Modular data center cooling system

CN122803215APending Publication Date: 2026-09-22VERTIV INTERNATIONAL LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202610338556.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2026-03-13
Filing Date
2026-03-19
Publication Date
2026-09-22

AI Technical Summary

Technical Problem

在这样的设计中,管道定位和布线增加了泄漏的风险,需要更多的空间,并且妨碍了维护和操纵的可及性

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122803215A_ABST
    Figure CN122803215A_ABST
Patent Text Reader

Abstract

Modular data center systems and liquid cooling systems for modular data center systems are provided. A liquid cooling system can include one or more coolant distribution units (CDUs) to regulate distribution of coolant, and a secondary fluid network coupled to the CDUs. The secondary fluid network can include one or more primary conduits coupled to the CDUs, where the primary conduits can be arranged in a hot aisle formed by at least two rows of racks including a plurality of racks. The secondary fluid network can include one or more branch conduits coupled to the primary conduits, where the branch conduits can be arranged below the primary conduits with the hot aisle. The secondary fluid network can include conduits to couple the branch conduits to the plurality of racks. The primary conduits can distribute coolant from the CDUs to the branch conduits, and the branch conduits can distribute the coolant to the plurality of racks via the conduits.
Need to check novelty before this filing date? Find Prior Art

Description

[0001] Cross-references to related applications

[0002] This application claims the benefits of U.S. Provisional Application No. 63 / 774,468, filed March 19, 2025, and U.S. Non-Provisional Application No. 19 / 566,438, filed March 13, 2026, both of which are incorporated herein by reference in their entirety. Technical Field

[0003] This disclosure generally relates to the field of cooling systems, and more specifically to cooling systems for modular data centers. Background Technology

[0004] The rise of artificial intelligence (AI) and machine learning (ML), along with high-performance computing, has brought new challenges to cooling systems in data centers. For example, AI and ML models require training, which typically takes place in high-performance data centers. As the density of chips, servers, and racks increases, traditional air-cooling methods struggle to effectively manage the resulting heat levels on their own. This has led to an increased demand for liquid cooling systems.

[0005] However, one challenge of liquid cooling systems is the secondary fluid network. For example, the placement of piping and related piping components presents considerable difficulties due to space constraints within the cooling system. It is important that the components of the secondary fluid network remain accessible for ease of handling and maintenance, while also minimizing the risk of leaks. In conventional designs, the secondary fluid network is mounted above the rack (e.g., in the ceiling). In such designs, piping placement and wiring increase the risk of leaks, require more space, and hinder accessibility for maintenance and handling.

[0006] Therefore, a system is needed to address one or more of the drawbacks of the methods described above. Summary of the Invention

[0007] In one embodiment, the modular data center system includes: a modular housing including a plurality of walls defining a cavity; at least two rack rows housed within the cavity of the modular housing, the at least two rack rows including at least a first rack row and a second rack row, wherein the first rack row is arranged at a selected distance from the second rack row to form a thermal aisle, wherein each rack row includes a plurality of racks; one or more coolant distribution units configured to regulate coolant distribution; and a secondary fluid network coupled to the one or more coolant distribution units, wherein the secondary fluid network includes: one or more main conduits, the one or more... A main conduit is coupled to one or more coolant distribution units, wherein one or more main conduits are arranged in the hot aisle; one or more branch conduits are coupled to one or more main conduits, wherein one or more branch conduits are arranged below one or more main conduits together with the hot aisle; and one or more conduits are configured to couple one or more branch conduits to multiple racks in at least two rack rows, wherein one or more main conduits distribute coolant from one or more coolant distribution units to one or more branch conduits, wherein one or more branch conduits distribute coolant to multiple racks via one or more conduits.

[0008] In one embodiment, the liquid cooling system includes: one or more coolant distribution units configured to regulate coolant distribution; and a secondary fluid network coupled to the one or more coolant distribution units, wherein the secondary fluid network includes: one or more main pipes coupled to the one or more coolant distribution units, wherein the one or more main pipes are arranged in a thermal aisle formed by at least two rack rows including multiple racks; one or more branch pipes coupled to the one or more main pipes, wherein the one or more branch pipes are arranged below the one or more main pipes together with the thermal aisle; and one or more conduits configured to couple the one or more branch pipes to multiple racks in the at least two rack rows, wherein the one or more main pipes distribute coolant from one or more coolant distribution units to one or more branch pipes, wherein the one or more branch pipes distribute coolant to multiple racks via one or more conduits.

