LED lamp bead and preparation process thereof

Abstract

This disclosure pertains to the field of LED technology and relates to an LED chip and its manufacturing process, comprising: providing a component to be packaged, the component including a substrate, an LED chip disposed on the substrate, and an electrical connector disposed between the two; placing the component to be packaged in a packaging mold, such that the light-emitting side of the LED chip faces and corresponds to the arc-shaped molding surface of the packaging mold; introducing a light-transmitting encapsulating material into the packaging mold, and under the constraint of the arc-shaped molding surface, covering the LED chip and the electrical connector with the light-transmitting encapsulating material; curing the light-transmitting encapsulating material, and forming an integral encapsulating colloid after demolding, the integral encapsulating colloid having an arc-shaped light-emitting surface protruding away from the substrate; this solution can directly form an integral arc-shaped encapsulating colloid with an expanding angle effect through the packaging molding process without substantially changing the LED chip substrate, chip, and electrical connection structure.

Description

Technical Field

[0001] This disclosure relates to the field of LED technology, and more specifically, to an LED lamp bead and its manufacturing process. Background Technology

[0002] LED chips are widely used in home appliances, consumer electronics, instruments, and various display control panels due to their small size, fast response speed, low power consumption, and ease of surface mounting. Small-sized surface-mount LED chips are commonly used to form digital displays, icon indicators, status prompts, or partial backlight displays. They are typically mounted within a PCB board or display module and display light signals outwards through the panel's light-transmitting area. As home appliance display interfaces demand higher levels of integration, viewing comfort, and multi-angle visibility, LED chips not only need to meet forward brightness requirements but also maintain good visibility and display uniformity when viewed from the side or at an angle.

[0003] Existing surface-mount LED chips typically consist of an LED chip mounted on a substrate, connected to the substrate electrodes via wire bonding or other electrical connection structures. A transparent or fluorescent encapsulating adhesive is then used to cover the LED chip and the electrical connection structures, which cures to form an encapsulating colloid. To facilitate mass packaging, cutting, and surface mounting, the light-emitting surface of these encapsulating colloids is often planar or near-planar. The light emitted by the LED chip is primarily emitted in the forward direction of the chip, with relatively limited lateral light emission. When these chips are used in home appliance displays, curved panels, or display windows requiring a wide viewing angle, they are prone to significant brightness attenuation and insufficient visibility of displayed content at oblique viewing angles, making it difficult to meet wide-angle display requirements.

[0004] Therefore, it is necessary to improve the existing LED chips to solve the technical problems of limited light emission angle and insufficient visibility when viewed at an angle. Summary of the Invention

[0005] The purpose of this disclosure is to provide an LED light bead and its manufacturing process to solve the above-mentioned technical problems.

[0006] Other features and advantages of this disclosure will become apparent from the following detailed description, or may be learned in part from practice of this disclosure.

[0007] According to one aspect of this disclosure, a process for manufacturing LED chips is provided, comprising the following steps: A component to be packaged is provided, the component to be packaged includes a substrate, an LED chip disposed on the substrate, and an electrical connector disposed between the two; The component to be packaged is placed in the packaging mold, such that the light-emitting side of the LED chip faces and corresponds to the arc-shaped surface of the packaging mold; A light-transmitting encapsulating material is introduced into the encapsulation mold, and under the constraint of the arc-shaped molding surface, the light-transmitting encapsulating material covers the LED chip and the electrical connector. The light-transmitting encapsulating material is cured and demolded to form an integral encapsulating colloid, which has an arc-shaped light-emitting surface that protrudes away from the substrate.

[0008] Optionally, the integrated encapsulant includes an arc-shaped apex located above the LED chip and an arc-shaped edge located around the apex, wherein the arc-shaped apex protrudes away from the substrate relative to the arc-shaped edge along the thickness direction of the substrate.

[0009] Optionally, the arc-shaped shaping surface includes an arc apex region and arc edge regions located on both sides of the arc apex region; When the component to be packaged is placed in the packaging mold, the projection of the arc apex region along the thickness direction of the substrate covers the light-emitting area of ​​the LED chip, and the projection of the arc edge region along the thickness direction of the substrate is located on the outer periphery of the LED chip, so that the cured integrated encapsulant forms an arc-shaped light-emitting surface with a central adhesive thickness greater than the peripheral adhesive thickness.

[0010] Optionally, the encapsulation molding die includes a first mold portion and a second mold portion disposed opposite to each other. The first mold portion is provided with a substrate receiving groove for accommodating the substrate, and the second mold portion is provided with the arc-shaped molding surface on the side facing the substrate receiving groove. After the first mold portion and the second mold portion are closed, an encapsulation molding space for molding the light-transmitting encapsulating material is formed between the upper surface of the substrate and the arc-shaped molding surface.

