Power module, multiphase power module and method of manufacturing thereof

Abstract

This invention discloses a power module, a multiphase power module, and a method for manufacturing the same. The power module includes an inductor, a first printed circuit board orthogonally disposed to the inductor on a first surface of the inductor, and a second printed circuit board orthogonally disposed to the inductor on a second surface of the inductor via an inductor platform. The second printed circuit board includes a plurality of output capacitors disposed on the first surface of the second printed circuit board, and at least some of the output capacitors are disposed below the inductor, between the second surface of the inductor and the first surface of the second printed circuit board.

Description

Technical Field

[0001] This disclosure generally relates to power supplies, and more specifically to multiphase integrated power modules including a vertical printed circuit board (PCB) and output capacitors disposed on a bottom PCB, around and below an inductor fixed to the bottom PCB. Background Technology

[0002] A power converter transforms input power into output power to provide the required voltage and current to a load. Multiphase power converters comprise multiple parallel power stages that operate out of phase, offering lower output ripple voltage, better transient performance, and lower input capacitor ripple current ratings.

[0003] One issue with multiphase power converters is their footprint on the motherboard. Typically, a box-type pin or pin connector is needed to connect the multiphase power converter to the output capacitors located on the motherboard. Adding more output capacitors can improve the converter's dynamic performance (e.g., providing fast transient loads). However, additional output capacitors increase the space required for the multiphase power converter on the motherboard.

[0004] A voltage regulator module (VRM) in a power supply is an electronic device that ensures the output voltage remains stable and within a specified range even when the input voltage changes or the load current fluctuates. A VRM can be single-phase or multi-phase. The primary function of a VRM is to convert fluctuating or high input voltages into a stable, reliable output voltage, suitable for powering sensitive electronic equipment. VRMs are crucial for providing the correct operating voltage, preventing damage, and ensuring optimal performance for sensitive electronic devices such as microprocessors, memory modules, and other components. In computer power supplies, multiple VRMs are essential for powering the CPU and other high-performance components.

[0005] Therefore, a system and method are needed to reduce the space occupied by multiphase power converters on the electronic component motherboard by integrating the output capacitors on the multiphase power converter instead of on the motherboard. Summary of the Invention

[0006] The power module includes an inductor, a first printed circuit board (PCB) orthogonally disposed to the inductor at a first surface of the inductor, and a second PCB orthogonally disposed to the inductor at a second surface of the inductor via an inductor platform. The second surface of the inductor is opposite to the first surface of the inductor, and the second PCB includes a plurality of output capacitors disposed on the first surface of the second PCB. Furthermore, at least some of the plurality of output capacitors are disposed below the inductor, between the second surface of the inductor and the first surface of the second PCB.

[0007] In any aspect of this document, the inductor platform and the first surface of the inductor each include at least one groove.

[0008] In any aspect of this document, the inductor platform and the first surface of the inductor each include at least one pin protruding from the inductor platform and the first surface of the inductor.

[0009] In any aspect of this document, at least one pin of the inductor platform is disposed between at least one recess.

[0010] In any aspect of this document, at least one pin of the first surface of the inductor is disposed between at least one recess.

[0011] In any aspect of this article, an adhesive is provided within the groove.

[0012] In any aspect of this article, the inductor has a square or round shape.

[0013] In any aspect of this document, the first PCB includes at least one power device chip disposed on a first surface of the first PCB.

[0014] In any aspect of this document, the first PCB also includes an input capacitor disposed on a first surface of the first PCB and surrounding at least one power device chip.

[0015] In any aspect of this document, the power module also includes a third PCB, which is disposed parallel to the inductor on the third surface of the inductor.

[0016] In any aspect of this document, the third PCB transmits and receives signals from the first PCB and the second PCB.

[0017] In any aspect of this paper, the third surface of the inductor is orthogonal to the first and second surfaces of the inductor.

[0018] In any aspect of this article, the third PCB and the inductor are positioned between the first PCB and the second PCB.

[0019] In any aspect of this article, the number of output capacitors disposed below the inductor and between the second surface of the inductor and the first surface of the second PCB is greater than the number of output capacitors not disposed below the inductor.

[0020] A multiphase power module includes multiple output voltage nodes, an inductor including multiple inductor groups, and a first printed circuit board (PCB) orthogonally disposed to the inductor at a first surface of the inductor. The first PCB includes a first surface and a second surface. The multiphase power module also includes multiple power chips disposed on the first surface of the first PCB, a second PCB orthogonally disposed to the inductor at a second surface of the inductor via an inductor platform, and multiple output capacitors disposed on the first surface of the second PCB. The multiple power chips are coupled to the multiple inductors to provide multiple output voltages at the multiple output voltage nodes, and at least some of the multiple output capacitors are disposed below the inductors, between the second surface of the inductors and the first surface of the second PCB. Furthermore, the multiple output capacitors are coupled to the multiple voltage nodes.

[0021] In any aspect of this document, the inductor platform and the first surface of the inductor each include at least one groove.

[0022] In any aspect of this document, the inductor platform and the first surface of the inductor each include at least one pin protruding from the inductor platform and the first surface of the inductor.

[0023] In any aspect of this document, at least one pin of the inductor platform is disposed between at least one recess.

[0024] In any aspect of this document, at least one pin of the first surface of the inductor is disposed between at least one recess.

