cooling system

Abstract

A cooling system is provided, including a radiator, a spring element, and a frame. The radiator includes a base and a heat exchanger portion coupled to a first surface of the base. The frame includes a first frame surface having at least one opening for receiving the radiator. The opening includes a stepped portion located at an inner sidewall of the opening, the stepped portion being configured to receive the spring element and the first surface of the base.

Description

Technical Field

[0001] This disclosure relates to cooling systems, including radiators. Background Technology

[0002] In many applications of electronic power systems with top-side cooling components, large common heat sinks are used. However, large heat sinks present numerous challenges related to mechanical stress, thermal interfaces, isolation, and assembly.

[0003] When multiple components share a common heatsink, one of the most critical challenges is ensuring the flatness of the top sides of the components. This can lead to significant height discrepancies between components. This necessitates the use of thick thermal interface materials, such as spacers or spacer pads, which, however, degrades the thermal performance of the devices. Other issues, such as PCB warpage, must also be considered, especially when using large PCBs.

[0004] Documents US 9.646.910 B2 and US 7.269.018 B2 outline common solutions in the prior art. However, the solutions provided remain complex, difficult to manufacture, and offer little improvement in thermal performance.

[0005] Therefore, the purpose of this disclosure is to at least mitigate these disadvantages. Summary of the Invention

[0006] According to a first aspect of this disclosure, a cooling system is provided. The cooling system includes a radiator, the radiator including a base and a heat exchanger portion coupled to a first surface of the base. The cooling system also includes a spring element and a frame, the frame including a first frame surface having at least one opening for receiving the radiator, wherein the opening includes a stepped portion at an inner sidewall of the opening, the stepped portion being configured to receive the spring element and the first surface of the base.

[0007] The cooling system according to this disclosure enables the integration of sensitive components, such as the housing of an inverter and corresponding cooling elements, such as a heat sink, into a compact common structure.

[0008] The frame forms the main body to accommodate at least one or more radiators, i.e., cooling elements, wherein the radiators are inserted into the frame. Each radiator includes a base having a first surface. The first surface of one or more radiators engages with a stepped portion of the inner sidewall of the opening. An elastic element or spring element is arranged between the first surface of the radiator and the stepped portion. The elastic element may be a compressible element configured to compensate for possible height differences between the cooling surfaces of the heat dissipation components to be cooled by the cooling system. Furthermore, the frame may be an insulating frame and / or may be part of a fluid cooling system.

[0009] The frame allows for the use of a separate heatsink for each sensitive component, rather than a large common heatsink. This enhances thermal performance, specifically the efficiency of heat transfer away from sensitive components. The frame can be used in various implementation schemes.

[0010] Furthermore, using frames supports sustainability by making repairs, refurbishments, and recycling easier. Frames can also be applied to a variety of sensitive components, such as discrete molded modules, passive components, and power modules.

[0011] In addition, the frame can also be used to move and / or store heat sinks and sensitive components during the production process.

[0012] In one embodiment, the base includes a second surface opposite to the first surface, and the second surface is configured to contact the heat transfer surface of the heating device.

[0013] The sensitive component may be a heat-generating device, which may include at least one heat transfer surface configured to transfer heat from the device to a heat sink. The heat transfer surface may be in at least thermal contact with a second surface of the heat sink.

[0014] In one embodiment, the first surface of the base includes a collar portion, wherein the collar portion contacts the spring element when the heat sink is in the inserted position within the frame.

[0015] The base may form a collar portion. The collar portion may be configured to interlock and contact the stepped portion at the inner wall of the opening, such that the radiator engages with the stepped portion in a positively interlocking manner in the insertion direction. The collar portion may also be referred to as the circumferential portion of the first surface of the radiator, wherein the circumferential portion / collar portion circumferentially surrounds at least a portion of the heat exchanger portion.

