the electrical components according to the visual inspection results to align the electrical components with the solder paste-coated positions on the printed circuit board. The printed circuit board with the electrical components mounted is sent into a reflow oven for reflow soldering, so that the mounted electrical components are soldered and fixed to the printed circuit board.

[0016] The present invention has the following beneficial effects: 1. In this invention, a vision inspection camera is used to detect the position and angle of the printed circuit board and electrical components. The translation drive unit transports the mounting base and the gripped electrical components towards the printed circuit board in the mounting station according to the position detection results of the vision inspection camera, so that the electrical components are accurately aligned with the mounting positions on the printed circuit board. The mounting unit can rotate and adjust the angle of the electrical components according to the angle detection results of the vision inspection camera during the adsorption and transportation process, so that the electrical components can be correctly mounted on the mounting positions of the printed circuit board. Thus, the combination of translation and rotation angle adjustment can greatly improve the mounting accuracy and prevent defects such as poor soldering or short circuits caused by pin misalignment during the mounting of electrical components, thereby improving the quality of the final printed circuit board product.

[0017] 2. In this invention, the mounting unit uses a servo motor, drive wheel, and drive belt to drive the negative pressure nozzle to move up and down, enabling the negative pressure nozzle to pick up and mount electrical components. Compared to driving the negative pressure nozzle up and down with a cylinder, the servo motor and drive belt can precisely control the position, speed, and mounting pressure, which helps improve the mounting accuracy of electrical components. At the same time, it can cooperate with the angle adjustment component, which is also composed of a servo motor, drive wheel, and drive belt, to drive the negative pressure nozzle to move up and down while rotating to adjust the angle. This allows the negative pressure nozzle to adjust the angle of the picked-up electrical components, further improving the mounting accuracy of electrical components.

[0018] 3. The material preparation unit in this invention includes an unwinding unit, a winding unit, a stripping unit, and a material preparation tray. The winding unit can pull and unwind the belt on the unwinding unit. After unwinding, the belt moves through the stripping unit and then winds onto the winding unit. The stripping unit can peel off the electrical components on the belt as it moves through. The belt then transports the peeled electrical components to the material preparation slot on the material preparation tray. Thus, through the cooperation of the unwinding unit, the winding unit, the stripping unit, and the material preparation tray, continuous feeding and preparation of electrical components can be achieved, making the feeding and preparation process of electrical components more convenient and faster. Furthermore, the electrical components are clamped in the material preparation slot for preparation, and the material preparation slot can limit the electrical components, improving the accuracy of electrical component preparation and positioning.

[0019] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of the invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a three-dimensional structural diagram of the automatic chip mounter of the present invention; Figure 2 For the present invention Figure 1 A magnified structural diagram at point A; Figure 3 For the present invention Figure 1 A magnified structural diagram at point B; Figure 4 This is a front structural diagram of the automatic chip mounter of the present invention; Figure 5 For the present invention Figure 4 A magnified structural diagram at point C; Figure 6 This is a top view of the automatic chip mounter of the present invention; Figure 7 This is a three-dimensional structural diagram of the frame of the present invention; Figure 8 This is a three-dimensional structural diagram of the material preparation section of the present invention; Figure 9 This is a side view of the material preparation section of the present invention. Figure 10 This is a three-dimensional structural diagram of the patch portion of the present invention; Figure 11 This is a three-dimensional structural diagram of the back of the patch base of the present invention; Figure 12 This is a three-dimensional structural diagram of a single patch unit of the present invention; Figure 13 This is a side view of a single patch unit of the present invention.

