A power module with a uniform temperature heat sink

Abstract

The application discloses a power module with an even-temperature radiator, comprising a radiator body, an insulating substrate and a plurality of power chips arranged in an array. The radiator body is internally provided with a flow channel, a water inlet is arranged at the center position of the bottom of the flow channel, the projection of the water inlet is located at the geometric center of the overall layout of the plurality of power chips, and water outlets are symmetrically arranged at both sides of the bottom. The flow channel comprises a main shunt channel and a plurality of bending heat exchange channels corresponding to the arrangement of the power chips. The main shunt channel is in communication with the water inlet and extends to both sides. The bending heat exchange channels are continuously bent and are located directly below the projections of the power chips as a whole, and the bending portions of the bending heat exchange channels accurately correspond to the projection edges of the high-heat areas of the power chips. The application breaks the traditional one-way water cooling structure, adopts a symmetric shunt layout of 'water inlet at the center and water outlet at both sides', and combines with targeted heat exchange channels matched with the heat generation characteristics of the chips, so that the problems of poor even-temperature and low cold energy utilization rate of the existing radiator are effectively solved.

Description

Technical Field

[0001] This invention belongs to the field of power module technology, and specifically relates to a power module with a heat sink. Background Technology

[0002] Most liquid coolers on the market currently have only one inlet and one outlet, with coolant flowing in from one side and out from the other. This unidirectional flow structure results in higher cooling capacity on the inlet side and lower capacity on the outlet side. Consequently, the power module chip temperature is lower on the inlet side, gradually increasing along a single direction to reach its peak at the outlet side. This phenomenon leads to extremely uneven heat dissipation, poor chip temperature uniformity, and the highest and lowest chip temperatures can differ by as much as 10°C. Furthermore, with the inlet and outlet located on both sides of the module, the cooling capacity utilization efficiency of this type of cooler is low; moreover, its flow channel design is relatively simple, with the coolant flow path being evenly distributed without any optimization design based on the specific layout of the chip, failing to meet the precise heat dissipation requirements of high-heat areas.

[0003] Therefore, this application provides a power module with a heat sink with a uniform temperature distribution, which aims to solve the problems of poor temperature uniformity, low cooling capacity utilization, and mismatch between the flow channel design and chip layout of existing water-cooled heat sinks. Summary of the Invention

[0004] The present invention provides a power module with a heat sink for heat dissipation, which aims to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: A power module with a heat sink includes: a heat sink body, an insulating substrate disposed on the heat sink body, and a plurality of power chips arranged in an array on the insulating substrate. The heat sink body has a flow channel inside, and a water inlet is located at the center of its bottom. The projection of the water inlet is located at the geometric center of the overall layout of the multiple power chips. Water outlets are symmetrically located on both sides of the bottom of the heat sink body. The flow channel includes a main branch channel and multiple bend heat exchange channels. The main branch channel is connected to the water inlet and extends symmetrically to both sides. The bend heat exchange channels are arranged corresponding to the arrangement of the power chips, with one end connected to the main branch channel and the other end connected to the water outlet. The bent heat exchange channel is in a continuous bent and folded shape, and the entire bent heat exchange channel is located directly below the projection of the power chip, with the bent portion of the bent heat exchange channel corresponding to the projection edge of the power chip.

[0006] Furthermore, the bent heat exchange channel includes heat exchange sections and connecting sections that are alternately connected along the flow direction, wherein the heat exchange section serves as the bent section and its projection presses against the edge corresponding to the power chip.

[0007] Furthermore, the radiator body is provided with two symmetrically distributed return water channels. The end of the bent heat exchange channel away from the main branch channel is connected to the corresponding return water channel. The return water channel surrounds the outside of the bent heat exchange channel and is finally connected to the outlet.

[0008] Furthermore, each of the water inlets and outlets is equipped with outwardly extending pipe joints for connecting to external coolant circulation pipes.

[0009] Furthermore, the number of heat exchange sections corresponds to the number of power chips, and the projection of each heat exchange section covers the edge high-heat area of ​​the corresponding power chip.

[0010] Furthermore, the bent heat exchange channel adopts a circular arc transition at the junction of the heat exchange section and the connecting section.

[0011] Compared with the prior art, the present invention has the following technical effects: 1. Unlike traditional unidirectional flow channel designs, this invention employs a central inlet and symmetrical outlet design. Coolant flows in through the inlet at the geometric center of the corresponding chip's overall layout, and then symmetrically distributes to both sides through the main distribution channel. This allows for uniform diffusion of cooling from the center to both ends, effectively avoiding the thermal gradient accumulation phenomenon caused by unidirectional coolant flow, where the inlet side has a low temperature and the outlet side has a high temperature. This significantly reduces the temperature difference between the various power chips and improves the overall reliability of the module's operation.