[0016] In one embodiment, the opening is a through hole, and in the insertion position, the heat exchanger portion of the radiator protrudes beyond the second frame side of the frame. The heat exchanger portion may protrude beyond the frame to allow for better contact with the cooling fluid, such as ambient air. The heat exchanger portion may include, for example, fins, plates, pins, or any protrusions that enable heat transfer from the radiator to the cooling medium.

[0017] In an embodiment, the inner wall of at least one opening forms part of a channel, particularly a channel for guiding cooling fluid through the heat exchanger section of the radiator.

[0018] In this embodiment, the heat exchanger section may be at least partially surrounded by an open, at least partially inner wall. The second frame side of the frame may be configured such that the opening forms a channel or groove through which the cooling medium can flow.

[0019] In one embodiment, the frame forms a housing including channels, wherein the channels are leak-proof, and wherein a heat exchanger portion protrudes into the channels to contact the cooling fluid.

[0020] The frame may include liquid-tight or leak-proof channels, wherein the channels may be formed by extending sidewalls, such that the frame forms a complete shell surrounding and hermetically sealing the channels. In other words, the frame may also include sidewalls on the second frame side, which may form guiding channels for cooling fluid. Therefore, the system can be applied in liquid cooling systems.

[0021] In one implementation, the system may include a heating element, wherein the heating element is mounted on a panel.

[0022] Specifically, the heating element is a semiconductor device or a passive device, and the panel is a printed circuit board (PCB), an active metal solder substrate (AMB), or a direct copper bond substrate (DCB). The heating element may have a heat transfer surface, which may be arranged opposite the side of the device facing the panel.

[0023] This system can be used to cool semiconductor devices, particularly multiple semiconductor devices, where each device is in contact with a corresponding heat sink via a frame, and all devices are mounted on the same panel, a common practice in electronic power supply systems. The frame balances the height difference between the semiconductor devices and the panel using spring elements. For example, a PCB containing a top-side cooled component can be fixed to the top of the frame / carrier, allowing the heat sink to be pushed towards the top-side cooled component on the PCB by the spring elements. This establishes a stable yet flexible connection, particularly a thermal connection, between the heat-generating device and the heat sink.

[0024] In particular, the panel can be mounted on the first surface of the frame, allowing the heat dissipation device to be inserted into the opening and to make thermal contact with the second surface of the heat sink.

[0025] The frame can be additionally configured to provide additional mechanical support to the panel. In particular, the frame can be stronger and more rigid than the panel, thus reducing panel warping when the panel is mounted to the frame. Similarly, the panel itself can be lighter, thinner, and provide less mechanical support, which reduces the amount of material required and lowers the overall system cost.

[0026] In this implementation, the spring element is a washer, and it hermetically seals the connection between the heat sink and the frame. By providing a sealed connection between the heat sink and the frame, the frame can be used in a liquid cooling system. The washer can protect the heat-generating components of a semiconductor device from the effects of the cooling liquid.

[0027] Typically, in the insertion position, the spring element applies force to the first surface of the radiator, thereby pressing the second surface of the radiator against the heat transfer surface of the heat dissipation device.

[0028] In addition to good thermal contact, this further provides the effect of height differences being offset by spring elements. Therefore, the height of each heatsink can be defined independently of each other.

[0029] In one implementation, the frame includes multiple openings, each of which is configured to accommodate a corresponding heat sink among a plurality of heat sinks.

[0030] In particular, the frame can be configured to accommodate multiple semiconductor devices and / or passive components. In other words, a panel, such as a PCB, on which various devices can be mounted can be matched with the frame and its openings in an inverted position. Each heat-generating device and panel can be matched with a separate custom heatsink. Therefore, the size of the opening and / or the size of the sidewalls of the opening and / or the size of the stepped portions of the sidewalls can be configured to individually match the devices on the panel.

[0031] Compared to existing technologies, bulky large common radiators are divided into multiple units, which are inserted into openings in a specific arrangement of the frame / carrier.

