A GaN power device

Abstract

The application discloses a GaN power device, and relates to the technical field of auxiliary heat dissipation and stable connection of semiconductor power devices, and comprises a device shell, an external terminal, a power line interface, a heat transfer mechanism, a clamping stabilizing mechanism and a wire feeding mechanism. A rectangular heat dissipation groove is arranged at the top of the device shell, and a heat transfer flap, an elastic heat conduction plate, an intumescent fire-retardant silica gel strip, a turnover shaft and a reset torsional spring are arranged in the groove; when the device is working and heating up, the intumescent fire-retardant silica gel strip absorbs heat and expands and pushes the elastic heat conduction plate, so that the heat transfer flap is turned over to dissipate heat, meanwhile, the heat transfer flap drives the linkage pressing plate to press the pressure rotating block, and then drives the first clamping plate and the second clamping plate to clamp and position the connecting piece at the external terminal, and simultaneously pushes the wire feeding ring to move outside the power line interface. The structure can automatically enhance heat dissipation, stabilize the connection of the external terminal and limit the loosening of the power line when the device is heating up.

Description

Technical Field

[0001] This invention relates to the field of auxiliary heat dissipation and wiring stabilization technology for semiconductor power devices, specifically a GaN power device. Background Technology

[0002] GaN power devices are commonly used electrical components in power conversion, fast charging modules, inverter control, communication power supplies, and high-frequency power control circuits. In actual product assembly, GaN power devices are typically mounted on printed circuit boards (PCBs) and electrically connected to pads, conductive lines, and external wiring harnesses via pins, external terminals, or power line interfaces. Due to the high switching frequency, high power density, and rapid current changes of GaN power devices, their assembly quality on the PCB, the stability of terminal soldering, and heat dissipation during operation directly affect the conductivity reliability and lifespan of the entire PCB assembly. Especially during reflow soldering, terminal connection, power line connection, and long-term power-on operation, unstable terminal mounting or inadequate heat dissipation can easily lead to problems such as concentrated heat in the soldering area, loose terminal contacts, power line interface misalignment, and increased localized thermal stress on the PCB.

[0003] In the prior art, for example, prior art document CN119584447B discloses a GaN power device, which mainly improves the welding and assembly process of GaN power devices with circuit boards. By incorporating structures such as a U-shaped plate, a hollow plate, a scraper, an alcohol-filled cavity, a limiting mechanism, and a pushing mechanism at the bottom of the device body, the device can push the solder paste spreading between adjacent pins closer to the pins during surface mount assembly. During reflow soldering, the hollow plate separates adjacent pins and absorbs heat from the circuit board. Simultaneously, after soldering, the hollow plate maintains a certain distance between the device body and the circuit board, thereby improving issues such as solder bridging between adjacent pins, solder paste residue, and insufficient heat dissipation at the bottom of the device. The improvement of this type of structure mainly focuses on the solder paste handling, solder isolation, and post-soldering heat dissipation support during the manufacturing or assembly process of printed circuit boards.

[0004] However, in practical applications, GaN power devices face issues beyond just surface mounting and soldering. After being mounted on a printed circuit board (PCB), some GaN power devices require external terminals to connect to other components, conductive connectors, or functional modules, and are connected to external power supply harnesses via power line interfaces. Under prolonged power supply, repeated insertion and removal, equipment vibration, harness pulling, and device temperature and cooling cycles, these external terminals and power line interfaces are prone to problems such as unstable clamping of the connectors at the terminals, electrical connection misalignment, loose power line interfaces, and heat accumulation near the terminals. While the aforementioned comparative documents can improve the soldering quality and bottom heat dissipation between the device and the PCB, they primarily address solder paste diffusion and short circuits between adjacent pins during the soldering assembly stage. They do not address structural design for securing the external terminals after the GaN power device is mounted on the PCB, preventing loose power line interfaces, and managing heat dissipation during operation. This leaves room for further improvement in the electrical connection stability and operational reliability of the device during subsequent use.

[0005] Therefore, it is necessary to propose a GaN power device that can automatically trigger heat dissipation when the GaN power device heats up during operation, and simultaneously provide stable limiting for external terminal access components and power line interfaces. Summary of the Invention

[0006] The purpose of this invention is to provide a GaN power device to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a GaN power device, including a device housing, with external terminals provided at both the front and rear ends of the device housing, and a power line interface provided on one side of the device housing; A rectangular heat dissipation groove is provided in the middle of the top of the device housing. A heat transfer mechanism is provided on the top of the rectangular heat dissipation groove. The heat transfer mechanism includes a heat transfer flap, and one side of the heat transfer flap is rotatably disposed on one side of the rectangular heat dissipation groove. A stabilizing mechanism is provided on the outside of the external terminal. The stabilizing mechanism includes a stabilizing bracket, which is symmetrically arranged at the upper ends of the front and rear ends of the device housing. A wire feeding mechanism is provided on the outside of the power cord interface. The wire feeding mechanism includes a wire feeding ring, which is located on the outside of the power cord interface. After being heated, the heat transfer mechanism can drive the locking mechanism to press and position the access component at the external terminal, and simultaneously drive the wire feeding mechanism to move relative to the power line interface.