[0012] 2. In this invention, the bent portion of the heat exchange channel precisely corresponds to the projected edge of the power chip. Since the edge of the power chip is usually a high-heat area with concentrated thermal stress and the highest heat generation during operation, this design allows the coolant to precisely remove the heat from the chip edge. At the same time, the continuously bent structure increases the turbulence and heat exchange area of ​​the coolant directly below the chip, further improving the utilization rate of cooling capacity and heat dissipation efficiency.

[0013] 3. The bent heat exchange channel of the present invention adopts an arc transition at the junction of the heat exchange section and the connecting section, which guides the coolant to transition smoothly, eliminates the dead zone of eddy current, reduces the local resistance coefficient, and thus ensures a more uniform flow distribution among multiple parallel channels. In addition, the outer return water channel surrounds the bend heat exchange channel, which not only plays the role of collecting return water, but also assists in cooling the edge of the module, forming a cold coating, and further improves the temperature uniformity of the module edge. Attached Figure Description

[0014] Figure 1 This is an isometric view of the upper side of a power module with a heat sink according to the present invention; Figure 2 This is a front view of a power module with a heat sink according to the present invention; Figure 3 This is a bottom schematic diagram of a power module with a heat sink according to the present invention; Figure 4 This is a planar layout diagram of the internal flow channels of the radiator body described in this invention; Figure 5 This is a diagram showing the relationship between the internal flow channels of the heat sink body and the projected position of the chip, as described in this invention. Figure 6 This is a schematic diagram of the turbulence column arrangement of a power module with a heat sink according to the present invention.

[0015] In the picture: 1. Radiator body; 101. Heat dissipation base plate; 102. Water inlet; 103. Water outlet; 104. Main distribution channel; 105. Bent heat exchange channel; 1051. Heat exchange section; 1052. Connecting section; 1503. Turbulence column; 106. Return water channel; 2. Insulating substrate; 3. Power chip; 4. Pipe joints. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present application and with reference to the accompanying drawings.

[0017] like Figure 1-5 As shown, a power module with a uniform heat sink is characterized in that it includes: a heat sink body 1, an insulating substrate 2 disposed on the heat sink body 1, and a plurality of power chips 3 arranged in an array on the insulating substrate 2. The heat sink body 1 has a flow channel inside, and a water inlet 102 is provided at the center of its bottom. The projection of the water inlet 102 is located at the geometric center of the overall layout of the multiple power chips 3. Water outlets 103 are symmetrically provided on both sides of the bottom of the heat sink body 1. The flow channel includes a main branch channel 104 and multiple bent heat exchange channels 105. The main branch channel 104 is connected to the inlet 102 and extends symmetrically to both sides. The bent heat exchange channels 105 are arranged corresponding to the arrangement of the power chips 3, with one end connected to the main branch channel 104 and the other end connected to the outlet 103. The bent heat exchange channel 105 is in a continuous bent and folded shape, and the entire bent heat exchange channel 105 is located directly below the projection of the power chip 3, with the bent portion of the bent heat exchange channel 105 corresponding to the projection edge of the power chip 3.

[0018] In one specific embodiment, the radiator inlet and outlet can be a single inlet and double outlet, or a double inlet and double outlet or multiple inlet and multiple outlet pattern, and this application does not limit this.

[0019] like Figure 4-5 As shown, the bent heat exchange channel 105 includes a heat exchange section 1051 and a connecting section 1052 that are alternately connected along the flow direction. The heat exchange section 1051 serves as the bent section and its projection presses against the edge corresponding to the power chip 3.

[0020] like Figure 4 As shown, the radiator body 1 is also provided with two symmetrically distributed return water channels 106. The end of the bent heat exchange channel 105 away from the main branch channel 104 is connected to the corresponding return water channel 106. The return water channel 106 surrounds the outside of the bent heat exchange channel 105 and finally connects to the outlet 103.

[0021] like Figure 3 As shown, each of the water inlet 102 and each of the water outlets 103 is equipped with an outwardly extending pipe joint 4 for connecting to an external coolant circulation pipeline.

[0022] like Figure 5 As shown, the number of heat exchange sections 1051 corresponds to the number of power chips 3, and the projection of each heat exchange section 1051 covers the edge high-heat area of ​​the corresponding power chip 3.

[0023] like Figure 4 As shown, the bent heat exchange channel 105 adopts an arc transition at the junction of the heat exchange section 1051 and the connecting section 1052.