[0011] Optionally, the second mold part is further provided with an edge limiting surface arranged around the outer periphery of the arc-shaped molding surface, an overflow buffer groove located outside the edge limiting surface, and an exhaust micro-groove connecting the encapsulation molding space and the overflow buffer groove. The exhaust micro-groove extends from the edge of the arc-shaped surface in a direction away from the arc-shaped surface.

[0012] Optionally, after the first mold and the second mold are closed, a colloid edge forming gap is formed between the edge limiting surface and the upper surface of the substrate, and the distance between the middle part of the arc forming surface and the upper surface of the substrate is greater than the height of the colloid edge forming gap.

[0013] Optionally, before introducing the light-transmitting encapsulating material into the encapsulation mold, the amount of light-transmitting encapsulating material to be introduced is determined based on the colloid molding volume jointly defined by the LED chip, electrical connector, and arc-shaped molding surface. The amount of the light-transmitting encapsulating material introduced satisfies the following conditions: under the constraint of the arc-shaped surface, the light-transmitting encapsulating material can continuously cover the LED chip and the electrical connector, and fill the arc-shaped area corresponding to the arc-shaped surface, while the edge of the light-transmitting encapsulating material does not exceed the predetermined encapsulation boundary on the substrate.

[0014] Optionally, a light-transmitting encapsulating material is introduced into the encapsulation mold, and under the constraint of the arc-shaped molding surface, the light-transmitting encapsulating material covers the LED chip and the electrical connector, specifically including the following steps: First, the light-transmitting encapsulating material is placed above the light-emitting side of the LED chip or in the molding area corresponding to the arc-shaped molding surface; Then, the packaging mold is brought into the forming state, and the arc-shaped forming surface is gradually brought closer to the component to be packaged; As the arc-shaped molding surface approaches the component to be encapsulated, the light-transmitting encapsulating material flows from the light-emitting side of the LED chip to the periphery of the LED chip and enters the vicinity of the electrical connector. The outer surface of the light-transmitting encapsulating material is shaped by the arc-shaped molding surface, so that the light-transmitting encapsulating material forms an arc-shaped outer surface corresponding to the arc-shaped molding surface.

[0015] Optionally, the transparent encapsulating material is cured to form an integral encapsulating body after demolding, specifically including the following steps: While the encapsulation mold is in the forming state, the light-transmitting encapsulation material is cured in the first stage, so that the light-transmitting encapsulation material forms a preliminary arc-shaped outer surface under the constraint of the arc-shaped forming surface. After the first stage of curing, the encapsulation mold is separated from the pre-shaped light-transmitting encapsulation material; After demolding, the pre-shaped transparent encapsulating material is cured in a second stage to form an integral encapsulating material that is bonded to the substrate.

[0016] The present invention also provides an LED lamp bead, which is manufactured using the LED lamp bead manufacturing process described above, wherein the LED lamp bead comprises: A substrate having an upper surface; LED chip, wherein the LED chip is disposed on the upper surface of the substrate; An electrical connector, wherein the electrical connector is connected between the LED chip and the electrode pad; An integrated encapsulating colloid is applied to the upper surface of the substrate and continuously encapsulates the LED chip and the electrical connector. The integrated encapsulating colloid has an arc-shaped light-emitting surface that protrudes away from the substrate.

[0017] As can be seen from the above technical solutions, the exemplary embodiments disclosed herein possess at least the following advantages and positive effects: In the technical solutions provided by some embodiments of this disclosure: during the preparation process, by using an arc-shaped molding surface to constrain the shape of the light-transmitting encapsulating material during the encapsulation molding process, the encapsulating material directly forms an integral structure with an arc-shaped light-emitting surface after curing; compared with conventional planar light-emitting LED beads, this arc-shaped light-emitting surface can change the refraction and emission path of the light emitted from the LED chip on the surface of the encapsulating material, increase the lateral light-emitting component, thereby helping to expand the light-emitting angle of the LED bead and improve the visibility and display uniformity at the oblique viewing angle; at the same time, the arc-shaped light-emitting surface is obtained by integral molding of the encapsulating material, without the need for additional independent lenses or diffusers, which can better balance the simplification of the encapsulation structure, production compatibility and mass production cost; this solution can directly form an integral arc-shaped encapsulating material with an angle-expanding effect through the encapsulation molding process without basically changing the LED bead substrate, chip and electrical connection structure.

[0018] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings: Figure 1 This is a schematic diagram of the finished structure of the LED lamp bead in this embodiment 1; Figure 2 This is a schematic diagram of the LED lamp bead manufacturing process before molding in this embodiment 1; Figure 3 This is a schematic diagram of the molding process for manufacturing LED beads in this embodiment 1; Figure 4 This is a schematic diagram of the LED lamp bead packaging molding mold of this embodiment; Illustration: LED bead 100, substrate 110, LED chip 120, curved top 141, curved edge 142, electrical connector 130, integrated encapsulant 140; The encapsulation molding mold 200, the arc-shaped molding surface 201, the first mold part 210, the second mold part 220, the substrate receiving groove 211, the edge limiting surface 221, the overflow buffer groove 222, and the venting micro groove 223. Detailed Implementation

[0020] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art.

