A three-dimensional twisted fin microchannel heat sink
Patent Information
- Application Number
- CN202610901110.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-06-22
- Publication Date
- 2026-09-22
AI Technical Summary
换热效果有限，局部温度不均匀；
换热强化显著：本发明提出的扭曲结构能够对流体产生有效的扰动，经过实验测试，努塞尔数平均提升大于20%，对流换热系数提升约31%~51%；
Smart Images
Figure CN122803222A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of single-phase and two-phase flow heat dissipation technology, and more particularly to a finned microchannel heat dissipation device. It is suitable for heat dissipation management in high heat flux density electronic devices, data centers, and power electronic equipment. Background Technology
[0002] With the rapid development of microelectronic devices, data centers, and high-performance computing (HPC) systems, chip power density is constantly increasing, and local heat flux can even exceed 1000 W / cm². Traditional air cooling and simple liquid cooling solutions can no longer meet the needs of efficient thermal management.
[0003] Microchannel heat transfer has become a research hotspot due to its high heat transfer efficiency, compact structure, and good integrability. However, the fluid within microchannels is mostly in a laminar flow state, with a thick and stable thermal boundary layer, resulting in limited heat transfer capacity. While existing technologies, such as common straight-fin or rectangular-fin microchannels, have improved heat transfer performance to some extent, they suffer from the following shortcomings: The heat exchange effect is limited, and the local temperature is uneven. Excessive pressure drop leads to decreased system energy efficiency; It is difficult to simultaneously enhance heat transfer and control flow resistance.
[0004] Therefore, there is an urgent need for a new type of microchannel structure that can both enhance heat exchange and reasonably control flow resistance, thereby improving the overall performance of the system. Summary of the Invention
[0005] The purpose of this invention is to provide a three-dimensional torsion turbulence finned microchannel heat dissipation device. By improving the traditional finned microchannel, it realizes three-dimensional turbulent flow of fluid, enhances boundary layer disruption and fluid mixing, reduces wall temperature and thermal resistance, and at the same time takes into account flow resistance control, thereby improving overall energy efficiency.
[0006] The solution of the present invention is: a three-dimensional tortuous flow microchannel heat dissipation device, comprising an external flow channel substrate and a flow guide substrate connected in sequence, and a three-dimensional tortuous fin microchannel substrate, wherein the three-dimensional tortuous fin microchannel substrate comprises a base and a fin array; the angle between each fin in the fin array and the incoming flow direction changes continuously along the fin height direction, forming a three-dimensional turbulent flow, which enhances fluid mixing and disrupts the boundary layer structure.
[0007] Preferably, the cross-section of the fin in the direction of airflow is airfoil-shaped or rectangular, and a twisted structure is generated along the height direction.
[0008] Preferably, when the cross-section of the fin in the direction of incoming flow is airfoil-shaped, the pitch angle of the fin twist structure changes continuously with height, the angle between the fin root chord and the direction of incoming flow is 0°, and the angle between the fin tip chord and the direction of incoming flow is 12-18°; when the cross-section of the fin in the direction of incoming flow is rectangular, the torsion angle of the fin twist structure changes continuously with height, the angle between the axis of the fin root rectangle along its length and the direction of incoming flow is 0°, and the angle between the axis of the fin tip rectangle along its length and the direction of incoming flow is 12-18°.
[0009] Preferably, when the fin cross-section is rectangular, the projected length of the rectangular fin along the incoming flow direction is 0.8-3mm, the thickness is 0.05-0.5mm, and the height is 0.5-2mm; preferably, the projected length is 1.5mm, the thickness is 0.2-0.3mm, and the height is 1-2mm.
[0010] Preferably, when the fin cross-section is rectangular, the rectangular fin takes the long side direction as the chord direction and rotates continuously around the central axis of the fin along different cross-sections in the height direction to form a continuously variable pitch rectangular three-dimensional twisted fin, and periodic contraction-expansion turbulence microchannels are formed between the rectangular fins.
