Two-phase vacuum cooling system compatible with electronic device cold plate and immersion liquid cooling

Abstract

The application belongs to the technical field of electronic equipment cooling, and specifically discloses a two-phase vacuum cooling system compatible with electronic equipment cold plate type and immersion type liquid cooling, which comprises a vacuum condensing tank, a condenser, a water storage pool, a cooling water circulating pipeline, a pumping pipeline, a gas-liquid separation tank and a cooling liquid circulating pipeline; heat generated by the operation of the electronic equipment is transferred to the cooling liquid; the heated cooling liquid becomes gaseous and rises to contact the condenser; most of the gaseous cooling liquid condenses into liquid and returns; the gaseous cooling liquid and water vapor that have not condensed are pumped to the gas-liquid separation tank by the pumping pump to condense into liquid cooling liquid; and the non-condensed gas is discharged through a safety valve. The application utilizes negative pressure to lower the boiling point of the cooling liquid, so that the cooling liquid is evaporated at low temperature to absorb heat, and the gas bubbles in the cooling liquid can be discharged in time to avoid local overheating caused by the retention of the gas bubbles; the discharged gaseous cooling liquid can be basically completely condensed and recovered, so as to avoid the waste of the cooling liquid and environmental pollution caused by the discharge of the gaseous cooling liquid.

Description

Technical Field

[0001] This invention relates to the field of electronic device cooling technology, and more specifically to a two-phase vacuum cooling system compatible with both cold plate and immersion liquid cooling for electronic devices. Background Technology

[0002] With the continuous growth of AI computing power, the power consumption of a single GPU card has gradually increased from 300W to 700W, 1000W, and even higher, while the heat load of a single server rack has gradually increased from 30kW to 60kW, 120kW, and over 300kW. Existing air-cooled systems suffer from high PUE (Power Usage Effectiveness); traditional cold plate systems suffer from high-flow circulation and system complexity; and traditional two-phase immersion systems suffer from high requirements for coolant conditions, localized overheating due to bubble retention, interference from non-condensable gases, and coolant leakage.

[0003] For example, patent application number CN114138084A discloses an immersion negative pressure liquid cooling system for servers, including a liquid storage tank, a heat exchanger, and an immersion device for immersing and installing servers, which are connected to form a loop. The liquid storage tank includes a first negative pressure chamber with a low vacuum degree and a second negative pressure chamber with a high vacuum degree. The first negative pressure chamber and the second negative pressure chamber are spaced apart from each other and connected by a liquid delivery pipe. A drive pump is provided in the second negative pressure chamber, which is connected to the pipe opening of the liquid delivery pipe and is used to transport the coolant in the second negative pressure chamber to the first negative pressure chamber. A one-way valve is provided in the liquid delivery pipe to allow the coolant to flow unidirectionally from the second negative pressure chamber to the first negative pressure chamber. Although this solution solves the problem that the coolant will not leak when there are cracks in the system due to the negative pressure attraction, it ignores the fact that the vacuum pump will extract gaseous coolant during the vacuuming process, which not only wastes coolant but also harms the environment. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a two-phase vacuum cooling system compatible with both cold plate and immersion liquid cooling for electronic devices. It utilizes negative pressure to lower the boiling point of the coolant, enabling the coolant to evaporate at low temperatures for efficient heat dissipation of electronic devices. It can also promptly remove air bubbles from the coolant, preventing localized overheating caused by trapped air bubbles. The discharged gaseous coolant can be almost entirely condensed and recovered, and the non-condensable gases can be automatically discharged, avoiding coolant waste and environmental pollution caused by the discharge of gaseous coolant.

[0005] This invention provides a two-phase vacuum cooling system compatible with both cold plate and immersion liquid cooling for electronic devices, including a vacuum condenser, a condenser, a water storage tank, a cooling water circulation pipeline, an exhaust pipeline, a gas-liquid separator, and a coolant circulation pipeline;

[0006] The vacuum condenser has a liquid zone and a gas zone inside, which contain coolant. The coolant in the liquid zone is used to absorb heat from electronic equipment. The top of the vacuum condenser is equipped with an air extraction port, and the upper side of the vacuum condenser near the liquid zone is equipped with a liquid inlet.

[0007] The condenser is located in the gaseous zone of the vacuum condenser and is used to perform preliminary condensation on the gaseous coolant generated by the absorption of heat and vaporization of the coolant, so that most of the gaseous coolant condenses into liquid and flows back to the liquid zone.

[0008] The water storage tank stores cooling water, and the cooling water circulation pipeline is used to circulate the cooling water in the water storage tank to the condenser to provide a cold source for the condenser to condense the gaseous coolant.

[0009] The extraction pipeline is connected between the air extraction port of the vacuum condenser and the air inlet pipe of the gas-liquid separator. The extraction pipeline is equipped with a pump to extract the gas in the vacuum condenser to the gas-liquid separator, so that the vacuum condenser maintains negative pressure and the gas-liquid separator maintains positive pressure.

[0010] The gas-liquid separator is placed in the cooling water in the water storage tank. The gaseous coolant that has not been initially condensed in the gas pumped into the gas-liquid separator condenses into liquid in a low-temperature and high-pressure environment. The bottom of the gas-liquid separator is provided with a drain port, which is connected to the inlet of the vacuum condenser through a coolant return pipeline. This is used to return the condensed liquid coolant in the gas-liquid separator to the vacuum condenser. The top of the gas-liquid separator is provided with a safety valve, which is used to automatically discharge non-condensable gas when the pressure inside the tank exceeds a preset upper limit.

