A novel multi-pixel substrate

Abstract

The application provides a novel multi-pixel substrate, comprising: a substrate; a plurality of cutting lines, each of which is arranged on the surface of the substrate; a first metal connecting diameter, which is arranged on the front surface of the substrate; and a second metal connecting diameter.The novel multi-pixel substrate provided by the application is matched with the substrate, the cutting lines, the first metal connecting diameter, the second metal connecting diameter, LED wafers and positive and negative electrode pads, in the substrate electrical detection operation, the first metal connecting diameter and the second metal connecting diameter are used to connect and collect all the positive and negative electrode pads to the periphery of the substrate, only two groups of probes are needed to complete the overall detection, the traditional point-by-point detection mode is abandoned, the production detection efficiency is greatly improved, the number of test probe configurations is reduced, the equipment cost of the test fixture is reduced, and the probe only contacts the peripheral collection area and does not scratch the positive and negative electrode pads of the pixel area, so that the subsequent wire bonding process is stable.

Description

Technical Field

[0001] This invention relates to the field of LED packaging technology, and in particular to a novel multi-pixel substrate. Background Technology

[0002] With the rapid development of the automotive industry, vehicle driving safety has received increasing attention. Automotive headlights, especially high beams, are crucial for improving the driver's field of vision at night or in low-light conditions. However, traditional high beams can cause severe glare to drivers of oncoming or ahead vehicles when meeting or following other vehicles, posing a significant safety hazard. To overcome this problem, Adaptive Driving Beam (ADB) technology has emerged.

[0003] Currently, in the field of ADB headlights with fewer than 100 pixels (32, 84, 96, etc.), the mainstream technology is the array-type LED solution. Please refer to the appendix. Figure 4 This solution achieves chip-level point light emission by precisely arranging LED chips in an array on a ceramic substrate, attaching a phosphor sheet on top of the chips, and setting white barriers around the chips to make them flush with the phosphor sheet surface. However, existing multi-pixel ceramic substrates require multiple sets of positive and negative electrode pads to match the LED chips in order to achieve independent control of each pixel. Taking a 32-pixel ceramic substrate as an example, it requires 20 pairs of pads. Therefore, after die bonding, all pads need to be tested one by one to confirm the electrical yield of the product, resulting in a significant reduction in production efficiency. If a test fixture is used for testing, 20 pairs of test probes need to be configured on the fixture to form a precise alignment with the substrate pads. This not only increases equipment costs, but also, during the testing process, the metal probes may scratch the surface of the positive and negative electrode pads, thus affecting the stability of subsequent wire bonding processes.

[0004] Therefore, it is necessary to provide a novel multi-pixel substrate to solve the above-mentioned technical problems. Summary of the Invention

[0005] This invention provides a novel multi-pixel substrate that solves the problems of existing multi-pixel ADB headlight substrates, which require testing all pads one by one, resulting in low production efficiency, easy scratching of pads by test probes, affecting subsequent wire bonding processes, and high equipment costs due to the large number of test fixture probes.

[0006] To solve the above-mentioned technical problems, the present invention provides a novel multi-pixel substrate, comprising:

[0007] substrate;

[0008] Multiple cutting lines, all of which are formed on the surface of the substrate;

[0009] A first metal connection diameter is disposed on the front side of the substrate;

[0010] The second metal connection diameter is disposed in the middle layer of the substrate;

[0011] Multiple LED chips are disposed on the top of the substrate;

[0012] Positive and negative electrode pads are disposed on the top of the substrate.

[0013] Preferably, the positive and negative electrode pads include a positive electrode and a negative electrode, both of which are disposed on the top of the substrate.

[0014] Preferably, the substrate has a three-layer structure, consisting of a front layer, a middle layer, and a back layer; the first metal connecting diameter is disposed on the front layer of the substrate, and the second metal connecting diameter is disposed on the middle layer of the substrate.

[0015] Preferably, the first metal connection diameter connects all positive electrode pads on the front side of the substrate in series and extends to the periphery of the substrate to form a total pad, and the second metal connection diameter connects all negative electrode pads on the front side of the substrate in series and extends to the periphery of the substrate to form a total pad, and the width of the first metal connection diameter and the second metal connection diameter are equal to the width of the cutting line.

