Temperature-controlled directional heat dissipation and dehumidification device

Abstract

The application discloses a temperature control directional heat dissipation and dehumidification device and belongs to the technical field of shell heat dissipation and dehumidification. The device comprises a collector shell, a terminal side cover plate and a first reserved frame slot assembled on the back of the collector shell through bolts, and a heat dissipation mechanism is assembled in the collector shell. The waste heat generated by the chip is secondarily utilized through the heat borrowing mechanism, precise temperature control of the dew condensation prone area is realized, and the device is different from the prior art which adopts a global heater to prevent condensation. The heat of the internal high heat generating element is directionally conducted to the terminal side cover plate through the heat conduction assembly, the hot air is blown out along the edge of the terminal side cover plate by using the air duct of the heat dissipation fan, the temperature of the back of the terminal is always maintained above the dew point temperature without increasing additional heating energy consumption, the physical condition of forming a condensation water bridge between the terminal pins is destroyed, and the problem of the backflow of the hot air after traditional global heating interfering with the heat dissipation of the core chip is avoided.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation and dehumidification technology for equipment casings, and more specifically, to a temperature-controlled directional heat dissipation and dehumidification device. Background Technology

[0002] Intelligent controllers are electronic devices that integrate data acquisition, signal processing, and remote communication. They are widely used in industrial automation and other scenarios. In existing technologies, these terminals typically adopt a metal casing structure, which integrates functional units such as algorithm chips and communication modules. While the metal casing design provides electromagnetic shielding and mechanical protection, due to the thermal inertia of the metal material itself, the overall temperature of the casing will remain at a low level for a long time when the external factory environment temperature is low, especially at night or during winter shutdown. Meanwhile, the internal chip board will continuously generate heat when working, forming a temperature field distribution of internal heat and external cold.

[0003] When the hot and humid air flows through the inner wall of the casing, the areas far from the heat source of the chip, especially the dead corners of the airflow, still maintain a lower temperature. The hot and humid air will condense on these cold surfaces to form dew. The back of the pins of the terminals is particularly cold because of its compact structure, poor air circulation, and the high thermal conductivity of the terminals as metal parts. As a result, the condensation on the back of the terminal block not only adheres directly to the insulating substrate, but also forms water bridges between the densely arranged metal pins.

[0004] In existing technologies, in order to reduce the harm of condensation on the back of the terminal block of the intelligent controller, a heater is used to raise the overall temperature inside the cabinet so that the internal temperature is always higher than the dew point temperature. However, the heater generates a global thermal effect inside the casing, which not only consumes a lot of power, but also the heated air can easily flow directly to and heat the chip heat source under thermal pressure, which will affect the normal heat dissipation of the algorithm chip. Summary of the Invention

[0005] In view of the problems existing in the prior art, the purpose of the present invention is to provide a temperature-controlled directional heat dissipation and dehumidification device, which aims to solve the above-mentioned technical problems.

[0006] To solve the above problems, the present invention adopts the following technical solution.

[0007] A temperature-controlled directional heat dissipation and dehumidification device includes a collector housing and a terminal side cover plate bolted to the back of the collector housing. A first reserved frame groove is formed on the back of the collector housing at the outer edge of the terminal side cover plate. A heat dissipation mechanism is assembled inside the collector housing. The heat dissipation mechanism includes a concave frame fixedly connected to symmetrical positions on both sides of the collector housing. Several dissipation mechanisms are sequentially arranged on the concave frame. Each dissipation mechanism includes a circular assembly block. A first liquid storage ring for storing coolant is fixedly connected to the outer edge of the circular assembly block. A separate cooling fan is assembled at the outer position of each side of the concave frame by plugging in. The collector housing is equipped with a heat-borrowing mechanism located near the terminal side cover. The heat-borrowing mechanism includes a rectangular cavity frame fixedly connected to the side wall of the terminal side cover. Both sides of the rectangular cavity frame are fixedly connected to a first heat-conducting plate, and both ends of the rectangular cavity frame are fixedly connected to air-borrowing ducts communicating with the concave frame cover on the same side to borrow the air ducts of the two separate cooling fans. The borrowed air blows the heat transferred by the first heat-conducting plate out from the first reserved frame groove on the outer edge of the terminal side cover.

[0008] As a further aspect of the present invention: the heat-borrowing mechanism further includes a second reserved frame groove on the side of the rectangular cavity frame near the terminal side cover plate, the second reserved frame groove being connected to the first reserved frame groove on the outer edge of the terminal side cover plate; the first heat-conducting plate extends outward along the inner bottom of the collector housing, and the extended end faces the vicinity of the chip board on which the heat source is assembled inside the collector housing, and contacts the side of the heat source chip board; a plurality of heat dissipation fins are fixedly connected to one end of the side of the rectangular cavity frame, and the heat dissipation fins all extend into the interior of the rectangular cavity frame.

[0009] As a further aspect of the present invention: the heat dissipation mechanism further includes an isolation base fixedly connected to the bottom of the collector housing. The isolation base is a cover structure with a certain height, and the outer edges of the isolation base are all closed and connected to the bottom of the concave frame covers on both sides. An opening penetrating into the interior of the isolation base is provided at the bottom of the concave frame covers on both sides, and magnetic filter strips are magnetically attached to the openings.

[0010] As a further aspect of the present invention: the top of the isolation base has a square opening, and a thermal mechanism for mounting the chip board is assembled through the square opening. The bottom of the isolation base is fixedly connected to a hollow base partition. The bottom of the collector housing is an inverted concave shape to allow ventilation into the isolation base through the hollow holes on the surface of the hollow base partition. Several reserved circular openings are sequentially opened on the surface of the concave frame cover at the position above the magnetic filter strip. The circular assembly blocks are assembled one by one into the reserved circular openings.

[0011] As a further aspect of the present invention: the thermal mechanism includes a color-developing detachable base plate, the color-developing detachable base plate being entirely composed of color-developing metal material and assembled in the opening at the top of the isolated base, and magnetic coatings being fixedly installed on both the upper and lower surfaces of the color-developing detachable base plate, with openings for mounting bolts to fix the chip board at the four corners of the magnetic coating on the upper surface of the color-developing detachable base plate, and a fixed-point heat dissipation module for fixed-point heat dissipation being assembled on the bottom surface of the color-developing detachable base plate by magnetic adsorption of the magnetic coating.