[0011] Furthermore, the liquid zone of the vacuum condenser is equipped with a first temperature sensor, and the gaseous zone of the vacuum condenser is equipped with a second temperature sensor located below the condenser and a third temperature sensor located above the condenser.

[0012] Furthermore, the top of the vacuum condenser is equipped with a pressure sensor for detecting the gas pressure inside the vacuum condenser. The pressure sensor is connected to the control system. The control system controls the operation of the pump based on the pressure detected by the pressure sensor inside the vacuum condenser, so that the normal operating pressure inside the vacuum condenser is maintained between 25 kPa and 60 kPa. When the pressure sensor detects that the pressure inside the vacuum condenser is greater than 60 kPa, the load on the electronic equipment is automatically reduced or the system enters a protection operation state.

[0013] Furthermore, the gaseous zone of the vacuum condenser is also equipped with a manifold below the condenser, a baffle plate above the condenser, and a wire mesh demister above the baffle plate.

[0014] The manifold is a conical structure with a central opening, and a gap is left between the lower periphery of the manifold and the inner wall of the vacuum condenser.

[0015] The baffle plate is an inverted conical structure with a central opening, and the upper edge of the baffle plate forms a seal with the inner wall of the vacuum condenser.

[0016] Furthermore, the condenser is a multi-stage condenser, including a primary condensing unit, a secondary condensing unit, and a tertiary condensing unit arranged sequentially from bottom to top and connected in parallel to the cooling water circulation pipeline;

[0017] The lower part of the water storage tank is provided with a water intake. The cooling water circulation pipeline includes a first booster pump. The suction end of the first booster pump is connected to the water intake. The discharge end of the first booster pump is connected to the inlet ends of the first-stage condensing unit, the second-stage condensing unit, and the third-stage condensing unit, respectively. The outlet ends of the first-stage condensing unit, the second-stage condensing unit, and the third-stage condensing unit are respectively connected from the top of the water storage tank.

[0018] Furthermore, the vacuum condenser is equipped with high and low liquid level sensors with upper and lower liquid level detection points to detect the liquid level of the coolant in the vacuum condenser.

[0019] The lower end of the air inlet pipe of the gas-liquid separator extends into the lower part of the gas-liquid separator, and the upper end extends out of the top of the gas-liquid separator and is connected to the pumping pipeline. The gas-liquid separator is also equipped with a low liquid level sensor and a high liquid level sensor located above the end of the air inlet pipe that extends into the gas-liquid separator.

[0020] The inlet of the vacuum condenser is connected to a replenishing valve, and a drain valve is connected in series on the coolant return pipeline.

[0021] The high and low liquid level sensors, the replenishing valve, the low liquid level sensor, the high liquid level sensor, and the drain valve are respectively connected to the control system. When the high and low liquid level sensors detect that the liquid level in the vacuum condenser is lower than the lower liquid level detection point, they control the drain valve to open, and the coolant in the gas-liquid separator tank is replenished into the vacuum condenser until the low liquid level sensor detects that the liquid level in the gas-liquid separator tank is lower than the low liquid level detection point, at which point the drain valve is closed. When the high liquid level sensor detects that the liquid level in the gas-liquid separator tank is higher than the high liquid level detection point, it controls the drain valve to open, and the coolant in the gas-liquid separator tank is replenished into the vacuum condenser until the low liquid level sensor detects that the liquid level in the gas-liquid separator tank is lower than the low liquid level detection point, at which point the drain valve is closed. When both the high and low liquid level sensors detect that the liquid level in the vacuum condenser is lower than the lower liquid level detection point, and the low liquid level sensor detects that the liquid level in the gas-liquid separator tank is lower than the low liquid level detection point, it controls the replenishing valve to open to replenish condensate into the vacuum condenser until the high and low liquid level sensors detect that the liquid level in the vacuum condenser tank is higher than the upper liquid level detection point, at which point the replenishing valve is closed.

[0022] Furthermore, it also includes a water cooling system, which includes a second booster pump and a cooling tower / radiator. The lower part of the water storage tank is provided with a water outlet. The water suction end of the second booster pump is connected to the water outlet, the water discharge end of the second booster pump is connected to the water inlet end of the cooling tower / radiator, and the water outlet end of the cooling tower / radiator is connected from the top of the water storage tank.

[0023] The water storage tank is equipped with a fourth temperature sensor. The fourth temperature sensor and the second booster pump are respectively connected to the control system. When the fourth temperature sensor detects that the water temperature in the water storage tank exceeds the preset value, it controls the second booster pump to work so as to circulate and cool the water in the water storage tank through the cooling tower / radiator.

[0024] Furthermore, this two-phase vacuum cooling system is used for cold plate liquid cooling of electronic equipment. The vacuum condenser has a liquid outlet at the bottom, and one or more parallel cold plates are arranged below the vacuum condenser for heat conduction in contact with the electronic equipment. The liquid inlet of the cold plate is connected to the liquid outlet at the bottom of the vacuum condenser, so that the coolant in the vacuum condenser can flow into the cold plate under the action of gravity. The exhaust end of the cold plate is connected to the liquid inlet of the vacuum condenser, so that the coolant in the cold plate absorbs heat and vaporizes, and then enters the gaseous zone of the vacuum condenser through the liquid inlet.

[0025] Furthermore, the two-phase vacuum cooling system is used for immersion liquid cooling of electronic equipment. The liquid zone of the vacuum condenser is equipped with a tray for placing electronic equipment, and the side wall of the vacuum condenser is equipped with an explosion-proof gland for the wires and cables of the electronic equipment to pass through.

