Housing and electronic device

Abstract

The application provides a shell and an electronic device. The shell provided by the application comprises a first substrate layer and a heat insulation sheet. The heat insulation sheet is carried on the first substrate layer, and a projection of the first substrate layer covers part of the first substrate layer. The thermal conductivity of the first substrate layer is greater than that of the heat insulation sheet. When the shell is used in the electronic device, the surface of the electronic device has a lower maximum temperature.

Description

Technical Field

[0001] This application relates to the field of electronics, specifically to a housing and an electronic device. Background Technology

[0002] Electronic devices such as mobile phones contain chips (such as system-on-a-chip, or SOC). Since chips generate heat when they are working, the outer surface of the electronic device corresponding to the chip location can easily heat up rapidly. High temperatures can affect user safety and user experience. Summary of the Invention

[0003] This application provides a housing that, when applied to an electronic device, allows the surface of the electronic device to have a lower maximum temperature.

[0004] A first aspect of this application provides a housing, the housing comprising:

[0005] First substrate layer; and

[0006] A heat insulation sheet is supported on the first substrate layer, and the orthographic projection of the heat insulation sheet on the first substrate layer covers a portion of the first substrate layer; the thermal conductivity of the first substrate layer is greater than the thermal conductivity of the heat insulation sheet.

[0007] A second aspect of this application provides an electronic device, the electronic device comprising:

[0008] Display screen;

[0009] A heat source, the heat source being located on one side of the display screen; and

[0010] The housing described in the first aspect of this application is located on the side of the heat source away from the display screen, and the heat insulation sheet of the housing is arranged corresponding to the heat source.

[0011] The housing in this embodiment includes a first substrate layer and a heat insulation sheet. The heat insulation sheet is supported on the first substrate layer, and its orthographic projection covers a portion of the first substrate layer. The thermal conductivity λ1 of the first substrate layer is greater than the thermal conductivity λ2 of the heat insulation sheet. By designing the relationship between the thermal conductivity of the first substrate layer and the heat insulation sheet, when the housing is applied to an electronic device, the surface of the electronic device is less prone to localized heating, resulting in a lower maximum temperature and improved user experience. Attached Figure Description

[0012] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic planar structure diagram of the housing according to an embodiment of this application.

[0014] Figure 2 The housing along the first embodiment of this application Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0015] Figure 3 The housing along the second embodiment of this application Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0016] Figure 4 The housing along the third embodiment of this application Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0017] Figure 5 The housing along the fourth embodiment of this application Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0018] Figure 6 The housing along the fifth embodiment of this application Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0019] Figure 7 The housing along the sixth embodiment of this application Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0020] Figure 8 The housing along the seventh embodiment of this application Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0021] Figure 9 The housing of the eighth embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0022] Figure 10 The housing edge of the ninth embodiment of this application Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0023] Figure 11 The housing along the tenth embodiment of this application Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0024] Figure 12 The housing edge of the eleventh embodiment of this application Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0025] Figure 13 The housing of the twelfth embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0026] Figure 14 The housing of the thirteenth embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0027] Figure 15 This is a schematic flowchart of a method for preparing a shell according to an embodiment of this application.

[0028] Figure 16 This is a schematic flowchart of a method for preparing a shell according to another embodiment of this application.

[0029] Figure 17 This is a schematic diagram of the shell structure of Comparative Example 1 of this application.

[0030] Figure 18 This is a schematic diagram of the shell structure of Comparative Example 2 of this application.

[0031] Figure 19 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0032] Figure 20 This is a partial exploded structural diagram of an electronic device according to an embodiment of this application.

[0033] Figure 21 This is a circuit block diagram of an electronic device according to an embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100-Housing, 10-First substrate layer, 11-First fiber resin layer, 20-Heat insulation sheet, 21-Heat insulation layer, 30-Second substrate layer, 31-Second fiber resin layer, 40-Underlying cover, 50-Anti-fingerprint layer, 400-Electronic device, 410-Display screen, 420-Middle frame, 430-Heat source, 450-Memory, 470-Camera module, 101-Light-transmitting part. Detailed Implementation

[0036] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0037] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0038] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0039] It should be noted that, for ease of explanation, the same reference numerals denote the same components in the embodiments of this application, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0040] Electronic devices such as mobile phones contain chips (such as system-on-a-chip, or SOC). Since chips generate heat when they are working, the outer surface of the electronic device corresponding to the chip location can easily heat up rapidly. High temperatures can affect user safety and affect the user experience.

[0041] The heat source of electronic devices such as mobile phones is mainly concentrated on the chip. In related technologies, the material of the electronic device's casing is homogeneous and has uniform thermal conductivity. Therefore, the temperature of the chip on the outer surface of the electronic device can easily become too high locally, thereby reducing the user's comfort and affecting user safety.

[0042] Figure 1 This is a schematic planar structure diagram of the housing 100 according to an embodiment of this application. Figure 2 The housing 100 of the first embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction. Figure 3 The housing 100 of the second embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction. Figure 4 The housing 100 of the third embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0043] Please see Figures 1 to 4 This application provides a housing 100, which includes a first substrate layer 10 and a heat insulation sheet 20. The heat insulation sheet 20 is supported on the first substrate layer 10, and the orthographic projection of the heat insulation sheet 20 covers a portion of the first substrate layer 10. The thermal conductivity λ1 of the first substrate layer 10 is greater than the thermal conductivity λ2 of the heat insulation sheet 20.

[0044] The housing 100 of this application can be applied to portable electronic devices such as mobile phones, tablets, laptops, desktop computers, smart bracelets, smartwatches, e-readers, and game consoles. Optionally, the housing 100 of this application can be a back cover (battery cover), mid-frame, decorative part, protective shell, protective lens or decorative part of a camera module, etc., for electronic devices. In the accompanying drawings and description of this application, the housing 100 is illustrated and described using the back cover of an electronic device (such as a mobile phone) as an example, and should not be construed as a limitation on the housing 100 and electronic devices of the embodiments of this application. The housing 100 of the embodiments of this application can be a 2D structure, a 2.5D structure, a 3D structure, etc. It should be noted that a protective shell refers to a shell that is fitted onto at least part of the outer periphery of an electronic device to protect the electronic device, and can be independent of the protective parts or protective covers of the electronic device.

[0045] It should be noted that the heat insulation sheet 20 covers a portion of the first substrate layer 10.

[0046] It should be noted that when the housing 100 is applied to electronic devices, the heat insulation sheet 20 corresponds to the main heat source of the electronic device, such as the system-on-a-chip (SOC), central processing unit, controller, etc.

[0047] In some embodiments, the heat insulation sheet 20 is disposed on the surface of the first substrate layer 10. In other embodiments, the heat insulation sheet 20 is partially embedded in the first substrate layer 10, for example, the heat insulation sheet 20 is embedded in the first substrate layer 10, and one surface of the heat insulation sheet 20 is exposed outside the first substrate layer 10 and flush with one surface of the first substrate layer 10 (e.g., Figure 2 and Figure 3 (As shown). In some other embodiments, the heat insulation sheet 20 is completely embedded inside the first substrate layer 10, that is, the heat insulation sheet 20 is located inside the first substrate layer 10 (e.g. Figure 4 (As shown). It can be understood that when the heat insulation sheet 20 is at least partially embedded in the first substrate layer 10, the first substrate layer 10 is disposed around the outer periphery of the heat insulation sheet 20.

[0048] Optionally, the first substrate layer 10 has a sheet-like structure, and the diaphragm sheet has a sheet-like structure.