[0012] As a further aspect of the present invention: each of the first liquid storage rings is fixedly connected to a liquid flow disk. The interior of the liquid flow disk is hollow and communicates with the inner cavity of the first liquid storage ring on the outer edge. Several ventilation tubes are fixedly connected to the surface of the liquid flow disk in a circumferentially equidistant manner. The ventilation tubes are isolated from the inner cavity of the liquid flow disk to achieve airflow without interfering with the cold liquid inside the cavity. The two sides of the collector housing are respectively isolated by the concave structure of the concave frame to form detachable assembly cavities for accommodating the circular assembly block and the separate cooling fan.

[0013] As a further aspect of the present invention: heat-conducting connecting blocks corresponding one-to-one with the side walls of the circular assembly blocks are fixedly connected to both sides of the color-displaying detachable base plate, and a valve port sleeve is fixedly installed at the bottom of each circular assembly block to replenish coolant in series. Several fans corresponding one-to-one with the center of the circular assembly blocks on the same side are assembled in the separate cooling fan. A dust collection box is placed at the bottom of each detachable assembly cavity.

[0014] As a further aspect of the present invention: a shaft sleeve is assembled at the center of each fluid flow disc via a sealing ring, and a cleaning plate is assembled on the outer surfaces of both sides of the fluid flow disc via the shaft sleeve. Each cleaning plate is attached to the outer surface of the fluid flow disc, and cotton strips are pasted and installed on the contact end face of each cleaning plate. Furthermore, an outwardly extending transmission rod is fixedly connected to the cleaning plate facing the outside of the collector housing on each circular assembly block. One end of the transmission rod is aligned with the center of the circular assembly block, and the other end extends outward to connect with the fan shaft of the split cooling fan on the same side to utilize the fan's rotational power.

[0015] As a further aspect of the present invention: the fixed-point heat dissipation module includes a magnetically movable block adsorbed on the bottom surface of the hollow base partition. The bottom surface of the color-displaying detachable base plate is magnetically coated with a second liquid storage ring. Magnetic rings are fixedly installed on both the upper and lower surfaces of the second liquid storage ring. The second liquid storage ring is adsorbed and corresponds to the magnetically movable block on the bottom surface of the hollow base partition through the lower magnetic ring. The circular cavity of the second liquid storage ring stores cold liquid.

[0016] As a further aspect of the present invention: a servo motor located at the center of the second liquid storage ring is fixedly installed inside the ring by a bracket, a heat dissipation fan is fixedly installed on the top output end of the servo motor, and a transparent cover plate is bolted to the top of the collector housing. The transparent cover plate is a viewing plate to directly observe the color development status of the color development detachable base plate.

[0017] Compared with the prior art, the technical solution provided by the present invention has at least the following beneficial effects: This solution utilizes a heat-borrowing mechanism to repurpose the waste heat generated by the chip, enabling precise temperature control of areas prone to condensation. Unlike existing technologies that use a global heater to prevent condensation, this solution uses a heat-conducting component to directionally transfer heat from internal high-heat-generating components to the terminal side cover. The cooling fan then blows hot air out along the edge of the terminal side cover. Without increasing additional heating energy consumption, the temperature on the back of the terminal is always maintained above the dew point temperature, thus disrupting the physical conditions for condensation bridges to form between the terminal pins. This avoids the problem of hot air backflow interfering with the heat dissipation of the core chip after traditional global heating.

[0018] By constructing a controlled cold extreme point inside the casing through the dehumidification mechanism, the internal hot and humid air is guided to actively condense water vapor at this point. Combined with the mechanical structure, efficient physical dehumidification is achieved. The cold liquid in the liquid storage ring forms a concentrated condensation surface. The cleaning component cleverly utilizes the motor torque of the split cooling fan to simultaneously drive the water-absorbing material to continuously rotate and wipe the condensation surface without the need for an additional drive source. This not only removes and collects the precipitated cold water droplets in real time, maintaining the high heat exchange efficiency of the condensation surface, but also prevents the condensation droplets from splashing onto the core electrical area under the impact of internal airflow, thus avoiding the potential insulation hazard.

[0019] By combining thermal colorimetric technology with a magnetic positioning structure, when abnormal heat concentration occurs in a localized area of ​​the heat source, the colorimetric metal material of the supporting base can provide intuitive visual feedback. Maintenance personnel can drag the fixed-point heat dissipation module containing coolant inside to the high-temperature hot spot area from the outside of the casing via magnetic coupling without opening the cover and stopping the machine. This allows for the instant absorption and buffering of localized heat accumulation through the shortest conduction path. Subsequently, combined with independent servo fan blades, the heat is quickly dissipated, ensuring the long-term operational reliability of the intelligent data acquisition terminal in harsh industrial environments. Attached Figure Description

[0020] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the invention and, together with the specification, further serve to explain the principles of the invention and enable those skilled in the art to practice and use the invention.

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the bottom surface of the data collector housing; Figure 3 This is a schematic diagram of the disassembled housing of the data collector of the present invention; Figure 4 This is a schematic diagram of the terminal side cover plate of the present invention in a disassembled state; Figure 5 This is a schematic diagram of the heat dissipation mechanism of the present invention in a partially disassembled state; Figure 6 This is a schematic diagram of the disassembled state of the removing mechanism of the present invention; Figure 7 This is a schematic diagram of the structure of the fixed-point heat dissipation module of the present invention; Figure 8 This is a schematic diagram of the ventilation path of the heat dissipation mechanism of the present invention.

[0022] Figure Labels 1. Data collector housing; 2. Terminal side cover; 3. First reserved frame groove; 4. Heat transfer mechanism; 41. Rectangular cavity frame; 42. Second reserved frame groove; 43. Air transfer duct; 44. First heat conduction plate; 45. Heat dissipation fins; 5. Heat dissipation mechanism; 51. Recessed frame cover; 52. Reserved round opening; 53. Isolation base; 54. Square opening; 55. Hollowed-out base partition; 56. Demountable assembly cavity; 57. Magnetic filter strip; 6. Thermal sensing mechanism; 61. Detachable color-developing base plate; 62. Magnetic coating; 63. Thermally conductive connecting block; 7. Discharge mechanism; 71. Circular assembly block; 72. First liquid storage ring; 73. Liquid flow disc; 74. Ventilation duct; 75. Valve port sleeve; 76. Shaft sleeve; 77. Cleaning plate; 78. Cotton swab; 79. Transmission rod; 8. Separate cooling fan; 9. Fixed-point heat dissipation module; 91. Magnetic moving block; 92. Second liquid storage ring; 93. Magnetic ring; 94. Servo motor; 95. Heat dissipation fan blades; 10. Transparent cover plate; 11. Ash collection box.