[0026] Furthermore, the extraction pipeline is also equipped with a dehumidifier for dehydrating and dehumidifying the gas extracted from the vacuum condenser.

[0027] The vacuum condenser is provided with a liquid outlet at the bottom. A dehydration pipeline is connected between the liquid outlet and the liquid inlet of the vacuum condenser. A coarse filter, a third booster pump, a molecular sieve drying cylinder, a precision filter and an online moisture sensor are connected in series from the liquid outlet to the liquid inlet on the dehydration pipeline.

[0028] The liquid zone of the vacuum condenser is equipped with a moisture detector. If the moisture detector detects that the moisture content of the coolant in the vacuum condenser is greater than the preset value, the pressure in the vacuum condenser is first controlled to 10 kPa to 25 kPa. After running for a certain period of time, if the moisture content is still greater than the preset value, the third booster pump is started to drive the coolant in the vacuum condenser into the dehydration pipeline for forced circulation and dehydration until the moisture content is lower than the preset value.

[0029] The beneficial effects of this invention are reflected in:

[0030] When using the two-phase vacuum cooling system of this invention to cool electronic equipment, the pump creates negative pressure in the vacuum condenser, which lowers the boiling point of the coolant. The heat generated by the electronic equipment is transferred to the coolant, causing it to evaporate at a low temperature and rise from a liquid to a gaseous state. This not only avoids localized overheating of the electronic equipment due to bubble retention, but also utilizes the heat absorption of the coolant's gas-liquid phase change for efficient heat dissipation. The gaseous coolant rises to the gaseous zone and contacts the condenser for cooling, causing most of the gaseous coolant to condense into a liquid state and flow back into the vacuum. In the liquid zone at the bottom of the condenser, cooling water from the reservoir circulates to the condenser through a cooling water circulation pipe, providing a cold source for the condenser to condense the gaseous coolant. Uncondensed gaseous coolant and water vapor are pumped to the gas-liquid separator by a pump. The gas-liquid separator is placed in the cooling water in the reservoir, allowing the gaseous coolant entering the gas-liquid separator to further condense into liquid coolant under low temperature and high pressure. Non-condensable gases are discharged through a safety valve, and the liquid coolant in the gas-liquid separator can flow back to the vacuum condenser through the coolant return pipe.

[0031] Therefore, this invention utilizes negative pressure to lower the boiling point of the coolant, enabling low-temperature evaporation of the coolant for efficient heat dissipation of electronic equipment and timely removal of air bubbles from the coolant, preventing localized overheating caused by trapped air bubbles. Simultaneously, this invention utilizes cooling water from a storage tank to condense the gaseous coolant twice, through a condenser in a vacuum condensing tank and a gas-liquid separator in the storage tank, ensuring that almost all discharged gaseous coolant is condensed and recovered, avoiding waste and environmental pollution caused by external discharge. By installing a safety valve at the top of the gas-liquid separator, not only is positive pressure maintained inside the separator, providing a high-pressure condensation environment for the gaseous coolant, but non-condensable gases are also automatically discharged if the pressure inside the separator exceeds the limit. Attached Figure Description

[0032] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0033] Figure 1 This is a schematic diagram of a two-phase vacuum cooling system used for cold plate liquid cooling of electronic devices in one embodiment of the present invention;

[0034] Figure 2 This is a schematic diagram of a two-phase vacuum cooling system used for immersion liquid cooling of electronic equipment in another embodiment of the present invention.

[0035] In the attached diagram, 100-vacuum condenser; 110-liquid zone; 120-gas zone; 130-exhaust port; 140-liquid inlet; 150-first temperature sensor; 160-second temperature sensor; 170-third temperature sensor; 180-pressure sensor; 190-manifold; 1100-baffle plate; 1110-wire demister; 1120-high and low liquid level sensors; 1130-replenishment valve; 1140-liquid outlet; 1150-tray; 1160-explosion-proof gland; 1170-moisture detector; 1180-manhole; 200-condenser; 210-first-stage condensation unit; 220-second-stage condensation unit; 230-third-stage condensation unit; 300-water storage tank; 310-water outlet; 320-fourth temperature sensor. Sensors; 330 - Float-type automatic water replenisher; 340 - Water inlet; 400 - Cooling water circulation pipeline; 410 - First booster pump; 500 - Pumping pipeline; 510 - Pump; 520 - Dehumidifier; 600 - Gas-liquid separator; 610 - Drain outlet; 620 - Safety valve; 630 - Air inlet pipe; 640 - Low level sensor; 650 - High level sensor; 700 - Coolant circulation pipeline; 710 - Drain valve; 800 - Water cooling system; 810 - Second booster pump; 820 - Cooling tower / radiator; 900 - Cold plate; 1000 - Dehydration pipeline; 1010 - Coarse filter; 1020 - Third booster pump; 1030 - Molecular sieve drying cylinder; 1040 - Precision filter; 1050 - Online moisture sensor. Detailed Implementation

[0036] The embodiments of the technical solution of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the technical solution of the present invention and are therefore intended to limit the scope of protection of the present invention.

[0037] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application should have the ordinary meaning as understood by one of ordinary skill in the art to which this invention pertains.

[0038] like Figure 1 and Figure 2 As shown, this embodiment of the invention provides a two-phase vacuum cooling system compatible with both plate-type and immersion liquid cooling for electronic devices, including a vacuum condenser 100, a condenser 200, a water storage tank 300, a cooling water circulation pipeline 400, an exhaust pipeline 500, a gas-liquid separator 600, and a cooling liquid circulation pipeline 700.

