Cooling plate structure

Abstract

The present application provides a cooling plate structure, comprising a diamond substrate and a carrier. The diamond substrate has a heat receiving surface and a heat dissipating surface. The carrier is integrally formed with a frame assembly on the periphery of the diamond substrate to provide protection or structural fixation. The diamond substrate is directly contacted by a heat source member and a heat dissipating member through the heat receiving surface and the heat dissipating surface, respectively, under the support of the carrier. The high thermal conductivity and low thermal resistance of the diamond material can greatly improve the overall heat dissipation efficiency.

Description

Technical Field

[0001] This invention relates to the field of cooling technology, and in particular to a cooling plate structure. Background Technology

[0002] As the processing speed and power density of electronic components gradually increase, the heat generated during operation also increases. If this heat cannot be dissipated from the electronic components in a timely manner, the operating temperature of the components will rise, thereby affecting their performance, reliability, and lifespan. Therefore, improving the heat dissipation efficiency of electronic components has become an important issue in related technical fields.

[0003] Currently, to utilize the high thermal conductivity of diamond, the industry generally categorizes common heat dissipation structures (heat sinks) into two main approaches. One approach involves attaching a powdered diamond material to one side of a metal layer or plate to form a diamond layer, which together with the metal plate constitutes a heat dissipation structure. The other approach involves bonding a powdered diamond layer to one side of a metal plate, and then stacking another metal plate on the other side of the powdered diamond layer to create an interlocking sandwich structure. For example, a multi-layered sandwich structure can be formed by alternating layers of copper and diamond. While these methods introduce diamond material into the heat dissipation structure, the heat conduction path still requires indirect heat transfer through the metal layer or other intermediate layers.

[0004] Specifically, in the aforementioned fully-attached or sandwich-layered structures, the diamond layer typically does not directly contact both the heat source component and the heat dissipation end simultaneously. Instead, heat is first transferred to the diamond layer via the metal layer, or vice versa. In other words, such structures are essentially still indirect contact heat transfer structures. Although diamond material itself has a high thermal conductivity and low thermal resistance, the presence of the metal layer still creates thermal resistance and limits the overall heat transfer efficiency, preventing the heat dissipation structure from fully utilizing the low thermal resistance advantage of diamond material. Therefore, how to enable the diamond material to directly contact the heat source component and the heat dissipation end under fixed or load-bearing conditions, thereby reducing or eliminating the thermal resistance caused by the metal layer or interlayer, has become a problem that needs to be improved in related technical fields. Summary of the Invention

[0005] The purpose of this invention is to provide a cooling plate structure that allows the heated surface and the heat dissipation surface of a diamond substrate to directly contact the heat source component and the heat dissipation medium (or heat dissipation component) respectively when the substrate is fixed and supported, thereby improving the overall heat dissipation efficiency.

[0006] To achieve the above objectives, the present invention provides a cooling plate structure comprising a diamond substrate and a carrier. The diamond substrate has a heat dissipation surface and a heat receiving surface. The carrier is formed integrally around the periphery of the diamond substrate by injection molding to form a frame, thereby covering and fixing the periphery of the diamond substrate to provide protection or structural fixation. The carrier integrally surrounds the diamond substrate, allowing the portions of the diamond substrate not covered by the carrier to be exposed while supported by the carrier, and enabling direct contact between the heat dissipation medium or component and the heat source component, respectively.

[0007] The diamond substrate is either a single-crystal diamond or a polycrystalline diamond.

[0008] The carrier is integrally formed on the periphery of the diamond substrate by at least one of the following methods: injection molding, compression molding, casting molding, or 3D printing.

[0009] The carrier can be made of a metallic material, a polymer material, or a thermally conductive composite material.

[0010] To achieve the above objectives, the present invention provides a cooling plate structure manufactured by 3D printing, comprising: a diamond substrate, which is a molded body (substrate) formed by 3D printing of nano-sized diamond powder and adhesive material, the molded body having a heat dissipation surface and a heat receiving surface; and a carrier, which is also formed on the periphery of the diamond substrate by 3D printing, injection molding, compression molding, casting, etc., to cover and fix the periphery of the diamond substrate to form a frame and provide protection or structural fixation. In this way, by 3D printing, the diamond substrate and the carrier are integrally formed, and the carrier provides protection, support or structural fixation on the periphery of the diamond substrate, while exposing the parts of the heat dissipation surface and the heat receiving surface of the diamond substrate that are not covered by the carrier.

[0011] The carrier can be made of a metallic material, a polymer material, or a thermally conductive composite material.