[0025] A method for manufacturing a multiphase power module includes: setting an inductor; setting a first printed circuit board (PCB) orthogonal to the inductor at a first surface of the inductor; and setting a second PCB orthogonal to the inductor at a second surface of the inductor via an inductor platform. The second surface of the inductor is opposite to the first surface of the inductor. The method further includes: setting a plurality of output capacitors on the first surface of the second PCB; and setting at least some of the plurality of output capacitors below the inductor and between the second surface of the inductor and the first surface of the second PCB. Attached Figure Description

[0026] Figure 1 This is a block diagram illustrating a schematic configuration of a multiphase power module according to an embodiment of the present disclosure.

[0027] Figure 2 This is a perspective view of a multiphase power supply module according to an embodiment of the present disclosure.

[0028] Figure 3A and 3B This is an exploded perspective view of a multiphase power supply module according to an embodiment of the present disclosure.

[0029] Figure 4 This is a side view of a multiphase power supply module according to an embodiment of the present disclosure.

[0030] Figure 5A and Figure 5B This is a perspective view of the inductor of a multiphase power module according to an embodiment of the present disclosure.

[0031] Figure 6 This is a block diagram of an electronic device including a power board comprising multiple multiphase power modules, according to an embodiment of the present disclosure.

[0032] Figure 7 A flowchart illustrating a method for manufacturing a multiphase power module according to an embodiment of the present disclosure is shown.

[0033] In the accompanying drawings, similar parts and / or features may have the same reference numerals. Furthermore, various parts of the same type can be distinguished by adding a letter after the reference numeral to differentiate them. If only the first reference numeral is used in the description, the description applies to any similar parts that have the same first reference numeral, regardless of the second reference numeral. Detailed Implementation

[0034] At least one example embodiment relates to a power module. The power module includes an inductor, a first printed circuit board (PCB), and a second PCB. The first PCB is configured to be orthogonal to the inductor at a first surface of the inductor, and the second PCB is configured to be orthogonal to the inductor at a second surface of the inductor via an inductor platform. The second surface of the inductor is opposite to the first surface of the inductor, and the second PCB includes a plurality of output capacitors disposed on the first surface of the second PCB. At least some of the plurality of output capacitors are disposed below the inductor, between the second surface of the inductor and the first surface of the second PCB.

[0035] At least one example embodiment relates to a multiphase power module. The multiphase power module includes multiple output voltage nodes, an inductor including multiple inductor groups, a first printed circuit board (PCB) orthogonally disposed to the inductor at a first surface of the inductor, a second PCB orthogonally disposed to the inductor at a second surface of the inductor via an inductor platform, and multiple power chips disposed on the first surface of the first PCB, wherein the multiple power chips are coupled to the multiple inductors to provide multiple output voltages at the multiple output voltage nodes. The first PCB includes a first surface and a second surface. Multiple output capacitors are disposed on the first surface of the second PCB. Furthermore, at least some of the multiple output capacitors are disposed below the inductor, between the second surface of the inductor and the first surface of the second PCB, and the multiple output capacitors are coupled to the multiple voltage nodes.

[0036] At least one example embodiment relates to a method of manufacturing a multiphase power module. The method includes: setting an inductor; setting a first printed circuit board (PCB) orthogonal to the inductor at a first surface of the inductor; setting a second PCB orthogonal to the inductor at a second surface of the inductor via an inductor platform; setting the first surface of the inductor opposite to the second surface of the inductor; setting a plurality of output capacitors on the first surface of the second PCB; and setting at least some of the plurality of output capacitors below the inductor and between the second surface of the inductor and the first surface of the second PCB.

[0037] This subject matter is described with reference to the accompanying drawings, wherein the same reference numerals are used to refer to the same elements throughout. In the following description, numerous specific details are set forth for ease of explanation in order to provide a full understanding of the invention. However, it will be apparent that the subject matter can be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form to facilitate the description of the invention.

[0038] Furthermore, the term “exemplary” as used herein means intended as an example, instance, or illustration. Any aspect or design described herein as “exemplary” is not necessarily to be construed as superior to other aspects or designs. Rather, the use of the term “exemplary” is intended to present concepts in a concrete manner. As used herein, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or.” That is, unless otherwise stated or clear from the context, “X adopts A or B” is intended to mean any natural inclusive arrangement. That is, if X adopts A; X adopts B; or X adopts both A and B, then “X adopts A or B” is satisfied in any of the foregoing cases. Furthermore, the article “a” as used herein and in the appended claims should generally be construed as meaning “one or more” unless otherwise stated or clear from the context to refer to the singular form. In addition, the term “coupled” as used herein refers to direct or indirect electrical or mechanical coupling.

[0039] The term “converter” as used herein includes, but is not limited to, any one or any combination of “regulator,” “DC regulator,” “voltage regulator,” “DC voltage regulator,” “DC-DC converter,” “DC converter,” and “converter,” and includes, but is not limited to, the literal meaning of any of these terms.

[0040] Figure 1 A schematic diagram of a multiphase power supply module 100 according to an embodiment of the present disclosure is shown. Figure 1 In the example, the multiphase power module 100 includes a pulse width modulated (PWM) controller (not shown), two power supply units 121 and 131, two inductors 148 and 152 for supplying power to a load (not shown), two output capacitors 140 and 144, and an input capacitor 136. Each of the power supply units 121 and 131, inductors 148 and 152, input capacitor 136, and output capacitors 140 and 144 represents a power stage 190 and 195 of the multiphase power module 100. Power supply units 121 and 131 each include power switches 120, 124, 128, and 132, and phase drivers, control, and detection units 184 and 188 for driving the power switches 120, 124, 128, and 132. Control and detection units 184 and 188 provide detection functions (the power stage detects current / temperature signals and sends this information to the controller) and control functions (e.g., implementing current sharing, overcurrent / overtemperature protection, etc.).