[0021] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this disclosure.

[0022] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0023] The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all content and operations / steps, nor do they necessarily have to be performed in the described order. For example, some operations / steps can be broken down, while others can be combined or partially combined; therefore, the actual execution order may change depending on the specific circumstances.

[0024] Example 1: Figure 1 A schematic diagram of the finished structure of an LED lamp bead to which embodiments of the present disclosure can be applied is shown. Figure 2 This is a schematic diagram of the LED lamp bead manufacturing process before molding in this embodiment. Figure 3 This is a schematic diagram of the molding process for manufacturing LED beads in this embodiment. Figure 4 This is a schematic diagram of the packaging mold for the LED beads in this embodiment.

[0025] like Figure 1 As shown Figure 4 As shown, the present invention provides a manufacturing process for an LED bead 100, comprising the following steps: S1, a component to be packaged is provided, the component to be packaged includes a substrate 110, an LED chip 120 disposed on the substrate 110 and an electrical connector 130 disposed between the two.

[0026] The substrate 110 is preferably a PCB substrate 110 or other insulating carrier substrate 110 suitable for surface mount mounting, on which positive and negative electrode pads and chip mounting areas can be pre-formed; after the LED chip 120 is fixed on the substrate 110, its light-emitting side faces the side away from the substrate 110.

[0027] The electrical connector 130 can be made of gold wire, alloy wire, conductive connection layer, or other structures that enable the chip electrode to conduct to the electrode of the substrate 110. The electrical connector 130 forms the base carrier for subsequent arc-shaped encapsulation, so that the chip position, the electrical connection position and the substrate 110 bearing surface are in a relatively stable state, thereby facilitating the subsequent formation of a shape-controlled encapsulation encapsulation on the light-emitting side of the chip.

[0028] S2, the component to be packaged is placed in the packaging mold 200, so that the light-emitting side of the LED chip 120 faces and corresponds to the arc-shaped surface 201 of the packaging mold 200.

[0029] After placing the component to be packaged into the packaging mold 200, the light-emitting side of the LED chip 120 is oriented toward the arc-shaped molding surface 201 in the mold. The purpose is to ensure that the outer surface of the subsequent encapsulating colloid can be shaped according to the shape of the arc-shaped molding surface 201.

[0030] The arc-shaped surface 201 can be pre-processed according to the light emission angle and shape of the target lamp bead. Its surface is preferably polished or demolded to reduce scratches, sticking or atomization defects on the surface of the cured colloid.

[0031] A stable relative relationship is formed between the LED chip 120, the substrate 110, and the arc-shaped surface 201, so that the encapsulating material can form a light-emitting surface that protrudes away from the substrate 110 after subsequent curing, instead of a conventional planar light-emitting surface.

[0032] S3, introduce transparent encapsulating material into the encapsulation mold 200, and under the constraint of the arc-shaped molding surface 201, make the transparent encapsulating material cover the LED chip 120 and the electrical connector 130.

[0033] It should be noted that the light-transmitting encapsulating material is introduced into the encapsulation mold 200 and, under the constraint of the mold, covers the LED chip 120 and the electrical connector 130.

[0034] The light-transmitting encapsulating compound can be transparent epoxy resin, transparent silicone, or other light-transmitting compounds suitable for LED encapsulation; when the LED bead 100 is used for white light display, phosphor can also be mixed into the light-transmitting compound.

[0035] Before introducing the rubber compound, it can be stirred, filtered, or degassed to reduce the impact of air bubbles, impurities, and surface defects on the gloss effect.

[0036] The key is to enable the adhesive to both cover the LED chip 120 and the electrical connector 130, providing protection and insulation, and to form a predetermined shape under the constraint of the arc-shaped surface 201, providing an adhesive basis for subsequently expanding the light emission angle.

[0037] S4, the light-transmitting encapsulating material is cured and demolded to form an integral encapsulating colloid 140. The integral encapsulating colloid 140 has an arc-shaped light-emitting surface that protrudes away from the substrate 110.

[0038] Specifically, the light-transmitting encapsulating material is cured to transform it from a flowing state into a stable encapsulating colloid, and the arc-shaped light-emitting surface defined by the arc-shaped molding surface 201 is retained after demolding.

[0039] The curing method can be selected according to the adhesive system, such as heat curing, UV-assisted curing, or segmented curing. During the curing process, the shape of the adhesive should be kept stable to avoid deformation of the arc-shaped glossy surface due to sagging, shrinkage, or demolding.