[0011] Preferably, in the fin array, the spacing between fins perpendicular to the flow direction is 1-2 mm; the fins are arranged in a crisscross pattern along the fluid flow direction, with the distance between the apexes of adjacent fins being 0.9-2 mm; the fin height is 0.5-2 mm, the fin chord length / length is 1.5-3 mm, and the fin width is 0.2-1 mm.
[0012] Preferably, the fin density in the fin array is 40-100 fins / square centimeter.
[0013] Preferably, the external flow channel substrate is provided with a refrigerant inlet and a refrigerant outlet; the flow guide substrate is provided with a flow guide groove and a flow guide plate near the refrigerant inlet, and the flow guide substrate is provided with a flow guide groove and a flow guide plate near the refrigerant outlet; the external flow channel substrate and the flow guide substrate are sealed together using waterproof adhesive through a cover plate sealing rubber ring; the three-dimensional twisted turbulence fin microchannel substrate and the flow guide substrate are sealed together using waterproof sealant through a base sealing rubber ring.
[0014] Preferably, the refrigerant inlet and refrigerant outlet are perpendicular to the upper surface of the fins.
[0015] Preferably, the working fluid is deionized water or dielectric coolant.
[0016] Preferably, the external flow channel substrate is made of transparent material, and the fin material is copper.
[0017] This invention is applied to chip heat dissipation, data center liquid cooling systems, or thermal management of high-power electronic devices.
[0018] The three-dimensional twisted turbulence finned microchannel heat dissipation device of the present invention improves the heat transfer coefficient by 30%–55% under the conditions of heat transfer power of 180–360 W and Reynolds number of 230–530. Under the conditions, the performance evaluation factor PEC ≥ 1.2 and the performance coefficient COP ≥ 2 times that of the traditional non-twisted finned microchannel structure.
[0019] The beneficial effects of this invention compared to the prior art are: Significantly enhanced heat transfer: The twisted structure proposed in this invention can effectively disturb the fluid. Experimental tests show that the Nusselt number is increased by an average of more than 20%, and the convective heat transfer coefficient is increased by about 31% to 51%. Uniform temperature distribution: The average wall temperature is reduced by 6.7~10.6 K, suppressing local overheating; Flow resistance optimization: PEC exceeds 1.4; Significantly improved energy efficiency: Maximum COP exceeds 210,000, more than twice that of traditional structures; Wide range of applications: suitable for chip cooling, data center liquid cooling, and power electronics heat dissipation. Attached Figure Description
[0020] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0021] Figure 1 An exploded perspective view of the three-dimensional twisted turbulence fin microchannel heat dissipation device provided in an embodiment of the present invention; Figure 2 A twisted perspective view of a single three-dimensional twisted airfoil provided in an embodiment of the present invention; Figure 3 A twisted perspective view of a single three-dimensional twisted rectangular fin provided in an embodiment of the present invention; Figure 4 Electron microscope image of the fins of the three-dimensional torsion airfoil microchannel heat dissipation device provided in this embodiment; Figure 5 A perspective view of the three-dimensional twisted turbulence fin microchannel substrate provided in an embodiment of the present invention; Figure 6 A three-dimensional perspective view of the external flow channel substrate provided in an embodiment of the present invention; Figure 7 A three-dimensional perspective view of the flow-guiding substrate provided in an embodiment of the present invention; Figure 8 A schematic diagram of the arrangement and distribution of three-dimensional turbulence fins provided in an embodiment of the present invention; Figure 9 A schematic diagram showing the distribution of the inlet channel, outlet channel, and microchannels provided in an embodiment of the present invention; Figure 10 A comparison of temperature curves between the three-dimensional tortuous turbulence finned microchannel heat dissipation device provided in this embodiment and a traditional finned microchannel heat dissipation device in actual heat dissipation tests. Figure 11 The graph shows the variation trend of the average performance evaluation factor PEC with Reynolds number in actual heat dissipation tests of the three-dimensional tortuous turbulence finned microchannel heat dissipation device