[0049] The housing 100 of this application embodiment includes a first substrate layer 10 and a heat insulation sheet 20. The heat insulation sheet 20 is supported on the first substrate layer 10, and the orthographic projection of the heat insulation sheet 20 covers a portion of the first substrate layer 10. The thermal conductivity λ1 of the first substrate layer 10 is greater than the thermal conductivity λ2 of the heat insulation sheet 20. By designing the relationship between the thermal conductivity of the first substrate layer 10 and the heat insulation sheet 20, when the housing 100 is applied to an electronic device, the surface of the electronic device is less prone to localized heating, resulting in a lower maximum temperature and improved user experience.

[0050] In some embodiments, the ratio of the thermal conductivity λ1 of the first substrate layer 10 to the thermal conductivity λ2 of the heat insulation sheet 20 is in the range of: λ1 / λ2≥2.

[0051] Specifically, the ratio λ1 / λ2 of the thermal conductivity λ1 of the first substrate layer 10 to the thermal conductivity λ2 of the heat insulation sheet 20 can be, but is not limited to, 2, 5, 8, 10, 15, 20, 25, 30, 35, 40, 45, 50, 65, 60, etc. If the ratio λ1 / λ2 of the thermal conductivity λ1 of the first substrate layer 10 to the thermal conductivity λ2 of the heat insulation sheet 20 is too low, then either the thermal conductivity λ1 of the first substrate layer 10 is too low or the thermal conductivity λ2 of the heat insulation sheet 20 is too high. When the thermal conductivity λ1 of the first substrate layer 10 is too low, the heat dissipation effect of the housing 100 is reduced, causing heat to accumulate inside the electronic device when the housing 100 is used, making it difficult to dissipate. This results in excessively high internal or local temperatures in the electronic device, which can easily cause malfunctions, lag, etc., reducing the user experience. If the thermal conductivity λ2 of the heat insulation sheet 20 is too high, then when the housing 100 is used in an electronic device, the heat of the electronic device is easily transferred to the surface of the housing 100, causing excessively high local temperatures on the surface of the housing 100, reducing the user's experience. If the ratio of the thermal conductivity λ1 of the first substrate layer 10 to the thermal conductivity λ2 of the heat insulation sheet 20 is too high, it will increase the manufacturing cost of the housing 100. Alternatively, to achieve a higher thermal conductivity for the first substrate layer 10, a conductive material must be used, which will cause the housing 100 to suppress electromagnetic radiation and affect the normal operation of electronic devices using the housing 100.

[0052] In one specific embodiment, the ratio λ1 / λ2 of the thermal conductivity λ1 of the first substrate layer 10 to the thermal conductivity λ2 of the heat insulation sheet 20 is in the range of 2 ≤ λ1 / λ2 ≤ 50. This allows the surface of the electronic device to avoid localized heating when the housing 100 is applied to the electronic device, resulting in a lower maximum temperature and improved user experience; it also allows the housing 100 to have a lower cost.

[0053] In some embodiments, the thermal conductivity λ1 of the first substrate layer 10 is in the range of 0.2 W / (m·K) ≤ λ1 ≤ 5 W / (m·K).

[0054] Specifically, the thermal conductivity λ1 of the first substrate layer 10 can be, but is not limited to, 0.2 W / (m·K), 0.5 W / (m·K), 0.8 W / (m·K), 1.0 W / (m·K), 1.2 W / (m·K), 1.5 W / (m·K), 1.8 W / (m·K), 2.0 W / (m·K), 2.2 W / (m·K), 2.5 W / (m·K), 2.8 W / (m·K), 3.0 W / (m·K), 3.2 W / (m·K), 3.5 W / (m·K), 3.8 W / (m·K), 4.0 W / (m·K), 4.2 W / (m·K), 4.5 W / (m·K), 4.8 W / (m·K), 5 W / (m·K), etc.

[0055] In this embodiment, the thermal conductivity λ1 of the first substrate layer 10 is too low, which reduces the heat dissipation effect of the housing 100. When the housing 100 is applied to an electronic device, heat accumulates inside the electronic device and is difficult to dissipate, causing the internal or local temperature of the electronic device to be too high. This can easily lead to malfunctions or lag in the electronic device, thus reducing the user experience. On the other hand, if the thermal conductivity λ1 of the first substrate layer 10 is too high, it increases the cost of the first substrate layer 10, thereby increasing the manufacturing cost of the housing 100.

[0056] Optionally, the first substrate layer 10 and the heat insulation sheet 20 are insulating.

[0057] Figure 5 The housing 100 of the fourth embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0058] Please see Figure 5 Optionally, the first substrate layer 10 may include, but is not limited to, at least one first fiber resin layer 11. For example, the first substrate layer 10 may include, but is not limited to, one, two, three, four, five, or six first fiber resin layers 11. When the first substrate layer 10 includes at least two first fiber resin layers 11, the at least two first fiber resin layers 11 are stacked sequentially.

[0059] Optionally, the first fiber resin layer 11 has a sheet-like structure. When there are at least two first fiber resin layers 11, the at least two first fiber resin layers 11 are stacked sequentially along their thickness direction.

[0060] Optionally, the first fiber resin layer 11 includes a first fiber cloth and a first resin, wherein the first resin is wrapped around the outer periphery of the first fiber cloth.

[0061] Alternatively, the first fiber cloth can be formed by weaving or spinning.

[0062] Optionally, the first fiber cloth may be, but is not limited to, at least one of ultra-high molecular weight polyethylene fiber cloth (UPE fiber), carbon fiber cloth, glass fiber cloth, aramid fiber cloth, poly(p-phenylene benzodioxazole) fiber cloth (PBO fiber), liquid crystal polymer cloth (LCP fiber), ceramic fiber cloth, basalt fiber cloth, etc.

[0063] When the first substrate layer 10 includes multiple layers of first fiber resin layers 11, the first fiber fabrics in the multiple layers of first fiber resin layers 11 may be the same or different. For example, all multiple layers of first fiber resin layers 11 may be glass fiber resin layers (i.e., all first fiber fabrics may be glass fiber fabrics); or some of the multiple layers of first fiber resin layers 11 may be glass fiber resin layers (i.e., some first fiber fabrics may be glass fiber fabrics) and some may be ceramic fiber resin layers (i.e., some first fiber fabrics may be ceramic fiber fabrics).

[0064] Optionally, the first resin may be, but is not limited to, at least one of epoxy resin, phenolic resin, bismaleimide resin, benzoxazine resin, etc.

[0065] In one specific embodiment, the first substrate layer 10 is a glass fiber resin layer with a thermal conductivity of 0.26 W / (m·K).

[0066] Optionally, the thickness of the first substrate layer 10 ranges from 0.04 mm to 0.2 mm. Specifically, the thickness of the first substrate layer 10 can be, but is not limited to, 0.04 mm, 0.06 mm, 0.08 mm, 0.10 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, 0.20 mm, etc. In this embodiment, if the thickness of the first substrate layer 10 is too thin, it increases the difficulty of manufacturing the first substrate layer 10, increases the number of manufacturing steps of the shell 100, and thus increases the manufacturing cost of the shell 100; if the thickness of the first substrate layer 10 is too thick, it is not conducive to the design of the various film layer structures of the shell 100 and the size design of the shell 100.

[0067] In some embodiments, the thermal conductivity λ2 of the heat insulation sheet 20 is in the range of: λ2≤0.2W / (m·K).

[0068] Specifically, the thermal conductivity λ2 of the heat insulation sheet 20 can be, but is not limited to, less than or equal to 0.2 W / (m·K), less than or equal to 0.18 W / (m·K), less than or equal to 0.16 W / (m·K), less than or equal to 0.14 W / (m·K), less than or equal to 0.12 W / (m·K), less than or equal to 0.10 W / (m·K), less than or equal to 0.08 W / (m·K), less than or equal to 0.06 W / (m·K), less than or equal to 0.04 W / (m·K), less than or equal to 0.02 W / (m·K), less than or equal to 0.01 W / (m·K), etc.