[0041] According to one embodiment of this disclosure, the multiphase power module 100 may be a buck converter. It is understood that the multiphase power module 100 may also be configured as a boost converter or other types of power converters, depending on the application. Each phase of the multiphase power module 100 may be connected to provide a multiphase output voltage at voltage output nodes 156, 172.

[0042] According to one embodiment of this disclosure, power supply devices 121 and 131 receive input voltages VIN 104 and VCC 112, respectively, to generate output voltage VOUT1 at voltage output node 156 and VOUT2 at voltage output node 172, respectively. The output voltages VOUT1 and VOUT2 of power supply devices 121 and 131 can be connected together and interleaved to generate multiphase output voltages. For example, output voltage nodes 156 and 172 can be connected together, wherein power supply devices 121 and 131 each provide one phase of the multiphase output voltage.

[0043] Output capacitor 140 is connected to output voltage node 156, and output capacitor 144 is connected to output voltage node 172. Figure 1 In the example, output capacitor 140 has a first terminal connected between inductor 148 and output voltage node 156 and a second terminal connected to ground 160. Similarly, output capacitor 144 has a first terminal connected between inductor 152 and output voltage node 172 and a second terminal connected to ground 160. For clarity, Figure 1 Other capacitors (e.g., input capacitor 136, power supply capacitor, etc.) and other components not shown are unnecessary for understanding the invention.

[0044] In one embodiment of this disclosure, power supply devices 121, 131 use MP86976 Intelli-Phase. TM The solution is implemented using a single-chip IC, which is available from Monolithic Power Systems, Inc. Other suitable single-chip ICs may also be used without compromising the advantages of this disclosure. Phase 1 drivers, control and detection units 184 and 188, and a pair of switches (e.g., metal-oxide-semiconductor field-effect transistors (MOSFETs)) are integrated into power supply units 121 and 131. Figure 1 As shown, the power supply unit 121 has a first pin for receiving a PWM1 signal 108, a second pin for receiving an input voltage VIN 104, a third pin for connecting to ground 160, a fourth pin for connecting to a switching node 125 formed by power switches 120 and 124, a fifth pin for connecting to an enable (EN) signal 110 (e.g., providing remote on / off functionality), a sixth pin for connecting to an enable current sensor (ISEN1) signal 164, and a seventh pin for connecting to an enable temperature sensor (TENS1) 168. The drain of power switch 120 is connected to the input voltage VIN 104, and the source of power switch 124 is connected to ground 160. The source of power switch 120 is connected to the drain of power switch 124 at the switching node 125.

[0045] Furthermore, the power supply unit 131 has a first pin for receiving the PWM2 signal 116, a second pin for receiving the input voltage VCC 112, a third pin for connecting to ground 160, a fourth pin for connecting to the switching node 135 formed by power switches 128 and 132, a fifth pin for connecting to the enable (EN) signal 110, a sixth pin for connecting to the enable current sensor (ISEN2) signal 176, and a seventh pin for connecting to the enable temperature sensor (TENS2) 180. The drain of power switch 128 is connected to the input voltage VCC 112, and the source of power switch 132 is connected to ground 160. The source of power switch 128 is connected to the drain of power switch 132 at the switching node 135.

[0046] PWM control is well known in the art. In short, an external PWM controller generates a PWM1 signal, which is received by the power supply unit 121 through its first pin. The phase 1 driver, control, and detection unit 184 turns power switches 120 and 124 on and off according to the PWM1 signal 108. When power switch 120 is on and power switch 124 is off, the input voltage VIN104 (through power switch 120) is connected to switch node 125; however, when power switch 120 is off and power switch 124 is on, switch node 125 (through power switch 124) is connected to ground 160. The first terminal of inductor 148 is connected to switch node 125, and the second terminal of inductor 148 is connected between output voltage node 156 and output capacitor 140, whereby the output voltage VOUT1 is generated.

[0047] In addition, an external PWM controller generates a PWM2 signal 116, which is received by a phase 2 driver, control, and detection unit 188 at the first pin of the power supply unit 131. The phase 2 driver, control, and detection unit 188 turns power switches 128 and 132 on and off according to the PWM2 signal 116. When power switch 128 is on and power switch 132 is off, the input voltage VCC 112 (through power switch 128) is connected to the switching node 135; however, when power switch 128 is off and power switch 132 is on, the switching node 135 (through power switch 132) is connected to ground 160. The first terminal of inductor 152 is connected to the switching node 135, and the second terminal of inductor 152 is connected between the output voltage node 172 and the output capacitor 144, where an output voltage VOUT2 is generated.

[0048] exist Figure 1In the example, the external PWM controller generates PWM signals PWM1 108 and PWM2 116, which keep the corresponding output voltages VOUT1 156 and VOUT2 172 stable. For ease of illustration, other circuitry used to implement PWM control, such as sensing circuitry (e.g., control and sensing circuitry similar to those discussed above), is not shown.