[0023] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiments of the present invention. However, this is only for illustrative purposes and is not intended to limit the present invention to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation

[0024] The present invention provides a temperature-controlled directional heat dissipation and dehumidification device with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art can use other alternative methods to implement some known technologies; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.

[0025] like Figures 1 to 8 As shown, this embodiment of the invention provides a temperature-controlled directional heat dissipation and dehumidification device, including a collector housing 1 and a terminal side cover plate 2 assembled to the back of the collector housing 1 by bolts. A first reserved frame groove 3 is formed on the back of the collector housing 1 at the position of the outer edge of the terminal side cover plate 2. A heat dissipation mechanism 5 is assembled inside the collector housing 1. The heat dissipation mechanism 5 includes a concave frame cover 51 fixedly connected to the symmetrical positions of the two side walls of the collector housing 1. A plurality of dissipation mechanisms 7 are sequentially arranged on the concave frame cover 51. The dissipation mechanism 7 includes a circular assembly block 71. A first liquid storage ring 72 for storing coolant is fixedly connected to the outer edge of the circular assembly block 71. A separate cooling fan 8 is assembled by plugging in at the outer position of each side concave frame cover 51. The collector housing 1 is equipped with a heat-borrowing mechanism 4 located inside the terminal side cover 2. The heat-borrowing mechanism 4 includes a rectangular cavity frame 41 fixedly connected to the side wall of the terminal side cover 2. Both sides of the rectangular cavity frame 41 are fixedly connected to a first heat-conducting plate 44. Both ends of the rectangular cavity frame 41 are fixedly connected to air-borrowing ducts 43 that communicate with the concave frame cover 51 on the same side to borrow the air ducts of the two separate cooling fans 8. The borrowed air blows the heat transferred by the first heat-conducting plate 44 out from the first reserved frame groove 3 on the outer edge of the terminal side cover 2.

[0026] To address the issue of condensation bridging in the dead-angle area on the back of terminal blocks caused by the thermal inertia of the metal casing in existing industrial electronic equipment under low-temperature or high-humidity conditions, the above-mentioned technical solution is adopted. This solution mainly consists of a collector housing 1, a terminal side cover 2, a heat dissipation mechanism 5, a condensation removal mechanism 7, a separate cooling fan 8, and a heat transfer mechanism 4.

[0027] The collector housing 1 serves as the external protection and support structure for the entire electronic device, possessing excellent electromagnetic shielding and mechanical protection performance. The terminal side cover 2 is assembled to its back using bolts, forming a complete electrical containment chamber. A first reserved frame groove 3 is opened on the back of the collector housing 1 at the outer edge of the terminal side cover 2 to create a pressure relief and heat dissipation channel on the outer edge of the terminal side cover 2, preventing this side from being the coldest point on the housing. The heat dissipation mechanism 5 is embedded inside the collector housing 1. Recessed frame covers 51 are symmetrically positioned on its two side walls, providing an intake and exhaust base for the two-way split cooling fans 8. A desiccation mechanism 7 is assembled onto the recessed frame covers 51. A first liquid-storing ring 72, fixedly connected to the outer edge of the circular assembly block 71, is pre-stored with coolant to create a controllable cold extreme inside the collector housing 1. This actively induces condensation of moisture from the hot and humid air inside the chassis on this surface, concentrating scattered moisture there.

[0028] The rectangular cavity frame 41 in the heat-borrowing mechanism 4 is fixed to the side wall of the terminal side cover plate 2 and forms a complete heat conduction bridge with the first heat-conducting plates 44 on both sides. The first heat-conducting plates 44 can absorb waste heat from the vicinity of high-heat-generating components inside the casing, such as integrated circuit boards like algorithm chip boards. The air-borrowing ducts 43, which are connected to both ends of the rectangular cavity frame 41 and communicate with the concave frame cover 51, can be connected to the main air duct system of the split cooling fan 8. During operation, the high-speed airflow generated by the split cooling fan 8 can not only maintain normal heat dissipation circulation, but also a portion of the airflow can be borrowed through the air-borrowing ducts 43 and pressed into the rectangular cavity frame 41. After heat exchange with the waste heat delivered by the first heat-conducting plates 44, it is transformed into warm and dry airflow, which is then blown outward along the first reserved frame groove 3 on the surface of the terminal side cover plate 2 to stably distribute a portion of the internal heat to one side of the terminal side cover plate 2, so as to avoid condensation on this side affecting the stability of the wiring terminal. The waste heat generated by the equipment itself is utilized in a secondary, targeted manner. The waste heat of the chip is used to heat the terminal side cover plate 2 area, which is most susceptible to cooling. This not only eliminates the energy consumption and space occupation of an external global heater, but also keeps the temperature on the back of the terminal above the dew point temperature.

[0029] like Figures 1 to 8As shown, the heat transfer mechanism 4 also includes a second reserved frame groove 42 opened on the side of the rectangular cavity frame 41 near the terminal side cover plate 2. The second reserved frame groove 42 is connected to the first reserved frame groove 3 on the outer edge of the terminal side cover plate 2. The first heat-conducting plate 44 extends outward along the inner bottom of the collector housing 1, and the extended end faces the vicinity of the chip board with the heat source assembled inside the collector housing 1 and contacts the side of the heat source chip board. The first heat-conducting plate 44 is fixedly connected to one end of the side of the rectangular cavity frame 41 and a plurality of heat dissipation fins 45 are fixedly connected thereto, and the heat dissipation fins 45 all extend into the interior of the rectangular cavity frame 41.

[0030] A second reserved frame groove 42 is provided on the side wall of the rectangular cavity frame 41 close to the terminal side cover plate 2. The second reserved frame groove 42 is aligned with and connected to the first reserved frame groove 3 at the outer edge of the terminal side cover plate 2, thereby constructing a directional exhaust channel for heat dissipation. At the same time, the first heat-conducting plate 44, as a heat transfer component, is closely attached to and extends along the inner bottom of the collector housing 1 into the interior depth direction, pointing towards the chip board inside the collector housing 1, which serves as the main heat source, and directly contacts the edge side of the heat source chip board.

