Portable hybrid heat sink module, high heat flux electronic device and method of detecting same

Abstract

Provided are a portable hybrid heat dissipation module, a high heat flux electronic device, and a detection method thereof. The portable hybrid heat dissipation module includes a boiling enhancement coating plate, a housing, and a cooling mechanism. The boiling enhancement coating plate includes a boiling enhancement coating. The housing is formed with a dual-phase chamber, and the boiling enhancement coating plate is combined with the housing to seal the dual-phase chamber. The cooling mechanism is disposed in the housing corresponding to the dual-phase chamber.

Description

Technical Field

[0001] This invention generally relates to a portable hybrid heat dissipation module; more specifically, it relates to a portable hybrid heat dissipation module that dissipates heat through phase change and heat exchange, a high heat flux electronic device including the portable hybrid heat dissipation module, and a method for detecting the heat dissipation performance of the portable hybrid heat dissipation module. Background Technology

[0002] Two-phase cooling is a novel technology for server heat dissipation in recent years. It effectively enhances heat dissipation through a highly efficient phase change phenomenon to address the increasing heat density (or heat flux) of chips. However, the two-phase liquids used in two-phase cooling are generally special low-boiling-point liquids, making them extremely expensive and prone to evaporation. Furthermore, heat sinks or cooling modules require 100% performance testing before mass production, forcing manufacturers to not only build entirely new testing equipment for two-phase cooling but also deal with significant losses of the two-phase liquids caused by testing.

[0003] Furthermore, commercially available heat dissipation modules or test prototypes are generally too large, making it impossible to customize and simplify the size of a single dual-phase heatsink. Summary of the Invention

[0004] One objective of this invention is to provide a portable hybrid heat dissipation module that achieves efficient hybrid heat dissipation through phase change heat dissipation and heat exchange, and is suitable for high heat flux (or high heat generation) electronic devices.

[0005] Another objective of this invention is to provide a portable hybrid heat dissipation module that integrates a housing with a two-phase chamber and a cooling mechanism into a single structure to achieve a design that minimizes volume, thereby reducing the amount and loss of two-phase fluid, and improving the overall structural strength and sealing performance.

[0006] Another object of the present invention is to provide a portable hybrid heat dissipation module, which uses a boiling-enhanced coating plate containing a boiling-enhanced coating (BEC) as a cover of the heat dissipation module housing to seal the two-phase chamber of the housing, thereby reducing the number of components and achieving an airtight effect.

[0007] Another objective of this invention is to provide a portable hybrid heat dissipation module that can adjust the boiling point temperature of a two-phase fluid by adjusting the pressure inside the two-phase chamber, thereby expanding the range of usable two-phase fluids and allowing for the selection of more cost-effective two-phase fluids.

[0008] In one embodiment, the present invention provides a portable hybrid heat dissipation module, which includes a boiling-enhanced coating plate, a housing, and a cooling mechanism, wherein: the housing forms a two-phase chamber, and the boiling-enhanced coating plate is combined with the housing to seal the two-phase chamber; the cooling mechanism is disposed on the housing corresponding to the two-phase chamber.

[0009] In one embodiment, the cooling mechanism includes a coolant inlet, a coolant outlet, and a coolant flow space. The coolant inlet and coolant outlet are formed in the housing, and the coolant flow space communicates with the coolant inlet and coolant outlet and is adjacent to or located within the two-phase chamber.

[0010] In one embodiment, the cooling mechanism includes a plurality of first fins disposed in the housing and located outside the dual-phase chamber.

[0011] In one embodiment, the cooling mechanism further includes a plurality of second fins disposed in the housing and located within the dual-phase chamber.

[0012] In one embodiment, the portable hybrid heat dissipation module of the present invention further includes a sealing ring, wherein the housing has an opening communicating with the two-phase chamber, and the sealing ring is disposed around the opening between the housing and the boiling-enhanced coating plate.

[0013] In one embodiment, the housing has a groove surrounding the cavity opening, and a sealing ring is disposed in the groove.

[0014] In one embodiment, the portable hybrid heat dissipation module of the present invention further includes a fluid inlet, wherein the fluid inlet is disposed in the housing and communicates with the two-phase chamber, and the fluid inlet allows working fluid to flow into the two-phase chamber.

[0015] In one embodiment, the portable hybrid heat dissipation module of the present invention further includes a control valve, wherein the control valve is disposed on the housing corresponding to the fluid inlet to control the communication between the two-phase chamber and the outside through the fluid inlet.

[0016] In one embodiment, the fluid inlet can be selectively used as a regulating gate for the internal pressure of the two-phase chamber.

[0017] In one embodiment, the portable hybrid heat dissipation module of the present invention further includes a coupling member for joining the housing and the boiling-enhanced coating plate, thereby making the two-phase chamber an airtight space.

[0018] In one embodiment, the boiling-enhanced coating plate includes a boiling-enhanced coating and a frame, wherein the frame supports the boiling-enhanced coating and a coupling secures the frame to the housing.