[0049] The input voltages VIN 104 and VCC 112, the output voltages VOUT1 156 and VOUT2 172, and the switching frequencies of power switches 120, 124, 128, and 132 depend on the details of the monolithic IC switching block. In one embodiment of this disclosure, the monolithic IC switching block employs the aforementioned MP86976 Intelli-Phase. TM The solution is implemented using a monolithic IC, with input voltages VIN 104 and VCC 112 ranging from 3V to 7V, output voltages VOUT1 156 and VOUT2 172 ranging from 0.4V to 2V (e.g., 0.8V), and power switches 120, 124, 128, and 132 operating at frequencies ranging from 1MHz to 2MHz (e.g., 1.5MHz). The relatively low input voltages VIN 104 and VCC 112, along with the relatively high switching frequencies of power switches 120, 124, 128, and 132, allow for relatively small physical dimensions of output inductors 148 and 152 (e.g., 2.5mm × 5mm × 1.2mm).

[0050] According to one embodiment of this disclosure, the input voltage VIN 104 can be in the range of 4.5V to 15V, the input voltage VCC 112 can be 5V, the output voltages VOUT1 156 and VOUT2 172 can be in the range of 0.75V to 1.3V, and the switching frequency can be in the range of 500kHz to 1MHz.

[0051] Figure 2This is a perspective view of a multiphase power module 200 according to an embodiment of the present disclosure. The multiphase power module 200 typically includes a top printed circuit board (PCB) 204, a bottom PCB 208, a vertical PCB 212 disposed between the top PCB 204 and the bottom PCB 208, and an inductor 230 disposed between the top PCB 204 and the bottom PCB 208 and parallel to the vertical PCB 212. The vertical PCB 212 is used to transmit and receive signals from the top PCB 204 and the bottom PCB 208. Furthermore, the vertical PCB 212 includes an inner copper layer and serves as an interface between the top PCB 204 and the bottom PCB 208. By incorporating the vertical PCB 212, alternating current (AC) losses can be reduced and the interference immunity of the two-phase power module can be improved, thereby improving the performance of the multiphase power module 200.

[0052] According to embodiments of this disclosure, a vertical PCB 212 is used as a connector between a top PCB 204 and a bottom PCB 208. The vertical PCB 212 is attached to the top PCB 204 and the bottom PCB 208 via, for example, a solder plate. The vertical PCB 212 is, for example, a multilayer board. The multilayer structure of the vertical PCB 212 facilitates power input through the staggered design between the layers of the vertical PCB 212. Furthermore, since the vertical PCB 212 is positioned close to the inductor 230, it acts as a shield to prevent signal interference from the inductor 230. According to a further embodiment of this disclosure, the vertical PCB 212 also includes a half-hole design in the solder edge to enhance the solderability of the vertical PCB 212.

[0053] Inductor 230 may include an inductor bank comprising multiple inductors. Inductor 230 includes an inductor winding embedded in a core. The inductor winding is made of, for example, copper and has a cylindrical shape. The inductor core is made of, for example, metal powder and has a generally U-shaped structure.

[0054] The top PCB 204 includes two power device chips 216 and 220, and discrete components 224. Discrete components 224 may include resistors and capacitors for the multiphase power module 200, such as input capacitors providing pulse current at the input, filter capacitors and resistors for powering the drivers and internal logic circuits, etc. Power device chips 216 and 220 each have one or more pins that are connected via the top PCB 204 to one end of an inductor 230 in an inductor group, where each inductor includes a winding.

[0055] The bottom PCB 208 includes an output capacitor 228. As discussed in more detail below, the output capacitor 228 is disposed around the inductor 230, or below the inductor 230, between the bottom surface of the inductor 230 and the top surface of the bottom PCB 208.

[0056] The two power device chips 216 and 220 represent the above. Figure 1 The two power stages 190 and 195 are discussed in the text. According to... Figure 2 The embodiment of this disclosure shown includes a multiphase power module 200 comprising an integrated power stage with a continuous output current of 80 amperes (A) and a peak current of 140 A. The multiphase power module 200 occupies a footprint of only 0.9 cm². 2 (0.14in 2 According to a further embodiment of this disclosure, the multiphase power module 200 includes a planar grid array (LGA) or solder bump termination for connecting the multiphase power module 200 to a motherboard.

[0057] Figure 3A and 3B This is an exploded perspective view of a multiphase power supply module 200 according to an embodiment of the present disclosure. Figure 3A and Figure 3B As shown, inductor 230 includes a top side 336 and a bottom side 316. An inductor platform 320 is disposed on the bottom side 316 of inductor 230. According to an embodiment of this disclosure, inductor platform 320 includes at least one recess 340 and a plurality of leads 334. The at least one recess 340 includes an adhesive (e.g., glue) to secure the inductor platform 320 of inductor 230 to the top surface 312 of bottom PCB 208. Furthermore, the plurality of leads 334 provide conductivity between inductor 230 and bottom PCB 208. Inductor platform 320 is configured to raise the bottom surface 316 of inductor 230 from the top surface 312 of bottom PCB 208. By incorporating inductor platform 320, a plurality of output capacitors 228 can be directly disposed on the top surface 312 of bottom PCB 208.

[0058] Multiple output capacitors 228 may be disposed around or below the inductor 230. According to embodiments of this disclosure, the inductor platform 320 raises the inductor from the top surface 312 of the bottom PCB 208 by, for example, 0.9 mm to 1.1 mm. According to further embodiments of this disclosure, at least 24 output capacitors 228 (e.g., 0402 output capacitors) are disposed around and below the inductor 230. The number of output capacitors 228 disposed around and below the inductor 230 depends on the size of the output capacitors 228. This arrangement of the output capacitors 228 around or below the inductor 230 reduces the overall space occupied by the multiphase power module 200 on the electronic device motherboard. Furthermore, the entire space of the bottom PCB 208 can be utilized.

