Display device and electronic device including the same

Abstract

A display device and an electronic device including the same are provided. The display device includes a display panel and a cover panel on one surface of the display panel, wherein the cover panel includes a light blocking layer on the one surface of the display panel, a buffer layer on the light blocking layer, a first metal layer on the buffer layer, and a second metal layer on the first metal layer. In a plan view, the cover panel includes a central area, a peripheral area adjacent to the central area in a first direction and a second direction crossing the first direction, and a corner area at least partially surrounding the central area and the peripheral area, through holes are defined in the first metal layer, the through holes overlap the corner area and penetrate the first metal layer, and the through holes are spaced apart from each other.

Description

[0001] This application claims priority to and all benefits arising therefrom of Korean Patent Application No. 10-2025-0036453, filed on March 21, 2025, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] This disclosure relates to a display device and an electronic device including the display device. Background Technology

[0003] With the development of multimedia, the importance of display devices is increasing. Therefore, various types of display devices, such as organic light-emitting diodes (OLEDs) and liquid crystal displays (LCDs), are being used.

[0004] Display devices include display panels, such as organic light-emitting display panels or liquid crystal display panels, as means for displaying images on the display device. Examples of light-emitting display panels in display panels may include light-emitting elements such as light-emitting diodes (LEDs), and examples of such light-emitting diodes include organic light-emitting diodes (OLEDs) that use organic materials as fluorescent materials and inorganic light-emitting diodes that use inorganic materials as fluorescent materials.

[0005] In addition, the display device includes a sub-panel member disposed below the display panel. The sub-panel member may include various functional pieces for protecting the display panel from heat, external impacts, and other effects. Summary of the Invention

[0006] This disclosure provides a display device that can prevent the cover panel disposed below the display panel from warping under high temperature and high humidity conditions.

[0007] It should be noted that the purpose of this disclosure is not limited to the above-described purposes, and other purposes of this disclosure will be apparent to those skilled in the art from the following description.

[0008] According to an aspect of this disclosure, a display device includes a display panel and a cover panel located on one surface of the display panel, wherein the cover panel includes: a light-blocking layer located on the one surface of the display panel; a buffer layer located on the light-blocking layer; a first metal layer located on the buffer layer; and a second metal layer located on the first metal layer. In a plan view, the cover panel includes a central region, peripheral regions adjacent to the central region in a first direction and a second direction intersecting the first direction, and corner regions at least partially surrounding the central region and the peripheral regions. Through-holes are defined in the first metal layer, the through-holes overlapping with the corner regions and penetrating the first metal layer, and the through-holes are spaced apart from each other.

[0009] In one embodiment, the outermost edge of the corner area of ​​the cover panel may include a curve in the plan view.

[0010] In an embodiment, in a plan view, the through holes can be arranged in a radial pattern.

[0011] In one embodiment, the through-hole can be made invisible from the outside of the cover panel.

[0012] In an embodiment, the coefficients of thermal expansion of the first metal layer and the second metal layer may be different from each other.

[0013] In an embodiment, the coefficient of thermal expansion of the first metal layer may be greater than that of the second metal layer.

[0014] In an embodiment, the display device may further include an adhesive layer located between the buffer layer and the first metal layer, and the adhesive layer may also be located inside the through-hole.

[0015] In one embodiment, the adhesive layer may be in direct contact with the inner surface of the defined via of the first metal layer.

[0016] In an embodiment, the display device may further include a lower adhesive layer located between the first metal layer and the second metal layer, and the lower adhesive layer may also be located inside the through-hole.

[0017] In one embodiment, the lower adhesive layer may be in direct contact with the inner surface of the defined through-hole of the first metal layer.

[0018] In one embodiment, the first metal layer may include aluminum, and the second metal layer may include copper.

[0019] According to an aspect of this disclosure, a display device includes a display panel and a cover panel located on one surface of the display panel, wherein the cover panel includes: a light-blocking layer located on the one surface of the display panel; a buffer layer located on the light-blocking layer; a first metal layer located on the buffer layer; and a second metal layer located on the first metal layer. In a plan view, the cover panel includes a central region, peripheral regions adjacent to the central region in a first direction and in a second direction intersecting the first direction, and corner regions at least partially surrounding the central region and the peripheral regions. Through-holes are defined in the first metal layer, overlapping with and penetrating the central region and the peripheral regions, and spaced apart from each other.