[0009] It should be understood that the foregoing general description and the following detailed description are merely exemplary and illustrative, and do not necessarily limit the scope of this disclosure. The accompanying drawings, incorporated in and constituting a part of this specification, illustrate the subject matter of this disclosure. Together, the specification and drawings serve to illustrate the principles of this disclosure. Attached Figure Description

[0010] Those skilled in the art can better understand the many advantages of this disclosure by referring to the accompanying drawings.

[0011] Figure 1A This is a simplified schematic diagram of a modular data center system including a secondary fluid network according to one or more embodiments of the present disclosure.

[0012] Figure 1B This is a simplified side view of a modular data center system including a secondary fluid network according to one or more embodiments of this disclosure.

[0013] Figure 1C This is a simplified schematic diagram of a modular data center system including a secondary fluid network according to one or more embodiments of the present disclosure.

[0014] Figure 1D This is a simplified side view of a modular data center system including a secondary fluid network according to one or more embodiments of this disclosure.

[0015] Figure 1E This is a simplified schematic diagram of a modular data center system including a secondary fluid network according to one or more embodiments of the present disclosure.

[0016] Figure 1F This is a simplified schematic diagram of a modular data center system including a secondary fluid network according to one or more embodiments of the present disclosure. Detailed Implementation

[0017] The disclosed subject matter will now be referred to in detail, and is shown in the accompanying drawings.

[0018] Embodiments of this disclosure relate to modular data center systems. Specifically, embodiments of this disclosure relate to modular data center systems including a liquid cooling system comprising a secondary fluid network. The secondary fluid network can be configured to increase space available for other infrastructure and reduce the risk of leaks. For example, the secondary fluid network can be arranged within the thermal aisles formed by the racks, which reduces the risk of leaks—because piping and valves are not arranged above the racks (as is the case in conventional designs) and also frees up space for other infrastructure. In the event of a leak, fluid from the secondary fluid network can drip into a drain pan located below the grille of the thermal aisle, rather than dripping onto the rack equipment itself.

[0019] Furthermore, secondary fluid networks can be configured to provide greater accessibility to piping components, enabling proper equipment handling and maintenance. For example, valves on piping can be easily accessed in hot aisles, allowing data center personnel to operate them via the hot aisle. Secondary fluid networks can be compact, allowing them to be transported as a single module, and can also be scaled based on customer needs.

[0020] Figures 1A to 1F A modular data center system 100 including a secondary fluid network 102 according to one or more embodiments of the present disclosure is shown.

[0021] In one implementation, the modular data center system 100 includes a housing 101 configured to house one or more components of the system 100. For example, the housing 101 may be configured to house power and cooling systems. By another example, the housing 101 may be configured to house equipment (e.g., support data center equipment, etc.).

[0022] The housing 101 may be formed of a plurality of walls 103 defining at least one cavity configured to receive components of the system 100. In a non-limiting example, the housing 101 may include an outdoor housing. In another non-limiting example, the housing 101 may include an indoor housing.

[0023] Modular data center system 100 may include a liquid cooling system. For example, modular data center system 100 may include a direct-to-chip liquid cooling system within a cavity of housing 101. The liquid cooling system of modular data center system 100 may include a secondary fluid network 102 (as will be discussed further herein) disposed within the thermal aisles of modular data center system 100. For example, secondary fluid network 102 may be configured to provide a stable flow of coolant directly to information technology (IT) equipment within modular data center system 100. For example, secondary fluid network 102 may be configured to provide coolant directly to IT equipment within multiple racks 104.