[0016] Preferably, a heat-dissipating metal pad is provided on the back side of the substrate, and the heat-dissipating metal pad is electrically isolated from the metal lines on the front side and the middle layer of the substrate.

[0017] Preferably, the novel multi-pixel substrate further includes a plurality of positioning reference pads, all of which are disposed on the top of the substrate.

[0018] Preferably, four positioning reference pads are provided, which are located around the top of the substrate.

[0019] Preferably, the novel multi-pixel substrate further includes a plurality of barriers, which are respectively disposed on the outer surfaces of the plurality of LED chips.

[0020] Preferably, the enclosure includes a base, a mounting cavity, and a reflective layer. The base is disposed on the top of the substrate, the mounting cavity is opened on the top of the base, and the reflective layer is disposed on the inner side of the mounting cavity.

[0021] Preferably, the enclosure further includes an overflow groove, which is located on the top of the base.

[0022] Compared with related technologies, the novel multi-pixel substrate provided by the present invention has the following beneficial effects:

[0023] This invention provides a novel multi-pixel substrate. Through the cooperation of the substrate, dicing lines, first metal connecting diameter, second metal connecting diameter, LED chip, and positive and negative electrode pads, during the substrate electrical testing operation, the first metal connecting diameter and the second metal connecting diameter connect all the positive and negative electrode pads in series and aggregate them to the periphery of the substrate. Only two sets of probes are needed to complete the overall testing, abandoning the traditional point-by-point testing method, greatly improving the production testing efficiency, reducing the number of test probes, reducing the equipment cost of test fixtures, and the probes only contact the peripheral aggregated area, without scratching the positive and negative electrode pads in the pixel area, ensuring the stability of subsequent wire bonding processes.

[0024] By cooperating with the substrate and the positioning reference pad, the equipment can quickly complete visual recognition and mechanical alignment in various processing steps such as substrate die bonding, inspection, and cutting, effectively improving the substrate positioning accuracy, reducing processing deviations, and ensuring the processing quality and production stability of each process.

[0025] The enclosure, consisting of a base, mounting cavity, reflective layer, and overflow tank, works together to provide physical protection for the LED chip during the LED chip packaging and light emission process. The overflow tank can collect excess encapsulation glue to prevent glue from overflowing and causing circuit and pad failures. The inner wall reflective layer can concentrate light, optimize light output, and improve overall light output efficiency and light distribution performance. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a first embodiment of a novel multi-pixel substrate provided by the present invention;

[0027] Figure 2 for Figure 1 The diagram shows the monomer structure.

[0028] Figure 3 for Figure 1 The circuit diagram shown is shown below;

[0029] Figure 4 This is a schematic diagram of a multi-pixel substrate structure in the prior art provided by the present invention;

[0030] Figure 5 This is a schematic diagram of a second embodiment of a novel multi-pixel substrate provided by the present invention;

[0031] Figure 6 A schematic diagram of the structure of a third embodiment of a novel multi-pixel substrate provided by the present invention;

[0032] Figure 7 for Figure 6 The diagram shows a side cross-sectional view of the fence.

[0033] The following are the labels in the diagram: 1. Substrate, 2. Cutting line, 3. First metal connection diameter, 4. Second metal connection diameter, 5. LED chip, 6. Positive and negative electrode pads, 61. Positive electrode, 62. Negative electrode, 7. Positioning reference pad, 8. Enclosure, 81. Base, 81. Mounting cavity, 82. Reflective layer, 83. Glue overflow groove. Detailed Implementation

[0034] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0035] First Embodiment

[0036] Please refer to the following: Figure 1 , Figure 2 , Figure 3 , Figure 4 ,in, Figure 1 This is a schematic diagram of the structure of a first embodiment of a novel multi-pixel substrate provided by the present invention; Figure 2 for Figure 1 The diagram shows the monomer structure. Figure 3 for Figure 1 The circuit diagram shown is shown below; Figure 4 This is a schematic diagram of a multi-pixel substrate structure in the prior art provided by the present invention.