[0020] In one embodiment, the outermost edge of the corner area of ​​the cover panel may include a curve in the plan view.

[0021] In an embodiment, the coefficients of thermal expansion of the first metal layer and the second metal layer may be different from each other.

[0022] In an embodiment, the coefficient of thermal expansion of the first metal layer may be greater than that of the second metal layer.

[0023] In an embodiment, the display device may further include an adhesive layer located between the buffer layer and the first metal layer, and the adhesive layer may also be located inside the through-hole.

[0024] In one embodiment, the adhesive layer may be in direct contact with the inner surface of the defined via of the first metal layer.

[0025] In an embodiment, the display device may further include a lower adhesive layer located between the first metal layer and the second metal layer, and the lower adhesive layer may also be located inside the through-hole.

[0026] In one embodiment, the lower adhesive layer may be in direct contact with the inner surface of the defined through-hole of the first metal layer.

[0027] According to an aspect of this disclosure, an electronic device includes a display device for displaying an image and a processor for transmitting image data signals for displaying the image to the display device. The display device includes a display panel and a cover panel located on one surface of the display panel. The cover panel includes: a light-blocking layer located on the one surface of the display panel; a buffer layer located on the light-blocking layer; a first metal layer located on the buffer layer; and a second metal layer located on the first metal layer. In a plan view, the cover panel includes a central region, peripheral regions adjacent to the central region in a first direction and a second direction intersecting the first direction, and corner regions at least partially surrounding the central region and the peripheral regions. Through-holes are defined in the first metal layer, overlapping with and penetrating the corner regions, and spaced apart from each other.

[0028] However, the aspects of this disclosure are not limited to those set forth herein. These and other aspects of the disclosure will become more apparent to those skilled in the art upon reference to the detailed description of the disclosure given below.

[0029] According to embodiments of this disclosure, the warping of the cover panel disposed below the display panel under high temperature and high humidity conditions can be prevented, thus providing a display device with improved reliability.

[0030] It should be noted that the effects of this disclosure are not limited to those described above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description. Attached Figure Description

[0031] The above and other aspects and features of this disclosure will become more apparent from the detailed description of embodiments thereof with reference to the accompanying drawings, in which: Figure 1This is an exploded perspective view of the display device according to an embodiment; Figure 2 This is a rear view of the display device according to an embodiment; Figure 3 yes Figure 2 A magnified plan view of part B1; Figure 4 It is along Figure 3 A cross-sectional view of the display device taken by line X1-X1'; Figure 5 yes Figure 4 An enlarged sectional view of part B3; Figures 6 to 8 It is shown Figure 5 A view of a modified example of a display device; Figure 9 The display device according to another embodiment is along Figure 3 A sectional view taken by line X1-X1'; Figure 10 yes Figure 9 An enlarged sectional view of part B5; Figures 11 to 13 It is shown Figure 10 A view of a modified example of a display device; Figure 14 This is a rear view of a display device according to another embodiment; Figure 15 yes Figure 14 Enlarged plan view of part B7; Figure 16 This is a block diagram of an electronic device according to an embodiment; and Figure 17 Schematic diagrams of electronic devices according to various embodiments are shown. Detailed Implementation

[0032] The invention will now be described more fully below with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. However, the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0033] It will also be understood that when a layer is referred to as being "on" another layer or substrate, the layer may be directly on said other layer or substrate, or an intervening layer may be present. Throughout the specification, the same reference numerals denote the same components.

[0034] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, the first element discussed below may be referred to as the second element without departing from the teachings of the invention. Similarly, the second element may also be referred to as the first element.

[0035] Each of the features in the various embodiments of this disclosure can be combined in part or in whole with each other, and various interlocks and drives are technically possible. The various embodiments can be implemented independently of each other or can be implemented together in association.

[0036] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, “a,” “an,” “the,” and “at least one” do not indicate a limitation on quantity and are intended to include both singular and plural. For example, unless the context clearly indicates otherwise, “an element” has the same meaning as “at least one element.” “At least one” should not be construed as limited to “a” or “an.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will also be understood that when the terms “comprising” and / or variations thereof or “including” and / or variations thereof are used in this specification, it indicates the presence of the stated features, regions, integrals, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, regions, integrals, steps, operations, elements, components, and / or groups thereof. Embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0037] Figure 1 This is an exploded perspective view of a display device according to an embodiment. Figure 2 This is a rear view of the display device according to an embodiment.