[0040] The cured encapsulant is integrated with the substrate 110 and continuously covers the LED chip 120 and electrical connector 130. This protects the chip and electrical connection structure while changing the light emission path through the convex arc-shaped light-emitting surface, thereby improving the visibility of the LED in the oblique observation direction.

[0041] The working principle of this invention is as follows: During the preparation process, the shape of the light-transmitting encapsulating material is constrained by the arc-shaped molding surface 201 during the encapsulation molding process, so that the encapsulating material directly forms an integral structure with an arc-shaped light-emitting surface after curing. Compared with the conventional planar light-emitting surface of the LED bead 100, the arc-shaped light-emitting surface can change the refraction and emission path of the light emitted from the LED chip 120 on the surface of the encapsulating material, increase the lateral light-emitting component, thereby expanding the light-emitting angle of the LED bead 100 and improving the visibility and display uniformity at the tilted viewing angle. At the same time, the arc-shaped light-emitting surface is obtained by integral molding of the encapsulating material, without the need for additional independent lenses or diffusers, which can better balance the simplification of the encapsulation structure, production compatibility and mass production cost. This solution can directly form an integral arc-shaped encapsulating material with an expanding angle effect through the encapsulation molding process without basically changing the LED bead 100 substrate 110, chip and electrical connection structure.

[0042] In this embodiment, the integrated encapsulant 140 specifically includes an arc-shaped top 141 located above the LED chip 120 and an arc-shaped edge 142 located around the arc-shaped top 141. The arc-shaped top 141 protrudes along the thickness direction of the substrate 110 relative to the arc-shaped edge 142 on the side away from the substrate 110.

[0043] Specifically, the integrated encapsulant 140 forms a continuously convex encapsulant profile through an arc-shaped apex 141 and an arc-shaped edge 142. The arc-shaped apex 141 corresponds to the main light-emitting direction of the LED chip 120, and the arc-shaped edge 142 continuously transitions from the arc-shaped apex 141 towards the substrate 110. With this structure, the outer surface of the encapsulant is no longer planar, but forms an arc-shaped light-emitting interface similar to a microlens above the chip, allowing the light emitted by the chip to be refracted by the arc-shaped light-emitting surface and emitted over a wider angle range. Simultaneously, the arc-shaped apex 141 and the arc-shaped edge 142 are continuously molded from the same encapsulant, avoiding assembly errors and interface losses caused by external lenses.

[0044] In this embodiment, it is further explained that the arc-shaped molding surface 201 includes an arc apex region and arc edge regions located on both sides of the arc apex region; when the component to be packaged is placed in the packaging molding mold 200, the projection of the arc apex region along the thickness direction of the substrate 110 covers the light-emitting area of ​​the LED chip 120, and the projection of the arc edge region along the thickness direction of the substrate 110 is located on the outer periphery of the LED chip 120, so that the cured integrated encapsulant 140 forms an arc-shaped light-emitting surface with a central adhesive thickness greater than the peripheral adhesive thickness.

[0045] Furthermore, the arc apex region and the light-emitting region of the LED chip 120 maintain a corresponding relationship in the thickness direction of the substrate 110, so that the maximum thickness area of ​​the integrated encapsulant 140 is located on the main light-emitting path of the chip; the arc edge region is located on the outer periphery of the LED chip 120, so that the thickness of the encapsulant gradually decreases from the center to the periphery. Through the above-mentioned projection position relationship, the light-transmitting encapsulant, after curing, can form an arc-shaped light-emitting surface with a central protrusion and a peripheral transition, which is beneficial to achieve a smoother emission transition of forward and side light, and reduce light skewing or uneven brightness caused by the asymmetry of the encapsulant shape.

[0046] For small-sized LED beads 100, taking the 0603 specification as an example, the height difference between the arc top 141 and the arc edge 142 protruding along the thickness direction of the substrate 110 can be 0.05mm to 0.30mm, preferably 0.10mm to 0.20mm; the arc-shaped light-emitting surface can be a circular arc surface, an elliptical arc surface or a continuously transitioning curved surface.

[0047] The projection of the arc apex region along the thickness direction of the substrate 110 completely covers the light-emitting area of ​​the LED chip 120, and can extend to the outer periphery of the LED chip 120 by 0.02mm to 0.15mm.

[0048] In this embodiment, the encapsulation molding mold 200 specifically includes a first mold portion 210 and a second mold portion 220 disposed opposite to each other. The first mold portion 210 is provided with a substrate receiving groove 211 for receiving a substrate 110, and the second mold portion 220 is provided with an arc-shaped surface 201 on the side facing the substrate receiving groove 211. After the first mold portion 210 and the second mold portion 220 are closed, an encapsulation molding space for molding light-transmitting encapsulating adhesive is formed between the upper surface of the substrate 110 and the arc-shaped surface 201.

