High-yield anti-edge-collapse LED package cutting process

Abstract

The application provides a high-yield anti-edge collapse LED packaging cutting process and relates to the technical field of LED packaging processing. The application comprises the following steps: step 1, product cutting pretreatment; step 2, knife path planning and parameter setting: planning the product cutting path position, setting the cutting path offset allowance and segmented cutting parameters; step 3, segmented cutting processing: sequentially performing the pre-scar shallow cutting process and the secondary fine cutting process on the product, and step by step completing stress release and product complete granulation; and step 4, product cutting post-processing. The application adopts the segmented cutting process of pre-scar shallow cutting and secondary fine cutting on the LED packaging continuous sheet product, step by step releases the internal stress of the packaging body, reduces the instantaneous impact force of single straight cutting, solves the problems of edge collapse and block falling that are prone to occur in the traditional straight cutting process, simultaneously eliminates the internal residual stress, avoids the reliability faults such as hidden cracks, glue layer peeling, delamination and dead lamps of the product in the subsequent process, greatly improves the production yield of the product, and meets the demand of large-scale production.

Description

Technical Field

[0001] This invention relates to the field of LED packaging and processing technology, and more specifically, to a high-yield LED packaging and cutting process that prevents edge chipping. Background Technology

[0002] LED packaging is the entire process of transforming a bare LED chip into a standardized LED device (LED bead / module) that can be directly soldered and powered through a series of processes including mechanical fixing, electrical connection, optical shaping, and protective sealing. After LED packaging, the continuous packaged products need to be cut into individual LED products, which is one of the core processes in the post-packaging processing. Currently, the post-packaging cutting process in the LED packaging industry generally adopts a one-pass direct cutting process with diamond blades, which cuts the continuous LED packaged products into individual particles at a constant blade speed and constant feed rate, while using traditional wet cutting methods for cooling during the cutting process.

[0003] Existing processes have several shortcomings in actual large-scale production: First, the impact stress during a single direct cut is high, and the LED encapsulation colloid and bracket are subjected to strong impact, making them prone to defects such as chipping, breakage, and corner damage. At the same time, the cutting stress remains inside the encapsulation, causing microcracks in the product. This can lead to reliability issues such as adhesive peeling, product delamination, and dead LEDs during subsequent use, resulting in a low overall product yield. Second, the product yield fluctuates greatly during mass production due to cutting vibration and stress fluctuations, which cannot meet the production requirements of large-scale, high-quality LED encapsulation products. Summary of the Invention

[0004] This invention aims to solve problems such as high edge chipping rate, product microcracks, high cutting stress, low production yield, and frequent glue contamination of cutting tools in existing LED packaging and cutting processes.

[0005] To address the above problems, this invention provides a high-yield, chip-resistant LED packaging and cutting process, comprising the following steps: Step 1: Pre-treatment of the product before cutting; Step 2, Toolpath Planning and Parameter Setting: Plan the product cutting path position, set the cutting path offset allowance and segmented cutting parameters; Step 3, Segmented Cutting Process: Perform pre-scratching shallow cutting and secondary precision cutting processes on the product in sequence to complete stress release and complete product separation in stages; Step 4: Post-cutting processing of the product.

[0006] The present invention provides a high-yield LED packaging and cutting process with anti-chipping properties, which, compared with the prior art, has the following beneficial effects, but is not limited to: This high-yield, chip-resistant LED packaging cutting process abandons the traditional one-time straight-cut process. Instead, it employs a segmented cutting process involving pre-scribing shallow cuts and secondary precision cuts on LED packaged products. Combined with planned cutting path positions, set cutting path offset allowances, and segmented cutting parameters, it releases internal stress in the package step by step, reducing the instantaneous impact of a single straight cut. By optimizing both the process flow and parameters, it solves the appearance defects such as chipping, piece loss, and corner defects that are common in traditional straight-cut processes. At the same time, it eliminates internal residual stress, preventing reliability failures such as microcracks, adhesive peeling, delamination, and dead LEDs. This reduces the fluctuation range of product yield during mass production, significantly improving the overall product yield and reducing frequent adhesive contamination of cutting tools, thus meeting the production needs of large-scale, high-quality LED packaging products.