[0019] In one embodiment, the coupling includes a screw, a fastener, or a combination thereof.

[0020] In another embodiment, the present invention provides a high heat flux electronic device comprising the above-described portable hybrid heat dissipation module and high heat flux electronic device, wherein the high heat flux electronic device is combined with a boiling-enhanced coating plate and is located on the outside of the housing.

[0021] In one embodiment, the portable hybrid heat dissipation module further includes a fluid inlet disposed in the housing and communicating with the two-phase chamber, and the fluid inlet can selectively serve as a regulating gate for the internal pressure of the two-phase chamber.

[0022] In one embodiment, the boiling-enhanced coating plate includes a boiling-enhanced coating and a frame, the frame supporting the boiling-enhanced coating and fixing it to the housing, and high heat flux electronic devices are combined with the boiling-enhanced coating.

[0023] In yet another embodiment, the present invention provides a method for testing a portable hybrid heat dissipation module, comprising: using the above-described portable hybrid heat dissipation module; bonding a boiling-enhanced coating plate to a housing to seal a two-phase chamber; injecting a working fluid into the two-phase chamber; heating the boiling-enhanced coating plate with a predetermined amount of heat; and measuring the temperature of the boiling-enhanced coating plate to determine the heat dissipation performance of the boiling-enhanced coating plate.

[0024] In one embodiment, during the step of injecting the working fluid, the amount of working fluid injected is less than 75% of the volume of the biphase chamber.

[0025] In one embodiment, the step of injecting the working fluid includes injecting a dielectric fluid, semiconductive fluid, or conductive fluid with a boiling point temperature of 45 degrees Celsius or higher and 250 degrees Celsius or lower at atmospheric pressure.

[0026] In one embodiment, the step of injecting the working fluid includes injecting a liquid fluorinated liquid, water, propylene glycol, or ethylene glycol.

[0027] In one embodiment, the detection method of the present invention further includes adjusting the boiling point temperature of the working fluid by adjusting the pressure in the two-phase chamber.

[0028] Compared to existing technologies, the portable hybrid heat dissipation module of this invention integrates the housing with a two-phase chamber and the cooling mechanism into a single structure, achieving a minimized volume design. This reduces the amount and loss of the two-phase fluid used and improves the overall structural strength. Furthermore, the portable hybrid heat dissipation module of this invention achieves efficient hybrid heat dissipation through phase change heat dissipation and heat exchange, making it suitable for high-heat-flux electronic devices. In addition, the portable hybrid heat dissipation module of this invention can be selectively used as a testing instrument for boiling-enhanced coating plates to detect their heat dissipation performance. The testing method of this invention can adjust the boiling point temperature of the two-phase fluid by adjusting the pressure within the two-phase chamber, thus allowing the use of relatively inexpensive and readily available fluid materials, without being limited to specific two-phase fluids. Attached Figure Description

[0029] Figure 1A This is an unassembled schematic diagram of a portable hybrid heat dissipation module according to an embodiment of the present invention.

[0030] Figure 1B for Figure 1A A schematic diagram of the combination of a portable hybrid heat dissipation module.

[0031] Figure 2 This is a schematic diagram of a portable hybrid heat dissipation module according to another embodiment of the present invention.

[0032] Figure 3 This is a schematic diagram of a portable hybrid heat dissipation module according to another embodiment of the present invention.

[0033] Figure 4 This is a schematic diagram of a portable hybrid heat dissipation module according to another embodiment of the present invention.

[0034] Figure 5A This is a cross-sectional schematic diagram of a high heat flux electronic device according to an embodiment of the present invention.

[0035] Figure 5B This is an exploded schematic diagram of a high heat flux electronic device according to an embodiment of the present invention.

[0036] Figure 6 This is a schematic diagram illustrating the operation of a detection method for a portable hybrid heat dissipation module according to an embodiment of the present invention.

[0037] Figure 7 This is a flowchart illustrating a method for detecting a portable hybrid heat dissipation module according to an embodiment of the present invention.

[0038] The reference numerals in the attached figures are explained as follows:

[0039] 1: High heat flux electronic devices

[0040] 10: Portable Hybrid Cooling Module

[0041] 100, 100A: Housing

[0042] 101: Biphasic Chamber

[0043] 101': Cavity

[0044] 102: Perforation

[0045] 103: Fluid inlet

[0046] 105: Locking hole

[0047] 107: Outer surface

[0048] 109: Inner surface

[0049] 110: Cooling mechanism

[0050] 110A: First fin

[0051] 110B: Second fin

[0052] 112: Coolant Inlet

[0053] 114: Coolant outlet

[0054] 116: Coolant flow space

[0055] 120: Groove

[0056] 130: Control valve

[0057] 20: Boiling-enhanced coating plate

[0058] 210: Boiling Enhanced Coating

[0059] 220: Framework

[0060] 222: Plate Hole

[0061] 30: Sealing ring

[0062] 40: Screws

[0063] 45: Locking hardware

[0064] 50: Working fluid

[0065] 50a: Bubbles

[0066] 50b: Droplet

[0067] 60: Heating device

[0068] 70: Fasteners

[0069] 80: High heat flux electronic devices

[0070] 82: Keyhole

[0071] S100-S500: Steps Detailed Implementation

[0072] Please refer to Figure 1A and Figure 1B , Figure 1A This is an unassembled schematic diagram of a portable hybrid heat dissipation module 10 according to an embodiment of the present invention, and Figure 1B for Figure 1A A schematic diagram of the portable hybrid heat dissipation module 10. (See attached diagram.) Figure 1A and Figure 1BAs shown, the portable hybrid cooling module 10 includes a boiling enhancement coating plate 20, a housing 100, and a cooling mechanism 110. The boiling enhancement coating plate 20 includes a boiling enhancement coating (BEC) 210. The housing 100 forms a two-phase chamber 101, and the boiling enhancement coating plate 20 is coupled to the housing 100 to seal the two-phase chamber 101. The cooling mechanism 110 is disposed on the housing 100 corresponding to the two-phase chamber 101. The cooling mechanism 110 can be used to cool the working fluid 50 (shown in the figure) that undergoes a phase change in the two-phase chamber 101. Figure 5A and Figure 6 It returns to the phase state before the phase change occurred.

[0073] Specifically, the boiling-enhanced coating plate 20 may be a boilerplate containing a boiling-enhanced coating 210. In this embodiment, the boiling-enhanced coating plate 20 may further include a frame 220, which supports the boiling-enhanced coating 210 for fixation to the housing 100. The boiling-enhanced coating 210 is generally formed of a metal (e.g., copper, aluminum, or their alloys) and its surface may be porous. Furthermore, the boiling-enhanced coating 210 can be fixed to the center of the frame 220 by any suitable method, such as welding, clamping, locking, pressing, etc., so that the boiling-enhanced coating plate 20 has a monolithic and tight structure. For example, the boiling-enhanced coating 210 can be fixed to the frame 220 by high-temperature welding. The boiling-enhanced coating plate 20 is typically mounted on components with high heat flux (e.g., a server's central processing unit (CPU) or graphics processing unit (GPU)) to reduce the boiling resistance of the working fluid 50 and meet the heat flux requirements of these components.

[0074] A biphasic chamber 101 is formed inside the housing 100, and the housing 100 has an opening 101' communicating with the biphasic chamber 101. In this embodiment, the biphasic chamber 101 is preferably located at the center of the housing 100, and the biphasic chamber 101 extends to the surface of the housing 100 to form the opening 101'. For example, the biphasic chamber 101 may be a space enclosed by a plurality of walls of the housing 100, and one side of the housing 100 is not at least completely closed by the walls, while the opening 101' communicating with the biphasic chamber 101 is formed on the surface of the housing 100. From another viewpoint, the housing 100 may have a "U"-shaped cross-section, and the space enclosed by the "U" shape is the biphasic chamber 101, and the opening of the "U" shape is the opening 101' of the biphasic chamber 101, but this is not a limitation. Depending on the practical application, the housing 100 may be any suitable shape having an open biphasic chamber 101. In this embodiment, the size of the cavity 101' preferably corresponds to the size of the boiling-enhanced coating plate 20, thus the size of the housing 100 can be significantly reduced to correspond to the size of a single boiling-enhanced coating plate 20. For example, the size of the cavity 101' preferably corresponds to the size of the boiling-enhanced coating 210, and the boiling-enhanced coating plate 20 can be fixed to the wall of the housing 100 by the frame 220 to serve as a cover for sealing the two-phase chamber 101. In other words, the boiling-enhanced coating plate 20 is combined with the housing 100 to seal the cavity 101' of the two-phase chamber 101, thereby making the two-phase chamber 101 an airtight space.

[0075] In this embodiment, the cooling mechanism 110 includes a coolant inlet 112, a coolant outlet 114, and a coolant flow space 116. The coolant inlet 112 and coolant outlet 114 are formed in the housing 100. The coolant flow space 116 connects the coolant inlet 112 and coolant outlet 114 and is adjacent to or located within the two-phase chamber 101. Specifically, the cooling mechanism 110 is located on the opposite side of the housing 100, for example, at the horizontal portion (or bottom) of a "U"-shaped cross-section, corresponding to the opening 101' of the two-phase chamber 101, and the coolant inlet 112 and coolant outlet 114 are formed in the wall of the housing 100. The coolant flow space 116 connects the coolant inlet 112 and coolant outlet 114, allowing coolant to flow from the coolant inlet 112 into the coolant flow space 116 located in the housing 100, and then out through the coolant outlet 114. In one embodiment, the coolant flow space 116 can be implemented as a flow channel or pipe within the housing 100, and the flow channel is preferably distributed corresponding to the two-phase chamber 101 to facilitate heat exchange with the two-phase fluid (i.e., the working fluid 50), thereby improving the cooling efficiency of the cooling mechanism 110. For example, the coolant flow space 116 can be a "U"-shaped pipe, or a serpentine or "S"-shaped pipe with multiple bends, but is not limited thereto. In one embodiment, the coolant of the cooling mechanism 110 can be water or any suitable coolant. Furthermore, the cooling mechanism 110 of the portable hybrid heat dissipation module 10 can be used in conjunction with a cooling pump and a cooling unit to improve cooling efficiency. For example, the cooling unit can reduce the temperature of the coolant flowing out of the coolant outlet 114 to a relatively low temperature by exchanging heat with the two-phase fluid 50, and the cooling pump can be used to effectively introduce the relatively low-temperature coolant from the coolant inlet 112 and discharge it from the coolant outlet 114, thereby achieving circulating cooling and improving cooling efficiency.

