LED lamp holder

Abstract

The application discloses an LED lamp holder. The LED lamp holder comprises a base, a plurality of conductive pins, a die-bonding piece, a plurality of chips and a sealing layer sealing the chips. The base is recessed inwardly with a cavity for light emission of the chips. Each conductive pin is embedded in the base and comprises a wire bonding area. The die-bonding piece is embedded in the base and comprises a die-bonding area. The die-bonding area has a height difference with the wire bonding area in a direction away from the bottom surface of the cavity. The chips are fixed one by one in the die-bonding area and are connected one by one with the wire bonding area. Due to the height difference between the die-bonding area and the wire bonding area, a bend is formed, which makes the path of water vapor blocking longer, is beneficial to prevent water vapor from entering and avoids damage to the chips, and the LED lamp holder has good moisture-proof effect.

Description

Technical Field

[0001] This application relates to LED lighting fixtures, and more particularly to LED lamp holders. Background Technology

[0002] The rapid development of LED chip technology and the increasing maturity of application technologies have made LED lighting increasingly common in daily life. In particular, LED outdoor displays have attracted much attention as a new type of energy-saving and environmentally friendly light source, with many countries and companies investing a lot of human and financial resources in research and development.

[0003] However, existing LED brackets, which consist of a plastic base and multiple conductive pins embedded in it, have some defects, such as the conductive pins not being firmly attached to the plastic base, which can easily create gaps, allowing moisture and humidity to penetrate and damage the LED bracket, resulting in poor moisture protection. Summary of the Invention

[0004] The purpose of this application is to disclose an LED bracket.

[0005] This application discloses an LED lamp holder. The LED lamp holder includes a base, multiple conductive pins, a die bonder, multiple chips, and a sealing layer sealing the chips. The base has an inwardly recessed cavity for light emission from the chips. Each conductive pin is embedded in the base and includes a wire bonding area; the die bonder is embedded in the base and includes a die bonding area, with a height difference between the die bonding area and the wire bonding area along the direction away from the bottom surface of the cavity. Each chip is fixed to the die bonding area and connected to the wire bonding area in a corresponding manner.

[0006] In some embodiments, the die-bonding region is lower than the wire bonding region.

[0007] In some embodiments, the die bonder includes a die bond segment, the surface of which is surrounded by a top surface and a connecting surface. The top surface of the die bond segment is provided with the die bond region. At least the periphery of the top surface of the die bond segment is covered by the base, so that the die bond region is exposed.

[0008] In some embodiments, all the die-bonding regions are arranged in a row, and all the bonding wire regions are located on opposite sides of the row of die-bonding regions.

[0009] In some embodiments, the plurality of chips includes n red light chips and m non-red light chips, the number of conductive pins is 2m+n, and each conductive pin is provided with a bonding wire area; there is only one die bonder and it is provided with all the die bond areas; the positive electrode of each red light chip is connected to one die bond area, and the negative electrode of each red light chip is connected to one bonding wire area; the positive and negative electrodes of each non-red light chip are respectively connected to different bonding wire areas, so that each chip is fixed to the die bond area in a one-to-one correspondence and is also connected to the bonding wire area in a one-to-one correspondence; or, the plurality of chips The chip includes n red light chips and m non-red light chips; the number of die-bonding components is m+n, each die-bonding component is provided with a die-bonding area, and the number of conductive pins is m+n; each die-bonding component and each conductive pin used to fix the non-red light chips is provided with a bonding area; the positive electrode of each red light chip is connected to one of the die-bonding areas, and the negative electrode of each red light chip is connected to one of the bonding areas; the positive and negative electrodes of each non-red light chip are respectively connected to different bonding areas, so that the chips are fixed to the die-bonding areas one-to-one and connected to the bonding areas one-to-one.

[0010] In some embodiments, the chip includes a red light chip, and the die bond to which the red light chip is fixed includes an exposed area that exposes the bottom surface of the cavity, the exposed area serving as a reflective area.