[0037] A novel multi-pixel substrate includes: substrate 1;

[0038] Multiple cutting lines 2 are formed on the surface of the substrate 1;

[0039] The first metal connection diameter 3 is disposed on the front side of the substrate 1;

[0040] The second metal connection diameter 4 is disposed in the middle layer of the substrate 1;

[0041] Multiple LED chips 5 are disposed on the top of the substrate 1;

[0042] Positive and negative electrode pads 6 are disposed on the top of the substrate 1.

[0043] The substrate 1 is made of ceramic material, which has the characteristics of insulation, high temperature resistance and excellent thermal conductivity, and is suitable for use in automotive ADB headlight LED packaging; the cutting lines 2 are arranged in an array to divide the entire substrate 1 into multiple independent pixel unit areas, providing precise positioning for subsequent slitting processes.

[0044] The positive and negative electrode pads 6 include a positive electrode 61 and a negative electrode 62, both of which are disposed on the top of the substrate 1.

[0045] Each pair of positive electrodes 61 and negative electrodes 62 correspond one-to-one, forming the power supply pads for a single pixel. They are evenly distributed in an array on the front side of the substrate 1, and their positions match those of the LED chips 5, ensuring that each LED chip 5 can be independently powered and emit light.

[0046] The substrate 1 has a three-layer structure, consisting of a front layer, a middle layer, and a back layer. The first metal connecting diameter 3 is located on the front layer of the substrate 1, and the second metal connecting diameter 4 is located on the middle layer of the substrate 1.

[0047] The three-layer structure is mutually insulated and isolated. The front layer is used to arrange the pads and the first metal connection diameter 3, while the middle layer is used to arrange the second metal connection diameter 4 separately. The two layers of circuits do not interfere with each other, avoiding short circuit problems. The layered design also simplifies the etching and coating process of the metal circuits.

[0048] The first metal connection diameter 3 connects all the positive electrode pads on the front side of the substrate 1 in series and extends to the periphery of the substrate 1 to form a total pad. The second metal connection diameter 4 connects all the negative electrode pads on the front side of the substrate 1 in series and extends to the periphery of the substrate 1 to form a total pad. The widths of the first metal connection diameter 3 and the second metal connection diameter 4 are equal to the width of the cutting line 2.

[0049] The first metal connecting diameter 3 and the second metal connecting diameter 4 are made of conductive metal material, and the circuit is continuous and conductive; the width of both is consistent with the cutting line 2, so that when cutting along the cutting line 2, the two series metal connecting diameters can be completely cut off, and the electrical connection between the pixel units is completely severed. The surrounding pads are arranged in a concentrated manner to form a unified test point.

[0050] The back of the substrate 1 is provided with a heat dissipation metal pad, which is electrically isolated from the metal lines on the front and middle layers of the substrate 1.

[0051] The heat dissipation metal pad covers most of the back of the substrate, which can quickly conduct the heat generated by the LED chip 5 and reduce the chip's operating temperature. The pad is set independently and does not participate in circuit conduction. It only serves the function of heat dissipation and will not affect the power supply lines of the front and middle layers.

[0052] The working principle of the novel multi-pixel substrate provided by this invention is as follows:

[0053] During the production and assembly stage, multiple LED chips 5 are sequentially die-bonded onto the positive and negative electrode pads 6 at corresponding positions on the substrate 1 according to preset positions, thus completing the chip fixation. All positive electrodes 61 on the front side of the substrate 1 are connected in series through the first metal connection 3, and all negative electrodes 62 are connected in series through the second metal connection 4 of the intermediate layer. Both types of circuits eventually converge at the convergence pads around the perimeter of the substrate 1.

[0054] During the electrical testing stage, the testing equipment uses only two sets of test probes to contact the corresponding positive and negative pads around the substrate. This allows for the electrical continuity and yield testing of all LED chips 5 on the entire substrate. Compared to the traditional method of testing all pads point by point, this greatly reduces the number of testing points and probes, significantly improving testing efficiency. At the same time, the probes only contact the outer summary area and will not touch the positive and negative pads 6 in the pixel area, thus preventing pad scratches from the source.