[0076] In another embodiment, such as Figure 2 As shown, the cooling mechanism may include a plurality of first fins 110A. The plurality of first fins 110A are disposed on the housing 100 and located outside the dual-phase chamber 101. For example, the plurality of first fins 110A are preferably disposed on the outer surface 107 of the housing 100 opposite to the cavity opening 101' (or the boiling-enhanced coating plate 20) to increase the heat dissipation surface area and achieve the desired heat dissipation effect. The plurality of first fins 110A can be cooled naturally or by forced cooling via a fan or water pump. The form of the first fins 110A is not limited to sheet-like or columnar shapes; the first fins 110A may include any structure that increases the heat dissipation surface area.

[0077] In yet another embodiment, such as Figure 3As shown, the cooling mechanism may further include a plurality of second fins 110B. The plurality of second fins 110B are disposed in the housing 100 and located within the two-phase chamber 101 to further enhance the condensation effect of the cooling mechanism. Specifically, the plurality of second fins 110B are preferably disposed on the inner surface 109 of the housing 100 opposite to the cavity opening 101' (or the boiling enhancement coating plate 20) to enhance the heat-carrying effect of the condensation surface within the two-phase chamber 101 and the working fluid 50 within the two-phase chamber 101. For example, the plurality of first fins 110A and the plurality of second fins 110B may be disposed on the outer and inner surfaces of the same wall of the housing 100, respectively, but are not limited thereto. In one embodiment, the plurality of first fins 110A and the plurality of second fins 110B are preferably integrated with the housing 100 into a single structure to achieve a design that minimizes volume and improves overall structural strength. The form of the second fin 110B is not limited to plate or column shape, and the second fin 110B may include any structure that can increase the heat dissipation surface area. For example, the second fin 110B may include a mountain-shaped pattern, surface grooves, or a hydrophobic surface treatment to enhance the accelerated return of condensate droplets.

[0078] In one embodiment, such as Figure 1A As shown, the portable hybrid heat dissipation module 10 further includes a connector (e.g., 40) for joining the housing 100 and the boiling-enhanced coating plate 20. For example, the connector may include a screw 40 (or a rivet). Corresponding to the screw 40 (or rivet) type connector, the boiling-enhanced coating plate 20 may have a plate hole 222 (e.g., formed in the frame 220), and the housing 100 has a locking hole 105 on the wall surface adjacent to the cavity 101'. When the boiling-enhanced coating plate 20 is joined to the housing 100 in a manner covering the cavity 101', the plate hole 222 aligns with the locking hole 105, and the screw 40 (or rivet) is inserted from the plate hole 222 into the locking hole 105 to secure the frame 220 of the boiling-enhanced coating plate 20 to the housing 100, but this is not a limitation. In another embodiment, such as... Figure 4 As shown, the coupling can be implemented as a fastener 70, wherein the housing 100 and the boiling-enhanced coating plate 20 have corresponding fastening structures. When the boiling-enhanced coating plate 20 covers the cavity 101' and is engaged with the housing 100, the fastener 70 presses and fixes the two fastening structures together. It should be noted that the boiling-enhanced coating plate 20 can be engaged with the housing 100 by either or both of the aforementioned screw 40 and fastener 70.

[0079] In one embodiment, such as Figure 1AAs shown, the portable hybrid heat dissipation module 10 further includes a sealing ring 30, which is disposed around the cavity opening 101' between the housing 100 and the boiling-enhanced coating plate 20 to strengthen the tightness of the connection between the housing 100 and the boiling-enhanced coating plate 20 or the airtightness of the two-phase chamber 101. Specifically, the housing 100 may have a groove 120 surrounding the cavity opening 101', and the sealing ring 30 is disposed in the groove 120 to accurately position the sealing ring 30. In one embodiment, the sealing ring 30 may be made of an elastic material, such as rubber, silicone, etc., but is not limited thereto. When the boiling-enhanced coating plate 20 is combined with the housing 100, the boiling-enhanced coating plate 20 can press against the sealing ring 30 to improve the tightness of the connection between it and the housing 100.