[0069] In this embodiment, the smaller the thermal conductivity λ2 of the heat insulation sheet 20, the better. However, if the thermal conductivity λ2 of the heat insulation sheet 20 is too small, it will increase the manufacturing cost of the heat insulation sheet 20, or even make the material impossible to achieve. If the thermal conductivity λ2 of the heat insulation sheet 20 is too large, the heat insulation effect of the heat insulation sheet 20 will be poor. When the housing 100 is applied to an electronic device and the heat insulation sheet 20 is set to correspond to the heat source of the electronic device, the surface of the housing 100 is still prone to local overheating, which reduces the user experience.

[0070] Furthermore, the thermal conductivity λ2 of the heat insulation sheet 20 is in the range of λ2≤0.1W / (m·K). This can better reduce the cost of the heat insulation sheet 20, while also enabling the heat insulation sheet 20 to have a better heat insulation effect. When the housing 100 is applied to electronic devices, it can better prevent the local temperature of the electronic device from becoming too high, thereby improving the user experience of the electronic device.

[0071] In some embodiments, the heat insulation sheet 20 includes resin and heat insulation filler, wherein the volume ratio of the heat insulation filler to the resin ranges from 0.1 to 1.

[0072] In the embodiments of this application, when the numerical range a to b is involved, unless otherwise specified, the numerical value can be any value between a and b, including the endpoint value a and the endpoint value b.

[0073] Understandably, the insulating filler is dispersed in the resin.

[0074] Specifically, the volume ratio of the heat-insulating filler to the resin can be, but is not limited to, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, etc.

[0075] In this embodiment, if the volume ratio of the heat insulation filler to the resin is too small, the heat insulation effect of the heat insulation sheet 20 is reduced. When the housing 100 is applied to an electronic device, the heat of the electronic device is easily transferred to the surface of the housing 100, causing the local temperature of the surface of the housing 100 to be too high, which reduces the user's feeling and experience. If the volume ratio of the heat insulation filler to the resin is too large, the resin content is too small, and the resin cannot completely coat the surface of the heat insulation filler, which reduces the bonding performance between the heat insulation fillers and the adhesion performance between the heat insulation sheet 20 and the first substrate layer 10, thus reducing the mechanical properties of the housing 100.

[0076] Furthermore, the volume ratio of the heat-insulating filler to the resin ranges from 0.3 to 0.8. This allows the heat insulation sheet 20 to have better heat insulation performance, as well as better bonding performance between the heat-insulating fillers and between the heat insulation sheet 20 and the first substrate layer 10.

[0077] Optionally, the resin may be, but is not limited to, at least one of epoxy resin, phenolic resin, bismaleimide resin, benzoxazine resin, etc.

[0078] In some embodiments, the heat-insulating filler may be hollow microspheres. Optionally, the hollow microspheres may be, but are not limited to, at least one of hollow glass spheres and hollow resin spheres. In this embodiment, by using hollow microspheres, because the center of the hollow microspheres is air, which has a lower thermal conductivity, the thermal conductivity of the heat insulation sheet 20 can be reduced more effectively, thereby improving the heat insulation effect of the heat insulation sheet 20.

[0079] Optionally, the hollow resin ball can be, but is not limited to, at least one of phenolic resin balls, epoxy resin balls, polymethyl methacrylate balls, etc.

[0080] Optionally, the glass transition temperature of the hollow resin spheres is greater than or equal to 120°C. Specifically, the glass transition temperature of the hollow resin spheres can be, but is not limited to, 120°C, 140°C, 160°C, 180°C, 200°C, 210°C, 220°C, 240°C, 260°C, 280°C, 300°C, etc. If the glass transition temperature of the hollow resin spheres is too low, the hollow resin spheres may soften or melt during the preparation of the heat insulation layer 21 and the heat insulation sheet 20, resulting in deformation and causing the air inside the hollow resin spheres to escape, thus reducing the heat insulation effect of the heat insulation layer 21 and the heat insulation sheet 20.

[0081] Optionally, the average particle size D of the hollow microspheres is in the range of 1 μm ≤ D ≤ 30 μm. Specifically, the average particle size D of the hollow microspheres can be, but is not limited to, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 12 μm, 14 μm, 16 μm, 18 μm, 20 μm, 22 μm, 24 μm, 26 μm, 28 μm, 30 μm, etc. If the average particle size D of the hollow microspheres is too small, it reduces the difficulty of preparing the hollow microspheres. In addition, if the pores of the hollow microspheres are too small, it reduces the heat insulation effect of the hollow microspheres. If the average particle size D of the hollow microspheres is too large, it makes the hollow microspheres easy to break under stress, reducing the service life of the shell 100 and reducing the heat insulation effect of the heat insulation sheet 20.

[0082] Furthermore, the average particle size D of the hollow microspheres is in the range of 3μm≤D≤28μm. This makes the hollow microspheres easier to prepare, and they have lower thermal conductivity, better heat insulation effect, are less prone to breakage under stress, and have higher mechanical strength.

[0083] Furthermore, the average particle size D of the hollow microspheres is in the range of 4μm≤D≤20μm. This makes the hollow microspheres easier to prepare, and they have lower thermal conductivity, better heat insulation effect, are less prone to breakage under stress, and have higher mechanical strength.

[0084] In some other embodiments, the heat insulation sheet 20 includes fiber cloth, resin and heat insulation filler, wherein the volume ratio of the heat insulation filler to the resin in the heat insulation sheet 20 ranges from 0.1 to 1.

[0085] Alternatively, the fiber cloth can be formed by weaving or spinning.

[0086] Optionally, the fiber cloth may be, but is not limited to, at least one of glass fiber, aramid fiber, liquid crystal polymer (LCP fiber), ceramic fiber, basalt fiber, etc.

[0087] Specifically, the volume ratio of the heat-insulating filler to the resin can be, but is not limited to, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 1, etc.

[0088] For a detailed description of other aspects of the thermal insulation filler and resin, please refer to the description in the corresponding section of the above embodiments, which will not be repeated here.

[0089] In this embodiment, if the volume ratio of the heat-insulating filler to the resin is too small, the heat insulation effect of the heat insulation sheet 20 is reduced. When the housing 100 is applied to an electronic device, the heat of the electronic device is easily transferred to the surface of the housing 100, causing the local temperature of the housing 100 to be too high, which reduces the user's comfort and experience. If the volume ratio of the heat-insulating filler to the resin is too large, the resin content is too small, and the resin cannot completely coat the surface of the heat-insulating filler and the fiber cloth, which reduces the bonding performance between the heat-insulating fillers and the adhesion performance between the heat insulation sheet 20 and the first substrate layer 10, thus reducing the mechanical properties of the housing 100. In addition, in this embodiment, the heat insulation sheet 20 also includes fiber cloth, which can give the heat insulation sheet 20 better mechanical strength. Therefore, when applied to the housing 100, it can prevent the mechanical strength of the corresponding part of the housing 100 to be too low, so that the housing 100 as a whole can have high mechanical strength and other mechanical properties.

[0090] Furthermore, the volume ratio of the heat-insulating filler to the resin ranges from 0.3 to 0.8. This allows the heat insulation sheet 20 to have better heat insulation performance, as well as better bonding performance between the heat-insulating fillers and between the heat insulation sheet 20 and the first substrate layer 10.

[0091] In other embodiments, the heat insulation sheet 20 is an aerogel heat insulation film. Optionally, the aerogel heat insulation film can be, but is not limited to, at least one of silica heat insulation film, alumina heat insulation film, titanium dioxide heat insulation film, etc. These aerogel heat insulation films can effectively reduce the thermal conductivity of the heat insulation sheet 20, thereby giving the heat insulation sheet 20 a better heat insulation effect.