[0031] At the other end of the first heat-conducting plate 44, that is, at the end fixedly connected to the side of the rectangular cavity frame 41, several heat dissipation fins 45 are fixedly connected, and the heat dissipation fins 45 all extend inward into the internal cavity of the rectangular cavity frame 41. The heat source transferred from the chip board by the first heat-conducting plate 44 is continuously conducted to these heat dissipation fins 45. Since the heat dissipation fins 45 are deep inside the rectangular cavity frame 41, when the airflow introduced by the split cooling fan 8 enters the rectangular cavity frame 41 through the air duct 43, the airflow will exchange the heat on the heat dissipation fins 45 that extend into the interior, so as to absorb heat and reduce relative humidity.

[0032] Through the coordinated operation of the first heat-conducting plate 44, the heat dissipation fins 45, and the second reserved frame groove 42, the heat-borrowing mechanism 4 can achieve targeted physical cooling of the chip board in terms of internal structural layout and thermal management. The extracted waste heat is converted into an anti-condensation hot air source in the rectangular cavity frame 41, and then guided by the second reserved frame groove 42 to the first reserved frame groove 3 to form a hot air curtain that is tightly attached to the back of the terminal side cover plate 2, so as to prevent the blind flow of internal moisture and improve the electrical safety protection capability and operational stability of the metal casing in high humidity and high and low temperature difference environments.

[0033] like Figures 1 to 8As shown, the heat dissipation mechanism 5 also includes an isolation base 53 fixedly connected to the bottom of the collector housing 1. The isolation base 53 is a cover structure with a certain height, and the outer edges of the isolation base 53 are all closed and connected to the bottom of the two concave frame covers 51. An opening is provided at the bottom of the two concave frame covers 51, which extends into the interior of the isolation base 53, and magnetic filter strips 57 are magnetically attached to the openings.

[0034] The isolation base 53 is fixedly connected to the bottom of the collector housing 1. In essence, it creates an independent accommodating space with a certain height in the bottom space of the collector housing 1. The accommodating space of the isolation base 53 is a cover structure with its outer edges closed. It can physically divide a dedicated bottom isolation air chamber inside the collector housing 1. On the one hand, it can effectively block the disorderly convergence of the chaotic temperature and humidity airflow above the chassis with the internal space of the base, providing an independent and controlled environment for the subsequent core heat-generating components. On the other hand, it can raise the circuit board with the integrated chip board inside. When the two separate cooling fans 8 are working to dissipate heat, they can dissipate heat on the upper surface of the circuit board and simultaneously dissipate heat on its bottom surface, similar to creating a clamping heat dissipation channel on the outer surface of the circuit board.

[0035] Meanwhile, the closed outer edge of the isolation base 53 directly connects to the bottom of the concave frame covers 51 distributed on both sides of the collector housing 1, making them integrally formed at the structural boundary. At the bottom of each concave frame cover 51, an opening is specially provided that penetrates directly into the internal cavity of the isolation base 53, thereby directly connecting the airflow channel of the external space of the concave frame cover 51 with the internal bottom layer of the isolation base 53. Magnetic filter strips 57 are installed on the through openings by magnetic adsorption, which can prevent dust, lint, and impurities from the external environment from entering the base with the cooling airflow. During daily operation, maintenance personnel can perform disassembly and disassembly procedures to clean or replace the filter screen.

[0036] like Figures 1 to 8 As shown, the top of the isolation base 53 has a square opening 54, and a thermal mechanism 6 for mounting the chip board is assembled through the square opening 54. The bottom of the isolation base 53 is fixedly connected to a hollow base partition 55. The bottom of the collector housing 1 is inverted concave to allow ventilation into the isolation base 53 through the hollow holes on the surface of the hollow base partition 55. Several reserved round openings 52 are sequentially opened on the surface of the concave frame cover 51 at the position above the magnetic filter strip 57. The round assembly blocks 71 are assembled into the reserved round openings 52 one by one.

[0037] The isolation base 53 has a square opening 54 at its top, forming a window for supporting and exchanging heat with core components. A thermally sensitive mechanism 6 for mounting the chip board is fitted into this square opening 54, allowing the chip board, which is the main heat source, to be mounted on top of the isolation base 53. This allows the bottom of the chip board to float directly above the internal air chamber of the isolation base 53, providing a direct contact airflow cooling channel for its bottom surface. This facilitates the cooling airflow from the bottom layer to directly wash over the back of the heat-generating components. A perforated base partition 55 is fixedly connected to the bottom boundary of the isolation base 53. Its surface has several perforations for air intake. To ensure that cold air from the outside can smoothly enter this channel, the bottom of the collector housing 1 is designed as an inverted concave structure. When the collector housing 1 is installed flat at the work site, this inverted concave bottom will naturally form a suspended air intake gap between the entire device and the mounting base. Cold air from the outside environment is naturally guided or actively drawn in through this suspended gap.

[0038] In the three-dimensional structural layout on the side of the housing, on the surface of the concave frame cover 51 on both sides of the collector housing 1, several reserved round openings 52 are sequentially opened at a position slightly above the bottom magnetic filter strip 57. These reserved round openings 52 constitute the installation interface, so that the basic component of the displacement mechanism 7, namely the circular assembly block 71, can be fitted and assembled into the reserved round openings 52 one by one.

[0039] like Figures 1 to 8 As shown, the thermal mechanism 6 includes a color-developing detachable base plate 61, which is made entirely of color-developing metal material and is assembled in the opening at the top of the isolated base 53. Magnetic coatings 62 are fixedly installed on both the upper and lower surfaces of the color-developing detachable base plate 61. Openings for mounting bolts to fix the chip board are provided at the four corners of the magnetic coating 62 on the upper surface of the color-developing detachable base plate 61. A fixed-point heat dissipation module 9 for fixed-point heat dissipation is assembled on the bottom surface of the color-developing detachable base plate 61 by magnetic adsorption through the magnetic coating 62.

[0040] The thermally sensitive mechanism 6 includes a color-displaying detachable base plate 61, which is made of a color-displaying metal material with temperature-sensitive properties. The specific material includes, but is not limited to, reversible thermochromic alloy materials, thermally conductive copper plates or thermally conductive aluminum plates with reversible bidirectional color-displaying temperature-sensitive coatings, and other existing thermally sensitive color-displaying metal materials. This not only gives it the excellent solid-state thermal conductivity and structural load-bearing performance of a metal substrate, but also allows it to directly absorb the waste heat emitted by the chip board above and generate corresponding physical color changes on the surface appearance according to the real-time changes in temperature gradient, thereby providing intuitive visual feedback for fixed-point heat dissipation.