[0022] In the diagram: 1. Frame; 2. Positioning section; 21. Fixture drive screw; 22. Fixture drive screw pair; 23. Positioning fixture; 24. Fixture slot; 25. Fixture conveyor rail; 3. Material preparation section; 31. Support plate; 32. Unwinding shaft; 33. Unwinding reel; 34. Rewinding shaft; 35. Rewinding reel; 36. Limiting shaft; 37. Tensioning limiting wheel; 38. Material preparation tray; 39. Material preparation slot; 310. Stripping plate; 4. Patch application section; 41. Crossbeam; 42. Base drive screw; 43. Base drive screw pair; 44. Patch application section. 45. Base plate; 46. Negative pressure suction tube; 47. Negative pressure suction nozzle; 48. Visual inspection camera; 49. Base drive motor; 40. Bracket; 410. Crossbeam drive screw; 411. Crossbeam drive motor; 412. Lifting drive motor; 413. Lifting drive drive wheel; 414. Lifting drive belt; 415. Lifting drive driven wheel; 416. Clamping block; 417. Lifting seat; 418. Correction motor; 419. Correction drive wheel; 420. Correction transmission belt; 421. Correction driven wheel; 422. Spline sleeve. Detailed Implementation

[0023] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0024] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0025] Example 1 Please see Figures 1-3 As shown, this embodiment is an automatic chip mounter, including a frame 1. The frame 1 is provided with a positioning part 2, a material preparation part 3 and a mounting part 4. The positioning part 2 can transport and fix the substrate to be mounted at the mounting station on the frame 1. The material preparation part 3 can simultaneously transport multiple electrical components that need to be mounted to the material preparation station on the frame 1. The placement unit 4 includes a placement base 44 and a translation drive unit. The translation drive unit can drive the placement base 44 to reciprocate between the placement station and the material preparation station. The placement base 44 is equipped with a vision inspection camera 47 and multiple placement units. The vision inspection camera 47 can detect the position and angle of the substrate and electrical components. The placement units can pick up the electrical components in the material preparation station. The translation drive unit can transport the placement base 44 and the picked-up electrical components towards the substrate in the placement station according to the position detection results of the vision inspection camera 47, so that the electrical components are accurately aligned with the placement position on the substrate. During the picking and transport of electrical components, the placement units can rotate and adjust the angle of the electrical components according to the angle detection results of the vision inspection camera 47, so that the electrical components can be correctly placed on the substrate.

[0026] When mounting electrical components onto a printed circuit board (PCB), the positioning unit 2 transports and fixes the PCB coated with solder paste to the mounting station on the rack 1. The material preparation unit 3 transports the electrical components to be mounted to the material preparation station on the rack 1. The translation drive unit drives the mounting base 44 to move to the material preparation station, and the mounting unit picks up the electrical components in the material preparation station. The vision inspection camera 47 performs real-time detection of the position and angle of the PCB and electrical components. The translation drive unit then drives the mounting base 44 to move towards the mounting station, so that the mounting base 44 carries the mounting unit and the picked-up electrical components towards the mounting station. The printed circuit board in the workstation moves closer, and at this time, the translation drive unit adjusts the position of the placement unit and the electrical components according to the position detection structure so that the electrical components are exactly aligned with the placement positions on the printed circuit board where solder paste is applied. At the same time, the placement unit adjusts the angle of the electrical components according to the angle visual detection results to align the electrical components with the solder paste-coated positions on the printed circuit board. Thus, the combination of translational orientation adjustment and rotation angle adjustment can greatly improve the placement accuracy and prevent defects such as cold solder joints or short circuits caused by pin misalignment during the placement of electrical components, thereby improving the quality of the final printed circuit board product.

[0027] Example 2 Please see Figure 1 , Figure 4 Figure 6 , Figure 7 As shown, the difference between this embodiment and the above embodiment is that the positioning part 2 includes a fixture drive screw 21 and a fixture conveying slide rail 25. The fixture conveying slide rail 25 is fixedly installed on the top surface of the frame 1. A positioning fixture 23 is slidably installed on the fixture conveying slide rail 25. The top surface of the positioning fixture 23 is provided with a plurality of fixture slots 24. The fixture drive screw 21 is rotatably installed on the top surface of the frame 1. A fixture drive screw pair 22 is threadedly installed on the fixture drive screw 21. The fixture drive screw pair 22 is fixedly connected to the bottom surface of the positioning fixture 23. A rotary drive component is also drivenly installed at the end of the fixture drive screw 21.