[0039] The vacuum condenser 100 has a liquid zone 110 and a gas zone 120 inside, which contain coolant. The coolant in the liquid zone 110 is used to absorb heat from electronic equipment. The top of the vacuum condenser 100 is provided with an air extraction port 130, and the upper side of the vacuum condenser 100 near the liquid zone 110 is provided with a liquid inlet 140.

[0040] In this embodiment, the coolant is stable in a liquid state under normal temperature and pressure, with a boiling point below 130°C, and under a negative pressure of 25 kPa, the boiling point is below 80°C.

[0041] The condenser 200 is located in the gaseous zone 120 of the vacuum condenser 100 and is used to perform preliminary condensation of the gaseous coolant generated by the absorption of heat and vaporization of the coolant, so that most of the gaseous coolant condenses into liquid and flows back to the liquid zone 110.

[0042] The water storage tank 300 stores cooling water, and the cooling water circulation pipe 400 is used to circulate the cooling water in the water storage tank 300 to the condenser 200 to provide a cold source for the condenser 200 to condense the gaseous coolant.

[0043] The extraction pipeline 500 is connected between the air extraction port 130 of the vacuum condenser 100 and the air inlet pipe 630 of the gas-liquid separator 600. The extraction pipeline 500 is equipped with a pump 510 to extract the gas in the vacuum condenser 100 to the gas-liquid separator 600, so that the vacuum condenser 100 maintains negative pressure and the gas-liquid separator 600 maintains positive pressure.

[0044] The gas-liquid separator 600 is placed in the cooling water in the water storage tank 300. The gaseous coolant that has not been initially condensed in the gas pumped into the gas-liquid separator 600 condenses into liquid in a low temperature and high pressure environment. The bottom of the gas-liquid separator 600 is provided with a drain port 610, which is connected to the inlet port 140 of the vacuum condenser 100 through the coolant circulation pipeline 700. This is used to return the condensed liquid coolant in the gas-liquid separator 600 to the vacuum condenser 100. The top of the gas-liquid separator 600 is provided with a safety valve 620, which is used to automatically discharge non-condensable gas when the pressure inside the tank exceeds the preset upper limit.

[0045] When using the two-phase vacuum cooling system of this invention to cool electronic equipment, the pump 510 draws negative pressure into the vacuum condenser 100, which lowers the boiling point of the coolant. The heat generated by the electronic equipment is transferred to the coolant, causing it to evaporate at a low temperature and rise from a liquid to a gaseous state. This not only avoids localized overheating of the electronic equipment due to bubble retention, but also utilizes the heat absorption of the coolant's gas-liquid phase change for efficient heat dissipation. The gaseous coolant rises to the gaseous zone 120 and contacts the condenser 200 for cooling, causing most of the gaseous coolant to condense into a liquid state and flow back to the liquid zone 110 at the bottom of the vacuum condenser 100, where it is stored. Cooling water in pool 300 circulates to condenser 200 through cooling water circulation pipe 400, providing a cold source for condenser 200 to condense gaseous coolant. Uncondensed gaseous coolant and water vapor are pumped to gas-liquid separator 600 by pump 510. Gas-liquid separator 600 is placed in cooling water in pool 300, so that gaseous coolant entering gas-liquid separator 600 is further condensed into liquid coolant under low temperature and high pressure. Non-condensable gas is discharged through safety valve 620. Liquid coolant in gas-liquid separator 600 can then flow back to vacuum condenser 100 through cooling water circulation pipe 700.

[0046] Therefore, this invention utilizes negative pressure to lower the boiling point of the coolant, enabling low-temperature evaporation of the coolant for efficient heat dissipation of electronic equipment and timely removal of air bubbles from the coolant, preventing localized overheating caused by trapped air bubbles. Simultaneously, this invention utilizes cooling water in the water storage tank 300 to condense the gaseous coolant twice, once through the condenser 200 in the vacuum condensing tank 100 and again through the gas-liquid separator 600 in the water storage tank 300. This ensures that almost all discharged gaseous coolant is condensed and recovered, preventing waste and environmental pollution caused by external discharge. By installing a safety valve 620 at the top of the gas-liquid separator 600, not only is positive pressure maintained within the separator 600, providing a high-pressure condensation environment for the gaseous coolant, but non-condensable gases are also automatically discharged if the pressure inside the separator exceeds the limit.

[0047] In some embodiments, the liquid zone 110 of the vacuum condenser 100 is provided with a first temperature sensor 150, and the gaseous zone 120 of the vacuum condenser 100 is provided with a second temperature sensor 160 located below the condenser 200 and a third temperature sensor 170 located above the condenser 200, so as to detect the temperature of the coolant, the gaseous coolant before condensation, and the gaseous coolant after condensation, respectively, and to provide complete feedback on the heat exchange status of the system.

[0048] In some embodiments, a pressure sensor 180 is provided on the top of the vacuum condenser 100 for detecting the gas pressure inside the vacuum condenser 100. The pressure sensor 180 is connected to the control system. The control system controls the pump 510 to work according to the pressure inside the vacuum condenser 100 detected by the pressure sensor 180, so that the normal working pressure inside the vacuum condenser 100 is maintained between 25 kPa and 60 kPa. When the pressure sensor 180 detects that the pressure inside the vacuum condenser 100 is greater than 60 kPa, the load on the electronic equipment is automatically reduced or the system enters a protection operation state.