provided in this embodiment and the traditional finned microchannel heat dissipation device. Figure 12 Infrared thermal images of the temperature distribution of the three-dimensional torsion turbulence finned microchannel heat dissipation device provided in this embodiment and the traditional finned microchannel heat dissipation device in actual heat dissipation tests. Figure 13 The diagram illustrates the application of the three-dimensional torsion turbulence finned microchannel heat dissipation device provided in this embodiment and the traditional finned microchannel heat dissipation device in the field of chip heat dissipation. Among them, 1-three-dimensional twisted fin microchannel substrate, 2-fin, 3-flow guide substrate, 4-rubber ring, 5-flow guide groove, 6-flow guide plate, 7-external flow channel substrate, 8-refrigerant inlet, 9-refrigerant outlet, 10-cover plate sealing groove, 11-cover plate sealing rubber ring, 12-base sealing rubber ring. Detailed Implementation
[0022] The following will be combined with the appendix Figure 1-13 The technical solutions of the present invention are clearly and completely described in the embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0023] It should be noted that in the description of this invention, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0024] It should be noted that in the description of this invention, the terms "connection" and "installation" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or a connection through an intermediate medium; they can refer to a mechanical connection or an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0025] The geometry of microchannels has a significant impact on heat transfer performance. Factors such as channel width, aspect ratio, fin structure, and surface roughness directly determine the fluid flow state, boundary layer development, and heat transfer efficiency. Optimizing the microchannel structure (such as corrugated channels, stepped channels, and airfoil fins) can enhance fluid turbulence, increase the convective heat transfer coefficient, and improve temperature uniformity, while effectively reducing pressure drop losses and achieving better thermal management performance.
[0026] Traditional flat microchannel cooling devices are prone to air bubble accumulation within the microchannels, leading to uneven distribution of the cooling fluid, significant localized overheating, and impacting heat dissipation efficiency and equipment reliability. Furthermore, existing manifold microchannel two-phase cooling devices generally suffer from uneven flow distribution, uneven temperature distribution, and limited overall flow heat transfer efficiency under high heat flux densities.
[0027] Three-dimensional twisted finned microchannels can effectively alleviate local overheating problems; however, due to limitations in traditional fabrication techniques, experimental research in this area is limited. This application designs and fabricates a three-dimensional twisted turbulence-induced finned microchannel heat dissipation device, referring to… Figure 1 , Figure 4 and Figure 12 The device includes a three-dimensional twisted turbulence fin microchannel substrate 1, a flow guiding substrate 3, and an external flow channel substrate 7 connected in sequence. The external flow channel substrate 7 is provided with a refrigerant inlet 8 and a refrigerant outlet 9. The flow guiding substrate 3 is provided with a flow guiding groove 5 and a flow guiding plate 6 near the refrigerant inlet 8, and the flow guiding substrate 3 is provided with a flow guiding groove 5 and a flow guiding plate 6 near the refrigerant outlet 9. The external flow channel substrate 6 and the flow guiding substrate 3 are sealed together using waterproof adhesive through a cover plate sealing rubber ring 11. The three-dimensional twisted turbulence fin microchannel substrate 1 is composed of a base and fins 2 arranged in a cross array. The three-dimensional twisted turbulence fin microchannel substrate 1 and the flow guiding substrate 3 are sealed together using waterproof sealant through a base sealing rubber ring.
[0028] In this embodiment, as Figure 8As shown, the chord length L of fin 2 is 1.5mm, the width W at its widest point is 0.24mm, the maximum twist angle a of fin 2 along the height direction is 15°, the distance D between the leading edges of adjacent fins 2 is 1.2mm, the distance T1 between the chords of adjacent rows of fins 2 is 0.6mm, the distance T2 between the chords of adjacent fins 2 in the same row is 1.2mm, the base size of the three-dimensional twisted fin microchannel substrate is 1mm×28mm×38mm, and the global size of the fin 2 array is 1mm×22mm×32mm.