[0024] This invention provides a power module with a heat sink, mainly comprising a heat sink body 1, an insulating substrate 2 disposed on the heat sink body 1, and a plurality of power chips 3 arranged in an array on the insulating substrate 2. The heat sink body 1 is typically made of a metal material with good thermal conductivity, such as aluminum alloy or copper; the insulating substrate 2 is used to support the power chips 3 and achieve electrical isolation and heat conduction. In this embodiment, the power chips 3 are arranged in two symmetrical arrays on the insulating substrate 2.

[0025] like Figure 3 and Figure 4As shown, the radiator body 1 has internal flow channels, with an inlet 102 located at the center of its bottom. The projection of the inlet 102 is located at the geometric center of the overall array layout of the multiple power chips 3. Outlets 103 are symmetrically located on both sides of the bottom of the radiator body 1. To facilitate connection with an external cooling system, outward-extending pipe connectors 4 are installed at both the inlet 102 and each outlet 103 for connecting to external coolant circulation pipes. The internal flow channel system of the radiator body 1 mainly includes a main branch channel 104 and multiple bent heat exchange channels 105. The main branch channel 104 is connected to the central inlet 102 and extends symmetrically to both sides along the length of the insulating substrate 2. This symmetrical flow channel architecture, with inlet in the middle and outlet at both ends, ensures that the freshest coolant with the lowest temperature enters first from the central area and is evenly distributed to both sides, effectively avoiding the significant temperature gradient caused by traditional single-sided inlet / outlet structures, and guaranteeing uniform heat dissipation from a macroscopic flow perspective.

[0026] like Figure 5 As shown in the projection position relationship, the edge area of ​​the power chip 3 is often a high-heat area when it is working. The present invention places the projection of the heat exchange part 1051 exactly on the edge of the corresponding power chip 3, and the number of heat exchange parts 1051 corresponds to the number of power chips 3, so that each bend can accurately cover the high-heat area of ​​a chip edge. When the coolant passes through the heat exchange part 1051, the change in the flow direction will generate local disturbance, which will destroy the thermal boundary layer, thereby achieving enhanced heat transfer at the position with the highest heat generation.

[0027] To reduce system flow resistance, the bent heat exchange channel 105 adopts a rounded transition design at the junction of the heat exchange section 1051 and the connecting section 1052, avoiding head loss and dead water zone caused by right-angle bends.

[0028] In addition, such as Figure 4 As shown, the radiator body 1 also has two symmetrically distributed return water channels 106 inside. The end of the bent heat exchange channel 105 away from the main branch channel 104 is connected to the corresponding return water channel 106. The return water channel 106 surrounds the outside of all the bent heat exchange channels 105 in a semi-encircling shape, and finally converges and connects to the outlets 103 on both sides. While guiding the coolant out, the return water channel 106 uses the remaining cooling capacity of the coolant to provide enveloping cooling to the outer area of ​​the module, further reducing the heat accumulation effect at the edge of the module.

[0029] Working principle: During operation, external low-temperature coolant is pumped into the radiator body 1 through the pipe joint 4 at the central inlet 102. The coolant first enters the main distribution channel 104 and is evenly distributed to the left and right sides. Subsequently, the coolant enters multiple bend heat exchange channels 105. When flowing through each heat exchange section 1051, it specifically removes the heat from the high-heat area at the edge of the power chip 3 directly above it. The coolant after absorbing heat flows into the outer return channel 106 and is finally discharged from the module through the symmetrical outlets 103 on both sides, completing a high-efficiency and uniform cooling cycle.

[0030] like Figure 6 As shown, in a preferred embodiment of the present invention, in order to further improve the precise heat dissipation efficiency of the high-heat area at the edge of the power chip 3 without significantly increasing the overall flow resistance of the water cooling system, the bent heat exchange channel 105 is provided with a turbulence column 1053 inside the corresponding heat exchange part 1051; and the turbulence column 1053 is only provided on the side wall of the heat exchange part 1051, and the turbulence column 1053 is not provided in the connecting part 1052 of the bent heat exchange channel 105 or in the internal area of ​​the main branch channel 104.

[0031] Furthermore, the cross-sectional shape of the turbulence-disrupting columns 501 can be circular, square, rhomboid, elliptical, or teardrop-shaped. Preferably, the plurality of turbulence-disrupting columns 501 are arranged in a staggered, quincunx pattern inside the heat exchange section 1051. When the coolant flows through this area, the staggered turbulence-disrupting columns 501 continuously and intensely divide, strip, and circulate the fluid, causing local shear flow and eddies to be generated. This forcibly disrupts the thermal boundary layer formed on the flow channel surface, greatly enhancing the local convective heat transfer coefficient directly below the high-heat zone.