[0007] Furthermore, in step 1, after attaching a high-viscosity UV film to the bottom surface of the LED packaged sheet product, it is placed in a special vacuum adsorption fixture for alignment, and after vacuum adsorption and fixation, it enters the cutting process.

[0008] Furthermore, in step 2, the cutting path position is planned according to the chip layout of the LED packaged sheet product, and the cutting path offset margin is set to make the cutting path deviate from the core area of ​​the chip. Then, the cutting parameters corresponding to the pre-scratching shallow cut and the secondary fine cut are set respectively.

[0009] Further, step 3 includes: Step 301, Pre-scratching shallow cut: Using a low-impact cutting mode, perform shallow pre-scratching along the preset cutting path; Step 302, Secondary fine cutting: Based on the pre-cut groove, adjust the cutting parameters to perform deep fine cutting.

[0010] Furthermore, in step 4, the vacuum adsorption is released and the individual LED products after granulation are removed. They are then subjected to UV degumming, cleaning, drying, full appearance inspection and sorting in sequence to complete the entire cutting process.

[0011] Furthermore, the adsorption pressure of the vacuum adsorption fixture is controlled at 0.4MPa~0.6MPa; the high-viscosity UV film is completely bonded to the bottom surface of the LED encapsulation sheet product, without bubbles or edge lifting.

[0012] Furthermore, the cutting parameters include spindle speed, feed rate, and cutting height, and the entire cutting process uses diamond cutting blades.

[0013] Furthermore, the UV degumming is performed by directional irradiation with ultraviolet light for 10-30 seconds.

[0014] Furthermore, the cleaning process employs pure water ultrasonic cleaning with an ultrasonic frequency of 40~68kHz and a cleaning duration of 5~10min, used to remove cutting dust and residual adhesive residue.

[0015] Furthermore, the drying process adopts hot air circulation drying, the drying temperature is controlled at 60~90℃, and the drying time is 25~35min; the appearance inspection uses an AOI optical inspection instrument to detect appearance defects. Attached Figure Description

[0016] Figure 1 This is a flowchart of the high-yield, edge-break-resistant LED packaging and cutting process according to an embodiment of the present invention; Figure 2 This is a cutting effect diagram of the LED packaged continuous product according to an embodiment of the present invention, formed by a high-yield, anti-chipping LED packaged cutting process. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this application clearer, specific embodiments of this application are described clearly and completely below with reference to the accompanying drawings. It should be understood that the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments described in this application without creative effort will fall within the scope of protection of this application.

[0018] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the specification of this application is for the purpose of describing specific embodiments only and is not intended to limit this application; the terms "comprising," "including," "having," "containing," "comprise," etc., in the specification, claims, and accompanying drawings of this application are open-ended terms, indicating that a method comprises one or more steps, or an apparatus comprises one or more elements, but do not exclude the inclusion of other steps or elements. The terms "first," "second," etc., in the specification, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or primary / secondary relationship. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0019] In the description of this application, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0020] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0021] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0022] See Figure 1 and Figure 2 The present invention provides a high-yield LED packaging and cutting process to prevent edge chipping, comprising the following steps: Step 1: Pre-treatment of the product before cutting; Step 2, Toolpath Planning and Parameter Setting: Plan the product cutting path position, set the cutting path offset allowance and segmented cutting parameters; Step 3, Segmented Cutting Process: Perform pre-scratching shallow cutting and secondary precision cutting processes on the product in sequence to complete stress release and complete product separation in stages; Step 4: Post-cutting processing of the product.