[0059] Similarly, Figure 3A and Figure 3B As shown, the top side 336 of the inductor 230 includes at least one recess 340 and a plurality of pins 334. The at least one recess 340 includes an adhesive to secure the top side 336 to the bottom side 304 of the top PCB 204. Furthermore, the plurality of pins 334 provide conductivity between the top PCB 204 and the inductor 230.

[0060] Figure 4 This is a side view of a multiphase power module 200 according to an embodiment of the present disclosure. According to an embodiment of the present disclosure, the inductor 230 may have a square or circular shape.

[0061] Figure 5A and Figure 5B This is a perspective view of the inductor 230 of a multiphase power module 200 according to an embodiment of the present disclosure. Figure 5A and Figure 5B As shown, inductor 230 includes a top side 336 and a bottom side 316, with an inductor platform 320 disposed on the bottom side 316 of inductor 230. At least one recess 340 and a plurality of pins 344 are provided on the inductor platform 320 and the top side 336 of inductor 230. The depth of at least one recess 340 is approximately 0.2 mm (implemented during the fabrication of the multiphase power module 200). As described above, at least one recess 340 is used to accommodate adhesive (e.g., glue) to secure inductor 230 to the corresponding top PCB 204 and bottom PCB 208, thereby meeting the inverted reflow requirements during the manufacturing process of multiphase power module 200.

[0062] Multiple pins 334 provide electrical conduction between inductor 230 and the top PCB 204 and bottom PCB 208. (As...) Figure 5BAs shown, the top surface 336 of the inductor 230 also includes a plurality of slots 500 arranged around a plurality of pins 334. The plurality of slots 500 have a thickness of approximately 0.05 mm and are used to release gases generated during the soldering process in the manufacture of the multiphase power module 200. By providing a plurality of slots 500 with a thickness of approximately 0.05 mm, the risk of solder balls being generated during the soldering process can be significantly reduced.

[0063] Figure 6 This is a block diagram of an electronic device 600 according to one embodiment of the present disclosure, including a power board 604 comprising multiple multiphase power modules 200. The electronic device 600 includes at least one instance of an integrated circuit 608 coupled to an external memory 612. The integrated circuit 608 may include a memory controller coupled to the external memory 612. The integrated circuit 608 is coupled to one or more peripheral devices 616 and the external memory 612. A power board 604 is also provided, which provides power voltages to the integrated circuit 608 and one or more power voltages to the memory 612 and / or the peripheral devices 616. In some embodiments of the present disclosure, more than one instance of the integrated circuit 608 may be included (and multiple external memories 612 may also be included).

[0064] Power board 604 includes multiple multiphase power modules 200A-200N (as described above) arranged within electronic device 600 to support the power requirements of electronic device 600, components, and / or peripheral devices 616. Based on the power requirements of electronic device 600, the number of multiphase power modules 200A-200N used by electronic device 600 can be increased to meet its power requirements. Specifically, if electronic device 600 requires a peak current greater than 600A for a graphics processing unit (GPU) or central processing unit (CPU), eight multiphase power modules 200A-200N can be arranged within electronic device 600 to provide 800A-880A. In some aspects of this disclosure, by integrating the power converter onto the inductor core, as described above, power board 604 can provide high current in a smaller footprint than conventional power supplies (which arrange components side-by-side), while reducing or eliminating electromagnetic and / or acoustic noise (as described above). In another aspect of this disclosure, each of the plurality of multiphase power modules 200A-200N supplies current to the load during operation with a common target output voltage.

[0065] Peripheral device 616 may include any desired circuitry, depending on the type of electronic device 600. For example, in one embodiment of this disclosure, electronic device 600 may be a mobile device (e.g., a personal digital assistant (PDA), tablet, laptop, smartphone, etc.), and peripheral device 616 may include devices for various types of wireless communication, such as WiFi, Bluetooth, cellular, GPS, etc. Peripheral device 616 may also include additional memory, including RAM, solid-state memory, or disk storage. Peripheral device 616 may include user interface devices, such as a display (including a touchscreen or multi-touchscreen), a keyboard or other input device, a microphone, a speaker, etc. In other embodiments of this disclosure, electronic device 600 may be any type of computing system (e.g., a desktop PC, workstation, watch, wearable device, and / or other types of computing systems).

[0066] External memory 612 may include any type of memory. For example, external memory 612 may be SRAM, dynamic RAM (DRAM) such as synchronous DRAM (SDRAM), double data rate (DDR, DDR2, DDR3, LPDDR1, LPDDR2, etc.) SDRAM, RAMBUSDRAM, etc. External memory 612 may include one or more memory modules with memory devices mounted on them, such as single in-line memory modules (SIMM), dual in-line memory modules (DIMM), etc.

[0067] Figure 7 A flowchart illustrating a method 700 for manufacturing a multiphase power module according to an embodiment of the present disclosure is shown. Although Figure 7 The diagram illustrates the general sequence of steps in a method 700 for manufacturing a multiphase power module according to one embodiment of the present disclosure; however, method 700 may include more or fewer steps, or may be implemented in a different manner. Figure 7 The steps are arranged in the order shown. Furthermore, two or more steps can be combined into one step. Typically, method 700 begins with START operation 704 and ends with END operation 732. Method 700 will be described here with reference to the aforementioned system, components, modules, etc.