[0032] Furthermore, the internal surface of the heat exchange section 1051 is provided with a surface roughening structure. This surface roughening structure can be directly formed on the bottom surface and inner sidewall of the flow channel of the heat exchange section 1051 through processing methods such as sandblasting and chemical etching, making the surface roughness of the inner wall of the heat exchange section 1051 significantly greater than that of the inner wall of the connecting section 1052. Utilizing the microscopic undulations of the rough surface, minute disturbances can be induced in the boundary layer fluid at its microscopic wall surface, prompting the near-wall fluid to enter a turbulent state earlier or faster, thereby reducing thermal resistance and improving heat exchange efficiency.

[0033] Because the power chip 3 generates extremely high heat during operation, and the heat flux density distribution on the insulating substrate 2 is extremely uneven, its edge area is often the main hot spot. If the turbulence structure is blindly arranged throughout the entire heat dissipation channel, although it can improve heat dissipation, it will lead to a sharp increase in the internal flow resistance of the entire water-cooled plate. This not only places excessive power requirements on the external pumping system and greatly increases energy consumption, but also causes excessive pressure inside the heat sink, leading to the risk of system leakage or cracking. However, this invention strictly confines the turbulence microstructure inside the heat exchange part 1051 that directly supports the high-heat area at the edge of the chip. This allows fresh and low-temperature coolant to be strongly disturbed and intensified by the turbulence microstructure when it enters the area below the heating zone on a macroscopic level. This ensures that the highest heat exchange performance is precisely delivered to the high-heat area at the edge of the chip that needs the most cooling. When the coolant absorbs heat and leaves the high-heat area, it enters the connecting part 1052, which serves as a connection and guide. Because the inner wall of the connecting part 1052 is smooth and there is no obstruction from any turbulence structure, the fluid can pass through with extremely low resistance and extremely high flow rate.

[0034] This stepped flow resistance design, while conforming to the spatial distribution of the three hot spots of the power chip and providing extremely precise and enhanced convective heat transfer, keeps the total pressure drop of the overall heat dissipation channel at an extremely low level, achieving a balance between high-efficiency heat dissipation performance and low hydrodynamic power consumption.

[0035] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the inventive concept of the present invention, and these all fall within the protection scope of the present invention.

Claims

1. A power module with a heat sink, characterized in that, include: The heat sink body (1), the insulating substrate (2) disposed on the heat sink body (1), and the multiple power chips (3) arranged in an array on the insulating substrate (2). The heat sink body (1) has a flow channel inside, and a water inlet (102) is provided at the center of its bottom. The projection of the water inlet (102) is located at the geometric center of the overall layout of the multiple power chips (3). Water outlets (103) are symmetrically provided on both sides of the bottom of the heat sink body (1). The flow channel includes a main branch channel (104) and multiple bend heat exchange channels (105). The main branch channel (104) is connected to the inlet (102) and extends symmetrically to both sides. The bend heat exchange channels (105) are arranged according to the arrangement position of the power chip (3), with one end connected to the main branch channel (104) and the other end connected to the outlet (103). The bent heat exchange channel (105) is in a continuous bent and folded shape, and the entire bent heat exchange channel (105) is located directly below the projection of the power chip (3), with the bent portion of the bent heat exchange channel (105) corresponding to the projection edge of the power chip (3).

2. A power module with a heat sink according to claim 1, characterized in that, The bent heat exchange channel (105) includes heat exchange sections (1051) and connecting sections (1052) that are alternately connected along the flow direction. The heat exchange section (1051) serves as the bent section and its projection presses against the edge corresponding to the power chip (3).

3. A power module with a heat sink according to claim 2, characterized in that, The radiator body (1) is also provided with two symmetrically distributed return water channels (106). The end of the bent heat exchange channel (105) away from the main branch channel (104) is connected to the corresponding return water channel (106). The return water channel (106) surrounds the outside of the bent heat exchange channel (105) and finally connects to the outlet (103).

4. A power module with a heat sink according to claim 3, characterized in that, Each of the water inlets (102) and each of the water outlets (103) is equipped with an outwardly extending pipe joint (4) for connecting to an external coolant circulation pipe.

5. A power module with a heat sink according to claim 4, characterized in that, The number of heat exchange sections (1051) corresponds to the number of power chips (3), and the projection of each heat exchange section (1051) covers the edge high-heat area of ​​the corresponding power chip (3).

6. A power module with a heat sink according to claim 5, characterized in that, The bent heat exchange channel (105) adopts a rounded transition at the junction of the heat exchange section (1051) and the connecting section (1052).

Images