[0011] In some embodiments, the bottom surface of the cavity is provided with a chip partition wall, the plurality of chips including a red light chip and an adjacent chip, the adjacent chip being adjacent to the red light chip, the chip partition wall being located between the red light chip and the adjacent chip, separating the die-bonding area of ​​the red light chip from the die-bonding area of ​​the adjacent chip; and / or, the bottom surface of the cavity is provided with a wire bonding area partition wall, the wire bonding area being separated from the chip by the wire bonding area partition wall.

[0012] In some embodiments, the height difference between the die-bonding region and the wire bonding region is d, and the height of the chip is h, -0.2mm≤dh≤0.2mm.

[0013] In some embodiments, the base is a plastic base, and the plurality of conductive pins and the die bonder are all injection molded to the plastic base; and / or, the bonding wire area is exposed on the bottom surface of the cavity and sealed by the sealing layer, the sealing layer being transparent to light.

[0014] In some embodiments, the width of the cavity increases in the direction away from the chip, the angle between the inner surface of the cavity and the vertical plane is α, and the vertical plane is perpendicular to the bottom surface of the cavity, with 5 degrees ≤ α ≤ 15 degrees.

[0015] For the LED lamp holder, the paths for blocking moisture include a first path and a second path. The first path is along the bonding gap between the back of the conductive pin and the base, with a portion of the back of the conductive pin facing away from the bottom surface of the cavity. The second path is the bonding gap between the front of the conductive pin and the base, and the bonding gap between the sealing layer and the bottom surface of the cavity. Due to the height difference between the die-bonding area and the wire-bonding area, a bend is formed. This bend makes both the first and second paths longer. Moisture usually does not enter such a long distance. Therefore, the height difference between the die-bonding area and the wire-bonding area, combined with the sealing layer sealing the chip, helps to prevent moisture (water or humidity) from entering and avoid damaging the chip. The LED lamp holder has good moisture-proof effect. Attached Figure Description

[0016] Figure 1 This is an exploded view of the first type of LED lamp holder in this application;

[0017] Figure 2 yes Figure 1 A 3D view of the LED light bracket shown;

[0018] Figure 3 yes Figure 2 The top view of the LED light bracket shown;

[0019] Figure 4 It is along Figure 3 A cross-sectional view along line AA;

[0020] Figure 5 It is along Figure 3 A cross-sectional view of the BB line;

[0021] Figure 6 yes Figure 5 A magnified view of part A in the middle;

[0022] Figure 7 This is a top view of the second type of LED lamp holder in this application;

[0023] Figure 8 yes Figure 7 The diagram shows the distribution of conductive pins and die bond of the second type of LED lamp holder. Detailed Implementation

[0024] The technical solutions in the embodiments (or "implementations") of this application will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0025] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movements between components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.

[0026] See Figure 1 , Figure 2 , Figures 4 to 7 , Figure 1 , Figure 2 and Figure 4 This illustrates the first type of LED light bracket. Figure 7 The diagram illustrates a second type of LED light bracket. The difference between the two types of LED light brackets lies in the composition of the die-bonding area; other parts, such as the connection between the conductive pins and the base, are the same. The structure of the first type of LED light bracket will be described later, but these structures can be applied to the second type. Both types of LED light brackets include a base 1, multiple conductive pins 2, a die-bonding component 21, multiple chips 3, and a sealing layer (not shown in the diagram) sealing the chips 3. The sealing layer can be formed by potting, or it can be formed by mounting a sealing element to the bottom of the cavity 11. In this embodiment, the die-bonding component 21 also serves as a conductive pin 2. In other embodiments, the die-bonding component 21 can be used solely to fix the chips 3. Compared to using the die-bonding component 21 as a conductive pin 2, this method results in more complex wiring for the chips 3. For example, for the red light chip 31, additional wiring is required, while when the die-bonding component 21 serves as a conductive pin, the red light chip 31 is directly connected to the die-bonding component 21 without additional wiring. Because chip 3 needs to be electrically connected to the corresponding conductive pin 2, the number of conductive pins 2 corresponds to the number of chips 3. For example, there are three chips: red chip 31, blue chip 32, and green chip 33. Of course, the number of chips 3 is not limited to this. In the first type of LED lamp holder, the conductive pins 2 include die bond 21 (i.e., the first conductive pin), second conductive pin 22, third conductive pin 23, fourth conductive pin 24, fifth conductive pin 25, and sixth conductive pin 26. The second type of LED lamp holder includes three die bonders 21 and three conductive pins (fourth conductive pin 24, fifth conductive pin 25, and sixth conductive pin 26).