[0028] The rotary drive component includes a servo motor, which is connected to the fixture drive screw 21 via a transmission wheel and a transmission belt. The positioning fixture 23 is provided with multiple fixture slots 24 that fit the printed circuit board. When mounting the printed circuit board, the printed circuit board is clamped and positioned in the fixture slots 24. Then, the servo motor drives the fixture drive screw 21 to rotate via the transmission wheel and the transmission belt. When the fixture drive screw 21 rotates, it drives the fixture drive screw pair 22 to be conveyed towards the mounting station in the middle of the top surface of the frame 1 through thread transmission. At the same time, the fixture drive screw pair 22 drives the positioning fixture 23 to slide synchronously along the fixture conveying slide rail 25, so that the positioning fixture 23 drives the printed circuit board in the fixture slot 24 to move and load it towards the mounting station.

[0029] Example 3 Please see Figures 1-9 As shown, the difference between this embodiment and the above embodiment is that the material preparation section 3 includes an unwinding section, a winding section, a stripping section and a material preparation tray 38. A roll is wound on the unwinding section, and multiple electrical components are attached to the roll at equal intervals. One end of the roll passes through the stripping section and is wound on the winding section. The material preparation tray 38 is fixedly installed on one side of the stripping section, and a material preparation groove 39 corresponding to the roll is provided on the material preparation tray 38. The take-up section pulls the unwinding section to unwind the belt. After unwinding, the belt moves past the stripping section and is then wound back onto the take-up section. The stripping section can peel off the electrical components from the belt as it moves past, and the belt then transports the peeled electrical components to the preparation slot 39 on the preparation tray 38. Through the cooperation of the unwinding section, take-up section, stripping section, and preparation tray 38, continuous feeding and preparation of electrical components can be achieved, making the feeding and preparation process of electrical components more convenient and faster. The electrical components are clamped in the preparation slot 39 for preparation, and the preparation slot 39 can limit the electrical components, improving the positioning accuracy of the electrical components preparation and positioning.

[0030] Furthermore, the unwinding section includes a support plate 31, which is fixedly installed on the top surface of the frame 1. An unwinding shaft 32 is fixedly installed on the support plate 31, and multiple unwinding reels 33 are rotatably installed on the unwinding shaft 32. Each unwinding reel 33 is wound with a roll, and multiple electrical components are attached to the roll at equal intervals in sequence. The take-up section includes a take-up shaft 34, which is rotatably mounted on the frame 1. Multiple take-up reels 35 are fixedly mounted on the take-up shaft 34. The ends of the tape can be wound onto the corresponding take-up reels 35. One end of the take-up shaft 34 is also connected to a take-up drive, which can drive the take-up shaft 34 to rotate so that the take-up shaft 34 drives the multiple take-up reels 35 to rotate synchronously for take-up. The stripping section includes a stripping plate 310, which is inclinedly arranged on one side of the preparation tray 38. The tape on the unwinding section is bent over the top edge of the stripping plate 310 and then wound onto the take-up section. The winding drive includes a servo motor, which is connected to the winding shaft 34 via a transmission belt and a transmission wheel. When electrical components are being loaded or prepared, the servo motor drives the winding shaft 34 to rotate via the transmission belt and the transmission wheel. The winding shaft 34 then drives the winding reel 35 on it to rotate, so that the winding reel 35 pulls and winds the belt. At this time, the unwinding reel 33 rotates to unwind, so that the belt gradually moves past the stripping plate 310. When the electrical components on the top surface of the belt move to the stripping plate 310, the belt is limited and bent by the stripping plate 310, while the electrical components remain straight. This allows the electrical components to gradually peel off from the belt. As the belt continues to be conveyed, the electrical components gradually move and are clamped into the material preparation groove 39 on the side of the material preparation tray 38 on one side of the stripping plate 310, thus separating the electrical components from the belt and loading and preparing the electrical components.