[0008] Furthermore, the heat transfer mechanism also includes an elastic heat-conducting plate, heat dissipation holes, a rotating bushing, a flipping shaft, a limiting seat, and a return torsion spring. The flipping shaft is provided through the lower end of one side of the heat transfer flip plate, and the two sides of the flipping shaft rotatably pass through the two sides of the rectangular heat dissipation groove. The rotating bushing is provided on the outer side of the flipping shaft, and the return torsion spring is provided on the outer side of the rotating bushing. The limiting seat is provided at one end of the return torsion spring, and the limiting seat is fixedly connected to the inner side of the rectangular heat dissipation groove. The elastic heat-conducting plate is provided on both sides of the heat transfer flip plate. Multiple heat dissipation holes are opened at the lower end of the surface of the elastic heat-conducting plate. An expansion-type flame-retardant silicone strip is provided on the upper side of the inner side of the elastic heat-conducting plate near the heat dissipation holes.

[0009] Furthermore, the expandable flame-retardant silicone strip extends along the inner edge of the elastic heat-conducting plate, and a space for thermal expansion is reserved between the expandable flame-retardant silicone strip and the elastic heat-conducting plate, so that after the expandable flame-retardant silicone strip absorbs the heat inside the device shell, it can push the elastic heat-conducting plate to extend outward, and push the heat transfer flap to rotate around the flip axis through the elastic heat-conducting plate.

[0010] Furthermore, the limiting seat is located on one side of the flipping path of the heat transfer flap to limit the maximum flipping angle of the heat transfer flap. The reset torsion spring is used to drive the heat transfer flap to reset after the expansion-type flame-retardant silicone strip cools and shrinks. The multiple heat dissipation holes are used to conduct the heat accumulated around the expansion-type flame-retardant silicone strip to the outside of the device housing.

[0011] Furthermore, the aforementioned stabilizing mechanism also includes a linkage pressure plate, a traction pressure rod, a second clamping plate, a first clamping plate, a limit baffle, a transmission swing arm, a rotating crossbar, a crossbar positioning seat, a pressure-bearing rotating block, a guide column, a two-way guide seat, a guide slide rod, a column limit sleeve, and a reset spring. The guide column is vertically arranged on the inner side of the stabilizing bracket. The upper and lower ends of the guide column are fitted with column limiting sleeves. The bidirectional guide seat is fitted in the middle of the outer side of the guide column. Rectangular grooves are opened on both sides of the bidirectional guide seat. The guide slide rod is arranged on the inner side of the rectangular groove. The reset spring is arranged on the outer side of the guide slide rod. The first card plate is sleeved on the outside of the guide slide rod on one side of the bidirectional guide seat, and the limiting baffle is provided on the outside of the bidirectional guide seat near the first card plate. The second card plate is sleeved on the outside of the guide slide rod on the other side of the bidirectional guide seat, and the side of the second card plate facing the first card plate has a U-shaped structure. The second card plate is provided with a traction pressure rod on one side, and the upper end of the traction pressure rod is provided with a rotating crossbar. The crossbar positioning seat is sleeved in the middle of the outer side of the rotating crossbar. The transmission swing arm is provided at one end of the rotating crossbar, and the pressure-bearing rotating block is provided at one end of the transmission swing arm. The linkage pressure plate is symmetrically arranged on both sides of the heat transfer flip plate, and the bottom surface of the linkage pressure plate is aligned with the top of the pressure-bearing rotating block.

[0012] Furthermore, the first card plate and the second card plate are respectively located on both sides of the external terminal. The first card plate can slide along the guide slide rod on one side of the bidirectional guide seat, and the second card plate can slide along the guide slide rod on the other side of the bidirectional guide seat. The reset spring is used to drive the first card plate and the second card plate to reset respectively, and the limiting baffle is used to limit the movement endpoint of the first card plate.