[0032] Furthermore, multiple heat sinks can be electrically isolated from each other, enabling systems with lower levels of electrical insulation compared to large shared heat sinks. This allows for the use of thinner thermal interface materials and better thermal contact between heat-generating components and their respective heat sink surfaces.

[0033] The frame can be made of any material, but heat-resistant, electrically insulating hard plastics are best suited. For example, spring elements can be made in the form of leaf springs or rubber rings.

[0034] In one embodiment, the portion between two adjacent openings of the frame has a width ranging from 10% to 40% of the diameter of the opening.

[0035] In particular, the portion between two adjacent openings in the frame can also be referred to as a bridge. The bridge can form a mounting section, i.e., a portion of the first frame surface, to which a corresponding portion of the panel will be attached at the mounting location. The width of the bridge can also be in the range of 10% to 30% or 10% to 20% of the opening diameter.

[0036] In particular, the portion between two adjacent openings in the frame can have a maximum width of 50% of the diameter of the opening.

[0037] A relatively thick bridge width has the following effects: the panel has good support for mounting to the frame, thereby reducing panel warpage. The openings in multiple openings are separated from each other by the bridge. The bridge forms part of the first surface of the frame and is configured to accommodate the panel components / parts. The thicker the bridge, the more contact surface is provided between the panel and the frame. The more contact surface provided, the better and more stable the connection between the panel and the frame in the mounting position. Therefore, the thickness of the bridge helps stabilize the connection and reduce panel warpage, which can occur due to thermal stress and / or mismatch of coefficients of thermal expansion (CTE). It has been observed that particularly good stability and low PCB warpage can be achieved if the bridge width is within the range described above.

[0038] In one embodiment, the frame includes a screw dome that protrudes above the first frame surface and, in the mounting position, spaces the panel from the first frame surface. The screw dome can separate the panel from the first frame surface, but it can also be coplanar with the first frame surface, i.e., part of the first frame surface. In this configuration, the second surface of the heat sink and / or the heat-generating device can also protrude above the first frame surface.

[0039] In another embodiment, the frame may not include a stepped portion at the inner sidewall of the opening. In this configuration, the first surface of the heat sink, particularly the collar portion, can contact the surface of the first frame, such that the base of the heat sink protrudes above the surface of the first frame. This frame can be further simplified and is easier to manufacture. This embodiment can also be combined with the aforementioned screw dome, wherein the height of the screw dome above the surface of the first frame can at least correspond to the thickness of the base of the heat sink, preferably corresponding to the height of the base and any components that may be attached, such as semiconductor devices and / or thermal interface materials.

[0040] In one embodiment, the frame includes a circumferential portion surrounding the surface of the first frame, and the height of the circumferential portion corresponds to the thickness of the panel.

[0041] The circumferential portion forms a stable frame-like protrusion around the panel. Therefore, the panel is completely embedded in the frame. The outer surface of the panel is coplanar with the surface of the circumferential portion.

[0042] In one embodiment, the frame includes a snap-fit ​​portion for interlocking with the panel in a mounting position, configured to securely attach the panel to the frame, and / or a portion between two adjacent openings of the frame includes additional snap-fit ​​features configured to protrude through the corresponding opening in the panel and engage with the outermost surface of the panel.

[0043] The production process can be simplified by using snaps in this part, as there is no need for tightening or gluing, and the panel and the heating element mounted on the panel are put into the installation position simply by snapping / clamping the panel into the frame.

[0044] In one implementation, the system includes a thermal interface material disposed between a second surface of the heat sink and a heat transfer surface of the heat-generating device. The thermal interface material may be electrically insulating. This may help achieve electrical isolation of the heat sink. A thermal interface material that may have a certain thickness and elasticity may further help to compensate for height differences in the heat-generating device.

[0045] In this implementation, the sidewalls of the opening, together with the heat sink and panel, form a sealed cavity. The semiconductor device is thus housed within the cavity of the frame and sealed to prevent, for example, environmental contamination. This allows the system to be used in environments with high levels of pollution.