[0031] Furthermore, a limiting shaft 36 is provided on one side of the stripping plate 310. A tensioning limiting wheel 37 located on the belt moving path is rotatably mounted on the limiting shaft 36. The tensioning limiting wheel 37 can tension and limit the belt, which not only keeps the belt in a taut state so that the belt bends at the stripping plate 310 and separates from the electrical components, but also the end plates at both ends of the tensioning limiting wheel 37 can correct and limit the belt on both sides, so that the belt is aligned and conveyed. This allows the electrical components on the belt to be accurately conveyed and clamped in the material preparation trough 39 after being separated from the belt, thus completing the feeding and preparation process.

[0032] Example 4 Please see Figures 1-6 , Figure 10 As shown, the difference between this embodiment and the above embodiment is that the translation drive unit includes a bracket 49, the bracket 49 is fixedly installed on the top surface of the frame 1, the top of the bracket 49 is slidably mounted with a crossbeam 41 via a slide rail, a crossbeam drive screw 410 is rotatably mounted on the bracket 49 and arranged parallel to the slide rail, a crossbeam drive motor 411 is driven to one end of the crossbeam drive screw 410, a crossbeam drive screw pair is threadedly mounted on the crossbeam drive screw 410, and the crossbeam drive screw pair is fixedly connected to the crossbeam 41. A base drive screw 42 is rotatably mounted on the crossbeam 41. A base drive motor 48 is driven at one end of the base drive screw 42. A base drive screw pair 43 is threadedly mounted on the base drive screw 42. The patch base 44 is slidably mounted on the crossbeam 41 via a slide rail. The base drive screw pair 43 is fixedly connected to the patch base 44.

[0033] When the translation drive unit is working, the beam drive motor 411 can drive the beam drive screw 410 to rotate. When the beam drive screw 410 rotates, it can drive the beam drive screw pair and the beam 41 to move back and forth above the frame 1 through thread transmission. This allows the beam 41 to drive the placement base 44 and the placement unit to move back and forth between the material preparation station and the placement station, and to compensate and adjust the longitudinal position of the placement unit. The base drive motor 48 can drive the base drive screw 42 to rotate. When the base drive screw 42 rotates, it can drive the placement base 44 and the placement unit to move left and right along the beam 41 through thread transmission, thereby compensating and adjusting the lateral position of the placement unit. Through longitudinal and lateral compensation and adjustment, the electrical components adsorbed and gripped below the placement unit can be aligned with the placement position on the printed circuit board in the placement station, thereby improving the placement accuracy of the electrical components.

[0034] Example 5 Please see Figures 1-5 , Figures 9-13 As shown, the difference between this embodiment and the above embodiment is that the patch unit includes a lifting drive motor 412, a lifting drive driven wheel 415, and a lifting seat 417. The lifting seat 417 is slidably inserted into the patch base 44 via a guide shaft. A negative pressure suction tube 45 is fixedly inserted into the lifting seat 417. The top end of the negative pressure suction tube 45 can be connected to a negative pressure air source through a hose. A negative pressure suction nozzle 46 is connected and installed at the bottom end of the negative pressure suction tube 45. The lifting drive motor 412 is fixedly installed on the patch base 44. The output end of the lifting drive motor 412 is driven and installed with a lifting drive drive wheel 413. The lifting drive driven wheel 415 is rotatably installed on the patch base 44. A lifting drive belt 414 is driven and installed between the lifting drive drive wheel 413 and the lifting drive driven wheel 415. A clamping block 416 is fixedly installed on one side of the lifting seat 417. The clamping block 416 is fixedly clamped onto the lifting drive belt 414.