[0049] This embodiment can use closed-loop control of the pump 510 to stabilize the pressure inside the vacuum condenser 100 within the optimal negative pressure range, ensuring a constant boiling point of the coolant and stable evaporative heat dissipation efficiency. At the same time, when the pressure exceeds the limit, the equipment load is automatically reduced or the system enters a protection mode to prevent negative pressure failure, a sudden rise in the boiling point of the coolant, and heat dissipation collapse, thus avoiding the risk of equipment burnout.

[0050] In some embodiments, the gaseous zone 120 of the vacuum condenser 100 is further equipped with a manifold 190 located below the condenser 200, a baffle plate 1100 located above the condenser 200, and a wire mesh demister 1110 located above the baffle plate 1100.

[0051] The manifold 190 is a conical structure with a central opening. A gap is left between the lower periphery of the manifold 190 and the inner wall of the vacuum condenser 100, allowing the condensed coolant to flow back along the inner wall of the vacuum condenser 100 to the bottom liquid zone 110 under gravity. The manifold 190, positioned below the condenser 200, gathers the rising gaseous coolant, guides the airflow evenly through the condenser 200, and increases the condensation contact area and condensation efficiency.

[0052] The baffle plate 1100 is an inverted conical structure with a central opening. The upper edge of the baffle plate 1100 forms a seal with the inner wall of the vacuum condenser 100, preventing gaseous coolant from directly leaking from the gap between the condenser 200 and the inner wall of the vacuum condenser 100 to the top of the vacuum condenser 100.

[0053] The wire mesh demister 1110 intercepts tiny mist droplets, further reducing liquid impurities entering the gas-liquid separator 600 and alleviating the load on downstream separation and condensation processes.

[0054] In some embodiments, the condenser 200 is a multi-stage condenser, including a primary condensing unit 210, a secondary condensing unit 220 and a tertiary condensing unit 230 arranged sequentially from bottom to top and connected in parallel to the cooling water circulation pipeline 400.

[0055] The lower part of the water storage tank 300 is provided with a water intake 340. The cooling water circulation pipeline 400 includes a first booster pump 410. The water intake end of the first booster pump 410 is connected to the water intake 340. The water discharge end of the first booster pump 410 is connected to the water inlet ends of the first-stage condensing unit 210, the second-stage condensing unit 220 and the third-stage condensing unit 230 respectively. The water outlet ends of the first-stage condensing unit 210, the second-stage condensing unit 220 and the third-stage condensing unit 230 are respectively connected from the top of the water storage tank 300.

[0056] In this embodiment, cooling water can be uniformly delivered to each stage of the condensing unit via the first booster pump 410. After heat exchange in each stage of the condensing unit, the cooling water returns to the storage tank 300, realizing the recycling of the cold source. By designing a multi-stage condensing unit, the first-stage condensing unit 210 is used for the main coolant vapor condensation load, the second-stage condensing unit 220 plays an auxiliary condensation role, and the third-stage condensing unit 230 is used to reduce the discharge of uncondensed coolant vapor and droplets.

[0057] In some embodiments, a high / low liquid level sensor 1120 with upper and lower liquid level detection points is provided inside the vacuum condenser 100 to detect the liquid level of the coolant inside the vacuum condenser 100.

[0058] The lower end of the air inlet pipe 630 of the gas-liquid separator 600 extends into the lower part of the gas-liquid separator 600, and the upper end extends out of the top of the gas-liquid separator 600 and is connected to the extraction pipe 500. The gas-liquid separator 600 is also equipped with a low liquid level sensor 640 and a high liquid level sensor 650 located above the end of the air inlet pipe 630 that extends into the gas-liquid separator 600.

[0059] The vacuum condenser 100 is connected to a replenishing valve 1130 at the liquid inlet 140 end, and a drain valve 710 is connected in series on the coolant circulation pipeline 700.

[0060] High and low liquid level sensors 1120, replenishment valve 1130, low liquid level sensor 640, high liquid level sensor 650, and drain valve 710 are respectively connected to the control system. When the high and low liquid level sensor 1120 detects that the liquid level in the vacuum condenser 100 is lower than the lower liquid level detection point, it controls the drain valve 710 to open, and the coolant in the gas-liquid separator 600 replenishes the vacuum condenser 100 until the low liquid level sensor 640 detects that the liquid level in the gas-liquid separator 600 is lower than the low liquid level detection point, and then closes the drain valve 710. When the high liquid level sensor 650 detects that the liquid level in the gas-liquid separator 600 is higher than the high liquid level detection point, it controls the drain valve 710 to open, and the gas-liquid separator... Coolant in the separator 600 is replenished to the vacuum condenser 100 until the low level sensor 640 detects that the liquid level in the gas-liquid separator 600 is lower than the low level detection point, and the drain valve 710 is closed. When the high and low level sensors 1120 detect that the liquid level in the vacuum condenser 100 is lower than the lower level detection point, and the low level sensor 640 detects that the liquid level in the gas-liquid separator 600 is lower than the low level detection point, the replenishment valve 1130 is opened to replenish condensant to the vacuum condenser 100 until the high and low level sensors 1120 detect that the liquid level in the vacuum condenser 100 is higher than the upper level detection point, and the replenishment valve 1130 is closed.