[0092] In one specific example, the thermal conductivity of the aerogel insulation film is 0.025 W / (m·K).

[0093] In some embodiments, the thickness h of the heat insulation sheet 20 along the thickness direction of the housing 100 ranges from 0.04 mm ≤ h ≤ 0.3 mm.

[0094] Understandably, along the thickness direction of the first substrate layer 10, the thickness h of the heat insulation sheet 20 ranges from 0.04 mm ≤ h ≤ 0.3 mm.

[0095] Specifically, along the thickness direction of the housing 100, the thickness h of the heat insulation sheet 20 can be, but is not limited to, 0.04mm, 0.06mm, 0.08mm, 0.10mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.20mm, 0.22mm, 0.24mm, 0.26mm, 0.28mm, 0.3mm, etc.

[0096] In this embodiment, if the thickness h of the heat insulation sheet 20 along the thickness direction of the housing 100 is too thin, the heat insulation effect of the heat insulation sheet 20 will be reduced; if the thickness h of the heat insulation sheet 20 along the thickness direction of the housing 100 is too thick, the mechanical strength of the housing 100 will be reduced due to the relatively low strength of the heat insulation sheet 20, or the thickness of the housing 100 will be increased, which is not conducive to the thinning and lightening of electronic devices.

[0097] Optionally, the area covered by the heat insulation sheet 20 on the first substrate layer 10 is greater than or equal to 1 mm. 2 Specifically, the area covered by the heat insulation sheet 20 on the first substrate layer 10 can be, but is not limited to, 1 mm. 2 2mm 2 2.5mm 2 3mm 2 3.5mm 2 4mm 2 5mm 2 6mm 2 10mm 2 20mm 2 30mm 2 50mm 2 80mm 2 100mm 2 150mm 2 200mm 2 300mm 2 400mm 2 500mm 2 600mm 2 700mm 2 800mm 2 1000mm 2 1200mm 2 1500mm 2 The area covered by the heat insulation sheet 20 on the first substrate layer 10 is too small. When the housing 100 is applied to electronic devices, this reduces the heat insulation effect of the heat insulation sheet 20 on the heat source of the electronic device, thus reducing the heat insulation effect of the heat insulation sheet 20 and making it difficult to effectively reduce the surface temperature of the housing 100. In addition, the small area covered by the heat insulation sheet 20 on the first substrate layer 10 also increases the difficulty of manufacturing the heat insulation sheet 20.

[0098] Furthermore, the heat insulation sheet 20 covers an area of ​​100 mm² on the first substrate layer 10. 2 Up to 1500mm 2 .

[0099] Figure 6The housing 100 of the fifth embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0100] Please see Figure 6 Optionally, the heat insulation sheet 20 may include one heat insulation layer 21 or multiple heat insulation layers 21. When the heat insulation layer 21 is multiple, the multiple heat insulation layers 21 are stacked sequentially.

[0101] Optionally, the heat insulation layer 21 has a sheet-like structure, and multiple layers of heat insulation layer 21 are stacked sequentially along its thickness direction. That is, they are stacked sequentially along the thickness direction of the shell 100.

[0102] Optionally, the shape of the heat insulation sheet 20 can be, but is not limited to, at least one of regular or irregular shapes such as square, rectangle, circle, and ellipse, and this application does not make specific limitations.

[0103] In some embodiments, the insulation layer 21 comprises resin and insulation filler. In other embodiments, the insulation layer 21 comprises fiber cloth, resin, and insulation filler. In still other embodiments, the insulation layer 21 is an aerogel insulation film. For detailed descriptions of other aspects of the resin, insulation filler, fiber cloth, and aerogel insulation film, please refer to the descriptions in the corresponding sections of the above embodiments, which will not be repeated here.

[0104] Optionally, the thickness of the single-layer heat insulation layer 21 ranges from 0.04 mm to 0.2 mm. Specifically, the thickness of the single-layer heat insulation layer 21 can be, but is not limited to, 0.04 mm, 0.06 mm, 0.08 mm, 0.10 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, 0.20 mm, etc. In this embodiment, if the thickness of the heat insulation layer 21 is too thin, the heat insulation effect of the heat insulation layer 21 will be reduced; if the thickness of the heat insulation layer 21 is too thick, the mechanical strength of the housing 100 will be reduced due to the relatively low strength of the heat insulation layer 21, or the thickness of the housing 100 will be increased, which is not conducive to the thinning and lightening of electronic devices.

[0105] Optionally, the thermal conductivity of the insulating filler can be less than or equal to 0.1 W / (m·K). Specifically, the thermal conductivity of the insulating filler can be, but is not limited to, 0.1 W / (m·K), 0.09 W / (m·K), 0.08 W / (m·K), 0.07 W / (m·K), 0.06 W / (m·K), 0.05 W / (m·K), 0.04 W / (m·K), 0.03 W / (m·K), 0.02 W / (m·K), 0.01 W / (m·K), etc. If the thermal conductivity of the insulating filler is too low, it will be difficult to achieve in terms of materials or will increase the cost of materials; if the thermal conductivity of the insulating filler is too high, it will reduce the heat insulation effect of the heat insulation sheet 20, and when the housing 100 is used in electronic devices, it will be detrimental to reducing the surface temperature of the housing 100.

[0106] Figure 7 The housing 100 of the sixth embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction. Figure 8 The housing 100 of the seventh embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction. Figure 9 The housing 100 of the eighth embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction. Figure 10 The housing 100 of the ninth embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0107] Please see Figures 7 to 10 In some embodiments, the housing 100 further includes a second substrate layer 30, which is disposed on the same side of the first substrate layer 10 and the heat insulation sheet 20, and the thermal conductivity λ3 of the second substrate layer 30 is greater than the thermal conductivity λ1 of the first substrate layer 10.

[0108] It should be noted that when the housing 100 is applied, the heat insulation sheet 20 is closer to the outer surface of the housing 100 than the second substrate layer 30, and the second substrate layer 30 is closer to the inner surface of the housing 100 than the heat insulation sheet 20. It can also be understood that when the housing 100 is applied to an electronic device, the heat insulation sheet 20 is closer to the outer surface of the electronic device than the second substrate layer 30, and the second substrate layer 30 is closer to the interior of the electronic device than the heat insulation sheet 20.

[0109] Optionally, when the housing 100 includes a second substrate layer 30, the heat insulation sheet 20 can completely penetrate the two opposing surfaces of the first substrate layer 10 along the thickness direction of the housing 100, such as... Figure 10 As shown. The heat insulation sheet 20 may also be at least partially embedded in the first substrate layer 10.

[0110] Understandably, the thermal conductivity of the second substrate layer 30 is greater than that of the first substrate layer 10, and the thermal conductivity of the first substrate layer 10 is greater than that of the thermal insulation sheet 20.

[0111] Understandably, the first substrate layer 10 and the second substrate layer 30 are stacked together, and the stacking direction of the first substrate layer 10 and the second substrate layer 30 is the thickness direction of the shell 100. It is also understood that the heat insulation sheet 20 and the second substrate layer 30 are stacked together, and the stacking direction of the heat insulation sheet 20 and the second substrate layer 30 is the thickness direction of the shell 100.

[0112] Optionally, the second substrate layer 30 has a sheet-like structure. The first substrate layer 10 and the second substrate layer 30 are stacked along their thickness direction.