[0013] Furthermore, when the heat transfer flap is heated and flipped, it can drive the linkage pressure plate to rotate synchronously. After the linkage pressure plate rotates, it can press down on the pressure rotating block. The pressure rotating block drives the rotating crossbar to rotate through the transmission swing arm. The rotating crossbar pushes the second clamping plate toward the first clamping plate through the traction pressure rod, so that the components or connectors connected to the external terminal are clamped between the first clamping plate and the second clamping plate.

[0014] Furthermore, the wire feeding mechanism also includes a guide sleeve, a push rod, a transverse slide rod, a limiting ring, a return spring, and a wire feeding push rod. The wire feeding push rods are provided on both sides of the top of the wire feeding ring. The transverse slide rod is provided at one end of the wire feeding push rod. The transverse slide rod extends transversely through the top layer of the device housing. The limiting ring is provided outside the transverse slide rod inside the guide sleeve. The return spring is provided on one side of the limiting ring. The push rod is provided at the other end of the transverse slide rod. One end of the push rod is aligned with the center of the pressure rotating block.

[0015] Furthermore, the guide sleeve is fixedly disposed inside the top layer of the device housing, the transverse slide rod can move laterally inside the guide sleeve, the limiting ring is used to limit the travel of the transverse slide rod, and the return spring is used to drive the transverse slide rod, the wire feeding push rod and the wire feeding ring to reset after the pressure rotating block loses its squeezing force.

[0016] Furthermore, the wire feeding ring is arranged around the outside of the power cord interface, and the wire feeding push rod is symmetrically connected to both sides of the upper end of the wire feeding ring. When the pressure rotating block rotates, it can push the push rod to move. The push rod drives the wire feeding push rod to move through the transverse slide rod, so that the wire feeding ring is displaced along the outside of the power cord interface, thereby guiding, pushing, or preventing loosening of the power cord connected to the power cord interface.

[0017] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention utilizes a combination of a heat transfer flap, an elastic heat-conducting plate, heat dissipation holes, an expandable flame-retardant silicone strip, a flipping shaft, a limiting seat, and a reset torsion spring to create a heat transfer structure on the top of the device housing that automatically activates upon heating. After the device heats up, the expandable flame-retardant silicone strip absorbs heat and expands, supporting the elastic heat-conducting plate. The elastic heat-conducting plate further pushes the heat transfer flap to rotate around the flipping shaft, allowing heat from the rectangular heat dissipation slots to be released outwards through the flipped heat transfer flap and heat dissipation holes. When the temperature drops, the reset torsion spring causes the heat transfer flap to reset. This process requires no additional electrical control and can automatically change the heat dissipation channel according to the device's heating state, improving the heat dissipation capacity of the top of the device housing and near the terminals.

[0018] 2. This invention, through the coordinated arrangement of a linkage pressure plate, a pressure-bearing rotating block, a transmission swing arm, a rotating crossbar, a traction pressure rod, a first clamping plate, a second clamping plate, a bidirectional guide seat, a guide slide rod, and a return spring, enables the heat transfer flap to rotate while simultaneously driving the locking mechanism. After the heat transfer flap rotates, it causes the linkage pressure plate to press against the pressure-bearing rotating block. The pressure-bearing rotating block, via the transmission swing arm and rotating crossbar, drives the traction pressure rod to rotate. The traction pressure rod pushes the second clamping plate towards the first clamping plate, clamping and positioning the components or connectors connected to the external terminals. When the heat-triggered force disappears, the return spring causes the clamping plates to reset. This structure transforms the heat dissipation action into a terminal locking action, reducing loosening of external terminals due to vibration, thermal expansion and contraction, or insertion / removal forces.

[0019] 3. This invention, through the coordinated arrangement of a pressure-bearing rotating block, a push-bearing connecting rod, a transverse sliding rod, a guide sleeve, a limiting ring, a return spring, a wire-feeding push rod, and a wire-feeding ring, enables the stabilizing mechanism to synchronously drive the wire-feeding mechanism to move relative to the power cable interface when it operates. When the pressure-bearing rotating block rotates, it pushes the push-bearing connecting rod and the transverse sliding rod to move laterally. The transverse sliding rod, through the wire-feeding push rod, drives the wire-feeding ring to move, causing the wire-feeding ring to push, guide, or limit the wire harness connected to the power cable interface. The limiting ring controls the movement stroke, and the return spring is used to restore the original position. This structure reduces the probability of the power cable shifting, shaking, or coming off at the interface, ensuring good power supply connection stability even under operating heat, installation vibration, and wire harness pulling conditions. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the GaN power device of the present invention; Figure 2 This is a schematic diagram of the overall structure of the GaN power device of the present invention from another perspective; Figure 3 This is a top view of the rectangular heat sink and linkage structure on the top of the GaN power device of the present invention; Figure 4 This is a partial structural schematic diagram of the assembly position of the heat transfer flap and the device shell in the GaN power device of the present invention; Figure 5 yes Figure 4 Enlarged view of point A; Figure 6 This is a schematic diagram of the assembly structure of the heat transfer mechanism, the stabilizing mechanism, and the wire feeding mechanism in the GaN power device of the present invention; Figure 7 This is a schematic diagram of the linkage structure between the stabilizing mechanism and the wire feeding mechanism in the GaN power device of the present invention; Figure 8 This is another perspective structural schematic diagram of the wire delivery mechanism and the stabilizing mechanism in the GaN power device of the present invention; Figure 9 This is a partial structural schematic diagram of the wire feed ring, wire feed push rod, and transverse slide rod in the GaN power device of the present invention.