[0038] Reference Figure 1 and Figure 2 The display device 10 is a device for displaying moving or still images and can be used as a display screen for various products.

[0039] Display device 10 may be a light-emitting display device, such as an organic light-emitting display device including organic light-emitting diodes, a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including inorganic semiconductors, and an ultra-small light-emitting display device including ultra-small light-emitting diodes such as micro light-emitting diodes or nano light-emitting diodes (micro LEDs or nano LEDs), but is not limited thereto. For example, display device 10 may be a type of display device other than a light-emitting display device. In the following, embodiments in which display device 10 is a light-emitting display device (e.g., an organic light-emitting display device) are disclosed.

[0040] The shape of the display device 10 can be varied. For example, the display device 10 can have shapes such as a rectangle with a long length, a rectangle with a long width, a square, a quadrilateral with rounded (rounded) corners (vertices), other polygonal or circular shapes. Figure 1 and Figure 2 The image shows a display device 10 having a rectangular shape with a long length in the first direction DR1.

[0041] In this specification, the first direction DR1 can be a direction parallel to the long side of the display device 10 in a plan view, for example, the horizontal direction of the display device 10. The second direction DR2 can be a direction parallel to the short side of the display device 10 in a plan view, for example, the vertical direction of the display device 10. The third direction DR3 can be the thickness direction of the display device 10.

[0042] The display device 10 may include a display panel DPNL, a cover window CW disposed above the display panel DPNL, and a cover panel CPNL disposed below the display panel DPNL.

[0043] The display panel DPNL may include a display area DA for displaying images and a non-display area NDA set around the display area DA.

[0044] Multiple pixels can be disposed in a display area DA. Pixels can display images. Each pixel may include a pixel driving circuit and a light-emitting element electrically connected to the pixel driving circuit, the pixel driving circuit including a transistor (e.g., a switching transistor, a driving transistor, etc.) and at least one capacitor. Pixels can generate light in response to an electrical signal applied to each pixel and display an image through the display area DA. According to an embodiment, some pixels may include transistors disposed in a non-display area NDA, but this disclosure is not limited thereto.

[0045] The non-display area NDA can be an area where no image is displayed. The non-display area NDA can be an edge area of ​​the display panel DPNL. The non-display area NDA can be an area outside the display area DA and can be configured to surround the display area DA. A pad (or "solder pad") portion (not shown) for connecting to the flexible circuit board FPCB can be located at one edge of the non-display area NDA, and the flexible circuit board FPCB can be connected to the pad portion.

[0046] A cover window (CW) can be mounted on the display panel (DPNL) to protect it. The cover window (CW) can be stacked on top of the display panel (DPNL) and cover its front surface. The cover window (CW) can be larger than the display panel (DPNL). The cover window (CW) can include materials such as glass, sapphire, or plastic. The cover window (CW) can be rigid, but not limited to, and can also be flexible.

[0047] The overlay window CW may include a transmissive region TA that transmits an image provided by the display panel DPNL and a border region BZA adjacent to the transmissive region TA. The transmissive region TA may be the area in which the image is displayed. In this embodiment, the transmissive region TA is shown as a rectangular shape with a long width, but this is only an example, and the transmissive region TA can have various shapes and is not limited to any one embodiment. The border region BZA may surround the transmissive region TA and be adjacent to the transmissive region TA. Therefore, the shape of the transmissive region TA can be substantially defined by the border region BZA. However, this is shown by way of example, and the border region BZA may also be configured to be adjacent only to one side of the transmissive region TA, or the border region BZA may be omitted.

[0048] The cover panel CPNL can be positioned below the display panel DPNL to support and protect the display panel DPNL.

[0049] like Figure 2 As shown, the cover panel CPNL may include a central region MA, peripheral regions SA1, SA2, SA3 and SA4 adjacent to the central region MA in a first direction DR1 and a second direction DR2 intersecting the first direction DR1, and corner regions CA1, CA2, CA3 and CA4 surrounding at least some of the central region MA and peripheral regions SA1, SA2, SA3 and SA4 in the plan view.