[0035] When the patch base 44 moves the negative pressure suction nozzle 46 above the material preparation station (material preparation tank 39), the lifting drive motor 412 drives the lifting drive drive wheel 413 to rotate counterclockwise. When the lifting drive drive wheel 413 rotates, it cooperates with the lifting drive driven wheel 415 to drive the lifting drive belt 414 to move cyclically. At this time, the left side of the lifting drive belt 414 moves downward, and through the clamping block 416, it drives the lifting seat 417 to move downward, so that the lifting seat 417 drives the negative pressure suction tube 45 and the negative pressure suction nozzle 46 to move downward synchronously until the negative pressure suction nozzle 46 abuts against the top surface of the electrical component below. Then the air source passes through the hose. Negative pressure is drawn into the negative pressure suction tube 45 and negative pressure suction nozzle 46 so that the negative pressure suction nozzle 46 can adsorb and grab the electrical components. Then, the lifting drive motor 412 drives the lifting drive drive wheel 413 to rotate clockwise. At this time, the lifting drive drive wheel 413 and the lifting drive driven wheel 415 cooperate to drive the lifting drive belt 414 to move in reverse cycle. At this time, the left side of the lifting drive belt 414 moves upward and resets, and drives the lifting seat 417 to move upward and reset through the clamping block 416. Thus, the lifting seat 417 drives the negative pressure suction tube 45, negative pressure suction nozzle 46 and electrical components to move upward synchronously, so that the electrical components are removed from the material preparation tank 39. Then, the translation drive unit drives the mounting base 44 and the electrical component to move towards the mounting station. When the electrical component moves directly above the mounting position on the printed circuit board, the lifting drive motor 412 drives the negative pressure nozzle 46 to move downward, so that the negative pressure nozzle 46 mounts the electrical component on the printed circuit board. At the same time, the air source stops drawing negative pressure on the negative pressure suction tube 45 and the negative pressure nozzle 46, so that the negative pressure nozzle 46 releases its grip on the electrical component. Finally, the lifting drive motor 412 drives the negative pressure nozzle 46 to move upward, completing the mounting operation of the electrical component. Among them, the lifting drive motor 412 is a servo motor. The servo motor, in conjunction with the transmission wheel and transmission belt, drives the negative pressure nozzle 46 to lift and lower, which can precisely control the position, speed and mounting pressure of the negative pressure nozzle 46, thus improving the mounting accuracy of electrical components.

[0036] Furthermore, the patch unit also includes a correction motor 418 and a spline sleeve 422. The correction motor 418 is fixedly mounted on the patch base 44. The output end of the correction motor 418 is driven by a correction drive wheel 419. The spline sleeve 422 is slidably fitted onto the outer ring of the negative pressure suction tube 45 through a keyway. The outer ring of the spline sleeve 422 is fixedly mounted with a correction driven wheel 421. The correction drive wheel 419 and the correction driven wheel 421 are connected by a correction transmission belt 420.

[0037] When the negative pressure suction nozzle 46 moves the adsorbed electrical component above the printed circuit board mounting position, if the vision inspection camera 47 detects an angular deviation in the electrical component, the correction motor 418 can drive the correction drive wheel 419 to rotate. When the correction drive wheel 419 rotates, it drives the correction driven wheel 421 to rotate through the correction transmission belt 420. The correction driven wheel 421 then drives the negative pressure suction tube 45, the negative pressure suction nozzle 46, and the electrical component to rotate synchronously through the spline sleeve 422, thereby adjusting and correcting the angle of the electrical component, so that the electrical component is precisely aligned with the mounting position on the printed circuit board below, thereby improving the mounting progress of the electrical component. Moreover, the correction motor 418 is a servo motor, which can perform fine-tuning of rotation according to the detection results of the vision inspection camera 47, thereby improving the adjustment and correction effect of the electrical component angle.