[0021] In the diagram: 1. Component housing; 2. First clamping plate; 3. External terminal; 4. Second clamping plate; 5. Traction rod; 6. Heat dissipation hole; 7. Expandable flame-retardant silicone strip; 8. Elastic heat-conducting plate; 9. Linkage pressure plate; 10. Heat transfer flap; 11. Clamping bracket; 12. Limiting baffle; 13. Transmission swing arm; 14. Rotating crossbar; 15. Crossbar positioning seat; 16. Return spring; 17. Limiting ring; 18. Transverse slide bar; 19. Pushing connecting rod; 20. Guide sleeve; 21. Rotating bushing; 22. Flipping shaft; 23. Limiting seat; 24. Reset torsion spring; 25. Pressurized rotating block; 26. Wire feeding push rod; 27. Guide column; 28. Wire feeding ring; 29. ​​Bidirectional guide seat; 30. Guide slide bar; 31. Column limiting sleeve; 32. Reset spring. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Example: like Figures 1 to 9As shown, a GaN power device includes a device housing 1, which serves as the external support structure for the GaN power device, housing the GaN power module, conductive connectors, heat dissipation auxiliary structures, and wiring auxiliary structures. External terminals 3 are provided at both the front and rear ends of the device housing 1, for connecting to external components, conductive connectors, or plug-in components. A power cord interface is provided on one side of the device housing 1, allowing a power cord to be inserted or passed through, enabling an external power supply to form an electrical connection with the internal circuitry of the GaN power device.

[0024] A rectangular heat dissipation groove is provided in the middle of the top of the device housing 1. The rectangular heat dissipation groove provides installation space for the heat transfer mechanism and provides a channel for the upward release of heat from inside the device housing 1. The heat transfer mechanism is provided on the top of the rectangular heat dissipation groove. The heat transfer mechanism includes a heat transfer flap 10, an elastic heat-conducting plate 8, heat dissipation holes 6, an expansion-type flame-retardant silicone strip 7, a rotating bushing 21, a flipping shaft 22, a limiting seat 23, and a return torsion spring 24. One side of the heat transfer flap 10 is located on one side of the rectangular heat dissipation groove. The lower end of one side of the heat transfer flap 10 is provided with a flipping shaft 22. The two sides of the flipping shaft 22 rotate through the two sides of the rectangular heat dissipation groove, so that the heat transfer flap 10 can be flipped around the flipping shaft 22. The rotating bushing 21 is sleeved on the outside of the flipping shaft 22 to improve the stability of the heat transfer flap 10 when it is flipped. The reset torsion spring 24 is located on the outside of the rotating bushing 21. One end of the reset torsion spring 24 is engaged with the limiting seat 23. The limiting seat 23 is fixedly connected to the inside of the rectangular heat dissipation groove to limit the excessive rotation of the heat transfer flap 10 and to provide a fixed support point for the reset torsion spring 24.

[0025] Elastic heat-conducting plates 8 are provided on both sides of the heat transfer flap 10. The elastic heat-conducting plates 8 can be made of thin metal plates or composite heat-conducting plates with certain thermal conductivity and elastic deformation capabilities. Multiple heat dissipation holes 6 are provided at the lower end of the surface of the elastic heat-conducting plate 8. These holes 6 are spaced apart along the length of the elastic heat-conducting plate 8 to increase the heat exchange area and allow heat around the expandable flame-retardant silicone strip 7 to be transferred outwards. An expandable flame-retardant silicone strip 7 is provided on the upper side of the inner side of the elastic heat-conducting plate 8 near the heat dissipation holes 6. The expandable flame-retardant silicone strip 7 expands in volume when heated and retracts to a certain extent after cooling. The expandable flame-retardant silicone strip 7 is located inside the elastic heat-conducting plate 8 so that after absorbing heat near the top of the device housing 1, it can directly support the elastic heat-conducting plate 8, thereby causing the elastic heat-conducting plate 8 to push against the heat transfer flap 10.