[0113] In this embodiment, by providing a second substrate layer 30 with higher thermal conductivity, when the housing 100 is applied to an electronic device, the second substrate layer 30 can better disperse the heat generated by the heat source of the electronic device quickly and evenly to the entire housing 100 (i.e., disperse the heat to the entire housing 100 first). With the superimposed effect of the heat insulation sheet 20, it can better prevent heat from accumulating in local areas of the housing 100 and further reduce the surface temperature of the housing 100.

[0114] In some embodiments, the ratio of the thermal conductivity λ3 of the second substrate layer 30 to the thermal conductivity λ1 of the first substrate layer 10 is in the range of λ3 / λ1≥2.

[0115] Specifically, the ratio λ3 / λ1 of the thermal conductivity λ3 of the second substrate layer 30 to the thermal conductivity λ1 of the first substrate layer 10 can be, but is not limited to, 2, 5, 8, 10, 15, 20, 25, 30, 35, 40, 45, 50, 65, 60, 70, 80, 90, 100, 120, 140, 160, 180, 200, 220, 240, 250, etc. If the ratio λ3 / λ1 of the thermal conductivity λ3 of the second substrate layer 30 to the thermal conductivity λ1 of the first substrate layer 10 is too low, the thermal conductivity λ3 of the second substrate layer 30 may be too low. When the thermal conductivity λ3 of the second substrate layer 30 is too low, the heat dissipation effect of the housing 100 is reduced. When the housing 100 is used in electronic devices, heat accumulates inside the electronic devices and is difficult to dissipate, causing the internal or local temperature of the electronic devices to be too high. This can easily lead to malfunctions, lag, etc., which reduce the user experience. The higher the ratio λ3 / λ1 of the thermal conductivity λ3 of the second substrate layer 30 to the thermal conductivity λ1 of the first substrate layer 10, the better. However, if the thermal conductivity λ1 of the first substrate layer 10 is too high, the thermal conductivity λ3 of the second substrate layer 30 will also be high, increasing the material cost of the second substrate layer 30. Alternatively, it may require the use of conductive materials to achieve the second substrate layer 30, which could cause the housing 100 to suppress electromagnetic wave radiation and affect the normal operation of electronic devices using the housing 100.

[0116] Furthermore, the ratio of the thermal conductivity λ3 of the second substrate layer 30 to the thermal conductivity λ1 of the first substrate layer 10, λ3 / λ1, is in the range of 2 ≤ λ3 / λ1 ≤ 250. This ensures that when the housing 100 is applied to an electronic device, the surface of the electronic device is less prone to localized heat generation, resulting in a lower maximum temperature and improved user experience; it also allows the housing 100 to have a lower cost.

[0117] In some embodiments, the thermal conductivity λ3 of the second substrate layer 30 is in the range of 10 W / (m·K) ≤ λ3 ≤ 50 W / (m·K).

[0118] Specifically, the thermal conductivity λ3 of the second substrate layer 30 can be, but is not limited to, 10 W / (m·K), 13 W / (m·K), 15 W / (m·K), 18 W / (m·K), 20 W / (m·K), 23 W / (m·K), 25 W / (m·K), 28 W / (m·K), 30 W / (m·K), 33 W / (m·K), 35 W / (m·K), 38 W / (m·K), 40 W / (m·K), 43 W / (m·K), 45 W / (m·K), 48 W / (m·K), 50 W / (m·K), etc.

[0119] In this embodiment, the thermal conductivity λ3 of the second substrate layer 30 is too low, which reduces the heat dissipation effect of the housing 100. When the housing 100 is applied to an electronic device, heat accumulates inside the electronic device and is difficult to dissipate, causing the internal or local temperature of the electronic device to be too high. This can easily lead to malfunctions or lag in the electronic device, reducing the user experience. On the other hand, if the thermal conductivity λ3 of the second substrate layer 30 is too high, it will increase the cost of the second substrate layer 30, thereby increasing the manufacturing cost of the housing 100. In addition, the second substrate layer 30 may require the use of conductive materials, which may cause the housing 100 to suppress electromagnetic wave radiation, affecting the normal operation of the electronic device using the housing 100.

[0120] Furthermore, the thermal conductivity λ3 of the second substrate layer 30 is in the range of 15 W / (m·K) ≤ λ3 ≤ 40 W / (m·K). This allows the housing 100 to have a lower manufacturing cost and better heat dissipation effect, which can better prevent excessive local temperature on the surface of electronic devices when applied to them.

[0121] Optionally, the second substrate layer 30 is insulating.

[0122] Figure 11 The housing 100 of the tenth embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0123] Please see Figure 11 Optionally, the second substrate layer 30 may include, but is not limited to, at least one second fiber resin layer 31. For example, the second substrate layer 30 may include, but is not limited to, one, two, three, four, five, or six second fiber resin layers 31. When the second substrate layer 30 includes at least two second fiber resin layers 31, the at least two second fiber resin layers 31 are stacked sequentially.

[0124] Optionally, the second fiber resin layer 31 has a sheet-like structure. When there are at least two layers of the second fiber resin layer 31, the at least two layers of the second fiber resin layer 31 are stacked sequentially along their thickness direction.

[0125] Optionally, the second fiber resin layer 31 includes a second fiber cloth and a second resin, with the second resin wrapping around the outer periphery of the second fiber cloth.

[0126] Alternatively, the second fiber cloth can be formed by weaving or spinning.

[0127] Optionally, the second fiber cloth may be, but is not limited to, at least one of the following fiber cloths with high thermal conductivity: ultra-high molecular weight polyethylene fiber cloth (UPE fiber), carbon fiber cloth, poly(p-phenylene benzodioxazole) fiber cloth (PBO fiber).

[0128] When the second substrate layer 30 includes multiple layers of second fiber resin layers 31, the second fiber fabrics in the multiple layers of second fiber resin layers 31 may be the same or different. For example, all multiple layers of second fiber resin layers 31 may be UPE fiber resin layers (i.e., the second fiber fabrics may all be ultra-high molecular weight polyethylene fiber fabrics); or part of the multiple layers of second fiber resin layers 31 may be UPE fiber resin layers (i.e., part of the second fiber fabrics may be ultra-high molecular weight polyethylene fiber fabrics) and part may be poly(p-phenylene benzodioxazole) fiber resin layers (i.e., part of the second fiber fabrics may be poly(p-phenylene benzodioxazole) fiber fabrics).

[0129] Optionally, the second resin may be, but is not limited to, at least one of epoxy resin, phenolic resin, bismaleimide resin, benzoxazine resin, etc.

[0130] Optionally, the thickness of the second substrate layer 30 ranges from 0.04 mm to 0.2 mm. Specifically, the thickness of the second substrate layer 30 can be, but is not limited to, 0.04 mm, 0.06 mm, 0.08 mm, 0.10 mm, 0.12 mm, 0.14 mm, 0.16 mm, 0.18 mm, 0.20 mm, etc. In this embodiment, if the thickness of the second substrate layer 30 is too thin, it increases the difficulty of manufacturing the second substrate layer 30, increases the number of manufacturing steps of the shell 100, and thus increases the manufacturing cost of the shell 100; if the thickness of the second substrate layer 30 is too thick, it is not conducive to the design of the various film layer structures of the shell 100 and the size design of the shell 100.

[0131] Optionally, the total number of layers of the first fiber resin layer 11 and the second fiber resin layer 31 ranges from 2 to 10 layers. Specifically, the total number of layers of the first fiber resin layer 11 and the second fiber resin layer 31 can be, but is not limited to, 2, 3, 4, 5, 6, 7, 8, 9, 10 layers, etc.

