Annealing apparatus

Abstract

The application provides an annealing device, relates to the field of semiconductor or photovoltaic material processing, and solves the technical problem of low process gas flow rate around a silicon wafer in a traditional vacuum annealing furnace. The annealing device comprises a process cavity, the process cavity has a process chamber, the process chamber has multiple process spaces arranged in sequence along a first direction and connected to each other, each process space is provided in communication with at least one gas inlet and at least one gas outlet, multiple blocking pieces, each process space is provided in correspondence with at least one blocking piece, each blocking piece corresponding to the process space is located on a first side or a second side of the process space, and at least one blocking piece is arranged between two adjacent process spaces. By arranging the blocking pieces, the movement path of the process gas is effectively limited, the process gas is reduced to bypass the process space, and the process gas flow rate around the product is significantly improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor or photovoltaic material processing, specifically to an annealing device. Background Technology

[0002] In the vacuum annealing process of photovoltaic cell manufacturing, especially in the back contact (BC) and perovskite photovoltaic cell industries, nitrogen purging is a crucial step in removing organic matter from the silicon wafer surface and ensuring process quality. As photovoltaic cell efficiency requirements continue to increase, the demands on silicon wafer surface cleanliness and process stability are becoming increasingly stringent. As a core piece of equipment in photovoltaic manufacturing, the uniformity of the flow field in the vacuum annealing furnace directly affects silicon wafer quality and production yield. The industry commonly improves the flow field by optimizing the inlet and outlet structures and adjusting process parameters, but these methods often suffer from insufficient targeting and limited flow uniformity, failing to effectively address issues such as low process gas velocity around the silicon wafer and poor pressure stability within the chamber. Summary of the Invention

[0003] To address the aforementioned technical problems, this application is proposed. An embodiment of this application provides an annealing apparatus.

[0004] In a first aspect, one embodiment of this application provides an annealing apparatus, comprising: a process chamber having a process cavity having a plurality of process spaces arranged sequentially and interconnected along a first direction, the process spaces being configured to accommodate a product, the process spaces having a first side and a second side in the first direction, and a third side and a fourth side in the second direction, the second direction intersecting the first direction, each process space being connected to at least one inlet and at least one outlet, the inlet being able to input process gas into the corresponding process space, and the outlet being able to extract process gas from the corresponding process space, the inlet being located on the third side of the process space and disposed on the cavity wall of the process chamber, and the outlet being located on the fourth side of the process space and disposed on the cavity wall of the process chamber; and a plurality of blocking members, each process space being correspondingly disposed with at least one blocking member, each blocking member corresponding to the process space being located on the first side or the second side of the process space, and at least one blocking member being disposed between two adjacent process spaces.

[0005] In some embodiments, at least two blocking elements are respectively disposed at at least two locations on the third side, the fourth side, and between the third and fourth sides of the corresponding process space; and / or, at least one blocking element includes at least one first blocking element disposed on the third side of the corresponding process space; and / or, at least one blocking element includes at least one second blocking element disposed on the fourth side of the corresponding process space; and / or, at least one blocking element includes at least one third blocking element disposed between the third and fourth sides of the corresponding process space.

[0006] In some embodiments, the blocking member includes a plate-like structure extending along a first direction and a vertical direction and perpendicular to a second direction, both of which intersect the vertical direction; and / or, the projection of the blocking member along the second direction onto the process cavity does not overlap with the air inlet and air outlet.

[0007] In some embodiments, the distance between the process space and each adjacent barrier in the first direction ranges from 2 mm to 5 mm.

[0008] In some embodiments, the carrier plate passes through multiple process spaces sequentially along the direction of movement. The carrier plate is configured to carry the product. The direction of movement is parallel to the first direction. The top of the blocking member is connected to the top inner wall of the process cavity. An obstacle space is formed between the bottom of the blocking member and the bottom of the process cavity. The carrier plate can pass through the obstacle space along the direction of movement. The direction from the top of the process cavity to the bottom intersects both the first direction and the second direction.

[0009] In some embodiments, the carrier plate passes through multiple process spaces sequentially along the direction of movement. The carrier plate is configured to carry products arranged in M ​​rows along the second direction, where M is an integer greater than 1. There is a gap between adjacent rows of products, and the direction of movement is parallel to the first direction. As the products arranged in M ​​rows along the second direction pass through the first or second side of any process space sequentially along the direction of movement, the blocking member disposed on the first or second side of the process space and located between the third and fourth sides of the process space is located in the gap.

[0010] In some embodiments, the carrier plate passes sequentially through multiple process spaces along the direction of movement, and the carrier plate is configured to carry the product. The direction of movement is parallel to the first direction. The annealing equipment further includes: multiple tailpipes connected to an outlet; a main pipe connected to the multiple tailpipes, the main pipe having an extraction port through which process gas can be extracted; wherein the position of the extraction port in the direction of movement is the extraction position, the position in the first process space along the direction of movement is the first position, the position in the second process space is the second position, and the extraction position in the direction of movement is located between the first position and the second position.

[0011] In some embodiments, for two adjacent process spaces along the direction of motion, the flow rate of the process gas output from the outlet corresponding to the first process space is greater than or equal to the flow rate of the process gas output from the outlet corresponding to the second process space, and for all process spaces arranged sequentially along the direction of motion, the flow rate of the process gas output from the outlet corresponding to the first process space is greater than the flow rate of the process gas output from the outlet corresponding to the last process space; and / or, for two adjacent process spaces along the direction of motion, the flow rate of the process gas introduced into the inlet corresponding to the first process space is greater than or equal to the flow rate of the process gas introduced into the inlet corresponding to the second process space, and for all process spaces arranged sequentially along the direction of motion, the flow rate of the process gas introduced into the inlet corresponding to the first process space is greater than the flow rate of the process gas introduced into the inlet corresponding to the last process space.

[0012] In some embodiments, for two adjacent process spaces along the direction of motion, the minimum inner diameter of the tailpipe connected to the outlet of the first process space is greater than or equal to the minimum inner diameter of the tailpipe connected to the outlet of the second process space, and for all process spaces arranged sequentially along the direction of motion, the minimum inner diameter of the tailpipe connected to the outlet of the first process space is greater than the minimum inner diameter of the tailpipe connected to the outlet of the last process space; and / or, the annealing equipment further includes: a plurality of reducing sleeves, the reducing sleeves being disposed in the tailpipe, for the tailpipes connected to the outlets of two adjacent process spaces along the direction of motion, the minimum inner diameter of the reducing sleeve disposed in the tailpipe connected to the outlet of the first process space is greater than or equal to the minimum inner diameter of the reducing sleeve disposed in the tailpipe connected to the outlet of the second process space, and for all process spaces arranged sequentially along the direction of motion, the minimum inner diameter of the reducing sleeve disposed in the tailpipe connected to the outlet of the first process space is greater than the minimum inner diameter of the reducing sleeve disposed in the tailpipe connected to the outlet of the last process space.

