A detachable circuit board integration method

Abstract

The application discloses a detachable circuit board integration method, defines detachable sub-circuits as sub-boards, defines the rest of the circuits as a mother board, and combs all the sub-boards, the mother board and the interconnection radio frequency signals between the sub-boards; a pair of resistors A1 and A2 are arranged on the mother board, the pin one of the resistors A1 and A2 is superimposed on a common pad one, a pair of resistors B1 and B2 are arranged on each sub-board, the pin one of the resistors B1 and B2 is superimposed on a common pad two, the common pad one is in communication with the mother board device, and the common pad two is in communication with the sub-board device; the boundary of the mother board and each sub-board is combed, the boundary is punched through in a stamp hole connection mode, all the interconnection radio frequency signal lines are printed, pass through the stamp hole and are connected with the pin two of the resistor A1 and the pin two of the resistor B1 at two ends respectively; the pin two of the resistor A2 is in communication with a mother board radio frequency connector, and the pin two of the resistor B2 is in communication with a sub-board radio frequency connector.

Description

Technical Field

[0001] This invention belongs to the field of circuit design technology and relates to a detachable circuit board assembly and segmentation technology. Background Technology

[0002] With the rapid development of technology, various electronic device platforms face more constraints on system size, weight, and cost. Circuit boards are required to be small, lightweight, and integrated, while also having high requirements for low cost. Various electronic devices face the challenge of miniaturization and integration, resulting in analog and digital circuits being laid out in the same structural component. Digital circuits are rich in stray signals, which can easily be transmitted through large-area grounding and interfere with analog signals.

[0003] Integrating multiple module circuits onto a single printed circuit board (PCB) according to application requirements, or removing one or more functional circuits already integrated onto a single board and placing them separately in different structural locations, can reduce design costs and increase system flexibility and reconfigurability. To achieve device miniaturization, we typically integrate as many sub-functional circuits as possible onto the same PCB, forming a large, multi-functional circuit. These sub-circuits must be interconnected by signals.

[0004] After the printed circuit board (PCB) is designed, manufactured, and components are assembled and tested, it is highly likely that sharing a board with different sub-circuits will lead to poor electromagnetic compatibility and signal quality, resulting in degraded equipment performance. In this case, redesigning the interfering sub-circuits on separate boards will inevitably require scrapping the already manufactured equipment, wasting manpower and time.

[0005] In electronic device design, multiple functional circuits are integrated onto a single printed circuit board. When space within the structure is limited, some circuits are removed and placed separately in other spaces and cavities. This achieves both modular standardization and integration, while also allowing for flexible selection of usage methods according to product requirements.

[0006] When equipment has complex functions, numerous components, and a complex electromagnetic environment, removing some functional modules can not only avoid signal radiation crosstalk in space, but also separate the grounding of different circuits, eliminate stray interference within the board, and ensure signal quality.

[0007] Therefore, there is an urgent need for a design methodology that modularizes mature functional circuit designs at the circuit board level. Applying mature and universal standardized functional circuit results can reduce the failure rate during the development phase of electronic devices, shorten the development cycle, and avoid economic losses. Summary of the Invention

[0008] This invention proposes a detachable circuit board, allowing some or more parts of the circuitry to be removed and installed elsewhere according to application requirements. The boards are interconnected via cables using pre-installed connectors, offering flexibility and convenience. Parts of the circuitry on the printed circuit board of electronic devices can be flexibly removed and used according to the structural layout, improving the versatility and reconfigurability of the electronic equipment. Without redesigning, manufacturing, or assembling the printed circuit board, circuits can be quickly separated, ensuring signal quality, shortening the development cycle, and avoiding economic losses.

[0009] Define the detachable sub-circuits as sub-boards and the remaining circuits as motherboards, and sort out all the sub-boards.

[0010] Furthermore, in the design of the printed circuit board, each sub-board is placed in the area at one of the four corners of the printed circuit board.

[0011] Organize the interconnection RF signals between the motherboard and each daughterboard. Set a pair of resistors A1 and A2 on the motherboard and overlap the pins of A1 and A2 on a common pad. Set a pair of resistors B1 and B2 on each daughterboard and overlap the pins of B1 and B2 on a common pad.

[0012] Furthermore, the resistances A1, A2, B1, and B2 are all zero Ω.

[0013] The boundaries between the motherboard and each daughterboard are sorted out, and the boundaries are opened up using a perforated stamp method. All interconnecting radio frequency signal lines are printed and passed through the perforated stamp.

[0014] Furthermore, the flooring connects the main board and each sub-board.

[0015] Each interconnect RF signal line is connected to pin 2 of resistor A1 and pin 2 of resistor B1 at both ends, with common pad 1 connected to the motherboard device and common pad 2 connected to the daughterboard device.

[0016] Pin A2 is connected to the motherboard RF connector, and pin B2 is connected to the daughterboard RF connector.

[0017] Furthermore, low-frequency rectangular connectors are provided on the sides of the motherboard and each daughterboard to connect low-frequency signal lines, control signal lines, and power lines.

[0018] Connect the selected sub-board and motherboard along the boundary and use them together. Remove resistors A2 and B2. Connect the motherboard components and sub-board components to the RF signal through common pad 1, resistor A1, printed interconnect RF signal line, resistor B1, and common pad 2.

[0019] Separate the selected motherboard and daughterboard along the boundary and use them separately. Remove resistors A1 and B1, and connect the two ends of the RF cable to the RF connectors of the motherboard and daughterboard respectively. The RF signals of the motherboard components and daughterboard components are connected through common pad 1, resistor A2, RF cable, resistor B2, and common pad 2.