[0080] Furthermore, such as Figure 1A As shown, the portable hybrid cooling module 10 further includes a fluid inlet 103. The fluid inlet 103 is disposed in the housing 100 and communicates with the two-phase chamber 101, and the fluid inlet 103 allows the working fluid 50 to flow into the two-phase chamber 101. Specifically, the fluid inlet 103 is formed in the wall of the housing 100, for example, preferably in a wall different from the wall where the cooling mechanism 110 (or the first fin 110A and the second fin 110B) are located. The fluid inlet 103 is used to connect the two-phase chamber 101 to the outside (e.g., a supply source of the working fluid 50 or a vacuum generator). For example, the fluid inlet 103 may be a channel penetrating the wall (e.g., a sidewall) of the housing 100 to allow the working fluid 50 to flow into the two-phase chamber 101. Specifically, the portable hybrid heat dissipation module 10 may further include a control valve 130, which is disposed in the housing 100 corresponding to the fluid inlet 103, to control the communication between the two-phase chamber 101 and the outside through the fluid inlet 103. In one embodiment, the control valve 130 may be connected to a supply source of the working fluid 50 and the fluid inlet 103, so as to control the injection amount of the working fluid 50 into the two-phase chamber 101 by opening or closing the control valve 130. For example, the injection amount of the working fluid 50 may be less than 75% of the volume of the two-phase chamber 101, and preferably about 50% of the volume of the two-phase chamber 101. The working fluid 50 is generally a liquid with a low boiling point temperature (e.g., below 60 degrees Celsius) at atmospheric pressure and is more easily evaporated, such as a fluorinated liquid, but is not limited thereto.

[0081] In another embodiment, the fluid inlet 103 can selectively serve as a gate for regulating the internal pressure of the two-phase chamber 101. Specifically, the control valve 130 can selectively connect a vacuum generator (e.g., a vacuum pump) and the fluid inlet 103 to control the pressure regulation of the two-phase chamber 101 by the vacuum generator. For example, due to the integrated structural design of the housing 100 and the cooling mechanism 110 (or the first fin 110A and the second fin 110B) of the portable hybrid heat dissipation module 10, the overall structural strength of the portable hybrid heat dissipation module 10 is improved. Combined with the airtight connection between the boiling-enhanced coating plate 20 and the housing 100, the vacuum generator can be controlled by the control valve 130 to perform a vacuuming procedure on the two-phase chamber 101 through the fluid inlet 103 to reduce the pressure in the two-phase chamber 101. Since the boiling point temperature of the working fluid 50 corresponds to its pressure, when the pressure within the two-phase chamber 101 decreases (e.g., a negative pressure is formed), the boiling point temperature of the working fluid 50 also decreases. Therefore, by adjusting (e.g., reducing) the pressure within the two-phase chamber 101 to lower the boiling point temperature of the working fluid 50, a commonly used liquid with a relatively high boiling point temperature at atmospheric pressure and readily available (i.e., inexpensive) can be used as the working fluid 50, not limited to low-boiling-point fluids (e.g., boiling point <60 degrees Celsius) specifically for phase changes. For example, the boiling point temperature of the working fluid 50 at atmospheric pressure is preferably above 45 degrees Celsius and below 250 degrees Celsius, and the working fluid 50 may contain, but is not limited to, commonly used liquids such as fluorinated liquids, water (e.g., deionized water), propylene glycol, or ethylene glycol. By adjusting the pressure within the two-phase chamber 101 to adjust the boiling point temperature of the working fluid 50, it is preferable to lower the higher boiling point temperature to achieve a commonly used operating range, such as 60 degrees Celsius to 150 degrees Celsius, but not limited to this. Furthermore, since the conductivity of the working fluid 50 does not affect the heat dissipation of the boiling-enhanced coating plate 20, the working fluid 50 can be a dielectric fluid, a semi-conductive fluid, or a conductive fluid. For example, the conductivity of a conductive fluid is greater than 0.01 S / m, and the conductivity of a semi-conductive fluid is between 10 S / m. -2 ~10 2 S / m, the conductivity of the dielectric fluid is less than 10. -8 S / m

[0082] In another embodiment, the portable hybrid heat dissipation module 10 of the present invention can be applied to high heat flux electronic devices to constitute high heat flux electronic devices. (See reference) Figure 5A , Figure 5A This is a cross-sectional schematic diagram of a high heat flux electronic device 1 according to an embodiment of the present invention. Figure 5A As shown, the high heat flux electronic device 1 of the present invention includes, for example, the above-described... Figures 1A to 4The high heat flux electronics 80 is a portable hybrid heat dissipation module (e.g., 10) and a high heat flux electronics 80. The high heat flux electronics 80 is coupled to the boiling-enhanced coating 210 of the boiling-enhanced coating plate 20 and is located on the outside of the housing 100. Specifically, the high heat flux electronics 80 and the boiling-enhanced coating plate 20 can be coupled in any suitable manner such that the boiling-enhanced coating plate 20 faces the two-phase chamber 101 to dissipate heat generated by the high heat flux electronics 80 towards the two-phase chamber 101. For example, the high heat flux electronics 80 can be a component with high heat flux (e.g., a central processing unit (CPU) or graphics processing unit (GPU) of a server). The boiling-enhanced coating plate 20 is disposed on the high heat flux electronics 80 as a two-phase heat sink for the high heat flux electronics 80. When the boiling-enhanced coating plate 20 is disposed on the high heat flux electronic device 80, the boiling-enhanced coating 210 preferably contacts the heat source of the high heat flux electronic device 80 so that when the high heat flux electronic device 80 is operating, the boiling-enhanced coating plate 20 can dissipate the heat generated by the high heat flux electronic device 80.