[0013] In some embodiments, the annealing apparatus further includes: a plurality of flow regulating components, which are connected to an air inlet and configured to detect and regulate the flow rate of the process gas introduced into the air inlet.

[0014] The annealing equipment proposed in this application effectively restricts the movement path of process gas by setting up blocking components, reducing the movement of process gas along the first or second side of the process space and its entry into adjacent process spaces, thereby bypassing the process space, reducing the waste of process gas, significantly increasing the flow rate of process gas around the product, improving purging efficiency, and reducing airflow crosstalk between different sub-chambers, making the pressure in the process chamber more stable, reducing turbulence zones, and reducing the risk of secondary deposition of organic matter on the product and carrier, thereby improving the stability of the vacuum annealing process and the product yield. Attached Figure Description

[0015] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0016] Figure 1 The diagram shows a flow field of a traditional vacuum annealing furnace.

[0017] Figure 2 The diagram shown is a structural schematic of an annealing apparatus provided in an exemplary embodiment of this application.

[0018] Figure 3 The diagram shown is a structural schematic of an annealing apparatus with a first baffle layout provided in an exemplary embodiment of this application.

[0019] Figure 4 The diagram shown is a schematic representation of the flow field of an annealing apparatus with a first baffle layout provided in an exemplary embodiment of this application.

[0020] Figure 5 The diagram shown is a structural schematic of an annealing apparatus with a second baffle layout provided in an exemplary embodiment of this application.

[0021] Figure 6 The diagram shown is a schematic representation of the flow field of an annealing apparatus with a second baffle layout provided in an exemplary embodiment of this application.

[0022] Figure 7 The diagram shown is a structural schematic of an annealing apparatus with a third baffle layout provided in an exemplary embodiment of this application.

[0023] Figure 8 The diagram shown is a schematic representation of the flow field of an annealing apparatus with a third baffle layout provided in an exemplary embodiment of this application.

[0024] Figure 9 The diagram shown is a structural schematic of an annealing apparatus with a fourth baffle layout provided in an exemplary embodiment of this application.

[0025] Figure 10 The diagram shows a flow field of an annealing apparatus with a fourth baffle layout provided in an exemplary embodiment of this application.

[0026] Figure 11 The diagram shown is a structural schematic of an annealing apparatus with a fifth baffle layout provided in an exemplary embodiment of this application.

[0027] Figure 12 The diagram shown is a structural schematic of an annealing apparatus with a sixth baffle layout provided in an exemplary embodiment of this application.

[0028] Figure 13 The diagram shown is a schematic representation of the process space and adjacent blocking elements provided in an exemplary embodiment of this application.

[0029] Figure 14 The diagram shows a schematic representation of a structure in which a clearance space is formed between the bottom of a blocking member and the bottom of a process cavity, according to an exemplary embodiment of this application.

[0030] Figure 15 The diagram shown is a schematic diagram of the gas path of an annealing device provided in an exemplary embodiment of this application.

[0031] Figure 16 The diagram shown is a structural schematic of the tailpipe and variable diameter ferrule provided in an exemplary embodiment of this application.

[0032] Figure label: 100 Annealing equipment; 110 Process chamber; 111 Process chamber; 1111 Sub-chamber; 120 Process space; 121 First side; 122 Second side; 123 Third side; 124 Fourth side; 130 Air inlet; 140 Air outlet; 150 Blocking component; 151 First blocking component; 152 Second blocking component; 153 Third blocking component; 160 Carrier plate; 161 Spacing space; 162 Clearance space; 170 Tail drain pipe; 180 Main pipe; 181 Extraction port; 190 Variable diameter ferrule; 200 Flow regulating assembly; 300 Traditional vacuum annealing furnace; 400 Support component; 500 Extraction pipe; 600 Pump set. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0034] Figure 1 The diagram shows a flow field of a traditional vacuum annealing furnace.

[0035] Currently, such as Figure 1 As shown, traditional vacuum annealing furnaces (300) generally suffer from the following problems.

[0036] First, the nitrogen flow rate between silicon wafers is too low, resulting in incomplete purging of organic matter and easy secondary deposition of organic matter.

[0037] Second, turbulent zones can easily form inside the cavity, affecting process stability.

[0038] Third, traditional uniform flow structures cannot balance increased flow velocity and uniform flow field, failing to meet the requirements of efficient and stable processes and the high cleanliness requirements of BC and perovskite batteries.

[0039] In related technologies, the flow field optimization schemes for vacuum annealing furnaces mainly include the following two types.

[0040] The first method involves installing flow equalizers at the air inlet and outlet of the cavity to even out the airflow and reduce direct airflow impact. However, this method has limited flow equalization effect, is difficult to increase the flow velocity between silicon wafers, and is prone to creating airflow dead zones in the middle of the cavity.

[0041] The second approach involves equipping each chamber of the cavity with an independent flow meter and control valve to achieve differentiated gas flow control. However, this method requires high control precision and is prone to mutual interference between airflows in different chambers, making it difficult to guarantee pressure stability.

[0042] In view of this, this application proposes an annealing device that, by setting up a blocking component, effectively restricts the movement path of the process gas, reduces the movement of the process gas along the first or second side of the process space, and reduces its entry into adjacent process spaces, thereby bypassing the process space, reducing the waste of process gas, significantly increasing the flow rate of the process gas around the product, improving purging efficiency, and reducing airflow crosstalk between different sub-chambers, making the pressure in the process chamber more stable, reducing turbulence zones, and lowering the risk of secondary deposition of organic matter on the product and carrier, thereby improving the stability of the vacuum annealing process and the product yield.

[0043] Figure 2 The diagram shown is a structural schematic of an annealing apparatus provided in an exemplary embodiment of this application. Figure 3 The diagram shown is a structural schematic of an annealing apparatus with a first baffle layout provided in an exemplary embodiment of this application. Figure 4 The diagram shown is a schematic representation of the flow field in an annealing apparatus with a first baffle layout according to an exemplary embodiment of this application. Figure 5 The diagram shown is a structural schematic of an annealing apparatus with a second baffle layout provided in an exemplary embodiment of this application. Figure 6 The diagram shown is a schematic representation of the flow field in an annealing apparatus with a second baffle layout provided in an exemplary embodiment of this application. Figure 7 The diagram shown is a structural schematic of an annealing apparatus with a third baffle layout provided in an exemplary embodiment of this application. Figure 8 The diagram shown is a schematic representation of the flow field in an annealing apparatus with a third baffle layout provided in an exemplary embodiment of this application. Figure 9The diagram shown is a structural schematic of an annealing apparatus with a fourth baffle layout provided in an exemplary embodiment of this application. Figure 10 The diagram shown is a schematic representation of the flow field in an annealing apparatus with a fourth baffle layout provided in an exemplary embodiment of this application. Figure 11 The diagram shown is a structural schematic of an annealing apparatus with a fifth baffle layout provided in an exemplary embodiment of this application. Figure 12 The diagram shown is a structural schematic of an annealing apparatus with a sixth baffle layout provided in an exemplary embodiment of this application. Wherein, Figure 3 , Figure 5 , Figure 7 , Figure 9 , Figure 11 and Figure 12 Adjacent sub-chambers 1111 are separated by dashed lines.