[0024] Multiple racks 104 can be arranged in at least two rack rows 106. For example, a modular data center system 100 may include at least two rack rows 106, where each rack row 106 includes multiple racks 104. Figure 1A In the non-limiting example shown, each rack row 106 may include seven (7) racks, wherein each rack may be configured to hold a corresponding IT device. Figure 1C In the additional non-limiting example shown, each rack row 106 may include twelve (12) racks, wherein each rack may be configured to hold a corresponding IT device. Figure 1E In the additional non-limiting example shown, each rack row 106 may include ten (10) racks, wherein each rack may be configured to hold a corresponding IT device. It should be noted herein that... Figures 1A to 1F Provided for illustrative purposes only and should not be construed as limiting the scope of this disclosure. Therefore, the plurality of racks 104 may include any number and configuration of racks.

[0025] At least two rack rows 106 may include at least a first rack row 106a arranged adjacent to a second rack row 106b. For example, the first rack row 106a may be positioned at a predetermined distance d from the second rack row 106b. Although Figures 1A to 1F A specific configuration of at least two rack rows 106 is depicted, but it is envisioned that the modular data center system 100 may include at least two rack rows 106 and multiple racks 104 in any suitable configuration.

[0026] The distance d between the first rack row 106a and the second rack row 106b can form a thermal aisle 108. For example, the depth of the thermal aisle 108 can correspond to a predetermined distance d between at least two rack rows 106.

[0027] For the purposes of this disclosure, hot aisle 108 can be an area where hot air exhausted from IT equipment (and other equipment) within rack 104 is collected and directed back to the cooling system. It is envisioned herein that a predetermined distance d between at least two rack rows 106 can be based on a minimum distance for maintainability and power distribution. For example, the service area could be approximately 900 mm (or 3 ft). As another example, the service area could be approximately 800 mm.

[0028] Secondary fluid network 102 may be coupled to one or more coolant distribution units 110 (CDUs) of the liquid cooling system. For example, modular data center system 100 may include two CDUs 110. For example, each row 106 may include CDUs 110, wherein a first rack row 106a includes a first CDU 110a, and a second rack row 106b includes a second CDU 110b arranged at a selected distance from the first CDU 110a. Although Figure 1A One or more CDUs 110 are depicted arranged in a specific configuration within the secondary fluid network 102; however, it is contemplated herein that one or more CDUs 110 may be arranged in any suitable configuration based on the arrangement and / or configuration of the liquid cooling system.

[0029] One or more CDUs 110 can be configured to regulate the distribution of cooling liquid in the liquid cooling system to maintain the temperature and pressure of the liquid within specific parameters. Furthermore, one or more CDUs 110 can be configured to separate the primary chilled water circuit from the secondary fluid network 102.

[0030] The secondary fluid network 102 includes one or more main conduits 112. For example, one or more main conduits 112 may be arranged in the middle of the thermal aisle 108. For example, the secondary fluid network 102 may include two main conduits 112, wherein a first main conduit 112a is arranged at a selected distance above a second main conduit 112b (e.g., Figures 1A to 1B (As shown).

[0031] One or more main conduits 112 may be fluidly coupled to one or more CDUs 110, such that a primary loop can be connected to one or more CDUs 110. For example, each main conduit 112a, 112b may be coupled to each CDU 110a, 110b. For example, a first main conduit 112a may be coupled to each of a first CDU 110a and a second CDU 110b, wherein a second main conduit 112b may be coupled to each of a first CDU 110a and a second CDU 110b. In this respect, a first end of the first main conduit 112a may be coupled to a first CDU 110a, and a second end of the first main conduit 112a may be coupled to a second CDU 110b. Furthermore, a first end of the second main conduit 112b may be coupled to a first CDU 110a, and a second end of the second main conduit 112b may be coupled to a second CDU 110b.

[0032] Secondary fluid network 102 includes one or more branch pipes 114. For example, one or more branch pipes 114 may be fluidly connected to one or more main pipes 112. For example, one or more branch pipes 114 may be arranged perpendicular to each of one or more main pipes 112, such that one or more branch pipes 114 are arranged vertically within the hot aisle 108 of the modular data center system 100. In a non-limiting example, a first set of branch pipes 114a may be coupled to a first main pipe 112a, and a second set of branch pipes 114b may be coupled to a second main pipe 112b. Continuing with the above example, the first set of branch pipes 114a may be arranged near a first rack row 106a, and the second set of branch pipes 114b may be arranged near a second rack row 106b. In this respect, multiple racks 104 within the first rack row 106a can be coupled to a first set of branch pipes 114a, and multiple racks 104 within the second rack row 106b can be coupled to a second set of branch pipes 114b. It is envisioned that the number and / or arrangement of one or more branch pipes 114 can be adjusted based on the number and / or configuration of the multiple racks 104.