[0061] Since the gas-liquid separator 600 is a high-pressure area and the vacuum condenser 100 is a low-pressure area, when the drain valve 710 is opened, the coolant in the gas-liquid separator 600 can automatically flow to the vacuum condenser 100, thus replenishing the vacuum condenser 100 from the gas-liquid separator 600. When the liquid level in the vacuum condenser 100 is lower than the lower liquid level detection point or the liquid level in the gas-liquid separator 600 is higher than the higher liquid level detection point, a replenishment command is triggered. This ensures that the liquid level in the vacuum condenser 100 is not lower than the lower liquid level detection point and the liquid level in the gas-liquid separator 600 is not higher than the higher liquid level detection point. When the liquid level in the gas-liquid separator 600 is lower than the lower liquid level detection point, the drain valve 710 is closed. Liquid valve 710 cuts off the supply of coolant from the gas-liquid separator 600 to the vacuum condenser 100, thus ensuring that the liquid level in the gas-liquid separator 600 does not fall below the low-level detection point. This ensures that the lower end of the inlet pipe 630 of the gas-liquid separator 600 is always submerged in coolant, allowing the gas entering the gas-liquid separator 600 to exchange heat with the cooling water in the water storage tank 300 through the coolant. This ensures that the gaseous coolant that has not been initially condensed can be quickly cooled and condensed. When the liquid level in the gas-liquid separator 600 falls below the low-level detection point and the vacuum condenser 100 needs replenishment, the replenishment valve 1130 is opened to supply external coolant to the system. This design ensures that the coolant levels in the vacuum condenser 100 and the gas-liquid separator 600 are always maintained within the set range, thereby ensuring the normal operation of the system.

[0062] It should be noted that in this embodiment, the high and low liquid level sensor 1120 can be a dual-point float liquid level switch, while the low liquid level sensor 640 and the high liquid level sensor 650 can be single-point float liquid level switches.

[0063] In some embodiments, a water cooling system 800 is also included, which includes a second booster pump 810 and a cooling tower / radiator 820. A water outlet 310 is provided at the lower part of the water storage tank 300. The water suction end of the second booster pump 810 is connected to the water outlet 310, the water discharge end of the second booster pump 810 is connected to the water inlet end of the cooling tower / radiator 820, and the water outlet end of the cooling tower / radiator 820 is connected from the top of the water storage tank 300.

[0064] A fourth temperature sensor 320 is installed in the water storage tank 300. The fourth temperature sensor 320 and the second booster pump 810 are respectively connected to the control system. When the fourth temperature sensor 320 detects that the water temperature in the water storage tank 300 exceeds the preset value, it controls the second booster pump 810 to work so as to circulate and cool the water in the water storage tank 300 through the cooling tower / radiator 820.

[0065] When the fourth temperature sensor 320 detects that the water temperature in the water storage tank 300 exceeds the preset value, the second booster pump 810 is started. The second booster pump 810 circulates the water in the water storage tank 300 to the cooling tower / radiator 820 for cooling. The cooled water then returns to the water storage tank 300, thus ensuring that the water temperature in the water storage tank 300 is within the set range.

[0066] In order to maintain a constant internal liquid level in the water storage tank 300, a float-type automatic water replenisher 330 is installed on the top of the water storage tank 300.

[0067] In addition, the vacuum condenser 100 of this embodiment is provided with a manual access point 1180 in the middle, which makes it convenient to open the manual access point 1180 to enter the vacuum condenser 100 for maintenance.

[0068] The two-phase vacuum cooling system of this embodiment is compatible with both plate-type and immersion liquid cooling for electronic devices.

[0069] like Figure 1 As shown, this two-phase vacuum cooling system is used for cold plate liquid cooling of electronic equipment. The vacuum condenser 100 has a liquid outlet 1140 at the bottom. One or more parallel cold plates 900 are provided below the vacuum condenser 100 for contacting and conducting heat with the electronic equipment. The liquid inlet end of the cold plate 900 is connected to the liquid outlet 1140 at the bottom of the vacuum condenser 100, so that the coolant in the vacuum condenser 100 can flow into the cold plate 900 under the action of gravity. The exhaust end of the cold plate 900 is connected to the liquid inlet 140 of the vacuum condenser 100, so that the coolant in the cold plate 900 absorbs heat and vaporizes, and then enters the gaseous zone 120 of the vacuum condenser 100 through the liquid inlet 140.

[0070] In this embodiment, the coolant fills the entire cold plate 900. The heat generated by the electronic equipment during operation is transferred to the coolant through the cold plate 900. After the coolant reaches its boiling point, it vaporizes, and the bubbles rise and enter the gaseous zone 120 through the inlet 140 of the vacuum condenser 100. The consumed coolant is discharged from the outlet 1140 at the bottom of the vacuum condenser 100 into the cold plate 900 for replenishment under the action of gravity. The greater the heat generated by the electronic equipment, the faster the coolant in the cold plate 900 vaporizes and the faster it is replenished. The whole process does not require external power and is completed automatically by physical laws.

[0071] like Figure 2 As shown, the two-phase vacuum cooling system is used for immersion liquid cooling of electronic equipment. The liquid zone 110 of the vacuum condenser 100 is provided with a tray 1150 for placing electronic equipment. The side wall of the vacuum condenser 100 is provided with an explosion-proof gland 1160 for the wires and cables of the electronic equipment to pass through and prevent air leakage.

[0072] In this embodiment, the electronic device is immersed in the coolant in the vacuum condenser 100. The coolant is in direct contact with the electronic device for cooling and temperature reduction. The coolant is a highly insulating, non-flammable, and low-corrosion medium (e.g., hydrofluoroether (HFE) or hydrofluoroolefin (HFO)).

[0073] Preferably, the extraction pipeline 500 is also equipped with a dehumidifier 520 for dehydrating and dehumidifying the gas extracted from the vacuum condenser 100.

[0074] The vacuum condenser 100 has a liquid outlet 1140 at the bottom. A dehydration pipeline 1000 is connected between the liquid outlet 1140 and the liquid inlet 140 of the vacuum condenser 100. A coarse filter 1010, a third booster pump 1020, a molecular sieve drying cylinder 1030, a precision filter 1040 and an online moisture sensor 1050 are connected in series from the liquid outlet 1140 to the liquid inlet 140 on the dehydration pipeline 1000.