[0049] It should be noted that the relative arrangement of the first mold portion 210 and the second mold portion 220 facilitates the positioning and constraint of the substrate 110 and the light-transmitting encapsulating material during mold closing. The substrate receiving groove 211 can restrict the position of the substrate 110 in the horizontal and thickness directions, so that the LED chip 120 remains stably aligned with the arc-shaped molding surface 201 on the second mold portion 220; the upper surface of the substrate 110 and the arc-shaped molding surface 201 together define the encapsulation molding space, so that the light-transmitting encapsulating material can be cured and molded within this space, thereby ensuring the consistency of the encapsulating height, arc position and shape of different batches of LED chips.

[0050] In this embodiment, the second module 220 is further provided with an edge limiting surface 221 arranged around the outer periphery of the arc forming surface 201, an overflow buffer groove 222 located outside the edge limiting surface 221, and an exhaust micro-groove 223 connecting the encapsulation molding space and the overflow buffer groove 222; the exhaust micro-groove 223 extends from the edge of the arc forming surface 201 in a direction away from the arc forming surface 201.

[0051] Preferably, the edge limiting surface 221 is used to define the peripheral boundary of the encapsulating colloid, the overflow buffer groove 222 is used to accommodate a small amount of excess colloid squeezed out during the mold closing process, and the venting micro-groove 223 is used to guide air in the encapsulation molding space to the overflow buffer groove 222. Through the cooperation of the edge limiting surface 221, the overflow buffer groove 222, and the venting micro-groove 223, the risk of air bubble residue, local missing colloid, and irregular edge overflow can be reduced while forming an arc-shaped light-emitting surface, which is especially suitable for the precision encapsulation molding of small-sized LED beads 100.

[0052] As a preferred embodiment, after the first mold portion 210 and the second mold portion 220 are molded together, a colloid edge forming gap is formed between the edge limiting surface 221 and the upper surface of the substrate 110, and the distance between the middle part of the arc forming surface 201 and the upper surface of the substrate 110 is greater than the height of the colloid edge forming gap.

[0053] More preferably, the edge molding gap of the colloid is used to define the peripheral thickness of the integral encapsulating colloid 140, and the larger gap between the center of the arc-shaped molding surface 201 and the upper surface of the substrate 110 is used to form the arc-shaped top 141 located above the LED chip 120. By making the center gap greater than the edge gap height, the encapsulation molding space presents a shape with a high center and low periphery in cross-section. After the light-transmitting encapsulating colloid is cured, a stable encapsulating colloid structure with a center thickness greater than the periphery thickness can be obtained, thereby forming an arc-shaped light-emitting surface with an expanding angle effect without the need for additional optical lenses.

[0054] In this embodiment, before introducing the light-transmitting encapsulating material into the encapsulation mold 200, the amount of light-transmitting encapsulating material to be introduced is determined based on the encapsulation volume defined by the LED chip 120, the electrical connector 130, and the arc-shaped molding surface 201.

[0055] The amount of light-transmitting encapsulating material introduced satisfies the following: under the constraint of the arc-shaped surface 201, the light-transmitting encapsulating material can continuously cover the LED chip 120 and the electrical connector 130, and fill the arc-shaped area corresponding to the arc-shaped surface 201, while the edge of the light-transmitting encapsulating material does not exceed the predetermined encapsulation boundary on the substrate 110.

[0056] Specifically, the amount of light-transmitting encapsulating material introduced can be determined based on the effective volume of the encapsulation molding space. This effective volume is mainly determined by the space between the upper surface of the substrate 110, the LED chip 120, the electrical connector 130, and the arc-shaped molding surface 201.

[0057] For small-sized LED beads 100, the amount of adhesive introduced should be slightly greater than the minimum amount of adhesive that can cover the LED chip 120 and electrical connector 130, so as to ensure that the adhesive can fully fill the arc area after mold closing. However, it should not be excessive, so as to avoid the adhesive exceeding the predetermined packaging boundary on the substrate 110 and affecting the shape and size of the LED bead and subsequent mounting.

[0058] Preferably, the amount of light-transmitting encapsulating adhesive introduced can be 95% to 110% of the theoretical volume of the encapsulation molding space. Specifically, it can be adjusted according to the viscosity of the adhesive, the height of the arc-shaped molding surface 201, and whether an overflow buffer structure is set, so as to take into account the integrity of the adhesive, the consistency of the arc surface, and the edge adhesive control effect.

[0059] In this embodiment, step S3 specifically includes the following steps: S31, first place the light-transmitting encapsulating material above the light-emitting side of the LED chip 120 or in the molding area corresponding to the arc-shaped molding surface 201.