[0046] In particular, the panel can be attached to the frame by gluing or screwing. Attached Figure Description

[0047] Exemplary embodiments of this disclosure are described with reference to the following figures:

[0048] Figure 1 The framework of an implementation of the first aspect of this disclosure is shown.

[0049] Figure 2 The radiator is shown being inserted. Figure 1 The framework.

[0050] Figure 3 A cross-sectional view of an embodiment of the present disclosure is shown.

[0051] Figure 4 Cross-sectional views of other embodiments of this disclosure are shown.

[0052] Figure 5 It shows Figure 4 3D view of the implementation method.

[0053] Figure 6 It shows Figure 4 and Figure 5 Other cross-sectional views of the implementation method. Detailed Implementation

[0054] In the following detailed description, reference is made to the accompanying drawings. The drawings illustrate specific examples in which the invention may be practiced. It should be understood that, unless otherwise specifically indicated, the features and principles described with respect to the various examples can be combined with each other. Furthermore, in the claims, certain elements are designated as "first element," "second element," "third element," etc., and this should not be construed as enumerating. Rather, such designations are used only to refer to different "elements." That is, for example, the presence of a "third element" does not require the presence of "first element" and "second element." The semiconductor device described herein may include (doped) semiconductor material and may be a semiconductor chip or be included in a semiconductor chip.

[0055] Figure 1 A frame 1 is shown as an embodiment of system 2 of this disclosure. Frame 1 includes a first frame surface 3 and a second side 4 opposite to the first frame surface 3. Frame 1 includes an opening 5. Figure 1 In this embodiment, the frame 1 includes a plurality of openings 5. The openings 5 ​​form through holes connecting a first frame surface 3 and a second side 4 of the frame. Each opening 5 includes an inner sidewall 6. The inner sidewall 6 includes a stepped portion 7. The stepped portion 7 is a circumferential protrusion and is part of the inner sidewall 6. The stepped portion 7 provides a support surface 8 configured to receive and contact a device to be inserted into the opening 5 of the frame 1.

[0056] Figure 2 It shows Figure 1 A frame 1 in which a heat sink 9 is inserted. The heat sink 9 includes a base 10 having a first surface 11. Figure 2 In the insertion position shown, the first surface 11 of the base 10 contacts the support surface 8 of the stepped portion 7. The base 10 of the heat sink 9 also includes a second surface 12.

[0057] In the insertion position, the second surface 12 of the base 10 can be coplanar with the first frame surface 3 and retracted into the frame 1, that is, retracted into the opening 5.

[0058] The second surface 12 of the base 10 forms a contact portion (i.e., a contact surface), which can be configured to make at least thermal contact with another heating device (not shown), which can also be inserted into the opening 5.

[0059] The radiator 9 also includes a heat exchanger section 13. In the insertion position, the radiator 9 is inserted into the opening 5 such that the heat exchanger section 13 protrudes beyond the frame 1, that is, beyond the second side of the frame 4.

[0060] Figure 3A cross-sectional view of the cooling system 2 according to this disclosure is shown. The radiator 9 is inserted into the frame 1 in an inverted position. In this position, the heat exchanger section 13 protrudes beyond the second side of the frame 4. The heat exchanger section 13 includes cooling structures, such as fins or ribs.

[0061] The base 10 of the radiator 9 includes a collar portion 14. The collar portion 14 is part of the first surface 11 of the base 10 and contacts the support surface 8 of the stepped portion 7 in the shown insertion position. A spring element 15 is arranged between the support surface 8 of the stepped portion 7 and the first surface 11 of the base 10.

[0062] The frame 1 is covered by a panel 16, which is fixedly attached to the frame 1. Various devices 17, which may be heating devices, are attached to the panel 16. In the mounting position, i.e., when the panel 16 is attached to the first frame surface 3, the devices 17 attached to the panel 16 are inserted into the opening 5.