[0041] In terms of overall structural assembly, the color-developing detachable base plate 61 is fitted into the square opening 54 at the top of the lower isolation base 53, forming a suspended heat transfer platform that directly faces the bottom cooling air duct. The upper and lower surfaces of the color-developing detachable base plate 61 are completely covered and fixedly installed with magnetic coating 62. Furthermore, the magnetic coating 62 on the upper surface of the color-developing detachable base plate 61 has specially reserved openings at the four corners for fasteners to pass through. This allows assembly bolts to pass through the openings, so that the chip board, which serves as the main heat source, can be firmly locked and fixed directly above the color-developing detachable base plate 61, ensuring a tight fit between the chip board and the color-developing metal surface, and achieving maximum efficiency in contact heat conduction.

[0042] The magnetic coating 62 on the bottom surface of the detachable color display base plate 61 directly adsorbs and assembles a fixed-point heat dissipation module 9 for back cooling. This eliminates the need for additional through holes or interfering clip brackets on the heat-conducting belly of the detachable color display base plate 61. This maximizes the flatness and airtightness of the bottom surface while allowing for flexible adsorption and positioning adjustments based on the most severely heated local hot spots on the chip board above. This greatly improves the flexibility and targeting of thermal management inside the casing.

[0043] like Figures 1 to 8 As shown, each of the first liquid storage rings 72 is fixedly connected to a liquid flow disk 73. The liquid flow disk 73 is hollow inside and communicates with the inner cavity of the first liquid storage ring 72 on the outer edge. Several ventilation tubes 74 are fixedly connected to the surface of the liquid flow disk 73 in a circumferentially equidistant manner. The ventilation tubes 74 are isolated from the inner cavity of the liquid flow disk 73 to achieve airflow without interfering with the cold liquid inside the cavity. The two sides of the collector housing 1 are respectively isolated by the concave structure of the concave frame cover 51 to form detachable assembly cavities 56 for accommodating the circular assembly block 71 and the separate cooling fan 8.

[0044] The first liquid storage ring 72 serves as an external cold energy carrier, and a liquid flow disk 73 is fixedly connected to its inner ring. The liquid flow disk 73 is not a solid baffle structure, but is designed with a cavity inside. The cavity is physically connected to the inner cavity of the first liquid storage ring 72 on the outer edge, so that the cold liquid that was originally stored only in the outer ring space can fill the center of the entire liquid flow disk 73, expanding the ring-shaped cold source into a complete and continuous large-area circular condensation wall, enhancing its ability to capture and force condensation of water vapor scattered in the chassis.

[0045] On the large-area surface of the liquid flow disk 73, several ventilation ducts 74 are arranged equidistantly and fixedly connected in a circular pattern. These ventilation ducts 74 adopt a tubular structure layout that runs through the front and rear of the liquid flow disk 73. They are isolated from the inner cavity of the liquid flow disk 73, ensuring smooth airflow in the front and rear ducts without interfering with or leaking the coolant encapsulated inside the cavity of the liquid flow disk 73. When the hot and humid air inside the casing is driven by the airflow through these ventilation ducts 74, the air is forced to make large-area, close contact with the inner wall of the ventilation duct 74, which is continuously cooled by the surrounding coolant. This not only provides a directional channel for airflow but also transforms the originally planar surface condensation into three-dimensional condensation on the inner wall of the tube bundle.

[0046] The collector housing 1 has an inwardly recessed structure on both sides through the concave frame cover 51, which isolates an independent detachable assembly cavity 56 outside the boundary of the housing body. Spatially, this provides a space for the circular assembly block 71 and the separate cooling fan 8 that provides airflow power. This ensures that the circular assembly block 71 and the separate cooling fan 8 can fit tightly against the main body of the housing to perform efficient heat and moisture exchange. Structurally, it physically and waterproofly isolates the condensation enrichment area from the core electrical housing chamber, ensuring that the liquid water droplets condensed on the first liquid storage ring 72 and the liquid flow disk 73 are confined to the outer walls of both sides of the collector housing 1 and do not penetrate or spread into the internal high-voltage terminals or chip area, thus achieving compatibility between electrical protection and efficient condensation and dehumidification.

[0047] like Figures 1 to 8 As shown, heat-conducting connecting blocks 63 corresponding to the side walls of the circular assembly blocks 71 are fixedly connected to both sides of the color-displaying detachable base plate 61. A valve port sleeve 75 is fixedly installed at the bottom of each circular assembly block 71 to replenish coolant in series. Several fans corresponding to the center of the circular assembly blocks 71 on the same side are assembled in the separate cooling fan 8. A dust collection box 11 is placed at the bottom of each detachable assembly cavity 56.

[0048] The configured heat-conducting connection block 63 is fixedly connected to both sides of the color-displaying detachable base plate 61, and corresponds one-to-one with the side wall of the circular assembly block 71 assembled inside the concave frame cover 51 and forms physical contact. A heat conduction connection path is constructed between the high-temperature bearing base in the center and the side modules. At the bottom boundary of each circular assembly block 71, a vertically downward valve sleeve 75 is fixedly installed. Adjacent valve sleeves 75 can be physically connected in series through external pipelines, so that maintenance personnel can uniformly pour or directionally replenish coolant into the interior without disassembling the overall mechanism on the side of the casing.

[0049] The separate cooling fan 8 is assembled onto the outside of the concave frame 51 via a plug-in connection. Inside, several independent micro-motor fans are arranged sequentially. The center of these fans corresponds precisely to the center of the circular assembly block 71 mounted on the same side, ensuring that the high-speed airflow blown in or drawn out by the fans can pass straight through the corresponding deflection mechanism 7. At the same time, at the bottom of the detachable assembly cavity 56 isolated inward from the concave frame 51, a dust collection box 11 is stably placed. This dust collection box 11 is used to collect dust particles that settle during the airflow process, as well as cold water droplets that drip naturally from the condensation end face above due to gravity.

[0050] The configured split-type cooling fan 8 serves as both an air source component providing airflow force and a transmission function in terms of spatial layout. After assembly, the central motor shaft of each fan inside the split-type cooling fan 8 will be coaxially inserted and connected with the outwardly extending transmission rod 79 on each circular assembly block 71. When the split-type cooling fan 8 is powered on and rotates to generate directional cooling airflow, the rotational force of its motor rotor will be synchronously transmitted to the internally assembled cleaning plate 77 through the transmission rod 79. This allows the cleaning plates 77 located on both sides of the liquid flow disk 73 to follow the rotation of the fan and closely adhere to the outer surface of the liquid flow disk 73 for continuous circumferential rotation cleaning.