[0132] Figure 12 The housing 100 of the eleventh embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0133] like Figure 12As shown, in one specific embodiment, the housing 100 includes three layers of glass fiber resin (i.e., the first fiber resin layer 11, wherein the glass fiber is of type E2116) and a UPE fiber resin layer (i.e., the second fiber resin layer 31, wherein the UPE fiber is of type 2116) stacked sequentially. The housing 100 also includes three heat insulation layers 21 (i.e., the heat insulation sheet 20 includes three heat insulation layers 21), the three heat insulation layers 21 being embedded in the three layers of glass fiber resin, and each heat insulation layer 21 corresponding to a glass fiber resin layer. The heat insulation layer 21 includes E2116 glass fiber cloth, hollow glass microspheres, and resin. The volume ratio of hollow glass microspheres to resin in the heat insulation layer 21 is 0.3, the average particle size of the hollow glass microspheres is 10μm, and the size of the heat insulation layer 21 is 20mm×20mm.

[0134] Figure 13 The housing 100 of the twelfth embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0135] Please see Figure 13 In some embodiments, the housing 100 further includes a cover layer 40, which is disposed on the side of the second substrate layer 30 opposite to the first substrate layer 10. This cover layer 40 is used to shield the internal components of the electronic device when the housing 100 is applied to the electronic device, thereby improving the device's appearance. Optionally, the cover layer 40 can be, but is not limited to, a light-shielding ink that absorbs or reflects light. Optionally, the cover layer 40 can be black, white, or gray. Optionally, the cover layer 40 can be a single layer or multiple layers, such as two, three, four, or five layers stacked together. Multiple layers of the cover layer 40 provide better shielding compared to a single layer. Optionally, the thickness of each cover layer 40 is 5 μm to 12 μm, specifically, it can be, but is not limited to, 5 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, etc. Optionally, the total thickness of the multilayer cover bottom layer 40 is 5μm to 50μm. Specifically, the thickness of the cover bottom layer 40 can be, but is not limited to, 5μm, 8μm, 10μm, 12μm, 15μm, 18μm, 20μm, 22μm, 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, etc.

[0136] In other embodiments, when the housing 100 includes only the first substrate layer 10 and does not include the second substrate layer 30, the cover layer 40 is disposed on the surface of the first substrate layer 10.

[0137] Figure 14 The housing 100 of the thirteenth embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0138] Please see Figure 14In some embodiments, the housing 100 further includes an anti-fingerprint layer 50, which is disposed on the side of the first substrate layer 10 and the heat insulation sheet 20 opposite to the second substrate layer 30, and is used to prevent fingerprints and dirt. Optionally, the anti-fingerprint layer 50 may include, but is not limited to, one or more of perfluoropolyether, perfluoropolyether derivatives, etc.

[0139] In other embodiments, when the housing 100 includes only the first substrate layer 10 and does not include the second substrate layer 30, the anti-fingerprint layer 50 is disposed on the surface of the first substrate layer 10. However, it should also be noted that the anti-fingerprint layer 50 is the outermost layer of the housing 100, that is, the surface of the anti-fingerprint layer 50 facing away from the first substrate layer 10 is the outer surface of the housing 100.

[0140] It should be noted that in some embodiments, the housing 100 may also include a bottom cover 40 and an anti-fingerprint layer 50.

[0141] The housing 100 of this application embodiment can be prepared by the methods described in the following embodiments of this application. In addition, it can also be prepared by other methods. The preparation methods of this application embodiment are merely one or more preparation methods of the housing 100 of this application and should not be construed as limiting the housing 100 provided in the embodiments of this application.

[0142] Figure 15 This is a schematic flowchart of a method for preparing a shell 100 according to an embodiment of this application.

[0143] Please see Figure 15 This application also provides a method for preparing a shell 100, the method comprising:

[0144] S201, providing insulation layer 21;

[0145] In some embodiments, providing the heat insulation layer 21 includes: mixing heat insulation filler (such as hollow glass spheres or hollow resin spheres) with resin in a predetermined volume ratio until uniform, and then pre-curing or semi-curing the resin to obtain the heat insulation layer 21.

[0146] In other embodiments, providing the heat insulation layer 21 includes: (1) mixing heat insulation filler (such as hollow glass spheres or hollow resin spheres) with resin in a predetermined volume ratio to obtain a heat insulation resin liquid; (2) immersing a fiber cloth in the heat insulation resin liquid; and (3) removing the fiber cloth and pre-curing or semi-curing the fiber cloth immersed in the heat insulation resin liquid to obtain the heat insulation layer 21.

[0147] In some other embodiments, providing the insulation layer 21 includes providing an aerogel insulation film.

[0148] For a detailed description of the other parts of the insulation layer 21, please refer to the description of the corresponding parts in the above embodiments, which will not be repeated here.

[0149] S202, providing a first fiber resin layer 11;

[0150] Optionally, providing the first fiber resin layer 11 includes: (1) providing a first fiber cloth and a first resin liquid; (2) immersing the first fiber cloth in the first resin liquid; and (3) removing the first fiber cloth and pre-curing or semi-curing the first fiber cloth immersed in the first resin liquid to obtain the first fiber resin layer 11.

[0151] For a detailed description of the other parts of the first fiber resin layer 11, the first fiber cloth, the first resin, etc., please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0152] It should be noted that there is no specific order between S201 and S202. S201 can come first, S202 can come first, or S201 and S202 can be performed simultaneously.

[0153] S203, the first fiber resin layer 11 and the heat insulation layer 21 are arranged according to a pre-designed structure and hot-pressed to obtain the shell 100.

[0154] Optionally, the first fiber resin layer 11 and the heat insulation layer 21 are arranged according to a pre-designed structure and hot-pressed in a hot press mold to allow the resin and the first resin to cure after curing. The first fiber resin layer 11 forms the first substrate layer 10, and the heat insulation layer 21 forms the heat insulation sheet 20. Then, the outer shape is machined using a CNC machine tool to obtain the shell 100.

[0155] In some embodiments, the first fiber resin layer 11 and the heat insulation layer 21 are arranged in a pre-designed structure and hot-pressed, including: (1) providing multiple layers of first fiber resin layer 11 and at least one heat insulation layer 21, wherein a portion of the first fiber resin layer 11 has openings (optionally, the openings can be achieved by punching); (2) stacking multiple layers of first fiber resin layer 11 in a preset order and providing the heat insulation layer 21 in the openings to obtain a stacked body; and (3) placing the stacked body in a hot-pressing mold and hot-pressing to obtain the shell 100.

[0156] It should be noted that in this embodiment, the first fiber resin layer 11 with openings can be one or more layers, and at least one first fiber resin layer 11 is left without openings. Compared with the scheme where all the first fiber resin layers 11 are open, leaving at least one first fiber resin layer 11 without openings can make the shell 100 with higher structural strength at the opening positions.

[0157] It should be noted that after the heat insulation layer 21 fills the openings, the thickness of the stack body corresponding to the position of the heat insulation layer 21 is the same as that of the position outside the heat insulation layer 21. Optionally, the first fiber resin layer 11 with the openings can be located near the outer layer of the stack body (i.e., the heat insulation layer 21 in the manufactured shell 100 is near the outer or inner surface of the shell 100), or it can be located near the middle of the stack body (i.e., the heat insulation layer 21 in the manufactured shell 100 is near the middle of the shell 100, i.e., the heat insulation layer 21 is located in the middle layer).