[0063] In the mounting position, device 17 is in thermal contact with heat sink 9. To enhance contact or compensate for any possible height difference, thermal interface material 18 is disposed between the second surface 12 of base 10 and the heat-generating surface of device 17.

[0064] The height of each heat-generating device 17 can be different. In order to establish good thermal contact between the heat sink 9 and the device 17, the spring element 15 can be adjusted accordingly. Therefore, by inserting the device 17 into the opening 5, devices 17 with different heights can be easily attached to the same panel 16 and make contact with the corresponding heat sink 9.

[0065] The portion 20 between two adjacent openings 5 ​​of the frame, also referred to as a bridge, is the supporting surface of the corresponding portion of the panel 16. The panel is completely coplanar with the surface 3 of the first frame.

[0066] The spring element 15 applies force to the collar portion 14 of the base 10 of the heat sink 9, and presses the second surface 12 of the heat sink against the device 17. Therefore, in the installed position, as the panel is attached to the frame 1, the spring element 15 is in a compressed state. As an additional effect, the spring element 15 can be implemented as a gasket to seal the connection between the heat sink 9 and the frame 1.

[0067] It is also conceivable that two frames 1 are mounted on different sides of a panel 16, that is, the panel 16 can be mounted on opposite sides of each other, and these devices can be inserted into the openings 5 ​​of the corresponding opposite frames 1.

[0068] Figure 4A cross-sectional view of another embodiment of the cooling system 2 is shown. The inner wall 6 of at least one opening 5 forms part of a channel 21, specifically for guiding cooling fluid through the heat exchanger section 13 of the radiator 9. In this embodiment, the heat exchanger section 13 of the radiator 9 does not protrude beyond the second side 4 of the frame 1.

[0069] More precisely, the heat exchanger section 13 is surrounded by a frame and protrudes only to the other part of the opening opposite the support surface 8 of the stepped section 7. The other part of the opening may also be referred to as the channel 21.

[0070] Furthermore, the sidewall 6 of the opening 5, together with the radiator 9 and the panel 16, forms a sealed cavity 22. A tight connection, i.e., a sealed connection or a liquid-proof or fluid-proof connection, can be established between the first frame surface and the panel 16, for example, by tightening or gluing.

[0071] The device 17 can have different heights and / or thicknesses. Therefore, the step portion 7 can be in different vertical positions relative to the panel 16 at the inner sidewall 6 of the opening 5. That is, the distance between the first frame surface 3 and the support surface 8 can be adjusted according to the height requirement of the device 17 to be inserted into the corresponding opening 5.

[0072] Device 17 is a surface mount device (SMD), but it can also be a through-hole device (THD).

[0073] Figure 5 It shows Figure 4 A 3D view of the implementation method. Besides Figure 4 The frame 1 includes a circumferential portion 23 surrounding the first frame surface 3. The circumferential portion 23 is adapted to surround the panel 16 (not shown), i.e., to match the dimensions of the panel 16.

[0074] The height of the circumferential portion 23 corresponds to the thickness of the panel 16 (not shown).

[0075] Figure 6 Further cross-sectional views of other embodiments of the cooling system 2 are shown. The frame 1 forms part of a housing 24 including a channel 21 and a cavity 22. The housing 24 includes an integral lower side member 25 that closes the channel 21 at the bottom side. The cooling system can therefore also be part of a liquid cooling system, as liquid can be guided through the leak-proof channel.