[0044] like Figures 2-12 As shown, this application embodiment provides an annealing apparatus 100 including: a process chamber 110 and a plurality of blocking members 150. The process chamber 110 has a process cavity 111. The process cavity 111 has a plurality of process spaces 120 arranged sequentially and interconnected along a first direction (such as the X direction in the figure). The process spaces 120 are configured to accommodate products. The process spaces 120 have a first side 121 and a second side 122 in the first direction, and a third side 123 and a fourth side 124 in a second direction (such as the Y direction in the figure), the second direction intersecting the first direction. Each process space 120 is connected to at least one inlet 130 and at least one outlet 140. Process gas can be input into the corresponding process space 120 through the inlet 130. Process gas in the corresponding process space 120 can be extracted through the outlet 140. The inlet 130 is located on the third side 123 of the process space 120 and is disposed on the cavity wall of the process chamber 110. The air outlet 140 is located on the fourth side 124 of the process space 120 and is disposed on the cavity wall of the process chamber 110. Each process space 120 is correspondingly disposed with at least one blocking member 150. Each blocking member 150 corresponding to the process space 120 is located on the first side 121 or the second side 122 of the process space 120, and at least one blocking member 150 is disposed between two adjacent process spaces 120.

[0045] Specifically, the process chamber 111 is divided into multiple sub-chambers 1111 arranged sequentially along the first direction, and the process space 120 can be a local area of ​​the sub-chamber 1111, such as the central area of ​​the sub-chamber 1111. Figure 3 , Figure 5 , Figure 7 , Figure 9 , Figure 11 and Figure 12As shown within the dashed box, there is a certain interval between adjacent process spaces 120. The carrier plate 160 can move within the process chamber 111. The carrier plate 160 is used to carry the carrier 400, which is used to carry at least one product. The process space 120 can accommodate the carrier 400, which may be, for example, a flower basket or a small boat, and the product may be, for example, a silicon wafer, a crystal wafer, a glass substrate, or a solar cell.

[0046] For example, the first direction and the second direction are two horizontal directions that are perpendicular to each other.

[0047] Specifically, each process space 120 is equipped with an independent air inlet 130 and an air outlet 140. The air inlet 130 is located on the cavity wall of the third side 123 of the process space 120 and is used to introduce process gas (such as nitrogen) into the process space 120. The air outlet 140 is located on the cavity wall of the fourth side 124 of the process space 120 and is used to extract waste gas from the process space 120. This design provides a basis for achieving independent airflow control for each process space 120.

[0048] Specifically, the blocking element 150 is a key component for improving the flow field distribution. For any process space 120, at least one blocking element 150 is disposed on the first side 121 or the second side 122 of the process space 120. Some of the blocking elements 150 located on the first side 121 or the second side 122 of the process space 120 are simultaneously located between two adjacent process spaces 120. This arrangement ensures that the blocking element 150 can effectively intercept a large amount of process gas, reducing the amount of process gas bypassing the process space 120. That is, it blocks a large amount of process gas from flowing along the first side 121 or the second side 122 of the process space 120 and from entering between adjacent process spaces 120, rather than entering the interior of the process space 120.

[0049] In the above embodiments, by setting the blocking member 150, the movement path of the process gas is effectively restricted, reducing the movement of the process gas along the first side 121 or the second side 122 of the process space 120 and its entry into adjacent process spaces 120, thereby bypassing the process space 120, reducing the waste of process gas, significantly increasing the flow rate of process gas around the product, improving purging efficiency, and reducing airflow crosstalk between different sub-chambers 1111, making the pressure in the process chamber 111 more stable, reducing the turbulence zone, and reducing the risk of secondary deposition of organic matter on the product and the carrier 400, thereby improving the stability of the vacuum annealing process and the product yield.

[0050] In some embodiments, such as Figures 3-12As shown, at least one blocking member 150 includes at least one of the following: at least one first blocking member 151, at least one second blocking member 152, and at least one third blocking member 153. The first blocking member 151 is disposed on the third side 123 of the corresponding process space 120. The second blocking member 152 is disposed on the fourth side 124 of the corresponding process space 120. The third blocking member 153 is disposed between the third side 123 and the fourth side 124 of the corresponding process space 120. And / or, at least two blocking members 150 are respectively disposed at at least two locations on the third side 123, the fourth side 124, and between the third side 123 and the fourth side 124 of the corresponding process space 120.

[0051] Specifically, the first blocking member 151 is disposed on the third side 123 of the process space 120 (i.e., the side where the air inlet 130 is located). Its main function is to initially guide the airflow entering from the air inlet 130, prevent the process gas from flowing to the first side 121 or the second side 122 of the process space 120, and prevent the process gas from entering between adjacent process spaces 120, so that the process gas can flow into the process space 120 in large quantities and in a concentrated manner and enter the product area, reducing airflow dispersion and thus enhancing the local purging effect.

[0052] Specifically, the second blocking member 152 is disposed on the fourth side 124 of the process space 120 (the side where the outlet 140 is located). Its main function is to optimize the flow field in the outlet area, reduce eddies and turbulence caused by airflow convergence, reduce suction resistance, and improve waste discharge efficiency. It can also allow some process gas between adjacent process spaces 120 and some process gas on the first side 121 or the second side 122 of the process space 120 to flow into the process space 120, thereby increasing the flow rate of process gas around the product.

[0053] Specifically, the third blocking member 153 is disposed between the third side 123 and the fourth side 124 of the process space 120. It is mainly used to block the process gas between adjacent process spaces 120 that does not pass through the product area, and to make this part of the process gas flow into the process space 120, thereby breaking the airflow crosstalk between adjacent process spaces 120. It can also make the process gas on the first side 121 or the second side 122 of the process space 120 flow into the process space 120, thereby enhancing the uniformity of the flow field and increasing the flow rate of the process gas around the product.