[0012] The present invention allows the heat source component to directly contact the heated surface of the diamond substrate, and allows the heat dissipation component or heat dissipation medium to directly contact the heat dissipation surface of the diamond substrate, so that the heat generated by the heat source component can be directly conducted to the heat dissipation component or heat dissipation medium through the diamond substrate, thereby greatly improving the overall heat dissipation efficiency. Attached Figure Description

[0013] Figure 1 This is a three-dimensional schematic diagram of a cooling plate structure according to an embodiment of the present invention.

[0014] Figure 2 This is a cross-sectional schematic diagram of a cooling plate structure according to an embodiment of the present invention.

[0015] Explanation of reference numerals in the attached figures: 10-cooling plate structure; 20-diamond substrate; 21-heat dissipation surface; 22-heat-receiving surface; 30-carrier. Detailed Implementation

[0016] Please refer to Figures 1 to 2 The figures shown are a perspective view and a cross-sectional view of a cooling plate structure 10 according to an embodiment of the present invention. The present invention provides a cooling plate structure 10, which mainly includes a diamond substrate 20 and a carrier 30.

[0017] The diamond substrate 20 has a heat dissipation surface 21 and a heat receiving surface 22. In some embodiments, the heat dissipation surface 21 and the heat receiving surface 22 are opposite to each other. The heat receiving surface 22 may be configured to be in direct contact with a heat source component, and the heat dissipation surface 21 may be configured to be in direct contact with other heat dissipation media (e.g., coolant, working fluid, or other media that can absorb and carry away heat) or heat dissipation components. In this way, the heat generated by the heat source component can be transferred to other heat dissipation media or components via the diamond substrate 20.

[0018] In addition, the heat dissipation surface 21 can be formed with heat dissipation fins or heat dissipation pillars (protrusions) to increase the heat dissipation area of ​​the heat dissipation surface.

[0019] In some embodiments, the diamond substrate 20 is a single-crystal diamond. When the diamond substrate 20 is a single-crystal diamond, it can have a more continuous crystal lattice structure. This reduces the impact of grain boundaries on heat transfer. The diamond substrate 20 can also be a polycrystalline diamond. When the diamond substrate 20 is a polycrystalline diamond, it still provides good thermal conductivity and can be manufactured according to the size requirements of the cooling plate structure 10. This increases the flexibility of the diamond substrate 20 in applications with cooling plate structures 10 of different sizes or specifications.

[0020] The carrier 30 integrally molded edge-wrapping assembly technology forms a frame around the periphery of the diamond substrate 20 to provide protection or structural fixation for the diamond substrate 20. The carrier 30 integrally molds around the periphery of the diamond substrate 20, allowing the diamond substrate 20 to be supported or carried by the carrier 30. The portions of the heat dissipation surface 21 and the heat receiving surface 22 of the diamond substrate 20 not covered by the carrier 30 are exposed, allowing direct contact between the heat dissipation medium or component and the heat source component, respectively. In this way, the diamond substrate 20, even when fixed, maintains a direct contact heat conduction path between the heat source end and the heat dissipation end, thereby improving overall heat dissipation efficiency.

[0021] In some embodiments, at least one diamond substrate 20 may be provided first, and then a carrier 30 may be integrally formed onto the periphery of the diamond substrate 20 by at least one of the following methods: injection molding, compression molding, casting, or 3D printing. For example, by injection molding, the diamond substrate 20 may be placed into a mold first, and then molding material may be injected to the periphery of the diamond substrate 20 to integrally cover the periphery of the diamond substrate 20 to form a frame. With this arrangement, the carrier 30 can stably support and carry the periphery of the diamond substrate 20, and the heat dissipation surface 21 and the heat receiving surface 22 of the diamond substrate 20 may be exposed under the support and fixation of the carrier 30. Therefore, the diamond substrate 20 can simultaneously maintain direct contact areas on both its upper and lower surfaces under the support and carrying of the carrier 30.

[0022] In other embodiments, the diamond substrate 20 can also be directly formed by 3D printing. Specifically, nano-sized diamond powder can be used as the main raw material for the diamond substrate 20, and the nano-sized diamond powder can be combined with a binder to form a diamond printing material suitable for 3D printing. Then, the diamond printing material can be stacked or deposited layer by layer using a 3D printing device to form a diamond substrate 20 with a heat dissipation surface 21 and a heat receiving surface 22. The aforementioned binder can be used to keep the nano-sized diamond powder in a predetermined shape during the printing process, and after subsequent curing, drying, sintering or other shaping processes, the diamond substrate 20 can have a substrate shape that provides thermal conductivity and structural support.