[0050] The outermost edges of the corner regions CA1, CA2, CA3, and CA4 may include curves. For example, the outermost edges of the corner regions CA1, CA2, CA3, and CA4 of the cover panel CPNL may all have a circular shape. Because the outermost edges of the corner regions CA1, CA2, CA3, and CA4 of the cover panel CPNL include curves, forces generated inside the cover panel CPNL and concentrated at the corners due to thermal expansion, etc., can be dispersed. Therefore, warping of the cover panel CPNL due to thermal expansion under high temperature and high humidity conditions can be prevented, thereby improving the reliability of the display device 10.

[0051] Additionally, the corner area CA can define the alignment opening ALH located at the outermost edge of the cover panel CPNL. Figure 2 The diagram shows a second alignment opening ALH2 and a first alignment opening ALH1 located at the third corner region CA3 and the fourth corner region CA4, respectively. However, this is shown as an example, and the alignment opening ALH may be located at one or more of the first corner region CA1, the second corner region CA2, the third corner region CA3, and the fourth corner region CA4. This disclosure is not limited to any one embodiment.

[0052] The display device 10 may also include a flexible circuit board (FPCB), a driving circuit (DIC), and a circuit board (PCB).

[0053] Each of the flexible printed circuit boards (FPCBs) can be disposed on a pad portion located on one edge of the display panel DPNL. Each of the FPCBs can be attached to the pad portion using a conductive adhesive member such as an anisotropic conductive film. Thus, multiple FPCBs can be electrically connected to the signal lines of the display panel DPNL. The multiple FPCBs can be flexible printed circuit boards or flexible films such as chip-on-film.

[0054] Each of the driving circuits DIC can be formed as an integrated circuit (IC) and attached to a corresponding flexible circuit board (FPCB), but the embodiments described in this specification are not limited thereto. Each of the driving circuits DIC can also be attached to the display panel DPNL by a chip-on-glass (COG) method, a chip-on-plastic (COP) method, or an ultrasonic bonding method.

[0055] The circuit board (PCB) can be positioned on the opposite side of each of multiple flexible printed circuit boards (FPCBs) connected to the display panel (DPNL). The PCB can be electrically connected to the display panel (DPNL) via the FPCB and can exchange signals with the drive circuit (DIC). The PCB can provide image data, control signals, power voltage, etc., to the display panel (DPNL) or the FPCB. The PCB can be, but is not limited to, a flexible printed circuit board or a rigid printed circuit board. For example, the PCB can be a rigid printed circuit board.

[0056] Figure 3 yes Figure 2 Enlarged plan view of part B1. Figure 4 It is along Figure 3 A cross-sectional view of the display device taken by line X1-X1'. Figure 5 yes Figure 4 Enlarged sectional view of part B3.

[0057] Reference Figures 3 to 5 The display device 10 may further include a light-blocking member BM to prevent additional components disposed in the non-display area NDA from being visually identified from the outside. The light-blocking member BM may be an organic film comprising colored or black organic materials. The light-blocking member BM may be formed by coating method to surround the periphery of the cover window CW on the rear surface of the cover window CW. The light-blocking member BM may be superimposed on the border area BZA of the cover window CW, and may be partially superimposed on the non-display area NDA of the display panel DPNL depending on the user's viewing angle.

[0058] The display device 10 may also include a transparent adhesive layer TAL that bonds the display panel DPNL and the cover window CW. The transparent adhesive layer TAL may include a transparent adhesive material such as optically clear adhesive (OCA) or optically clear resin (OCR).

[0059] The cover panel CPNL may include a metal layer MTL, a first adhesive layer ADL1, a buffer layer CSL, a second adhesive layer ADL2, a light blocking layer BL, and an upper adhesive layer UAL.

[0060] The metal layer MTL can be located below the cover panel CPNL, which can dissipate heat generated inside the display device 10 to the outside and can also be used to shield electromagnetic waves. The metal layer MTL can include a conductive metal selected from the group consisting of metals or combinations thereof with excellent thermal conductivity, such as copper (Cu), silver (Ag), gold (Au), aluminum (Al), nickel (Ni), etc. For example, the metal layer MTL can include a first metal layer MTL1 and a second metal layer MTL2 located on the first metal layer MTL1. In this embodiment, the first metal layer MTL1 can include copper (Cu), and the second metal layer MTL2 can include aluminum (Al). The coefficients of thermal expansion of the first metal layer MTL1 and the second metal layer MTL2 can be different from each other. In some embodiments, the coefficient of thermal expansion of the second metal layer MTL2 can be greater than the coefficient of thermal expansion of the first metal layer MTL1.