[0054] For example, taking the blocking member 160 of the first side 121 of a certain process space 120 as an example, at least two blocking members 160 are respectively disposed at at least two locations in the third side 123, the fourth side 124 and between the third side 123 and the fourth side 124 of the corresponding process space 120, including: two blocking members 160 are respectively disposed at the third side 123 and the fourth side 124 of the process space 120; two blocking members 160 are respectively disposed at the third side 123 and between the third side 123 and the fourth side 124 of the process space 120; two blocking members 160 are respectively disposed at the fourth side 124 and between the third side 123 and the fourth side 124 of the process space 120; and three blocking members 160 are respectively disposed at the third side 123, the fourth side 124 and between the third side 123 and the fourth side 124 of the process space 120. By setting two or more blocking elements 160 on the first side 121 or the second side 122 of the process space 120, the airflow in multiple areas around the process space 120 can be adjusted and guided, thereby enhancing the uniformity of the flow field and increasing the flow rate of the process gas around the product.

[0055] For example, such as Figure 5 and Figure 6 As shown, at least one blocking member 150 includes only a first blocking member 151, which is disposed on the third side 123 of the corresponding process space 120.

[0056] For example, such as Figure 3 and Figure 4 As shown, at least one blocking member 150 includes only a second blocking member 152, which is disposed on the fourth side 124 of the corresponding process space 120.

[0057] For example, such as Figure 7 and Figure 8 As shown, at least one blocking member 150 includes only a third blocking member 153, which is disposed between the third side 123 and the fourth side 124 of the corresponding process space 120.

[0058] For example, such as Figure 9 and Figure 10 As shown, there are at least two blocking elements 150, including a first blocking element 151 and a second blocking element 152. The first blocking element 151 is disposed on the third side 123 of the corresponding process space 120. The second blocking element 152 is disposed on the fourth side 124 of the corresponding process space 120. Blocking elements 150 are disposed on both sides of the process space 120, enabling bidirectional coordinated control and achieving dual optimization of flow velocity and flow field.

[0059] For example, such as Figure 11As shown, there are at least two blocking members 150. The at least two blocking members 150 include a first blocking member 151 and a third blocking member 153. The first blocking member 151 is disposed on the third side 123 of the corresponding process space 120, and the third blocking member 153 is disposed between the third side 123 and the fourth side 124 of the corresponding process space 120.

[0060] For example, such as Figure 12 As shown, there are at least three blocking members 150. At least two blocking members 150 include a first blocking member 151, a second blocking member 152, and a third blocking member 153. The first blocking member 151 is disposed on the third side 123 of the corresponding process space 120, the second blocking member 152 is disposed on the fourth side 124 of the corresponding process space 120, and the third blocking member 153 is disposed between the third side 123 and the fourth side 124 of the corresponding process space 120.

[0061] In the scenario of annealing silicon wafers in a vacuum annealing furnace, the nitrogen flow rate around the silicon wafer in the first sub-chamber 1111 along the direction of movement was tested, and the test results are as follows.

[0062] like Figure 1 As shown, without the obstruction 150, the average nitrogen flow velocity around the silicon wafer is 0.15 m / s.

[0063] like Figure 6 As shown, with the first barrier 151 in place, the average nitrogen flow velocity around the silicon wafer is 0.20 m / s, which is 33% higher than the flow velocity of the solution without the barrier 150.

[0064] like Figure 4 As shown, with the second barrier 152 in place, the average nitrogen flow velocity around the silicon wafer is 0.27 m / s, which is 80% higher than the flow velocity of the solution without the barrier 150.

[0065] like Figure 8 As shown, with the third barrier 153 in place, the average nitrogen flow velocity around the silicon wafer is 0.33 m / s, which is 120% higher than the flow velocity of the solution without the barrier 150.

[0066] like Figure 10 As shown, with the first barrier 151 and the second barrier 152 provided, the average nitrogen flow velocity around the silicon wafer is 0.31 m / s, which is 107% higher than the solution without the barrier 150.

[0067] Therefore, setting the third blocking element 153 can achieve the best flow rate increase effect.

[0068] In another test, such as Figure 8As shown, the process chamber 111 has 5 sub-chambers 1111. Each process space 120 has a third blocking element 153 on the first side 121 and the second side 122. By optimizing the simulation, the size and installation position of the third blocking element 153 can be determined, which can increase the process gas flow rate in the first sub-chamber 1111 along the direction of movement by 150%.

[0069] In the above embodiments, by providing at least one of the first blocking member 151, the second blocking member 152, and the third blocking member 153, the uniformity of the flow field inside the process chamber 111 can be significantly improved, turbulence and dead zones can be reduced, thereby significantly increasing the flow rate of the process gas in the product area and improving the quality of the product annealing process. By providing blocking members 150 at at least two locations in the process space 120, including the third side 123, the fourth side 124, and between the third side 123 and the fourth side 124, the process gas can be more precisely controlled and guided.

[0070] In some embodiments, the blocking member 150 includes a plate-like structure. The plate-like structure extends along a first direction and a vertical direction, and is perpendicular to a second direction, both of which intersect the vertical direction.

[0071] Specifically, using a plate-like structure for the barrier 150 is a simple and effective implementation. By extending the barrier 150 along the first direction and the vertical direction, and perpendicular to the second direction, the barrier 150 can have a sufficiently large size in the first direction to block the process gas moving along the second direction, thereby effectively intercepting the process gas moving along the second direction. Furthermore, a smaller barrier 150 can be used to block the process gas on either the first side 121 or the second side 122 of the process space 120, reducing the material required for the barrier 150 and saving costs.

[0072] In some embodiments, the projection of the blocking member 150 along the second direction onto the process cavity 110 does not overlap with either the air inlet 130 or the air outlet 140.

[0073] For example, the projection of the blocking member 150 on the process cavity 110 along the second direction is located on one side of the air inlet 130 in the second direction and on one side of the air outlet 140 in the second direction.

[0074] In the above embodiments, by ensuring that the projection of the blocking member 150 along the second direction on the process cavity 110 does not overlap with the air inlet 130, the blocking member 150 can be prevented from obstructing the air intake of the air inlet 130, thereby increasing the flow rate of the process gas around the product. Similarly, by ensuring that the projection of the blocking member 150 along the second direction on the process cavity 110 does not overlap with the air outlet 140, the blocking member 150 can be prevented from obstructing the air outlet 140, thereby increasing the flow rate of the process gas around the product.

[0075] Figure 13 The diagram shown is a schematic representation of the process space and adjacent blocking elements provided in an exemplary embodiment of this application. Wherein, Figure 13 The distance between the intermediate process space 120 and the adjacent blocking member 150 in the first direction is shown as indicated by the symbol d.

[0076] In some embodiments, such as Figure 13 As shown, the distance between the process space 120 and each adjacent barrier 150 in the first direction ranges from 2 mm to 5 mm.