[0038] Example 6 This embodiment discloses a method for fabricating an integrated circuit, the specific steps of which are as follows: Apply solder paste to the surface mount locations on the printed circuit board; The solder paste-coated printed circuit board is conveyed and fixed to the surface mount station on the frame 1 by the positioning part 2; The material preparation section 3 transports the electrical components that need to be surface mount to the material preparation station on the frame 1; The translation drive unit drives the chip mounting base 44 to move to the material preparation station, and the chip mounting unit adsorbs the electrical components in the material preparation station; The translation drive unit then drives the placement base 44 to move toward the placement station, so that the placement base 44 moves the placement unit and the adsorbed electrical components toward the printed circuit board in the placement station. The visual inspection camera 47 performs real-time inspection of the orientation of the printed circuit board and electrical components. The placement unit adjusts the orientation angle of the electrical components according to the visual inspection results to align the electrical components with the positions on the printed circuit board coated with solder paste. The printed circuit board with the electrical components mounted is sent into a reflow oven for reflow soldering, so that the mounted electrical components are soldered and fixed to the printed circuit board.

[0039] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0040] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that the present invention is not limited to the described order of actions, because according to the present invention, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to the present invention.

Claims

1. An automatic chip mounter, comprising a frame, characterized in that: The frame is equipped with a positioning part, a material preparation part and a mounting part. The positioning part can transport and fix the substrate to be mounted at the mounting station on the frame. The material preparation part can simultaneously transport multiple electrical components that need to be mounted to the material preparation station on the frame. The placement unit includes a placement base and a translation drive unit. The translation drive unit can drive the placement base to reciprocate between the placement station and the material preparation station. The placement base is equipped with a vision inspection camera and multiple placement units. The vision inspection camera can detect the position and angle of the substrate and electrical components. The placement units can adsorb and grasp the electrical components in the material preparation station. The translation drive unit, based on the position detection results of the vision inspection camera, transports the placement base and the adsorbed electrical components towards the substrate in the placement station, so that the electrical components are precisely aligned with the placement positions on the substrate. During the adsorption and transport of electrical components, the placement units can rotate and adjust the angle of the electrical components based on the angle detection results of the vision inspection camera, so that the electrical components can be properly mounted on the substrate.

2. An automatic chip mounter according to claim 1, characterized in that: The positioning part includes a fixture drive screw and a fixture conveying slide rail. The fixture conveying slide rail is fixedly installed on the top surface of the frame. A positioning fixture is slidably installed on the fixture conveying slide rail. The top surface of the positioning fixture is provided with multiple fixture slots. The fixture drive screw is rotatably mounted on the top surface of the frame. A fixture drive screw pair is threadedly mounted on the fixture drive screw. The fixture drive screw pair is fixedly connected to the bottom surface of the positioning fixture. A rotary drive component is also driven at the end of the fixture drive screw.

3. An automatic chip mounter according to claim 1, characterized in that: The material preparation section includes an unwinding section, a winding section, a stripping section, and a material preparation tray. A roll of tape is wound on the unwinding section, and multiple electrical components are attached to the roll of tape at equal intervals in sequence. One end of the roll of tape passes through the stripping section and is wound on the winding section. The material preparation tray is fixedly installed on one side of the stripping section, and the material preparation tray is provided with a material preparation groove corresponding to the roll of tape. The take-up section can pull and unwind the belt on the unwind section. After unwinding, the belt moves through the stripping section and then winds back onto the take-up section. The stripping section can peel off the electrical components on the belt as it moves through, and then the belt transports the peeled electrical components to the material preparation trough on the material preparation tray.

4. An automatic chip mounter according to claim 3, characterized in that: The unwinding section includes a support plate, which is fixedly installed on the top surface of the frame. An unwinding shaft is fixedly installed on the support plate, and multiple unwinding reels are rotatably installed on the unwinding shaft. Each unwinding reel has a roll of tape wound around it, and multiple electrical components are attached to the roll of tape at equal intervals in sequence.