[0033] One or more branch pipes 114 may be coupled to multiple racks 104 via one or more conduits 116. For example, one or more main pipes 112 may distribute chilled liquid (e.g., chilled water) from one or more CDUs 110 to one or more branch pipes 114, and subsequently distribute the chilled liquid to multiple racks 104 via one or more conduits 116.

[0034] One or more branch pipes 114 may include one or more valves 118. For example, one or more valves 118 may be configured to selectively isolate each of the multiple racks 104. For example, the multiple racks 104 may be hot-swappable into and / or hot-swappable out of the modular data center system 100. In this respect, IT equipment within a particular rack can be removed, replaced, or upgraded while the cooling system remains active, pressurized, and operational. Therefore, maintenance downtime can be reduced and cooling efficiency can be improved.

[0035] The secondary fluid network 102 may include a central support structure 122 configured to support one or more branch pipes 114. For example, the central support structure 122 may be arranged in the middle of the thermal channel 108. For example, the central support structure 122 may be arranged vertically along a basic central axis in the middle of the thermal channel 108.

[0036] The secondary fluid network 102 may include a structure 124 installed within a portion of the thermal aisle 108. For example, the structure 124 may be installed in a horizontal plane within a portion of the thermal aisle 108 between the first rack row 106a and the second rack row 106b.

[0037] In one embodiment, structure 124 may include a grille structure 124 installed within a portion of the thermal channel 108, wherein the grille structure 124 includes one or more perforations forming a grille pattern. For example, the grille structure 124 may be a metal grille structure.

[0038] In some implementations, structure 124 may include a solid structure (i.e., without perforations). For example, structure 124 may include one or more floor panels. However, it is contemplated herein that one or more perforations / grouts in structure 124 may provide greater visibility and easier accessibility beneath structure 124.

[0039] Structure 124 may be installed at a selected distance above floor 125 of modular data center system 100, with at least a portion of one or more conduits 116 disposed beneath structure 124. For example, one or more conduits 116 may be coupled to IT equipment within multiple racks 104 mounted on floor 125 of modular data center system 100 (e.g., below or above floor 125), and one or more conduits 116 may be routed beneath structure 124 to couple to one or more branch pipes 114. In this respect, data center personnel can access one or more components of secondary fluid network 102 via structure 124 (e.g., one or more conduits 116 beneath structure, one or more main pipes 112 above hot aisle 108, one or more branch pipes 114 within hot aisle 108, one or more valves 118 on one or more branch pipes, etc.).

[0040] Structure 124 may include one or more removable sections. For example, one or more removable sections of structure 124 may be removed to access components below structure 124 (e.g., one or more conduits 116 below structure, one or more main pipes 112 above hot passage 108, one or more branch pipes 114 within hot passage 108, one or more valves 118 on one or more branch pipes, etc.).

[0041] The secondary fluid network 102 may include one or more drain trays 126. For example, one or more drain trays 126 may be arranged below the central support structure 122 and positioned near the connection point between the end of one or more branch pipes 114 and one or more conduits 116. In this respect, in the event of a leak, fluid from the secondary fluid network 102 may drip into one or more drain trays 126 below the grid structure 124, rather than dripping onto the IT equipment within the multiple racks 104.

[0042] In some embodiments, the secondary fluid network 102 may include one or more ultrasonic vibration units 127. For example, one or more ultrasonic vibration units 127 may be coupled to one or more branch pipes 114 (or main pipe 112) to agitate and remove contaminants, which may be captured or filtered by integrated filter elements. For example, one or more ultrasonic vibration units 127 may include one or more piezoelectric transducers.

[0043] Modular data center system 100 may include one or more buses 128 configured to provide power to multiple racks 104 in at least two rack rows 106. For example, as Figures 1C to 1DAs shown, one or more busbars 128 may be mounted on one or more walls 103 of the modular data center system 100. For example, in a non-limiting example, one or more busbars 128 may be mounted on the inner surface of one or more walls 103 of the modular data center system 100.