[0020] This invention applies its design method to circuits that are difficult to simulate in the initial design phase and may interfere with each other on the same board. In subsequent use, a large circuit board can be split into two or more smaller circuit boards without changing the device's form factor; only an additional RF cable is needed for use in the original scenario. If subsequent use does not require circuit splitting, it only adds a few interconnect traces to the printed circuit board, with almost no increase in cost. This invention cleverly utilizes a stacked pad design, ensuring that no extra residual traces are created on the printed circuit board regardless of whether the circuit is split, thus preventing RF signal leakage. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the layout of the daughterboard and the motherboard.

[0022] Figure 2 This is a schematic diagram of the stamp perforation and radio frequency wiring.

[0023] Figure 3 It is a schematic diagram of the assembly of resistors, pads, devices, and connectors.

[0024] Figure 4 This is a schematic diagram of the wiring for a low-frequency rectangular connector.

[0025] Figure 5 This is a schematic diagram showing the splicing and use of the sub-board and the motherboard.

[0026] Figure 6 This is a diagram showing the disassembly and use of the daughterboard and motherboard. Detailed Implementation

[0027] The present invention will be further described in detail below with reference to the accompanying drawings.

[0028] Define the detachable sub-circuit as a sub-board and the remaining circuits as a motherboard. Organize all sub-boards and, during the printed circuit board design, place each sub-board in one of the four corner areas of the printed circuit board, such as... Figure 1 As shown, B is one of the sub-boards, and A is the motherboard.

[0029] Organize the interconnection RF signals between the motherboard and each daughterboard. Set a pair of zero-Ω resistors A1 and A2 on the motherboard and overlap the pins of A1 and A2 on the common pad one. Set a pair of zero-Ω resistors B1 and B2 on each daughterboard and overlap the pins of B1 and B2 on the common pad two.

[0030] The boundaries between the motherboard and each daughterboard are cleared, and a perforated connection method is used to connect the boundaries. A ground plane is laid to connect the motherboard and each daughterboard. All interconnecting RF signal lines are printed and passed through the perforated holes, such as... Figure 2 As shown.

[0031] Each interconnect RF signal line is connected to pin 2 of resistor A1 and pin 2 of resistor B1 at both ends, respectively. Common pad 1 is connected to motherboard device D1, and common pad 2 is connected to daughterboard device D2. Figure 3 As shown.

[0032] Pin A2 is connected to the motherboard RF connector, and pin B2 is connected to the daughterboard RF connector. Figure 3 As shown.

[0033] Low-frequency rectangular connectors are provided on the sides of the motherboard and each daughterboard for connecting low-frequency signal lines, control signal lines, and power lines, such as... Figure 4 As shown.

[0034] Connect the selected daughter board and mother board along the boundary, using them as a single board. Remove resistors A2 and B2. Connect the RF signals between mother board component D1 and daughter board component D2 via common pad one, resistor A1, printed interconnect RF signal lines, resistor B1, and common pad two. Figure 5 As shown.

[0035] Separate the selected motherboard and daughterboard along the boundary for separate use. Remove resistors A1 and B1. Connect the two ends of the RF cable to the RF connectors on the motherboard and daughterboard respectively. Connect the RF signals between motherboard component D1 and daughterboard component D2 via common pad one, resistor A2, RF cable, resistor B2, and common pad two. Figure 6 As shown.

Claims

1. A method for integrating a detachable circuit board, characterized in that, This includes: defining detachable sub-circuits as daughter boards and the remaining circuits as mother boards; organizing all daughter boards and the interconnection RF signals between the mother board and each daughter board; setting a pair of resistors A1 and A2 on the mother board, with pins 1 of A1 and A2 overlapped on a common pad 1; setting a pair of resistors B1 and B2 on each daughter board, with pins 1 of B1 and B2 overlapped on a common pad 2; common pad 1 is connected to the mother board components, and common pad 2 is connected to the daughter board components; organizing the boundaries between the mother board and each daughter board, using a perforated connection method to open the boundaries, printing all interconnection RF signal lines, passing them through the perforated holes, and connecting the two ends to pins 2 of resistor A1 and pins 2 of resistor B1 respectively; pin 2 of resistor A2 is connected to the mother board RF connector, and pin 2 of resistor B2 is connected to the daughter board RF connector.

2. The detachable circuit board integration method according to claim 1, characterized in that, The resistors A1, A2, B1, and B2 are all zero Ω.

3. The detachable circuit board integration method according to claim 1, characterized in that, Also includes: The floor is connected to the main board and each sub-board.

4. The detachable circuit board integration method according to claim 1, characterized in that, Also includes: Connect the selected sub-board and motherboard along the boundary and use them together. Remove resistors A2 and B2. Connect the motherboard components and sub-board components to the RF signal through common pad 1, resistor A1, printed interconnect RF signal line, resistor B1, and common pad 2.

5. The detachable circuit board integration method according to claim 1, characterized in that, Also includes: Separate the selected motherboard and daughterboard along the boundary and use them separately. Remove resistors A1 and B1, and connect the two ends of the RF cable to the RF connectors of the motherboard and daughterboard respectively. The RF signals of the motherboard components and daughterboard components are connected through common pad 1, resistor A2, RF cable, resistor B2, and common pad 2.

6. The detachable circuit board integration method according to claim 1, characterized in that, Also includes: When designing a printed circuit board, each sub-board is placed in one of the four corner areas of the printed circuit board.

7. The detachable circuit board integration method according to claim 6, characterized in that, Also includes: Low-frequency rectangular connectors are provided on the sides of the motherboard and each daughterboard to connect low-frequency signal lines, control signal lines, and power lines.

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