[0083] Please refer to Figure 5B , Figure 5B This is an exploded schematic diagram of a high heat flux electronic device according to an embodiment of the present invention. Figure 5B As shown, in one embodiment, the high heat flux electronic device 80 can be coupled to the portable hybrid heat dissipation module via a locking fastener 45. Specifically, the locking fastener 45 is preferably implemented as a spring screw to improve the tightness of the connection between the high heat flux electronic device 80 and the portable hybrid heat dissipation module, but is not limited thereto. In other embodiments, the locking fastener 45 can be implemented as a screw, rivet, etc. Corresponding to the locking fastener 45, the portable hybrid heat dissipation module can have a through hole 102 penetrating the housing 100A and the boiling-enhanced coating plate 20, and the high heat flux electronic device 80 has a locking hole 82 aligned with the through hole 102. The fastener 45 can be inserted into the through-hole 102 from one side of the housing 100A and pass through the boiling-enhanced coating plate 20 to lock with the locking hole 82. This allows for a tight connection between the high-heat-flux electronic device 80 and the portable hybrid heat dissipation module, enabling the high-heat-flux components of the high-heat-flux electronic device 80 (e.g., CPU, GPU) to form surface contact with the boiling-enhanced coating 210 of the boiling-enhanced coating plate 20, achieving a highly efficient heat dissipation configuration. It should be noted that the housing 100A has a similar configuration to the housing 100, the difference being that the four corners of the housing 100A form concave structures to accommodate the through-hole 102, but this is not a limitation. In another embodiment (not shown), at least one of the housing 100 and the boiling-enhanced coating plate 20 may have a convex structure to accommodate the through-hole 102. For example, at least one of the housing 100 and the boiling-enhanced coating plate 20 may form a wing portion or ear portion protruding laterally along the plane of the cavity 101' on one side adjacent to the cavity 101' of the two-phase chamber 101, for providing a perforation 102.

[0084] like Figure 6 As shown, the high heat flux electronic device 80 is located outside the portable hybrid heat dissipation module 10, i.e., outside the two-phase chamber 101, and is not in contact with the working fluid 50. Therefore, the conductivity of the working fluid 50 does not affect the operation of the high heat flux electronic device 80, allowing the working fluid 50 to be a dielectric fluid, a semi-conductive fluid, or a conductive fluid. Furthermore, the working fluid 50 absorbs the heat transferred from the high heat flux electronic device 80 by the boiling enhancement coating plate 20 and undergoes a phase change from liquid to gas through the action of the boiling enhancement coating 210, forming bubbles 50a, which can effectively dissipate the heat generated by the high heat flux electronic device 80. The bubbles 50a rise and contact the cooling surfaces of the cooling mechanism (e.g., the top surface of the two-phase chamber 101, the pipe-type coolant flow space 116, the second fin 110B, etc.), and then condense into droplets 50b, returning to the phase state before the phase change (i.e., liquid state). The droplet 50b returns to the working fluid pool by gravity, thereby achieving efficient mixing and heat dissipation through phase change and heat exchange. Furthermore, the boiling point temperature of the working fluid 50 can be adjusted by regulating the pressure within the two-phase chamber 101, allowing the use of a more economical working fluid and significantly reducing the cost of the working fluid 50.

[0085] The portable hybrid heat dissipation module 10 of the present invention can not only be combined with high-heat-flux electronic devices in a modular form to form high-heat-flux electronic devices, but can also be used in conjunction with a heating device (e.g., 60) to test the heat dissipation performance of a boiling-enhanced coating plate. Reference Figure 6 and Figure 7 This describes the operation and testing method of a portable hybrid heat dissipation module according to an embodiment of the present invention. Figure 6 and Figure 7 As shown, the detection method of the present invention includes: step S100, using the portable hybrid heat dissipation module (e.g., 10) of the present invention; step S200, combining the boiling-enhanced coating plate (e.g., 20) with the housing (e.g., 100) of the portable hybrid heat dissipation module 10 to seal the two-phase chamber 101; step S300, injecting working fluid 50 into the two-phase chamber 101; step S400, heating the boiling-enhanced coating plate with a predetermined amount of heat; and step S500: measuring the temperature of the boiling-enhanced coating plate to determine the heat dissipation performance of the boiling-enhanced coating plate.