[0027] The base 1 has an inwardly recessed cavity 11 for the chip 3 to emit light. The shape of the cavity 11 is not limited. In some embodiments, the cavity 11 is generally in the shape of a truncated pyramid with rounded edges at the sides. In other embodiments, the cavity 11 is generally in the shape of a cone.

[0028] Each of the conductive pins 2 is embedded in the base 1. The embedding method is not limited; for example, it can be achieved through injection molding. In other embodiments, the conductive pins 2 and the base 1 are embedded through a tight-fit assembly. In this case, the gap between the conductive pins 2 and the base 1 after assembly must be very small. The die bond 21 is embedded in the base 1 and includes a die bond region 211. Each conductive pin 2 includes a wire bonding region 212 (in some embodiments, when the die bond 21 serves as a conductive pin, the wire bonding region 212 is provided on the conductive pin portion that fixes the red light chip 31). After the conductive pin 2 is embedded in the base 1, the wire bonding region 212 is located in the receiving portion 101 of the base 1 (the receiving portion 101 is in...). Figure 1 (Illustrated in the diagram). Along the direction away from the bottom surface 111 of the cavity 11 (the direction is as shown in the diagram). Figure 4 and Figure 5 As indicated by the middle arrow R, the die-bonding region 211 and the bonding region 212 have a height difference, for example, in Figure 4 and Figure 5 In this embodiment, the die-bonding region 211 is lower than the wire bonding region 212, resulting in a height difference. When the die-bonding region 211 is lower than the wire bonding region 212, it is advantageous to have a smaller height difference between the chip 3 and the wire bonding region 212. This, in turn, helps to shorten the length of the wire bonding (e.g., gold wire 311) and reduce costs, and also helps to reduce the difficulty of soldering. In other embodiments, the die-bonding region 211 is higher than the wire bonding region 212, resulting in a height difference.

[0029] Each chip 3 is fixed to the die-bonding area 211 and connected to the wire bonding area 212. The following describes a connection method using the die-bonding component 211 as an example of a conductive pin: (See...) Figure 3 and Figure 7 The positive electrode of the red light chip 31 is connected to the die bond 21, and the negative electrode is connected to the bonding area 212 through the gold wire 311. The positive and negative electrodes of the blue light chip 32 are connected to the bonding areas 212 on both sides of the blue light chip 32 through the gold wire 311. Similarly, the positive and negative electrodes of the green light chip 33 are connected to the bonding areas 212 on both sides of the green light chip 33 through the gold wire 311.

[0030] As set above, see Figure 4 and Figure 5 The paths that block water vapor include the first path (e.g., Figure 4 (as shown by the solid arrow in the middle) and the second path (e.g.) Figure 5(As shown by the dashed arrow), the first path is along the bonding gap between the back of the conductive pin and the base, with a portion of the back of the conductive pin facing away from the bottom surface of the cavity; the second path is the bonding gap between the front of the conductive pin and the base, and the bonding gap between the sealing layer and the bottom surface of the cavity. Due to the height difference between the die-bonding area 211 and the wire bonding area 212, a bend is formed. This bend makes both the first and second paths longer. Moisture usually does not enter such a long distance. Therefore, the height difference between the die-bonding area 211 and the wire bonding area 212, combined with the sealing layer sealing the chip 3 (of course, the sealing layer sealing the chip 3 can also block moisture from the direction of the cavity 11), helps to prevent moisture (water or humidity) from entering and avoid damaging the chip 3. Ultimately, the LED lamp holder has a good moisture-proof effect.