[0060] Specifically, the light-transmitting encapsulating material can be applied to the light-emitting side of the LED chip 120 via a dispensing needle, a spray nozzle, or a transfer method, or it can be pre-applied to the molding area corresponding to the arc-shaped molding surface 201.

[0061] For small-sized LED beads 100, it is preferable to initially position the adhesive material in the center or adjacent area of ​​the light-emitting area of ​​the LED chip 120. This allows the adhesive material to diffuse outwards from the top of the LED chip 120 during subsequent mold assembly, reducing the off-center curvature of the light-emitting surface caused by adhesive material misalignment. Before placement, the transparent encapsulating adhesive material can undergo vacuum degassing or static degassing treatment to reduce the impact of air bubbles inside the cured adhesive on the uniformity of light emission.

[0062] S32, then the encapsulation mold 200 enters the forming state, and the arc-shaped forming surface 201 gradually approaches the component to be encapsulated.

[0063] Furthermore, when the encapsulation molding die 200 enters the molding state, the first mold portion 210 and the second mold portion 220 can gradually approach each other along the thickness direction of the substrate 110, instead of being pressed together rapidly in one go. By gradually closing the mold, the arc-shaped molding surface 201 can smoothly contact or approach the light-transmitting encapsulation material, allowing the material to spread slowly during the pressure process, reducing the impact on the electrical connector 130.

[0064] Preferably, the mold closing speed can be fast at first and then slow down, that is, the mold closing speed is reduced after the arc-shaped molding surface 201 starts to constrain the material, so as to improve the stability of the material filling and the consistency of the arc surface molding.

[0065] S33, during the process of the arc-shaped surface 201 approaching the component to be encapsulated, the light-transmitting encapsulating material flows from the light-emitting side of the LED chip 120 to the periphery of the LED chip 120 and enters the area around the electrical connector 130.

[0066] It should be noted that as the arc-shaped surface 201 gradually approaches the component to be encapsulated, the light-transmitting encapsulating material is squeezed and guided by the arc-shaped surface 201, flowing from the light-emitting side of the LED chip 120 to the periphery of the LED chip 120, and further entering the area around the electrical connector 130, thereby enabling the LED chip 120 and the electrical connector 130 to be continuously encapsulated by the adhesive.

[0067] This flow pattern helps reduce missing adhesive on the chip top and gaps around the electrical connector 130, while also preventing uneven encapsulation thickness caused by rapid build-up of adhesive from one side. When using gold wire as the electrical connector 130, the adhesive flow process should maintain a low impact force to prevent wire misalignment, collapse, or breakage.

[0068] S34, the outer surface of the light-transmitting encapsulating material is shaped by the arc-forming surface 201, so that the light-transmitting encapsulating material forms an arc-shaped outer surface corresponding to the arc-forming surface 201.

[0069] Preferably, after the light-transmitting encapsulating material is filled into the corresponding area of ​​the arc-shaped surface 201, the arc-shaped surface 201 defines the shape of the outer surface of the material, so that the outer surface of the material replicates or substantially conforms to the curved shape of the arc-shaped surface 201.

[0070] This shaping process allows the light-transmitting encapsulating material to form a predetermined arc-shaped outer contour before curing, resulting in an arc-shaped light-emitting surface that bulges away from the substrate 110 after curing. Direct shaping via the mold surface improves the arc height, the center position of the arc surface, and the consistency of the appearance of batch products compared to relying on the natural surface tension of the material to form the arc surface.

[0071] In this embodiment, step S4 specifically includes the following steps: S41, while the encapsulation mold 200 is in a molded state, the light-transmitting encapsulation material is cured in the first stage, so that the light-transmitting encapsulation material forms a preliminary curved outer surface under the constraint of the arc forming surface 201.

[0072] Specifically, the first stage of curing can be carried out while the encapsulation mold 200 is in a closed or limited state, so that the light-transmitting encapsulation material is continuously constrained by the arc-shaped surface 201 before it is fully cured. This stage is mainly used to transform the material from a flowing state to a semi-cured or pre-cured state with a certain shape retention capability, thereby avoiding deformation of the arc-shaped outer surface caused by material sagging, springback or shrinkage before and after demolding.

[0073] Depending on the adhesive system, the first stage of curing can be achieved by heating or photothermal composite curing. For example, the heating temperature can be selected from 80℃ to 120℃, and the curing time can be selected from 5 minutes to 30 minutes.

[0074] S42, after the first stage of curing, separates the encapsulation mold 200 from the pre-formed transparent encapsulation material.

[0075] Furthermore, after the first stage of curing, the light-transmitting encapsulating material has formed a preliminary curved outer surface. At this point, separating the encapsulation mold 200 from the material can reduce the risk of the material being stretched, collapsed, or damaged by adhesion during demolding.