5. An automatic placement machine according to claim 3, characterized in that: The take-up section includes a take-up shaft, which is rotatably mounted on the frame. Multiple take-up reels are fixedly mounted on the take-up shaft. The end of the tape can be wound onto the corresponding take-up reel. One end of the take-up shaft is also connected to a take-up drive component, which can drive the take-up shaft to rotate so that the take-up shaft drives the multiple take-up reels to rotate synchronously for take-up.

6. An automatic placement machine according to claim 3, characterized in that: The stripping section includes a stripping plate, which is inclinedly disposed on one side of the preparation tray. The roll on the unwinding section is bent past the top edge of the stripping plate and then wound onto the take-up section. A limit shaft is provided on one side of the stripping plate, and a tensioning limit wheel located on the conveyor belt moving path is rotatably mounted on the limit shaft.

7. An automatic chip mounter according to claim 1, characterized in that: The translation drive unit includes a bracket, which is fixedly installed on the top surface of the frame. A crossbeam is slidably installed on the top of the bracket via a slide rail. A crossbeam drive screw is rotatably installed on the bracket and arranged parallel to the slide rail. A crossbeam drive motor is driven at one end of the crossbeam drive screw. A crossbeam drive screw pair is threadedly installed on the crossbeam drive screw and is fixedly connected to the crossbeam. A base drive screw is rotatably mounted on the crossbeam. A base drive motor is driven at one end of the base drive screw. A base drive screw pair is threadedly mounted on the base drive screw. The patch base is slidably mounted on the crossbeam via a slide rail. The base drive screw pair is fixedly connected to the patch base.

8. An automatic placement machine according to any one of claims 1-7, characterized in that: The patch unit includes a lifting drive motor, a lifting drive driven wheel, and a lifting base. The lifting base is slidably inserted into the patch base via a guide shaft. A negative pressure suction tube is fixedly inserted into the lifting base. The top end of the negative pressure suction tube can be connected to a negative pressure air source through a flexible tube. A negative pressure suction nozzle is connected to the bottom end of the negative pressure suction tube. The lifting drive motor is fixedly mounted on the patch base. The output end of the lifting drive motor is driven by a lifting drive drive wheel. The lifting drive driven wheel is rotatably mounted on the patch base. A lifting drive belt is driven between the lifting drive drive wheel and the lifting drive driven wheel. A clamping block is fixedly mounted on one side of the lifting seat and is fixedly clamped to the lifting drive belt.

9. An automatic placement machine according to claim 8, characterized in that: The patch unit also includes a correction motor and a spline sleeve. The correction motor is fixedly installed on the patch base. The output end of the correction motor is driven by a correction drive wheel. The spline sleeve is slidably fitted onto the outer ring of the negative pressure suction tube through a keyway. The outer ring of the spline sleeve is fixedly installed with a correction driven wheel. The correction drive wheel and the correction driven wheel are connected by a correction drive belt.

10. A method for fabricating an integrated circuit, using an automatic placement machine as described in any one of claims 1-9, characterized in that, The specific steps are as follows: Apply solder paste to the surface mount locations on the printed circuit board; The positioning section transports and fixes the printed circuit board coated with solder paste to the placement station on the rack. The material preparation department transports the electrical components that need to be surface mounted to the material preparation station on the rack; The translation drive unit drives the surface mount base to move to the material preparation station, and the surface mount unit adsorbs the electrical components in the material preparation station; The translation drive unit then drives the placement base to move toward the placement station, so that the placement base moves the placement unit and the adsorbed electrical components toward the printed circuit board in the placement station. The visual inspection camera performs real-time detection of the orientation of the printed circuit board and electrical components. The placement unit adjusts the orientation angle of the electrical components according to the visual inspection results to align the electrical components with the solder paste-coated positions on the printed circuit board. The printed circuit board with the electrical components mounted is sent into a reflow oven for reflow soldering, so that the mounted electrical components are soldered and fixed to the printed circuit board.

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