[0031] Although not indicated Figure 7 and Figure 8 The LED light fixture shown blocks the path of moisture, however, Figure 7 and Figure 8 The die bond 21 can be considered as Figure 1 A portion of the die bond 21 is removed (for example, the portion used to fix the blue light chip 32 and the green light chip 33 is removed), therefore, Figure 7 and Figure 8 The path by which the LED light bracket blocks moisture can be found in [reference needed]. Figure 1 The LED light bracket shown blocks the path of moisture.

[0032] See Figure 4 , Figure 5 , Figure 1 and Figure 2 The die-bonding component 21 includes a die-bonding section 213. Of course, Figure 8 The die bond 21 shown also includes a die bond segment 213. The formation of the die bond segment 213 is not limited; for example, the die bond 21 can be formed by stretching. In this case, the die bond 21 can serve as a conductive pin, or it can be non-conductive; that is, the die bond segment 213 can simply be a component used for die bonding chips. Combined with... Figure 6 and Figure 5 The surface of the die-bonding segment 213 is formed by the top surface 2133 of the die-bonding segment and the connecting surface. The shape of the connecting surface is determined according to the shape of the die-bonding segment 213, for example, in... Figure 1 and Figure 8In the illustrated embodiment, the die-bonding segment 213 has a rectangular cross-section, and the connecting surface includes a bottom surface 2311 and a side surface 2312 of the die-bonding segment. The connecting surface (the bottom surface 2131, the side surface 2312, and the top surface 2133 of the die-bonding segment) forms a closed shape; for example, the connecting surface can also be an arc surface, etc. The top surface 2133 of the die-bonding segment is provided with the die-bonding area 211. The formation of the die-bonding area 211 is not limited, as long as it can fix the chip 3. The area of ​​the die-bonding area 211 can be larger than the projected area of ​​the chip 3 on the die-bonding area 211. For example, a portion of the top surface 2133 of the die-bonding segment 213 can serve as the die-bonding area 211. At least the periphery of the top surface 2133 of the die-bonding segment is covered by the base 1, so that the die-bonding area 211 is exposed, for example... Figure 1 and Figure 8 In this context, the package can be understood as being on the base 1. Figure 1 and Figure 8 A closed, annular barrier is formed around the periphery of the top surface 2133 of the die-bonding region shown. For example, Figures 4 to 6 In the case where the bonding surface of the die-bonding segment 213 and the periphery of the top surface 2133 of the die-bonding segment are wrapped, the periphery of the top surface 2133 of the die-bonding segment is in contact with the wrapping portion 12 of the base 1. In some embodiments, the wrapping portion 12 can be considered as part of the chip partition wall 13 or part of the wire bonding area partition wall 14, which facilitates the manufacture of the LED lamp bracket.

[0033] As described above, since at least the periphery of the top surface 2133 of the die-bonding segment 213 is covered by the base 1, the die-bonding area 211 of the die-bonding segment 213 is exposed. When moisture enters (e.g., along the... Figure 4 or Figure 5 When the arrow points in the indicated direction, moisture is blocked by the portion of the base 1 that encapsulates the crystal-bonding region 211 (e.g., the encapsulation portion 12). Figures 2 to 5 Regarding the first type of LED lamp holder shown, the wrapping part 12 can also prevent moisture from entering along the direction from the red light chip 31 to the green light chip 33. Figure 5 In the diagram, for the path shown by the dashed line inside the conductive pin 2, the wrapping portion 12 causes the dashed arrow to turn in the direction of the arrow. Figure 5 (Moving upwards), thus preventing moisture from affecting the performance of chip 3, and the LED lamp holder has good moisture-proof effect. In addition, the periphery of the top surface 2133 of the die-bonding segment is wrapped, so that the periphery of the top surface 2133 of the die-bonding segment is pressed by the wrapping part 12 of the base 1. It can be understood that the die-bonding segment 213 is stuck in the base 1. Therefore, the die-bonding segment 213 is not easy to warp, and the die-bonding segment 213 is not easy to separate from the base 1. It also helps to improve the flatness of the top surface 2133 of the die-bonding segment (for Figure 1For the LED lamp holder shown, the flatness refers to the fact that the three die-bonding regions 211 are on the same plane. Figure 8 For the LED lamp holder shown, it refers to the flatness of the die bonding area 211 of a single die bonding component 21, which helps to ensure that the heights of all chips 3 are close or equal, and ultimately improves the soldering yield.