[0061] The second metal layer MTL2 may define vias MH that overlap with and penetrate the corner region CA, and the vias MH may be spaced apart from each other. In a plan view, the vias MH of the second metal layer MTL2 may be arranged in various patterns such as a grid pattern, a radial pattern, or a zigzag pattern. In some embodiments, the vias MH may be arranged in a radial pattern. For example, vias MH1, MH2, MH3, MH4, MH5, and MH6 may be arranged radially along the first via line MHL1, the second via line MHL2, the third via line MHL3, the fourth via line MHL4, the fifth via line MHL5, and the sixth via line MHL6, which have different inclinations relative to the central via MH0 between the first direction DR1 and the second direction DR2. Figure 3 The illustration shows six via lines MHL in which vias MH are formed, but this is merely an example, and the number of via lines MHL in which vias MH are formed can vary and is not limited to any particular embodiment. Figure 3 As shown, relative to the central through-hole MH0, through-hole MH may include a first through-hole MH1 located on a first through-hole line MHL1 and spaced apart from each other, a second through-hole MH2 located on a second through-hole line MHL2 and spaced apart from each other, a third through-hole MH3 located on a third through-hole line MHL3 and spaced apart from each other, a fourth through-hole MH4 located on a fourth through-hole line MHL4 and spaced apart from each other, a fifth through-hole MH5 located on a fifth through-hole line MHL5 and spaced apart from each other, and a sixth through-hole MH6 located on a sixth through-hole line MHL6 and spaced apart from each other. Optionally, in some embodiments, through-hole MH may be arranged in a grid pattern. Optionally, in some embodiments, through-hole MH may not have a pattern.

[0062] like Figure 3 As shown, the via MH of the second metal layer MTL2 can have a circular shape in the plan view. However, the via MH is not limited to this and can have various shapes such as triangles and squares in the plan view. In addition, the via MH can have various sizes within a minimum area that ensures the performance of heat dissipation and shielding functions, and can be arranged to be spaced apart from adjacent via MHs in various ways.

[0063] The via MH can be located inside the second metal layer MTL2, and because the upper and lower parts of the second metal layer MTL2 are provided with layers, the via MH can be seen from the outside of the cover panel CPNL without being visually identifiable.

[0064] As an example, Figures 3 to 5 A via MH is shown formed in a region superimposed on the first corner region CA1 of the second metal layer MTL2, but via MH can also be formed in the same region superimposed on the second corner region CA2, the third corner region CA3 and the fourth corner region CA4 of the second metal layer MTL2.

[0065] Since the second metal layer MTL2 includes through-holes MH stacked with the corner region CA, forces generated and concentrated at the corners within the cover panel CPNL due to thermal expansion can be dispersed. Therefore, warping of the cover panel CPNL caused by thermal expansion under high temperature and high humidity conditions can be prevented, thus improving the reliability of the display device 10.

[0066] The first adhesive layer ADL1 may be located on the second metal layer MTL2. The first adhesive layer ADL1 may be located between the metal layer MTL and the buffer layer CSL, and may bond the metal layer MTL and the buffer layer CSL to each other. The first adhesive layer ADL1 may include an optically transparent pressure-sensitive adhesive (PSA).

[0067] The buffer layer CSL may be located on the metal layer MTL. The buffer layer CSL can be used to absorb external impacts and prevent damage to the display device 10. The buffer layer CSL may comprise a single layer or multiple stacked films. In some embodiments, the buffer layer CSL may comprise an elastically deformable material. For example, the buffer layer CSL may comprise thermoplastic elastomers (such as polyurethane thermoplastic elastomers, poly(styrene-butadiene-styrene)), polystyrene, polyolefins (such as polyethylene), polyamides, synthetic rubbers (such as polybutadiene, polyisobutylene, polychloroprene), polydimethylsiloxane, polyurethane, and silicone resins, as well as combinations thereof, but not limited thereto, and may be selected from materials having elasticity within a range that does not affect the image display of the display panel DPNL.

[0068] The second adhesive layer ADL2 may be located on the buffer layer CSL. The second adhesive layer ADL2 may be located between the buffer layer CSL and the light-blocking layer BL, and may bond the buffer layer CSL and the light-blocking layer BL to each other. The second adhesive layer ADL2 may include an optically transparent pressure-sensitive adhesive (PSA).