[0158] In other embodiments, the first fiber resin layer 11 and the heat insulation layer 21 are arranged according to a pre-designed structure and then hot-pressed, including: (1) providing multiple layers of the first fiber resin layer 11; (2) stacking the multiple layers of the first fiber resin layer 11 and at least one heat insulation layer 21 according to a preset pattern to obtain a stack; wherein, when the heat insulation layer 21 is multi-layered, the multiple heat insulation layers 21 are sequentially bonded together; and (3) placing the stack in a hot-pressing mold and hot-pressing to obtain the shell 100. It should be noted that, optionally, the heat insulation sheet 20 can be located near the outer layer of the stack (i.e., the heat insulation sheet 20 in the obtained shell 100 is near the outer or inner surface of the shell 100), and the heat insulation sheet 20 can also be located near the middle of the stack (i.e., the heat insulation sheet 20 in the obtained shell 100 is near the middle of the shell 100, i.e., the heat insulation sheet 20 is located in the middle layer). In other embodiments, a portion of the first fiber resin layer 11 may be pre-cured and laminated to form a sink, at least one heat insulation layer 21 may be placed in the sink, and then the two layers may be molded together to obtain the shell 100.

[0159] Optionally, the materials of the multiple first fiber cloths in the multiple first fiber resin layer 11 can be the same; or different; or partially the same and partially different. This application does not make specific limitations.

[0160] For detailed descriptions of the housing 100, the first substrate layer 10, the first fiber resin layer 11, the heat insulation sheet 20, the heat insulation layer 21, the second substrate layer 30, the second fiber resin layer 31, and other aspects, please refer to the descriptions of the corresponding parts of the above embodiments, which will not be repeated here.

[0161] Figure 16 This is a schematic flowchart of a method for preparing the shell 100 according to another embodiment of this application.

[0162] Please see Figure 16 This application also provides a method for preparing a shell 100, the method comprising:

[0163] S301, providing at least one insulation layer 21;

[0164] For a detailed description of the other parts of the insulation layer 21, please refer to the description of the corresponding parts in the above embodiments, which will not be repeated here.

[0165] S302, a first fiber resin layer 11 and a second fiber resin layer 31 are provided;

[0166] For a detailed description of the other parts of the first fiber resin layer 11, the first fiber cloth, the first resin, etc., please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0167] Optionally, providing the second fiber resin layer 31 includes: (1) providing a second fiber cloth and a second resin liquid; (2) immersing the second fiber cloth in the second resin liquid; and (3) removing the second fiber cloth and pre-curing or semi-curing the second fiber cloth immersed in the second resin liquid to obtain the second fiber resin layer 31.

[0168] For a detailed description of the other parts of the second fiber resin layer 31, the second fiber cloth, the second resin, etc., please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0169] It should be noted that there is no specific order between S301 and S302. S301 can come first, S302 can come first, or S301 and S302 can be performed simultaneously.

[0170] S303, the first fiber resin layer 11, the second fiber resin layer 31 and the heat insulation layer 21 are arranged according to a pre-designed structure and hot-pressed to obtain the shell 100.

[0171] Optionally, the first fiber resin layer 11, the second fiber resin layer 31 and the heat insulation layer 21 are arranged according to a pre-designed structure and hot-pressed in a hot press mold to allow the resin and the first resin to cure after curing. The outer shape is then processed by a CNC machine tool to obtain the shell 100.

[0172] In some embodiments, the first fiber resin layer 11 and the heat insulation layer 21 are arranged in a pre-designed structure and hot-pressed, including: (1) providing at least one first fiber resin layer 11, at least one second fiber resin layer 31 and at least one heat insulation layer 21, wherein a portion of the first fiber resin layer 11 has openings (optionally, the openings can be achieved by punching); (2) stacking at least one first fiber resin layer 11 in a preset order, and providing the heat insulation layer 21 in the openings, and placing the at least one second fiber resin layer 31 on the same side of the at least one first fiber resin layer 11 and the heat insulation layer 21 to obtain a stack; and (3) placing the stack in a hot-pressing mold and hot-pressing to obtain the shell 100.

[0173] In other embodiments, the first fiber resin layer 11 and the heat insulation layer 21 are arranged according to a pre-designed structure and hot-pressed, including: (1) providing at least one first fiber resin layer 11, at least one second fiber resin layer 31 and at least one heat insulation layer 21; (2) stacking at least one first fiber resin layer 11, at least one second fiber resin layer 31 and at least one heat insulation layer 21 according to a preset rule to obtain a stacked body; wherein, when there are multiple layers of heat insulation layer 21, the multiple layers of heat insulation layer 21 are sequentially bonded together; and (3) placing the stacked body in a hot-pressing mold and hot-pressing to obtain the shell 100.

[0174] For detailed descriptions of the housing 100, the first substrate layer 10, the first fiber resin layer 11, the heat insulation sheet 20, the heat insulation layer 21, the second substrate layer 30, the second fiber resin layer 31, and other aspects, please refer to the descriptions of the corresponding parts of the above embodiments, which will not be repeated here.

[0175] The housing 100 of this application embodiment will be further described below through specific embodiments.

[0176] Example 1

[0177] The housing 100 of this embodiment includes four layers of glass fiber epoxy resin (i.e., four layers of first fiber resin 11 and first substrate 10) stacked sequentially. The thickness of each glass fiber epoxy resin layer is 0.1 mm, and the mass fraction of epoxy resin in the glass fiber epoxy resin layer is 25%. The housing 100 also includes three layers of heat insulation layer 21 (heat insulation sheet 20) stacked sequentially. The three heat insulation layers 21 are sequentially embedded in the three layers of glass fiber epoxy resin stacked sequentially. The heat insulation layers 21 and the glass fiber epoxy resin Each layer corresponds to another layer, with each heat insulation layer 21 embedded in a glass fiber epoxy resin layer (i.e., the glass fiber epoxy resin layer surrounds the outer periphery of the heat insulation layer 21, and the heat insulation layer 21 is connected to the glass fiber epoxy resin layer). The dimensions of each heat insulation layer 21 are 20mm × 20mm × 0.1mm. The heat insulation layer 21 includes epoxy resin, hollow glass microspheres with an average particle size of 10μm, and glass fiber cloth. The mass fraction of the glass fiber cloth in the heat insulation layer 21 is 60%, and the volume ratio of hollow glass microspheres to epoxy resin in the heat insulation layer 21 is 0.3.

[0178] The structure of the housing 100 in this embodiment is as follows: Figure 6 As shown.

[0179] Example 2

[0180] The difference between this embodiment and embodiment 1 is that the glass fiber epoxy resin layer without the heat insulation layer 21 in embodiment 1 is replaced with a UPE fiber epoxy resin layer (i.e., the second fiber resin layer 31, the second substrate layer 30).

[0181] The structure of the housing 100 in this embodiment is as follows: Figure 12 As shown.

[0182] Comparative Example 1

[0183] The shell 100 of this comparative example includes four layers of glass fiber epoxy resin (i.e., four layers of first fiber resin 11) stacked sequentially. The thickness of each glass fiber epoxy resin layer is 0.1 mm, and the mass fraction of epoxy resin in the glass fiber epoxy resin layer is 25%. That is, the shell 100 of this comparative example does not include the heat insulation layer 21 and the second fiber resin layer 31.

[0184] The structure of the shell 100 in this comparative example is as follows: Figure 17 As shown.

[0185] Comparative Example 2

[0186] The shell 100 of this comparative example includes three layers of glass fiber epoxy resin (i.e., three first fiber resin layers 11) and one layer of UPE fiber epoxy resin (i.e., one second fiber resin layer 31) stacked sequentially. The thickness of each glass fiber epoxy resin layer is 0.1 mm, and the mass fraction of epoxy resin in the glass fiber epoxy resin layer is 25%. The thickness of the UPE fiber epoxy resin layer is 0.1 mm, and the mass fraction of epoxy resin in the UPE fiber epoxy resin layer is 25%.

[0187] The structure of the shell 100 in this comparative example is as follows: Figure 18 As shown.