[0034] See Figures 1 to 3 , Figure 7 and Figure 8 All the die-bonding regions 211 are arranged in a row, and all the bonding wire regions 212 are located on opposite sides of the row of die-bonding regions 211. Figure 2 and Figure 3 and Figure 1 Comparison, and Figure 8 and Figure 7 A comparison shows that one row of bonding wire areas 212 is located to the left of the die-bonding area 211, and the other row of bonding wire areas 212 is located to the right of the die-bonding area 211. Since there are three chips, the chip 3, all the bonding wire areas 212, and the exposed area 214 of the die-bonding component 21 form a nine-square grid, which can be understood as the chip 3 and the bonding wire areas 212 being arranged in an array. In other embodiments, the bonding wire areas 212 and the die-bonding area 211 can also be arranged in an array, as long as the connection between the chip 3 and the bonding wire areas 212 is achieved.

[0035] As described above, since all the die-bonding areas 211 are arranged in a row and all the bonding areas 212 are located on opposite sides of the row of die-bonding areas 211, the distance between the die-bonding areas 211 and the pin segments 201 of the conductive pins 2 is greater. Therefore, if moisture enters, the path to block the moisture is longer, which is more conducive to preventing moisture from entering and avoiding damage to the chip 3.

[0036] See Figure 1 and Figure 3 There is only one die-bonding member 21, and all of the die-bonding regions 211 are provided therein. Figure 1 The device contains three chips 3, and the die-bonding segment 213 of the die-bonding component 21 has three die-bonding areas 211. If there are more than three chips 3, more die-bonding areas 211 can be provided on the die-bonding segment 213. The red light chip 31, blue light chip 32, and green light chip 33 are all fixed to the corresponding die-bonding areas of the die-bonding component 21. Figure 1 and Figure 3 It can be deduced that the multiple chips include n red light chips 31 and m non-red light chips (in this embodiment, the non-red light chips are blue light chips 32 and green light chips 33, but are not limited to these; any chip that implements a non-red light lamp is a non-red light chip). The number of conductive pins can be deduced to be m+n, as shown in the figure, where n=1, m=2, and the number of conductive pins is 5. Each conductive pin 2 is respectively provided with the bonding wire area 212, see [reference needed]. Figure 1 The second conductive pin 22, the third conductive pin 23, the fourth conductive pin 24, the fifth conductive pin 25, and the sixth conductive pin 26 are each provided with a bonding area 212. The positive terminal of each red light chip 31 is connected to one of the die-bonding areas 211, and the negative terminal of each red light chip 31 is connected to one bonding area 212. In this case, the die-bonding component 21 can also be considered a conductive pin, but to distinguish it from other conductive pins, it is still referred to as a die-bonding component 21. The positive and negative terminals of each non-red light chip are respectively connected to different bonding areas to achieve a one-to-one correspondence between the chip and the die-bonding area, and also a one-to-one correspondence between the chip and the bonding area. For specific connection relationships, please refer to the foregoing.