[0023] In this embodiment, the high-yield, anti-chipping LED packaging cutting process abandons the traditional one-time straight-cut process. Instead, it employs a segmented cutting process involving pre-scratching shallow cutting and secondary precision cutting on LED packaged products. Combined with planned cutting path positions, set cutting path offset allowances, and segmented cutting parameters, the internal stress of the package is released step by step, reducing the instantaneous impact force of a single straight cut. By optimizing both the process flow and parameters, this process solves the problems of chipping, piece loss, and corner defects that are common in traditional straight-cut processes. At the same time, it eliminates internal residual stress, preventing subsequent reliability failures such as microcracks, adhesive peeling, delamination, and dead LEDs. This reduces the fluctuation range of product yield during mass production, significantly improving the overall product yield and reducing frequent adhesive contamination of cutting tools, thereby meeting the production needs of large-scale, high-quality LED packaging products.

[0024] See Figure 1 Optionally, in step 1, after attaching a high-viscosity UV film to the bottom surface of the LED packaged sheet product, it is placed in a special vacuum adsorption fixture to complete the alignment, and after vacuum adsorption is turned on to fix it, it enters the cutting process.

[0025] In this embodiment, a packaged LED sheet product is selected, and a high-viscosity UV film is attached to its entire bottom surface. Then, it is placed on a special vacuum adsorption fixture for alignment. After precise alignment, vacuum adsorption is activated for fixation. After vacuum adsorption fixation, the product enters the cutting process. The pre-cutting pretreatment method, which combines high-viscosity UV film with vacuum adsorption fixture for double fixation, improves the previous auxiliary process, enhances processing stability, effectively suppresses cutting vibration and product displacement, reduces surface scratch damage, minimizes yield fluctuations during mass production, and is suitable for large-scale continuous production operations.

[0026] See Figure 1 Optionally, in step 2, the cutting path position is planned according to the chip layout of the LED packaged sheet product, and the cutting path offset allowance is set to make the cutting path deviate from the core area of ​​the chip. Then, the cutting parameters corresponding to the pre-scratching shallow cut and the secondary fine cut are set respectively.

[0027] In this embodiment, the cutting path position is planned to ensure that the cutting path avoids the core area of ​​the chip. The cutting path offset margin is set to prevent physical damage to the chip. This avoids the high-speed blade directly scraping and cutting the chip, preventing chip breakage, electrode breakage, and wire breakage, thus preventing direct product scrap and functional failure from the source. In addition, the cutting process will generate mechanical stress and vibration. The offset margin can form a stress buffer to prevent the cutting stress and vibration from being transmitted to the chip area, avoiding microcracks and internal circuit desorption, and ensuring the optoelectronic performance and long-term reliability of the product. Because the load of a single straight cut is concentrated and fluctuates greatly under uniform parameters, by setting the cutting parameters corresponding to the pre-scribing shallow cut and the secondary fine cut, the pre-cutting and fine cutting parameters are matched differently, which can make the cutting load of the two processes uniform, the blade edge is subjected to stable force, reduce chipping and abnormal wear, reduce blade wear, production costs and tool change frequency, ensure cutting accuracy and stress release effect, and make the segmented cutting process run stably.

[0028] See Figure 2 Optionally, step 3 includes: Step 301, Pre-scratching shallow cut: Using a low-impact cutting mode, perform shallow pre-scratching along the preset cutting path; Step 302, Secondary fine cutting: Based on the pre-cut groove, adjust the cutting parameters to perform deep fine cutting.

[0029] In this embodiment, in the pre-scribing shallow cutting process, a low-impact cutting mode is adopted to perform shallow pre-scribing along the preset cutting path, which facilitates the initial release of internal stress in the packaged product, forms a regular cutting guide groove, and avoids misalignment and edge chipping in subsequent precision cutting; in the secondary precision cutting process, based on the pre-cut groove, the cutting parameters are adjusted to perform deep precision cutting, thereby completing the complete cutting and separation of the LED packaged continuous products in one go, controlling the cutting height throughout the process, and ensuring uniform cutting depth.

[0030] See Figure 1 Optionally, in step 4, the vacuum adsorption is released and the individual LED products after granulation are removed. They are then subjected to UV degumming, cleaning, drying, full appearance inspection and sorting to complete the entire cutting process.