[0188] The housings 100 of Examples 1, 2, Comparative Examples 1 and 2 were used as the same mobile phone back cover, and the heat insulation layer 21 (i.e. heat insulation sheet 20) of Examples 1 and 2 were set to correspond to the SOC chip of the mobile phone. The mobile phones were run at a fixed power consumption of 4 watts (4W) for 2 hours, and the highest temperature on the surface of Examples 1, 2, Comparative Examples 1 and 2 was measured respectively.

[0189] The on-machine test results of the housing 100 of Examples 1, 2, Comparative Examples 1 and 2 are shown in Table 1 below.

[0190] Table 1. On-machine test data of housing 100 in Examples 1, 2, Comparative Examples 1 and 2.

[0191] Example Maximum surface temperature of the casing (°C) Example 1 38.8℃ Example 2 38.5℃ Comparative Example 1 39.7℃ Comparative Example 2 39.2℃

[0192] As shown in Table 1, the test results of Example 1, Comparative Example 1, Example 2, and Comparative Example 2 indicate that when the housing 100 is not equipped with the heat insulation sheet 20 (as in Comparative Example 1 and Comparative Example 2), the maximum surface temperature of the housing 100 is relatively high. When the heat insulation sheet 20 is provided on the housing 100 corresponding to the position of the mobile phone's SOC chip, the maximum surface temperature of the housing 100 can be significantly reduced. The test results of Example 1 and Example 2 indicate that when a second substrate layer 30 with higher thermal conductivity is provided on the side of the housing 100 closer to the mobile phone, the maximum surface temperature of the housing 100 can be further reduced, improving the user experience.

[0193] Please see Figures 19 to 21 This application embodiment also provides an electronic device 400, which includes: a display screen 410, a heat source 430, and a housing 100 as described in this application embodiment. The heat source 430 is located on one side of the display screen 410, and the housing 100 is located on the side of the heat source 430 away from the display screen 410. The heat insulation sheet 20 of the housing 100 is provided corresponding to the heat source 430.

[0194] Understandably, the housing 100 is disposed opposite to the display screen 410, and the heat source 430 is located between the display screen 410 and the housing 100.

[0195] The electronic device 400 in this application embodiment can be, but is not limited to, a mobile phone, tablet computer, laptop computer, desktop computer, smart bracelet, smartwatch, e-reader, game console, or other portable electronic device 400.

[0196] For a detailed description of the housing 100, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0197] Optionally, the display screen 410 may be, but is not limited to, one or more of the following: liquid crystal display screen, light-emitting diode display screen (LED display screen), micro light-emitting diode display screen (Micro LED display screen), mini LED display screen, organic light-emitting diode display screen (OLED display screen).

[0198] Optionally, the heat source 430 may be, but is not limited to, at least one of a system-on-a-chip (SOC), a central processing unit, a controller, a processor, a microprocessor, a battery, etc. In the following embodiments of this application, the heat source 430 is illustrated using a system-on-a-chip as an example, and should not be construed as a limitation on the housing 100 and the heat source 430 of the embodiments of this application.

[0199] Optionally, if the heat source 430 is a system-on-a-chip (SoC), then the SoC is electrically connected to the display screen 410 and is used to control the display screen 410 to display. The SoC is also used to control the display screen 410 to receive signals input by the user.

[0200] Optionally, the heat source 430 is a system-on-a-chip (SoC), and the electronic device 400 of this application further includes a memory 450. The memory 450 is electrically connected to the SoC and is used to store the program code required for the SoC to run, the program code required to control the display screen 410, the display content of the display screen 410, etc.

[0201] Optionally, memory 450 may include volatile memory, such as random access memory (RAM); memory 450 may also include non-volatile memory (NVM), such as read-only memory (ROM), flash memory (FM), hard disk drive (HDD), or solid-state drive (SSD). Memory 450 may also include combinations of the above types of memory.

[0202] In some embodiments, the electronic device 400 of this application further includes a mid-frame 420 and a camera module 470. The mid-frame 420 is disposed between the display screen 410 and the housing 100, and the side of the mid-frame 420 is exposed between the housing 100 and the display screen 410. The mid-frame 420 and the housing 100 enclose an accommodating space (not shown), which is used to accommodate a system-on-a-chip (SoC), a memory 450, and the camera module 470. The camera module 470 is electrically connected to the SoC and is used to take pictures under the control of the SoC.

[0203] Optionally, the housing 100 has a light-transmitting portion 101, through which the camera module 470 can capture images. That is, in this embodiment, the camera module 470 is a rear-facing camera module 470. It is understood that in other embodiments, the light-transmitting portion 101 can be disposed on the display screen 410, i.e., the camera module 470 is a front-facing camera module 470. In the schematic diagram of this embodiment, the light-transmitting portion 101 is shown as an opening. In other embodiments, the light-transmitting portion 101 may not be an opening, but rather a light-transmitting material, such as plastic or glass.

[0204] It is understood that the electronic device 400 described in this embodiment is merely one form of the electronic device 400 used in the housing 100, and should not be construed as a limitation on the electronic device 400 provided in this application, nor should it be construed as a limitation on the housing 100 provided in various embodiments of this application.

[0205] In this application, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of these phrases in various locations throughout the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this application can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this application can be arbitrarily combined to form yet another embodiment that does not depart from the spirit and scope of the technical solution of this application, provided there is no contradiction between them.

[0206] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A housing, characterized in that, The housing includes: First substrate layer; and A heat insulation sheet is supported on the first substrate layer, and the orthographic projection of the heat insulation sheet on the first substrate layer covers a portion of the first substrate layer, wherein the thermal conductivity of the first substrate layer is greater than that of the heat insulation sheet.

2. The housing according to claim 1, characterized in that, The ratio of the thermal conductivity λ1 of the first substrate layer to the thermal conductivity λ2 of the insulation sheet is in the range of: λ1 / λ2≥2.

3. The housing according to claim 1, characterized in that, The thermal conductivity λ1 of the first substrate layer is in the range of: 0.2W / (m·K)≤λ1≤5W / (m·K).

4. The housing according to claim 1, characterized in that, The thermal conductivity λ2 of the heat insulation sheet is in the range of: λ2≤0.2W / (m·K).

5. The housing according to claim 1, characterized in that, The heat insulation sheet includes resin and heat insulation filler, wherein the volume ratio of the heat insulation filler to the resin is in the range of 0.1 to 1. or, The heat insulation sheet is an aerogel heat insulation film; or, The heat insulation sheet includes fiber cloth, resin and heat insulation filler, and the volume ratio of the heat insulation filler to the resin in the heat insulation sheet is in the range of 0.1 to 1.

6. The housing according to claim 5, characterized in that, The heat-insulating filler is a hollow microsphere, and the average particle size D of the hollow microsphere is in the range of 1μm≤D≤30μm.

7. The housing according to claim 1, characterized in that, Along the thickness direction of the shell, the thickness h of the heat insulation sheet ranges from 0.04mm ≤ h ≤ 0.3mm.

8. The housing according to claim 1, characterized in that, The housing further includes a second substrate layer, which is disposed on the same side as the first substrate layer and the heat insulation sheet, and the thermal conductivity of the second substrate layer is greater than that of the first substrate layer.

9. The housing according to claim 8, characterized in that, The ratio of the thermal conductivity λ3 of the second substrate layer to the thermal conductivity λ1 of the first substrate layer is in the range of: λ3 / λ1≥2.

10. The housing according to claim 8, characterized in that, The thermal conductivity λ3 of the second substrate layer is in the range of 10W / (m·K)≤λ3≤50W / (m·K).

11. An electronic device, characterized in that, The electronic device includes: Display screen; A heat source, the heat source being located on one side of the display screen; and The housing according to any one of claims 1-10, wherein the housing is located on the side of the heat source away from the display screen, and the heat insulation sheet of the housing is disposed corresponding to the heat source.

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