[0068] Method 700 can begin with START operation 704 and proceed to step 708, which involves setting the inductor. After setting the inductor in step 708, method 700 proceeds to step 712, where a first printed circuit board (PCB) orthogonal to the inductor is set at the first surface of the inductor. After setting the first PCB orthogonal to the inductor at the first surface of the inductor in step 712, method 700 proceeds to step 716, where a second PCB orthogonal to the inductor is set at the second surface of the inductor via an inductor platform.

[0069] After setting a second PCB orthogonal to the inductor at the second surface of the inductor via an inductor platform in step 716, method 700 proceeds to step 720, in which the second surface of the inductor is positioned opposite to the first surface of the inductor. After positioning the second surface of the inductor opposite to the first surface of the inductor in step 720, method 700 proceeds to step 724, in which a plurality of output capacitors are positioned on the first surface of the second PCB. After positioning the plurality of output capacitors on the first surface of the second PCB in step 724, method 700 proceeds to step 728, in which at least some of the plurality of output capacitors are positioned below the inductor and between the second surface of the inductor and the first surface of the second PCB. After positioning at least some of the plurality of output capacitors below the inductor and between the second surface of the inductor and the first surface of the second PCB in step 728, method 700 continues to END operation 732, at which point method 700 can terminate.

[0070] Any steps, functions, and operations discussed in this article can be performed continuously and automatically.

[0071] Exemplary apparatuses, systems, and methods of this disclosure have been described in relation to power converters. However, to avoid unnecessarily obscuring this disclosure, many known structures and apparatuses have been omitted from the foregoing description. Such omissions should not be construed as limiting the scope of the claimed disclosure. Specific details have been set forth to provide an understanding of this disclosure. However, it should be understood that this disclosure can be practiced in various ways beyond the specific details set forth herein.

[0072] Furthermore, while the exemplary embodiments shown herein depict the juxtaposition of various system components, some components may be remotely located, situated at a distance within a distributed network (e.g., a LAN and / or the Internet), or within a dedicated system. Therefore, it should be appreciated that system components may be combined into one or more devices, such as servers, communication equipment, or juxtaposed on specific nodes of a distributed network (e.g., analog and / or digital telecommunications networks, packet-switched networks, or circuit-switched networks). As can be understood from the foregoing description, system components can be deployed anywhere within a distributed component network for computational efficiency reasons without affecting system operation.

[0073] Furthermore, it should be recognized that the various links connecting the elements can be wired or wireless links, or any combination thereof, or any other known or later-developed element capable of providing data to and / or transmitting data from the connected elements. These wired or wireless links can also be secure links and can be capable of transmitting encrypted information. The transmission medium used as the link can be, for example, any carrier suitable for electrical signals, including coaxial cables, copper wires, and optical fibers, and can take the form of sound waves or light waves, such as those generated during radio wave and infrared data communication.

[0074] While flowcharts have been discussed and illustrated for specific sequences of events, it should be recognized that these sequences can be modified, added to, and omitted without materially affecting the operation of the disclosed embodiments, configurations, and aspects.

[0075] Various variations and modifications of this disclosure may be used. Some features of this disclosure may be provided without providing others.

[0076] In yet another embodiment, the systems and methods of this disclosure can be implemented in conjunction with a dedicated computer, a programmable microprocessor or microcontroller and peripheral integrated circuit elements, an ASIC or other integrated circuit, a digital signal processor, hardwired electronic or logic circuitry (e.g., discrete component circuitry), a programmable logic device or gate array (e.g., PLD, PLA, FPGA, PAL), a dedicated computer, any similar apparatus, etc. Generally, any device or apparatus capable of implementing the methods described herein can be used to implement various aspects of this disclosure. Exemplary hardware that can be used with this disclosure includes computers, handheld devices, telephones (e.g., cellular phones, internet-enabled phones, digital phones, analog phones, hybrid phones, etc.), and other hardware known in the art. Some of these devices include processors (e.g., single or multiple microprocessors), memory, non-volatile memory, input devices, and output devices. Furthermore, alternative software implementations can be constructed to implement the methods described herein, including but not limited to distributed processing or component / object distributed processing, parallel processing, or virtual machine processing.

[0077] In yet another embodiment, the disclosed method can be readily implemented in conjunction with software from object-oriented or object-based software development environments that provide portable source code usable on various computer or workstation platforms. Alternatively, the disclosed system can be implemented in hardware, partially or entirely, using standard logic circuitry or VLSI designs. Whether a system according to this disclosure is implemented using software or hardware depends on the system's speed and / or efficiency requirements, specific functionalities, and the particular software or hardware system or microprocessor or microcomputer system used.

[0078] In yet another embodiment, the disclosed method can be implemented in part in software, which can be stored on a storage medium and executed on a programmed general-purpose computer, special-purpose computer, microprocessor, etc., in cooperation with a controller and memory. In these cases, the systems and methods of this disclosure can be implemented as programs embedded in a personal computer (e.g., applets, etc.). This can be implemented as a resource residing on a server or computer workstation, or as a routine embedded in a dedicated measurement system, system component, etc. The system can also be implemented by physically incorporating the system and / or methods into the software and / or hardware system.

[0079] While this disclosure describes components and functionalities implemented in embodiments with reference to specific standards and protocols, this disclosure is not limited to such standards and protocols. Other similar standards and protocols not mentioned herein exist and are considered to be included in this disclosure. Furthermore, the standards and protocols mentioned herein, as well as other similar standards and protocols not mentioned herein, are regularly superseded by faster or more efficient equivalents having substantially the same functionality. Such alternative standards and protocols having the same functionality are considered to be equivalents included in this disclosure.