[0026] A stabilizing mechanism is provided on the outer side of the external terminal 3. The stabilizing mechanism includes a stabilizing bracket 11, a linkage pressure plate 9, a traction pressure rod 5, a second clamping plate 4, a first clamping plate 2, a limiting baffle 12, a transmission swing arm 13, a rotating crossbar 14, a crossbar positioning seat 15, a pressure-bearing rotating block 25, a guide column 27, a bidirectional guide seat 29, a guide slide rod 30, a column limiting sleeve 31, and a return spring 32. The stabilizing bracket 11 is symmetrically arranged at the upper ends of the front and rear ends of the device housing 1. The stabilizing bracket 11 is used to provide installation support for the first clamping plate 2, the second clamping plate 4, and their guide and return structures.

[0027] A guide post 27 is vertically installed on the inner side of the stabilizing bracket 11, which limits the installation position of the bidirectional guide seat 29. Both the upper and lower ends of the guide post 27 are fitted with post limiting sleeves 31, which restrict the vertical movement of the bidirectional guide seat 29 relative to the guide post 27, preventing the stabilizing mechanism from tilting during operation. A bidirectional guide seat 29 is fitted in the middle of the outer side of the guide post 27. Rectangular slots are formed on both sides of the bidirectional guide seat 29 to accommodate the guide slide rod 30 and the return spring 32. The guide slide rod 30 is located inside the rectangular slot, providing a lateral sliding trajectory for the first locking plate 2 and the second locking plate 4. The return spring 32 is located outside the guide slide rod 30, used to reset the first locking plate 2 or the second locking plate 4 after the external force is released.

[0028] A first clamping plate 2 is fitted onto the outside of the guide slide rod 30 on one side of the bidirectional guide seat 29. The first clamping plate 2 can slide laterally along the guide slide rod 30. A second clamping plate 4 is fitted onto the outside of the guide slide rod 30 on the other side of the bidirectional guide seat 29. The side of the second clamping plate 4 facing the first clamping plate 2 has a U-shaped structure. This U-shaped structure is used to partially cover the outside of the connector connected to the external terminal 3, so that the connector is not easy to fall out laterally when clamped. A limit baffle 12 is provided on the outside of the bidirectional guide seat 29 near the first clamping plate 2. The limit baffle 12 is used to limit the movement endpoint of the first clamping plate 2 and prevent the connector from being squeezed and damaged due to excessive sliding of the first clamping plate 2.

[0029] A traction rod 5 is provided on one side of the second clamping plate 4. A rotating crossbar 14 is provided through the upper end of the traction rod 5. A crossbar positioning seat 15 is sleeved in the middle of the outer side of the rotating crossbar 14. The crossbar positioning seat 15 is used to support the rotating crossbar 14, so that the rotating crossbar 14 can rotate stably. A transmission swing arm 13 is provided at one end of the rotating crossbar 14, and a pressure-bearing rotating block 25 is provided at one end of the transmission swing arm 13. The linkage pressure plate 9 is symmetrically arranged on both sides of the heat transfer flip plate 10, and the bottom surface of the linkage pressure plate 9 is aligned with the top of the pressure-bearing rotating block 25. After the heat transfer flip plate 10 is heated and flipped, it can squeeze the pressure-bearing rotating block 25 through the linkage pressure plate 9, thereby transmitting the flipping action of the heat transfer mechanism to the clamping mechanism.

[0030] A wire feeding mechanism is provided on the outside of the power cord interface. The wire feeding mechanism includes a wire feeding ring 28, a guide sleeve 20, a push rod 19, a transverse slide rod 18, a limiting ring 17, a return spring 16, and a wire feeding push rod 26. The wire feeding ring 28 is arranged around the outside of the power cord interface to guide and prevent the power cord connected to the power cord interface from the outside. Wire feeding push rods 26 are provided on both sides of the top of the wire feeding ring 28, and one end of the wire feeding push rod 26 is connected to the transverse slide rod 18. The transverse slide rod 18 extends transversely through the top layer of the device housing 1 and can slide inside the guide sleeve 20. The guide sleeve 20 is fixedly arranged inside the top layer of the device housing 1 to ensure the stability of the movement direction of the transverse slide rod 18. A limiting ring 17 is provided outside the transverse slide rod 18 inside the guide sleeve 20. The limiting ring 17 is used to limit the movement stroke of the transverse slide rod 18 and prevent the wire feeding ring 28 from moving excessively. A return spring 16 is provided on one side of the limiting ring 17. The return spring 16 is used to drive the transverse slide 18, the wire feeding push rod 26, and the wire feeding ring 28 to reset after the push link 19 loses external thrust. A push link 19 is provided at the other end of the transverse slide 18. One end of the push link 19 is on the same straight line as the center of the pressure rotating block 25, so that when the pressure rotating block 25 rotates, it can push the push link 19 to move laterally.