[0037] As described above, all die-bonding areas 211 are located within a die-bonding segment 213 of a single die-bonding component 21. The die-bonding segment 213 helps ensure that all chips 3 have similar or equal heights, ultimately improving soldering yield. Because of varying heights, some bonding wires may not solder well to their corresponding bonding areas 212, resulting in low yield.

[0038] See Figure 8 The chip consists of n red light chips and m non-red light chips, and the number of die-bonded components 21 is m+n. Figure 8 In this configuration, n = 1, m = 2, and the number of die bonders 21 is 3. Each die bonder 21 is provided with the die bond region 211; the number of conductive pins 2 is also m + n. Figure 8 It has three conductive pins: the fourth conductive pin 24, the fifth conductive pin 25, and the sixth conductive pin 26. Combined with... Figure 7 It is known that each die bond 21 used to fix the non-red light chip and each of the conductive pins are respectively provided with the bonding wire area 212. Figure 8 In this configuration, the die-bonding component 21 for fixing the blue light chip 32 and the die-bonding component 21 for fixing the green light chip 33 are respectively provided with a die-bonding area 211 and a wire bonding area 212. The fourth conductive pin 24, the fifth conductive pin 25, and the sixth conductive pin 26 are only provided with wire bonding areas 212. In this case, the positive electrode of each red light chip 31 is connected to one die-bonding area 211, and the negative electrode of each red light chip 31 is connected to one wire bonding area 212; the positive and negative electrodes of each non-red light chip are respectively connected to different wire bonding areas, so that the chips are fixed to the die-bonding areas one-to-one and connected to the wire bonding areas one-to-one.

[0039] As described above, the plurality of chips includes n red light chips and m non-red light chips; the number of die bonding components is m+n, and each die bonding component 21 is provided with a die bonding area 211. In this way, the die bonding component 21 or conductive pins can be manufactured using the same mold, resulting in low mold cost.

[0040] See Figures 1 to 3 as well as Figure 7 and Figure 8 The die bond 21 on which the red light chip 31 is fixed includes an exposed area 214 that exposes the bottom surface 111 of the cavity 11. The exposed area 214 is reflective. The composition of the exposed area 214 is not limited. For example, the exposed area 214 of the die bond 21 may be made of metal, or a reflective material may be coated on the die bond 21 to form the exposed area 214.

[0041] As described above, since the die bonding member 21 includes an exposed area 214, which is reflective, the area of ​​light emitted by the reflective chip 3 at the bottom of the cavity 11 is increased, which helps to reflect the light emitted by the chip 3 and thus improves the light emission efficiency of the lamp bead.

[0042] See Figure 5 and Figure 7 The height difference between the die-bonding region 211 and the bonding region 212 is d, and the height of the chip 3 is h, -0.2mm ≤ dh ≤ 0.2mm, for example, -0.2mm, -0.15mm, -0.1mm, -0.9mm, -0.8mm, -0.7mm, -0.6mm, -0.5mm, -0.4mm, -0.3mm, -0.2mm, -0.1mm, -0.05mm, -0.03mm, 0mm, 0.03mm, 0.06mm, 0.08mm, 0.1mm, 0.13mm, 0.15mm, 0.18mm, or 0.2mm. Figure 4 and Figure 5 In the above, d = h, and the top surface of chip 3 and the bonding area 212 are located on the same plane.

[0043] As described above, since -0.2mm≤dh≤0.2mm, it is beneficial to ensure that the height of the chip 3 and the bonding area 212 are close, which can shorten the length of the bonding wire (such as gold wire 311) and save costs, and reduce the difficulty of the solder joint.

[0044] See Figures 1 to 3 The plurality of chips includes a red light chip 31 and adjacent chips. The adjacent chips are adjacent to the red light chip 31. In the figure, the adjacent chips are a blue light chip 32 and a green light chip 33. In some embodiments, the adjacent chip may also be another red light chip 31. A chip partition wall 13 is provided on the bottom surface 111 of the cavity 11. The chip partition wall 13 is not limited in its arrangement; for example, it may be formed by a recess in the bottom surface 111. The chip partition wall 13 is located between the red light chip 31 and the adjacent chips, separating the die-bonding areas corresponding to the red light chip 31 and the adjacent chips.