[0023] After the diamond substrate 20 is formed by 3D printing, the carrier 30 can be subsequently formed on the periphery of the diamond substrate 20 by at least one of the following methods: 3D printing, injection molding, compression molding, or casting. If 3D printing is used, the carrier 30 can be formed by layer-by-layer stacking or deposition of another printing material along the periphery of the diamond substrate 20 to surround the diamond substrate 20 and form a border. In this way, the diamond substrate 20 and the carrier 30 can be formed from raw materials by 3D printing, and the carrier 30 can provide protection, support, or structural fixation on the periphery of the diamond substrate 20. Simultaneously, the portions of the heat dissipation surface 21 and the heat-receiving surface 22 of the diamond substrate 20 not covered by the carrier 30 are exposed, allowing direct contact between the heat dissipation component or heat dissipation medium and the heat source component.

[0024] In some embodiments, the carrier 30 may be made of a metallic material, a polymeric material, or a thermally conductive composite material. For example, the polymeric material may be a thermoplastic resin, a thermosetting resin, an engineering plastic, an elastomer, or a combination of the above materials. The thermally conductive composite material may comprise a polymeric matrix and a thermally conductive filler material dispersed within the polymeric matrix. The thermally conductive filler material may be, for example, a ceramic filler material, a carbon filler material, a metallic filler material, or a combination thereof. The carrier 30 made using the above materials can possess both supporting strength, molding flexibility, and structural integrity. Furthermore, in embodiments where the carrier 30 includes a thermally conductive composite material, the carrier 30 can also assist in heat transfer or diffusion, thereby improving the heat dissipation design flexibility of the cooling plate structure 10.

[0025] In some embodiments, the cooling plate structure 10 can serve as a heat spreader, water-cooled plate, water-cooling head, radiator, or other heat dissipation module base plate or substrate. When the cooling plate structure 10 is applied to the aforementioned heat dissipation module, a carrier 30 is formed around the periphery of the diamond substrate 20 to provide the protection, support, or structural fixation required for the combination of the cooling plate structure 10 and the heat dissipation module, so that the cooling plate structure 10 can constitute a base plate or substrate for contacting the heat source component. The heated surface 22 of the diamond substrate 20 can directly contact the heat source component, and the heat dissipation surface 21 of the diamond substrate 20 can directly contact the heat dissipation component or heat dissipation medium, thereby reducing the intermediate heat transfer layer between the heat source component and the diamond substrate 20 and lowering the thermal resistance at the heat source end. By using the portion of the heat dissipation surface 21 and the heated surface 22 of the diamond substrate 20 that is not covered by the carrier 30 as a thermally conductive contact area, the heat generated by the heat source component can be quickly transferred to the heat dissipation component or heat dissipation medium through the diamond substrate 20. This allows for the utilization of the high thermal conductivity and low thermal resistance of the diamond substrate 20, thereby improving the overall heat dissipation efficiency of the heat dissipation module.

Claims

1. A cooling plate structure, characterized in that, Include: A diamond substrate having a heat dissipation surface and a heat receiving surface; and A carrier is integrally formed around the periphery of the diamond substrate to cover and fix the periphery of the diamond substrate to form a frame and provide protection or structural fixation. The carrier is integrally formed around the diamond substrate, thereby exposing the portion of the heat dissipation surface and the heat receiving surface of the diamond substrate that is not covered by the carrier.

2. The cooling plate structure as described in claim 1, characterized in that, The diamond substrate is a single-crystal diamond or a polycrystalline diamond.

3. The cooling plate structure as described in claim 1, characterized in that, The carrier is integrally formed on the periphery of the diamond substrate by at least one of injection molding, compression molding, casting molding or 3D printing.

4. The cooling plate structure as described in claim 1, characterized in that, The carrier is made of a metallic material, a polymer material, or a thermally conductive composite material.

5. A cooling plate structure, characterized in that, Include: A diamond substrate is a molded body formed by 3D printing diamond powder and adhesive material, the molded body having a heat dissipation surface and a heat receiving surface; and A carrier is formed on the periphery of the diamond substrate by 3D printing, injection molding, compression molding or casting to cover and fix the periphery of the diamond substrate to form a frame and provide protection or structural fixation, thereby exposing the portion of the heat dissipation surface and the heat receiving surface of the diamond substrate that is not covered by the carrier.

6. The cooling plate structure as described in claim 5, characterized in that, The carrier is made of a metallic material, a polymer material, or a thermally conductive composite material.

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