[0031] Example 1: As Figures 1 to 6 As shown, during device operation, the heat generated by the power module inside the GaN power device is transferred to the top of the device housing 1 and the vicinity of the rectangular heat sink. The intumescent flame-retardant silicone strip 7 absorbs heat and expands, causing the elastic heat-conducting plate 8 to extend outwards or warp. Under this force, the elastic heat-conducting plate 8 pushes the heat transfer flap 10, causing it to rotate around the flip axis 22 inside the rectangular heat sink. The flip axis 22 ensures the heat transfer flap 10 flips along a fixed axis, the rotating bushing 21 reduces shaking during the flipping process, and the limiting seat 23 limits the maximum flipping angle of the heat transfer flap 10, preventing excessive flipping and interference with the device housing 1 or other structures. The reset torsion spring 24 elastically deforms when the heat transfer flap 10 flips and resets after the intumescent flame-retardant silicone strip 7 cools and contracts. At the same time, the heat dissipation holes 6 conduct heat from the outside of the expandable flame-retardant silicone strip 7 and the vicinity of the elastic heat-conducting plate 8 to the outside of the device housing 1, thereby enhancing the heat dissipation capacity of the rectangular heat sink area.

[0032] Example 2: Figures 1 to 8As shown, when the heat transfer flap 10 rotates under heat, it drives the linkage pressure plates 9 on both sides to rotate synchronously. After the linkage pressure plates 9 rotate, they press the pressure-bearing rotating block 25, which then rotates under pressure. When the pressure-bearing rotating block 25 rotates, it drives the transmission swing arm 13 to rotate, which in turn drives the rotating crossbar 14 to rotate. The rotating crossbar 14 then drives the traction pressure rod 5 to rotate. The traction pressure rod 5 rotates towards the second clamping plate 4, causing the second clamping plate 4 to slide along the guide slide rod 30 in the rectangular groove on the side of the bidirectional guide seat 29 away from the first clamping plate 2 after being subjected to force. At this time, the guide slide rod 30, which is adapted to the second clamping plate 4, provides a sliding track for the second clamping plate 4. The return spring 32 is compressed or stretched when the second clamping plate 4 moves, and provides elastic force for the subsequent return of the second clamping plate 4.

[0033] When a component, conductive connector, or plug is soldered or connected to the external terminal 3, the second clamping plate 4 moves towards the first clamping plate 2 and abuts against one side of the component. The other side of the component pushes the first clamping plate 2, and the first clamping plate 2, under force, slides along the corresponding guide slide rod 30 in the rectangular groove on the other side of the bidirectional guide seat 29, and its matching return spring 32 undergoes elastic deformation simultaneously. When the first clamping plate 2 moves to the limiting baffle 12, the limiting baffle 12 blocks the first clamping plate 2, preventing it from sliding further. At this time, the component is clamped between the first clamping plate 2 and the second clamping plate 4. The concave structure of the second clamping plate 4 can partially cover the component, making it less likely for the component to shift or fall off outside the external terminal 3. Through this structure, the heated flipping action of the heat transfer flap 10 can be simultaneously converted into a stabilizing action for the component at the external terminal 3.

[0034] Example 3: Figures 6 to 9 As shown, when the pressure-bearing rotating block 25 rotates, one side of the pressure-bearing rotating block 25 pushes the push rod 19 to move. After being subjected to force, the push rod 19 drives the transverse slide rod 18 to move laterally within the guide sleeve 20. The guide sleeve 20 is used to ensure the stability of the movement direction of the transverse slide rod 18 and prevent the transverse slide rod 18 from deflecting. When the transverse slide rod 18 moves, the limiting ring 17 moves synchronously. When the limiting ring 17 moves to a predetermined position, it can limit the movement stroke of the transverse slide rod 18 and prevent the transverse slide rod 18 from displacing excessively. The return spring 16 undergoes elastic deformation during the movement of the transverse slide rod 18 and drives the transverse slide rod 18 to reset after the pressure-bearing rotating block 25 loses its pushing force on the push rod 19.