[0029] Optionally, the external flow channel substrate 7 may be made of high-temperature resistant transparent resin, which should not produce significant deformation at a high temperature of 110°C; and / or, the flow guiding substrate 3 may be made of high-temperature resistant nylon resin, which should not produce significant deformation at a high temperature of 150°C; and / or, the waterproof sealant used for sealing should have a certain elasticity after curing to ensure that it does not lose its sealing performance when the equipment temperature changes drastically; and / or, when the fins 2 use corrosive refrigerants, appropriate post-treatment may be performed, such as galvanizing, to improve oxidation resistance and enhance corrosion resistance.
[0030] Reference Figure 4 The twist angle of fin 2 as the height changes should be selected from 12-18° according to specific requirements. Reducing the twist angle helps to reduce pressure drop loss and pump power, while increasing the twist angle helps to improve the heat transfer coefficient, reduce the average temperature of the heat dissipation wall, and improve the uniformity of temperature distribution. In this embodiment, it has been verified that the twist angle of 15° is the optimal angle.
[0031] Reference Figure 8 The number of fins in the array 2 should be adjusted according to the design requirements of the heat dissipation device. Increasing the number of fins helps to reduce the temperature of the heat exchange equipment, while decreasing the number of fins helps to reduce pressure drop. In this embodiment, the number of fins in the array 2 is 389. Furthermore, the height of the fins 2 should be adjusted between 0.5-2mm according to the design requirements of the heat dissipation device. Increasing the height of the fins 2 helps to enhance the heat transfer coefficient, reduce the temperature of the heat exchange wall, and improve the uniformity of temperature distribution. In this embodiment, the height of the fins 2 is 1mm. Furthermore, the distance between the leading edges of adjacent fins should be adjusted between 0.8-2 times the fin chord length according to the design requirements of the heat dissipation device. Decreasing the distance helps to reduce the average temperature of the heat exchange wall, while increasing the distance helps to reduce pressure drop. In this embodiment, the distance is 0.8 times the fin chord length.
[0032] Reference Figure 5 The arrows in the figure indicate the flow direction of some of the refrigerant. After entering the heat dissipation device through the refrigerant inlet 8, the refrigerant is dispersed by the guide plate 6 and flows evenly into the three-dimensional twisted fin microchannel substrate 1. Then, it flows out through the refrigerant outlet 9 after being converged by the guide plate 6.
[0033] The technical effectiveness of the heat dissipation device provided in this application will be verified by an actual heat dissipation test experiment.
[0034] The purpose of this experiment is to verify the improvement in flow heat transfer capability of the three-dimensional torsion turbulence fin microchannel heat dissipation device provided in this application compared with the traditional two-dimensional torsion turbulence fin microchannel heat dissipation device.
[0035] Both three-dimensional and two-dimensional torsion airfoil-shaped microchannels were fabricated using a copper base. Both types of fins are 1500 μm long, 0.24 μm wide, and 1000 μm high, arranged in a staggered pattern, with a total of 389 fins. Experimental conditions included a heating power between 180 and 360 W, deionized water as the working fluid, an inlet temperature of 10°C, and a Reynolds number (Re) between 230 and 530 for the flow rate. A comparison of the temperature curves of the three-dimensional torsion airfoil-shaped microchannel heat dissipation device provided in this application and a traditional two-dimensional torsion airfoil-shaped microchannel heat dissipation device in actual heat dissipation tests is shown below. Figure 10 As shown, the results indicate that the heat transfer coefficient of the airfoil continuous variable pitch fin structure is about 31% higher than that of the airfoil fixed pitch fin structure, while the PEC remains above 1.2. Figure 11 As shown, this indicates a higher heat transfer coefficient and a significant improvement in heat transfer capacity. The heat dissipation device provided in this application has a more uniform temperature distribution, such as... Figure 12 As shown, the performance of the three-dimensional twisted turbulence fin microchannel heat dissipation device is better than that of the traditional two-dimensional twisted fin microchannel heat dissipation device in all the working conditions involved in the experiment, indicating that the three-dimensional twisted turbulence fin microchannel heat dissipation device of this application is more suitable for application scenarios with higher requirements for heat exchange capacity.
[0036] The parts of this invention not described in detail are common knowledge to those skilled in the art.