[0055] After the test is completed, mechanical cutting is performed along the pre-set cutting line 2 on the substrate surface. Since the width of the first metal connection diameter 3 and the second metal connection diameter 4 is the same as the width of the cutting line 2, the two-layer series circuit will be completely cut off during the cutting process. After the division, the positive and negative electrode pads inside each independent pixel unit return to an independent state, and each LED chip 5 can achieve individual light control, which meets the requirements of ADB headlight zone dimming and anti-glare. The heat dissipation metal pad on the back of the substrate 1 continuously dissipates heat for the LED chip 5, ensuring the long-term stable operation of the lamp.

[0056] Compared with related technologies, the novel multi-pixel substrate provided by the present invention has the following beneficial effects:

[0057] By cooperating with each other, the substrate 1, the cutting line 2, the first metal connecting diameter 3, the second metal connecting diameter 4, the LED chip 5, and the positive and negative electrode pads 6 can perform electrical testing on the substrate 1. The first metal connecting diameter 3 and the second metal connecting diameter 4 connect all the positive and negative electrode pads 6 in series and bring them together to the periphery of the substrate 1. Only two sets of probes are needed to complete the overall testing, which eliminates the traditional point-by-point testing method, greatly improves the production testing efficiency, reduces the number of test probes, reduces the equipment cost of test fixtures, and the probes only contact the peripheral collection area, without scratching the positive and negative electrode pads 6 in the pixel area, ensuring the stability of subsequent wire bonding processes.

[0058] Second Embodiment

[0059] Please refer to the following: Figure 5 Based on the novel multi-pixel substrate provided in the first embodiment of this application, the second embodiment of this application proposes another novel multi-pixel substrate. The second embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0060] Specifically, the second embodiment of this application provides a novel multi-pixel substrate that differs in that the novel multi-pixel substrate further includes a plurality of positioning reference pads 7, all of which are disposed on the top of the substrate 1.

[0061] The positioning reference pads 7 are provided in four places, which are located around the top of the substrate 1.

[0062] The four positioning reference pads 7 are arranged diagonally or symmetrically on all four sides. They are made of highly recognizable metal material with high surface flatness and obvious reflective properties. These pads do not have a circuit conduction function and only serve as mechanical and visual positioning references. Their shape and position are uniform and standardized, making them compatible with the visual recognition and mechanical alignment systems of die bonders, testing equipment, and cutting equipment.

[0063] The working principle of the novel multi-pixel substrate provided by this invention is as follows:

[0064] In each process, including die bonding, electrical testing, and substrate cutting, automated equipment uses visual recognition or mechanical probes to sense the positioning reference pads 7 around the substrate 1, quickly completing the precise alignment, correction, and fixation. Subsequent processes such as wafer bonding, point testing, and slitting all rely on this reference for positioning.

[0065] Compared with related technologies, the novel multi-pixel substrate provided by the present invention has the following beneficial effects:

[0066] By cooperating with the positioning reference pad 7, the equipment can quickly complete visual recognition and mechanical alignment in various processing steps such as die bonding, inspection, and cutting of the substrate 1, effectively improving the positioning accuracy of the substrate 1, reducing processing deviations, and ensuring the processing quality and production stability of each process.

[0067] Third Embodiment

[0068] Please refer to the following: Figure 6 and Figure 7 Based on the novel multi-pixel substrate provided in the first embodiment of this application, the third embodiment of this application proposes another novel multi-pixel substrate. The third embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0069] Specifically, the third embodiment of this application provides a novel multi-pixel substrate that differs in that the novel multi-pixel substrate further includes a plurality of barriers 8, which are respectively disposed on the outer surfaces of the plurality of LED chips 5.

[0070] The enclosure 8 includes a base 81, a mounting cavity 81, and a reflective layer 82. The base 81 is disposed on the top of the substrate 1, the mounting cavity 81 is opened on the top of the base 81, and the reflective layer 82 is disposed on the inner side of the mounting cavity 81.