[0035] When the transverse slide bar 18 moves, it drives the wire feeding push rod 26 to move, and the wire feeding push rod 26 further drives the wire feeding ring 28 to move outside the power cord interface. The wire feeding ring 28 can be set around the outside of the power cord interface, so that the power cord passes through or abuts against the inside of the wire feeding ring 28. When the wire feeding ring 28 moves, it can guide, push, or limit the power cord at the power cord interface, so that the power cord is not easy to loosen due to vibration, pulling, or thermal expansion and contraction of the interface. After the device temperature drops, the expansion-type flame-retardant silicone strip 7 shrinks, and the heat transfer flap 10 resets, the pressure-bearing rotating block 25 loses the squeezing force of the linkage pressure plate 9, and the stabilizing mechanism and the wire feeding mechanism return to their initial positions under the action of the reset spring 32 and the return spring 16, respectively, so that they can be linked again for the next heating action.

[0036] In summary, this invention, by setting a heat transfer mechanism triggered by heat on the top of the device housing 1, setting a stabilizing mechanism linked to the heat transfer mechanism on the outside of the external terminal 3, and setting a wire feeding mechanism linked to the stabilizing mechanism on the outside of the power line interface, enables the GaN power device to automatically adjust the heat dissipation channel, stabilize the external terminal, and prevent the power line interface from loosening when the operating temperature rises. This structure does not rely on additional electronic control drive and can complete the mechanical linkage using the device's own heating state, making it suitable for GaN power devices that require improved operating heat dissipation capacity, terminal connection stability, and power line interface reliability.

[0037] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and to design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A GaN power device, comprising a device housing (1), characterized in that: External terminals (3) are provided at both the front and rear ends of the device housing (1), and a power cord interface is provided on one side of the device housing (1). A rectangular heat dissipation groove is provided at the middle of the top of the device housing (1). A heat transfer mechanism is provided at the top of the rectangular heat dissipation groove. The heat transfer mechanism includes a heat transfer flap (10). One side of the heat transfer flap (10) is rotatably disposed on one side of the rectangular heat dissipation groove. A stabilizing mechanism is provided on the outside of the external terminal (3). The stabilizing mechanism includes a stabilizing bracket (11), which is symmetrically arranged at the upper ends of the front and rear ends of the device housing (1). A wire feeding mechanism is provided on the outside of the power cord interface. The wire feeding mechanism includes a wire feeding ring (28), which is located on the outside of the power cord interface. After the heat transfer mechanism is heated, it can drive the locking mechanism to press and position the access component at the external terminal (3), and simultaneously drive the wire feeding mechanism to move relative to the power line interface.

2. A GaN power device according to claim 1, characterized in that: The heat transfer mechanism also includes an elastic heat-conducting plate (8), heat dissipation holes (6), a rotating bushing (21), a flipping shaft (22), a limiting seat (23), and a reset torsion spring (24). The flipping shaft (22) is provided through the lower end of one side of the heat transfer flip plate (10). The two sides of the flipping shaft (22) rotate through the two sides of the rectangular heat dissipation groove. The rotating bushing (21) is provided on the outer side of the flipping shaft (22). The reset torsion spring (24) is provided on the outer side of the rotating bushing (21). The limiting seat (23) is provided at one end of the reset torsion spring (24). The limiting seat (23) is fixedly connected to the inner side of the rectangular heat dissipation groove. The elastic heat-conducting plate (8) is provided on both sides of the heat transfer flip plate (10). Multiple heat dissipation holes (6) are opened at the lower end of the surface of the elastic heat-conducting plate (8). An expansion-type flame-retardant silicone strip (7) is provided on the upper side of the inner side of the elastic heat-conducting plate (8) near the heat dissipation holes (6).

3. A GaN power device according to claim 2, characterized in that: The expandable flame-retardant silicone strip (7) extends along the inner edge of the elastic heat-conducting plate (8), and a space for thermal expansion is reserved between the expandable flame-retardant silicone strip (7) and the elastic heat-conducting plate (8), so that the expandable flame-retardant silicone strip (7) can push the elastic heat-conducting plate (8) to extend outward after absorbing the heat inside the device shell (1), and push the heat transfer flap (10) to rotate around the flip axis (22) through the elastic heat-conducting plate (8).

4. A GaN power device according to claim 2, characterized in that: The limiting seat (23) is located on one side of the flipping path of the heat transfer flap (10) and is used to limit the maximum flipping angle of the heat transfer flap (10). The reset torsion spring (24) is used to drive the heat transfer flap (10) to reset after the expansion flame retardant silicone strip (7) cools down and shrinks. The multiple heat dissipation holes (6) are used to conduct the heat gathered around the expansion flame retardant silicone strip (7) to the outside of the device housing (1).