[0077] Specifically, for any process space 120 and an adjacent barrier 150 of the process space 120, the distance range between the process space 120 and the barrier 150 in the first direction refers to the distance range between the edge of the process space 120 near the barrier 150 in the first direction and the edge of the barrier 150 near the process space 120 in the first direction. Since the size and position of the process space 120 depend on the size and position of the carrier 400 carried by the carrier plate 160, the distance between the process space 120 and each adjacent blocking member 150 in the first direction is 2 mm to 5 mm. That is, the distance between the carrier 400 and each adjacent blocking member 150 in the first direction is 2 mm to 5 mm. For any carrier 400 and an adjacent blocking member 150, the distance between the carrier 400 and the blocking member 150 in the first direction can also be understood as: the distance between the edge of the carrier 400 near the blocking member 150 and the edge of the blocking member 150 near the carrier 400 in the first direction.

[0078] Specifically, if the blocking member 150 is located only on the first side 121 or the second side 122 of a process space 120, the distance between the blocking member 150 and the process space 120 in the first direction is 2 mm to 5 mm. If the blocking member 150 is located between two process spaces 120, the distance between the blocking member 150 and each process space 120 in the first direction is 2 mm to 5 mm.

[0079] For example, the distance between the process space 120 and each adjacent barrier 150 in the first direction is in the range of 2 mm, 3 mm, 4 mm or 5 mm.

[0080] In the above embodiments, since the blocking member 150 is relatively close to the adjacent process space 120 in the first direction, the blocking member 150 can effectively block process gas from passing through the first side 121 or the second side 122 of the process space 120, and also block process gas from passing between two adjacent process spaces 120. Furthermore, by maintaining a certain distance between the blocking member 150 and the adjacent process space 120 in the first direction, a smaller blocking member 150 can be used while ensuring the airflow blocking effect, thereby saving material for the blocking member 150.

[0081] Figure 14 The diagram shows a schematic representation of a structure in which a clearance space is formed between the bottom of a blocking member and the bottom of a process cavity, according to an exemplary embodiment of this application.

[0082] In some embodiments, such as Figure 14 As shown, the carrier plate 160 sequentially passes through multiple process spaces 120 along the direction of movement. The carrier plate 160 is configured to carry the product. The direction of movement is parallel to the first direction. The top of the blocking member 150 is connected to the top inner wall of the process cavity 110. A clearance space 162 is formed between the bottom of the blocking member 150 and the bottom of the process cavity 110. The carrier plate 160 can pass through the clearance space 162 along the direction of movement. The direction from the top to the bottom of the process cavity 110 intersects both the first and second directions.

[0083] For example, the top of the process cavity 110 points to the bottom in a vertical direction (as shown by Z in the figure).

[0084] It is understood that in this embodiment, the blocking members 150 that may interfere with the carrier plate 160 are mainly targeted. Other blocking members 150 may form a clearance space 162 between themselves and the bottom of the process cavity 110, or they may not form a clearance space 162 between themselves and the bottom of the process cavity 110.

[0085] For example, the top of the blocking member 150 can be connected to the top inner wall of the process cavity 110 by means of a screw or bolt or other connecting member, or the top of the blocking member 150 can be connected to the top inner wall of the process cavity 110 by welding.

[0086] In the above embodiments, by forming a clearance space 162 between the bottom of the blocking member 150 and the bottom of the process cavity 110, interference between the blocking member 150 and the carrier plate 160 can be avoided, allowing the carrier plate 160 to move smoothly in the process cavity 111 along the direction of movement.

[0087] In some embodiments, such as Figure 14As shown, the carrier plate 160 sequentially passes through multiple process spaces 120 along the direction of movement. The carrier plate 160 is configured to carry products arranged in M ​​rows along a second direction, where M is an integer greater than 1. There is a gap space 161 between adjacent rows of products. The direction of movement is parallel to the first direction. As the products arranged in M ​​rows along the second direction sequentially pass through the first side 121 or the second side 122 of any process space 120 along the direction of movement, the blocking member 150, which is provided on the first side 121 or the second side 122 of the process space 120 and located between the third side 123 and the fourth side 124 of the process space 120, is located in the gap space 161.

[0088] Specifically, the carrier plate 160 is configured to carry carrier members 400 arranged in M ​​rows along the second direction, and the carrier members 400 are configured to carry at least one product.

[0089] Specifically, the carrier plate 160 is configured to carry products arranged in M ​​rows and N columns along the second direction, where N is a positive integer, for example, M is 2 and N is 2.

[0090] Specifically, the dimension of the space 161 in the second direction is greater than the dimension of the blocking member 150 in the second direction.

[0091] For example, M is 2, 3 or 4. If M is 3, then two interval spaces 161 can be formed between the three rows of products, and the process chamber 111 can be provided with a blocking member 150 that is in the same position as the two interval spaces 161 in the second direction.

[0092] In the above embodiments, this structure allows the blocking member 150, located between the third side 123 and the fourth side 124 of the process space 120, to guide the process gas around each row of products while avoiding interference with the transport of products arranged in M ​​rows along the second direction by the carrier plate 160 in the direction of movement.

[0093] In some embodiments, such as Figure 2 and Figure 3 As shown, the carrier plate 160 sequentially passes through multiple process spaces 120 along the direction of movement. The carrier plate 160 is configured to carry the product, and its direction of movement is parallel to the first direction. The annealing equipment 100 also includes multiple tailpipes 170 and a main pipe 180. The tailpipes 170 are connected to the outlet 140. The main pipe 180 is connected to the multiple tailpipes 170. The main pipe 180 has an extraction port 181. Process gases can be extracted through the extraction port 181. The position of the extraction port 181 in the direction of movement is the extraction position, the position in the first process space 120 along the direction of movement is the first position, the position in the second process space 120 is the second position, and the extraction position in the direction of movement is located between the first position and the second position.

[0094] For example, the extraction port 181 is connected to the extraction pipe 500, and the pump unit 600 is connected to the extraction pipe 500. The pump unit 600 can extract process gas through the extraction pipe 500. Figure 3 The central air extraction port 181 is located at the connection between the air extraction pipe 500 and the main pipe 180.

[0095] Specifically, the extraction position can refer to the position of the geometric center or edge point of the extraction port 181 in the direction of movement. The first position can refer to the position of the geometric center or edge point of the first process space 120 in the direction of movement, and the second position can refer to the position of the geometric center or edge point of the second process space 120 in the direction of movement.

[0096] Specifically, most of the organic matter on the product will volatilize when the product moves along the direction of movement to the first process space 120 and the second process space 120. If the exhaust port 181 is located further back in the direction of movement, a large amount of gaseous organic matter in the first process space 120 and the second process space 120 will have a longer journey in the main pipe 180. After the temperature drops, it is easy to condense on the pipe wall of the main pipe 180, causing blockage of the main pipe 180. In addition, since the exhaust flow rate of the tailpipe 170 near the exhaust port 181 is larger and the exhaust flow rate of the tailpipe 170 far from the exhaust port 181 is smaller, some of the gaseous organic matter in the first process space 120 and the second process space 120 will move towards the process space 120 near the exhaust port 181. When the process gas passes through at least one process space 120, the gaseous organic matter is easy to recondense into a solid and deposit on the product surface, reducing the quality of the annealing process.