[0075] The liquid zone 110 of the vacuum condenser 100 is equipped with a moisture detector 1170. If the moisture detector 1170 detects that the moisture content of the coolant in the vacuum condenser 100 is greater than the preset value, the pressure inside the vacuum condenser 100 is first controlled to 10 kPa to 25 kPa. After running for a certain period of time, if the moisture content is still greater than the preset value, the third booster pump 1020 is started to drive the coolant in the vacuum condenser 100 into the dehydration pipeline 100 for forced circulation and dehydration until the moisture content is lower than the preset value.

[0076] In this embodiment, since the electronic equipment is in direct contact with the coolant, it is necessary to control the water content in the coolant in order to ensure the safe operation of the equipment.

[0077] During normal operation, the pressure inside the vacuum condenser 100 is 25 kPa to 60 kPa. The dehumidifier 520 dehydrates the gas extracted from the vacuum condenser 100, which can handle the dehumidification of the coolant under normal operating conditions. When the moisture detector 1170 detects that the moisture content of the coolant in the vacuum condenser 100 is greater than the preset value, the pressure inside the vacuum condenser 100 is first controlled to 10 kPa to 25 kPa. The boiling point temperature of the liquid decreases, which can accelerate the vaporization rate of the coolant. The dehumidifier 520 dehydrates the gas extracted from the vacuum condenser 100, which can accelerate the reduction of moisture in the coolant. After a certain period of operation, if the moisture content is still greater than the preset value, the third booster pump 1020 can be started to drive the coolant in the vacuum condenser 100 into the dehydration pipeline 100 for forced circulation and dehydration until the moisture content is lower than the preset value.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and specification of the present invention.

Claims

1. A two-phase vacuum cooling system compatible with both cold plate and immersion liquid cooling for electronic equipment, characterized in that, Includes vacuum condenser, condenser, water storage tank, cooling water circulation pipeline, extraction pipeline, gas-liquid separator and coolant circulation pipeline; The vacuum condenser has a liquid zone and a gas zone inside, which contain coolant. The coolant in the liquid zone is used to absorb heat from electronic equipment. The top of the vacuum condenser is equipped with an air extraction port, and the upper side of the vacuum condenser near the liquid zone is equipped with a liquid inlet. The condenser is located in the gaseous zone of the vacuum condenser and is used to perform preliminary condensation on the gaseous coolant generated by the absorption of heat and vaporization of the coolant, so that most of the gaseous coolant condenses into liquid and flows back to the liquid zone. The water storage tank stores cooling water, and the cooling water circulation pipeline is used to circulate the cooling water in the water storage tank to the condenser to provide a cold source for the condenser to condense the gaseous coolant. The extraction pipeline is connected between the air extraction port of the vacuum condenser and the air inlet pipe of the gas-liquid separator. The extraction pipeline is equipped with a pump to extract the gas in the vacuum condenser to the gas-liquid separator, so that the vacuum condenser maintains negative pressure and the gas-liquid separator maintains positive pressure. The gas-liquid separator is placed in the cooling water in the water storage tank. The gaseous coolant that has not been initially condensed in the gas pumped into the gas-liquid separator condenses into liquid in a low-temperature and high-pressure environment. The bottom of the gas-liquid separator is provided with a drain port, which is connected to the inlet of the vacuum condenser through a coolant return pipeline. This is used to return the condensed liquid coolant in the gas-liquid separator to the vacuum condenser. The top of the gas-liquid separator is provided with a safety valve, which is used to automatically discharge non-condensable gas when the pressure inside the tank exceeds a preset upper limit.

2. The two-phase vacuum cooling system compatible with both cold plate and immersion liquid cooling for electronic devices according to claim 1, characterized in that, The vacuum condenser is equipped with a first temperature sensor in the liquid zone, and a second temperature sensor located below the condenser and a third temperature sensor located above the condenser in the gaseous zone.

3. The two-phase vacuum cooling system compatible with both cold plate and immersion liquid cooling for electronic devices according to claim 1, characterized in that, The top of the vacuum condenser is equipped with a pressure sensor for detecting the gas pressure inside the vacuum condenser. The pressure sensor is connected to the control system. The control system controls the operation of the pump based on the pressure detected by the pressure sensor inside the vacuum condenser, so that the normal operating pressure inside the vacuum condenser is maintained between 25 kPa and 60 kPa. When the pressure sensor detects that the pressure inside the vacuum condenser is greater than 60 kPa, the load on the electronic equipment is automatically reduced or the system enters a protection operation state.

4. The two-phase vacuum cooling system compatible with both cold plate and immersion liquid cooling for electronic devices according to claim 1, characterized in that, The gaseous zone of the vacuum condenser is also equipped with a manifold below the condenser, a baffle plate above the condenser, and a wire mesh demister above the baffle plate. The manifold is a conical structure with a central opening, and a gap is left between the lower periphery of the manifold and the inner wall of the vacuum condenser. The baffle plate is an inverted conical structure with a central opening, and the upper edge of the baffle plate forms a seal with the inner wall of the vacuum condenser.