[0045] As described above, the die-bonding areas (in this embodiment, the die-bonding area 211 of the red light chip 31 and the die-bonding area of ​​the blue light chip 32) are separated by the chip partition wall 13, preventing the silver paste used to fix the red light chip 31 from contacting the die-bonding adhesive used to fix the blue light chip 32 and the green light chip 33. When the adjacent chip is a red light chip 31, contact between the silver paste of the two red light chips 31 is prevented.

[0046] In some embodiments, the chip partition wall 13 is ring-shaped, such as a U-shape, surrounding the red light chip 31, and includes a first partition wall 131. In other embodiments, the chip partition wall 13 includes a first partition wall 131 and a second partition wall 132 located between the chip 3 and the bonding area 212. In this case, the first partition wall 131 and the second partition wall 132 are, for example, L-shaped, to prevent silver paste from overflowing onto the bonding area 212. Alternatively, the chip partition wall 13 may also include a third partition wall 133 located between the chip 3 and the exposed area 214, which also prevents silver paste from overflowing onto the exposed area 214. When the third partition wall 133 is included, the first partition wall 131, the second partition wall 132, and the third partition wall 133 form a U-shape. If only avoiding contact between the silver paste and the die bond adhesive is considered, the chip partition wall 13 may only include the first partition wall 131.

[0047] See Figures 1 to 3 The bottom surface of the cavity 11 is recessed to form a wire bonding area partition wall 14, which separates the wire bonding area 212 from the chip 3. In this application, the die bonding area 211 of the die bonder 21 is in contact with the wire bonding area partition wall 14, thereby enabling the aforementioned base 1 to enclose the die bond section 213.

[0048] As described above, the bonding area 212 and the chip 3 are separated by the bonding area partition wall 14 to prevent die bond adhesive from overflowing into the bonding area 212.

[0049] In some embodiments, the base 1 is a plastic base, and the plurality of conductive pins 2 and the die bond 21 are all injection molded to the plastic base 1.

[0050] As described above, the injection molding process, the sealing of the chip 3 by the sealing layer, and the height difference between the bonding area 212 and the die bonding area 211, along with the tight bonding of the conductive pin 2 and the die bonding component 21 with the plastic base, further enhance the moisture resistance of the LED lamp holder.

[0051] See Figures 3 to 5 The bonding area 212 is exposed on the bottom surface 111 of the cavity 11 and is sealed by the sealing layer, which is transparent to light.

[0052] As described above, the bonding area 212 is exposed on the bottom surface 111, and the sealing layer is transparent. The bonding area 212 provides a larger metal area, which is beneficial for reflecting the light emitted by the chip 3, thereby improving the light emission efficiency of the lamp bead.

[0053] See Figure 4 The width of the cavity 11 increases in the direction away from the chip 3. The angle between the inner surface of the cavity 11 and the vertical plane is α. The vertical plane is perpendicular to the bottom surface 111 of the cavity 11. The angle is 5 degrees ≤ α ≤ 15 degrees, for example, 5 degrees, 5.5 degrees, 5.8 degrees, 6 degrees, 6.3 degrees, 6.8 degrees, 7 degrees, 7.5 degrees, 8 degrees, 8.5 degrees, 9 degrees, 9.3 degrees, 9.8 degrees, 10 degrees, 10.5 degrees, 10.8 degrees, 11 degrees, 11.3 degrees, 11.6 degrees, 12 degrees, 12.5 degrees, 13 degrees, 13.5 degrees, 14 degrees, 14.2 degrees, 14.5 degrees, 14.8 degrees, or 15 degrees.

[0054] As described above, since 5 degrees ≤ a ≤ 15 degrees, the draft angle of the base 1 is relatively small, which can obtain a larger metal area. The large metal area helps to reflect the light emitted by the chip 3, thereby improving the light emission efficiency of the lamp bead.