5. A GaN power device according to claim 1, characterized in that: The stabilizing mechanism also includes a linkage pressure plate (9), a traction pressure rod (5), a second clamping plate (4), a first clamping plate (2), a limiting baffle (12), a transmission swing arm (13), a rotating crossbar (14), a crossbar positioning seat (15), a pressure-bearing rotating block (25), a guide column (27), a two-way guide seat (29), a guide slide rod (30), a column limiting sleeve (31), and a return spring (32). The guide column (27) is vertically arranged on the inner side of the stabilizing bracket (11). The upper and lower ends of the guide column (27) are fitted with column limiting sleeves (31). The bidirectional guide seat (29) is fitted in the middle of the outer side of the guide column (27). The bidirectional guide seat (29) has rectangular grooves on both sides. The guide slide rod (30) is arranged on the inner side of the rectangular groove. The reset spring (32) is arranged on the outer side of the guide slide rod (30). The first card plate (2) is sleeved on the outside of the guide slide rod (30) on one side of the bidirectional guide seat (29), and the limiting baffle (12) is provided on the outside of the bidirectional guide seat (29) near the first card plate (2). The second card plate (4) is sleeved on the outside of the guide slide rod (30) on the other side of the bidirectional guide seat (29). The side of the second card plate (4) facing the first card plate (2) has a U-shaped structure. The second card plate (4) is provided with the traction pressure rod (5) on one side. The upper end of the traction pressure rod (5) is provided with the rotating crossbar (14). The crossbar positioning seat (15) is sleeved in the middle of the outside of the rotating crossbar (14). The transmission swing arm (13) is provided at one end of the rotating crossbar (14). The pressure rotating block (25) is provided at one end of the transmission swing arm (13). The linkage pressure plate (9) is symmetrically arranged on both sides of the heat transfer flip plate (10). The bottom surface of the linkage pressure plate (9) is aligned with the top of the pressure rotating block (25).

6. A GaN power device according to claim 5, characterized in that: The first card plate (2) and the second card plate (4) are located on both sides of the external terminal (3). The first card plate (2) can slide along the guide slide rod (30) on one side of the bidirectional guide seat (29), and the second card plate (4) can slide along the guide slide rod (30) on the other side of the bidirectional guide seat (29). The reset spring (32) is used to drive the first card plate (2) and the second card plate (4) to reset respectively. The limiting baffle (12) is used to limit the movement endpoint of the first card plate (2).

7. A GaN power device according to claim 5, characterized in that: When the heat transfer flap (10) is heated and flipped, it can drive the linkage pressure plate (9) to rotate synchronously. After the linkage pressure plate (9) rotates, it can press down on the pressure rotating block (25). The pressure rotating block (25) drives the rotating crossbar (14) to rotate through the transmission swing arm (13). The rotating crossbar (14) pushes the second card plate (4) to move toward the first card plate (2) through the traction pressure rod (5), so that the components or connectors connected to the external terminal (3) are clamped between the first card plate (2) and the second card plate (4).

8. A GaN power device according to claim 1, characterized in that: The wire feeding mechanism also includes a guide sleeve (20), a push rod (19), a transverse slide rod (18), a limiting ring (17), a return spring (16), and a wire feeding push rod (26). The wire feeding push rod (26) is provided on both sides of the top of the wire feeding ring (28). The transverse slide rod (18) is provided at one end of the wire feeding push rod (26). The transverse slide rod (18) extends transversely through the top layer of the device housing (1). The limiting ring (17) is provided on the outside of the transverse slide rod (18) inside the guide sleeve (20). The return spring (16) is provided on one side of the limiting ring (17). The push rod (19) is provided at the other end of the transverse slide rod (18). One end of the push rod (19) is on the same straight line as the center of the pressure rotating block (25).

9. A GaN power device according to claim 8, characterized in that: The guide sleeve (20) is fixedly installed inside the top layer of the device housing (1). The transverse slide bar (18) can move laterally inside the guide sleeve (20). The limiting ring (17) is used to limit the travel of the transverse slide bar (18). The return spring (16) is used to drive the transverse slide bar (18), the wire feeding push rod (26) and the wire feeding ring (28) to reset after the pressure rotating block (25) loses its squeezing force.

10. A GaN power device according to claim 8, characterized in that: The wire feeding ring (28) is arranged around the outside of the power cord interface. The wire feeding push rod (26) is symmetrically connected to the upper two sides of the wire feeding ring (28). When the pressure rotating block (25) rotates, it can push the push connecting rod (19) to move. The push connecting rod (19) drives the wire feeding push rod (26) to move through the transverse slide rod (18), so that the wire feeding ring (28) is displaced along the outside of the power cord interface, thereby guiding, pushing or preventing loosening of the power cord connected to the power cord interface.

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