[0076] In order to transfer heat from the radiator 9 to the cooling medium, the heat exchanger section 13 protrudes into the channel 21 and comes into contact with the cooling medium, such as an insulating fluid or water. List of reference numerals 1. Framework 2. System 3. First frame surface 4. Second frame side 5. Opening 6. Inner wall 7. Stepped section 8. Support surface 9. Radiator 10. Base 11. The first surface of the base 12. The second surface of the base 13. Heat Exchanger Section 14. Ring section 15. Spring element 16. Panel 17. Devices 18. Thermal interface materials 19. Heating surface 20. The section between openings / bridge 21. Passage 22. cavity 23. Zhou Xiangbu 24. Shell 25. Lower side members

Claims

1. A cooling system, comprising: A radiator, the radiator including a base and a heat exchanger portion coupled to a first surface of the base; Spring elements; as well as The framework includes: A first frame surface having at least one opening for receiving the heat sink, wherein the opening includes a stepped portion at the inner sidewall of the opening, the stepped portion being configured to receive the spring element and the first surface of the base.

2. The cooling system according to claim 1, wherein, The base includes a second surface opposite to the first surface, wherein the second surface is configured to contact the heat transfer surface of the heating device.

3. The cooling system according to claim 1 or 2, wherein, The first surface of the base includes a collar portion, wherein the collar portion contacts the spring element when the heat sink is in the insertion position within the frame.

4. The cooling system according to claim 3, wherein, The at least one opening is a through hole, and wherein, in the insertion position, the heat exchanger portion of the radiator protrudes beyond the second frame side of the frame.

5. The cooling system according to any one of the preceding claims, wherein, The inner wall of the at least one opening forms part of a channel.

6. The cooling system according to claim 5, wherein, The channel is used to guide cooling fluid through the heat exchanger section of the radiator.

7. The cooling system according to claim 5 or 6, wherein, The frame forms part of a housing including the channel, wherein the channel is leak-proof, and wherein the heat exchanger portion protrudes into the channel to contact the cooling fluid.

8. The cooling system according to any one of claims 2 to 7, wherein, The cooling system also includes the heating element, which is mounted on the panel.

9. The cooling system according to claim 8, wherein, The heating device is a semiconductor device or a passive device, and the panel is a printed circuit board (PCB), an active metal brazing substrate (AMB), or a direct copper bonding substrate (DCB).

10. The cooling system according to claim 8 or 9, wherein, The panel is mounted on the surface of the first frame such that the heating device is inserted into the opening and comes into thermal contact with the second surface of the base.

11. The cooling system according to any one of the preceding claims, wherein, The spring element is a washer and hermetically seals the connection between the radiator and the frame.

12. The cooling system according to any one of claims 3 to 11, wherein, In the insertion position, the spring element applies a force to the first surface of the base, and wherein the second surface of the base is thus pressed against the heat transfer surface of the heating device.

13. The cooling system according to claim 12, wherein, At the insertion position, the spring element applies a force to the collar portion.

14. The cooling system according to any one of the preceding claims, wherein, The frame includes multiple openings, each of which is configured to accommodate a corresponding heat sink among a plurality of heat sinks.

15. The cooling system according to claim 14, wherein, The portion between two adjacent openings of the frame has a maximum width of 50% of the diameter of the opening.

16. The cooling system according to any one of claims 8 to 15, wherein, The frame includes a screw dome that protrudes above the surface of the first frame at the mounting position.

17. The cooling system according to any one of claims 8 to 16, wherein, The frame includes a circumferential portion surrounding the surface of the first frame, wherein the height of the circumferential portion corresponds to the thickness of the panel.

18. The cooling system according to any one of claims 16 to 17, wherein, The frame includes a latching portion that interlocks with the panel at the mounting position, the latching portion being configured to securely attach the panel to the frame, and / or, wherein a portion between adjacent openings of the frame includes additional latching features configured to protrude through a corresponding opening in the panel and engage with the outermost surface of the panel.

19. The cooling system according to any one of claims 2 to 18, comprising a thermal interface material disposed between the second surface of the base and the heat transfer surface of the heating device.

20. The cooling system according to any one of claims 8 to 19, wherein, The sidewall of the opening, together with the radiator and the panel, forms a sealed cavity.

21. The cooling system according to any one of claims 8 to 20, wherein, The panel is attached to the frame by adhesive or screwing.

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