[0044] One or more walls 103 of the modular data center system 100 may include a plurality of support members 130 configured to support one or more buses 128 and couple one or more buses 128 to one or more walls 103. For example, each support member 130 may be horizontal and span a certain length of the housing 101 of the modular data center system. For example, the plurality of support members 130 may be vertically stacked on the inner surface of one or more walls 103, such that the modular data center system 100 may include rows of one or more buses 128 mounted on one or more walls 103 of the housing 101.

[0045] One or more buses 128 may include a group of buses comprising at least two or more buses. For example, at least a first group of buses 128a of one or more buses 128 may be arranged adjacent to a first rack row 106a and configured to provide power to a plurality of racks 104 of the first rack row 106a. As another example, a second group of buses 128b of one or more buses 128 may be arranged adjacent to a second rack row 106b and configured to provide power to a plurality of racks 104 of the second rack row 106b.

[0046] One or more busbars 128 may include one or more junction boxes. One or more junction boxes enable the distribution of power from the respective busbars 128 to multiple racks 104.

[0047] The housing 101 may include one or more frame support members 132 configured to provide at least partial support to the housing 101 and components within the housing 101 (e.g., equipment, secondary fluid network components, etc.). For example, the one or more frame support members 132 may include one or more vertical frame members for constructing / supporting the walls 103 of the housing 101, and one or more horizontal frame members for constructing / supporting the top of the housing 101.

[0048] The enclosure 101 may also include a door 134 that allows data center personnel to access components within the enclosure 101 (e.g., equipment, secondary fluid network components, etc.).

[0049] This document envisions that the secondary fluid network 102 of this disclosure can provide numerous advantages / benefits. For example, the secondary fluid network 102 can have a compact design, meaning that it can be fitted into a module (or modular IT infrastructure / shell) while providing other benefits. In one instance, the compact design of the secondary fluid network 102 can provide easy access to valves 118 located in the middle of the hot aisle 108. In this respect, data center personnel can immediately access valves 118 upon entry, as they are located in the middle of the hot aisle 108 on the vertical branch pipe 114. In another instance, the compact design of the secondary fluid network 102 can reduce the risk in the event of a leak—because the drain pan 126 is below the smaller vertical pipe 114 and valves 118. In the event of a leak, fluid from the secondary fluid network 102 can drip into the drain pan 126 below the grid structure 124, rather than dripping onto the IT equipment within multiple racks 104. Furthermore, the modular data center system 100 can be modified to accommodate a higher number of racks and / or a higher rack density.

[0050] The topics described herein sometimes illustrate different components contained within or connected to different other components. It should be understood that such architectures depicted are merely exemplary, and many other architectures can indeed achieve the same functionality. Conceptually, any arrangement of components that achieve the same function is effectively “associated” to achieve the desired function. Therefore, any two components combined herein to achieve a particular function can be considered “associated” with each other to achieve the desired function, regardless of the architecture or intermediate components. Similarly, any two such associated components can also be considered “operably connected” or “operably coupled” to each other to achieve the desired function, and any two components that can be suchly associated can also be considered “operably coupled” to each other to achieve the desired function. Specific examples of operably coupled components include, but are not limited to, physically matable and / or physically interactive components and / or wirelessly interactive components and / or logically interactive and / or logically interactive components.

[0051] While specific aspects of the subject matter described herein have been shown and described, it will be apparent to those skilled in the art that changes and modifications can be made based on the teachings herein without departing from the subject matter and its broader aspects, and therefore the appended claims are intended to cover within their scope all such changes and modifications that fall within the true spirit and scope of the subject matter described herein. Furthermore, it should be understood that the invention is defined by the appended claims.