[0097] In the above embodiments, by positioning the extraction position between the first and second positions, the travel distance of a large amount of gaseous organic matter volatilized from the first and second process spaces 120 within the main pipe 180 can be reduced, thereby reducing the risk of this gaseous organic matter condensing and clogging the main pipe 180. Furthermore, the extraction flow rate of the tailpipe 170 connecting the first and second process spaces 120 can be increased, allowing a large amount of gaseous organic matter volatilized from the products in the first and second process spaces 120 to directly enter the main pipe 180 through the tailpipe 170 and be quickly extracted by the pump unit 600 through the extraction port 181, reducing the risk of gaseous organic matter recondensing into solid deposits on the product surface and improving the cleanliness of the cavity.

[0098] According to experimental tests, such as Figure 7 As shown, the process chamber 111 has 5 sub-chambers 1111. Each process space 120 has a third blocking member 153 on the first side 121 and the second side 122. The air extraction position is located between the first position and the second position in the direction of movement. The test results are as follows.

[0099] The nitrogen flow rate in the silicon wafer area of ​​the first process space 120 is 0.26 m / s, which is 116% higher than that without the obstruction 150.

[0100] The nitrogen flow rate in the silicon wafer area of ​​the second process space 120 is 0.20 m / s, which is 98% higher than that when no obstruction is set in 150.

[0101] The nitrogen flow rate in the silicon wafer area of ​​the third process space 120 is 0.14 m / s, which is 178% higher than that without the obstruction 150.

[0102] The nitrogen flow rate in the silicon wafer area of ​​the fourth process space 120 is 0.12 m / s, which is 185% higher than that without the obstruction 150.

[0103] The nitrogen flow rate in the silicon wafer area of ​​the fifth process space 120 is 0.10 m / s, which is 190% higher than that without the obstruction 150.

[0104] Therefore, by setting the third blocking element 153 and setting the air extraction port 181 as described above, the nitrogen flow rate near the silicon wafer can be significantly increased, the purging efficiency can be improved, and the waste of gas caused by the airflow passing through the ineffective area between adjacent process spaces 120 can be reduced.

[0105] In some embodiments, for two adjacent process spaces 120 along the direction of movement, the flow rate of the process gas output from the outlet 140 corresponding to the first process space 120 is greater than or equal to the flow rate of the process gas output from the outlet 140 corresponding to the second process space 120. Furthermore, for all process spaces 120 arranged sequentially along the direction of movement, the flow rate of the process gas output from the outlet 140 corresponding to the first process space 120 is greater than the flow rate of the process gas output from the outlet 140 corresponding to the last process space 120.

[0106] Specifically, the flow rate setting method described above involves gradually decreasing the outlet flow rate of multiple process spaces 120 arranged sequentially along the direction of motion. More specifically, the outlet flow rate of the first few process spaces 120 is larger, while the outlet flow rate of the later process spaces 120 is smaller. In practical applications, the outlet flow rate of each process space 120 can be determined through multiple simulations and actual verifications.

[0107] For example, if there are process space 1, process space 2 and process space 3 in sequence along the direction of motion, the air flow rate of process space 1 is equal to the air flow rate of process space 2, and the air flow rate of process space 2 is greater than the air flow rate of process space 3.

[0108] In the above embodiments, by using this flow setting method, a large amount of gaseous organic matter volatilized from the product in the first few process spaces 120 can quickly and directly enter the main pipe 250 through the tailpipe 170, while passing through other process spaces 120 less, reducing the risk that gaseous organic matter will re-condense into a solid in other process spaces 120 and deposit on the product surface.

[0109] In some embodiments, for two adjacent process spaces 120 along the direction of movement, the flow rate of the process gas introduced into the inlet 130 corresponding to the first process space 120 is greater than or equal to the flow rate of the process gas introduced into the inlet 130 corresponding to the second process space 120, and for all process spaces 120 arranged sequentially along the direction of movement, the flow rate of the process gas introduced into the inlet 130 corresponding to the first process space 120 is greater than the flow rate of the process gas introduced into the inlet 130 corresponding to the last process space 120.

[0110] Specifically, the flow rate setting method in the above embodiment is to gradually increase the air intake flow rate of the process spaces 120 arranged sequentially along the direction of motion. More specifically, the air intake flow rate of the first few process spaces 120 is larger, while the air intake flow rate of the latter few process spaces 120 is smaller.

[0111] For example, if there are process spaces 1, 2, 3, 4 and 5 sequentially along the direction of movement. The air intake flow rate of process space 1 is 300 L / min to 1000 L / min (e.g., 400 L / min), the air intake flow rate of process space 2 is 200 L / min to 800 L / min (e.g., 400 L / min), and the air intake flow rates of process spaces 3, 4 and 5 are all 100 L / min to 300 L / min (e.g., 133 L / min).

[0112] For example, the air intake flow rate of process space 1 is XL / min, and the air intake flow rate of process space 2 is... L / min, the intake flow rates of process spaces 3, 4 and 5 are all L / min.

[0113] For example, the flow rate of the process gas introduced into the inlet 130 corresponding to the process space 120 can be precisely controlled by the flow regulation component 200 described later.

[0114] In the above embodiments, since the organic matter on the product mainly evaporates in large quantities in the first few process spaces 120 along the direction of movement, by making the air intake flow rate of the first few process spaces 120 larger, the gas flow rate around the product can be accelerated, so that the gaseous organic matter in the first few process spaces 120 can be quickly discharged, reducing the risk of secondary deposition of gaseous organic matter onto the product.

[0115] In some embodiments, for two adjacent process spaces 120 along the direction of movement, the minimum inner diameter of the tailpipe 170 connected to the air outlet 140 of the first process space 120 is greater than or equal to the minimum inner diameter of the tailpipe 170 connected to the air outlet 140 of the second process space 120. Furthermore, for all process spaces 120 arranged sequentially along the direction of movement, the minimum inner diameter of the tailpipe 170 connected to the air outlet 140 of the first process space 120 is greater than the minimum inner diameter of the tailpipe 170 connected to the air outlet 140 of the last process space 120.

[0116] For ease of representation, the minimum inner diameter of the tailpipe 170 connected to the air outlet 140 corresponding to the process space 120 is: the minimum inner diameter of the tailpipe 170 corresponding to the process space 120.

[0117] Specifically, if the extraction direction is defined as parallel to the second direction and is the direction away from the process chamber 111, the inner diameter of the tailpipe 170 along the extraction direction can be constant or gradually decrease. If the inner diameter of the tailpipe 170 gradually decreases along the extraction direction, then the minimum inner diameter of the tailpipe 170 is the inner diameter of the end of the tailpipe 170 away from the process chamber 111. By gradually decreasing the inner diameter of the reducing sleeve 190, airflow turbulence at the diameter change point can be avoided.