[0076] To facilitate demolding, the arc-shaped molding surface 201 can be pre-polished, coated with a release coating, or covered with a release film to keep the initially shaped outer surface of the colloid smooth and continuous. During demolding, it is preferable to smoothly separate the mold along the thickness direction of the substrate 110 to avoid lateral dragging of the arc-shaped outer surface.

[0077] S43, after demolding, the pre-shaped transparent encapsulating material is cured in the second stage to form an integral encapsulating material 140 that is bonded to the substrate 110.

[0078] Preferably, the second stage of curing is carried out after demolding. Its main function is to further improve the crosslinking degree, hardness, heat resistance and bonding strength between the light-transmitting encapsulating material and the substrate 110, so that it can finally form a stable integrated encapsulating material 140.

[0079] The temperature and time for the second-stage curing can be higher or longer than that for the first-stage curing. For example, it can be cured at 120°C to 160°C for 1 to 6 hours, depending on the material system of the light-transmitting encapsulating compound. After the second-stage curing, the integrated encapsulating compound 140 can maintain the arc-shaped light-emitting surface provided by the arc-shaped surface 201, and can also provide reliable protection for the LED chip 120 and the electrical connector 130.

[0080] Example 2: Combination Figure 1 As shown, the present invention also provides an LED lamp bead 100, which is manufactured using the LED lamp bead 100 manufacturing process as described in Embodiment 1. The LED lamp bead 100 includes: The substrate 110 has an upper surface, and the upper surface is provided with a chip mounting area and electrode pads spaced apart from the chip mounting area. LED chip 120 is disposed on the upper surface of substrate 110, in the chip mounting area, and the light emitting side of LED chip 120 faces the side away from substrate 110. Electrical connector 130 is connected between LED chip 120 and electrode pad; An integrated encapsulant 140 is applied to the upper surface of the substrate 110 and continuously encapsulates the LED chip 120 and the electrical connector 130. The integrated encapsulant 140 has an arc-shaped light-emitting surface that protrudes away from the substrate 110. The arc-shaped light-emitting surface includes an arc-shaped top 141 located above the LED chip 120 and an arc-shaped edge 142 located around the arc-shaped top 141 and extending to the upper surface of the substrate 110. The arc-shaped top 141 protrudes outward relative to the arc-shaped edge 142 along the thickness direction of the substrate 110.

[0081] Specifically, the LED bead 100 can be a surface-mount LED bead 100, and its substrate 110 is preferably a PCB substrate 110. The upper surface of the substrate 110 is provided with a chip mounting area and electrode pads. The LED chip 120 is mounted in the chip mounting area and electrically connected to the electrode pads through an electrical connector 130. Unlike conventional LED beads with a planar or near-planar encapsulation structure, the integrated encapsulation 140 in this embodiment is a single encapsulation structure that continuously covers the LED chip 120 and the electrical connector 130, and forms an arc-shaped light-emitting surface protruding away from the substrate 110 above the LED chip 120. The top of the arc 141 corresponds to the main light-emitting area of ​​the LED chip 120, and the edge of the arc 142 extends continuously from the top of the arc 141 to the upper surface of the substrate 110, so that the encapsulation 140 forms an arc-shaped profile that is high in the middle and low at the periphery in cross-section.

[0082] Furthermore, instead of adding a lens to the outside of a conventional LED chip, the LED chip 100 forms an arc-shaped light-emitting surface with a light-amplifying effect through the integral molding structure of the encapsulating colloid itself. For LED display interfaces, status indicators, or digital display scenarios of household appliances, the light-emitting angle of conventional planar colloid LED chips is usually about 120°, which can easily lead to decreased brightness or unclear display when viewed at an oblique angle. In this embodiment, by changing the colloid above the LED chip 120 from a planar structure to an arc-shaped structure, the light obtains a larger lateral emission component after being refracted by the arc-shaped light-emitting surface, thereby improving the light-emitting angle to 120°~160° and enhancing the visibility and display uniformity of the household appliance display interface at different viewing angles.

[0083] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0084] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A manufacturing process for LED beads, characterized in that, Includes the following steps: A component to be packaged is provided, the component to be packaged includes a substrate, an LED chip disposed on the substrate, and an electrical connector disposed between the two; The component to be packaged is placed in the packaging mold, such that the light-emitting side of the LED chip faces and corresponds to the arc-shaped surface of the packaging mold; A light-transmitting encapsulating material is introduced into the encapsulation mold, and under the constraint of the arc-shaped molding surface, the light-transmitting encapsulating material covers the LED chip and the electrical connector. The light-transmitting encapsulating material is cured and demolded to form an integral encapsulating colloid, which has an arc-shaped light-emitting surface that protrudes away from the substrate.