5. The two-phase vacuum cooling system compatible with both cold plate and immersion liquid cooling for electronic devices according to claim 1, characterized in that, The condenser is a multi-stage condenser, including a first-stage condensing unit, a second-stage condensing unit, and a third-stage condensing unit that are arranged sequentially from bottom to top and connected in parallel to the cooling water circulation pipeline; The lower part of the water storage tank is provided with a water intake. The cooling water circulation pipeline includes a first booster pump. The suction end of the first booster pump is connected to the water intake. The discharge end of the first booster pump is connected to the inlet ends of the first-stage condensing unit, the second-stage condensing unit, and the third-stage condensing unit, respectively. The outlet ends of the first-stage condensing unit, the second-stage condensing unit, and the third-stage condensing unit are respectively connected from the top of the water storage tank.

6. The two-phase vacuum cooling system for compatible electronic devices with cold plate and immersion liquid cooling as described in claim 1, characterized in that, The vacuum condenser is equipped with high and low liquid level sensors with upper and lower liquid level detection points to detect the liquid level of the coolant in the vacuum condenser. The lower end of the air inlet pipe of the gas-liquid separator extends into the lower part of the gas-liquid separator, and the upper end extends out of the top of the gas-liquid separator and is connected to the pumping pipeline. The gas-liquid separator is also equipped with a low liquid level sensor and a high liquid level sensor located above the end of the air inlet pipe that extends into the gas-liquid separator. The inlet of the vacuum condenser is connected to a replenishing valve, and a drain valve is connected in series on the coolant return pipeline. The high and low liquid level sensors, the replenishing valve, the low liquid level sensor, the high liquid level sensor, and the drain valve are respectively connected to the control system. When the high and low liquid level sensors detect that the liquid level in the vacuum condenser is lower than the lower liquid level detection point, they control the drain valve to open, and the coolant in the gas-liquid separator tank is replenished into the vacuum condenser until the low liquid level sensor detects that the liquid level in the gas-liquid separator tank is lower than the low liquid level detection point, at which point the drain valve is closed. When the high liquid level sensor detects that the liquid level in the gas-liquid separator tank is higher than the high liquid level detection point, it controls the drain valve to open, and the coolant in the gas-liquid separator tank is replenished into the vacuum condenser until the low liquid level sensor detects that the liquid level in the gas-liquid separator tank is lower than the low liquid level detection point, at which point the drain valve is closed. When both the high and low liquid level sensors detect that the liquid level in the vacuum condenser is lower than the lower liquid level detection point, and the low liquid level sensor detects that the liquid level in the gas-liquid separator tank is lower than the low liquid level detection point, it controls the replenishing valve to open to replenish condensate into the vacuum condenser until the high and low liquid level sensors detect that the liquid level in the vacuum condenser tank is higher than the upper liquid level detection point, at which point the replenishing valve is closed.

7. The two-phase vacuum cooling system compatible with both cold plate and immersion liquid cooling for electronic devices according to claim 1, characterized in that, It also includes a water cooling system, which includes a second booster pump and a cooling tower / radiator. The lower part of the water storage tank is provided with a water outlet. The water suction end of the second booster pump is connected to the water outlet, the water discharge end of the second booster pump is connected to the water inlet end of the cooling tower / radiator, and the water outlet end of the cooling tower / radiator is connected from the top of the water storage tank. The water storage tank is equipped with a fourth temperature sensor. The fourth temperature sensor and the second booster pump are respectively connected to the control system. When the fourth temperature sensor detects that the water temperature in the water storage tank exceeds the preset value, it controls the second booster pump to work so as to circulate and cool the water in the water storage tank through the cooling tower / radiator.

8. The two-phase vacuum cooling system for compatible electronic equipment with cold plate and immersion liquid cooling according to any one of claims 1-7, characterized in that, This two-phase vacuum cooling system is used for cold plate liquid cooling of electronic equipment. The vacuum condenser has a liquid outlet at the bottom and one or more parallel cold plates below it for contacting and conducting heat with the electronic equipment. The liquid inlet of the cold plate is connected to the liquid outlet at the bottom of the vacuum condenser, so that the coolant in the vacuum condenser can flow into the cold plate under the action of gravity. The exhaust end of the cold plate is connected to the liquid inlet of the vacuum condenser, so that the coolant in the cold plate absorbs heat and vaporizes, and then enters the gaseous zone of the vacuum condenser through the liquid inlet.

9. The two-phase vacuum cooling system for compatible electronic devices with cold plate and immersion liquid cooling according to any one of claims 1-7, characterized in that, This two-phase vacuum cooling system is used for immersion liquid cooling of electronic equipment. The liquid zone of the vacuum condenser is equipped with a tray for placing electronic equipment, and the side wall of the vacuum condenser is equipped with an explosion-proof gland for the wires and cables of the electronic equipment to pass through.

10. The two-phase vacuum cooling system for compatible electronic devices with cold plate and immersion liquid cooling as described in claim 9, characterized in that, The extraction pipeline is also equipped with a dehumidifier for dehydrating and dehumidifying the gas extracted from the vacuum condenser. The vacuum condenser is provided with a liquid outlet at the bottom. A dehydration pipeline is connected between the liquid outlet and the liquid inlet of the vacuum condenser. A coarse filter, a third booster pump, a molecular sieve drying cylinder, a precision filter and an online moisture sensor are connected in series from the liquid outlet to the liquid inlet on the dehydration pipeline. The liquid zone of the vacuum condenser is equipped with a moisture detector. If the moisture detector detects that the moisture content of the coolant in the vacuum condenser is greater than the preset value, the pressure in the vacuum condenser is first controlled to 10 kPa to 25 kPa. After running for a certain period of time, if the moisture content is still greater than the preset value, the third booster pump is started to drive the coolant in the vacuum condenser into the dehydration pipeline for forced circulation and dehydration until the moisture content is lower than the preset value.

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