[0118] For example, if there are process spaces 1, 2, 3, 4 and 5 in sequence along the direction of movement. The minimum inner diameter of the tailpipe 170 corresponding to process space 1 is 180 mm, the minimum inner diameter of the tailpipe 170 corresponding to process space 2 is 150 mm, and the minimum inner diameter of the tailpipe 170 corresponding to process spaces 3, 4 and 5 is 120 mm.

[0119] In related technologies, the furnace structure of vacuum annealing furnaces is fixed, lacking precise means of flow field control. It is impossible to improve the purging efficiency of key areas without changing the gas inlet formula. The process adaptability is poor, making it difficult to adapt to different slurry systems, silicon wafers of different thicknesses, or new annealing process curves. Moreover, process optimization relies on repeated trial and error, with long simulation and verification cycles, high costs, and difficulty in responding quickly to technology iterations.

[0120] In the above embodiments, by replacing the tailpipes 170 with different minimum inner diameters, the outlet flow rate of the process space 120 can be flexibly adjusted without changing the overall intake process formula. This optimizes the extraction resistance, increases the gas velocity around the product, and improves waste discharge efficiency, thereby flexibly and precisely adjusting the flow field inside the process space 120. Furthermore, this method is low-cost and convenient for process verification. Simulation results demonstrate that this airflow control method can significantly improve the uniform flow effect and substantially increase the efficiency of organic waste discharge.

[0121] Figure 16 The diagram shown is a structural schematic of the tailpipe and variable diameter ferrule provided in an exemplary embodiment of this application.

[0122] In some embodiments, such as Figure 16 As shown, the annealing equipment 100 also includes multiple reducing sleeves 190. The reducing sleeves 190 are disposed in the tailpipe 170. For the tailpipe 170 connected to the outlets 140 of two adjacent process spaces 120 along the direction of movement, the minimum inner diameter of the reducing sleeve 190 disposed in the tailpipe 170 connected to the outlet 140 of the first process space 120 is greater than or equal to the minimum inner diameter of the reducing sleeve 190 disposed in the tailpipe 170 connected to the outlet 140 of the second process space 120. Furthermore, for all process spaces 120 arranged sequentially along the direction of movement, the minimum inner diameter of the reducing sleeve 190 disposed in the tailpipe 170 connected to the outlet 140 of the first process space 120 is greater than the minimum inner diameter of the reducing sleeve 190 disposed in the tailpipe 170 connected to the outlet 140 of the last process space 120.

[0123] For ease of representation, the minimum inner diameter of the variable diameter ferrule 190 provided in the tailpipe 170 connected to the air outlet 140 of the process space 120 (hereinafter referred to as the process space 120) is: the minimum inner diameter of the variable diameter ferrule 190 of the process space 120.

[0124] Specifically, the inner diameter of the reducing ferrule 190 along the extraction direction can be constant or gradually decreasing. If the inner diameter of the reducing ferrule 190 gradually decreases along the extraction direction, the minimum inner diameter of the reducing ferrule 190 is the inner diameter of the end of the reducing ferrule 190 furthest from the process chamber 111. Furthermore, the reducing ferrule 190 and the tailpipe 170 should be sealed together by a sealing element, such as a flange. By gradually decreasing the inner diameter of the reducing ferrule 190 and ensuring a sealed connection between the reducing ferrule 190 and the tailpipe 170, airflow turbulence and leakage at the diameter change are avoided. The inner diameter of the reducing ferrule 190 can be determined through simulation and actual verification.

[0125] For example, if there are process spaces 1, 2, 3, 4 and 5 sequentially along the direction of movement. The minimum inner diameter of the variable diameter ferrule 190 corresponding to process space 1 is 180 mm, the minimum inner diameter of the variable diameter ferrule 190 corresponding to process space 2 is 150 mm, and the minimum inner diameter of the variable diameter ferrules 190 corresponding to process spaces 3, 4 and 5 is 120 mm.

[0126] In the above embodiments, by setting the variable-diameter ferrule 190, the outlet airflow of the process space 120 can be flexibly adjusted without changing the overall inlet air process formula, reducing suction resistance, increasing the gas velocity around the product, improving waste discharge efficiency, and adapting to high cleanliness process requirements. Furthermore, by replacing the variable-diameter ferrule 190 with different inner diameters, it can adapt to changing process formulas, resulting in low implementation costs and convenient process verification. Simulation verification shows that this airflow control method can significantly improve the uniform flow effect and significantly increase the efficiency of organic waste discharge.

[0127] Figure 15 The diagram shown is a schematic diagram of the gas path of an annealing device provided in an exemplary embodiment of this application.

[0128] In some embodiments, such as Figure 15 As shown, the annealing apparatus 100 also includes a plurality of flow regulating components 200. The flow regulating components 200 are connected to the inlet 130. The flow regulating components 200 are configured to detect and regulate the flow rate of the process gas introduced into the inlet 130.

[0129] Specifically, the flow regulation component 200 corresponding to each process space 120 can independently regulate the air intake flow of that process space 120. The air intake flow of each process space 120 can be optimized through multiple adjustments and tests, such as simulation and actual testing, to flexibly adapt to the process requirements of multiple operating conditions.

[0130] For example, the flow regulation component 200 may include a high-precision gas mass flow controller (MFC) that can detect and regulate the intake flow rate in real time.

[0131] For example, process gas can be introduced into the air inlet 130 in a continuous ventilation manner, or process gas can be introduced into the air inlet 130 in a cyclical manner of 5 seconds of ventilation followed by 5 seconds of cessation of ventilation.

[0132] In the above embodiments, by setting the flow regulation component 200, the air intake flow rate of the process space 120 can be automatically and accurately detected and adjusted, thereby precisely controlling the flow field within the process space 120 and ensuring stable operation under multiple working conditions. Furthermore, adjusting the air intake flow rate of the process space 120 through the flow regulation component 200 can also be used for flow field testing of the annealing equipment 100.

[0133] Furthermore, in related technologies, when multiple cavities of a vacuum annealing furnace are connected in series, it is difficult to coordinate and stably control the airflow, pressure, and flow rate, resulting in large fluctuations in process parameters and failing to meet the requirements for stable mass production. However, in the embodiments of this application, by combining the inlet flow rate control (controlled by the flow adjustment component 200) and outlet flow rate control (controlled by the inner diameter of the tailpipe 240 or the inner diameter control of the variable diameter ferrule 260) of the process space 120, independent control of the gas field of multiple process spaces 120 can be achieved.