[0031] In this embodiment, after the LED packaged sheet product is segmented and cut, the vacuum adsorption is turned off and the negative pressure fixation is released. The individual LED products after separation are removed from the special vacuum adsorption fixture and then subjected to UV degumming, cleaning, drying, full appearance inspection and sorting in sequence to complete the entire cutting process. Through processes such as UV degumming, cleaning, drying, full appearance inspection and sorting, the subsequent auxiliary processes are improved, thereby completely removing processing impurities and moisture and screening out defective products, making the quality of the finished product controllable and further ensuring the quality of the products leaving the factory.

[0032] Optionally, the adsorption pressure of the vacuum adsorption fixture is controlled at 0.4MPa~0.6MPa; the high-viscosity UV film is completely bonded to the bottom surface of the LED encapsulation sheet product, without bubbles or edge lifting.

[0033] In this embodiment, the high-speed cutting of the blade during cutting generates severe vibration and instantaneous cutting thrust. An adsorption pressure of 0.4MPa~0.6MPa, for example, 0.5MPa, firmly adheres the LED packaged sheet to the fixture table, eliminating workpiece micro-slippage and bouncing, ensuring precise toolpath, and effectively suppressing cutting vibration and displacement, preventing edge chipping and off-cutting from the source. The high-viscosity UV film is completely adhered to the bottom surface of the LED packaged sheet, without bubbles or warping. This bubble-free and edge-free adhesion keeps the entire LED packaged sheet horizontal, facilitating the elimination of cutting defects caused by bubbles and preventing chain defects caused by warping; thus achieving the desired result.

[0034] Optionally, the cutting parameters include spindle speed, feed rate, and cutting height, and the entire cutting process uses diamond cutting blades.

[0035] In this embodiment, the entire cutting process uses diamond cutting blades, which are characterized by high hardness, sharp cutting edge, smooth cross-section, and long wear life. They can accurately achieve shallow depth and narrow kerf cutting, and the toolpath offset is easy to control. Combined with precisely matched spindle speed, feed rate, and cutting height parameters, for example: the spindle speed (i.e., the constant blade speed) is 30,000 r / min, the feed rate for the pre-scribing shallow cutting process is 10 mm / s, and the cutting height is 0.11 mm. The feed rate for the secondary precision cutting process is 60 mm / s, and the cutting height is consistent with the pre-scribing shallow cutting process at 0.11 mm. The cutting parameters are optimized in segments to achieve the optimal balance between cutting efficiency and cutting quality. Through segmented cutting and precise parameter matching optimization, cutting stress is released step by step, reducing the instantaneous impact force during cutting, solving the problems of cutting edge chipping and chip / colloid damage, significantly improving the cutting yield, reducing blade wear, and improving the production efficiency and product reliability of LED packaging post-cutting.

[0036] Optionally, UV degumming is performed by directional irradiation with ultraviolet light for 10-30 seconds.

[0037] In this embodiment, after the individual LED products are removed from the dedicated vacuum adsorption fixture, they are first subjected to UV degumming treatment. This involves directional irradiation of the UV film on the bottom surface of the product using UV light. For example, CH-1523-1 UV film is used (this film has significantly reduced adhesion after UV irradiation and can be easily peeled off). Then, UV light with a wavelength of 365nm is used for irradiation (the UV irradiation power is 80% of the UV degumming machine's power, and the energy is 500~600mj / cm²). 2 Irradiate for 10-30 seconds to make the UV film lose its stickiness and easy to peel off.

[0038] Optionally, the cleaning process uses pure water ultrasonic cleaning with an ultrasonic frequency of 40~68kHz and a cleaning time of 5~10 minutes to remove cutting dust and residual adhesive residue.

[0039] In this embodiment, the product with the UV film removed is placed into a pure water ultrasonic cleaning device, the ultrasonic frequency is set to 40~68kHz, and the cleaning time is set to 5~10min, so as to facilitate the removal of dust, glue residue and debris generated during cutting.