Claims

1. A modular data center system, comprising: A modular housing, the modular housing including multiple walls defining a cavity; At least two rack rows are accommodated within the cavity of the modular housing, the at least two rack rows including at least a first rack row and a second rack row, wherein the first rack row is arranged at a selected distance from the second rack row to form a thermal aisle, and wherein each rack row includes a plurality of racks; One or more coolant distribution units, said one or more coolant distribution units being configured to regulate the distribution of coolant within the modular data center system; and A secondary fluid network, coupled to one or more coolant distribution units, wherein the secondary fluid network includes: One or more main pipes are coupled to one or more coolant distribution units, wherein the one or more main pipes are arranged in a portion of the thermal aisle; One or more branch pipes coupled to one or more main pipes, wherein the one or more branch pipes are arranged perpendicular to the heat aisle below the one or more main pipes; and One or more conduits, said one or more conduits being configured to couple said one or more branch conduits to said plurality of racks in said at least two rack rows, The one or more main pipes distribute the coolant from the one or more coolant distribution units to the one or more branch pipes, wherein the one or more branch pipes distribute the coolant to the plurality of racks via the one or more conduits.

2. The modular data center system according to claim 1, wherein, The secondary fluid network also includes: A structure installed within the hot aisle, wherein the structure is installed at a selected distance above the floor of the modular data center system.

3. The modular data center system according to claim 2, wherein, The structure is a grid structure, which includes one or more perforations forming a grid pattern.

4. The modular data center system according to claim 2, wherein, One or more conduits are arranged below the structure.

5. The modular data center system according to claim 4, wherein, The secondary fluid network also includes: One or more drainage trays are arranged below the structure.

6. The modular data center system according to claim 1, wherein, The one or more branch pipes include one or more valves, wherein the one or more valves are configured to selectively isolate each of the plurality of racks.

7. The modular data center system according to claim 1, further comprising: One or more buses are arranged adjacent to the first rack row and the second rack row, and the one or more buses are configured to provide power to the plurality of racks in the first rack row and the second rack row.

8. The modular data center system according to claim 7, wherein, The one or more busbars are coupled to at least two of the plurality of walls of the modular housing.

9. The modular data center system according to claim 1, wherein, The multiple racks include data center support equipment.

10. The modular data center system according to claim 1, wherein, The secondary fluid network also includes: A central support structure configured to support one or more branch pipes.

11. The modular data center system according to claim 1, wherein, The secondary fluid network also includes: One or more ultrasonic vibration units coupled to one or more branch pipes, wherein the one or more ultrasonic vibration units are configured to agitate and remove contaminants within the one or more branch pipes.

12. A liquid cooling system, comprising: One or more coolant distribution units, the one or more coolant distribution units being configured to regulate the distribution of coolant within the liquid cooling system; as well as A secondary fluid network, coupled to one or more coolant distribution units, wherein the secondary fluid network includes: One or more main pipes coupled to one or more coolant distribution units, wherein the one or more main pipes are arranged in a thermal aisle formed by at least two rack rows comprising multiple racks; One or more branch pipes coupled to one or more main pipes, wherein the one or more branch pipes are arranged below the one or more main pipes together with the heat aisle; and One or more conduits, said one or more conduits being configured to couple said one or more branch conduits to said plurality of racks in said at least two rack rows, The one or more main pipes distribute the coolant from the one or more coolant distribution units to the one or more branch pipes, wherein the one or more branch pipes distribute the coolant to the plurality of racks via the one or more conduits.

13. The liquid cooling system according to claim 12, wherein, The liquid cooling system is a direct-to-chip liquid cooling system.

14. The liquid cooling system according to claim 12, wherein, The coolant includes chilled water.

15. The liquid cooling system according to claim 12, wherein, The secondary fluid network also includes: A structure installed within the hot aisle, wherein the structure is installed at a selected distance above the floor of the data center housing.

16. The liquid cooling system according to claim 15, wherein, The structure is a grid structure, which includes one or more perforations forming a grid pattern.

17. The liquid cooling system according to claim 15, wherein, One or more conduits are arranged below the structure.

18. The liquid cooling system according to claim 15, wherein, The secondary fluid network also includes: One or more drainage trays are arranged below the structure.

19. The liquid cooling system according to claim 12, wherein, The one or more branch pipes include one or more valves, wherein the one or more valves are configured to selectively isolate each of the plurality of racks.

20. The liquid cooling system according to claim 12, wherein, The secondary fluid network also includes: One or more ultrasonic vibration units coupled to one or more branch pipes, wherein the one or more ultrasonic vibration units are configured to agitate and remove contaminants within the one or more branch pipes.