[0071] The base 81 is integrally formed with the substrate 1, and surrounds the LED chip 5 inside the mounting cavity 82, which provides physical protection for the chip. The mounting cavity 82 provides a light-emitting cavity for LED light emission. The reflective layer 83 on the inner wall is made of a high reflectivity material, which can reflect stray light, concentrate light, improve light emission efficiency and light directionality, and meet the light distribution requirements of ADB headlights.

[0072] The enclosure 8 also includes an overflow groove 83, which is located on the top of the base 81.

[0073] During the encapsulation of fluorescent adhesive and sealant, excess adhesive can flow into the overflow tank 84 to prevent it from overflowing onto the positive and negative electrode pads 6 and the metal connection diameter, thus preventing short circuits, poor wire bonding, and other problems, and ensuring the smooth progress of the encapsulation process.

[0074] The working principle of the novel multi-pixel substrate provided by this invention is as follows:

[0075] A baffle 8 is installed on the outside of each LED chip 5. After die bonding, the LED chip 5 is housed in the mounting cavity 82 of the base 81 to form an independent light-emitting cavity. When performing fluorescent glue dispensing and encapsulation operations, excess glue flows into the overflow groove 84 along the top surface of the base 81, effectively isolating the glue and protecting the surrounding circuits and pads. When the LED chip 5 is working and emitting light, the reflective layer 83 on the inner wall of the mounting cavity 82 reflects and concentrates the light, optimizing the light emission angle and light efficiency.

[0076] Compared with related technologies, the novel multi-pixel substrate provided by the present invention has the following beneficial effects:

[0077] The enclosure 8, composed of base 81, mounting cavity 81, reflective layer 82, and overflow groove 83, works together to provide physical protection for LED chip 5 during the encapsulation and light emission process. The overflow groove 83 can collect excess encapsulation glue to prevent glue from overflowing and causing circuit and pad failures. The inner wall reflective layer 82 can concentrate light, optimize light emission effect, and improve overall light emission efficiency and light distribution performance.

[0078] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A novel multi-pixel substrate, characterized in that, include: substrate; Multiple cutting lines, all of which are formed on the surface of the substrate; A first metal connection diameter is disposed on the front side of the substrate; The second metal connection diameter is disposed in the middle layer of the substrate; Multiple LED chips are disposed on the top of the substrate; Positive and negative electrode pads are disposed on the top of the substrate.

2. The novel multi-pixel substrate according to claim 1, characterized in that, The positive and negative electrode pads include a positive electrode and a negative electrode, both of which are disposed on the top of the substrate.

3. The novel multi-pixel substrate according to claim 1, characterized in that, The substrate has a three-layer structure, consisting of a front layer, a middle layer, and a back layer; the first metal connector is located on the front layer of the substrate, and the second metal connector is located on the middle layer of the substrate.

4. A novel multi-pixel substrate according to claim 3, characterized in that, The first metal connection diameter connects all positive electrode pads on the front side of the substrate in series and extends to the periphery of the substrate to form a total pad. The second metal connection diameter connects all negative electrode pads on the front side of the substrate in series and extends to the periphery of the substrate to form a total pad. The widths of the first metal connection diameter and the second metal connection diameter are equal to the width of the cutting line.

5. A novel multi-pixel substrate according to claim 3, characterized in that, The back of the substrate is provided with a heat dissipation metal pad, which is electrically isolated from the metal lines on the front and middle layers of the substrate.

6. A novel multi-pixel substrate according to claim 1, characterized in that, It also includes multiple positioning reference pads, all of which are disposed on the top of the substrate.

7. A novel multi-pixel substrate according to claim 6, characterized in that, The positioning reference pads are provided in four places, which are located around the top of the substrate.

8. A novel multi-pixel substrate according to claim 1, characterized in that, It also includes multiple enclosures, which are respectively disposed on the outer side of multiple LED chips.

9. A novel multi-pixel substrate according to claim 8, characterized in that, The enclosure includes a base, a mounting cavity, and a reflective layer. The base is disposed on the top of the substrate, the mounting cavity is opened on the top of the base, and the reflective layer is disposed on the inner side of the mounting cavity.

10. A novel multi-pixel substrate according to claim 9, characterized in that, The enclosure also includes an overflow trough, which is located on the top of the base.

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