[0086] Specifically, at Figure 6 Although drawn in the middle Figure 1AThe portable hybrid heat dissipation module 10 is used as an example for illustration, but in step S100, the portable hybrid heat dissipation module of any of the aforementioned embodiments can be used. In step S200, the boiling-enhanced coating plate 20 or other boiling-enhanced coating plate to be tested can be combined with the housing 100 by means of a connector (e.g., 40, 70) to form an airtight space in the two-phase chamber 101. In step S300, the working fluid 50 is injected into the two-phase chamber 101 through the fluid inlet 103, and the injection volume of the working fluid 50 is less than 75% of the volume of the two-phase chamber 101, preferably about 50% of the volume of the two-phase chamber 101, so as to form a working fluid pool in the two-phase chamber 101. When the cooling mechanism is composed of a coolant inlet 112, a coolant outlet 114 and a coolant flow space 116 (i.e. Figure 1A The detection method of the present invention further includes, before the step of heating the boiling enhanced coating plate 20, introducing coolant (e.g., water) through the coolant inlet 112 so that the coolant flows through the coolant flow space 116 and then flows out from the coolant outlet 114.

[0087] Furthermore, after step S200 or S300 (e.g., step S300), the detection method of the present invention further includes adjusting the boiling point temperature of the working fluid 50 by adjusting the pressure within the two-phase chamber 101. Specifically, a vacuum pump can be connected through the fluid inlet 103 to adjust the pressure in the two-phase chamber 101, thereby adjusting the boiling point temperature of the working fluid 50 to a lower boiling temperature range (e.g., 60 to 150 degrees Celsius) to achieve better heat transfer. This expands the range of usable two-phase fluids, allowing for the selection of more economical two-phase fluids such as water, propylene glycol, or ethylene glycol.

[0088] In step S400, as Figure 6As shown, the heating device 60 is used in conjunction with the heating of the fluidized bed coating 20 to provide a predetermined amount of heat. In one embodiment, the heating device 60 may include a heating block. The heating device 60 is activated after the heating block is mounted on the fluidized bed coating 210 of the fluidized bed coating 20, and the heat dissipation performance of the fluidized bed coating 20 is tested at a predetermined wattage. Since the working fluid 50 carries away the heat from the fluidized bed coating 20 (e.g., the fluidized bed coating 210), and due to its low boiling point temperature, a portion of the working fluid 50 in the working fluid pool undergoes a phase change from liquid to gas to form bubbles 50a. The bubbles 50a rise and contact the cooling surfaces of the cooling mechanism (e.g., the top surface of the two-phase chamber 101, the pipe-type coolant flow space 116, the second fin 110B, etc.), and then condense into droplets 50b, returning to the phase state before the phase change (i.e., liquid). The droplets 50b return to the working fluid pool by gravity. Therefore, the predetermined heat supplied to the boiling-enhanced coating plate 20 can be dissipated through a two-phase heat dissipation mechanism, in which the working fluid 50 undergoes a phase change by receiving heat from the boiling-enhanced coating plate 20, and the cooling mechanism restores the working fluid 50 that has undergone a phase change to the phase state before the phase change.

[0089] In step S500, the heat dissipation performance of the fluidized bed reinforced coating plate 20 can be determined by measuring its temperature. Specifically, a reference fluidized bed reinforced coating plate can be used in advance to replace the fluidized bed reinforced coating plate 20 and bonded to the housing 100. The temperature of the reference fluidized bed reinforced coating plate is measured using the same testing method described above, thus establishing a heat dissipation performance reference standard. When the measured temperature of the fluidized bed reinforced coating plate 20 is lower than the temperature of the reference fluidized bed reinforced coating plate, the heat dissipation performance of the fluidized bed reinforced coating plate 20 is considered good. When the measured temperature of the fluidized bed reinforced coating plate 20 is higher than the temperature of the reference fluidized bed reinforced coating plate by a certain amount, the heat dissipation performance of the fluidized bed reinforced coating plate 20 is considered poor. This allows for effective sorting of good and defective dual-phase fluidized bed reinforced coating plates or heat dissipation modules, improving testing efficiency.

[0090] Furthermore, after testing the heat dissipation performance of the boiling-enhanced coating plate (e.g., 20), procedures such as removing the heating device 60, recovering the working fluid 50 from the two-phase chamber 101, removing the boiling-enhanced coating plate, and then cleaning and packaging can be performed. Therefore, the housing 100 of the portable heat dissipation module 10 can serve as a device for testing heat dissipation performance, allowing for the testing of different boiling-enhanced coating plates according to the testing method of the present invention by combining it with the boiling-enhanced coating plate to be tested.

[0091] Because the portable hybrid heat dissipation module of the present invention integrates the housing and cooling mechanism into a single structure, and designs a simplified structure for a single boiling-enhanced coating plate, its volume is significantly reduced compared to existing large-scale testing prototypes, thereby improving the portability of the portable hybrid heat dissipation module. This also significantly reduces the amount of working fluid 50 used, saving costs and resources. Table 1 shows relevant comparative values ​​as examples, but is not limited to these.