2. The LED lamp bead manufacturing process according to claim 1, characterized in that, The integrated encapsulant includes an arc-shaped apex located above the LED chip and an arc-shaped edge located around the apex. The arc-shaped apex protrudes away from the substrate relative to the arc-shaped edge along the thickness direction of the substrate.

3. The LED lamp bead manufacturing process according to claim 1, characterized in that, The arc-shaped surface includes an arc apex region and arc edge regions located on both sides of the arc apex region; When the component to be packaged is placed in the packaging mold, the projection of the arc apex region along the thickness direction of the substrate covers the light-emitting area of ​​the LED chip, and the projection of the arc edge region along the thickness direction of the substrate is located on the outer periphery of the LED chip, so that the cured integrated encapsulant forms an arc-shaped light-emitting surface with a central adhesive thickness greater than the peripheral adhesive thickness.

4. The LED lamp bead manufacturing process according to claim 1, characterized in that, The encapsulation molding die includes a first mold part and a second mold part arranged opposite to each other. The first mold part is provided with a substrate receiving groove for accommodating the substrate, and the second mold part is provided with the arc-shaped molding surface on the side facing the substrate receiving groove. After the first mold part and the second mold part are closed, an encapsulation molding space for molding the light-transmitting encapsulating material is formed between the upper surface of the substrate and the arc-shaped molding surface.

5. The LED lamp bead manufacturing process according to claim 4, characterized in that, The second mold part is also provided with an edge limiting surface arranged around the outer periphery of the arc-shaped molding surface, an overflow buffer groove located outside the edge limiting surface, and an exhaust micro-groove connecting the encapsulation molding space and the overflow buffer groove. The exhaust micro-groove extends from the edge of the arc-shaped surface in a direction away from the arc-shaped surface.

6. The LED lamp bead manufacturing process according to claim 5, characterized in that, After the first mold and the second mold are closed, a colloid edge forming gap is formed between the edge limiting surface and the upper surface of the substrate, and the distance between the middle part of the arc forming surface and the upper surface of the substrate is greater than the height of the colloid edge forming gap.

7. The LED lamp bead manufacturing process according to claim 1, characterized in that, Before introducing the light-transmitting encapsulating material into the encapsulation mold, the amount of light-transmitting encapsulating material to be introduced is determined based on the colloid molding volume defined by the LED chip, electrical connector, and arc-shaped molding surface. The amount of the light-transmitting encapsulating material introduced satisfies the following conditions: under the constraint of the arc-shaped surface, the light-transmitting encapsulating material can continuously cover the LED chip and the electrical connector, and fill the arc-shaped area corresponding to the arc-shaped surface, while the edge of the light-transmitting encapsulating material does not exceed the predetermined encapsulation boundary on the substrate.

8. The LED lamp bead manufacturing process according to claim 1, characterized in that, Introducing a light-transmitting encapsulating material into the encapsulation mold, and under the constraint of the arc-shaped molding surface, allowing the light-transmitting encapsulating material to cover the LED chip and the electrical connector, specifically includes the following steps: First, the light-transmitting encapsulating material is placed above the light-emitting side of the LED chip or in the molding area corresponding to the arc-shaped molding surface; Then, the packaging mold is brought into the forming state, and the arc-shaped forming surface is gradually brought closer to the component to be packaged; As the arc-shaped molding surface approaches the component to be encapsulated, the light-transmitting encapsulating material flows from the light-emitting side of the LED chip to the periphery of the LED chip and enters the vicinity of the electrical connector. The outer surface of the light-transmitting encapsulating material is shaped by the arc-shaped molding surface, so that the light-transmitting encapsulating material forms an arc-shaped outer surface corresponding to the arc-shaped molding surface.

9. The LED lamp bead manufacturing process according to claim 8, characterized in that, The transparent encapsulating material is cured and, after demolding, forms an integral encapsulating body. The specific steps include: While the encapsulation mold is in the forming state, the light-transmitting encapsulation material is cured in the first stage, so that the light-transmitting encapsulation material forms a preliminary arc-shaped outer surface under the constraint of the arc-shaped forming surface. After the first stage of curing, the encapsulation mold is separated from the pre-shaped light-transmitting encapsulation material; After demolding, the pre-shaped transparent encapsulating material is cured in a second stage to form an integral encapsulating material that is bonded to the substrate.

10. An LED lamp bead, characterized in that, The LED is manufactured using the manufacturing process described in any one of claims 1 to 9, wherein the LED comprises: A substrate having an upper surface; LED chip, wherein the LED chip is disposed on the upper surface of the substrate; An electrical connector, wherein the electrical connector is connected between the LED chip and the electrode pad; An integrated encapsulating colloid is applied to the upper surface of the substrate and continuously encapsulates the LED chip and the electrical connector. The integrated encapsulating colloid has an arc-shaped light-emitting surface that protrudes away from the substrate.

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