[0051] like Figures 1 to 8 As shown, a shaft sleeve 76 is assembled at the center of the liquid flow disk 73 via a sealing ring, and a cleaning plate 77 is assembled on the outer surfaces of both sides of the liquid flow disk 73 via the shaft sleeve 76. Each cleaning plate 77 is attached to the outer surface of the liquid flow disk 73, and a cotton strip 78 is attached to the contact end face of the cleaning plate 77. An outwardly extending transmission rod 79 is fixedly connected to the cleaning plate 77 facing the outside of the collector housing 1 on each circular assembly block 71. One end of the transmission rod 79 is aligned with the center of the circular assembly block 71, and the other side extends outward to connect with the fan shaft of the split cooling fan 8 on the same side to borrow the rotational power of the fan.

[0052] In this design, a shaft sleeve 76 is tightly assembled at the center of each flow disk 73 via a sealing ring. Since the internal cavity of the flow disk 73 is filled with coolant for heat exchange, the sealing ring ensures that the shaft sleeve 76, when penetrating the center of the flow disk 73, provides a mechanical rotation fulcrum while simultaneously blocking the outward leakage path of the internal coolant. Based on the through-support of the shaft sleeve 76, cleaning plates 77 are simultaneously assembled on the outer surfaces of both the front and rear sides of the flow disk 73, with each cleaning plate 77 tightly adhering to the outer surface of the flow disk 73 in a parallel mechanical posture. Cotton strips 78 are flatly pasted onto the contact surfaces of the cleaning plates 77. These cotton strips 78 serve as a flexible contact medium, possessing not only excellent deformation adhesion characteristics but also capillary absorption capabilities.

[0053] In terms of power, each circular assembly block 71 has a horizontally extending transmission rod 79 fixedly connected to the cleaning plate 77 facing the outside of the collector housing 1. One end of the transmission rod 79 is coaxially aligned with the central axis of the circular assembly block 71 and the liquid flow disk 73, while the other side extends outward and is directly embedded in the central motor fan shaft of the split cooling fan 8 on the same side, directly utilizing the motor rotation power generated by the split cooling fan 8 when performing directional exhaust. When the split cooling fan 8 is powered on and rotates at high speed, the torque output by its central shaft is directly transmitted to the outer cleaning plate 77 through the transmission rod 79, and, relying on the rigid linkage of the central shaft sleeve 76, synchronously drives the cleaning plate 77 on the inner side of the liquid flow disk 73 to rotate together. At this time, the cleaning plates 77 on both sides closely follow the rotation frequency of the split cooling fan 8 and continuously perform circumferential rotation sweeping on both sides of the liquid flow disk 73.

[0054] During this dynamic operation, the cotton swab 78 can not only remove dust and lint adhering to the metal disk surface with the cooling airflow in real time to ensure high thermal conductivity of the surface, but also actively wipe and absorb the cold water droplets continuously precipitated on the surface of the liquid flow disk 73 due to active condensation, preventing water droplets from splashing to the core electrical area under the impact of airflow, and improving the long-term stability of the device in high humidity conditions.

[0055] like Figures 1 to 8 As shown, the fixed-point heat dissipation module 9 includes a magnetic moving block 91 that is adsorbed onto the bottom surface of the hollow base partition 55. The bottom surface of the color-displaying detachable base plate 61 is adsorbed and installed with a second liquid storage ring 92 through a magnetic coating 62. Magnetic rings 93 are fixedly installed on both the upper and lower surfaces of the second liquid storage ring 92. The second liquid storage ring 92 is adsorbed and corresponds to the magnetic moving block 91 on the bottom surface of the hollow base partition 55 through the lower magnetic ring 93. The ring cavity of the second liquid storage ring 92 stores cold liquid.

[0056] In this module, the magnetic moving block 91 is attached to the bottom surface of the hollow base partition 55 in a sliding and adjustable step state, which essentially acts as the control and guidance end of the entire fixed-point heat dissipation module 9 outside the casing or in the bottom safe area. The second liquid storage ring 92, which is the core heat absorption component, is directly attached to the magnetic coating 62 on the bottom surface of the upper color-developing detachable base plate 61 through the magnetic ring 93 fixedly installed on its upper surface. Since the heat source chip board is directly supported above the color-developing detachable base plate 61, this close fit configuration of the second liquid storage ring 92 enables it to directly absorb the concentrated waste heat of the chip from the back side with the shortest physical conduction path.

[0057] A magnetic ring 93 is also fixedly installed on the lower surface of the second liquid storage ring 92, and the lower magnetic ring 93 and the magnetic moving block 91 located on the bottom surface of the hollow base partition 55 form a magnetic coupling corresponding to each other with an upper and lower gap. When the maintenance personnel observe through the transparent cover plate 10 that a certain part of the color-developing detachable base plate 61 has changed color due to local overheating of the chip, there is no need to disassemble the equipment casing or cut off the operating power. They only need to manually move the magnetic moving block 91 under the base. The magnetic moving block 91 will rely on magnetic force to drag the upper second liquid storage ring 92 smoothly along the bottom surface of the color-developing detachable base plate 61 until it aligns with the high-temperature hot spot area where the color has changed.

[0058] During this operation, the annular cavity of the second liquid storage ring 92 is sealed with coolant, which allows it to instantly and continuously absorb and disintegrate local heat accumulation after being moved below the hot spot. This effectively prevents the chip from being reduced in frequency or damaged due to local hot spots. The stored coolant is a liquid heat exchange medium with high specific heat capacity, excellent thermal conductivity and high insulation safety requirements for electronic equipment, which is available in the prior art. Specific materials include, but are not limited to, electronic grade fluorinated liquid, high-purity synthetic thermally conductive silicone oil, or high-purity deionized water with added anti-corrosion and antifreeze components.

[0059] like Figures 1 to 8 As shown, a servo motor 94 located at the center of the second liquid storage ring 92 is fixedly installed inside the ring by a bracket. A heat dissipation fan 95 is fixedly installed on the top output end of the servo motor 94. A transparent cover plate 10 is assembled on the top of the collector housing 1 by bolts. The transparent cover plate 10 is a viewing plate to directly observe the color development state of the color development detachable base plate 61.

[0060] The configured servo motor 94 is a high-strength micro brushless motor in the prior art, used to drive the heat dissipation fan 95 at the output end to rotate at high speed for heat dissipation, and the assembled transparent cover plate 10 is a visible panel in the prior art.