[0134] Furthermore, by combining the inlet flow rate control (controlled by the flow regulation component 200) and outlet flow rate control (controlled by the inner diameter of the tailpipe 240 or the inner diameter of the variable diameter ferrule 260) within the process space 120, and the frequency conversion control of the pump group 600, the process pressure requirements can be precisely matched, achieving integrated process parameter control of pressure, gas volume, and flow rate. This ensures stable airflow under different process conditions and improves the consistency and reliability of the vacuum annealing process. Through multiple sets of experimental data, flow field simulation, and on-site debugging verification, this structure has achieved stable mass production application. The equipment exhibits small fluctuations in process parameters, high repeatability, and reliable operation. It is compatible with the vacuum annealing processes of high-efficiency photovoltaic cells such as BC and perovskite, improving production yield.

[0135] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, effects, etc. mentioned in this application are merely examples and not limitations. These advantages, benefits, effects, etc. should not be considered as essential features of each embodiment of this application.

[0136] Furthermore, the specific details disclosed above are for illustrative and illustrative purposes only, and are not intended to be limiting. These details do not limit the scope of this application to the requirement that it must adopt the specific details described above.

[0137] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0138] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0139] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0140] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. An annealing apparatus, characterized in that, include: A process cavity has a process chamber, which has a plurality of process spaces arranged sequentially and interconnected along a first direction. The process spaces are configured to accommodate products. Each process space has a first side and a second side in the first direction, and a third side and a fourth side in the second direction, which intersects the first direction. Each process space is connected to at least one air inlet and at least one air outlet. Process gas can be input into the corresponding process space through the air inlet, and process gas can be extracted from the corresponding process space through the air outlet. The air inlet is located on the third side of the process space and is disposed on the cavity wall of the process cavity, and the air outlet is located on the fourth side of the process space and is disposed on the cavity wall of the process cavity. Multiple blocking elements are provided, with each process space corresponding to at least one blocking element. Each blocking element corresponding to the process space is located on the first side or the second side of the process space, and at least one blocking element is provided between two adjacent process spaces.

2. The annealing equipment according to claim 1, characterized in that, At least two blocking elements are respectively disposed at at least two locations on the third side, the fourth side, and between the third side and the fourth side of the corresponding process space; and / or, At least one of the blocking elements includes at least one first blocking element, the first blocking element being disposed on the third side of the corresponding process space; and / or, At least one of the blocking elements includes at least one second blocking element, the second blocking element being disposed on the fourth side of the corresponding process space; and / or, At least one of the blocking elements includes at least one third blocking element disposed between the third side and the fourth side of the corresponding process space.

3. The annealing equipment according to claim 1 or 2, characterized in that, The blocking member includes a plate-like structure that extends along the first direction and the vertical direction and is perpendicular to the second direction. Both the first direction and the second direction intersect the vertical direction. And / or, the projection of the blocking member on the process cavity along the second direction does not overlap with either the air inlet or the air outlet.

4. The annealing equipment according to claim 1 or 2, characterized in that, The distance between the process space and each of the adjacent barriers in the first direction ranges from 2 mm to 5 mm.

5. The annealing equipment according to claim 1 or 2, characterized in that, The carrier plate passes through multiple process spaces sequentially along the direction of movement. The carrier plate is configured to carry the product. The direction of movement is parallel to the first direction. The top of the blocking member is connected to the top inner wall of the process cavity. A clearance space is formed between the bottom of the blocking member and the bottom of the process cavity. The carrier plate can pass through the clearance space along the direction of movement. The direction from the top of the process cavity to the bottom intersects both the first direction and the second direction.

6. The annealing equipment according to claim 1 or 2, characterized in that, The carrier plate passes through multiple process spaces sequentially along the direction of movement. The carrier plate is configured to carry products arranged in M ​​rows along the second direction, where M is an integer greater than 1. There is a gap between adjacent rows of products. The direction of movement is parallel to the first direction. Wherein, as the products arranged in M ​​rows along the second direction pass sequentially through the first or second side of any of the process spaces along the direction of movement, the blocking member disposed on the first or second side of the process space and located between the third and fourth sides of the process space is located in the interval space.

7. The annealing equipment according to claim 1 or 2, characterized in that, The carrier plate sequentially passes through multiple process spaces along the direction of movement, the carrier plate being configured to carry the product, and the direction of movement being parallel to the first direction; The annealing equipment further includes: Multiple tailpipes, wherein the tailpipes are connected to the air outlet; The main pipe is connected to multiple tailpipes and has an exhaust port through which process gas can be extracted. Wherein, the position of the air extraction port in the direction of movement is the air extraction position, the position of the first process space along the direction of movement is the first position, the position of the second process space is the second position, and the air extraction position in the direction of movement is located between the first position and the second position.

8. The annealing equipment according to claim 7, characterized in that, For two adjacent process spaces along the direction of movement, the flow rate of the process gas output from the outlet corresponding to the first process space is greater than or equal to the flow rate of the process gas output from the outlet corresponding to the second process space. Furthermore, for all process spaces arranged sequentially along the direction of movement, the flow rate of the process gas output from the outlet corresponding to the first process space is greater than the flow rate of the process gas output from the outlet corresponding to the last process space. And / or, For two adjacent process spaces along the direction of movement, the flow rate of the process gas introduced through the air inlet corresponding to the first process space is greater than or equal to the flow rate of the process gas introduced through the air inlet corresponding to the second process space. Furthermore, for all process spaces arranged sequentially along the direction of movement, the flow rate of the process gas introduced through the air inlet corresponding to the first process space is greater than the flow rate of the process gas introduced through the air inlet corresponding to the last process space.

9. The annealing equipment according to claim 7, characterized in that, For two adjacent process spaces along the direction of movement, the minimum inner diameter of the tailpipe connected to the air outlet of the first process space is greater than or equal to the minimum inner diameter of the tailpipe connected to the air outlet of the second process space. Furthermore, for all process spaces arranged sequentially along the direction of movement, the minimum inner diameter of the tailpipe connected to the air outlet of the first process space is greater than the minimum inner diameter of the tailpipe connected to the air outlet of the last process space. And / or, The annealing equipment also includes: Multiple variable diameter ferrules are disposed on the tailpipe. For the tailpipes connected to the air outlets of two adjacent process spaces along the direction of movement, the minimum inner diameter of the variable diameter ferrule disposed in the tailpipe connected to the air outlet of the first process space is greater than or equal to the minimum inner diameter of the variable diameter ferrule disposed in the tailpipe connected to the air outlet of the second process space. Furthermore, for all process spaces arranged sequentially along the direction of movement, the minimum inner diameter of the variable diameter ferrule disposed in the tailpipe connected to the air outlet of the first process space is greater than the minimum inner diameter of the variable diameter ferrule disposed in the tailpipe connected to the air outlet of the last process space.

10. The annealing equipment according to claim 7, characterized in that, The annealing equipment also includes: Multiple flow control components, which are connected to the air inlet and configured to detect and regulate the flow rate of the process gas introduced into the air inlet.

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