[0069] A light-blocking layer BL may be located on the second adhesive layer ADL2. The light-blocking layer BL serves to block light transmission and prevent components disposed beneath the light-blocking layer BL from being visually identified from the outside of the display device 10. The light-blocking layer BL may comprise a light-blocking material or a colored film with low light transmittance. For example, the light-blocking layer BL may be a black plastic film (e.g., a black polyethylene terephthalate (PET) film).

[0070] The upper adhesive layer UAL can be located on the light-blocking layer BL. The upper adhesive layer UAL can be located above the cover panel CPNL and can bond the cover panel CPNL and the display panel DPNL to each other. The upper adhesive layer UAL can be at least one of optically clear resin (OCR), optically clear adhesive (OCA), and pressure-sensitive adhesive (PSA). In an embodiment, the upper adhesive layer UAL can be an embossed adhesive layer. The material of the embossed adhesive layer is not particularly limited, and adhesive materials known to those skilled in the art can be used. For example, various polymer resins can be used as materials for the embossed adhesive layer.

[0071] Figures 6 to 8 It is shown Figure 5 A modified example view of the display device.

[0072] The following text will primarily describe the differences, and repeated descriptions will be omitted.

[0073] Reference Figure 6 ,and Figure 5 In contrast, the first adhesive layer ADL1 can also be located inside the through-hole MH of the second metal layer MTL2, and can be in direct contact with the inner surface of the defined through-hole MH of the second metal layer MTL2.

[0074] Reference Figure 7 ,and Figure 6 In contrast, a portion of the first adhesive layer ADL1 located inside the via MH can directly contact the inner surface of the second metal layer MTL2 that defines the via MH, while another portion of the first adhesive layer ADL1 located inside the via MH can not directly contact the inner surface of the second metal layer MTL2 that defines the via MH.

[0075] Reference Figure 8 ,and Figure 7In contrast, the first adhesive layer ADL1 located inside the through-hole MH can directly contact the inner surface of the through-hole MH defined by the second metal layer MTL2.

[0076] Figure 9 The display device according to another embodiment is along Figure 3 A sectional view taken by line X1-X1'. Figure 10 yes Figure 9 A magnified plan view of part B5.

[0077] The following text will primarily describe the differences, and repeated descriptions will be omitted.

[0078] Reference Figure 9 and Figure 10 ,and Figure 4 and Figure 5 Alternatively, the display device 10' may further include a lower adhesive layer SAL located between the first metal layer MTL1 and the second metal layer MTL2. The lower adhesive layer SAL can bond the first metal layer MTL1 and the second metal layer MTL2 to each other. The lower adhesive layer SAL may include an optically transparent pressure-sensitive adhesive (PSA).

[0079] Figures 11 to 13 It is shown Figure 10 A modified example view of the display device.

[0080] The following text will primarily describe the differences, and repeated descriptions will be omitted.

[0081] Reference Figure 11 ,and Figure 10 In contrast, the first adhesive layer ADL1 and the lower adhesive layer SAL can also be located inside the through-hole MH of the second metal layer MTL2, and can not be in direct contact with the inner surface of the defined through-hole MH of the second metal layer MTL2.

[0082] Reference Figure 12 ,and Figure 11 In contrast, a portion of the first adhesive layer ADL1 located inside the via MH and a portion of the lower adhesive layer SAL located inside the via MH can directly contact the inner surface of the second metal layer MTL2 defining the via MH, while another portion of the first adhesive layer ADL1 located inside the via MH and another portion of the lower adhesive layer SAL located inside the via MH can not directly contact the inner surface of the second metal layer MTL2 defining the via MH.

[0083] Reference Figure 13 ,and Figure 12In contrast, the first adhesive layer ADL1 and the lower adhesive layer SAL located inside the through hole MH can directly contact the inner surface of the through hole MH that defines the second metal layer MTL2.

[0084] Figure 14 This is a rear view of a display device according to another embodiment. Figure 15 yes Figure 14 Enlarged plan view of part B7.

[0085] The following text will primarily describe the differences, and repeated descriptions will be omitted.