[0061] The usage method provided by this invention is as follows: When the device is started in a low-temperature and high-humidity industrial environment, and the internal integrated chip board begins to generate waste heat, the system drives the separate cooling fans 8 located outside the concave frame covers 51 on both sides of the collector housing 1 to rotate in opposite directions to draw away the hot air. Under this exhaust state, the external cold air enters from the gap formed by the inverted concave shape on the bottom surface of the collector housing 1 under the action of negative pressure, passes through the hollow holes on the surface of the hollow base partition 55 and enters the interior of the isolation base 53. The airflow washes the bottom surface of the color-developing detachable base plate 61 and the fixed-point heat dissipation module 9 from bottom to top, passes through the square opening 54 through the space around the chip board, and then splits to both sides.

[0062] During the exhaust process, the motor rotor shaft of the split cooling fan 8 directly drives the embedded transmission rod 79 to rotate. The transmission rod 79 drives the cleaning plates 77 on both sides of the liquid flow disk 73 to rotate circumferentially through the central shaft sleeve 76. When the air carrying internal moisture flows through the dew removal mechanism 7, the moisture condenses into water droplets on the surface of the liquid flow disk 73 under the action of the first liquid storage ring 72 of the cold carrier. The rotating cleaning plate 77 drives the cotton strip 78 attached to the end face to continuously wipe the metal disk surface, physically adsorbing the cold water droplets and guiding them to fall into the dust collection box 11 at the bottom under the influence of gravity. The dry airflow after physical dehumidification is finally discharged from the detachable assembly chambers 56 on both sides.

[0063] Based on the internal heat distribution or lateral airflow heat exchange requirements, the system adjusts the working mode of the split cooling fan 8 to one side intake and the other side exhaust. At this time, external air is forced in from the detachable assembly cavity 56 on the intake side, and the airflow passes through the ventilation tube 74 on the liquid flow disc 73 on that side and enters the internal space of the collector housing 1.

[0064] Because the airflow is unidirectional and flows horizontally, this horizontal air duct simultaneously traverses the upper and lower surfaces of the removable color display base plate 61, providing synchronous convective heat exchange to the heat-generating chip plate at the top and the interior of the isolated base 53 at the bottom. The high-temperature airflow, having absorbed heat from the internal equipment, then passes through the ventilation duct 74 on the other side of the liquid flow disc 73 and is exhausted outwards from the corresponding removable assembly cavity 56 by the separate cooling fan 8 on the exhaust side. In this unidirectional airflow path, the cleaning plates 77 on both sides continue their rotating dust-sweeping action using the rotational power provided by the separate cooling fan 8, maintaining the unobstructed flow and high thermal conductivity of the tube bundles and the air duct on both sides.

[0065] To address the issues of internal heat and external cold caused by the thermal inertia of the metal material in the terminal side cover 2, as well as the condensation bridges in the dead corner area on the back, the heat transfer mechanism 4 is linked with the overall heat dissipation airflow for distribution. The first heat-conducting plate 44, which is in direct contact with the side of the chip board, conducts the high-temperature waste heat generated by the chip outward and delivers it to the heat dissipation fins 45 fixed on the side of the rectangular cavity frame 41.

[0066] Meanwhile, during the operation of the split cooling fan 8, a portion of the airflow in its duct is introduced into the rectangular cavity frame 41 by the air duct 43. The borrowed airflow passes through the gap between the heat dissipation fins 45, absorbs the heat conducted by the solid and transforms it into warm airflow. Then, it flows along the second reserved frame groove 42 on the side of the rectangular cavity frame 41 near the terminal side cover plate 2 to the outer edge of the terminal side cover plate 2, and finally blows out from the first reserved frame groove 3. The hot air blows directionally across the back of the terminal side cover plate 2, raising the temperature of the most susceptible surface and preventing it from falling below the dew point temperature, thus blocking the conditions for condensation to occur near the terminal block.

[0067] Finally, during continuous operation of the device, if there is an abnormal concentration of heat in a local area of ​​the chip board, the thermal mechanism 6, together with the fixed-point heat dissipation module 9, performs targeted treatment. The local high temperature at the bottom of the chip board is directly transferred to the color-developing detachable base plate 61 below. After absorbing the heat, the color-developing detachable base plate 61 undergoes a physical color change in the corresponding hot spot area. After observing the color development state through the transparent cover plate 10 on the top of the collector housing 1, the magnetic moving block 91, which is adsorbed on the bottom surface of the hollow base partition plate 55, is manually moved horizontally at the bottom.

[0068] The magnetically movable block 91, relying on the air-tight magnetic coupling of the upper and lower magnetic rings 93, drives the second liquid storage ring 92 to slide along the magnetic coating 62 on the bottom surface of the color-displaying detachable base plate 61 until it aligns with the hot spot area where the color changes. At this time, the cold liquid stored inside the cavity of the second liquid storage ring 92 absorbs and buffers the concentrated waste heat in this area. At the same time, the servo motor 94 assembled in the center starts, driving the top heat dissipation fan 95 to rotate, quickly blowing away the heat accumulated on the surface of the second liquid storage ring 92 and stripping it into the bottom airflow inside the isolated base 53, thus completing the targeted cooling of the chip hot spot.

[0069] This invention encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this invention. To provide the public with a thorough understanding of this invention, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand the invention even without these details. Furthermore, to avoid unnecessary misunderstanding of the essence of this invention, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0070] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A temperature-controlled directional heat dissipation and dehumidification device, comprising a collector housing (1) and a terminal side cover plate (2) bolted to the back of the collector housing (1), characterized in that: The back of the collector housing (1) is provided with a first reserved frame groove (3) at the position of the outer edge of the terminal side cover plate (2), and a heat dissipation mechanism (5) is assembled inside the collector housing (1). The heat dissipation mechanism (5) includes a concave frame cover (51) fixedly connected to the symmetrical positions of the two side walls of the collector housing (1). A plurality of dissipation mechanisms (7) are arranged sequentially on the concave frame cover (51). The dissipation mechanism (7) includes a circular assembly block (71). A first liquid storage ring (72) for storing coolant is fixedly connected to the outer edge of the circular assembly block (71). A separate cooling fan (8) is assembled at the outer position of each side concave frame cover (51) by plugging. The collector housing (1) is provided with a heat-borrowing mechanism (4) located near the terminal side cover plate (2). The heat-borrowing mechanism (4) includes a rectangular cavity frame (41) fixedly connected to the side wall of the terminal side cover plate (2). Both sides of the rectangular cavity frame (41) are fixedly connected to a first heat-conducting plate (44). Both ends of the rectangular cavity frame (41) are fixedly connected to a wind-borrowing duct (43) communicating with the concave frame cover (51) on the same side to borrow the air duct of the two-sided split cooling fan (8). The borrowed air blows the heat transferred by the first heat-conducting plate (44) out from the first reserved frame groove (3) on the outer edge of the terminal side cover plate (2).