[0040] Optionally, the drying process uses hot air circulation drying, with the drying temperature controlled at 60~90℃ and the drying time at 25~35 minutes; the appearance inspection uses an AOI optical inspection instrument to detect appearance defects.

[0041] In this embodiment, after cleaning, the product is sent to a hot air circulating drying equipment, and the drying temperature and drying time are controlled, such as the drying temperature being controlled at 80℃ and the drying time being controlled at 30 minutes, so as to facilitate the removal of residual moisture on the product surface. Finally, an AOI optical inspection instrument is used to perform a full appearance inspection on all products, checking for defects such as chipped edges, missing corners, hidden cracks, and surface scratches one by one, rejecting defective products, completing the sorting and granulation, and storing qualified products in the warehouse.

[0042] While the present invention has been disclosed above, its scope of protection is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all such changes and modifications will fall within the scope of protection of the present invention.

Claims

1. A high-yield, chip-resistant LED packaging and cutting process, characterized in that, Includes the following steps: Step 1: Pre-treatment of the product before cutting; Step 2, Toolpath Planning and Parameter Setting: Plan the product cutting path position, set the cutting path offset allowance and segmented cutting parameters; Step 3, Segmented Cutting Process: Perform pre-scratching shallow cutting and secondary precision cutting processes on the product in sequence to complete stress release and complete product separation in stages; Step 4: Post-cutting processing of the product.

2. The high-yield, anti-chipping LED packaging and cutting process according to claim 1, characterized in that, In step 1, after attaching a high-viscosity UV film to the bottom surface of the LED packaged sheet product, it is placed in a special vacuum adsorption fixture to complete the alignment. After vacuum adsorption and fixation, it enters the cutting process.

3. The high-yield, anti-chipping LED packaging and cutting process according to claim 1, characterized in that, In step 2, the cutting path position is planned according to the chip layout of the LED packaged continuous product. When setting the cutting path offset margin, the cutting path is deviated from the core area of ​​the chip. Then, the cutting parameters corresponding to the pre-scratching shallow cut and secondary fine cut are set respectively.

4. The high-yield, anti-chipping LED packaging and cutting process according to claim 1, characterized in that, Step 3 includes: Step 301, Pre-scratching shallow cut: Using a low-impact cutting mode, perform shallow pre-scratching along the preset cutting path; Step 302, Secondary fine cutting: Based on the pre-cut groove, adjust the cutting parameters to perform deep fine cutting.

5. The high-yield, anti-chipping LED packaging and cutting process according to claim 1, characterized in that, In step 4, the vacuum adsorption is released and the individual LED products after granulation are removed. They are then subjected to UV degumming, cleaning, drying, full appearance inspection and sorting to complete the entire cutting process.

6. The high-yield, anti-chipping LED packaging and cutting process according to claim 2, characterized in that, The adsorption pressure of the vacuum adsorption fixture is controlled at 0.4MPa~0.6MPa; the high viscosity UV film is completely bonded to the bottom surface of the LED encapsulation sheet product, without bubbles or edge lifting.

7. The high-yield, anti-chipping LED packaging and cutting process according to claim 3, characterized in that, The cutting parameters include spindle speed, feed rate, and cutting height, and the entire cutting process uses diamond cutting blades.

8. The high-yield, anti-chipping LED packaging and cutting process according to claim 5, characterized in that, The UV degumming process employs directional UV light irradiation for 10-30 seconds.

9. The high-yield, anti-chipping LED packaging and cutting process according to claim 5, characterized in that, The cleaning process uses pure water ultrasonic cleaning with an ultrasonic frequency of 40~68kHz and a cleaning time of 5~10min to remove cutting dust and residual adhesive residue.

10. The high-yield, anti-chipping LED packaging and cutting process according to claim 5, characterized in that, The drying process uses hot air circulation drying, with the drying temperature controlled at 60~90℃ and the drying time at 25~35 minutes; the appearance inspection uses an AOI optical inspection instrument to detect appearance defects.

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