[0092] Table 1

[0093]

[0094]

[0095] Furthermore, since the portable hybrid heat dissipation module of the present invention adjusts the boiling point temperature of the working fluid by adjusting the pressure of the two-phase chamber, a more economical working fluid can be used, resulting in a significant reduction in the cost of the working fluid. Table 2 shows relevant comparative values ​​as examples, but is not limited thereto.

[0096] Table 2

[0097]

[0098] The present invention has been described by the above embodiments; however, the above embodiments are for illustrative purposes only and are not intended to be limiting. Those skilled in the art will recognize that other modifications may be made to the illustrative embodiments described herein without departing from the spirit of the invention. Therefore, the scope of the invention also covers such modifications and is limited only by the appended claims.

Claims

1. A portable hybrid heat dissipation module, comprising: Boiling-enhanced coating plate; A housing having a two-phase chamber, and the boiling-enhanced coating plate being bonded to the housing to seal the two-phase chamber; and A cooling mechanism is provided in the housing corresponding to the two-phase chamber.

2. The portable hybrid heat dissipation module as claimed in claim 1, wherein the cooling mechanism includes a coolant inlet, a coolant outlet, and a coolant flow space, the coolant inlet and the coolant outlet are formed in the housing, and the coolant flow space communicates with the coolant inlet and the coolant outlet and is adjacent to or located within the dual-phase chamber.

3. The portable hybrid heat dissipation module as claimed in claim 1, wherein the cooling mechanism includes a plurality of first fins disposed on the housing and located outside the dual-phase cavity.

4. The portable hybrid heat dissipation module as claimed in claim 3, wherein the cooling mechanism further includes a plurality of second fins disposed in the housing and located within the dual-phase chamber.

5. The portable hybrid heat dissipation module as claimed in claim 1 further includes a sealing ring, wherein the housing has an opening communicating with the dual-phase chamber, and the sealing ring is disposed around the opening between the housing and the boiling-enhanced coating plate.

6. The portable hybrid heat dissipation module as claimed in claim 5, wherein the housing has a groove surrounding the cavity opening, and the sealing ring is disposed in the groove.

7. The portable hybrid heat dissipation module as claimed in claim 1 further includes a fluid inlet, wherein the fluid inlet is disposed in the housing and communicates with the dual-phase chamber, and the fluid inlet allows working fluid to flow into the dual-phase chamber.

8. The portable hybrid heat dissipation module as claimed in claim 7 further includes a control valve, wherein the control valve is disposed on the housing corresponding to the fluid inlet to control the communication between the two-phase chamber and the outside through the fluid inlet.

9. The portable hybrid heat dissipation module of claim 7, wherein the fluid inlet can be selectively used as a gate for regulating the internal pressure of the two-phase chamber.

10. The portable hybrid heat dissipation module as claimed in claim 1 further includes a connector for joining the housing and the boiling-enhanced coating plate, thereby making the two-phase chamber an airtight space.

11. The portable hybrid heat dissipation module of claim 10, wherein the boiling-enhanced coating plate includes a boiling-enhanced coating and a frame, wherein the frame supports the boiling-enhanced coating, and the connector secures the frame to the housing.

12. The portable hybrid heat dissipation module of claim 10, wherein the coupling comprises screws, fasteners, or a combination thereof.

13. A high heat flux electronic device, comprising: The portable hybrid heat dissipation module according to claim 1; and High heat flux electronic devices are combined with the boiling-enhanced coating plate and located on the outside of the housing.

14. The high heat flux electronic device of claim 13, wherein the portable hybrid heat dissipation module further includes a fluid inlet disposed in the housing and communicating with the two-phase chamber, and the fluid inlet can selectively serve as a gate for regulating the internal pressure of the two-phase chamber.

15. The high heat flux electronic device of claim 13, wherein the boiling-enhancing coating plate comprises a boiling-enhancing coating and a frame, the frame supporting the boiling-enhancing coating and fixing it to the housing, and the high heat flux electronic device is combined with the boiling-enhancing coating.

16. A method for testing a portable hybrid heat dissipation module, comprising: Use the portable hybrid heat dissipation module according to claim 1; The boiling-enhanced coating plate is bonded to the housing to seal the two-phase chamber; Inject the working fluid into the two-phase chamber; The boiling-enhanced coating plate is heated to a predetermined temperature. as well as The temperature of the fluidized bed reinforced coating plate is measured to determine its heat dissipation performance.

17. The detection method of claim 16, wherein in the step of injecting the working fluid, the amount of the working fluid injected is less than 75% of the volume of the biphasic chamber.

18. The detection method of claim 16, wherein the step of injecting the working fluid comprises injecting a dielectric fluid, semiconducting fluid, or conductive fluid with a boiling point temperature of 45 degrees Celsius or higher and 250 degrees Celsius or lower under atmospheric pressure.

19. The detection method of claim 18, wherein the step of injecting the working fluid comprises injecting a liquid fluorinated liquid, water, propylene glycol or ethylene glycol.

20. The detection method of claim 16 further comprises: adjusting the boiling point temperature of the working fluid by adjusting the pressure in the two-phase chamber.

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