2. The temperature-controlled directional heat dissipation and dehumidification device according to claim 1, characterized in that, The heat transfer mechanism (4) further includes a second reserved frame groove (42) on the side of the rectangular cavity frame (41) near the terminal side cover plate (2), the second reserved frame groove (42) and the first reserved frame groove (3) on the outer edge of the terminal side cover plate (2) are connected to each other; the first heat conduction plate (44) extends outward along the inner bottom of the collector housing (1), and the extended end faces the vicinity of the chip board with the heat source assembled inside the collector housing (1) and contacts the side of the heat source chip board. The first heat conduction plate (44) is fixedly connected to one end of the side of the rectangular cavity frame (41) and a number of heat dissipation fins (45) are fixedly connected, and the heat dissipation fins (45) all extend into the interior of the rectangular cavity frame (41).

3. The temperature-controlled directional heat dissipation and dehumidification device according to claim 2, characterized in that, The heat dissipation mechanism (5) also includes an isolation base (53) fixedly connected to the bottom of the collector housing (1). The isolation base (53) is a cover structure with a certain height. The outer edges of the isolation base (53) are closed and connected to the bottom of the two concave frame covers (51). An opening is provided at the bottom of the two concave frame covers (51) to penetrate into the isolation base (53). Magnetic filter strips (57) are attached to the openings by magnetic attraction.

4. The temperature-controlled directional heat dissipation and dehumidification device according to claim 3, characterized in that, The top of the isolation base (53) is provided with a square opening (54), and a thermal mechanism (6) for holding the chip board is assembled through the square opening (54). The bottom of the isolation base (53) is fixedly connected with a hollow base partition (55). The bottom of the collector housing (1) is inverted concave to cooperate with the hollow holes on the surface of the hollow base partition (55) to ventilate the interior of the isolation base (53). Several reserved round openings (52) are sequentially opened on the surface of the concave frame cover (51) at the position above the magnetic filter strip (57). The round assembly blocks (71) are assembled one by one into the reserved round openings (52).

5. The temperature-controlled directional heat dissipation and dehumidification device according to claim 4, characterized in that, The thermal mechanism (6) includes a color-developing detachable base plate (61), which is made of color-developing metal material and is assembled in the opening at the top of the isolation base (53). The upper and lower surfaces of the color-developing detachable base plate (61) are fixedly equipped with magnetic coating (62). The magnetic coating (62) on the upper surface of the color-developing detachable base plate (61) has openings at the four corners for mounting bolts to fix the chip board. The bottom surface of the color-developing detachable base plate (61) is assembled with a fixed-point heat dissipation module (9) for fixed-point heat dissipation by magnetic coating (62).

6. The temperature-controlled directional heat dissipation and dehumidification device according to claim 5, characterized in that, The first liquid storage ring (72) is fixedly connected to a liquid flow disk (73). The liquid flow disk (73) is hollow inside and communicates with the inner cavity of the first liquid storage ring (72) on the outer edge. The surface of the liquid flow disk (73) is fixedly connected with several ventilation tubes (74) in a circumferentially equidistant manner. The ventilation tubes (74) are isolated from the inner cavity of the liquid flow disk (73) to achieve airflow without interfering with the cold liquid inside the cavity. The collector housing (1) is separated on both sides by the concave structure of the concave frame cover (51) to create detachable assembly cavities (56) for accommodating the circular assembly block (71) and the separate cooling fan (8).

7. The temperature-controlled directional heat dissipation and dehumidification device according to claim 6, characterized in that, The color-displaying detachable base plate (61) has heat-conducting connecting blocks (63) that correspond one-to-one with the side walls of the circular assembly blocks (71) in sequence on both sides. Each circular assembly block (71) has a valve port sleeve (75) fixedly installed at the bottom to replenish coolant in series. The split-type cooling fan (8) has several fans that correspond one-to-one with the center of the circular assembly blocks (71) on the same side in sequence. The bottom of the detachable assembly cavity (56) is equipped with a dust collection box (11).

8. The temperature-controlled directional heat dissipation and dehumidification device according to claim 7, characterized in that, At the center of each fluid flow disk (73), a shaft sleeve (76) is assembled through a sealing ring. Cleaning plates (77) are assembled on the outer surfaces of both sides of the fluid flow disk (73) through the shaft sleeve (76). Each cleaning plate (77) is attached to the outer surface of the fluid flow disk (73), and cotton strips (78) are pasted on the contact end face of each cleaning plate (77). Each circular assembly block (71) has an outwardly extending transmission rod (79) fixedly connected to the cleaning plate (77) facing the outside of the collector housing (1). One end of the transmission rod (79) is aligned with the center of the circular assembly block (71), and the other side extends outward to connect with the fan shaft of the split cooling fan (8) on the same side to borrow the rotational power of the fan.

9. A temperature-controlled directional heat dissipation and dehumidification device according to claim 8, characterized in that, The fixed-point heat dissipation module (9) includes a magnetic moving block (91) adsorbed on the bottom surface of the hollow base partition (55). The bottom surface of the color-displaying detachable base plate (61) is adsorbed and installed with a second liquid storage ring (92) through a magnetic coating (62). Magnetic rings (93) are fixedly installed on both the upper and lower surfaces of the second liquid storage ring (92). The second liquid storage ring (92) is adsorbed and corresponds to the magnetic moving block (91) on the bottom surface of the hollow base partition (55) through the lower magnetic ring (93). The ring cavity of the second liquid storage ring (92) stores cold liquid.

10. A temperature-controlled directional heat dissipation and dehumidification device according to claim 9, characterized in that, The second liquid storage ring (92) has a servo motor (94) fixedly installed inside the ring by a bracket. A heat dissipation fan (95) is fixedly installed on the top output end of the servo motor (94). A transparent cover plate (10) is assembled on the top of the collector housing (1) by bolts. The transparent cover plate (10) is a viewing plate to directly observe the color development state of the color development detachable base plate (61).

Images