[0055] It should be noted that the technical solutions or features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. An LED lamp holder, characterized in that, The LED lamp holder includes a base, multiple conductive pins, a die bond, multiple chips, and a sealing layer for sealing the chips, wherein: The base has an inwardly recessed cavity for the chip to emit light; Each of the conductive pins is embedded in the base and includes a wire bonding area; the die bonder is embedded in the base and includes a die bonder area; the die bonder area and the wire bonding area have a height difference along a direction away from the bottom surface of the cavity; Each chip is fixed to the die-bonding area and connected to the wire bonding area.

2. The LED lamp holder according to claim 1, characterized in that, The die-bonding region is lower than the wire bonding region.

3. The LED lamp holder according to claim 1, characterized in that, The die-bonding component includes a die-bonding segment, the surface of which is surrounded by a top surface and a connecting surface. The top surface of the die-bonding segment is provided with the die-bonding area. At least the periphery of the top surface of the die-bonding segment is covered by the base, so that the die-bonding area is exposed.

4. The LED lamp holder according to claim 1, characterized in that, All the die-bonding regions are arranged in a row, and all the bonding wire regions are located on opposite sides of the row of die-bonding regions.

5. The LED lamp holder according to claim 1, characterized in that, The plurality of chips includes n red light chips and m non-red light chips. The number of conductive pins is 2m+n, and each conductive pin is provided with a bonding area. There is only one die bonder, which is provided with all the die bonders. The positive electrode of each red light chip is connected to one die bonder, and the negative electrode of each red light chip is connected to one bonding area. The positive and negative electrodes of each non-red light chip are respectively connected to different bonding areas, so that each chip is fixed to the die bonder in a one-to-one correspondence and is also connected to the bonding area in a one-to-one correspondence. Alternatively, the plurality of chips may include n red light chips and m non-red light chips; the number of die bonding components is m+n, each die bonding component is provided with a die bonding area, and the number of conductive pins is m+n; Each die bond and each conductive pin used to fix the non-red light chip is provided with a bonding area; the positive electrode of each red light chip is connected to one of the die bond areas, and the negative electrode of each red light chip is connected to one of the bonding areas; the positive and negative electrodes of each non-red light chip are respectively connected to different bonding areas, so that the chip is fixed to the die bond area in a one-to-one correspondence, and is also connected to the bonding area in a one-to-one correspondence.

6. The LED lamp holder according to claim 1, characterized in that, The chip includes a red light chip, and the die bond for fixing the red light chip includes an exposed area that exposes the bottom surface of the cavity, the exposed area serving as a reflective area.

7. The LED lamp holder according to claim 1, characterized in that, The bottom surface of the cavity is provided with a chip partition wall. The plurality of chips include a red light chip and an adjacent chip. The adjacent chip is adjacent to the red light chip. The chip partition wall is located between the red light chip and the adjacent chip, separating the die-bonding area of ​​the red light chip from the die-bonding area of ​​the adjacent chip. And / or, the bottom surface of the cavity is provided with a wire bonding area partition wall, and the wire bonding area is separated from the chip by the wire bonding area partition wall.

8. The LED lamp holder according to claim 1, characterized in that, The height difference between the die-bonding region and the wire bonding region is d, and the height of the chip is h, -0.2mm≤dh≤0.2mm.

9. The LED lamp holder according to claim 1, characterized in that, The base is a plastic base, and the plurality of conductive pins and the die bond are all injection molded to the plastic base; And / or, the bonding area is exposed on the bottom surface of the cavity and sealed by the sealing layer, which is transparent to light.

10. The LED lamp holder according to claim 1, characterized in that, The width of the cavity increases in the direction away from the chip, the angle between the inner surface of the cavity and the vertical plane is α, the vertical plane is perpendicular to the bottom surface of the cavity, and 5 degrees ≤ α ≤ 15 degrees.

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