Claims
1. A three-dimensional tortuous flow-disrupting fin microchannel heat dissipation device, comprising an external flow channel substrate and a flow-guiding substrate connected in sequence, characterized in that: It also includes a three-dimensional twisted fin microchannel substrate, which includes a base and a fin array; the angle between each fin in the fin array and the incoming flow direction changes continuously along the fin height direction, forming a three-dimensional turbulent flow, which enhances fluid mixing and disrupts the boundary layer structure.
2. The three-dimensional torsion turbulence fin microchannel heat dissipation device according to claim 1, characterized in that: The cross-section of the fins in the direction of airflow is airfoil-shaped or rectangular, and a twisted structure is generated along the height direction.
3. The three-dimensional torsion turbulence fin microchannel heat dissipation device according to claim 2, characterized in that: When the cross-section of the fin in the direction of incoming flow is airfoil-shaped, the pitch angle of the fin twist structure changes continuously with height. The angle between the fin root chord and the direction of incoming flow is 0°, and the angle between the fin tip chord and the direction of incoming flow is 12-18°. When the cross-section of the fin in the direction of incoming flow is rectangular, the torsion angle of the fin twist structure changes continuously with height. The angle between the axis of the fin root rectangle along its length and the direction of incoming flow is 0°, and the angle between the axis of the fin tip rectangle along its length and the direction of incoming flow is 12-18°.
4. The three-dimensional torsion turbulence fin microchannel heat dissipation device according to claim 2, characterized in that: When the fin cross-section is rectangular, the projected length of the rectangular fin along the incoming flow direction is 0.8-3mm, the thickness is 0.05-0.5mm, and the height is 0.5-2mm; preferably, the projected length is 1.5mm, the thickness is 0.2-0.3mm, and the height is 1-2mm.
5. The three-dimensional torsion turbulence fin microchannel heat dissipation device according to claim 2, characterized in that: When the fin cross-section is rectangular, the rectangular fin takes the long side direction as the chord direction and rotates continuously around the central axis of the fin along different cross-sections in the height direction to form a continuously variable pitch rectangular three-dimensional twisted fin. The rectangular fins form a periodic contraction-expansion turbulence microchannel.
6. The three-dimensional torsion turbulence fin microchannel heat dissipation device according to claim 1, characterized in that: In the fin array, the spacing between fins perpendicular to the flow direction is 1-2 mm; the fins are arranged in a crisscross pattern along the fluid flow direction, with the distance between the apexes of adjacent fins being 0.9-2 mm; the fin height is 0.5-2 mm, the fin chord length / length is 1.5-3 mm, and the fin width is 0.2-1 mm.
7. The three-dimensional torsion turbulence fin microchannel heat dissipation device according to claim 1, characterized in that: The fin density in the fin array is 40-100 fins / square centimeter.
8. The three-dimensional torsion turbulence fin microchannel heat dissipation device according to claim 1, characterized in that: The external flow channel substrate has a refrigerant inlet and a refrigerant outlet; the flow guide substrate has a flow guide groove and a flow guide plate near the refrigerant inlet, and a flow guide substrate has a flow guide groove and a flow guide plate near the refrigerant outlet; the external flow channel substrate and the flow guide substrate are sealed together with waterproof adhesive through a cover plate sealing rubber ring; the three-dimensional twisted turbulence fin microchannel substrate and the flow guide substrate are sealed together with waterproof sealant through a base sealing rubber ring.
9. A three-dimensional torsion turbulence finned microchannel heat dissipation device according to claim 8, characterized in that: The refrigerant inlet and refrigerant outlet are perpendicular to the upper surface of the fins.
10. The three-dimensional torsion turbulence fin microchannel heat dissipation device according to claim 1, characterized in that: The working fluid is deionized water or dielectric coolant.
11. The three-dimensional torsion turbulence fin microchannel heat dissipation device according to claim 1, characterized in that: The external flow channel substrate is made of transparent material, and the fins are made of copper.
12. The three-dimensional torsion turbulence finned microchannel heat dissipation device according to claim 1, characterized in that: It is used for chip heat dissipation, data center liquid cooling systems, or thermal management of high-power electronic devices.