[0080] This disclosure includes components, methods, processes, systems, and / or apparatuses substantially identically depicted and described herein in various embodiments, configurations, and aspects, including various embodiments, sub-combinations, and subsets thereof. Those skilled in the art, upon understanding this disclosure, will learn how to make and use the systems and methods disclosed herein. In various embodiments, configurations, and aspects, this disclosure includes providing devices and methods in the absence of items not shown and / or described herein, or providing devices and methods in various embodiments, configurations, or aspects in the absence of those items that may have been used in prior devices or processes, for example, to improve performance, achieve ease of use, and / or reduce implementation costs.

[0081] The foregoing discussion of this disclosure is for illustrative and descriptive purposes. The foregoing is not intended to limit this disclosure to one or more of the forms disclosed herein. For example, in the foregoing detailed description, various features of this disclosure are combined in one or more embodiments, configurations, or aspects to simplify the disclosure. Features of embodiments, configurations, or aspects of this disclosure may be combined in alternative embodiments, configurations, or aspects other than those described above. This approach to disclosure should not be construed as reflecting an intention that the claimed disclosure requires more features than expressly recited in each claim. Rather, as reflected in the following claims, the inventive aspect is present in all features of a single foregoing disclosed embodiment, configuration, or aspect. Therefore, the following claims are hereby incorporated into this detailed description, each claim being an independent, preferred embodiment of this disclosure.

[0082] Furthermore, while the description of this disclosure includes descriptions of one or more embodiments, configurations, or aspects, as well as certain variations and modifications, other variations, combinations, and modifications are possible upon understanding this disclosure, within the scope of this disclosure, for example, within the skill and knowledge of those skilled in the art. It is intended to obtain rights by including alternative embodiments, configurations, or aspects (to the permissible extent), including structures, functions, scopes, or steps that are substitutes, interchangeable, and / or equivalent to the claimed structure, function, scope, or steps, regardless of whether such substitutes, interchangeable, and / or equivalent structures, functions, scopes, or steps are disclosed herein, and is not intended to disclose any patentable subject matter.

[0083] The phrases “at least one,” “one or more,” “or,” and “and / or” are open-ended expressions that function as both conjunctions and separators. For example, each of the expressions “at least one of A, B, and C,” “at least one of A, B, or C,” “one or more of A, B, and C,” “one or more of A, B, or C,” and “A, B, and / or C” indicates a single A, a single B, a single C, a combination of A and B, a combination of A and C, a combination of B and C, or a combination of A, B, and C.

[0084] The term "a" refers to one or more of the entities in question. Therefore, the terms "a," "one or more," and "at least one" are used interchangeably herein. It should also be noted that the terms "comprising," "including," and "having" are used interchangeably.

[0085] As used herein, the term "automatic" and its variations refer to any process or operation, typically continuous or semi-continuous, that can be performed without substantial human input. However, a process or operation can be automatic if input is received before its execution, even if the execution of the process or operation uses substantial or non-substantial human input. Human input is considered substantial if it influences how a process or operation is performed. Human input consenting to the execution of a process or operation is not considered "substantial."

[0086] The aspects of this disclosure may take the form of an embodiment that is entirely hardware, an embodiment that is entirely software (including firmware, resident software, microcode, etc.), or an embodiment that combines software and hardware aspects, which are generally referred to herein as a "circuit," a "module," or a "system." Any combination of one or more computer-readable media may be used. The computer-readable media may be a computer-readable signal medium or a computer-readable storage medium.

[0087] Computer-readable storage media can be, for example, but not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatuses, or devices, or any suitable combination thereof. More specific examples (a non-exhaustive list) of computer-readable storage media include the following: electrical connections having one or more wires; portable computer disks; hard disks; random access memory (RAM); read-only memory (ROM); erasable programmable read-only memory (EPROM or flash memory); optical fiber; portable optical disc read-only memory (CD-ROM); optical storage devices; magnetic storage devices; or any suitable combination thereof. In the context of this document, a computer-readable storage medium can be any tangible medium that can contain or store programs for use by or in connection with an instruction execution system, apparatus, or device.

[0088] Computer-readable signal media can include propagated data signals embodying computer-readable program code, for example, in baseband or as part of a carrier wave. Such propagated signals can take many forms, including but not limited to electromagnetic, optical, or any suitable combination thereof. A computer-readable signal medium can be any computer-readable medium that is not a computer-readable storage medium and can communicate, propagate, or transmit programs for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer-readable medium can be transmitted using any suitable medium, including but not limited to wireless, wired, fiber optic cable, RF, etc., or any suitable combination thereof.

[0089] The terms “determine,” “calculate,” and their variations, as used herein, are used interchangeably and include any type of method, process, mathematical operation, or technique.

[0090] This disclosure includes, in various aspects, embodiments, and / or configurations, components, methods, processes, systems, and / or apparatuses substantially as described and illustrated herein, including aspects, embodiments, configuration embodiments, sub-combinations, and / or subsets. Those skilled in the art, upon understanding this disclosure, will learn how to make and use the disclosed aspects, embodiments, and / or configurations. This disclosure includes, in various aspects, embodiments, and / or configurations, providing devices and processes in the absence of items not described and / or not described herein, or providing devices and processes in various aspects, embodiments, and / or configurations herein, including the absence of items that may have been used in prior devices or processes, for example, to improve performance, achieve ease of implementation, and / or reduce implementation costs.