[0086] Reference Figure 14 and Figure 15 ,and Figure 2 and Figure 3 In comparison, the second metal layer MTL2 (see...) Figure 4 The vias MH can be defined therein, overlapping with the central region MA, the second peripheral region SA2, and the fourth peripheral region SA4, and penetrating the second metal layer MTL2, and the vias MH can be spaced apart from each other. The vias MH can be arranged in a grid pattern. For example, the vias MH can be arranged in a grid shape along first via lines MHL1, second via lines MHL2, third via lines MHL3, and fourth via lines MHL4 spaced apart on the first direction DR1. The vias MH can include vias MH located on and spaced apart from each other on the first via lines MHL1, second via lines MHL2, third via lines MHL3, and fourth via lines MHL4 on the second direction DR2. Figure 14 The illustration shows four via lines MHL in which vias MH are formed, but this is only an example, and the number of via lines MHL in which vias MH are formed can vary and is not limited to any one embodiment.

[0087] like Figure 15 As shown, the via MH of the second metal layer MTL2 can have a quadrilateral shape in the plan view. However, the via MH is not limited to this and can have various shapes such as triangles and circles in the plan view. In addition, the via MH can have various sizes within a minimum area that ensures the performance of heat dissipation and shielding functions, and can be arranged to be spaced apart from adjacent via MHs in various ways.

[0088] As an example, Figure 14 and Figure 15A via MH is shown formed in a region superimposed on the central region MA, the second peripheral region SA2, and the fourth peripheral region SA4 of the second metal layer MTL2. However, the via MH may be formed in one or more of the regions superimposed on the central region MA and the first peripheral region SA1, the second peripheral region SA2, the third peripheral region SA3, and the fourth peripheral region SA4 of the second metal layer MTL2.

[0089] Since the second metal layer MTL2 includes through-holes MH stacked with the corner region CA, forces generated and concentrated at the corners within the cover panel CPNL due to thermal expansion can be dispersed. Therefore, warping of the cover panel CPNL caused by thermal expansion under high temperature and high humidity conditions can be prevented, thus improving the reliability of the display device 10.

[0090] Additionally, the corner area CA of the cover panel CPNL can also define the alignment opening ALH located at the outermost edge of the cover panel CPNL (see...). Figure 2 Although not in Figure 14 As shown directly, however, the alignment opening ALH may be located in one or more of the first corner region CA1, the second corner region CA2, the third corner region CA3, and the fourth corner region CA4, and is not limited to any one embodiment.

[0091] Although not shown, it is in accordance with the embodiment Figure 14 and Figure 15 In the display device 10", the display device 10" may have the same shape as described above in the cross-sectional view. Figure 4 and Figure 9 The same structure, and the through-hole MH of the second metal layer MTL2 of the display device 10" can have the same characteristics as described above. Figures 5 to 8 and Figures 10 to 13 The arrangement of the layers on the upper and lower parts of the second metal layer MTL2 shown is the same, and is not limited to any one embodiment.

[0092] The display device according to the embodiments can be applied to various electronic devices.

[0093] Figure 16 This is a block diagram of an electronic device according to an embodiment.

[0094] Reference Figure 16 The electronic device 1 according to the embodiment may include a display module 11, a processor 12, a memory 13 and a power module 14.

[0095] The processor 12 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0096] The data required for the operation of the processor 12 or the display module 11 can be stored in the memory 13. When the processor 12 executes the application stored in the memory 13, image data signals and / or input control signals can be transmitted to the display module 11, and the display module 11 can process the provided signals and output image information through the display screen.

[0097] The power module 14 may include a power module (such as a power adapter or battery device) and a power conversion module that converts the power supplied by the power module to generate the power required for the operation of the electronic device 1.

[0098] At least one of the modules of the electronic device 1 described above may be included in the display device according to the above embodiment. Furthermore, some of the modules functionally included in the electronic device 1 may be included in the display device, while other modules may be disposed separately from the display device. For example, the display device includes a display module 11, and the processor 12, memory 13, and power module 14 may be disposed as other devices within the electronic device 1 besides the display device.

[0099] Figure 17 Schematic diagrams of electronic devices according to various embodiments are shown.

[0100] Reference Figure 17 Various electronic devices employing the display device according to the embodiments may include not only image display electronic devices (such as smartphones 1_1a, tablet PCs 1_1b, laptop computers 1_1c, TVs 1_1d, and desktop monitors 1_1e), but also wearable electronic devices (such as smart glasses 1_2a, head-mounted displays 1_2b, and smartwatches 1_2c), and vehicle electronic devices 1_3 (such as central information displays (CIDs), interior mirror displays, etc., installed on the dashboard, central instrument panel, or instrument cluster of a vehicle) that include display modules.