[0091] The foregoing discussion is for illustrative and descriptive purposes. It is not intended to limit this disclosure to one or more of the forms disclosed herein. For example, in the foregoing detailed description, various features of this disclosure are combined in one or more aspects, embodiments, and / or configurations to simplify the disclosure. Features of aspects, embodiments, and / or configurations of this disclosure may be combined in alternative aspects, embodiments, and / or configurations other than those described above. This approach to the disclosure should not be construed as reflecting an intention that the claims require more features than expressly recited in each claim. Rather, as reflected in the following claims, the inventive aspect is present in all features of a single foregoing aspect, embodiment, and / or configuration. Therefore, the following claims are hereby incorporated into this detailed description, each claim being an independent preferred embodiment of this disclosure.

[0092] Furthermore, although this specification includes descriptions of one or more aspects, embodiments, and / or configurations, as well as certain variations and modifications, other variations, combinations, and modifications will also fall within the scope of this disclosure upon understanding it, for example, those variations, combinations, and modifications that may be apparent to those skilled in the art within their skill and knowledge. It is intended to obtain the right to include alternative aspects, embodiments, and / or configurations to the permissible extent, including substitutions, interchangeable and / or equivalent structures, functions, scopes, or steps to the claimed structure, function, scope, or steps, whether such substitutions, interchangeable and / or equivalent structures, functions, scopes, or steps are disclosed herein, and it is not intended to disclose any patentable subject matter.

Claims

1. A power module, characterized in that, The power module includes: Inductor; A first printed circuit board, the first printed circuit board being orthogonal to the inductor at a first surface of the inductor; and A second printed circuit board, which is orthogonal to the inductor at the second surface of the inductor via an inductor platform. The second surface of the inductor is opposite to the first surface of the inductor. The second printed circuit board includes a plurality of output capacitors disposed on a first surface of the second printed circuit board. At least some of the plurality of output capacitors are disposed below the inductor and between the second surface of the inductor and the first surface of the second printed circuit board.

2. The power module according to claim 1, characterized in that, The inductor platform and the first surface of the inductor each include at least one groove.

3. The power module according to claim 2, characterized in that, The inductor platform and the first surface of the inductor each include at least one pin, the at least one pin protruding from the inductor platform and the first surface of the inductor.

4. The power module according to claim 3, characterized in that, The at least one pin of the inductor platform is disposed between the at least one recess.

5. The power module according to claim 4, characterized in that, The at least one pin on the first surface of the inductor is disposed between the at least one groove.

6. The power module according to claim 5, characterized in that, An adhesive is provided inside the groove.

7. The power module according to claim 1, characterized in that, The inductor is square or round in shape.

8. The power module according to claim 1, characterized in that, The first printed circuit board includes at least one power device chip disposed on a first surface of the first printed circuit board.

9. The power module according to claim 8, characterized in that, The first printed circuit board also includes a plurality of input capacitors disposed on the first surface of the first printed circuit board and surrounding the at least one power device chip.

10. The power module according to claim 1, characterized in that, The power module also includes a third printed circuit board, which is disposed parallel to the inductor on the third surface of the inductor.

11. The power module according to claim 10, characterized in that, The third printed circuit board sends and receives signals from the first printed circuit board and the second printed circuit board.

12. The power module according to claim 10, characterized in that, The third surface of the inductor is orthogonal to the first and second surfaces of the inductor.

13. The power module according to claim 10, characterized in that, The third printed circuit board and the inductor are disposed between the first printed circuit board and the second printed circuit board.

14. The power module according to claim 1, characterized in that, Below the inductor, between the second surface of the inductor and the first surface of the second printed circuit board, there are more output capacitors than there are output capacitors not located below the inductor.

15. A multiphase power supply module, characterized in that, The multiphase power module includes: Multiple output voltage nodes; Inductors including multiple inductor groups; A first printed circuit board is orthogonally disposed to the inductor at a first surface of the inductor, and the first printed circuit board includes a first surface and a second surface. Multiple power chips are disposed on the first surface of the first printed circuit board, and the multiple power chips are coupled to the multiple inductors to provide multiple output voltages at the multiple output voltage nodes; A second printed circuit board is disposed orthogonally to the inductor at the second surface of the inductor via an inductor platform. A plurality of output capacitors are disposed on a first surface of the second printed circuit board, at least some of the plurality of output capacitors are disposed below the inductor and between the second surface of the inductor and the first surface of the second printed circuit board, and the plurality of output capacitors are coupled to the plurality of voltage nodes.

16. The multiphase power supply module according to claim 15, characterized in that, The inductor platform and the first surface of the inductor each include at least one groove.

17. The multiphase power supply module according to claim 16, characterized in that, The inductor platform and the first surface of the inductor each include at least one pin, the at least one pin protruding from the inductor platform and the first surface of the inductor.

18. The multiphase power supply module according to claim 17, characterized in that, The at least one pin of the inductor platform is disposed between the at least one recess.

19. The multiphase power supply module according to claim 18, characterized in that, The at least one pin on the first surface of the inductor is disposed between the at least one groove.

20. A method for manufacturing a multiphase power supply module, characterized in that, The method includes: Install an inductor; A first printed circuit board orthogonal to the inductor is disposed on the first surface of the inductor; A second printed circuit board is provided, orthogonal to the inductor at the second surface of the inductor via an inductor platform, wherein the second surface of the inductor is opposite to the first surface of the inductor; A plurality of output capacitors are disposed on the first surface of the second printed circuit board; and At least some of the plurality of output capacitors are disposed below the inductor, between the second surface of the inductor and the first surface of the second printed circuit board.

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