[0101] In summarizing the detailed description, those skilled in the art will appreciate that many variations and modifications can be made to the preferred embodiments without substantially departing from the principles of the invention. Therefore, the preferred embodiments of the invention disclosed are used only in a general and descriptive sense and not for limiting purposes.

Claims

1. A display device, the display device comprising: Display panel; as well as Cover panel, located on one surface of the display panel. The cover panel includes: a light-blocking layer located on one surface of the display panel; a buffer layer located on the light-blocking layer; a first metal layer located on the buffer layer; and a second metal layer located on the first metal layer. In the plan view, the covering panel includes a central region, peripheral regions adjacent to the central region in a first direction and a second direction intersecting the first direction, and corner regions that at least partially surround the central region and the peripheral regions. A through-hole is defined in the first metal layer, the through-hole overlapping with the corner region and penetrating the first metal layer, and The through holes are spaced apart from each other.

2. The display device according to claim 1, wherein, The outermost edge of the corner region of the cover panel includes a curve in the plan view.

3. The display device according to claim 1, wherein, In the plan view, the through holes are arranged in a radial pattern.

4. The display device according to claim 3, wherein, The through-hole is not visually identifiable from the outside of the cover panel.

5. The display device according to claim 1, wherein, The coefficients of thermal expansion of the first metal layer and the second metal layer are different from each other.

6. The display device according to claim 5, wherein, The coefficient of thermal expansion of the first metal layer is greater than that of the second metal layer.

7. The display device according to claim 1, further comprising an adhesive layer located between the buffer layer and the first metal layer. in, The adhesive layer is also located inside the through hole.

8. The display device according to claim 7, wherein, The adhesive layer is in direct contact with the inner surface of the first metal layer that defines the through hole.

9. The display device according to claim 1, further comprising a lower adhesive layer located between the first metal layer and the second metal layer. in, The lower adhesive layer is also located inside the through hole.

10. The display device according to claim 9, wherein, The lower adhesive layer is in direct contact with the inner surface of the first metal layer that defines the through hole.

11. The display device according to claim 1, wherein, The first metal layer comprises aluminum, and the second metal layer comprises copper.

12. A display device, the display device comprising: Display panel; as well as Cover panel, located on one surface of the display panel. The cover panel includes: a light-blocking layer located on one surface of the display panel; a buffer layer located on the light-blocking layer; a first metal layer located on the buffer layer; and a second metal layer located on the first metal layer. In the plan view, the covering panel includes a central region, peripheral regions adjacent to the central region in a first direction and a second direction intersecting the first direction, and corner regions that at least partially surround the central region and the peripheral regions. The first metal layer defines a through-hole, which overlaps with the central region and the peripheral region and penetrates the first metal layer, and the through-holes are spaced apart from each other.

13. The display device according to claim 12, wherein, The outermost edge of the corner region of the cover panel includes a curve in the plan view.

14. The display device according to claim 12, wherein, The coefficients of thermal expansion of the first metal layer and the second metal layer are different from each other.

15. The display device according to claim 14, wherein, The coefficient of thermal expansion of the first metal layer is greater than that of the second metal layer.

16. The display device according to claim 12, further comprising an adhesive layer located between the buffer layer and the first metal layer. in, The adhesive layer is also located inside the through hole.

17. The display device according to claim 16, wherein, The adhesive layer is in direct contact with the inner surface of the first metal layer that defines the through hole.

18. The display device according to claim 12, further comprising a lower adhesive layer located between the first metal layer and the second metal layer. in, The lower adhesive layer is also located inside the through hole.

19. The display device according to claim 18, wherein, The lower adhesive layer is in direct contact with the inner surface of the first metal layer that defines the through hole.

20. An electronic device, the electronic device comprising: Display device for displaying images; as well as The processor is configured to transmit image data signals for displaying the image to the display device. The display device includes: a display panel; and a cover panel located on one surface of the display panel. The cover panel includes: a light-blocking layer located on one surface of the display panel; a buffer layer located on the light-blocking layer; a first metal layer located on the buffer layer; and a second metal layer located on the first metal layer. In the plan view, the covering panel includes a central region, peripheral regions adjacent to the central region in a first direction and a second direction intersecting the first direction, and corner regions that at least partially surround the central region and the peripheral regions. The first metal layer defines a through-hole, the through-hole overlapping the corner region and penetrating the first metal layer, and the through-holes are spaced apart from each other.

Images